TI1 LMT87DCKT Sc70/to-92, analog temperature sensors with class-ab output Datasheet

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LMT87, LMT87-Q1
SNIS170C – JAN 2014 – REVISED OCTOBER 2015
LMT87/LMT87-Q1 SC70/TO-92,
Analog Temperature Sensors with Class-AB Output
1 Features
3 Description
•
The LMT87 and LMT87-Q1 are precision CMOS
integrated-circuit temperature sensors with an analog
output voltage that is linearly and inversely
proportional to temperature. Its features make it
suitable for many general temperature sensing
applications. It can operate down to 2.7-V supply with
5.4-µA power consumption. Package options
including through-hole TO-92 package allows the
LMT87 to be mounted on-board, off-board, to a heat
sink, or on multiple unique locations in the same
application. A class-AB output structure gives the
LMT87 and LMT87-Q1 strong output source and sink
current capability that can directly drive up to 1.1-nF
capacitive loads. This means it is well suited to drive
an analog-to-digital converter sample-and-hold input
with its transient load requirements. It has accuracy
specified in the operating range of −50°C to 150°C.
The accuracy, 3-lead package options, and other
features also make the LMT87 and LMT87-Q1 an
alternative to thermistors.
1
•
•
•
•
•
•
•
•
•
LMT87-Q1 is AEC-Q100 Grade 0 Qualified and is
Manufactured on an Automotive Grade Flow
Very Accurate: ±0.3°C typical
Wide Temperature Range of −50°C to 150°C
Low 5.4-µA Quiescent Current
Sensor Gain of –13.6 mV/°C
Packages:
– Small SC70 (SOT 5-lead) Surface Mount
– Leaded TO-92
Output is Short-Circuit Protected
Push-Pull Output with 50-µA Source Current
Capability
Footprint Compatible with the Industry-Standard
LM20/19 and LM35 Temperature Sensors
Cost-Effective Alternative to Thermistors
2 Applications
•
•
•
•
•
•
•
•
For devices with different average sensor gains and
comparable
accuracy,
the
LMT84/LM84-Q1,
LMT85/LMT85-Q1, and LMT86/LMT86-Q1 (For more
details, see .)
Automotive
Industrial
White Goods – Appliances
Battery Management
Disk Drives
Games
Wireless Transceivers
Cell phones
Device Information (1)
PART NUMBER
LMT87
LMT87-Q1
(1)
PACKAGE
BODY SIZE (NOM)
SOT (5)
2.00 mm x 1.25 mm
TO-92 (3)
4.3 mm x 3.5 mm
SOT (5)
2.00 mm x 1.25 mm
For all available packages, see the orderable addendum
addendum at the end of the data sheet.
4 Full-Range Celsius Temperature Sensor (−50°C to 150°C)
Output Voltage vs Temperature
VDD (+2.7V to +5.5V)
3.5
LMT87
CBP
OUT
OUTPUT VOLTAGE (V)
3.0
VDD
2.5
2.0
1.5
1.0
0.5
0.0
GND
±50
0
50
100
150
TEMPERATURE (ƒC)
C001
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LMT87, LMT87-Q1
SNIS170C – JAN 2014 – REVISED OCTOBER 2015
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Table of Contents
1
2
3
4
5
6
7
8
Features ..................................................................
Applications ...........................................................
Description .............................................................
Full-Range Celsius Temperature Sensor (−50°C
to 150°C) .................................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
5
5
5
5
6
6
6
7
Absolute Maximum Ratings ......................................
ESD Ratings - Commercial .......................................
ESD Ratings - Automotive ........................................
Recommended Operating Conditions ......................
Thermal Information ..................................................
Accuracy Characteristics...........................................
Electrical Characteristics ..........................................
Typical Characteristics .............................................
8.2 Functional Block Diagram ......................................... 9
8.3 Feature Description................................................... 9
8.4 Device Functional Modes........................................ 11
9
1
2
4
5
Detailed Description .............................................. 9
8.1 Overview ................................................................... 9
Application and Implementation ........................ 12
9.1 Application Information............................................ 12
9.2 Typical Applications ............................................... 12
10 Power Supply Recommendations ..................... 14
11 Layout................................................................... 14
11.1 Layout Guidelines ................................................. 14
11.2 Layout Example .................................................... 15
12 Device and Documentation Support ................. 16
12.1
12.2
12.3
12.4
12.5
Related Links ........................................................
