DDR2 SDRAM
512Mb C-die DDR2 SDRAM
512Mb C-die DDR2 SDRAM Specification
Version 1.4
August 2005
INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS,
AND IS SUBJECT TO CHANGE WITHOUT NOTICE.
NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,
TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY. ALL
INFORMATION IN THIS DOCUMENT IS PROVIDED
ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND.
1. For updates or additional information about Samsung products, contact your nearest Samsung office.
2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar
applications where Product failure could result in loss of life or personal or physical harm, or any military or
defense application, or any governmental procurement to which special terms or provisions may apply.
* Samsung Electronics reserves the right to change products or specification without notice.
Page 1 of 29
Rev. 1.4 Aug. 2005
DDR2 SDRAM
512Mb C-die DDR2 SDRAM
Contents
0. Ordering Information
1. Key Feature
2. Package Pinout/Mechanical Dimension & Addressing
2.1 Package Pinout & Mechanical Dimension
2.2 Input/Output Function Description
2.3 Addressing
3. Absolute Maximum Rating
4. AC & DC Operating Conditions & Specifications
Page 2 of 29
Rev. 1.4 Aug. 2005
DDR2 SDRAM
512Mb C-die DDR2 SDRAM
0. Ordering Information
Org.
DDR2-800 5-5-5
DDR2-667 5-5-5
DDR2-533 4-4-4
DDR2-400 3-3-3
Package
128Mx4
K4T51043QC-ZC(L)E7
K4T51043QC-ZC(L)E6
K4T51043QC-ZC(L)D5
K4T51043QC-ZC(L)CC
60 FBGA
64Mx8
K4T51083QC-ZC(L)E7
K4T51083QC-ZC(L)E6
K4T51083QC-ZC(L)D5
K4T51083QC-ZC(L)CC
60 FBGA
32Mx16
K4T51163QC-ZC(L)E7
K4T51163QC-ZC(L)E6
K4T51163QC-ZC(L)D5
K4T51163QC-ZC(L)CC
84 FBGA
Note : Speed bin is in order of CL-tRCD-tRP.
1.Key Features
Speed
DDR2-800
5-5-5
DDR2-667
5-5-5
DDR2-533
4-4-4
DDR2-400
3-3-3
Units
CAS Latency
5
5
4
3
tCK
tRCD(min)
12.5
15
15
15
ns
tRP(min)
12.5
15
15
15
ns
tRC(min)
51.5
54
55
55
ns
• JEDEC standard 1.8V ± 0.1V Power Supply
• VDDQ = 1.8V ± 0.1V
• 200 MHz fCK for 400Mb/sec/pin, 267MHz fCK for 533Mb/sec/
pin, 333MHz fCK for 667Mb/sec/pin, 400MHz fCK for 800Mb/
sec/pin
• 4 Banks
• Posted CAS
• Programmable CAS Latency: 3, 4, 5
• Programmable Additive Latency: 0, 1 , 2 , 3 and 4
• Write Latency(WL) = Read Latency(RL) -1
• Burst Length: 4 , 8(Interleave/nibble sequential)
• Programmable Sequential / Interleave Burst Mode
• Bi-directional Differential Data-Strobe (Single-ended datastrobe is an optional feature)
• Off-Chip Driver(OCD) Impedance Adjustment
• On Die Termination
• Special Function Support
-PASR(Partial Array Self Refresh)
-50ohm ODT
-High Temperature Self-Refresh rate enable
• Average Refresh Period 7.8us at lower than TCASE 85°C,
3.9us at 85°C < TCASE < 95 °C
The 512Mb DDR2 SDRAM is organized as a 32Mbit x 4 I/Os x 4
banks, 16Mbit x 8 I/Os x 4banks or 8Mbit x 16 I/Os x 4 banks
device. This synchronous device achieves high speed doubledata-rate transfer rates of up to 800Mb/sec/pin (DDR2-800) for
general applications.
The chip is designed to comply with the following key DDR2
SDRAM features such as posted CAS with additive latency, write
latency = read latency -1, Off-Chip Driver(OCD) impedance
adjustment and On Die Termination.
All of the control and address inputs are synchronized with a pair
of externally supplied differential clocks. Inputs are latched at the
crosspoint of differential clocks (CK rising and CK falling). All I/Os
are synchronized with a pair of bidirectional strobes (DQS and
DQS) in a source synchronous fashion. The address bus is used
to convey row, column, and bank address information in a RAS/
CAS multiplexing style. For example, 512Mb(x4) device receive
14/11/2 addressing.
The 512Mb DDR2 device operates with a single 1.8V ± 0.1V
power supply and 1.8V ± 0.1V VDDQ.
The 512Mb DDR2 device is available in 60ball FBGAs(x4/x8) and
in 84ball FBGAs(x16).
Note: The functionality described and the timing specifications
included in this data sheet are for the DLL Enabled mode of operation.
• All of Lead-free products are compliant for RoHS
Note : This data sheet is an abstract of full DDR2 specification and does not cover the common features which are described in “Samsung’s DDR2
SDRAM Device Operation & Timing Diagram”
Page 3 of 29
Rev. 1.4 Aug. 2005
DDR2 SDRAM
512Mb C-die DDR2 SDRAM
2. Package Pinout/Mechanical Dimension & Addressing
2.1 Package Pinout
x4 package pinout (Top View) : 60ball FBGA Package
1
2
3
7
8
9
VDD
NC
VSS
A
VSSQ
DQS
VDDQ
VSSQ
DM
B
DQS
VSSQ
NC
DQ1
VDDQ
C
VDDQ
DQ0
VDDQ
NC
VSSQ
DQ3
D
DQ2
VSSQ
NC
VDDL
VREF
VSS
E
VSSDL
CK
VDD
CKE
WE
F
RAS
CK
ODT
BA0
BA1
G
CAS
CS
A10/AP
A1
H
A2
A0
A3
A5
J
A6
A4
A7
A9
K
A11
A8
A12
NC
L
NC
A13
NC
VDDQ
NC
VSS
VDD
VDD
VSS
Notes :
1. Pin B3 has identical capacitance as pin B7.
2. VDDL and VSSDL are power and ground for the DLL.
Ball Locations (x4)
: Populated Ball
+ : Depopulated Ball
Top View (See the balls through the Package)
1
A
B
C
D
E
F
+
G
H
+
J
K
L
+
+
2
3
4
5
6
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
Page 4 of 29
7
8
9
+
+
+
Rev. 1.4 Aug. 2005
DDR2 SDRAM
512Mb C-die DDR2 SDRAM
x8 package pinout (Top View) : 60ball FBGA Package
1
2
3
7
8
9
NU/
RDQS
VSS
A
VSSQ
DQS
VDDQ
VSSQ
DM/
RDQS
DQ6
B
DQS
VSSQ
DQ7
VDDQ
DQ1
VDDQ
C
VDDQ
DQ0
VDDQ
DQ4
VSSQ
DQ3
D
DQ2
VSSQ
DQ5
VDDL
VREF
VSS
E
VSSDL
CK
VDD
CKE
WE
F
RAS
CK
ODT
BA0
BA1
G
CAS
CS
A10/AP
A1
H
A2
A0
A3
A5
J
A6
A4
A7
A9
K
A11
A8
A12
NC
L
NC
A13
VDD
NC
VSS
VDD
VDD
VSS
Notes :
1. Pins B3 and A2 have identical capacitance as pins B7 and A8.
2. For a read, when enabled, strobe pair RDQS & RDQS are
identical in function and timing to strobe pair DQS & DQS and
input masking function is disabled.
3. The function of DM or RDQS/RDQS are enabled by EMRS
command.
