Samsung K4T1G164QE Consumer memory Datasheet

Apr. 2010
Consumer Memory
Product Guide
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SPECIFICATIONS WITHOUT NOTICE.
Products and specifications discussed herein are for reference purposes only. All information discussed
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ⓒ 2010 Samsung Electronics Co., Ltd. All rights reserved.
-1-
Apr. 2010
Product Guide
Consumer Memory
1. CONSUMER MEMORY ORDERING INFORMATION
1
2
3
4
5
6
7
8
9
10
11
K 4 X X X X X X X X - X X X X
Speed
SAMSUNG Memory
Temperature & Power
DRAM
Package Type
Product
Revision
Density & Refresh
Interface (VDD, VDDQ)
Organization
1. SAMSUNG Memory : K
Bank
7. Interface ( VDD, VDDQ)
2. DRAM : 4
3. Product
S
H
T
B
D
J
: SDRAM
: DDR SDRAM
: DDR2 SDRAM
: DDR3 SDRAM
: GDDR
: GDDR3
64 : 64Mb, 4K/64ms
28 : 128Mb, 4K/64ms
56 : 256Mb, 8K/64ms
51 : 512Mb, 8K/64ms
2G : 2Gb, 8K/64ms
: LVTTL (3.3V, 3.3V)
8
: SSTL_2 (2.5V, 2.5V)
Q
: SSTL_18 (1.8V, 1.8V)
6
: SSTL_15 (1.5V, 1.5V)
K
: POD_18 (1.8V, 1.8V)
8. Revision
4. Density & Refresh
1G : 1Gb, 8K/64ms
2
M
: 1st Gen.
H
: 9th Gen.
A
B
: 2nd Gen.
I
: 10th Gen.
: 3rd Gen.
J
: 11th Gen.
C
: 4th Gen.
K
: 12th Gen.
D
: 5th Gen.
L
: 13th Gen.
E
: 6th Gen.
N
: 14th Gen.
F
: 7th Gen.
O
: 15th Gen.
G
: 8th Gen.
S
: 19th Gen.
9. Package Type
10 : 1Gb, 8K/32ms
TSOPII (Lead-free)
100TQFP(Lead-free) only for 128Mb GDDR
U
:
Z
: FBGA (Lead-free)
5. Organization
V
: 144FBGA (Lead-free) only for 128Mb GDDR
04 : x4
L
: TSOPII (Lead-free & Halogen-free)
H
: FBGA (Lead-free & Halogen-free)
F
: FBGA(Lead-free & Halogen-free) for 64Mb DDR, 128Mb GDDR
M
: FBGA DDP (Lead-free & Halogen-free)
B
: FBGA FLIP-CHIP (Lead-free & Halogen-free)
08 : x8
16 : x16
32 : x32
31 : x32 (2CS)
10. Temperature & Power
C
: Commercial Temp. & Normal Power
: 2 Banks
L
: Commercial Temp. & Low Power
3
: 4 Banks
I
: Industrial Temp. & Normal Power
4
: 8 Banks
6. Bank
2
-2-
P
: Industrial Temp. & Low Power
D
: Industrial Temp. & Super Low Power
Q
: Commercial Temp. DDR3+ (Gapless, BL4)
Apr. 2010
Product Guide
1
2
3
