Vicor IB048Q096T70N1-00 5:1 intermediate bus converter module: up to 750 w output Datasheet

IBC Module
IB048Q096T70N1-00
5:1 Intermediate Bus Converter Module: Up to 750 W Output
Features
Size:
2.30 x 1.45 x 0.42 in
58,4 x 36,8 x 10,6 mm
• Input: 38 – 55 Vdc
• 98.2% peak efficiency
• Output: 9.6 Vdc at 48 Vin
• Low profile: 0.42” height above board
• Output current: up to 70 A
• Industry standard 1/4 Brick pinout
• Output power: up to 750 W
[A]
• 1,500 Vdc isolation
[A]
• Sine Amplitude Converter
• Low noise 1 MHz ZVS/ZCS
For lower power applications see 300 W model IB048E096T40N1-00 or 500 W model IB048E096T48N1-00
Product Overview
The Intermediate Bus Converter (IBC) Module is a very efficient, low profile, isolated, fixed
ratio converter for power system applications in enterprise and optical access networks.
Rated at up to 530 W from 38 Vin and up to 750 W from 54 to 55 Vin, the IBC
conforms to an industry standard quarter-brick footprint while supplying power greatly
exceeding competitive quarter-bricks. Its leading efficiency enables full load operation
at 50 °C with only 400 LFM airflow. Its small cross section facilitates unimpeded airflow
— above and below its thin body — to minimize the temperature rise of downstream
components. A baseplate option is available for alternative cooling schemes.
Applications
• Enterprise networks
• Optical access networks
• Storage networks
• Automated test equipment
Absolute Maximum Ratings
Min
Max
Unit
38
55
Vdc
Non-operating
75
Vdc
Input voltage slew rate
5
V/μs
Notes
Input voltage (+In to –In)
Operating
<100 mS
EN to –IN
-0.5
20
Vdc
Output voltage (+Out to –Out)
-0.5
12.8
Vdc
70
A
Pout ≤ 750 W
Vdc
1 min.
Hottest Semiconductor
Output current
Dielectric withstand
(input to output)
1,500
Temperature
Operating junction
Storage
-40
125
°C
-55
125
°C
IBC MODULE
Rev 1.8
vicorpower.com
Page 1 of 14
11/2012
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IB048Q096T70N1-00
SPECIFICATIONS
All specifications valid at 48 VIN , 100% rated load and 25 °C ambient, unless otherwise indicated.
Electrical Characteristics
Attribute
Symbol
INPUT (Operating from DC input source)
Operating input voltage
Non-operating input surge withstand
Operating input dV/dt
Conditions / Notes
Min
Typ
Max
Unit
38
48
55
75
5
Vdc
Vdc
V/us
38
36
7
200
Vdc
Vdc
Vdc
µs
µs
64
64
4
Vdc
Vdc
µs
30
ms
50
µs
50
µs
250
ms
3.5
0.15
14.1
16.9
W
W
A
A
750
mArms
40
25
A
A
μF
nH
<100 mS
0.003
Undervoltage protection
Turn-on
Turn-off
Turn-on/ Turn-off hysteresis
Time constant
Undervoltage blanking time
33
31
2
UV blanking time is enabled after start up
Overvoltage protection
Turn-off
Turn-on
Time constant
50
100
60
55
Turn ON delay
VIN reaching turn-on voltage
to enable function operational, see Figure 6
Enable to 10% VOUT; pre-applied VIN,
see Figure 7, 0 load capacitance
From 10% to 90% VOUT, 10% load,
0 load capacitance
See page 10 for restart after EN pin disable
Start up inhibit
Turn-on delay
Output voltage rise time
Restart turn-on delay
No Load power dissipation
Enabled
Disabled
Input current
Inrush current overshoot
25
2.3
0.12
Low line, full load
Using test circuit in Figure 21, 15% load, high line
At max power;
Using test circuit in Figure 22; see Fig 5
Input reflected ripple current
Peak short circuit input current
Repetitive short circuit peak current
Internal input capacitance
Internal input inductance
Recommended external
input capacitance
17.6
5
OUTPUT
DC Output voltage band
Output power [a]
38-54 VIN
48-54 VIN
54-55 VIN
Output current
470
μF
11.0
V
0
0
530
670
W
W
0
750
70
W
A
15
%
mΩ
200 nH maximum source inductance
47
No load, over Vin range
7.6
9.6
P ≤ 750 W
of Iout max, maximum output capacitance
Output start up load
Effective output resistance
Line regulation (K factor)
VOUT = K • VIN @ no load
Full power operation; See Parallel Operation
on page 11; up to 3 units
Current share accuracy
[a]
20
0.198
2.9
0.200
0.2020
10
Does not exceed IPC-9592 derating guidelines. At 70 °C ambient, full power operation may exceed IPC-9592 guidelines, but does not exceed
component ratings, does not activate OTP and does not compromise reliability.
