Product Folder Sample & Buy Support & Community Tools & Software Technical Documents LM60, LM60-Q1 SNIS119E – MAY 2004 – REVISED SEPTEMBER 2015 LM60 and LM60-Q1 2.7-V, SOT-23 or TO-92 Temperature Sensor 1 Features 3 Description • • • • • The LM60 and LM60-Q1 devices are precision integrated-circuit temperature sensors that can sense a −40°C to +125°C temperature range while operating from a single 2.7-V supply. The output voltage of the device is linearly proportional to Celsius (Centigrade) temperature (6.25 mV/°C) and has a DC offset of 424 mV. The offset allows reading negative temperatures without the need for a negative supply. The nominal output voltage of the device ranges from 174 mV to 1205 mV for a −40°C to +125°C temperature range. The device is calibrated to provide accuracies of ±2°C at room temperature and ±3°C over the full −25°C to +125°C temperature range. 1 • Calibrated Linear Scale Factor of 6.25 mV/°C Rated for Full −40°C to +125°C Range Suitable for Remote Applications Available in SOT-23 and TO-92 Packages LM60-Q1 is AEC-Q100 Grade 1 Qualified and is Manufactured on an Automotive Grade Flow. Key Specifications – Accuracy at 25°C: ± 2°C and ± 3°C (Maximum) – Accuracy for −40°C to +125°C: ±4°C (Maximum) – Accuracy for −25°C to +125°C: ±3°C (Maximum) – Temperature Slope: 6.25 mV/°C – Power-Supply Voltage Range: 2.7 V to 10 V – Current Drain at 25°C: 110 μA (Maximum) – Nonlinearity: ±0.8°C (Maximum) – Output Impedance: 800 Ω (Maximum) 2 Applications • • • • • • • Automotive Cell Phones and Computers Power Supply Modules Battery Management Fax Machines and Printers HVAC and Disk Drives Appliances The linear output of the device, 424-mV offset, and factory calibration simplify external circuitry required in a single supply environment where reading negative temperatures is required. Because the quiescent current of the device is less than 110 μA, self-heating is limited to a very low 0.1°C in still air in the SOT-23 package. Shutdown capability for the device is intrinsic because its inherent low power consumption allows it to be powered directly from the output of many logic gates. Device Information(1) PART NUMBER LM60 LM60 LM60-Q1 Simplified Schematic PACKAGE BODY SIZE (NOM) TO-92 (3) 4.30 mm × 4.30 mm SOT-23 (3) 2.92 mm × 1.30 mm SOT-23 (3) 2.92 mm × 1.30 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Full-Range Centigrade Temperature Sensor (−40°C to +125°C) 1.50 1.205 LM60/LM60-Q1 Output Voltage (V) 1.25 1.00 0.580 0.75 0.50 0.174 0.25 VO = (+6.25 mV/°C × T °C) + 424 mV 0.00 ±50 ±25 0 25 50 75 DUT Temperature (ƒC) 100 125 150 C001 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. LM60, LM60-Q1 SNIS119E – MAY 2004 – REVISED SEPTEMBER 2015 www.ti.com Table of Contents 1 2 3 4 5 6 7 8 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Device Comparison Table..................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 4 4 7.1 7.2 7.3 7.4 7.5 7.6 4 4 5 5 5 7 Absolute Maximum Ratings ...................................... ESD Ratings ............................................................ Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... Typical Characteristics .............................................. Detailed Description .............................................. 9 8.1 Overview ................................................................... 9 8.2 Functional Block Diagram ......................................... 9 8.3 Feature Description................................................... 9 8.4 Device Functional Modes.......................................... 9 9 Application and Implementation ........................ 10 9.1 Application Information............................................ 10 9.2 Typical Applications ................................................ 11 9.3 System Examples ................................................... 13 10 Power Supply Recommendations ..................... 13 11 Layout................................................................... 13 11.1 Layout Guidelines ................................................. 13 11.2 Layout Example .................................................... 