Consumer Memory
4
5
6
7
8
9
10
11
K 4 X X X X X X X X - X X X X
Speed
SAMSUNG Memory
Temperature & Power
DRAM
Package Type
Product
Revision
Density & Refresh
Interface (VDD, VDDQ)
Organization
Bank
11. Speed
75 : 7.5ns, PC133 (133MHz CL=3)
60 : 6.0ns (166MHz CL=3)
50 : 5.0ns (200MHz CL=3)
40 : 4.0ns (250MHz CL=3)
B0 : DDR266 (133MHz @ CL=2.5, tRCD=3, tRP=3)
B3 : DDR333 (166MHz @ CL=2.5, tRCD=3, tRP=3)
CC : DDR400 (200MHz @ CL=3, tRCD=3, tRP=3)
E6 : DDR2-667 (333MHz @ CL=5, tRCD=5, tRP=5)
E7 : DDR2-800 (400MHz @ CL=5, tRCD=5, tRP=5)
F7 : DDR2/3-800 (400MHz @ CL=6, tRCD=6, tRP=6)
F8 : DDR2/3-1066 (533MHz @ CL=7, tRCD=7, tRP=7)
H9 : DDR3-1333 (667MHz @ CL=9, tRCD=9, tRP=9)
K0 : DDR3-1600 (800MHz @ CL=11, tRCD=11, tRP=11)
7A : GDDR3-2.6Gbps (0.77ns)
08 : GDDR3-2.4Gbps (0.8ns)
1A : GDDR3-2.0Gbps (1.0ns)
12 : GDDR3-1.6Gbps (1.25ns)
14 : GDDR3-1.4Gbps (1.4ns)
-3-
Apr. 2010
Product Guide
Consumer Memory
2. Commercial Temperature Consumer DRAM Component Product Guide
2.1 SDRAM
Density
Bank
64Mb N-die
4Banks
128Mb K-die
4Banks
128Mb O-die
4Banks
256Mb J-die
256Mb N-die
Part Number
4Banks
4Banks
Package & Power,
Temp. (-C/-L) & Speed
Org.
K4S640832N
LC(L)75
8M x 8
K4S641632N
LC(L)50/C(L)60/C(L)75
4M x 16
K4S280832K
U*1C(L)75
16M x 8
K4S281632K
UC(L)50/C(L)60/C(L)75
8M x 16
K4S280832O
LC(L)75
16M x 8
K4S281632O
LC(L)50/C(L)60/C(L)75
8M x 16
K4S560432J
U*1C(L)75
64M x 4
K4S560832J
UC(L)75
32M x 8
K4S561632J
UC(L)60/C(L)75
16M x 16
K4S560432N
LC(L)75
64M x 4
K4S560832N
LC(L)75
32M x 8
K4S561632N
LC(L)60/C(L)75
16M x 16
Interface
Refresh
Power (V)
Package
Avail.
LVTTL
4K/64ms
3.3±0.3V
54pin TSOP(II)
Now
LVTTL
4K/64ms
3.3±0.3V
54pin TSOP(II)*1
Now
LVTTL
4K/64ms
3.3±0.3V
54pin TSOP(II)
3Q’10
LVTTL
8K/64ms
3.3±0.3V
54pin TSOP(II)*1
Now
LVTTL
8K/64ms
3.3±0.3V
54pin TSOP(II)
Now
Package
Avail.
NOTE : 1. 128Mb K-die SDR and 256Mb J-die SDR DRAMs support Lead-free & Halogen-free package with Lead-free package code(-U)
2.2 DDR SDRAM
Density
Bank
Part Number
64Mb N-die
4Banks
K4H641638N
Package & Power,
Temp. (-C/-L) & Speed
LC(L)CC
FC(L)CC
Org.
