LM2940-N, LM2940C www.ti.com SNVS769I – MARCH 2000 – REVISED APRIL 2013 LM2940-N/LM2940C 1A Low Dropout Regulator Check for Samples: LM2940-N, LM2940C FEATURES DESCRIPTION • • • • • • • The LM2940-N/LM2940C positive voltage regulator features the ability to source 1A of output current with a dropout voltage of typically 0.5V and a maximum of 1V over the entire temperature range. Furthermore, a quiescent current reduction circuit has been included which reduces the ground current when the differential between the input voltage and the output voltage exceeds approximately 3V. The quiescent current with 1A of output current and an input-output differential of 5V is therefore only 30 mA. Higher quiescent currents only exist when the regulator is in the dropout mode (VIN − VOUT ≤ 3V). 1 2 Dropout Voltage Typically 0.5V @IO = 1A Output Current in Excess of 1A Output Voltage Trimmed Before Assembly Reverse Battery Protection Internal Short Circuit Current Limit Mirror Image Insertion Protection P+ Product Enhancement Tested Designed also for vehicular applications, the LM2940N/LM2940C and all regulated circuitry are protected from reverse battery installations or 2-battery jumps. During line transients, such as load dump when the input voltage can momentarily exceed the specified maximum operating voltage, the regulator will automatically shut down to protect both the internal circuits and the load. The LM2940/LM2940C cannot be harmed by temporary mirror-image insertion. Familiar regulator features such as short circuit and thermal overload protection are also provided. Typical Application *Required if regulator is located far from power supply filter. **COUT must be at least 22 μF to maintain stability. May be increased without bound to maintain regulation during transients. Locate as close as possible to the regulator. This capacitor must be rated over the same operating temperature range as the regulator and the ESR is critical; see curve. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2000–2013, Texas Instruments Incorporated LM2940-N, LM2940C SNVS769I – MARCH 2000 – REVISED APRIL 2013 www.ti.com Connection Diagrams Figure 1. TO-220 (NDE) Plastic Package Front View See Package Number NDE0003B Figure 2. SOT-223 (DCY) 3-Lead Front View See Package Number DCY0004A Figure 3. 16-Lead CDIP (NFE) Top View See Package Number NFE0016A Figure 4. 16-Lead CLGA (NAC) Top View See Package Number NAC0016A Figure 5. DDPAK/ TO-263 (KTT) Top View Figure 6. Side View See Package Number KTT0003B N/C 1 GND 2 8 N/C 7 GND GND INPUT 3 6 VOUT N/C 4 5 VOUT Pin 2 and pin 7 are fused to center DAP Pin 5 and 6 need to be tied together on PCB board Figure 7. WSON (NGN) 8-Lead Top View See Package Number NGN0008A These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 2 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM2940-N LM2940C LM2940-N, LM2940C www.ti.com SNVS769I – MARCH 2000 – REVISED APRIL 2013 Absolute Maximum Ratings (1) (2) LM2940-N KTT, NFE, NAC, NDE, DCY ≤ 100 ms 60V LM2940C KTT, NDE ≤ 1 ms 45V Internal Power Dissipation (3) Internally Limited Maximum Junction Temperature 150°C −65°C ≤ TJ ≤ +150°C Storage Temperature Range Soldering Temperature ESD Susceptibility (1) (2) (3) (4) (5) (4) TO-220 (NDE), Wave 260°C, 10s DDPAK/ TO-263 (KTT) 235°C, 30s SOT-223 (DCY) 260°C, 30s WSON-8 (NGN) 235°C, 30s (5) 2 kV Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are conditions under which the device functions but the specifications might not be ensured. For ensured specifications and test conditions see the Electrical Characteristics. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. The maximum allowable power dissipation is a function of the maximum junction temperature, TJ, the junction-to-ambient thermal resistance, θJA, and the ambient temperature, TA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. The value of θJA (for devices in still air with no heatsink) is 60°C/W for the TO-220 package, 80°C/W for the DDPAK/TO-263 package, and 174°C/W for the SOT-223 package. The effective value of θJA can be reduced by using a heatsink (see Application Hints for specific information on heatsinking). The value of θJA for the WSON package is specifically dependent on PCB trace area, trace material, and the number of layers and thermal vias. For improved thermal resistance and power dissipation for the WSON package, refer to Application Note AN-1187 (SNOA401). It is recommended that 6 vias be placed under the center pad to improve thermal performance. Refer to JEDEC J-STD-020C for surface mount device (SMD) package reflow profiles and conditions. Unless otherwise stated, the temperature and time are for Sn-Pb (STD) only. ESD rating is based on the human body model, 100 pF discharged through 1.5 kΩ. Operating Conditions (1) Input Voltage 26V LM2940-N NDE, LM2940-N KTT LM2940C NDE, LM2940C KTT Temperature Range (1) LM2940-N DCY −40°C ≤ TJ ≤ 125°C 0°C ≤ TJ ≤ 125°C −40°C ≤ TA ≤ 85°C LM2940-N NFE, LM2940-N NAC −55°C ≤ TJ ≤ 125°C LM2940-N NGN −40°C ≤ TJ ≤ 125°C Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are conditions under which the device functions but the specifications might not be ensured. For ensured specifications and test conditions see the Electrical Characteristics. Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM2940-N LM2940C Submit Documentation Feedback 3 LM2940-N, LM2940C SNVS769I – MARCH 2000 – REVISED APRIL 2013 www.ti.com Electrical Characteristics VIN = VO + 5V, IO = 1A, CO = 22 μF, unless otherwise specified. Boldface limits apply over the entire operating temperature range of the indicated device. All other specifications apply for TA = TJ = 25°C. Output Voltage (VO) Parameter Output Voltage 5V Conditions Typ 5 mA ≤ IO ≤ 1A 8V LM2940N/883 Limit (2) Typ LM2940-N Limit (1) 8.00 7.76/7.60 7.76/7.60 VMIN 8.24/8.40 8.24/8.40 VMAX 6.25V ≤ VIN ≤ 26V 5.00 LM2940N/883 Limit (2) Units 9.4V ≤ VIN ≤ 26V 4.85/4.75 4.85/4.75 5.15/5.25 5.15/5.25 20 50 40/50 20 80 50/80 mVMAX LM2940-N, LM2940-N/883 35 50/80 50/100 55 80/130 80/130 mVMAX LM2940C 35 50 55 80 1000/1000 mΩ Line Regulation VO + 2V ≤ VIN ≤ 26V, IO = 5 mA Load Regulation 50 mA ≤ IO ≤ 1A Output Impedance LM2940-N Limit (1) 100 mADC and 20 mArms, 35 1000/1000 55 15/20 10 15/20 15/20 mAMAX 50/60 30 45/60 50/60 mAMAX 700/700 240 1000/1000 μVrms fO = 120 Hz Quiescent Current VO +2V ≤ VIN ≤ 26V, IO = 5 mA LM2940-N, LM2940-N/883 10 15/20 LM2940C 10 15 VIN = VO + 5V, 30 45/60 IO = 1A Output Noise Voltage 10 Hz − 100 kHz, 150 IO = 5 mA Ripple Rejection fO = 120 Hz, 1 Vrms, IO = 100 mA LM2940-N 72 60/54 LM2940C 72 60 fO = 1 kHz, 1 Vrms, 66 54/48 66 54 60/50 dBMIN 54/48 dBMIN IO = 5 mA Long Term Stability 20 32 mV/ 1000 Hr Dropout Voltage IO = 1A 0.5 0.8/1.0 0.7/1.0 0.5 0.8/1.0 0.7/1.0 VMAX IO = 100 mA 110 150/200 150/200 110 150/200 150/200 mVMAX 1.9 1.6 1.5/1.3 1.9 1.6 1.6/1.3 AMIN 75 60/60 75 60/60 (3) Short Circuit Current See Maximum Line Transient RO = 100Ω LM2940-N, T ≤ 100 ms LM2940-N/883, T ≤ 20 ms LM2940C, T ≤ 1 ms Reverse Polarity DC Input Voltage (1) (2) (3) 4 40/40 55 45 LM2940-N, LM2940-N/883 −30 −15/−15 LM2940C −30 −15 40/40 55 45 −30 −15/−15 −30 −15 VMIN RO = 100Ω −15/−15 −15/−15 VMIN All limits are specified at TA = TJ = 25°C only (standard typeface) or over the entire operating temperature range of the indicated device (boldface type). All limits at TA = TJ = 25°C are 100% production tested. All limits at temperature extremes are specified via correlation using standard Statistical Quality Control methods. All limits are specified at TA = TJ = 25°C only (standard typeface) or over the entire operating temperature range of the indicated device (boldface type). All limits are 100% production tested and are used to calculate Outgoing Quality Levels. Output current will decrease with increasing temperature but will not drop below 1A at the maximum specified temperature. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM2940-N LM2940C LM2940-N, LM2940C www.ti.com SNVS769I – MARCH 2000 – REVISED APRIL 2013 Electrical Characteristics (continued) VIN = VO + 5V, IO = 1A, CO = 22 μF, unless otherwise specified. Boldface limits apply over the entire operating temperature range of the indicated device. All other specifications apply for TA = TJ = 25°C. Output Voltage (VO) Parameter 5V Conditions Reverse Polarity Transient Input Voltage Typ LM2940-N Limit (1) −75 −50/−50 −55 −45/−45 8V LM2940N/883 Limit (2) Typ LM2940-N Limit (1) −75 −50/−50 LM2940N/883 Limit (2) Units RO = 100Ω LM2940-N, T ≤ 100 ms LM2940-N/883, T ≤ 20 ms LM2940C, T ≤ 1 ms VMIN −45/−45 −45/−45 Electrical Characteristics VIN = VO + 5V, IO = 1A, CO = 22 μF, unless otherwise specified. Boldface limits apply over the entire operating temperature range of the indicated device. All other specifications apply for TA = TJ = 25°C. Output Voltage (VO) 9V 10V LM2940-N Parameter Conditions Typ Limit LM2940-N Typ (1) 5 mA ≤ IO ≤1A 9.00 8.73/8.55 11.5V ≤ VIN ≤ 26V 10.00 9.27/9.45 Line Regulation VO + 2V ≤ VIN ≤ 26V, Units (1) 10.5V ≤ VIN ≤ 26V Output Voltage Limit 9.70/9.50 VMIN 10.30/10.50 VMAX 20 90 20 100 mVMAX LM2940-N 60 90/150 65 100/165 mVMAX LM2940C 60 90 IO = 5 mA Load Regulation Output Impedance 50 mA ≤ IO ≤ 1A 100 mADC and 20 mArms, 60 65 mΩ fO = 120 Hz Quiescent Current VO +2V ≤ VIN < 26V, IO = 5 mA Output Noise Voltage LM2940-N 10 15/20 LM2940C 10 15 VIN = VO + 5V, IO = 1A 30 45/60 10 Hz − 100 kHz, 270 10 15/20 mAMAX 30 45/60 mAMAX μVrms 300 IO = 5 mA Ripple Rejection fO = 120 Hz, 1 Vrms, IO = 100 mA LM2940-N 64 52/46 LM2940C 64 52 Long Term Stability Dropout Voltage Short Circuit Current (1) (2) 34 63 51/45 36 dBMIN mV/ 1000 Hr IO = 1A 0.5 0.8/1.0 0.5 0.8/1.0 VMAX IO = 100 mA 110 150/200 110 150/200 mVMAX (2) 1.9 1.6 1.9 1.6 AMIN See All limits are specified at TA = TJ = 25°C only (standard typeface) or over the entire operating temperature range of the indicated device (boldface type). All limits at TA = TJ = 25°C are 100% production tested. All limits at temperature extremes are specified via correlation using standard Statistical Quality Control methods. Output current will decrease with increasing temperature but will not drop below 1A at the maximum specified temperature. Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM2940-N LM2940C Submit Documentation Feedback 5 LM2940-N, LM2940C SNVS769I – MARCH 2000 – REVISED APRIL 2013 www.ti.com Electrical Characteristics (continued) VIN = VO + 5V, IO = 1A, CO = 22 μF, unless otherwise specified. Boldface limits apply over the entire operating temperature range of the indicated device. All other specifications apply for TA = TJ = 25°C. Output Voltage (VO) 9V 10V LM2940-N Parameter Conditions Typ LM2940-N Limit Typ Limit (1) Units (1) Maximum Line Transient RO = 100Ω T ≤ 100 ms Reverse Polarity DC Input Voltage LM2940-N 75 60/60 LM2940C 55 45 LM2940-N −30 −15/−15 LM2940C −30 −15 LM2940-N −75 −50/−50 LM2940C −55 −45/−45 75 60/60 VMIN −30 −15/−15 VMIN −75 −50/−50 VMIN RO = 100Ω Reverse Polarity Transient Input Voltage RO = 100Ω T ≤ 100 ms Electrical Characteristics VIN = VO + 5V, IO = 1A, CO = 22 μF, unless otherwise specified. Boldface limits apply over the entire operating temperature range of the indicated device. All other specifications apply for TA = TJ = 25°C. Output Voltage (VO) Parameter 12V Conditions LM2940-N Limit (1) 12.0 0 11.64/11.40 LM2940N/833 Limit (2) 11.64/11.40 12.36/12.60 12.36/12.60 20 120 75/120 LM2940-N, LM2940-N/883 55 120/200 120/190 LM2940C 55 120 Typ LM2940-N Limit (1) 15.0 0 14.55/14.25 14.55/14.25 VMIN 15.45/15.75 15.45/15.75 VMAX 20 150 95/150 mVMAX 150/240 mVMAX 70 150 1000/1000 mΩ 15/20 mAMAX 50/60 mAMAX 1000/1000 μVrms 13.6V ≤ VIN ≤ 26V Output Voltage 5 mA ≤ IO ≤1A Line Regulation 15V Typ VO + 2V ≤ VIN ≤ 26V, LM2940N/833 Limit (2) Units 16.75V ≤ VIN ≤ 26V IO = 5 mA Load Regulation Output Impedance 50 mA ≤ IO ≤ 1A 100 mADC and 20 mArms, 80 1000/1000 100 fO = 120 Hz Quiescent Current Output Noise Voltage (1) (2) 6 VO +2V ≤ VIN ≤ 26V, IO = 5 mA LM2940-N, LM2940-N/883 10 15/20 LM2940C 10 15 VIN = VO + 5V, IO = 1A 30 45/60 10 Hz − 100 kHz, 360 15/20 10 15 50/60 30 45/60 1000/1000 450 IO = 5 mA All limits are specified at TA = TJ = 25°C only (standard typeface) or over the entire operating temperature range of the indicated device (boldface type). All limits at TA = TJ = 25°C are 100% production tested. All limits at temperature extremes are specified via correlation using standard Statistical Quality Control methods. All limits are specified at TA = TJ = 25°C only (standard typeface) or over the entire operating temperature range of the indicated device (boldface type). All limits are 100% production tested and are used to calculate Outgoing Quality Levels. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM2940-N LM2940C LM2940-N, LM2940C www.ti.com SNVS769I – MARCH 2000 – REVISED APRIL 2013 Electrical Characteristics (continued) VIN = VO + 5V, IO = 1A, CO = 22 μF, unless otherwise specified. Boldface limits apply over the entire operating temperature range of the indicated device. All other specifications apply for TA = TJ = 25°C. Output Voltage (VO) Parameter Ripple Rejection 12V Conditions Typ LM2940-N Limit (1) LM2940-N 66 54/48 LM2940C 66 54 15V LM2940N/833 Limit (2) Typ LM2940-N Limit (1) 64 52 LM2940N/833 Limit (2) Units fO = 120 Hz, 1 Vrms, IO = 100 mA fO = 1 kHz, 1 Vrms, 52/46 IO = 5 mA Long Term Stability Dropout Voltage 48 0.5 0.8/1.0 0.7/1.0 0.5 0.8/1.0 0.7/1.0 VMAX IO = 100 mA 110 150/200 150/200 110 150/200 150/200 mVMAX (3) 1.9 1.6 1.6/1.3 1.9 1.6 1.6/1.3 AMIN 75 60/60 40/40 VMIN 55 45 55 45 LM2940-N, LM2940-N/883 −30 −15/−15 −15/−15 VMIN LM2940C −30 −15 −30 −15 −75 −50/−50 −45/−45 VMIN −55 −45/−45 −55 −45/−45 RO = 100Ω LM2940-N, T ≤ 100 ms LM2940C, T ≤ 1 ms Reverse Polarity Transient Input Voltage 40/40 RO = 100Ω −15/−15 RO = 100Ω LM2940-N, T ≤ 100 ms LM2940-N/883, T ≤ 20 ms LM2940C, T ≤ 1 ms (3) dBMIN mV/ 1000 Hr 60 LM2940-N/883, T ≤ 20 ms Reverse Polarity DC Input Voltage 48/42 IO = 1A Short Circuit Current See Maximum Line Transient dBMIN −45/−45 Output current will decrease with increasing temperature but will not drop below 1A at the maximum specified temperature. Thermal Performance Thermal Resistance Junction-to-Case, θ(JC) 3-Lead TO-220 4 3-Lead DDPAK/TO-263 4 3-Lead TO-220 Thermal Resistance Junction-to-Ambient, θ(JA) 3-Lead DDPAK/TO-263 SOT-223 60 (1) (1) 8-Lead WSON (1) (1) °C/W 80 174 (1) °C/W 35 The maximum allowable power dissipation is a function of the maximum junction temperature, TJ, the junction-to-ambient thermal resistance, θJA, and the ambient temperature, TA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. The value of θJA (for devices in still air with no heatsink) is 60°C/W for the TO-220 package, 80°C/W for the DDPAK/TO-263 package, and 174°C/W for the SOT-223 package. The effective value of θJA can be reduced by using a heatsink (see Application Hints for specific information on heatsinking). The value of θJA for the WSON package is specifically dependent on PCB trace area, trace material, and the number of layers and thermal vias. For improved thermal resistance and power dissipation for the WSON package, refer to Application Note AN-1187 (SNOA401). It is recommended that 6 vias be placed under the center pad to improve thermal performance. Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM2940-N LM2940C Submit Documentation Feedback 7 LM2940-N, LM2940C SNVS769I – MARCH 2000 – REVISED APRIL 2013 www.ti.com Typical Performance Characteristics 8 Dropout Voltage Dropout Voltage vs. Temperature Figure 8. Figure 9. Output Voltage vs. Temperature Quiescent Current vs. Temperature Figure 10. Figure 11. Quiescent Current Quiescent Current Figure 12. Figure 13. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM2940-N LM2940C LM2940-N, LM2940C www.ti.com SNVS769I – MARCH 2000 – REVISED APRIL 2013 Typical Performance Characteristics (continued) Line Transient Response Load Transient Response Figure 14. Figure 15. Ripple Rejection Low Voltage Behavior Figure 16. Figure 17. Low Voltage Behavior Low Voltage Behavior Figure 18. Figure 19. Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM2940-N LM2940C Submit Documentation Feedback 9 LM2940-N, LM2940C SNVS769I – MARCH 2000 – REVISED APRIL 2013 www.ti.com Typical Performance Characteristics (continued) 10 Low Voltage Behavior Low Voltage Behavior Figure 20. Figure 21. Low Voltage Behavior Output at Voltage Extremes Figure 22. Figure 23. Output at Voltage Extremes Output at Voltage Extremes Figure 24. Figure 25. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM2940-N LM2940C LM2940-N, LM2940C www.ti.com SNVS769I – MARCH 2000 – REVISED APRIL 2013 Typical Performance Characteristics (continued) Output at Voltage Extremes Output at Voltage Extremes Figure 26. Figure 27. Output at Voltage Extremes Output Capacitor ESR Figure 28. Figure 29. Peak Output Current Output Impedance Figure 30. Figure 31. Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM2940-N LM2940C Submit Documentation Feedback 11 LM2940-N, LM2940C SNVS769I – MARCH 2000 – REVISED APRIL 2013 www.ti.com Typical Performance Characteristics (continued) Maximum Power Dissipation (TO-220) Maximum Power Dissipation (SOT-223) Figure 32. Figure 33. Maximum Power Dissipation (DDPAK/TO-263) Figure 34. 12 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM2940-N LM2940C LM2940-N, LM2940C www.ti.com SNVS769I – MARCH 2000 – REVISED APRIL 2013 Equivalent Schematic Diagram Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM2940-N LM2940C Submit Documentation Feedback 13 LM2940-N, LM2940C SNVS769I – MARCH 2000 – REVISED APRIL 2013 www.ti.com APPLICATION INFORMATION EXTERNAL CAPACITORS The output capacitor is critical to maintaining regulator stability, and must meet the required conditions for both ESR (Equivalent Series Resistance) and minimum amount of capacitance. MINIMUM CAPACITANCE: The minimum output capacitance required to maintain stability is 22 μF (this value may be increased without limit). Larger values of output capacitance will give improved transient response. ESR LIMITS: The ESR of the output capacitor will cause loop instability if it is too high or too low. The acceptable range of ESR plotted versus load current is shown in the graph below. It is essential that the output capacitor meet these requirements, or oscillations can result. Figure 35. Output Capacitor ESR Limits It is important to note that for most capacitors, ESR is specified only at room temperature. However, the designer must ensure that the ESR will stay inside the limits shown over the entire operating temperature range for the design. For aluminum electrolytic capacitors, ESR will increase by about 30X as the temperature is reduced from 25°C to −40°C. This type of capacitor is not well-suited for low temperature operation. Solid tantalum capacitors have a more stable ESR over temperature, but are more expensive than aluminum electrolytics. A cost-effective approach sometimes used is to parallel an aluminum electrolytic with a solid Tantalum, with the total capacitance split about 75/25% with the Aluminum being the larger value. If two capacitors are paralleled, the effective ESR is the parallel of the two individual values. The “flatter” ESR of the Tantalum will keep the effective ESR from rising as quickly at low temperatures. HEATSINKING A heatsink may be required depending on the maximum power dissipation and maximum ambient temperature of the application. Under all possible operating conditions, the junction temperature must be within the range specified under Absolute Maximum Ratings. To determine if a heatsink is required, the power dissipated by the regulator, PD, must be calculated. The figure below shows the voltages and currents which are present in the circuit, as well as the formula for calculating the power dissipated in the regulator: 14 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM2940-N LM2940C LM2940-N, LM2940C www.ti.com SNVS769I – MARCH 2000 – REVISED APRIL 2013 IIN = IL + IG PD = (VIN − VOUT) IL + (VIN) IG Figure 36. Power Dissipation Diagram The next parameter which must be calculated is the maximum allowable temperature rise, TR(MAX). This