14 11.3 Thermal Considerations ........................................ 14 12 Device and Documentation Support ................. 16 12.1 12.2 12.3 12.4 12.5 Related Links ........................................................ Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 16 16 16 16 16 13 Mechanical, Packaging, and Orderable Information ........................................................... 16 4 Revision History Changes from Revision D (November 2012) to Revision E • 2 Page Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1 Submit Documentation Feedback Copyright © 2004–2015, Texas Instruments Incorporated Product Folder Links: LM60 LM60-Q1 LM60, LM60-Q1 www.ti.com SNIS119E – MAY 2004 – REVISED SEPTEMBER 2015 5 Device Comparison Table ORDER NUMBER ACCURACY OVER SPECIFIED TEMPERATURE RANGE SPECIFIED TEMPERATURE RANGE LM60BIM3 ±3 –25°C ≤ TA ≤ +125°C ±4 –40°C ≤ TA ≤ +125°C ±4 –40°C ≤ TA ≤ +125°C LM60BIZ ±3 –25°C ≤ TA ≤ +125°C LM60CIZ ±4 –40°C ≤ TA ≤ +125°C LM60BIM3X LM60CIM3 LM60CIM3X LM60QIM3 LM60QIM3X Submit Documentation Feedback Copyright © 2004–2015, Texas Instruments Incorporated Product Folder Links: LM60 LM60-Q1 3 LM60, LM60-Q1 SNIS119E – MAY 2004 – REVISED SEPTEMBER 2015 www.ti.com 6 Pin Configuration and Functions DBZ Package 3-Pin SOT-23 Top View LP Package 3-Pin TO-92 Bottom View Pin Functions PIN NAME TYPE SOT-23 NO. TO92 NO. GND 3 3 GND VOUT 2 2 O +VS 1 1 POWER DESCRIPTION Device ground, connected to power supply negative terminal Temperature sensor analog output Positive power supply pin 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT V Supply voltage −0.2 12 Output voltage −0.6 VS + 0.6 V 10 mA Output current Input current at any pin (2) Maximum junction temperature (TJMAX) −65 Storage temperature (Tstg) (1) (2) 5 mA 125 °C 150 °C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. When the input voltage (VI) at any pin exceeds power supplies (VI < GND or VI > +VS), the current at that pin should be limited to 5 mA. 7.2 ESD Ratings VALUE UNIT LM60 in DBZ Package V(ESD) Electrostatic discharge (1) Human-body model (HBM) ±2500 Machine Model (MM) ±250 Human-body model (HBM) ±2500 Machine Model (MM) ±200 V LM60 in LP Package V(ESD) (1) 4 Electrostatic discharge (1) V The human body model is a 100-pF capacitor discharged through a 1.5-kΩ resistor into each pin. The machine model is a 200-pF capacitor discharged directly into each pin. Submit Documentation Feedback Copyright © 2004–2015, Texas Instruments Incorporated Product Folder Links: LM60 LM60-Q1 LM60, LM60-Q1 www.ti.com SNIS119E – MAY 2004 – REVISED SEPTEMBER 2015 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT LM60B (TMIN ≤ TA ≤ TMAX) –25 125 °C LM60C/LM60-Q1 (TMIN ≤ TA ≤ TMAX) –40 125 °C Supply Voltage (+VS) 2.7 10 V (1) Soldering process must comply with National Semiconductor's Reflow Temperature Profile specifications. Refer to www.national.com/packaging. Reflow temperature profiles are different for lead-free and non-lead-free packages. 7.4 Thermal Information THERMAL METRIC (1) LM60/LM60-Q1 LM60 DBZ (SOT-23) LP (TO-92) 3 PINS 3 PINS UNIT RθJA (2) Junction-to-ambient thermal resistance 266 162 °C/W RθJC(top) Junction-to-case (top) thermal resistance 135 85 °C/W RθJB Junction-to-board thermal resistance 59 — °C/W ψJT Junction-to-top characterization parameter 18 29 °C/W ψJB Junction-to-board characterization parameter 58 142 °C/W (1) (2) For more information about traditional and new thermal metrics, see the Semiconductor or IC Package Thermal Metrics application report, SPRA953. The junction to ambient thermal resistance (RθJA) is specified without a heat sink in still air. 7.5 Electrical Characteristics Unless otherwise noted, these specifications apply for +VS = 3 VDC and ILOAD = 1 μA. All limits TA = TJ = 25°C unless otherwise noted. PARAMETER Accuracy TEST CONDITIONS LM60B TA = TJ = TMIN to TMAX LM60C/LM60-Q1 TA = TJ = TMIN to TMAX (3) MIN (1) TYP (2) MAX (1) –2 2 –3 3 –3 3 –4 4 Output Voltage at 0°C UNIT °C °C 424 mV LM60B TA = TJ = TMIN to TMAX –0.6 ±0.6 LM60C/LM60-Q1 TA = TJ = TMIN to TMAX –0.8 ±0.8 LM60B TA = TJ = TMIN to TMAX 6.06 6.44 LM60C/LM60-Q1 TA = TJ = TMIN to TMAX 6 6.5 Nonlinearity (4) °C 6.25 Sensor Gain (Average Slope) Output Impedance 