TI ICL7135CN 4 1/2-digit precision analog-to-digital converter Datasheet

 SLAS074D − DECEMBER 1986 − REVISED SEPTEMBER 2003
D Zero Reading for 0-V Input
D Precision Null Detection With True Polarity
DW OR N PACKAGE
(TOP VIEW)
at Zero
VCC −
REF
ANLG COMMON
INT OUT
AUTO ZERO
BUFF OUT
Cref −
Cref +
IN −
IN +
VCC +
D5
B1
B2
D 1-pA Typical Input Current
D True Differential Input
D Multiplexed Binary-Coded-Decimal (BCD)
D
D
D
D
D
D
Output
Low Rollover Error: ± 1 Count Max
Control Signals Allow Interfacing With
UARTs or Microprocessors
Autoranging Capability With Over- and
Under-Range Signals
TTL-Compatible Outputs
Second Source to Teledyne TSC7135,
Intersil ICL7135, Maxim ICL7135, and
Siliconix Si7135
CMOS Technology
1
28
2
27
3
26
4
25
5
24
6
23
7
22
8
21
9
20
10
19
11
18
12
17
13
16
14
15
UNDER RANGE
OVER RANGE
STROBE
RUN/HOLD
DGTL GND
POLARITY
CLK
BUSY
D1
D2
D3
D4
B8
B4
DESCRIPTION
The ICL7135C and TLC7135C converters are manufactured with Texas Instruments highly efficient CMOS
technology. These 4 1/2-digit, dual-slope-integrating, analog-to-digital converters (ADCs) are designed to
provide interfaces to both a microprocessor and a visual display. The digit-drive outputs D1 through D4 and
multiplexed binary-coded-decimal outputs B1, B2, B4, and B8 provide an interface for LED or LCD
decoder/drivers as well as microprocessors.
The ICL7135C and TLC7135C offer 50-ppm (one part in 20,000) resolution with a maximum linearity error of
one count. The zero error is less than 10 µV and zero drift is less than 0.5 µV/°C. Source-impedance errors are
minimized by low input current (less than 10 pA). Rollover error is limited to ± 1 count.
The BUSY, STROBE, RUN/HOLD, OVER RANGE, and UNDER RANGE control signals support
microprocessor-based measurement systems. The control signals also can support remote data acquisition
systems with data transfer through universal asynchronous receiver transmitters (UARTs).
The ICL7135C and TLC7135C are characterized for operation from 0°C to 70°C.
AVAILABLE OPTIONS
PACKAGE
TA
PLASTIC DIP
(N)
0°C to 70°C
SMALL OUTLINE
(DW)
ICL7135CN
TLC7135CN
TLC7135CDW
Caution. These devices have limited built-in protection. The leads should be shorted together or the device placed in conductive foam
during storage or handlilng to prevent electrostatic damage to the MOS gates.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  1999−2003, Texas Instruments Incorporated
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1
SLAS074D − DECEMBER 1986 − REVISED SEPTEMBER 2003
FUNCTIONAL BLOCK DIAGRAM
DIGITAL SECTION
POLARITY
From Analog
Section
23
20
Polarity
Flip-Flop
Latch
19
18
17
Zero
Cross
Detect
CLK
RUN/HOLD
OVER RANGE
UNDER RANGE
STROBE
BUSY
DGTL GND
22
Latch
Control
Logic
12
D1 (LSD)
D2
D3
Digit
Drive
Output
D4
D5 (MSD)
Counters
Latch
Multiplexer
25
27
28
13
Latch
26
14
21
24
15
16
Latch
B1 (LSB)
B2
B4
Binary
Coded
Decimal
Output
B8 (MSB)
ANALOG SECTION
RINT
Cref
8
Cref +
Cref −
7
BUFF
OUT
CAZ
5
6
Buffer
−
Input
High
−
A/Z
INT
IN +
10
DE(−)
DE(+)
Z/I
A/Z
A/Z
DE(+)
ANLG
COMMON
IN −
2
DE(−)