4. VDDL and VSSDL are power and ground for the DLL.
Ball Locations (x8)
: Populated Ball
+ : Depopulated Ball
Top View (See the balls through the Package)
1
A
B
C
D
E
F
+
G
H
+
J
K
L
+
2
3
4
5
6
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
Page 5 of 29
7
8
9
+
+
+
Rev. 1.4 Aug. 2005
DDR2 SDRAM
512Mb C-die DDR2 SDRAM
x16 package pinout (Top View) : 84ball FBGA Package
1
2
3
7
8
9
VDD
NC
VSS
A
VSSQ
UDQS
VDDQ
DQ14
VSSQ
UDM
B
UDQS
VSSQ
DQ15
VDDQ
DQ9
VDDQ
C
VDDQ
DQ8
VDDQ
DQ12
VSSQ
DQ11
D
DQ10
VSSQ
DQ13
LDQS
VDDQ
VDD
NC
VSS
E
VSSQ
DQ6
VSSQ
LDM
F
LDQS
VSSQ
DQ7
VDDQ
DQ1
VDDQ
G
VDDQ
DQ0
VDDQ
DQ4
VSSQ
DQ3
H
DQ2
VSSQ
DQ5
VDDL
VREF
VSS
J
VSSDL
CK
VDD
CKE
WE
K
RAS
CK
BA0
BA1
L
CAS
CS
A10/AP
A1
M
A2
A0
A3
A5
N
A6
A4
A7
A9
P
A11
A8
A12
NC
R
NC
NC
NC
VSS
VDD
ODT
VDD
VSS
Note :
1. VDDL and VSSDL are power and ground for the DLL.
2. In case of only 8 DQs out of 16 DQs are used, LDQS, LDQSB and DQ0~7 must be used.
1
Ball Locations (x16)
A
B
C
: Populated Ball
+ : Depopulated Ball
D
E
F
Top View
(See the balls through the Package)
G
H
J
K
+
L
M
+
N
P
+
R
Page 6 of 29
2
3
4
5
6
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
7
8
9
+
+
+
Rev. 1.4 Aug. 2005
DDR2 SDRAM
512Mb C-die DDR2 SDRAM
FBGA Package Dimension(x4/x8)
10.00 ± 0.10
# A1 INDEX MARK
6.40
0.80
9
8
7
1.60
6
5
4
3
2
1
A
B
D
8.00
E
F
0.80
H
J
1.60
4.00
G
11.00 ± 0.10
C
K
L
3.20
(5.00)
(0.90)
(1.80)
60-∅0.45±0.05
0.10MAX
∅0.2 M A B
10.00 ± 0.10
0.45±0.05
11.00 ± 0.10
#A1
0.35±0.05
MAX.1.20
Page 7 of 29
Rev. 1.4 Aug. 2005
DDR2 SDRAM
512Mb C-die DDR2 SDRAM
FBGA Package Dimension(x16)
11.00 ± 0.10
# A1 INDEX MARK
6.40
0.80
9
8
7
1.60
6
5
4
3
2
1
A
B
C
D
E
11.20
H
0.80
J
K
L
5.60
M
13.00 ± 0.10
F
G
1.60
N
P
R
3.20
∅0.2 M A B
(5.50)
(0.90)
(1.80)
0.10MAX
84-∅0.45±0.05
11.00 ± 0.10
0.45±0.05
13.00 ± 0.10
#A1
0.35±0.05
MAX.1.20
Page 8 of 29
Rev. 1.4 Aug. 2005
DDR2 SDRAM
512Mb C-die DDR2 SDRAM
2.2 Input/Output Functional Description
Symbol
Type
Function
Input
Clock: CK and CK are differential clock inputs. All address and control input signals are sampled on the crossing of the positive edge of
CK and negative edge of CK. Output (read) data is referenced to the crossings of CK and CK (both directions of crossing).
CKE
Input
Clock Enable: CKE HIGH activates, and CKE Low deactivates, internal clock signals and device input buffers and output drivers. Taking CKE Low provides Precharge Power-Down and Self Refresh operation (all banks idle), or Active Power-Down (row Active in any
bank). CKE is synchronous for power down entry and exit, and for self refresh entry. CKE is asynchronous for self refresh exit. After
VREF has become stable during the power on and initialization swquence, it must be maintained for proper operation of the CKE
receiver. For proper self-refresh entry and exit, VREF must be maintained to this input. CKE must be maintained high throughout read
and write accesses. Input buffers, excluding CK, CK, ODT and CKE are disabled during power-down. Input buffers, excluding CKE, are
disabled during self refresh.
CS
Input
Chip Select: All commands are masked when CS is registered HIGH. CS provides for external Rank selection on systems with multiple
Ranks. CS is considered part of the command code.
ODT
Input
On Die Termination: ODT (registered HIGH) enables termination resistance internal to the DDR2 SDRAM. When enabled, ODT is only
applied to each DQ, DQS, DQS, RDQS, RDQS, and DM signal for x4/x8 configurations. For x16 configuration ODT is applied to each
DQ, UDQS/UDQS, LDQS/LDQS, UDM, and LDM signal. The ODT pin will be ignored if the Extended Mode Register (EMRS(1)) is programmed to disable ODT.
RAS, CAS, WE
Input
Command Inputs: RAS, CAS and WE (along with CS) define the command being entered.
DM
Input
Input Data Mask: DM is an input mask signal for write data. Input data is masked when DM is sampled HIGH coincident with that input
data during a Write access. DM is sampled on both edges of DQS. Although DM pins are input only, the DM loading matches the DQ
and DQS loading. For x8 device, the function of DM or RDQS/RDQS is enabled by EMRS command.
BA0 - BA1
Input
Bank Address Inputs: BA0 - BA1 define to which bank an Active, Read, Write or Precharge command is being applied (For 256Mb and
512Mb, BA2 is not applied). Bank address also determines if the mode register or extended mode register is to be accessed during a
MRS or EMRS cycle.
A0 - A13
Input
Address Inputs: Provided the row address for Active commands and the column address and Auto Precharge bit for Read/Write commands to select one location out of the memory array in the respective bank. A10 is sampled during a Precharge command to determine
whether the Precharge applies to one bank (A10 LOW) or all banks (A10 HIGH). If only one bank is to be precharged, the bank is
selected by BA0, BA1. The address inputs also provide the op-code during Mode Register Set commands.
CK, CK
DQ
DQS, (DQS)
(LDQS), (LDQS)
(UDQS), (UDQS)
(RDQS), (RDQS)
Input/Output Data Input/ Output: Bi-directional data bus.
Data Strobe: output with read data, input with write data. Edge-aligned with read data, centered in write data. For the x16, LDQS corresponds to the data on DQ0-DQ7; UDQS corresponds to the data on DQ8-DQ15. For the x8, an RDQS option using DM pin can be
enabled via the EMRS(1) to simplify read timing. The data strobes DQS, LDQS, UDQS, and RDQS may be used in single ended mode
or paired with optional complementary signals DQS, LDQS, UDQS, and RDQS to provide differential pair signaling to the system during
both reads and writes. An EMRS(1) control bit enables or disables all complementary data strobe signals.
In this data sheet, "differential DQS signals" refers to any of the following with A10 = 0 of EMRS(1)
x4 DQS/DQS
Input/Output x8 DQS/DQS
if EMRS(1)[A11] = 0
x8 DQS/DQS, RDQS/RDQS,
if EMRS(1)[A11] = 1
x16 LDQS/LDQS and UDQS/UDQS
"single-ended DQS signals" refers to any of the following with A10 = 1 of EMRS(1)
x4 DQS
x8 DQS if EMRS(1)[A11] = 0
x8 DQS, RDQS, if EMRS(1)[A11] = 1
x16 LDQS and UDQS
NC
No Connect: No internal electrical connection is present.
VDD/VDDQ
Supply
Power Supply: 1.8V +/- 0.1V, DQ Power Supply: 1.8V +/- 0.1V
VSS/VSSQ
Supply
Ground, DQ Ground
VDDL
Supply
DLL Power Supply: 1.8V +/- 0.1V
VSSDL
Supply
DLL Ground
VREF
Supply
Reference voltage
Page 9 of 29
Rev. 1.4 Aug. 2005
DDR2 SDRAM
512Mb C-die DDR2 SDRAM
2.3 512Mb Addressing
Configuration
128Mb x4
64Mb x 8
32Mb x16
# of Banks
4
4
4
Bank Address
BA0,BA1
BA0,BA1
BA0,BA1
Auto precharge
A10/AP
A10/AP
A10/AP
Row Address
A0 ~ A13
A0 ~ A13
A0 ~ A12
Column Address
A0 ~ A9,A11
A0 ~ A9
A 0 ~ A9
* Reference information: The following tables are address mapping information for other densities.
