Emerson Network Power LGA10C-00SADJXJ Embedded power device Datasheet

Technical Reference Note
Embedded Power for
Business-Critical Continuity
SXX06E
Rev. 08.010.6
Page 1 of 2
Rev. 12.07.09
LGA C Series
of 28
LGA C Series
3/6/10/20 A
Total Power: 15-100 Watts
No. of Outputs: Single
Special Features
• 3,6,10 and 20 A output
current rating
• Wide input voltage
range: up to 14 Vdc
• Adjustable output
voltage: 0.59-5.1 V
• Excellent transient
response
• High efficiency
• Output margining
• Power enable
• Minimal airflow
requirement
• Termination voltage
capability
• Ultra compact profile
and footprint
• RoHS compliant
• Remote sense
Standards
Designed to meet EN60950
when utilized in end use
equipment.
International Standards for
Solderability: J-STD-002B
IEC-60068-2-58
Product Family:
Function:
Usage:
LGA C Series
Embedded Power Device
ASIC, Memory, FPGAs, Telecom and
Networking Equipment, Servers,
Industrial Equipment, POL Regulation
Definition:
The LGA C Series is a new high density, non-isolated converter for space sensitive applications. This Embedded Power
Device (EPD) has a wide input range up to14.0 V and offers a
0.59-5.1 V adjustable output with 3, 6, 10 and 20 A capability
without derating. This EPD offers a complete feature set of
of enable, remote sense, and power good inclusive of a wide
adjustable output range.
Technical Reference Note
Embedded Power for
Business-Critical Continuity
Rev. 12.07.09
LGA C Series
of 28
Electrical Description
Electrical Description
The LGA C Series is implemented using a voltage mode
single-phase synchronous buck topology. A block
diagram of the converter is shown in Figure 1.
The output voltage is adjustable over a range of
0.59 - 5.1 V by using a resistor or voltage as described
on Page 5. (Factory preset is 0.591Vout.)
Vin
Trim
Vout
+Sense
-Sense
The converter can be shut down via the remote ON/
OFF. The remote ON/OFF operates with positive logic
that is compatible with popular logic devices. Positive
logic implies that the converter is enabled if the remote ON/OFF input is high (or floating), and disabled if
it is low.
+
-
Fixed Frequency Voltage
Mode Controlled PWM
∩∩∩
Vout
Remote
ON/OFF
GND
PGood
Figure 1 - Electrical Block Diagram
The power good signal is an open collector output that is pulled low by the PWM controller when it
detects the output is not within ±10% of its set value.
The output is monitored for overcurrent and short-circuit conditions. When the PWM controller detects
an overcurrent condition, it forces the module into hiccup mode.
A typical application is shown in Figure 2.
Rofs+
Rofs-
Wide Operating Temperature Range
The LGA C Series's ability to accommodate a wide
range of ambient temperatures is the result of its
extremely high power conversion efficiency and
resultant low power dissipation, combined with
the excellent thermal performance of the
thermally enhanced cover. The maximum output
power that the module delivers will depend on a
number of parameters, primarily:
•
•
•
•
Input voltage range
Output load current
Air velocity (forced or natural convection)
Addition of heatisnk
Rmargin
Margin Control
23
Enable On/Off
12
21
LGA C Series
9-10
5-8
Cin
GND
22
Power Good
Vout
1-4
Ruvlo
Vin
13
15
14
24
+Sense
R
L
O
A
D
Cout
Rtrim
-Sense GND
Figure 2 - Standard Application Drawing
The LGA C Series module has an operating temperature range of -40 °C to 85 °C with suitable derating.
Technical Reference Note
Embedded Power for
Business-Critical Continuity
Rev. 12.07.09
LGA C Series
of 28
Features and Functions
Output Voltage Adjustment
The output voltage on all models is adjustable from 0.59 - 5.1 V.
Undervoltage Lockout
The default undervoltage lockout is set as follows:
LGA 03/06/10C: 2.9 V
LGA20C: 4.3 V
Current Limit and Short-Circuit Protection
The LGA C models have a built-in non-latching current limit function and full continuous short-circuit
protection. The module monitors current through the top and bottom FET. When an overcurrent
condition occurs, the module goes into hiccup mode, where it attempts to power up periodically to
determine if the problem persists.
The output current level is sensed through the voltage drop across the top and bottom FETs during
their on time. This type of sensing is affected by temperature due to the change in Rdson. At higher
temperatures, the Rdson increases, which lowers the overcurrent point.
Note that the module specifications are not guaranteed when the unit is operated in an overcurrent
condition.
Remote ON/OFF
The remote ON/OFF input allows external circuitry to put the LGA C Series converter into a low dissipation
sleep mode. Positive logic remote ON/OFF is available as standard.
The EPD is turned on if the remote ON/OFF pin is high or floating. Pulling the pin low will turn off the EPD. To guarantee turn-on, the enable voltage must be above 0.50 V. To turn off the enable voltage, it must be
pulled below 0.2 V.
Figures illustrating the response of the unit to switching on and off using the remote ON/OFF feature are
included on pages 13, 16, 20 and 25. Figures 3 and 4 show various circuits for driving the remote ON/OFF
feature. The remote ON/OFF input can be driven through a discrete device (e.g. a bipolar signal transistor)
or directly from a logic gate output. The output of the logic gate may be an open-collector (or opendrain) device. Please note the remote ON/OFF pin should only be driven in the following range:
If,
Vin ≤ 5 V, Von/off (max) = Vin
If,
Vin > 5 V, Von/off (max) = 5 V
Technical Reference Note
Embedded Power for
Business-Critical Continuity
Rev. 12.07.09
LGA C Series
of 28
Features and Functions (cont'd)
Remote ON/OFF (cont'd)
LGA C Series
Remote ON/OFF
Vout
Vin
Vout
Vin
LGA C Series
5V
Remote ON/OFF
PGood
PGood
Ground
Ground
Figure 3 - Remote ON/OFF Input Drive Circuit for
Non-Isolated Biopolar
Figure 4 - Remote ON/OFF Input Drive Circuit for
Logic Driver
Power Good
The LGA C modules have a power good indicator output. This output pin uses positive logic and is opencollector. Also, the power good output is able to sink 10 mA.