3 V ≤ +VS ≤ 10 V 2.7 V ≤ +VS ≤ 3.3 V TA = TJ = TMIN to TMAX Line Regulation (5) (1) (2) (3) (4) (5) 800 Ω –0.3 0.3 mV/V –2.3 2.3 mV TA = TJ = TMIN to TMAX TA = TJ = TMIN to TMAX mV/°C Limits are specified to TI's AOQL (Average Outgoing Quality Level). Typicals are at TJ = TA = 25°C and represent most likely parametric norm. Accuracy is defined as the error between the output voltage and 6.25 mV/°C times the case temperature of the device plus 424 mV, at specified conditions of voltage, current, and temperature (expressed in °C). Nonlinearity is defined as the deviation of the output-voltage-versus-temperature curve from the best-fit straight line, over the rated temperature range of the device. Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output due to heating effects can be computed by multiplying the internal dissipation by the thermal resistance. Submit Documentation Feedback Copyright © 2004–2015, Texas Instruments Incorporated Product Folder Links: LM60 LM60-Q1 5 LM60, LM60-Q1 SNIS119E – MAY 2004 – REVISED SEPTEMBER 2015 www.ti.com Electrical Characteristics (continued) Unless otherwise noted, these specifications apply for +VS = 3 VDC and ILOAD = 1 μA. All limits TA = TJ = 25°C unless otherwise noted. PARAMETER TEST CONDITIONS Quiescent Current 2.7 V ≤ +VS ≤ 10 V Change of Quiescent Current 2.7 V ≤ +VS ≤ 10 V MIN (1) (6) 6 MAX (1) 82 110 μA 125 μA TA = TJ = TMIN to TMAX Temperature Coefficient of Quiescent Current Long Term Stability (6) TYP (2) TJ = TMAX = 125°C for 1000 hours UNIT ±5 μA 0.2 μA/°C ±0.2 °C For best long-term stability, any precision circuit will give best results if the unit is aged at a warm temperature, temperature cycled for at least 46 hours before long-term life test begins for both temperatures. This is especially true when a small (surface-mount) part is wavesoldered; allow time for stress relaxation to occur. The majority of the drift will occur in the first 1000 hours at elevated temperatures. The drift after 1000 hours will not continue at the first 1000 hour rate. Submit Documentation Feedback Copyright © 2004–2015, Texas Instruments Incorporated Product Folder Links: LM60 LM60-Q1 LM60, LM60-Q1 www.ti.com SNIS119E – MAY 2004 – REVISED SEPTEMBER 2015 7.6 Typical Characteristics To generate these curves, the device was mounted to a printed-circuit-board as shown in Figure 20. Figure 1. Thermal Resistance Junction to Air Figure 2. Thermal Time Constant Figure 3. Thermal Response in Still Air With Heat Sink Figure 4. Thermal Response in Stirred Oil Bath With Heat Sink 0 Figure 5. Thermal Response in Still Air Without a Heat Sink Figure 6. Start-Up Voltage vs Temperature Submit Documentation Feedback Copyright © 2004–2015, Texas Instruments Incorporated Product Folder Links: LM60 LM60-Q1 7 LM60, LM60-Q1 SNIS119E – MAY 2004 – REVISED SEPTEMBER 2015 www.ti.com Typical Characteristics (continued) To generate these curves, the device was mounted to a printed-circuit-board as shown in Figure 20. Figure 7. Quiescent Current vs Temperature Figure 8. Accuracy vs Temperature Figure 9. Noise Voltage Figure 10. Supply Voltage vs Supply Current SVA-1268122 Figure 11. Start-Up Response 8 Submit Documentation Feedback Copyright © 2004–2015, Texas Instruments Incorporated Product Folder Links: LM60 LM60-Q1 LM60, LM60-Q1 www.ti.com SNIS119E – MAY 2004 – REVISED SEPTEMBER 2015 8 Detailed Description 8.1 Overview The LM60 and LM60-Q1 devices are precision analog bipolar temperature sensors that can sense a −40°C to +125°C temperature range while operating from a single 2.7-V supply. The output voltage of the LM60 and LM60-Q1 is linearly proportional to Celsius (Centigrade) temperature (6.25 mV/°C) and has a DC offset of 424 mV. The offset allows reading negative temperatures with a single positive supply. The nominal output voltage of the device ranges from 174 mV to 1205 mV for a −40°C to +125°C temperature range. The device is calibrated to provide accuracies of ±2.0°C at room temperature and ±3°C over the full −25°C to +125°C temperature range. With a quiescent current of the device is less than 110 μA, self-heating is limited to a very low 0.1°C in still air in the SOT-23 package. Shutdown capability for the device is intrinsic because its inherent low power consumption allows it to be powered directly from the output of many logic gates. The output of the LM60 and LM60-Q1 is a Class A base emitter follower, thus the LM60 and LM60-Q1 can source quite a bit of current while sinking less than 1 µA. In any event load current should be minimized in order to limit it's contribution to the total temperature error. The temperature-sensing element is based on a delta VBE topology of two transistors (Q1 and Q2 in Functional Block Diagram) that are sized with a 10:1 area ratio. 