INTERSIL ISL54500IRUZ-T

ISL54500
Features
The Intersil ISL54500 device is a low ON-resistance,
low voltage, bidirectional, single pole/double throw
(SPDT) analog switch designed to operate from a
single +1.8V to +5.5V supply. Targeted applications
include battery powered equipment that benefit from
low ON-resistance and fast switching speeds
(tON = 22ns, tOFF = 15ns). The digital logic input is
1.8V CMOS compatible when using a single +3V
supply.
• ON-resistance (rON)
- VCC = +5.0V . . . . . . . . . . . . . . . . . . . . . 5.0Ω
- VCC = +3.0V . . . . . . . . . . . . . . . . . . . . . 7.0Ω
- VCC = +1.8V . . . . . . . . . . . . . . . . . . . . . 13Ω
Cell phones, for example, often face ASIC
functionality limitations. The number of analog input
or GPIO pins may be limited and digital geometries
are not well suited to analog switch performance. This
part may be used to “mux-in” additional functionality
while reducing ASIC design risk. The ISL54500 is
offered in the 6 Ld 1.2mmx1.0mmx0.4mm pitch
µTDFN package, and 6 Ld SOT-23 package, alleviating
board space limitations.
The ISL54500 is a committed SPDT that consists of
one normally open (NO) and one normally closed
(NC) switch. This configuration can also be used as a
2-to-1 multiplexer.
TABLE 1. FEATURES AT A GLANCE
ISL54500
Number of Switches
1
SW
SPDT or 2-1 MUX
1.8V rON
12Ω
1.8V tON/tOFF
70ns/52ns
3V rON
6.0Ω
3V tON/tOFF
30ns/20ns
5V rON
5.0Ω
5V tON/tOFF
22ns/15ns
Packages
6 Ld µTDFN, 6 Ld SOT-23
November 9, 2009
FN6549.2
1
• rON Matching Between Channels . . . . . . . . . 46mΩ
• rON Flatness (+4.5V Supply) . . . . . . . . . . . . . 1.1Ω
• Single Supply Operation . . . . . . . . +1.8V to +5.5V
• Fast Switching Action (+4.5V Supply)
- tON . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22ns
- tOFF . . . . . . . . . . . . . . . . . . . . . . . . . . . 15ns
• Guaranteed Break-Before-Make
• ESD HBM Rating . . . . . . . . . . . . . . . . . . . . . . . 6kV
• 1.8V, CMOS logic compatible (+3V supply)
• Available in 6 Ld µTDFN and 6 Ld SOT-23 Packages
• Pb-free Available (RoHS compliant)
Applications
• Battery powered, handheld, and portable
equipment
- Cellular/Mobile Phones
- Pagers
- Laptops, notebooks, palmtops
• Portable Test and Measurement
• Medical Equipment
• Audio and Video Switching
Related Literature
• Technical Brief TB363 “Guidelines for Handling and
Processing Moisture Sensitive Surface Mount
Devices (SMDs)”
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2007, 2009. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
ISL54500
+1.8V to +5.5V, 5Ω, Single SPDT Analog Switch
ISL54500
Ordering Information
PART NUMBER
(Notes 1, 4)
PACKAGE
(Pb-Free)
(Tape and Reel)
TEMP. RANGE
(°C)
PART MARKING
PKG. DWG. #
ISL54500IRUZ-T (Note 2)
0
-40 to +85
6 Ld µTDFN
L6.1.2x1.0A
ISL54500IHZ-T (Note 3)
4500
-40 to +85
6 Ld SOT-23
MDP0038
NOTES:
1. Please refer to TB347 for details on reel specifications.
2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials
and NiPdAu plate - e4 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering
operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free
requirements of IPC/JEDEC J STD-020.
3. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach
materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both
SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that
meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
4. For Moisture Sensitivity Level (MSL), please see device information page for ISL54500. For more information on MSL please
see techbrief TB363.