Interface
Refresh
Power (V)
4M x 16
SSTL_2
4K/64m
2.5±0.2V
66pinTSOPII
60ball FBGA
Now
64Mb Q-die
4Banks
K4H641638Q
LC(L)CC
4M x 16
SSTL_2
4K/64m
2.5±0.2V
66pinTSOPII
2Q’10
128Mb L-die
4Banks
K4H281638L
LC(L)/C(L)CC
8M x 16
SSTL_2
4K/64m
2.5±0.2V*1
66pinTSOPII
Now
128Mb O-die
4Banks
K4H281638O
LC(L)CC/C(L)B3
8M x 16
SSTL_2
4K/64m
2.5±0.2V*1
66pinTSOPII
2Q’10
K4H560438J
LC(L)B3/C(L)B0
64M x 4
256Mb J-die
4Banks
K4H560838J
LC(L)CC/C(L)B3
32M x 8
SSTL_2
8K/64m
2.5±0.2V*2
66pinTSOPII
Now
K4H561638J
LC(L)CC/C(L)B3
16M x 16
K4H560438N
LC(L)B3/C(L)B0
64M x 4
K4H560838N
LC(L)CC/C(L)B3
32M x 8
SSTL_2
8K/64m
2.5±0.2V*2
66pinTSOPII
Now
LC(L)CC/C(L)B3
16M x 16
256Mb N-die
4Banks
K4H561638N
K4H510438F
512Mb F-die
4Banks
K4H510838F
K4H511638F
K4H510438G
512Mb G-die
4Banks
K4H510838G
K4H511638G
LC(L)B3/C(L)B0
HC(L)CC/C(L)B3
LC(L)CC/C(L)B3
HC(L)CC/C(L)B3
LC(L)CC/C(L)B3
HC(L)CC/C(L)B3
LC(L)B3/C(L)B0
HC(L)CC/C(L)B3
LC(L)CC/C(L)B3
HC(L)CC/C(L)B3
LC(L)CC/C(L)B3
HC(L)CC/C(L)B3
64M x 8
DDR500
DDR400
2.5V ± 0.125V
2.5V ± 0.2V
DDR400
DDR333/266
2.6V ± 0.1V
2.5V ± 0.2V
SSTL_2
8K/64m
2.5±0.2V*2
64M x 8
32M x 16
-4-
66pinTSOPII
60ball FBGA
Now
66pinTSOPII
60ball FBGA
66pinTSOPII
128M x 4
2. VDD/VDDQ SPEC for 256/512Mb DDR
VDD/VDDQ
60ball FBGA
32M x 16
NOTE : 1. VDD/VDDQ SPEC for 128Mb DDR L-die
VDD/VDDQ
66pinTSOPII
128M x 4
60ball FBGA
SSTL_2
8K/64m
2.5±0.2V*2
66pinTSOPII
60ball FBGA
66pinTSOPII
60ball FBGA
Now
Apr. 2010
Product Guide
Consumer Memory
2.3 DDR2 SDRAM
Density
Banks
Part Number
128Mb O-die
4Banks
K4T28163QO
256Mb I-die
4Banks
256Mb N-die
4Banks
512Mb G-die
4Banks
512Mb I-die
4Banks
1Gb E-die
8Banks
1Gb F-die
8Banks
Package & Power,
Org.
Interface
Refresh
Power (V)
Package
Avail.
HCF8/E7/F7/E6
8M x 16
SSTL_18
4K/64m
1.8V±0.1V
84ball FBGA
Now
K4T56163QI
Z*1C(L)E7/F7/E6/D5/CC
16M x 16
SSTL_18
8K/64m
1.8V±0.1V
84ball FBGA
Now
SSTL_18
8K/64m
1.8V±0.1V
84ball FBGA
Now
Temp. (-C/-L) & Speed
K4T56163QN
HCF8/E7/F7/E6
16M x 16
K4T51083QG
HC(L)F8/E7/F7/E6
64M x 8
K4T51163QG
HC(L)F8/E7/F7/E6
32M x 16
K4T51043QI
HC(L)E7/F7/E6
128M x 4
K4T51083QI
HC(L)E7/F7/E6
64M x 8
K4T51163QI
HC(L)F8/E7/F7/E6
32M x 16
K4T1G084QE
HC(L)F8/E7/F7/E6
128M x 8
K4T1G164QE
HC(L)F8/E7/F7/E6
64M x 16
SSTL_18
8K/64m
1.8V±0.1V
SSTL_18
8K/64m
1.8V±0.1V
60ball FBGA
84ball FBGA
Now
60ball FBGA
Now
84ball FBGA
Now
60ball FBGA
SSTL_18
8K/64m
1.8V±0.1V
SSTL_18
8K/64m
1.8V±0.1V
Interface
Refresh
Power (V)
SSTL_15
8K/64m
1.5V±0.075V
SSTL_15
8K/64m
1.5V±0.075V
SSTL_15
8K/64m
1.5V±0.075V
Org.
