NSC LM5010MHX

LM5010
High Voltage 1A Step Down Switching Regulator
General Description
Features
The LM5010 Step Down Switching Regulator features all the
functions needed to implement a low cost, efficient, buck
bias regulator capable of supplying in excess of 1A load
current. This high voltage regulator contains an N-Channel
Buck Switch, and is available in thermally enhanced LLP-10
and TSSOP-14EP packages. The hysteretic regulation
scheme requires no loop compensation, results in fast load
transient response, and simplifies circuit implementation.
The operating frequency remains constant with line and load
variations due to the inverse relationship between the input
voltage and the on-time. The valley current limit detection is
set at 1.25A. Additional features include: VCC under-voltage
lockout, thermal shutdown, gate drive under-voltage lockout,
and maximum duty cycle limiter.
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Input Voltage Range: 8V to 75V
Valley Current Limit At 1.25A
Switching Frequency Can Exceed 1 MHz
Integrated N-Channel Buck Switch
Integrated Startup Regulator
No Loop Compensation Required
Ultra-Fast Transient Response
Operating Frequency Remains Constant With Load and
Line Variations
Maximum Duty Cycle Limited During Startup
Adjustable Output Voltage
Precision 2.5V Feedback Reference
Thermal shutdown
Typical Applications
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High Efficiency Point-Of-Load (POL) Regulator
Non-Isolated Telecommunications Buck Regulator
Secondary High Voltage Post Regulator
Automotive Systems
Package
n LLP-10 (4 mm x 4 mm)
n TSSOP-14EP
n Both Packages Have Exposed Thermal Pad For
Improved Heat Dissipation
20119943
Basic Stepdown Regulator
© 2004 National Semiconductor Corporation
DS201199
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LM5010 High Voltage 1A Step Down Switching Regulator
October 2004
LM5010
Connection Diagrams
20119902
20119903
Ordering Information
Order Number
Package Type
NSC Package Drawing
Supplied As
LM5010SD
LLP-10 (4x4)
SDC10A
1000 Units on Tape and Reel
LM5010SDX
LLP-10 (4x4)
SDC10A
3500 Units on Tape and Reel
LM5010MH
TSSOP-14EP
MXA14A
1000 Units on Tape and Reel
LM5010MHX
TSSOP-14EP
MXA14A
3500 Units on Tape and Reel
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2
LM5010
Pin Description
PIN NUMBER
LLP-10
TSSOP-14
NAME
1
2
SW
Switching Node
DESCRIPTION
Internally connected to the buck switch source.
Connect to the inductor, free-wheeling diode, and
bootstrap capacitor.
2
3
BST
Boost pin for bootstrap capacitor
Connect a 0.022 µF capacitor from SW to this pin.
The capacitor is charged from VCC via an internal
diode during each off-time.
3
4
ISEN
Current sense
The re-circulating current flows through the internal
sense resistor, and out of this pin to the
free-wheeling diode. Current limit is nominally set at
1.25A.
4
5
SGND
Sense Ground
Re-circulating current flows into this pin to the
current sense resistor.
5
6
RTN
Circuit Ground
Ground for all internal circuitry other than the current
limit detection.
6
9
FB
Feedback input from the
regulated output
Internally connected to the regulation and
over-voltage comparators. The regulation level is
2.5V.
7
10
SS
Softstart
An internal 11.5 µA current source charges an
external capacitor to 2.5V, providing the softstart
function.
8
11
RON/SD
On-time control and shutdown
An external resistor from VIN to this pin sets the
buck switch on-time. Grounding this pin shuts down
the regulator.
9
12
VCC
Output from the startup regulator
Nominally regulates at 7.0V. An external voltage
(7.5V-14V) can be applied to this pin to reduce
internal dissipation. An internal diode connects VCC
to VIN.
10
13
VIN
Input supply voltage
Nominal input range is 8.0V to 75V.
1,7,8,14
NC
No connection.
No internal connection.
