IDH06SG60C 3rd Generation thinQ!TM SiC Schottky Diode Features Product Summary • Revolutionary semiconductor material - Silicon Carbide VDC 600 V • No reverse recovery / No forward recovery QC 8 nC • Temperature independent switching behavior IF; TC< 130 °C 6 A • Switching behavior benchmark • High surge current capability • Pb-free lead plating; RoHS compliant • Qualified according to JEDEC1) for target applications • Breakdown voltage tested at 20mA2) • Optimized for high temperature operation • Lowest Figure of Merit QC/IF thinQ! 3G Diode designed for fast switching applications like: • SMPS e.g.; CCM PFC • Motor Drives; Solar Applications; UPS Type Package Marking Pin 1 Pin 2 IDH06SG60C PG-TO220-2 D06G60C C A Maximum ratings Parameter Symbol Conditions Continuous forward current IF Value T C<130 °C 6 Surge non-repetitive forward current, I F,SM sine halfwave T C=25 °C, t p=10 ms 32 T C=150 °C, t p=10 ms 23 I F,max T C=25 °C, t p=10 µs 190 ∫i 2dt T C=25 °C, t p=10 ms 5.1 T C=150 °C, t p=10 ms 2.5 Non-repetitive peak forward current Unit A A2s i ²t value Repetitive peak reverse voltage V RRM T j=25 °C 600 V Diode dv/dt ruggedness dv/ dt VR= 0….480 V 50 V/ns Power dissipation P tot T C=25 °C 71 W Operating and storage temperature T j, T stg -55 ... 175 °C Soldering temperature, wavesoldering only allowed at leads T sold Mounting torque Rev. 2.4 1.6mm (0.063 in.) from case for 10s 260 M3 and M3.5 screws 60 page 1 Ncm 2012-12-12 IDH06SG60C Parameter Values Symbol Conditions Unit min. typ. max. - - 2.1 - - 62 600 - - Thermal characteristics Thermal resistance, junction - case R thJC Thermal resistance, junction - ambient R thJA Thermal resistance, junction- ambient, leaded K/W Electrical characteristics, at T j=25 °C, unless otherwise specified Static characteristics DC blocking voltage V DC I R=0.05 mA, T j=25 °C Diode forward voltage VF I F=6 A, T j=25 °C - 2.1 2.3 I F=6 A, T j=150 °C - 2.8 - V R=600 V, T j=25 °C - 0.5 50 V R=600 V, T j=150 °C - 2 500 - 8 - nC - - <10 ns pF Reverse current IR V µA AC characteristics Total capacitive charge Qc Switching time3) tc V R=400 V,I F≤I F,max, di F/dt =200 A/µs, T j=150 °C Total capacitance C V R=1 V, f =1 MHz - 130 - V R=300 V, f =1 MHz - 20 - V R=600 V, f =1 MHz - 20 - 1) J-STD20 and JESD22 2) All devices tested under avalanche conditions, for a time periode of 10ms, at 20mA. 3) tc is the time constant for the capacitive displacement current waveform (independent from T j, ILOAD and di/dt), different from trr which is dependent on Tj, ILOAD and di/dt. No reverse recovery time constant trr due to absence of minority carrier injection. 4) Under worst case Zth conditions. 5) Only capacitive charge occuring, guaranteed by design. Rev. 2.4 page 2 2012-12-12 IDH06SG60C 1 Power dissipation 2 Diode forward current P tot=f(T C); parameter: RthJC(max) I F=f(T C)4); T j≤175 °C; parameter: D = t p/T 45 80 40 70 0.1 35 60 30 IF [A] Ptot [W] 50 40 25 0.3 20 0.5 30 15 0.7 1 20 10 10 5 0 0 25 50 75 100 125 150 25 175 50 75 100 TC [°C] 125 150 175 TC [°C] 3 Typ. forward characteristic 4 Typ. forward characteristic in surge current mode I F=f(VF); t p=400 µs; parameter:T j I F=f(VF); t p=400 µs; parameter: T j 8 40 -55ºC 25ºC 175ºC 150ºC 100ºC 150ºC 7 IF 30 IF 6 IF [A] IF [A] 5 4 3 -55ºC 20 175ºC 25ºC 2 10 100ºC 1 0 0 0 1 2 3 4 VF[V] Rev. 2.4 0 2 4 6 8 10 VF[V] page 3 2012-12-12 IDH06SG60C 5 Typ. capacitance charge vs. current slope 6 Typ. reverse current vs. reverse voltage 5) Q C=f(di F/dt ) ; I F≤I F,max I R=f(VR); parameter: T j 101 8 100 6 10-1 IR [µA] Qc [nC] 10 4 10-2 175 °C 150 °C 100 °C 2 10-3 0 -55 °C 25 °C 10-4 100 400 700 1000 100 200 diF/dt [A/µs] 300 400 500 600 VR [V] 7 Typ. transient thermal impedance 8 Typ. capacitance vs. reverse voltage Z thJC=f(t p); parameter: D = t P/T C =f(V R); T C=25 °C, f =1 MHz 101 175 150 125 100 C [pF] ZthJC [K/W] 0.5 0.2 100 75 0.05 0.1 10-1 50 0.05 0.02 25 0 10-2 0 10-6 10-5 10-4 10-3 10-2 10-1 tP [s] Rev. 2.4 10-1 100 101 102 103 VR [V] page 4 2012-12-12 IDH06SG60C 9 Typ. C stored energy E C=f(V R) 3.5 3.0 Ec [µJ] 2.5 2.0 1.5 1.0 0.5 0.0 0 200 400 600 VR [V] Rev. 2.4 page 5 2012-12-12 IDH06SG60C PG-TO220-2: Outline Dimensions in mm/inches Rev. 2.4 page 6 2012-12-12 IDH06SG60C Published by Infineon Technologies AG 81726 Munich, Germany © 2012 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems and/or automotive, aviation and aerospace applications or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support , automotive, aviation and aerospace device or system or to affect the safety or effectiveness of that device or system. Life support systems are intended to be implanted in the human body and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Rev. 2.4 page 7 2012-12-12