Samsung K4S280432F-UC75 128mb f-die sdram specification 54 tsop-ii with pb-free (rohs compliant) Datasheet

CMOS SDRAM
SDRAM 128Mb F-die (x4, x8, x16)
128Mb F-die SDRAM Specification
54 TSOP-II with Pb-Free
(RoHS compliant)
Revision 1.2
August 2004
* Samsung Electronics reserves the right to change products or specification without notice.
Rev. 1.2 August 2004
SDRAM 128Mb F-die (x4, x8, x16)
CMOS SDRAM
Revision History
Revision 1.0 (January, 2004)
- First release.
Revision 1.1 (May, 2004)
• Added Note 5. sentense of tRDL parameter.
Revision 1.2 (August, 2004)
• Corrected typo.
Rev. 1.2 August 2004
CMOS SDRAM
SDRAM 128Mb F-die (x4, x8, x16)
8M x 4Bit x 4 Banks / 4M x 8Bit x 4 Banks / 2M x 16Bit x 4 Banks SDRAM
FEATURES
• JEDEC standard 3.3V power supply
• LVTTL compatible with multiplexed address
• Four banks operation
• MRS cycle with address key programs
-. CAS latency (2 & 3)
-. Burst length (1, 2, 4, 8 & Full page)
-. Burst type (Sequential & Interleave)
• All inputs are sampled at the positive going edge of the system clock.
• Burst read single-bit write operation
• DQM (x4,x8) & L(U)DQM (x16) for masking
• Auto & self refresh
• 64ms refresh period (4K Cycle)
• 54 TSOP(II) Pb-free Package
• RoHS compliant
GENERAL DESCRIPTION
The K4S280432F / K4S280832F / K4S281632F is 134,217,728 bits synchronous high data rate Dynamic RAM organized as 4 x
8,388,608 words by 4 bits / 4 x 4,194,304 words by 8 bits / 4 x 2,097,152 words by 16 bits, fabricated with SAMSUNG′s high performance CMOS technology. Synchronous design allows precise cycle control with the use of system clock I/O transactions are possible
on every clock cycle. Range of operating frequencies, programmable burst length and programmable latencies allow the same device to
be useful for a variety of high bandwidth, high performance memory system applications.
Ordering Information
Part No.
Orgainization
Max Freq.
Interface
Package
K4S280432F-UC(L)75
32M x 4
133MHz
LVTTL
54pin TSOP(II)
K4S280832F-UC(L)75
16M x 8
133MHz
LVTTL
54pin TSOP(II)
K4S281632F-UC(L)60/75
8M x 16
166MHz
LVTTL
54pin TSOP(II)
Organization
Row Address
Column Address
32Mx4
A0~A11
A0-A9, A11
16Mx8
A0~A11
A0-A9
8Mx16
A0~A11
A0-A8
Row & Column address configuration
Rev. 1.2 August 2004
CMOS SDRAM
SDRAM 128Mb F-die (x4, x8, x16)
Package Physical Dimension
0~8°C
#1
#27
10.16
0.400
0.125+0.075
-0.035
0.005+0.003
-0.001
22.62
MAX
0.891
22.22
0.875
0.10
MAX
0.004
(
0.71
)
0.028
+0.10
0.30 -0.05
0.012 +0.004
-0.002
± 0.10
0.21
0.008
± 0.004
± 0.05
± 0.002
0.80
0.0315
1.00
0.039
± 0.10
± 0.004
( 0.50 )
0.020
#28
11.76±0.20
0.463±0.008
#54
0.45~0.75
0.018~0.030
0.25
TYP
0.010
1.20
MAX
0.047
0.05
MIN
0.002
54Pin TSOP Package Dimension
Rev. 1.2 August 2004
CMOS SDRAM
SDRAM 128Mb F-die (x4, x8, x16)
FUNCTIONAL BLOCK DIAGRAM
I/O Control
Data Input Register
LWE
LDQM
Bank Select
8M x 4 / 4M x 8 / 2M x 16
8M x 4 / 4M x 8 / 2M x 16
Output Buffer
8M x 4 / 4M x 8 / 2M x 16
Sense AMP
Row Decoder
ADD
Row Buffer
Refresh Counter
DQi
Column Decoder
Col. Buffer
LCBR
LRAS
Address Register
CLK
8M x 4 / 4M x 8 / 2M x 16
Latency & Burst Length
LCKE
Programming Register
LRAS
LCBR
LWE
LCAS
LDQM
LWCBR
Timing Register
CLK
CKE
CS
RAS
CAS
WE
L(U)DQM
* Samsung Electronics reserves the right to change products or specification without notice.
