Infineon HYB18T512800AC Ddr2 registered memory module Datasheet

D at a S he e t, R ev . 0 .8 5 , Ap r . 2 00 4
H YS72 T 640 00 [G/H ]R - x -A (5 12 M B y t e )
H YS72 T 128 00 0[ G/H] R-x-A ( 1 G B y t e )
H YS72 T 128 02 0[ G/H] R-x-A ( 1 G B y t e )
H YS72 T 256 02 0[ G/H] R-x-A ( 2 G B y t e )
H YS72 T 256 22 0[ G/H] R-x-A ( 2 G B y t e )
DDR 2 Reg istered Me mo ry Mo dul es
M em or y P r od uc t s
N e v e r
s t o p
t h i n k i n g .
HYS72T[256/128/64][0/2][0/2]0[G/H]R-[5/3.7]-A
Preliminary Data Sheet Rev. 0.85 (Apr. 2004)
Low Profile 240-pin Registered DDR2 SDRAM Modules Datasheet
512 MByte, 1 GByte & 2 GByte Modules
PC2-3200R, PC2-4300R
• Programmable CAS Latencies (3, 4 & 5),
Burst Length (4 & 8) and Burst Type.
• 240-pin Registered 8-Byte ECC Dual-In-Line
DDR2 SDRAM Module for PC, Workstation
and Server main memory applications
• Auto Refresh and Self Refresh
• One rank 64Mb x 72, 128Mb x 72 and
two ranks 128Mb × 72 and 256Mb x 72
organizations
• All inputs and outputs SSTL_1.8 compatible
• Re-drive for all input signals using register
and PLL devices.
• JEDEC standard Double Data Rate 2
Synchronous DRAMs (DDR2 SDRAMs) with
+ 1.8 V (± 0.1 V) power supply
• OCD (Off-Chip Driver Impedance
Adjustment) and ODT (On-Die Termination)
• Serial Presence Detect with E2PROM
• 512MB and 1 GB modulesModules built with
512Mb DDR2 SDRAMs in 60-ball FBGA
chipsize packages
• Low Profile Modules form factor:
133.35 mm x 30,00 mm (MO-237)
• Two versions of 2 GB modules
• Based on JEDEC standard reference card
designs
built with 63-ball FBGA dual die chipsize packages
(2 x 512Mb components) or 60-ball FBGA packages
Performance:
–5
–3.7
Component Speed Grade on Module
Speed Grade Indicator
DDR2–400
DDR2–533
Module Speed Grade
Unit
PC2–3200R
PC2–4300R
Max. Clock Frequency @ CL = 3
200
200
MHz
Max. Clock Frequency@ CL = 4 & 5
200
266
MHz
1.0 Description
The INFINEON HYS72Taaabcd[G/H]R module family are low profile Registered DIMM modules
with 30,00 mm height based on DDR2 technology. DIMMs are available in 64M x 72 (512MByte),
128M x 72 (1GByte) and 256M x 72 (2GByte) organisation and density, intended for mounting into
240 pin connector sockets.
The memory array is designed with 512Mb Double Data Rate (DDR2) Synchronous DRAMs for
ECC applications. All control and address signals are re-driven on the DIMM using register devices
and a PLL for the clock distribution. This reduces capacitive loading to the system bus, but adds one
cycle to the SDRAM timing. Decoupling capacitors are mounted on the PCB board, which provide
a proper voltage supply impedance over the whole frequency range of operations as number and
values are accordant to the JEDEC specification. The DIMMs feature serial presence detect based
on a serial E2PROM device using the 2-pin I2C protocol. The first 128 bytes are programmed with
configuration data and the second 128 bytes are available to the customer.
2
Rev. 0.85, 2004-04
HYS72T[256/128/64][0/2][0/2]0[G/H]R-[5/3.7]-A
Registered DDR2 SDRAM Modules
1.1 Ordering Information
Product Type
Compliance Code
Description
SDRAM Technology
PC2-3200 (DDR2-400)
HYS72T64000GR-5-A
PC2-3200R-333-11-A
one rank 512 MB Reg. DIMM
HYS72T128020GR-5-A
PC2-3200R-333-11-B
two ranks 1024 MB Reg.DIMM
512 Mbit (x8)
512 Mbit (x8)
HYS72T128000GR-5-A
PC2-3200R-333-11-C
one rank 1024 MB Reg. DIMM
512 Mbit (x4)
HYS72T256220GR-5-A
PC2-3200R-333-11
two ranks 2048 MB Reg. DIMM
512 Mbit (x4)
HYS72T256020GR-5-A
PC2-3200R-333-11
two ranks 2048 MB Reg. DIMM
512 Mbit (x4)
HYS72T64000GR-3.7-A
PC2-4300R-444-11-A
one rank 512 MB Reg. DIMM
512 Mbit (x8)
HYS72T128020GR-3.7-A
PC2-4300R-444-11-B
two ranks 1024 MB Reg.DIMM
512 Mbit (x8)
HYS72T128000GR-3.7-A
PC2-4300R-444-11-C
one rank 1024 MB Reg. DIMM
512 Mbit (x4)
HYS72T256020GR-3.7-A
PC2-4300R-444-11
two ranks 2048 MB Reg. DIMM
512 Mbit (x4)
PC2-4300 (DDR2-533)
PC2-3200 (DDR2-400)
HYS72T64000HR-5-A
PC2-3200R-333-11-A
one rank 512 MB Reg. DIMM
512 Mbit (x8)
HYS72T128020HR-5-A
PC2-3200R-333-11-B
two ranks 1024 MB Reg.DIMM
512 Mbit (x8)
HYS72T128000HR-5-A
PC2-3200R-333-11-C
one rank 1024 MB Reg. DIMM
512 Mbit (x4)
HYS72T256220HR-5-A
PC2-3200R-333-11
two ranks 2048 MB Reg. DIMM
512 Mbit (x4)
HYS72T256020HR-5-A
PC2-3200R-333-11
two ranks 2048 MB Reg. DIMM
512 Mbit (x4)
HYS72T64000HR-3.7-A
PC2-4300R-444-11-A
one rank 512 MB Reg. DIMM
512 Mbit (x8)
HYS72T128020HR-3.7-A
PC2-4300R-444-11-B
two ranks 1024 MB Reg.DIMM
512 Mbit (x8)
HYS72T128000HR-3.7-A
PC2-4300R-444-11-C
one rank 1024 MB Reg. DIMM
512 Mbit (x4)
HYS72T256020HR-3.7-A
PC2-4300R-444-11
two ranks 2048 MB Reg. DIMM
512 Mbit (x4)
PC2-4300 (DDR2-533)
Notes:
1. For all INFINEON DDR2 module and component nomenclature see section 8 of this data sheet.
2. The Compliance Code is printed on the module label and describes the speed grade, e. g. “PC2-4300R-444-11-C”, where
4300R means Registered modules with 4.26 GB/sec Module Bandwidth and “444-11” means CAS latency = 4, trcd latency
= 4 and trp latency = 4 using the latest JEDEC SPD Revision 1.1 and produced on the Raw Card “C”.
1.2 Address Format
Product Type
DIMM Density Organization DIMM Ranks SDRAMs # of SDRAMs # of row/bank/
column bits
HYS72T64000GR
HYS72T64000HR
512 MB
64Mb × 72
1
(512Mb)
64Mb × 8
9
14/2/10
HYS72T128020GR
HYS72T128020HR
1024 MB
2 x 64Mb × 72
2
(512Mb)
64Mb × 8
18
14/2/10
HYS72T128000GR
HYS72T128000HR
1024 MB
128Mb x 72
1
(512Mb)
128Mb × 4
18
14/2/11
HYS72T256220GR
HYS72T256220HR
2048 MB
2 x 128Mb × 72
2
(512Mb)
128Mb × 4
36
14/2/11
HYS72T256020GR
HYS72T256020HR
2048 MB
2 x 128Mb × 72
2
(512Mb)
128Mb × 4
36
14/2/11
Data Sheet
Preliminary
3
Rev. 0.85, 2004-04
HYS72T[256/128/64][0/2][0/2]0[G/H]R-[5/3.7]-A
Registered DDR2 SDRAM Modules
1.3 Components on Modules and RawCard
DIMM
Density
DRAM components
reference datasheet
PLL
Register
Raw Card
512 MB
HYB18T512800AC
HYB18T512800AF
1:10, 1.8V, CU877
1:1 25-bit 1.8V SSTU32864
A
1024 MB
HYB18T512800AC
HYB18T512800AF
1:10, 1.8V, CU877
1:2 14-bit 1.8V SSTU32864
B
1024 MB
HYB18T512400AC
HYB18T512400AF
1:10, 1.8V, CU877
1:2 14-bit 1.8V SSTU32864
C
2048 MB
HYB18T512400AC
HYB18T512400AF
tbd.
tbd.
tbd.
2048 MB
HYB18T512400AC
HYB18T512400AF
tbd.
tbd.
tbd.
For a detailed description of all functionalities of the DRAM components on these modules see the referenced component data
sheet
1.4 Pin Definition and Function
Pin Name
Description
Pin Name
Description
A[13:0]
Row Address Inputs
CB[7:0]
DIMM ECC Check Bits
A11, A[9:0]
Column Address Inputs 4)
DQS[8:0]
SDRAM low data strobes
A10/AP
Column Address Input for AutoPrecharge
DM[8:0] /
DQS[17:9]
SDRAM low data mask/
high data strobes
BA[1:0]
SDRAM Bank Selects
DQS[17:0]
SDRAM differential data strobes
CK0
Clock input
SCL
Serial bus clock
SDA
Serial bus data line
(positive line of differential pair)
CK0
Clock input
(negative line of differential pair)
RAS
Row Address Strobe
SA[2:0]
slave address select
CAS
Column Address Strobe
VDD
Power (+ 1.8 V)
WE
Read/Write Input
VREF
I/O reference supply
CS[1:0]
Chip Selects 3)
VSS
Ground
CKE[1:0]
Clock Enable 3)
VDDSPD
EEPROM power supply
ODT[1:0]
Active termination control lines 1) 3)
RESET
Register and PLL control pin 2)
DQ[63:0]
Data Input/Output
NC
No connection
1) Active termination only applies to DQ, DQS, DQS and DM signals
2) When low, all register outputs will be driven low and the PLL clocks to the DRAM and registers will be set to low levels (the
PLL will remain synchronized with the input clock
3) CS1, ODT1 and CKE1 are used on dual rank modules only
4) Column address A11 is used on modules based on x4 organised 512Mb DDR2 components only.
