SEMICONDUCTOR TECHNICAL DATA KIA2431P/S/T/M/AP/AS/ AT/AM/BM BIPOLAR LINEAR INTEGRATED CIRCUIT PROGRAMMABLE PRECISION REFERENCES The KIA2431P/S/T/M/AP/AS/AT/AM/BM are integrated circuits are three-terminal programmable shunt regulator diodes. These monolithic IC voltage reference operate as a low temperature coefficient zener which is programmable from Vref to 16 volts with two external resistors. These devices exhibit a wide operating current range of 80μA to 50mA with a typical dynamic impedance of 0.22Ω. The characteristics of these references make them excellent replacements for zener diodes in many applications such as digital voltmeters, power supplies, and op amp circuitry. FEATURES ・Programmable Output Voltage to 16 Volts. LINE UP ITEM KIA2431 KIA2431 KIA2431 P S T M AP AS AT AM BM Package TO-92 TSM TSV SOT-23 TO-92 TSM TSV SOT-23 SOT-23 Vref Tolerance (%) ±1.5 ±1.0 ±0.5 ・Low Dynamic Output Impedance : 0.22Ω(Typ.). A to 50mA. ・Sink Current Capability of 80μ ・Equivalent Full-Range Temperature Coefficient of 30ppm/℃ (Typ.). ・Temperature Compensated for Operation Over Full Rated Operating Temperature Range. ・Low Output Noise Voltage. Marking Type No. Marking KIA2431T/S/M 24A KIA2431AT/AS/AM 24B KIA2431BM 24C 2011. 7. 6 Revision No : 6 1/6 KIA2431P/S/T/M/AP/AS/AT/AM/BM MAXIMUM RATINGS (Ta=25℃) (Full operating ambient temperature range applies unless otherwise noted.) CHARACTERISTIC SYMBOL RATING UNIT VKA 16 V Cathode Current Range, Continuous IK 50 mA Reference Input Current Range, Continuos Iref 3 mA Operating Junction Temperature Tj 150 ℃ Operating Temperature Topr -40～85 ℃ Storage Temperature Tstg -65～150 ℃ Cathode To Anode Voltage KIA2431P/AP 700 KIA2431S/AS (Note1) Total Power Dissipation 900 PD KIA2431T/AT mW 550 KIA2431AM/BM (Note2) 350 Note1) Package Mounted on 99.5% Alumina (10㎜×8㎜×0.6㎜) Note2) Package Mounted on a ceramic board (600㎟×0.8㎜) ELECTRICAL CHARACTERISTICS (Ta=25℃) CHARACTERISTICS SYMBOL TEST CIRCUIT TEST CONDITION KIA2431P/S/T/M Reference Input Voltage KIA2431AP/AS/AT/AM Vref Figure 1 VKA=Vref , IK=10mA KIA2431BM Reference Input Voltage ΔVref Deviation Over Temperature Range Ratio of Change in Reference Input Voltage ΔVref / to Change in Cathode to Anode Voltage ΔVKA Figure 1 (Note 1) VKA=Vref , IK=10mA ΔVKA= MIN. TYP. MAX. UNIT 1.222 1.240 1.258 V 1.228 1.240 1.252 V 1.234 1.240 1.246 V - 7.0 20 mV - -0.6 -1.5 mV/V Figure 2 IK=10mA Iref Figure 2 IK=10mA, R1=10kΩ, R2=∞ - 0.15 0.5 μA ΔIref Figure 2 IK=10mA, R1=10kΩ, R2=∞ - 0.05 0.3 μA Minimum Cathode Current For Regulation Imin Figure 1 VKA=Vref - 55 80 μA Off-State Cathode Current Ioff Figure 3 VKA=16V, Vref=0V - 2.6 1000 nA Dynamic Impedance Zka - 0.22 0.4 Ω Reference Input Current Ta=25℃ Reference Input Current Deviation Over Temperature Range 2011. 7. 6 Revision No : 6 16V～Vref Figure 1 VKA=Vref, IK=0.08mA～50mA, (Note 2) f≦1.0kHz 2/6 KIA2431P/S/T/M/AP/AS/AT/AM/BM Example : ΔVref = 5.0mV and slope is positive, Vref at 25℃=1.245V, ΔTa=110℃ αVref = 0.005×106 = 36.5 ppm/℃ 110×1.245 Note 2: The dynamic impedance Zka is defined as: |Zka| = ΔVKA ΔIk * CKA greater than 100nF is needed for stability. When the device is programmed with two external Note 1: resistors, R1 and R2, (refer to Figure 2) the total The deviation parameter ΔVref is defined as the differences dynamic impedance of the circuit is defined as: between the maximum and minimum values obtained over the full operating ambient temperature range that applies. |Zka'| = |Zka| (1+ R1 R2 ) The average temperature coefficient of the Reference input voltage, ΔVref , is defined as: αVref ( ppm ℃ ( )= = ΔVref Vref at 25℃ ) × 106 ΔTa ΔVref × 106 ΔTa(Vref at 25℃) αVref can be positive or negative depending on whether Vref Min. or Vref Max. occurs at the lower ambient temperature. 2011. 7. 6 Revision No : 6 3/6 KIA2431P/S/T/M/AP/AS/AT/AM/BM 2011. 7. 6 Revision No : 6 4/6 KIA2431P/S/T/M/AP/AS/AT/AM/BM 2011. 7. 6 Revision No : 6 5/6 KIA2431P/S/T/M/AP/AS/AT/AM/BM PRECAUTION FOR USE SOLDERING Flat Package (TSM/TSV/SOT-23 Package) Elements mounting styles of electronic devices are gaining in further diversification over recent years, and needs for components are all the more expanding in varieties. Especially, surface mounting is steadily penetrating into industrial segments as a world-wide popular technical trend. Although exposure to high temperature is inevitable during soldering we recommend limiting the soldering temperature to low levels as shown in figure for the sake of retaining inherent excellent reliability. (a) When employing solder reflow method ① Atmospheric temperature around resin surfaces must be less than 240℃, not exceeding the time length of 10 sec. ② Recommend temperature profile ③ Precautions on heating method When resin in kept exposed to high temperature for a long time, device reliability may be marred. Therefore, it is essential to complete soldering in the shortest time possible to prevent temperature of resin from rising. (b) When employing halogen lamps or infrared-ray heaters When halogen lamps or infrared-ray heaters are used, avoid direct irradiation onto resin surfaces; such devices cause extensive localized temperature rise. ※ Please keep a reflow solder operating when TSM/TSV package's soldering. 2011. 7. 6 Revision No : 6 6/6