8.2 Functional Block Diagram 8.3 Feature Description 8.3.1 LM60 Transfer Function The LM60 follows a simple linear transfer function to achieve the accuracy as listed in Electrical Characteristics as given: VO = (6.25 mV/°C × T °C) + 424 mV where • • T is the temperature VO is the LM60 output voltage (1) 8.4 Device Functional Modes The device's only functional mode is that it has an analog output directly proportional to temperature. Submit Documentation Feedback Copyright © 2004–2015, Texas Instruments Incorporated Product Folder Links: LM60 LM60-Q1 9 LM60, LM60-Q1 SNIS119E – MAY 2004 – REVISED SEPTEMBER 2015 www.ti.com 9 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 9.1 Application Information The device has low supply current and wide supply range therefore it can easily be driven by a battery. 9.1.1 Capacitive Loads The device handles capacitive loading well. Without any special precautions, the device can drive any capacitive load as shown in Figure 12. Over the specified temperature range the device has a maximum output impedance of 800 Ω. In an extremely noisy environment adding some filtering to minimize noise pick-up could be required. TI recommends that 0.1 μF be added from +VS to GND to bypass the power supply voltage, as shown in Figure 13. In a noisy environment, adding a capacitor from the output to ground. A 1-μF output capacitor with the 800-Ω output impedance will form a 199-Hz lowpass filter. Because the thermal time constant of the device is much slower than the 6.3-ms time constant formed by the RC, the overall response time of the device is not be significantly affected. For much larger capacitors this additional time lag increases the overall response time of the device. LM60/LM60-Q1 Figure 12. No Decoupling Required for Capacitive Load LM60/LM60-Q1 Figure 13. Filter Added for Noisy Environment 10 Submit Documentation Feedback Copyright © 2004–2015, Texas Instruments Incorporated Product Folder Links: LM60 LM60-Q1 LM60, LM60-Q1 www.ti.com SNIS119E – MAY 2004 – REVISED SEPTEMBER 2015 9.2 Typical Applications 9.2.1 Full-Range Centigrade Temperature Sensor Because the LM60 is a simple temperature sensor that provides an analog output, design requirements related to the layout are also important. Refer to Layout for details. LM60/LM60-Q1 VO = (6.25 mV/°C × T°C) + 424 mV Figure 14. Full-Range Centigrade Temperature Sensor (−40°C to +125°C) Operating from a Single Li-Ion Battery Cell 9.2.1.1 Design Requirements For this design example, use the design parameters listed in Table 1. Table 1. Temperature and Typical VO Values of Figure 14 TEMPERATURE (T) TYPICAL VO 125°C 1205 mV 100°C 1049 mV 25°C 580 mV 0°C 424 mV –25°C 268 mV –40°C 174 mV 9.2.1.2 Detailed Design Procedure Selection of the LM60 is based on the output voltage transfer function being able to meet the needs of the rest of the system. 9.2.1.3 Application Curve 1.50 1.205 Output Voltage (V) 1.25 1.00 0.580 0.75 0.50 0.174 0.25 VO = (+6.25 mV/°C × T °C) + 424 mV 0.00 ±50 ±25 0 25 50 75 100 DUT Temperature (ƒC) 125 150 C001 Figure 15. LMT60 and LMT60-Q1 Output Transfer Function Submit Documentation Feedback Copyright © 2004–2015, Texas Instruments Incorporated Product Folder Links: LM60 LM60-Q1 11 LM60, LM60-Q1 SNIS119E – MAY 2004 – REVISED SEPTEMBER 2015 www.ti.com 9.2.2 Centigrade Thermostat Application V+ R3 R4 LM4040 V+ VT R1 4.1V U3 0.1 µF R2 (High = overtemp alarm) + U1 - VOUT LM7211 LM60 VTemp U2 Figure 16. Centigrade Thermostat 9.2.2.1 Design Requirements A simple thermostat can be created by using a reference (LM4040) and a comparator (LM7211) as shown in Figure 16. 