When the output of the module is within ±10% of the nominal set point, the Power Good pin can be pulled
high. Note that Power Good should not be pulled higher than the following conditions: If,
Vin ≤ 5 V, Vpgood (max) = Vin
If,
Vin > 5 V, Vpgood (max) = 5 V
Current Sink Capabilities
The LGA C series of dc-dc converters is able to current sink as well as current source. The EPD operates
over the full output current range at any specified output voltage. This feature allows the LGA C to fit into
any voltage termination application.
Setting Output Voltage
The output of the module can be adjusted from 0.59 V to 5.1 V. This is accomplished by connecting an
external resistor between Trim and -Sense as shown in Figure 5 and graphed in Figure 8 or by driving the
Trim pin with an external voltage as shown in Figure 6. High accuracy setpoints can be achieved with the
use of a potentiometer as shown in Figure 7.
Technical Reference Note
Embedded Power for
Business-Critical Continuity
Rev. 12.07.09
LGA C Series
of 28
Applications
Setting Output Voltage (cont'd)
Setting Output Voltage (cont'd)
LGA C Series
LGA C Series
Vout
Vout
Vin
Vin
Vt
Trim
Trim
Remote
ON/OFF
Rtrim
Remote
ON/OFF
Rtrim 2
Rtrim 1
-Sense
-Sense
Figure 5 - Output Voltage Trim
Figure 6 - Output Voltage Trim with Voltage Source
The trim equation for the basic configuration shown in Figure 5 is:
Rtrim (kΩ) = 1.182 (Vout - 0.591)
Where Vout is the desired output voltage and Rtrim is the resistance required between the Trim pin and
-Sense.
The trim equation for the external voltage configuration shown in Figure 6 is:
Rtrim2 (kΩ) = Rtrim1 (1.182 - 2Vt)
Rtrim1 (Vout - 0.591) - 1.182
Where Vout is the desired output voltage, Rtrim1 (kΩ) and Rtrim2 (kΩ) are the resistors in Figure 6 and
Vt is the applied external output voltage. Note: If,
Vin ≤ 5 V, Vpin24 (max) = Vin
If,
Vin > 5 V, Vpin24 (max) = 5 V
Technical Reference Note
Embedded Power for
Business-Critical Continuity
Rev. 12.07.09
LGA C Series
of 28
Applications (cont'd)
Setting Output Voltage (cont'd)
The trim equation for the potentiometer configuration show in Figure 7.
0.591
Vout =
(2Rtrim2 + 2Rpot + Rtrim1Rtrim2 + Rtrim1Rpot + 2Rtrim1)
(Rtrim2 + Rpot)Rtrim1 *
Where Vout is the desired output voltage, Rtrim1(kΩ) and Rtrim2(kΩ) are the resistors in Figure 7 and
Rpot is the resistance of the potentiometer.
LGA C Series
Vout
Vin
Trim
Rtrim1
Remote
Rtrim2
Rpot
ON/OFF
-Sense
REQUIRED TRIM RESISTOR (Ω)
1000000
100000
10000
1000
100
10
0
1
2
3
4
5
DESIRED OUTPUT VOLTAGE SETPOINT (V)
Figure 7 - Output Voltage Trim with Potentiometer
Figure 8 - Typical Trim Curves
Undervoltage Lockout
These EPD's have built-in undervoltage lockout to ensure reliable output power. The lockout prevents the
unit from operating when the input voltage is too low. The UVLO for the LGA03/06/10C can be adjusted
with the following equation:
14.8 * 6.81
Ruvlo(kΩ) =
6.81 * Vturn_on - 18.16
The UVLO for the LGA20C can be adjusted with the following equation:
30.1 * 4.22
Ruvlo(kΩ) =
8.577 * Vturn_on - 34.32
Technical Reference Note
Applications (cont'd)
Embedded Power for
Business-Critical Continuity
Rev. 12.07.09
LGA C Series
of 28
Output Capacitance
The LGA C Series has output capacitors inside the converter. Limited output capacitance, 10uF for the 3 A/6A/10A and 50 uF for the 20A, is required for stable operation. When powering loads with large
dynamic current requirements, improved voltage regulation is obtained by inserting low ESR capacitors
as close as possible to the load. Low ESR ceramic capacitors will handle the short duration high
frequency components of the dynamic current requirement. In addition, higher values of electrolytic
capacitors should be used to handle the mid-frequency components.
It is equally important to use good design practices when configuring the dc distribution system. Low
resistance and low inductance PCB layout traces should be utilized, particularly in the high current output
section. Remember that the capacitance of the distribution system and the associated ESR are within the
feedback loop of the power capabilities, thus affecting the stability and dynamic response of the module.
Note that the maximum rated value of output capacitance varies between models and for each output
voltage setpoint. A stability vs. Load Capacitance calculator, (see your sales representative), details how
an external load capacitance influences the gain and phase margins of the LGA C Series modules.
Setting Margin Control
To margin the output voltage up, pull the margin control pin high. To margin down, pull the margin
control pin low. If the pin is left floating, the feature is disabled. The maximum margining range is ±33%
of the output voltage setting, with maximum output at 5.5 V. The equations for margining up and down
are as follows:
Vmargin_up = 0.1182 * Rmargin * Rtrim + 2k
Rtrim
Rofs+
Vmargin_down = 0.1182 * Rmargin * Rtrim + 2k
Rtrim
Rofs
Note: The margin control pin cannot be pulled in the following range:
If, Vin ≤ 5V then Vmargin(max) = Vin
If, Vin > 5V then Vmargin(max) = 5V
See Table 1 for suggested margining values.