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
16
16
16
16
16
13 Mechanical, Packaging, and Orderable
Information ........................................................... 16
5 Revision History
Changes from Revision B (May 2014) to Revision C
Page
•
Deleted all mentions of TO-126 package .............................................................................................................................. 1
•
Added TO-92 LPM pin configuration graphic ......................................................................................................................... 4
•
Changed Handling Ratings to ESD Ratings and moved Storage Temperature to Absolute Maximum Ratings table........... 5
•
Changed KV to V ................................................................................................................................................................... 5
•
Added layout recommendation for TO-92 LP and LPM packages....................................................................................... 15
•
Added Community Resources ............................................................................................................................................. 16
Changes from Revision A (June 2013) to Revision B
Page
•
Added data sheet flow and layout to conform with new TI standards. Added the following sections: Application and
Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, Mechanical,
Packaging, and Orderable Information .................................................................................................................................. 1
•
Added TO-92 and TO-126 package information. .................................................................................................................. 1
•
Changed 450 °C/W to 275 °C/W. New specification is derived using TI ' s latest methodology. ......................................... 6
•
Deleted Note: The input current is leakage only and is highest at high temperature. It is typically only 0.001 μA. The
1 μA limit is solely based on a testing limitation and does not reflect the actual performance of the part............................. 6
2
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Device Comparison (1)
ORDER NUMBER
PACKAGE
(2)
BODY SIZE (NOM)
MOUNTING TYPE
LMT87DCK
SOT (AKA
5
2.00 mm x 1.25 mm
Surface mount
LMT87LP
TO-92 (AKA (2): LP)
3
4.3 mm x 3.5 mm
Through-hole; straight leads
LMT87LPM
TO-92 (AKA (2): LPM)
3
4.3 mm x 3.5 mm
Through-hole; formed leads
5
2.00 mm x 1.25 mm
Surface mount
LMT87DCK-Q1
(1)
(2)
SOT (AKA
: SC70, DCK)
PIN
(2)
: SC70, DCK)
For all available packages and complete order numbers, see the orderable addendum at the end of the data sheet.
AKA = Also Known As
Comparable Alternative Devices
PART NUMBER
AVERAGE OUTPUT SENSOR GAIN
POWER SUPPLY RANGE
LMT84/LMT84-Q1
–5.5 mV/°C
1.5 V to 5.5 V
LMT85/LMT85-Q1
–8.2 mV/°C
1.8 V to 5.5 V
LMT86/LMT86-Q1
–10.9 mV/°C
2.2 V to 5.5 V
LMT87/LMT87-Q1
–13.6 mV/°C
2.7 V to 5.5 V
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6 Pin Configuration and Functions
3-Pin TO-92
LPM Package
5-Pin SOT (SC70)
DCK Package
Top View
1
5
VDD
VDD
2
LMT87
GND
3
4
OUT
VDD
VDD
OUT
GND
3-Pin TO-92
LP Package
VDD
OUT
GND
Pin Functions
PIN
LABEL
DCK
NUMBER
LP
NUMBER
DESCRIPTION
LPC
NUMBER
TYPE
VDD
5
Power
VDD
1
Power
EQUIVALENT CIRCUIT
FUNCTION
Power Supply Voltage
Power Supply Voltage
VDD
OUT
Analog
Output
3
See Pin
Diagrams
Outputs a voltage which is inversely
proportional to temperature
See Pin
Diagrams
GND
VDD
4
Power
Positive Supply Voltage
GND
2
Ground
Power Supply Ground, (direct
connection to the back side of the
die)
4
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7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1) (2)
MIN
MAX
UNIT
Supply Voltage
−0.3
6
V
Voltage at Output Pin
−0.3
(VDD + 0.5)
V
Output Current
-7
7
mA
Input Current at Any Pin (3)
-5
5
mA
150
°C
150
°C
TJMAX
Maximum Junction Temperature
Tstg
Storage Temperature
(1)
(2)
(3)
–65
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions . Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Soldering process must comply with TI's Reflow Temperature Profile specifications. Refer to www.ti.com/packaging. Reflow temperature
profiles are different for lead-free and non-lead-free packages.
When the input voltage (VI) at any pin exceeds power supplies (VI < GND or VI > V), the current at that pin should be limited to 5 mA.
7.2 ESD Ratings - Commercial
VALUE
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins.
Applies for TO-92 package LMT87LP.
VESD
(1)
(2)
(3)
Electrostatic discharge
UNIT
(1)
±2500
Human body model (HBM), per JESD22-A114, all pins. Applies for SC70
package LMT87DCK.
