ICS3726-12 PRELIMINARY INFORMATION HIGH PERFORMANCE VCXO Description Features The ICS3726-12 is a low cost, low-jitter, high-performance 3.3 volt VCXO designed to replace expensive discrete VCXOs modules. The ICS3726-12 offers a wider operating frequency range and improved power supply noise rejection. The on-chip Voltage Controlled Crystal Oscillator accepts a 0 to 3.3 V input voltage. Using ICS’ patented VCXO techniques, the device uses an inexpensive external pullable crystal in the range of 20 to 52 MHz to produce a VCXO output clock at that same frequency. • • • • • • • • • • This part is ideal for Set-Top Box, multimedia clock synthesizers and ADSL/VDSL applications. Packaged in 8-pin SOIC Operational frequency range of 20 MHz to 52 MHz Uses an inexpensive external crystal On-chip patented VCXO with pull range of 400 ppm VCXO tuning voltage of 0 to VDD Operating voltage of 3.3 V 12 mA output drive capability at TTL levels Works with surface mount crystal with CL=10 pF Advanced, low-power, sub-micron CMOS process Available in Pb (lead) free package The frequency of the on-chip VCXO is adjusted by an external control voltage input into pin VIN. Because VIN is a high-impedance input, it can be driven directly from an PWM RC integrator circuit. Frequency output increases with VIN voltage input. The usable range of VIN is 0 to VDD. Block Diagram VDD VIN X1 20 to 52 MHz Pullable Crystal X2 Voltage Controlled Crystal Oscillator Optional tuning crystal capacitors GND 1 MDS 3726-12 B I n t e gra te d C i r c u i t S y s t e m s 20 to 52 MHz Clock (REFOUT) ● 525 Race Stre et, San Jo se, CA 9 5126 Revision 120505 ● te l (40 8) 2 97-12 01 ● w w w. i c st . c o m PRELIMINARY INFORMATION ICS3726-12 HIGH PERFORMANCE VCXO Pin Assignment X1 1 8 X2 NC 2 7 NC VI N 3 6 VDD GND 4 5 REFOUT I CS37 26- 12 8 - P i n ( 1 5 0 mi l ) S OI C Pin Descriptions Pin Number Pin Name Pin Type 1 X1 Input 2 NC — 3 VIN Input Voltage input to VCXO. Zero to VDD signal which controls the VCXO frequency. 4 GND Power Connect to ground. 5 REFOUT Output VCXO CMOS level clock output matches the nominal frequency of the crystal. 6 VDD Power Connect to +3.3 V (0.01 µf decoupling capacitor recommended). 7 NC — 8 X2 Input Crystal connection. Connect to the external pullable crystal. Do connet to this pin. No connect. Do not connect this pin to anything. Crystal connection. Connect to a pullable 20 to 52 MHz crystal. 2 MDS 3726-12 B In te grated Circuit Systems Pin Description ● 525 Ra ce Street, San Jose, CA 9512 6 Revision 120505 ● tel (4 08) 297-1 201 ● w w w. i c s t . c o m PRELIMINARY INFORMATION ICS3726-12 HIGH PERFORMANCE VCXO External Component Selection The external crystal must be connected as close to the chip as possible and should be on the same side of the PCB as the ICS3726-12. There should be no vias between the crystal pins and the X1 and X2 device pins. There should be no signal traces underneath or close to the crystal. See application note MAN05. The ICS3726-12 requires a minimum number of external components for proper operation. Decoupling Capacitors A decoupling capacitor of 0.01 µF should be connected between VDD and GND on pins 6 and 4 as close to the ICS3726-12 as possible. For optimum device performance, the decoupling capacitor should be mounted on the component side of the PCB. Avoid the use of vias in the decoupling circuit. Series Termination Resistor When the PCB trace between the clock output and the load is over 1 inch, series termination should be used. To series terminate a 50Ω trace (a commonly used trace impedance), place a 33Ω resistor in series with the clock line, as close to the clock output pin as possible. The nominal impedance of the clock output is 20Ω. Crystal Tuning Load Capacitors The crystal traces should include pads for small fixed capacitors, one between X1 and ground, and another between X2 and ground. Stuffing of these capacitors on the PCB is optional. The need for these capacitors is determined at system prototype evaluation, and is influenced by the particular crystal used (manufacture and frequency) and by PCB layout. The typical required capacitor value is 1 to 4 pF. This chip has internal load capacitors and is designed to work with surface mount crystals with 10 pF load capacitance. The procedure for determining the value of these capacitors can be found in application note MAN05. Quartz Crystal The ICS3726-12 VCXO function consists of the external crystal and the integrated VCXO oscillator circuit. To assure the best system performance (frequency pull range) and reliability, a crystal device with the recommended parameters (shown below) must be used, and the layout guidelines discussed in the following section shown must be followed. The oscillation frequency of a quartz crystal is determined by its “cut” and by the load capacitors connected to it. The