Technical Reference Note
Embedded Power for
Business-Critical Continuity
Rev. 12.07.09
LGA C Series
of 28
Applications (cont'd)
Setting Margin Control (cont'd)
Margin Up and Down 5%
Vout_nom (V)
Rtrim (kΩ)
Rmargin (kΩ)
Rofs- (kΩ)
Rofs+ (kΩ)
Vmargin_down (V) Vout _down (V) Vmargin_up (V)
Vout_up (V)
0.9
3.83
2.49
10.0
10.0
0.045
0.855
0.045
0.945
1.2
1.96
2.49
10.0
10.0
0.059
1.141
0.059
1.259
1.8
0.976
2.49
10.0
10.0
0.090
1.710
0.090
1.890
2.5
0.619
2.49
10.0
10.0
0.125
2.375
0.125
2.625
3.3
0.432
2.49
10.0
10.0
0.166
3.134
0.166
3.466
5.0
0.267
2.49
10.0
10.0
0.250
4.750
0.250
5.250
Margin Up and Down 10%
0.9
3.83
4.99
10.0
10.0
0.090
0.810
0.090
0.990
1.2
1.96
4.99
10.0
10.0
0.119
1.081
0.199
1.319
1.8
0.976
4.99
10.0
10.0
0.180
1.620
0.180
1.980
2.5
0.619
4.99
10.0
10.0
0.250
2.250
0.250
2.750
3.3
0.432
4.99
10.0
10.0
0.332
2.968
0.332
3.632
5.0
0.267
4.99
10.0
10.0
0.501
4.499
0.501
5.501
Table 1 - Suggested Margin Values
Water Washing
Water-washing is not recommended.
Interface Finish
Electroless Nickel Immersion Gold (ENIG).
Solder Paste
Solderballs are caused between LGA and substrate due to printing an excessive amount of solderpaste. Stencil apertures should be windowpaned; dividing them into quadrants rather than printing a continuous
deposit over the entire pad. This will control the amount of solder available to form a joint between LGA
and customer board. Additionally, this will also reduce the formation of voids. Solder Paste Window Paning
Figure 9: Window Paning
Figure 10: Window Paning
Technical Reference Note
Embedded Power for
Business-Critical Continuity
Rev. 12.07.09
LGA C Series
of 28
Applications (cont'd)
Recommend Placement Method
Use of a placement machine with front lighting and pad recognition is recommended. For best results,
place the LGA based on the centerpoint of the pad array (case silhouetting is not recommended for
placement).
Reflow Guidelines
For a SnPb process: pads should be above 183 °C (liquidus) for 90 seconds max (60-75 seconds typical)
with a peak temperature of 225 °C. For a leadfree SAC305 process: pads should be above 217 °C (liquidus)
for 90 seconds max (60-75 seconds typical) with a peak temperature of 250 °C. The LGA Series products passed solderability testing per J-STD-002B and IEC-60068-2-58. The test was
conducted by Process Sciences, Inc in August, 2007
Thermal Hotspot
The electrical operating conditions of the LGA (shown below) determine how much power is dissipated
within the converter.
•
Input voltage (Vin)
•
Output voltage (Vo)
•
Output current (Io)
The following parameters further influence the thermal stresses experienced by the converter:
•
Ambient temperature
•
Air velocity
1
•
Thermal efficiency of the end system application
•
Parts mounted on system PCB that may block airflow
•
Real airflow characteristics at the converter location
In order to simplify the thermal design, a number of thermal
derating plots are provided in this Technical Reference Note. These derating graphs show the load current of the LGA
versus the ambient air temperature and forced air velocity.
However, since the thermal performance is heavily dependent
upon the final system application, the user needs to ensure
the thermal reference point temperatures are kept within
the recommended temperature rating. It is recommended
that the thermal reference point temperatures are measured
using a thermocouple or an IR camera. In order to comply
with stringent Emerson Network Power derating criteria the
ambient temperature should never exceed 85 °C. The case
maximum recommended temperature is 100 °C. Please
contact Emerson Network Power for further support.
2
LGAXXX-0XSADJJ
Figure 11: Thermal Hotspots
1: With Heatsink
2: Without Heatsink
Technical Reference Note
Embedded Power for
Business-Critical Continuity
Rev. 12.07.09
LGA C Series
10 of 28
Applications (cont'd)
Heatsink Accessory
System should be reflowed before attaching heatsink. 1. Clean the top surface of the case with isopropyl alcohol and ensure the case surface is air-dried. 2. Remove clear plastic liner from bottom of the heatsink to expose the adhesive. 3. Align heatsink with case and apply even pressure (10-15 PSI) for 10-20 seconds.
Recommended
Air flow direction
Liner
Heatsink Number System with Options
Product Family
LGA
Product
-
HTSK
Product
HTSK = Heatsink
Package
-
KIT
Package
KIT = Heatsink and
Adhesive
Height*
-
XXX
LGA20 + Heatsink
045 = 0.45"
048 = 0.48"
050 = 0.50"
*Height is the total height of the LGA20C-00SADJJ with heatsink attached.
