Actel M1AFS250-FFG256PP Actel fusion mixed-signal fpgas Datasheet

Preliminary v1.7
Actel Fusion Mixed-Signal FPGAs
®
Family with Optional ARM® Support
Features and Benefits
– Frequency: Input 1.5–350 MHz, Output 0.75–350 MHz
Low Power Consumption
High-Performance Reprogrammable Flash
Technology
•
•
•
•
• Single 3.3 V Power Supply with On-Chip 1.5 V Regulator
• Sleep and Standby Low Power Modes
Advanced 130-nm, 7-Layer Metal, Flash-Based CMOS Process
Nonvolatile, Retains Program when Powered Off
Live at Power-Up (LAPU) Single-Chip Solution
350 MHz System Performance
In-System Programming (ISP) and Security
• Secure ISP with 128-Bit AES via JTAG
• FlashLock® to Secure FPGA Contents
Advanced Digital I/O
Embedded Flash Memory
• 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation
• Bank-Selectable I/O Voltages – Up to 5 Banks per Chip
• Single-Ended
I/O
Standards:
LVTTL,
LVCMOS
3.3 V / 2.5 V /1.8 V / 1.5 V, 3.3 V PCI / 3.3 V PCI-X, and
LVCMOS 2.5 V / 5.0 V Input
• Differential I/O Standards: LVPECL, LVDS, BLVDS, and M-LVDS
– Built-In I/O Registers
– 700 Mbps DDR Operation
• Hot-Swappable I/Os
• Programmable Output Slew Rate, Drive Strength, and Weak
Pull-Up/Down Resistor
• Pin-Compatible Packages across the Fusion Family
• User Flash Memory – 2 Mbits to 8 Mbits
– Configurable 8-, 16-, or 32-Bit Datapath
– 10 ns Access in Read-Ahead Mode
• 1 kbit of Additional FlashROM
Integrated A/D Converter (ADC) and Analog I/O
•
•
•
•
•
•
Up to 12-Bit Resolution and up to 600 ksps
Internal 2.56 V or External Reference Voltage
ADC: Up to 30 Scalable Analog Input Channels
High-Voltage Input Tolerance: –10.5 V to +12 V
Current Monitor and Temperature Monitor Blocks
Up to 10 MOSFET Gate Driver Outputs
– P- and N-Channel Power MOSFET Support
– Programmable 1, 3, 10, 30 µA and 20 mA Drive Strengths
• ADC Accuracy is Better than 1%
SRAMs and FIFOs
• Variable-Aspect-Ratio 4,608-Bit SRAM Blocks (×1, ×2, ×4, ×9,
and ×18 organizations available)
• True Dual-Port SRAM (except ×18)
• Programmable Embedded FIFO Control Logic
On-Chip Clocking Support
•
•
•
•
Internal 100 MHz RC Oscillator (accurate to 1%)
Crystal Oscillator Support (32 kHz to 20 MHz)
Programmable Real-Time Counter (RTC)
6 Clock Conditioning Circuits (CCCs) with 1 or 2 Integrated
PLLs
– Phase Shift, Multiply/Divide, and Delay Capabilities
Soft ARM7™ Core Support in M7 and M1 Fusion Devices
• ARM Cortex™-M1 (without debug), CoreMP7Sd (with
debug) and CoreMP7S (without debug)
Fusion Family
Fusion Devices
ARM-Enabled
Fusion Devices
AFS090
Analog and I/Os
AFS1500
M1AFS250
M1AFS600
M1AFS1500
System Gates
90,000
250,000
600,000
1,500,000
Tiles (D-flip-flops)
2,304
6,144
13,824
38,400
Yes
Yes
Yes
Yes
PLLs
1
1
2
2
Globals
18
18
18
18
Flash Memory Blocks (2 Mbits)
Memory
AFS600
M7AFS600
Cortex-M1 2
Secure (AES) ISP
General
Information
AFS250
CoreMP7 1
1
1
2
4
Total Flash Memory Bits
2M
2M
4M
8M
FlashROM Bits
1k
1k
1k
1k
RAM Blocks (4,608 bits)
6
8
24
60
RAM kbits
27
36
108
270
Analog Quads
5
6
10
10
Analog Input Channels
15
18
30
30
Gate Driver Outputs
5
6
10
10
I/O Banks (+ JTAG)
4
4
5
5
Maximum Digital I/Os
75
114
172
252
Analog I/Os
20
24
40
40
Notes:
1. Refer to the CoreMP7 datasheet for more information.
2. Refer to the Cortex-M1 product brief for more information.
October 2008
© 2008 Actel Corporation
I
Actel Fusion Mixed-Signal FPGAs
Fusion Device Architecture Overview
Bank 0
Bank 1
CCC
SRAM Block
4,608-Bit Dual-Port SRAM
or FIFO Block
OSC
I/Os
CCC/PLL
VersaTile
Bank 4
Bank 2
ISP AES
Decryption
User Nonvolatile
FlashROM
Flash Memory Blocks
Analog
Quad
Analog
Quad
Analog
Quad
Analog
Quad
Charge Pumps
ADC
Analog
Quad
SRAM Block
4,608-Bit Dual-Port SRAM
or FIFO Block
Flash Memory Blocks
Analog
Quad
Analog
Quad
Analog
Quad
Analog
Quad
Analog
Quad
CCC
Bank 3
Figure 1-1 • Fusion Device Architecture Overview (AFS600)
Package I/Os: Single-/Double-Ended (Analog)
Fusion Devices
AFS090
AFS250
ARM-Enabled Devices
AFS600
AFS1500
M7AFS600
CoreMP7
Cortex-M1
M1AFS250
M1AFS600
M1AFS1500
QN108
37/9 (16)
QN180
60/16 (20)
65/15 (24)
93/26 (24)
95/46 (40)
75/22 (20)
114/37 (24)
119/58 (40)
119/58 (40)
172/86 (40)
223/109 (40)
PQ208
FG256
FG484
FG676
252/126 (40)
Note: All devices in the same package are pin compatible with the exception of the PQ208 package (AFS250 and AFS600).
II
P r el im in ar y v 1 .7
Actel Fusion Mixed-Signal FPGAs
Product Ordering Codes
M7AFS600
_
1
G
FG
256
I
Application (ambient temperature range)
Blank = Commercial (0 to +70°C)
I = Industrial (–40 to +85°C)
PP = Pre-Production
ES = Engineering Silicon (room temperature only)
Package Lead Count
Lead-Free Packaging Options
Blank = Standard Packaging
G = RoHS-Compliant (green) Packaging
Package Type
QN = Quad Flat No Lead (0.5 mm pitch)
PQ = Plastic Quad Flat Pack (0.5 mm pitch)
FG = Fine Pitch Ball Grid Array (1.0 mm pitch)
Speed Grade
F = 20% Slower than Standard
Blank = Standard
1 = 15% Faster than Standard
2 = 25% Faster than Standard
Part Number
Fusion Devices
AFS090 = 90,000 System Gates
AFS250 = 250,000 System Gates
AFS600 = 600,000 System Gates
AFS1500 = 1,500,000 System Gates
ARM-Enabled Fusion Devices
M7AFS600
M1AFS250
M1AFS600
M1AFS1500
=
=
=
=
600,000 System Gates
250,000 System Gates
600,000 System Gates
1,500,000 System Gates
Notes:
1. DC and switching characteristics for –F speed grade targets are based only on simulation. The characteristics provided for
the –F speed grade are subject to change after establishing FPGA specifications. Some restrictions might be added and
will be reflected in future revisions of this document. The –F speed grade is only supported in the commercial
temperature range.
2. Quad Flat No Lead packages are only offered as RoHS compliant, QNG.
P re li m i n a ry v 1 .7
III
Actel Fusion Mixed-Signal FPGAs
Temperature Grade Offerings
Fusion Devices
AFS090
AFS250
AFS600
M1AFS250
M1AFS600
M1AFS1500
–
–
CoreMP7
ARM-Enabled Devices
AFS1500
M7AFS600
Cortex-M1
QN108
C, I
–
QN180
C, I
C, I
–
–
PQ208
–
C, I
C, I
–
FG256
C, I
C, I
C, I
C, I
FG484
–
–
C, I
C, I
FG676
–
–
–
C, I
Notes:
1. C = Commercial Temperature Range: 0°C to 70°C Ambient
2. I = Industrial Temperature Range: –40°C to 85°C Ambient
Speed Grade and Temperature Grade Matrix
–F1
Std.
–1
–2
C2
✓
I3
–
✓
✓
✓
✓
✓
✓
Notes:
1. DC and switching characteristics for –F speed grade targets are based only on simulation. The characteristics provided
for the –F speed grade are subject to change after establishing FPGA specifications. Some restrictions might be added
and will be reflected in future revisions of this document. The –F speed grade is only supported in the commercial
temperature range.
2. C = Commercial Temperature Range: 0°C to 70°C Ambient
3. I = Industrial Temperature Range: –40°C to 85°C Ambient
Contact your local Actel representative for device availability (http://www.actel.com/contact/offices/index.html).
IV
P r el im in ar y v 1 .7
1 – Fusion Device Family Overview
Introduction
The Actel Fusion® mixed-signal FPGA satisfies the demand from system architects for a device that
simplifies design and unleashes their creativity. As the world’s first mixed-signal programmable
logic family, Fusion integrates mixed-signal analog, flash memory, and FPGA fabric in a monolithic
device. Actel Fusion devices enable designers to quickly move from concept to completed design
and then deliver feature-rich systems to market. This new technology takes advantage of the
unique properties of Actel flash-based FPGAs, including a high-isolation, triple-well process and the
ability to support high-voltage transistors to meet the demanding requirements of mixed-signal
system design.
Actel Fusion mixed-signal FPGAs bring the benefits of programmable logic to many application
areas, including power management, smart battery charging, clock generation and management,
and motor control. Until now, these applications have only been implemented with costly and
space-consuming discrete analog components or mixed-signal ASIC solutions. Actel Fusion mixedsignal FPGAs present new capabilities for system development by allowing designers to integrate a
wide range of functionality into a single device, while at the same time offering the flexibility of
upgrades late in the manufacturing process or after the device is in the field. Actel Fusion devices
provide an excellent alternative to costly and time-consuming mixed-signal ASIC designs. In
addition, when used in conjunction with the Actel or ARM-based soft MCU core, Actel Fusion
technology represents the definitive mixed-signal FPGA platform.
Flash-based Fusion devices are live at power-up. As soon as system power is applied and within
normal operating specifications, Fusion devices are working. Fusion devices have a 128-bit flashbased lock and industry-leading AES decryption, used to secure programmed intellectual property
(IP) and configuration data. Actel Fusion devices are the most comprehensive single-chip analog
and digital programmable logic solution available today.
To support this new ground-breaking technology, Actel has developed a series of major tool
innovations to help maximize designer productivity. Implemented as extensions to the popular
Actel Libero® Integrated Design Environment (IDE), these new tools allow designers to easily
instantiate and configure peripherals within a design, establish links between peripherals, create
or import building blocks or reference designs, and perform hardware verification. This tool suite
will also add comprehensive hardware/software debug capability as well as a suite of utilities to
simplify development of embedded soft-processor-based solutions.
General Description
The Actel Fusion family, based on the highly successful ProASIC®3 and ProASIC3E Flash FPGA
architecture, has been designed as a high-performance, programmable, mixed-signal platform. By
combining an advanced flash FPGA core with flash memory blocks and analog peripherals, Fusion
devices dramatically simplify system design and, as a result, dramatically reduce overall system cost
and board space.
The state-of-the-art flash memory technology offers high-density integrated flash memory blocks,
enabling savings in cost, power, and board area relative to external flash solutions, while providing
increased flexibility and performance. The flash memory blocks and integrated analog peripherals
enable true mixed-mode programmable logic designs. Two examples are using an on-chip soft
processor to implement a fully functional Flash MCU and using high-speed FPGA logic to offer
system and power supervisory capabilities. Live at power-up and capable of operating from a single
3.3 V supply, the Fusion family is ideally suited for system management and control applications.
The devices in the Fusion family are categorized by FPGA core density. Each family member
contains many peripherals, including flash memory blocks, an analog-to-digital-converter (ADC),
high-drive outputs, both RC and crystal oscillators, and a real-time counter (RTC). This provides the
Pr e li m i n a ry v1 . 7
1-1
Fusion Device Family Overview
user with a high level of flexibility and integration to support a wide variety of mixed-signal
applications. The flash memory block capacity ranges from 2 Mbits to 8 Mbits. The integrated 12bit ADC supports up to 30 independently configurable input channels. The on-chip crystal and RC
oscillators work in conjunction with the integrated phase-locked loops (PLLs) to provide clocking
support to the FPGA array and on-chip resources. In addition to supporting typical RTC uses such as
watchdog timer, the Fusion RTC can control the on-chip voltage regulator to power down the
device (FPGA fabric, flash memory block, and ADC), enabling a low-power standby mode.
The Actel Fusion family offers revolutionary features, never before available in an FPGA. The
nonvolatile flash technology gives the Fusion solution the advantage of being a secure, low-power,
single-chip solution that is live at power-up. Fusion is reprogrammable and offers time to market
benefits at an ASIC-level unit cost. These features enable designers to create high-density systems
using existing ASIC or FPGA design flows and tools.
The family has up to 1.5 M system gates, supported with up to 270 kbits of true dual-port SRAM, up
to 8 Mbits of flash memory, 1 kbit of user FlashROM, and up to 278 user I/Os. With integrated flash
memory, the Fusion family is the ultimate soft-processor platform. The AFS600 and AFS1500 devices
both support the Actel ARM7 core (CoreMP7). The ARM-enabled versions are identified with the
M7 prefix as M7AFS600 and M7AFS1500. The AFS250, AFS600, and AFS1500 devices support the
Actel Cortex-M1 core. The Cortex-M1-enabled versions are identified with the M1 prefix as
M1AFS250, M1AFS600, and M1AFS1500.
Flash Advantages
Reduced Cost of Ownership
Advantages to the designer extend beyond low unit cost, high performance, and ease of use. Flashbased Fusion devices are live at power-up and do not need to be loaded from an external boot
PROM. On-board security mechanisms prevent access to the programming information and enable
secure remote updates of the FPGA logic. Designers can perform secure remote in-system
reprogramming to support future design iterations and field upgrades, with confidence that
valuable IP cannot be compromised or copied. Secure ISP can be performed using the industrystandard AES algorithm with MAC data authentication on the device. The Fusion family device
architecture mitigates the need for ASIC migration at higher user volumes. This makes the Fusion
family a cost-effective ASIC replacement solution for applications in the consumer, networking and
communications, computing, and avionics markets.
Security
As the nonvolatile, flash-based Fusion family requires no boot PROM, there is no vulnerable
external bitstream. Fusion devices incorporate FlashLock, which provides a unique combination of
reprogrammability and design security without external overhead, advantages that only an FPGA
with nonvolatile flash programming can offer.
Fusion devices utilize a 128-bit flash-based key lock and a separate AES key to secure programmed
IP and configuration data. The FlashROM data in Fusion devices can also be encrypted prior to
loading. Additionally, the Flash memory blocks can be programmed during runtime using the
industry-leading AES-128 block cipher encryption standard (FIPS Publication 192). The AES standard
was adopted by the National Institute of Standards and Technology (NIST) in 2000 and replaces the
DES standard, which was adopted in 1977. Fusion devices have a built-in AES decryption engine
and a flash-based AES key that make Fusion devices the most comprehensive programmable logic
device security solution available today. Fusion devices with AES-based security allow for secure
remote field updates over public networks, such as the Internet, and ensure that valuable IP
remains out of the hands of system overbuilders, system cloners, and IP thieves. As an additional
security measure, the FPGA configuration data of a programmed Fusion device cannot be read
back, although secure design verification is possible. During design, the user controls and defines
both internal and external access to the flash memory blocks.
Security, built into the FPGA fabric, is an inherent component of the Fusion family. The Flash cells
are located beneath seven metal layers, and many device design and layout techniques have been
used to make invasive attacks extremely difficult. Fusion with FlashLock and AES security is unique
in being highly resistant to both invasive and noninvasive attacks. Your valuable IP is protected,
1 -2
Pr e li m i n a r y v1 . 7
Actel Fusion Mixed-Signal FPGAs
making secure remote ISP possible. A Fusion device provides the most impenetrable security for
programmable logic designs.
Single Chip
Flash-based FPGAs store their configuration information in on-chip flash cells. Once programmed,
the configuration data is an inherent part of the FPGA structure, and no external configuration
data needs to be loaded at system power-up (unlike SRAM-based FPGAs). Therefore, flash-based
Fusion FPGAs do not require system configuration components such as EEPROMs or
microcontrollers to load device configuration data. This reduces bill-of-materials costs and PCB
area, and increases security and system reliability.
Live at Power-Up
Flash-based Fusion devices are Level 0 live at power-up (LAPU). LAPU Fusion devices greatly simplify
total system design and reduce total system cost by eliminating the need for CPLDs. The Fusion
LAPU clocking (PLLs) replaces off-chip clocking resources. The Fusion mix of LAPU clocking and
analog resources makes these devices an excellent choice for both system supervisor and system
management functions. LAPU from a single 3.3 V source enables Fusion devices to initiate, control,
and monitor multiple voltage supplies while also providing system clocks. In addition, glitches and
brownouts in system power will not corrupt the Fusion device flash configuration. Unlike SRAMbased FPGAs, the device will not have to be reloaded when system power is restored. This enables
reduction or complete removal of expensive voltage monitor and brownout detection devices from
the PCB design. Flash-based Fusion devices simplify total system design and reduce cost and design
risk, while increasing system reliability.
Firm Errors
Firm errors occur most commonly when high-energy neutrons, generated in the upper atmosphere,
strike a configuration cell of an SRAM FPGA. The energy of the collision can change the state of the
configuration cell and thus change the logic, routing, or I/O behavior in an unpredictable way.
Another source of radiation-induced firm errors is alpha particles. For an alpha to cause a soft or
firm error, its source must be in very close proximity to the affected circuit. The alpha source must
be in the package molding compound or in the die itself. While low-alpha molding compounds are
being used increasingly, this helps reduce but does not entirely eliminate alpha-induced firm errors.
Firm errors are impossible to prevent in SRAM FPGAs. The consequence of this type of error can be
a complete system failure. Firm errors do not occur in Fusion Flash-based FPGAs. Once it is
programmed, the flash cell configuration element of Fusion FPGAs cannot be altered by highenergy neutrons and is therefore immune to errors from them.
Recoverable (or soft) errors occur in the user data SRAMs of all FPGA devices. These can easily be
mitigated by using error detection and correction (EDAC) circuitry built into the FPGA fabric.
Low Power
Flash-based Fusion devices exhibit power characteristics similar to those of an ASIC, making them
an ideal choice for power-sensitive applications. With Fusion devices, there is no power-on current
surge and no high current transition, both of which occur on many FPGAs.
Fusion devices also have low dynamic power consumption and support both low power standby
mode and very low power sleep mode, offering further power savings.
Advanced Flash Technology
The Fusion family offers many benefits, including nonvolatility and reprogrammability through an
advanced flash-based, 130-nm LVCMOS process with seven layers of metal. Standard CMOS design
techniques are used to implement logic and control functions. The combination of fine granularity,
enhanced flexible routing resources, and abundant flash switches allows very high logic utilization
(much higher than competing SRAM technologies) without compromising device routability or
performance. Logic functions within the device are interconnected through a four-level routing
hierarchy.
Pr e li m i n a ry v1 . 7
1-3
Fusion Device Family Overview
Advanced Architecture
The proprietary Fusion architecture provides granularity comparable to standard-cell ASICs. The
Fusion device consists of several distinct and programmable architectural features, including the
following (Figure 1-1 on page 1-5):
•
•
Embedded memories
–
Flash memory blocks
–
FlashROM
–
SRAM and FIFO
Clocking resources
–
PLL and CCC
–
RC oscillator
–
Crystal oscillator
–
No-Glitch MUX (NGMUX)
•
Digital I/Os with advanced I/O standards
•
FPGA VersaTiles
•
Analog components
–
ADC
–
Analog I/Os supporting voltage, current, and temperature monitoring
–
1.5 V on-board voltage regulator
–
Real-time counter
The FPGA core consists of a sea of VersaTiles. Each VersaTile can be configured as a three-input
logic lookup table (LUT) equivalent or a D-flip-flop or latch (with or without enable) by
programming the appropriate flash switch interconnections. This versatility allows efficient use of
the FPGA fabric. The VersaTile capability is unique to the Actel families of flash-based FPGAs.
VersaTiles and larger functions are connected with any of the four levels of routing hierarchy. Flash
switches are distributed throughout the device to provide nonvolatile, reconfigurable interconnect
programming. Maximum core utilization is possible for virtually any design.
In addition, extensive on-chip programming circuitry allows for rapid (3.3 V) single-voltage
programming of Fusion devices via an IEEE 1532 JTAG interface.
Unprecedented Integration
Integrated Analog Blocks and Analog I/Os
Fusion devices offer robust and flexible analog mixed-signal capability in addition to the highperformance flash FPGA fabric and flash memory block. The many built-in analog peripherals
include a configurable 32:1 input analog MUX, up to 10 independent MOSFET gate driver outputs,
and a configurable ADC. The ADC supports 8-, 10-, and 12-bit modes of operation with a
cumulative sample rate up to 600 k samples per second (ksps), differential nonlinearity (DNL) < 1.0
LSB, and Total Unadjusted Error (TUE) of 0.72 LSB in 10-bit mode. The TUE is used for
characterization of the conversion error and includes errors from all sources, such as offset and
linearity. Internal bandgap circuitry offers 1% voltage reference accuracy with the flexibility of
utilizing an external reference voltage. The ADC channel sampling sequence and sampling rate are
programmable and implemented in the FPGA logic using Designer and Libero IDE software tool
support.
Two channels of the 32-channel ADCMUX are dedicated. Channel 0 is connected internally to VCC
and can be used to monitor core power supply. Channel 31 is connected to an internal temperature
diode which can be used to monitor device temperature. The 30 remaining channels can be
connected to external analog signals. The exact number of I/Os available for external connection
signals is device-dependent (refer to the "Fusion Family" table on page I for details).
1 -4
Pr e li m i n a r y v1 . 7
Actel Fusion Mixed-Signal FPGAs
With Fusion, Actel also introduces the Analog Quad I/O structure (Figure 1-1 on page 1-5). Each
quad consists of three analog inputs and one gate driver. Each quad can be configured in various
built-in circuit combinations, such as three prescaler circuits, three digital input circuits, a current
monitor circuit, or a temperature monitor circuit. Each prescaler has multiple scaling factors
programmed by FPGA signals to support a large range of analog inputs with positive or negative
polarity. When the current monitor circuit is selected, two adjacent analog inputs measure the
voltage drop across a small external sense resistor. Built-in operational amplifiers amplify small
voltage signals (2 mV sensitivity) for accurate current measurement. One analog input in each quad
can be connected to an external temperature monitor diode and achieves detection accuracy of
±3ºC. In addition to the external temperature monitor diode(s), a Fusion device can monitor an
internal temperature diode using dedicated channel 31 of the ADCMUX.
Figure 1-1 on page 1-5 illustrates a typical use of the Analog Quad I/O structure. The Analog Quad
shown is configured to monitor and control an external power supply. The AV pad measures the
source of the power supply. The AC pad measures the voltage drop across an external sense resistor
to calculate current. The AG MOSFET gate driver pad turns the external MOSFET on and off. The AT
pad measures the load-side voltage level.
Power
Line Side
Load Side
Off-Chip
Rpullup
AV
Pads
AC
Voltage
Monitor Block
AG
Current
Monitor Block
On-Chip
AT
Gate
Driver
Temperature
Monitor Block
Analog Quad
Prescaler
Prescaler
Prescaler
Power
MOSFET
Gate Driver
Digital
Input
Digital
Input
Current
Monitor/Instr
Amplifier
To FPGA
(DAVOUTx)
To Analog MUX
Digital
Input
Temperature
Monitor
To FPGA
(DACOUTx)
From FPGA
(GDONx)
To Analog MUX
To FPGA
(DATOUTx)
To Analog MUX
Figure 1-1 • Analog Quad
Embedded Memories
Flash Memory Blocks
The flash memory available in each Fusion device is composed of one to four flash blocks, each 2
Mbits in density. Each block operates independently with a dedicated flash controller and
interface. Fusion flash memory blocks combine fast access times (60 ns random access and 10 ns
access in Read-Ahead mode) with a configurable 8-, 16-, or 32-bit datapath, enabling high-speed
Pr e li m i n a ry v1 . 7
1-5
Fusion Device Family Overview
flash operation without wait states. The memory block is organized in pages and sectors. Each
page has 128 bytes, with 33 pages comprising one sector and 64 sectors per block. The flash block
can support multiple partitions. The only constraint on size is that partition boundaries must
coincide with page boundaries. The flexibility and granularity enable many use models and allow
added granularity in programming updates.
Fusion devices support two methods of external access to the flash memory blocks. The first
method is a serial interface that features a built-in JTAG-compliant port, which allows in-system
programmability during user or monitor/test modes. This serial interface supports programming of
an AES-encrypted stream. Secure data can be passed through the JTAG interface, decrypted, and
then programmed in the flash block. The second method is a soft parallel interface.
FPGA logic or an on-chip soft microprocessor can access flash memory through the parallel
interface. Since the flash parallel interface is implemented in the FPGA fabric, it can potentially be
customized to meet special user requirements. For more information, refer to the CoreCFI
Handbook. The flash memory parallel interface provides configurable byte-wide (×8), word-wide
(×16), or dual-word-wide (×32) data port options. Through the programmable flash parallel
interface, the on-chip and off-chip memories can be cascaded for wider or deeper configurations.
The flash memory has built-in security. The user can configure either the entire flash block or the
small blocks to prevent unintentional or intrusive attempts to change or destroy the storage
contents. Each on-chip flash memory block has a dedicated controller, enabling each block to
operate independently.
The flash block logic consists of the following sub-blocks:
•
Flash block – Contains all stored data. The flash block contains 64 sectors and each sector
contains 33 pages of data.
•
Page Buffer – Contains the contents of the current page being modified. A page contains 8
blocks of data.
•
Block Buffer – Contains the contents of the last block accessed. A block contains 128 data
bits.
•
ECC Logic – The flash memory stores error correction information with each block to
perform single-bit error correction and double-bit error detection on all data blocks.
User Nonvolatile FlashROM
In addition to the flash blocks, Actel Fusion devices have 1 kbit of user-accessible, nonvolatile
FlashROM on-chip. The FlashROM is organized as 8×128-bit pages. The FlashROM can be used in
diverse system applications:
•
Internet protocol addressing (wireless or fixed)
•
System calibration settings
•
Device serialization and/or inventory control
•
Subscription-based business models (for example, set-top boxes)
•
Secure key storage for secure communications algorithms
•
Asset management/tracking
•
Date stamping
•
Version management
The FlashROM is written using the standard IEEE 1532 JTAG programming interface. Pages can be
individually programmed (erased and written). On-chip AES decryption can be used selectively over
public networks to securely load data such as security keys stored in the FlashROM for a user
design.
The FlashROM can be programmed (erased and written) via the JTAG programming interface, and
its contents can be read back either through the JTAG programming interface or via direct FPGA
core addressing.
The FlashPoint tool in the Actel Fusion development software solutions, Libero IDE and Designer,
has extensive support for flash memory blocks and FlashROM. One such feature is auto-generation
of sequential programming files for applications requiring a unique serial number in each part.
Another feature allows the inclusion of static data for system version control. Data for the
FlashROM can be generated quickly and easily using the Actel Libero IDE and Designer software
1 -6
Pr e li m i n a r y v1 . 7
Actel Fusion Mixed-Signal FPGAs
tools. Comprehensive programming file support is also included to allow for easy programming of
large numbers of parts with differing FlashROM contents.
SRAM and FIFO
Fusion devices have embedded SRAM blocks along the north and south sides of the device. Each
variable-aspect-ratio SRAM block is 4,608 bits in size. Available memory configurations are 256×18,
512×9, 1k×4, 2k×2, and 4k×1 bits. The individual blocks have independent read and write ports that
can be configured with different bit widths on each port. For example, data can be written
through a 4-bit port and read as a single bitstream. The SRAM blocks can be initialized from the
flash memory blocks or via the device JTAG port (ROM emulation mode), using the UJTAG macro.
In addition, every SRAM block has an embedded FIFO control unit. The control unit allows the
SRAM block to be configured as a synchronous FIFO without using additional core VersaTiles. The
FIFO width and depth are programmable. The FIFO also features programmable Almost Empty
(AEMPTY) and Almost Full (AFULL) flags in addition to the normal EMPTY and FULL flags. The
embedded FIFO control unit contains the counters necessary for the generation of the read and
write address pointers. The SRAM/FIFO blocks can be cascaded to create larger configurations.
Clock Resources
PLLs and Clock Conditioning Circuits (CCCs)
Fusion devices provide designers with very flexible clock conditioning capabilities. Each member of
the Fusion family contains six CCCs. In the two larger family members, two of these CCCs also
include a PLL; the smaller devices support one PLL.
The inputs of the CCC blocks are accessible from the FPGA core or from one of several inputs with
dedicated CCC block connections.
The CCC block has the following key features:
•
Wide input frequency range (fIN_CCC) = 1.5 MHz to 350 MHz
•
Output frequency range (fOUT_CCC) = 0.75 MHz to 350 MHz
•
Clock phase adjustment via programmable and fixed delays from –6.275 ns to +8.75 ns
•
Clock skew minimization (PLL)
•
Clock frequency synthesis (PLL)
•
On-chip analog clocking resources usable as inputs:
–
100 MHz on-chip RC oscillator
–
Crystal oscillator
Additional CCC specifications:
•
Internal phase shift = 0°, 90°, 180°, and 270°
•
Output duty cycle = 50% ± 1.5%
•
Low output jitter. Samples of peak-to-peak period jitter when a single global network is
used:
–
70 ps at 350 MHz
–
90 ps at 100 MHz
–
180 ps at 24 MHz
–
Worst case < 2.5% × clock period
•
Maximum acquisition time = 150 µs
•
Low power consumption of 5 mW
Global Clocking
Fusion devices have extensive support for multiple clocking domains. In addition to the CCC and
PLL support described above, there are on-chip oscillators as well as a comprehensive global clock
distribution network.
The integrated RC oscillator generates a 100 MHz clock. It is used internally to provide a known
clock source to the flash memory read and write control. It can also be used as a source for the PLLs.
Pr e li m i n a ry v1 . 7
1-7
Fusion Device Family Overview
The crystal oscillator supports the following operating modes:
•
Crystal (32.768 kHz to 20 MHz)
•
Ceramic (500 kHz to 8 MHz)
•
RC (32.768 kHz to 4 MHz)
Each VersaTile input and output port has access to nine VersaNets: six main and three quadrant
global networks. The VersaNets can be driven by the CCC or directly accessed from the core via
MUXes. The VersaNets can be used to distribute low-skew clock signals or for rapid distribution of
high-fanout nets.
Digital I/Os with Advanced I/O Standards
The Fusion family of FPGAs features a flexible digital I/O structure, supporting a range of voltages
(1.5 V, 1.8 V, 2.5 V, and 3.3 V). Fusion FPGAs support many different digital I/O standards, both
single-ended and differential.
The I/Os are organized into banks, with four or five banks per device. The configuration of these
banks determines the I/O standards supported. The banks along the east and west sides of the
device support the full range of I/O standards (single-ended and differential). The south bank
supports the Analog Quads (analog I/O). In the family's two smaller devices, the north bank
supports multiple single-ended digital I/O standards. In the family’s larger devices, the north bank is
divided into two banks of digital Pro I/Os, supporting a wide variety of single-ended, differential,
and voltage-referenced I/O standards.
Each I/O module contains several input, output, and enable registers. These registers allow the
implementation of the following applications:
•
Single-Data-Rate (SDR) applications
•
Double-Data-Rate (DDR) applications—DDR LVDS I/O for chip-to-chip communications
•
Fusion banks support LVPECL, LVDS, BLVDS, and M-LVDS with 20 multi-drop points.
VersaTiles
The Fusion core consists of VersaTiles, which are also used in the successful Actel ProASIC3 family.
The Fusion VersaTile supports the following:
•
All 3-input logic functions—LUT-3 equivalent
•
Latch with clear or set
•
D-flip-flop with clear or set and optional enable
Refer to Figure 1-2 for the VersaTile configuration arrangement.
LUT-3 Equivalent
X1
X2
X3
LUT-3
D-Flip-Flop with Clear or Set
Y
Data
CLK
CLR
Y
D-FF
Enable D-Flip-Flop with Clear or Set
Data
CLK
Enable
CLR
Figure 1-2 • VersaTile Configurations
1 -8
Pr e li m i n a r y v1 . 7
Y
D-FFE
Actel Fusion Mixed-Signal FPGAs
Related Documents
Application Notes
Fusion FlashROM
http://www.actel.com/documents/Fusion_FROM_AN.pdf
Fusion SRAM/FIFO Blocks
http://www.actel.com/documents/Fusion_RAM_FIFO_AN.pdf
Using DDR in Fusion Devices
http://www.actel.com/documents/Fusion_DDR_AN.pdf
Fusion Security
http://www.actel.com/documents/Fusion_Security_AN.pdf
Using Fusion RAM as Multipliers
http://www.actel.com/documents/Fusion_Multipliers_AN.pdf
Prototyping with AFS600 for Smaller Devices
http://www.actel.com/documents/Fusion_Prototyp_AN.pdf
UJTAG Applications in Actel’s Low-Power Flash Devices
http://www.actel.com/documents/LPD_UJTAG_HBs.pdf
In-System Programming (ISP) of Actel's Low-Power Flash Devices Using FlashPro3
http://www.actel.com/documents/LPD_ISP_HBs.pdf
Handbook
Fusion Handbook
http://www.actel.com/documents/Fusion_HB.pdf
User’s Guides
Designer User's Guide
http://www.actel.com/documents/designer_UG.pdf
Fusion, IGLOO/e and ProASIC3/E Macro Library Guide
http://www.actel.com/documents/pa3_libguide_ug.pdf
SmartGen, FlashROM, Flash Memory System Builder, and Analog System Builder User's Guide
http://www.actel.com/documents/genguide_ug.pdf
White Papers
Fusion Technology
http://www.actel.com/documents/Fusion_Tech_WP.pdf
Pr e li m i n a ry v1 . 7
1-9
Fusion Device Family Overview
Part Number and Revision Date
Part Number 51700092-013-0
Revised October 2008
List of Changes
The following table lists critical changes that were made in the current version of the document.
Previous Version
Changes in Current Version (Preliminary v1.7)
Page
Advance v1.6
(August 2008)
The version number category was changed from Advance to Preliminary, which
means the datasheet contains information based on simulation and/or initial
characterization. The information is believed to be correct, but changes are
possible.
Advance v1.4
(July 2008)
The title of the datasheet changed from Actel Programmable System Chips to
Actel Fusion Mixed-Signal FPGAs. In addition, all instances of programmable
system chip were changed to mixed-signal FPGA.
N/A
Advance v0.9
(October 2007)
The following bullet was updated from High-Voltage Input Tolerance: ±12 V to
High-Voltage Input Tolerance: 10.5 V to 12 V.
I
The following bullet was updated from Programmable 1, 3, 10, 30 µA and 25
mA Drive Strengths to Programmable 1, 3, 10, 30 µA and 20 mA Drive
Strengths.
I
This bullet was added to the "Integrated A/D Converter (ADC) and Analog I/O"
section:
I
ADC Accuracy is Better than 1%
In the "Integrated Analog Blocks and Analog I/Os" section, ±4 LSB was changed
to 0.72. The following sentence was deleted:
1-4
The input range for voltage signals is from –12 V to +12 V with full-scale output
values from 0.125 V to 16 V.
In addition, 2°C was changed to 3°C:
"One analog input in each quad can be connected to an external temperature
monitor diode and achieves detection accuracy of ±3ºC."
The following sentence was deleted:
The input range for voltage signals is from –12 V to +12 V with full-scale output
values from 0.125 V to 16 V.
Advance v0.7
(January 2007)
In the "Package I/Os: Single-/Double-Ended (Analog)" table,
AFS1500/M7AFS1500 I/O counts were updated for the following devices:
the
II
FG484: 223/109
FG676: 252/126
Advance v0.4
(April 2006)
The AFS1500 digital I/O count was updated in the "Fusion Family" table.
I
The AFS1500 digital I/O count was updated in the "Package I/Os: Single/Double-Ended (Analog)" table.
II
Advance v0.3
(April 2006)
The G was moved in the "Product Ordering Codes" section.
III
Advance v0.2
(April 2006)
The "Features and Benefits" section was updated.
I
The "Fusion Family" table was updated.
I
The "Package I/Os: Single-/Double-Ended (Analog)" table was updated.
II
1 -1 0
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
Previous Version
Advance v0.2
(continued)
Changes in Current Version (Preliminary v1.7)
Page
The "Product Ordering Codes" table was updated.
III
The "Temperature Grade Offerings" table was updated.
IV
The "General Description" section was updated to include ARM information.
1-1
Pr e li m i n a ry v1 . 7
1 - 11
Fusion Device Family Overview
Datasheet Categories
Categories
In order to provide the latest information to designers, some datasheets are published before data
has been fully characterized. Datasheets are designated as "Product Brief," "Advance,"
"Preliminary," and "Production." The definition of these categories are as follows:
Product Brief
The product brief is a summarized version of a datasheet (advance or production) and contains
general product information. This document gives an overview of specific device and family
information.
Advance
This version contains initial estimated information based on simulation, other products, devices, or
speed grades. This information can be used as estimates, but not for production. This label only
applies to the DC and Switching Characteristics chapter of the datasheet and will only be used
when the data has not been fully characterized.
