TI1 LT1030C Quadruple low-power line driver Datasheet

LT1030C
QUADRUPLE LOW-POWER LINE DRIVER
SLLS048F – APRIL 1989 – REVISED APRIL 1998
D
D
D
D
D
D
D
D
D
Low Supply Voltage . . . ±5 V to ±15 V
Supply Current . . . 500 µA Typical
Zero Supply Current When Shut Down
Outputs Can Be Driven ±30 V
Output Open When Off (3-State)
10-mA Output Drive
Outputs of Several Devices Can Be
Connected in Parallel
Meets or Exceeds the Requirements of
ANSI EIA/TIA-232-F Specifications
Designed to Be Interchangeable With
Linear Technology LT1030
D OR N PACKAGE
(TOP VIEW)
VCC–
IN1
OUT1
ON/OFF
IN2
OUT2
GND
1
14
2
13
3
12
4
11
5
10
6
9
7
8
VCC+
STROBE
IN4
OUT4
NC
IN3
OUT3
NC – No internal connection
description
The LT1030C is an EIA/TIA-232-F line driver that operates over a ±5-V to ±15-V supply-voltage range on low
supply current. The device can be shut down to zero supply current. Current limiting fully protects the outputs
from externally applied voltages of ±30 V. Since the output swings to within 200 mV of the positive supply and
to within 1 V of the negative supply, supply-voltage requirements are minimized.
A major advantage of the LT1030C is the high-impedance output state when the device is off or powered down.
This feature allows several different drivers on the same bus.
The device can be used as an EIA/TIA-232-F driver, micropower interface, or level translator, among others.
The LT1030C is characterized for operation from 0°C to 70°C.
AVAILABLE OPTIONS
PACKAGE
SMALL OUTLINE
(D)
PLASTIC DIP
(N)
LT1030CD
LT1030CN
The D package is available taped and reeled.
Add the suffix R to the device type (i.e.,
LT1030CDR).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  1998, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
LT1030C
QUADRUPLE LOW-POWER LINE DRIVER
SLLS048F – APRIL 1989 – REVISED APRIL 1998
logic symbol†
STROBE
13
ON/OFF
IN1
IN2
IN3
IN4
G1
4
EN
2
3
1
5
6
9
8
12
11
OUT1
OUT2
OUT3
OUT4
† This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
logic diagram
ON/OFF
STROBE
IN1
IN2
IN3
IN4
4
13
3
2
6
5
8
9
11
12
OUT1
OUT2
OUT3
OUT4
Terminal Functions
TERMINAL
NAME
2
DESCRIPTION
NO.
GND
7
Ground terminal
IN1
IN2
IN3
IN4
2
5
9
12
Logic inputs. INx operate properly on TTL or CMOS levels. Output valid from VI = VCC– + 2 V to 15 V. Connect to 5 V
when not used.
ON/OFF
4
ON/OFF shuts down the entire circuit. It cannot be left open. For normally on operation, connect between 5 V and 10 V.
If VIL is at or near 0.8 V, significant settling time may be required.
OUT1
OUT2
OUT3
OUT4
3
6
8
11
Line driver outputs
STROBE
13
STROBE forces all outputs low. Drive with 3 V. Strobe terminal input impedance is approximately 2 kΩ to GND. Leave
STROBE open when not used.
VCC+
VCC–
14
Positive supply
1
Negative supply
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
LT1030C
QUADRUPLE LOW-POWER LINE DRIVER
SLLS048F – APRIL 1989 – REVISED APRIL 1998
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC+ (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 V to 15 V
Supply voltage range, VCC– . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 V to –15 V
Input voltage range, logic inputs, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VCC– to 25 V
Input voltage range at ON/OFF, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 V to 12 V
Output voltage range, VO (any output) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VCC+ – 30 V to VCC– + 30 V
Duration of output short circuit to ±30 V at (or below) 25°C (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . Unlimited
Package thermal impedance, θJA (see Note 3): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values, except differential voltages, are with respect to GND.
2. The output may be shorted to either supply. Temperature and/or supply voltages must be limited to ensure that the maximum
dissipation rating is not exceeded.