3
APPLICATION INFORMATION
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LM5010
Absolute Maximum Ratings (Note 1)
VIN to SW
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
All Other Inputs to GND
VIN to GND
76V
BST to GND
90V
SW to GND (Steady State)
Current Out of ISEN
76V
BST to SW
14V
VCC to GND
14V
SGND to RTN
Human Body Model
2kV
Storage Temperature Range
-55˚C to +150˚C
Lead Temperature (Soldering 4 sec) (Note 4)
260˚C
Operating Ratings (Note 1)
VIN
-0.3V to +0.3V
SS to RTN
See Text
-0.3 to 7V
ESD Rating (Note 2)
-1.5V
BST to VCC
76V
8V to 75V
Operating Junction Temperature
-0.3V to 4V
−40˚C to + 125˚C
Electrical Charateristics
Specifications with standard typeface are for TJ = 25˚C, and those with boldface type apply over full Operating Junction
Temperature range. VIN = 48V, RON = 200kΩ, unless otherwise stated (Note 5) and (Note 6).
Symbol
Parameter
Conditions
Min
Typ
Max
Units
6.6
7
7.4
Volts
VCC Regulator
VCCReg
UVLOVCC
VCC regulated output
VIN - VCC
ICC = 0 mA, FS < 200 kHz
7.5V ≤ VIN ≤ 8.0V
1.3
V
VCC output impedance
(0 mA ≤ ICC ≤ 5 mA)
VIN = 8.0V
VIN = 48V
140
2.5
Ω
VCC current limit (Note 3)
VCC = 0V
10
mA
VCC under-voltage lockout
threshold
VCC increasing
5.8
V
UVLOVCC hysteresis
VCC decreasing
145
mV
UVLOVCC filter delay
100 mV overdrive
IIN operating current
Non-switching, FB = 3V
650
850
µA
IIN shutdown current
RON/SD = 0V
95
200
µA
0.35
0.80
Ω
4.3
5.0
3
µs
Switch Characteristics
Rds(on)
UVLOGD
Buck Switch Rds(on)
ITEST = 200 mA
Gate Drive UVLO
VBST - VSW Increasing
3.0
V
UVLOGD hysteresis
440
mV
Pull-up voltage
2.5
V
Internal current source
11.5
µA
Softstart Pin
Current Limit
ILIM
Threshold
Current out of ISEN
1
1.25
1.5
A
Resistance from ISEN to SGND
130
mΩ
Response time
150
ns
On Timer, RON/SD Pin
tON - 1
On-time
VIN = 10V, RON = 200 kΩ
2.1
2.75
3.4
µs
tON - 2
On-time
VIN = 75V, RON = 200 kΩ
290
390
490
ns
Shutdown threshold
Voltage at RON/SD rising
0.35
0.65
1.1
Threshold hysteresis
Voltage at RON/SD falling
V
40
mV
265
ns
Off Timer
tOFF
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Off-time
4
(Continued)
Specifications with standard typeface are for TJ = 25˚C, and those with boldface type apply over full Operating Junction
Temperature range. VIN = 48V, RON = 200kΩ, unless otherwise stated (Note 5) and (Note 6).
Symbol
Parameter
Conditions
Min
Typ
Max
2.5
2.550
Units
Regulation and Over-Voltage Comparators (FB Pin)
VREF
FB regulation threshold
SS pin = steady state
2.445
FB over-voltage threshold
V
2.9
V
1
nA
Thermal shutdown
temperature
175
˚C
Thermal shutdown hysteresis
20
˚C
40
40
˚C/W
FB bias current
Thermal Shutdown
TSD
Thermal Resistance
θJA
Junction to Ambient
SDC Package
MXA Package
Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device
is intended to be functional. For guaranteed specifications and test conditions, see the Electrical Characteristics.
Note 2: The human body model is a 100pF capacitor discharged through a 1.5kΩ resistor into each pin.
Note 3: VCC provides bias for the internal gate drive and control circuits. Device thermal limitations limit external loading.
Note 4: For detailed information on soldering plastic TSSOP and LLP packages refer to the Packaging Data Book available from National Semiconductor
Corporation.
Note 5: Typical specifications represent the most likely parametric norm at 25˚C operation.
Note 6: All limits are guaranteed. All electrical characteristics having room temperature limits are tested during production with TA = 25˚C. All hot and cold limits are
guaranteed by correlating the electrical characteristics to process and temperature variations and applying statistical process control.
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LM5010
Electrical Charateristics
LM5010
Typical Application Circuit and Block Diagram
(pin numbers are for the LLP-10 package)
20119944
FIGURE 1.