Interface
Refresh
Power (V)
PKG
Avail.
K4T1G084QF
BC(L)F8/E7/F7/E6
128M x 8
K4T1G164QF
BC(L)F8/E7/F7/E6
64M x 16
84ball FBGA
60ball FBGA
84ball FBGA
Now
Now
NOTE : 1. 128Mb I-die DDR2 84ball FBGA supports Halogen-free package
2.4 DDR3 SDRAM
Density
Banks
1Gb E-die
8Banks
2Gb B-die
8Banks
2Gb C-die
8Banks
Part Number
Package & Power,
Temp. (-C/-L) & Speed
Org.
K4B1G0846E
HC(L)F7/F8/H9/K0
128M x 8
K4B1G1646E
HC(L)F7/F8/H9/K0
64M x 16
K4B2G0846B
HC(L)F7/F8/H9/K0
256M x 8
K4B2G1646B
HC(L)F7/F8/H9/K0
128M x 16
K4B2G0846C
HC(L)F8/H9/K0
256M x 8
K4B2G1646C
HC(L)F8/H9/K0
128M x 16
PKG
78ball FBGA
96ball FBGA
78ball FBGA
96ball FBGA
78ball FBGA
96ball FBGA
Avail.
Now
Now
Now
2.5 DDR3+ SDRAM
Part Number
Package & Power,
Density
Banks
1Gb E-die
8Banks
K4B1G1646E
HQH9
64M x 16
SSTL_15
8K/64m
1.5V±0.075V
96ball FBGA
Now
2Gb C-die
8Banks
K4B2G1646C
HQH9
128M x 16
SSTL_15
8K/64m
1.5V±0.075V
96ball FBGA
Now
Temp. (-C/-L) & Speed
NOTE : For more details about product specifications or technical files, please contact us "[email protected]"
-5-
Apr. 2010
Product Guide
Consumer Memory
2.6 GDDR SDRAM
Density
Banks
Part Number
Package & Power,
Temp. (-C/-L) & Speed
Org.
Interface
Refresh
Power (V)
4Banks
K4D263238K
VC40/50
Avail.
Lead-free & Halogenfree
144ball FBGA
FC40/50
128Mb K-die
PKG
4M x 32
SSTL_2
4K/32m
2.5V±5%
Lead-free
144ball FBGA
3Q. ’10
EOL
Lead-free & Halogenfree
U*1C40/50
100pin TQFP*1
NOTE : 1. 128Mb K-die GDDR TQFP supports Lead-free & Halogen-free package with Lead-free package code(-U)
2.7 GDDR3 SDRAM
Density
Banks
Part Number
1Gb E-die
8Banks
K4J10324KE
Package & Power,
Temp. (-C/-L) & Speed
HC7A/08/1A/12/14
Org.
Interface
Refresh
Power (V)
PKG
Avail.
32M x 32
SSTL_2
8K/32m
1.8V±0.1V
136ball FBGA
Now
-6-
Apr. 2010
Product Guide
Consumer Memory
3. Industrial Temperature Consumer DRAM Component Product Guide
3.1 SDRAM
Density
Bank
64Mb N-die
4Banks
Package & Power,
Temp. & Speed
Part Number
Org.
Interface
Refresh
Power (V)
Package
Avail.
4M x 16
LVTTL
4K/64ms
3.3±0.3V
54pin TSOP(II)
Now
KS641632N
LI(P)60/I(P)75
8M x 16
LVTTL
4K/64ms
3.3±0.3V
8M x 16
LVTTL
4K/64ms
3.3±0.3V
128Mb K-die
4Banks
K4S281632K
U*1I(P)60/I(P)75
128Mb O-die
4Banks
K4S281632O
LI(P)60/I(P)75
16M x 16
LVTTL
8K/64ms
3.3±0.3V
16M x 16
LVTTL
8K/64ms
3.3±0.3V
256Mb J-die
4Banks
K4S561632J
U*1I(P)60/I(P)75
256Mb N-die
4Banks
K4S561632N
LI(P)60/I(P)75
54pin
TSOP(II)*1
54pin TSOP(II)
54pin
TSOP(II)*1
Now
3Q ’10
Now
54pin TSOP(II)
2Q ’10
Package
Avail.
