IXYS IXDI404 4 ampere dual low-side ultrafast mosfet driver Datasheet

IXDN404PI / N404SI / N404SI-16
IXDF404PI / F404SI / F404SI-16
IXDI404PI / I404SI / I404SI-16
4 Ampere Dual Low-Side Ultrafast MOSFET Drivers
Features
General Description
• Built using the advantages and compatibility
of CMOS and IXYS HDMOSTM processes
• Latch-Up Protected Over Entire
Operating Range
• High Peak Output Current: 4A Peak
• Wide Operating Range: 4.5V to 25V
• High Capacitive Load
Drive Capability: 1800pF in <15ns
• Matched Rise And Fall Times
• Low Propagation Delay Time
• Low Output Impedance
• Low Supply Current
• Two Drivers in Single Chip
The IXDN404/IXDI404/IXDF404 is comprised of two 4 Ampere
CMOS high speed MOSFET drivers. Each output can source
and sink 4A of peak current while producing voltage rise and
fall times of less than 15ns to drive the latest IXYS MOSFETs
& IGBT's. The input of the driver is compatible with TTL or
CMOS and is fully immune to latch up over the entire operating
range. A patent-pending circuit virtually eliminates CMOS
power supply cross conduction and current shoot-through.
Improved speed and drive capabilities are further enhanced by
very low, matched rise and fall times.
Applications
•
•
•
•
•
•
•
•
•
•
Driving MOSFETs and IGBTs
Motor Controls
Line Drivers
Pulse Generators
Local Power ON/OFF Switch
Switch Mode Power Supplies (SMPS)
DC to DC Converters
Pulse Transformer Driver
Class D Switching Amplifiers
Limiting di/dt Under Short Circuit
The IXDN404 is configured as a dual non-inverting gate driver,
the IXDI404 is a dual inverting gate driver, and the IXDF404 is a
dual inverting + non-inverting gate driver.
The IXDN404/IXDI404/IXDF404 family are available in the
standard 8 pin P-DIP (PI), SOP-8 (SI) and SOP-16 (SI-16)
packages.
Figure 1 - IXDN404 Dual 4A Non-Inverting Gate Driver Functional Block Diagram
Vcc
P
IN A
ANTI-CROSS
CONDUCTION
CIRCUIT *
OUT A
N
P
IN B
ANTI-CROSS
CONDUCTION
CIRCUIT *
GND
* Patent Pending
Copyright © IXYS CORPORATION 2001
First Release
OUT B
N
IXDN404PI / N404SI / N404SI-16
IXDF404PI / F404SI / F404SI-16
IXDN404PI / N404SI / N404SI-16
Figure 2 - IXDI404 Dual Inverting 4A Gate Driver Functional Block Diagram
Vcc
P
ANTI-CROSS
CONDUCTION
CIRCUIT *
IN A
OUT A
N
P
ANTI-CROSS
CONDUCTION
CIRCUIT *
IN B
OUT B
N
GND
Figure 3 - IXDF404 Inverting + Non-Inverting 4A Gate Driver Functional Block Diagram
Vcc
P
ANTI-CROSS
CONDUCTION
CIRCUIT *
IN A
OUT A
N
P
ANTI-CROSS
CONDUCTION
CIRCUIT *
IN B
GND
* Patent Pending
2
OUT B
N
IXDN404PI / N404SI / N404SI-16
IXDF404PI / F404SI / F404SI-16
Absolute Maximum Ratings (Note 1)
Parameter
Supply Voltage
All Other Pins
Operating Ratings
Parameter
Operating Temperature Range
Value
25V
-0.3V to VCC + 0.3V
150oC
Junction Temperature
Storage Temperature
Soldering Lead Temperature
(10 seconds maximum)
IXDI404PI / I404SI / I404SI-16
Value
-40oC to 85oC
Thermal Impedance (Junction To Ambient)
8 Pin PDIP (PI) (θJA)
120oC/W
8 Pin SOIC (SI) (θJA)
110oC/W
16 Pin SOIC (SI-16) (θJA)
110oC/W
-65oC to 150oC
300oC
Electrical Characteristics
Unless otherwise noted, TA = 25 oC, 4.5V ≤ VCC ≤ 25V .
All voltage measurements with respect to GND. Device configured as described in Test Conditions. All specifications are for one channel.