Preliminary
The datasheet contains information based on simulation and/or initial characterization. The
information is believed to be correct, but changes are possible.
Unmarked (production)
This version contains information that is considered to be final.
Export Administration Regulations (EAR)
The products described in this document are subject to the Export Administration Regulations
(EAR). They could require an approved export license prior to export from the United States. An
export includes release of product or disclosure of technology to a foreign national inside or
outside the United States.
Actel Safety Critical, Life Support, and High-Reliability
Applications Policy
The Actel products described in this advance status document may not have completed Actel’s
qualification process. Actel may amend or enhance products during the product introduction and
qualification process, resulting in changes in device functionality or performance. It is the
responsibility of each customer to ensure the fitness of any Actel product (but especially a new
product) for a particular purpose, including appropriateness for safety-critical, life-support, and
other high-reliability applications. Consult Actel’s Terms and Conditions for specific liability
exclusions relating to life-support applications. A reliability report covering all of Actel’s products is
available on the Actel website at http://www.actel.com/documents/ORT_Report.pdf. Actel also
offers a variety of enhanced qualification and lot acceptance screening procedures. Contact your
local Actel sales office for additional reliability information.
1 -1 2
Pr e li m i n a ry v1 . 7
2 – Device Architecture
Fusion Stack Architecture
To manage the unprecedented level of integration in Fusion devices, Actel developed the Fusion
technology stack (Figure 2-1). This layered model offers a flexible design environment, enabling
design at very high and very low levels of abstraction. Fusion peripherals include hard analog IP
and hard and soft digital IP. Peripherals communicate across the FPGA fabric via a layer of soft
gates—the Fusion backbone. Much more than a common bus interface, this Fusion backbone
integrates a micro-sequencer within the FPGA fabric and configures the individual peripherals and
supports low-level processing of peripheral data. Fusion applets are application building blocks
that can control and respond to peripherals and other system signals. Applets can be rapidly
combined to create large applications. The technology is scalable across devices, families, design
types, and user expertise, and supports a well-defined interface for external IP and tool
integration.
At the lowest level, Level 0, are Fusion peripherals. These are configurable functional blocks that
can be hardwired structures such as a PLL or analog input channel, or soft (FPGA gate) blocks such
as a UART or two-wire serial interface. The Fusion peripherals are configurable and support a
standard interface to facilitate communication and implementation.
Connecting and controlling access to the peripherals is the Fusion backbone, Level 1. The backbone
is a soft-gate structure, scalable to any number of peripherals. The backbone is a bus and much
more; it manages peripheral configuration to ensure proper operation. Leveraging the common
peripheral interface and a low-level state machine, the backbone efficiently offloads peripheral
management from the system design. The backbone can set and clear flags based upon peripheral
behavior and can define performance criteria. The flexibility of the stack enables a designer to
configure the silicon, directly bypassing the backbone if that level of control is desired.
One step up from the backbone is the Fusion applet, Level 2. The applet is an application building
block that implements a specific function in FPGA gates. It can react to stimuli and board-level
events coming through the backbone or from other sources, and responds to these stimuli by
accessing and manipulating peripherals via the backbone or initiating some other action. An applet
controls or responds to the peripheral(s). Applets can be easily imported or exported from the
design environment. The applet structure is open and well-defined, enabling users to import
applets from Actel, system developers, third parties, and user groups.
Optional ARM or 8051 Processor
Flash
Memory
User Applications
Level 3
Fusion Applets
Level 2
Fusion Smart Backbone
Level 1
Smart Peripherals
Analog
Analog
Analog
in FPGA
Smart
Smart
Smart
Fabric
Peripheral 1 Peripheral 2 Peripheral n (e.g., logic, PLL, FIFO)
Level 0
Note: Levels 1, 2, and 3 are implemented in FPGA logic gates.
Figure 2-1 • Fusion Architecture Stack
Pr e li m i n a ry v1 . 7
2-1
Device Architecture
The system application, Level 3, is the larger user application that utilizes one or more applets.
Designing at the highest level of abstraction supported by the Actel Fusion technology stack, the
application can be easily created in FPGA gates by importing and configuring multiple applets.
In fact, in some cases an entire FPGA system design can be created without any HDL coding.
An optional MCU enables a combination of software and HDL-based design methodologies. The
MCU can be on-chip or off-chip as system requirements dictate. System portioning is very flexible,
allowing the MCU to reside above the applets or to absorb applets, or applets and backbone, if
desired.
The Actel Fusion technology stack enables a very flexible design environment. Users can engage in
design across a continuum of abstraction from very low to very high.
Core Architecture
VersaTile
Based upon successful Actel ProASIC3/E logic architecture, Fusion devices provide granularity
comparable to gate arrays. The Fusion device core consists of a sea-of-VersaTiles architecture.
As illustrated in Figure 2-2, there are four inputs in a logic VersaTile cell, and each VersaTile can be
configured using the appropriate flash switch connections:
•
Any 3-input logic function
•
Latch with clear or set
•
D-flip-flop with clear or set
•
Enable D-flip-flop with clear or set (on a 4th input)
VersaTiles can flexibly map the logic and sequential gates of a design. The inputs of the VersaTile
can be inverted (allowing bubble pushing), and the output of the tile can connect to high-speed,
very-long-line routing resources. VersaTiles and larger functions are connected with any of the four
levels of routing hierarchy.
When the VersaTile is used as an enable D-flip-flop, the SET/CLR signal is supported by a fourth
input, which can only be routed to the core cell over the VersaNet (global) network.
2 -2
Pr e li m i n a r y v1 . 7
Actel Fusion Mixed-Signal FPGAs
The output of the VersaTile is F2 when the connection is to the ultra-fast local lines, or YL when the
connection is to the efficient long-line or very-long-line resources (Figure 2-2).
0
1
Data
X3
0
1
0
1
Y
Pin 1
F2
YL
CLK
X2
0
1
CLR/
Enable
X1
CLR
XC*
Legend:
Via (hard connection)
Switch (flash connection)
Ground
Note: *This input can only be connected to the global clock distribution network.
Figure 2-2 • Fusion Core VersaTile
Pr e li m i n a ry v1 . 7
2-3
Device Architecture
VersaTile Characteristics
Sample VersaTile Specifications—Combinatorial Module
The Fusion library offers all combinations of LUT-3 combinatorial functions. In this section, timing
characteristics are presented for a sample of the library (Figure 2-3). For more details, refer to the
Fusion, IGLOO/e and ProASIC3/E Macro Library Guide.
A
A
A
OR2
NOR2
Y
A
AND2
A
Y
NAND2
B
A
B
C
XOR2
Y
A
NAND3
B
MUX2
B
C
Pr e li m i n a r y v1 . 7
Y
0
Y
Figure 2-3 • Sample of Combinatorial Cells
XOR3
A
MAJ3
S
2 -4
Y
B
A
A
B
C
Y
B
B
B
Y
INV
1
Y
Actel Fusion Mixed-Signal FPGAs
tPD
A
NAND2 or
Any Combinatorial
Logic
B
Y
tPD = MAX(tPD(RR), tPD(RF), tPD(FF), tPD(FR))
where edges are applicable for the
particular combinatorial cell
VCCA
50%
50%
A, B, C
GND
VCCA
50%
50%
OUT
GND
VCCA
tPD
(FF)
tPD
(RR)
tPD
(FR)
OUT
50%
tPD
(RF)
50%
GND
Figure 2-4 • Combinatorial Timing Model and Waveforms
Pr e li m i n a ry v1 . 7
2-5
Device Architecture
Timing Characteristics
Table 2-1 •
Combinatorial Cell Propagation Delays
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V
Combinatorial Cell
Equation
Parameter
–2
–1
Std.
Units
Y = !A
tPD
0.40
0.46
0.54
ns
Y=A·B
tPD
0.47
0.54
0.63
ns
Y = !(A · B)
tPD
0.47
0.54
0.63
ns
Y=A+B
tPD
0.49
0.55
0.65
ns
NOR2
Y = !(A + B)
tPD
0.49
0.55
0.65
ns
XOR2
Y=A⊕B
tPD
0.74
0.84
0.99
ns
MAJ3
Y = MAJ(A, B, C)
tPD
0.70
0.79
0.93
ns
XOR3
Y=A⊕B⊕C
tPD
0.87
1.00
1.17
ns
MUX2
Y = A !S + B S
tPD
0.51
0.58
0.68
ns
AND3
Y=A·B·C
tPD
0.56
0.64
0.75
ns
INV
AND2
NAND2
OR2
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
Sample VersaTile Specifications—Sequential Module
The Fusion library offers a wide variety of sequential cells, including flip-flops and latches. Each has
a data input and optional enable, clear, or preset. In this section, timing characteristics are
presented for a representative sample from the library (Figure 2-5). For more details, refer to the
Fusion, IGLOO/e and ProASIC3/E Macro Library Guide.
2 -6
Pr e li m i n a r y v1 . 7
Actel Fusion Mixed-Signal FPGAs
Data
D
Out
Q
Data
Out
D
En
DFN1
CLK
Q
DFN1E1
CLK
PRE
Data
Out
Q
D
Data
D
En
DFN1C1
Q
Out
DFI1E1P1
CLK
CLK
CLR
Figure 2-5 • Sample of Sequential Cells
tCKMPWH tCKMPWL
CLK
50%
50%
50%
50%
50%
50%
50%
tHD
tSUD
50%
Data
EN
50%
tWPRE
50%
tHE
PRE
0
50%
tSUE
tRECPRE
tREMPRE
50%
50%
tWCLR
50%
CLR
tRECCLR
50%
tREMCLR
50%
tPRE2Q
50%
Out
50%
tCLR2Q
50%
tCLKQ
Figure 2-6 • Sequential Timing Model and Waveforms
Pr e li m i n a ry v1 . 7
2-7
Device Architecture
Sequential Timing Characteristics
Table 2-2 •
Parameter
Register Delays
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V
Description
tCLKQ
Clock-to-Q of the Core Register
–2
–1
Std.
Units
0.55
0.63
0.74
ns
tSUD
Data Setup Time for the Core Register
0.43
0.49
0.57
ns
tHD
Data Hold Time for the Core Register
0.00
0.00
0.00
ns
tSUE
Enable Setup Time for the Core Register
0.45
0.52
0.61
ns
tHE
Enable Hold Time for the Core Register
0.00
0.00
0.00
ns
tCLR2Q
Asynchronous Clear-to-Q of the Core Register
0.40
0.45
0.53
ns
tPRE2Q
Asynchronous Preset-to-Q of the Core Register
0.40
0.45
0.53
ns
tREMCLR
Asynchronous Clear Removal Time for the Core Register
0.00
0.00
0.00
ns
tRECCLR
Asynchronous Clear Recovery Time for the Core Register
0.22
0.25
0.30
ns
tREMPRE
Asynchronous Preset Removal Time for the Core Register
0.00
0.00
0.00
ns
tRECPRE
Asynchronous Preset Recovery Time for the Core Register
0.22
0.25
0.30
ns
tWCLR
Asynchronous Clear Minimum Pulse Width for the Core Register
0.22
0.25
0.30
ns
tWPRE
Asynchronous Preset Minimum Pulse Width for the Core Register
0.22
0.25
0.30
ns
tCKMPWH
Clock Minimum Pulse Width HIGH for the Core Register
0.32
0.37
0.43
ns
tCKMPWL
Clock Minimum Pulse Width LOW for the Core Register
0.36
0.41
0.48
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
2 -8
Pr e li m i n a r y v1 . 7
Actel Fusion Mixed-Signal FPGAs
Array Coordinates
During many place-and-route operations in the Actel Designer software tool, it is possible to set
constraints that require array coordinates. Table 2-3 is provided as a reference. The array
coordinates are measured from the lower left (0, 0). They can be used in region constraints for
specific logic groups/blocks, designated by a wildcard, and can contain core cells, memories, and
I/Os.
Table 2-3 provides array coordinates of core cells and memory blocks.
I/O and cell coordinates are used for placement constraints. Two coordinate systems are needed
because there is not a one-to-one correspondence between I/O cells and edge core cells. In
addition, the I/O coordinate system changes depending on the die/package combination. It is not
listed in Table 2-3. The Designer ChipPlanner tool provides array coordinates of all I/O locations. I/O
and cell coordinates are used for placement constraints. However, I/O placement is easier by
package pin assignment.
Figure 2-7 illustrates the array coordinates of an AFS600 device. For more information on how to
use array coordinates for region/placement constraints, see the Designer User's Guide or online
help (available in the software) for Fusion software tools.
Table 2-3 •
Array Coordinates
VersaTiles
Min.
Memory Rows
Max.
Bottom
All
Top
Min.
Max.
Device
x
y
x
y
(x, y)
(x, y)
(x, y)
(x, y)
AFS090
3
2
98
25
None
(3, 26)
(0, 0)
(101, 29)
AFS250
3
2
130
49
None
(3, 50)
(0, 0)
(133, 53)
AFS600
3
4
194
75
(3, 2)
(3, 76)
(0, 0)
(197, 79)
AFS1500
3
4
322
123
(3, 2)
(3, 124)
(0, 0)
(325, 129)
I/O Tile
(0, 79)
Top Row (7, 79) to (189, 79)
Bottom Row (5, 78) to (192, 78)
(197, 79)
Memory (3, 77)
Blocks (3, 76)
(194, 77) Memory
(194, 76) Blocks
VersaTile (Core)
(3, 75)
(194, 75)
VersaTile (Core)
(194, 4)
VersaTile(Core)
VersaTile (Core)
(3, 4)
(194, 3) Memory
(194, 2) Blocks
Memory (3, 3)
Blocks (3, 2)
(197, 1)
(0, 0)
UJTAG FlashROM
I/O Tile to Analog Block
Top Row (5, 1) to (168, 1)
Bottom Row (7, 0) to (165, 0)
(197, 0)
Top Row (169, 1) to (192, 1)
Note: The vertical I/O tile coordinates are not shown. West side coordinates are {(0, 2) to (2, 2)} to {(0, 77) to (2,
77)}; east side coordinates are {(195, 2) to (197, 2)} to {(195, 77) to (197, 77)}.
Figure 2-7 • Array Coordinates for AFS600
Pr e li m i n a ry v1 . 7
2-9
Device Architecture
Routing Architecture
The routing structure of Fusion devices is designed to provide high performance through a flexible
four-level hierarchy of routing resources: ultra-fast local resources; efficient long-line resources;
high-speed very-long-line resources; and the high-performance VersaNet networks.
The ultra-fast local resources are dedicated lines that allow the output of each VersaTile to connect
directly to every input of the eight surrounding VersaTiles (Figure 2-8). The exception to this is that
the SET/CLR input of a VersaTile configured as a D-flip-flop is driven only by the VersaNet global
network.
The efficient long-line resources provide routing for longer distances and higher-fanout
connections. These resources vary in length (spanning one, two, or four VersaTiles), run both
vertically and horizontally, and cover the entire Fusion device (Figure 2-9 on page 2-11). Each
VersaTile can drive signals onto the efficient long-line resources, which can access every input of
every VersaTile. Active buffers are inserted automatically by routing software to limit loading
effects.
The high-speed very-long-line resources, which span the entire device with minimal delay, are used
to route very long or high-fanout nets: length +/–12 VersaTiles in the vertical direction and length
+/–16 in the horizontal direction from a given core VersaTile (Figure 2-10 on page 2-12). Very long
lines in Fusion devices, like those in ProASIC3 devices, have been enhanced. This provides a
significant performance boost for long-reach signals.
The high-performance VersaNet global networks are low-skew, high-fanout nets that are accessible
from external pins or from internal logic (Figure 2-11 on page 2-13). These nets are typically used to
distribute clocks, reset signals, and other high-fanout nets requiring minimum skew. The VersaNet
networks are implemented as clock trees, and signals can be introduced at any junction. These can
be employed hierarchically, with signals accessing every input on all VersaTiles.
Long Lines
L
Inputs
L
L
L
Ultra-Fast Local Lines
(connects a VersaTile to the
adjacent VersaTile, I/O buffer,
or memory block)
Output
L
L
L
L
L
Note: Input to the core cell for the D-flip-flop set and reset is only available via the VersaNet global network connection.
Figure 2-8 • Ultra-Fast Local Lines Connected to the Eight Nearest Neighbors
Global Resources (VersaNets)
Fusion devices offer powerful and flexible control of circuit timing through the use of analog
circuitry. Each chip has six CCCs. The west CCC also contains a PLL core. In the two larger devices
2 -1 0
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
Spans Four VersaTiles
Spans Two VersaTiles
Spans One VersaTile
VersaTile
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
Spans One VersaTile
Spans Two VersaTiles
Spans Four VersaTiles
Figure 2-9 • Efficient Long-Line Resources
(AFS600 and AFS1500), the west and the east CCCs each contain a PLL. The PLLs include delay lines,
a phase shifter (0°, 90°, 180°, 270°), and clock multipliers/dividers. Each CCC has all the circuitry
needed for the selection and interconnection of inputs to the VersaNet global network. The east
and west CCCs each have access to three VersaNet global lines on each side of the chip (six lines
total). The CCCs at the four corners each have access to three quadrant global lines on each
quadrant of the chip.
Advantages of the VersaNet Approach
One of the architectural benefits of Fusion is the set of powerful and low-delay VersaNet global
networks. Fusion offers six chip (main) global networks that are distributed from the center of the
FPGA array (Figure 2-11). In addition, Fusion devices have three regional globals (quadrant globals)
in each of the four chip quadrants. Each core VersaTile has access to nine global network resources:
three quadrant and six chip (main) global networks. There are a total of 18 global networks on the
device. Each of these networks contains spines and ribs that reach all VersaTiles in all quadrants
(Figure 2-12 on page 2-14). This flexible VersaNet global network architecture allows users to map
up to 180 different internal/external clocks in a Fusion device. Details on the VersaNet networks are
given in Table 2-4 on page 2-14. The flexibility of the Fusion VersaNet global network allows the
designer to address several design requirements. User applications that are clock-resource-intensive
can easily route external or gated internal clocks using VersaNet global routing networks.
Designers can also drastically reduce delay penalties and minimize resource usage by mapping
critical, high-fanout nets to the VersaNet global network.
Pr e li m i n a ry v1 . 7
2 - 11
Device Architecture
High-Speed, Very-Long-Line Resources
Pad Ring
SRAM
I/O Ring
Pad Ring
I/O Ring
16×12 Block of VersaTiles
Figure 2-10 • Very-Long-Line Resources
2 -1 2
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
Quadrant Global Pads
High-Performance
VersaNet Global Network
I/O Ring
Pad Ring
Pad Ring
Top Spine
Main (chip)
Global Network
Global
Pads
Chip (main)
Global Pads
Global Spine
Global Ribs
Spine-Selection
Tree MUX
I/O Ring
Bottom Spine
Figure 2-11 • Overview of Fusion VersaNet Global Network
Pr e li m i n a ry v1 . 7
2 - 13
Device Architecture
Northwest Quadrant Global Network
CCC
CCC
Quadrant Global Spine
3
3
3
Chip (main)
Global
Network
6
6
3
6
6
3
3
CCC
CCC
6
Global Spine
6
6
3
3
6
3
3
CCC
CCC
Southeast Quadrant Global Network
Figure 2-12 • Global Network Architecture
Table 2-4 •
Globals/Spines/Rows by Device
AFS090
AFS250
AFS600
AFS1500
Global VersaNets (trees)*
9
9
9
9
VersaNet Spines/Tree
4
8
12
20
Total Spines
36
72
108
180
VersaTiles in Each Top or Bottom Spine
384
768
1,152
1,920
2,304
6,144
13,824
38,400
Total VersaTiles
Note: *There are six chip (main) globals and three globals per quadrant.
2 -1 4
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
VersaNet Global Networks and Spine Access
The Fusion architecture contains a total of 18 segmented global networks that can access the
VersaTiles, SRAM, and I/O tiles on the Fusion device. There are 6 chip (main) global networks that
access the entire device and 12 quadrant networks (3 in each quadrant). Each device has a total of
18 globals. These VersaNet global networks offer fast, low-skew routing resources for high-fanout
nets, including clock signals. In addition, these highly segmented global networks offer users the
flexibility to create low-skew local networks using spines for up to 180 internal/external clocks (in
an AFS1500 device) or other high-fanout nets in Fusion devices. Optimal usage of these low-skew
networks can result in significant improvement in design performance on Fusion devices.
The nine spines available in a vertical column reside in global networks with two separate regions
of scope: the quadrant global network, which has three spines, and the chip (main) global
network, which has six spines. Note that there are three quadrant spines in each quadrant of the
device. There are four quadrant global network regions per device (Figure 2-12 on page 2-14).
The spines are the vertical branches of the global network tree, shown in Figure 2-11 on page 2-13.
Each spine in a vertical column of a chip (main) global network is further divided into two equallength spine segments: one in the top and one in the bottom half of the die.
Each spine and its associated ribs cover a certain area of the Fusion device (the "scope" of the
spine; see Figure 2-11 on page 2-13). Each spine is accessed by the dedicated global network MUX
tree architecture, which defines how a particular spine is driven—either by the signal on the global
network from a CCC, for example, or another net defined by the user (Figure 2-13). Quadrant
spines can be driven from user I/Os on the north and south sides of the die, via analog I/Os
configured as direct digital inputs. The ability to drive spines in the quadrant global networks can
have a significant effect on system performance for high-fanout inputs to a design.
Details of the chip (main) global network spine-selection MUX are presented in Figure 2-13. The
spine drivers for each spine are located in the middle of the die.
Quadrant spines are driven from a north or south rib. Access to the top and bottom ribs is from the
corner CCC or from the I/Os on the north and south sides of the device. For details on using spines
in Fusion devices, see the Actel application note Using Global Resources in Actel Fusion Devices.
Internal/External
Signals
Internal/External
Signals
Tree Node MUX
Tree Node MUX
Internal/External
Signal
Tree Node MUX
Global Rib
Internal/External
Signal
Global Driver MUX
Spine
Figure 2-13 • Spine-Selection MUX of Global Tree
Pr e li m i n a ry v1 . 7
2 - 15
Device Architecture
Clock Aggregation
Clock aggregation allows for multi-spine clock domains. A MUX tree provides the necessary
flexibility to allow long lines or I/Os to access domains of one, two, or four global spines. Signal
access to the clock aggregation system is achieved through long-line resources in the central rib,
and also through local resources in the north and south ribs, allowing I/Os to feed directly into the
clock system. As Figure 2-14 indicates, this access system is contiguous.
There is no break in the middle of the chip for north and south I/O VersaNet access. This is different
from the quadrant clocks, located in these ribs, which only reach the middle of the rib.Refer to the
Using Global Resources in Actel Fusion Devices application note.
Global Spine
Global Rib
Global Driver and MUX
Tree Node MUX
I/O Access
Internal Signal Access
Global Signal Access
Figure 2-14 • Clock Aggregation Tree Architecture
2 -1 6
Pr e li m i n a ry v1 . 7
I/O Tiles
Actel Fusion Mixed-Signal FPGAs
Global Resource Characteristics
AFS600 VersaNet Topology
Clock delays are device-specific. Figure 2-15 is an example of a global tree used for clock
routing. The global tree presented in Figure 2-15 is driven by a CCC located on the west side
of the AFS600 device. It is used to drive all D-flip-flops in the device.
Central
Global Rib
CCC
VersaTile
Rows
Global Spine
Figure 2-15 • Example of Global Tree Use in an AFS600 Device for Clock Routing
Pr e li m i n a ry v1 . 7
2 - 17
Device Architecture
VersaNet Timing Characteristics
Global clock delays include the central rib delay, the spine delay, and the row delay. Delays do not
include I/O input buffer clock delays, as these are dependent upon I/O standard, and the clock may
be driven and conditioned internally by the CCC module. Table 2-5, Table 2-6, Table 2-7, and
Table 2-8 on page 2-19 present minimum and maximum global clock delays within the
device.Minimum and maximum delays are measured with minimum and maximum loading,
respectively.
Timing Characteristics
Table 2-5 •
AFS1500 Global Resource Timing
Commercial-Case Conditions: TJ = 70°C, VCC = 1.425 V
–2
Parameter
1
Description
–1
Min.
Max.
2
1
Std.
Min.
Max.
2
Min.
1
Max.2
Units
tRCKL
Input LOW Delay for Global Clock
1.53
1.75
1.74
1.99
2.05
2.34
ns
tRCKH
Input HIGH Delay for Global Clock
1.53
1.79
1.75
2.04
2.05
2.40
ns
tRCKMPWH
Minimum Pulse Width HIGH for Global
Clock
ns
tRCKMPWL
Minimum Pulse Width LOW for Global
Clock
ns
tRCKSW
Maximum Skew for Global Clock
FRMAX
Maximum Frequency for Global Clock
0.26
0.29
0.34
ns
MHz
Notes:
1. Value reflects minimum load. The delay is measured from the CCC output to the clock pin of a sequential
element located in a lightly loaded row (single element is connected to the global net).
2. Value reflects maximum load. The delay is measured on the clock pin of the farthest sequential element
located in a fully loaded row (all available flip-flops are connected to the global net in the row).
3. For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
Table 2-6 •
AFS600 Global Resource Timing
Commercial-Case Conditions: TJ = 70°C, VCC = 1.425 V
–2
Parameter
Description
–1
Std.
Min.1
Max.2
Min.1
Max.2
Min.1
Max.2
Units
tRCKL
Input LOW Delay for Global Clock
1.27
1.49
1.44
1.70
1.69
2.00
ns
tRCKH
Input HIGH Delay for Global Clock
1.26
1.54
1.44
1.75
1.69
2.06
ns
tRCKMPWH
Minimum Pulse Width HIGH for Global
Clock
ns
tRCKMPWL
Minimum Pulse Width LOW for Global
Clock
ns
tRCKSW
Maximum Skew for Global Clock
FRMAX
Maximum Frequency for Global Clock
0.27
0.31
0.36
ns
MHz
Notes:
1. Value reflects minimum load. The delay is measured from the CCC output to the clock pin of a sequential
element located in a lightly loaded row (single element is connected to the global net).
2. Value reflects maximum load. The delay is measured on the clock pin of the farthest sequential element
located in a fully loaded row (all available flip-flops are connected to the global net in the row).
3. For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
2 -1 8
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
Table 2-7 •
AFS250 Global Resource Timing
Commercial-Case Conditions: TJ = 70°C, VCC = 1.425 V
–2
Parameter
Description
Min.
1
–1
2
1
Std.
Max.
Min.
Max.
2
Min.
1
Max.2
Units
tRCKL
Input LOW Delay for Global Clock
0.89
1.12
1.02
1.27
1.20
1.50
ns
tRCKH
Input HIGH Delay for Global Clock
0.88
1.14
1.00
1.30
1.17
1.53
ns
tRCKMPWH
Minimum Pulse Width HIGH for Global
Clock
ns
tRCKMPWL
Minimum Pulse Width LOW for Global
Clock
ns
tRCKSW
Maximum Skew for Global Clock
FRMAX
Maximum Frequency for Global Clock
0.26
0.30
0.35
ns
MHz
Notes:
1. Value reflects minimum load. The delay is measured from the CCC output to the clock pin of a sequential
element located in a lightly loaded row (single element is connected to the global net).
2. Value reflects maximum load. The delay is measured on the clock pin of the farthest sequential element
located in a fully loaded row (all available flip-flops are connected to the global net in the row).
3. For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
Table 2-8 •
AFS090 Global Resource Timing
Commercial-Case Conditions: TJ = 70°C, VCC = 1.425 V
–2
Parameter
Description
–1
Std.
Min.1
Max.2
Min.1
Max.2
Min.1
Max.2 Units
tRCKL
Input LOW Delay for Global Clock
0.84
1.07
0.96
1.21
1.13
1.43
ns
tRCKH
Input HIGH Delay for Global Clock
0.83
1.10
0.95
1.25
1.12
1.47
ns
tRCKMPWH
Minimum Pulse Width HIGH for Global
Clock
ns
tRCKMPWL
Minimum Pulse Width LOW for Global
Clock
ns
tRCKSW
Maximum Skew for Global Clock
FRMAX
Maximum Frequency for Global Clock
0.27
0.30
0.36
ns
MHz
Notes:
1. Value reflects minimum load. The delay is measured from the CCC output to the clock pin of a sequential
element located in a lightly loaded row (single element is connected to the global net).
2. Value reflects maximum load. The delay is measured on the clock pin of the farthest sequential element
located in a fully loaded row (all available flip-flops are connected to the global net in the row).
3. For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
Pr e li m i n a ry v1 . 7
2 - 19
Device Architecture
Clocking Resources
The Fusion family has a robust collection of clocking peripherals, as shown in the block diagram in
Figure 2-16. These on-chip resources enable the creation, manipulation, and distribution of many
clock signals. The Fusion integrated RC oscillator produces a 100 MHz clock source with no external
components. For systems requiring more precise clock signals, the Actel Fusion family supports an
on-chip crystal oscillator circuit. The integrated PLLs in each Fusion device can use the RC oscillator,
crystal oscillator, or another on-chip clock signal as a source. These PLLs offer a variety of
capabilities to modify the clock source (multiply, divide, synchronize, advance, or delay). Utilizing
the CCC found in the popular Actel ProASIC3 family, Fusion incorporates six CCC blocks. The CCCs
allow access to Fusion global and local clock distribution nets, as described in the "Global Resources
(VersaNets)" section on page 2-10.
Off-Chip
On-Chip
100 MHz
RC Oscillator
GNDOSC
VCCOSC
Clock Out to FPGA Core through CCC
XTAL1
GLINT
Crystal Oscillator
XTAL2
Xtal Clock
External
External
Crystal or
RC
Clock I/Os
From FPGA Core
Figure 2-16 • Fusion Clocking Options
2 -2 0
Pr e li m i n a ry v1 . 7
PLL/
CCC
GLA
GLC
To Core
NGMUX
CLKOUT
Actel Fusion Mixed-Signal FPGAs
RC Oscillator
The RC oscillator is an on-chip free-running clock source generating a 100 MHz clock. It can be used
as a source clock for both on-chip and off-chip resources. When used in conjunction with the Fusion
PLL and CCC circuits, the RC oscillator clock source can be used to generate clocks of varying
frequency and phase.
The Fusion RC oscillator is very accurate at ±1% over commercial and industrial temperature
ranges. It is an automated clock, requiring no setup or configuration by the user. It requires only
that the power and GNDOSC pins be connected; no external components are required. The RC
oscillator can be used to drive either a PLL or another internal signal.
RC Oscillator Characteristics
Table 2-9 •
Parameter
FRC
Electrical Characteristics of RC Oscillator
Description
Conditions
Operating
Frequency
Min.
Typ.
Max.
Units
100
MHz
1
%
3
%
Period Jitter (at 5 k cycles)
100
ps
Cycle–Cycle Jitter (at 5 k cycles)
100
ps
Period
Jitter
(at
5k
cycles)
with
1 kHz / 300 mV peak-to-peak noise on power
supply
150
ps
Cycle–Cycle Jitter (at 5 k cycles) with 1 kHz /
300 mV peak-to-peak noise on power supply
150
ps
Output Duty Cycle
50
%
Operating Current
1
mA
Accuracy
Temperature: 0°C to 85°C
Voltage: 3.3 V ± 5%
Temperature: –40°C to 125°C
Voltage: 3.3 V ± 5%
Output Jitter
IDYNRC
Pr e li m i n a ry v1 . 7
2 - 21
Device Architecture
Crystal Oscillator
The on-chip crystal oscillator circuit works with an off-chip crystal to generate a high-precision
clock. It has an accuracy of 100 ppm (0.01%) and is capable of providing system clocks for Fusion
peripherals and other system clock networks, both on-chip and off-chip. When combined with the
on-chip CCC/PLL blocks, a wide range of clock frequencies can be created to support various design
requirements.
The on-chip circuitry is designed to work with an external crystal, a ceramic resonator, or an RC
network. It can only support one of these configurations at a time. Typical design practices dictate
that the desired mode for the crystal oscillator be determined and the board designed for a single
configuration. The crystal oscillator supports four modes of operation, defined in Table 2-10.
In Mode 0, the oscillator is configured to work with an external RC network. The RC components
are connected to the XTAL1 pin, with XTAL2 left floating. The frequency generated by the circuit in
Mode 0 is determined by the RC time constant of the selected components (Figure 2-18).
Table 2-10 • Crystal Oscillator Mode Definition
Mode
RTCMODE/MODE[1:0]
Frequency Range
RC network (Mode 0)
00
N/A
Low gain (Mode 1)
01
0.032 to 0.20 MHz
Medium gain (Mode 2)
10
0.20 to 2.0 MHz
High gain (Mode 3)
11
2.0 to 20.0 MHz
XTL
SELMODE
CLKOUT
RTCMODE[1:0]
MODE[1:0]
Figure 2-17 • Crystal Oscillator Macro
RC Time Constant Values vs. Frequency
RC Time Constant (sec)
1.00E-0.3
1.00E-0.4
1.00E-0.5
1.00E-0.6
1.00E-0.7
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
Frequency (MHz)
Figure 2-18 • Crystal Oscillator: RC Time Constant Values vs. Frequency (typical)
2 -2 2
Pr e li m i n a ry v1 . 7
4.5
Actel Fusion Mixed-Signal FPGAs
In Modes 1 to 3, the crystal oscillator is configured to support an external crystal or ceramic
resonator. These modes correspond to low, medium, and high gain. They differ in the crystal or
resonator frequency supported. The crystal or resonator is connected to the XTAL1 and XTAL2 pins.
Additionally, a capacitor is required on both XTAL1 and XTAL2 pins to ground (Figure 2-16 on
page 2-20). Table 2-10 on page 2-22 details each crystal oscillator mode, supported frequency
range, and recommended capacitor value.
A use model supported by the Fusion device involves powering down the core while the RTC
continues to run, clocked by the crystal oscillator. When powered down, the core cannot control
crystal oscillator mode pins. Also, some designers may wish to avoid the RTC altogether. To support
both situations, the crystal oscillator can be controlled by either the RTC or the FPGA core. If the
RTC is instantiated in the design, it will by default use RTCMODE[1:0] to set the crystal oscillator
control pins (the default). If the RTC is not used in the design, the FPGA core will set the crystal
oscillator control pins with MODE[1:0].
The crystal oscillator can be disabled/enabled by RTC or FPGA upon operation requirement. When
the crystal oscillator is disabled, XTL1 and XTL2 pins can be left floating.
Crystal Oscillator Characteristics
Table 2-11 • Electrical Characteristics of the Crystal Oscillator
Parameter
FXTAL
Description
Conditions
Operating Frequency
Using External Crystal
Using Ceramic Resonator
Using RC Network
Min.
Max.
Units
0.032
20
MHz
0.5
8
MHz
0.032
4
MHz
Output Duty Cycle
IDYNXTAL
Typ.
50
%
Output Jitter
With 10 MHz Crystal
50
ps RMS
Operating Current
RC
0.6
mA
0.032–0.2 MHz
0.19
mA
0.2–2.0 MHz
0.6
mA
2.0–20.0 MHz
0.6
mA
10
µA
0.5
Vp–p
ISTBXTAL
Sleep Current
PSRRXTAL
Power Supply
Tolerance
VIHXTAL
Input Logic Level HIGH
VILXTAL
Input Logic Level LOW
Noise
90% of VCC
V
10% of VCC
Pr e li m i n a ry v1 . 7
V
2 - 23
Device Architecture
Clock Conditioning Circuits
In Fusion devices, the CCCs are used to implement frequency division, frequency multiplication,
phase shifting, and delay operations.
The CCCs are available in six chip locations—each of the four chip corners and the middle of the
east and west chip sides.
Each CCC can implement up to three independent global buffers (with or without programmable
delay), or a PLL function (programmable frequency division/multiplication, phase shift, and delays)
with up to three global outputs. Unused global outputs of a PLL can be used to implement
independent global buffers, up to a maximum of three global outputs for a given CCC.
A global buffer can be placed in any of the three global locations (CLKA-GLA, CLKB-GLB, and CLKCGLC) of a given CCC.
A PLL macro uses the CLKA CCC input to drive its reference clock. It uses the GLA and, optionally,
the GLB and GLC global outputs to drive the global networks. A PLL macro can also drive the YB
and YC regular core outputs. The GLB (or GLC) global output cannot be reused if the YB (or YC)
output is used (Figure 2-19). Refer to the "PLL Macro" section on page 2-30 for more information.
Each global buffer, as well as the PLL reference clock, can be driven from one of the following:
•
3 dedicated single-ended I/Os using a hardwired connection
•
2 dedicated differential I/Os using a hardwired connection
•
The FPGA core
The CCC block is fully configurable, either via flash configuration bits set in the programming
bitstream or through an asynchronous interface. This asynchronous interface is dynamically
accessible from inside the Fusion device to permit changes of parameters (such as divide ratios)
during device operation. To increase the versatility and flexibility of the clock conditioning system,
the CCC configuration is determined either by the user during the design process, with
configuration data being stored in flash memory as part of the device programming procedure, or
by writing data into a dedicated shift register during normal device operation. This latter mode
allows the user to dynamically reconfigure the CCC without the need for core programming. The
shift register is accessed through a simple serial interface. Refer to the UJTAG Applications in Actel’s
Low-Power Flash Devices handbook chapter and the "CCC and PLL Characteristics" section on
page 2-31 for more information.