ICS3726-12 incorporates on-chip variable load capacitors that pull (change) the frequency of the crystal. The crystal specified for use with the ICS3726-12 is designed to have zero frequency error when the total of on-chip + stray capacitance is 10 pF. Recommended Crystal Parameters: Initial Accuracy at 25°C Temperature Stability Aging Load Capacitance Shunt Capacitance, C0 C0/C1 Ratio Equivalent Series Resistance 3 MDS 3726-12 B In te grated Circuit Systems ±20 ppm ±30 ppm ±20 ppm 10 pF 7 pF max 250 max 35 Ω max ● 525 Ra ce Street, San Jose, CA 9512 6 Revision 120505 ● tel (4 08) 297-1 201 ● w w w. i c s t . c o m PRELIMINARY INFORMATION ICS3726-12 HIGH PERFORMANCE VCXO Absolute Maximum Ratings Stresses above the ratings listed below can cause permanent damage to the ICS3726-12. These ratings, which are standard values for ICS commercially rated parts, are stress ratings only. Functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods can affect product reliability. Electrical parameters are guaranteed only over the recommended operating temperature range. Item Rating Supply Voltage, VDD 7V All Inputs and Outputs -0.5 V to VDD+0.5 V Ambient Operating Temperature 0 to +70°C Storage Temperature -65 to +150°C Soldering Temperature 260°C Recommended Operation Conditions Parameter Ambient Operating Temperature Power Supply Voltage (measured in respect to GND) Min. Typ. Max. Units 0 – +70 °C +3.45 V +3.15 Reference crystal parameters 4 MDS 3726-12 B In te grated Circuit Systems Refer to page 3 ● 525 Ra ce Street, San Jose, CA 9512 6 Revision 120505 ● tel (4 08) 297-1 201 ● w w w. i c s t . c o m PRELIMINARY INFORMATION ICS3726-12 HIGH PERFORMANCE VCXO DC Electrical Characteristics VDD=3.3 V ±5% , Ambient temperature 0 to +70°C, unless stated otherwise Parameter Symbol Conditions Operating Voltage VDD Output High Voltage VOH IOH = -12 mA Output Low Voltage VOL IOL = 12 mA Output High Voltage (CMOS Level) VOH IOH = -4 mA Operating Supply Current IDD No load Short Circuit Current IOS VIN, VCXO Control Voltage VIA Min. Typ. 3.15 Max. Units 3.45 V 2.4 V 0.4 V VDD-0.4 V 6 mA ±50 mA 0 3.3 V AC Electrical Characteristics VDD = 3.3 V ±5%, Ambient Temperature 0 to +70° C, unless stated otherwise Parameter Symbol Output Frequency FO Crystal Pullability FP VCXO Gain Conditions Min. Typ. Max. Units 20 0V< VIN < 3.3 V, Note 1 52 MHz + 200 VIN = VDD/2 + 1 V, Note 1 ppm 150 ppm/V Output Rise Time tOR 0.8 to 2.0 V, CL=15 pF 1.5 ns Output Fall Time tOF 2.0 to 0.8 V, CL=15 pF 1.5 ns Output Clock Duty Cycle tD Measured at 1.4 V, CL=15 pF 60 % Period Jitter RMS tJ CL=15 pF @35.328 MHz 6.7 ps Period Jitter P- P tJ CL=15 [email protected] MHz 46 ps Integrated Jitter RMS Integrated 12 kHz to 20 MHz @ 35.328 MHz 1 ps Phase Noise relative to Carrier @35.328 MHz Carrier frequency @10 Hz -65 dBc/Hz @100 Hz -90 dBc/Hz @1 kHz -120 dBc/Hz @10 kHz -140 dBc/Hz @100 kHz -147 dBc/Hz @1 MHz -147 dBc/Hz 40 50 Note 1: External crystal device must conform with Pullable Crystal Specifications listed on page 3. 5 MDS 3726-12 B In te grated Circuit Systems ● 525 Ra ce Street, San Jose, CA 9512 6 Revision 120505 ● tel (4 08) 297-1 201 ● w w w. i c s t . c o m PRELIMINARY INFORMATION ICS3726-12 HIGH PERFORMANCE VCXO Package Outline and Package Dimensions (8-pin SOIC) Package dimensions are kept current with JEDEC Publication No. 95 Millimeters Inches* 8 Symbol E A A1 B C D E e H h L α H INDEX AREA 1 2 D Min Max Min 1.35 1.75 0.10 0.25 0.33 0.51 0.19 0.25 4.80 5.00 3.80 4.00 1.27 BASIC 5.80 6.20 0.25 0.50 0.40 1.27 0° 8° Max .0532 .0688 .0040 .0098 .013 .020 .0075 .0098 .1890 .1968 .1497 .1574 0.050 BASIC .2284 .2440 .010 .020 .016 .050 0° 8° *For reference only. Controlling dimensions in mm. A h x 45 A1 C -Ce SEATING PLANE B L .10 (.004) C Ordering Information Part / Order Number Marking Shipping Packaging Package Temperature ICS3726M-12 ICS3726M-12T ICS3726M-12LF ICS3726M-12LFT 3726M-12 3726M-12 3726M12L 3726M12L Tubes Tape and Reel Tubes Tape and Reel 8-pin SOIC 8-pin SOIC 8-pin SOIC 8-pin SOIC 0 to +70° C 0 to +70° C 0 to +70° C 0 to +70° C Parts that are ordered with a "LF" suffix to the part number are the Pb-Free configuration and are RoHS compliant. While the information presented herein has been checked for both accuracy and reliability, Integrated Circuit Systems (ICS) assumes no responsibility for either its use or for the infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary environmental requirements are not recommended without additional processing by ICS. ICS reserves the right to change any circuitry or specifications without notice. ICS does not authorize or warrant any ICS product for use in life support devices or critical medical instruments. 6 MDS 3726-12 B In te grated Circuit Systems ● 525 Ra ce Street, San Jose, CA 9512 6 Revision 120505 ● tel (4 08) 297-1 201 ● w w w. i c s t . c o m