Technical Reference Note
Embedded Power for
Business-Critical Continuity
Rev. 12.07.09
LGA C Series
11 of 28
All Models
Parameter
Test Conditions
Min
Typ
Max
Units
Absolute Maximums
Input Voltage
0
14.0
V
Enable Voltage
0
5
V
Operating Ambient Temperature
-40
85
°C
Non-Operating Ambient Temperature
-40
125
°C
100
°C
0.591
5.1
V
Output Setpoint Accuracy
-1.0
+1.0
%
Output Regulation (Line)
-0.2
+0.2
%
Case Temperature
Output Specifications
Ouput Voltage
Duty Cycle
90
%
Turn On Specifications
Turn On Delay (with Vin)
Turn On Delay (with Enable)
Output Rise TIme
10% - 90%
2
3
ms
2.0
3
ms
1.5
ms
Enable Specifications
Signal Low (Unit Off)
Signal Low Current
Signal High (Unit On)
Signal High Current
0
12 Vin
0
0.4
400
15
Moisture Sensitivity Level
Material Type
1
UL94V-0
3
FR4 PCB
International Standards
Solderability
uA
V
Material Ratings
Flammability
V
J-STD-002B
IEC-60068-2-58
uA
Technical Reference Note
Embedded Power for
Business-Critical Continuity
Rev. 12.07.09
LGA C Series
12 of 28
LGA03C
Parameter
Test Conditions
Min
Internal input capacitance rated 16 Vdc max.
3
Typ
Max
Units
14.0
V
3
A
Input Specifications
Input Voltage
Input Current (Max)
Input Current (No Load)
12.0 Vin, 2.5 Vout, 0 Aout
55
mA
Input Current (Standby)
12.0 Vin, Module disabled
14
mA
10
uF
1
uF
Input Capacitance (Internal)
Input Capacitance (External)
Required for input ripple current
Output Specifications
Output Current
0
Output Capacitance (Internal)
Output Capacitance (External)
Output Ripple/Noise (Peak/Peak)
3
20
A
uF
12 Vin, 0.9 Vout (Startup capacitance)
10
3,000
uF
12 Vin, 2.5 Vout (Startup capacitance)
10
1,100
uF
12 Vin, 5.0 Vout (Startup capacitance)
10
450
uF
5 Vin, 0.9 Vout, 10 uF Cout
15
mV
12 Vin, 2.5 Vout, 10 uF Cout
20
mV
12 Vin, 5 Vout, 10 uF Cout
30
mV
5 Vin, 0.9 Vout, 3 Aout
79.1
%
12 Vin, 2.5 Vout, 3 Aout
86.4
%
12 Vin, 5 Vout, 3 Aout
91.8
%
Dynamic Load Response (Peak Deviation)
12 Vin, 0.9 Vout, 1.5-3 at 5 A/us, 10 uF Cout
85
mV
Dynamic Load Response (Setting Time)
12 Vin, 0.9 Vout, 1.5-3 at 5 A/us, 10 uF Cout
8
us
Dynamic Load Response (Peak Deviation)
12 Vin, 2.5 Vout, 1.5-3 at 5 A/us, 10 uF Cout
95
mV
Dynamic Load Response (Setting Time)
12 Vin, 2.5 Vout, 1.5-3 at 5 A/us, 10 uF Cout
15
us
Hiccup Mode
6
A
Telcordia SR-332, Method II, Parts Stress,
40 °C Ambient, 400 LFM, 100% Load
28,037,062
Hours
0.1
oz
1,000
kHz
3
°C/W
Efficiency
Protection Specification
Over Current Protection
General Specifications
MTBF
Weight
Switching Frequency
Junction to Case Thermal Resistance
Technical Reference Note
Embedded Power for
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Rev. 12.07.09
LGA C Series
13 of 28
LGA03C
Output Current (A)
All Inputs and Outputs
2.50V Efficiency
4
3.8
3.6
3.4
3.2
0.95
3 Vin
5 Vin
7 Vin
12 Vin
13.8 Vin
0.9
3
2.8
2.6
2.4
2.2
2
100 LFM
0.85
0.8
0.75
0
30
35
40
45
50
55
60
65
70
75
80
1
2
3
85
Output Current (A)
Ambient (C)
Figure 12: Thermal Derating Curve for All Inputs and Outputs
Figure 13: 2.5 V Efficiency vs. Load
5.00V Efficiency
1
0.95
7 Vin
12 Vin
13.8 Vin
0.9
0.85
0.8
0
1
2
3
Output Current (A)
Figure 14: 5 V Efficiency vs. Load
Figure 15: Remote On/Off
(Channel 1: Output Voltage, Channel 2: PGood,
Channel 3: Enable)
Figure 16: Typical Output Ripple
Figure 17: Transient Response 100% - 50%
(Channel 4: Current Step at 1 A/div,
Channel 1: Output Voltage Deviation)
Technical Reference Note
LGA03C
Figure 18: Transient Response 50% - 100%
(Channel 4: Current Step at 1 A/div,
Channel 1: Output Voltage Deviation)
Embedded Power for
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Rev. 12.07.09
LGA C Series
14 of 28
Technical Reference Note
Embedded Power for
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Rev. 12.07.09
LGA C Series
15 of 28
LGA06C
Parameter
Test Conditions
Min
Internal input capacitance rated 16 Vdc max.