256Mb
Configuration
64Mb x4
32Mb x 8
16Mb x16
# of Banks
4
4
4
Bank Address
BA0,BA1
BA0,BA1
BA0,BA1
Auto precharge
A10/AP
A10/AP
A10/AP
Row Address
A0 ~ A12
A0 ~ A12
A0 ~ A12
Column Address
A0 ~ A9,A11
A0 ~ A9
A 0 ~ A8
Configuration
256Mb x4
128Mb x 8
64Mb x16
# of Banks
8
8
8
Bank Address
BA0 ~ BA2
BA0 ~ BA2
BA0 ~ BA2
1Gb
Auto precharge
A10/AP
A10/AP
A10/AP
Row Address
A0 ~ A13
A0 ~ A13
A0 ~ A12
Column Address
A0 ~ A9,A11
A0 ~ A9
A 0 ~ A9
Configuration
512Mb x4
256Mb x 8
128Mb x16
2Gb
# of Banks
8
8
8
Bank Address
BA0 ~ BA2
BA0 ~ BA2
BA0 ~ BA2
Auto precharge
A10/AP
A10/AP
A10/AP
Row Address
A0 ~ A14
A0 ~ A14
A0 ~ A13
Column Address
A0 ~ A9,A11
A0 ~ A9
A 0 ~ A9
Configuration
1 Gb x4
512Mb x 8
256Mb x16
4Gb
# of Banks
8
8
8
Bank Address
BA0 ~ BA2
BA0 ~ BA2
BA0 ~ BA2
Auto precharge
A10/AP
A10/AP
A10/AP
Row Address
A0 - A15
A0 - A15
A0 - A14
Column Address/page size
A0 - A9,A11
A0 - A9
A0 - A9
Page 10 of 29
Rev. 1.4 Aug. 2005
DDR2 SDRAM
512Mb C-die DDR2 SDRAM
3. Absolute Maximum DC Ratings
Symbol
Rating
Units
Notes
Voltage on VDD pin relative to VSS
- 1.0 V ~ 2.3 V
V
1
VDDQ
Voltage on VDDQ pin relative to VSS
- 0.5 V ~ 2.3 V
V
1
VDDL
Voltage on VDDL pin relative to VSS
- 0.5 V ~ 2.3 V
V
1
Voltage on any pin relative to VSS
- 0.5 V ~ 2.3 V
V
1
-55 to +100
°C
1, 2
VDD
VIN, VOUT
TSTG
Parameter
Storage Temperature
Note :
1. Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Exposure to absolute maximum rating conditions for extended periods may affect reliability.
2. Storage Temperature is the case surface temperature on the center/top side of the DRAM. For the measurement conditions, please refer to JESD51-2
standard.
4. AC & DC Operating Conditions
Recommended DC Operating Conditions (SSTL - 1.8)
Symbol
Parameter
Rating
Min.
Typ.
Max.
Units
VDD
Supply Voltage
1.7
1.8
1.9
V
Notes
VDDL
Supply Voltage for DLL
1.7
1.8
1.9
V
4
VDDQ
Supply Voltage for Output
1.7
1.8
1.9
V
4
VREF
Input Reference Voltage
0.49*VDDQ
0.50*VDDQ
0.51*VDDQ
mV
1,2
Termination Voltage
VREF-0.04
VREF
VREF+0.04
V
3
VTT
Note : There is no specific device VDD supply voltage requirement for SSTL-1.8 compliance. However under all conditions VDDQ must be less than or equal
to VDD.
1. The value of VREF may be selected by the user to provide optimum noise margin in the system. Typically the value of VREF is expected to be about 0.5
x VDDQ of the transmitting device and VREF is expected to track variations in VDDQ.
2. Peak to peak AC noise on VREF may not exceed +/-2% VREF(DC).
3. VTT of transmitting device must track VREF of receiving device.
4. AC parameters are measured with VDD, VDDQ and VDDL tied together.
Page 11 of 29
Rev. 1.4 Aug. 2005
DDR2 SDRAM
512Mb C-die DDR2 SDRAM
Operating Temperature Condition
Symbol
Parameter
Rating
Units
Notes
TOPER
Operating Temperature
0 to 95
°C
1, 2
1. Operating Temperature is the case surface temperature on the center/top side of the DRAM. For the measurement conditions, please refer to
JESD51.2 standard.
2. At 85 - 95 °C operation temperature range, doubling refresh commands in frequency to a 32ms period ( tREFI=3.9 us ) is required, and to enter to
self refresh mode at this temperature range, an EMRS command is required to change internal refresh rate.
Input DC Logic Level
Symbol
Parameter
Min.
Max.
Units
VIH(DC)
DC input logic high
VREF + 0.125
VDDQ + 0.3
V
VIL(DC)
DC input logic low
- 0.3
VREF - 0.125
V
Notes
Input AC Logic Level
DDR2-400, DDR2-533
DDR2-667, DDR2-800
Min.
Max.
Min.
AC input logic high
VREF + 0.250
-
VREF + 0.200
AC input logic low
-
VREF - 0.250
Symbol
Parameter
VIH (AC)
VIL (AC)
Units
Max.
V
VREF - 0.200
V
AC Input Test Conditions
Symbol
Condition
Value
Units
Notes
VREF
Input reference voltage
0.5 * VDDQ
V
1
VSWING(MAX)
Input signal maximum peak to peak swing
1.0
V
1
SLEW
Input signal minimum slew rate
1.0
V/ns
2, 3
Notes:
1. Input waveform timing is referenced to the input signal crossing through the VIH/IL(AC) level applied to the device under test.
2. The input signal minimum slew rate is to be maintained over the range from VREF to VIH(AC) min for rising edges and the range from VREF to VIL(AC)
max for falling edges as shown in the below figure.
3. AC timings are referenced with input waveforms switching from VIL(AC) to VIH(AC) on the positive transitions and VIH(AC) to VIL(AC) on the negative
transitions.
VDDQ
VIH(AC) min
VIH(DC) min
VSWING(MAX)
VREF
VIL(DC) max
VIL(AC) max
delta TF
Falling Slew =
delta TR
VREF - VIL(AC) max
delta TF
Rising Slew =
VSS
VIH(AC) min - VREF
delta TR
< AC Input Test Signal Waveform >
Page 12 of 29
Rev. 1.4 Aug. 2005
DDR2 SDRAM
512Mb C-die DDR2 SDRAM
Differential input AC logic Level
Symbol
Parameter
Min.
Max.
Units
Notes
VID(AC)
AC differential input voltage
0.5
VDDQ + 0.6
V
1
VIX(AC)
AC differential cross point voltage
0.5 * VDDQ - 0.175
0.5 * VDDQ + 0.175
V
2
Notes:
1. VID(AC) specifies the input differential voltage |VTR -VCP | required for switching, where VTR is the true input signal (such as CK, DQS, LDQS or UDQS)
and VCP is the complementary input signal (such as CK, DQS, LDQS or UDQS). The minimum value is equal to V IH (AC) - V IL(AC).
2. The typical value of VIX(AC) is expected to be about 0.5 * VDDQ of the transmitting device and VIX(AC) is expected to track variations in VDDQ .
VIX(AC) indicates the voltage at which differential input signals must cross.
VDDQ
VTR
Crossing point
VID
VIX or VOX
VCP
VSSQ
< Differential signal levels >
Differential AC output parameters
Symbol
VOX(AC)
Parameter
AC differential cross point voltage
Min.
Max.
Units
Note
0.5 * VDDQ - 0.125
0.5 * VDDQ + 0.125
V
1
Note :
1. The typical value of VOX(AC) is expected to be about 0.5 * VDDQ of the transmitting device and VOX(AC) is expected to track variations in VDDQ .
VOX(AC) indicates the voltage at which differential output signals must cross.
ODT DC electrical characteristics
SYMBOL
MIN
NOM
MAX
UNITS
Rtt effective impedance value for EMRS(A6,A2)=0,1; 75 ohm
PARAMETER/CONDITION
Rtt1(eff)
60
75
90
ohm
1
Rtt effective impedance value for EMRS(A6,A2)=1,0; 150 ohm
Rtt2(eff)
120
150
180
ohm
1
50
60
ohm
1
+6
%
1
Rtt effective impedance value for EMRS(A6,A2)=1,1; 50 ohm
Rtt3(eff)
40
Deviation of VM with respect to VDDQ/2
delta VM
-6
NOTES
Note1: Test condition for Rtt measurements
Measurement Definition for Rtt(eff): Apply VIH (ac) and VIL (ac) to test pin separately, then measure current I(VIH (ac)) and I( VIL (ac)) respectively. VIH
(ac), VIL (ac), and VDDQ values defined in SSTL_18
Rtt(eff) =
delta VM =
VIH (ac) - VIL (ac)
I(VIH (ac)) - I(VIL (ac))
2 x Vm
VDDQ
-1
x 100%
Measurement Definition for VM: Measure voltage (VM) at test pin (midpoint) with no load.