Pin Configuration
(Note 5)
ISL54500
(6 LD SOT-23)
TOP VIEW
ISL54500
(6 LD ΜTDFN)
TOP VIEW
NO
1
6
IN
GND
2
5
V+
NC
3
4
COM
NC
1
6 GND
IN
2
5 COM
NO
3
4 V+
NOTE:
5. Switches Shown for Logic “0” Input.
Pin Descriptions
Truth Table
NOTE:
LOGIC
PIN NC
PIN NO
0
ON
OFF
1
OFF
ON
µTDFN SOT-23
PIN
PIN
NAME NUMBER NUMBER
V+
5
4
System Power Supply Input
(+1.8V to +5.5V)
GND
2
6
Ground Connection
IN
6
2
Digital Control Input
COM
4
5
Analog Switch Common Pin
NO
1
3
Analog Switch Normally Open
Pin
NC
3
1
Analog Switch Normally
Closed Pin
Logic “0” ≤0.5V. Logic “1” ≥1.4V with a 3V supply.
2
FUNCTION
FN6549.2
November 9, 2009
ISL54500
Absolute Maximum Ratings
Thermal Information
V+ to GND . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 to 6.5V
Input Voltages
NO, NC, IN (Note 6) . . . . . . . . . . . . -0.5 to ((V+) + 0.5V)
Output Voltages
COM (Note 6) . . . . . . . . . . . . . . . . -0.5 to ((V+) + 0.5V)
Continuous Current NO, NC, or COM. . . . . . . . . . . . ±300mA
Peak Current NO, NC, or COM
(Pulsed 1ms, 10% Duty Cycle, Max) . . . . . . . . . . ±500mA
ESD Rating:
Human Body Model . . . . . . . . . . . . . . . . . . . . . . . . >6kV
Machine Model. . . . . . . . . . . . . . . . . . . . . . . . . . . >200V
Charged Device Model . . . . . . . . . . . . . . . . . . . . . . . . . . . .>2.2kV
Thermal Resistance (Typical)
θJA (°C/W) θJC (°C/W)
6 Ld µTDFN Package (Notes 7, 9). .
239.2
111.6
6 Ld SOT-23 Package (Note 8, 9) . .
260
120
Maximum Junction Temperature (Plastic Package). . +150°C
Maximum Storage Temperature Range. . . . . -65°C to +150°C
Pb-free reflow profile . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Operating Conditions
V+ (Positive DC Supply Voltage) . . .
Analog Signal Range . . . . . . . . . . .
VIN (Digital Logic Input Voltage (IN)
Temperature Range . . . . . . . . . . . .
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
. . 1.8V to 5.5V
. . . . . 0V to V+
. . . . . 0V to V+
-40°C to +85°C
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact
product reliability and result in failures not covered by warranty.
NOTES:
6. Signals on NC, NO, IN, or COM exceeding V+ or GND are clamped by internal diodes. Limit forward diode current to maximum
current ratings.
7. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach”
features. See Tech Brief TB379.
8. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief
TB379 for details.
9. For θJC, the “case temp” location is taken at the package top center.
Electrical Specifications - 5V Supply
PARAMETER
Test Conditions: V+ = +4.5V to +5.5V, GND = 0V, VINH = 2.0V, VINL = 0.8V
(Note 10), Unless Otherwise Specified. Boldface limits apply over the operating
temperature range, -40°C to +85°C.