3
Typ
Max
Units
14.0
V
6
A
Input Specifications
Input Voltage
Input Current (Max)
Input Current (No Load)
12.0 Vin, 2.5 Vout, 0 Aout
94
mA
Input Current (Standby)
12.0 Vin, Module disabled
14
mA
10
uF
1
uF
Input Capacitance (Internal)
Input Capacitance (External)
Required for input ripple current
Output Specifications
Output Current
0
Output Capacitance (Internal)
Output Capacitance (External)
Output Ripple/Noise (Peak/Peak)
6
20
A
uF
12 Vin, 0.9 Vout (Startup capacitance)
10
7,500
uF
12 Vin, 2.5 Vout (Startup capacitance)
10
1,500
uF
12 Vin, 5.0 Vout (Startup capacitance)
10
750
uF
5 Vin, 0.9 Vout, 10 uF Cout
20
mV
12 Vin, 2.5 Vout, 10 uF Cout
35
mV
12 Vin, 5 Vout, 10 uF Cout
50
mV
5 Vin, 0.9 Vout, 6 Aout
80.1
%
12 Vin, 2.5 Vout, 6 Aout
86.5
%
12 Vin, 5 Vout, 6 Aout
92.1
%
Dynamic Load Response (Peak Deviation)
12 Vin, 0.9 Vout, 3-6 at 5 A/us, 10 uF Cout
125
mV
Dynamic Load Response (Setting Time)
12 Vin, 0.9 Vout, 3-6 at 5 A/us, 10 uF Cout
8
us
Dynamic Load Response (Peak Deviation)
12 Vin, 2.5 Vout, 3-6 at 5 A/us, 10 uF Cout
175
mV
Dynamic Load Response (Setting Time)
12 Vin, 2.5 Vout, 3-6 at 5 A/us, 10 uF Cout
8
us
Hiccup Mode
11
A
Telcordia SR-332, Method II, Parts Stress,
40 °C Ambient, 400 LFM, 100% Load
27,141,984
Hours
0.1
oz
1,000
kHz
3
°C/W
Efficiency
Protection Specification
Over Current Protection
General Specifications
MTBF
Weight
Switching Frequency
Junction to Case Thermal Resistance
Technical Reference Note
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Rev. 12.07.09
LGA C Series
16 of 28
LGA06C
Output Current (A)
All Inputs and Outputs
2.50V Efficiency
6.1
6.08
6.06
6.04
6.02
0.95
3 Vin
5 Vin
7 Vin
12 Vin
13.8 Vin
0.9
6
5.98
5.96
5.94
5.92
5.9
30
100 LFM
0.85
0.8
35
40
45
50
55
60
65
70
75
80
0
85
2
4
6
Output Current (A)
Ambient (C)
Figure 19: Thermal Derating Curve for All Inputs and Outputs
Figure 20: 2.5 V Efficiency vs. Load
5.01V Efficiency
1
0.95
7 Vin
12 Vin
13.8 Vin
0.9
0.85
0.8
0
2
4
6
Figure 21: 5 V Efficiency vs. Load
Figure 22: Remote On/Off
(Channel 1: Output Voltage, Channel 2: PGood,
Channel 3: Enable)
Figure 23: Typical Output Ripple
Figure 24: Transient Response 100% - 50%
(Channel 4: Current Step at 2 A/div,
Channel 1: Output Voltage Deviation)
Technical Reference Note
LGA06C
Figure 25: Transient Response 50% - 100%
(Channel 4: Current Step at 2 A/div,
Channel 1: Output Voltage Deviation)
Embedded Power for
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LGA C Series
17 of 28
Technical Reference Note
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LGA C Series
18 of 28
LGA10C
Parameter
Test Conditions
Min
Internal input capacitance rated 16 Vdc max.
3
Typ
Max
Units
14.0
V
10
A
Input Specifications
Input Voltage
Input Current (Max)
Input Current (No Load)
12.0 Vin, 2.5 Vout, 0 Aout
100
mA
Input Current (Standby)
12.0 Vin, Module disabled
14
mA
10
uF
1
uF
Input Capacitance (Internal)
Input Capacitance (External)
Required for input ripple current
Output Specifications
Output Current
0
Output Capacitance (Internal)
Output Capacitance (External)
Output Ripple/Noise (Peak/Peak)
10
20
A
uF
12 Vin, 0.9 Vout (Startup capacitance)
10
7,500
uF
12 Vin, 2.5 Vout (Startup capacitance)
10
2,400
uF
12 Vin, 5.0 Vout (Startup capacitance)
10
1,200
uF
5 Vin, 0.9 Vout, 10 uF Cout
30
mV
12 Vin, 2.5 Vout, 10 uF Cout
40
mV
12 Vin, 5 Vout, 10 uF Cout
45
mV
5 Vin, 0.9 Vout, 10 Aout
76.6
%
12 Vin, 2.5 Vout, 10 Aout
85.9
%
12 Vin, 5 Vout, 10 Aout
91.7
%
Dynamic Load Response (Peak Deviation)
12 Vin, 0.9 Vout, 5-10 at 5 A/us, 10 uF Cout
90
mV
Dynamic Load Response (Setting Time)
12 Vin, 0.9 Vout, 5-10 at 5 A/us, 10 uF Cout
8
us
Dynamic Load Response (Peak Deviation)
12 Vin, 2.5 Vout, 5-10 at 5 A/us, 10 uF Cout
135
mV
Dynamic Load Response (Setting Time)
12 Vin, 2.5 Vout, 5-10 at 5 A/us, 10 uF Cout
8
us
Hiccup Mode
20
A
Telcordia SR-332, Method II, Parts Stress,
40 °C Ambient, 400 LFM, 100% Load
27,141,984
Hours
0.1
oz
1,000
kHz
9
°C/W
Efficiency
Protection Specification
Over Current Protection
General Specifications
MTBF
Weight
Switching Frequency
Junction to Case Thermal Resistance
Technical Reference Note
Embedded Power for
Business-Critical Continuity