Page 13 of 29
Rev. 1.4 Aug. 2005
DDR2 SDRAM
512Mb C-die DDR2 SDRAM
OCD default characteristics
Description
Parameter
Min
Max
Normal 18ohms
See full strength default driver characteristics
Output impedance
Output impedance step size for OCD calibration
Pull-up and pull-down mismatch
Output slew rate
Nom
Sout
Unit
Notes
ohms
1,2
6
0
1.5
ohms
0
4
ohms
1,2,3
1.5
5
V/ns
1,4,5,6,7,8
Notes:
1. Absolute Specifications (0°C ≤ TCASE ≤ +95°C; VDD = +1.8V ±0.1V, VDDQ = +1.8V ±0.1V)
2. Impedance measurement condition for output source dc current: VDDQ = 1.7V; VOUT = 1420mV; (VOUT-VDDQ)/Ioh must be less than 23.4 ohms for
values of VOUT between VDDQ and VDDQ- 280mV. Impedance measurement condition for output sink dc current: VDDQ = 1.7V; VOUT = 280mV;
VOUT/Iol must be less than 23.4 ohms for values of VOUT between 0V and 280mV.
3. Mismatch is absolute value between pull-up and pull-dn, both are measured at same temperature and voltage.
4. Slew rate measured from VIL(AC) to VIH(AC).
5. The absolute value of the slew rate as measured from DC to DC is equal to or greater than the slew rate as measured from AC to AC. This is guaranteed by design and characterization.
6. This represents the step size when the OCD is near 18 ohms at nominal conditions across all process and represents only the DRAM uncertainty.
Output slew rate load :
VTT
25 ohms
Output
(VOUT)
Reference
Point
7. DRAM output slew rate specification applies to 400Mb/sec/pin, 533Mb/sec/pin, 667Mb/sec/pin and 800Mb/sec/pin speed bins.
8. Timing skew due to DRAM output slew rate mis-match between DQS / DQS and associated DQs is included in tDQSQ and tQHS specification.
Page 14 of 29
Rev. 1.4 Aug. 2005
DDR2 SDRAM
512Mb C-die DDR2 SDRAM
IDD Specification Parameters and Test Conditions
(IDD values are for full operating range of Voltage and Temperature, Notes 1 - 5)
Symbol
Proposed Conditions
Units
IDD0
Operating one bank active-precharge current;
tCK = tCK(IDD), tRC = tRC(IDD), tRAS = tRASmin(IDD); CKE is HIGH, CS\ is HIGH between valid commands;
Address bus inputs are SWITCHING; Data bus inputs are SWITCHING
mA
IDD1
Operating one bank active-read-precharge current;
IOUT = 0mA; BL = 4, CL = CL(IDD), AL = 0; tCK = tCK(IDD), tRC = tRC (IDD), tRAS = tRASmin(IDD), tRCD =
tRCD(IDD); CKE is HIGH, CS\ is HIGH between valid commands; Address bus inputs are SWITCHING; Data pattern is same as IDD4W
mA
IDD2P
Precharge power-down current;
All banks idle; tCK = tCK(IDD); CKE is LOW; Other control and address bus inputs are STABLE; Data bus inputs are
FLOATING
mA
IDD2Q
Precharge quiet standby current;
All banks idle; tCK = tCK(IDD); CKE is HIGH, CS\ is HIGH; Other control and address bus inputs are STABLE; Data
bus inputs are FLOATING
mA
IDD2N
Precharge standby current;
All banks idle; tCK = tCK(IDD); CKE is HIGH, CS\ is HIGH; Other control and address bus inputs are SWITCHING;
Data bus inputs are SWITCHING
mA
IDD3P
Active power-down current;
Fast PDN Exit MRS(12) = 0mA
All banks open; tCK = tCK(IDD); CKE is LOW; Other control and address bus
Slow PDN Exit MRS(12) = 1mA
inputs are STABLE; Data bus inputs are FLOATING
IDD3N
Active standby current;
All banks open; tCK = tCK(IDD), tRAS = tRASmax(IDD), tRP = tRP(IDD); CKE is HIGH, CS\ is HIGH between valid
commands; Other control and address bus inputs are SWITCHING; Data bus inputs are SWITCHING
mA
IDD4W
Operating burst write current;
All banks open, Continuous burst writes; BL = 4, CL = CL(IDD), AL = 0; tCK = tCK(IDD), tRAS = tRASmax(IDD), tRP
= tRP(IDD); CKE is HIGH, CS\ is HIGH between valid commands; Address bus inputs are SWITCHING; Data bus
inputs are SWITCHING
mA
IDD4R
Operating burst read current;
All banks open, Continuous burst reads, IOUT = 0mA; BL = 4, CL = CL(IDD), AL = 0; tCK = tCK(IDD), tRAS = tRASmax(IDD), tRP = tRP(IDD); CKE is HIGH, CS\ is HIGH between valid commands; Address bus inputs are SWITCHING; Data pattern is same as IDD4W
mA
IDD5B
Burst auto refresh current;
tCK = tCK(IDD); Refresh command at every tRFC(IDD) interval; CKE is HIGH, CS\ is HIGH between valid commands; Other control and address bus inputs are SWITCHING; Data bus inputs are SWITCHING
mA
IDD6
Self refresh current;
CK and CK\ at 0V; CKE ≤ 0.2V; Other control and address bus inputs are
FLOATING; Data bus inputs are FLOATING
IDD7
Operating bank interleave read current;
All bank interleaving reads, IOUT = 0mA; BL = 4, CL = CL(IDD), AL = tRCD(IDD)-1*tCK(IDD); tCK = tCK(IDD), tRC
= tRC(IDD), tRRD = tRRD(IDD), tFAW = tFAW(IDD), tRCD = 1*tCK(IDD); CKE is HIGH, CS\ is HIGH between valid
commands; Address bus inputs are STABLE during DESELECTs; Data pattern is same as IDD4R; Refer to the following page for detailed timing conditions
Page 15 of 29
Notes
mA
mA
Normal
mA
Low Power
mA
mA
Rev. 1.4 Aug. 2005
DDR2 SDRAM
512Mb C-die DDR2 SDRAM
Notes :
1. IDD specifications are tested after the device is properly initialized
2. Input slew rate is specified by AC Parametric Test Condition
3. IDD parameters are specified with ODT disabled.
4. Data bus consists of DQ, DM, DQS, DQS\, RDQS, RDQS\, LDQS, LDQS\, UDQS, and UDQS\. IDD values must be met with all combinations of EMRS
bits 10 and 11.
5. Definitions for IDD
LOW is defined as Vin ≤ VILAC(max)
HIGH is defined as Vin ≥ VIHAC(min)
STABLE is defined as inputs stable at a HIGH or LOW level
FLOATING is defined as inputs at VREF = VDDQ/2
SWITCHING is defined as:
inputs changing between HIGH and LOW every other clock cycle (once per two clocks) for address and control
signals, and
inputs changing between HIGH and LOW every other data transfer (once per clock) for DQ signals not including
masks or strobes.
For purposes of IDD testing, the following parameters are utilized
Parameter
DDR2-800
DDR2-667
DDR2-533
DDR2-400
5-5-5
5-5-5
4-4-4
3-3-3
Units
CL(IDD)
5
5
4
3
tRCD(IDD)
12.5
15
15
15
tCK
ns
tRC(IDD)
57.5
60
60
55
ns
tRRD(IDD)-x4/x8
7.5
7.5
7.5
7.5
ns
tRRD(IDD)-x16
10
10
10
10
ns
tCK(IDD)
2.5
3
3.75
5
ns
tRASmin(IDD)
45
45
45
40
ns
tRP(IDD)
12.5
15
15
15
ns
tRFC(IDD)
105
105
105
105
ns
Detailed IDD7
The detailed timings are shown below for IDD7.