2 -2 4
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
Clock Source
Clock Conditioning
CLKA
EXTFB
POWERDOWN
Input LVDS/LVPECL Macro
PADN
GLA
LOCK
GLB
YB
GLC
YC
Y
PADP
INBUF2 Macro
Y
PAD
Output
OADIVRST
OADIVHALF
OADIV[4:0]
OAMUX[2:0]
DLYGLA[4:0]
OBDIV[4:0]
OBMUX[2:0]
DLYYB[4:0]
DLYGLB[4:0]
OCDIV[4:0]
OCMUX[2:0]
DLYYC[4:0]
DLYGLC[4:0]
FINDIV[6:0]
FBDIV[6:0]
FBDLY[4:0]
FBSEL[1:0]
XDLYSEL
VCOSEL[2:0]
GLA
or
GLA and (GLB or YB)
or
GLA and (GLC or YC)
or
GLA and (GLB or YB) and
(GLC or YC)
Notes:
1. Visit the Actel website for future application notes concerning dynamic PLL reconfiguration. Refer to the
"PLL Macro" section on page 2-30 for signal descriptions.
2. Many specific INBUF macros support the wide variety of single-ended and differential I/O standards for the
Fusion family.
3. Refer to the Fusion, IGLOO/e, and ProASIC3/E Macro Library Guide for more information.
Figure 2-19 • Fusion CCC Options: Global Buffers with the PLL Macro
Table 2-12 • Available Selections of I/O Standards within CLKBUF and CLKBUF_LVDS/LVPECL Macros
CLKBUF Macros
CLKBUF_LVCMOS5
CLKBUF_LVCMOS331
CLKBUF_LVCMOS18
CLKBUF_LVCMOS15
CLKBUF_PCI
CLKBUF_LVDS2
CLKBUF_LVPECL
Notes:
1. This is the default macro. For more details, refer to the Fusion, IGLOO/e and ProASIC3/E Macro Library
Guide.
2. The BLVDS and M-LVDS standards are supported with CLKBUF_LVDS.
Pr e li m i n a ry v1 . 7
2 - 25
Device Architecture
Global Buffers with No Programmable Delays
The CLKBUF and CLKBUF_LVPECL/LVDS macros are composite macros that include an I/O macro
driving a global buffer, hardwired together (Figure 2-20).
The CLKINT macro provides a global buffer function driven by the FPGA core.
The CLKBUF, CLKBUF_LVPECL/LVDS, and CLKINT macros are pass-through clock sources and do not
use the PLL or provide any programmable delay functionality.
Many specific CLKBUF macros support the wide variety of single-ended and differential I/O
standards supported by Fusion devices. The available CLKBUF macros are described in the Fusion,
IGLOO/e and ProASIC3/E Macro Library Guide.
Clock Source
Clock Conditioning
Output
GLA
CLKBUF_LVDS/LVPECL Macro
CLKBUF Macro
CLKINT Macro
None
PADN
PADP
Y
PAD
Y
A
Y
or
GLB
or
GLC
Figure 2-20 • Global Buffers with No Programmable Delay
2 -2 6
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
Global Buffers with Programmable Delay
The CLKDLY macro is a pass-through clock source that does not use the PLL, but provides the ability
to delay the clock input using a programmable delay (Figure 2-21). The CLKDLY macro takes the
selected clock input and adds a user-defined delay element. This macro generates an output clock
phase shift from the input clock.
The CLKDLY macro can be driven by an INBUF macro to create a composite macro, where the I/O
macro drives the global buffer (with programmable delay) using a hardwired connection. In this
case, the I/O must be placed in one of the dedicated global I/O locations.
Many specific INBUF macros support the wide variety of single-ended and differential I/O standards
supported by the Fusion family. The available INBUF macros are described in the Fusion, IGLOO/e
and ProASIC3/E Macro Library Guide.
The CLKDLY macro can be driven directly from the FPGA core.
The CLKDLY macro can also be driven from an I/O that is routed through the FPGA regular routing
fabric. In this case, users must instantiate a special macro, PLLINT, to differentiate from the
hardwired I/O connection described earlier.
The visual CLKDLY configuration in the SmartGen part of the Libero IDE and Designer tools allows
the user to select the desired amount of delay and configures the delay elements appropriately.
SmartGen also allows the user to select the input clock source. SmartGen will automatically
instantiate the special macro, PLLINT, when needed.
Clock Source
Clock Conditioning
Output
GLA
Input LVDS/LVPECL Macro
CLK
PADN
GL
Y
or
GLB
PADP
or
DLYGL[4:0]
GLC
INBUF* Macro
Y
PAD
Figure 2-21 • Fusion CCC Options: Global Buffers with Programmable Delay
Pr e li m i n a ry v1 . 7
2 - 27
Device Architecture
Global Input Selections
Each global buffer, as well as the PLL reference clock, can be driven from one of the following
(Figure 2-22):
•
3 dedicated single-ended I/Os using a hardwired connection
•
2 dedicated differential I/Os using a hardwired connection
•
The FPGA core
Each shaded box represents an
input buffer called out by the
appropriate name: INBUF or
INBUF_LVDS/LVPECL.
To Core
Sample Pin Names
1
GAA0
1
GAA1
+
Source for CCC
(CLKA or CLKB or CLKC)
1
GAA2
Routed Clock
2
(from FPGA core)
+
GAA[0:2]: GA represents global in the northwest corner
of the device. A[0:2]: designates specific A clock source.
Notes:
3. Represents the global input pins. Globals have direct access to the clock conditioning block and are not
routed via the FPGA fabric. Refer to the "User I/O Naming Convention" section on page 2-157 for more
information.
4. Instantiate the routed clock source input as follows:
a) Connect the output of a logic element to the clock input of the PLL, CLKDLY, or CLKINT macro.
b) Do not place a clock source I/O (INBUF or INBUF_LVPECL/LVDS) in a relevant global pin location.
5. LVDS-based clock sources are available in the east and west banks on all Fusion devices.
Figure 2-22 • Clock Input Sources Including CLKBUF, CLKBUF_LVDS/LVPECL, and CLKINT
2 -2 8
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
CCC Physical Implementation
The CCC circuit is composed of the following (Figure 2-23):
•
PLL core
•
3 phase selectors
•
6 programmable delays and 1 fixed delay
•
5 programmable frequency dividers that provide frequency multiplication/division (not
shown in Figure 2-23 because they are automatically configured based on the user's
required frequencies)
•
1 dynamic shift register that provides CCC dynamic reconfiguration capability (not shown)
CCC Programming
The CCC block is fully configurable. It is configured via static flash configuration bits in the array,
set by the user in the programming bitstream, or configured through an asynchronous dedicated
shift register, dynamically accessible from inside the Fusion device. The dedicated shift register
permits changes of parameters such as PLL divide ratios and delays during device operation. This
latter mode allows the user to dynamically reconfigure the PLL without the need for core
programming. The register file is accessed through a simple serial interface.
CLKA
Four-Phase Output
PLL Core
Fixed Delay
Phase
Select
Programmable
Delay Type 2
GLA
Programmable
Delay Type 2
GLB
Programmable
Delay Type 1
YB
Programmable
Delay Type 2
GLC
Programmable
Delay Type 1
YC
Programmable
Delay Type 1
Phase
Select
Phase
Select
Note: Clock divider and multiplier blocks are not shown in this figure or in SmartGen. They are automatically
configured based on the user's required frequencies.
Figure 2-23 • PLL Block
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2 - 29
Device Architecture
PLL Macro
The PLL functionality of the clock conditioning block is supported by the PLL macro. Note that the
PLL macro reference clock uses the CLKA input of the CCC block, which is only accessible from the
global A[0:2] package pins. Refer to Figure 2-22 on page 2-28 for more information.
The PLL macro provides five derived clocks (three independent) from a single reference clock. The
PLL feedback loop can be driven either internally or externally. The PLL macro also provides powerdown input and lock output signals. During power-up, POWERDOWN should be asserted LOW until
VCC is up. See Figure 2-19 on page 2-25 for more information.
Inputs:
•
CLKA: selected clock input
•
POWERDOWN (active low): disables PLLs. The default state is power-down on (active low).
Outputs:
•
LOCK (active high): indicates that PLL output has locked on the input reference signal
•
GLA, GLB, GLC: outputs to respective global networks
•
YB, YC: allows output from the CCC to be routed back to the FPGA core
As previously described, the PLL allows up to five flexible and independently configurable clock
outputs. Figure 2-23 on page 2-29 illustrates the various clock output options and delay elements.
As illustrated, the PLL supports three distinct output frequencies from a given input clock. Two of
these (GLB and GLC) can be routed to the B and C global networks, respectively, and/or routed to
the device core (YB and YC).
There are five delay elements to support phase control on all five outputs (GLA, GLB, GLC, YB, and
YC).
There is also a delay element in the feedback loop that can be used to advance the clock relative to
the reference clock.
The PLL macro reference clock can be driven by an INBUF macro to create a composite macro,
where the I/O macro drives the global buffer (with programmable delay) using a hardwired
connection. In this case, the I/O must be placed in one of the dedicated global I/O locations.
The PLL macro reference clock can be driven directly from the FPGA core.
The PLL macro reference clock can also be driven from an I/O routed through the FPGA regular
routing fabric. In this case, users must instantiate a special macro, PLLINT, to differentiate it from
the hardwired I/O connection described earlier.
The visual PLL configuration in SmartGen, available with the Libero IDE and Designer tools, will
derive the necessary internal divider ratios based on the input frequency and desired output
frequencies selected by the user. SmartGen allows the user to select the various delays and phase
shift values necessary to adjust the phases between the reference clock (CLKA) and the derived
clocks (GLA, GLB, GLC, YB, and YC). SmartGen also allows the user to select where the input clock is
coming from. SmartGen automatically instantiates the special macro, PLLINT, when needed.
2 -3 0
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
CCC and PLL Characteristics
Timing Characteristics
Table 2-13 • Fusion CCC/PLL Specification
Parameter
Min.
Typ.
Max.
Unit
Clock Conditioning Circuitry Input Frequency fIN_CCC
1.5
350
MHz
Clock Conditioning Circuitry Output Frequency fOUT_CCC
0.75
350
MHz
Delay Increments in Programmable Delay Blocks1, 2
160
ps
Number of Programmable Values in Each Programmable
Delay Block
32
Input Period Jitter
1.5
CCC Output Peak-to-Peak Period Jitter FCCC_OUT
Max Peak-to-Peak Period Jitter
1 Global
Network
Used
3 Global
Networks
Used
0.75 MHz to 24 MHz
1.00%
1.00%
24 MHz to 100 MHz
1.50%
1.50%
100 MHz to 250 MHz
2.25%
2.25%
250 MHz to 350 MHz
3.50%
3.50%
Acquisition Time
Tracking Jitter3
LockControl = 0
300
µs
LockControl = 1
6.0
ms
LockControl = 0
1.6
ns
LockControl = 1
0.8
ns
48.5
51.5
%
0.6
5.56
ns
0.025
5.56
ns
Output Duty Cycle
Delay Range in Block: Programmable Delay 1
1, 2
Delay Range in Block: Programmable Delay 2 1, 2
Delay Range in Block: Fixed Delay
ns
1, 2
2.2
ns
Notes:
1. This delay is a function of voltage and temperature. See Table 3-7 on page 3-9 for deratings.
2. TJ = 25°C, VCC = 1.5 V
3. Tracking jitter is defined as the variation in clock edge position of PLL outputs with reference to PLL input
clock edge. Tracking jitter does not measure the variation in PLL output period, which is covered by period
jitter parameter.
Pr e li m i n a ry v1 . 7
2 - 31
Device Architecture
No-Glitch MUX (NGMUX)
Positioned downstream from the PLL/CCC blocks, the NGMUX provides a special switching
sequence between two asynchronous clock domains that prevents generating any unwanted
narrow clock pulses. The NGMUX is used to switch the source of a global between three different
clock sources. Allowable inputs are either two PLL/CCC outputs or a PLL/CCC output and a regular
net, as shown in Figure 2-24. The GLMUXCFG[1:0] configuration bits determine the source of the
CLK inputs (i.e., internal signal or GLC). These are set by SmartGen during design but can also be
changed by dynamically reconfiguring the PLL. The GLMUXSEL[1:0] bits control which clock source
is passed through the NGMUX to the global network (GL). See Table 2-14.
Crystal Oscillator
RC Oscillator
W I/O Ring
GLMUXCFG[1:0]
CCC/PLL
GLINT
PLL/
CCC
Clock I/Os
To Clock Rib Driver
GLA
NGMUX
GLC
GL
From FPGA Core
PWR UP
GLMUXSEL[1:0]
Figure 2-24 • NGMUX
Table 2-14 • NGMUX Configuration and Selection Table
GLMUXCFG[1:0]
00
01
2 -3 2
GLMUXSEL[1:0]
Selected Input
Signal
MUX Type
2-to-1 GLMUX
X
0
GLA
X
1
GLC
X
0
GLA
X
1
GLINT
Pr e li m i n a ry v1 . 7
2-to-1 GLMUX
Actel Fusion Mixed-Signal FPGAs
The NGMUX macro is simplified to show the two clock options that have been selected by the
GLMUXCFG[1:0] bits. Figure 2-25 illustrates the NGMUX macro. During design, the two clock
sources are connected to CLK0 and CLK1 and are controlled by GLMUXSEL[1:0] to determine which
signal is to be passed through the MUX.
CLK0
GL
CLK1
GLMUXSEL[1:0]
Figure 2-25 • NGMUX Macro
The sequence of switching between two clock sources (from CLK0 to CLK1) is as follows
(Figure 2-26):
•
GLMUXSEL[1:0] transitions to initiate a switch.
•
GL drives one last complete CLK0 positive pulse (i.e., one rising edge followed by one falling
edge).
•
From that point, GL stays LOW until the second rising edge of CLK1 occurs.
•
At the second CLK1 rising edge, GL will begin to continuously deliver the CLK1 signal.
•
Minimum tsw = 0.05 ns at 25°C (typical conditions)
For examples of NGMUX operation, refer to the Fusion Handbook.
tSW
CLK0
CLK1
GLMUXSEL[1:0]
GL
Figure 2-26 • NGMUX Waveform
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2 - 33
Device Architecture
Real-Time Counter System
The addition of the RTC system enables Fusion devices to support both standby and sleep modes of
operation, greatly reducing power consumption in many applications.
The RTC system comprises six blocks that work together to provide this increased functionality and
reduced power consumption. Figure 2-27 shows these blocks and how they are connected.
•
RTC (Figure 2-28)
•
Crystal oscillator
•
VCC33UP detector
•
Voltage regulator initialization
•
Voltage regulator logic
•
1.5 V voltage regulator
The RTC provides a counter as well as a MATCH output signal that can be used in the FPGA and,
optionally, to power up the on-chip 1.5 V voltage regulator and provide a 1.5 V power source (in
conjunction with an external pass transistor) to the FPGA fabric portion of the Fusion silicon device.
The FPGA fabric can then be used to power down the 1.5 V voltage regulator.
1.5 V FPGA Supply Input
FPGA Fabric
1.5/3.3 Volt Level Shift Circuitry
3.3 V
From
Core Flash
Bits
RTC
Crystal Oscillator
MODE[1:0]
ACM
RTCMATCH
0
RTCMODE[1:0]
XTAL1
EN
VR Logic
Flash Bits
VRINITSTATE
SELMODE
RTCPSMMATCH
FPGA_VRON
VRON
RTCCLK
VRFPD
PTBASE
External
Pass
Transistor
PTEM
RTCPSMMATCH
XTAL2
CLKOUT
1.5 V Voltage
Regulator
VR Init
1.5 V
Output
VRPU
PUB
VCC33UP
~ VRPSM
Power-Up/Down
Toggle Control
Switch
Figure 2-27 • Real-Time Counter System
2 -3 4
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
Analog Configuration MUX (ACM) Interface
Control/Status
Register
7-Bit Prescaler
(Crystal ÷ 128)
40-Bit
Counter
40-Bit Match
Register
Main
Registers
40-Bit
Read-Hold
Register
40 XNORs
Match
Bits
Match
Figure 2-28 • RTC Block Diagram
Real-Time Counter
The RTC can be configured to power up the FPGA fabric at a specific time or periodically. Custom
user logic or a soft microcontroller within the FPGA fabric portion of the Fusion device can be
programmed to read and modify the registers in the RTC. Based on this information or other
internal or external conditions, the FPGA may decide to power down the voltage regulator and
thereby shut off the FPGA fabric.
The 3.3 V supply must be valid and the crystal oscillator (nominally 32.768 kHz) enabled for a selftimed wake-up/restart operation. When operating from the 3.3 V supply with the 1.5 V core
voltage disabled, the ACM interface to the FPGA is disabled.
A 40-bit loadable counter is used as the primary timekeeping element within the RTC. This counter
can be configured to reset itself when a count value is reached that matches the value set within a
40-bit match register. Note that the only exception to this self-clearing mechanism occurs when the
40-bit counter is equal to zero (0x0000000000), since the counter would never increment from
zero. When the device is first powered up (i.e., when the 3.3 V supply becomes valid), the 40-bit
counter and 40-bit match register are cleared to logic 0, and the MATCH output signal is active
(logic 1). At any time when the 40-bit counter value does not match the value in the 40-bit match
register, the MATCH output signal will become inactive (logic 0).
Both the counter and match registers are addressable (read/write) from the FPGA and through a
JTAG instruction. The RTC is considered part of the analog system and is accessed via the ACM.
Refer to the "Analog Configuration MUX" section on page 2-124 for detailed instructions on
writing to the RTC via the ACM. The counter action can be suspended/resumed by clearing/setting
the Cntr_En bit in the Control/Status register.
If a 32.768 kHz external crystal is connected to the crystal oscillator pad, the 40-bit counter will
have a maximum count of 4,294,967,296 seconds, which equates to just over 136 years of elapsed
timekeeping with a minimum period of 1/256 of a second, which will be the toggle rate of the LSB
of the 40-bit counter.
Frequencies other than 32.768 kHz can be used as a clock source with the appropriate scaling of
the LSB time interval. The maximum input clock frequency is 20 MHz (the crystal oscillator limit).
The RTC signals are included in the Analog Block macro. The signal functions and descriptions are
listed in Table 2-15.
A Fusion use model includes the RTC controlling the power-up state of the FPGA core via the 1.5 V
regulator. To support this model, the crystal oscillator must be running and configured when the
FPGA is powered off. Hence, when the RTC is enabled in the system design, it will configure the
crystal oscillator via the RTCXTLMODE[1:0] and RTCXTLSEL pins.
A 7-bit prescaler block is used to divide the source clock (from the external crystal) by 128. This
prescaled 50%-duty-cycle clock signal is then used by the counter logic as its reference clock. Given
Pr e li m i n a ry v1 . 7
2 - 35
Device Architecture
an external crystal frequency of 32.768 kHz, the prescaler output clock will toggle at a rate of
32.768 kHz / 128 = 256 Hz.
The RTC is built from and controlled by a set of registers, denoted "Main Registers" in Figure 2-27
on page 2-34. These registers are accessed via the ACM.
The FPGA fabric portion of the Fusion device must be powered up and active at least once to write
to the various registers within the RTC to initialize them for the user’s application. Users set up the
RTC by configuring it from the Actel SmartGen tool, implementing custom logic or programming a
soft microcontroller.
The 40-bit counter and match registers are each divided into five bytes. Each byte is directly
addressable by the ACM. The address map of registers accessed through the ACM and used by the
RTC is shown in Table 2-16 on page 2-36.
Table 2-15 • RTC Macro Signal Description
Signal Name
Number of Bits
Direction
Function
RTCMATCH
1
Out
Match between 40-bit counter and match register
RTCPSMMATCH
1
Out
RTCMATCH connected to voltage regulator power
supply monitor (VRPSM) (Figure 2-30 on page 2-40)
RTCXTLMODE[1:0]
2
Out
Drives XTLOSC RTCMODE[1:0] pins
RTCXTLSEL
1
Out
Drives XTLOSC SELMODE pin
RTCCLK
1
In
RTC clock input from XTLOSC CLKOUT pin
Table 2-16 • RTC ACM Memory Map
ACM_ADDR[7:0] Decimal Register Name
Description
Use
0x40
64
COUNTER0
Counter bits 7:0
Used to preload the counter to a
specified start point. Default setting
is all zeroes.
0x41
65
COUNTER1
Counter bits 15:8
0x42
66
COUNTER2
Counter bits 23:16
0x43
67
COUNTER3
Counter bits 31:24
0x44
68
COUNTER4
Counter bits 39:32
0x48
72
MATCHREG0
Match register bits 7:0
0x49
73
MATCHREG1
Match register bits 15:8
0x4A
74
MATCHREG2
Match register bits 23:16
0x4B
75
MATCHREG3
Match register bits 31:24
0x4C
76
MATCHREG4
Match register bits 39:32
0x50
80
MATCHBITS0
Individual match bits 7:0
0x51
81
MATCHBITS1
0x52
82
MATCHBITS2
0x53
83
MATCHBITS3
Each bit of the 40-bit counter is
compared
to each bit of the 40-bit
Individual match bits 15:8
match register via XNOR gates. These
Individual match bits 23:16 40 match bits are partitioned into 5
Individual match bits 31:24 bytes.
0x54
84
MATCHBITS4
Individual match bits 39:32
0x58
88
CTRL_STAT
Control (write) / Status Control (write) / Status (read) register
(read) register bits 7:0
bits 7:0
0x59
89
TEST_REG
Test register(s)
The RTC uses a 40-bit register to
compare against the 40-bit counter
value to determine when a match
occurs. This 40-bit match register, like
the counter, is broken into 5 bytes
(MATCHREG0–4).
Test register(s)
Note: Accessing RTC Registers: When reading the RTC count or match register, which operates in the XTLCLK
domain, the appropriate 40-bit value is first copied to a capture register through clock synchronization
circuitry, if and only if the least significant byte of that set of register is addressed. Higher-order bytes of
the same set of registers captured with the LSB can then be read on immediately later read cycles. Higherorder bytes of that set of registers can be read in any order but must be read before switching to a
different set of registers to ensure data consistency. For example, RTC counter address ranges from 0x40
to 0x44, register 0x40 must be accessed first before accessing addresses 0x41, 0x42, 0x43, and 0x44 to get
the full 40-bit value.
2 -3 6
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
The Control/Status register (CTRL_STAT) is an 8-bit register that defines the operation of the RTC.
The Control register can reset the RTC, enabling operation to begin with all zeroes in the counter.
The RTC can be configured to clear upon a match with the Match register, or it can continue to
count while still setting the match signal. To enable the Fusion device to power up at a specific time
or at periodic intervals, the RTC can be configured to turn on the 1.5 V voltage regulator.
Table 2-17 details the CTRL_STAT settings.
Table 2-17 • RTC Control/Status Register
Bit
Name
Description
7
rtc_rst
RTC Reset: Writing a logic 1 to this bit causes an RTC reset.2 Writing a logic 0 to this bit will
allow synchronous deassertion of reset after two ACM_CLK cycles if VCC33UP = 1.3
6
cntr_en
Counter Enable: A logic 1 in this bit will enable the counter if the RTC is not in reset.
It takes 64 RTCCLK positive edges (one-half of the prescaler division factor), after reset is
removed and cntr_en = 1, before the counter is incremented.4
A logic 0 in this bit resets the prescaler and therefore suspends incrementing the counter,
but the counter is not reset.
Before writing to the counter registers, the counter must be disabled.
5
vr_en_mat
Voltage Regulator Enable on Match: Writing a logic 1 to this bit will allow the RTCMATCH
output port to go to logic 1 when a match occurs between the 40-bit counter and the 40bit match register.
Logic 0 forces RTCMATCH to logic 0 to prevent enabling the voltage regulator from the
RTC.
4:3
xt_mode[1:0 Crystal Oscillator Mode: These bits control the RTCXTLMODE[1:0] output ports that are
]
connected to the RTCMODE[1:0] input pins of the crystal oscillator pad. For 32 kHz crystal
operation, this should be set to '01'.
2
rst_cnt_omat Reset Counter on Match: A logic 1 written to this bit allows the counter to clear itself when
a match occurs. In this situation, the 40-bit counter clears on the next rising edge of the
prescaled clock, approximately 4 ms after the match occurs (the prescaled clock toggles at a
rate of 256 Hz, given a 32.768 kHz external crystal).
(See the "Crystal Oscillator" section on page 2-22.)
A logic 0 written to this bit allows the counter to increment indefinitely while still allowing
match events to occur.
1
rstb_cnt
Counter Reset: A logic 0 resets the 40-bit counter value to zero. A logic 1 allows the
counter to count.4
0
xtal_en
Crystal Oscillator Enable: This bit controls the RTCXTLSEL output port connected to the
SELMODE input pin of the crystal oscillator. If a logic 0 is written to this bit, only the FPGA
fabric can be used to control the crystal oscillator EN and MODE[1:0] inputs.
xtal_en = 1: RTC takes control of crystal oscillator. For example, the RTC Mode bits
configure the crystal oscillator (not the FPGA mode bits).
To enable sleep mode, set xtal_en = ‘0’, so the crystal is controlled from the FPGA EN signal.
Then when the FPGA is powered down, the signal from the fpga_en will be 0. It disables
the crystal oscillator.
Notes:
1. Default state (set when VCC33UP = 0) for bits 0–7 is logic 0.
2. Reset of all RTC states (except this Control/Status register) occurs asynchronously if VCC33UP = 0 or
CTRL_STAT bit 7 (rtc_rst) is set to 1.
3. Reset is removed synchronously after two rising edges of ACM_CLK, following both VCC33UP = 1 and rtc_rst = 0.
4. Counter will first increment on the 64th rising edge of RTCCLK after all of the following are true:
a. reset is removed
b. rstb_cnt (CTRL_STAT bit 1) is set to 1
c. cntr_en (CTRL_STAT bit 6) is set to 1
and will then increment every 128 RTCCLK cycles.
Pr e li m i n a ry v1 . 7
2 - 37
Device Architecture
Crystal Oscillator (Xtal Osc)
When used as the clock source for the RTC, the crystal oscillator will be configured by the RTC with
the RTCXTLMODE[1:0] RTC macro pins. Refer to the "Crystal Oscillator" section on page 2-22 for
specific details on crystal oscillator operation.
The crystal oscillator input to the RTC is divided by 128, so bit 0 of the RTC toggles at the frequency
of the crystal oscillator divided by 128. The frequencies of the RTC are gated by those of the crystal
oscillator, from 32.768 kHz to 20 MHz. When used with a 32.768 kHz crystal, bit 0 of the of RTC has
a period of ~7.8 ms, and bit 7 has a period of 1 second.
Voltage Regulator (VR) Initialization (Init)
The VR Init block determines voltage regulator behavior when the 3.3 V supply is valid. The Fusion
devices support different use models. Some of these require the 1.5 V voltage regulator to turn on
when the 3.3 V supply is stable. Other use models require additional conditions to be met before
the 1.5 V VR turns on. Since the FPGA is not operating when the 3.3 V supply is off, the VR Init
block lets the user define VR behavior at design time. Two bits can be set within the core, which
bits the VR Init block will read as it comes out of reset and either turn on the VR or leave it in an off
state.
Voltage Regulator Logic
The VR Logic block, along with the VR, combines commands from the FPGA, RTC, VR Init block,
VCC33UP detector, and PUB pad to determine whether or not the VR is enabled.
The VR can be enabled from several sources: the PUB pin, the RTC_MATCH signal from the RTC
block, or triggered by the VR Init block. Once triggered, the VR will remain on. Only the FPGA
fabric can disable the VR, unless the VCC33A supply falls below the VCC33UP threshold and a reset
occurs.
2 -3 8
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Actel Fusion Mixed-Signal FPGAs
1.5 V Voltage Regulator
The VR generates a 1.5 V power supply from the 3.3 V power supply. The 1.5 V output is intended
to supply all 1.5 V needs of the Fusion device. This regulator requires an external bipolar pass
transistor (Figure 2-29). The VR can drive up to 20 mA of current through the PTBASE pad. The
amount of 1.5 V current available is dependent upon the gain of the external pass transistor used.
Enable for this block is generated in the VR Logic block or from the PUB pin.
The VR is forced "on" with TRST high or floating (internal pull-up), so an external pull-down is
required on TRST if the customer desires to power-down the VR.
The 1.5 V is not supplied internally to the Fusion device. It must be routed externally to the VCC pins
on the device. Therefore the user is not required to use the VR and can use an off-chip 1.5 V supply
if desired.
On-Chip
Off-Chip
VCC33A
RTC FPGA
VCC33A
PTBASE
1.5 V
Regulator
PTEM
1.5 V Out
PDVR
VCC33A
1 µA
PUB
Power-Up/Down Control Circuit
Figure 2-29 • Voltage Regulator
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2 - 39
Device Architecture
Voltage Regulator Power Supply Monitor (VRPSM)
As the functions of the VR Logic and Power System Monitor work closely together to control the
power-up state of the FPGA core, these functions were combined into a single VRPSM macro
(Figure 2-30).
The signals for the VRPSM macro are listed in Table 2-18. The PUB input comes from the PUB pin on
the device and can be pulled LOW by a signal external to the Fusion device. This can be used to
wake up the device. The inputs VRINITSTATE and RTCPSMMTACH come from the VR Init and RTC
blocks, respectively, and either can initiate a VR power-up. The detailed description is available in
the Fusion Handbook.
PUB
FPGAGOOD
VRPU
PUCORE
VRINITSTATE
RTCPSMMATCH
Figure 2-30 • VRPSM Macro
Table 2-18 • Signals for VRPSM Macro
Signal Name
PUB
Number of
Bits
Direction
Function
1
Input
Active low signal to power up the FPGA core via
the 1.5 V regulator.
In this reference design, PUB is on the top level,
connected to an external switch.
2 -4 0
VRPU
1
Input
When this pin is at logic 1, the FPGA core will be
turned off via the voltage regulator.
VRINITSTATE
1
Input
This feature is not used in this reference design and
is not shown in the macro generated by SmartGen.
If used, the signal enables you to set your voltage
regulator output at power-up (ON or OFF).
RTCPSMMATCH
1
Input
This feature is not used in this reference design. If
used, this active high signal is driven by the RTC’s
match signal to indicate that the RTC counter value
matches the pre-defined Match register value set in
SmartGen.
FPGAGOOD
1
Output
Logic 1 indicates that FPGA is logically functional.
PUCORE
1
Output
Logic 1 indicates that FPGA is logically functional.
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
Embedded Memories
Fusion devices include four types of embedded memory: flash block, FlashROM, SRAM, and FIFO.
Flash Memory Block
Fusion is the first FPGA that offers a flash memory block (FB). Each FB block stores 2 Mbits of data.
The flash memory block macro is illustrated in Figure 2-31. The port pin name and descriptions are
detailed on Table 2-19 on page 2-42. All flash memory block signals are active high, except for CLK
and active low RESET. All flash memory operations are synchronous to the rising edge of CLK.
ADDR[17:0]
RD[31:0]
BUSY
WD[31:0]
DATAWIDTH[1:0]
STATUS[1:0]
REN
READNEXT
PAGESTATUS
WEN
ERASEPAGE
PROGRAM
SPAREPAGE
AUXBLOCK
UNPROTECTPAGE
OVERWRITEPAGE
DISCARDPAGE
OVERWRITEPROTECT
PAGELOSSPROTECT
PIPE
LOCKREQUEST
CLK
RESET
Figure 2-31 • Flash Memory Block
Pr e li m i n a ry v1 . 7
2 - 41
Device Architecture
Flash Memory Block Pin Names
Table 2-19 • Flash Memory Block Pin Names
Interface Name
Width Direction
Description
ADDR[17:0]
18
In
Byte offset into the FB. Byte-based address.
AUXBLOCK
1
In
When asserted, the page addressed is used to access the auxiliary block
within that page.
BUSY
1
Out
CLK
1
In
User interface clock. All operations and status are synchronous to the
rising edge of this clock.
DATAWIDTH[1:0]
2
In
Data width
When asserted, indicates that the FB is performing an operation.
00 = 1 byte in RD/WD[7:0]
01 = 2 bytes in RD/WD[15:0]
1x = 4 bytes in RD/WD[31:0]
DISCARDPAGE
1
In
When asserted, the contents of the Page Buffer are discarded so that a
new page write can be started.
ERASEPAGE
1
In
When asserted, the contents of the Page Buffer are discarded so that a
new page write can be started.
LOCKREQUEST
1
In
When asserted, indicates to the JTAG controller that the FPGA
interface is accessing the FB.
OVERWRITEPAGE
1
In
When asserted, the page addressed is overwritten with the contents of
the Page Buffer if the page is writable.
OVERWRITEPROTE
CT
1
In
When asserted, all program operations will set the overwrite protect
bit of the page being programmed.
PAGESTATUS
1
In
When asserted with REN, initiates a read page status operation.
PAGELOSSPROTECT
1
In
When asserted, a modified Page Buffer must be programmed or
discarded before accessing a new page.
PIPE
1
In
Adds a pipeline stage to the output for operation above 50 MHz.
PROGRAM
1
In
When asserted, writes the contents of the Page Buffer into the FB page
addressed.
RD[31:0]
32
Out
Read data; data will be valid from the first non-busy cycle (BUSY = 0)
after REN has been asserted.
READNEXT
1
In
When asserted with REN, initiates a read-next operation.
REN
1
In
When asserted, initiates a read operation.
RESET
1
In
When asserted, resets the state of the FB (active low).
SPAREPAGE
1
In
When asserted, the sector addressed is used to access the spare page
within that sector.
2 -4 2
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
Table 2-19 • Flash Memory Block Pin Names (continued)
Interface Name
STATUS[1:0]
Width Direction
2
Out
Description
Status of the last operation completed:
00: Successful completion
01: Read-/Unprotect-Page: single error detected and corrected
Write: operation addressed a write-protected page
Erase-Page: protection violation
Program: Page Buffer is unmodified
Protection violation
10: Read-/Unprotect-Page: two or more errors detected
11: Write: attempt to write to another page before programming
current page
Erase-Page/Program: page write count has exceeded the 10-year
retention threshold
UNPROTECTPAGE
1
In
When asserted, the page addressed is copied into the Page Buffer and
the Page Buffer is made writable.
WD[31:0]
32
In
Write data
WEN
1
In
When asserted, stores WD in the page buffer.
All flash memory block input signals are active high, except for RESET.
Pr e li m i n a ry v1 . 7
2 - 43
Device Architecture
Flash Memory Block Diagram
A simplified diagram of the flash memory block is shown in Figure 2-32.
Output
MUX
RD[31:0]
ECC
Logic
Page Buffer = 8 Blocks
Plus AUX Block
Flash Array = 64 Sectors
Block Buffer
(128 bits)
WD[31 :0]
ADDDR[17:0]
DATAWIDTH[1:0]
REN
READNEXT
PAGESTATUS
WEN
ERASEPAGE
PROGRAM
SPAREPAGE
Control
Logic
AUXBLOCK
UNPROTECTPAGE
OVERWRITEPAGE
DISCARDPAGE
OVERWRITEPROTECT
PAGELOSSPROTECT
PIPE
LOCKREQUEST
CLK
RESET
STATUS[1:0]
BUSY
Figure 2-32 • Flash Memory Block Diagram
The logic consists of the following sub-blocks:
•
Flash Array
Contains all stored data. The flash array contains 64 sectors, and each sector contains 33
pages of data.
•
Page Buffer
A page-wide volatile register. A page contains 8 blocks of data and an AUX block.
•
Block Buffer
Contains the contents of the last block accessed. A block contains 128 data bits.
•
ECC Logic
The FB stores error correction information with each block to perform single-bit error
correction and double-bit error detection on all data blocks.
2 -4 4
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
Flash Memory Block Addressing
Figure 2-33 shows a graphical representation of the flash memory block.
Spare Page
Page 31
P
33
es
ag
..
..
n
or
ct
e
S
Page 3
Page 2
Page 1
....
....
Page 0
1
or
ct
e
S
0
or
ct
Se
1190
1
2
3
4
5
6
7
Aux
Block
140
Block
0
Notes:
1 block = 128 bits
1 page = 8 blocks plus the AUX block
1 sector = 33 pages
1 Flash array = 64 sectors
User Data
(32 bits)
Byte 15
Byte 14
Byte 3
Byte 2
Byte 1
Byte 0
Block Organization
Figure 2-33 • Flash Memory Block Organization
Each FB is partitioned into sectors, pages, blocks, and bytes. There are 64 sectors in an FB, and each
sector contains 32 pages and 1 spare page. Each page contains 8 data blocks and 1 auxiliary block.
Each data block contains 16 bytes of user data, and the auxiliary block contains 4 bytes of user
data.
Addressing for the FB is shown in Table 2-20.
Table 2-20 • FB Address Bit Allocation ADDR[17:0]
17
12
Sector
11
7
6
Page
4
3
Block
0
Byte
When the spare page of a sector is addressed (SPAREPAGE active), ADDR[11:7] are ignored.
When the Auxiliary block is addressed (AUXBLOCK active), ADDR[6:2] are ignored.
Note: The spare page of sector 0 is unavailable for any user data. Writes to this page will return an
error, and reads will return all zeroes.
Pr e li m i n a ry v1 . 7
2 - 45
Device Architecture
Data operations are performed in widths of 1 to 4 bytes. A write to a location in a page that is not
already in the Page Buffer will cause the page to be read from the FB Array and stored in the Page
Buffer. The block that was addressed during the write will be put into the Block Buffer, and the
data written by WD will overwrite the data in the Block Buffer. After the data is written to the
Block Buffer, the Block Buffer is then written to the Page Buffer to keep both buffers in sync.
Subsequent writes to the same block will overwrite the Block Buffer and the Page Buffer. A write to
another block in the page will cause the addressed block to be loaded from the Page Buffer, and
the write will be performed as described previously.
The data width can be selected dynamically via the DATAWIDTH input bus. The truth table for the
data width settings is detailed in Table 2-21. The minimum resolvable address is one 8-bit byte. For
data widths greater than 8 bits, the corresponding address bits are ignored—when
DATAWIDTH = 0 (2 bytes), ADDR[0] is ignored, and when DATAWIDTH = '10' or '11' (4 bytes),
ADDR[1:0] are ignored. Data pins are LSB-oriented and unused WD data pins must be grounded.