Data Sheet
Preliminary
4
Rev. 0.85, 2004-04
HYS72T[256/128/64][0/2][0/2]0[G/H]R-[5/3.7]-A
Registered DDR2 SDRAM Modules
1.5 Pin Configuration
PIN#
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
Symbol
VREF
VSS
DQ0
DQ1
VSS
DQS0
DQS0
VSS
DQ2
DQ3
VSS
DQ8
DQ9
VSS
DQS1
DQS1
VSS
RESET
NC
VSS
DQ10
DQ11
VSS
DQ16
DQ17
VSS
DQS2
DQS2
VSS
DQ18
DQ19
VSS
DQ24
DQ25
VSS
DQS3
DQS3
VSS
DQ26
DQ27
Data Sheet
Preliminary
PIN#
121
122
123
124
125
126
127
128
129
130
131
132
133
134
135
136
137
138
139
140
141
142
143
144
145
146
147
148
149
150
151
152
153
154
155
156
157
158
159
160
Symbol
VSS
DQ4
DQ5
VSS
DM0, DQS9
DQS9
VSS
DQ6
DQ7
VSS
DQ12
DQ13
VSS
DM1, DQS10
DQS10
VSS
NC
NC
VSS
DQ14
DQ15
VSS
DQ20
DQ21
VSS
DM2, DQS11
DQS11
VSS
DQ22
DQ23
VSS
DQ28
DQ29
VSS
DM3, DQS12
DQS12
VSS
DQ30
DQ31
VSS
PIN#
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
5
Symbol
A4
VDDQ
A2
VDD
KEY
VSS
VSS
VDD
NC
VDD
A10/AP
BA0
VDDQ
WE
CAS
VDDQ
CS1
ODT1
VDDQ
VSS
DQ32
DQ33
VSS
DQS4
DQS4
VSS
DQ34
DQ35
VSS
DQ40
DQ41
VSS
DQS5
DQS5
VSS
DQ42
DQ43
VSS
DQ48
DQ49
PIN#
181
182
183
184
185
186
187
188
189
190
191
192
193
194
195
196
197
198
199
200
201
202
203
204
205
206
207
208
209
210
211
212
213
214
215
216
217
218
219
Symbol
VDDQ
A3
A1
VDD
KEY
CK0
CK0
VDD
A0
VDD
BA1
VDDQ
RAS
CS0
VDDQ
ODT0
A13
VDD
VSS
DQ36
DQ37
VSS
DM4, DQS13
DQS13
VSS
DQ38
DQ39
VSS
DQ44
DQ45
VSS
DM5, DQS14
DQS14
VSS
DQ46
DQ47
VSS
DQ52
DQ53
VSS
Rev. 0.85, 2004-04
HYS72T[256/128/64][0/2][0/2]0[G/H]R-[5/3.7]-A
Registered DDR2 SDRAM Modules
Pin Configuration (cont’d)
PIN#
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
Symbol
VSS
CB0
CB1
VSS
DQS8
DQS8
VSS
CB2
CB3
VSS
VDDQ
CKE0
VDD
NC
NC
VDDQ
A11
A7
VDD
A5
PIN#
161
162
163
164
165
166
167
168
169
170
171
172
173
174
175
176
177
178
179
180
Symbol
CB4
CB5
VSS
DM8, DQS17
DQS17
VSS
CB6
CB7
VSS
VDDQ
NC, CKE1
VDD
NC
NC
VDDQ
A12
A9
VDD
A8
A6
PIN#
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
Symbol
VSS
SA2
NC
VSS
DQS6
DQS6
VSS
DQ50
DQ51
VSS
DQ56
DQ57
VSS
DQS7
DQS7
VSS
DQ58
DQ59
VSS
SDA
SCL
PIN#
220
221
222
223
224
225
226
227
228
229
230
231
232
233
234
235
236
237
238
239
240
Symbol
NC
NC
VSS
DM6, DQS15
DQS15
VSS
DQ54
DQ55
VSS
DQ60
DQ61
VSS
DM7, DQS16
DQS16
VSS
DQ62
DQ63
VSS
VDDSPD
SA0
SA1
1.6 Pin Locations
Front
p in 1
pin 1 21
64
18 4
65
1 85
120
2 40
Backside
240 pin Modules (MO-237)
Data Sheet
Preliminary
6
Rev. 0.85, 2004-04
HYS72T[256/128/64][0/2][0/2]0[G/H]R-[5/3.7]-A
Registered DDR2 SDRAM Modules
1.7 Registered DIMM Input/Output Functional Description
Symbol
Type
Polarity
Function
CK0, CK0
Input
The system clock inputs. All address and command lines are sampled on the cross point of
Cross point the rising edge of CK and the falling edge of CK. An on-board DLL circuit is driven from the
clock inputs and output timing for read operations is synchronized to the input clock.
CKE[1:0]
Input
CKE high activates and CKE low deactivates internal clock signals and device input buffers
Active High and output drivers of the SDRAMs. Taking CKE low provides Precharge Power-Down and
Self-Refresh operation (all banks idle), or Active Power-Down (row Active in any bank).
CS[1:0]
Input
Enables the associated SDRAM command decoder when low and disables decoder when
high. When decoder is disabled, new commands are ignored and previous operations conActive Low tinue. The input signals also disable all outputs (except CKE and ODT) of the register(s) on
the DIMM when both inputs are high. When both CS[1:0] are high, all register outputs (except
CK, ODT and Chip select) remain in the previous state.
ODT[1:0]
RAS, CAS,
WE
Input
Active High On-Die Termination control signals
Input
sampled at the positive edge of the clock, RAS, CAS and WE define the operation to
Active Low When
be executed by the SDRAM.
Input
Active High Masks write data when high, issued concurrently with input data.
DM[8:0]
BA[1:0]
A[13:0]
DQ[63:0],
CB[7:0]
-
Selects which internal SDRAM memory bank is activated
Input
-
During Bank Activate command cycle, Address defines the row address. During a Read or
Write command cycle, Address defines the column address. In addition to the column
address, A10(=AP) is used to invoke Auto-Precharge operation at the end of the burst read
or write cycle. If AP is high, Auto Precharge is selected and BA[1:0] defines the bank to be
precharged. If AP is low, Auto-Precharge is disabled. During a Precharge command cycle,
AP is used in conjunction with BA[1:0] to control which bank(s) to precharge. If AP is high, all
banks will be precharged regardless of the state of BA[1:0]. If AP is low, BA[1:0] are used to
define which bank to precharge.
I/O
-
Data and Check Bit Input /Output pins.
Input
The data strobes, associated with one data byte, source with data transfer. In Write mode,
the data strobe is sourced by the controller and is centered in the data window. In Read
mode the data strobe is sources by the DDR2 SDRAM and is sent at the leading edge of the
Cross point data window. DQS signals are complements, and timing is relative to the crosspoint of
respective DQS and DQS. If the module is to be operated in single ended strobe mode, all
DQS signals must be tied on the system board to VSS and DDR2 SDRAM mode registers
programmed appropriately.
DQS[17:0],
DQS[17:0]
I/O
SA[2:0]
Input
-
These signals are tied at the system planar to either VSS or VDDSPD to configure the serial
SPD EEPROM address range
SDA
I/O
-
This bidirectional pin is used to transfer data into and out of the SPD EEPROM. A resistor
maybe connected from the SDA bus line to VDDSPD on the system planar to act as a pullup.
SCL
Input
-
This signal is used to clock data into the SPD EEPROM. A resistor maybe connected from
the SCL bus line to VDDSPD on the system planar to act as a pull-up.
RESET
Input
-
The RESET pin is connected to the RST pin on the register and to the OE pin on the PLL.
When low, all register outputs will be driven low and the PLL clocks to the DRAMs and the
register(s) will be set to low level. The PLL will remain synchronized with the input clock.
VDD, VSS
Supply
-
Power and ground for the DDR SDRAM input buffers and core logic.
VREF
Supply
-
Reference voltage for the SSTL-18 inputs.
VDDSPD
Supply
-
Serial EEPROM positive power supply, wired to a separated power pin at the connector
which supports from 1.7 Volt to 3.6 Volt.
Note: CS1, ODT1 and CKE1 are used on dual rank modules only.
Data Sheet
Preliminary
7
Rev. 0.85, 2004-04
HYS72T[256/128/64][0/2][0/2]0[G/H]R-[5/3.7]-A
Registered DDR2 SDRAM Modules
2.0 Block Diagrams
2.1 One Rank 64M x 72 (512 MByte) DDR2 SDRAM DIMM Module (x8 components)
HYS72T64000[G/H] on Raw Card A
RS0
DQS0
DQS4
DQS0
DM0/DQS9
DQS4
DM4/DQS13
NU/
RDQS
DQS9
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
DM/
RDQS
0
1
2
3
4
5
6
7
CS DQS DQS
DQ32
DQ33
DQ34
DQ35
DQ36
DQ37
DQ38
DQ39
D0
DQS1
DQS5
DQS1
DM1/DQS10
DQS5
DM5/DQS14
NU/
RDQS
DQS10
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
DM/
RDQS
0
1
2
3
4
5
6
7
CS DQS
DQS
DQS2
DQS6
DQS6
DM6/DQS15
NU/
RDQS
DQ16
DQ17
DQ18
DQ19
DQ20
DQ21
DQ22
DQ23
DM/
RDQS
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
CS DQS
DQS
D2
DQS7
DQS7
DM7/DQS16
NU/
RDQS
DM/
