SN54F245, SN74F245 OCTAL BUS TRANSCEIVERS WITH 3-STATE OUTPUTS SDFS010A – MARCH 1987 – REVISED OCTOBER 1993 SN54F245 . . . J PACKAGE SN74F245 . . . DB, DW, OR N PACKAGE (TOP VIEW) 3-State Outputs Drive Bus Lines Directly Package Options Include Plastic Small-Outline (SOIC) and Shrink Small-Outline (SSOP) Packages, Ceramic Chip Carriers, and Plastic and Ceramic DIPs DIR A1 A2 A3 A4 A5 A6 A7 A8 GND description These octal bus transceivers are designed for asynchronous communication between data buses. The devices transmit data from the A bus to the B bus or from the B bus to the A bus depending upon the logic level at the direction-control (DIR) input. The output enable (OE) input can be used to disable the device so the buses are effectively isolated. 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 VCC OE B1 B2 B3 B4 B5 B6 B7 B8 SN54F245 . . . FK PACKAGE (TOP VIEW) A2 A1 DIR VCC The SN74F245 is available in TI’s shrink small-outline package (DB), which provides the same I/O pin count and functionality of standard small-outline packages in less than half the printed-circuit-board area. A3 A4 A5 A6 A7 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 B1 B2 B3 B4 B5 A8 GND B8 B7 B6 The SN54F245 is characterized for operation over the full military temperature range of – 55°C to 125°C. The SN74F245 is characterized for operation from 0°C to 70°C. OE • • FUNCTION TABLE INPUTS OPERATION OE DIR L L B data to A bus L H A data to B bus H X Isolation Copyright 1993, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 2–1 SN54F245, SN74F245 OCTAL BUS TRANSCEIVERS WITH 3-STATE OUTPUTS SDFS010A – MARCH 1987 – REVISED OCTOBER 1993 logic symbol† OE DIR A1 19 1 2 logic diagram (positive logic) DIR G3 1 3EN1[BA] 3EN2[AB] 19 18 1 B1 A1 OE 2 2 A2 A3 A4 A5 A6 A7 A8 3 17 4 16 5 15 6 14 7 13 8 12 9 11 B2 18 B3 B1 B4 B5 B6 B7 To Seven Other Channels B8 † This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. absolute maximum ratings over operating free-air temperature range (unless otherwise noted)‡ Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.5 V to 7 V Input voltage range, VI (except I/O ports) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 1.2 V to 7 V Input current range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 30 mA to 5 mA Voltage range applied to any output in the disabled or power-off state . . . . . . . . . . . . . . . . . . . – 0.5 V to 5.5 V Voltage range applied to any output in the high state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.5 V to VCC Current into any output in the low state: SN54F245 (A1 thru A8) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 mA SN54F245 (B1 thru B8) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 mA SN74F245 (A1 thru A8) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 mA SN74F245 (B1 thru B8) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA Operating free-air temperature range: SN54F245 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 55°C to 125°C SN74F245 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 65°C to 150°C ‡ Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: The input voltage ratings may be exceeded provided the input current ratings are observed. 2–2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN54F245, SN74F245 OCTAL BUS TRANSCEIVERS WITH 3-STATE OUTPUTS SDFS010A – MARCH 1987 – REVISED OCTOBER 1993 recommended operating conditions SN54F245 VCC VIH Supply voltage VIL IIK Low-level input voltage IOH High level output current High-level IOL Low level output current Low-level TA Operating free-air temperature High-level input voltage SN74F245 MIN NOM MAX MIN NOM MAX 4.5 5 5.5 4.5 5 5.5 2 2 UNIT V V 0.8 0.8 V – 18 – 18 mA A1 thru A8 –3 –3 B1 thru B8 – 12 – 15 A1 thru A8 20 24 B1 thru B8 48 64 Input clamp current – 55 125 0 70 mA mA °C electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VIK VCC = 4.5 V, A1 thru A8 VOH 5V VCC = 4 4.5 IIL‡ IOS§ II = – 18 mA IOH = – 1 mA IOH = – 3 mA IOH = – 12 mA 3.4 2.5 3.4 2.4 3.3 2.4 3.3 2 3.2 A1 thru A8 VCC = 4 4.5 5V IOL = 20 mA IOL = 24 mA 0.3 0.5 VCC = 4 4.5 5V IOL = 48 mA IOL = 64 mA 0.38 0.55 5V VCC = 5 5.5 VI = 5.5 V VI = 7 V VCC = 5 5.5 5V V, VI = 2 2.7 7V VCC = 5 5.5 5V V, VI = 0 0.5 5V VCC = 5 5.5 5V V, VO = 0 A and B DIR, OE A and B DIR, OE A1 thru A8 B1 thru B8 IOH = – 15 mA IOH = – 1 mA to – 3 mA 2 3.1 0.35 0.5 0.42 0.55 1 1 0.1 0.1 70 70 20 20 – 0.65 – 0.65 – 1.2 – 1.2 – 60 – 150 – 60 – 150 – 100 – 225 – 100 – 225 70 90 70 90 Outputs low 95 120 95 120 Outputs disabled 85 110 85 † All typical values are at VCC = 5 V, TA = 25°C. ‡ For I/O ports, the parameters IIH and IIL include the off-state output current. § Not more than one output should be shorted at a time, and the duration of the short circuit should not exceed one second. 