LM185-1.2-N, LM285-1.2-N, LM385-1.2-N www.ti.com SNVS742E – JANUARY 2000 – REVISED APRIL 2013 LM185-1.2-N/LM285-1.2-N/LM385-1.2-N Micropower Voltage Reference Diode Check for Samples: LM185-1.2-N, LM285-1.2-N, LM385-1.2-N FEATURES 1 • • • • • • 2 • ±1% and 2% Initial Tolerance Operating Current of 10μA to 20mA 1Ω Dynamic Impedance Low Temperature Coefficient Low Voltage Reference—1.235V 2.5V Device and Adjustable Device Also Available LM185-2.5 Series and LM185 Series, respectively DESCRIPTION The LM185-1.2-N/LM285-1.2-N/LM385-1.2-N are micropower 2-terminal band-gap voltage regulator diodes. Operating over a 10μA to 20mA current range, they feature exceptionally low dynamic impedance and good temperature stability. On-chip trimming is used to provide tight voltage tolerance. Since the LM185-1.2-N band-gap reference uses only transistors and resistors, low noise and good long term stability result. Careful design of the LM185-1.2-N has made the device exceptionally tolerant of capacitive loading, making it easy to use in almost any reference application. The wide dynamic operating range allows its use with widely varying supplies with excellent regulation. The extremely low power drain of the LM185-1.2-N makes it useful for micropower circuitry. This voltage reference can be used to make portable meters, regulators or general purpose analog circuitry with battery life approaching shelf life. Further, the wide operating current allows it to replace older references with a tighter tolerance part. The LM185-1.2-N is rated for operation over a −55°C to 125°C temperature range while the LM285-1.2-N is rated −40°C to 85°C and the LM385-1.2-N 0°C to 70°C. The LM185-1.2-N/LM285-1.2-N are available in a hermetic TO package and the LM285-1.2-N/LM3851.2-N are also available in a low-cost TO-92 molded package, as well as SOIC and SOT-23. CONNECTION DIAGRAM Figure 1. T0-92 Package (LP) (Bottom View) Figure 3. SOIC Package * Pin 3 is attached to the Die Attach Pad (DAP) and should be connected to Pin 2 or left floating. Figure 2. SOT-23 Figure 4. TO Package (NDV) (Bottom View) 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2000–2013, Texas Instruments Incorporated LM185-1.2-N, LM285-1.2-N, LM385-1.2-N SNVS742E – JANUARY 2000 – REVISED APRIL 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ABSOLUTE MAXIMUM RATINGS (1) (2) (3) Reverse Current 30mA Forward Current 10mA Operating Temperature Range (4) LM185-1.2-N −55°C to +125°C LM285-1.2-N −40°C to +85°C LM385-1.2-N ESD Susceptibility 0°C to 70°C (5) 2kV −55°C to +150°C Storage Temperature Soldering Information TO-92 package: 10 sec. 260°C TO package:10 sec. 300°C SOIC and SOT-23 Pkg. Vapor phase (60 sec.) 215°C Infrared (15 sec.) 220°C See AN-450 “Surface Mounting Methods and Their Effect on Product Reliability” for other methods of soldering surface mount devices. (1) (2) (3) (4) (5) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional. For specifications and test conditions, see the Electrical Characteristics. The specifications apply only for the test conditions listed. Refer to RETS185H-1.2 for military specifications. If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications. For elevated temperature operation, see Table 1. The human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. Table 1. TJ(max) for Elevated Temperature Operation 2 Submit Documentation Feedback DEVICE TJ(max) (°C) LM185-1.2-N 150 LM285-1.2-N 125 LM385-1.2-N 100 Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM185-1.2-N LM285-1.2-N LM385-1.2-N LM185-1.2-N, LM285-1.2-N, LM385-1.2-N www.ti.com SNVS742E – JANUARY 2000 – REVISED APRIL 2013 ELECTRICAL CHARACTERISTICS (1) LM185-1.2-N Parameter Conditions Typ LM185BX-1.2-N LM385B-1.2-N LM185BY-1.2-N LM385BX-1.2-N