9.2.2.2 Detailed Design Procedure Use Equation 2 and Equation 3 to calculate the threshold values for T1 and T2. (4.1)R2 R2 + R1||R3 (2) (4.1)R2||R3 VT2 = R1 + R2||R3 (3) VT1 = 9.2.2.3 Application Curve VTEMP VT1 VT2 VOUT Figure 17. Thermostat Output Waveform 12 Submit Documentation Feedback Copyright © 2004–2015, Texas Instruments Incorporated Product Folder Links: LM60 LM60-Q1 LM60, LM60-Q1 www.ti.com SNIS119E – MAY 2004 – REVISED SEPTEMBER 2015 9.3 System Examples 9.3.1 Conserving Power Dissipation With Shutdown The LMT89 draws very little power therefore it can simply be shutdown by driving the LMT89 supply pin with the output of a logic gate as shown in Figure 18. LM60/LM60-Q1 Figure 18. Conserving Power Dissipation With Shutdown 10 Power Supply Recommendations In an extremely noisy environment, adding some filtering to minimize noise pick-up. Adding 0.1 μF from +VS to GND is recommended to bypass the power supply voltage, as shown in Figure 13. In a noisy environment adding a capacitor from the output to ground. 11 Layout 11.1 Layout Guidelines The LM60 and LM60-Q1 can be applied easily in the same way as other integrated-circuit temperature sensors. It can be glued or cemented to a surface. The temperature that the LM60 and LM60-Q1 is sensing will be within about +0.1°C of the surface temperature that the leads of th LM60 and LM60-Q1 are attached to. This presumes that the ambient air temperature is almost the same as the surface temperature. If the air temperature were much higher or lower than the surface temperature, the actual temperature of the device die would be at an intermediate temperature between the surface temperature and the air temperature. To ensure good thermal conductivity the backside of the device die is directly attached to the GND pin. The lands and traces to the device will, of course, be part of the printed-circuit-board, which is the object whose temperature is being measured. These printed-circuit-board lands and traces do not cause the temperature of the device to deviate from the desired temperature. Alternatively, the device can be mounted inside a sealed-end metal tube, and can then be dipped into a bath or screwed into a threaded hole in a tank. As with any IC, the device and accompanying wiring and circuits must be kept insulated and dry to avoid leakage and corrosion. Specifically when the device operates at cold temperatures where condensation can occur. Printed-circuit coatings and varnishes such as a conformal coating and epoxy paints or dips are often used to ensure that moisture cannot corrode the device or connections. Submit Documentation Feedback Copyright © 2004–2015, Texas Instruments Incorporated Product Folder Links: LM60 LM60-Q1 13 LM60, LM60-Q1 SNIS119E – MAY 2004 – REVISED SEPTEMBER 2015 www.ti.com 11.2 Layout Example +VS 1 3 VO GND 2 Via to ground plane Via to power plane 1/2-inch square printed circuit board with 2 oz. copper foil or similar. Figure 19. PCB Layout 11.3 Thermal Considerations The thermal resistance junction to ambient (RθJA) is the parameter used to calculate the rise of a device junction temperature due to the device power dissipation. Use Equation 4 to calculate the rise in the die temperature of the device. TJ = TA + RθJA [(+VS IQ) + (+VS − VO) IL] where • • IQ is the quiescent current IL is the load current on the output (4) Table 2 summarizes the rise in die temperature of the LM60 and LM60-Q1 without any loading, and the thermal resistance for different conditions. The values in Table 2 were actually measured where as the values shown in Thermal Information where calculated using modeling methods as described in the Semiconductor and IC Package Thermal Metrics application report, SPRA953. Table 2. Temperature Rise of LM60/LM60-Q1 Due to Self-Heating and Thermal Resistance (RθJA) SOT-23 (1) NO HEAT SINK Still air 14 TO-92 (1) NO HEAT FIN TO-92 (3) SMALL HEAT FIN RθJA TJ − TA RθJA TJ − TA RθJA TJ − TA RθJA (°C/W) (°C) (°C/W) (°C) (°C/W) (°C) (°C/W) (°C) 450 0.17 260 0.1 180 0.07 140 0.05 180 0.07 90 0.034 70 0.026 Moving air (1) (2) (3) SOT-23 (2) SMALL HEAT FIN TJ − TA Part soldered to 30 gauge wire. Heat sink used is 1/2-in square printed-circuit-board