3
9
INT
Input
Low
A/Z, DE( ±), Z/I
POST OFFICE BOX 655303
Comparator
+
+
2
4 INT OUT
+
REF
CINT
Integrator
−
A/Z
AUTO
ZERO
• DALLAS, TEXAS 75265
To
Digital
Section
SLAS074D − DECEMBER 1986 − REVISED SEPTEMBER 2003
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted(1)
UNIT
Supply voltage (VCC+ with respect to VCC −)
15 V
Analog input voltage (IN − or IN +)
Reference voltage range
VCC − to VCC+
VCC − to VCC+
Clock input voltage range
0 V to VCC+
Operating free-air temperature range, TA
0°C to 70°C
Storage temperature range, Tstg
−65°C to 150°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds: N package
260°C
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
MIN
NOM
MAX
Supply voltage, VCC+
4
5
6
V
Supply voltage, VCC−
−3
−5
−8
V
Reference voltage, Vref
UNIT
1
High-level input voltage, CLK, RUN/HOLD, VIH
V
2.8
V
Low-level input voltage, CLK, RUN/HOLD, VIL
0.8
Differential input voltage, VID
VCC − +1
1.2
Maximum operating frequency, fclock (see Note 1)
Operating free-air temperature range, TA
NOTE 1: Clock frequency range extends down to 0 Hz.
V
VCC+ − 0.5
2
V
MHz
0
°C
70
ELECTRICAL CHARACTERISTICS
VCC + = 5 V, VCC − = 5 V, Vref = 1 V, fclock = 120 kHz, TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
D1-D5, B1,B2,B4,B8
IO = − 1 mA
IO = − 10 µA
MIN
TYP
MAX
2.4
5
4.9
5
UNIT
VOH
High-level output voltage
VOL
VON(PP)
Low-level output voltage
αVO
IIH
Zero-reading temperature coefficient of output voltage
VID = 0,
VI = 5 V,
0°C ≤ TA ≤ 70°C
0.5
2
High-level input current
0°C ≤ TA ≤ 70°C
0.1
10
µA
IIL
Low-level input current
VI = 0 V,
0°C ≤ TA ≤ 70°C
−0.02
−0.1
mA
Input leakage current, IN − and IN +
VID = 0
TA = 25°C
0°C ≤ TA ≤ 70°C
1
II
Positive supply current
fclock = 0
TA = 25°C
0°C ≤ TA ≤ 70°C
1
ICC +
Negative supply current
fclock = 0
TA = 25°C
0°C ≤ TA ≤ 70°C
−0.8
ICC −
Other outputs
Peak-to-peak output noise voltage (see Note 1)
IO = 1.6 mA
VID = 0,
Full scale = 2 V
0.4
V
V
µV
15
µV/°C
10
250
pA
2
3
mA
−2
−3
mA
Cpd
Power dissipation capacitance
See Note 2
40
pF
NOTES: 1. This is the peak-to-peak value that is not exceeded 95% of the time.
2. Factor-relating clock frequency to increase in supply current. At VCC+ = 5 V, ICC+ = ICC+(fclock = 0) + Cpd × 5 V × fclock
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3
SLAS074D − DECEMBER 1986 − REVISED SEPTEMBER 2003
OPERATING CHARACTERISTICS
VCC + = 5 V, VCC − = 5 V, Vref = 1 V, fclock = 120 kHz, TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
αFS
EL
Full-scale temperature coefficient (see Note 1)
Linearity error
VID = 2 V,
0°C ≤ TA ≤ 70°C
−2 V ≤ VID ≤ 2 V
ED
EFS
Differential linearity error (see Note 2)
−2 V ≤ VID ≤ 2 V
± Full-scale symmetry error (rollover error) (see Note 3)
VID = ± 2 V
Display reading with 0-V input
VID = 0,
Display reading in ratiometric operation
VID = Vref, TA = 25°C
0°C ≤ TA ≤ 70°C
MIN
TYP
MAX
5
0.5
LSB
0.5
−0.0000
1
± 0.0000 0.0000
0.9998
0.9999
1.0000
0.9995
0.9999
1.0005
NOTES: 1. This parameter is measured with an external reference having a temperature coefficient of less than 0.01 ppm/°C.