LM285-1.2-N LM385BY-1.2-N LM385-1.2-N Units (Limit) LM285BX-1.2-N LM285BY-1.2-N Tested Limit (2) (3) Reverse Breakdown TA = 25°C, Voltage 10μA ≤ IR ≤ 20mA Minimum Operating Current Reverse Breakdown Voltage Change with Current 1.23 5 Design Limit (4) 1.223 10 Design Limit (4) 1.223 1.247 8 Tested Limit (2) 1 1.5 V(Min) 1.260 15 20 LM385M3-1.2-N 10μA ≤ IR ≤ 1mA Design Limit (4) 1.205 1.247 20 Tested Limit (2) 1 1.5 V(Max) 15 20 μA 10 15 (Max) 1 1.5 mV (Max) 1mA ≤ IR ≤ 20mA 10 20 20 25 20 25 mV (Max) IR = 100μA, f = 20Hz 1 Ω Wideband Noise IR = 100μA, 60 μV (rms) 10Hz ≤ f ≤ 10kHz Long Term Stability IR = 100μA, T = 1000 Hr, 20 ppm Reverse Dynamic Impedance TA = 25°C ±0.1°C Average Temperature Coefficient (5) IR = 100μA X Suffix 30 30 ppm/°C Y Suffix 50 50 ppm/°C All Others 150 150 150 ppm/°C (Max) (1) (2) (3) (4) (5) Parameters identified with boldface type apply at temperature extremes. All other numbers apply at TA = TJ = 25°C. Production tested. A military RETS electrical specification is available on request. Specified by design. Not production tested. These limits are not used to calculate average outgoing quality levels. The average temperature coefficient is defined as the maximum deviation of reference voltage at all measured temperatures between the operating TMAX and TMIN, divided by TMAX − TMIN. The measured temperatures are −55°C, −40°C, 0°C, 25°C, 70°C, 85°C, 125°C. THERMAL CHARACTERISTICS Thermal Resistance θJA (junction to ambient) θJC (junction to case) Copyright © 2000–2013, Texas Instruments Incorporated TO-92 TO SOIC SOT-23 180°C/W (0.4″ leads) 170°C/W (0.125″ leads) 440°C/W 165°C/W 283°C/W N/A 80°C/W N/A N/A Submit Documentation Feedback Product Folder Links: LM185-1.2-N LM285-1.2-N LM385-1.2-N 3 LM185-1.2-N, LM285-1.2-N, LM385-1.2-N SNVS742E – JANUARY 2000 – REVISED APRIL 2013 www.ti.com TYPICAL PERFORMANCE CHARACTERISTICS 4 Reverse Characteristics Reverse Characteristics Figure 5. Figure 6. Forward Characteristics Temperature Drift of 3 Representative Units Figure 7. Figure 8. Reverse Dynamic Impedance Reverse Dynamic Impedance Figure 9. Figure 10. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM185-1.2-N LM285-1.2-N LM385-1.2-N LM185-1.2-N, LM285-1.2-N, LM385-1.2-N www.ti.com SNVS742E – JANUARY 2000 – REVISED APRIL 2013 TYPICAL PERFORMANCE CHARACTERISTICS (continued) Noise Voltage Filtered Output Noise Figure 11. Figure 12. Response Time Figure 13. Copyright © 2000–2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM185-1.2-N LM285-1.2-N LM385-1.2-N 5 LM185-1.2-N, LM285-1.2-N, LM385-1.2-N SNVS742E – JANUARY 2000 – REVISED APRIL 2013 www.ti.com TYPICAL APPLICATIONS Figure 14. Wide Input Range Reference Figure 15. Micropower Reference from 9V Battery Figure 16. Reference from 1.5V Battery *IQ ≃ 30μA Figure 17. Micropower* 5V Regulator 6 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM185-1.2-N LM285-1.2-N LM385-1.2-N LM185-1.2-N, LM285-1.2-N, LM385-1.2-N www.ti.com SNVS742E – JANUARY 2000 – REVISED APRIL 2013 *IQ ≃20μA standby current Figure 18. Micropower* 10V Reference Figure 19. Copyright © 2000–2013, Texas Instruments Incorporated Figure 20. Precision 1μA to 1mA Current Sources Submit Documentation Feedback Product Folder Links: LM185-1.2-N LM285-1.2-N LM385-1.2-N 7 LM185-1.2-N, LM285-1.2-N, LM385-1.2-N SNVS742E – JANUARY 2000 – REVISED APRIL 2013 www.ti.com METER THERMOMETERS Calibration 1. Short LM385-1.2-N, adjust R3 for IOUT= temp at 1μA/°K 2. Remove short, adjust R2 for correct reading in centigrade †IQ at 1.3V≃500μA IQ at 1.6V≃2.4mA Figure 21. 