TEST CONDITIONS
TEMP
MIN
(°C) (Notes 11, 12)
TYP
MAX
(Notes 11, 12) UNITS
ANALOG SWITCH CHARACTERISTICS
Analog Signal Range, VANALOG
ON-Resistance, rON
Full
0
-
V+
V
V+ = 4.5V, ICOM = 100mA, VNO or VNC = 0V
to V+, (Note 14, See Figure 5)
25
-
4.2
5
Ω
Full
-
-
6
Ω
rON Matching Between
Channels, ΔrON
V+ = 4.5V, ICOM = 100mA, VNO or
VNC = 2.5V (Note 14)
25
-
0.046
0.2
Ω
Full
-
-
0.3
Ω
rON Flatness, rFLAT(ON)
V+ = 4.5V, ICOM = 100mA, VNO or VNC = 0V
to V+, (Notes 13, 14)
25
-
1.1
1.3
Ω
Full
-
-
1.5
Ω
25
-25
1.2
25
nA
Full
NO or NC OFF Leakage Current, V+ = 5.5V, VCOM = 0.3V, 5V, VNO or
INO(OFF) or INC(OFF)
VNC = 5V, 0.3V
-150
-
150
nA
V+ = 5.5V, VCOM = 0.3V, 5V, or VNO or
VNC = 0.3V, 5V, or Floating
25
-30
1.7
30
nA
Full
-300
-
300
nA
V+ = 4.5V, VNO or VNC = 3.0V, RL = 50Ω,
CL = 35pF (See Figure 1)
25
-
22
-
ns
Full
-
23
-
ns
V+ = 4.5V, VNO or VNC = 3.0V, RL = 50Ω,
CL = 35pF (See Figure 1)
25
-
15
-
ns
Full
-
15
-
ns
Break-Before-Make Time Delay, V+ = 5.5V, VNO or VNC = 3.0V, RL = 50Ω,
CL = 35pF (See Figure 3)
tD
Full
-
18
-
ns
Charge Injection, Q
VG = 0V, RG = 0Ω, CL = 1.0nF (See Figure 2)
25
-
16
-
pC
OFF-Isolation
RL = 50Ω, CL = 5pF, f = 1MHz,
VCOM = 1VP-P (See Figure 4)
25
-
75
-
dB
Total Harmonic Distortion
f = 20Hz to 20kHz, VCOM = 2VP-P, RL = 32Ω
25
-
0.12
-
%
COM ON Leakage Current,
ICOM(ON)
DYNAMIC CHARACTERISTICS
Turn-ON Time, tON
Turn-OFF Time, tOFF
3
FN6549.2
November 9, 2009
ISL54500
Electrical Specifications - 5V Supply
PARAMETER
Test Conditions: V+ = +4.5V to +5.5V, GND = 0V, VINH = 2.0V, VINL = 0.8V
(Note 10), Unless Otherwise Specified. Boldface limits apply over the operating
temperature range, -40°C to +85°C. (Continued)
TEST CONDITIONS
Total Harmonic Distortion
f = 20Hz to 20kHz, VCOM = 2VP-P,
RL = 600Ω
-3dB Bandwidth
NO or NC OFF Capacitance,
COFF
TEMP
MIN
(°C) (Notes 11, 12)
TYP
MAX
(Notes 11, 12) UNITS
25
-
0.01
-
%
Signal = 0dBm, RL = 50Ω
25
-
350
-
MHz
V+ = 4.5V, f = 1MHz, VNO or
VNC = VCOM = 0V (See Figure 7)
25
-
6
-
pF
COM ON Capacitance, CCOM(ON) V+ = 4.5V, f = 1MHz, VNO or
VNC = VCOM = 0V (See Figure 7)
25
-
12
-
pF
Full
1.8
-
5.5
V
25
-
0.02
0.1
µA
Full
-
0.5
2.5
µA
Full
-
-
0.8
V
POWER SUPPLY CHARACTERISTICS
Power Supply Range
Positive Supply Current, I+
V+ = 5.5V, VIN = 0V or V+
DIGITAL INPUT CHARACTERISTICS
Input Voltage Low, VINL
Input Voltage High, VINH
Input Current, IINH, IINL
V+ = 5.5V, VIN = 0V or V+
Electrical Specifications - 3V Supply
PARAMETER
Full
2.4
-
-
V
Full
-0.1
0.044
0.1
µA
Test Conditions: V+ = +2.7V to +3.6V, GND = 0V, VINH = 1.4V, VINL = 0.5V
(Note 10), Unless Otherwise Specified. Boldface limits apply over the operating
temperature range, -40°C to +85°C.