Table 2-21 • Data Width Settings
DATAWIDTH[1:0]
Data Width
00
1 byte [7:0]
01
2 byte [15:0]
10, 11
4 bytes [31:0]
Flash Memory Block Protection
Page Loss Protection
When the PAGELOSSPROTECT pin is set to logic 1, it prevents writes to any page other than the
current page in the Page Buffer until the page is either discarded or programmed.
A write to another page while the current page is Page Loss Protected will return a STATUS of '11'.
Overwrite Protection
Any page that is Overwrite Protected will result in the STATUS being set to '01' when an attempt is
made to either write, program, or erase it. To set the Overwrite Protection state for a page, set the
OVERWRITEPROTECT pin when a Program operation is undertaken. To clear the Overwrite Protect
state for a given page, an Unprotect Page operation must be performed on the page, and then the
page must be programmed with the OVERWRITEPROTECT pin cleared to save the new page.
LOCKREQUEST
The LOCKREQUEST signal is used to give the user interface control over simultaneous access of the
FB from both the User and JTAG interfaces. When LOCKREQUEST is asserted, the JTAG interface will
hold off any access attempts until LOCKREQUEST is deasserted.
Flash Memory Block Operations
FB Operation Priority
The FB provides for priority of operations when multiple actions are requested simultaneously.
Table 2-22 shows the priority order (priority 0 is the highest).
Table 2-22 • FB Operation Priority
Operation
2 -4 6
Priority
System Initialization
0
FB Reset
1
Read
2
Write
3
Erase Page
4
Program
5
Unprotect Page
6
Discard Page
7
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
Access to the FB is controlled by the BUSY signal. The BUSY output is synchronous to the CLK signal.
FB operations are only accepted in cycles where BUSY is logic 0.
Write Operation
Write operations are initiated with the assertion of the WEN signal. Figure 2-34 on page 2-47
illustrates the multiple Write operations.
CLK
WEN
ADDR[17:0]
A0
A1
A2
A3
A4
A5
A6
WD[31:0]
D0
D1
D2
D3
D4
D5
D6
DATAWIDTH[1:0]
PAGELOSSPROTECT
BUSY
STATUS[1:0]
S0
S1
S2
S3
S4
S5
S6
Figure 2-34 • FB Write Waveform
When a Write operation is initiated to a page that is currently not in the Page Buffer, the FB control
logic will issue a BUSY signal to the user interface while the page is loaded from the FB Array into
the Page Buffer. (Note: The number of clock cycles that the BUSY output is asserted during the load
of the Page Buffer is variable.) After loading the page into the Page Buffer, the addressed data
block is loaded from the Page Buffer into the Block Buffer. Subsequent writes to the same block of
the page will incur no busy cycles. A write to another block in the page will assert BUSY for four
cycles (five cycles when PIPE is asserted), to allow the data to be written to the Page Buffer and
have the current block loaded into the Block Buffer.
Write operations are considered successful as long as the STATUS output is '00'. A non-zero STATUS
indicates that an error was detected during the operation and the write was not performed. Note
that the STATUS output is "sticky"; it is unchanged until another operation is started.
Only one word can be written at a time. Write word width is controlled by the DATAWIDTH bus.
Users are responsible for keeping track of the contents of the Page Buffer and when to program it
to the array. Just like a regular RAM, writing to random addresses is possible. Users can write into
the Page Buffer in any order but will incur additional BUSY cycles. It is not necessary to modify the
entire Page Buffer before saving it to nonvolatile memory.
Write errors include the following:
1. Attempting to write a page that is Overwrite Protected (STATUS = '01'). The write is not
performed.
2. Attempting to write to a page that is not in the Page Buffer when Page Loss Protection is
enabled (STATUS = '11'). The write is not performed.
Program Operation
A Program operation is initiated by asserting the PROGRAM signal on the interface. Program
operations save the contents of the Page Buffer to the FB Array. Due to the technologies inherent
in the FB, a program operation is a time consuming operation (~8 ms). While the FB is writing the
data to the array, the BUSY signal will be asserted.
Pr e li m i n a ry v1 . 7
2 - 47
Device Architecture
During a Program operation, the sector and page addresses on ADDR are compared with the
stored address for the page (and sector) in the Page Buffer. If there is a mismatch between the two
addresses, the Program operation will be aborted and an error will be reported on the STATUS
output.
It is possible to write the Page Buffer to a different page in memory. When asserting the PROGRAM
pin, if OVERWRITEPAGE is asserted as well, the FB will write the contents of the Page Buffer to the
sector and page designated on the ADDR inputs if the destination page is not Overwrite Protected.
A Program operation can be utilized to either modify the contents of the page in the flash memory
block or change the protections for the page. Setting the OVERWRITEPROTECT bit on the interface
while asserting the PROGRAM pin will put the page addressed into Overwrite Protect Mode.
Overwrite Protect Mode safeguards a page from being inadvertently overwritten during
subsequent Program or Erase operations.
Program operations that result in a STATUS value of '01' do not modify the addressed page. For all
other values of STATUS, the addressed page is modified.
Program errors include the following:
1. Attempting to program a page that is Overwrite Protected (STATUS = '01')
2. Attempting to program a page that is not in the Page Buffer when the Page Buffer has
entered Page Loss Protection Mode (STATUS = '01')
3. Attempting to perform a program with OVERWRITEPAGE set when the page addressed has
been Overwrite Protected (STATUS = '01')
4. The Write Count of the page programmed exceeding the Write Threshold defined in the
part specification (STATUS = '11')
5. The ECC Logic determining that there is an uncorrectable error within the programmed
page (STATUS = '10')
6. Attempting to program a page that is not in the Page Buffer when OVERWRITEPAGE is not
set and the page in the Page Buffer is modified (STATUS = '01')
7. Attempting to program the page in the Page Buffer when the Page Buffer is not modified
The waveform for a Program operation is shown in Figure 2-35.
CLK
PROGRAM
Page
ADDR[17:0]
OVERWRITEPAGE
OVERWRITEPROTECT
PAGELOSSPROTECT
BUSY
STATUS[1:0]
0
Valid
Figure 2-35 • FB Program Waveform
Note: OVERWRITEPAGE is only sampled when the PROGRAM or ERASEPAGE pins are asserted.
OVERWRITEPAGE is ignored in all other operations.
2 -4 8
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
Erase Page Operation
The Erase Page operation is initiated when the ERASEPAGE pin is asserted. The Erase Page
operation allows the user to erase (set user data to zero) any page within the FB.
The use of the OVERWRITEPAGE and PAGELOSSPROTECT pins is the same for erase as for a Program
Page operation.
As with the Program Page operation, a STATUS of '01' indicates that the addressed page is not
erased.
A waveform for an Erase Page operation is shown in Figure 2-36.
Erase errors include the following:
1. Attempting to erase a page that is Overwrite Protected (STATUS = '01')
2. Attempting to erase a page that is not in the Page Buffer when the Page Buffer has entered
Page Loss Protection mode (STATUS = '01')
3. The Write Count of the erased page exceeding the Write Threshold defined in the part
specification (STATUS = '11')
4. The ECC Logic determining that there is an uncorrectable error within the erased page
(STATUS = '10')
CLK
ERASE
ADDR[17:0]
Page
OVERWRITEPROTECT
PAGELOSSPROTECT
BUSY
STATUS[1:0]
Valid
Figure 2-36 • FB Erase Page Waveform
Pr e li m i n a ry v1 . 7
2 - 49
Device Architecture
Read Operation
Read operations are designed to read data from the FB Array, Page Buffer, Block Buffer, or status
registers. Read operations support a normal read and a read-ahead mode (done by asserting
READNEXT). Also, the timing for Read operations is dependent on the setting of PIPE.
The following diagrams illustrate representative timing for Non-Pipe Mode (Figure 2-37) and Pipe
Mode (Figure 2-38) reads of the flash memory block interface.
CLK
REN
ADDR[17:0]
A0
A1
A2
A3
A4
DATAWIDTH[1:0]
BUSY
STATUS[1:0]
0
S0
S1
S2
S3
0
RD[31:0]
0
D0
D1
D2
D3
0
S4
D4
0
Figure 2-37 • Read Waveform (Non-Pipe Mode, 32-bit access)
CLK
REN
ADDR[17:0]
A0
A1
A2
A3
A4
DATAWIDTH[1:0]
BUSY
STATUS[1:0]
0
S0
S1
S2
S3
0
RD[31:0]
0
D0
D1
D2
D3
0
Figure 2-38 • Read Waveform (Pipe Mode, 32-bit access)
2 -5 0
Pr e li m i n a ry v1 . 7
S4
X
D4
0
Actel Fusion Mixed-Signal FPGAs
The following error indications are possible for Read operations:
1. STATUS = '01' when a single-bit data error was detected and corrected within the block
addressed.
2. STATUS = '10' when a double-bit error was detected in the block addressed (note that the
error is uncorrected).
In addition to data reads, users can read the status of any page in the FB by asserting PAGESTATUS
along with REN. The format of the data returned by a page status read is shown in Table 2-23, and
the definition of the page status bits is shown in Table 2-24.
Table 2-23 • Page Status Read Data Format
31
8
7
4
3
2
1
0
Write Count Reserved Over Threshold Read Protected Write Protected Overwrite Protected
Table 2-24 • Page Status Bit Definition
Page Status Bit(s)
Definition
31–8
The number of times the page addressed has been programmed/erased
7–4
Reserved; read as 0
3
Over Threshold indicator (see the"Program Operation" section on page 2-47)
2
Read Protected; read protect bit for page, which is set via the JTAG interface
and only affects JTAG operations. This bit can be overridden by using the
correct user key value.
1
Write Protected; write protect bit for page, which is set via the JTAG interface
and only affects JTAG operations. This bit can be overridden by using the
correct user key value.
0
Overwrite Protected; designates that the user has set the OVERWRITEPROTECT
bit on the interface while doing a Program operation. The page cannot be
written without first performing an Unprotect Page operation.
Pr e li m i n a ry v1 . 7
2 - 51
Device Architecture
Read Next Operation
The Read Next operation is a feature by which the next block relative to the block in the Block
Buffer is read from the FB Array while performing reads from the Block Buffer. The goal is to
minimize wait states during consecutive sequential Read operations.
The Read Next operation is performed in a predetermined manner because it does look-ahead
reads. The general look-ahead function is as follows:
•
Within a page, the next block fetched will be the next in linear address.
•
When reading the last data block of a page, it will fetch the first block of the next page.
•
When reading spare pages, it will read the first block of the next sector's spare page.
•
Reads of the last sector will wrap around to sector 0.
•
Reads of Auxiliary blocks will read the next linear page's Auxiliary block.
When an address on the ADDR input does not agree with the predetermined look-ahead address,
there is a time penalty for this access. The FB will be busy finishing the current look-ahead read
before it can start the next read. The worst case is a total of nine BUSY cycles before data is
delivered.
The Non-Pipe Mode and Pipe Mode waveforms for Read Next operations are illustrated in
Figure 2-39 and Figure 2-40.
CLK
REN
READNEXT
ADDR[17:0]
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
DATAWIDTH[1:0]
BUSY
STATUS[1:0]
0
S0
S1
S2
S3
0
S4
S5
S6
S7
0
S8
S9
RD[31:0]
0
D0
D1
D2
D3
0
D4
D5
D6
D7
0
D8
D9
A6
A7
Figure 2-39 • Read Next Waveform (Non-Pipe Mode, 32-bit access)
CLK
REN
READNEXT
A0
ADDR[17:0]
A1
A2
A3
A4
A5
A8
BUSY
STATUS[1:0]
RD[31:0]
0
S0
S1
S2
S3
0
S4
S5
S6
S7
0
D0
D1
D2
D3
0
D4
D5
D6
D7
0
Figure 2-40 • Read Next WaveForm (Pipe Mode, 32-bit access)
2 -5 2
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
Unprotect Page Operation
An Unprotect Page operation will clear the protection for a page addressed on the ADDR input. It
is initiated by setting the UNPROTECTPAGE signal on the interface along with the page address on
ADDR.
If the page is not in the Page Buffer, the Unprotect Page operation will copy the page into the Page
Buffer. The Copy Page operation occurs only if the current page in the Page Buffer is not Page Loss
Protected.
The waveform for an Unprotect Page operation is shown in Figure 2-41.
CLK
UNPROTECTPAGE
ADDR[17:0]
Page
BUSY
STATUS[1:0]
Valid
Figure 2-41 • FB Unprotected Page Waveform
The Unprotect Page operation can incur the following error conditions:
1. If the copy of the page to the Page Buffer determines that the page has a single-bit
correctable error in the data, it will report a STATUS = '01'.
2. If the address on ADDR does not match the address of the Page Buffer, PAGELOSSPROTECT is
asserted, and the Page Buffer has been modified, then STATUS = '11' and the addressed
page is not loaded into the Page Buffer.
3. If the copy of the page to the Page Buffer determines that at least one block in the page has
a double-bit uncorrectable error, STATUS = '10' and the Page Buffer will contain the
corrupted data.
Discard Page Operation
If the contents of the modified Page Buffer have to be discarded, the DISCARDPAGE signal should
be asserted. This command results in the Page Buffer being marked as unmodified.
The timing for the operation is shown in Figure 2-42. The BUSY signal will remain asserted until the
operation has completed.
CLK
DISCARDPAGE
BUSY
Figure 2-42 • FB Discard Page Waveform
Pr e li m i n a ry v1 . 7
2 - 53
Device Architecture
Flash Memory Block Characteristics
CLK
RESET
Active Low, Asynchronous
BUSY
Figure 2-43 • Reset Timing Diagram
Table 2-25 • Flash Memory Block Timing
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V
Parameter
–2
–1
Std.
Units
Clock-to-Q in 5-cycle read mode of the Read Data
7.99
9.10
10.70
ns
Clock-to-Q in 6-cycle read mode of the Read Data
5.03
5.73
6.74
ns
Clock-to-Q in 5-cycle read mode of BUSY
4.95
5.63
6.62
ns
Clock-to-Q in 6-cycle read mode of BUSY
4.45
5.07
5.96
ns
Clock-to-Status in 5-cycle read mode
11.24
12.81
15.06
ns
Clock-to-Status in 6-cycle read mode
4.48
5.10
6.00
ns
tDSUNVM
Data Input Setup time for the Control Logic
1.92
2.19
2.57
ns
tDHNVM
Data Input Hold time for the Control Logic
0.00
0.00
0.00
ns
tASUNVM
Address Input Setup time for the Control Logic
2.76
3.14
3.69
ns
tAHNVM
Address Input Hold time for the Control Logic
0.00
0.00
0.00
ns
tSUDWNVM
Data Width Setup time for the Control Logic
1.85
2.11
2.48
ns
tHDDWNVM
Data Width Hold time for the Control Logic
0.00
0.00
0.00
ns
tSURENNVM
Read Enable Setup time for the Control Logic
3.85
4.39
5.16
ns
tHDRENNVM
Read Enable Hold Time for the Control Logic
0.00
0.00
0.00
ns
tSUWENNVM
Write Enable Setup time for the Control Logic
2.37
2.69
3.17
ns
tHDWENNVM
Write Enable Hold Time for the Control Logic
0.00
0.00
0.00
ns
tSUPROGNVM
Program Setup time for the Control Logic
2.16
2.46
2.89
ns
tHDPROGNVM
Program Hold time for the Control Logic
0.00
0.00
0.00
ns
tSUSPAREPAGE
SparePage Setup time for the Control Logic
3.74
4.26
5.01
ns
tHDSPAREPAGE
SparePage Hold time for the Control Logic
0.00
0.00
0.00
ns
tSUAUXBLK
Auxiliary Block Setup Time for the Control Logic
3.74
4.26
5.00
ns
tHDAUXBLK
Auxiliary Block Hold Time for the Control Logic
0.00
0.00
0.00
ns
tSURDNEXT
ReadNext Setup Time for the Control Logic
2.17
2.47
2.90
ns
tHDRDNEXT
ReadNext Hold Time for the Control Logic
0.00
0.00
0.00
ns
tSUERASEPG
Erase Page Setup Time for the Control Logic
3.76
4.28
5.03
ns
tHDERASEPG
Erase Page Hold Time for the Control Logic
0.00
0.00
0.00
ns
tSUUNPROTECTPG
Unprotect Page Setup Time for the Control Logic
2.01
2.29
2.69
ns
tHDUNPROTECTPG
Unprotect Page Hold Time for the Control Logic
0.00
0.00
0.00
ns
tCLK2RD
tCLK2BUSY
tCLK2STATUS
2 -5 4
Description
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
Table 2-25 • Flash Memory Block Timing (continued)
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V
Parameter
Description
–2
–1
Std.
Units
tSUDISCARDPG
Discard Page Setup Time for the Control Logic
1.88
2.14
2.52
ns
tHDDISCARDPG
Discard Page Hold Time for the Control Logic
0.00
0.00
0.00
ns
tSUOVERWRPRO
Overwrite Protect Setup Time for the Control Logic
1.64
1.86
2.19
ns
tHDOVERWRPRO
Overwrite Protect Hold Time for the Control Logic
0.00
0.00
0.00
ns
tSUPGLOSSPRO
Page Loss Protect Setup Time for the Control Logic
1.69
1.93
2.27
ns
tHDPGLOSSPRO
Page Loss Protect Hold Time for the Control Logic
0.00
0.00
0.00
ns
tSUPGSTAT
Page Status Setup Time for the Control Logic
2.49
2.83
3.33
ns
tHDPGSTAT
Page Status Hold Time for the Control Logic
0.00
0.00
0.00
ns
tSUOVERWRPG
Over Write Page Setup Time for the Control Logic
1.88
2.14
2.52
ns
tHDOVERWRPG
Over Write Page Hold Time for the Control Logic
0.00
0.00
0.00
ns
tSULOCKREQUEST
Lock Request Setup Time for the Control Logic
0.87
0.99
1.16
ns
tHDLOCKREQUEST
Lock Request Hold Time for the Control Logic
0.00
0.00
0.00
ns
tRECARNVM
Reset Recovery Time
0.94
1.07
1.25
ns
tREMARNVM
Reset Removal Time
0.00
0.00
0.00
ns
tMPWARNVM
Asynchronous Reset Minimum Pulse Width for the
Control Logic
10.00
12.50
12.50
ns
tMPWCLKNVM
Clock Minimum Pulse Width for the Control Logic
4.00
5.00
5.00
ns
tFMAXCLKNVM
Maximum Frequency for Clock for the Control Logic
100.00
80.00
80.00
MHz
Pr e li m i n a ry v1 . 7
2 - 55
Device Architecture
FlashROM
Fusion devices have 1 kbit of on-chip nonvolatile flash memory that can be read from the FPGA
core fabric. The FlashROM is arranged in eight banks of 128 bits during programming. The 128 bits
in each bank are addressable as 16 bytes during the read-back of the FlashROM from the FPGA core
(Figure 2-44).
The FlashROM can only be programmed via the IEEE 1532 JTAG port. It cannot be programmed
directly from the FPGA core. When programming, each of the eight 128-bit banks can be selectively
reprogrammed. The FlashROM can only be reprogrammed on a bank boundary. Programming
involves an automatic, on-chip bank erase prior to reprogramming the bank. The FlashROM
supports a synchronous read and can be read on byte boundaries. The upper three bits of the
FlashROM address from the FPGA core define the bank that is being accessed. The lower four bits
of the FlashROM address from the FPGA core define which of the 16 bytes in the bank is being
accessed.
The maximum FlashROM access clock is 20 MHz. Figure 2-45 shows the timing behavior of the
FlashROM access cycle—the address has to be set up on the rising edge of the clock for DOUT to be
valid on the next falling edge of the clock.
If the address is unchanged for two cycles:
•
D0 becomes invalid 10 ns after the second rising edge of the clock.
•
D0 becomes valid again 10 ns after the second falling edge.
If the address unchanged for three cycles:
•
D0 becomes invalid 10 ns after the second rising edge of the clock.
•
D0 becomes valid again 10 ns after the second falling edge.
•
D0 becomes invalid 10 ns after the third rising edge of the clock.
•
D0 becomes valid again 10 ns after the third falling edge.
Byte Number in Bank
15 14 13
12
11 10
4 LSB of ADDR (READ)
9
Bank Number
3 MSB of ADDR (READ)
7
6
5
4
3
2
1
0
Figure 2-44 • FlashROM Architecture
2 -5 6
Pr e li m i n a ry v1 . 7
8
7
6
5
4
3
2
1
0
Actel Fusion Mixed-Signal FPGAs
FlashROM Characteristics
Address
tSU
tSU
tSU
tHOLD
tHOLD
tHOLD
A1
A0
tCK2Q
tCK2Q
tCK2Q
D0
D0
D1
Figure 2-45 • FlashROM Timing Diagram
Table 2-26 • FlashROM Access Time
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V
Parameter
Description
–2
–1
Std.
Units
tSU
Address Setup Time
0.53
0.61
0.71
ns
tHOLD
Address Hold Time
0.00
0.00
0.00
ns
tCK2Q
Clock to Out
21.42
24.40
28.68
ns
FMAX
Maximum Clock frequency
15.00
15.00
15.00
MHz
Pr e li m i n a ry v1 . 7
2 - 57
Device Architecture
SRAM and FIFO
All Fusion devices have SRAM blocks along the north side of the device. Additionally, AFS600 and
AFS1500 devices have an SRAM block on the south side of the device. To meet the needs of highperformance designs, the memory blocks operate strictly in synchronous mode for both read and
write operations. The read and write clocks are completely independent, and each may operate at
any desired frequency less than or equal to 350 MHz. The following configurations are available:
•
4k×1, 2k×2, 1k×4, 512×9 (dual-port RAM—two read, two write or one read, one write)
•
512×9, 256×18 (two-port RAM—one read and one write)
•
Sync write, sync pipelined/nonpipelined read
The Fusion SRAM memory block includes dedicated FIFO control logic to generate internal
addresses and external flag logic (FULL, EMPTY, AFULL, AEMPTY).
During RAM operation, addresses are sourced by the user logic, and the FIFO controller is ignored.
In FIFO mode, the internal addresses are generated by the FIFO controller and routed to the RAM
array by internal MUXes. Refer to Figure 2-46 for more information about the implementation of
the embedded FIFO controller.
The Fusion architecture enables the read and write sizes of RAMs to be organized independently,
allowing for bus conversion. This is done with the WW (write width) and RW (read width) pins. The
different D×W configurations are 256×18, 512×9, 1k×4, 2k×2, and 4k×1. For example, the write size
can be set to 256×18 and the read size to 512×9.
Both the write and read widths for the RAM blocks can be specified independently with the WW
(write width) and RW (read width) pins. The different D×W configurations are 256×18, 512×9,
1k×4, 2k×2, and 4k×1.
Refer to the allowable RW and WW values supported for each of the RAM macro types in
Table 2-27 on page 2-61.
When a width of one, two, or four is selected, the ninth bit is unused. For example, when writing 9bit values and reading 4-bit values, only the first four bits and the second four bits of each 9-bit
value are addressable for read operations. The ninth bit is not accessible.
2 -5 8
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
Conversely, when writing 4-bit values and reading 9-bit values, the ninth bit of a read operation
will be undefined. The RAM blocks employ little-endian byte order for read and write operations.
RD[17:0]
RD
WD[17:0]
WD
RCLK
RCLK
WCLK
WCLK
RAM
RADD[J:0]
RBLK
REN
REN
WEN
FWEN
RW[2:0]
WW[2:0]
FREN
RPIPE
WADD[J:0]
CNT 12
E
=
ESTOP
FULL
AFVAL
AFULL
WBLK
WEN
CNT 12
SUB 12
AEVAL
AEMPTY
E
=
FSTOP
EMPTY
Reset
Figure 2-46 • Fusion RAM Block with Embedded FIFO Controller
Pr e li m i n a ry v1 . 7
2 - 59
Device Architecture
RAM4K9 Description
RAM4K9
ADDRA11 DOUTA8
ADDRA10 DOUTA7
ADDRA0
DINA8
DINA7
DOUTA0
DINA0
WIDTHA1
WIDTHA0
PIPEA
WMODEA
BLKA
WENA
CLKA
ADDRB11
ADDRB10
DOUTB8
DOUTB7
ADDRB0
DOUTB0
DINB8
DINB7
DINB0
WIDTHB1
WIDTHB0
PIPEB
WMODEB
BLKB
WENB
CLKB
RESET
Figure 2-47 • RAM4K9
2 -6 0
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
The following signals are used to configure the RAM4K9 memory element:
WIDTHA and WIDTHB
These signals enable the RAM to be configured in one of four allowable aspect ratios (Table 2-27).
Table 2-27 • Allowable Aspect Ratio Settings for WIDTHA[1:0]
WIDTHA1, WIDTHA0
WIDTHB1, WIDTHB0
D×W
00
00
4k×1
01
01
2k×2
10
10
1k×4
11
11
512×9
Note: The aspect ratio settings are constant and cannot be changed on the fly.
BLKA and BLKB
These signals are active low and will enable the respective ports when asserted. When a BLKx signal
is deasserted, the corresponding port’s outputs hold the previous value.
WENA and WENB
These signals switch the RAM between read and write mode for the respective ports. A LOW on
these signals indicates a write operation, and a HIGH indicates a read.
CLKA and CLKB
These are the clock signals for the synchronous read and write operations. These can be driven
independently or with the same driver.
PIPEA and PIPEB
These signals are used to specify pipelined read on the output. A LOW on PIPEA or PIPEB indicates
a nonpipelined read, and the data appears on the corresponding output in the same clock cycle. A
HIGH indicates a pipelined, read and data appears on the corresponding output in the next clock
cycle.
WMODEA and WMODEB
These signals are used to configure the behavior of the output when the RAM is in write mode. A
LOW on these signals makes the output retain data from the previous read. A HIGH indicates passthrough behavior, wherein the data being written will appear immediately on the output. This
signal is overridden when the RAM is being read.
RESET
This active low signal resets the output to zero, disables reads and writes from the SRAM block, and
clears the data hold registers when asserted. It does not reset the contents of the memory.
ADDRA and ADDRB
These are used as read or write addresses, and they are 12 bits wide. When a depth of less than 4 k
is specified, the unused high-order bits must be grounded (Table 2-28).
Table 2-28 • Address Pins Unused/Used for Various Supported Bus Widths
ADDRx
D×W
Unused
Used
4k×1
None
[11:0]
2k×2
[11]
[10:0]
1k×4
[11:10]
[9:0]
512×9
[11:9]
[8:0]
Note: The "x" in ADDRx implies A or B.
Pr e li m i n a ry v1 . 7
2 - 61
Device Architecture
DINA and DINB
These are the input data signals, and they are nine bits wide. Not all nine bits are valid in all
configurations. When a data width less than nine is specified, unused high-order signals must be
grounded (Table 2-29).
DOUTA and DOUTB
These are the nine-bit output data signals. Not all nine bits are valid in all configurations. As with
DINA and DINB, high-order bits may not be used (Table 2-29). The output data on unused pins is
undefined.
Table 2-29 • Unused/Used Input and Output Data Pins for Various Supported Bus Widths
DINx/DOUTx
D×W
Unused
Used
4k×1
[8:1]
[0]
2k×2
[8:2]
[1:0]
1k×4
[8:4]
[3:0]
512×9
None
[8:0]
Note: The "x" in DINx and DOUTx implies A or B.
2 -6 2
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
RAM512X18 Description
RAM512X18
RADDR8
RADDR7
RD17
RD16
RADDR0
RD0
RW1
RW0
PIPE
REN
RCLK
WADDR8
WADDR7
WADDR0
WD17
WD16
WD0
WW1
WW0
WEN
WCLK
RESET
Figure 2-48 • RAM512X18
Pr e li m i n a ry v1 . 7
2 - 63
Device Architecture
RAM512X18 exhibits slightly different behavior from RAM4K9, as it has dedicated read and write
ports.
WW and RW
These signals enable the RAM to be configured in one of the two allowable aspect ratios
(Table 2-30).
Table 2-30 • Aspect Ratio Settings for WW[1:0]
WW[1:0]
RW[1:0]
D×W
01
01
512×9
10
10
256×18
00, 11
Reserved
00, 11
WD and RD
These are the input and output data signals, and they are 18 bits wide. When a 512×9 aspect ratio
is used for write, WD[17:9] are unused and must be grounded. If this aspect ratio is used for read,
then RD[17:9] are undefined.
WADDR and RADDR
These are read and write addresses, and they are nine bits wide. When the 256×18 aspect ratio is
used for write or read, WADDR[8] or RADDR[8] are unused and must be grounded.
WCLK and RCLK
These signals are the write and read clocks, respectively. They are both active high.
WEN and REN
These signals are the write and read enables, respectively. They are both active low by default.
These signals can be configured as active high.
RESET
This active low signal resets the output to zero, disables reads and/or writes from the SRAM block,
and clears the data hold registers when asserted. It does not reset the contents of the memory.
PIPE
This signal is used to specify pipelined read on the output. A LOW on PIPE indicates a nonpipelined
read, and the data appears on the output in the same clock cycle. A HIGH indicates a pipelined
read, and data appears on the output in the next clock cycle.
Clocking
The dual-port SRAM blocks are only clocked on the rising edge. SmartGen allows falling-edgetriggered clocks by adding inverters to the netlist, hence achieving dual-port SRAM blocks that are
clocked on either edge (rising or falling). For dual-port SRAM, each port can be clocked on either
edge or by separate clocks, by port.
Fusion devices support inversion (bubble pushing) throughout the FPGA architecture, including the
clock input to the SRAM modules. Inversions added to the SRAM clock pin on the design schematic
or in the HDL code will be automatically accounted for during design compile without incurring
additional delay in the clock path.
The two-port SRAM can be clocked on the rising edge or falling edge of WCLK and RCLK.
If negative-edge RAM and FIFO clocking is selected for memory macros, clock edge inversion
management (bubble pushing) is automatically used within the Fusion development tools,
without performance penalty.
2 -6 4
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
Modes of Operation
There are two read modes and one write mode:
•
Read Nonpipelined (synchronous—1 clock edge): In the standard read mode, new data is
driven onto the RD bus in the same clock cycle following RA and REN valid. The read address
is registered on the read port clock active edge, and data appears at RD after the RAM
access time. Setting PIPE to OFF enables this mode.
•
Read Pipelined (synchronous—2 clock edges): The pipelined mode incurs an additional clock
delay from the address to the data but enables operation at a much higher frequency. The
read address is registered on the read port active clock edge, and the read data is registered
and appears at RD after the second read clock edge. Setting PIPE to ON enables this mode.
•
Write (synchronous—1 clock edge): On the write clock active edge, the write data is written
into the SRAM at the write address when WEN is HIGH. The setup times of the write address,
write enables, and write data are minimal with respect to the write clock. Write and read
transfers are described with timing requirements in the "SRAM Characteristics" section on
page 2-66 and the "FIFO Characteristics" section on page 2-77.
RAM Initialization
Each SRAM block can be individually initialized on power-up by means of the JTAG port using the
UJTAG mechanism (refer to the "JTAG IEEE 1532" section on page 2-224 and the Fusion SRAM/FIFO
Blocks application note). The shift register for a target block can be selected and loaded with the
proper bit configuration to enable serial loading. The 4,608 bits of data can be loaded in a single
operation.
Pr e li m i n a ry v1 . 7
2 - 65
Device Architecture
SRAM Characteristics
Timing Waveforms
tCYC
tCKH
tCKL
CLK
tAS
tAH
A0
ADD
A1
A2
tBKS
tBKH
BLK_B
tENS
tENH
WEN_B
tCKQ1
DO
Dn
D0
D1
D2
tDOH1
Figure 2-49 • RAM Read for Flow-Through Output
tCYC
tCKH
tCKL
CLK
tAS
tAH
A0
ADD
A1
A2
tBKS
tBKH
BLK_B
tENS
tENH
WEN_B
tCKQ2
DO
Dn
D0
D1
tDOH2
Figure 2-50 • RAM Read for Pipelined Output
2 -6 6
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
tCYC
tCKH
tCKL
CLK
tAS
tAH
A0
ADD
A1
A2
tBKS
tBKH
BLK_B
tENS
tENH
WEN_B
tDS
DI0
DI
tDH
DI1
Dn
DO
D2
Figure 2-51 • RAM Write, Output Retained (WMODE = 0)
tCYC
tCKH
tCKL
CLK
tAS
tAH
A0
ADD
A1
A2
tBKS
tBKH
BLK_B
tENS
WEN_B
tDS
DO
(flow-through)
DO
(Pipelined)
DI1
D0
DI
tDH
DI2
DI0
Dn
Dn
DI1
DI0
DI1
Figure 2-52 • RAM Write, Output as Write Data (WMODE = 1)
Pr e li m i n a ry v1 . 7
2 - 67
Device Architecture
CLK1
tAS
tAH
A0
ADD1
tDS
A3
D2
D3
tDH
D0
DI1
A2
tWRO
CLK2
tAS
A0
ADD2
tAH
A1
A4
tCKQ1
DO2
(flow-through)
Dn
D0
D1
tCKQ2
DO2
(Pipelined)
Dn
D0
Figure 2-53 • One Port Write / Other Port Read Same
CLK1
tAS
A0
ADD1
tDS
DI1
tAH
A1
A3
D2
D3
tDH
D1
tCCKH
CLK2
WEN_B1
WEN_B2
tAS
ADD2
A0
DI2
D0
tAH
A4
A0
D4
tCKQ1
DO2
(pass-through)
D0
Dn
tCKQ2
DO2
(pipelined)
Dn
Figure 2-54 • Write Access After Write onto Same Address
2 -6 8
Pr e li m i n a ry v1 . 7
D0
Actel Fusion Mixed-Signal FPGAs
CLK1
tAS
tAH
A0
ADD1
tDS
DI1
A2
A3
D2
D3
tDH
D0
tWRO
CLK2
WEN_B1
WEN_B2
tAS
A4
A1
A0
ADD2
tAH
tCKQ1
DO2
(pass-through)
Dn
D1
D0
tCKQ2
DO2
(pipelined)
Dn
D0
Figure 2-55 • Read Access After Write onto Same Address
Pr e li m i n a ry v1 . 7
2 - 69
Device Architecture
CLK1
tAS
A0
ADD1
WEN_B1
DO1
(pass-through)
tAH
A0
A1
tCKQ1
tCKQ1
Dn
D1
D0
tCKQ2
DO1
(pipelined)
D0
Dn
tCCKH
CLK2
tAS
tAH
ADD2
A0
A1
A3
DI2
D1
D2
D3
WEN_B2
Figure 2-56 • Write Access After Read onto Same Address
tCYC
tCKH
tCKL
CLK
RESET_B
tRSTBQ
DO
Dm
Dn
Figure 2-57 • RAM Reset
2 -7 0
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
Timing Characteristics
Table 2-31 • RAM4K9
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V
Parameter
Description
–2
–1
Std.
Units
tAS
Address Setup time
0.25
0.28
0.33
ns
tAH
Address Hold time
0.00
0.00
0.00
ns
tENS
REN_B,WEN_B Setup time
0.14
0.16
0.19
ns
tENH
REN_B, WEN_B Hold time
0.10
0.11
0.13
ns
tBKS
BLK_B Setup time
0.23
0.27
0.31
ns
tBKH
BLK_B Hold time
0.02
0.02
0.02
ns
tDS
Input data (DI) Setup time
0.18
0.21
0.25
ns
tDH
Input data (DI) Hold time
0.00
0.00
0.00
ns
tCKQ1
Clock High to New Data Valid on DO (output retained, WMODE = 0)
1.79
2.03
2.39
ns
Clock High to New Data Valid on DO (flow-through, WMODE = 1)
2.36
2.68
3.15
ns
tCKQ2
Clock High to New Data Valid on DO (pipelined)
0.89
1.02
1.20
ns
tWRO
Address collision clk-to-clk delay for reliable read access after write
on same address
TBD
TBD
TBD
ns
tCCKH
Address collision clk-to-clk delay for reliable write access after
write/read on same address
TBD
TBD
TBD
ns
tRSTBQ
RESET_B Low to Data Out Low on DO (flow-through)
0.92
1.05
1.23
ns
RESET_B Low to Data Out Low on DO (pipelined)
0.92
1.05
1.23
ns
tREMRSTB
RESET_B Removal
0.29
0.33
0.38
ns
tRECRSTB
RESET_B Recovery
1.50
1.71
2.01
ns
tMPWRSTB
RESET_B Minimum Pulse Width
0.21
0.24
0.29
ns
tCYC
Clock Cycle time
3.23
3.68
4.32
ns
FMAX
Maximum Clock Frequency
310
272
231
MHz
Note: For the derating values at specific junction temperature and voltage-supply levels, refer to Table 3-7 on
page 3-9.
Pr e li m i n a ry v1 . 7
2 - 71
Device Architecture
Table 2-32 • RAM512X18
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V
Parameter
Description
–2
–1
Std.
Units
tAS
Address Setup time
0.25
0.28
0.33
ns
tAH
Address Hold time
0.00
0.00
0.00
ns
tENS
REN_B,WEN_B Setup time
0.09
0.10
0.12
ns
tENH
REN_B, WEN_B Hold time
0.06
0.07
0.08
ns
tDS
Input data (DI) Setup time
0.18
0.21
0.25
ns
tDH
Input data (DI) Hold time
0.00
0.00
0.00
ns
tCKQ1
Clock High to New Data Valid on DO (output retained, WMODE = 0)
2.16
2.46
2.89
ns
tCKQ2
Clock High to New Data Valid on DO (pipelined)
0.90
1.02
1.20
ns
tWRO
Address collision clk-to-clk delay for reliable read access after write
on same address
TBD
TBD
TBD
ns
tCCKH
Address collision clk-to-clk delay for reliable write access after
write/read on same address
TBD
TBD
TBD
ns
tRSTBQ
RESET_B Low to Data Out Low on DO (flow-through)
0.92
1.05
1.23
ns
RESET_B Low to Data Out Low on DO (pipelined)
0.92
1.05
1.23
ns
tREMRSTB
RESET_B Removal
0.29
0.33
0.38
ns
tRECRSTB
RESET_B Recovery
1.50
1.71
2.01
ns
tMPWRSTB
RESET_B Minimum Pulse Width
0.21
0.24
0.29
ns
tCYC
Clock Cycle time
3.23
3.68
4.32
ns
FMAX
Maximum Clock Frequency
310
272
231
MHz
Note: For the derating values at specific junction temperature and voltage-supply levels, refer to Table 3-7 on
page 3-9.