Rev. 12.07.09
LGA C Series
19 of 28
LGA10C
0.9V 5Vin
10
9.5
9
8.5
8
100LF M
200LF M
7.5
7
6.5
6
5.5
5
300LF M
400LF M
30
40
50
60
70
Output Current (A)
Output Current (A)
0.9V 3.3Vin
10
9.5
9
8.5
8
7.5
7
6.5
6
5.5
5
80
100LF M
30
40
50
0.9V 12Vin
2.5V 3.3Vin
200LF M
9
8.8
8.6
8.4
8.2
8
300LF M
400LF M
40
50
60
70
10
9.5
9
8.5
8
7.5
7
6.5
100LF M
200LF M
300LF M
400LF M
6
5.5
5
80
30
40
50
Ambient (C)
60
70
80
Ambient (C)
Figure 28: Thermal Derating Curve - 0.9 V
Figure 29: Thermal Derating Curve - 2.5 V
2.5V 5Vin
2.5V 12Vin
10
9.5
9
8.5
8
7.5
7
6.5
100LF M
200LF M
300LF M
400LF M
6
5.5
5
40
50
60
70
80
Ambient (C)
Figure 30: Thermal Derating Curve - 2.5 V
Output Current (A)
Output Current (A)
80
Figure 27: 2 Thermal Derating Curve - 0.9 V
100LF M
30
70
Figure 26: Thermal Derating Curve - 0.9 V
10
9.8
9.6
9.4
9.2
30
60
Ambient (C)
Output Current (A)
Output Current (A)
Ambient (C)
10
9.8
9.6
9.4
9.2
100LF M
200LF M
9
8.8
8.6
8.4
8.2
8
300LF M
400LF M
30
40
50
60
70
80
Ambient (C)
Figure 31: Thermal Derating Curve - 2.5 V
Technical Reference Note
Embedded Power for
Business-Critical Continuity
Rev. 12.07.09
LGA C Series
20 of 28
Output Current (A)
5V 12Vin
2.5V Efficiency
10
9.8
9.6
0.95
9.4
9.2
9
8.8
8.6
100LF M
200LF M
300LF M
400LF M
8.4
8.2
8
3 Vin
5 Vin
7 Vin
12 Vin
13.8 Vin
0.9
0.85
0.8
30
40
50
60
70
0
80
5
10
Output Current (A)
Ambient (C)
Figure 32: Thermal Derating Curve - 5 V
Figure 33: 2.5 V Efficiency vs. Load
5.0V Efficiency
1
7 Vin
12 Vin
13.8 Vin
0.95
0.9
0.85
0
5
10
Output Current (A)
Figure 34: 5 V Efficiency vs. Load
Figure 36: Typical Output Ripple
Figure 35: Remote On/Off
(Channel 1: Output Voltage, Channel 2: PGood,
Channel 3: Enable)
Figure 37: Transient Response 100% - 50%
(Channel 1: Output Voltage Deviation,
Channel 2: Current Step at 2 A/div)
Technical Reference Note
LGA10C
Figure 38: Transient Response 50% - 100%
(Channel 1: Output Voltage Deviation,
Channel 2: Current Step at 2 A/div)
Embedded Power for
Business-Critical Continuity
Rev. 12.07.09
LGA C Series
21 of 28
Technical Reference Note
Embedded Power for
Business-Critical Continuity
Rev. 12.07.09
LGA C Series
22 of 28
LGA20C
Parameter
Test Conditions
Min
Internal input capacitance rated 16 Vdc max.
4.5
Typ
Max
Units
14.0
V
20
A
Input Specifications
Input Voltage
Input Current (Max)
Input Current (No Load)
12.0 Vin, 2.5 Vout, 0 Aout
87
mA
Input Current (Standby)
12.0 Vin, Module disabled
13
mA
10
uF
10
uF
Input Capacitance (Internal)
Input Capacitance (External)
Required for input ripple current
Output Specifications
Output Current
0
Output Capacitance (Internal)
Output Capacitance (External)
Output Ripple/Noise (Peak/Peak)
20
20
A
uF
12 Vin, 0.9 Vout (Startup capacitance)
50
7,500
uF
12 Vin, 2.5 Vout (Startup capacitance)
50
2,400
uF
12 Vin, 5.0 Vout (Startup capacitance)
50
500
uF
5 Vin, 0.9 Vout, 10 uF Cout
25
mV
12 Vin, 2.5 Vout, 10 uF Cout
45
mV
12 Vin, 5 Vout, 10 uF Cout
70
mV
5 Vin, 0.9 Vout, 20 Aout
77.3
%
12 Vin, 2.5 Vout, 20 Aout
86.6
%
12 Vin, 5 Vout, 20 Aout
91.2
%
Dynamic Load Response (Peak Deviation)
12 Vin, 0.9 Vout, 10-20 at 5 A/us, 50 uF Cout
95
mV
Dynamic Load Response (Setting Time)
12 Vin, 0.9 Vout, 10-20 at 5 A/us, 50 uF Cout
12
us
Dynamic Load Response (Peak Deviation)
12 Vin, 2.5 Vout, 10-20 at 5 A/us, 50 uF Cout
175
mV
Dynamic Load Response (Setting Time)
12 Vin, 2.5 Vout, 10-20 at 5 A/us, 50 uF Cout
20
us
Hiccup Mode
27
A
Telcordia SR-332, Method II, Parts Stress,
40 °C Ambient, 400 LFM, 100% Load
28,388,596
Hours
Weight
0.1
oz
Switching Frequency
800
kHz
2
°C/W
Efficiency
Protection Specification
Over Current Protection
General Specifications
MTBF
Junction to Case Thermal Resistance
Technical Reference Note
Embedded Power for
Business-Critical Continuity
Rev. 12.07.09
LGA C Series
23 of 28
LGA20C
0.9Vout 12Vin
20
20
18
18
16
14
100LF M
12
200LF M
10
300LF M
8
400LF M
6
Output Current (A)
Output Current (A)
0.9Vout 5Vin
16
14
100LFM
12
200LFM
10
300LFM
8
400LFM
6
4
4
2
2
30
40
50
60
70
30
80
40
50
Figure 39: Thermal Derating Curve (5 Vin - 0.9 Vout)
80
2.5Vout 12Vin
20
20
18
18
16
14
100LF M
12
200LF M
10
300LF M
8
400LF M
6
Output Current (A)
Output Current (A)
70