±2500
Charged device model (CDM), per JEDEC specification JESD22-C101,
all pins. (2) Applies for all parts.
±1000
Machine model ESD stress voltage, per JEDEC specification JESD22A115. (3) Applies for SC70 package LMT87DCK.
±250
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
The machine model is a 200-pF capacitor discharged directly into each pin.
7.3 ESD Ratings - Automotive
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human-body model (HBM), per JESD22-A114, all pins.
SC70 package LMT87DCK-Q1.
(1)
Applies for
Charged-device model (CDM), per JEDEC specification JESD22-C101,
all pins. (2) Applies for SC70 package LMT87DCK-Q1.
UNIT
±2500
V
±1000
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.4 Recommended Operating Conditions
MIN
Specified Temperature Range
VDD
Supply Voltage Range
MAX
UNIT
TMIN ≤ TA ≤ TMAX
°C
–50 ≤ TA ≤ 150
°C
2.7
5.5
V
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7.5 Thermal Information
THERMAL METRIC
(1)
(2) (3)
LMT87
LMT87-Q1
LMT87
DCK
LP
5 PINS
3 PINS
UNIT
RθJA
Junction-to-ambient thermal resistance
275
167
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
84
90
°C/W
RθJB
Junction-to-board thermal resistance
56
146
°C/W
ψJT
Junction-to-top characterization parameter
1.2
35
°C/W
ψJB
Junction-to-board characterization parameter
55
146
°C/W
(1)
(2)
(3)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report (SPRA953).
The junction-to-ambient thermal resistance (R θJA) under natural convection is obtained in a simulation on a JEDEC-standard, High K
board as specified in JESD51-7, in an environment described in JESD51-2.
Changes in output due to self heating can be computed by multiplying the internal dissipation by the thermal resistance.
7.6 Accuracy Characteristics
These limits do not include DC load regulation. These stated accuracy limits are with reference to the values in Table 1.
PARAMETER
CONDITIONS
70°C to 150°C; VDD = 3.0 V to 5.5 V
MIN (1)
TYP
MAX (1)
-2.7
±0.4
2.7
20°C to 40°C; VDD = 2.7 V to 5.5 V
±0.6
20°C to 40°C; VDD = 3.4 V to 5.5 V
-2.7
0°C; VDD = 3.6 V to 5.5 V
-2.7
–50°C; VDD = 4.2 V to 5.5 V
(1)
(2)
°C
±0.6
2.7
±0.3
–50°C; VDD = 3.6 V to 5.5 V
°C
°C
±0.3
Temperature accuracy (2) 0°C; VDD = 3.0 V to 5.5 V
UNIT
°C
°C
±0.6
2.7
±0.3
°C
°C
Limits are specific to TI's AOQL (Average Outgoing Quality Level).
Accuracy is defined as the error between the measured and reference output voltages, tabulated in the Transfer Table at the specified
conditions of supply gain setting, voltage, and temperature (expressed in °C). Accuracy limits include line regulation within the specified
conditions. Accuracy limits do not include load regulation; they assume no DC load.
7.7 Electrical Characteristics
Unless otherwise noted, these specifications apply for +VDD = 2.7 V to 5.5 V. MIN and MAX limits apply for TA = TJ = TMIN to
TMAX ; typical limits apply for TA = TJ = 25°C.
PARAMETER
CONDITIONS
MIN (1)
Sensor gain (output transfer
function slope)
Load regulation (3)
Line regulation
Supply current
CL
Output load capacitance
(1)
(2)
(3)
(4)
(5)
6
(2)
MAX
(1)
–13.6
Source ≤ 50 μA, (VDD – VOUT) ≥ 200 mV
–1
Sink ≤ 50 μA, VOUT ≥ 200 mV
UNIT
mV/°C
–0.22
0.26
(4)
IS
TYP
mV
1
mV
μV/V
200
TA = 30°C to 150°C, (VDD – VOUT) ≥ 100 mV
5.4
8.1
μA
TA = –50°C to 150°C, (VDD – VOUT) ≥ 100 mV
5.4
9
μA
1.9
ms
50
μA
1100
Power-on time (5)
CL= 0 pF to 1100 pF
Output drive
TA = TJ = 25°C
0.7
–50
pF
Limits are specific to TI's AOQL (Average Outgoing Quality Level).
Typicals are at TJ = TA = 25°C and represent most likely parametric norm.
Source currents are flowing out of the LMT87 and LMT87-Q1. Sink currents are flowing into the LMT87 and LMT87-Q1.