Rev. 1.2 August 2004
CMOS SDRAM
SDRAM 128Mb F-die (x4, x8, x16)
PIN CONFIGURATION (Top view)
x8
x16
x4
VDD
VDD
VDD
DQ0
DQ0
N.C
VDDQ
VDDQ
VDDQ
DQ1
N.C
N.C
DQ2
DQ1
DQ0
VSSQ
VSSQ
VSSQ
DQ3
N.C
N.C
DQ4
DQ2
N.C
VDDQ
VDDQ
VDDQ
DQ5
N.C
N.C
DQ6
DQ3
DQ1
VSSQ
VSSQ
VSSQ
DQ7
N.C
N.C
VDD
VDD
VDD
LDQM
N.C
N.C
WE
WE
WE
CAS
CAS
CAS
RAS
RAS
RAS
CS
CS
CS
BA0
BA0
BA0
BA1
BA1
BA1
A10/AP A10/AP A10/AP
A0
A0
A0
A1
A1
A1
A2
A2
A2
A3
A3
A3
VDD
VDD
VDD
x4
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
VSS
N.C
VSSQ
N.C
DQ3
VDDQ
N.C
N.C
VSSQ
N.C
DQ2
VDDQ
N.C
VSS
N.C/RFU
DQM
CLK
CKE
N.C
A11
A9
A8
A7
A6
A5
A4
VSS
x8
VSS
DQ7
VSSQ
N.C
DQ6
VDDQ
N.C
DQ5
VSSQ
N.C
DQ4
VDDQ
N.C
VSS
N.C/RFU
DQM
CLK
CKE
N.C
A11
A9
A8
A7
A6
A5
A4
VSS
x16
VSS
DQ15
VSSQ
DQ14
DQ13
VDDQ
DQ12
DQ11
VSSQ
DQ10
DQ9
VDDQ
DQ8
VSS
N.C/RFU
UDQM
CLK
CKE
N.C
A11
A9
A8
A7
A6
A5
A4
VSS
54Pin TSOP
(400mil x 875mil)
(0.8 mm Pin pitch)
PIN FUNCTION DESCRIPTION
Pin
Name
Input Function
CLK
System clock
Active on the positive going edge to sample all inputs.
CS
Chip select
Disables or enables device operation by masking or enabling all inputs except
CLK, CKE and DQM
CKE
Clock enable
Masks system clock to freeze operation from the next clock cycle.
CKE should be enabled at least one cycle prior to new command.
Disable input buffers for power down in standby.
A0 ~ A11
Address
Row/column addresses are multiplexed on the same pins.
Row address : RA0 ~ RA11,
Column address : (x4 : CA0 ~ CA9,CA11), (x8 : CA0 ~ CA9), (x16 : CA0 ~ CA8)
BA0 ~ BA1
Bank select address
Selects bank to be activated during row address latch time.
Selects bank for read/write during column address latch time.
RAS
Row address strobe
Latches row addresses on the positive going edge of the CLK with RAS low.
Enables row access & precharge.
CAS
Column address strobe
Latches column addresses on the positive going edge of the CLK with CAS low.
Enables column access.
WE
Write enable
Enables write operation and row precharge.
Latches data in starting from CAS, WE active.
DQM
Data input/output mask
Makes data output Hi-Z, tSHZ after the clock and masks the output.
Blocks data input when DQM active.
DQ0 ~ N
Data input/output
Data inputs/outputs are multiplexed on the same pins.
(x4 : DQ0 ~ 3), (x8 : DQ0 ~ 7), (x16 : DQ0 ~ 15)
VDD/VSS
Power supply/ground
Power and ground for the input buffers and the core logic.
VDDQ/VSSQ
Data output power/ground
Isolated power supply and ground for the output buffers to provide improved noise
immunity.
N.C/RFU
No connection
/reserved for future use
This pin is recommended to be left No Connection on the device.