2. The magnitude of the difference between the worst case step of adjacent counts and the ideal step.
3. Rollover error is the difference between the absolute values of the conversion for 2 V and − 2 V.
TIMING DIAGRAMS
End of Conversion
BUSY†
B1 −B8
D5
D4
D3
D2
D1
D5
STROBE†
200 Counts
D5
200 Counts
201 Counts
D4
200 Counts
D3
200 Counts
D2
200 Counts
D1
200 Counts
† Delay between BUSY going low and the first STROBE pulse is dependent upon the analog input.
Figure 1
4
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ppm/°C
count
0.01
0°C ≤ TA ≤ 70°C
UNIT
count
Digital
Reading
Digital
Reading
SLAS074D − DECEMBER 1986 − REVISED SEPTEMBER 2003
Digital Scan
for OVER-RANGE
D5
D4
D3
D2
D1
1000 Counts
Figure 2
Integrator Output
AUTO ZERO
10,001 Counts
Signal Int
10,000
Counts
De-Integrate
20,001 Counts Max
Full Measurement Cycle
40,002 Counts
BUSY
OVER RANGE
When Applicable
UNDER RANGE
When Applicable
Figure 3
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5
SLAS074D − DECEMBER 1986 − REVISED SEPTEMBER 2003
STROBE
AUTO ZERO
Digit Scan
for OVER RANGE
Signal Integrate
Deintegrate†
D5†
D4
D3
D2
D1
† First D5 of AUTO ZERO and deintegrate is one count longer.
Figure 4
PRINCIPLES OF OPERATION
A measurement cycle for the ICL7135C and TLC7135C consists of the following four phases.
1. Auto-Zero Phase. The internal IN + and IN− inputs are disconnected from the terminals and internally
connected to ANLG COMMON. The reference capacitor is charged to the reference voltage. The
system is configured in a closed loop and the auto-zero capacitor is charged to compensate for offset
voltages in the buffer amplifier, integrator, and comparator. The auto-zero accuracy is limited only by the
system noise, and the overall offset, as referred to the input, is less than 10 µV.
2. Signal Integrate Phase. The auto-zero loop is opened and the internal IN + and IN − inputs are
connected to the external terminals. The differential voltage between these inputs is integrated for a
fixed period of time. When the input signal has no return with respect to the converter power supply, IN−
can be tied to ANLG COMMON to establish the correct common-mode voltage. Upon completion of this
phase, the polarity of the input signal is recorded.
3. Deintegrate Phase. The reference is used to perform the deintegrate task. The internal IN− is internally
connected to ANLG COMMON and IN+ is connected across the previously charged reference
capacitor. The recorded polarity of the input signal ensures that the capacitor is connected with the
correct polarity so that the integrator output polarity returns to zero. The time required for the output to
return to zero is proportional to the amplitude of the input signal. The return time is displayed as a digital
reading and is determined by the equation 10,000 × (VID/Vref). The maximum or full-scale conversion
occurs when VID is two times Vref.
4. Zero Integrator Phase. The internal IN− is connected to ANLG COMMON. The system is configured in a
closed loop to cause the integrator output to return to zero. Typically, this phase requires 100 to 200
clock pulses. However, after an over-range conversion, 6200 pulses are required.
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SLAS074D − DECEMBER 1986 − REVISED SEPTEMBER 2003
DESCRIPTION OF ANALOG CIRCUITS
Input Signal Range
The common mode range of the input amplifier extends from 1 V above the negative supply to 1 V below the
positive supply. Within this range, the common-mode rejection ratio (CMRR) is typically 86 dB. Both differential
and common-mode voltages cause the integrator output to swing. Therefore, care must be exercised to ensure
that the integrator output does not become saturated.