IBC MODULE
Rev 1.8
vicorpower.com
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800 735.6200
%
IB048Q096T70N1-00
SPECIFICATIONS (CONT.)
All specifications valid at 48 VIN , 100% rated load and 25 °C ambient, unless otherwise indicated.
Electrical Characteristics (Continued)
Attribute
Symbol
OUTPUT (Continued)
Efficiency
50% load
Full load
Internal output inductance
Internal output capacitance
Load capacitance
Output OVP set point
Conditions / Notes
See Figure 1,2 and 3
See Figure 1,2 and 3
Module will shutdown
20 MHz bandwidth, using test circuit in
Figure 23
Of Iout max., will not shutdown when started
into max Cout; and 15% load
Auto restart with duty cycle <10%
Output voltage ripple
Output Overload protection threshold
Over current protection time constant
Short circuit current response time
Switching frequency
Transient Response
Voltage overshoot
Response time
VIN step
Min
Typ
97.9
97.0
98.2
97.3
1.6
92.4
0
12
Max
4500
60
105
Pre-bias voltage
mVp-p
150
%
1.2
1.5
ms
µs
MHz
100
1.25
mV
µs
V
12
Vdc
1
0
%
%
nH
μF
μF
Vdc
150
1.0
25% load step; 1A /μS; See Figures 13 & 14
See Figures 13 & 14
5 V step in 1 μS within Vin operating range
Unit will start up
into pre-bias voltage on output
Unit
General Characteristics
Conditions: 25 °C case, 75% rated load and specified input voltage range unless otherwise specified.
Attribute
Symbol
MTBF
Service life
Conditions / Notes
Calculated per Telcordia SR-332, 40 °C
Calculated at 30 °C
TJ ; Converter will reset when over
temperature condition is removed
Input to output
Input to output
Over temperature shut down
Dielectric withstand
Insulation resistance
Mechanical
Weight
Length
Width
Height above customer board
Clearance to customer board
Min
Typ
Max
1.0
7
125
Mhrs
Years
130
135
1,500
Agency approvals
Altitude, operating
Relative humidity, Operating
RoHS compliance
IBC MODULE
Rev 1.8
vicorpower.com
Page 3 of 14
11/2012
800 735.6200
°C
Vdc
MΩ
30
1.38 /39.1
2.30 /58.4
1.45 /36.8
0.42/10.6
From lowest component on IBC
UL/CSA 60950, EN60950
Low voltage directive
Derate operating temp 1 °C
per 1,000 feet above sea level
Non condensing
Compatible with RoHS directive 2002/95/EC
Unit
oz/g
in/mm
in/mm
in/mm
in/mm
0.12/0.30
cTUVus
CE
-500
10,000
Feet
10
90
%
IB048Q096T70N1-00
SPECIFICATIONS (CONT.)
Control & Interface Specifications
Attribute
Symbol
Conditions / Notes
Enable (negative logic)
Module enable threshold
Module enable current
Module disable threshold
Module disable current
Disable hysteresis
Enable pin open circuit voltage
Referenced to –IN
EN to –IN resistance
Enable (positive logic)
Module enable threshold
Module disable threshold
EN source current (operating)
EN voltage (operating)
Open circuit
Referenced to –IN
Min
Typ
Max
130
200
2.4
10
Unit
0.8
VEN = 0.8 V
VEN = 2.4 V
500
2.5
Vdc
µA
Vdc
µA
mV
Vdc
3.0
35
2.0
2.5
4.7
5
VEN = 5 V
kΩ
3.0
1.45
2
5.3
Vdc
Vdc
mA
Vdc
IPC-9592A, Based on Class II Category 2 the following detail is applicable. – Pre-conditioning required
Environmental Qualification
Test Description
5.2.3 HALT (Highly Accelerated Life testing)
Test Detail
Low Temp
High Temp
Rapid Thermal Cycling
6 DOF Random Vibration Test
Input Voltage Test
Output Load Test
Combined Stresses Test
Quantity Tested
3
3
3
3
3
3
3
5.2.4 THB (Temp. Humidity Bias)
(72 hr presoak required) 1000 hrs – Continuous Bias
5.2.5 HTOB (High Temp. Operating Bias)
Power cycle - On 42 minutes
Off 1 minute, On 1 minute, Off 1 minute, On 1 minute, Off 1 minute,
On 1 minute, Off 1 minute, On 1 minute, Off 10 minutes. Alternating
between maximum and minimum operating Voltage every hour.