3. The package thermal impedance is calculated in accordance with JESD 51, except for through-hole packages, which use a trace
length of zero.
recommended operating conditions
MIN
MAX
Supply voltage, VCC+
5
15
V
Supply voltage, VCC–
–5
–15
V
2
15
V
High-level input voltage, VIH (see Note 4)
Low-level input voltage, VIL (see Note 4)
Operating free-air temperature, TA
0
UNIT
0.8
V
70
°C
NOTE 4: These VIH and VIL specifications apply only for inputs IN1–IN4. For operating levels for ON/OFF, see Figure 2.
electrical characteristics over operating free-air temperature range, VCC± = ±5 V to ±15 V (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
VOM+
VOM–
Maximum positive peak output voltage swing
IIH
IIL
High-level input current
Maximum negative peak output voltage swing
Low-level input current
II
current ON/OFF
Input current,
IO
Output current
IOZ
Off-state output current
ICC
Supply current (all outputs low)
ICC(
CC(off)
ff)
Off state supply current
Off-state
IO = –2 mA,
IO = 2 mA,
TA = 25°C
TA = 25°C
VI ≥ 2 V,
VI ≤ 0.8 V,
TA = 25°C
TA = 25°C
MIN
VCC+–0.3
VI ≥ at 2.4 V, IO = 0
ON/OFF at 0.4 V
ON/OFF at 0.1 V
VCC+–0.1
VCC–+0.9
5
MAX
UNIT
V
VCC–+1.4
20
µA
–10
–20
µA
–0.1
–10
30
65
2
VI = 0
VI = 5 V
TA = 25°C
VO = ±15 V, TA = 25°C,
ON/OFF at 0.4 V
TYP‡
12
V
µA
mA
±2
±100
µA
500
1000
µA
10
150
10
µA
‡ All typical values are at VCC± = ±12 V, TA = 25°C.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
LT1030C
QUADRUPLE LOW-POWER LINE DRIVER
SLLS048F – APRIL 1989 – REVISED APRIL 1998
operating characteristics, VCC± = ±5 V to ±15 V, TA = 25°C
PARAMETER
SR
TEST CONDITIONS
Driver slew rate
RL = 3 kΩ,
MIN
TYP†
MAX
UNIT
4
15
30
V/µs
CL = 51 pF
† All typical values are at VCC± = ±12 V, TA = 25°C.
TYPICAL CHARACTERISTICS
MAXIMUM PEAK OUTPUT VOLTAGE
vs
OUTPUT CURRENT
ON/OFF TERMINAL VOLTAGE
vs
FREE-AIR TEMPERATURE
1.8
VCC+ –0.2
Output High
VCC+ –0.4
VCC– +1.4
VCC– +1.2
VCC– +1
Output Low
VCC– +0.8
VCC– +0.6
VCC– +0.4
VCC± = ±12 V
TA = 25°C
VCC– +0.2
VCC–
0
±1
±2
±3
VCC± = ±12 V
RL = 3 kΩ
1.6
ON/OFF Terminal Voltage – V
VOM
VOM – Maximum Peak Output Voltage – V
VCC+
±4
1.4
Min On Voltage
1.2
1
Max Off Voltage
IO < 200 µA
0.8
0.6
0.4
Max Off Voltage
IO < 20 µA
0.2
±5
GND
0
10
IO–Output Current – mA
Figure 1
4
20
30
40
50
60
TA – Free-Air Temperature – °C
Figure 2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
70
LT1030C
QUADRUPLE LOW-POWER LINE DRIVER
SLLS048F – APRIL 1989 – REVISED APRIL 1998
TYPICAL CHARACTERISTICS
ON/OFF TERMINAL CURRENT
vs
ON/OFF TERMINAL VOLTAGE
VCC+
140
VCC+ –0.2
120
IO = 1 mA
IO = 5 mA
VCC+ –0.4
ON/OFF Terminal Current – µ A
VOM
VOM – Maximum Peak Output Voltage – V
MAXIMUM PEAK OUTPUT VOLTAGE
vs
FREE-AIR TEMPERATURE
VCC– +1.4
IO = –5 mA
VCC– +1.2
VCC– +1
IO = –1 mA
VCC– +0.8
100
80
60
40
20
0
VCC± = ±12 V
VCC– +0.6
0
10
20
30
40
50
VCC± = ±12 V
TA = 25°C
60
–20
70
0
2.5
TA – Free-Air Temperature – °C
5
7.5
10
12.5
ON/OFF Terminal Voltage – V
Figure 3
15
Figure 4