0°C−100°C Thermometer Figure 22. *2N3638 or 2N2907 select for inverse HFE ≃ 5 †Select for operation at 1.3V ‡IQ ≃ 600μA to 900μA Figure 23. Lower Power Thermometer 8 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM185-1.2-N LM285-1.2-N LM385-1.2-N LM185-1.2-N, LM285-1.2-N, LM385-1.2-N www.ti.com SNVS742E – JANUARY 2000 – REVISED APRIL 2013 Calibration 1. Short LM385-1.2-N, adjust R3 for IOUT= temp at 1.8μA/°K 2. Remove short, adjust R2 for correct reading in °F Figure 24. 0°F−50°F Thermometer Adjustment Procedure 1. Adjust TC ADJ pot until voltage across R1 equals Kelvin temperature multiplied by the thermocouple Seebeck coefficient. 2. Adjust zero ADJ pot until voltage across R2 equals the thermocouple Seebeck coefficient multiplied by 273.2. Figure 25. Micropower Thermocouple Cold Junction Compensator Copyright © 2000–2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM185-1.2-N LM285-1.2-N LM385-1.2-N 9 LM185-1.2-N, LM285-1.2-N, LM385-1.2-N SNVS742E – JANUARY 2000 – REVISED APRIL 2013 www.ti.com Thermocouple Seebeck R1 R2 Voltage Voltage Type Coefficient (Ω) (Ω) Across R1 Across R2 @ 25°C (mV) (μV/°C) (mV) J 52.3 523 1.24k 15.60 14.32 T 42.8 432 1k 12.77 11.78 K 40.8 412 953Ω 12.17 11.17 S 6.4 63.4 150Ω 1.908 1.766 Typical supply current 50μA Calibration 1. Adjust R1 so that V1 = temp at 1mV/°K 2. Adjust V2 to 273.2mV †IQ for 1.3V to 1.6V battery voltage = 50μA to 150μA Figure 26. Centigrade Thermometer 10 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM185-1.2-N LM285-1.2-N LM385-1.2-N LM185-1.2-N, LM285-1.2-N, LM385-1.2-N www.ti.com SNVS742E – JANUARY 2000 – REVISED APRIL 2013 SCHEMATIC DIAGRAM Copyright © 2000–2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM185-1.2-N LM285-1.2-N LM385-1.2-N 11 LM185-1.2-N, LM285-1.2-N, LM385-1.2-N SNVS742E – JANUARY 2000 – REVISED APRIL 2013 www.ti.com REVISION HISTORY Changes from Revision D (April 2013) to Revision E • 12 Page Changed layout of National Data Sheet to TI format .......................................................................................................... 11 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM185-1.2-N LM285-1.2-N LM385-1.2-N PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) LM185BYH-1.2 ACTIVE TO NDU 2 1000 TBD Call TI Call TI -55 to 125 LM185BYH1.2 LM185BYH-1.2/NOPB ACTIVE TO NDU 2 1000 Green (RoHS & no Sb/Br) POST-PLATE Level-1-NA-UNLIM -55 to 125 LM185BYH1.2 LM185H-1.2 ACTIVE TO NDU 2 1000 TBD Call TI Call TI -55 to 125 LM185H1.2 LM185H-1.2/NOPB ACTIVE TO NDU 2 1000 Green (RoHS & no Sb/Br) POST-PLATE Level-1-NA-UNLIM -55 to 125 LM185H1.2 LM285BXM-1.2/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 285BX M1.2 LM285BXMX-1.2/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 285BX M1.2 LM285BXZ-1.2/LFT4 ACTIVE TO-92 LP 3 2000 Green (RoHS & no Sb/Br) SNCU Level-1-NA-UNLIM LM285BXZ-1.2/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) SNCU Level-1-NA-UNLIM -40 to 85 285BX Z-1.2 LM285BYM-1.2/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 285BY M1.2 LM285BYMX-1.2/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 285BY M1.2 LM285H-1.2 ACTIVE TO NDU 2 1000 TBD Call TI Call TI -40 to 85 LM285H1.2 LM285H-1.2/NOPB ACTIVE TO NDU 2 1000 Green (RoHS & no Sb/Br) POST-PLATE Level-1-NA-UNLIM -40 to 85 LM285H1.2 LM285M-1.2/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LM285 M1.2 LM285MX-1.2/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LM285 M1.2 LM285Z-1.2/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) SNCU Level-1-NA-UNLIM -40 to 85 LM28 5Z-1.2 LM385BM-1.2 ACTIVE SOIC D 8 95 TBD Call TI Call TI 0 to 70 LM385 BM1.2 LM385BM-1.2/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM385 BM1.2 LM385BMX-1.2 ACTIVE SOIC D 8 2500 TBD Call TI Call TI 0 to 70 LM385 Addendum-Page 1 285BX Z-1.2 Samples PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) BM1.2 LM385BMX-1.2/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM385 BM1.2 LM385BXM-1.2/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 