Figure 40: Thermal Derating Curve (12 Vin - 0.9 Vout)
2.5Vout 5Vin
16
14
100LFM
12
200LFM
10
300LFM
8
400LFM
6
4
4
2
2
30
40
50
60
70
30
80
40
50
60
70
80
Ambient (C)
Ambient (C)
Figure 41: Thermal Derating Curve (5 Vin - 2.5 Vout)
Figure 42: Thermal Derating Curve (12 Vin - 2.5 Vout)
5Vout 12Vin
0.9Vout 5Vin
20
20
18
18
16
14
100LF M
12
200LF M
10
300LF M
8
400LF M
6
4
Output Current (A)
Output Current (A)
60
Ambient (C)
Ambient (C)
16
14
12
100LFM
10
200LFM
8
6
4
2
2
30
40
50
60
70
80
Ambient (C)
Figure 43: Thermal Derating Curve (12 Vin - 5 Vout)
30
40
50
60
70
80
Ambient (C)
Figure 44: Thermal Derating Curve (5 Vin - 0.9 Vout)
with 0.5" Heatsink
Technical Reference Note
Embedded Power for
Business-Critical Continuity
Rev. 12.07.09
LGA C Series
24 of 28
LGA20C
2.5Vout 5Vin
20
20
18
18
16
16
14
100LFM
12
200LFM
10
300LFM
8
6
Output Current (A)
Output Current (A)
0.9Vout 12Vin
14
100LFM
12
200LFM
10
300LFM
8
400LFM
6
4
4
2
2
30
40
50
60
70
30
80
40
50
70
80
Figure 46: Thermal Derating Curve (5 Vin - 2.5 Vout)
with 0.5" Heatsink
Figure 45: Thermal Derating Curve (12 Vin - 0.9 Vout)
with 0.5" Heatsink
2.5Vout 12Vin
5Vout 12Vin
20
20
18
18
16
14
100LFM
12
200LFM
10
300LFM
8
400LFM
6
4
Output Current (A)
Output Current (A)
60
Ambient (C)
Ambient (C)
16
14
100LFM
12
200LFM
10
300LFM
8
400LFM
6
4
2
2
30
40
50
60
70
80
30
40
50
Ambient (C)
60
70
80
Ambient (C)
Figure 47: Thermal Derating Curve (12 Vin - 2.5 Vout)
with 0.5" Heatsink
Figure 48: Thermal Derating Curve (12 Vin - 5 Vout)
with 0.5" Heatsink
2.51V Efficiency
5.06V Efficiency
0.95
1
5 Vin
7 Vin
12 Vin
13.8 Vin
0.9
0.85
0.8
0.95
7 Vin
12 Vin
13.8 Vin
0.9
0.85
0.8
0.75
0
5
10
15
20
Output Current (A)
Figure 49: 2.5 V Efficiency vs. Load
0
5
10
15
20
Output Current (A)
Figure 50: 5 V Efficiency vs. Load
Technical Reference Note
Embedded Power for
Business-Critical Continuity
Rev. 12.07.09
LGA C Series
25 of 28
LGA20C
Figure 51: Remote On/Off
(Channel 1: Output Voltage, Channel 2: PGood,
Channel 3: Enable)
Figure 52: Typical Output Ripple
Figure 53 Transient Response 50% - 100%
(Channel 1: Output Voltage Deviation,
Channel 4: Current Step at 5 A/div )
Figure 54: Transient Response 100% - 50%
(Channel 1: Output Voltage Deviation,
Channel 4: Current Step at 5 A/div)
Technical Reference Note
Embedded Power for
Business-Critical Continuity
Rev. 12.07.09
LGA C Series
26 of 28
Mechanical drawings
.139 3.53
MAX
SECTION A-A
SCALE 4 : 1
A
A.139
3.53
MAX
A
.020±.003 0.51±0.08
SECTION A-A
SCALE 4 : 1
A
.031 0.79
PCB .020
REF ±.003 0.51±0.08
.102 2.59
REF
A
Component Height
.031 0.79
PCB REF
Model #
DIM A in (mm)
.102 2.59
REF
A
.650 16.51
MAX
.650 16.51
MAX
A
.008 A
.650 16.51
MAX
LGA03
LGA06
LGA10
0.129 (3.27)
LGA20
0.210 (5.33)
.008 A
.650 16.51
MAX
Recommended Application
System Board Footprint
Solder Paste Stencil
PIN 16
PIN 1
PIN 4
0 (0)
MODULE OUTLINE
0.690 (17.53)
0.564 (14.33)
0.418 (10.62)
0.272 (6.91)
0.126 (3.20)
0 (0)
0 (0)
0 0
.049 1.24
.098 2.49
.147 3.73
.245 6.22
.294 7.47
.196 4.98
.045 1.14
.090 2.29
.114 2.90
.177 4.50
0.114" X 0.104"
2X
.135 3.43
.024 0.61
.180 4.57
.225 5.72
0.114" X 0.114"
8X
.317 8.05
.487 12.37
.114 2.90
.114 2.90
KEEP OUT AREA
Tolerance Note: ± 0.010 (0.25)
.048 1.22
PIN 9
.024 0.61
.340 8.64
PIN 15 0.612 (15.55)
0.567 (14.40)
0.522 (13.26)
0.477 (12.12)
0.432 (10.97)
0.387 (9.83)
PIN 11
PIN 8
0.295 (7.50) PIN 5
8X .120 X .120
.343 8.71
.042 1.07
0.570 (14.48) PIN 10
0.125 (3.18)
0.024" X.024"
14X
13X
.104 2.64
0 0
0.690 (17.53)
0.435 (11.05)
.392 9.96
.487 12.37
14X .025 X .025
PIN 24
.194 4.93
2X .120 X .110
0.220 (5.59)
0.269 (6.83)
0.318 (8.08)
0.367 (9.32)
0.416 (10.57)
0.465 (11.81)
0.514 (13.06)
0.563 (14.30)
0.612 (15.54)
0 (0)
Recommend Stencil thickness of 6 mil
(see window paning on page 9)
Technical Reference Note
Embedded Power for
Business-Critical Continuity
Rev. 12.07.09
LGA C Series
27 of 28
Packaging
LGA03C, 06C, 10C
EIA DIMENSIONS
W
32.0 ±0.30
E
1.75 ±0.10
F
14.2 ±0.10
So
28.4 ±0.10
P
24.0 ±0.10
Po
4.0 ±0.10
P2
2.0 ±0.10
Do
Ø 1.5 +0.10 -0.00
D1
Ø 2.0 MIN
T
0.40 ±0.05
Ao
16.6 ±0.10
Bo
16.7 ±0.10
Ko
3.7 ±0.10
LGA20C
LGA20C
EIA DIMENSIONS
Notes:
a)
b)
c)
d)
e)
T&R packaging comes in Standard 13" reel size.