Line regulation (DC) is calculated by subtracting the output voltage at the highest supply voltage from the output voltage at the lowest
supply voltage. The typical DC line regulation specification does not include the output voltage shift discussed in Output Voltage Shift.
Specified by design and characterization.
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7.8 Typical Characteristics
4
TEMPERATURE ERROR (ºC)
3
2
1
0
-1
-2
-3
-4
-50
-25
0
25
50
75
100 125 150
TEMPERATURE (ºC)
Figure 1. Temperature Error vs Temperature
Figure 2. Minimum Operating Temperature vs
Supply Voltage
Figure 3. Supply Current vs Temperature
Figure 4. Supply Current vs Supply Voltage
Figure 5. Load Regulation, Sourcing Current
Figure 6. Load Regulation, Sinking Current
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Typical Characteristics (continued)
Figure 7. Change in VOUT vs Overhead Voltage
Figure 8. Supply-Noise Gain vs Frequency
Figure 9. Output Voltage vs Supply Voltage
8
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8 Detailed Description
8.1 Overview
The LMT87 and LMT87-Q1 are analog output temperature sensors. The temperature sensing element is
comprised of a simple base emitter junction that is forward biased by a current source. The temperature sensing
element is then buffered by an amplifier and provided to the OUT pin. The amplifier has a simple push-pull output
stage thus providing a low impedance output source.
8.2 Functional Block Diagram
VDD
OUT
Thermal Diodes
GND
8.3 Feature Description
8.3.1 LMT87/LMT87-Q1 Transfer Function
The output voltage of the LMT87 and LMT87-Q1, across the complete operating temperature range is shown in
Table 1. This table is the reference from which the LMT87 and LMT87-Q1 accuracy specifications (listed in the
Accuracy Characteristics section) are determined. This table can be used, for example, in a host processor lookup table. A file containing this data is available for download at LMT87 product folder under Tools and Software
Models.
Table 1. LMT87/LMT87-Q1 Transfer Table
TEMP
(°C)
VOUT
(mV)
TEMP
(°C)
VOUT
(mV)
TEMP
(°C)
VOUT
(mV)
TEMP
(°C)
VOUT
(mV)
TEMP
(°C)
VOUT
(mV)
-50
3277
-10
2767
30
2231
70
1679
110
1115
-49
3266
-9
2754
31
2217
71
1665
111
1101
-48
3254
-8
2740
32
2204
72
1651
112
1087
-47
3243
-7
2727
33
2190
73
1637
113
1073
-46
3232
-6
2714
34
2176
74
1623
114
1058
-45
3221
-5
2700
35
2163
75
1609
115
1044
-44
3210
-4
2687
36
2149
76
1595
116
1030
-43
3199
-3
2674
37
2136
77
1581
117
1015
-42
3186
-2
2660
38
2122
78
1567
118
1001
-41
3173
-1
2647
39
2108
79
1553
119
987
-40
3160
0
2633
40
2095
80
1539
120
973
-39
3147
1
2620
41
2081
81
1525
121
958
-38
3134
2
2607
42
2067
82
1511
122
944
-37
3121
3
2593
43
2054
83
1497
123
929
-36
3108
4
2580
44
2040
84
1483
124
915
-35
3095
5
2567
45
2026
85
1469
125
901
-34
3082
6
2553
46
2012
86
1455
126
886
-33
3069
7
2540
47
1999
87
1441
127
872
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Table 1. LMT87/LMT87-Q1 Transfer Table (continued)
TEMP
(°C)
VOUT
(mV)
TEMP
(°C)
VOUT
(mV)
TEMP
(°C)
VOUT
(mV)
TEMP
(°C)
VOUT
(mV)
TEMP
(°C)
VOUT
(mV)
-32
3056
8
2527
48
1985
88
1427
128
858
-31
3043
9
2513
49
1971
89
1413
129
843
-30
3030
10
2500
50
1958
90
1399
130
829
-29
3017
11
2486
51
1944
91
1385
131
814
-28
3004
12
2473
52
1930
92
1371
132
800
-27
2991
13
2459
53
1916
93
1356
133
786
-26
2978
14
2446
54
1902
94
1342
134
771
-25
2965
15
2433
55
1888
95
1328
135
757
-24
2952
16
2419
56
1875
96
1314
136
742
-23
2938
17
2406
57
1861
97
1300
137
728
-22
2925
18
2392
58
1847
98
1286
138
713
-21
2912
19
2379
59
1833
99
1272
139
699
-20
2899
20
2365
60
1819
100
1257
140
684
-19
2886
21
2352
61
1805
101
1243
141
670
-18
2873
22
2338
62
1791
102
1229
142
655
-17
2859
23
2325
63
1777
103
1215
143
640
-16
2846
24
2311
64
1763
104
1201
144
626
-15
2833
25
2298
65
1749
105
1186
145
611
-14
2820
26
2285
66
1735
106
1172
146
597
-13
2807
27
2271
67
1721
107
1158
147
582
-12
2793
28
2258
68
1707
108
1144
148
568
-11
2780
29
2244
69
1693
109
1130
149
553
150
538
Although the LMT87 and LMT87-Q1 is very linear, its response does have a slight umbrella parabolic shape.