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6
LM5010
Typical Performance Characteristics
20119904
20119906
FIGURE 2. VCC vs VIN
FIGURE 4. ICC vs Externally Applied VCC
20119905
20119907
FIGURE 3. VCC vs ICC
FIGURE 5. On-Time vs VIN and RON
7
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LM5010
Typical Performance
Characteristics (Continued)
20119910
FIGURE 7. IIN vs VIN
20119908
FIGURE 6. Voltage at RON/SD Pin
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LM5010
Typical Performance Characteristics
(Continued)
20119911
FIGURE 8. Startup Sequence
48V telecom applications, as well as the new 42V automotive power bus. Implemented as a Point-of-Load regulator
following a highly efficient intermediate bus converter can
result in high overall system efficiency. Features include:
Thermal shutdown, VCC under-voltage lockout, gate drive
under-voltage lockout, and maximum duty cycle limit.
Functional Description
The LM5010 Step Down Switching Regulator features all the
functions needed to implement a low cost, efficient buck bias
power converter capable of supplying in excess of 1A to the
load. This high voltage regulator contains an N-Channel
buck switch, is easy to implement, and is available in the
thermally enhanced LLP-10 and TSSOP-14EP packages.
The regulator’s operation is based on a hysteretic control
scheme, and uses an on-time which varies inversely with
VIN. This feature results in the operating frequency remaining relatively constant with load and input voltage variations.
The switching frequency can range from 100 kHz to > 1.0
MHz. The hysteretic control requires no loop compensation
resulting in very fast load transient response. The valley
current limit detection circuit, internally set at 1.25A, holds
the buck switch off until the high current level subsides.
Figure 1 shows the functional block diagram. The LM5010
can be applied in numerous applications to efficiently regulate down higher voltages. This regulator is well suited for
Hysteretic Control Circuit
Overview
The LM5010 buck DC-DC regulator employs a control
scheme based on a comparator and a one-shot on-timer,
with the output voltage feedback (FB) compared to an internal reference (2.5V). If the FB voltage is below the reference
the buck switch is turned on for a time period determined by
the input voltage and a programming resistor (RON). Following the on-time the switch remains off for 265 ns, or until the
FB voltage falls below the reference, whichever is longer.
The buck switch then turns on for another on-time period.
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LM5010
Hysteretic Control Circuit
Overview (Continued)
Typically when the load current increases suddenly, the offtimes are temporarily at the minimum of 265 ns. Once regulation is established, the off-time resumes its normal value.
The output voltage is set by two external resistors (R1, R2).
The regulated output voltage is calculated as follows:
(1)
VOUT = 2.5V x (R1 + R2) / R2
(3)
At low load current, the circuit operates in discontinuous
conduction mode, during which the inductor current ramps
up from zero to a peak during the on-time, then ramps back
to zero before the end of the off-time. The next on-time
period starts when the voltage at FB falls below the reference - until then the inductor current remains zero, and the
load current is supplied by the output capacitor (C2). In this
mode the operating frequency is lower than in continuous
conduction mode, and varies with load current. Conversion
efficiency is maintained at light loads since the switching
losses reduce with the reduction in load and frequency. The
approximate discontinuous operating frequency can be calculated as follows:
Output voltage regulation is based on ripple voltage at the
feedback input, requiring a minimum amount of ESR for the
output capacitor C2. The LM5010 requires a minimum of 25
mV of ripple voltage at the FB pin. In cases where the
capacitor’s ESR is insufficient additional series resistance
may be required (R3 in Figure 1 ).
When in regulation, the LM5010 operates in continuous
conduction mode at heavy load currents and discontinuous
conduction mode at light load currents. In continuous conduction mode current always flows through the inductor,
never reaching zero during the off-time. In this mode the
operating frequency remains relatively constant with load
and line variations. The minimum load current for continuous
conduction mode is one-half the inductor’s ripple current
amplitude. The approximate operating frequency is calculated as follows:
(4)
where RL = the load resistance.
For applications where lower output voltage ripple is required the output can be taken directly from a low ESR
output capacitor as shown in Figure 9. However, R3 slightly
degrades the load regulation.
(2)
The buck switch duty cycle is approximately equal to:
20119915
FIGURE 9. Low Ripple Output Configuration
The minimum input operating voltage is determined by the
regulator’s dropout voltage, the VCC UVLO falling threshold
()5.65V), and the frequency. When VCC falls below the
falling threshold the VCC UVLO activates to shut off the buck
switch and ground the softstart pin. If VCC is externally
loaded, the minimum input voltage increases since the output impedance at VCC is )140Ω at low VIN. See Figures 2
and 3. In applications involving a high value for VIN where
power dissipation in the startup regulator is a concern, an
auxiliary voltage can be diode connected to the VCC pin
(Figure 10). Setting the auxiliary voltage to between 7.5V
and 14V shuts off the internal regulator, reducing internal
power dissipation. The current required into the VCC pin is
shown in Figure 4. Internally a diode connects VCC to VIN.