Tape material: Black, Anti-static Polystyrene Amine free.
Surface Resistivity: <1012 Ohms/Sq
Module quanity/reel:
LGA03C, LGA06C, LGA10 C
= 600 pcs
LGA20C
= 450pcs.
Products are MSL 3.
W
32.0 ±0.30
E
1.75 ±0.10
F
14.2 ±0.10
So
28.4 ±0.10
P
24.0 ±0.10
Po
4.0 ±0.10
P2
2.0 ±0.10
Do
Ø 1.5 +0.10 -0.00
D1
Ø 2.0 MIN
T
0.40 ±0.05
Ao
16.8 ±0.10
Bo
16.8 ±0.10
Ko
5.8 ±0.10
Technical Reference Note
Embedded Power for
Business-Critical Continuity
Rev. 12.07.09
LGA C Series
28 of 28
Model Number System with Options
Product Family
Rated Output
Current
LGA
Land Grid
Array
Performance
XX
C
Rated Output
Current
03 = 3 Amp
06 = 6 Amp
10 = 10 Amp
20 = 20 Amp
Performance
C = Cost
Optimized
Input Voltage
-
Type of Output
­Americas
Options
RoHS Compliance
XX
SADJ
X
J
Input Voltage
00 = 3-14.0 V
01 = 4.5-14.0 V
Type of Output
Single
Adjustable
Output
Options
X = Various
Options
(see Sales Rep)
RoHS Compliance
J = Pb free (RoHS
6/6 compliant)
LGA
Package
Product
-
HTSK -
Land Grid
Array
Product
HTSK = Heatsink
KIT
Asia (HK)
Height*
-
Package
Heatsink and
Adhesive
XXX
16th - 17th Floors, Lu Plaza
2 Wing Yip Street, Kwun Tong
Kowloon, Hong Kong
Telephone: +852 2176 3333
Facsimile: +852 2176 3888
LGA20 + Heatsink
045 = 0.45"
048 = 0.48"
050 = 0.50"
*Height is the total height of the LGA20C-00SADJJ with heatsink attached.
For global contact, visit:
Operating Information
Output
Power
(Max.)
Input
Voltage
Europe (UK)
Waterfront Business Park
Merry Hill, Dudley
West Midlands, DY5 1LX
United Kingdom
Telephone: +44 (0) 1384 842 211
Facsimile: +44 (0) 1384 843 355
Heatsink Number System with Options
Product Family
5810 Van Allen Way
Carlsbad, CA 92008
USA
Telephone: +1 760 930 4600
Facsimile: +1 760 930 0698
Output
Voltage
Output
Current
(Min.)
Output
Current
(Max.)
Efficiency
(Typical)
Regulation
Load
Standard
Model
Numbers
15 W
3-14.0 Vdc
0.59-5.1 Vdc
0A
3A
92%
±0.5%
LGA03C-00SADJJ
30 W
3-14.0 Vdc
0.59-5.1 Vdc
0A
6A
92%
±0.5%
LGA06C-00SADJJ
50 W
3-14.0 Vdc
0.59-5.1 Vdc
0A
10 A
92%
±0.5%
LGA10C-00SADJJ
100 W
4.5-14.0 Vdc
0.59-5.1 Vdc
0A
20 A
91%
±0.5%
LGA20C-01SADJJ
NA
NA
NA
NA
NA
NA
NA
LGA-HTSK-KIT-XXX
www.PowerConversion.com
techsupport.embeddedpower
@emerson.com
While every precaution has been taken to ensure
accuracy and completeness in this literature, Emerson
Network Power assumes no responsibility, and disclaims
all liability for damages resulting from use of this
information or for any errors or omissions.
Emerson Network Power.
The global leader in enabling
business-critical continuity.
AC Power
Pin Chart
Connectivity
Pin Assignments
Embedded Computing
Single Output
1
Vout
2
Vout
3
Vout
4
Vout
5
GND
6
GND
7
GND
8
GND
Embedded Power
DC Power
9
10
11
12
13
14
15
16
This is a Preliminary Datasheet. Emerson
Network Power reserves the right to make
changes to the information contained herein
without notice and assumes no liability as a
result of its use or application.
Vin
Vin
NC
- Offset
+ Offset
- Sense
+ Sense
NC
17
18
19
20
21
22
23
24
NC
NC
NC
NC
Enable
Power Good
Margin Control
Trim
Monitoring
Outside Plant
Power Switching & Controls
Precision Cooling
Racks & Integrated Cabinets
Services
Surge Protection
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