5.2.6 TC (Temp. Cycling)
700 cycles , 30 minute dwell at each extreme – 20C minimum ramp rate.
30
5.2.7 Power Cycling
Reference IPC-9592A
3
5.2.8 – 5.2.13 Shock and Vibration
Random Vibration – Operating IEC 60068-2-64 (normal operation vibration)
Random Vibration Non-operating (transportation) IEC 60068-2-64
Shock Operating - normal operation shock IEC 60068-2-27
Free fall - IEC 60068-2-32
Drop Test 1 full shipping container (box)
3
3
3
3
12
5.2.14 Other Environmental Tests
5.2.14.1 Corrosion Resistance – Not required
5.2.14.2 Dust Resistance – Unpotted class II GR-1274-CORE
5.2.14.3 SMT Attachment Reliability IPC-9701 - J-STD-002
5.2.14.4 Through Hole solderability – J-STD-002
N/A
3
3
5
ESD Classification Testing
Sample size assumes CDM testing
12
Total Quantity
30
30
161
IBC MODULE
Rev 1.8
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IB048Q096T70N1-00
SPECIFICATIONS (CONT.)
WAVEFORMS
Efficiency TAMB 25 °C
99%
98%
98%
Efficiency (%)
Efficiency (%)
Efficiency TAMB 55 °C
99%
97%
96%
95%
97%
96%
95%
94%
0
14
28
56
42
70
94%
0
Iout (A)
VIN :
38 V
48 V
14
28
56
42
Iout (A)
55 V
VIN :
38 V
48 V
55 V
Figure 2 — Efficiency vs. output current, 55 °C ambient
Figure 1 — Efficiency vs. output current, 25 °C ambient
Efficiency TAMB 70 °C
99%
Efficiency (%)
98%
97%
96%
95%
94%
0
14
28
56
42
70
Iout (A)
VIN :
38 V
48 V
55 V
Figure 3 — Efficiency vs. output current, 70 °C ambient
Figure 4 — Inrush current at high line 15% load; 5 A/div,
Max load capacitance
Figure 5 — Input reflected ripple current at nominal line, full load.
See Fig 22 for setup.
Figure 6 — Turn on delay time;
VIN turn on delay at nominal line, 15% load
IBC MODULE
Rev 1.8
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IB048Q096T70N1-00
SPECIFICATIONS (CONT.)
WAVEFORMS (CONT.)
Figure 7 — Turn on delay time; Enable turn on delay at nominal line,
15% load, 0 load capacitance
Figure 8 — Output voltage rise time at nominal line, 10% load
0 load capacitance
Figure 9 — Overshoot at turn on at nominal line, 15% load
0 load capacitance
Figure 10 — Undershoot at turn off at nominal line, 15% load
0 load capacitance
Figure 11 — Load transient response; nominal line
Load step 75– 100%
Figure 12 — Load transient response; Full load to 75%; nominal line
IBC MODULE
Rev 1.8
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IB048Q096T70N1-00
SPECIFICATIONS (CONT.)
WAVEFORMS (CONT.)
Figure 13 — Load transient response; nominal line
Load step 0 – 25%; 10 A/div
Figure 14 — Load transient response; 25–0%; nominal line
Figure 15 — Input transient response;
Vin step low line to high line at full load
Figure 16 — Output ripple; Nominal line, full load
Figure 17 — Three module parallel array test. Vout change when one
module is disabled. Nominal Vin, Iout = 140 A
Figure 18 — Three module parallel array test. Vout change with two
modules operating and a third module enabled. Nominal
Vin, Iout = 140 A
IBC MODULE
Rev 1.8
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IB048Q096T70N1-00
SPECIFICATIONS (CONT.)
WAVEFORMS (CONT.)
Output Current Derating
80
70
70
60
Output Current (A)
50
40
30
20
10
0
60
50
40
30
20
10
0
25
35
45
55
65
75
85
95
35
25
Ambient Air Temperature (°C)
200 LFM
400 LFM
200 LFM
+IN
EN
47 µF
75
400 LFM
+OUT
+
IBC
–IN
C*
Vsource
_
470 µF
+IN
EN
+OUT
IBC
–IN
–OUT
Figure 21 — Test circuit; inrush current overshoot
+OUT
10 µF
Figure 22 — Test circuit; input reflected ripple current
0.1 µF
IBC
–IN
E – Load
–OUT
Cya
Cyc
Cyb
Cyd
95
600 LFM
*Maximum load capacitance
+IN
85
Current Probe
10 µH
Load
_
65
Figure 20 — Maximum output power derating vs ambient air temperature.