This shape is very accurately reflected in Table 1. The Transfer Table can be calculated by using the parabolic
equation.
mV
mV
ª
º ª
VTEMP mV = 2230.8mV - «13.582
T - 30°C » - «0.00433 2 T - 30°C
°C
¬
¼ ¬
°C
2º
»
¼
(1)
The parabolic equation is an approximation of the transfer table and the accuracy of the equation degrades
slightly at the temperature range extremes. Equation 1 can be solved for T resulting in:
T
13 .582
13 .582
2
4 u 0.00433 u 2230 .8 VTEMP mV
2 u ( 0.00433 )
30
(2)
For an even less accurate linear transfer function approximation, a line can easily be calculated over the desired
temperature range from the Table using the two-point equation:
·
¹
V - V1 =
V2 - V1
T2 - T1
· u (T - T1)
¹
(3)
Where V is in mV, T is in °C, T1 and V1 are the coordinates of the lowest temperature, T2 and V2 are the
coordinates of the highest temperature.
For example, if we want to resolve this equation, over a temperature range of 20°C to 50°C, we would proceed
as follows:
1958 mV - 2365 mV·
u (T - 20oC)
50oC - 20oC
¹
·
¹
V - 2365 mV =
o
(4)
o
V - 2365 mV = (-13.6 mV / C) u (T - 20 C)
(5)
o
V = (-13.6 mV / C) u T + 2637 mV
(6)
Using this method of linear approximation, the transfer function can be approximated for one or more
temperature ranges of interest.
10
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8.4 Device Functional Modes
8.4.1 Mounting and Thermal Conductivity
The LMT87 and LMT87-Q1 can be applied easily in the same way as other integrated-circuit temperature
sensors. It can be glued or cemented to a surface.
To ensure good thermal conductivity, the backside of the LMT87 and LMT87-Q1 die is directly attached to the
GND pin (Pin 2 of the SC70 DCK package). The temperatures of the lands and traces to the other leads of the
LMT87 and LMT87-Q1 will also affect the temperature reading.
Alternatively, the LMT87 and LMT87-Q1 can be mounted inside a sealed-end metal tube, and can then be
dipped into a bath or screwed into a threaded hole in a tank. As with any IC, the LMT87 and LMT87-Q1 and
accompanying wiring and circuits must be kept insulated and dry, to avoid leakage and corrosion. This is
especially true if the circuit may operate at cold temperatures where condensation can occur. If moisture creates
a short circuit from the output to ground or VDD, the output from the LMT87 and LMT87-Q1 will not be correct.
Printed-circuit coatings are often used to ensure that moisture cannot corrode the leads or circuit traces.
The thermal resistance junction to ambient (RθJA or θJA) is the parameter used to calculate the rise of a device
junction temperature due to its power dissipation. The equation used to calculate the rise in the LMT87 and
LMT87-Q1's die temperature is:
TJ = TA + TJA ¬ª(VDDIS ) + (VDD - VOUT ) IL ¼º
(7)
where TA is the ambient temperature, IS is the supply current, IL is the load current on the output, and Vout is the
output voltage. For example, in an application where TA = 30°C, VDD = 5 V, IS = 5.4 μA, VOUT = 2231 mV, and IL
= 2 μA, the junction temperature would be 30.014°C, showing a self-heating error of only 0.014°C. Since the
junction temperature of the LMT87 and LMT87-Q1 is the actual temperature being measured, care should be
taken to minimize the load current that the LMT87 and LMT87-Q1 is required to drive. Thermal Information
shows the thermal resistance of the LMT87 and LMT87-Q1.