2 -7 2
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
FIFO4K18 Description
FIFO4K18
RD17
RD16
RW2
RW1
RW0
WW2
WW1
WW0
ESTOP
FSTOP
RD0
FULL
AFULL
EMPTY
AEMPTY
AEVAL11
AEVAL10
AEVAL0
AFVAL11
AFVAL10
AFVAL0
REN
RBLK
RCLK
WD17
WD16
WD0
WEN
WBLK
WCLK
RPIPE
RESET
Figure 2-58 • FIFO4KX18
Pr e li m i n a ry v1 . 7
2 - 73
Device Architecture
The following signals are used to configure the FIFO4K18 memory element:
WW and RW
These signals enable the FIFO to be configured in one of the five allowable aspect ratios
(Table 2-33).
Table 2-33 • Aspect Ratio Settings for WW[2:0]
RW2, RW1, RW0
D×W
000
000
4k×1
001
001
2k×2
010
010
1k×4
011
011
512×9
100
100
256×18
101, 110, 111
Reserved
WW2, WW1, WW0
101, 110, 111
WBLK and RBLK
These signals are active low and will enable the respective ports when LOW. When the RBLK signal
is HIGH, the corresponding port’s outputs hold the previous value.
WEN and REN
Read and write enables. WEN is active low and REN is active high by default. These signals can be
configured as active high or low.
WCLK and RCLK
These are the clock signals for the synchronous read and write operations. These can be driven
independently or with the same driver.
RPIPE
This signal is used to specify pipelined read on the output. A LOW on RPIPE indicates a
nonpipelined read, and the data appears on the output in the same clock cycle. A HIGH indicates a
pipelined read, and data appears on the output in the next clock cycle.
RESET
This active low signal resets the output to zero when asserted. It resets the FIFO counters. It also
sets all the RD pins LOW, the FULL and AFULL pins LOW, and the EMPTY and AEMPTY pins HIGH
(Table 2-34).
Table 2-34 • Input Data Signal Usage for Different Aspect Ratios
D×W
WD/RD Unused
4k×1
WD[17:1], RD[17:1]
2k×2
WD[17:2], RD[17:2]
1k×4
WD[17:4], RD[17:4]
512×9
WD[17:9], RD[17:9]
256×18
–
WD
This is the input data bus and is 18 bits wide. Not all 18 bits are valid in all configurations. When a
data width less than 18 is specified, unused higher-order signals must be grounded (Table 2-34).
RD
This is the output data bus and is 18 bits wide. Not all 18 bits are valid in all configurations. Like the
WD bus, high-order bits become unusable if the data width is less than 18. The output data on
unused pins is undefined (Table 2-34).
2 -7 4
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
ESTOP, FSTOP
ESTOP is used to stop the FIFO read counter from further counting once the FIFO is empty (i.e., the
EMPTY flag goes HIGH). A HIGH on this signal inhibits the counting.
FSTOP is used to stop the FIFO write counter from further counting once the FIFO is full (i.e., the
FULL flag goes HIGH). A HIGH on this signal inhibits the counting.
For more information on these signals, refer to the "ESTOP and FSTOP Usage" section on
page 2-76.
FULL, EMPTY
When the FIFO is full and no more data can be written, the FULL flag asserts HIGH. The FULL flag is
synchronous to WCLK to inhibit writing immediately upon detection of a full condition and to
prevent overflows. Since the write address is compared to a resynchronized (and thus timedelayed) version of the read address, the FULL flag will remain asserted until two WCLK active
edges after a read operation eliminates the full condition.
When the FIFO is empty and no more data can be read, the EMPTY flag asserts HIGH. The EMPTY
flag is synchronous to RCLK to inhibit reading immediately upon detection of an empty condition
and to prevent underflows. Since the read address is compared to a resynchronized (and thus timedelayed) version of the write address, the EMPTY flag will remain asserted until two RCLK active
edges after a write operation removes the empty condition.
For more information on these signals, refer to the "FIFO Flag Usage Considerations" section on
page 2-76.
AFULL, AEMPTY
These are programmable flags and will be asserted on the threshold specified by AFVAL and
AEVAL, respectively.
When the number of words stored in the FIFO reaches the amount specified by AEVAL while
reading, the AEMPTY output will go HIGH. Likewise, when the number of words stored in the FIFO
reaches the amount specified by AFVAL while writing, the AFULL output will go HIGH.
Pr e li m i n a ry v1 . 7
2 - 75
Device Architecture
AFVAL, AEVAL
The AEVAL and AFVAL pins are used to specify the almost-empty and almost-full threshold
values, respectively. They are 12-bit signals. For more information on these signals, refer to
"FIFO Flag Usage Considerations" section.
ESTOP and FSTOP Usage
The ESTOP pin is used to stop the read counter from counting any further once the FIFO is empty
(i.e., the EMPTY flag goes HIGH). Likewise, the FSTOP pin is used to stop the write counter from
counting any further once the FIFO is full (i.e., the FULL flag goes HIGH).
The FIFO counters in the Fusion device start the count at 0, reach the maximum depth for the
configuration (e.g., 511 for a 512×9 configuration), and then restart at 0. An example application
for the ESTOP, where the read counter keeps counting, would be writing to the FIFO once and
reading the same content over and over without doing another write.
FIFO Flag Usage Considerations
The AEVAL and AFVAL pins are used to specify the 12-bit AEMPTY and AFULL threshold values,
respectively. The FIFO contains separate 12-bit write address (WADDR) and read address (RADDR)
counters. WADDR is incremented every time a write operation is performed, and RADDR is
incremented every time a read operation is performed. Whenever the difference between WADDR
and RADDR is greater than or equal to AFVAL, the AFULL output is asserted. Likewise, whenever
the difference between WADDR and RADDR is less than or equal to AEVAL, the AEMPTY output is
asserted. To handle different read and write aspect ratios, AFVAL and AEVAL are expressed in terms
of total data bits instead of total data words. When users specify AFVAL and AEVAL in terms of
read or write words, the SmartGen tool translates them into bit addresses and configures these
signals automatically. SmartGen configures the AFULL flag to assert when the write address
exceeds the read address by at least a predefined value. In a 2k×8 FIFO, for example, a value of
1,500 for AFVAL means that the AFULL flag will be asserted after a write when the difference
between the write address and the read address reaches 1,500 (there have been at least 1500 more
writes than reads). It will stay asserted until the difference between the write and read addresses
drops below 1,500.
The AEMPTY flag is asserted when the difference between the write address and the read address
is less than a predefined value. In the example above, a value of 200 for AEVAL means that the
AEMPTY flag will be asserted when a read causes the difference between the write address and the
read address to drop to 200. It will stay asserted until that difference rises above 200. Note that the
FIFO can be configured with different read and write widths; in this case, the AFVAL setting is
based on the number of write data entries and the AEVAL setting is based on the number of read
data entries. For aspect ratios of 512×9 and 256×18, only 4,096 bits can be addressed by the 12 bits
of AFVAL and AEVAL. The number of words must be multiplied by 8 and 16, instead of 9 and 18.
The SmartGen tool automatically uses the proper values. To avoid halfwords being written or read,
which could happen if different read and write aspect ratios are specified, the FIFO will assert FULL
or EMPTY as soon as at least a minimum of one word cannot be written or read. For example, if a
two-bit word is written and a four-bit word is being read, the FIFO will remain in the empty state
when the first word is written. This occurs even if the FIFO is not completely empty, because in this
case, a complete word cannot be read. The same is applicable in the full state. If a four-bit word is
written and a two-bit word is read, the FIFO is full and one word is read. The FULL flag will remain
asserted because a complete word cannot be written at this point.
2 -7 6
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
FIFO Characteristics
Timing Waveforms
RCLK/
WCLK
tMPWRSTB
tRSTCK
RESET_B
tRSTFG
EF
tRSTAF
AEF
tRSTFG
FF
tRSTAF
AFF
WA/RA
(Address Counter)
MATCH (A0)
Figure 2-59 • FIFO Reset
tCYC
RCLK
tRCKEF
EF
tCKAF
AEF
WA/RA
(Address Counter)
NO MATCH
NO MATCH
Dist = AEF_TH
MATCH (EMPTY)
Figure 2-60 • FIFO EMPTY Flag and AEMPTY Flag Assertion
Pr e li m i n a ry v1 . 7
2 - 77
Device Architecture
tCYC
WCLK
t WCKFF
FF
t CKAF
AFF
WA/RA NO MATCH
(Address Counter)
NO MATCH
Dist = AFF_TH
MATCH (FULL)
Figure 2-61 • FIFO FULL and AFULL Flag Assertion
WCLK
WA/RA
(Address Counter)
RCLK
MATCH
(EMPTY)
NO MATCH
1st rising
edge
after 1st
write
NO MATCH
NO MATCH
NO MATCH
Dist = AEF_TH + 1
2nd rising
edge
after 1st
write
tRCKEF
EF
tCKAF
AEF
Figure 2-62 • FIFO EMPTY Flag and AEMPTY Flag Deassertion
RCLK
WA/RA
(Address Counter) MATCH (FULL)
NO MATCH
1st Rising
Edge
After 1st
Read
WCLK
NO MATCH
NO MATCH
NO MATCH
Dist = AFF_TH - 1
1st Rising
Edge
After 2nd
Read
tWCKF
FF
tCKAF
AFF
Figure 2-63 • FIFO FULL Flag and AFULL Flag Deassertion
2 -7 8
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
Timing Characteristics
Table 2-35 • FIFO
Worst Commercial-Case Conditions: TJ = 70°C, VCC = 1.425 V
Parameter
Description
–2
–1
Std.
Units
tENS
REN_B, WEN_B Setup time
1.34
1.52
1.79
ns
tENH
REN_B, WEN_B Hold time
0.00
0.00
0.00
ns
tBKS
BLK_B Setup time
0.19
0.22
0.26
ns
tBKH
BLK_B Hold time
0.00
0.00
0.00
ns
tDS
Input data (DI) Setup time
0.18
0.21
0.25
ns
tDH
Input data (DI) Hold time
0.00
0.00
0.00
ns
tCKQ1
Clock High to New Data Valid on DO (flow-through)
2.17
2.47
2.90
ns
tCKQ2
Clock High to New Data Valid on DO (pipelined)
0.94
1.07
1.26
ns
tRCKEF
RCLK High to Empty Flag Valid
1.72
1.96
2.30
ns
tWCKFF
WCLK High to Full Flag Valid
1.63
1.86
2.18
ns
tCKAF
Clock High to Almost Empty/Full Flag Valid
6.19
7.05
8.29
ns
tRSTFG
RESET_B Low to Empty/Full Flag Valid
1.69
1.93
2.27
ns
tRSTAF
RESET_B Low to Almost-Empty/Full Flag Valid
6.13
6.98
8.20
ns
tRSTBQ
RESET_B Low to Data out Low on DO (flow-through)
0.92
1.05
1.23
ns
RESET_B Low to Data out Low on DO (pipelined)
0.92
1.05
1.23
ns
tREMRSTB
RESET_B Removal
0.29
0.33
0.38
ns
tRECRSTB
RESET_B Recovery
1.50
1.71
2.01
ns
tMPWRSTB
RESET_B Minimum Pulse Width
0.21
0.24
0.29
ns
tCYC
Clock Cycle time
3.23
3.68
4.32
ns
FMAX
Maximum Frequency for FIFO
310
272
231
ns
Note: For specific junction temperature and voltage-supply levels, refer to Table 3-7 on page 3-9 for derating
values.
Pr e li m i n a ry v1 . 7
2 - 79
Device Architecture
Analog Block
With the Fusion family, Actel has introduced the world's first mixed-mode FPGA solution.
Supporting a robust analog peripheral mix, Fusion devices will support a wide variety of
applications. It is this Analog Block that separates Fusion from all other FPGA solutions on the
market today.
By combining both flash and high-speed CMOS processes in a single chip, these devices offer the
best of both worlds. The high-performance CMOS is used for building RAM resources. These highperformance structures support device operation up to 350 MHz. Additionally, the advanced Actel
0.13 µm flash process incorporates high-voltage transistors and a high-isolation, triple-well process.
Both of these are suited for the flash-based programmable logic and nonvolatile memory
structures.
High-voltage transistors support the integration of analog technology in several ways. They aid in
noise immunity so that the analog portions of the chip can be better isolated from the digital
portions, increasing analog accuracy. Because they support high voltages, Actel flash FPGAs can be
connected directly to high-voltage input signals, eliminating the need for external resistor divider
networks, reducing component count, and increasing accuracy. By supporting higher internal
voltages, the Actel advanced flash process enables high dynamic range on analog circuitry,
increasing precision and signal–noise ratio. Actel flash FPGAs also drive high-voltage outputs,
eliminating the need for external level shifters and drivers.
The unique triple-well process enables the integration of high-performance analog features with
increased noise immunity and better isolation. By increasing the efficiency of analog design, the
triple-well process also enables a smaller overall design size, reducing die size and cost.
The Analog Block consists of the Analog Quad I/O structure, RTC (for details refer to the "Real-Time
Counter System" section on page 2-34), ADC, and ACM. All of these elements are combined in the
single Analog Block macro, with which the user implements this functionality (Figure 2-64).
The Analog Block needs to be reset/reinitialized after the core powers up or the device is
programmed. An external reset/initialize signal, which can come from the internal voltage
regulator when it powers up, must be applied.
2 -8 0
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
VAREF
GNDREF
AV0
AC0
AT0
DAVOUT0
DACOUT0
DATOUT0
DAVOUT9
DACOUT9
DATOUT9
AV9
AC9
AT9
ATRETURN01
AG0
AG1
ATRETURN9
DENAV0
DENAC0
DENAT0
AG9
DENAV0
DENAC0
DENAT0
CMSTB0
CSMTB9
GDON0
GDON9
TMSTB0
TMSTB9
MODE[3:0]
TVC[7:0]
STC[7:0]
CHNUMBER[4:0]
BUSY
CALIBRATE
DATAVALID
SAMPLE
TMSTINT
ADCSTART
VAREFSEL
PWRDWN
ADCRESET
RESULT[11:0]
RTCMATCH
RTCXTLMODE
RTCXTLSEL
RTCPSMMATCH
RTCCLK
SYSCLK
ACMWEN
ACMRESET
ACMWDATA
ACMADDR
ACMCLK
ACMRDATA[7:0]
AB
Figure 2-64 • Analog Block Macro
Pr e li m i n a ry v1 . 7
2 - 81
Device Architecture
Table 2-36 describes each pin in the Analog Block. Each function within the Analog Block will be
explained in detail in the following sections.
Table 2-36 • Analog Block Pin Description
Signal Name
Number
of Bits
Direction
Function
Input/Output Voltage reference for ADC
Location of
Details
VAREF
1
ADC
GNDREF
1
Input
External ground reference
ADC
MODE[3:0]
4
Input
ADC operating mode
ADC
SYSCLK
1
Input
External system clock
TVC[7:0]
8
Input
Clock divide control
ADC
STC[7:0]
8
Input
Sample time control
ADC
ADCSTART
1
Input
Start of conversion
ADC
PWRDWN
1
Input
Comparator power-down if 1
ADC
ADCRESET
1
Input
ADC resets and disables Analog
Quad – active high
ADC
BUSY
1
Output
1 – Running conversion
ADC
CALIBRATE
1
Output
1 – Power-up calibration
ADC
DATAVALID
1
Output
1 – Valid conversion result
ADC
RESULT[11:0]
12
Output
Conversion result
ADC
TMSTBINT
1
Input
Internal temp. monitor strobe
ADC
SAMPLE
1
Output
1 – An analog signal is actively being
sampled (stays high during signal
acquisition only)
ADC
0 – No analog signal is being
sampled
VAREFSEL
1
Input
0 = Output
internal
voltage
reference (2.56 V) to VAREF
ADC
1 = Input external voltage reference
from VAREF and GNDREF
CHNUMBER[4:0]
5
Input
Analog input channel select
ACMCLK
1
Input
ACM clock
ACM
ACMWEN
1
Input
ACM write enable – active high
ACM
ACMRESET
1
Input
ACM reset – active low
ACM
ACMWDATA[7:0]
8
Input
ACM write data
ACM
ACMRDATA[7:0]
8
Output
ACM read data
ACM
ACMADDR[7:0]
8
Input
ACM address
ACM
CMSTB0 to CMSTB9
10
Input
Current monitor strobe – 1 per quad, Analog Quad
active high
GDON0 to GDON9
10
Input
Control to power MOS – 1 per quad
TMSTB0 to TMSTB9
10
Input
Temperature monitor strobe – 1 per Analog Quad
quad; active high
2 -8 2
Pr e li m i n a ry v1 . 7
Input
multiplexer
Analog Quad
Actel Fusion Mixed-Signal FPGAs
Table 2-36 • Analog Block Pin Description (continued)
Number
of Bits
Direction
DAVOUT0, DACOUT0, DATOUT0
to
DAVOUT9, DACOUT9, DATOUT9
30
Output
DENAV0, DENAC0, DENAT0 to
DENAV9, DENAC9, DENAT9
30
AV0
Signal Name
Function
Location of
Details
Digital outputs – 3 per quad
Analog Quad
Input
Digital input enables – 3 per quad
Analog Quad
1
Input
Analog Quad 0
Analog Quad
AC0
1
Input
Analog Quad
AG0
1
Output
Analog Quad
AT0
1
Input
Analog Quad
ATRETURN01
1
Input
Temperature monitor return shared Analog Quad
by Analog Quads 0 and 1
AV1
1
Input
Analog Quad 1
AC1
1
Input
Analog Quad
AG1
1
Output
Analog Quad
AT1
1
Input
Analog Quad
AV2
1
Input
AC2
1
Input
Analog Quad
AG2
1
Output
Analog Quad
AT2
1
Input
Analog Quad
ATRETURN23
1
Input
Temperature monitor return shared Analog Quad
by Analog Quads 2 and 3
AV3
1
Input
Analog Quad 3
AC3
1
Input
Analog Quad
AG3
1
Output
Analog Quad
AT3
1
Input
Analog Quad
AV4
1
Input
AC4
1
Input
Analog Quad
AG4
1
Output
Analog Quad
AT4
1
Input
Analog Quad
ATRETURN45
1
Input
Temperature monitor return shared Analog Quad
by Analog Quads 4 and 5
AV5
1
Input
Analog Quad 5
AC5
1
Input
Analog Quad
AG5
1
Output
Analog Quad
AT5
1
Input
Analog Quad
AV6
1
Input
AC6
1
Input
Analog Quad
AG6
1
Output
Analog Quad
AT6
1
Input
Analog Quad
Analog Quad 2
Analog Quad 4
Analog Quad 6
Pr e li m i n a ry v1 . 7
Analog Quad
Analog Quad
Analog Quad
Analog Quad
Analog Quad
Analog Quad
2 - 83
Device Architecture
Table 2-36 • Analog Block Pin Description (continued)
Signal Name
Number
of Bits
Direction
ATRETURN67
1
Input
Temperature monitor return shared Analog Quad
by Analog Quads 6 and 7
AV7
1
Input
Analog Quad 7
AC7
1
Input
Analog Quad
AG7
1
Output
Analog Quad
AT7
1
Input
Analog Quad
AV8
1
Input
AC8
1
Input
Analog Quad
AG8
1
Output
Analog Quad
AT8
1
Input
Analog Quad
ATRETURN89
1
Input
Temperature monitor return shared
by Analog Quads 8 and 9
Analog Quad
AV9
1
Input
Analog Quad 9
Analog Quad
AC9
1
Input
Analog Quad
AG9
1
Output
Analog Quad
AT9
1
Input
Analog Quad
RTCMATCH
1
Output
MATCH
RTC
RTCPSMMATCH
1
Output
MATCH connected to VRPSM
RTC
RTCXTLMODE[1:0]
2
Output
Drives XTLOSC RTCMODE[1:0] pins
RTC
RTCXTLSEL
1
Output
Drives XTLOSC MODESEL pin
RTC
RTCCLK
1
Input
RTC clock input
RTC
Function
Analog Quad 8
Location of
Details
Analog Quad
Analog Quad
Analog Quad
With the Fusion family, Actel introduces the Analog Quad, shown in Figure 2-65 on page 2-85, as
the basic analog I/O structure. The Analog Quad is a four-channel system used to precondition a set
of analog signals before sending it to the ADC for conversion into a digital signal. To maximize the
usefulness of the Analog Quad, the analog input signals can also be configured as LVTTL digital
input signals. The Analog Quad is divided into four sections.
The first section is called the Voltage Monitor Block, and its input pin is named AV. It contains a
two-channel analog multiplexer that allows an incoming analog signal to be routed directly to the
ADC or allows the signal to be routed to a prescaler circuit before being sent to the ADC. The
prescaler can be configured to accept analog signals between –12 V and 0 or between 0 and +12 V.
The prescaler circuit scales the voltage applied to the ADC input pad such that it is compatible with
the ADC input voltage range. The AV pin can also be used as a digital input pin.
The second section of the Analog Quad is called the Current Monitor Block. Its input pin is named
AC. The Current Monitor Block contains all the same functions as the Voltage Monitor Block with
one addition, which is a current monitoring function. A small external current sensing resistor
(typically less than 1 Ω) is connected between the AV and AC pins and is in series with a power
source. The Current Monitor Block contains a current monitor circuit that converts the current
through the external resistor to a voltage that can then be read using the ADC.
The third part of the Analog Quad is called the Gate Driver Block, and its output pin is named AG.
This section is used to drive an external FET. There are two modes available: a High Current Drive
mode and a Current Source Control mode. Both negative and positive voltage polarities are
available, and in the current source control mode, four different current levels are available.
2 -8 4
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
The fourth section of the Analog Quad is called the Temperature Monitor Block, and its input pin
name is AT. This block is similar to the Voltage Monitor Block, except that it has an additional
function: it can be used to monitor the temperature of an external diode-connected transistor. It
has a modified prescaler and is limited to positive voltages only.
The Analog Quad can be configured during design time by Actel Libero IDE; however, the ACM can
be used to change the parameters of any of these I/Os during runtime. This type of change is
referred to as a context switch. The Analog Quad is a modular structure that is replicated to
generate the analog I/O resources. Each Fusion device supports between 5 and 10 Analog Quads.
The analog pads are numbered to clearly identify both the type of pad (voltage, current, gate
driver, or temperature pad) and its corresponding Analog Quad (AV0, AC0, AG0, AT0, AV1, …, AC9,
AG9, and AT9). There are three types of input pads (AVx, ACx, and ATx) and one type of analog
output pad (AGx). Since there can be up to 10 Analog Quads on a device, there can be a maximum
of 30 analog input pads and 10 analog output pads.
Off-Chip
AV
Pads
AC
Voltage
Monitor Block
AG
Current
Monitor Block
AT
Gate
Driver
Temperature
Monitor Block
On-Chip
Analog Quad
Prescaler
Prescaler
Prescaler
Power
MOSFET
Gate Driver
Digital
Input
Digital
Input
Current
Monitor/Instr
Amplifier
To FPGA
(DAVOUTx)
To Analog MUX
Digital
Input
Temperature
Monitor
To FPGA
(DACOUTx)
From FPGA
(GDONx)
To Analog MUX
To FPGA
(DATOUTx)
To Analog MUX
Figure 2-65 • Analog Quad
Pr e li m i n a ry v1 . 7
2 - 85
Device Architecture
Voltage Monitor
The Fusion Analog Quad offers a robust set of voltage-monitoring capabilities unique in the FPGA
industry. The Analog Quad comprises three analog input pads— Analog Voltage (AV), Analog
Current (AC), and Analog Temperature (AT)—and a single gate driver output pad, Analog Gate
(AG). There are many common characteristics among the analog input pads. Each analog input can
be configured to connect directly to the input MUX of the ADC. When configured in this manner
(Figure 2-66), there will be no prescaling of the input signal. Care must be taken in this mode not
to drive the ADC into saturation by applying an input voltage greater than the reference voltage.
The internal reference voltage of the ADC is 2.56 V. Optionally, an external reference can be
supplied by the user. The external reference can be a maximum of 3.3 V DC.
Off-Chip
AV
Pads
AC
Voltage
Monitor Block
AG
Current
Monitor Block
AT
Gate
Driver
Temperature
Monitor Block
On-Chip
Analog Quad
Prescaler
Prescaler
Digital
Input
Digital
Input
Prescaler
Power
MOSFET
Gate Driver
Current
Monitor / Instr
Amplifier
To FPGA
(DAVOUTx)
To Analog MUX
Temperature
Monitor
To FPGA
(DACOUTx)
From FPGA
(GDONx)
To Analog MUX
Figure 2-66 • Analog Quad Direct Connect
2 -8 6
Digital
Input
Pr e li m i n a ry v1 . 7
To FPGA
(DATOUTx)
To Analog MUX
Actel Fusion Mixed-Signal FPGAs
The Analog Quad offers a wide variety of prescaling options to enable the ADC to resolve the input
signals. Figure 2-67 shows the path through the Analog Quad for a signal that is to be prescaled
prior to conversion. The ADC internal reference voltage and the prescaler factors were selected to
make both prescaling and postscaling of the signals easy binary calculations (refer to Table 2-54 on
page 2-128 for details). When an analog input pad is configured with a prescaler, there will be a
1 MΩ resistor to ground. This occurs even when the device is in power-down mode. In low power
standby or sleep mode (VCC is OFF, VCC33A is ON, VCCI is ON) or when the resource is not used,
analog inputs are pulled down to ground through a 1 MΩ resistor. The gate driver output is
floating (or tristated), and there is no extra current on VCC33A.
These scaling factors hold true whether the particular pad is configured to accept a positive or
negative voltage. Note that whereas the AV and AC pads support the same prescaling factors, the
AT pad supports a reduced set of prescaling factors and supports positive voltages only.
Typical scaling factors are given in Table 2-54 on page 2-128, and the gain error (which contributes
to the minimum and maximum) is in Table 2-46 on page 2-115.
Off-Chip
AV
Pads
AC
Voltage
Monitor Block
AG
Current
Monitor Block
AT
Gate
Driver
Temperature
Monitor Block
On-Chip
Analog Quad
Prescaler
Prescaler
Prescaler
Power
MOSFET
Gate Driver
Digital
Input
Digital
Input
Current
Monitor / Instr
Amplifier
To FPGA
(DAVOUTx)
To Analog MUX
Digital
Input
Temperature
Monitor
To FPGA
(DACOUTx)
From FPGA
(GDONx)
To Analog MUX
To FPGA
(DATOUTx)
To Analog MUX
Figure 2-67 • Analog Quad Prescaler Input Configuration
Pr e li m i n a ry v1 . 7
2 - 87
Device Architecture
Terminology
BW – Bandwidth
BW is a range of frequencies that a Channel can handle.
Channel
A channel is define as an analog input configured as one of the Prescaler range shown in
Table 2-54 on page 2-128. The channel includes the Prescaler circuit and the ADC.
Channel Gain
Channel Gain is a measured of the deviation of the actual slope from the ideal slope. The slope is
measured from the 20% and 80% point.
Gain actual
Gain = ----------------------Gain ideal
EQ 2-1
Channel Gain Error
Channel Gain Error is a deviation from the ideal slope of the transfer function. The Prescaler Gain
Error is expressed as the percent difference between the actual and ideal, as shown in EQ 2-2.
Error Gain = (1-Gain) × 100%
EQ 2-2
Channel Input Offset Error
Channel Offset error is measured as the input voltage that causes the transition from zero to a
count of one. An Ideal Prescaler will have offset equal to ½ of LSB voltage. Offset error is a positive
or negative when the first transition point is higher or lower than ideal. Offset error is expressed in
LSB or input voltage.
Total Channel Error
Total Channel Error is defined as the total error measured compared to the ideal value. Total
Channel Error is the sum of gain error and offset error combined. Figure 2-68 shows how Total
Channel Error is measured.
ea
lO
ut
pu
t
ADC Output Code
Total Channel Error is defined as the difference between the actual ADC output and ideal ADC
output. In the example shown in Figure 2-68, the Total Channel Error would be a negative number.
C hannel G ain
Id
Actual Output
T otal C hannel Er r or
}
C hannel Input
O ffset Er r or
In p u t V o lta g e to P re sca le r
Figure 2-68 • Total Channel Error Example
2 -8 8
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
Direct Digital Input
The AV, AC, and AT pads can also be configured as high-voltage digital inputs (Figure 2-69). As
these pads are 12 V–tolerant, the digital input can also be up to 12 V. However, the frequency at
which these pads can operate is limited to 10 MHz.
To enable one of these analog input pads to operate as a digital input, its corresponding Digital
Input Enable (DENAxy) pin on the Analog Block must be pulled HIGH, where x is either V, C, or T
(for AV, AC, or AT pads, respectively) and y is in the range 0 to 9, corresponding to the appropriate
Analog Quad.
When the pad is configured as a digital input, the signal will come out of the Analog Block macro
on the appropriate DAxOUTy pin, where x represents the pad type (V for AV pad, C for AC pad, or
T for AT pad) and y represents the appropriate Analog Quad number. Example: If the AT pad in
Analog Quad 5 is configured as a digital input, it will come out on the DATOUT5 pin of the Analog
Block macro.
Off-Chip
AV
Pads
AC
Voltage
Monitor Block
AG
AT
Gate
Driver
Current
Monitor Block
Temperature
Monitor Block
On-Chip
Analog Quad
Prescaler
Prescaler
Prescaler
Power
MOSFET
Gate Driver
Digital
Input
Digital
Input
Current
Monitor / Instr
Amplifier
To FPGA
(DAVOUTx)
To Analog MUX
Digital
Input
Temperature
Monitor
To FPGA
(DACOUTx)
From FPGA
(GDONx)
To Analog MUX
To FPGA
(DATOUTx)
To Analog MUX
Figure 2-69 • Analog Quad Direct Digital Input Configuration
Pr e li m i n a ry v1 . 7
2 - 89
Device Architecture
Current Monitor
The Fusion Analog Quad is an excellent element for voltage- and current-monitoring applications.
In addition to supporting the same functionality offered by the AV pad, the AC pad can be
configured to monitor current across an external sense resistor (Figure 2-70). To support this
current monitor function, a differential amplifier with 10x gain passes the amplified voltage drop
between the AV and AC pads to the ADC. The amplifier enables the user to use very small resistor
values, thereby limiting any impact on the circuit. This function of the AC pad does not limit AV
pad operation. The AV pad can still be configured for use as a direct voltage input or scaled
through the AV prescaler independently of it’s use as an input to the AC pad’s differential
amplifier.
Power
Off-Chip
AV
Pads
AC
Voltage
Monitor Block
AG
AT
Gate
Driver
Current
Monitor Block
Temperature
Monitor Block
On-Chip
Analog Quad
Prescaler
Prescaler
Digital
Input
Prescaler
Power
MOSFET
Gate Driver
Digital
Input
Current
Monitor / Instr
Amplifier
To FPGA
(DAVOUTx)
To Analog MUX
Temperature
Monitor
To FPGA
(DACOUTx)
From FPGA
(GDONx)
To Analog MUX
Figure 2-70 • Analog Quad Current Monitor Configuration
2 -9 0
Digital
Input
Pr e li m i n a ry v1 . 7
To FPGA
(DATOUTx)
To Analog MUX
Actel Fusion Mixed-Signal FPGAs
To initiate a current measurement, the appropriate Current Monitor Strobe (CMSTB) signal on the
AB macro must be asserted low for at least tCMSLO in order to discharge the previous measurement.
Then CMSTB must be asserted high for at least tCMSET prior to asserting the ADCSTART signal. The
CMSTB must remain high until after the SAMPLE signal is de-asserted by the AB macro. Note that
the minimum sample time cannot be less than tCMSHI. Figure 2-71 shows the timing diagram of
CMSTB in relationship with the ADC control signals.
tCMSHI
CMSTBx
tCMSLO
tCMSET
VADC
ADCSTART can be asserted
after this point to start ADC
sampling.
ADCSTART
Figure 2-71 • Timing Diagram for Current Monitor Strobe
Figure 2-72 illustrates positive current monitor operation. The differential voltage between AV and
AC goes into the 10× amplifier and is then converted by the ADC. For example, a current of 1.5 A is
drawn from a 10 V supply and is measured by the voltage drop across a 0.050 Ω sense resistor, The
voltage drop is amplified by ten times by the amplifier and then measured by the ADC. The 1.5 A
current creates a differential voltage across the sense resistor of 75 mV. This becomes 750 mV after
amplification. Thus, the ADC measures a current of 1.5 A as 750 mV. Using an ADC with 8-bit
resolution and VAREF of 2.56 V, the ADC result is decimal 75. EQ 2-3 shows how to compute the
current from the ADC result.
N
I = ( ADC × V AREF ) ⁄ ( 10 × 2 × R sense )
EQ 2-3
where
I is the current flowing through the sense resistor
ADC is the result from the ADC
VAREF is the Reference voltage
N is the number of bits
Rsense is the resistance of the sense resistor
Pr e li m i n a ry v1 . 7
2 - 91
Device Architecture
0-12 V
AVx
I
RSENSE
ACx
CMSTBx
10 X
VADC
to Analog MUX
(refer Table 2-36
for MUX channel
number)
Current Monitor
Figure 2-72 • Positive Current Monitor
Care must be taken when choosing the right resistor for current measurement application. Note
that because of the 10× amplification, the maximum measurable difference between the AV and
AC pads is VAREF / 10. A larger AV-to-AC voltage drop will result in ADC saturation; that is, the
digital code put out by the ADC will stay fixed at the full scale value. Therefore, the user must
select the external sense resistor appropriately. Table 2-37 shows recommended resistor values for
different current measurement ranges. When choosing resistor values for a system, there is a tradeoff between measurement accuracy and power consumption. Choosing a large resistor will increase
the voltage drop and hence increase accuracy of the measurement; however the larger voltage
drop dissipates more power (P = I2 × R).
The Current Monitor is a unipolar system, meaning that the differential voltage swing must be
from 0 V to VAREF /10. Therefore, the Current Monitor only supports differential voltage where
|VAV-VAC| is greater than 0 V. This results in the requirement that the potential of the AV pad must
be larger than the potential of the AC pad. This is straightforward for positive voltage systems. For
a negative voltage system, it means that the AV pad must be "more negative" than the AC pad.
This is shown in Figure 2-73.
In this case, both the AV pad and the AC pad are configured for negative operations and the
output of the differential amplifier still falls between 0 V and VAREF as required.
2 -9 2
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
Table 2-37 • Recommended Resistor for Different Current Range Measurement
Current Range
Recommended Minimum Resistor Value (Ohms)
> 5 mA – 10 mA
10 – 20
> 10 mA – 20 mA
5 – 10
> 20 mA – 50 mA
2.5 – 5
> 50 mA – 100 mA
1–2
> 100 mA – 200 mA
0.5 – 1
> 200 mA – 500 mA
0.3 – 0.5
> 500 mA – 1 A
0.1 – 0.2
>1A–2A
0.05 – 0.1
>2A–4A
0.025 – 0.05
>4A–8A
0.0125 – 0.025
> 8 A – 12 A
0.00625 – 0.02
RSENSE
0 to
–10.5 V
AVx
I
ACx
CMSTBx
10 X
VADC
to Analog MUX
(refer Table 2-36
for MUX channel
number)
Current Monitor
Figure 2-73 • Negative Current Monitor
Terminology
Accuracy
The accuracy of Fusion Current Monitor is ±2 mV minimum plus 5% of the differential voltage at
the input. The input accuracy can be translated to error at the ADC output by using EQ 2-4. The
10 V/V gain is the gain of the Current Monitor Circuit, as described in the "Current Monitor"
section on page 2-90. For 8-bit mode, N = 8, VAREF= 2.56 V, zero differential voltage between AV
and AC, the Error (EADC) is equal to 2 LSBs.
N
2
E ADC = ( 2mV + 0.05 V AV – V AC ) × ( 10V ) ⁄ V × --------------V AREF
EQ 2-4
where
N is the number of bits
VAREF is the Reference voltage
VAV is the voltage at AV pad
VAC is the voltage at AC pad
Pr e li m i n a ry v1 . 7
2 - 93
Device Architecture
Gate Driver
The Fusion Analog Quad includes a Gate Driver connected to the Quad's AG pin (Figure 2-74).
Designed to work with external p- or n-channel MOSFETs, the Gate driver is a configurable current
sink or source and requires an external pull-up or pull-down resistor. The AG supports 4 selectable
gate drive levels: 1 µA, 3 µA, 10 µA, and 30 µA (Figure 2-75 on page 2-95). The AG also supports a
High Current Drive mode in which it can sink 20 mA; in this mode the switching rate is
approximately 1.3 MHz with 100 ns turn-on time and 600 ns turn-off time. Modeled on an opendrain-style output, it does not output a voltage level without an appropriate pull-up or pull-down
resistor. If 1 V is forced on the drain, the current sinking/sourcing will exceed the ability of the
transistor, and the device could be damaged.
The AG pad is turned on via the corresponding GDONx pin in the Analog Block macro, where x is
the number of the corresponding Analog Quad for the AG pad to be enabled (GDON0 to GDON9).