RDQS
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
CS DQS
DQS
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
DQ56
DQ57
DQ58
DQ59
DQ60
DQ61
DQ62
DQ63
D3
DM/
RDQS
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
DM/
RDQS
0
1
2
3
4
5
6
7
DQS
CS DQS DQS
D5
0
1
2
3
4
5
6
7
NU/
RDQS
DQS16
CS DQS
D4
0
1
2
3
4
5
6
7
NU/
RDQS
DQ48
DQ49
DQ50
DQ51
DQ52
DQ53
DQ54
DQ55
DQS3
DQ24
DQ25
DQ26
DQ27
DQ28
DQ29
DQ30
DQ31
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
DQS15
DQS3
DM3/DQS12
DQS12
NU/
RDQS
DQ40
DQ41
DQ42
DQ43
DQ44
DQ45
DQ46
DQ47
D1
DM/
RDQS
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
DQS14
DQS0
DM2/DQS11
DQS11
NU/
RDQS
DQS13
CS DQS
DQS
D6
DM/
RDQS
CS DQS
DQS
D7
DQS8
DQS8
DM8/DQS17
NU/
RDQS
DQS17
CB0
CB1
CB2
CB3
CB4
CB5
CB6
CB7
1:1
CS0 *
B A 0-BA1
A0 -A13
RAS
CAS
WE
CKE0
ODT0
RESET
PCK7
PCK 7
R
E
G
I
S
T
E
R
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
DM/
RDQS
VDDSPD
Serial PD
Serial PD
CS DQS DQS
SCL
D8
SDA
WP A0
RS0 -> C S : SDRAMs D0-D8
RB A0 -RBA1 -> BA 0-BA1 : SDRAMs D0 -D8
RA0 -RA 13-> A0 -A 13: SDR A Ms D0 -D 8
RR A S -> RAS : SD RAMs D0- D 8
RC AS -> C A S: SD RAMs D0-D8
RW E -> WE : SD RAMs D0-D8
RCK E0 -> CKE : SDR A
D0-D8
RODT0 -> ODT 0: SDRAMs D0-D8
A1
A2
SA0 SA1 SA2
CK0
CK 0
RESET
P
L
L
OE
VDD, V DDQ
D0 - D8
VREF
D0 - D8
V SS
D0 - D8
PCK0-PCK6,PCK8,PCK9
PCK0-PCK6,PCK8,PCK9
CK : SDRAMs D0-D8
CK : SDRAMs D0-D8
PCK7 -> CK : Register
PCK7 > CK : Register
Notes:
1. DQ-to-I/O wiring may be changed within a byte
2. Unless otherwise noted, resistor values are 22 Ohms
RST
*) CS0 connects to DCS and VDD connects to CSR on the Registers
Data Sheet
Preliminary
8
Rev. 0.85, 2004-04
HYS72T[256/128/64][0/2][0/2]0[G/H]R-[5/3.7]-A
Registered DDR2 SDRAM Modules
Block Diagrams (cont’d)
2.2 128M x 72 (1GByte) two rank DDR2 SDRAM DIMM Modules (x8 components)
HYS72T128020[G/H] on Raw Card B
RS1
RS0
DQS0
DQS4
DQS0
DM0/DQS9
DQS4
DM4/DQS13
NU/
RDQS
DQS9
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
DM/
RDQS
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
CS DQS DQS
NU/
RDQS
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
D0
DM/
RDQS
0
1
2
3
4
5
6
7
CS DQS DQS
DQ32
DQ33
DQ34
DQ35
DQ36
DQ37
DQ38
DQ39
D9
DQS1
DQS5
DQS1
DM1/DQS10
DQS5
DM5/DQS14
NU/
RDQS
DQS10
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
DM/
RDQS
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
CS DQS
DQS
NU/
RDQS
DM/
RDQS
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
D1
CS DQS
DQS
DQS2
DQS6
DQS6
DM6/DQS15
NU/
RDQS
DQ16
DQ17
DQ18
DQ19
DQ20
DQ21
DQ22
DQ23
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
DM/
RDQS
0
1
2
3
4
5
6
7
CS DQS
DQS
NU/
RDQS
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
D2
DM/
RDQS
0
1
2
3
4
5
6
7
CS DQS DQS
DQ48
DQ49
DQ50
DQ51
DQ52
DQ53
DQ54
DQ55
D11
DQS3
DQS7
DQS7
DM7/DQS16
NU/
RDQS
DQ24
DQ25
DQ26
DQ27
DQ28
DQ29
DQ30
DQ31
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
DM/
RDQS
0
1
2
3
4
5
6
7
CS DQS DQS
NU/
RDQS
DM/
RDQS
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
D3
CS DQS
DQS
NU/
RDQS
DQ56
DQ57
DQ58
DQ59
DQ60
DQ61
DQ62
DQ63
D12
DM/
RDQS
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
CS DQS
DM/
RDQS
CS DQS
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
DM/
RDQS
DM/
RDQS
DM/
RDQS
NU/
RDQS
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
D7
CS DQS DQS
D14
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
CS DQS DQS
CS DQS DQS
D13
0
1
2
3
4
5
6
7
NU/
RDQS
DQS
D6
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
DM/
RDQS
0
1
2
3
4
5
6
7
NU/
RDQS
DQS
D5
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
DQS16
NU/
RDQS
CS DQS DQS
D4
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
NU/
RDQS
DQS15
DQS3
DM3/DQS12
DQS12
NU/
RDQS
DQ40
DQ41
DQ42
DQ43
DQ44
DQ45
DQ46
DQ47
D10
DM/
RDQS
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
DQS14
DQS0
DM2/DQS11
DQS11
NU/
RDQS
DQS13
CS DQS
DQS
D15
DM/
RDQS
0
1
2
3
4
5
6
7
CS DQS DQS
D16
DQS8
DQS8
DM0/DQS17
NU/
RDQS
DQS17
CB0
CB1
CB2
CB3
CB4
CB5
CB6
CB7
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
DM/
RDQS
CS DQS
D8
DQS
NU/
RDQS
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
DM/
RDQS
0
1
2
3
4
5
6
7
VDDSPD
Serial PD
VDD, V DDQ
D0 - D17
VREF
D0 - D17
CS DQS DQS
D17
V SS
D0 - D17
Serial PD
SCL
1:2
CS0 *
CS1 *
B A 0-BA1
A0 -A13
RAS
CAS
WE
CKE0
CKE1
ODT0
ODT1
RESET
PCK7
PCK 7
R
E
G
I
S
T
E
R
RS1 -> C S : SDRAMs D9-D17
RB A0 -RBA1 -> B A 0-BA1 : SDRAMs D0-D17
RA0 -RA 13-> A0 -A 13: SDR A Ms D0-D17
RR A S -> RAS : SD RAMs D0-D17
RC AS -> C A S: SD RAMs D0-D17
RW E -> WE : SD RAMs D0-D17
RCK E0 -> CKE :SDRAMs D0-D8
RCK E1 -> CKE :SDRAMs D9-D17
RODT0 -> ODT : SDRAMs D0-D8
SDA
WP A0
RS0 -> C S : SDRAMs D0-D8
A1
A2
SA0 SA1 SA2
PCK0-PCK6, PCK8,PCK9
CK 0
CK 0
P
L
L
RESET
OE
PCK0-PCK6,
PCK8,PCK9
CK : SDRAMs D0-D17
CK : SDRAMs D0-D17
:
PCK7 -> CK Register
PCK7 > CK : Register
RODT1 -> ODT : SDRAMs D9-D17
RST
DQ-to-I/O wiring may be changed within a byte
DQ/DQS/DQS, adress and control resistors are 22 Ohms
*) CS0 connects to CRS, CS1 connects to CSR on a Register. CS1 connects to DCS and CS0 connects to CSR on another Register.
RESET, PCK7 and PCK7 connect to bother Registers. Other signals connect to one of two Registers.
Data Sheet
Preliminary
9
Rev. 0.85, 2004-04
HYS72T[256/128/64][0/2][0/2]0[G/H]R-[5/3.7]-A
Registered DDR2 SDRAM Modules
Block Diagrams (cont’d)
2.3 One Rank 128M x 72 (1 GByte) DDR2 SDRAM DIMM Modules (x4 components)
HYS72T128000[G/H] on Raw Card C
VSS
RS0
DQS0
DQS9
DQS9
DQS0
DM
DQ0
DQ1
DQ2
DQ3
I/O 0
I/O 1
I/O 2
I/O 3
CS DQS
DM
DQS
D0
DQS1
DQS0
DQ4
DQ5
DQ6
DQ7
I/O 0
I/O 1
I/O 2
I/O 3
DQ12
DQ13
DQ14
DQ15
I/O 0
I/O 1
I/O 2
I/O 3
DQ20
DQ21
DQ22
DQ23
I/O 0
I/O 1
I/O 2
I/O 3
DQ28
DQ29
DQ30
DQ31
I/O 0
I/O 1
I/O 2
I/O 3
DQ36
DQ37
DQ38
DQ39
I/O 0
I/O 1
I/O 2
I/O 3
DQ44
DQ45
DQ46
DQ47
I/O 0
I/O 1
I/O 2
I/O 3
DQ52
DQ53
DQ54
DQ55
I/O 0
I/O 1
I/O 2
I/O 3
DQ60
DQ61
DQ62
DQ63
I/O 0
I/O 1
I/O 2
I/O 3
CB4
CB5
CB6
CB7
I/O 0
I/O 1
I/O 2
I/O 3
DQS10
DQS10
DM
DQ8
DQ9
DQ10
DQ11
I/O 0
I/O 1
I/O 2
I/O 3
DQ16
DQ17
DQ18
DQ19
I/O 0
I/O 1
I/O 2
I/O 3
DM
CS DQS DQS
D1
DM
DM
CS DQS DQS
D2
I/O 0
I/O 1
I/O 2
I/O 3
DM
CS DQS DQS
D3
DQS
CS DQS
DQS
D12
DQS13
DQS4
DQS4
DQS13
DM
DQ32
DQ33
DQ34
DQ35
I/O 0
I/O 1
I/O 2
I/O 3
DM
CS DQS DQS
D4
CS DQS
DQS
D13
DQS14
DQS14
DQS5
DQS5
DM
DQ40
DQ41
DQ42
DQ43
I/O 0
I/O 1
I/O 2
I/O 3
DQ48
DQ49
DQ50
DQ51
I/O 0
I/O 1
I/O 2
I/O 3
DM
CS DQS DQS
D5
CS DQS
DQS
D14
DQS15
DQS15
DQS6
DQS6
DM
DM
CS DQS DQS
D6
CS DQS
DQS
D15
DQS16
DQS16
DQS7
DQS7
DM
DQ56
DQ57
DQ58
DQ59
I/O 0
I/O 1
I/O 2
I/O 3
CB0
CB1
CB2
CB3
I/O 0
I/O 1
I/O 2
I/O 3
DM
CS DQS DQS
D7
DQS8
DQS8
CS DQS
DQS
D16
DQS17
DQS17
DM
DM
CS DQS DQS
D8
Serial PD
RS0 -> C S : SDRAMs D0-D17
RB A0 -RBA1 -> BA 0-BA1 : SDRAMs
RA0 -RA 13-> A0 -A 13: SDR A Ms D0-D17
RR A S -> RAS : SD RAMs D0-D17
RC AS -> C A S: SD RAMs D0-D17
RW E -> WE : SD RAMs D0-D17
RCK E0 -> CKE :SDRAMs D0-D17
RODT0 -> ODT : SDRAMs D0-D17
SCL
SDA
WP A0
A1
A2
SA0 SA1 SA2
CK 0
CK 0
RST
RESET
*) CS0 connects to DCS of Register 1 and CSR of Register 2,
CSR of Register 1 and DCS of Register 2 connects to VDD
**) RESET, PCK7 and PCK7 connet to both Registers.
Other signals connect to one of two Registers.