Start-up Regulator (VCC)
The startup regulator is integral to the LM5010. The input pin
(VIN) can be connected directly to line voltages up to 75V.
The VCC output is regulated at 7.0V, ± 6%, and is current
limited to 10 mA. Upon power up the regulator sources
current into the external capacitor at VCC (C3). With a 0.1 µF
capacitor at VCC, approximately 58 µs are required for the
VCC voltage to reach the under-voltage lockout threshold
(UVLO) of 5.8V (t1 in Figure 8), at which time the buck switch
is enabled, and the softstart pin is released to allow the
softstart capacitor (C6) to charge up. VOUT then increases to
its regulated value as the softstart voltage increases (t2 in
Figure 8).
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LM5010
Start-up Regulator (VCC)
(Continued)
20119916
FIGURE 10. Self Biased Configuration
Regulation Comparator
The feedback voltage at FB is compared to the voltage at the
Softstart pin (2.5V, ± 2%). In normal operation (the output
voltage is regulated) an on-time period is initiated when the
voltage at FB falls below 2.5V. The buck switch stays on for
the on-time causing the FB voltage to rise above 2.5V. After
the on-time period the buck switch stays off until the FB
voltage falls below 2.5V. Bias current at the FB pin is less
than 5 nA over temperature.
(5)
The inverse relationship of tON vs. VIN results in a nearly
constant frequency as VIN is varied. If the application requires a high frequency the minimum value for tON, and
consequently RON, is limited by the off-time (265 ns, ± 15%)
which limits the maximum duty cycle at minimum VIN. The
tolerance for Equation 5 is ± 25%. Frequencies in excess of
1 MHz are possible with the LM5010.
Over-Voltage Comparator
The feedback voltage at FB is compared to an internal 2.9V
reference. If the voltage at FB rises above 2.9V the on-time
is immediately terminated. This condition can occur if the
input voltage, or the output load, change suddenly. The buck
switch will not turn on again until the voltage at FB falls below
2.5V.
Shutdown
The LM5010 can be remotely shut down by taking the
RON/SD pin below 0.65V. See Figure 11. In this mode the
softstart pin is internally grounded, the on-timer is disabled,
and the input current at VIN is reduced (Figure 7). Releasing
the RON/SD pin allows normal operation to resume. When
the switch is open, the nominal voltage at RON/SD is shown
in Figure 6.
ON-Time Control
The on-time of the internal switch (see Figure 5) is determined by the RON resistor and the input voltage (VIN), calculated from the following:
20119918
FIGURE 11. Shutdown Implementation
11
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LM5010
current ratchets up until the lower peak attempts to exceed
the threshold. During the Current Limited portion of Figure
12, the current ramps down to the threshold during each
off-time, initiating the next on-time (assuming the voltage at
FB is < 2.5V). During each on-time the current ramps up an
amount equal to:
Current Limit
Current limit detection occurs during the off-time by monitoring the recirculating current through the free-wheeling diode
(D1). The detection threshold is 1.25A, ± 0.25A. Referring to
Figure 1, when the buck switch is off the inductor current
flows through the load, into SGND, through the sense resistor,
out of ISEN and through D1. If that current exceeds the
threshold the current limit comparator output switches to
delay the start of the next on-time period. The next on-time
starts when the current out of ISEN is below the threshold and
the voltage at FB is below 2.5V. If the overload condition
persists causing the inductor current to exceed the threshold
during each on-time, that is detected at the beginning of
each off-time. The operating frequency is lower due to
longer-than-normal off-times.
(6)
During this time the LM5010 is in a constant current mode,
with an average load current (IOCL) equal to the threshold +
∆I/2.
The “valley current limit” technique allows the load current to
exceed the current limit threshold as long as the lower peak
of the inductor current is less than the threshold.
Figure 12 illustrates the inductor current waveform. During
normal operation the load current is IO, the average of the
ripple waveform. When the load resistance decreases the
20119920
FIGURE 12. Inductor Current - Current Limit Operation
The current limit threshold can be increased by connecting
an external resistor (RCL) between SGND and ISEN. The
external resistor typically is less than 1Ω, and its calculation
is explained in the Applications Information section.