Power
Line Side
Load Side
Off-Chip
Rpullup
AV
Pads
AC
Voltage
Monitor Block
AG
Current
Monitor Block
AT
Gate
Driver
Temperature
Monitor Block
On-Chip
Analog Quad
Prescaler
Prescaler
Digital
Input
Digital
Input
Prescaler
Power
MOSFET
Gate Driver
Current
Monitor / Instr
Amplifier
To FPGA
(DAVOUTx)
To Analog MUX
Digital
Input
Temperature
Monitor
To FPGA
(DACOUTx)
From FPGA
(GDONx)
To Analog MUX
To FPGA
(DATOUTx)
To Analog MUX
Figure 2-74 • Gate Driver
The gate-to-source voltage (Vgs) of the external MOSFET is limited to the programmable drive
current times the external pull-up or pull-down resistor value (EQ 2-5).
Vgs ≤ Ig × (Rpullup or Rpulldown)
EQ 2-5
The rate at which the gate voltage of the external MOSFET slews is determined by the current, Ig,
sourced or sunk by the AG pin and the gate-to-source capacitance, CGS, of the external MOSFET. As
an approximation, the slew rate is given by EQ 2-6.
dv/dt = Ig / CGS
EQ 2-6
2 -9 4
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
CGS is not a fixed capacitance but, depending on the circuitry connected to its drain terminal, can
vary significantly during the course of a turn-on or turn-off transient. Thus, EQ 2-6 on page 2-94
can only be used for a first-order estimate of the switching speed of the external MOSFET.
1 µA
3 µA
10 µA
30 µA
AG
High
Current
1 µA
3 µA
10 µA
30 µA
Figure 2-75 • Gate Driver Example
Pr e li m i n a ry v1 . 7
2 - 95
Device Architecture
Temperature Monitor
The final pin in the Analog Quad is the Analog Temperature (AT) pin. The AT pin is used to
implement an accurate temperature monitor in conjunction with an external diode-connected
bipolar transistor (Figure 2-76). For improved temperature measurement accuracy, it is important
to use the ATRTN pin for the return path of the current sourced by the AT pin. Each ATRTN pin is
shared between two adjacent Analog Quads. Additionally, if not used for temperature monitoring,
the AT pin can provide functionality similar to that of the AV pad. However, in this mode only
positive voltages can be applied to the AT pin, and only two prescaler factors are available (16 V
and 4 V ranges—refer to Table 2-54 on page 2-128).
Discrete
Bipolar
Transistor
Off-Chip
AV
Pads
AC
Voltage
Monitor Block
AG
Gate
Driver
Current
Monitor Block
ATRTN
AT
Temperature
Monitor Block
On-Chip
Analog Quad
Prescaler
Prescaler
Digital
Input
Digital
Input
Prescaler
Power
MOSFET
Gate Driver
Current
Monitor / Instr
Amplifier
To FPGA
(DAVOUTx)
To Analog MUX
Digital
Input
Temperature
Monitor
To FPGA
(DACOUTx)
From FPGA
(GDONx)
To Analog MUX
To FPGA
(DATOUTx)
To Analog MUX
Figure 2-76 • Temperature Monitor Quad
Fusion uses a remote diode as a temperature sensor. The Fusion Temperature Monitor uses a
differential input; the AT pin and ATRTN (AT Return) pin are the differential inputs to the
2 -9 6
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
Temperature Monitor. There is one Temperature Monitor in each Quad. A simplified block diagram
is shown in Figure 2-77.
VDD33A
10 µA
100 µA
TMSTBx
+
ATx
+
∆V
VADC
12.5 X
–
to Analog MUX
(refer Table 2-36
for MUX Channel
Number)
–
ATRTNxy
Figure 2-77 • Block Diagram for Temperature Monitor Circuit
The Fusion approach to measuring temperature is forcing two different currents through the diode
with a ratio of 10:1. The switch that controls the different currents is controlled by the Temperature
Monitor Strobe signal, TMSTB. Setting TMSTB to '1' will initiate a Temperature reading. The TMSTB
should remain '1' until the ADC finishes sampling the voltage from the Temperature Monitor. The
minimum sample time for the Temperature Monitor cannot be less than the minimum strobe high
time minus the setup time. Figure 2-78 shows the timing diagram.
tTMSHI
TMSTBx
tTMSLO
tTMSSET
VADC
ADC should start
sampling at this point
ADCSTART
Figure 2-78 • Timing Diagram for the Temperature Monitor Strobe Signal
The diode’s voltage is measured at each current level and the temperature is calculated based on
EQ 2-7.
kT I TMSLO
V TMSLO – V TMSHI = n ------ ⎛⎝ ln ---------------⎞⎠
I TMSHI
q
EQ 2-7
Pr e li m i n a ry v1 . 7
2 - 97
Device Architecture
where
ITMSLO is the current when the Temperature Strobe is Low, typically 100 µA
ITMSHI is the current when the Temperature Strobe is High, typically 10 µA
VTMSLO is diode voltage while Temperature Strobe is Low
VTMSHI is diode voltage while Temperature Strobe is High
n is the non-ideality factor of the diode-connected transistor. It is typically 1.004 for the Actelrecommended transistor type 2N3904.
K = 1.3806 x 10-23 J/K is the Boltzman constant
Q = 1.602 x 10-19 C is the charge of a proton
When ITMSLO / ITMSHI = 10, the equation can be simplified as shown in EQ 2-8.
–4
ΔV = V TMSLO – V TMSHI = 1.986 × 10 nT
EQ 2-8
In the Fusion TMB, the ideality factor n for 2N3904 is 1.004 and ΔV is amplified 12.5 times by an
internal amplifier; hence the voltage before entering the ADC is as given in EQ 2-9.
V ADC = ΔV × 12.5 = 2.5 mV ⁄ ( K × T )
EQ 2-9
This means the temperature to voltage relationship is 2.5 mV per degree Kelvin. The unique design
of Fusion has made the Temperature Monitor System simple for the user. When the 10-bit mode
ADC is used, each LSB represents 1 degree Kelvin, as shown in EQ 2-10. That is, e. 25°C is equal to
293°K and is represented by decimal 293 counts from the ADC.
10
2
1K = 2.5 mV × ----------------- = 1 LSB
2.56 V
EQ 2-10
If 8-bit mode is used for the ADC resolution, each LSB represents 4 degrees Kelvin; however, the
resolution remains as 1 degree Kelvin per LSB, even for 12-bit mode, due to the Temperature
Monitor design. An example of the temperature data format for 10-bit mode is shown in
Table 2-38.
Table 2-38 • Temperature Data Format
Temperature (K)
Digital Output
(ADC 10-bit mode)
–40°C
233
00 1110 1001
–20°C
253
00 1111 1101
0°C
273
01 0001 0001
1°C
274
01 0001 0010
10 °C
283
01 0001 1011
25°C
298
01 0010 1010
50 °C
323
01 0100 0011
85 °C
358
01 0110 0110
Temperature
2 -9 8
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
Terminology
Resolution
Resolution defines the smallest temperature change Fusion Temperature Monitor can resolve. For
ADC configured as 8-bit mode, each LSB represents 4°C, and 1°C per LSB for 10-bit mode. With 12bit mode, the Temperature Monitor can still only resolve 1°C due to Temperature Monitor design.
Offset
The Fusion Temperature Monitor has a systematic offset of +5°C, excluding error due board
resistance and ideality factor of the external diode, between the operation range of –40°C to
+85°C. For instance, 25°C will be read by the Temperature Monitor as 30°C plus error. The user can
remove any offset error through hardware or software during the calibration routine.
Pr e li m i n a ry v1 . 7
2 - 99
Device Architecture
Analog-to-Digital Converter Block
At the heart of the Fusion analog system is a programmable Successive Approximation Register
(SAR) ADC. The ADC can support 8-, 10-, or 12-bit modes of operation. In 12-bit mode, the ADC can
resolve 500 ksps. All results are MSB-justified in the ADC. The input to the ADC is a large 32:1
analog input multiplexer. A simplified block diagram of the Analog Quads, analog input
multiplexer, and ADC is shown in Figure 2-79. The ADC offers multiple self-calibrating modes to
ensure consistent high performance both at power-up and during runtime.
VCC (1.5 V)
0
Pads
AV0
AC0
AG0
AT0
ATRETURN01
AV1
AC1
AG1
AT1
AV2
AC2
AG2
AT2
ATRETURN23
AV3
AC3
AG3
AT3
AV4
AC4
AG4
AT4
ATRETURN45
AV5
AC5
AG5
AT5
AV6
AC6
AG6
AT6
ATRETURN67
AV7
AC7
AG7
AT7
AV8
AC8
AG8
AT8
ATRETURN89
AV9
AC9
AG9
AT9
1
Analog
Quad 0
These are hardwired
connections within
Analog Quad.
Analog
Quad 1
Analog
Quad 2
Analog
Quad 3
Analog
Quad 4
Analog MUX
(32 to 1)
Analog
Quad 5
ADC
Digital Output to FPGA
Analog
Quad 6
Analog
Quad 7
Analog
Quad 8
Analog
Quad 9
31
Temperature
Monitor
CHNUMBER[4:0]
Internal Diode
Figure 2-79 • ADC Block Diagram
2 -1 0 0
12
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
ADC Input Multiplexer
At the input to the Fusion ADC is a 32:1 multiplexer. Of the 32 input channels, up to 30 are user
definable. Two of these channels are hardwired internally. Channel 31 connects to an internal
temperature diode so the temperature of the Fusion device itself can be monitored. Channel 0 is
wired to the FPGA’s 1.5 V VCC supply, enabling the Fusion device to monitor its own power supply.
Doing this internally makes it unnecessary to use an analog I/O to support these functions. The
balance of the MUX inputs are connected to Analog Quads (see the "Analog Quad" section on
page 2-84). Table 2-39 defines which Analog Quad inputs are associated with which specific analog
MUX channels. The number of Analog Quads present is device-dependent; refer to the family list in
the "Fusion Family" table on page I of this datasheet for the number of quads per device.
Regardless of the number of quads populated in a device, the internal connections to both VCC and
the internal temperature diode remain on Channels 0 and 31, respectively. To sample the internal
temperature monitor, it must be strobed (similar to the AT pads). The TMSTBINT pin on the Analog
Block macro is the control for strobing the internal temperature measurement diode.
To determine which channel is selected for conversion, there is a five-pin interface on the Analog
Block, CHNUMBER[4:0], defined in Table 2-40 on page 2-102. Table 2-39 shows the correlation
between the analog MUX input channels and the analog input pins.
Table 2-39 • Analog MUX Channels
Analog MUX Channel
Signal
0
Vcc_analog
1
AV0
2
AC0
3
AT0
4
AV1
5
AC1
6
AT1
7
AV2
8
AC2
9
AT2
10
AV3
11
AC3
12
AT3
13
AV4
14
AC4
15
AT4
16
AV5
17
AC5
18
AT5
19
AV6
20
AC6
21
AT6
Pr e li m i n a ry v1 . 7
Analog Quad Number
Analog Quad 0
Analog Quad 1
Analog Quad 2
Analog Quad 3
Analog Quad 4
Analog Quad 5
Analog Quad 6
2 -101
Device Architecture
Table 2-39 • Analog MUX Channels (continued)
Analog MUX Channel
Signal
Analog Quad Number
22
AV7
Analog Quad 7
23
AC7
24
AT7
25
AV8
26
AC8
27
AT8
28
AV9
29
AC9
30
AT9
31
Internal temperature
monitor
Analog Quad 8
Analog Quad 9
Table 2-40 • Channel Selection
Channel Number
2 -1 0 2
CHNUMBER[4:0]
0
00000
1
00001
2
00010
3
00011
.
.
.
.
.
.
30
11110
31
11111
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
ADC Description
The Actel Fusion ADC is a 12-bit SAR ADC. It offers a wide variety of features for different use
models. Figure 2-80 shows a block diagram of the Fusion ADC.
•
Configurable resolution: 8-bit, 10-bit, and 12-bit mode
•
DNL: 0.6 LSB for 10-bit mode
•
INL: 0.4 LSB for 10-bit mode
•
No missing code
•
Internal VAREF = 2.56 V
•
Maximum Sample Rate = 600 ksps
•
Power-up calibration and dynamic calibration after every sample to compensate for
temperature drift over time
CALIBRATE
SAMPLE
BUSY
DATAVALID
VAREF
Analog
MUX
Signals from
Analog Quads
STATUS
32
12
SAR ADC
CHNUMBER
STC
SYSCLK
RESULT
MODE
TVC
ADCCLK
Figure 2-80 • ADC Simplified Block Diagram
ADC Configuration Description
The Fusion ADC can be configured to operate in 8-, 10-, or 12-bit modes, power-down after
conversion, and dynamic calibration. This is controlled by MODE[3:0], as defined in Table 2-41.
Table 2-41 • Mode Bits Function
Name
Bits
Function
MODE
3
0 – Internal calibration after every conversion; two ADCCLK cycles are used
after the conversion.
1 – No calibration after every conversion
MODE
2
0 – Power-down after conversion
1 – No Power-down after conversion
MODE
1:0
00 – 10-bit
01 – 12-bit
10 – 8-bit
11 – Unused
Pr e li m i n a ry v1 . 7
2 -103
Device Architecture
The speed of the ADC depends on its internal clock, ADCCLK, which is not accessible to users. The
ADCCLK is derived from SYSCLK. Input signal TVC[7:0], Time Divider Control, determines the speed
of the ADCCLK in relationship to SYSCLK, based on EQ 2-11.
t ADCCLK = 4 × ( 1 + TVC ) × t SYSCLK
EQ 2-11
TVC: Time Divider Control (0–255)
tADCCLK is the period of ADCCLK, and must be between 0.5 MHz and 10 MHz
tSYSCLK is the period of SYSCLK
Table 2-42 • TVC Bits Function
Name
Bits
Function
TVC
[7:0]
SYSCLK divider control
The frequency of ADCCLK, fADCCLK, must be within 0.5 Hz to 10 MHz.
The inputs to the ADC are synchronized to SYSCLK. A conversion is initiated by asserting the
ADCSTART signal on a rising edge of SYSCLK. Figure 2-82 on page 2-108 and Figure 2-83 on
page 2-108 show the timing diagram for the ADC.
A conversion is performed in three phases. In the first phase, the analog input voltage is sampled
on the input capacitor. This phase is called sample phase. During the sample phase, the output
signals BUSY and SAMPLE change from '0' to '1', indicating the ADC is busy and sampling the
analog signal. The sample time can be controlled by input signals STC[7:0]. The sample time can be
calculated by EQ 2-12. When controlling the sample time for the ADC along with the use of
Prescaler or Current Monitor or Temperature Monitor, the minimum sample time for each must be
obeyed. Refer to the corresponding section and Table 2-43 for further information.
t sample = ( 2 + STC ) × t ADCCLK
EQ 2-12
STC: Sample Time Control value (0–255)
tSAMPLE is the sample time
Table 2-43 • STC Bits Function
Name
Bits
STC
[7:0]
Function
Sample time control
Sample time is computed based on the period of ADCCLK.
The second phase is called the distribution phase. During distribution phase, the ADC computes the
equivalent digital value from the value stored in the input capacitor. In this phase, the output
signal SAMPLE goes back to '0', indicating the sample is completed; but the BUSY signal remains
'1', indicating the ADC is still busy for distribution. The distribution time depends strictly on the
number of bits. If the ADC is configured as a 10-bit ADC, then 10 ADCCLK cycles are needed. EQ 213 describes the distribution time.
t distrib = N × t ADCCLK
EQ 2-13
N: Number of bits
The last phase is the post-calibration phase. This is an optional phase. The post-calibration phase
takes two ADCCLK cycles. The output BUSY signal will remain '1' until the post-calibration phase is
completed. If the post-calibration phase is skipped, then the BUSY signal goes to '0' after
distribution phase. As soon as BUSY signal goes to '0', the DATAVALID signal goes to '1', indicating
the digital result is available on the RESULT output signals. DATAVAILD will remain '1' until the next
ADCSTART is asserted. Actel recommends enabling post-calibration to compensate for drift and
temperature-dependent effects. This ensures that the ADC remains consistent over time and with
2 -1 0 4
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
temperature. The post-calibration phase is enabled by bit 3 of the Mode register. EQ 2-14 describes
the post-calibration time.
t post-cal = MODE [ 3 ] × ( 2 × t ADCCLK )
EQ 2-14
MODE[3]: Bit 3 of the Mode register, described in Table 2-41 on page 2-103.
The calculation for the conversion time for the ADC is summarized in EQ 2-15.
tconv = tsync_read + tsample + tdistrib + tpost-cal + tsync_write
EQ 2-15
tconv: conversion time
tsync_read: maximum time for a signal to synchronize with SYSCLK. For calculation purposes, the
worst case is a period of SYSCLK, tSYSCLK.
tsample: Sample time
tdistrib: Distribution time
tpost-cal: Post-calibration time
tsync_write: Maximum time for a signal to synchronize with SYSCLK. For calculation purposes, the
worst case is a period of SYSCLK, tSYSCLK.
Example
This example shows how to choose the correct settings to achieve the fastest sample time in 10-bit
mode for a system that runs at 66 MHz.
The period of SYSCLK: tSYSCLK = 1/66 MHz = 0.015 µs
Choosing TVC between 1 and 33 will meet the maximum and minimum period for the ADCCLK
requirement. A higher TVC leads to a higher ADCCLK period.
The minimum TVC is chosen so that tdistrib and tpost-cal can be run faster. The period of ADCCLK
with a TVC of 1 can be computed by EQ .
t ADCCLK = 4 × ( 1 + TVC ) × t SYSCLK = 4 × ( 1 + 1 ) × 0.015 µs = 0.12 µs
From Table 2-47 on page 2-118, minimum conversion for 10-bit mode is 1.8 µs. To compute STC, the
calculation will first compute the post-calibration time, second the distribution time, and finally the
STC setting.
Since Actel recommends post-calibration for temperature drift over time, post-calibration shall be
enabled and the post-calibration time, tpost-cal, can be computed by EQ 2-16. The post-calibration
time is 0.24 µs.
t post-cal = 2 × t ADCCLK = 0.24 µs
EQ 2-16
The distribution time, tdistrib, is equal to 1.2 µs and can be computed using EQ 2-17.
t distrib = N × t ADCCLK = 10 × 0.12 = 1.2 µs
EQ 2-17
The STC value can now be computed through EQ 2-18. The sample time is equal to 0.32 µs. By
rearranging EQ 2-12 on page 2-104 with a tsample of 0.35 µs, the STC can be computed.
tsample = tconv – tpost-cal – tdistrib – tsync_read – tsync_write
= 1.8 µs – 0.24 µs – 1.2 µs – 0.15 µs – 0.15 µs = 0.32 µs
t sample
µs- – 2 = 2.85
STC = ------------------ – 2 = 0.35
-----------------t ADCCLK
0.12 µs
EQ 2-18
Pr e li m i n a ry v1 . 7
2 -105
Device Architecture
And so, STC will be rounded up to 3 to ensure the minimum conversion time is met. The sample
time, tsample, with an STC of 3, is now equal to 0.36 µs.
The total sample time, using EQ 2-19, can now be summated.
= t sync_read + t sample + t distrib + t post-cal + t sync_write = 0.015 µs + 0.36 µs + 1.2 µs + 0.24 µs + 0.015 µs = 1.8
EQ 2-19
The optimal setting for the system running at 66 MHz with an ADC for 10-bit mode chosen is listed
as follows:
TVC[7:0]
=1
= 0x01
STC[7:0]
=3
= 0x03
MODE[3:0]
= b'0100
= 0x4*
*Note that no power-down after every conversion is chosen in this case; however, if the application
is power-sensitive, the MODE[2] can be set to '0', as described above, and it will not affect any
performance.
Integrated Voltage Reference
The Fusion device has an integrated on-chip 2.56 V reference voltage for the ADC. The value of this
reference voltage was chosen to make the prescaling and postscaling factors for the prescaler
blocks change in a binary fashion. However, if desired, an external reference voltage of up to 3.3 V
can be connected between the VAREF and GNDREF pins. The VAREFSEL control pin is used to select
the reference voltage.
Table 2-44 • VAREF Bit Function
Name
Bit
VAREF
0
Function
Reference voltage selection
0 – Internal voltage reference selected. VAREF pin outputs 2.56 V.
1 – Input external voltage reference from VAREF and GNDREF
ADC Operation Description
The ADC can be powered down independently of the FPGA core, as an additional control or for
power-saving considerations, via the PWRDWN pin of the Analog Block. The PWRDWN pin controls
only the comparators in the ADC.
Once the ADC has powered up and been released from reset, ADCRESET, the ADC will initiate a
calibration routine designed to provide optimal ADC performance. The Fusion ADC offers a robust
calibration scheme to reduce integrated offset and linearity errors. The offset and linearity errors
of the main capacitor array are compensated for with an 8-bit calibration capacitor array. The
offset/linearity error calibration is carried out in two ways. First, a power-up calibration is carried
out when the ADC comes out of reset. This is initiated by the CALIBRATE output of the Analog
Block macro and is a fixed number of ADC_CLK cycles (3,840 cycles), as shown in Figure 2-81 on
page 2-107. In this mode, the linearity and offset errors of the capacitors are calibrated.
To further compensate for drift and temperature-dependent effects, every conversion is followed
by post-calibration of either the offset or a bit of the main capacitor array. The post-calibration
ensures that, over time and with temperature, the ADC remains consistent.
After both calibration and the setting of the appropriate configurations, as explained above, the
ADC is ready for operation. Setting the ADCSTART signal high for one clock period will initiate the
sample and conversion of the analog signal on the channel as configured by CHNUMBER[4:0]. The
status signals SAMPLE and BUSY will show when the ADC is sampling and converting (Figure 2-83
on page 2-108). Both SAMPLE and BUSY will initially go high. After the ADC has sampled and held
the analog signal, SAMPLE will go low. After the entire operation has completed and the analog
signal is converted, BUSY will go low and DATAVALID will go high. This indicates that the digital
result is available on the RESULT[11:0] pins.
2 -1 0 6
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
DATAVALID will remain high until a subsequent ADC_START is issued. The DATAVALID goes low on
the rising edge of SYSCLK as shown in Figure 2-82 on page 2-108. The RESULT signals will be kept
constant until the ADC finishes the subsequent sample. The next sampled RESULT will be available
when DATAVALID goes high again. It is ideal to read the RESULT when DATAVALID is '1'. The
RESULT is latched and remains unchanged until the next DATAVLAID rising edge.
Intra-Conversion
Performing a conversion during power-up, calibration is possible but should be avoided, since the
performance is not guaranteed, as shown in Table 2-46 on page 2-115. This is described as intraconversion.
Injected Conversion
A conversion can be interrupted by another conversion. Before the current conversion is finished, a
second conversion can be started by issuing a pulse on signal ADCSTART. When a second conversion
is issued before the current conversion is completed, the current conversion would be dropped and
the ADC would start the second conversion on the rising edge of the SYSCLK. This is known as
injected conversion. Since the ADC is synchronous, the minimum time to issue a second conversion
is two clock cycles of SYSCLK after the previous one.
Timing Diagram
tCAL = 3,840 tADCCLK*
SYSCLK
tRECCLR
tREMCLR
ADCRESET
tSUTVC
tHDTVC
TVC[7:0]
tCK2QCAL
tCK2QCAL
CALIBRATE
Note: *Refer to EQ 2-11 on page 2-104 for the calculation on the period of ADCCLK, tADCCLK.
Figure 2-81 • Power-Up Calibration Status Signal Timing Diagram
Pr e li m i n a ry v1 . 7
2 -107
Device Architecture
tMINSYSCLK
tMPWSYSCLK
SYSCLK
tHDADCSTART
tSUADCSTART
ADCSTART
tSUMODE
tHDMODE
MODE[3:0]
tSUTVC
tHDTVC
tSUSTC
tHDSTC
TVC[7:0]
STC[7:0]
tSUVAREFSEL
tHDVAREFSEL
VAREF
tHDCHNUM
tSUCHNUM
CHNUMBER[7:0]
Figure 2-82 • Input Setup Time
t SAMPLE1
t DATA2START 3
SYSCLK
tSUADCSTART tHDADCSTART
ADCSTART
tCK2QBUSY
BUSY
tCK2QSAMPLE
SAMPLE
t CONV2
t CK2QVAL
t CK2QVAL
DATAVALID
tCLK 2RESULT
1 st Sample Result
ADC_ RESULT[11:0]
2nd Sample Result
Notes:
1. Refer to EQ 2-12 on page 2-104 for the calculation on the sample time, tSAMPLE.
2. See EQ 2-19 on page 2-106 for calculation on the conversion time, tCONV.
3. Minimum time to issue an ADCSTART after DATAVALID is 1 SYSCLK period
Figure 2-83 • Standard Conversion Status Signal Timing Diagram
2 -1 0 8
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
ADC Interface Timing
Table 2-45 • ADC Interface Timing
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V
Parameter
Description
–2
–1
Std.
Units
tSUMODE
Mode Pin Setup Time
0.56
0.64
0.75
ns
tHDMODE
Mode Pin Hold Time
0.26
0.29
0.34
ns
tSUTVC
Clock Divide Control (TVC) Setup Time
0.68
0.77
0.90
ns
tHDTVC
Clock Divide Control (TVC) Hold Time
0.32
0.36
0.43
ns
tSUSTC
Sample Time Control (STC) Setup Time
1.58
1.79
2.11
ns
tHDSTC
Sample Time Control (STC) Hold Time
1.27
1.45
1.71
ns
tSUVAREFSEL
Voltage Reference Select (VAREFSEL) Setup Time
0.00
0.00
0.00
ns
tHDVAREFSEL
Voltage Reference Select (VAREFSEL) Hold Time
0.67
0.76
0.89
ns
tSUCHNUM
Channel Select (CHNUMBER) Setup Time
0.90
1.03
1.21
ns
tHDCHNUM
Channel Select (CHNUMBER) Hold Time
0.00
0.00
0.00
ns
tSUADCSTART
Start of Conversion (ADCSTART) Setup Time
0.75
0.85
1.00
ns
tHDADCSTART
Start of Conversion (ADCSTART) Hold Time
0.43
0.49
0.57
ns
tCK2QBUSY
Busy Clock-to-Q
1.33
1.51
1.78
ns
tCK2QCAL
Power-Up Calibration Clock-to-Q
0.63
0.71
0.84
ns
tCK2QVAL
Valid Conversion Result Clock-to-Q
3.12
3.55
4.17
ns
tCK2QSAMPLE
Sample Clock-to-Q
0.22
0.25
0.30
ns
tCK2QRESULT
Conversion Result Clock-to-Q
2.53
2.89
3.39
ns
tCLR2QBUSY
Busy Clear-to-Q
2.06
2.35
2.76
ns
tCLR2QCAL
Power-Up Calibration Clear-to-Q
2.15
2.45
2.88
ns
tCLR2QVAL
Valid Conversion Result Clear-to-Q
2.41
2.74
3.22
ns
tCLR2QSAMPLE
Sample Clear-to-Q
2.17
2.48
2.91
ns
tCLR2QRESULT
Conversion result Clear-to-Q
2.25
2.56
3.01
ns
tRECCLR
Recovery Time of Clear
0.00
0.00
0.00
ns
tREMCLR
Removal Time of Clear
0.63
0.72
0.84
ns
tMPWSYSCLK
Clock Minimum Pulse Width for the ADC
4.00
4.00
4.00
ns
tFMAXSYSCLK
Clock Maximum Frequency for the ADC
100.00
100.00
100.00
MHz
Pr e li m i n a ry v1 . 7
2 -109
Device Architecture
Terminology
Conversion Time
Conversion time is the interval between the release of the hold state (imposed by the input
circuitry of a track-and-hold) and the instant at which the voltage on the sampling capacitor settles
to within one LSB of a new input value.
DNL – Differential Non-Linearity
For an ideal ADC, the analog-input levels that trigger any two successive output codes should differ
by one LSB (DNL = 0). Any deviation from one LSB in defined as DNL (Figure 2-84).
ADC Output Code
Ideal Output
Error = –0.5 LSB
Actual Output
Error = +1 LSB
In p u t V o lta g e to P re sca le r
Figure 2-84 • Differential Non-Linearity (DNL)
ENOB – Effective Number of Bits
ENOB specifies the dynamic performance of an ADC at a specific input frequency and sampling
rate. An ideal ADC’s error consists only of quantization of noise. As the input frequency increases,
the overall noise (particularly in the distortion components) also increases, thereby reducing the
ENOB and SINAD (also see “Signal-to-Noise and Distortion Ratio (SINAD)”.) ENOB for a full-scale,
sinusoidal input waveform is computed using EQ 2-20.
– 1.76ENOB = SINAD
---------------------------------6.02
EQ 2-20
FS Error – Full-Scale Error
Full-scale error is the difference between the actual value that triggers that transition to full-scale
and the ideal analog full-scale transition value. Full-scale error equals offset error plus gain error.
2 -1 1 0
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Actel Fusion Mixed-Signal FPGAs
Gain Error
The gain error of an ADC indicates how well the slope of an actual transfer function matches the
slope of the ideal transfer function. Gain error is usually expressed in LSB or as a percent of fullscale (%FSR). Gain error is the full-scale error minus the offset error (Figure 2-85).
Gain = 2 LSB
1...11
ADC Output Code
Ideal Output
Actual Output
FS
Voltage
0...00
In p u t V o lta g e to P re sca le r
Figure 2-85 • Gain Error
Gain Error Drift
Gain-error drift is the variation in gain error due to a change in ambient temperature, typically
expressed in ppm/°C.
Pr e li m i n a ry v1 . 7
2 -111
Device Architecture
INL – Integral Non-Linearity
INL is the deviation of an actual transfer function from a straight line. After nullifying offset and
gain errors, the straight line is either a best-fit straight line or a line drawn between the end points
of the transfer function (Figure 2-86).
IN L = +0.5 LSB
ADC Output Code
Ideal Output
Actual Output
IN L = +1 LSB
Input V oltage to P rescaler
Figure 2-86 • Integral Non-Linearity (INL)
LSB – Least Significant Bit
In a binary number, the LSB is the least weighted bit in the group. Typically, the LSB is the furthest
right bit. For an ADC, the weight of an LSB equals the full-scale voltage range of the converter
divided by 2N, where N is the converter’s resolution. For a 10-bit ADC with a unipolar full-scale
voltage of 2.56 V, 1 LSB = (2.56 V / 210) = 2.5 mV.
No Missing Codes
An ADC has no missing codes if it produces all possible digital codes in response to a ramp signal
applied to the analog input.
Offset Error
Offset error indicates how well the actual transfer function matches the ideal transfer function at a
single point. For an ideal ADC, the first transition occurs at 0.5 LSB above zero. The offset voltage is
measured by applying an analog input such that the ADC outputs all zeroes and increases until the
first transition occurs (Figure 2-87).
2 -1 1 2
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
ADC Output Code
Ideal Output
Actual Output
0...01
Offset Error = 1.5 LSB
0...00
In p u t V o lta g e to P re sca le r
Figure 2-87 • Offset Error
Resolution
ADC resolution is the number of bits used to represent an analog input signal. To more accurately
replicate the analog signal, resolution needs to be increased.
Sampling Rate
Sampling rate or sample frequency, specified in samples per second (sps), is the rate at which an
ADC acquires (samples) the analog input.
SNR – Signal-to-Noise Ratio
SNR is the ratio of the amplitude of the desired signal to the amplitude of the noise signals at a
given point in time. For a waveform perfectly reconstructed from digital samples, the theoretical
maximum SNR (EQ 2-21) is the ratio of the full-scale analog input (RMS value) to the RMS
quantization error (residual error). The ideal, theoretical minimum ADC noise is caused by
quantization error only and results directly from the ADC’s resolution (N bits):
SNR dB[MAX] = 6.02 dB × N + 1.76 dB
EQ 2-21
SINAD – Signal-to-Noise and Distortion
SINAD is the ratio of the rms amplitude to the mean value of the root-sum-square of the all other
spectral components, including harmonics, but excluding DC. SINAD is a good indication of the
overall dynamic performance of an ADC because it includes all components which make up noise
and distortion.
Total Harmonic Distortion
THD measures the distortion content of a signal, and is specified in decibels relative to the carrier
(dBc). THD is the ratio of the RMS sum of the selected harmonics of the input signal to the
fundamental itself. Only harmonics within the Nyquist limit are included in the measurement.
TUE – Total Unadjusted Error
Pr e li m i n a ry v1 . 7
2 -113
Device Architecture
TUE is a comprehensive specification that includes linearity errors, gain error, and offset error. It is
the worst-case deviation from the ideal device performance. TUE is a static specification
(Figure 2-88).
ADC Output Code
T U E = ±0.5 LSB
ID EAL OU T PU T
In p u t V o lta g e to P re sca le r
Figure 2-88 • Total Unadjusted Error (TUE)
2 -1 1 4
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
Analog System Characteristics
Table 2-46 • Analog Channel Specifications
All Values at Industrial Operating Conditions (unless noted otherwise)
Typical: VCC33A = 3.3 V, VCC = 1.5 V, and TA = 25°C
Parameter
Description
Condition
Minimum Typical
Maximum
Units
Voltage Monitor using Analog Pads AV, AC and AT (using prescaler)
VINAP
Input Voltage
Refer to Table 3-2 on page 3-3.
Uncalibrated Gain
and Offset Errors
Refer
to
page 2-120.
Table 2-48
on
Calibrated Gain
and Offset Errors
Refer
to
page 2-121.
Table 2-49
on
Bandwidth
Input Resistance
Refer to Table 3-3 on page 3-4.
Scaling Factor
Prescaler modes (Table 2-54 on
page 2-128).
Sampling Time
100
kHz
10
µs
Current Monitor using Analog Pads AV and AC1 (potential on the AV pad must be greater than the AC pad)
VRSM 1
CMRR
tCMSHI
Maximum
Differential Input
VAREF / 10
mV
–10.5 to
+12
V
Resolution
See Accuracy specification
Common Mode
Range
Refer to Table 3-2 on page 3-3 for
maximum voltage limits.
Common Mode
Rejection Ratio
DC – 1 kHz
60
dB
1 kHz – 10 kHz
50
dB
>10 kHz
30
dB
Strobe
High time
ADC
conv.
time
tCMSLO
Low time
5
µs
tCMSSET
Setting time
0.02
µs
Accuracy
Input differential voltage > 50 mV
200
–2 – (0.05 ×
(AV – AC)
to
2 + (0.05 ×
(AV – AC))
µs
mV
Notes:
1. VRSM is the maximum voltage drop across the current sense resistor.
2. Analog inputs used as digital inputs can tolerate the same voltage limits as the corresponding analog pad.
There is no reliability concern on digital inputs as long as VIND does not exceed these limits.
3. VIND is limited to VCC33A + 0.2 to allow reaching 10 MHz input frequency.
4. Measurement is done by forcing a temperature on an external diode, with the Fusion device at room
temperature.
5. The temperature offset is a fixed positive value.
6. The high current mode has a maximum power limit of 20 mW. Appropriate current limit resistors must be
used, based on voltage on the pad.
Pr e li m i n a ry v1 . 7
2 -115
Device Architecture
Table 2-46 • Analog Channel Specifications (continued)
All Values at Industrial Operating Conditions (unless noted otherwise)
Typical: VCC33A = 3.3 V, VCC = 1.5 V, and TA = 25°C
Parameter
Description
Condition
Minimum Typical
Maximum
Units
Temperature Monitor Using Analog Pad AT
External
Resolution
Temperature
Monitor4
(using
external
Offset 5
diode
Accuracy
2N3904)
External Sensor
Source Current
Internal
Resolution
Temperature
Monitor
Offset
8-bit ADC
4
°C
10-bit ADC
1
°C
12-bit ADC
1
°C
5
ºC
±3
°C
High level
10
µA
Low level
100
µA
8-bit ADC
4
°C
10-bit ADC
1
°C
12-bit ADC
1
°C
5
ºC
5
Accuracy
tTMSHI
tTMSLO
Temperature
Monitor Strobe
tTMSSET
±3
°C
High time
10
105
µs
Low time
5
µs
Setting time
5
µs
Analog Input as a Digital Input
VIND 2, 3
Input Voltage
VHYSDIN
Hysteresis
0.3
V
VIHDIN
Input HIGH
1.2
V
VILDIN
Input LOW
0.9
V
VMPWDIN
Minimum Pulse
Width
FDIN
Maximum Frequency
ISTBDIN
Input Leakage
Current
2
µA
IDYNDIN
Dynamic Current
20
µA
tINDIN
Input Delay
10
ns
Refer to Table 3-2 on page 3-3.
50
ns
10
MHz
Notes:
1. VRSM is the maximum voltage drop across the current sense resistor.
2. Analog inputs used as digital inputs can tolerate the same voltage limits as the corresponding analog pad.
There is no reliability concern on digital inputs as long as VIND does not exceed these limits.
3. VIND is limited to VCC33A + 0.2 to allow reaching 10 MHz input frequency.
4. Measurement is done by forcing a temperature on an external diode, with the Fusion device at room
temperature.
5. The temperature offset is a fixed positive value.
6. The high current mode has a maximum power limit of 20 mW. Appropriate current limit resistors must be
used, based on voltage on the pad.
2 -1 1 6
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
Table 2-46 • Analog Channel Specifications (continued)
All Values at Industrial Operating Conditions (unless noted otherwise)
Typical: VCC33A = 3.3 V, VCC = 1.5 V, and TA = 25°C
Parameter
Description
Condition
Minimum Typical
Maximum
Units
±20
mA
Gate Driver Output Using Analog Pad AG
VG
Voltage Range
IG
Output Current Drive High Current Mode6 at 1.0 V
Refer to Table 3-2 on page 3-3.