Legend: A = Active; RA = Read with Autoprecharge; D = Deselect
IDD7: Operating Current: All Bank Interleave Read operation
All banks are being interleaved at minimum tRC(IDD) without violating tRRD(IDD) and tFAW(IDD) using a burst length of 4. Control and address bus
inputs are STABLE during DESELECTs. IOUT = 0mA
Timing Patterns for 4 bank devices with 1KB or 2KB page size
-DDR2-400 3/3/3
A0 RA0 A1 RA1 A2 RA2 A3 RA3 D D D
-DDR2-533 4/4/4
A0 RA0 D A1 RA1 D A2 RA2 D A3 RA3 D D D D D
-DDR2-667 5/5/5
A0 RA0 D D A1 RA1 D D A2 RA2 D D A3 RA3 D D D D D D
-DDR2-800 5/5/5
A0 RA0 D D A1 RA1 D D A2 RA2 D D A3 RA3 D D D D D D D D D
Page 16 of 29
Rev. 1.4 Aug. 2005
DDR2 SDRAM
512Mb C-die DDR2 SDRAM
DDR2 SDRAM IDD Spec Table(1)
128Mx4(K4T51043QC)
Symbol
800@CL=5
CE7
LE7
667@CL=5
533@CL=4
Unit
400@CL=3
CE6
LE6
CD5
LD5
CCC
IDD0
tbd
85
65
80
65
80
65
mA
IDD1
tbd
100
75
95
75
95
75
mA
Notes
LCC
IDD2P
tbd
8
5
8
4.5
8
4.5
mA
IDD2Q
tbd
35
30
30
25
30
25
mA
IDD2N
tbd
40
35
35
30
35
30
mA
mA
IDD3P-F
tbd
30
25
30
25
30
25
IDD3P-S
tbd
12
8
12
8
12
8
mA
IDD3N
tbd
55
45
50
40
50
40
mA
IDD4W
tbd
130
120
110
100
100
90
mA
IDD4R
tbd
135
125
115
105
105
95
mA
IDD5
tbd
150
135
140
125
140
125
mA
IDD6
tbd
8
4
8
4
8
4
mA
IDD7
tbd
220
180
220
180
220
180
mA
64Mx8(K4T51083QC)
Symbol
800@CL=5
CE7
LE7
667@CL=5
533@CL=4
Unit
400@CL=3
CE6
LE6
CD5
LD5
CCC
LCC
65
80
65
mA
mA
IDD0
tbd
85
65
80
IDD1
tbd
100
75
95
75
95
75
IDD2P
tbd
8
5
8
4.5
8
4.5
mA
IDD2Q
tbd
35
30
30
25
30
25
mA
IDD2N
tbd
40
35
35
30
35
30
mA
IDD3P-F
tbd
30
25
30
25
30
25
mA
IDD3P-S
tbd
12
8
12
8
12
8
mA
IDD3N
tbd
55
45
50
40
50
40
mA
IDD4W
tbd
140
130
120
110
110
95
mA
IDD4R
tbd
145
135
125
115
110
100
mA
IDD5
tbd
150
135
140
125
140
125
mA
IDD6
tbd
8
4
8
4
8
4
mA
IDD7
tbd
220
180
220
180
220
180
mA
Page 17 of 29
Notes
Rev. 1.4 Aug. 2005
DDR2 SDRAM
512Mb C-die DDR2 SDRAM
DDR2 SDRAM IDD Spec Table(2)
32Mx16(K4T51163QC)
Symbol
800@CL=5
CE7
LE7
667@CL=5
533@CL=4
Unit
400@CL=3
CE6
LE6
CD5
LD5
CCC
IDD0
tbd
100
85
95
85
95
85
mA
IDD1
tbd
115
100
110
100
110
100
mA
LCC
IDD2P
tbd
8
5
8
4.5
8
4.5
mA
IDD2Q
tbd
35
30
30
25
30
25
mA
IDD2N
tbd
40
35
35
30
35
30
mA
mA
IDD3P-F
tbd
30
25
30
25
30
25
IDD3P-S
tbd
12
8
12
8
12
8
mA
IDD3N
tbd
55
45
50
40
50
40
mA
IDD4W
tbd
175
165
155
145
135
125
mA
IDD4R
tbd
180
170
160
150
140
130
mA
IDD5
tbd
150
135
140
125
140
125
mA
IDD6
tbd
8
4
8
4
8
4
mA
IDD7
tbd
300
270
300
270
300
270
mA
Page 18 of 29
Notes
Rev. 1.4 Aug. 2005
DDR2 SDRAM
512Mb C-die DDR2 SDRAM
Input/Output capacitance
Parameter
DDR2-400
DDR2-533
Symbol
Input capacitance, CK and CK
CCK
Input capacitance delta, CK and CK
CDCK
Input capacitance, all other input-only pins
CI
Input capacitance delta, all other input-only pins
Input/output capacitance, DQ, DM, DQS, DQS
DDR2-667
DDR2-800
Units
Min
Max
Min
Max
Min
Max
1.0
2.0
1.0
2.0
1.0
2.0
pF
x
0.25
x
0.25
x
0.25
pF
1.0
2.0
1.0
2.0
1.0
1.75
pF
CDI
x
0.25
x
0.25
x
0.25
pF
CIO
2.5
4.0
2.5
3.5
2.5
3.5
pF
x
0.5
x
0.5
x
0.5
pF
Input/output capacitance delta, DQ, DM, DQS, DQS CDIO
Electrical Characteristics & AC Timing for DDR2-800/667/533/400
(0 °C < TOPER < 95 °C; VDDQ = 1.8V + 0.1V; VDD = 1.8V + 0.1V)
Refresh Parameters by Device Density
Parameter
Symbol
Refresh to active/Refresh command time
Average periodic refresh interval
tRFC
tREFI
256Mb
512Mb
1Gb
2Gb
4Gb
Units
75
105
127.5
195
327.5
ns
0 °C ≤ TCASE ≤ 85°C
7.8
7.8
7.8
7.8
7.8
µs
85 °C < TCASE ≤ 95°C
3.9
3.9
3.9
3.9
3.9
µs
Speed Bins and CL, tRCD, tRP, tRC and tRAS for Corresponding Bin
Speed
DDR2-800(E7)
Bin(CL - tRCD - tRP)
Parameter
DDR2-667(E6)
5-5-5
DDR2-533(D5)
5-5-5
min
max
tCK, CL=3
5
tCK, CL=4
3.75
tCK, CL=5
DDR2-400(CC)
4-4-4
min
max
8
5
8
3.75
2.5
8
tRCD
12.5
tRP
12.5
tRC
tRAS
3-3-3
Units
min
max
min
max
8
5
8
5
8
ns
8
3.75
8
5
8
ns
3
8
3.75
8
-
-
ns
-
15
-
15
-
15
-
ns
-
15
-
15
-
15
-
ns
51.5
-
54
-
55
-
55
-
ns
39
70000
39
70000
40
70000
40
70000
ns
Page 19 of 29
Rev. 1.4 Aug. 2005
DDR2 SDRAM
512Mb C-die DDR2 SDRAM
Timing Parameters by Speed Grade
(Refer to notes for informations related to this table at the bottom)
Parameter
Symbol
DDR2-800
DDR2-667
DDR2-533
DDR2-400
min
max
min
max
min
max
min
max
-500
+500
-600
+600
Units Notes
DQ output access time from CK/CK
tAC
-400
+400
-450
+450
ps
DQS output access time from CK/CK
tDQSCK
-350
+350
-400
+400
-450
+450
-500
+500
ps
CK high-level width
tCH
0.45
0.55
0.45
0.55
0.45
0.55
0.45
0.55
tCK
CK low-level width
tCL
0.45
0.55
0.45
0.55
0.45
0.55
0.45
0.55
tCK
CK half period
tHP
min(tCL,
tCH)
x
min(tCL,
tCH)
x
min(tCL,
tCH)
x
min(tCL,
tCH)
x
ps
Clock cycle time, CL=x
tCK
2500
8000
3000
8000
3750
8000
5000
8000
ps
24
20,21
DQ and DM input hold time
tDH(base)
125
x
175
x
225
x
275
x
ps
15,16,
17,20
DQ and DM input setup time
tDS(base)
50
x
100
x
100
x
150
x
ps
15,16,
17,21
Control & Address input pulse width for each
input
tIPW
0.6
x
0.6
x
0.6
x
0.6
x
tCK
DQ and DM input pulse width for each input
tDIPW
0.35
x
0.35
x
0.35
x
0.35
x
tCK
Data-out high-impedance time from CK/CK
tHZ
DQS low-impedance time from CK/CK
tLZ(DQS)
x
tAC max
x
tAC max
x
tAC max
x
tAC max
ps
tAC min
tAC max
tAC min
tAC max
tAC min
tAC max
tAC min
tAC max
ps
27
tAC max
2*tAC
min
tAC max
tAC max
ps
27
x
240
x
350
ps
22
21
DQ low-impedance time from CK/CK
tLZ(DQ)
2*tAC
min
DQS-DQ skew for DQS and associated DQ
signals
tDQSQ
x
200