The peak current out of SW and ISEN must not exceed 3.5A.
The average current out of SW must be less than 3A, and
the average current out of ISEN must be less than 2A.
Softstart
The softstart feature allows the converter to gradually reach
a steady state operating point, thereby reducing startup
stresses and current surges. Upon turn-on, after VCC
reaches the under-voltage threshold (t1 in Figure 8), an
internal 11.5 µA current source charges the external capacitor at the Softstart pin to 2.5V (t2 in Figure 8). The ramping
voltage at SS (and at the non-inverting input of the regulation
comparator) ramps up the output voltage in a controlled
manner. This feature keeps the load current from going to
current limit during startup, thereby reducing inrush currents.
An internal switch grounds the Softstart pin if VCC is below
the under-voltage lockout threshold, if a thermal shutdown
occurs, or if the circuit is shutdown using the RON/SD pin.
N - Channel Buck Switch and
Driver
The LM5010 integrates an N-Channel buck switch and associated floating high voltage gate driver. The peak current
through the buck switch must not be allowed to exceed 3.5A,
and the average current must be less than 3A. The gate
driver circuit is powered by the external bootstrap capacitor
between BST and SW (C4). During each off-time, the SW pin
is at approximately -1V, and C4 is re-charged from VCC
through the internal high voltage diode. The minimum offtime of 265 ns ensures a minimum time each cycle to
recharge the bootstrap capacitor. A 0.022 µF ceramic capacitor is recommended for C4.
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Thermal Shutdown
The LM5010 should be operated so the junction temperature
does not exceed 125˚C. If the junction temperature increases above that, an internal Thermal Shutdown circuit
activates (typically) at 175˚C, taking the controller to a low
power reset state by disabling the buck switch and the
on-timer, and grounding the Softstart pin. This feature helps
prevent catastrophic failures from accidental device over12
RON, FS: RON sets the on-time, and can be chosen using
Equation 2 to set a nominal frequency, or from Equation 5 if
the on-time at a particular VIN is important. A higher frequency generally means a smaller inductor and capacitors
(value, size and cost), but higher switching losses. A lower
frequency means a higher efficiency, but with larger components. If PC board space is tight, a higher frequency is better.
The resulting on-time and frequency have a ± 25% tolerance. Re-arranging Equation 2 ,
(Continued)
heating. When the junction temperature reduces below
155˚C (typical hysteresis = 20˚C), the Softstart pin is released and normal operation resumes.
Applications Information
EXTERNAL COMPONENTS
The procedure for calculating the external components is
illustrated with a design example. The circuit in Figure 1 is to
be configured for the following specifications:
• VOUT = 10V
• VIN = 15V to 75V
The next larger standard value (137 kΩ) is chosen for RON,
yielding a nominal frequency of 618 kHz.
• FS = 625 kHz
• Minimum load current = 150 mA
• Maximum load current = 1.0A
• Softstart time = 5 ms.
R1 and R2:The ratio of these resistors is calculated from:
R1/R2 = (VOUT/2.5V) - 1
(7)
R1/R2 calculates to 3.0. The resistors should be chosen
from standard value resistors in the range of 1.0 kΩ - 10 kΩ.
Values of 3.0 kΩ for R1, and 1.0 kΩ for R2 will be used.
L1: The inductor value is determined based on the load
current, ripple current, and the minimum and maximum input
voltage (VIN(min), VIN(max)). Refer to Figure 13 .
20119922
FIGURE 13. Inductor Current
To keep the circuit in continuous conduction mode, the maximum allowed ripple current is twice the minimum load current, or 300 mAp-p. Using this value of ripple current, the
inductor (L1) is calculated using the following:
(9)
(8)
where FS(min) is the minimum frequency (FS - 25%).
IPK+ = 1.0A + 0.234A / 2 = 1.117A
RCL: Since it is obvious that the lower peak of the inductor
current waveform does not exceed 1.0A at maximum load
current (see Figure 13), it is not necessary to increase the
current limit threshold. Therefore RCL is not needed for this
exercise. For applications where the lower peak exceeds
1.0A, see the section below on increasing the current limit
threshold.
C2 and R3: Since the LM5010 requires a minimum of 25
mVp-p of ripple at the FB pin for proper operation, the
required ripple at VOUT1 is increased by R1 and R2. This
necessary ripple is created by the inductor ripple current
acting on C2’s ESR + R3. First, the minimum ripple current is
determined.