Symbol
Parameter
VIH
High input voltage
VIL
Low input voltage
VIN
Input voltage range
IIN
Input current
VOH
High output voltage
VOL
Low output voltage
ROH
Output resistance
@ Output High
Output resistance
@ Output Low
Peak output current
ROL
IPEAK
IDC
Test Conditions
Min
0V ≤ VIN ≤ VCC
Units
V
0.8
V
-5
VCC + 0.3
V
-10
10
µA
VCC - 0.025
V
0.025
V
IOUT = 10mA, VCC = 18V
1.5
3
Ω
IOUT = 10mA, VCC = 18V
1.5
3
Ω
VCC is 18V
4
tR
CL=1800pF Vcc=18V
11
tF
Fall time
CL=1800pF Vcc=18V
tONDLY
VCC
On-time propagation
delay
Off-time propagation
delay
Power supply voltage
ICC
Power supply current
VIN = 3.5V
VIN = 0V
VIN = + VCC
A
1
A
12
15
ns
12
14
17
ns
CL=1800pF Vcc=18V
33
34
38
ns
CL=1800pF Vcc=18V
28
30
35
ns
4.5
18
25
V
1
0
3
10
10
mA
µA
µA
Ordering Information
Part Number
IXDN404PI
IXDN404SI
IXDN404SI-16
IXDI404PI
IXDI404SI
IXDI404SI-16
IXDF404PI
IXDF404SI
IXDF404SI-16
Max
3.5
Continuous output
current
Rise time
tOFFDLY
Typ
Package Type
8-Pin PDIP
8-Pin SOIC
16-Pin SOIC
8-Pin PDIP
8-Pin SOIC
16-Pin SOIC
8-Pin PDIP
8-Pin SOIC
16-Pin SOIC
Temp. Range
Configuration
-40°C to +85°C
Dual Non Inverting
-40°C to +85°C
Dual Inverting
-40°C to +85°C
Inverting + Non Inverting
NOTE: Mounting or solder tabs on all packages are connected to ground
3
IXDN404PI / N404SI / N404SI-16
IXDF404PI / F404SI / F404SI-16
IXDN404PI / N404SI / N404SI-16
Pin Description
SYMBOL
IN A
FUNCTION
A Channel Input
GND
Ground
IN B
B Channel Input
OUT B
B Channel Output
VCC
Supply Voltage
OUT A
A Channel Output
DESCRIPTION
A Channel Input signal-TTL or CMOS compatible.
The system ground pin. Internally connected to all circuitry, this pin provides
ground reference for the entire chip. This pin should be connected to a low
noise analog ground plane for optimum performance.
B Channel Input signal-TTL or CMOS compatible.
B Channel Driver output. For application purposes, this pin is connected via
a resistor to a gate of a MOSFET/IGBT.
Positive power-supply voltage input. This pin provides power to the entire
chip. The range for this voltage is from 4.5V to 25V.
A Channel Driver output. For application purposes, this pin is connected via
a resistor to a gate of a MOSFET/IGBT.
CAUTION: These devices are sensitive to electrostatic discharge; follow proper ESD procedures when
handling and assembling this component.
Note 1: Operating the device beyond parameters with listed “Absolute Maximum Ratings” may cause permanent
damage to the device. Typical values indicate conditions for which the device is intended to be functional, but do not
guarantee specific performance limits. The guaranteed specifications apply only for the test conditions listed.
Exposure to absolute maximum rated conditions for extended periods may affect device reliability.
Figure 4 - Characteristics Test Diagram
Vcc
10uF
25V
1 NC
2 In A
3 Gnd
4
In B
NC 8
7
Out A
Vcc 6
Out B 5
Agilent 1147A
Current Probe
1800 pF
4
Agilent 1147A
Current Probe
1800 pF
IXDN404PI / N404SI / N404SI-16
IXDF404PI / F404SI / F404SI-16
IXDI404PI / I404SI / I404SI-16
Typical Performance Characteristics
Fig. 6
Rise Time vs. Supply Voltage
Fig. 5
Fall Time vs. Supply Voltage
60
40
35
50
30
40
Fall Time (ns)
Rise Time (ns)
25
CL=4700 pF
20
15
1800 pF
30
CL=4700 pF
20
1800 pF
10
10
200 pF
5
200 pF
0
0
8
10
12
14
16
8
18
10
12
Fig. 7
14
16
18
Supply Voltage (V)
Supply Voltage (V)
Rise And Fall Times vs. Case Temperature
CL=1nF VCC=18V
Fig. 8
Rise Time vs. Load Capacitance
80
25
70
8V
60
15
Rise Time (ns)
Time (ns)
20
tF
10
tR
10V
50
12V
40
18V
30
14V 16V
20
5
10
0
-40
-20
0
20
40
60
80
100
0
0k
120
2k
4k
Temperature (°C)
Fig. 9
6k
8k
10k
Load Capacitance (pF)
Max / Min Input vs. Case Temperature