NOTE : 1. 128Mb K-die SDR and 256Mb J-die SDR DRAMs support Lead-free & Halogen-free package with Lead-free package code(-U)
3.2 DDR SDRAM
Density
Bank
Package & Power,
Temp. & Speed
Part Number
K4H510838F
512Mb F-die
512Mb G-die
4Banks
4Banks
LI(P)B3
LI(P)B3
K4H511638F
HI(P)B3
LI(P)CC/B3
K4H511638G
HI(P)CC/B3
Org.
Interface
Refresh
Power (V)
8K/64m
2.5±0.2V*1
66pinTSOPII
64M x 8
32M x 16
SSTL_2
66pinTSOPII
Now
60ball FBGA
66pinTSOPII
32M x 16
SSTL_2
8K/64m
2.5±0.2V*1
Org.
Interface
Refresh
Power (V)
Package
Avail.
32M x 16
SSTL_18
8K/64m
1.8V±0.1V
84ball FBGA
Now
32M x 16
SSTL_18
8K/64m
1.8V±0.1V
84ball FBGA
Now
SSTL_18
8K/64m
1.8V ± 0.1V
60ball FBGA
Now
84ball FBGA
Now
SSTL_18
8K/64m
1.8V ± 0.1V
Interface
Refresh
Power (V)
60ball FBGA
Now
NOTE : 1. VDD/VDDQ SPEC for 256/512Mb DDR
VDD/VDDQ
DDR400
DDR333/266
2.6V ± 0.1V
2.5V ± 0.2V
3.3 DDR2 SDRAM
Density
Bank
512Mb G-die
4Banks
512Mb I-die
4Banks
1Gb E-die
8Banks
1Gb F-die
8Banks
Part Number
Package & Power,
Temp. & Speed
K4T51163QG
HI(P)F7/I(P)E6/I(P)D5/
I(P)CC
K4T51163QG
HDE6
K4T51163QI
HI(P)E7/I(P)F7/I(P)E6
K4T51163QI
HDE7/E6
K4T1G084QE
HI(P)F7/I(P)E6
128M x 8
K4T1G164QE
HI(P)F7/I(P)E6
64M x 16
K4T1G084QF
BI(P)F7/I(P)E6
128M x 8
K4T1G164QF
BI(P)F7/I(P)E6
64M x 16
60ball FBGA
84ball FBGA
2Q ’10
3.4 DDR3 SDRAM
Part Number
Package & Power,
Temp. & Speed
Density
Bank
Org.
1Gb E-die
8Banks
K4B1G1646E
HI(P)H9
64M x 16
SSTL_15
8K/64m
1.5V±0.075V
96ball FBGA
Now
2Gb B-die
8Banks
K4B2G1646B
HI(P)H9
128M x 16
SSTL_15
8K/64m
1.5V±0.075V
96ball FBGA
Now
2Gb C-die
8Banks
K4B2G1646C
HI(P)H9
128M x 16
SSTL_15
8K/64m
1.5V±0.075V
96ball FBGA
2Q ’10
-7-
Package
Avail.
Apr. 2010
Product Guide
Consumer Memory
4. Package Dimension
54Pin TSOP(II) (for SDRAM)
#27
(10.76)
(10°)
(10°)
(0.50)
(0.80)
(1.50)
0.075 MAX
0.
25
)
[
(R
(R
0.
25
)
+0.10
0.35 - 0.05
(4°)
0.05 MIN
(R
(0.71)
[
0.