This provides a minimum value for L1 - the next higher
standard value (100 µH) will be used. L1 must be rated for
the peak current (IPK+) to prevent saturation. The peak current occurs at maximum load current with maximum ripple.
The maximum ripple is calculated by re-arranging Equation
8 using VIN(max), FS(min), and the minimum inductor value,
based on the manufacturer’s tolerance. Assume, for this
exercise, the inductor’s tolerance is ± 20%.
13
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LM5010
Thermal Shutdown
LM5010
Applications Information
peak of the output current waveform, ramps up to the peak
value, then drops to zero at turn-off. The average current into
VIN during this on-time is the load current. For a worst case
calculation, C1 must supply this average load current during
the maximum on-time. The maximum on-time is calculated
using Equation 5, with a 25% tolerance added:
(Continued)
(10)
C1 is calculated from:
The minimum ESR for C2 is then equal to:
where IO is the load current, and ∆V is the allowable ripple
voltage at VIN (1V for this example). Quality ceramic capacitors with a low ESR should be used for C1. To allow for
capacitor tolerances and voltage effects, a 2.2 µF capacitor
will be used
C3: The capacitor at the VCC pin provides not only noise
filtering and stability, but also prevents false triggering of the
VCC UVLO at the buck switch on/off transitions. For this
reason, C3 should be no smaller than 0.1 µF, and should be
a good quality, low ESR, ceramic capacitor. This capacitor
also determines the initial startup delay (t1 in Figure 8).
If the capacitor used for C2 does not have sufficient ESR, R3
is added in series as shown in Figure 1. C2 should generally
be no smaller than 3.3 µF, although that is dependent on the
frequency and the allowable ripple amplitude at VOUT1. Experimentation is usually necessary to determine the minimum value for C2, as the nature of the load may require a
larger value. A load which creates significant transients requires a larger value for C2 than a non-varying load.
D1: The important parameters are reverse recovery time and
forward voltage drop. The reverse recovery time determines
how long the current surge lasts each time the buck switch is
turned on. The forward voltage drop is significant in the
event the output is short-circuited as it is mainly this diode’s
voltage (plus the voltage across the current limit sense resistor) which forces the inductor current to decrease during
the off-time. For this reason, a higher voltage is better,
although that affects efficiency. A reverse recovery time of
)30 ns, and a forward voltage drop of )0.75V are preferred.
The reverse leakage specification is important as that can
significantly affect efficiency. Other types of diodes may have
a lower forward voltage drop, but may have longer recovery
times, or greater reverse leakage. D1 should be rated for the
maximum VIN, and for the peak current when in current limit
(IPK in Figure 11) which is equal to:
IPK = 1.5A + IOR(max) = 1.734A
where 1.5A is the maximum guaranteed current limit threshold, and the maximum ripple current was previously calculated as 234 mAp-p. Note that this calculation is valid only
when RCL is not required.
C1: Assuming the voltage supply feeding VIN has a source
impedance greater than zero, this capacitor limits the ripple
voltage at VIN while supplying most of the switch current
during the on-time. At maximum load current, when the buck
switch turns on, the current into VIN increases to the lower
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C4: The recommended value for C4 is 0.022 µF. A high
quality ceramic capacitor with low ESR is recommended as
C4 supplies the surge current to charge the buck switch gate
at turn-on. A low ESR also ensures a complete recharge
during each off-time.
C5: This capacitor suppresses transients and ringing due to
long lead inductance at VIN. A low ESR, 0.1 µF ceramic chip
capacitor is recommended, located physically close to the
LM5010.
C6: The capacitor at the SS pin determines the softstart
time, i.e. the time for the reference voltage at the regulation
comparator, and the output voltage, to reach their final value.
The time is determined from the following:
For a 5 ms softstart time, C6 calculates to 0.022 µF.
FINAL CIRCUIT
The final circuit is shown in Figure 14, and its performance is
shown in Figures 15 - 18.
14
LM5010
Applications Information
(Continued)
20119933
FIGURE 14. LM5010 Example Circuit
Item
Description
Part No.