Data Sheet
Preliminary
CS DQS
D11
DQS12
DM
DQ24
DQ25
DQ26
DQ27
R
E
G
I
S
T
E
R
DQS
DQS12
DQS3
DQS3
1:2
CS DQS
D10
DQS11
DQS11
DQS2
DQS2
CS0 *
B A 0-BA1
A0 -A13
RAS
CAS
WE
CKE0
ODT0
RESET
PCK7
PCK 7
CS DQS DQS
D9
P
L
L
OE
CS DQS
DQS
D17
VDDSPD
Serial PD
VDD, V DDQ
D0 - D17
VREF
D0 - D17
V SS
PCK0-PCK6,
PCK8,PCK9
PCK0-PCK6,
PCK8,PCK9
D0 - D17
CK : SDRAMs D0-D17
CK : SDRAMs D0-D17
PCK7 -> CK : Register
PCK7 > CK : Register
DQ-to-I/O wiring may be changed within per nibble
Unless otherwise noted, resistor values are 22 Ohms
10
Rev. 0.85, 2004-04
HYS72T[256/128/64][0/2][0/2]0[G/H]R-[5/3.7]-A
Registered DDR2 SDRAM Modules
Block Diagrams (cont’d)
2.4 256M x 72 (2 GByte) two rank DDR2 SDRAM DIMM Modules (x4 components)
HYS72T256020[G/H] / HYS72T256220[G/H]
RS1
VSS
RS0
DQS0
DQS9
DQS9
DQS0
DM CS DQS DQS
DQ0
DQ1
DQ2
DQ3
I/O 0
I/O 1
I/O 2
I/O 3
D0-0
DM CS DQS DQS
I/O 0
I/O 1
I/O 2
I/O 3
DM CS DQS
D0-1
DQS1
DQS1
DQ4
DQ5
DQ6
DQ7
I/O 0
I/O 1
I/O 2
I/O 3
DQ12
DQ13
DQ14
DQ15
I/O 0
I/O 1
I/O 2
I/O 3
DQ20
DQ21
DQ22
DQ23
I/O 0
I/O 1
I/O 2
I/O 3
DM CS DQS
I/O 0
I/O 1
I/O 2
I/O 3
DQS
D1-0
DM CS DQS
I/O 0
I/O 1
I/O 2
I/O 3
DQS
D9-0
DM CS DQS
D1-1
DQS2
DQS2
DQS
D9-1
DM CS DQS
DQS
I/O 0
I/O 1
I/O 2
I/O 3
D10-0
DQS
D10-1
DQS11
DQS11
DM CS DQS
I/O 0
I/O 1
I/O 2
I/O 3
DQ16
DQ17
DQ18
DQ19
DQS
D2-0
DM CS DQS
I/O 0
I/O 1
I/O 2
I/O 3
DQS
DM CS DQS
D2-1
DQS3
DQS3
DM CS DQS
DQS
I/O 0
I/O 1
I/O 2
I/O 3
D11-0
DQS
D11-1
DQS12
DQS12
DM CS DQS
DQ24
DQ25
DQ26
DQ27
I/O 0
I/O 1
I/O 2
I/O 3
DQS
D3-0
DM CS DQS
I/O 0
I/O 1
I/O 2
I/O 3
DQS
DM CS DQS
I/O 0
I/O 1
I/O 2
I/O 3
DQ28
DQ29
DQ30
DQ31
D3-1
DQS4
DQS4
DM CS DQS
DQS
I/O 0
I/O 1
I/O 2
I/O 3
D12-0
DQS
D12-1
DQS13
DQS13
DM CS DQS
DQ32
DQ33
DQ34
DQ35
I/O 0
I/O 1
I/O 2
I/O 3
DQS
D4-0
DM CS DQS
I/O 0
I/O 1
I/O 2
I/O 3
DQS
DM CS DQS
I/O 0
I/O 1
I/O 2
I/O 3
DQ36
DQ37
DQ38
DQ39
D4-1
DQS5
DQS5
DM CS DQS DQS
DQS
I/O 0
I/O 1
I/O 2
I/O 3
D13-0
D13-1
DQS14
DQS14
DM CS DQS
DQ40
DQ41
DQ42
DQ43
I/O 0
I/O 1
I/O 2
I/O 3
DQS
D5-0
DM CS DQS
I/O 0
I/O 1
I/O 2
I/O 3
DQS
DM CS DQS
D5-1
DQS6
DQS6
DQ44
DQ45
DQ46
DQ47
I/O 0
I/O 1
I/O 2
I/O 3
DQ52
DQ53
DQ54
DQ55
I/O 0
I/O 1
I/O 2
I/O 3
DQ60
DQ61
DQ62
DQ63
I/O 0
I/O 1
I/O 2
I/O 3
CB4
CB5
CB6
CB7
I/O 0
I/O 1
I/O 2
I/O 3
DM CS DQS DQS
DQS
I/O 0
I/O 1
I/O 2
I/O 3
D14-0
D14-1
DQS15
DQS15
DM CS DQS
I/O 0
I/O 1
I/O 2
I/O 3
DQ48
DQ49
DQ50
DQ51
DQS
D6-0
DM CS DQS
I/O 0
I/O 1
I/O 2
I/O 3
DQS
DM CS DQS
D6-1
DQS7
DQS7
DM CS DQS
DQS
I/O 0
I/O 1
I/O 2
I/O 3
D15-0
DQS
D15-1
DQS16
DQS16
DM CS DQS
DQ56
DQ57
DQ58
DQ59
I/O 0
I/O 1
I/O 2
I/O 3
DQS
D7-0
DM CS DQS
I/O 0
I/O 1
I/O 2
I/O 3
DQS
DM CS DQS
D7-1
DQS8
DQS8
DM CS DQS
DQS
I/O 0
I/O 1
I/O 2
I/O 3
D16-0
DQS
D16-1
DQS17
DQS17
DM CS DQS
CB0
CB1
CB2
CB3
I/O 0
I/O 1
I/O 2
I/O 3
DQS
D8-0
DM CS DQS
I/O 0
I/O 1
I/O 2
I/O 3
DQS
DM CS DQS
D8-1
1:2
R
E
G
I
S
T
E
R
RS0 -> C S : SDRAMs D0-0 ~ D17-0
RS1 -> C S : SDRAMs D0-1 ~ D17-1
RB A0 -RBA1 -> BA 0-BA1 : SDRAMs D0~D17
RA0 -RA 13-> A0 -A 13: SDR A Ms D0~D17
RR A S -> RAS : SD RAMs D0~D17
RC AS -> C A S: SDRAMs D0~D17
RW E -> WE : SDRAMs D0~D17
RCK E0 -> CKE : SDRAMs D0-0 ~ D17-0
RCK E1 -> CKE :SDRAMs D0-1 ~ D17-1
RODT0 -> ODT : SDRAMs D0-0 ~ D17-0
RODT1 -> ODT : SDRAMs D0-1 ~ D17-1
SCL
DM CS DQS
DQS
I/O 0
I/O 1
I/O 2
I/O 3
D17-0
Serial PD
RESET
PCK7
PCK 7
I/O 0
I/O 1
I/O 2
I/O 3
DQS10
DQS10
DQ8
DQ9
DQ10
DQ11
CS0 *
CS1 *
B A 0-BA1
A0 -A13
RAS
CAS
WE
CKE0
CKE1
ODT0
ODT1
DM CS DQS
DQS
DQS
D17-1
VDDSPD
Serial PD
VDD, V DDQ
D0 - D17
SDA
WP A0
A1
A2
VREF
SA0 SA1 SA2
CK 0
CK 0
RESET
P
L
L
OE
V SS
PCK0-PCK6, PCK8,PCK9
PCK0-PCK6,
PCK8,PCK9
D0 - D17
D0 - D17
CK : SDRAMs D0-D17
CK : SDRAMs D0-D17
PCK7 -> CK : Register
PCK7 > CK : Register
Notes:
1. DQ-to-I/O wiring may be changed within a nibble.
2. Unless otherwise noted, resistors values are 22 Ohms
RST
*) CS0 connects to CRS, CS1 connects to CSR on a Register. CS1 connects to DCS and CS0 connects to CSR on another Register.
RESET, PCK7 and PCK7 connect to bother Registers. Other signals connect to one of two Registers.
Data Sheet
Preliminary
11
Rev. 0.85, 2004-04
HYS72T[256/128/64][0/2][0/2]0[G/H]R-[5/3.7]-A
Registered DDR2 SDRAM Modules
3.0 Absolute Maximum Ratings
Parameter
Symbol
Limit Values
min.
max.
Unit
Voltage on any pins relative to VSS
VIN, VOUT
– 0.5
2.3
V
Voltage on VDD relative to VSS
VDD
– 1.0
2.3
V
Voltage on VDD Q relative to VSS
VDDQ
– 0.5
2.3
Storage temperature range
TSTG
-55
+100
o
C
Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
3.1 Operating Temperature Range
Parameter
Symbol
Limit Values
min.
max.
Unit
DIMM Module Operating Temperature Range (ambient)
TOPR
0
+55
o
C
DRAM Component Case Temperature Range
TCASE
0
+95
o
C
Notes
1-4
1. DRAM Component Case Temperature is the surface temperature in the center on the top side of any of the DRAMs. For
measurement conditions, please refer to the JEDEC document JESD51-2.
2. Within the DRAM Component Case Temperature range all DRAM specification will be supported.
3. Above 85oC DRAM case temperature the Auto-Refresh command interval has to be reduced to tREFI = 3.9 µs.
4. Self-Refresh period is hard-coded in the DRAMs and therefore it is imperative that the system ensures the DRAM is below
85oC case temperature before initiating self-refresh operation.
3.2 Supply Voltage Levels and DC Operating Conditions
Parameter
Symbol
Limit Values
min.
nom.
Unit
Notes
max.
Device Supply Voltage
VDD
1.7
1.8
1.9
V
-
Output Supply Voltage
VDDQ
1.7
1.8
1.9
V
1)
Input Reference Voltage
VREF
0.49 x VDDQ
0.5 x VDDQ
0.51 x VDDQ
V
2)
EEPROM Supply Voltage
VDDSPD
1.7
–
3.6
V
DC Input Logic High
VIH (DC)
VREF + 0.125
–
VDDQ + 0.3
V
DC Input Logic Low
VIL (DC)
– 0.30
–
VREF – 0.125
V
In / Output Leakage Current
IL
–5
–
5
µA
1
2
3
3)
Under all conditions, VDDQ must be less than or equal to VDD
Peak to peak AC noise on VREF may not exceed ± 2% VREF (DC).VREF is also expected to track noise variations in VDDQ.
For any pin on the DIMM connector under test input of 0 V ≤ VIN ≤ VDDQ + 0.3 V.
Data Sheet
Preliminary
12
Rev. 0.85, 2004-04
HYS72T[256/128/64][0/2][0/2]0[G/H]R-[5/3.7]-A
Registered DDR2 SDRAM Modules
4.0 IDD Specifications and Conditions
4.1 512 MByte Registered Module HYS72T64000[G/H] (one rank, nine components x8)
512 MByte HYS72T64000[G/H]
PC2-3200R “-5”
PC2-4300R “-3.7”
max.
max.
918
Unit
mA
Note
745
Symbol
Parameter / Condition
Operating Current
IDD0
1
IDD1
Operating Current
790
1008
mA
1
IDD2P
Precharge PD Standby Current
286
369
mA
1
IDD2N
Precharge Standby Current
538
639
mA
1
IDD2Q
Precharge Quiet Standby Current
475
603
mA
1
IDD3P(0)
Active PD Standby Current
367
477
mA
1
IDD3P(1)
LP Active PD Standby Current
295
378
mA
1
IDD3N
Active Standby Current
565
693
mA
1
IDD4R
Operating Current Burst Read
880
1143
mA
1
IDD4W
Operating Current Burst Write
925
1188
mA
1
IDD5B
Auto-Refresh Current (tRFCmin.)
1330
1503
mA
1
IDD5D
Auto-Refresh Current (tREFI)
304
387
mA
1
IDD6
Self-Refresh Current
36
36
mA
1
IDD7
Operating Current
1420
1593
mA
1
Note: 1) Calculated values from component data. ODT disabled. IDD1, IDD4R, and IDD7 are defined with the outputs disabled.
Currents includes Registers and PLL.
4.2 1024 MByte Registered Module HYS72T128020[G/H] (two ranks, 18 components x8)
1024 MByte HYS72T128020[G/H]
PC2-3200R “-5”
Symbol
Parameter / Condition
Operating Current
IDD0
PC2-4300R “-3.7”
max.
max.
1111
Unit
mA
Note
899
1, 2
IDD1
Operating Current
944
1201
mA
1, 2
IDD2P
Precharge PD Standby Current
440
562
mA
1, 3
IDD2N
Precharge Standby Current
944
1210
mA
1, 3
IDD2Q
Precharge Quiet Standby Current
818
1030
mA
1, 3
IDD3P(0)
Active PD Standby Current
602
778
mA
1, 3
IDD3P(1)
LP Active PD Standby Current
458
580
mA
1, 3
IDD3N
Active Standby Current
998
1210
mA
1, 3
IDD4R
Operating Current Burst Read
1034
1336
mA
1, 2
IDD4W
Operating Current Burst Write
1079
1381
mA
1, 2
IDD5B
Auto-Refresh Current (tRFCmin.)