15
)
0.10 MAX
(10°)
0.80TYP
[0.80 ± 0.08]
0.45 ~ 0.75
0.125 - 0.035
1.20 MAX
(10°)
0.1
5)
1.00 ± 0.10
0.210 ± 0.05
0.665 ± 0.05
+0.075
22.22 ± 0.10
(R
11.76 ± 0.20
#1
(1.50)
(0.80)
#28
10.16 ± 0.10
#54
(0.50)
Units : Millimeters
NOTE
1. ( ) IS REFERENCE
2. [ ] IS ASS’Y OUT QUALITY
0.25TYP
(0° ∼ 8°)
66Pin TSOP(II) (for DDR)
#33
(10.76)
(0.50)
NOTE
1. ( ) IS REFERENCE
2. [ ] IS ASS’Y OUT QUALITY
Detail A
0.
25
)
(4°)
(R
0.075 MAX
0.
25
)
Detail B
[
(R
Detail A
0.05 MIN
0.
15
)
(0.71)
(10°)
0.45 ~ 0.75
1.20 MAX
1.00 ± 0.10
(10°)
0.10 MAX
(R
(10°)
(10°)
(0.80)
(1.50)
0.210 ± 0.05
(R
0.1
5)
0.125 - 0.035
[
0.665 ± 0.05
+0.075
22.22 ± 0.10
0.65TYP
[0.65 ± 0.08]
11.76 ± 0.20
#1
(1.50)
(0.80)
#34
10.16 ± 0.10
#66
(0.50)
Units : Millimeters
0.25TYP
Detail B
(0° ∼ 8°)
0.25 ± 0.08
0.30 ± 0.08
-8-
Apr. 2010
Product Guide
Consumer Memory
60Ball FBGA (For DDR 64Mb N-die)
#A1
Units : Millimeters
0.10 Max
8.00 ± 0.10
8.0 0 ± 0.10
A
#A1 MARK
0.80 x 8 = 6.40
0.80
9
8
1.60
7
6
5
4
3
2
B
1
(Datum A)
A
B
(Datum B)
C
12.00 ± 0.10
E
F
0.50
G
H
12.00 ± 0.10
1.00 x 11 = 11.00
D
J
1.00
K
L
M
0.32 ± 0.05
1.10 ± 0.10
TOP VIEW
60 - ∅ 0.45 SOLDER BALL
(Post Reflow 0.50 ± 0.05)
∅0.20 M
BOTTOM VIEW
A B
60Ball FBGA (For DDR 512Mb F-die, 512Mb G-die)
Units : Millimeters
9.00 ± 0.10
A
1.00MAX
0.80 x8 = 6.40
9.00 ± 0.10
0.80 x4 = 3.20
WINDOW MOLD AREA
0.80 x2= 1.60
9
8
7
6
#A1 MARK(option)
0.80 x2 = 1.60
5
4
3
2
B
1
0.80
A
B
0.50
F
G
0.50
H
0.45 ± 0.05
J
K
L
M
60-∅0.45 ± 0.05
0.20 M A B
1.20 MAX
(0.90)
(0.90)
(1.80)
(Datum A)
4-CORNER MARK(option)
TOP VIEW
BOTTOM VIEW
-9-
12.00 ± 0.10
12.00 ± 0.10
E
1.00 x11= 11.00
C
D
5.50
(Datum B)
1.00
#A1
Apr. 2010
Product Guide
Consumer Memory
60Ball FBGA (For DDR2 x8)
Units : Millimeters
0.10MAX
# A1 INDEX MARK
7.50 ± 0.10
7.50 ± 0.10
MOLDING AREA
A
0.80 x 8 = 6.40
#A1
0.80
B
1.60
(Datum A)
9
(Datum B)
8
7
6
5
4
3
2
1
A
B
E
0.50 ± 0.05
F
0.80
G
H
9.50 ± 0.10
9.50 ± 0.10
D
0.80 x 10 = 8.00
C
J
K
L
0.35±0.05
1.10±0.10
(0.95)
(1.90)
60-∅0.45 Solder ball
(Post reflow 0.50 ± 0.05)