Low Current Mode – ± 1 µA
±1
µA
Low Current Mode – ± 3 µA
±3
µA
Low Current Mode – ± 10 µA
±10
µA
Low Current Mode – ± 30 µA
±30
µA
100
nA
1.3
MHz
Low Current Mode – 3,000 kΩ resistive load
±1 µA
3
kHz
Low Current Mode – 1,000 kΩ resistive load
±3 µA
7
kHz
Low Current Mode – 300 kΩ resistive load
±10 µA
25
kHz
Low Current Mode – 105 kΩ resistive load
±30 µA
78
kHz
IOFFG
Maximum
Current
FG
(maximum
switching
rate)
High Current Mode 1 kΩ resistive load
at 1.0 V
Off
Notes:
1. VRSM is the maximum voltage drop across the current sense resistor.
2. Analog inputs used as digital inputs can tolerate the same voltage limits as the corresponding analog pad.
There is no reliability concern on digital inputs as long as VIND does not exceed these limits.
3. VIND is limited to VCC33A + 0.2 to allow reaching 10 MHz input frequency.
4. Measurement is done by forcing a temperature on an external diode, with the Fusion device at room
temperature.
5. The temperature offset is a fixed positive value.
6. The high current mode has a maximum power limit of 20 mW. Appropriate current limit resistors must be
used, based on voltage on the pad.
Pr e li m i n a ry v1 . 7
2 -117
Device Architecture
Table 2-47 • ADC Characteristics in Direct Input Mode
All Values at Industrial Operating Conditions (unless noted otherwise)
Typical: VCC33A = 3.3 V, VCC = 1.5 V, and TA = 25°C
Parameter
Description
Condition
Minimum
Typical
Maximum
Units
All Analog Inputs
VINADC
Input Voltage (direct to Refer to Table 3-2 on
ADC)
page 3-3.
CINADC
Input Capacitance
ZINADC
VAREF
Channel not selected
Input Impedance
Reference Voltage
7
pF
Channel selected
not sampling
but
8
pF
Channel selected
sampling
and
18
pF
8-bit mode
2
kΩ
10-bit mode
2
kΩ
12-bit mode
2
kΩ
Internal
reference
Accuracy at 25°C
Temperature Drift
Internal Reference
2.537
of
External reference
2.56
2.583
65
2.527
V
ppm/°
C
VCC33A +
0.05
V
DC Accuracy (using external reference)1, 2
TUE
INL
DNL
Total Unadjusted Error
Integral Non-Linearity
Differential
Linearity
(no missing codes)
8-bit mode
0.29
LSB
10-bit mode
0.72
LSB
12-bit mode
1.80
LSB
8-bit mode
0.20
0.25
LSB
10-bit mode
0.32
0.43
LSB
12-bit mode
1.71
1.80
LSB
0.20
0.24
LSB
10-bit mode
0.60
0.65
LSB
12-bit mode
2.40
2.48
LSB
8-bit mode
0.01
0.17
LSB
10-bit mode
0.05
0.20
LSB
12-bit mode
0.20
0.40
LSB
8-bit mode
0.0004
0.003
LSB
10-bit mode
0.002
0.011
LSB
12-bit mode
0.007
0.044
LSB
Non- 8-bit mode
Offset Error
Gain Error
Gain Error (with internal All modes
reference)
Notes:
1. Accuracy of the external reference is 2.56 V ± 4.6 mV.
2. Data is based on characterization.
3. The sample rate is time-shared among active analog inputs.
2 -1 1 8
Pr e li m i n a ry v1 . 7
2.0
%FSR
Actel Fusion Mixed-Signal FPGAs
Table 2-47 • ADC Characteristics in Direct Input Mode (continued)
All Values at Industrial Operating Conditions (unless noted otherwise)
Typical: VCC33A = 3.3 V, VCC = 1.5 V, and TA = 25°C
Parameter
Description
Condition
Minimum
Typical
Maximum
Units
Dynamic Accuracy (using external reference, 100 kHz Sine Wave Input, 2.38 VP-P, 500 ksps,
fADCCLK = 10 MHz)1, 2
SNR
SINAD
THD
ENOB
Conversion
Signal-to-Noise Ratio
Signal-to-Noise and
Distortion
Total Harmonic
Distortion
Effective Number of Bits
8-bit mode
48.0
49.5
dB
10-bit mode
58.0
60.0
dB
12-bit mode
62.9
64.5
dB
8-bit mode
47.6
49.5
dB
10-bit mode
57.4
59.8
dB
12-bit mode
62.0
64.2
dB
8-bit mode
–74.4
–63.0
dBc
10-bit mode
–78.3
–63.0
dBc
12-bit mode
–77.9
–64.4
dBc
8-bit mode
7.6
7.9
bits
10-bit mode
9.2
9.6
bits
12-bit mode
10.0
10.4
bits
8-bit mode
1.7
µs
10-bit mode
1.8
µs
12-bit mode
2.0
µs
2
Conversion Time
Sample Rate2
8-bit mode
600
ksps
10-bit mode
550
ksps
12-bit mode
500
ksps
Notes:
1. Accuracy of the external reference is 2.56 V ± 4.6 mV.
2. Data is based on characterization.
3. The sample rate is time-shared among active analog inputs.
Pr e li m i n a ry v1 . 7
2 -119
Device Architecture
Table 2-48 • Uncalibrated Analog Channel Accuracy*
Worst-Case Industrial Conditions, TA = 85°C
Total Channel
Error (LSB)
Analog Prescaler Neg.
Pos.
Pad
Range (V) Max. Med. Max.
Channel Input Offset
Error (LSB)
Neg
Max
Med.
Positive Range
AV, AC
AT
Neg.
Max.
Med.
Channel Gain Error
(%FSR)
Pos.
Max.
Min.
Typ.
Max.
ADC in 10-Bit Mode
16
–22
–2
12
–11
–2
14
–169
–32
224
3
0
–3
8
–40
–5
17
–11
–5
21
–87
–40
166
2
0
–4
4
–45
–9
24
–16
–11
36
–63
–43
144
2
0
–4
2
–70
–19
33
–33
–20
66
–66
–39
131
2
0
–4
1
–25
–7
5
–11
–3
26
–11
–3
26
3
–1
–3
0.5
–41
–12
8
–12
–7
38
–6
–4
19
3
–1
–3
0.25
–53
–14
19
–20
–14
40
–5
–3
10
5
0
–4
0.125
–89
–29
24
–40
–28
88
–5
–4
11
7
0
–5
16
–3
9
15
–4
0
4
–64
5
64
1
0
–1
4
–10
2
15
–11
–2
11
–44
–8
44
1
0
–1
Negative Range
AV, AC
Pos.
Max.
Channel Input Offset
Error (mV)
ADC in 10-Bit Mode
16
–35
–10
9
–24
–6
9
–383
–96
148
5
–1
–6
8
–65
–19
12
–34
–12
9
–268
–99
75
5
–1
–5
4
–86
–28
21
–64
–24
19
–254
–96
76
5
–1
–6
2
–136
–53
37
–115
–42
39
–230
–83
78
6
–2
–7
1
–98
–35
8
–39
–8
15
–39
–8
15
10
–3
–10
0.5
–121
–46
7
–54
–14
18
–27
–7
9
10
–4
–11
0.25
–149
–49
19
–72
–16
40
–18
–4
10
14
–4
–12
0.125
–188
–67
38
–112
–27
56
–14
–3
7
16
–5
–14
Note: *Channel Accuracy includes prescaler and ADC accuracies. For 12-bit mode, multiply the LSB count by 4.
For 8-bit mode, divide the LSB count by 4. Gain remains the same.
2 -1 2 0
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
Table 2-49 • Calibrated Analog Channel Accuracy 1,2,3
Worst-Case Industrial Conditions, TA = 85°C
Condition
Analog Pad
Prescaler Range (V)
Input
Voltage4
Total Channel Error (LSB)
(V)
Negative Max.
Positive Range
AV, AC
AT
Positive Max.
16
0.300 to 12.0
–6
1
6
8
0.250 to 8.00
–6
0
6
4
0.200 to 4.00
–7
–1
7
2
0.150 to 2.00
–7
0
7
1
0.050 to 1.00
–6
–1
6
16
0.300 to 16.0
–5
0
5
4
0.100 to 4.00
–7
–1
7
Negative Range
AV, AC
Median
ADC in 10-Bit Mode
ADC in 10-Bit Mode
16
–0.400 to –10.5
–7
1
9
8
–0.350 to –8.00
–7
–1
7
4
–0.300 to –4.00
–7
–2
9
2
–0.250 to –2.00
–7
–2
7
1
–0.050 to –1.00
–16
–1
20
Notes:
1. Channel Accuracy includes prescaler and ADC accuracies. For 12-bit mode, multiply the LSB count by 4. For
8-bit mode, divide the LSB count by 4. Overall accuracy remains the same.
2. Requires enabling Analog Calibration in the Actel tool flow.
3. Calibrated with two-point calibration methodology, using 20% and 80% full-scale points.
4. The lower limit of the input voltage is determined by the prescaler input offset.
Pr e li m i n a ry v1 . 7
2 -121
Device Architecture
Table 2-50 • Analog Channel Accuracy: Monitoring Standard Positive Voltages
Typical Conditions, TA = 25°C
Direct ADC2,3
(%FSR)
Calibrated Typical Error per Positive Prescaler Setting1 (%FSR)
Input Voltage
(V)
16 V (AT)
16 V (12 V)
(AV/AC)
8V
(AV/AC)
4 V (AT)
4V
(AV/AC)
2V
(AV/AC)
1V
(AV/AC)
VAREF = 2.56 V
15
1
14
1
12
1
1
5
2
2
1
3.3
2
2
1
1
1
2.5
3
2
1
1
1
1.8
4
4
1
1
1
1
1
1.5
5
5
2
2
2
1
1
1.2
7
6
2
2
2
1
1
0.9
9
9
4
3
3
1
1
1
1
Notes:
1. Requires enabling Analog Calibration in the Actel tool flow.
2. Direct ADC mode using an external VAREF of 2.56V±4.6mV, without Analog Calibration macro.
3. For input greater than 2.56 V, the ADC output will saturate. A higher VAREF or prescaler usage is
recommended.
Examples
Calculating Accuracy for an Uncalibrated Analog Channel
Formula
For a given prescaler range,
Output Voltage = (Channel Output Offset in V) + (Input Voltage x Channel Gain)
where
Channel Output offset in V = Channel Output offset in LSBs x Equivalent voltage per LSB
Channel Gain Factor = 1+ (% Channel Gain / 100)
Example
Input Voltage = 5 V
Chosen Prescaler range = 8 V range
Refer to Table 2-48 on page 2-120.
Max. Output Voltage = (Max Positive output offset) + (Input Voltage x Max Gain Factor)
Max. Positive output offset = (8 LSB) x (8mV per LSB in 10-bit mode)
Max. Positive output offset = 64 mV
Max. Gain = 1 + (2/100)
Max. Gain = 1.02
Max. Output Voltage = (64 mV) + (5 V x 1.02)
Max. Output Voltage = 5.164 V
Similarly,
2 -1 2 2
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
Min. Output Voltage = (Min. Negative output offset) + (Input Voltage x Min. Gain)
= (–136 mV) + (5 V x 0.98) = 4.764 V
Calculating Accuracy for a Calibrated Analog Channel
Formula
For a given prescaler range,
Output Voltage = Channel TUE in V + Input Voltage
where
Channel TUE in V = Channel TUE in LSBs x Equivalent voltage per LSB
Example
Input Voltage = 5 V
Chosen Prescaler range = 8 V range
Refer to Table 2-49 on page 2-121.
Max. Output Voltage = Max. Channel TUE in V + Input Voltage
Max. Channel TUE in V = (6 LSB) × (8 mV per LSB in 10-bit mode) = 48 mV
Max. Output Voltage = 48 mV + 5 V = 5.048 V
Similarly,
Min Output Voltage = Min Channel TUE in V + Input Voltage = (-48 mV) + 5 V = 4.952 V
Calculating LSBs from a Given Error Budget
Formula
For a given prescaler range,
LSB count = ± (Input Voltage × Required % error) / (Equivalent voltage per LSB)
Example
Input Voltage = 5 V
Required error margin= 1%
Refer to Table 2-49 on page 2-121.
Equivalent voltage per LSB = 16 mV for a 16V prescaler, with ADC in 10-bit mode
LSB Count = ± (5.0 V × 1%) / (0.016)
LSB Count = ± 3.125
Equivalent voltage per LSB = 8 mV for an 8 V prescaler, with ADC in 10-bit mode
LSB Count = ± (5.0 V × 1%) / (0.008)
LSB Count = ± 6.25
The 8 V prescaler satisfies the calculated LSB count accuracy requirement (see Table 2-49 on
page 2-121).
Pr e li m i n a ry v1 . 7
2 -123
Device Architecture
Analog Configuration MUX
The ACM is the interface between the FPGA, the Analog Block configurations, and the real-time
counter. Actel Libero IDE will generate IP that will load and configure the Analog Block via the
ACM. However, users are not limited to using the Libero IDE IP. This section provides a detailed
description of the ACM's register map, truth tables for proper configuration of the Analog Block
and RTC, as well as timing waveforms so users can access and control the ACM directly from their
designs.
The Analog Block contains four 8-bit latches per Analog Quad that are initialized through the
ACM. These latches act as configuration bits for Analog Quads. The ACM block runs from the core
voltage supply (1.5 V).
Access to the ACM is achieved via 8-bit address and data busses with enables. The pin list is
provided in Table 2-36 on page 2-82. The ACM clock speed is limited to a maximum of 10 MHz,
more than sufficient to handle the low-bandwidth requirements of configuring the Analog Block
and the RTC (sub-block of the Analog Block).
Table 2-51 decodes the ACM address space and maps it to the corresponding Analog Quad and
configuration byte for that quad.
Table 2-51 • ACM Address Decode Table for Analog Quad
ACMADDR [7:0] in
Decimal
Name
Description
Associated
Peripheral
0
–
–
Analog Quad
1
AQ0
Byte 0
Analog Quad
2
AQ0
Byte 1
Analog Quad
3
AQ0
Byte 2
Analog Quad
4
AQ0
Byte 3
Analog Quad
5
AQ1
Byte 0
Analog Quad
.
.
.
.
.
.
.
.
.
Analog Quad
36
AQ8
Byte 3
Analog Quad
37
AQ9
Byte 0
Analog Quad
38
AQ9
Byte 1
Analog Quad
39
AQ9
Byte 2
Analog Quad
40
AQ9
Byte 3
Analog Quad
Undefined
Analog Quad
Undefined
Analog Quad
Undefined
RTC
41
.
.
.
.
.
.
63
2 -1 2 4
64
COUNTER0
Counter bits 7:0
RTC
65
COUNTER1
Counter bits 15:8
RTC
66
COUNTER2
Counter bits 23:16
RTC
67
COUNTER3
Counter bits 31:24
RTC
68
COUNTER4
Counter bits 39:32
RTC
72
MATCHREG0
Match register bits 7:0
RTC
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
Table 2-51 • ACM Address Decode Table for Analog Quad (continued)
ACMADDR [7:0] in
Decimal
Name
Description
Associated
Peripheral
73
MATCHREG1
Match register bits 15:8
RTC
74
MATCHREG2
Match register bits 23:16
RTC
75
MATCHREG3
Match register bits 31:24
RTC
76
MATCHREG4
Match register bits 39:32
RTC
80
MATCHBITS0
Individual match bits 7:0
RTC
81
MATCHBITS1
Individual match bits 15:8
RTC
82
MATCHBITS2
Individual match bits 23:16
RTC
83
MATCHBITS3
Individual match bits 31:24
RTC
84
MATCHBITS4
Individual match bits 39:32
RTC
88
CTRL_STAT
Control (write) / Status (read)
register bits 7:0
RTC
89
TEST_REG
Test register(s)
RTC
Note: ACMADDR bytes 1 to 40 pertain to the Analog Quads; bytes 64 to 89 pertain to the RTC.
ACM Characteristics1
ACMCLK
tSUEACM
tHEACM
ACMWEN
tSUDACM
ACMWDATA
D0
tSUAACM
ACMADDRESS
tHDACM
D1
tHAACM
A0
A1
Figure 2-89 • ACM Write Waveform
tMPWCLKACM
ACMCLK
ACMADDRESS
A0
A1
tCLKQACM
ACMRDATA
RD0
RD1
Figure 2-90 • ACM Read Waveform
1. When addressing the RTC addresses (i.e., ACMADDR 64 to 89), there is no timing generator, and the
rc_osc, byte_en, and aq_wen signals have no impact.
Pr e li m i n a ry v1 . 7
2 -125
Device Architecture
Timing Characteristics
Table 2-52 • Analog Configuration Multiplexer (ACM) Timing
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V
Parameter
Description
–2
–1
Std.
Units
tCLKQACM
Clock-to-Q of the ACM
19.73
22.48
26.42
ns
tSUDACM
Data Setup time for the ACM
4.39
5.00
5.88
ns
tHDACM
Data Hold time for the ACM
0.00
0.00
0.00
ns
tSUAACM
Address Setup time for the ACM
4.73
5.38
6.33
ns
tHAACM
Address Hold time for the ACM
0.00
0.00
0.00
ns
tSUEACM
Enable Setup time for the ACM
3.93
4.48
5.27
ns
tHEACM
Enable Hold time for the ACM
0.00
0.00
0.00
ns
tMPWARACM
Asynchronous Reset Minimum Pulse Width for the
ACM
10.00
10.00
10.00
ns
tREMARACM
Asynchronous Reset Removal time for the ACM
12.98
14.79
17.38
ns
tRECARACM
Asynchronous Reset Recovery time for the ACM
12.98
14.79
17.38
ns
tMPWCLKACM
Clock Minimum Pulse Width for the ACM
45.00
45.00
45.00
ns
tFMAXCLKACM
lock Maximum Frequency for the ACM
10.00
10.00
10.00
MHz
2 -1 2 6
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
Analog Quad ACM Description
Table 2-53 maps out the ACM space associated with configuration of the Analog Quads within the
Analog Block. Table 2-53 shows the byte assignment within each quad and the function of each bit
within each byte. Subsequent tables will explain each bit setting and how it corresponds to a
particular configuration. After 3.3 V and 1.5 V are applied to Fusion, Analog Quad configuration
registers are loaded with default settings until the initialization and configuration state machine
changes them to user-defined settings.
Table 2-53 • Analog Quad ACM Byte Assignment
Byte
Bit
Signal (Bx)
Function
Byte 0
0
B0[0]
Scaling factor control – prescaler
Highest voltage range
(AV)
1
B0[1]
2
B0[2]
3
B0[3]
Analog MUX select
Prescaler
4
B0[4]
Current monitor switch
Off
5
B0[5]
Direct analog input switch
Off
6
B0[6]
Selects V-pad polarity
Positive
7
B0[7]
Prescaler op amp mode
Power-down
Byte 1
0
B1[0]
Scaling factor control – prescaler
Highest voltage range
(AC)
1
B1[1]
2
B1[2]
3
B1[3]
Analog MUX select
Prescaler
4
B1[4]
5
B1[5]
Direct analog input switch
Off
6
B1[6]
Selects C-pad polarity
Positive
7
B1[7]
Prescaler op amp mode
Power-down
0
B2[0]
Internal
monitor
1
B2[1]
Spare
–
2
B2[2]
Current drive control
Lowest current
3
B2[3]
4
B2[4]
Spare
–
5
B2[5]
Spare
–
6
B2[6]
Selects G-pad polarity
Positive
7
B2[7]
Selects low/high drive
Low drive
Byte 3
0
B3[0]
Scaling factor control – prescaler
Highest voltage range
(AT)
1
B3[1]
2
B3[2]
3
B3[3]
Analog MUX select
Prescaler
4
B3[4]
5
B3[5]
Direct analog input switch
Off
6
B3[6]
–
–
7
B3[7]
Prescaler op amp mode
Power-down
Byte 2
(AG)
chip
Pr e li m i n a ry v1 . 7
Default Setting
temperature Off
2 -127
Device Architecture
Table 2-54 details the settings available to control the prescaler values of the AV, AC, and AT pins.
Note that the AT pin has a reduced number of available prescaler values.
Table 2-54 • Prescaler Control Truth Table—AV (x = 0), AC (x = 1), and AT (x = 3)
Control Lines
Bx[2:0]
Scaling Factor, LSB for an 8-Bit LSB for a 10-Bit LSB for a 12-Bit
Conversion2
Conversion2
Pad to ADC
Conversion2
(mV)
(mV)
(mV)
Input
Full-Scale
Voltage
Range
Name
000 1
0.15625
64
16
4
16.368 V
16 V
001
0.3125
32
8
2
8.184 V
8V
0.625
16
4
1
4.092 V
4V
011
1.25
8
2
0.5
2.046 V
2V
100
2.5
4
1
0.25
1.023 V
1V
101
5.0
2
0.5
0.125
0.5115 V
0.5 V
110
10.0
1
0.25
0.0625
0.25575 V
0.25 V
111
20.0
0.5
0.125
0.03125
0.127875 V
0.125 V
010
1
Notes:
1. These are the only valid ranges for the Temperature Monitor Block Prescaler.
2. LSB voltage equivalences assume VAREF = 2.56 V.
Table 2-55 details the settings available to control the MUX within each of the AV, AC, and AT
circuits. This MUX determines whether the signal routed to the ADC is the direct analog input,
prescaled signal, or output of either the Current Monitor Block or the Temperature Monitor Block.
Table 2-55 • Analog Multiplexer Truth Table—AV (x = 0), AC (x = 1), and AT (x = 3)
Control Lines Bx[4]
Control Lines Bx[3]
ADC Connected To
0
0
Prescaler
0
1
Direct input
1
0
Current amplifier temperature monitor
1
1
Not valid
Table 2-56 details the settings available to control the Direct Analog Input switch for the AV, AC,
and AT pins.
Table 2-56 • Direct Analog Input Switch Control Truth Table—AV (x = 0), AC (x = 1), and AT (x = 3)
Control Lines Bx[5]
Direct Input Switch
0
Off
1
On
Table 2-57 details the settings available to control the polarity of the signals coming to the AV, AC,
and AT pins. Note that the only valid setting for the AT pin is logic 0 to support positive voltages.
Table 2-57 • Voltage Polarity Control Truth Table—AV (x = 0), AC (x = 1), and AT (x = 3)*
Control Lines Bx[6]
Input Signal Polarity
0
Positive
1
Negative
Note: *The B3[6] signal for the AT pad should be kept at logic 0 to accept only positive voltages.
2 -1 2 8
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
Table 2-58 details the settings available to either power down or enable the prescaler associated
with the analog inputs AV, AC, and AT.
Table 2-58 • Prescaler Op Amp Power-Down Truth Table—AV (x = 0), AC (x = 1), and AT (x = 3)
Control Lines Bx[7]
Prescaler Op Amp
0
Power-down
1
Operational
Table 2-59 details the settings available to enable the Current Monitor Block associated with the AC
pin.
Table 2-59 • Current Monitor Input Switch Control Truth Table—AV (x = 0)
Control Lines B0[4]
Current Monitor Input Switch
0
Off
1
On
Table 2-60 details the settings available to configure the drive strength of the gate drive when not
in high-drive mode.
Table 2-60 • Low-Drive Gate Driver Current Truth Table (AG)
Control Lines B2[3]
Control Lines B2[2]
Current (µA)
0
0
1
0
1
3
1
0
10
1
1
30
Table 2-61 details the settings available to set the polarity of the gate driver (either p-channel- or
n-channel-type devices).
Table 2-61 • Gate Driver Polarity Truth Table (AG)
Control Lines B2[6]
Gate Driver Polarity
0
Positive
1
Negative
Table 2-62 details the settings available to turn on the Gate Driver and set whether high-drive
mode is on or off.
Table 2-62 • Gate Driver Control Truth Table (AG)
Control Lines B2[7]
GDON
Gate Driver
0
0
Off
0
1
Low drive on
1
0
Off
1
1
High drive on
Table 2-63 details the settings available to turn on and off the chip internal temperature monitor.
Table 2-63 • Internal Temperature Monitor Control Truth Table
Control Lines B2[0]
PDTMB
Chip Internal Temperature Monitor
0
0
Off
1
1
On
Pr e li m i n a ry v1 . 7
2 -129
Device Architecture
User I/Os
Introduction
Fusion devices feature a flexible I/O structure, supporting a range of mixed voltages (1.5 V, 1.8 V,
2.5 V, and 3.3 V) through a bank-selectable voltage. Table 2-65, Table 2-66, Table 2-67, and
Table 2-68 on page 2-133 show the voltages and the compatible I/O standards. I/Os provide
programmable slew rates, drive strengths, weak pull-up, and weak pull-down circuits. 3.3 V PCI and
3.3 V PCI-X are 5 V–tolerant. See the "5 V Input Tolerance" section on page 2-143 for possible
implementations of 5 V tolerance.
All I/Os are in a known state during power-up, and any power-up sequence is allowed without
current impact. Refer to the "I/O Power-Up and Supply Voltage Thresholds for Power-On Reset
(Commercial and Industrial)" section on page 3-5 for more information. In low power standby or
sleep mode (VCC is OFF, VCC33A is ON, VCCI is ON) or when the resource is not used, digital inputs are
tristated, digital outputs are tristated, and digital bibufs (input/output) are tristated.
I/O Tile
The Fusion I/O tile provides a flexible, programmable structure for implementing a large number of
I/O standards. In addition, the registers available in the I/O tile in selected I/O banks can be used to
support high-performance register inputs and outputs, with register enable if desired (Figure 2-91
on page 2-131). The registers can also be used to support the JESD-79C DDR standard within the I/O
structure (see the "Double Data Rate (DDR) Support" section on page 2-137 for more information).
As depicted in Figure 2-92 on page 2-136, all I/O registers share one CLR port. The output register
and output enable register share one CLK port. Refer to the "I/O Registers" section on page 2-136
for more information.
I/O Banks and I/O Standards Compatibility
The digital I/Os are grouped into I/O voltage banks. There are three digital I/O banks on the AFS090
and AFS250 devices and four digital I/O banks on the AFS600 and AFS1500 devices. Figure 2-105 on
page 2-158 and Figure 2-106 on page 2-158 show the bank configuration by device. The north side
of the I/O in the AFS600 and AFS1500 devices comprises two banks of Actel Pro I/Os. The Actel Pro
I/Os support a wide number of voltage-referenced I/O standards in addition to the multitude of
single-ended and differential I/O standards common throughout all Actel digital I/Os. Each I/O
voltage bank has dedicated I/O supply and ground voltages (VCCI/GNDQ for input buffers and
VCCI/GND for output buffers). Because of these dedicated supplies, only I/Os with compatible
standards can be assigned to the same I/O voltage bank. Table 2-66 and Table 2-67 on page 2-132
show the required voltage compatibility values for each of these voltages.
For more information about I/O and global assignments to I/O banks, refer to the specific pin table
of the device in the "Package Pin Assignments" section on page 4-1 and the "User I/O Naming
Convention" section on page 2-157.
Each Pro I/O bank is divided into minibanks. Any user I/O in a VREF minibank (a minibank is the
region of scope of a VREF pin) can be configured as a VREF pin (Figure 2-91 on page 2-131). Only one
VREF pin is needed to control the entire VREF minibank. The location and scope of the VREF
minibanks can be determined by the I/O name. For details, see the "User I/O Naming Convention"
section on page 2-157.
Table 2-67 on page 2-132 shows the I/O standards supported by Fusion devices and the
corresponding voltage levels.
I/O standards are compatible if the following are true:
2 -1 3 0
•
Their VCCI values are identical.
•
If both of the standards need a VREF, their VREF values must be identical (Pro I/O only).
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
Bank 0
CCC
Bank 1
CCC
Up to five VREF
minibanks within
an I/O bank
CCC
Common VREF
signal for all I/Os
in VREF minibanks
VREF signal scope is
between 8 and 18 I/Os.
I/O
I/O
VCCI
GND
VCC
I/O
I/O
I/O
I/O
VCCI
GND
VCC
I/O
I/O
If needed, the VREF for a given
minibank can be provided by
any I/O within the minibank.
I/O Pad
Figure 2-91 • Fusion Pro I/O Bank Detail Showing VREF Minibanks (north side of AFS600 and AFS1500)
Table 2-64 • I/O Standards Supported by Bank Type
I/O Bank
Standard I/O
Differential I/O
Standards
Single-Ended I/O Standards
Voltage-Referenced
HotSwap
LVTTL/LVCMOS 3.3 V, LVCMOS –
2.5 V / 1.8 V / 1.5 V, LVCMOS
2.5/5.0 V
–
Yes
Advanced I/O LVTTL/LVCMOS 3.3 V, LVCMOS LVPECL and LVDS
2.5 V / 1.8 V / 1.5 V, LVCMOS
2.5/5.0 V, 3.3 V PCI / 3.3 V PCI-X
–
–
Pro I/O
GTL+ 2.5 V / 3.3 V, GTL 2.5 V / 3.3 V,
HSTL Class I and II, SSTL2 Class I and
II, SSTL3 Class I and II
LVTTL/LVCMOS 3.3 V, LVCMOS LVPECL and LVDS
2.5 V / 1.8 V / 1.5 V, LVCMOS
2.5/5.0 V, 3.3 V PCI / 3.3 V PCI-X
Pr e li m i n a ry v1 . 7
Yes
2 -131
Device Architecture
Table 2-65 • I/O Bank Support by Device
I/O Bank
AFS090
AFS250
AFS600
AFS1500
Standard I/O
N
N
–
–
Advanced I/O
E, W
E, W
E, W
E, W
Pro I/O
–
–
N
N
Analog Quad
S
S
S
S
Note: E = East side of the device
W = West side of the device
N = North side of the device
S = South side of the device
Table 2-66 • Fusion VCCI Voltages and Compatible Standards
VCCI (typical)
Compatible Standards
3.3 V
LVTTL/LVCMOS 3.3, PCI 3.3, SSTL3 (Class I and II),* GTL+ 3.3, GTL 3.3,* LVPECL
2.5 V
LVCMOS 2.5, LVCMOS 2.5/5.0, SSTL2 (Class I and II),* GTL+ 2.5,* GTL 2.5,* LVDS, BLVDS, M-LVDS
1.8 V
LVCMOS 1.8
1.5 V
LVCMOS 1.5, HSTL (Class I),* HSTL (Class II)*
Note: *I/O standard supported by Pro I/O banks.
Table 2-67 • Fusion VREF Voltages and Compatible Standards*
VREF (typical)
Compatible Standards
1.5 V
SSTL3 (Class I and II)
1.25 V
SSTL2 (Class I and II)
1.0 V
GTL+ 2.5, GTL+ 3.3
0.8 V
GTL 2.5, GTL 3.3
0.75 V
HSTL (Class I), HSTL (Class II)
Note: *I/O standards supported by Pro I/O banks.
2 -1 3 2
Pr e li m i n a ry v1 . 7
3.3 V
2.5 V
1.8 V
–
1.5 V
–
Pr e li m i n a ry v1 . 7
LVPECL (3.3 V)
LVDS (2.5 V ± 5%)
SSTL3 Class I and II (3.3 V)
SSTL2 Class I and II (2.5 V)
HSTL Class I and II (1.5 V)
GTL (2.5 V)
GTL (3.3 V)
GTL + (2.5 V)
GTL + (3.3 V)
3.3 V PCI / PCI-X
LVCMOS 1.5 V
LVCMOS 1.8 V
LVCMOS 2.5 V
LVTTL/LVCMOS 3.3 V
Minibank Voltage (typical)
I/O Bank Voltage (typical)
Actel Fusion Mixed-Signal FPGAs
Table 2-68 • Fusion Standard and Advanced I/O Features
–
0.80 V
1.00 V
1.50 V
–
0.80 V
1.00 V
1.25 V
0.75 V
Note: White box: Allowable I/O standard combinations
Gray box: Illegal I/O standard combinations
2 -133
Device Architecture
Features Supported on Pro I/Os
Table 2-69 lists all features supported by transmitter/receiver for single-ended and differential
I/Os.
Table 2-69 • Fusion Pro I/O Features
Feature
Description
Single-ended and voltage- •
referenced transmitter
features
•
Weak pull-up and pull-down
•
Two slew rates
•
Skew between output buffer enable/disable time: 2 ns delay (rising edge)
and 0 ns delay (falling edge); see "Selectable Skew between Output Buffer
Enable/Disable Time" on page 2-148 for more information
•
Five drive strengths
•
5 V–tolerant receiver ("5 V Input Tolerance" section on page 2-143)
•
LVTTL/LVCMOS 3.3 V outputs compatible with 5 V TTL inputs ("5 V Output
Tolerance" section on page 2-146)
•
High performance (Table 2-73 on page 2-141)
Schmitt trigger option
•
ESD protection
•
Programmable delay: 0 ns if bypassed, 0.625 ns with '000' setting, 6.575 ns
with '111' setting, 0.85-ns intermediate delay increments (at 25°C, 1.5 V)
•
High performance (Table 2-73 on page 2-141)
•
Separate ground planes, GND/GNDQ, for input buffers only to avoid
output-induced noise in the input circuitry
•
Programmable Delay: 0 ns if bypassed, 0.625 ns with '000' setting, 6.575 ns
with '111' setting, 0.85-ns intermediate delay increments (at 25°C, 1.5 V)
•
High performance (Table 2-73 on page 2-141)
•
Separate ground planes, GND/GNDQ, for input buffers only to avoid
output-induced noise in the input circuitry
BLVDS, •
Two I/Os and external resistors are used to provide a CMOS-style LVDS,
BLVDS, M-LVDS, or LVPECL transmitter solution.
•
Activation of hot insertion (disabling the clamp diode) is selectable by I/Os.
•
Weak pull-up and pull-down
•
Fast slew rate
•
ESD protection
•
High performance (Table 2-73 on page 2-141)
•
Programmable delay: 0.625 ns with '000' setting, 6.575 ns with '111'
setting, 0.85-ns intermediate delay increments (at 25°C, 1.5 V)
•
Separate input buffer ground and power planes to avoid output-induced
noise in the input circuitry
Voltage-referenced
differential receiver features
LVDS/LVPECL differential
receiver features
2 -1 3 4
Activation of hot insertion (disabling the clamp diode) is selectable by I/Os.
•
Single-ended receiver features •
CMOS-style
LVDS,
M-LVDS, or LVPECL
transmitter
Hot insertion in every mode except PCI or 5 V input tolerant (these modes
use clamp diodes and do not allow hot insertion)
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
Table 2-70 • Maximum I/O Frequency for Single-Ended, Voltage-Referenced, and Differential I/Os;
All I/O Bank Types (maximum drive strength and high slew selected)
Specification
Performance Up To
LVTTL/LVCMOS 3.3 V
200 MHz
LVCMOS 2.5 V
250 MHz
LVCMOS 1.8 V
200 MHz
LVCMOS 1.5 V
130 MHz
PCI
200 MHz
PCI-X
200 MHz
HSTL-I
300 MHz
HSTL-II
300 MHz
SSTL2-I
300 MHz
SSTL2-II
300 MHz
SSTL3-I
300 MHz
SSTL3-II
300 MHz
GTL+ 3.3 V
300 MHz
GTL+ 2.5 V
300 MHz
GTL 3.3 V
300 MHz
GTL 2.5 V
300 MHz
LVDS
350 MHz
LVPECL
300 MHz
Pr e li m i n a ry v1 . 7
2 -135
Device Architecture
I/O Registers
Each I/O module contains several input, output, and enable registers. Refer to Figure 2-92 for a
simplified representation of the I/O block.
The number of input registers is selected by a set of switches (not shown in Figure 2-92) between
registers to implement single or differential data transmission to and from the FPGA core. The
Designer software sets these switches for the user.
A common CLR/PRE signal is employed by all I/O registers when I/O register combining is used.
Input register 2 does not have a CLR/PRE pin, as this register is used for DDR implementation. The
I/O register combining must satisfy some rules.
1
Input
Reg
I/O / Q0
2
Input
Reg
Y
Pull-Up/Down
Resistor Control
CLR/PRE
To FPGA Core
I/O / Q1
ICE
3
Input
Reg
PAD
CLR/PRE
I/O / ICLK
Signal Drive Strength
and Slew-Rate Control
A
I/O / D0
E = Enable Pin
4
OCE Output
Reg
From FPGA Core
CLR/PRE
I/O / D1 / ICE
ICE
5
Output
Reg
CLR/PRE
I/O / OCLK
I/O / OE
OCE
6
Output
Enable
Reg
CLR/PRE
I/O / CLR or I/O / PRE / OCE
Note: Fusion I/Os have registers to support DDR functionality (see the "Double Data Rate (DDR) Support" section
on page 2-137 for more information).
Figure 2-92 • I/O Block Logical Representation
2 -1 3 6
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
Double Data Rate (DDR) Support
Fusion Pro I/Os support 350 MHz DDR inputs and outputs. In DDR mode, new data is present on
every transition of the clock signal. Clock and data lines have identical bandwidths and signal
integrity requirements, making it very efficient for implementing very high-speed systems.
DDR interfaces can be implemented using HSTL, SSTL, LVDS, and LVPECL I/O standards. In addition,
high-speed DDR interfaces can be implemented using LVDS I/O.
Input Support for DDR
The basic structure to support a DDR input is shown in Figure 2-93. Three input registers are used to
capture incoming data, which is presented to the core on each rising edge of the I/O register clock.
Each I/O tile on Fusion devices supports DDR inputs.
Output Support for DDR
The basic DDR output structure is shown in Figure 2-94 on page 2-138. New data is presented to
the output every half clock cycle. Note: DDR macros and I/O registers do not require additional
routing. The combiner automatically recognizes the DDR macro and pushes its registers to the I/O
register area at the edge of the chip. The routing delay from the I/O registers to the I/O buffers is
already taken into account in the DDR macro.