8.4.2 Output Noise Considerations
A push-pull output gives the LMT87 and LMT87-Q1 the ability to sink and source significant current. This is
beneficial when, for example, driving dynamic loads like an input stage on an analog-to-digital converter (ADC).
In these applications the source current is required to quickly charge the input capacitor of the ADC. The LMT87
and LMT87-Q1 is ideal for this and other applications which require strong source or sink current.
The LMT87 and LMT87-Q1 supply-noise gain (the ratio of the AC signal on VOUT to the AC signal on VDD) was
measured during bench tests. Its typical attenuation is shown in Figure 8 found in the Typical Characteristics
section. A load capacitor on the output can help to filter noise.
For operation in very noisy environments, some bypass capacitance should be present on the supply within
approximately 5 centimeters of the LMT87 and LMT87-Q1.
8.4.3 Capacitive Loads
The LMT87 and LMT87-Q1 handles capacitive loading well. In an extremely noisy environment, or when driving
a switched sampling input on an ADC, it may be necessary to add some filtering to minimize noise coupling.
Without any precautions, the LMT87 and LMT87-Q1 can drive a capacitive load less than or equal to 1100 pF, as
shown in Figure 10. For capacitive loads greater than 1100 pF, a series resistor may be required on the output,
as shown in Figure 11.
VDD
LMT87
OPTIONAL
BYPASS
CAPACITANCE
GND
OUT
CLOAD ” 1100 pF
Figure 10. LMT87 No Decoupling Required for Capacitive Loads Less than 1100 pF
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11
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www.ti.com
Device Functional Modes (continued)
VDD
RS
LMT87
OUT
OPTIONAL
BYPASS
CAPACITANCE
GND
CLOAD > 1100 pF
Figure 11. LMT87 with Series Resistor for Capacitive Loading Greater than 1100 pF
CLOAD
MINIMUM RS
1.1 nF to 99 nF
3 kΩ
100 nF to 999 nF
1.5 kΩ
1 μF
800 Ω
8.4.4 Output Voltage Shift
The LMT87 and LMT87-Q1 is very linear over temperature and supply voltage range. Due to the intrinsic
behavior of an NMOS/PMOS rail-to-rail buffer, a slight shift in the output can occur when the supply voltage is
ramped over the operating range of the device. The location of the shift is determined by the relative levels of
VDD and VOUT. The shift typically occurs when VDD- VOUT = 1 V.
This slight shift (a few millivolts) takes place over a wide change (approximately 200 mV) in VDD or VOUT. Since
the shift takes place over a wide temperature change of 5°C to 20°C, VOUT is always monotonic. The accuracy
specifications in the Accuracy Characteristics table already include this possible shift.
9 Application and Implementation
9.1 Application Information
The LMT87/LMT87-Q1 features make it suitable for many general temperature sensing applications. It can
operate down to 2.7-V supply with 5.4-µA power consumption. Package options including through-hole TO-92
package also allows the LMT87 to be mounted on-board, off-board, to a heat sink, or on multiple unique
locations in the same application.
9.2 Typical Applications
9.2.1 Connection to ADC
Simplified Input Circuit of
SAR Analog-to-Digital Converter
+2.7V to +5.5V
Reset
Input
Pin
LMT87
VDD
CBP
RMUX
RSS
Sample
OUT
GND
CFILTER
CMUX
CSAMPLE
Figure 12. Suggested Connection to a Sampling Analog-to-Digital Converter Input Stage
12
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LMT87, LMT87-Q1
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SNIS170C – JAN 2014 – REVISED OCTOBER 2015
Typical Applications (continued)
9.2.1.1 Design Requirements
Most CMOS ADCs found in microcontrollers and ASICs have a sampled data comparator input structure. When
the ADC charges the sampling cap, it requires instantaneous charge from the output of the analog source such
as the LMT87 and LMT87-Q1 temperature sensor and many op amps. This requirement is easily accommodated
by the addition of a capacitor (CFILTER).
9.2.1.2 Detailed Design Procedure
The size of CFILTER depends on the size of the sampling capacitor and the sampling frequency. Since not all
ADCs have identical input stages, the charge requirements will vary. This general ADC application is shown as
an example only.
9.2.1.3 Application Curves
3.5
OUTPUT VOLTAGE (V)
3.0
2.5
2.0
1.5
1.0
0.5
0.0
±50
0
50
100
150
TEMPERATURE (ƒC)
C001
Figure 13. Analog Output Transfer Function
9.2.2 Conserving Power Dissipation with Shutdown
VDD
SHUTDOWN
VOUT
LMT87
Any logic
device output
Figure 14. Simple Shutdown Connection of the LMT87
9.2.2.1 Design Requirements
Since the power consumption of the LMT87 is less than 9 µA, it can simply be powered directly from any logic
gate output, thus not requiring a specific shutdown pin. The device can even be powered directly from a
microcontroller GPIO. In this way it can easily be turned off for cases such as battery powered systems where
power savings is critical.