TEST CONDITIONS
TEMP
(°C)
MIN
(Notes 11, 12)
Full
TYP
MAX
(Notes 11, 12) UNITS
ANALOG SWITCH CHARACTERISTICS
0
-
V+
V
V+ = 2.7V, ICOM = 100mA, VNO or VNC = 0V
to V+, (Note 14, See Figure 5)
25
-
6.3
7
Ω
Full
-
-
8
Ω
rON Matching Between
Channels, ΔrON
V+ = 2.7V, ICOM = 100mA, VNO or
VNC = 1.5V (Note 14)
25
-
0.05
0.3
Ω
Full
-
-
0.4
Ω
rON Flatness, rFLAT(ON)
V+ = 2.7V, ICOM = 100mA, VNO or VNC = 0V
to V+, (Notes 13, 14)
25
-
1.8
2.3
Ω
Full
-
-
2.5
Ω
25
-
28
-
ns
Full
-
30
-
ns
25
-
20
-
ns
Full
-
30
-
ns
Full
-
22
-
ns
Analog Signal Range, VANALOG
ON-Resistance, rON
DYNAMIC CHARACTERISTICS
Turn-ON Time, tON
V+ = 2.7V, VNO or VNC = 1.5V, RL = 50Ω,
CL = 35pF (See Figure 1)
Turn-OFF Time, tOFF
V+ = 2.7V, VNO or VNC = 1.5V, RL = 50Ω,
CL = 35pF (See Figure 1)
Break-Before-Make Time Delay, V+ = 3.0V, VNO or VNC = 1.5V, RL = 50Ω,
CL = 35pF (See Figure 3)
tD
Charge Injection, Q
VG = 0V, RG = 0Ω, CL = 1.0nF (See Figure 2)
25
-
12
-
pC
OFF-Isolation
RL = 50Ω, CL = 5pF, f = 1MHz, VCOM = 1VP-p
(See Figure 4)
25
-
75
-
dB
Total Harmonic Distortion
f = 20Hz to 20kHz, VCOM = 2VP-P, RL = 32Ω
f = 20Hz to 20kHz, VCOM = 2VP-P,
RL = 600Ω
25
-
0.4
-
%
25
-
0.053
-
%
-3dB Bandwidth
Signal = 0dBM, RL = 50Ω
25
-
350
-
MHz
NO or NC OFF Capacitance,
COFF
f = 1MHz, VNO or VNC = VCOM = 0V
(See Figure 7)
25
-
6
-
pF
COM ON Capacitance, CCOM(ON) f = 1MHz, VNO or VNC = VCOM = 0V
(See Figure 7)
25
-
12
-
pF
Total Harmonic Distortion
4
FN6549.2
November 9, 2009
ISL54500
Electrical Specifications - 3V Supply
Test Conditions: V+ = +2.7V to +3.6V, GND = 0V, VINH = 1.4V, VINL = 0.5V
(Note 10), Unless Otherwise Specified. Boldface limits apply over the operating
temperature range, -40°C to +85°C.
PARAMETER
TEST CONDITIONS
TEMP
(°C)
MIN
(Notes 11, 12)
TYP
MAX
(Notes 11, 12) UNITS
25
-
0.02
-
µA
Full
-
0.11
-
µA
POWER SUPPLY CHARACTERISTICS
Positive Supply Current, I+
V+ = 3.6V, VIN = 0V or V+
DIGITAL INPUT CHARACTERISTICS
Input Voltage Low, VINL
Full
-
-
0.5
V
Input Voltage High, VINH
Full
1.4
-
-
V
Full
-0.1
0.049
0.1
µA
Input Current, IINH, IINL
V+ = 3.6V, VIN = 0V or V+
Electrical Specifications - 1.8V Supply
PARAMETER
Test Conditions: V+ = +1.8V, GND = 0V, VINH = 1V, VINL = 0.4V (Note 10),
Unless Otherwise Specified.
TEST CONDITIONS
TEMP
(°C)
MIN
(Notes 11, 12)
TYP
Full
0
-
MAX
(Notes 11, 12) UNITS
ANALOG SWITCH CHARACTERISTICS
Analog Signal Range, VANALOG
ON-Resistance, rON
V+ = 1.8V, ICOM = 10mA, VNO or VNC = 0V
to V+, (Note 14, See Figure 5)
V+
V
25
-
11.9
12.8
Ω
Full
-
-
13.8
Ω
DYNAMIC CHARACTERISTICS
Turn-ON Time, tON
Turn-OFF Time, tOFF
V+ = 1.8V, VNO or VNC = 1.5V, RL = 50Ω,
CL = 35pF (See Figure 1)
25
-
70
-
ns
Full
-
130
-
ns
V+ = 1.8V, VNO or VNC = 1.5V, RL = 50Ω,
CL = 35pF (See Figure 1)
25
-
52
-
ns
Full
-
100
-
ns
Break-Before-Make Time Delay,
tD
V+ = 1.8V, VNO or VNC = 1.5V, RL = 50Ω,
CL = 35pF (See Figure 3)
Full
-
42
-
ns
Charge Injection, Q
VG = 0, RG = 0Ω, CL = 1.0nF (See Figure 2)
25
-
5.8
-
pC
Input Voltage Low, VINL
Full
-
-
0.4
V
Input Voltage High, VINH
Full
1
-
-
V
DIGITAL INPUT CHARACTERISTICS
NOTES:
10. VIN = input voltage to perform proper function.
11. The algebraic convention, whereby the most negative value is a minimum and the most positive a maximum, is used in this data sheet.
12. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by
characterization and are not production tested.
13. Flatness is defined as the difference between maximum and minimum value of on-resistance over the specified analog signal range.
14. Limits established by characterization and are not production tested.
5
FN6549.2
November 9, 2009
ISL54500
Test Circuits and Waveforms
V+
LOGIC
INPUT
V+
tr < 20ns
tf < 20ns
50%
C
0V
tOFF
SWITCH
INPUT VNO
COM
IN
VOUT
90%
SWITCH
OUTPUT
VOUT
NO or NC
SWITCH
INPUT
90%
LOGIC
INPUT
RL
50Ω
GND
CL
35pF
0V
tON
Note: Logic input waveform is inverted for switches that
have the opposite logic sense.
Note: Repeat test for all switches. CL includes fixture and
stray capacitance.
RL
V OUT = V (NO or NC) ---------------------------R L + r ( ON )
FIGURE 1A. MEASUREMENT POINTS
FIGURE 1B. TEST CIRCUIT
FIGURE 1. SWITCHING TIMES
V+
SWITCH
OUTPUT
VOUT
ΔVOUT
ON
LOGIC
INPUT
RG
ON
OFF
C
VOUT
COM
NO OR NC
VINH
VINL
VG
GND
IN
CL
LOGIC
INPUT
Q = ΔVOUT x CL
FIGURE 2B. TEST CIRCUIT
FIGURE 2A. MEASUREMENT POINTS
FIGURE 2. CHARGE INJECTION
V+
C
V+
LOGIC
INPUT
VNX
0V
SWITCH
OUTPUT
VOUT
NO
0V
LOGIC
INPUT
tD
FIGURE 3A. MEASUREMENT POINTS
RL
50Ω
IN
90%
VOUT
COM
NC
CL
35pF
GND
CL includes fixture and stray capacitance.
FIGURE 3B. TEST CIRCUIT
FIGURE 3. BREAK-BEFORE-MAKE TIME
6
FN6549.2
November 9, 2009
ISL54500
Test Circuits and Waveforms (Continued)
V+
V+
C
C
rON = V1/I1 *
SIGNAL
GENERATOR
NO OR NC
NO OR NC
VNX
IN
0V OR V+
I1
IN
V1
VINL OR VINH
100mA
COM
COM
ANALYZER
GND
GND
RL
* I = 10mA AT V+ = 1.8V
1
FIGURE 4. OFF-ISOLATION TEST CIRCUIT
FIGURE 5. rON TEST CIRCUIT
V+
C
V+
C
50Ω
COM
NO OR NC
NO OR NC
IN1
SIGNAL
GENERATOR
0V or V+
VINL OR VINH
COM
NC OR NO
ANALYZER
IN
IMPEDANCE
ANALYZER
GND
GND
RL
FIGURE 6. CROSSTALK TEST CIRCUIT
Detailed Description
The ISL54500 is a bi-directional, single pole/double
throw (SPDT) analog switch that offers precise
switching capability from a single 1.8V to 5.5V supply
with low ON-resistance (5Ω) and high speed operation
(tON = 22ns, tOFF = 15ns). The device is especially
well suited for portable battery powered equipment
due to its low operating supply voltage (1.8V), low
power consumption (0.11µW), low leakage currents
(300nA max) and small µTDFN and SOT-23 packages.
The low ON-resistance and rON flatness provide very
low insertion loss and distortion to application that
require signal reproduction.
FIGURE 7. CAPACITANCE TEST CIRCUIT
parasitic SCR structures to turn ON, creating a low
impedance path from the V+ power supply to ground.
This will result in a significant amount of current flow in
the IC, which can potentially create a latch-up state or
permanently damage the IC. The external V+ resistor
limits the current during this over-stress situation and
has been found to prevent latch-up or destructive
damage for many over voltage transient events.