0.2 M A B
TOP VIEW
BOTTOM VIEW
0.10MAX
84Ball FBGA (For DDR2 128Mb O-die/256Mb N-die/512Mb G-die, I-die/1Gb E-die)
7.50 ± 0.10
Units : Millimeters
7.50 ± 0.10
A
0.80 x 8 = 6.40
#A1
0.80
9
(Datum A)
# A1 INDEX MARK
3.20
MOLDING AREA
8
7
1.60
6
5
4
B
3
2
1
A
B
(Datum B)
C
D
H
0.80
J
K
12.50 ± 0.10
0.80 x 14 = 11.20
F
G
0.50±0.05
L
5.60
12.50 ± 0.10
E
M
N
P
R
0.35±0.05
1.10±0.10
(0.95)
(1.90)
84-∅0.45 Solder ball
(Post reflow 0.50 ± 0.05)
0.2 M A B
TOP VIEW
BOTTOM VIEW
- 10 -
Apr. 2010
Product Guide
Consumer Memory
60Ball FBGA (for DDR2 1Gb F-die x8)
0.10MAX
Units : Millimeters
7.50 ± 0.10
A
0.80 x 8 = 6. 40
7.50 ± 0.10
# A1 INDEX MARK
3.20
(Datum A)
0.80
#A1
9
8
7
1.60
6
5
4
B
3
2
1
A
C
0.80 x 10 = 8.00
D
9.50 ± 0.10
E
F
H
4.00
0.80
G
J
9.50 ± 0.10
0.80
B
(Datum B)
K
L
0.37±0.05
1.10±0.10
(0.30)
60-∅0.48 Solder ball
(Post reflow 0.50 ± 0.05)
(0.60)
0.2 M A B
TOP VIEW
MOLDING AREA
BOTTOM VIEW
84Ball FBGA (for DDR2 1Gb F-die x16)
0.10MAX
Units : Millimeters
7.50 ± 0.10
A
0.80 x 8 = 6. 40
7.50 ± 0.10
# A1 INDEX MARK
3.20
0.80
#A1
9
(Datum A)
8
7
1.60
6
5
4
B
3
2
1
A
B
C
D
12.50 ± 0.10
F
G
H
0.80
J
K
5.60
L
M
N
P
R
0.37±0.05
1.10±0.10
(0.30)
MOLDING AREA
84-∅0.48 Solder ball
(Post reflow 0.50 ± 0.05)
0.2 M A B
TOP VIEW
- 11 -
(0.60)
BOTTOM VIEW
12.50 ± 0.10
E
0.80 x 14 = 11.20
0.80
(Datum B)
Apr. 2010
Product Guide
Consumer Memory
84Ball FBGA (For DDR2 256Mb I-die)
Units : Millimeters
0.10MAX
9.00 ± 0.10
9.00 ± 0.10
A
0.80 x 8 = 6.40
3.20
0.80
#A1
9
(Datum A)
8
# A1 INDEX MARK
1.60
7
6
5
4
B
3
2
1
A
B
0.80
(Datum B)
C
D
0.80 x 14 = 11.20
13.00 ± 0.10
F
G
H
0.80
J
K
5.60
L
13.00 ± 0.10
E
M
N
P
R
0.35 ± 0.05
1.10 ± 0.10
(0.95)
84-∅0.45 Solder ball
(Post reflow 0.50 ± 0.05)
0.2 M A B
TOP VIEW
MOLDING AREA
(1.90)
BOTTOM VIEW
78Ball FBGA (for DDR3 1Gb x8 E-die / DDR3 2Gb x8 C-die)
0.10MAX
7.50 ± 0.10
0.80
(Datum A)
7.50 ± 0.10
1.60
A
#A1 INDEX MARK
3.20
B
0.35 ± 0.05
1.10 ± 0.10
(0.95)
78 - ∅0.45 Solder ball
(Post Reflow ∅0.50 ± 0.05)
0.2 M A B
TOP VIEW
MOLDING AREA
(1.90)
BOTTOM VIEW