Longitudinal airflow, Board and junction temperatures <125 °C.
Tested with IBC evaluation board IB048Q096T70N1-CB
Current Probe
Vsource
55
Ambient Air Temperature (°C)
600 LFM
Figure 19 — Maximum output power derating vs ambient air temperature.
Transverse airflow, Board and junction temperatures <125 °C.
Tested with IBC evaluation board IB048Q096T70N1-CB
+
45
20 MHz BW
Cy a-d = 4700 pF
Figure 23 — Test circuit; output voltage ripple
IBC MODULE
Rev 1.8
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Load
Output Current (A)
Output Current Derating
80
–OUT
IB048Q096T70N1-00
SPECIFICATIONS (CONT.)
THERMAL DATA
Figure 24 — Thermal plot, 200 LFM, 25 °C, 48 Vin, 670 W output power
Figure 25 — Thermal plot, 200 LFM, 25 °C, 48 Vin, 670 W output power
Figure 26 — Thermal plot, 400 LFM, 25 °C, 48 Vin, 670 W output power
Figure 27 — Thermal plot, 400 LFM, 25 °C, 48 Vin, 670 W output power
Figure 28 — Thermal plot, 600 LFM, 25 °C, 48 Vin, 670 W output power
Figure 29 — Thermal plot, 600 LFM, 25 °C, 48 Vin, 670 W output power
IBC MODULE
Rev 1.8
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IB048Q096T70N1-00
PIN / CONTROL FUNCTIONS
+In / -In – DC Voltage Input Pins
The IBC input voltage range should not be exceeded. An internal
undervoltage /overvoltage lockout function prevents operation outside of
the normal operating input range. The IBC turns on within an input voltage
window bounded by the “Input under-voltage turn-on” and “Input
over-voltage turn-off” levels, as specified. The IBC may be protected against
accidental application of a reverse input voltage by the addition of a
rectifier in series with the positive input, or a reverse rectifier in shunt with
the positive input located on the load side of the input fuse.
The connection of the IBC to its power source should be implemented with
minimal distribution inductance. If the interconnect inductance exceeds
100 nH, the input should be bypassed with a RC damper to retain low
source impedance and stable operation. With an interconnect inductance
of 200 nH, the RC damper may be 47 μF in series with 0.3 Ω. A single
electrolytic or equivalent low-Q capacitor may be used in place of the series
RC bypass.
2
Top View
3
4
Pin
1
2
3
4
5
EN - Enable/Disable
Negative Logic Option
If the EN port is left floating, the IBC output is disabled. Once this port ispulled lower than 0.8 Vdc with respect to –In, the output is enabled. The
EN port can be driven by a relay, opto-coupler, or open collector transistor.
Refer to Figures 6 and 7 for the typical enable / disable characteristics. This
port should not be toggled at a rate higher than 1 Hz. The EN port should
also not be driven by or pulled up to an external voltage source.
5
1
Figure 30 — IBC Pin Designations
Positive Logic Option
If the EN port is left floating, the IBC output is enabled. Once this port is
pulled lower than 1.4 Vdc with respect to –In, the output is disabled. This
action can be realized by employing a relay, opto-coupler, or open collector
transistor. This port should not be toggled at a rate higher than 1 Hz.
The EN port should also not be driven by or pulled up to an external voltage source. The EN port can source up to 2 mA at 5 Vdc. The EN port
should never be used to sink current.
If the IBC is disabled using the EN pin, the module will attempt to restart
approximately every 250ms. Once the module has been disabled for at least
250ms, the turn on delay after the EN pin is enabled will be as shown in
Figure 7.
+Out / -Out – DC Voltage Output Pins
Total load capacitance at the output of the IBC should not exceed the
specified maximum. Owing to the wide bandwidth and low output
impedance of the IBC, low frequency bypass capacitance and significant
energy storage may be more densely and efficiently provided by adding
capacitance at the input of the IBC.
IBC MODULE
Rev 1.8
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800 735.6200
Function
Vin+
Enable
VinVoutVout+
IB048Q096T70N1-00
APPLICATIONS NOTE
Parallel Operation
Input Impedance Recommendations
The IBC will inherently current share when operated in an array. Arrays may
be used for higher power or redundancy in an application. Current sharing
accuracy is maximized when the source and load impedance presented to
each IBC within an array are equal. The recommended method to achieve
matched impedances is to dedicate common copper planes within the PCB
to deliver and return the current to the array, rather than rely upon traces
of varying lengths. In typical applications the current being delivered to the
load is larger than that sourced from the input, allowing narrower traces to
be utilized on the input side if necessary. The use of dedicated power
planes is, however, preferable.