DQ hold skew factor
tQHS
x
2* tACmin tAC max 2* tACmin
x
300
300
x
340
x
400
x
450
ps
tHP tQHS
x
tHP tQHS
x
tHP tQHS
x
tHP tQHS
x
ps
First DQS latching transition to associated clock
tDQSS
edge
-0.25
0.25
-0.25
0.25
-0.25
0.25
-0.25
0.25
tCK
DQS input high pulse width
tDQSH
0.35
x
0.35
x
0.35
x
0.35
x
tCK
DQS input low pulse width
tDQSL
0.35
x
0.35
x
0.35
x
0.35
x
tCK
DQS falling edge to CK setup time
tDSS
0.2
x
0.2
x
0.2
x
0.2
x
tCK
DQS falling edge hold time from CK
tDSH
0.2
x
0.2
x
0.2
x
0.2
x
tCK
Mode register set command cycle time
tMRD
2
x
2
x
2
x
2
x
tCK
Write postamble
tWPST
0.4
0.6
0.4
0.6
0.4
0.6
0.4
0.6
tCK
Write preamble
tWPRE
0.35
x
0.35
x
0.35
x
0.35
x
tCK
Address and control input hold time
tIH(base)
250
x
275
x
375
x
475
x
ps
14,16,1
8,23
Address and control input setup time
tIS(base)
175
x
200
x
250
x
350
x
ps
14,16,1
8,22
Read preamble
tRPRE
0.9
1.1
0.9
1.1
0.9
1.1
0.9
1.1
tCK
28
Read postamble
tRPST
0.4
0.6
0.4
0.6
0.4
0.6
0.4
0.6
tCK
28
Active to active command period for 1KB page
size products
tRRD
7.5
x
7.5
x
7.5
x
7.5
x
ns
12
Active to active command period for 2KB page
size products
tRRD
10
x
10
x
10
x
10
x
ns
12
Four Activate Window for 1KB page size
products
tFAW
35
37.5
37.5
37.5
ns
Four Activate Window for 2KB page size
products
tFAW
45
50
50
50
ns
CAS to CAS command delay
tCCD
2
Write recovery time
tWR
15
x
15
x
15
x
15
x
ns
Auto precharge write recovery + precharge time
tDAL
WR+tRP
x
WR+tRP
x
WR+tRP
x
WR+tRP
x
tCK
23
Internal write to read command delay
tWTR
7.5
7.5
x
7.5
x
10
x
ns
33
Internal read to precharge command delay
tRTP
11
Exit self refresh to a non-read command
tXSNR
DQ/DQS output hold time from DQS
tQH
2
2
2
tCK
7.5
7.5
7.5
7.5
ns
tRFC + 10
tRFC + 10
tRFC + 10
tRFC + 10
ns
Page 20 of 29
19
Rev. 1.4 Aug. 2005
DDR2 SDRAM
512Mb C-die DDR2 SDRAM
Parameter
Symbol
DDR2-800
min
max
200
DDR2-667
min
max
200
DDR2-533
min
max
200
DDR2-400
min
Units Notes
max
Exit self refresh to a read command
tXSRD
Exit precharge power down to any non-read
command
200
tCK
tXP
2
x
2
x
2
x
2
x
tCK
Exit active power down to read command
tXARD
2
x
2
x
2
x
2
x
tCK
9
Exit active power down to read command
(slow exit, lower power)
tXARDS
tCK
9, 10
CKE minimum pulse width
(high and low pulse width)
8 - AL
7 - AL
6 - AL
6 - AL
t
CKE
3
3
3
3
ODT turn-on delay
tAOND
2
2
2
2
2
2
2
2
tCK
ODT turn-on
tAON
tAC(min)
tAC(max)
+0.7
tAC(min)
tAC(max)
+0.7
tAC(min)
tAC(max)
+1
tAC(min)
tAC(max)
+1
ns
ODT turn-on(Power-Down mode)
tAONPD
2tCK+tA
tAC(min)+ 2tCK+tAC
tAC(min)+ 2tCK+tAC tAC(min)+ 2tCK+tAC tAC(min)+
C(max)+
2
(max)+1
2
(max)+1
2
(max)+1
2
1
ns
ODT turn-off delay
t
AOFD
ODT turn-off
t
ODT turn-off (Power-Down mode)
tAOFPD
AOF
2.5
2.5
tAC(min)
tAC(max)
+ 0.6
2.5
2.5
tAC(min)
tAC(max)
+ 0.6
2.5
2.5
tAC(min)
tAC(max)+
0.6
tCK
2.5
2.5
tCK
tAC(min)
tAC(max)+
0.6
ns
2.5tCK+
2.5tCK+
2.5tCK+
2.5tCK+
tAC(min)+
tAC(min)+
tAC(min)+
tAC(min)+
tAC(max)
tAC(max)
tAC(max)
tAC(max)
2
2
2
2
+1
+1
+1
+1
ns
ODT to power down entry latency
tANPD
3
3
3
3
tCK
ODT power down exit latency
tAXPD
8
8
8
8
tCK
OCD drive mode output delay
tOIT
Minimum time clocks remains ON after CKE
asynchronously drops LOW
tDelay
0
tIS+tCK
+tIH
12
0
tIS+tCK
+tIH
Page 21 of 29
12
0
tIS+tCK
+tIH
12
0
12
tIS+tCK
+tIH
36
13, 25
26
ns
ns
24
Rev. 1.4 Aug. 2005
DDR2 SDRAM
512Mb C-die DDR2 SDRAM
General notes, which may apply for all AC parameters
1. Slew Rate Measurement Levels
a. Output slew rate for falling and rising edges is measured between VTT - 250 mV and VTT + 250 mV for
single ended signals. For differential signals (e.g. DQS - DQS) output slew rate is measured between DQS - DQS = -500 mV and DQS - DQS =
+500mV. Output slew rate is guaranteed by design, but is not necessarily tested on each device.
b. Input slew rate for single ended signals is measured from dc-level to ac-level: from VIL(dc) to VIH(ac) for rising edges and from VIH(dc) and VIL(ac)
for falling edges.
For differential signals (e.g. CK - CK) slew rate for rising edges is measured from CK - CK = -250 mV to CK - CK = +500 mV (250mV to -500 mV for
falling edges).
c. VID is the magnitude of the difference between the input voltage on CK and the input voltage on CK, or between DQS and DQS for differential
strobe.
2. DDR2 SDRAM AC timing reference load
Following figure represents the timing reference load used in defining the relevant timing parameters of the part. It is not intended to be either a precise
representation of the typical system environment or a depiction of the actual load presented by a production tester. System designers will use IBIS or other
simulation tools to correlate the timing reference load to a system environment. Manufacturers will correlate to their production test conditions (generally a
coaxial transmission line terminated at the tester electronics).
VDDQ
DUT
DQ
DQS
DQS
RDQS
RDQS
Output
Timing
reference
point
VTT = VDDQ/2
25Ω
<AC Timing Reference Load>
The output timing reference voltage level for single ended signals is the crosspoint with VTT. The output timing reference voltage level for differential signals is the crosspoint of the true (e.g. DQS) and the complement (e.g. DQS) signal.
3. DDR2 SDRAM output slew rate test load
Output slew rate is characterized under the test conditions as shown in the following figure.