TYPICAL CHARACTERISTICS
OUTPUT CURRENT
vs
FREE-AIR TEMPERATURE
OFF-STATE OUTPUT CURRENT
vs
FREE-AIR TEMPERATURE
30
–1
I OZ
ICC – Off-State Output Current – µ A
VCC± = ±12 V
I O – Output Current – mA
IO
27.5
25
Sinking
22.5
20
17.5
Sourcing
15
0
10
20
30
40
50
60
TA – Free-Air Temperature – °C
70
VCC± = ±12 V
VO = –25 V
–0.1
–0.01
25
30
Figure 5
35
40 45
50
55
60
TA – Free-Air Temperature – °C
65
70
Figure 6
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
LT1030C
QUADRUPLE LOW-POWER LINE DRIVER
SLLS048F – APRIL 1989 – REVISED APRIL 1998
TYPICAL CHARACTERISTICS
OFF-STATE SUPPLY CURRENT
vs
FREE-AIR TEMPERATURE
SUPPLY CURRENT
vs
TOTAL SUPPLY VOLTAGE
5
VCC± = ±12 V
ON/OFF at 0.4 V
0.07
TA = 25°C
4.5
4
ICC
I CC – Supply Current – mA
ICCoff – Off-State Supply Current – µ A
I CC(off)
0.1
0.05
0.03
ÁÁÁ
ÁÁÁ
ÁÁÁ
3.5
3
All Outputs High
2.5
2
1.5
1
All Outputs Low
0.5
0.01
45
50
55
60
65
0
70
TA – Free-Air Temperature –°C
10 12.5 15 17.5 20 22.5
25 27.5
|VCC+ – VCC–| – Total Supply Voltage – V
Figure 7
30
Figure 8
TYPICAL CHARACTERISTICS
SUPPLY CURRENT
vs
FREE-AIR TEMPERATURE
SLEW RATE
vs
FREE-AIR TEMPERATURE
4
17
VCC± = ±12 V
VCC± = ±12 V
RL = 3 kΩ
CL = 51 pF
3
SR – Slew Rate – V/
V/us
µs
ICC
mA
A
I CC – Supply Current – m
3.5
All Outputs High
2.5
2
1.5
1
16
Falling
15
Rising
14
All Outputs Low
0.5
0
0
10
60
20
30
40
50
TA – Free-Air Temperature – °C
70
13
0
10
Figure 9
6
20
30
40
50
60
TA – Free-Air Temperature – °C
Figure 10
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
70
LT1030C
QUADRUPLE LOW-POWER LINE DRIVER
SLLS048F – APRIL 1989 – REVISED APRIL 1998
APPLICATION INFORMATION
forward biasing the substrate
As with other bipolar integrated circuits, forward biasing the substrate diode can cause problems. The LT1030C
draws high current from VCC+ to GND when VCC– is open circuited or pulled above ground. Connecting a diode
from VCC– to GND (if possible) prevents the high-current state. Any low-cost diode can be used (see Figure 11).
LT1030C
1
14
7
8
1N4001
Figure 11. Connecting a Diode From VCC– to GND
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
7
PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LT1030CD
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
0 to 70
LT1030C
LT1030CDG4
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
0 to 70
LT1030C
LT1030CDR
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
0 to 70
LT1030C
LT1030CN
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
LT1030CN
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2014
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
LT1030CDR
Package Package Pins
Type Drawing
SOIC
D
14
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
2500
330.0
16.4
Pack Materials-Page 1
6.5
B0
(mm)
K0
(mm)
P1
(mm)
9.0
2.1
8.0
W
Pin1
(mm) Quadrant
16.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LT1030CDR
SOIC
D
14
2500
367.0
367.0
38.0
Pack Materials-Page 2
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