is calculated by using the formula: TR(MAX) = TJ(MAX) − TA(MAX) where • • TJ(MAX) is the maximum allowable junction temperature, which is 125°C for commercial grade parts. TA(MAX)is the maximum ambient temperature which will be encountered in the application. (1) Using the calculated values for TR(MAX) and PD, the maximum allowable value for the junction-to-ambient thermal resistance, θ(JA), can now be found: θ(JA) = TR(MAX) / PD (2) NOTE If the maximum allowable value for θ(JA) is found to be ≥ 53°C/W for the TO-220 package, ≥ 80°C/W for the DDPAK/TO-263 package, or ≥ 174°C/W for the SOT-223 package, no heatsink is needed since the package alone will dissipate enough heat to satisfy these requirements. If the calculated value for θ(JA)falls below these limits, a heatsink is required. HEATSINKING TO-220 PACKAGE PARTS The TO-220 can be attached to a typical heatsink, or secured to a copper plane on a PC board. If a copper plane is to be used, the values of θ(JA) will be the same as shown in the next section for the DDPAK/TO-263. If a manufactured heatsink is to be selected, the value of heatsink-to-ambient thermal resistance, θ(H−A), must first be calculated: θ(H−A) = θ(JA) − θ(C−H) − θ(J−C) where • • θ(J−C) is defined as the thermal resistance from the junction to the surface of the case. A value of 3°C/W can be assumed for θ(J−C) for this calculation. θ(C−H) is defined as the thermal resistance between the case and the surface of the heatsink. The value of θ(C−H) will vary from about 1.5°C/W to about 2.5°C/W (depending on method of attachment, insulator, etc.). If the exact value is unknown, 2°C/W should be assumed for θ(C−H). (3) When a value for θ(H−A) is found using the equation shown, a heatsink must be selected that has a value that is less than or equal to this number. θ(H−A) is specified numerically by the heatsink manufacturer in the catalog, or shown in a curve that plots temperature rise vs power dissipation for the heatsink. HEATSINKING DDPAK/TO-263 PACKAGE PARTS The DDPAK/TO-263 (KTT) package uses a copper plane on the PCB and the PCB itself as a heatsink. To optimize the heat sinking ability of the plane and PCB, solder the tab of the package to the plane. Figure 37 shows for the DDPAK/TO-263 the measured values of θ(JA) for different copper area sizes using a typical PCB with 1 ounce copper and no solder mask over the copper area used for heatsinking. Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM2940-N LM2940C Submit Documentation Feedback 15 LM2940-N, LM2940C SNVS769I – MARCH 2000 – REVISED APRIL 2013 www.ti.com Figure 37. θ(JA) vs. Copper (1 ounce) Area for the DDPAK/TO-263 Package As shown in the figure, increasing the copper area beyond 1 square inch produces very little improvement. It should also be observed that the minimum value of θ(JA) for the DDPAK/TO-263 package mounted to a PCB is 32°C/W. As a design aid, Figure 38 shows the maximum allowable power dissipation compared to ambient temperature for the DDPAK/TO-263 device. This assumes a θ(JA) of 35°C/W for 1 square inch of 1 ounce copper and a maximum junction temperature (TJ) of 125°C. Figure 38. Maximum Power Dissipation vs. TA for the DDPAK/TO-263 Package HEATSINKING SOT-223 PACKAGE PARTS The SOT-223 (DCY) packages use a copper plane on the PCB and the PCB itself as a heatsink. To optimize the heat sinking ability of the plane and PCB, solder the tab of the package to the plane. Figure 39 and Figure 40 show the information for the SOT-223 package. Figure 40 assumes a θ(JA) of 74°C/W for 1 square inch of 1 ounce copper and 51°C/W for 1 square inch of 2 ounce copper, with a maximum ambient temperature (TA) of 85°C and a maximum junction temperature (TJ) of 125°C. For techniques for improving the thermal resistance and power dissipation for the SOT-223 package, please refer to Application Note AN-1028 (SNVA036). 16 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM2940-N LM2940C LM2940-N, LM2940C www.ti.com SNVS769I – MARCH 2000 – REVISED APRIL 2013 Figure 39. θ(JA) vs. Copper (2 ounce) Area for the SOT-223 Package Figure 40. Maximum Power Dissipation vs. TA for the SOT-223 Package HEATSINKING WSON PACKAGE PARTS The value of θJA for the WSON package is specifically dependent on PCB trace area, trace material, and the number of layers and thermal vias. It is recommended that a minimum of 6 thermal vias be placed under the center pad to improve thermal performance. For techniques for improving the thermal resistance and power dissipation for the WSON package, please refer to Application Note AN-1187 (SNOA401). Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM2940-N LM2940C Submit Documentation Feedback 17 LM2940-N, LM2940C SNVS769I – MARCH 2000 – REVISED APRIL 2013 www.ti.com REVISION HISTORY Changes from Revision H (April 2013) to Revision I • 18 Page Changed layout of National Data Sheet to TI format .......................................................................................................... 