- 12 -
11.00 ± 0.10
4.80
0.80
0.80
(Datum B)
A
B
C
D
E
F
G
H
J
K
L
M
N
0.80 x 12 = 9.60
9 8 7 6 5 4 3 2 1
11.00 ± 0.10
#A1
Units : Millimeters
Apr. 2010
Product Guide
Consumer Memory
96Ball FBGA (for DDR3 1Gb x16 E-die / DDR3+ 1Gb x16 E-die / DDR3 2Gb x16 C-die)
7.50 ± 0.10
0.10MAX
#A1
Units : Millimeters
0.80
7.50 ± 0.10
A
#A1 INDEX MARK
1.60
3.20
B
9 8 7 6 5 4 3 2 1
0.35 ± 0.05
1.10 ± 0.10
MOLDING AREA
(1.90)
0.2 M A B
BOTTOM VIEW
78Ball FBGA (for DDR3 2Gb x8 B-die)
Units : Millimeters
0.10MAX
9.00 ± 0.10
A
0.80 x 8 = 6.40
0.80
(Datum A)
9.00 ± 0.10
1.60
#A1 INDEX MARK
3.20
B
0.35 ± 0.05
1.10 ± 0.10
(0.95)
78 - ∅0.45 Solder ball
(Post Reflow ∅0.50 ± 0.05)
0.2 M A B
TOP VIEW
MOLDING AREA
(1.90)
BOTTOM VIEW
- 13 -
11.50 ± 0.10
4.80
0.80
0.80
(Datum B)
A
B
C
D
E
F
G
H
J
K
L
M
N
0.80 x 12 = 9.60
9 8 7 6 5 4 3 2 1
11.50 ± 0.10
#A1
13.30 ± 0.10
(0.95)
96 - ∅0.45 Solder ball
(Post Reflow ∅0.50 ± 0.05)
TOP VIEW
0.80 x 15 = 12.00
0.40
0.80
13.30 ± 0.10
(Datum B)
6.00
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
(Datum A)
Apr. 2010
Product Guide
Consumer Memory
96Ball FBGA (for DDR3 2Gb x16 B-die)
Units : Millimeters
0.10MAX
9.00 ± 0.10
#A1
A
0.80 x 8 = 6.40
#A1 INDEX MARK
0.80 1.60
9.00 ± 0.10
3.20
B
9 8 7 6 5 4 3 2 1
0.35 ± 0.05
1.10 ± 0.10
(0.95)
96 - ∅0.45 Solder ball
(Post Reflow ∅0.50 ± 0.05)
MOLDING AREA
(1.90)
0.2 M A B
TOP VIEW
BOTTOM VIEW
136Ball FBGA (for GDDR3 1Gb E-die)
0.10MAX
Units : Millimeters
10.00 ± 0.10
A
0.80 x 11 = 8.80
# A1 INDEX MARK
4.40
0.80
10.00 ± 0.10
12 11 10 9
2.00
8
7
6
5
4
3
2
B
1
(Datum A) A
B
0.80
C
D
(Datum B) E
0.80 x 16 = 12.80
H
J
K
0.80
L
6.40
M
N
P
R
T
V
0.35 ± 0.05
1.10 ± 0.10
0.95
136-∅0.45 Solder ball
(Post reflow 0.50 ± 0.05)
TOP VIEW
0.2 M A B
- 14 -
1.90
MOLDING AREA
BOTTOM VIEW
14.00 ± 0.10
F
G
14.00 ± 0.10
#A1
13.30 ± 0.10
0.80 x 15 = 12.00
0.40
0.80
13.30 ± 0.10
(Datum B)
6.00
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
(Datum A)
Apr. 2010
Product Guide
Consumer Memory
For further information,
[email protected]
- 15 -