385BX M1.2 LM385BXMX-1.2/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 385BX M1.2 LM385BXZ-1.2/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) SNCU Level-1-NA-UNLIM 0 to 70 385BX Z-1.2 LM385BYM-1.2/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 385BY M1.2 LM385BYMX-1.2 ACTIVE SOIC D 8 2500 TBD Call TI Call TI 0 to 70 385BY M1.2 LM385BYMX-1.2/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 385BY M1.2 LM385BYZ-1.2/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) SNCU Level-1-NA-UNLIM 0 to 70 385BY Z-1.2 LM385BZ-1.2/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) SNCU Level-1-NA-UNLIM 0 to 70 LM385 BZ1.2 LM385M-1.2 ACTIVE SOIC D 8 95 TBD Call TI Call TI 0 to 70 LM385 M1.2 LM385M-1.2/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM385 M1.2 LM385M3-1.2 ACTIVE SOT-23 DBZ 3 1000 TBD Call TI Call TI 0 to 70 R11 LM385M3-1.2/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 R11 LM385M3X-1.2 ACTIVE SOT-23 DBZ 3 3000 TBD Call TI Call TI 0 to 70 R11 LM385M3X-1.2/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 R11 LM385MX-1.2 ACTIVE SOIC D 8 2500 TBD Call TI Call TI 0 to 70 LM385 M1.2 LM385MX-1.2/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM385 M1.2 LM385Z-1.2/LFT3 ACTIVE TO-92 LP 3 2000 Green (RoHS & no Sb/Br) SNCU Level-1-NA-UNLIM Addendum-Page 2 LM385 Z-1.2 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 11-Apr-2013 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) LM385Z-1.2/LFT4 ACTIVE TO-92 LP 3 2000 Green (RoHS & no Sb/Br) SNCU Level-1-NA-UNLIM LM385Z-1.2/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) SNCU Level-1-NA-UNLIM (4) LM385 Z-1.2 0 to 70 LM385 Z-1.2 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Top-Side Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 3 Samples PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM285BXMX-1.2/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM285BYMX-1.2/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM285MX-1.2/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM385BMX-1.2 SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM385BMX-1.2/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM385BXMX-1.2/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM385BYMX-1.2 SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM385BYMX-1.2/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM385M3-1.2 SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM385M3-1.2/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM385M3X-1.2 SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM385M3X-1.2/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM385MX-1.2 SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM385MX-1.2/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM285BXMX-1.2/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM285BYMX-1.2/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM285MX-1.2/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM385BMX-1.2 SOIC D 8 2500 367.0 367.0 35.0 LM385BMX-1.2/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM385BXMX-1.2/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM385BYMX-1.2 SOIC D 8 2500 367.0 367.0 35.0 LM385BYMX-1.2/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM385M3-1.2 SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM385M3-1.2/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM385M3X-1.2 SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM385M3X-1.2/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM385MX-1.2 SOIC D 8 2500 367.0 367.0 35.0 LM385MX-1.2/NOPB SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2 MECHANICAL DATA NDU0002A H02A (Rev F) www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2013, Texas Instruments Incorporated