110 VCC = 5.5 V POST OFFICE BOX 655303 V 2.7 Outputs high ICC UNIT V VCC = 4.75 V, DIR, OE – 1.2 2.5 Any output A and B SN74F245 TYP† MAX MIN – 1.2 VCC = 4 4.5 5V B1 thru B8 IIH‡ MIN B1 thru B8 VOL II SN54F245 TYP† MAX TEST CONDITIONS • DALLAS, TEXAS 75265 V mA µA mA mA mA 2–3 SN54F245, SN74F245 OCTAL BUS TRANSCEIVERS WITH 3-STATE OUTPUTS SDFS010A – MARCH 1987 – REVISED OCTOBER 1993 switching characteristics (see Note 2) PARAMETER FROM (INPUT) TO (OUTPUT) VCC = 5 V, CL = 50 pF, RL = 500 Ω, TA = 25°C VCC = 4.5 V to 5.5 V, CL = 50 pF, RL = 500 Ω, TA = MIN to MAX† ′F245 tPLH tPHL A or B B or A tPZH tPZL OE A or B tPHZ tPLZ OE A or B SN54F245 SN74F245 MIN TYP MAX MIN MAX MIN MAX 1.7 3.8 6 1.2 7.5 1.7 7 1.7 4.2 6 1.2 7.5 1.7 7 2.2 4.9 7 1.7 9 2.2 8 2.7 5.6 8 2.2 10 2.7 9 2.2 4.6 6.5 1.7 9 2.2 7.5 1.2 4.6 6.5 1.2 10 1.2 7.5 † For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions. NOTE 2: Load circuits and waveforms are shown in Section 1. 2–4 POST OFFICE BOX 655303 UNIT • DALLAS, TEXAS 75265 ns ns ns PACKAGE OPTION ADDENDUM www.ti.com 10-Jun-2014 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) 85511012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 85511012A SNJ54F 245FK 8551101RA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 8551101RA SNJ54F245J 8551101SA ACTIVE CFP W 20 1 TBD A42 N / A for Pkg Type -55 to 125 8551101SA SNJ54F245W JM38510/34803B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/ 34803B2A JM38510/34803BRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 34803BRA JM38510/34803BSA ACTIVE CFP W 20 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 34803BSA M38510/34803B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/ 34803B2A M38510/34803BRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 34803BRA M38510/34803BSA ACTIVE CFP W 20 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 34803BSA SN54F245J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 SN54F245J SN74F245DBLE OBSOLETE SSOP DB 20 TBD Call TI Call TI 0 to 70 SN74F245DBR ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 F245 SN74F245DW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 F245 SN74F245DWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 F245 SN74F245DWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 F245 SN74F245DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 F245 SN74F245DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 F245 Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 10-Jun-2014 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty SN74F245N ACTIVE PDIP N 20 Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 Device Marking (4/5) SN74F245N SN74F245N3 OBSOLETE PDIP N 20 TBD Call TI Call TI 0 to 70 SN74F245NE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74F245N SN74F245NSR ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74F245 SNJ54F245FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 85511012A SNJ54F 245FK SNJ54F245J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 8551101RA SNJ54F245J SNJ54F245W ACTIVE CFP W 20 1 TBD A42 N / A for Pkg Type -55 to 125 8551101SA SNJ54F245W (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com 10-Jun-2014 (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN54F245, SN74F245 : • Catalog: SN74F245 • Military: SN54F245 NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product • Military - QML certified for Military and Defense Applications Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2015 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74F245DBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1 SN74F245DWR SOIC DW 20 2000 330.0 24.4 10.8 13.3 2.7 12.0 24.0 Q1 SN74F245DWR SOIC DW 20 2000 330.0 24.4 10.8 13.3 2.7 12.0 24.0 Q1 SN74F245NSR SO NS 20 2000 330.0 24.4 9.0 13.0 2.4 4.0 24.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2015 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74F245DBR SSOP DB 20 2000 367.0 367.0 38.0 SN74F245DWR SOIC DW 20 2000 367.0 367.0 45.0 SN74F245DWR SOIC DW 20 2000 367.0 367.0 45.0 SN74F245NSR SO NS 20 2000 367.0 367.0 45.0 Pack Materials-Page 2 PACKAGE OUTLINE DW0020A SOIC - 2.65 mm max height SCALE 1.200 SOIC C 10.63 TYP 9.97 SEATING PLANE PIN 1 ID AREA A 0.1 C 20 1 13.0 12.6 NOTE 3 18X 1.27 2X 11.43 10 11 B 7.6 7.4 NOTE 4 20X 0.51 0.31 0.25 C A B 2.65 MAX 0.33 TYP 0.10 SEE DETAIL A 0.25 GAGE PLANE 0 -8 0.3 0.1 1.27 0.40 DETAIL A TYPICAL 4220724/A 05/2016 NOTES: 1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.43 mm per side. 5. Reference JEDEC registration MS-013. www.ti.com EXAMPLE BOARD LAYOUT DW0020A SOIC - 2.65 mm max height SOIC 20X (2) SYMM 1 20 20X (0.6) 18X (1.27) SYMM (R0.05) TYP 10 11 (9.3) LAND PATTERN EXAMPLE SCALE:6X SOLDER MASK OPENING METAL SOLDER MASK OPENING METAL UNDER SOLDER MASK 0.07 MAX ALL AROUND 0.07 MIN ALL AROUND SOLDER MASK DEFINED NON SOLDER MASK DEFINED SOLDER MASK DETAILS 4220724/A 05/2016 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com EXAMPLE STENCIL DESIGN DW0020A SOIC - 2.65 mm max height SOIC 20X (2) SYMM 1 20 20X (0.6) 18X (1.27) SYMM 11 10 (9.3) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:6X 4220724/A 05/2016 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. 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