17 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM2940-N LM2940C PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) LM2940CS-12 ACTIVE DDPAK/ TO-263 KTT 3 45 TBD Call TI Call TI 0 to 125 LM2940CS -12 P+ LM2940CS-12/NOPB ACTIVE DDPAK/ TO-263 KTT 3 45 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR 0 to 125 LM2940CS -12 P+ LM2940CS-15 ACTIVE DDPAK/ TO-263 KTT 3 45 TBD Call TI Call TI 0 to 125 LM2940CS -15 P+ LM2940CS-15/NOPB ACTIVE DDPAK/ TO-263 KTT 3 45 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR 0 to 125 LM2940CS -15 P+ LM2940CS-5.0 ACTIVE DDPAK/ TO-263 KTT 3 45 TBD Call TI Call TI 0 to 125 LM2940CS -5.0 P+ LM2940CS-5.0/NOPB ACTIVE DDPAK/ TO-263 KTT 3 45 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR 0 to 125 LM2940CS -5.0 P+ LM2940CS-9.0 ACTIVE DDPAK/ TO-263 KTT 3 45 TBD Call TI Call TI 0 to 125 LM2940CS -9.0 P+ LM2940CS-9.0/NOPB ACTIVE DDPAK/ TO-263 KTT 3 45 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR 0 to 125 LM2940CS -9.0 P+ LM2940CSX-12 ACTIVE DDPAK/ TO-263 KTT 3 500 TBD Call TI Call TI 0 to 125 LM2940CS -12 P+ LM2940CSX-12/NOPB ACTIVE DDPAK/ TO-263 KTT 3 500 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR 0 to 125 LM2940CS -12 P+ LM2940CSX-15 ACTIVE DDPAK/ TO-263 KTT 3 500 TBD Call TI Call TI 0 to 125 LM2940CS -15 P+ LM2940CSX-15/NOPB ACTIVE DDPAK/ TO-263 KTT 3 500 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR 0 to 125 LM2940CS -15 P+ LM2940CSX-5.0 ACTIVE DDPAK/ TO-263 KTT 3 500 TBD Call TI Call TI 0 to 125 LM2940CS -5.0 P+ LM2940CSX-5.0/NOPB ACTIVE DDPAK/ TO-263 KTT 3 500 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR 0 to 125 LM2940CS -5.0 P+ LM2940CSX-9.0 ACTIVE DDPAK/ TO-263 KTT 3 500 TBD Call TI Call TI 0 to 125 LM2940CS -9.0 P+ LM2940CSX-9.0/NOPB ACTIVE DDPAK/ TO-263 KTT 3 500 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR 0 to 125 LM2940CS -9.0 P+ LM2940CT-12 ACTIVE TO-220 NDE 3 45 TBD Call TI Call TI 0 to 125 LM2940CT -12 P+ Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 11-Apr-2013 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) LM2940CT-12/NOPB ACTIVE TO-220 NDE 3 45 Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM 0 to 125 LM2940CT -12 P+ LM2940CT-15 ACTIVE TO-220 NDE 3 45 TBD Call TI Call TI 0 to 125 LM2940CT -15 P+ LM2940CT-15/NOPB ACTIVE TO-220 NDE 3 45 Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM 0 to 125 LM2940CT -15 P+ LM2940CT-5.0 ACTIVE TO-220 NDE 3 45 TBD Call TI Call TI 0 to 125 LM2940CT -5.0 P+ LM2940CT-5.0/LF01 ACTIVE TO-220 NDG 3 45 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR LM2940CT-5.0/NOPB ACTIVE TO-220 NDE 3 45 Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM 0 to 125 LM2940CT -5.0 P+ LM2940CT-9.0 ACTIVE TO-220 NDE 3 45 TBD Call TI Call TI 0 to 125 LM2940CT -9.0 P+ LM2940CT-9.0/NOPB ACTIVE TO-220 NDE 3 45 Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM 0 to 125 LM2940CT -9.0 P+ LM2940IMP-10 ACTIVE SOT-223 DCY 4 1000 TBD Call TI Call TI -40 to 85 L55B LM2940IMP-10/NOPB ACTIVE SOT-223 DCY 4 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 L55B LM2940IMP-12 ACTIVE SOT-223 DCY 4 1000 TBD Call TI Call TI -40 to 85 L56B LM2940IMP-12/NOPB ACTIVE SOT-223 DCY 4 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 L56B LM2940IMP-15 ACTIVE SOT-223 DCY 4 1000 TBD Call TI Call TI -40 to 85 L70B LM2940IMP-15/NOPB ACTIVE SOT-223 DCY 4 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 L70B LM2940IMP-5.0 ACTIVE SOT-223 DCY 4 1000 TBD Call TI Call TI -40 to 85 L53B LM2940IMP-5.0/NOPB ACTIVE SOT-223 DCY 4 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 L53B LM2940IMP-9.0 ACTIVE SOT-223 DCY 4 1000 TBD Call TI Call TI -40 to 85 L0EB LM2940IMP-9.0/NOPB ACTIVE SOT-223 DCY 4 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 L0EB LM2940IMPX-10 ACTIVE SOT-223 DCY 4 2000 TBD Call TI Call TI -40 to 85 L55B Addendum-Page 2 LM2940CT -5.0 P+ Samples PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) LM2940IMPX-10/NOPB ACTIVE SOT-223 DCY 4 2000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 L55B LM2940IMPX-12 ACTIVE SOT-223 DCY 4 2000 TBD Call TI Call TI -40 to 85 L56B LM2940IMPX-12/NOPB ACTIVE SOT-223 DCY 4 2000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 L56B LM2940IMPX-5.0 ACTIVE SOT-223 DCY 4 2000 TBD Call TI Call TI -40 to 85 L53B LM2940IMPX-5.0/NOPB ACTIVE SOT-223 DCY 4 2000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 L53B LM2940IMPX-8.0 ACTIVE SOT-223 DCY 4 2000 TBD Call TI Call TI -40 to 85 L54B LM2940IMPX-8.0/NOPB ACTIVE SOT-223 DCY 4 2000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 L54B LM2940LD-12 ACTIVE WSON NGN 8 1000 TBD Call TI Call TI -40 to 125 L00018B LM2940LD-12/NOPB ACTIVE WSON NGN 8 1000 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 125 L00018B LM2940LD-5.0 ACTIVE WSON NGN 8 1000 TBD Call TI Call TI -40 to 125 L00014B LM2940LD-5.0/NOPB ACTIVE WSON NGN 8 1000 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 125 L00014B LM2940S-10 ACTIVE DDPAK/ TO-263 KTT 3 45 TBD Call TI Call TI -40 to 125 LM2940S -10 P+ LM2940S-10/NOPB ACTIVE DDPAK/ TO-263 KTT 3 45 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR -40 to 125 LM2940S -10 P+ LM2940S-12 ACTIVE DDPAK/ TO-263 KTT 3 45 TBD Call TI Call TI -40 to 125 LM2940S -12 P+ LM2940S-12/NOPB ACTIVE DDPAK/ TO-263 KTT 3 45 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR -40 to 125 LM2940S -12 P+ LM2940S-5.0 ACTIVE DDPAK/ TO-263 KTT 3 45 TBD Call TI Call TI -40 to 125 LM2940S -5.0 P+ LM2940S-5.0/NOPB ACTIVE DDPAK/ TO-263 KTT 3 45 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR -40 to 125 LM2940S -5.0 P+ LM2940S-8.0 ACTIVE DDPAK/ TO-263 KTT 3 45 TBD Call TI Call TI -40 to 125 LM2940S -8.0 P+ LM2940S-8.0/NOPB ACTIVE DDPAK/ TO-263 KTT 3 45 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR -40 to 125 LM2940S -8.0 P+ Addendum-Page 3 Samples PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) LM2940S-9.0 ACTIVE DDPAK/ TO-263 KTT 3 45 TBD Call TI Call TI -40 to 125 LM2940S -9.0 P+ LM2940S-9.0/NOPB ACTIVE DDPAK/ TO-263 KTT 3 45 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR -40 to 125 LM2940S -9.0 P+ LM2940SX-10 ACTIVE DDPAK/ TO-263 KTT 3 500 TBD Call TI Call TI -40 to 125 LM2940S -10 P+ LM2940SX-10/NOPB ACTIVE DDPAK/ TO-263 KTT 3 500 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR -40 to 125 LM2940S -10 P+ LM2940SX-12 ACTIVE DDPAK/ TO-263 KTT 3 500 TBD Call TI Call TI -40 to 125 LM2940S -12 P+ LM2940SX-12/NOPB ACTIVE DDPAK/ TO-263 KTT 3 500 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR -40 to 125 LM2940S -12 P+ LM2940SX-5.0 ACTIVE DDPAK/ TO-263 KTT 3 500 TBD Call TI Call TI -40 to 125 LM2940S -5.0 P+ LM2940SX-5.0/NOPB ACTIVE DDPAK/ TO-263 KTT 3 500 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR -40 to 125 LM2940S -5.0 P+ LM2940SX-8.0 ACTIVE DDPAK/ TO-263 KTT 3 500 TBD Call TI Call TI -40 to 125 LM2940S -8.0 P+ LM2940SX-8.0/NOPB ACTIVE DDPAK/ TO-263 KTT 3 500 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR -40 to 125 LM2940S -8.0 P+ LM2940SX-9.0 ACTIVE DDPAK/ TO-263 KTT 3 500 TBD Call TI Call TI -40 to 125 LM2940S -9.0 P+ LM2940SX-9.0/NOPB ACTIVE DDPAK/ TO-263 KTT 3 500 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR -40 to 125 LM2940S -9.0 P+ LM2940T-10.0 ACTIVE TO-220 NDE 3 45 TBD Call TI Call TI -40 to 125 LM2940T 10.0 P+ LM2940T-10.0/NOPB ACTIVE TO-220 NDE 3 45 Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM -40 to 125 LM2940T 10.0 P+ LM2940T-12.0 ACTIVE TO-220 NDE 3 45 TBD Call TI Call TI -40 to 125 LM2940T 12.0 P+ LM2940T-12.0/NOPB ACTIVE TO-220 NDE 3 45 Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM -40 to 125 LM2940T 12.0 P+ LM2940T-5.0 ACTIVE TO-220 NDE 3 45 TBD Call TI Call TI -40 to 125 LM2940T -5.0 P+ LM2940T-5.0/LF08 ACTIVE TO-220 NEB 3 45 Green (RoHS & no Sb/Br) CU SN Level-3-245C-168 HR Addendum-Page 4 LM2940T -5.0 P+ Samples PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) LM2940T-5.0/NOPB ACTIVE TO-220 NDE 3 45 Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM -40 to 125 LM2940T -5.0 P+ LM2940T-8.0 ACTIVE TO-220 NDE 3 45 TBD Call TI Call TI -40 to 125 LM2940T -8.0 P+ LM2940T-8.0/NOPB ACTIVE TO-220 NDE 3 45 Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM -40 to 125 LM2940T -8.0 P+ LM2940T-9.0 ACTIVE TO-220 NDE 3 45 TBD Call TI Call TI -40 to 125 LM2940T -9.0 P+ LM2940T-9.0/NOPB ACTIVE TO-220 NDE 3 45 Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM -40 to 125 LM2940T -9.0 P+ (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Top-Side Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 5 Samples PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 6 PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM2940CSX-12 DDPAK/ TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2 LM2940CSX-12/NOPB DDPAK/ TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2 LM2940CSX-15 DDPAK/ TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2 LM2940CSX-15/NOPB DDPAK/ TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2 LM2940CSX-5.0 DDPAK/ TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2 LM2940CSX-5.0/NOPB DDPAK/ TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2 LM2940CSX-9.0 DDPAK/ TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2 LM2940CSX-9.0/NOPB DDPAK/ TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2 LM2940IMP-10 SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM2940IMP-10/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM2940IMP-12 SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM2940IMP-12/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM2940IMP-15 SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM2940IMP-15/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM2940IMP-5.0 SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM2940IMP-5.0/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM2940IMP-9.0 SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM2940IMP-9.0/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM2940IMPX-10 SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM2940IMPX-10/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM2940IMPX-12/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM2940IMPX-5.0/NOPB