VDDQ
DUT
DQ
DQS, DQS
RDQS, RDQS
Output
VTT = VDDQ/2
Test point
25Ω
<Slew Rate Test Load>
Page 22 of 29
Rev. 1.4 Aug. 2005
DDR2 SDRAM
512Mb C-die DDR2 SDRAM
4. Differential data strobe
DDR2 SDRAM pin timings are specified for either single ended mode or differential mode depending on the setting of the EMRS “Enable DQS” mode
bit; timing advantages of differential mode are realized in system design. The method by which the DDR2 SDRAM pin timings are measured is mode
dependent. In single ended mode, timing relationships are measured relative to the rising or falling edges of DQS crossing at VREF. In differential mode,
these timing relationships are measured relative to the crosspoint of DQS and its complement, DQS. This distinction in timing methods is guaranteed by
design and characterization. Note that when differential data strobe mode is disabled via the EMRS, the complementary pin, DQS, must be tied externally
to VSS through a 20 ohm to 10 K ohm resisor to insure proper operation.
tDQSH
DQS
DQS/
tDQSL
DQS
DQS
tWPRE
tWPST
VIH(dc)
VIH(ac)
DQ
D
D
VIL(dc)
VIL(ac)
tDS
DM
D
D
DMin
tDH
tDS
VIH(ac)
tDH
VIH(dc)
DMin
DMin
DMin
VIL(ac)
VIL(dc)
<Data input (write) timing>
tCH
tCL
CK
CK/CK
CK
DQS
DQS/DQS
DQS
tRPRE
tRPST
DQ
Q
Q
tDQSQmax
Q
Q
tDQSQmax
tQH
tQH
<Data output (read) timing>
5. AC timings are for linear signal transitions.
6. These parameters guarantee device behavior, but they are not necessarily tested on each device. They
tester correlation.
may be guaranteed by device design or
7. All voltages are referenced to VSS.
8. Tests for AC timing, IDD, and electrical (AC and DC) characteristics, may be conducted at nominal reference/supply voltage levels, but the related
specifications and device operation are guaranteed for the full voltage range specified.
Page 23 of 29
Rev. 1.4 Aug. 2005
DDR2 SDRAM
512Mb C-die DDR2 SDRAM
Specific Notes for dedicated AC parameters
9. User can choose which active power down exit timing to use via MRS(bit 12). tXARD is expected to be used for fast active power down exit timing.
tXARDS is expected to be used for slow active power down exit timing.
10. AL = Additive Latency
11. This is a minimum requirement. Minimum read to precharge timing is AL + BL/2 providing the tRTP and tRAS(min) have been satisfied.
12. A minimum of two clocks (2 * tCK) is required irrespective of operating frequency
13. Timings are guaranteed with command/address input slew rate of 1.0 V/ns.
14. These parameters guarantee device behavior, but they are not necessarily tested on each device. They may be guaranteed by device design or tester
correlation.
15. Timings are guaranteed with data, mask, and (DQS/RDQS in singled ended mode) input slew rate of 1.0 V/ns.
16. Timings are guaranteed with CK/CK differential slew rate of 2.0 V/ns. Timings are guaranteed for DQS signals with a differential slew rate of 2.0 V/ns
in differential strobe mode and a slew rate of 1V/ns in single ended mode.
17. tDS and tDH derating Values
∆tDS, ∆tDH Derating Values of DDR2-400, DDR2-533 (ALL units in ‘ps’, Note 1 applies to entire Table)
DQS,DQS Differential Slew Rate
4.0 V/ns
DQ
Siew
rate
V/ns
3.0 V/ns
2.0 V/ns
1.8 V/ns
1.6 V/ns
1.4V/ns
1.2V/ns
1.0V/ns
0.8V/ns
∆tDS
∆tDH
∆tDS
∆tDH
∆tDS
∆tDH
∆tDS
∆tDH
∆tDS
∆tDH
∆tDS
∆tDH
∆tDS
∆tDH
∆tDS
∆tDH
∆tDS
2.0
125
45
125
45
125
45
-
-
-
-
-
-
-
-
-
-
-
∆tDH
-
1.5
83
21
83
21
83
21
95
33
-
-
-
-
-
-
-
-
-
-
1.0
0
0
0
0
0
0
12
12
24
24
-
-
-
-
-
-
-
-
0.9
-
-
-11
-14
-11
-14
1
-2
13
10
25
22
-
-
-
-
-
-
0.8
-
-
-
-
-25
-31
-13
-19
-1
-7
11
5
23
17
-
-
-
-
0.7
-
-
-
-
-
-
-31
-42
-19
-30
-7
-18
5
-6
17
6
-
-
0.6
-
-
-
-
-
-
-
-
-43
-59
-31
-47
-19
-35
-7
-23
5
-11
0.5
-
-
-
-
-
-
-
-
-
-
-74
-89
-62
-77
-50
-65
-38
-53
0.4
-
-
-
-
-
-
-
-
-
-
-
-
-127
-140
-115
-128
-103
-116
∆tDS, ∆tDH Derating Values for DDR2-667, DDR2-800 (ALL units in ‘ps’, Note 1 applies to entire Table)
DQS,DQS Differential Slew Rate
4.0 V/ns
DQ
Slew
rate
V/ns
3.0 V/ns
2.0 V/ns
1.8 V/ns
1.6 V/ns
1.4V/ns
1.2V/ns
1.0V/ns
0.8V/ns
∆tDS
∆tDH
∆tDS
∆tDH
∆tDS
∆tDH
∆tDS
∆tDH
∆tDS
∆tDH
∆tDS
∆tDH
∆tDS
∆tDH
∆tDS
∆tDH
∆tDS
∆tDH
2.0
100
45
100
45
100
45
-
-
-
-
-
-
-
-
-
-
-
-
1.5
67
21
67
21
67
21
79
33
-
-
-
-
-
-
-
-
-
-
1.0
0
0
0
0
0
0
12
12
24
24
-
-
-
-
-
-
-
-
0.9
-
-
-5
-14
-5
-14
7
-2
19
10
31
22
-
-
-
-
-
-
0.8
-
-
-
-
-13
-31
-1
-19
11
-7
23
5
35
17
-
-
-
-
0.7
-
-
-
-
-
-
-10
-42
2
-30
14
-18
26
-6
38
6
-
-
0.6
-
-
-
-
-
-
-
-
-10
-59
2
-47
14
-35
26
-23
38
-11
0.5
-
-
-
-
-
-
-
-
-
-
-24
-89
-12
-77
0
-65
12
-53
0.4
-
-
-
-
-
-
-
-
-
-
-
-
-52
-140
-40
-128
-28
-116
For all input signals the total tDS (setup time) and tDH(hold time) required is calculated by adding the datasheet tDS(base) and tDH(base) value to the
delta tDS and delta tDH derating value respectively. Example: tDS(total setup time)= tDS(base) + delta tDS.
Page 24 of 29
Rev. 1.4 Aug. 2005
DDR2 SDRAM
512Mb C-die DDR2 SDRAM
18. tIS and tIH (input setup and hold) derating.
tIS, tIH Derating Values for DDR2-400, DDR2-533
CK,CK Differential Slew Rate
2.0 V/ns
Command/Address Slew
rate
(V/ns)
1.5 V/ns
1.0 V/ns
Units
Notes
∆tIS
∆tIH
∆tIS
∆tIH
∆tIS
∆tIH
4.0
+187
+94
+217
+124
+247
+154
ps
1
3.5
+179
+89
+209
+119
+239
+149
ps
1
3.0
+167
+83
+197
+113
+227
+143
ps
1
2.5
+150
+75
+180
+105
+210
+135
ps
1
2.0
+125
+45
+155
+75
+185
+105
ps
1
1.5
+83
+21
+113
+51
+143
+81
ps
1
1.0
0
0
+30
+30
+60
60
ps
1
0.9
-11
-14
+19
+16
+49
+46
ps
1
0.8
-25
-31
+5
-1
+35
+29
ps
1
0.7
-43
-54
-13
-24
+17
+6
ps
1
0.6
-67
-83
-37
-53
-7
-23
ps
1
0.5
-110
-125
-80
-95
-50
-65
ps
1
0.4
-175
-188
-145
-158
-115
-128
ps
1
0.3
-285
-292
-255
-262
-225
-232
ps
1
0.25
-350
-375
-320
-345
-290
-315
ps
1
0.2
-525
-500
-495
-470
-465
-440
ps
1
0.15
-800
-708
-770
-678
-740
-648
ps
1
Units
Notes
∆tIS and ∆tIH Derating Values for DDR2-667, DDR2-800
CK,CK Differential Slew Rate
2.0 V/ns
Command/Address Slew
rate
(V/ns)
1.5 V/ns
1.0 V/ns
∆tIS
∆tIH
∆tIS
∆tIH
∆tIS
∆tIH
4.0
+150
+94
+180
+124
+210
+154
ps
1
3.5
+143
+89
+173
+119
+203
+149
ps
1
3.0
+133
+83
+163
+113
+193
+143
ps
1
2.5
+120
+75
+150
+105
+180
+135
ps
1
2.0
+100
+45
+130
+75
+160
+105
ps
1
1.5
+67
+21
+97
+51
+127
+81
ps
1
1.0
0
0
+30
+30
+60
+60
ps
1
0.9
-5
-14
+25
+16
+55
+46
ps
1
0.8
-13
-31
+17
-1
+47
+29
ps
1
0.7
-22
-54
+8
-24
+38
+6
ps
1
0.6
-34
-83
-4
-53
+26
-23
ps
1
0.5
-60
-125
-30
-95
0
-65
ps
1
0.4
-100
-188
-70
-158
-40
-128
ps
1
0.3
-168
-292
-138
-262
-108
-232
ps
1
0.25
-200
-375
-170
-345
-140
-315
ps
1
0.2
-325
-500
-295
-470
-265
-440
ps
1
0.15
-517
-708
-487
-678
-457
-648
ps
1
0.1
-1000
-1125
-970
-1095
-940
-1065
ps
1
Page 25 of 29
Rev. 1.4 Aug. 2005
DDR2 SDRAM
512Mb C-die DDR2 SDRAM
For all input signals the total tIS (setup time) and tIH (hold time) required is calculated by adding the datasheet tIS(base) and tIH(base) value to the delta
tIS and delta tIH derating value respectively. Example: tIS (total setup time) = tIS(base) + delta tIS
19. The maximum limit for this parameter is not a device limit. The device will operate with a greater value for this parameter, but system performance
(bus turnaround) will degrade accordingly.