Analog Common
Analog common (ANLG COMMON) is connected to the internal IN− during the auto-zero, deintegrate, and zero
integrator phases. When IN− is connected to a voltage that is different from analog common during the signal
integrate phase, the resulting common-mode voltage is rejected by the amplifier. However, in most applications,
IN− is set at a known fixed voltage (i.e., power supply common for instance). In this application, analog common
should be tied to the same point, thus removing the common-mode voltage from the converter. Removing the
common-mode voltage in this manner slightly increases conversion accuracy.
Reference
The reference voltage is positive with respect to analog common. The accuracy of the conversion result is
dependent upon the quality of the reference. Therefore, to obtain a high accuracy conversion, a high quality
reference should be used.
DESCRIPTION OF DIGITAL CIRCUITS
RUN/HOLD Input
When RUN/HOLD is high or open, the device continuously performs measurement cycles every 40,002 clock
pulses. When this input is taken low, the integrated circuit continues to perform the ongoing measurement cycle
and then hold the conversion reading for as long as the terminal is held low. When the terminal is held low after
completion of a measurement cycle, a short positive pulse (greater than 300 ns) initiates a new measurement
cycle. When this positive pulse occurs before the completion of a measurement cycle, it will not be recognized.
The first STROBE pulse, which occurs 101 counts after the end of a measurement cycle, is an indication of the
completion of a measurement cycle. Thus, the positive pulse could be used to trigger the start of a new
measurement after the first STROBE pulse.
STROBE Input
Negative going pulses from this input transfer the BCD conversion data to external latches, UARTs, or
microprocessors. At the end of the measurement cycle, STROBE goes high and remains high for 201 counts.
The most significant digit (MSD) BCD bits are placed on the BCD terminals. After the first 101 counts, halfway
through the duration of output D1−D5 going high, the STROBE terminal goes low for 1/2 clock pulse width. The
placement of the STROBE pulse at the midpoint of the D5 high pulse allows the information to be latched into
an external device on either a low-level or an edge. Such placement of the STROBE pulse also ensures that
the BCD bits for the second MSD are not yet competing for the BCD lines and latching of the correct bits is
ensured. The above process is repeated for the second MSD and the D4 output. Similarly, the process is
repeated through the least significant digit (LSD). Subsequently, inputs D5 through D1 and the BCD lines
continue scanning without the inclusion of STROBE pulses. This subsequent continuous scanning causes the
conversion results to be continuously displayed. Such subsequent scanning does not occur when an over-range
condition occurs.
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SLAS074D − DECEMBER 1986 − REVISED SEPTEMBER 2003
BUSY Output
The BUSY output goes high at the beginning of the signal integrate phase. BUSY remains high until the first
clock pulse after zero crossing or at the end of the measurement cycle when an over-range condition occurs.
It is possible to use the BUSY terminal to serially transmit the conversion result. Serial transmission can be
accomplished by ANDing the BUSY and CLOCK signals and transmitting the ANDed output. The transmitted
output consists of 10,001 clock pulses, which occur during the signal integrate phase, and the number of clock
pulses that occur during the deintegrate phase. The conversion result can be obtained by subtracting 10,001
from the total number of clock pulses.
OVER-RANGE Output
When an over-range condition occurs, this terminal goes high after the BUSY signal goes low at the end of the
measurement cycle. As previously noted, the BUSY signal remains high until the end of the measurement cycle
when an over-range condition occurs. The OVER RANGE output goes high at the end of BUSY and goes low
at the beginning of the deintegrate phase in the next measurement cycle.
UNDER-RANGE Output
At the end of the BUSY signal, this terminal goes high when the conversion result is less than or equal to 9%
(count of 1800) of the full-scale range. The UNDER-RANGE output is brought low at the beginning of the signal
integrate phase of the next measurement cycle.
POLARITY Output
The POLARITY output is high for a positive input signal and updates at the beginning of each deintegrate phase.
The polarity output is valid for all inputs including ± 0 and OVER RANGE signals.
Digit-Drive (D1, D2, D4 and D5) Outputs
Each digit-drive output (D1 through D5) sequentially goes high for 200 clock pulses. This sequential process
is continuous unless an over-range occurs. When an over-range occurs, all of the digit-drive outputs are blanked
from the end of the strobe sequence until the beginning of the deintegrate phase (when the sequential digit-drive
activation begins again). The blanking activity during an over-range condition can cause the display to flash and
indicate the over-range condition.