VCC=18V CL=1nF
Fig. 10
Fall Time vs. Load Capacitance
100
3.2
8V
90
3.0
80
Minimum Input High
2.8
Max / Min Input (V)
Fall Time (ns)
70
10V
60
12V
50
40
18V
30
14V 16V
2.6
2.4
2.2
Maximum Input Low
2.0
20
1.8
10
0
0k
2k
4k
6k
8k
1.6
-60
10k
-40
-20
0
20
40
o
Load Capacitance (pF)
Temperature ( C)
5
60
80
100
IXDN404PI / N404SI / N404SI-16
IXDF404PI / F404SI / F404SI-16
Fig. 11
100
Supply Current vs. Load Capacitance
Vcc=18V
Fig. 12
100
IXDN404PI / N404SI / N404SI-16
Supply Current vs. Frequency
Vcc=18V
CL= 1800 pF
80
60
2 MHz
1 MHz
500 KHz
40
100 kHz
20
1000 pF
Supply Current (mA)
Supply Current (mA)
10
200 pF
1
0.1
50 kHz
10 kHz
0
0.1k
0.01
1.0k
1
10.0k
10
Fig. 13
100
100
1000
Frequency (kHz)
Load Capacitance (pF)
Supply Current vs. Load Capacitance
Vcc=12V
Fig. 14
100
Supply Current vs. Frequency
Vcc=12V
Supply Current (mA)
Supply Current (mA)
80
60
2 MHz
1 MHz
500 KHz
40
10
CL= 1800 pF
1
200 pF
1000 pF
0.1
20
100 kHz
0
0.1k
50 kHz
10 kHz
1.0k
0.01
1
10.0k
10
Fig. 15
100
100
1000
Frequency (kHz)
Load Capacitance (pF)
Supply Current vs. Load Capacitance
Vcc=8V
Fig. 16
100
Supply Current vs. Frequency
Vcc=8V
80
Supply Current (mA)
Supply Current (mA)
10
60
40
2 MHz
1 MHz
20
0
0.1k
500 KHz
CL= 1800 pF
1000 pF
1
200 pF
0.1
100 kHz
50 kHz
10 kHz
0.01
1.0k
1
10.0k
Load Capacitance (pF)
10
100
Frequency (kHz)
6
1000
IXDN404PI / N404SI / N404SI-16
IXDF404PI / F404SI / F404SI-16
50
Propagation Delay vs. Input Voltage
CL=1800pF VCC=15V
Fig. 18
Propagation Delay vs. Supply Voltage
CL=1800pF VIN=5V@1kHz
Fig. 17
IXDI404PI / I404SI / I404SI-16
60
50
Propagation Delay (ns)
Propagation Delay (ns)
40
tONDLY
30
tOFFDLY
20
10
tONDLY
40
30
tOFFDLY
20
10
0
0
8
10
12
14
16
0
18
2
4
Fig. 19
6
8
10
12
Input Voltage (V)
Supply Voltage (V)
Fig. 20
Propagation Delay Times vs. Temperature
CL=1800pF VCC=18V
Quiescent Supply Current vs. Temperature
VCC=18V VIN=5V@1kHz CL=1000pF
0.26
60
55
0.24
tONDLY
45
Time (ns)
Quiescent Vcc Input Current (mA)
50
40
tOFFDLY
35
30
25
20
15
0.22
0.20
0.18
0.16
0.14
10
-40
-20
0
20
40
60
80
100
-40
120
-20
40
60
80
Temperature ( C)
Fig. 22
P Channel Output Current Vs. Temperature
VCC=18V, CL=1000pF
N Channel Output Current Vs. Temperature
VCC=18V, CL=1000pF
6
N Channel Output Current (A)
6
P Channel Output Current (A)
20
o
Temperature (°C)
Fig. 21
0
5
4
3
5
4
3
-40
-20
0
20
40
60
80
100
-40
o
-20
0
20
40
o
Temperature ( C)
Temperature ( C)
7
60
80
100
IXDN404PI / N404SI / N404SI-16
IXDF404PI / F404SI / F404SI-16
Low-State Output Resistance
Vs. Supply Voltage
Fig. 24
Fig. 22
High State Output Resistance
vs. Supply Voltage
Fig. 23
IXDN404PI / N404SI / N404SI-16
5
Low-State Output Resistance (Ohms)
3.0
High State Output Resistance (Ohm)
4
3
2
1
2.0
1.0
0.0
0
10
8
15
20
8
25
10
15
25
Vcc vs. P Channel Output Current
VCC vs. N Channel Output Current
Fig. 26
0
8
-2
6
N Channel Output Current (A)
P Channel Output Current (A)
Fig. 25
20
Supply Voltage (V)
Supply Voltage (V)
-4
4
-6
2
-8
8
10
15
20
25
0
30
8
10
15
20
Vcc
Vcc
8
25
30
IXDN404PI / N404SI / N404SI-16
IXDF404PI / F404SI / F404SI-16
IXDI404PI / I404SI / I404SI-16
PIN CONFIGURATIONS
1
NC
2
IN A
3
GND
4
INB
NC
8
1
NC
OUT A
7
2
IN A
VS 6
3
GND
OUT B 5
4
INB
8 Lead PDIP (PI)
8 Pin SOIC (SI)
IXDN404
1 NC
NC 16
NC
8
1
NC
OUT A
7
2
IN A
VS 6
3
GND
OUT B 5
4
INB
8 Lead PDIP (PI)
8 Pin SOIC (SI)
IXDI404
1 NC
NC 16
NC
8
OUT A
7
VS 6
OUT B 5
8 Lead PDIP (PI)
8 Pin SOIC (SI)
IXDF404
1 NC
NC 16
2 IN A
OUT A 15
2 IN A
OUT A 15
2 IN A
OUT A 15
3 NC
OUT A 14
3 NC
OUT A 14
3 NC
OUT A 14
4 GND
VCC 13
4 GND
VCC 13
4 GND
VCC 13
5 GND
VCC 12
5 GND
VCC 12
5 GND
VCC 12
6 NC
OUT B 11
6 NC
OUT B 11
6 NC
OUT B 11
7 IN B
OUT B 10
7 IN B
OUT B 10
7 IN B
OUT B 10