Under normal operation, the sub-microamp IDD
current of the IC produces an insignificant voltage drop
across the 100Ω series resistor resulting in no impact
to switch operation or performance.
External V+ Series Resistor
For improved ESD and latch-up immunity Intersil
recommends adding a 100Ω resistor in series with the
V+ power supply pin of the ISL54050 IC
(see Figure 8).
During an overvoltage transient event (such as occurs
during system level IEC 61000 ESD testing), substrate
currents can be generated in the IC that can trigger
7
FN6549.2
November 9, 2009
ISL54500
V+
C
OPTIONAL
PROTECTION
RESISTOR
OPTIONAL
SCHOTTKY
DIODE
V+
100Ω
OPTIONAL
PROTECTION
RESISTOR
NO
COM
NC
INX
VNX
VCOM
IN
GND
GND
OPTIONAL
SCHOTTKY
DIODE
FIGURE 8. V+ SERIES RESISTOR FOR ENHANCED
ESD AND LATCH-UP IMMUNITY
Supply Sequencing And Overvoltage
Protection
With any CMOS device, proper power supply
sequencing is required to protect the device from
excessive input currents, which might permanently
damage the IC. All I/O pins contain ESD protection
diodes from the pin to V+ and to GND (see Figure 9).
To prevent forward biasing these diodes, V+ must be
applied before any input signals, and the input signal
voltages must remain between V+ and GND.
If these conditions cannot be guaranteed then
precautions must be implemented to prohibit the
current and voltage at the logic pin and signal pins
from exceeding the maximum ratings of the switch.
The following two methods can be used to provide
additional protection to limit the current in the event
that the voltage at a signal pin or logic pin goes below
ground or above the V+ rail.
Logic inputs can easily be protected by adding a 1kΩ
resistor in series with the input (see Figure 9). The
resistor limits the input current below the threshold
that produces permanent damage, and the
sub-microamp input current produces an insignificant
voltage drop during normal operation.
This method is not acceptable for the signal path
inputs. Adding a series resistor to the switch input
defeats the purpose of using a low rON switch.
Connecting Schottky diodes to the signal pins (as
shown in Figure 9) will shunt the fault current to the
supply or to ground, thereby protecting the switch.
These Schottky diodes must be sized to handle the
expected fault current.
FIGURE 9. OVERVOLTAGE PROTECTION
Power-Supply Considerations
The ISL54500 construction is typical of most single
supply CMOS analog switches, in that they have two
supply pins: V+ and GND. V+ and GND drive the
internal CMOS switches and set their analog voltage
limits. Unlike switches with a 4V maximum supply
voltage, the ISL54500 5.5V maximum supply voltage
provides plenty of room for the 10% tolerance of 3.6V
supplies, as well as room for overshoot and noise
spikes.
The minimum recommended supply voltage is 1.8V but
the part will operate with a supply below 1.8V. It is
important to note that the input signal range, switching
times, and ON-resistance degrade at lower supply
voltages. Refer to the “Electrical Specifications” tables
starting on page 3 and the ”Typical Performance
Curves” starting on page 9 for details.
V+ and GND also power the internal logic and level
shifters. The level shifters convert the input logic levels
to switched V+ and GND signals to drive the analog
switch gate terminals.
This family of switches cannot be operated with bipolar
supplies because the input switching point becomes
negative in this configuration.
Logic-Level Thresholds
This switch family is 1.8V CMOS compatible (0.5V and
1.4V) over a supply range of 2V to 3.6V (see
Figure 16). At 3.6V the VIH level is about 0.98V. This is
still below the 1.8V CMOS guaranteed high output
minimum level of 1.4V, but noise margin is reduced.
The digital input stages draw supply current whenever
the digital input voltage is not at one of the supply
rails. Driving the digital input signals from GND to V+
with a fast transition time minimizes power dissipation.
High-Frequency Performance
In 50Ω systems, the ISL54500 has a -3dB bandwidth
of 350MHz (see Figure 17). The frequency response is
8
FN6549.2
November 9, 2009
ISL54500
very consistent over a wide V+ range, and for varying
analog signal levels.
One of these diodes conducts if any analog signal
exceeds V+ or GND.