1484
1696
mA
1, 2
IDD5D
Auto-Refresh Current (tREFI)
476
598
mA
1, 3
IDD6
Self-Refresh Current
72
72
mA
1, 3
IDD7
Operating Current
1574
1786
mA
1, 2
Notes: 1) Calculated values from component data. ODT disabled. IDD1, IDD4R, and IDD7 are defined with the outputs disabled.
Currents includes Registers and PLL.
2) The other rank is in IDD2P Precharge Power-Down Standby Current mode
3) Both ranks are in the same IDD current mode
Data Sheet
Preliminary
13
Rev. 0.85, 2004-04
HYS72T[256/128/64][0/2][0/2]0[G/H]R-[5/3.7]-A
Registered DDR2 SDRAM Modules
4.3 1024 Mbyte Registered Module HYS72T128000[G/H] (one rank, 18 components x4)
1024 MByte HYS72T128000[G/H]
PC2-3200R “-5”
Symbol
Parameter / Condition
Operating Current
IDD0
PC2-4300R “-3.7”
max.
max.
1660
Unit
mA
Note
1358
1448
1840
mA
1
1
IDD1
Operating Current
IDD2P
Precharge PD Standby Current
440
562
mA
1
IDD2N
Precharge Standby Current
944
1210
mA
1
IDD2Q
Precharge Quiet Standby Current
818
1030
mA
1
IDD3P(0)
Active PD Standby Current
602
778
mA
1
IDD3P(1)
LP Active PD Standby Current
458
580
mA
1
IDD3N
Active Standby Current
998
1210
mA
1
IDD4R
Operating Current Burst Read
1628
2110
mA
1
IDD4W
Operating Current Burst Write
1718
2200
mA
1
IDD5B
Auto-Refresh Current (tRFCmin.)
2528
2830
mA
1
IDD5D
Auto-Refresh Current (tREFI)
476
598
mA
1
IDD6
Self-Refresh Current
72
72
mA
1
IDD7
Operating Current
2708
3010
mA
1
Note: 1) Calculated values from component data. ODT disabled. IDD1, IDD4R, and IDD7 are defined with the outputs disabled.
Currents includes Registers and PLL.
4.4 2048 MByte Registered Module HYS72T256[0/2]20[G/H] (two ranks, 36 components x4)
2048 MByte HYS72T256020[G/H]
2048 MByte HYS72T256220[G/H]
PC2-3200R “-5”
Symbol
Parameter / Condition
Operating Current
IDD0
PC2-4300R “-3.7”
max.
max.
1696
Unit
mA
Note
1394
1520
1912
mA
1, 2
512
623
mA
1, 3
1, 2
IDD1
Operating Current
IDD2P
Precharge PD Standby Current
IDD2N
Precharge Standby Current
1520
1930
mA
1, 3
IDD2Q
Precharge Quiet Standby Current
1268
1570
mA
1, 3
IDD3P(0)
Active PD Standby Current
836
1066
mA
1, 3
IDD3P(1)
LP Active PD Standby Current
548
670
mA
1, 3
IDD3N
Active Standby Current
1628
1930
mA
1, 3
IDD4R
Operating Current Burst Read
1700
2182
mA
1, 2
IDD4W
Operating Current Burst Write
1790
2272
mA
1, 2
IDD5B
Auto-Refresh Current (tRFCmin.)
2600
2902
mA
1, 2
IDD5D
Auto-Refresh Current (tREFI)
584
706
mA
1, 3
IDD6
Self-Refresh Current
144
144
mA
1, 3
IDD7
Operating Current
2780
3082
mA
1, 2
Notes: 1) Calculated values from component data. ODT disabled. IDD1, IDD4R, and IDD7 are defined with the outputs disabled.
Currents includes Registers and PLL.
2) The other rank is in IDD2P Precharge Power-Down Standby Current mode
3) Both ranks are in the same IDD current mode
Data Sheet
Preliminary
14
Rev. 0.85, 2004-04
HYS72T[256/128/64][0/2][0/2]0[G/H]R-[5/3.7]-A
Registered DDR2 SDRAM Modules
4.5 IDD Measurement Conditions
(VDD = 1.8V ± 0.1V; VDDQ = 1.8V ± 0.1V)
Symbol
Parameter/Condition
IDD0
Operating Current - One bank Active - Precharge
tCK = tCKmin., tRC = tRCmin., tRAS = tRASmin., CKE is HIGH, CS is high between valid commands. Address and control
inputs are SWITCHING, Databus inputs are SWITCHING.
IDD1
Operating Current - One bank Active - Read - Precharge
IOUT = 0 mA, BL = 4, tCK = tCKmin., tRC = tRCmin., tRAS = tRASmin.,tRCD = tRCDmin.,AL = 0, CL = CLmin.;
CKE is HIGH, CS is high between valid commands. Address and control inputs are SWITCHING, Databus inputs are
SWITCHING.
IDD2P
Precharge Power-Down Current: All banks idle; CKE is LOW; tCK = tCKmin.;
IDD2N
Precharge Standby Current: All banks idle; CS is HIGH; CKE is HIGH; tCK = tCKmin.;
IDD2Q
IDD3P(0)
IDD3P(1)
Other control and address inputs are STABLE, Data bus inputs are FLOATING.
Other control and address inputs are SWITCHING, Data bus inputs are SWITCHING.
Precharge Quiet Standby Current: All banks idle; CS is HIGH; CKE is HIGH; tCK = tCKmin.;
Other control and address inputs are STABLE, Data bus inputs are FLOATING.
Active Power-Down Current: All banks open; tCK = tCKmin., CKE is LOW; Other control and address inputs are STABLE, Data bus
MRS A12 bit is set to “0” (Fast Power-down Exit);
inputs are FLOATING.
Active Power-Down Current: All banks open; tCK = tCKmin., CKE is LOW; Other control and address inputs are STABLE, Data bus
MRS A12 bit is set to “1” (Slow Power-down Exit);
inputs are FLOATING.
IDD3N
Active Standby Current: All banks open; tCK = tCKmin.; tRAS = tRASmax; tRP = tRPmin.,CKE is HIGH; CS is high between
valid commands. Other control and address inputs are SWITCHING, Data bus inputs are SWITCHING.
IDD4R
Operating Current - Burst Read: All banks open; Continuous burst reads; BL = 4;AL = 0, CL = CLmin.; tCK = tCKmin.;
tRAS = tRASmax., tRP = tRPmin.; CKE is HIGH, CS is high between valid commands.
Address inputs are SWITCHING; Data Bus inputs are SWITCHING; IOUT = 0mA.
IDD4W
Operating Current - Burst Write: All banks open; Continuous burst writes; BL = 4; AL = 0, CL = CLmin.; tCK = tCKmin.;
tRAS = tRASmax., tRP = tRPmin.; CKE is HIGH, CS is high between valid commands.
Address inputs are SWITCHING; Data Bus inputs are SWITCHING;
IDD5B
Burst Auto-Refresh Current: tCK = tCKmin., Refresh command every tRFC = tRFCmin. interval, CKE is HIGH, CS is HIGH
between valid commands, Other control and address inputs are SWITCHING, Data bus inputs are SWITCHING.
IDD5D
Distributed Auto-Refresh Current: tCK = tCKmin., Refresh command every tRFC = tREFI interval, CKE is LOW and CS is HIGH
between valid commands, Other control and address inputs are SWITCHING, Data bus inputs are SWITCHING.
IDD6
Self-Refresh Current: CKE ≤ 0.2V; external clock off, CK and CK at 0V; Other control and address inputs are FLOATING, Data bus
inputs are FLOATING. RESET = Low. IDD6 current values are guaranteed up to TCASE of 85oC max.
IDD7
All Bank Interleave Read Current:
1. All banks are being interleaved at minimum tRC without violating tRRD using a burst length of 4. Control and address
bus inputs are STABLE during DESELECTS. Iout = 0mA.
2. Timing pattern:
- DDR2 -400: A0 RA0 A1 RA1 A2 RA2 A3 RA3 D D D D
- DDR2 -533: A0 RA0 D A1 RA1 D A2 RA2 D A3 RA3 D D D D D
- DDR2 -667: A0 RA0 D D A1 RA1 D D A2 RA2 D D A3 RA3 D D D D D
3. Legend: A = Activate, RA = Read with Auto-Precharge, D=DESELECT
Notes:
1. IDD specifications are tested after the device is properly initialized and IDD parameter are specified with ODT disabled.
2. Definitions for IDD:
LOW is defined as VIN <= VIL(ac)max; HIGH is defined as VIN >= VIH(ac)min.
STABLE is defined as inputs are stable at a HIGH or LOW level.
FLOATING is defined as inputs are VREF = VDDQ / 2.
SWITCHING is defined as:
inputs are changing between HIGH and LOW every other clock (once per two cycles) for address and control signals, and
inputs changing between HIGH and LOW every other clock (once per cycle) for DQ signals not including mask or strobes.
3. IDD1, IDD4R, and IDD7 current measurements are defined with the outputs disabled (Iout = 0 mA). To achieve this on module
level the output buffers can be disabled using an EMRS(1) (Extended Mode Register Command) by setting A12 bit to HIGH.
3. For two rank modules: For all active current measurements the other rank is in Precharge Power-Down Mode IDD2P
4. RESET signal is high for all currents, except for IDD6 “Self Refresh”.
5. All current measurements includes Register and PLL current consumption.
Data Sheet
Preliminary
15
Rev. 0.85, 2004-04
HYS72T[256/128/64][0/2][0/2]0[G/H]R-[5/3.7]-A
Registered DDR2 SDRAM Modules
4.5 IDD Measurement Conditions (cont’d)
For testing the IDD parameters, the following timing parameters are used:
Parameter
PC2-3200R “-5“
PC2-4300R “-3.7”
3-3-3
4-4-4
Unit
Symbol
CAS Latency
CLmin
3
4
Clock Cycle Time
tCKmin
5
3.75
ns
tRCDmin
15
15
ns
Active to Read or Write delay
Active to Active / Auto-Refresh command period
Active bank A to Active bank B command delay
x4 & x8
Active to Precharge Command
Precharge Command Period
Auto-Refresh to Active / Auto-Refresh command period
Average periodic Refresh interval
tCK
tRCmin
60
60
ns
tRRDmin
7.5
7.5
ns
tRASmin
45
45
ns
tRPmin
15
15
ns
tRFCmin
105
105
ns
tREFI
7.8
7.8
µs
4.6 ODT (On Die Termination) Current
The ODT function adds additional current consumption to the DDR2 SDRAM when enabled by the EMRS(1).
Depending on address bits A6 & A2 in the EMRS(1) a “week” or “strong” termination can be selected. The current consumption for any terminated input pin, depends on the input pin is in tri-state or driving “0” or “1”, as long
a ODT is enabled during a given period of time.
ODT current per terminated pin:
EMRS(1) State min. typ. max.