8 NC
NC 9
16 Pin SOIC
IXDN404SI-16
8 NC
NC 9
16 Pin SOIC
IXDI404SI-16
8 NC
NC 9
16 Pin SOIC
IXDF404SI-16
Supply Bypassing, Grounding Practices And Output Lead inductance
GROUNDING
In order for the design to turn the load off properly, the IXDN404
must be able to drain this 2.5A of current into an adequate
grounding system. There are three paths for returning current
that need to be considered: Path #1 is between the IXDN404
and its load. Path #2 is between the IXDN404 and its power
supply. Path #3 is between the IXDN404 and whatever logic is
driving it. All three of these paths should be as low in resistance
and inductance as possible, and thus as short as practical. In
addition, every effort should be made to keep these three
ground paths distinctly separate. Otherwise, the returning
ground current from the load may develop a voltage that would
have a detrimental effect on the logic line driving the IXDN404.
When designing a circuit to drive a high speed MOSFET
utilizing the IXDN404/IXDI404/IXDF404, it is very important to
observe certain design criteria in order to optimize performance
of the driver. Particular attention needs to be paid to Supply
Bypassing, Grounding, and minimizing the Output Lead
Inductance.
Say, for example, we are using the IXDN404 to charge a 2500pF
capacitive load from 0 to 25 volts in 25ns.
Using the formula: I= ∆V C / ∆t, where ∆V=25V C=2500pF &
∆t=25ns, we can determine that to charge 2500pF to 25 volts
in 25ns will take a constant current of 2.5A. (In reality, the
charging current won’t be constant, and will peak somewhere
around 4A).
OUTPUT LEAD INDUCTANCE
Of equal importance to Supply Bypassing and Grounding are
issues related to the Output Lead Inductance. Every effort
should be made to keep the leads between the driver and its
load as short and wide as possible. If the driver must be placed
farther than 2” (5mm) from the load, then the output leads
should be treated as transmission lines. In this case, a twistedpair should be considered, and the return line of each twisted
pair should be placed as close as possible to the ground pin
SUPPLY BYPASSING
In order for our design to turn the load on properly, the IXDN404
must be able to draw this 2.5A of current from the power supply
in the 25ns. This means that there must be very low impedance
between the driver and the power supply. The most common
method of achieving this low impedance is to bypass the power
supply at the driver with a capacitance value that is a magnitude
larger than the load capacitance. Usually, this would be
achieved by placing two different types of bypassing capacitors,
with complementary impedance curves, very close to the driver
itself. (These capacitors should be carefully selected, low
inductance, low resistance, high-pulse current-service
capacitors). Lead lengths may radiate at high frequency due
to inductance, so care should be taken to keep the lengths of
the leads between these bypass capacitors and the IXDN404
to an absolute minimum.
of the driver, and connected directly to the ground terminal
of the load.
9
IXDN404PI / N404SI / N404SI-16
IXDF404PI / F404SI / F404SI-16
IXDN404PI / N404SI / N404SI-16
IXYS Corporation
3540 Bassett St; Santa Clara, CA 95054
Tel: 408-982-0700; Fax: 408-496-0670
e-mail: [email protected]
IXYS Semiconductor GmbH
Edisonstrasse15 ; D-68623; Lampertheim
Tel: +49-6206-503-0; Fax: +49-6206-503627
e-mail: [email protected]
Directed Energy, Inc.
An IXYS Company
2401 Research Blvd. Ste. 108, Ft. Collins, CO 80526
Tel: 970-493-1901; Fax: 970-493-1903
e-mail: [email protected]
10
Doc #9200-0234 R1
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