with 2-oz. foil with part attached as shown in Figure 20. Part glued or leads soldered to 1-in square of 1/16-in printed-circuit-board with 2-oz. foil or similar. Submit Documentation Feedback Copyright © 2004–2015, Texas Instruments Incorporated Product Folder Links: LM60 LM60-Q1 LM60, LM60-Q1 www.ti.com SNIS119E – MAY 2004 – REVISED SEPTEMBER 2015 Ground Plane on 062 copper clad board. LM60/LM60-Q1 1/2" 1/2" 1/2-in Square Printed-Circuit-Board with 2-oz. Copper Foil or Similar. Figure 20. Printed-Circuit-Board Used for Heat Sink to Generate Thermal Response Curves Submit Documentation Feedback Copyright © 2004–2015, Texas Instruments Incorporated Product Folder Links: LM60 LM60-Q1 15 LM60, LM60-Q1 SNIS119E – MAY 2004 – REVISED SEPTEMBER 2015 www.ti.com 12 Device and Documentation Support 12.1 Related Links The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 3. Related Links PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY LM60 Click here Click here Click here Click here Click here LM60-Q1 Click here Click here Click here Click here Click here 12.2 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 12.3 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 12.4 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 12.5 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 16 Submit Documentation Feedback Copyright © 2004–2015, Texas Instruments Incorporated Product Folder Links: LM60 LM60-Q1 PACKAGE OPTION ADDENDUM www.ti.com 23-Aug-2015 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LM60BIM3 NRND SOT-23 DBZ 3 1000 TBD Call TI Call TI -25 to 125 T6B LM60BIM3/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -25 to 125 T6B LM60BIM3X NRND SOT-23 DBZ 3 3000 TBD Call TI Call TI -25 to 125 T6B LM60BIM3X/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -25 to 125 T6B LM60BIZ/LFT3 ACTIVE TO-92 LP 3 2000 Green (RoHS & no Sb/Br) CU SN N / A for Pkg Type LM60BIZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) CU SN N / A for Pkg Type -25 to 125 LM60 BIZ LM60CIM3 NRND SOT-23 DBZ 3 1000 TBD Call TI Call TI -40 to 125 T6C LM60CIM3/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 T6C LM60 BIZ LM60CIM3X NRND SOT-23 DBZ 3 3000 TBD Call TI Call TI -40 to 125 T6C LM60CIM3X/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 T6C LM60CIZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) CU SN N / A for Pkg Type -40 to 125 LM60 CIZ LM60QIM3/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L60Q LM60QIM3X/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L60Q (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 23-Aug-2015 Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. 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OTHER QUALIFIED VERSIONS OF LM60, LM60-Q1 : • Catalog: LM60 • Automotive: LM60-Q1 NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product • Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 6-Mar-2015 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) LM60BIM3 SOT-23 DBZ 3 1000 178.0 8.4 LM60BIM3/NOPB SOT-23 DBZ 3 1000 178.0 LM60BIM3X SOT-23 DBZ 3 3000 178.0 LM60BIM3X/NOPB SOT-23 DBZ 3 3000 LM60CIM3 SOT-23 DBZ 3 LM60CIM3/NOPB SOT-23 DBZ LM60CIM3X SOT-23 DBZ LM60CIM3X/NOPB SOT-23 LM60QIM3/NOPB LM60QIM3X/NOPB 3.3 2.9 1.22 4.0 8.0 Q3 8.4 3.3 2.9 1.22 4.0 8.0 Q3 8.4 3.3 2.9 1.22 4.0 8.0 Q3 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 Pack Materials-Page 1 W Pin1 (mm) Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 6-Mar-2015 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM60BIM3 SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM60BIM3/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM60BIM3X SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM60BIM3X/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM60CIM3 SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM60CIM3/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM60CIM3X SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM60CIM3X/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM60QIM3/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM60QIM3X/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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