BCD Outputs
The BCD bits (B1, B2, B4 and B8) for a given digit are sequentially activated on these outputs. Simultaneously,
the appropriate digit-drive line for the given digit is activated.
System Aspects
Integrating Resistor
The value of the integrating resistor (RINT) is determined by the full-scale input voltage and the output current
of the integrating amplifier. The integrating amplifier can supply 20 µA of current with negligible nonlinearity. The
equation for determining the value of this resistor is:
R
INT
+
Full Scale Voltage
I
INT
Integrating amplifier current, IINT, from 5 to 40 µA yields good results. However, the nominal and recommended
current is 20 µA.
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SLAS074D − DECEMBER 1986 − REVISED SEPTEMBER 2003
Integrating Capacitor
The product of the integrating resistor and capacitor should be selected to give the maximum voltage swing
without causing the integrating amplifier output to saturate and get too close to the power supply voltages. When
the amplifier output is within 0.3 V of either supply, saturation occurs. With ± 5-V supplies and ANLG COMMON
connected to ground, the designer should design for a ± 3.5-V to ± 4-V integrating amplifier swing. A nominal
capacitor value is 0.47 µF. The equation for determining the value of the integrating capacitor (CINT) is:
C
INT
+
10, 000
Clock Period
I
INT
Integrator Output Voltage Swing
where
IINT is nominally 20 µA.
Capacitors with large tolerances and high dielectric absorption can induce conversion inaccuracies. A capacitor
that is too small could cause the integrating amplifier to saturate. High dielectric absorption causes the effective
capacitor value to be different during the signal integrate and deintegrate phases. Polypropylene capacitors
have very low dielectric absorption. Polystyrene and polycarbonate capacitors have higher dielectric
absorption, but also work well.
Auto-Zero and Reference Capacitor
Large capacitors tend to reduce noise in the system. Dielectric absorption is unimportant except during power
up or overload recovery. Typical values are 1 µF.
Reference Voltage
For high-accuracy absolute measurements, a high quality reference should be used.
Rollover Resistor and Diode
The ICL7135C and TLC7135C have a small rollover error; however, it can be corrected. The correction is to
connect the cathode of any silicon diode to INT OUT and the anode to a resistor. The other end of the resistor
is connected to ANLG COMMON or ground. For the recommended operating conditions, the resistor value is
100 kΩ. This value may be changed to correct any rollover error that has not been corrected. In many noncritical
applications the resistor and diode are not needed.
Maximum Clock Frequency
For most dual-slope A/D converters, the maximum conversion rate is limited by the frequency response of the
comparator. In this circuit, the comparator follows the integrator ramp with a 3-µs delay. Therefore, with a
160-kHz clock frequency (6-µs period), half of the first reference integrate clock period is lost in delay. Hence,
the meter reading changes from 0 to 1 with a 50-µV input, 1 to 2 with a 150-µV input, 2 to 3 with a 250-µV input,
etc. This transition at midpoint is desirable; however, when the clock frequency is increased appreciably above
160 kHz, the instrument flashes 1 on noise peaks even when the input is shorted. The above transition points
assume a 2-V input range is equivalent to 20,000 clock cycles.
When the input signal is always of one polarity, comparator delay need not be a limitation. Clock rates of 1 MHz
are possible since nonlinearity and noise do not increase substantially with frequency. For a fixed clock
frequency, the extra count or counts caused by comparator delay are a constant and can be subtracted out
digitally.
For signals with both polarities, the clock frequency can be extended above 160 kHz without error by using a
low value resistor in series with the integrating capacitor. This resistor causes the integrator to jump slightly
towards the zero-crossing level at the beginning of the deintegrate phase, and thus compensates for the
comparator delay. This series resistor should be 10 Ω to 50 Ω. This approach allows clock frequencies up to
480 kHz.