Enabled ODT current per DQ
added IDDQ current for ODT enabled;
ODT is HIGH; Data Bus inputs are FLOATING
Unit
A6 = 0, A2 = 1
5
6
7.5
mA/DQ
A6 = 1, A2 = 0
2.5
3
3.75 mA/DQ
A6 = 0, A2 = 1
10
12
15
mA/DQ
A6 = 1, A2 = 0
5
6
7.5
mA/DQ
IODTO
Active ODT current per DQ
IODTT
added IDDQ current for ODT enabled;
ODT is HIGH; worst case of Data Bus inputs are STABLE or SWITCHING.
note: For power consumption calculations the ODT duty cycle has to be taken into account
Data Sheet
Preliminary
16
Rev. 0.85, 2004-04
HYS72T[256/128/64][0/2][0/2]0[G/H]R-[5/3.7]-A
Registered DDR2 SDRAM Modules
5.0 Electrical Characteristics & AC Timings
5.1 AC Timing Parameter by Speed Grade (Component level data, for reference only)
Symbol
tAC
-5
DDR2-400
Parameter
DQ output access time from CK / CK
tDQSCK DQS output access time from CK / CK
-3.7
DDR2-533
Min
Max
− 600
− 500
Unit
Min
Max
+ 600
-500
+500
+ 500
−450
+450
ps
ps
tCH
CK, CK high-level width
0.45
0.55
0.45
0.55
tCK
0.45
0.55
0.45
0.55
tCK
tCL
CK, CK low-level width
tHP
Clock Half Period
tCK
Clock cycle time
min. (tCL, tCH)
min. (tCL, tCH)
CL = 3
5000
8000
5000
8000
ps
CL = 4 & 5
5000
8000
3750
8000
ps
tIS
Address and control input setup time
600
-
600
-
ps
tIH
Address and control input hold time
600
-
600
-
ps
tDS
DQ and DM input setup time
400
-
350
-
ps
tDH
DQ and DM input hold time
400
-
350
-
ps
tIPW
Control and Addr. input pulse width (each input)
0.6
-
0.6
-
tCK
tDIPW
DQ and DM input pulse width (each input)
0.35
-
0.35
-
tCK
tHZ
-
tACmax
-
tACmax
ps
tLZ(DQ) DQ low-impedance from CK / CK
2*tACmin
tACmax
2*tACmin
tACmax
ps
tLZ(DQS) DQS low-impedance from CK / CK
tACmin
tACmax
tACmin
tACmax
ps
-
350
-
300
ps
ps
tDQSQ
Data-out high-impedance time from CK / CK
DQS-DQ skew
(for DQS & associated DQ signals)
tQHS
Data hold skew factor
tQH
Data Output hold time from DQS
-
450
-
400
tHP-tQHS
-
tHP-tQHS
-
Write command to 1st DQS latching transition
WL
-0.25
WL
+0.25
WL
-0.25
WL
+0.25
tCK
tDQSL,H DQS input low (high) pulse width (write cycle)
0.35
-
0.35
-
tCK
tDSS
DQS falling edge to CLK setup time
(write cycle)
0.2
-
0.2
-
tCK
tDSH
DQS falling edge hold time from CLK
(write cycle)
0.2
-
0.2
-
tCK
tMRD
Mode register set command cycle time
2
-
2
-
tCK
tWPRE
Write preamble
0.25
-
0.25
-
tCK
tWPST
Write postamble
0.40
0.60
0.40
0.60
tCK
tRPRE
Read preamble
0.9
1.1
0.9
1.1
tCK
tRPST
Read postamble
0.40
0.60
0.40
0.60
tCK
tRAS
Active to Precharge command
45
70000
45
70000
ns
tRC
Active to Active/Auto-refresh command period
60
-
60
-
ns
tRFC
Auto-refresh to Active/Auto-refresh command period
105
-
105
-
ns
tDQSS
Data Sheet
Preliminary
17
Rev. 0.85, 2004-04
HYS72T[256/128/64][0/2][0/2]0[G/H]R-[5/3.7]-A
Registered DDR2 SDRAM Modules
Symbol
tRCD
-5
DDR2-400
Parameter
Active to Read or Write delay (with and without Auto-Precharge) delay
-3.7
DDR2-533
Max
Min
Max
15
-
15
-
tRP
Precharge command period
tRRD
Active bank A to Active bank
B command
tCCD
CAS A to CAS B Command Period
2
-
tWR
Write recovery time
15
-
tDAL
Auto precharge write recovery + precharge time
WR+tRP
-
tWTR
Internal write to read command delay
10
tRTP
Internal read to precharge command delay
7.5
2
x4 & x8
(1k page size)
tXARD
Exit power down to any valid command
(other than NOP or Deselect)
tXARDS
Exit active power-down mode to read command
(slew exit, lower power)
tXP
Unit
Min
ns
15
-
15
-
ns
7.5
-
7.5
-
ns
2
-
tCK
15
-
ns
WR+tRP
-
tCK
-
7.5
-
ns
-
7.5
-
ns
-
2
-
tCK
6 - AL
-
6 - AL
-
tCK
2
-
2
-
tCK
tCK
Exit precharge power-down to any valid command (other
than NOP or Deselect)
tXSRD
Exit Self-Refresh to read command
200
-
200
-
tXSNR
Exit Self-Refresh to non-read command
tRFC + 10
-
tRFC + 10
-
ns
tCKE
CKE minimum high and low pulse width
3
-
3
-
tCK
tOIT
OCD drive mode output delay
0
12
0
12
ns
tIS+tCK
+tIH
-
tIS+tCK
+tIH
-
ns
time clocks remain ON after CKE asynchrotDELAY Minimum
nously drops low
tREFI
o
Average Periodic Refresh
Interval
o
0 C - 85 C
-
7.8
-
7.8
85oC - 95oC
-
3.9
-
3.9
µs
1. For details and notes see the relevant INFINEON component datasheet
2. Timing definition and values for tis, tih, tds and tdh may change due to actual JEDEC work. This may also effect the SPD code
for these parameters.
5.2 ODT AC Electrical Characteristics and Operating Conditions (all speed bins)
Symbol Parameter / Condition
tAOND
tAON
min.
max.
Units
2
2
tCK
DDR2-400/533
tAC(min)
tAC(max) + 1 ns
DDR2-667
tAC(min)
tAC(max) + 0.7 ns
tAC(min) + 2 ns
2 tCK + tAC(max) + 1 ns
ns
2.5
2.5
tCK
ns
ODT turn-on delay
ODT turn-on
tAONPD ODT turn-on (Power-Down Modes)
tAOFD
tAOF
ODT turn-off delay
ODT turn-off
ns
tAC(min)
tAC(max) + 0.6 ns
tAOFPD
ODT turn-off delay (Power-Down Modes)
tAC(min) + 2 ns
2.5 tCK + tAC(max) + 1 ns
ns
tANPD
ODT to Power Down Mode Entry Latency
3
-
tCK
tAXPD
ODT Power Down Exit Latency
8
-
tCK
Data Sheet
Preliminary
18
Rev. 0.85, 2004-04
HYS72T[256/128/64][0/2][0/2]0[G/H]R-[5/3.7]-A
Registered DDR2 SDRAM Modules
6.0 Serial Presence Detect Codes for Registered Modules
Label Code
Jedec SPD Revision
Byte# Description
0
Programmed SPD Bytes in EEPROM
1
Total number of Bytes in EEPROM
2
Memory Type (DDR2)
3
Number of Row Addresses
4
Number of Column Addresses
5
DIMM Rank and Stacking Information
6
Data Width
7
Not used
8
Interface Voltage Level
9
tCK @ CLmax (Byte 18) [ns]
10
tAC SDRAM @ CLmax (Byte 18) [ns]
11
Error Correction Support (non-ECC, ECC)
12
Refresh Rate and Type
13
Primary SDRAM Width
14
Error Checking SDRAM Width
15
Not used
16
Burst Length Supported
17
Number of Banks on SDRAM Device
18
Supported CAS Latencies
19
Not used
20
DIMM Type Information
21
DIMM Attributes
22
Component Attributes
23
tCK @ CLmax -1 (Byte 18) [ns]
24
tAC SDRAM @ CLmax -1 [ns]
25
tCK @ CLmax -2 (Byte 18) [ns]
26
tAC SDRAM @ CLmax -2 [ns]
27
tRP.min [ns]
28
tRRD.min [ns]
Data Sheet
Preliminary
19
HYS72T64000GR–3.7–A
HYS72T64000HR–3.7–A
2 GByte
1 GByte
×72
×72
2 Ranks (×4) 1 Rank (×4)
PC2–4300R–444
Rev. 1.1
Rev. 1.1
HEX
HEX
80
80
08
08
08
08
0E
0E
0B
0B
61
60
48
48
00
00
05
05
3D
3D
50
50
02
02
82
82
04
04
04
04
00
00
0C
0C
04
04
38
38
00
00
01
01
07
05
01
01
3D
3D
50
50
50
50
60
60
3C
3C
1E
1E
HYS72T128020GR–3.7–A
HYS72T128020HR–3.7–A
Organization
HYS72T128000GR–3.7–A
HYS72T128000HR–3.7–A
Product Type
HYS72T256020GR–3.7–A
HYS72T256020HR–3.7–A
6.1 SPD Codes for PC2–4300R (–3.7)
1 GByte
512 MB
×72
×72
2 Ranks (×8) 1 Rank (×8)
Rev. 1.1
HEX
80
08
08
0E
0A
61
48
00
05
3D
50
02
82
08
08
00
0C
04
38
00
01
05
01
3D
50
50
60
3C
1E
Rev. 1.1
HEX
80
08
08
0E
0A
60
48
00
05
3D
50
02
82
08
08
00
0C
04
38
00
01
04
01
3D
50
50
60
3C
1E
Rev. 0.85, 2004-04
Label Code
Jedec SPD Revision
Byte# Description
29
tRCD.min [ns]
30
tRAS.min [ns]
31
Module Density per Rank
32
tAS.min and tCS.min [ns]
33
tAH.min and tCH.min [ns]
34
tDS.min [ns]
35
tDH.min [ns]
36
tWR.min [ns]
37
tWTR.min [ns]
38
tRTP.min [ns]
39
Analysis Characteristics
40
tRC and tRFC Extension
41
tRC.min [ns]
42
tRFC.min [ns]
43
tCK.max [ns]
44
tDQSQ.max [ns]
45
tQHS.max [ns]
46
PLL Relock Time
47
TCASE.max Delta / ∆ T4R4W Delta
48
Psi(T-A) DRAM
49
∆ T0
50
∆ T2N (UDIMM) or ∆ T2Q (RDIMM)
51
∆ T2P
52
∆ T3N
53
∆ T3P.fast
54
∆ T3P.slow
55
∆ T4R / ∆ T4R4W Sign