Rev. 1.2 August 2004
CMOS SDRAM
SDRAM 128Mb F-die (x4, x8, x16)
ABSOLUTE MAXIMUM RATINGS
Symbol
Value
Unit
Voltage on any pin relative to Vss
Parameter
VIN, VOUT
-1.0 ~ 4.6
V
Voltage on VDD supply relative to Vss
VDD, VDDQ
-1.0 ~ 4.6
V
TSTG
-55 ~ +150
°C
Storage temperature
Power dissipation
PD
1
W
Short circuit current
IOS
50
mA
Note : Permanent device damage may occur if "ABSOLUTE MAXIMUM RATINGS" are exceeded.
Functional operation should be restricted to recommended operating condition.
Exposure to higher than recommended voltage for extended periods of time could affect device reliability.
DC OPERATING CONDITIONS
Recommended operating conditions (Voltage referenced to VSS = 0V, TA = 0 to 70°C)
Parameter
Supply voltage
Symbol
Min
Typ
Max
Unit
VDD, VDDQ
3.0
3.3
3.6
V
Note
Input logic high voltage
VIH
2.0
3.0
VDD+0.3
V
Input logic low voltage
VIL
-0.3
0
0.8
V
2
Output logic high voltage
VOH
2.4
-
-
V
IOH = -2mA
Output logic low voltage
VOL
-
-
0.4
V
IOL = 2mA
ILI
-10
-
10
uA
3
Input leakage current
1
Notes : 1. VIH (max) = 5.6V AC. The overshoot voltage duration is ≤ 3ns.
2. VIL (min) = -2.0V AC. The undershoot voltage duration is ≤ 3ns.
3. Any input 0V ≤ VIN ≤ VDDQ.
Input leakage currents include Hi-Z output leakage for all bi-directional buffers with Tri-State outputs.
CAPACITANCE
(VDD = 3.3V, TA = 23°C, f = 1MHz, VREF =1.4V ± 200 mV)
Pin
Clock
RAS, CAS, WE, CS, CKE, DQM
Symbol
Min
Max
Unit
CCLK
2.5
3.5
pF
CIN
2.5
3.8
pF
Address
CADD
2.5
3.8
pF
(x4 : DQ0 ~ DQ3), (x8 : DQ0 ~ DQ7), (x16 : DQ0 ~ DQ15)
COUT
4.0
6.0
pF
Note
Rev. 1.2 August 2004
CMOS SDRAM
SDRAM 128Mb F-die (x4, x8, x16)
DC CHARACTERISTICS (x4, x8)
(Recommended operating condition unless otherwise noted, TA = 0 to 70°C)
Parameter
Operating current
(One bank active)
Precharge standby current in
power-down mode
Precharge standby current in
non power-down mode
Active standby current in
power-down mode
Active standby current in
non power-down mode
(One bank active)
Symbol
ICC1
ICC2P
-75
Burst length = 1
tRC ≥ tRC(min)
IO = 0 mA
90
CKE ≤ VIL(max), tCC = 10ns
2
ICC2PS CKE & CLK ≤ VIL(max), tCC = ∞
ICC2N
ICC2NS
ICC3P
2
CKE ≥ VIH(min), CS ≥ VIH(min), tCC = 10ns
Input signals are changed one time during 20ns
20
CKE ≥ VIH(min), CLK ≤ VIL(max), tCC = ∞
Input signals are stable
10
CKE ≤ VIL(max), tCC = 10ns
5
ICC3PS CKE & CLK ≤ VIL(max), tCC = ∞
ICC3N
ICC3NS
Note
mA
1
mA
mA
5
mA
30
mA
CKE ≥ VIH(min), CLK ≤ VIL(max), tCC = ∞
Input signals are stable
25
mA
110
mA
1
2
ICC4
IO = 0 mA
Page burst
Refresh current
ICC5
tRC ≥ tRC(min)
ICC6
Unit
CKE ≥ VIH(min), CS ≥ VIH(min), tCC = 10ns
Input signals are changed one time during 20ns
Operating current
(Burst mode)
Self refresh current
Version
Test Condition
CKE ≤ 0.2V
200
mA
C
2
mA
3
L
800
uA
4
Notes : 1. Measured with outputs open.