SOT-223 LM2940IMPX-12 LM2940IMPX-5.0 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM2940IMPX-8.0/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM2940IMPX-8.0 LM2940LD-12 WSON NGN 8 1000 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1 LM2940LD-12/NOPB WSON NGN 8 1000 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1 LM2940LD-5.0 WSON NGN 8 1000 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1 LM2940LD-5.0/NOPB WSON NGN 8 1000 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1 LM2940SX-10 DDPAK/ TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2 LM2940SX-10/NOPB DDPAK/ TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2 LM2940SX-12 DDPAK/ TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2 LM2940SX-12/NOPB DDPAK/ TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2 LM2940SX-5.0 DDPAK/ TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2 LM2940SX-5.0/NOPB DDPAK/ TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2 LM2940SX-8.0 DDPAK/ TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2 LM2940SX-8.0/NOPB DDPAK/ TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2 LM2940SX-9.0 DDPAK/ TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2 LM2940SX-9.0/NOPB DDPAK/ TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2 Pack Materials-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM2940CSX-12 DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0 LM2940CSX-12/NOPB DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0 LM2940CSX-15 DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0 LM2940CSX-15/NOPB DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0 LM2940CSX-5.0 DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0 LM2940CSX-5.0/NOPB DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0 LM2940CSX-9.0 DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0 LM2940CSX-9.0/NOPB DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0 LM2940IMP-10 SOT-223 DCY 4 1000 367.0 367.0 35.0 LM2940IMP-10/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0 LM2940IMP-12 SOT-223 DCY 4 1000 367.0 367.0 35.0 LM2940IMP-12/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0 LM2940IMP-15 SOT-223 DCY 4 1000 367.0 367.0 35.0 LM2940IMP-15/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0 LM2940IMP-5.0 SOT-223 DCY 4 1000 367.0 367.0 35.0 LM2940IMP-5.0/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0 LM2940IMP-9.0 SOT-223 DCY 4 1000 367.0 367.0 35.0 LM2940IMP-9.0/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0 LM2940IMPX-10 SOT-223 DCY 4 2000 367.0 367.0 35.0 LM2940IMPX-10/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0 Pack Materials-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM2940IMPX-12 SOT-223 DCY 4 2000 367.0 367.0 35.0 LM2940IMPX-12/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0 LM2940IMPX-5.0 SOT-223 DCY 4 2000 367.0 367.0 35.0 LM2940IMPX-5.0/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0 LM2940IMPX-8.0 SOT-223 DCY 4 2000 367.0 367.0 35.0 LM2940IMPX-8.0/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0 LM2940LD-12 WSON NGN 8 1000 210.0 185.0 35.0 LM2940LD-12/NOPB WSON NGN 8 1000 213.0 191.0 55.0 LM2940LD-5.0 WSON NGN 8 1000 210.0 185.0 35.0 LM2940LD-5.0/NOPB WSON NGN 8 1000 213.0 191.0 55.0 LM2940SX-10 DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0 LM2940SX-10/NOPB DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0 LM2940SX-12 DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0 LM2940SX-12/NOPB DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0 LM2940SX-5.0 DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0 LM2940SX-5.0/NOPB DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0 LM2940SX-8.0 DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0 LM2940SX-8.0/NOPB DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0 LM2940SX-9.0 DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0 LM2940SX-9.0/NOPB DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0 Pack Materials-Page 4 MECHANICAL DATA NDE0003B www.ti.com MECHANICAL DATA NDG0003F T03F (Rev B) www.ti.com MECHANICAL DATA MPDS094A – APRIL 2001 – REVISED JUNE 2002 DCY (R-PDSO-G4) PLASTIC SMALL-OUTLINE 6,70 (0.264) 6,30 (0.248) 3,10 (0.122) 2,90 (0.114) 4 0,10 (0.004) M 3,70 (0.146) 3,30 (0.130) 7,30 (0.287) 6,70 (0.264) Gauge Plane 1 2 0,84 (0.033) 0,66 (0.026) 2,30 (0.091) 4,60 (0.181) 1,80 (0.071) MAX 3 0°–10° 0,10 (0.004) M 0,25 (0.010) 0,75 (0.030) MIN 1,70 (0.067) 1,50 (0.059) 0,35 (0.014) 0,23 (0.009) Seating Plane 0,08 (0.003) 0,10 (0.0040) 0,02 (0.0008) 4202506/B 06/2002 NOTES: A. B. C. D. All linear dimensions are in millimeters (inches). This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion. Falls within JEDEC TO-261 Variation AA. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA NGN0008A LDC08A (Rev B) www.ti.com MECHANICAL DATA KTT0003B TS3B (Rev F) BOTTOM SIDE OF PACKAGE www.ti.com MECHANICAL DATA NEB0003G TA03G (Rev A) www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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