An OFF switch acts like a capacitor and passes higher
frequencies with less attenuation, resulting in signal
feedthrough from a switch’s input to its output.
Off-isolation is the resistance to this feedthrough, while
crosstalk indicates the amount of feedthrough from
one switch to another. Figure 18 details the high
off-isolation provided by this family. At 1MHz,
of-isolation is about 75dB in 50Ω systems, decreasing
approximately 20dB per decade as frequency
increases. Higher load impedances decrease
off-isolation due to the voltage divider action of the
switch OFF impedance and the load impedance.
Virtually all the analog leakage current comes from the
ESD diodes to V+ or GND. Although the ESD diodes on
a given signal pin are identical and therefore fairly well
balanced, they are reverse biased differently. Each is
biased by either V+ or GND and the analog signal. This
means their leakages will vary as the signal varies. The
difference in the two diode leakages to the V+ and
GND pins constitutes the analog-signal-path leakage
current. All analog leakage current flows between each
pin and one of the supply terminals, not to the other
switch terminal. This is why both sides of a given
switch can show leakage currents of the same or
opposite polarity. There is no connection between the
analog signal paths and V+ or GND.
Leakage Considerations
ESD protection diodes are internally connected
between each analog-signal pin and both V+ and GND.
Typical Performance Curves
TA = +25°C, Unless Otherwise Specified
6
8
V+ = 4.5V
ICOM = 100mA
ICOM = 100mA
7
5
V+ = 2.7V
6
4
V+ = 3V
rON (Ω)
rON (Ω)
5
4
V+ = 4.5V
3
+85°C
+25°C
3
-40°C
V+ = 5V
2
2
1
1
0
0
1
2
3
4
5
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
VCOM (V)
VCOM (V)
FIGURE 10. ON-RESISTANCE vs SUPPLY VOLTAGE vs
SWITCH VOLTAGE
FIGURE 11. ON-RESISTANCE vs SWITCH VOLTAGE
8
14
13
7
+85°C
12
11
+25°C
5
10
rON (Ω)
rON (Ω)
6
-40°C
4
+85°C
9
8
+25°C
7
-40°C
6
V+ = 2.7V
ICOM = 100mA
3
5
V+ = 1.8V
ICOM = 10mA
4
3
2
0
0.5
1.0
1.5
2.0
2.5
VCOM (V)
FIGURE 12. ON-RESISTANCE vs SWITCH VOLTAGE
9
2
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
VCOM (V)
FIGURE 13. ON-RESISTANCE vs SWITCH VOLTAGE
FN6549.2
November 9, 2009
ISL54500
Typical Performance Curves
TA = +25°C, Unless Otherwise Specified (Continued)
100
130
120
-40°C
90
-40°C
110
80
100
70
80
tOFF (ns)
tON (ns)
90
+25°C
70
60
50
+25°C
50
40
30
40
+85°C
20
30
+85°C
10
20
10
60
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
0
6.0
1.5
2.0
2.5
3.0
3.5
FIGURE 14. TURN-ON TIME vs SUPPLY VOLTAGE
4.5
5.0
5.5
6.0
FIGURE 15. TURN-OFF TIME vs SUPPLY VOLTAGE
1.4
0
-1
1.2
-2
V+ = 1.8V TO 5.5V
VCOM = 1VP-P
-3
NORMALIZED GAIN (dB)
1.0
VINH AND VINL (V)
4.0
V+ (V)
V+ (V)
VINH
0.8
VINL
0.6
0.4
-4
-5
-6
-7
-8
-9
-10
0.2
-11
-12
0.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
V+ (V)
FIGURE 16. DIGITAL SWITCHING POINT vs SUPPLY
VOLTAGE
10
-13
100k
1M
10M
100M
1G
FREQUENCY (Hz)
FIGURE 17. FREQUENCY RESPONSE
FN6549.2
November 9, 2009
ISL54500
Typical Performance Curves
TA = +25°C, Unless Otherwise Specified (Continued)
-20
-30
19
V+ = 1.8V TO 5.5V
-40
14
-50
Q (pC)
(dB)
-60
-70
-80
9
4
-90
V+ = 5V
-100
-1
-110
-120