Package
Value
C1
Ceramic Capacitor
TDK C4532X7R2A225M
1812
2.2 µF, 100V
C2
Ceramic Capacitor
TDK C4532X7R1E156M
1812
15 µF, 25V
C3
Ceramic Capacitor
Kemet C0805C104K4RAC
0805
0.1 µF, 16V
C4, C6
Ceramic Capacitor
Kemet C0805C223K4RAC
0805
0.022 µF, 16V
C5
Ceramic Capacitor
TDK C2012X7R2A104M
0805
0.1 µF, 100V
D1
Ultra fast diode
Central Semi CMR2U-01
SMB
100V, 2A
L1
Inductor
TDK SLF10145
10.1 x 10.1
100 µH
R1
Resistor
Vishay CRCW08053001F
0805
3.0 kΩ
R2
Resistor
Vishay CRCW08051001F
0805
1.0 kΩ
R3
Resistor
Vishay CRCW08052R80F
0805
2.8 Ω
RON
Resistor
Vishay CRCW08051373F
0805
137 kΩ
U1
Switching regulator
National Semi LM5010
15
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LM5010
Applications Information
(Continued)
20119936
FIGURE 17. Output Voltage Ripple vs VIN
Circuit of Figure 14
20119934
FIGURE 15. Efficiency vs VIN
Circuit of Figure 14
20119937
FIGURE 18. Frequency vs VIN
Circuit of Figure 14
20119935
FIGURE 16. Efficiency vs Load Current and VIN
Circuit of Figure 14
INCREASING THE CURRENT LIMIT THRESHOLD
The current limit threshold is nominally 1.25A, with a minimum guaranteed value of 1.0A. If, at maximum load current,
the lower peak of the inductor current (IPK- in Figure 13)
exceeds 1.0A, resistor RCL must be added between SGND
and ISEN to increase the current limit threshold to equal or
exceed that lower peak current. This resistor diverts some of
the recirculating current from the internal sense resistor so
that a higher current level is needed to switch the internal
current limit comparator. IPK- is calculated from:
(11)
where IO(max) is the maximum load current, and IOR(min) is
the minimum ripple current calculated using Equation 10.
RCL is calculated from:
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16
LM5010
Applications Information
(Continued)
The inductor L1 and diode D1 must be rated for this current.
(12)
where 0.11Ω is the minimum value of the internal resistance
from SGND to ISEN. The next smaller standard value resistor
should be used for RCL. With the addition of RCL it is necessary to check the average and peak current values to ensure
they do not exceed the LM5010 limits. At maximum load
current the average current through the internal sense resistor is:
PC BOARD LAYOUT
The LM5010 regulation, over-voltage, and current limit comparators are very fast, and will respond to short duration
noise pulses. Layout considerations are therefore critical for
optimum performance. The layout must be as neat and
compact as possible, and all the components must be as
close as possible to their associated pins. The current loop
formed by D1, L1, C2, and the SGND and ISEN pins should be
as small as possible. The ground connection from C2 to C1
should be as short and direct as possible. If it is expected
that the internal dissipation of the LM5010 will produce high
junction temperatures during normal operation, good use of
the PC board’s ground plane can help considerably to dissipate heat. The exposed pad on the IC package bottom can
be soldered to a ground plane, and that plane should both
extend from beneath the IC, and be connected to exposed
ground plane on the board’s other side using as many vias
as possible. The exposed pad is internally connected to the
IC substrate.
The use of wide PC board traces at the pins, where possible,
can help conduct heat away from the IC. The four No Connect pins on the TSSOP package are not electrically connected to any part of the IC, and may be connected to
ground plane to help dissipate heat from the package. Judicious positioning of the PC board within the end product,
along with the use of any available air flow (forced or natural
convection) can help reduce the junction temperature.
(13)
If IAVE is less than 2.0A no changes are necessary. If it
exceeds 2.0A, RCL must be reduced. The upper peak of the
inductor current (IPK+), at maximum load current, is calculated using the following:
(14)
where IOR(max) is calculated using Equation 9. If IPK+ exceeds 3.5A , the inductor value must be increased to reduce
the ripple amplitude. This will necessitate recalculation of
IOR(min), IPK-, and RCL.
When the circuit is in current limit, the upper peak current out
of the SW pin is
17
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LM5010
Physical Dimensions
inches (millimeters) unless otherwise noted
14-Lead TSSOP Package
NS Package Number MXA14A
10-Lead LLP Package
NS Package Number SDC10A
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18
LM5010 High Voltage 1A Step Down Switching Regulator
Notes
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves
the right at any time without notice to change said circuitry and specifications.
For the most current product information visit us at www.national.com.
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