DATA SHEET LL4148/ LL4448/ LL914B SEMICONDUCTOR 500 mW LL-34 Hermetically Sealed Glass Fast Switching Diodes Absolute Maximum Ratings Symbol PD TSTG TA = 25°C unless otherwise noted Parameter Value Units 500 mW -65 to +200 °C +175 °C 75 V Power Dissipation Storage Temperature Range TJ Operating Junction Temperature WIV Working Inverse Voltage IO Average Rectified Current 150 mA IFM Non-repetitive Peak Forward Current 450 mA 2 A IFSURGE Peak Forward Surge Current SURFACE MOUNT LL34 DEVICE MARKING DIAGRAM These ratings are limiting values above which the serviceability of the diode may be impaired. Cathode Band Color : Black Specification Features: Fast Switching Device (TRR <4.0 nS) LL-34 (Mini-MELF) Package Surface Device Type Mounting Anode Cathode Hermetically Sealed Glass Compression Bonded Construction All external surfaces are corrosion resistant and leads are readily solderable ELECTRICAL SYMBOL 1st band indicates negative polarity Electrical Characteristics TA = 25°C unless otherwise noted Parameter Symbol Limits Test Condition Min BV IR VF Breakdown Voltage Reverse Leakage Current Forward Voltage LL4448, LL914B 100 IR=5µA 75 LL4448, LL914B Reverse Recovery Time Volts VR=20V 25 nA VR=75V 5 µA IF=5mA TCLL4148, LL4148 TRR IR=100µA Unit Max 0.62 0.72 IF=10mA 1.0 IF=100mA 1.0 Volts IF=IR=10mA RL=100Ω 4 nS 4 pF IRR=1mA C Capacitance http://www.yeashin.com VR=0V, f=1MHZ 1 REV.03 20140409 DEVICE CHARACTERISTICS 1000 10,000 100 IR, LEAKAGE CURRENT (nA) IF, INSTANTANEOUS FORWARD CURRENT (mA) LL4148/ LL4448/ LL914B 10 1.0 0.1 1000 100 10 VR = 20V 1 0.01 0 1 2 0 100 200 Tj, JUNCTION TEMPERATURE (°C) Fig. 2, Leakage Current vs Junction Temperature VF, INSTANTANEOUS FORWARD VOLTAGE (V) Fig. 1 Forward Characteristics Electrical Symbol Definition Typical Characteristics I Symbol Parameter (mA) IF BV Breakdown Voltage @ IR IR Reverse Leakage Current @ VR BV VR Reverse Voltage IF Forward Current VF Forward Voltage @ IF (V) (mV) VR IR VF V IR (nA) (µA) LL34 (Mini-MELF) Tape Packaging Standards This standard practices for surface-mount tape packaging of leadless (Mini-MELF) components meets the requirements of EIA Standard RS-481-A. http://www.yeashin.com 2 REV.03 20140409 PACKAGE OUTLINE & DIMENSIONS LL4148/ LL4448/ LL914B LL-34 SOLDERABLE END .020(0.5) .012(0.3) .063(1.6) I .055(1.4) 146 (3.7) .130(3.3) CATHODE BAND Unit:inch(mm) http://www.yeashin.com 3 REV.03 20140409