9.2.2.2 Detailed Design Procedure
Simply connect the VDD pin of the LMT87 directly to the logic shutdown signal from a microcontroller.
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LMT87, LMT87-Q1
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Typical Applications (continued)
9.2.2.3 Application Curves
Time: 500 μsec/div; Top trace: VDD 1 V/div;
Bottom trace: OUT 1 V/div
Figure 15. Output Turn-on Response Time without a
Capacitive Load and VDD=3.3V
Time: 500 μsec/div; Top trace: VDD 1 V/div;
Bottom trace: OUT 1 V/div
Figure 16. Output Turn-on Response Time with a 1.1 nF
Capacitive Load and VDD=3.3V
Time: 500 μsec/div; Top trace: VDD 2 V/div;
Bottom trace: OUT 1 V/div
Figure 17. Output Turn-on Response Time without a
Capacitive Load and VDD=5V
Time: 500 μsec/div; Top trace: VDD 2 V/div;
Bottom trace: OUT 1 V/div
Figure 18. Output Turn-on Response Time with a 1.1 nF
Capacitive Load and VDD=5V
10 Power Supply Recommendations
The low supply current and supply range of 2.7 V to 5.5 V allow the device to easily be powered from many
sources.
Power supply bypassing is optional and is mainly dependent on the noise on the power supply used. In noisy
systems it may be necessary to add bypass capacitors to lower the noise that is coupled to the output of the
LMT87.
11 Layout
11.1 Layout Guidelines
The LMT87 is extremely simple to layout. If a power supply bypass capacitor is used, it should be connected as
shown in the Layout Example.
14
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LMT87, LMT87-Q1
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SNIS170C – JAN 2014 – REVISED OCTOBER 2015
11.2 Layout Example
VIA to ground plane
VIA to power plane
VDD
VDD
VDD
GND
0.01 µ F
OUT
VDD
Figure 19. SC70 Package Recommended Layout
GND
OUT
VDD
Figure 20. TO-92 LP Package Recommended Layout
GND
OUT
VDD
Figure 21. TO-92 LPM Package Recommended Layout
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Product Folder Links: LMT87 LMT87-Q1
15
LMT87, LMT87-Q1
SNIS170C – JAN 2014 – REVISED OCTOBER 2015
www.ti.com
12 Device and Documentation Support
12.1 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 2. Related Links
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
LMT87
Click here
Click here
Click here
Click here
Click here
LMT87-Q1
Click here
Click here
Click here
Click here
Click here
12.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
16
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Product Folder Links: LMT87 LMT87-Q1
PACKAGE OPTION ADDENDUM
www.ti.com
25-May-2017
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LMT87DCKR
ACTIVE
SC70
DCK
5
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-50 to 150
BUA
LMT87DCKT
ACTIVE
SC70
DCK
5
250
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-50 to 150
BUA
LMT87LP
ACTIVE
TO-92
LP
3
1800
Green (RoHS
& no Sb/Br)
CU SN
N / A for Pkg Type
-50 to 150
LMT87
LMT87LPG
PREVIEW
TO-92
LPG
3
1000
TBD
Call TI
Call TI
-50 to 150
LMT87LPM
ACTIVE
TO-92
LP
3
2000
Green (RoHS
& no Sb/Br)
CU SN
N / A for Pkg Type
-50 to 150
LMT87
LMT87QDCKRQ1
ACTIVE
SC70
DCK
5
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-50 to 150
BVA
LMT87QDCKTQ1
ACTIVE
SC70
DCK
5
250
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-50 to 150
BVA
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
25-May-2017
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF LMT87, LMT87-Q1 :
• Catalog: LMT87
• Automotive: LMT87-Q1
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
28-Jul-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
LMT87DCKR
SC70
DCK
5
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
3000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
LMT87DCKT
SC70
DCK
5
250
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