1k
V+ = 1.8V
10k
100k
1M
10M
100M
FREQUENCY (Hz)
FIGURE 18. OFF-ISOLATION
1G
-6
0.0
0.5
1.0
1.5
2.0
2.5
V+ = 3V
3.0
3.5
4.0
4.5
5.0
VCOM (V)
FIGURE 19. CHARGE INJECTION vs SWITCH VOLTAGE
Die Characteristics
SUBSTRATE POTENTIAL (POWERED UP):
GND
TRANSISTOR COUNT:
PROCESS:
Submicron CMOS
11
FN6549.2
November 9, 2009
ISL54500
SOT-23 Package Family
MDP0038
e1
D
SOT-23 PACKAGE FAMILY
A
MILLIMETERS
6
N
SYMBOL
4
E1
2
E
3
0.15 C D
1
2X
2
3
0.20 C
5
2X
e
0.20 M C A-B D
B
b
NX
0.15 C A-B
1
3
SOT23-5
SOT23-6
A
1.45
1.45
MAX
A1
0.10
0.10
±0.05
A2
1.14
1.14
±0.15
b
0.40
0.40
±0.05
c
0.14
0.14
±0.06
D
2.90
2.90
Basic
E
2.80
2.80
Basic
E1
1.60
1.60
Basic
e
0.95
0.95
Basic
e1
1.90
1.90
Basic
L
0.45
0.45
±0.10
L1
0.60
0.60
Reference
N
5
6
Reference
D
2X
TOLERANCE
Rev. F 2/07
NOTES:
C
A2
16. Plastic interlead protrusions of 0.25mm maximum per side are not
included.
SEATING
PLANE
A1
0.10 C
15. Plastic or metal protrusions of 0.25mm maximum per side are not
included.
17. This dimension is measured at Datum Plane “H”.
18. Dimensioning and tolerancing per ASME Y14.5M-1994.
NX
19. Index area - Pin #1 I.D. will be located within the indicated zone
(SOT23-6 only).
(L1)
20. SOT23-5 version has no center lead (shown as a dashed line).
H
A
GAUGE
PLANE
c
L
0.25
0° +3°
-0°
For additional products, see www.intersil.com/product_tree
Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted
in the quality certifications found at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications
at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by
Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any
infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any
patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
12
FN6549.2
November 9, 2009
ISL54500
Ultra Thin Dual Flat No-Lead Plastic Package (UTDFN)
A
E
L6.1.2x1.0A
B
6 LEAD ULTRA THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE
MILLIMETERS
PIN 1
REFERENCE
2X
0.10C
2X
0.10C
TOP VIEW
MIN
NOMINAL
MAX
NOTES
A
0.45
0.50
0.55
-
A1
-
-
0.05
-
A3
DETAIL A
0.10C
7X
SYMBOL
D
A
0.08C
A1 A3
SIDE VIEW
C
SEATING
PLANE
4X
e
DETAIL B
1
5X
L
3
L1
-
0.127 REF
b
0.15
0.20
0.25
5
D
0.95
1.00
1.05
-
E
1.15
1.20
1.25
-
e
-
0.40 BSC
L
0.30
0.35
0.40
-
L1
0.40
0.45
0.50
-
N
6
2
Ne
3
3
θ
0
-
4
12
Rev. 2 8/06
NOTES:
6
4
BOTTOM VIEW
b 6X
0.10 C A B
0.05C NOTE 3
1. Dimensioning and tolerancing conform to ASME Y14.51994.
2. N is the number of terminals.
3. Ne refers to the number of terminals on E side.
4. All dimensions are in millimeters. Angles are in degrees.
0.1x45°
CHAMFER
5. Dimension b applies to the metallized terminal and is
measured between 0.15mm and 0.30mm from the
terminal tip.
6. The configuration of the pin #1 identifier is optional, but
must be located within the zone indicated. The pin #1
identifier may be either a mold or mark feature.
A3
A1
7. Maximum package warpage is 0.05mm.
DETAIL A
DETAIL B PIN 1 LEAD
8. Maximum allowable burrs is 0.076mm in all directions.
9. JEDEC Reference MO-255.
10. For additional information, to assist with the PCB Land
Pattern Design effort, see Intersil Technical Brief TB389.
1.00
1.40
0.20
0.30
0.45
0.20
0.35
0.40
LAND PATTERN 10
13
FN6549.2
November 9, 2009