2. Refresh period is 64ms.
3. K4S2804(08)32F-UC
4. K4S2804(08)32F-UL
5. Unless otherwise noted, input swing IeveI is CMOS(VIH /VIL=VDDQ/VSSQ)
Rev. 1.2 August 2004
CMOS SDRAM
SDRAM 128Mb F-die (x4, x8, x16)
DC CHARACTERISTICS (x16)
(Recommended operating condition unless otherwise noted, TA = 0 to 70°C)
Parameter
Operating current
(One bank active)
Precharge standby current in
power-down mode
Precharge standby current in
non power-down mode
Active standby current in
power-down mode
Active standby current in
non power-down mode
(One bank active)
Symbol
ICC1
ICC2P
Burst length = 1
tRC ≥ tRC(min)
IO = 0 mA
-60
-75
130
100
CKE ≤ VIL(max), tCC = 10ns
2
ICC2PS CKE & CLK ≤ VIL(max), tCC = ∞
ICC2N
ICC2NS
ICC3P
20
CKE ≥ VIH(min), CLK ≤ VIL(max), tCC = ∞
Input signals are stable
10
CKE ≤ VIL(max), tCC = 10ns
5
ICC3NS
30
CKE ≥ VIH(min), CLK ≤ VIL(max), tCC = ∞
Input signals are stable
25
IO = 0 mA
Page burst
Refresh current
ICC5
tRC ≥ tRC(min)
ICC6
CKE ≤ 0.2V
mA
1
mA
5
CKE ≥ VIH(min), CS ≥ VIH(min), tCC = 10ns
Input signals are changed one time during 20ns
ICC4
Note
mA
ICC3PS CKE & CLK ≤ VIL(max), tCC = ∞
ICC3N
Unit
mA
2
CKE ≥ VIH(min), CS ≥ VIH(min), tCC = 10ns
Input signals are changed one time during 20ns
Operating current
(Burst mode)
Self refresh current
Version
Test Condition
150
220
mA
mA
140
mA
1
200
mA
2
C
2
mA
3
L
800
uA
4
Notes : 1. Measured with outputs open.
2. Refresh period is 64ms.
3. K4S281632F-UC
4. K4S281632F-UL
5. Unless otherwise noted, input swing IeveI is CMOS(VIH /VIL=VDDQ/VSSQ)
Rev. 1.2 August 2004
CMOS SDRAM
SDRAM 128Mb F-die (x4, x8, x16)
AC OPERATING TEST CONDITIONS (VDD = 3.3V ± 0.3V, TA = 0 to 70°C)
Parameter
Value
Input levels (Vih/Vil)
Input timing measurement reference level
Input rise and fall time
Output timing measurement reference level
Output load condition
Unit
2.4/0.4
V
1.4
V
tr/tf = 1/1
ns
1.4
V
See Fig. 2
3.3V
Vtt = 1.4V
1200Ω
50Ω
VOH (DC) = 2.4V, IOH = -2mA
VOL (DC) = 0.4V, IOL = 2mA
Output
870Ω
Output
Z0 = 50Ω
50pF
50pF
(Fig. 1) DC output load circuit
(Fig. 2) AC output load circuit
OPERATING AC PARAMETER
(AC operating conditions unless otherwise noted)
Parameter
Symbol
Version
- 60 (x16 only)
- 75
Unit
Note
Row active to row active delay
tRRD(min)
12
15
ns
1
RAS to CAS delay
tRCD(min)
18
20
ns
1
tRP(min)
18
20
ns
1
tRAS(min)
42
45
ns
1
Row precharge time
Row active time
tRAS(max)
100
Row cycle time
tRC(min)
ns
1
Last data in to row precharge
tRDL(min)
2
CLK
2,5
Last data in to Active delay
tDAL(min)
2 CLK + tRP
-
5
Last data in to new col. address delay
tCDL(min)
1
CLK
2
Last data in to burst stop
tBDL(min)
1
CLK
2
1
CLK
3
ea
4
Col. address to col. address delay
Number of valid output data
60
us
tCCD(min)
CAS latency=3
CAS latency=2
65
2
-
1
Notes : 1. The minimum number of clock cycles is determined by dividing the minimum time required with clock cycle time
and then rounding off to the next higher integer.
2. Minimum delay is required to complete write.
3. All parts allow every cycle column address change.
4. In case of row precharge interrupt, auto precharge and read burst stop.
5. In 100MHz and below 100MHz operating conditions, tRDL=1CLK and tDAL=1CLK + 20ns is also supported.
SAMSUNG recommends tRDL=2CLK and tDAL=2CLK + tRP.