56
∆ T5B
57
∆ T7
58
Psi(ca) PLL
59
Psi(ca) REG
60
∆ TPLL
Data Sheet
Preliminary
20
HYS72T64000GR–3.7–A
HYS72T64000HR–3.7–A
2 GByte
1 GByte
×72
×72
2 Ranks (×4) 1 Rank (×4)
PC2–4300R–444
Rev. 1.1
Rev. 1.1
HEX
HEX
3C
3C
2D
2D
01
01
25
25
37
37
10
10
22
22
3C
3C
1E
1E
1E
1E
00
00
00
00
3C
3C
69
69
80
80
1E
1E
28
28
0F
0F
51
51
78
78
3E
3E
22
22
1E
1E
1E
1E
24
24
17
17
34
34
1E
1E
20
20
C4
C4
8C
8C
61
61
HYS72T128020GR–3.7–A
HYS72T128020HR–3.7–A
Organization
HYS72T128000GR–3.7–A
HYS72T128000HR–3.7–A
Product Type
HYS72T256020GR–3.7–A
HYS72T256020HR–3.7–A
HYS72T[256/128/64][0/2][0/2]0[G/H]R-[5/3.7]-A
Registered DDR2 SDRAM Modules
1 GByte
512 MB
×72
×72
2 Ranks (×8) 1 Rank (×8)
Rev. 1.1
HEX
3C
2D
80
25
37
10
22
3C
1E
1E
00
00
3C
69
80
1E
28
0F
51
78
3E
22
1E
1E
24
17
34
1E
20
C4
8C
61
Rev. 1.1
HEX
3C
2D
80
25
37
10
22
3C
1E
1E
00
00
3C
69
80
1E
28
0F
51
78
3E
22
1E
1E
24
17
34
1E
20
C4
8C
61
Rev. 0.85, 2004-04
Label Code
Jedec SPD Revision
Byte# Description
61
∆ TREG / Toggle Rate
62
SPD Revision
63
Checksum of Bytes 0-62
64
JEDEC ID Code of Infineon (1)
65
JEDEC ID Code of Infineon (2)
66
JEDEC ID Code of Infineon (3)
67
JEDEC ID Code of Infineon (4)
68
JEDEC ID Code of Infineon (5)
69
JEDEC ID Code of Infineon (6)
70
JEDEC ID Code of Infineon (7)
71
JEDEC ID Code of Infineon (8)
72
Module Manufacturer Location
73
Product Type, Char 1
74
Product Type, Char 2
75
Product Type, Char 3
76
Product Type, Char 4
77
Product Type, Char 5
78
Product Type, Char 6
79
Product Type, Char 7
80
Product Type, Char 8
81
Product Type, Char 9
82
Product Type, Char 10
83
Product Type, Char 11
84
Product Type, Char 12
85
Product Type, Char 13
86
Product Type, Char 14
87
Product Type, Char 15
88
Product Type, Char 16
89
Product Type, Char 17
90
Product Type, Char 18
91
Module Revision Code
92
Test Program Revision Code
Data Sheet
Preliminary
21
HYS72T64000GR–3.7–A
HYS72T64000HR–3.7–A
2 GByte
1 GByte
×72
×72
2 Ranks (×4) 1 Rank (×4)
PC2–4300R–444
Rev. 1.1
Rev. 1.1
HEX
HEX
78
78
11
11
8E
8B
C1
C1
00
00
00
00
00
00
00
00
00
00
00
00
00
00
xx
xx
37
37
32
32
54
54
32
31
35
32
36
38
30
30
32
30
30
30
47 / 48
47 / 48
52
52
33
33
2E
2E
37
37
41
41
20
20
20
20
20
20
0x
2x
xx
xx
HYS72T128020GR–3.7–A
HYS72T128020HR–3.7–A
Organization
HYS72T128000GR–3.7–A
HYS72T128000HR–3.7–A
Product Type
HYS72T256020GR–3.7–A
HYS72T256020HR–3.7–A
HYS72T[256/128/64][0/2][0/2]0[G/H]R-[5/3.7]-A
Registered DDR2 SDRAM Modules
1 GByte
512 MB
×72
×72
2 Ranks (×8) 1 Rank (×8)
Rev. 1.1
HEX
78
11
12
C1
00
00
00
00
00
00
00
xx
37
32
54
31
32
38
30
32
30
47 / 48
52
33
2E
37
41
20
20
20
2x
xx
Rev. 1.1
HEX
78
11
10
C1
00
00
00
00
00
00
00
xx
37
32
54
36
34
30
30
30
47 / 48
52
33
2E
37
41
20
20
20
20
2x
xx
Rev. 0.85, 2004-04
Label Code
Jedec SPD Revision
Byte# Description
93
Module Manufacturing Date Year
94
Module Manufacturing Date Week
95
Module Serial Number (1)
96
Module Serial Number (2)
97
Module Serial Number (3)
98
Module Serial Number (4)
99 Not used
127
Data Sheet
Preliminary
22
HYS72T64000GR–3.7–A
HYS72T64000HR–3.7–A
2 GByte
1 GByte
×72
×72
2 Ranks (×4) 1 Rank (×4)
PC2–4300R–444
Rev. 1.1
Rev. 1.1
HEX
HEX
xx
xx
xx
xx
xx
xx
xx
xx
xx
xx
xx
xx
00
00
HYS72T128020GR–3.7–A
HYS72T128020HR–3.7–A
Organization
HYS72T128000GR–3.7–A
HYS72T128000HR–3.7–A
Product Type
HYS72T256020GR–3.7–A
HYS72T256020HR–3.7–A
HYS72T[256/128/64][0/2][0/2]0[G/H]R-[5/3.7]-A
Registered DDR2 SDRAM Modules
1 GByte
512 MB
×72
×72
2 Ranks (×8) 1 Rank (×8)
Rev. 1.1
HEX
xx
xx
xx
xx
xx
xx
00
Rev. 1.1
HEX
xx
xx
xx
xx
xx
xx
00
Rev. 0.85, 2004-04
HYS72T[256/128/64][0/2][0/2]0[G/H]R-[5/3.7]-A
Registered DDR2 SDRAM Modules
1 GByte
1 GByte
512 MB
×72
×72
×72
1 Rank (×4) 2 Ranks (×8) 1 Rank (×8)
Rev. 1.1
HEX
80
Rev. 1.1
HEX
80
Rev. 1.1
HEX
80
08
08
08
08
08
08
0E
0B
61
08
0E
0B
61
08
0E
0B
60
08
0E
0A
61
08
0E
0A
60
48
00
05
50
60
48
00
05
50
60
48
00
05
50
60
48
00
05
50
60
48
00
05
50
60
02
02
02
02
02
82
04
04
00
0C
04
82
04
04
00
0C
04
82
04
04
00
0C
04
82
08
08
00
0C
04
82
08
08
00
0C
04
38
00
01
07
01
50
60
50
60
38
00
01
07
01
50
60
50
60
38
00
01
05
01
50
60
50
60
38
00
01
05
01
50
60
50
60
38
00
01
04
01
50
60
50
60
Label Code
Jedec SPD Revision
Byte# Description
0
Programmed SPD Bytes in
EEPROM
1
Total number of Bytes in
EEPROM
2
Memory Type (DDR2)
3
Number of Row Addresses
4
Number of Column Addresses
5
DIMM Rank and Stacking
Information
6
Data Width
7
Not used
8
Interface Voltage Level
9
tCK @ CLmax (Byte 18) [ns]
10
tAC SDRAM @ CLmax (Byte 18)
[ns]
11
Error Correction Support (nonECC, ECC)
12
Refresh Rate and Type
13
Primary SDRAM Width
14
Error Checking SDRAM Width
15
Not used
16
Burst Length Supported
17
Number of Banks on SDRAM
Device
18
Supported CAS Latencies
19
Not used
20
DIMM Type Information
21
DIMM Attributes
22
Component Attributes
23
tCK @ CLmax -1 (Byte 18) [ns]
24
tAC SDRAM @ CLmax -1 [ns]
25
tCK @ CLmax -2 (Byte 18) [ns]
26
tAC SDRAM @ CLmax -2 [ns]
Data Sheet
Preliminary
23
HYS72T64000GR–5–A
HYS72T64000HR–5–A
HYS72T128020GR–5–A
HYS72T128020HR–5–A
2 GByte
2 GByte
×72
×72
2 Ranks (×4) 2 Ranks (×4)
PC2–3200R–333
Rev. 1.1
Rev. 1.1
HEX
HEX
80
80
HYS72T128000GR–5–A
HYS72T128000HR–5–A
Organization
HYS72T256220GR–5–A
HYS72T256220HR–5–A
Product Type
HYS72T256020GR–5–A
HYS72T256020HR–5–A
6.2 SPD Codes for PC2–3200R (–5)
Rev. 0.85, 2004-04
1 GByte
1 GByte
512 MB
×72
×72
×72
1 Rank (×4) 2 Ranks (×8) 1 Rank (×8)
Rev. 1.1
HEX
3C
1E
3C
2D
01
35
47
15
27
3C
28
1E
00
00
3C
69
80
23
2D
0F
51
78
32
1D
Rev. 1.1
HEX
3C
1E
3C
2D
80
35
47
15
27
3C
28
1E
00
00
3C
69
80
23
2D
0F
51
78
32
1D
Rev. 1.1
HEX
3C
1E
3C
2D
80
35
47
15
27
3C
28
1E
00
00
3C
69
80
23
2D
0F
51
78
32
1D
1E
1B
1E
17
28
1B
1E
C4
1E
1B
1E
17
28
1B
1E
C4
1E
1B
1E
17
28
1B
1E
C4
1E
1B
1E
17
28
1B
1E
C4
Label Code
Jedec SPD Revision
Byte# Description
27
tRP.min [ns]
28
tRRD.min [ns]
29
tRCD.min [ns]
30
tRAS.min [ns]
31
Module Density per Rank
32
tAS.min and tCS.min [ns]
33
tAH.min and tCH.min [ns]
34
tDS.min [ns]
35
tDH.min [ns]
36
tWR.min [ns]
37
tWTR.min [ns]
38
tRTP.min [ns]
39
Analysis Characteristics
40
tRC and tRFC Extension
41
tRC.min [ns]
42
tRFC.min [ns]
43
tCK.max [ns]
44
tDQSQ.max [ns]
45
tQHS.max [ns]
46
PLL Relock Time
47
TCASE.max Delta / ∆ T4R4W Delta
48
Psi(T-A) DRAM
49
∆ T0
50
∆ T2N (UDIMM) or ∆ T2Q
(RDIMM)
51
∆ T2P
52
∆ T3N
53
∆ T3P.fast
54
∆ T3P.slow
55
∆ T4R / ∆ T4R4W Sign
56
∆ T5B
57
∆ T7
58
Psi(ca) PLL
Data Sheet
Preliminary
1E
1B
1E
17
28
1B
1E
C4
24
HYS72T64000GR–5–A
HYS72T64000HR–5–A
HYS72T128020GR–5–A
HYS72T128020HR–5–A
2 GByte
2 GByte
×72
×72
2 Ranks (×4) 2 Ranks (×4)
PC2–3200R–333
Rev. 1.1
Rev. 1.1
HEX
HEX
3C
3C
1E
1E
3C
3C
2D
2D
01
01
35
35
47
47
15
15
27
27
3C
3C
28
28
1E
1E
00
00
00
00
3C
3C
69
69
80
80
23
23
2D
2D
0F
0F
51
51
78
78
32
32
1D
1D
HYS72T128000GR–5–A
HYS72T128000HR–5–A
Organization
HYS72T256220GR–5–A
HYS72T256220HR–5–A
Product Type
HYS72T256020GR–5–A
HYS72T256020HR–5–A
HYS72T[256/128/64][0/2][0/2]0[G/H]R-[5/3.7]-A
Registered DDR2 SDRAM Modules
Rev. 0.85, 2004-04
Label Code
Jedec SPD Revision
Byte# Description
59
Psi(ca) REG
60
∆ TPLL
61
∆ TREG / Toggle Rate
62
SPD Revision
63
Checksum of Bytes 0-62
64
JEDEC ID Code of Infineon (1)
65