20. MIN ( tCL, tCH) refers to the smaller of the actual clock low time and the actual clock high time as provided to the device (i.e. this value can be greater
than the minimum specification limits for tCL and tCH). For example, tCL and tCH are = 50% of the period, less the half period jitter ( tJIT(HP)) of the clock
source, and less the half period jitter due to crosstalk ( tJIT(crosstalk)) into the clock traces.
21. tQH = tHP – tQHS, where:
tHP = minimum half clock period for any given cycle and is defined by clock high or clock low ( tCH, tCL).
tQHS accounts for:
1) The pulse duration distortion of on-chip clock circuits; and
2) The worst case push-out of DQS on one transition followed by the worst case pull-in of DQ on the next transition, both of which are, separately,
due to data pin skew and output pattern effects, and pchannel to n-channel variation of the output drivers.
22. tDQSQ: Consists of data pin skew and output pattern effects, and p-channel to n-channel variation of the output drivers as well as output slew rate
mismatch between DQS / DQS and associated DQ in any given cycle.
23. tDAL = WR + RU{tRP(ns)/tCK(ns)}, where RU stands for round up.
WR refers to the tWR parameter stored in the MRS. For tRP, if the result of the division is not already an integer, round up to the next highest integer. tCK
refers to the application clock period.
Example: For DDR533 at tCK = 3.75ns with tWR programmed to 4 clocks.
tDAL = 4 + (15 ns / 3.75 ns) clocks = 4 + (4) clocks = 8 clocks.
24. The clock frequency is allowed to change during self–refresh mode or precharge power-down mode. In case of clock frequency change during precharge power-down, a specific procedure is required as described in DDR2 device operation
25. ODT turn on time min is when the device leaves high impedance and ODT resistance begins to turn on.
ODT turn on time max is when the ODT resistance is fully on. Both are measured from tAOND.
26. ODT turn off time min is when the device starts to turn off ODT resistance.
ODT turn off time max is when the bus is in high impedance. Both are measured from tAOFD.
27. tHZ and tLZ transitions occur in the same access time as valid data transitions. These parameters are referenced to a specific voltage level which
specifies when the device output is no longer driving (tHZ), or begins driving (tLZ). Following figure shows a method to calculate the point when device is
no longer driving (tHZ), or begins driving (tLZ) by measuring the signal at two different voltages. The actual voltage measurement points are not critical as
long as the calculation is consistent.
28. tRPST end point and tRPRE begin point are not referenced to a specific voltage level but specify when the device output is no longer driving (tRPST),
or begins driving (tRPRE). Following figure shows a method to calculate these points when the device is no longer driving (tRPST), or begins driving
(tRPRE) by measuring the signal at two different voltages. The actual voltage measurement points are not critical as long as the calculation is consistent.
These notes are referenced in the “Timing parameters by speed grade” tables for DDR2-400/533/667 and DDR2-800.
Page 26 of 29
Rev. 1.4 Aug. 2005
DDR2 SDRAM
512Mb C-die DDR2 SDRAM
VOH + x mV
VTT + 2x mV
VOH + 2x mV
VTT + x mV
tLZ
tHZ
tRPRE begin point
tRPST end point
T2
T1
VOL + 2x mV
VTT - x mV
VOL + x mV
VTT - 2x mV
tHZ,tRPST end point = 2*T1-T2
T1
T2
tLZ,tRPRE begin point = 2*T1-T2
<Test method for tLZ, tHZ, tRPRE and tRPST>
29. Input waveform timing with differential data strobe enabled MR[bit10]=0, is referenced from the input signal crossing at the VIH(ac) level to the differential data strobe crosspoint for a rising signal, and from the input signal crossing at the VIL(ac) level to the differential data strobe crosspoint for a falling signal applied to the device under test.
30. Input waveform timing with differential data strobe enabled MR[bit10]=0, is referenced from the input signal crossing at the VIH(dc) level to the differential data strobe crosspoint for a rising signal and VIL(dc) to the differential data strobe crosspoint for a falling signal applied to the device under test.
Differential Input waveform timing
DQS
DQS
tDS
tDH
tDS
Page 27 of 29
tDH
VDDQ
VIH(ac) min
VIH(dc) min
VREF(dc)
VIL(dc) max
VIL(ac) max
VSS
Rev. 1.4 Aug. 2005
DDR2 SDRAM
512Mb C-die DDR2 SDRAM
31. Input waveform timing is referenced from the input signal crossing at the VIH(ac) level for a rising signal and VIL(ac) for a falling signal applied to the
device under test.
32. Input waveform timing is referenced from the input signal crossing at the VIL(dc) level for a rising signal and VIH(dc) for a falling signal applied to the
device under test.
CK
CK
tIS
tIH
tIS
tIH
VDDQ
VIH(ac) min
VIH(dc) min
VREF(dc)
VIL(dc) max
VIL(ac) max
VSS
33. tWTR is at lease two clocks (2 * tCK) independent of operation frequency.
34. Input waveform timing with single-ended data strobe enabled MR[bit10] = 1, is referenced from the input signal crossing at the VIH(ac) level to the single-ended data strobe crossing VIH/L(dc) at the start of its transition for a rising signal, and from the input signal crossing at the VIL(ac) level to the singleended data strobe crossing VIH/L(dc) at the start of its transition for a falling signal applied to the device under test. The DQS signal must be monotonic
between Vil(dc)max and Vih(dc)min.
35. Input waveform timing with single-ended data strobe enabled MR[bit10] = 1, is referenced from the input signal crossing at the VIH(dc) level to the single-ended data strobe crossing VIH/L(ac) at the end of its transition for a rising signal, and from the input signal crossing at the VIL(dc) level to the singleended data strobe crossing VIH/L(ac) at the end of its transition for a falling signal applied to the device under test. The DQS signal must be monotonic
between Vil(dc)max and Vih(dc)min.
36. tCKEmin of 3 clocks means CKE must be registered on three consecutive positive clock edges. CKE must remain at the valid input level the entire
time it takes to achieve the 3 clocks of registeration. Thus, after any CKE transition, CKE may not change from its valid level during the time period of tIS
+ 2*tCK + tIH.
Page 28 of 29
Rev. 1.4 Aug. 2005
DDR2 SDRAM
512Mb C-die DDR2 SDRAM
Revision History
Version 1.0 (Feb. 2005)
- Initial Release
Version 1.1 (Mar. 2005)
- Added Low power current values for 533&400 speed
- Changed IDD3N/2Q normal current values for x16 org.
Version 1.2 (May 2005)
- Corrected typo
Version 1.3 (Jul. 2005)
- Revised the Odering Information
Version 1.4 (Aug. 2005)
- Revised the IDD Current Values
Page 29 of 29
Rev. 1.4 Aug. 2005