Rev. 1.2 August 2004
CMOS SDRAM
SDRAM 128Mb F-die (x4, x8, x16)
AC CHARACTERISTICS (AC operating conditions unless otherwise noted)
Parameter
CLK cycle
time
Symbol
CAS latency=3
tCC
CAS latency=2
CAS latency=3
CLK to valid
output delay
CAS latency=2
Output data
hold time
CAS latency=2
- 60 (x16 only)
Min
6
-
tSAC
CAS latency=3
tOH
- 75
Max
Min
7.5
1000
10
Max
1000
5
5.4
-
6
2.5
3
-
3
Unit
Note
ns
1
ns
1,2
ns
2
CLK high pulse width
tCH
2.5
2.5
ns
3
CLK low pulse width
tCL
2.5
2.5
ns
3
Input setup time
tSS
1.5
1.5
ns
3
Input hold time
tSH
1
0.8
ns
3
CLK to output in Low-Z
tSLZ
1
1
ns
2
CLK to output
in Hi-Z
CAS latency=3
tSHZ
CAS latency=2
5
5.4
-
6
ns
Notes : 1. Parameters depend on programmed CAS latency.
2. If clock rising time is longer than 1ns, (tr/2-0.5)ns should be added to the parameter.
3. Assumed input rise and fall time (tr & tf) = 1ns.
If tr & tf is longer than 1ns, transient time compensation should be considered,
i.e., [(tr + tf)/2-1]ns should be added to the parameter.
DQ BUFFER OUTPUT DRIVE CHARACTERISTICS
Parameter
Symbol
Condition
Min
Output rise time
trh
Measure in linear
region : 1.2V ~ 1.8V
Output fall time
tfh
Output rise time
Output fall time
Typ
Max
Unit
Notes
1.37
4.37
Volts/ns
3
Measure in linear
region : 1.2V ~ 1.8V
1.30
3.8
Volts/ns
3
trh
Measure in linear
region : 1.2V ~ 1.8V
2.8
3.9
5.6
Volts/ns
1,2
tfh
Measure in linear
region : 1.2V ~ 1.8V
2.0
2.9
5.0
Volts/ns
1,2
Notes : 1. Rise time specification based on 0pF + 50 Ω to VSS, use these values to design to.
2. Fall time specification based on 0pF + 50 Ω to VDD, use these values to design to.
3. Measured into 50pF only, use these values to characterize to.
4. All measurements done with respect to VSS.
Rev. 1.2 August 2004
CMOS SDRAM
SDRAM 128Mb F-die (x4, x8, x16)
IBIS SPECIFICATION
66MHz and 100MHz/133MHz Pull-up
0
IOH Characteristics (Pull-up)
(V)
3.45
3.3
3.0
2.6
2.4
2.0
1.8
1.65
1.5
1.4
1.0
0.0
0.0
-21.1
-34.1
-58.7
-67.3
-73.0
-77.9
-80.8
-88.6
-93.0
100MHz
133MHz
Max
I (mA)
-2.4
-27.3
-74.1
-129.2
-153.3
-197.0
-226.2
-248.0
-269.7
-284.3
-344.5
-502.4
0.5
1
1.5
2
2.5
3
3.5
0
66MHz
Min
-100
I (mA)
-200
-0.7
-7.5
-13.3
-27.5
-35.5
-41.1
-47.9
-52.4
-72.5
-93.0
mA
Voltage
100MHz
133MHz
Min
I (mA)
-300
-400
-500
-600
Voltage
IOH Min (100MHz/133MHz)
IOH Min (66MHz)
IOH Max (66 and 100MHz/133MHz)
66MHz and 100MHz/133MHz Pull-down
IOL Characteristics (Pull-down)
(V)
0.0
0.4
0.65
0.85
1.0
1.4
1.5
1.65
1.8
1.95
3.0
3.45
100MHz
133MHz
Min
I (mA)
0.0
27.5
41.8
51.6
58.0
70.7
72.9
75.4
77.0
77.6
80.3
81.4
100MHz
133MHz
Max
I (mA)
0.0
70.2
107.5
133.8
151.2
187.7
194.4
202.5
208.6
212.0
219.6
222.6
250
66MHz
Min
I (mA)
0.0
17.7
26.9
33.3
37.6
46.6
48.0
49.5
50.7
51.5
54.2
54.9
200
150
mA
Voltage
100
50
0
0
0.5
1
1.5
2
2.5
3
3.5
Voltage
IOL Min (100MHz/133MHz)
IOL Min (66MHz)
IOL Max (100MHz/133MHz)
Rev. 1.2 August 2004
CMOS SDRAM
SDRAM 128Mb F-die (x4, x8, x16)
Minimum VDD clamp current
(Referenced to VDD)