JEDEC ID Code of Infineon (2)
66
JEDEC ID Code of Infineon (3)
67
JEDEC ID Code of Infineon (4)
68
JEDEC ID Code of Infineon (5)
69
JEDEC ID Code of Infineon (6)
70
JEDEC ID Code of Infineon (7)
71
JEDEC ID Code of Infineon (8)
72
Module Manufacturer Location
73
Product Type, Char 1
74
Product Type, Char 2
75
Product Type, Char 3
76
Product Type, Char 4
77
Product Type, Char 5
78
Product Type, Char 6
79
Product Type, Char 7
80
Product Type, Char 8
81
Product Type, Char 9
82
Product Type, Char 10
83
Product Type, Char 11
84
Product Type, Char 12
85
Product Type, Char 13
86
Product Type, Char 14
87
Product Type, Char 15
88
Product Type, Char 16
89
Product Type, Char 17
90
Product Type, Char 18
91
Module Revision Code
Data Sheet
Preliminary
25
HYS72T64000GR–5–A
HYS72T64000HR–5–A
HYS72T128020GR–5–A
HYS72T128020HR–5–A
2 GByte
2 GByte
×72
×72
2 Ranks (×4) 2 Ranks (×4)
PC2–3200R–333
Rev. 1.1
Rev. 1.1
HEX
HEX
8C
8C
59
59
5C
5C
11
11
C3
C3
C1
C1
00
00
00
00
00
00
00
00
00
00
00
00
00
00
xx
xx
37
37
32
32
54
54
32
32
35
35
36
36
30
32
32
32
30
30
47 / 48
47 / 48
52
52
35
35
41
41
20
20
20
20
20
20
20
20
20
20
0x
0x
HYS72T128000GR–5–A
HYS72T128000HR–5–A
Organization
HYS72T256220GR–5–A
HYS72T256220HR–5–A
Product Type
HYS72T256020GR–5–A
HYS72T256020HR–5–A
HYS72T[256/128/64][0/2][0/2]0[G/H]R-[5/3.7]-A
Registered DDR2 SDRAM Modules
1 GByte
1 GByte
512 MB
×72
×72
×72
1 Rank (×4) 2 Ranks (×8) 1 Rank (×8)
Rev. 1.1
HEX
8C
59
5C
11
C0
C1
00
00
00
00
00
00
00
xx
37
32
54
31
32
38
30
30
30
47 / 48
52
35
41
20
20
20
20
20
2x
Rev. 1.1
HEX
8C
59
5C
11
47
C1
00
00
00
00
00
00
00
xx
37
32
54
31
32
38
30
32
30
47 / 48
52
35
41
20
20
20
20
20
2x
Rev. 1.1
HEX
8C
59
5C
11
45
C1
00
00
00
00
00
00
00
xx
37
32
54
36
34
30
30
30
47 / 48
52
35
41
20
20
20
20
20
20
2x
Rev. 0.85, 2004-04
1 GByte
1 GByte
512 MB
×72
×72
×72
1 Rank (×4) 2 Ranks (×8) 1 Rank (×8)
Rev. 1.1
HEX
xx
xx
Rev. 1.1
HEX
xx
xx
Rev. 1.1
HEX
xx
xx
xx
xx
xx
xx
xx
xx
xx
xx
xx
00
xx
xx
xx
xx
00
xx
xx
xx
xx
00
xx
xx
xx
xx
00
xx
xx
xx
xx
00
Label Code
Jedec SPD Revision
Byte# Description
92
Test Program Revision Code
93
Module Manufacturing Date
Year
94
Module Manufacturing Date
Week
95
Module Serial Number (1)
96
Module Serial Number (2)
97
Module Serial Number (3)
98
Module Serial Number (4)
99 Not used
127
Data Sheet
Preliminary
26
HYS72T64000GR–5–A
HYS72T64000HR–5–A
HYS72T128020GR–5–A
HYS72T128020HR–5–A
2 GByte
2 GByte
×72
×72
2 Ranks (×4) 2 Ranks (×4)
PC2–3200R–333
Rev. 1.1
Rev. 1.1
HEX
HEX
xx
xx
xx
xx
HYS72T128000GR–5–A
HYS72T128000HR–5–A
Organization
HYS72T256220GR–5–A
HYS72T256220HR–5–A
Product Type
HYS72T256020GR–5–A
HYS72T256020HR–5–A
HYS72T[256/128/64][0/2][0/2]0[G/H]R-[5/3.7]-A
Registered DDR2 SDRAM Modules
Rev. 0.85, 2004-04
HYS72T[256/128/64][0/2][0/2]0[G/H]R-[5/3.7]-A
Registered DDR2 SDRAM Modules
7.0 Package Outline
7.1 Raw Card A
Module Package
DDR2 Registered DIMM Modules Raw Card A
one physical rank, 9 components x8 organised
133.35 +- 0.15
2.7 max.
Register
30.0.
Front View
4.0
PLL
pin 1
64
120
65
63,0
5,175
5,175
55,0
1.27 +- 0.1
PCB warpage 0.40
5.0
Backside View
184
240
185
10.0
17.80
pin 121
3
3
Detail of Contacts B
5.0
2.50 +- 0.20
0.20 +- 0.15
Detail of Contacts A
3.8 typ.
0.75R
0.8 +- 0.05
1.0
1.5
2.5
note: all outline dimensions and tolerances are in accordance with the JEDEC standard (MO-237)
Data Sheet
Preliminary
27
Rev. 0.85, 2004-04
HYS72T[256/128/64][0/2][0/2]0[G/H]R-[5/3.7]-A
Registered DDR2 SDRAM Modules
7.2 Raw Card B
Module Package
DDR2 Registered DIMM Modules Raw Card B
two one physical rank, 18 components x8 organised
1 3 3.3 5 +- 0.15
4.0 m a x.
Register
Front View
30.0.
4 .0
PLL
p in 1
64
1 20
65
6 3,0
5,1 75
5 ,1 7 5
55 ,0
1 .27 +- 0.1
PCB warpage 0.40
5.0
Backside View
240
185
1 84
Register
10.0
17.80
pin 1 21
3
3
D e tail o f C o nta cts B
5 .0
2.50 +- 0.20
0.20 +- 0.15
D e ta il of C on tac ts A
3.8 typ.
0 .8
0 .75 R
+
- 0.05
1 .0
1 .5
2.5
note: all outline dimensions and tolerances are in accordance with the JEDEC standard (MO-237)
Data Sheet
Preliminary
28
Rev. 0.85, 2004-04
HYS72T[256/128/64][0/2][0/2]0[G/H]R-[5/3.7]-A
Registered DDR2 SDRAM Modules
7.3 Raw Card C
Module Package
DDR2 Registered DIMM Modules Raw Card C
one physical rank, 18 components x4 organised
1 3 3.3 5 +- 0.15
4.0 m a x.
Register
Front View
30.0.
4 .0
PLL
p in 1
64
1 20
65
6 3,0
5,1 75
5 ,1 7 5
55 ,0
1 .27 -+ 0.1
PCB warpage 0.40
5.0
Backside View
240
185
1 84
Register
10.0
17.80
pin 1 21
3
3
D e tail o f C o nta cts B
5 .0
2.50 +- 0.20
0.20 +- 0.15
D e ta il of C on tac ts A
3.8 typ.
0 .8
0 .75 R
+
- 0.05
1 .0
1 .5
2.5
note: all outline dimensions and tolerances are in accordance with the JEDEC standard (MO-237)
Data Sheet
Preliminary
29
Rev. 0.85, 2004-04
HYS72T[256/128/64][0/2][0/2]0[G/H]R-[5/3.7]-A
Registered DDR2 SDRAM Modules
7.4 Raw Card (tbd)
Module Package
DDR2 Registered DIMM Modules Raw Card (tbd.)
two physical ranks, 36 components x4 organised - planar version
133.35 +- 0.15
4.0 max.
Register
30.0
4.0
PLL
Register
Front View
pin 1
64
120
65
63,0
5,175
5,175
55,0
1.27 +- 0.1
PCB warpage 0.40
5.0
Backside View
184
240
185
10.0
17.80
pin 121
3
3
Detail of Contacts B
5.0
2.50 +- 0.20
0.20 +- 0.15
Detail of Contacts A
3.8 typ.
0.75R
0.8 -+ 0.05
1.0
1.5
2.5
note: all outline dimensions and tolerances are in accordance with the JEDEC standard (MO237)
Data Sheet
Preliminary
30
Rev. 0.85, 2004-04
HYS72T[256/128/64][0/2][0/2]0[G/H]R-[5/3.7]-A
Registered DDR2 SDRAM Modules
8.0 Nomenclature (Modules & Components)
8.1 DDR2 DIMM Modules
1
Example:
HYS
2
3
4
5
6
7
8
9
10
11
72
T
128
0
2
0
G
R
-5
-A
0 = standard
2 = dual die package
1
INFINEON Prefix
HYS for DIMM Modules
7
Product Variations
2
Module Data Width
64 = Non-ECC Modules
72 = ECC Modules
8
Package
3
DRAM Technology
9
Module Type
R = Registered DIMMs
U = Unbuffered DIMMs
DL = Small Outline DIMMs
4
Memory Density per I/O
64 = 64 Mb
128 = 128 Mb
256 = 256 Mb
10
Speed Grade
-5 = PC2-3200 (DDR2-400)
-3.7 = PC2-4300 (DDR2-533)
-3 = PC2-5400 (DDR2-667)
5
Raw Card Generation
0 = first generation
11
Die Revision
A = 1st Generation
B = 2nd Generation
C = 3rd Generation
6
Number of Memory
Ranks
0 = One Rank
2 = Two Ranks
Multiplying “Memory Density per I/O” with “Module Data Width”
and dividing by 8 for Non-ECC and 9 for ECC modules gives the
overall module memory density in MBytes.
T = DDR2
G= BGA components
8.2 DDR2 Memory Components
1
Example:
HYB
2
3
4
5
6
7
8
9
18
T
512
40
0
A
C
-5
1
INFINEON
Component Prefix
HYB for DRAM Components
6
Product Variations
0 = standard
2 = dual die package
2
Power Supply Voltage
18 = 1.8 V Power Supply
7
Die Revision
A = 1st Generation
B = 2nd Generation
C = 3rd Generation
3
DRAM Technology
T = DDR2
8
Package Type
C = BGA package
F = BGA package (lead and
halogen free)
4
Memory Density
256 = 256 Mb
512 = 512 Mb
1G = 1024Mb
9
Speed Grade
-5 =...DDR2-400
-3.7 =.DDR2-533
-3 =...DDR2-667
5
Memory Organisation
40 = x4, 4 data in/outputs
80 = x8, 8 data in/outputs
16 = x16, 16 data in/outputs
Data Sheet
Preliminary
31
Rev. 0.85, 2004-04
HYS72T[256/128/64][0/2][0/2]0[G/H]R-[5/3.7]-A
Registered DDR2 SDRAM Modules
Data Sheet
Preliminary
32
Rev. 0.85, 2004-04