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SLAS074D − DECEMBER 1986 − REVISED SEPTEMBER 2003
Minimum Clock Frequency
The minimum clock frequency limitations result from capacitor leakage from the auto-zero and reference
capacitors. Measurement cycles as high as 10 µs are not influenced by leakage error.
Rejection of 50-Hz or 60-Hz Pickup
To maximize the rejection of 50-Hz or 60-Hz pickup, the clock frequency should be chosen so that an integral
multiple of 50-Hz or 60-Hz periods occur during the signal integrate phase. To achieve rejection of these signals,
some clock frequencies that can be used are:
50 Hz: 250, 166.66, 125, 100 kHz, etc.
60 Hz: 300, 200, 150, 120, 100, 40, 33.33 kHz, etc.
Zero-Crossing Flip-Flop
This flip-flop interrogates the comparator’s zero-crossing status. The interrogation is performed after the
previous clock cycle and the positive half of the ongoing clock cycle has occurred, so any comparator transients
that result from the clock pulses do not affect the detection of a zero-crossing. This procedure delays the
zero-crossing detection by one clock cycle. To eliminate the inaccuracy, which is caused by this delay, the
counter is disabled for one clock cycle at the beginning of the deintegrate phase. Therefore, when the
zero-crossing is detected one clock cycle later than the zero-crossing actually occurs, the correct number of
counts is displayed.
Noise
The peak-to-peak noise around zero is approximately 15 µV (peak-to-peak value not exceeded 95% of the
time). Near full scale, this value increases to approximately 30 µV. Much of the noise originates in the auto-zero
loop, and is proportional to the ratio of the input signal to the reference.
Analog and Digital Grounds
For high-accuracy applications, ground loops must be avoided. Return currents from digital circuits must not
be sent to the analog ground line.
Power Supplies
The ICL7135C and TLC7135C are designed to work with ± 5-V power supplies. However, 5-V operation is
possible when the input signal does not vary more than ± 1.5 V from midsupply.
10
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PACKAGE OPTION ADDENDUM
www.ti.com
21-Dec-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
ICL7135CN
ACTIVE
PDIP
N
28
13
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
ICL7135CNG4
ACTIVE
PDIP
N
28
13
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
TLC7135CDW
ACTIVE
SOIC
DW
28
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLC7135CDWG4
ACTIVE
SOIC
DW
28
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLC7135CDWR
ACTIVE
SOIC
DW
28
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLC7135CDWRG4
ACTIVE
SOIC
DW
28
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLC7135CN
ACTIVE
PDIP
N
28
13
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
TLC7135CNG4
ACTIVE
PDIP
N
28
13
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
TLC7135CDWR
Package Package Pins
Type Drawing
SOIC
DW
28
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
1000
330.0
32.4
Pack Materials-Page 1
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
11.35
18.67
3.1
16.0
32.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TLC7135CDWR
SOIC
DW
28
1000
346.0
346.0
49.0
Pack Materials-Page 2
MECHANICAL DATA
MPDI008 – OCTOBER 1994
N (R-PDIP-T**)
PLASTIC DUAL-IN-LINE PACKAGE
24 PIN SHOWN
A
24
13
0.560 (14,22)
0.520 (13,21)
1
12
0.060 (1,52) TYP
0.200 (5,08) MAX
0.610 (15,49)
0.590 (14,99)
0.020 (0,51) MIN
Seating Plane
0.100 (2,54)
0.021 (0,53)
0.015 (0,38)
0.125 (3,18) MIN
0.010 (0,25) M
PINS **
0°– 15°
0.010 (0,25) NOM
24
28
32
40
48
52
A MAX
1.270
(32,26)
1.450
(36,83)
1.650
(41,91)
2.090
(53,09)
2.450
(62,23)
2.650
(67,31)
A MIN
1.230
(31,24)
1.410
(35,81)
1.610
(40,89)
2.040
(51,82)
2.390
(60,71)
2.590
(65,79)
DIM
4040053 / B 04/95
NOTES: A.
B.
C.
D.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
Falls within JEDEC MS-011
Falls within JEDEC MS-015 (32 pin only)
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