VDD Clamp @ CLK, CKE, CS, DQM & DQ
I (mA)
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.23
1.34
3.02
5.06
7.35
9.83
12.48
15.30
18.31
20
15
mA
VDD (V)
0.0
0.2
0.4
0.6
0.7
0.8
0.9
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
2.6
10
5
0
0
1
2
3
Voltage
I (mA)
Minimum VSS clamp current
VSS Clamp @ CLK, CKE, CS, DQM & DQ
I (mA)
-57.23
-45.77
-38.26
-31.22
-24.58
-18.37
-12.56
-7.57
-3.37
-1.75
-0.58
-0.05
0.0
0.0
0.0
0.0
-3
-2
-1
0
0
-10
-20
mA
VSS (V)
-2.6
-2.4
-2.2
-2.0
-1.8
-1.6
-1.4
-1.2
-1.0
-0.9
-0.8
-0.7
-0.6
-0.4
-0.2
0.0
-30
-40
-50
-60
Voltage
I (mA)
Rev. 1.2 August 2004
CMOS SDRAM
SDRAM 128Mb F-die (x4, x8, x16)
SIMPLIFIED TRUTH TABLE
Command
Register
CKEn-1
Mode register set
Auto refresh
Refresh
Entry
Self
refresh
(V=Valid, X=Don′t care, H=Logic high, L=Logic low)
H
H
CKEn
CS
RAS
CAS
WE
DQM
X
L
L
L
L
X
OP code
L
L
L
H
X
X
X
X
H
L
L
H
H
H
H
X
X
X
X
L
L
H
H
X
V
H
X
L
H
L
H
X
V
H
X
L
H
L
L
X
V
H
X
L
H
H
L
X
H
X
L
L
H
L
X
Entry
H
L
H
X
X
X
L
V
V
V
Exit
L
H
X
X
X
X
Entry
H
L
Exit
L
H
L
H
Bank active & row addr.
H
Read &
column address
Write &
column address
Exit
Auto precharge disable
Auto precharge enable
Auto precharge disable
Auto precharge enable
Burst stop
Precharge
Bank selection
All banks
Clock suspend or
active power down
BA0,1
Precharge power down mode
DQM
H
No operation command
H
H
X
X
X
L
H
H
H
H
X
X
X
V
V
V
L
X
X
H
X
X
X
L
H
H
H
X
A10/AP
A0 ~ A9,
A11,
Note
1,2
3
3
3
3
Row address
L
Column
address
H
L
Column
address
H
X
V
L
X
H
4
4,5
4
4,5
6
X
X
X
X
X
X
V
X
X
X
7
Notes : 1. OP Code : Operand code
A0 ~ A11 & BA0 ~ BA1 : Program keys. (@ MRS)
2. MRS can be issued only at all banks precharge state.
A new command can be issued after 2 CLK cycles of MRS.
3. Auto refresh functions are as same as CBR refresh of DRAM.
The automatical precharge without row precharge command is meant by "Auto".
Auto/self refresh can be issued only at all banks precharge state.
4. BA0 ~ BA1 : Bank select addresses.
If both BA0 and BA1 are "Low" at read, write, row active and precharge, bank A is selected.
If BA0 is "High" and BA1 is "Low" at read, write, row active and precharge, bank B is selected.
If BA0 is "Low" and BA1 is "High" at read, write, row active and precharge, bank C is selected.
If both BA0 and BA1 are "High" at read, write, row active and precharge, bank D is selected.
If A10/AP is "High" at row precharge, BA0 and BA1 is ignored and all banks are selected.
5. During burst read or write with auto precharge, new read/write command can not be issued.
Another bank read/write command can be issued after the end of burst.
New row active of the associated bank can be issued at tRP after the end of burst.
6. Burst stop command is valid at every burst length.
7. DQM sampled at positive going edge of a CLK and masks the data-in at the very CLK (Write DQM latency is 0),
but makes Hi-Z state the data-out of 2 CLK cycles after. (Read DQM latency is 2)
Rev. 1.2 August 2004