LMT87QDCKRQ1
SC70
DCK
5
3000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
LMT87QDCKTQ1
SC70
DCK
5
250
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
28-Jul-2015
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LMT87DCKR
SC70
DCK
5
3000
210.0
185.0
35.0
LMT87DCKT
SC70
DCK
5
250
210.0
185.0
35.0
LMT87QDCKRQ1
SC70
DCK
5
3000
210.0
185.0
35.0
LMT87QDCKTQ1
SC70
DCK
5
250
210.0
185.0
35.0
Pack Materials-Page 2
PACKAGE OUTLINE
LPG0003A
TO-92 - 5.05 mm max height
SCALE 1.300
TO-92
4.1
3.9
3.25
3.05
3X
0.55
0.40
5.05
MAX
3
1
3X (0.8)
3X
15.5
15.1
3X
0.48
0.35
3X
2X 1.27 0.05
0.51
0.36
2.64
2.44
2.68
2.28
1.62
1.42
2X (45 )
1
(0.5425)
2
3
0.86
0.66
4221343/B 09/2016
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
www.ti.com
EXAMPLE BOARD LAYOUT
LPG0003A
TO-92 - 5.05 mm max height
TO-92
0.05 MAX
ALL AROUND
TYP
FULL R
TYP
METAL
TYP
(1.07)
3X ( 0.75) VIA
2X
METAL
(1.7)
2X (1.7)
2
1
2X
SOLDER MASK
OPENING
3
2X (1.07)
(R0.05) TYP
(1.27)
SOLDER MASK
OPENING
(2.54)
LAND PATTERN EXAMPLE
NON-SOLDER MASK DEFINED
SCALE:20X
4221343/B 09/2016
www.ti.com
PACKAGE OUTLINE
LP0003A
TO-92 - 5.34 mm max height
SCALE 1.200
SCALE 1.200
TO-92
5.21
4.44
EJECTOR PIN
OPTIONAL
5.34
4.32
(1.5) TYP
SEATING
PLANE
(2.54)
NOTE 3
2X
4 MAX
(0.51) TYP
6X
0.076 MAX
SEATING
PLANE
2X
2.6 0.2
3X
12.7 MIN
3X
3X
0.55
0.38
0.43
0.35
2X 1.27 0.13
FORMED LEAD OPTION
STRAIGHT LEAD OPTION
OTHER DIMENSIONS IDENTICAL
TO STRAIGHT LEAD OPTION
3X
2.67
2.03
4.19
3.17
3
2
1
3.43 MIN
4215214/B 04/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Lead dimensions are not controlled within this area.
4. Reference JEDEC TO-226, variation AA.
5. Shipping method:
a. Straight lead option available in bulk pack only.
b. Formed lead option available in tape and reel or ammo pack.
c. Specific products can be offered in limited combinations of shipping medium and lead options.
d. Consult product folder for more information on available options.
www.ti.com
EXAMPLE BOARD LAYOUT
LP0003A
TO-92 - 5.34 mm max height
TO-92
0.05 MAX
ALL AROUND
TYP
FULL R
TYP
METAL
TYP
(1.07)
3X ( 0.85) HOLE
2X
METAL
(1.5)
2X (1.5)
2
1
(R0.05) TYP
3
2X (1.07)
(1.27)
SOLDER MASK
OPENING
2X
SOLDER MASK
OPENING
(2.54)
LAND PATTERN EXAMPLE
STRAIGHT LEAD OPTION
NON-SOLDER MASK DEFINED
SCALE:15X
0.05 MAX
ALL AROUND
TYP
( 1.4)
2X ( 1.4)
METAL
3X ( 0.9) HOLE
METAL
(R0.05) TYP
2
1
(2.6)
SOLDER MASK
OPENING
3
2X
SOLDER MASK
OPENING
(5.2)
LAND PATTERN EXAMPLE
FORMED LEAD OPTION
NON-SOLDER MASK DEFINED
SCALE:15X
4215214/B 04/2017
www.ti.com
TAPE SPECIFICATIONS
LP0003A
TO-92 - 5.34 mm max height
TO-92
13.7
11.7
32
23
(2.5) TYP
0.5 MIN
16.5
15.5
11.0
8.5
9.75
8.50
19.0
17.5
6.75
5.95
2.9
TYP
2.4
3.7-4.3 TYP
13.0
12.4
FOR FORMED LEAD OPTION PACKAGE
4215214/B 04/2017
www.ti.com
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Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such
products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards
and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must
ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in
life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use.
Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life
support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all
medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S.
TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product).
Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications
and that proper product selection is at Designers’ own risk. Designers are solely responsible for compliance with all legal and regulatory
requirements in connection with such selection.
Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer’s noncompliance with the terms and provisions of this Notice.
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