To take full advantage of the IBC capabilities, the impedance presented to
its input terminals must be low from DC to approximately 5 MHz.
The source should exhibit low inductance and should have a critically
damped response. If the interconnect inductance is excessive, the IBC input
pins should be bypassed with an RC damper (e.g., 47 μF in series with
0.3 Ω) to retain low source impedance and proper operation. Given the
wide bandwidth of the IBC, the source response is generally the limiting
factor in the overall system response.
Anomalies in the response of the source will appear at the output of the
IBC multiplied by its K factor. The DC resistance of the source should be
kept as low as possible to minimize voltage deviations. This is especially
important if the IBC is operated near low or high line as the
overvoltage /undervoltage detection circuitry could be activated.
One or more IBCs in an array may be disabled without adversely affecting
operation or reliability as long as the load does not exceed the rated power
of the enabled IBCs.
The IBC power train and control architecture allow bi-directional power
transfer, including reverse power processing from the IBC output to its
input. The IBC’s ability to process power in reverse improves the IBC transient response to an output load dump.
Input Fuse Recommendations
The IBC is not internally fused in order to provide flexibility in configuring
power systems. However, input line fusing of VI Bricks must always be
incorporated within the power system. A fast acting fuse should be placed
in series with the +In port. See safety agency approvals.
Thermal Considerations
The temperature distribution of the VI Brick can vary significantly
with its input /output operating conditions, thermal management and
environmental conditions. Although the PCB is UL rated to 130 °C, it is
recommended that PCB temperatures be maintained at or below 125 °C.
For maximum long term reliability, lower PCB temperatures are
recommended for continuous operation, however, short periods of
operation at 125 °C will not negatively impact performance or reliability.
Application Notes
For IBC and VI Brick application notes on soldering, thermal management,
board layout, and system design visit vicorpower.com.
WARNING: Thermal and voltage hazards. The IBC can operate with surface
temperatures and operating voltages that may be hazardous to personnel.
Ensure that adequate protection is in place to avoid inadvertent contact.
PART NUMBERING
Product
Family
Input
Voltage
Package
IB
048
Q
Nominal
Output Voltage
096
Temperature
Grade
Output
Current
T
70
IBC MODULE
Rev 1.8
vicorpower.com
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800 735.6200
Enable
Logic
Pin
Length
N = Negative
P = Positive
1 = 0.145
2 = 0.210
3 = 0.180
Options
-00 = Open frame
-BP = Baseplate
IB048Q096T70N1-00
MECHANICAL DRAWINGS
.417 ± .025
[10.58 ± .64]
.180
[4.57]
.11
[2.9]
Figure 31 — IBC Outline drawing
2.300
58.42
.150
3.81
h
.210
5.33
.725
18.42
1.030
26.16
<>
1.450
36.83
.063 THRU
1.59
M3 x .50
TAP THRU
(4) PL.
h
1.860
47.24
<>
.220
5.59
.450±.025
11.43±.64
.180
4.57
.040
1.02
(3) PL.
.02
.6
.093
2.36
(3) PL.
.125
3.18
(2) PL.
.060
1.52
(2) PL.
Figure 32 — IBC outline drawing - baseplate option
IBC MODULE
Rev 1.8
vicorpower.com
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800 735.6200
View of underneath panel
IB048Q096T70N1-00
MECHANICAL DRAWINGS
Top View
Figure 33 — IBC PCB recommended hole pattern
IBC MODULE
Rev 1.8
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IB048Q096T70N1-00
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systems.
Information furnished by Vicor is believed to be accurate and reliable. However, no responsibility is assumed by Vicor for its use. Vicor makes no
representations or warranties with respect to the accuracy or completeness of the contents of this publication. Vicor reserves the right to make
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Specifications are subject to change without notice.
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granted by this document. Interested parties should contact Vicor's Intellectual Property Department.
The products described on this data sheet are protected by the following U.S. Patents Numbers:
5,945,130; 6,403,009; 6,710,257; 6,911,848; 6,930,893; 6,934,166; 6,940,013; 6,969,909; 7,038,917;
7,166,898; 7,187,263; 7,361,844; D496,906; D505,114; D506,438; D509,472; and for use under 6,975,098 and 6,984,965.
Vicor Corporation
25 Frontage Road
Andover, MA, USA 01810
Tel: 800-735-6200
Fax: 978-475-6715
email
Customer Service: [email protected]
Technical Support: [email protected]
IBC MODULE
Rev 1.8
vicorpower.com
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800 735.6200