Refer to the Actel application note Using DDR for Fusion Devices for more information.
Input DDR
A
D
Data
INBUF
FF1
E
B
CLK
Out_QF
(to core)
CLKBUF
Out_QR
(to core)
FF2
C
CLR
INBUF
DDR_IN
Figure 2-93 • DDR Input Register Support in Fusion Devices
Pr e li m i n a ry v1 . 7
2 -137
Device Architecture
Data_F
(from core)
A
FF1
B
CLK
CLKBUF
0
E
C
D
Data_R
Out
1
(from core)
FF2
B
CLR
INBUF
C
DDR_OUT
Figure 2-94 • DDR Output Support in Fusion Devices
2 -1 3 8
Pr e li m i n a ry v1 . 7
OUTBUF
Actel Fusion Mixed-Signal FPGAs
Hot-Swap Support
Hot-swapping (also called hot plugging) is the operation of hot insertion or hot removal of a card
in (or from) a powered-up system. The levels of hot-swap support and examples of related
applications are described in Table 2-71. The I/Os also need to be configured in hot insertion mode
if hot plugging compliance is required.
Table 2-71 • Levels of Hot-Swap Support
Device
Example of
Card
Circuitry
Application with
Ground
Connected Cards that Contain
Connection to Bus Pins
Fusion Devices
Hot
Power
Swapping
Applied
Level
Description to Device Bus State
1
Cold-swap
No
–
2
Hot-swap
while reset
Yes
3
Hot-swap
while bus
idle
4
Hot-swap
on an active
bus
–
Compliance of
Fusion Devices
–
System and card
with Actel FPGA chip
are powered down,
then card gets
plugged into system,
then power supplies
are turned on for
system but not for
FPGA on card.
Compliant I/Os
can but do not
have to be set to
hot insertion
mode.
Held in
Must be
reset state made and
maintained
for 1 ms
before,
during, and
after
insertion/
removal
–
In PCI hot plug
specification, reset
control circuitry
isolates the card
busses until the card
supplies are at their
nominal operating
levels and stable.
Compliant I/Os
can but do not
have to be set to
hot insertion
mode.
Yes
Held idle Same as Level
(no
2
ongoing
I/O
processes
during
insertion/re
moval)
Must
remain
glitch-free
during
power-up
or powerdown
Board bus shared
with card bus is
"frozen," and there
is no toggling
activity on bus. It is
critical that the logic
states set on the bus
signal do not get
disturbed during
card
insertion/removal.
Compliant with
cards with two
levels of
staging. I/Os
have to be set to
hot insertion
mode.
Yes
Same as Level Same as
Bus may
Level 3
have active 2
I/O
processes
ongoing,
but device
being
inserted or
removed
must be
idle.
There is activity on
the system bus, and
it is critical that the
logic states set on
the bus signal do not
get disturbed during
card
insertion/removal.
Compliant with
cards with two
levels of
staging. I/Os
have to be set to
hot insertion
mode.
Pr e li m i n a ry v1 . 7
2 -139
Device Architecture
For Fusion devices requiring Level 3 and/or Level 4 compliance, the board drivers connected to
Fusion I/Os need to have 10 kΩ (or lower) output drive resistance at hot insertion, and 1 kΩ (or
lower) output drive resistance at hot removal. This is the resistance of the transmitter sending a
signal to the Fusion I/O, and no additional resistance is needed on the board. If that cannot be
assured, three levels of staging can be used to meet Level 3 and/or Level 4 compliance. Cards with
two levels of staging should have the following sequence:
1. Grounds
2. Powers, I/Os, other pins
Cold-Sparing Support
Cold-sparing means that a subsystem with no power applied (usually a circuit board) is electrically
connected to the system that is in operation. This means that all input buffers of the subsystem
must present very high input impedance with no power applied so as not to disturb the operating
portion of the system.
Pro I/O banks and standard I/O banks fully support cold-sparing.
For Pro I/O banks, standards such as PCI that require I/O clamp diodes, can also achieve cold-sparing
compliance, since clamp diodes get disconnected internally when the supplies are at 0 V.
For Advanced I/O banks, since the I/O clamp diode is always active, cold-sparing can be
accomplished either by employing a bus switch to isolate the device I/Os from the rest of the system
or by driving each advanced I/O pin to 0 V.
If Standard I/O banks are used in applications requiring cold-sparing, a discharge path from the
power supply to ground should be provided. This can be done with a discharge resistor or a
switched resistor. This is necessary because the standard I/O buffers do not have built-in I/O clamp
diodes.
If a resistor is chosen, the resistor value must be calculated based on decoupling capacitance on a
given power supply on the board (this decoupling capacitor is in parallel with the resistor). The RC
time constant should ensure full discharge of supplies before cold-sparing functionality is required.
The resistor is necessary to ensure that the power pins are discharged to ground every time there is
an interruption of power to the device.
I/O cold-sparing may add additional current if the pin is configured with either a pull-up or pull
down resistor and driven in the opposite direction. A small static current is induced on each IO pin
when the pin is driven to a voltage opposite to the weak pull resistor. The current is equal to the
voltage drop across the input pin divided by the pull resistor. Please refer to Table 2-92 on
page 2-169, Table 2-93 on page 2-169, and Table 2-94 on page 2-171 for the specific pull resistor
value for the corresponding I/O standard.
For example, assuming an LVTTL 3.3 V input pin is configured with a weak Pull-up resistor, a current
will flow through the pull-up resistor if the input pin is driven low. For an LVTTL 3.3 V, pull-up
resistor is ~45 kΩ and the resulting current is equal to 3.3 V / 45 kΩ = 73 µA for the I/O pin. This is
true also when a weak pull-down is chosen and the input pin is driven high. Avoiding this current
can be done by driving the input low when a weak pull-down resistor is used, and driving it high
when a weak pull-up resistor is used.
In Active and Static modes, this current draw can occur in the following cases:
2 -1 4 0
•
Input buffers with pull-up, driven low
•
Input buffers with pull-down, driven high
•
Bidirectional buffers with pull-up, driven low
•
Bidirectional buffers with pull-down, driven high
•
Output buffers with pull-up, driven low
•
Output buffers with pull-down, driven high
•
Tristate buffers with pull-up, driven low
•
Tristate buffers with pull-down, driven high
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
Electrostatic Discharge (ESD) Protection
Fusion devices are tested per JEDEC Standard JESD22-A114-B.
Fusion devices contain clamp diodes at every I/O, global, and power pad. Clamp diodes protect all
device pads against damage from ESD as well as from excessive voltage transients.
Each I/O has two clamp diodes. One diode has its positive (P) side connected to the pad and its
negative (N) side connected to VCCI. The second diode has its P side connected to GND and its N side
connected to the pad. During operation, these diodes are normally biased in the Off state, except
when transient voltage is significantly above VCCI or below GND levels.
By selecting the appropriate I/O configuration, the diode is turned on or off. Refer to Table 2-72 on
page 2-141 and Table 2-73 on page 2-141 for more information about I/O standards and the clamp
diode.
The second diode is always connected to the pad, regardless of the I/O configuration selected.
Table 2-72 • Fusion Standard and Advanced I/O – Hot-Swap and 5 V Input Tolerance Capabilities
Clamp Diode
Hot Insertion
5 V Input Tolerance1
Standard Advanced Standard Advanced Standard Advanced
I/O
I/O
I/O
I/O
I/O
I/O
I/O Assignment
3.3 V LVTTL/LVCMOS
No
Yes
Yes
No
Input
Buffer
Output
Buffer
Yes1
Yes1
Enabled/Disabled
1
Enabled/Disabled
3.3 V PCI, 3.3 V PCI-X
N/A
Yes
N/A
No
N/A
Yes
LVCMOS 2.5 V
No
Yes
Yes
No
Yes1
Yes2
Enabled/Disabled
1
Yes2
Enabled/Disabled
No
Enabled/Disabled
LVCMOS 2.5 V / 5.0 V
No
Yes
Yes
No
Yes
LVCMOS 1.8 V
No
Yes
Yes
No
No
LVCMOS 1.5 V
No
Yes
Yes
No
No
No
Enabled/Disabled
Differential,
LVDS/BLVDS/M-LVDS/
LVPECL 3
N/A
Yes
N/A
No
N/A
No
Enabled/Disabled
Notes:
1. Can be implemented with an external IDT bus switch, resistor divider, or Zener with resistor.
2. Can be implemented with an external resistor and an internal clamp diode.
3. Bidirectional LVPECL buffers are not supported. I/Os can be configured as either input buffers or output buffers.
Table 2-73 • Fusion Pro I/O – Hot-Swap and 5 V Input Tolerance Capabilities
Clamp
Diode
I/O Assignment
Hot
Insertion
5 V Input
Tolerance
1
Input Buffer
Output Buffer
3.3 V LVTTL/LVCMOS
No
Yes
Yes
Enabled/Disabled
3.3 V PCI, 3.3 V PCI-X
Yes
No
Yes1
Enabled/Disabled
No
Yes
No
Enabled/Disabled
Yes
No
Yes2
Enabled/Disabled
LVCMOS 1.8 V
No
Yes
No
Enabled/Disabled
LVCMOS 1.5 V
No
Yes
No
Enabled/Disabled
Voltage-Referenced Input Buffer
No
Yes
No
Enabled/Disabled
LVCMOS 2.5 V
3
LVCMOS 2.5 V / 5.0 V
3
Pr e li m i n a ry v1 . 7
2 -141
Device Architecture
Table 2-73 • Fusion Pro I/O – Hot-Swap and 5 V Input Tolerance Capabilities
I/O Assignment
Differential, LVDS/BLVDS/M-LVDS/LVPECL4
Clamp
Diode
Hot
Insertion
5 V Input
Tolerance
No
Yes
No
Input Buffer
Output Buffer
Enabled/Disabled
Notes:
1. Can be implemented with an external IDT bus switch, resistor divider, or Zener with resistor.
2. Can be implemented with an external resistor and an internal clamp diode.
3. In the SmartGen, FlashROM, Flash Memory System Builder, and Analog System Builder User's Guide, select
the LVCMOS5 macro for the LVCMOS 2.5 V / 5.0 V I/O standard or the LVCMOS25 macro for the LVCMOS 2.5
V I/O standard.
4. Bidirectional LVPECL buffers are not supported. I/Os can be configured as either input buffers or output buffers.
2 -1 4 2
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
5 V Input Tolerance
I/Os can support 5 V input tolerance when LVTTL 3.3 V, LVCMOS 3.3 V, LVCMOS 2.5 V / 5 V, and
LVCMOS 2.5 V configurations are used (see Table 2-74 on page 2-146 for more details). There are
four recommended solutions (see Figure 2-95 to Figure 2-98 on page 2-146 for details of board and
macro setups) to achieve 5 V receiver tolerance. All the solutions meet a common requirement of
limiting the voltage at the input to 3.6 V or less. In fact, the I/O absolute maximum voltage rating is
3.6 V, and any voltage above 3.6 V may cause long-term gate oxide failures.
Solution 1
The board-level design needs to ensure that the reflected waveform at the pad does not exceed
the limits provided in Table 3-4 on page 3-4. This is a long-term reliability requirement.
This scheme will also work for a 3.3 V PCI / PCI-X configuration, but the internal diode should not
be used for clamping, and the voltage must be limited by the two external resistors, as explained
below. Relying on the diode clamping would create an excessive pad DC voltage of 3.3 V + 0.7 V =
4 V.
The following are some examples of possible resistor values (based on a simplified simulation
model with no line effects and 10 Ω transmitter output resistance, where Rtx_out_high = (VCCI –
VOH) / IOH, Rtx_out_low = VOL / IOL).
Example 1 (high speed, high current):
Rtx_out_high = Rtx_out_low = 10 Ω
R1 = 36 Ω (±5%), P(r1)min = 0.069 Ω
R2 = 82 Ω (±5%), P(r2)min = 0.158 Ω
Imax_tx = 5.5 V / (82 * 0.95 + 36 * 0.95 + 10) = 45.04 mA
tRISE = tFALL = 0.85 ns at C_pad_load = 10 pF (includes up to 25% safety margin)
tRISE = tFALL = 4 ns at C_pad_load = 50 pF (includes up to 25% safety margin)
Example 2 (low–medium speed, medium current):
Rtx_out_high = Rtx_out_low = 10 Ω
R1 = 220 Ω (±5%), P(r1)min = 0.018 Ω
R2 = 390 Ω (±5%), P(r2)min = 0.032 Ω
Imax_tx = 5.5 V / (220 * 0.95 + 390 * 0.95 + 10) = 9.17 mA
tRISE = tFALL = 4 ns at C_pad_load = 10 pF (includes up to 25% safety margin)
tRISE = tFALL = 20 ns at C_pad_load = 50 pF (includes up to 25% safety margin)
Other values of resistors are also allowed as long as the resistors are sized appropriately to limit the
voltage at the receiving end to 2.5 V < Vin(rx) < 3.6 V when the transmitter sends a logic 1. This
range of Vin_dc(rx) must be assured for any combination of transmitter supply (5 V ± 0.5 V),
transmitter output resistance, and board resistor tolerances.
Pr e li m i n a ry v1 . 7
2 -143
Device Architecture
Temporary overshoots are allowed according to Table 3-4 on page 3-4.
Solution 1
Fusion I/O Input
Off-Chip
On-Chip
3.3 V
5.5 V
Rext1
Rext2
Requires two board resistors,
LVCMOS 3.3 V I/Os
Figure 2-95 • Solution 1
Solution 2
The board-level design must ensure that the reflected waveform at the pad does not exceed limits
provided in Table 3-4 on page 3-4. This is a long-term reliability requirement.
This scheme will also work for a 3.3 V PCI/PCI-X configuration, but the internal diode should not be
used for clamping, and the voltage must be limited by the external resistors and Zener, as shown in
Figure 2-96. Relying on the diode clamping would create an excessive pad DC voltage of 3.3 V + 0.7
V = 4 V.
Solution 2
Fusion I/O Input
Off-Chip
On-Chip
3.3 V
5.5 V
Rext1
Zener
3.3 V
Requires one board resistor, one
Zener 3.3 V diode, LVCMOS 3.3 V I/Os
Figure 2-96 • Solution 2
2 -1 4 4
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
Solution 3
The board-level design must ensure that the reflected waveform at the pad does not exceed limits
provided in Table 3-4 on page 3-4. This is a long-term reliability requirement.
This scheme will also work for a 3.3 V PCI/PCIX configuration, but the internal diode should not be
used for clamping, and the voltage must be limited by the bus switch, as shown in Figure 2-97.
Relying on the diode clamping would create an excessive pad DC voltage of 3.3 V + 0.7 V = 4 V.
Solution 3
Fusion I/O Input
Off-Chip
On-Chip
Bus
Switch
IDTQS32X23
3.3 V
5.5 V
5.5 V
Requires a bus switch on the board,
LVTTL/LVCMOS 3.3 V I/Os.
Figure 2-97 • Solution 3
Pr e li m i n a ry v1 . 7
2 -145
Device Architecture
Solution 4
Solution 4
Fusion I/O Input
Off-Chip
On-Chip
2.5 V On-Chip
Clamp
Diode
5.5 V
2.5 V
Rext1
Requires one board resistor.
Available for LVCMOS 2.5 V / 5.0 V.
Figure 2-98 • Solution 4
Table 2-74 • Comparison Table for 5 V–Compliant Receiver Scheme
Scheme
Board Components
1
Two resistors
2
Resistor and Zener 3.3 V
3
Bus switch
4
Minimum resistor
Speed
Low to
Current Limitations
high1
Medium
High
value2
Limited by transmitter's drive strength
N/A
Medium
R = 47 Ω at TJ = 70°C
Limited by transmitter's drive strength
Maximum diode current at 100% duty cycle, signal
constantly at '1'
R = 150 Ω at TJ = 85°C
52.7 mA at TJ =70°C / 10-year lifetime
R = 420 Ω at TJ = 100°C
16.5 mA at TJ = 85°C / 10-year lifetime
5.9 mA at TJ = 100°C / 10-year lifetime
For duty cycles other than 100%, the currents can be
increased by a factor = 1 / (duty cycle).
Example: 20% duty cycle at 70°C
Maximum current = (1 / 0.2) * 52.7 mA = 5 * 52.7 mA =
263.5 mA
Notes:
1. Speed and current consumption increase as the board resistance values decrease.
2. Resistor values ensure I/O diode long-term reliability.
5 V Output Tolerance
Fusion I/Os must be set to 3.3 V LVTTL or 3.3 V LVCMOS mode to reliably drive 5 V TTL receivers. It is
also critical that there be NO external I/O pull-up resistor to 5 V, since this resistor would pull the I/O
pad voltage beyond the 3.6 V absolute maximum value and consequently cause damage to the I/O.
When set to 3.3 V LVTTL or 3.3 V LVCMOS mode, Fusion I/Os can directly drive signals into 5 V TTL
receivers. In fact, VOL = 0.4 V and VOH = 2.4 V in both 3.3 V LVTTL and 3.3 V LVCMOS modes exceed
2 -1 4 6
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
the VIL = 0.8 V and VIH = 2 V level requirements of 5 V TTL receivers. Therefore, level '1' and level '0'
will be recognized correctly by 5 V TTL receivers.
Simultaneously Switching Outputs and PCB Layout
•
Simultaneously switching outputs (SSOs) can produce signal integrity problems on adjacent
signals that are not part of the SSO bus. Both inductive and capacitive coupling parasitics of
bond wires inside packages and of traces on PCBs will transfer noise from SSO busses onto
signals adjacent to those busses. Additionally, SSOs can produce ground bounce noise and
VCCI dip noise. These two noise types are caused by rapidly changing currents through GND
and VCCI package pin inductances during switching activities:
•
Ground bounce noise voltage = L(GND) * di/dt
•
VCCI dip noise voltage = L(VCCI) * di/dt
Any group of four or more input pins switching on the same clock edge is considered an SSO bus.
The shielding should be done both on the board and inside the package unless otherwise
described.
In-package shielding can be achieved in several ways; the required shielding will vary depending
on whether pins next to SSO bus are LVTTL/LVCMOS inputs, LVTTL/LVCMOS outputs, or
GTL/SSTL/HSTL/LVDS/LVPECL inputs and outputs. Board traces in the vicinity of the SSO bus have to
be adequately shielded from mutual coupling and inductive noise that can be generated by the
SSO bus. Also, noise generated by the SSO bus needs to be reduced inside the package.
PCBs perform an important function in feeding stable supply voltages to the IC and, at the same
time, maintaining signal integrity between devices.
Key issues that need to considered are as follows:
•
Power and ground plane design and decoupling network design
•
Transmission line reflections and terminations
Pr e li m i n a ry v1 . 7
2 -147
Device Architecture
Selectable Skew between Output Buffer Enable/Disable Time
The configurable skew block is used to delay the output buffer assertion (enable) without affecting
deassertion (disable) time.
Output Enable
(from FPGA core)
ENABLE (IN)
MUX
ENABLE (OUT)
Skew Circuit
I/O Output
Buffers
Skew Select
Figure 2-99 • Block Diagram of Output Enable Path
ENABLE (IN)
ENABLE (OUT)
Less than
0.1 ns
Less than
0.1 ns
Figure 2-100 • Timing Diagram (option1: bypasses skew circuit)
ENABLE (IN)
ENABLE (OUT)
1.2 ns
(typical)
Less than
0.1 ns
Figure 2-101 • Timing Diagram (option 2: enables skew circuit)
At the system level, the skew circuit can be used in applications where transmission activities on
bidirectional data lines need to be coordinated. This circuit, when selected, provides a timing
margin that can prevent bus contention and subsequent data loss or transmitter overstress due to
transmitter-to-transmitter current shorts. Figure 2-102 presents an example of the skew circuit
2 -1 4 8
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
implementation in a bidirectional communication system. Figure 2-103 shows how bus contention
is created, and Figure 2-104 on page 2-150 shows how it can be avoided with the skew circuit.
Transmitter
ENABLE/
DISABLE
Transmitter 1: Fusion I/O
Skew or
Bypass
Skew
EN(r1)
Routing
Delay (t1)
EN(b1)
Transmitter 2: Generic I/O
EN(b2)
Routing
Delay (t2)
ENABLE(t2)
ENABLE(t1)
Bidirectional Data Bus
Figure 2-102 • Example of Implementation of Skew Circuits in Bidirectional Transmission Systems Using Fusion
Devices
EN (b1)
EN (b2)
ENABLE (r1)
ENABLE (t1)
Transmitter 1: OFF
Transmitter 1: ON
Transmitter 1: OFF
ENABLE (t2)
Transmitter 2: ON
Transmitter 2: OFF
Bus
Contention
Figure 2-103 • Timing Diagram (bypasses skew circuit)
Pr e li m i n a ry v1 . 7
2 -149
Device Architecture
EN (b1)
EN (b2)
ENABLE (t1)
Transmitter 1: OFF
Transmitter 1: ON
Transmitter 1: OFF
ENABLE (t2)
Transmitter 2: ON
Transmitter 2: OFF
Result: No Bus Contention
Figure 2-104 • Timing Diagram (with skew circuit selected)
Weak Pull-Up and Weak Pull-Down Resistors
Fusion devices support optional weak pull-up and pull-down resistors for each I/O pin. When the
I/O is pulled up, it is connected to the VCCI of its corresponding I/O bank. When it is pulled down, it
is connected to GND. Refer to Table 2-94 on page 2-171 for more information.
Slew Rate Control and Drive Strength
Fusion devices support output slew rate control: high and low. The high slew rate option is
recommended to minimize the propagation delay. This high-speed option may introduce noise into
the system if appropriate signal integrity measures are not adopted. Selecting a low slew rate
reduces this kind of noise but adds some delays in the system. Low slew rate is recommended when
bus transients are expected. Drive strength should also be selected according to the design
requirements and noise immunity of the system.
The output slew rate and multiple drive strength controls are available in LVTTL/LVCMOS 3.3 V,
LVCMOS 2.5 V, LVCMOS 2.5 V / 5.0 V input, LVCMOS 1.8 V, and LVCMOS 1.5 V. All other I/O
standards have a high output slew rate by default.
For Fusion slew rate and drive strength specifications, refer to the appropriate I/O bank table:
•
Fusion Standard I/O (Table 2-75 on page 2-151)
•
Fusion Advanced I/O (Table 2-76 on page 2-151)
•
Fusion Pro I/O (Table 2-77 on page 2-151)
Table 2-79 on page 2-153 lists the default values for the above selectable I/O attributes as well as
those that are preset for each I/O standard.
2 -1 5 0
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
Refer to Table 2-75, Table 2-76, and Table 2-77 on page 2-151 for SLEW and OUT_DRIVE settings.
Table 2-78 on page 2-152 lists the I/O default attributes. Table 2-79 on page 2-153 lists the voltages
for the supported I/O standards.
Table 2-75 • Fusion Standard I/O Standards—OUT_DRIVE Settings
OUT_DRIVE (mA)
I/O Standards
2
4
6
8
Slew
LVTTL/LVCMOS 3.3 V
✓
✓
✓
✓
High
Low
LVCMOS 2.5 V
✓
✓
✓
✓
High
Low
LVCMOS 1.8 V
✓
✓
–
–
High
Low
LVCMOS 1.5 V
–
–
–
–
High
Low
Table 2-76 • Fusion Advanced I/O Standards—SLEW and OUT_DRIVE Settings
OUT_DRIVE (mA)
I/O Standards
2
4
6
8
12
16
Slew
LVTTL/LVCMOS 3.3 V
✓
✓
✓
✓
✓
✓
High
Low
LVCMOS 2.5 V
✓
✓
✓
✓
✓
–
High
Low
LVCMOS 1.8 V
✓
✓
✓
✓
–
–
High
Low
LVCMOS 1.5 V
✓
✓
–
–
–
–
High
Low
Table 2-77 • Fusion Pro I/O Standards—SLEW and OUT_DRIVE Settings
OUT_DRIVE (mA)
I/O Standards
2
4
6
8
12
16
24
LVTTL/LVCMOS 3.3 V
✓
✓
✓
✓
✓
✓
✓
High
Low
LVCMOS 2.5 V
✓
✓
✓
✓
✓
✓
✓
High
Low
LVCMOS 2.5 V/5.0 V
✓
✓
✓
✓
✓
✓
✓
High
Low
LVCMOS 1.8 V
✓
✓
✓
✓
✓
✓
–
High
Low
LVCMOS 1.5 V
✓
✓
✓
✓
✓
–
–
High
Low
Pr e li m i n a ry v1 . 7
Slew
2 -151
Device Architecture
SKEW (tribuf and bibuf only)
RES_PULL
OUT_LOAD (output only)
COMBINE_REGISTER
IN_DELAY (input only)
IN_DELAY_VAL (input only)
SCHMITT_TRIGGER (input only)
Table 2-78 • Fusion Pro I/O Default Attributes
Off
None
35 pF
–
Off
0
Off
Off
None
35 pF
–
Off
0
Off
Off
None
35 pF
–
Off
0
Off
Off
None
35 pF
–
Off
0
Off
LVCMOS 1.5 V
Off
None
35 pF
–
Off
0
Off
PCI (3.3 V)
Off
None
10 pF
–
Off
0
Off
PCI-X (3.3 V)
Off
None
10 pF
–
Off
0
Off
GTL+ (3.3 V)
Off
None
10 pF
–
Off
0
Off
GTL+ (2.5 V)
Off
None
10 pF
–
Off
0
Off
GTL (3.3 V)
Off
None
10 pF
–
Off
0
Off
GTL (2.5 V)
Off
None
10 pF
–
Off
0
Off
HSTL Class I
Off
None
20 pF
–
Off
0
Off
HSTL Class II
Off
None
20 pF
–
Off
0
Off
SSTL2
Class I and II
Off
None
30 pF
–
Off
0
Off
SSTL3
Class I and II
Off
None
30 pF
–
Off
0
Off
LVDS, BLVDS,
M-LVDS
Off
None
0 pF
–
Off
0
Off
LVPECL
Off
None
0 pF
–
Off
0
Off
I/O Standards
SLEW
(output only)
LVTTL/LVCMOS Refer to the following
3.3 V
tables for more
information:
LVCMOS 2.5 V
Table 2-75 on page 2-151
LVCMOS
Table 2-76 on page 2-151
2.5/5.0 V
Table 2-77 on page 2-151
LVCMOS 1.8 V
2 -1 5 2
OUT_DRIVE
(output only)
Refer to the following
tables for more
information:
Table 2-75 on page 2-151
Table 2-76 on page 2-151
Table 2-77 on page 2-151
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
Table 2-79 • Fusion Pro I/O Supported Standards and Corresponding VREF and VTT Voltages
Input/Output Supply
Voltage (VCCI_TYP)
Input Reference Voltage
(VREF_TYP)
Board Termination Voltage
(VTT_TYP)
LVTTL/LVCMOS 3.3 V
3.30 V
–
–
LVCMOS 2.5 V
2.50 V
–
–
LVCMOS 2.5 V / 5.0 V
Input
2.50 V
–
–
LVCMOS 1.8 V
1.80 V
–
–
LVCMOS 1.5 V
1.50 V
–
–
PCI 3.3 V
3.30 V
–
–
PCI-X 3.3 V
3.30 V
–
–
GTL+ 3.3 V
3.30 V
1.00 V
1.50 V
GTL+ 2.5 V
2.50 V
1.00 V
1.50 V
GTL 3.3 V
3.30 V
0.80 V
1.20 V
GTL 2.5 V
2.50 V
0.80 V
1.20 V
HSTL Class I
1.50 V
0.75 V
0.75 V
HSTL Class II
1.50 V
0.75 V
0.75 V
SSTL3 Class I
3.30 V
1.50 V
1.50 V
SSTL3 Class II
3.30 V
1.50 V
1.50 V
SSTL2 Class I
2.50 V
1.25 V
1.25 V
SSTL2 Class II
2.50 V
1.25 V
1.25 V
LVDS, BLVDS, M-LVDS
2.50 V
–
–
LVPECL
3.30 V
–
–
I/O Standard
Pr e li m i n a ry v1 . 7
2 -153
Device Architecture
I/O Software Support
In the Fusion development software, default settings have been defined for the various I/O
standards supported. Changes can be made to the default settings via the use of attributes;
however, not all I/O attributes are applicable for all I/O standards. Table 2-80 and Table 2-81 list the
valid I/O attributes that can be manipulated by the user for each I/O standard.
Single-ended I/O standards in Fusion support up to five different drive strengths.
Table 2-80 • Fusion Standard and Advanced I/O Attributes vs. I/O Standard Applications
I/O Standards
SLEW
SKEW
(output OUT_DRIVE (all macros
only) (output only) with OE)*
OUT_LOAD
RES_PULL (output only) COMBINE_REGISTER
LVTTL/LVCMOS 3.3 V
✓
✓
✓
✓
✓
✓
LVCMOS 2.5 V
✓
✓
✓
✓
✓
✓
LVCMOS 2.5/5.0 V
✓
✓
✓
✓
✓
✓
LVCMOS 1.8 V
✓
✓
✓
✓
✓
✓
LVCMOS 1.5 V
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
PCI (3.3 V)
PCI-X (3.3 V)
✓
✓
LVDS, BLVDS, M-LVDS
✓
✓
LVPECL
Note: *This does not apply to the north I/O bank on AFS090 and AFS250 devices.
HOT_SWAPPABLE
SCHMITT_TRIGGER (input only)
IN_DELAY_VAL (input only)
IN_DELAY (input only)
COMBINE_REGISTER
OUT_LOAD (output only)
RES_PULL
OUT_DRIVE (output only)
SLEW (output only)
I/O Standards
SKEW (all macros with OE)
Table 2-81 • Fusion Pro I/O Attributes vs. I/O Standard Applications
LVTTL/LVCMOS 3.3 V
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
LVCMOS 2.5 V
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
LVCMOS 2.5/5.0 V
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
LVCMOS 1.8 V
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
LVCMOS 1.5 V
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
3
✓
✓
✓
✓
3
✓
✓
✓
✓
3
✓
✓
PCI (3.3 V)
PCI-X (3.3 V)
GTL+ (3.3 V)
2 -1 5 4
✓
Pr e li m i n a ry v1 . 7
✓
Actel Fusion Mixed-Signal FPGAs
HOT_SWAPPABLE
SCHMITT_TRIGGER (input only)
IN_DELAY_VAL (input only)
IN_DELAY (input only)
COMBINE_REGISTER
OUT_LOAD (output only)
RES_PULL
SKEW (all macros with OE)
OUT_DRIVE (output only)
I/O Standards
SLEW (output only)
Table 2-81 • Fusion Pro I/O Attributes vs. I/O Standard Applications (continued)
GTL+ (2.5 V)
✓
✓
✓
✓
✓
✓
GTL (3.3 V)
✓
✓
✓
✓
✓
✓
GTL (2.5 V)
✓
✓
✓
✓
✓
✓
HSTL Class I
✓
✓
✓
✓
✓
✓
HSTL Class II
✓
✓
✓
✓
✓
✓
SSTL2 Class I and II
✓
✓
✓
✓
✓
✓
SSTL3 Class I and II
✓
✓
✓
✓
✓
✓
LVDS, BLVDS, M-LVDS
✓
✓
✓
✓
✓
✓
✓
✓
✓
LVPECL
Table 2-82 lists the default values for the above selectable I/O attributes as well as those that are
preset for each I/O standard. See Table 2-75, Table 2-76, and Table 2-77 on page 2-151 for SLEW and
OUT_DRIVE settings.
Pr e li m i n a ry v1 . 7
2 -155
Device Architecture
Refer to the following
tables for more
information:
Off
None
35 pF
–
Off
None
35 pF
–
LVCMOS 2.5/5.0 V
Table 2-75 on page 2-151
Table 2-75 on page 2-151
Off
None
35 pF
–
LVCMOS 1.8 V
Table 2-76 on page 2-151
Table 2-76 on page 2-151
Off
None
35 pF
–
LVCMOS 1.5 V
Table 2-77 on page 2-151
Table 2-77 on page 2-151
Off
None
35 pF
–
PCI (3.3 V)
Off
None
10 pF
–
PCI-X (3.3 V)
Off
None
10 pF
–
LVDS, BLVDS, M-LVDS
Off
None
–
–
LVPECL
Off
None
–
–
LVTTL/LVCMOS 3.3 V
LVCMOS 2.5 V
2 -1 5 6
SLEW (output only)
OUT_DRIVE (output only)
Pr e li m i n a ry v1 . 7
COMBINE_REGISTER
RES_PULL
Refer to the following
tables for more
information:
I/O Standards
OUT_LOAD (output only)
SKEW (tribuf and bibuf only)
Table 2-82 • I/O Default Attributes
Actel Fusion Mixed-Signal FPGAs
User I/O Naming Convention
Due to the comprehensive and flexible nature of Fusion device user I/Os, a naming scheme is used
to show the details of the I/O (Figure 2-105 on page 2-158 and Figure 2-106 on page 2-158). The
name identifies to which I/O bank it belongs, as well as the pairing and pin polarity for differential
I/Os.
I/O Nomenclature
= Gmn/IOuxwByVz
Gmn is only used for I/Os that also have CCC access—i.e., global pins.
G
= Global
m
= Global pin location associated with each CCC on the device: A (northwest corner), B (northeast corner), C
(east middle), D (southeast corner), E (southwest corner), and F (west middle).
n
= Global input MUX and pin number of the associated Global location m, either A0, A1, A2, B0, B1, B2, C0,
C1, or C2. Figure 2-22 on page 2-28 shows the three input pins per clock source MUX at CCC location m.
u
= I/O pair number in the bank, starting at 00 from the northwest I/O bank and proceeding in a clockwise
direction.
x
= P (Positive) or N (Negative) for differential pairs, or R (Regular – single-ended) for the I/Os that support
single-ended and voltage-referenced I/O standards only. U (Positive-LVDS only) or V (Negative-LVDS
only) restrict the I/O differential pair from being selected as an LVPECL pair.
w
= D (Differential Pair), P (Pair), or S (Single-Ended). D (Differential Pair) if both members of the pair are
bonded out to adjacent pins or are separated only by one GND or NC pin; P (Pair) if both members of the
pair are bonded out but do not meet the adjacency requirement; or S (Single-Ended) if the I/O pair is not
bonded out. For Differential (D) pairs, adjacency for ball grid packages means only vertical or horizontal.
Diagonal adjacency does not meet the requirements for a true differential pair.
B
= Bank
y
= Bank number (0–3). The Bank number starts at 0 from the northwest I/O bank and proceeds in a
clockwise direction.
V
= Reference voltage
z
= Minibank number
Pr e li m i n a ry v1 . 7
2 -157
Device Architecture
Standard I/O Bank
CCC
"B"
Bank 0
Bank 3
Bank 1
AFS090
AFS250
CCC/PLL
"F"
CCC
"C"
Bank 3
Bank 1
CCC
"E"
Bank 2 (analog)
Advanced I/O Bank
Advanced I/O Bank
CCC
"A"
CCC
"D"
Analog Quads
Figure 2-105 • Naming Conventions of Fusion Devices with Three Digital I/O Banks
Pro I/O Bank
Bank 0
Bank 1
Bank 4
CCC/PLL
"F"
Bank 2
AFS600
AFS1500
Bank 4
CCC
"E"
CCC
"B"
CCC/PLL
"C"
Bank 2
Bank 3 (analog)
CCC
"D"
Analog Quads
Figure 2-106 • Naming Conventions of Fusion Devices with Four I/O Banks
2 -1 5 8
Pr e li m i n a ry v1 . 7
Advnaced I/O Bank
Advanced I/O Bank
CCC
"A"
Actel Fusion Mixed-Signal FPGAs
User I/O Characteristics
Timing Model
I/O Module
(Non-Registered)
Combinational Cell
Combinational Cell
Y
Y
tPD = 0.56 ns
tPD = 0.49 ns
LVPECL (Pro IO banks)
tDp = 1.60 ns
I/O Module
(Non-Registered)
Combinational Cell
Y
LVTTL/LVCMOS 3.3 V (Pro I/O banks)
tDP = 2.74 ns Output drive strength = 12 mA
High slew rate
I/O Module
Combinational Cell
(Non-Registered)
tPD = 0.87 ns
Y
I/O Module
(Registered)
LVTTL/LVCMOS 3.3 V (Pro I/O banks)
Output drive strength = 24 mA
tDP = 2.39 ns High slew rate
tPY = 1.22 ns
tPD = 0.51 ns
LVPECL
(Pro IO Banks)
D
Q
Combinational Cell
I/O Module
(Non-Registered)
Y
Input LVTTL/LVCMOS
3.3 V (Pro IO banks)
tICLKQ = 0.24 ns
tISUD = 0.26 ns
Register Cell Combinational Cell
tPY = 0.90 ns
D
Y
Q
I/O Module
(Non-Registered)
tPY = 1.36 ns
I/O Module
(Registered)
Register Cell
D
Q
D
Q
GTL+ 3.3 V
tDP = 1.53 ns
tPD = 0.47 ns
tCLKQ = 0.55 ns
tSUD = 0.43 ns
LVDS,
BLVDS,
M-LVDS (Pro IO Banks)
LVCMOS 1.5 V (Pro IO banks)
Output drive strength = 12 mA
tDP = 3.30 ns High slew
tPD = 0.47 ns
tCLKQ = 0.55 ns
tSUD = 0.43 ns
tOCLKQ = 0.59 ns
tOSUD = 0.31 ns
Input LVTTL/LVCMOS
3.3 V (Pro IO banks)
IInput LVTTL/LVCMOS
3.3 V (Pro IO banks)
tPY = 0.90 ns
tPY = 0.90 ns
Figure 2-107 • Timing Model
Operating Conditions: –2 Speed, Commercial Temperature Range (TJ = 70°C), Worst-Case VCC =
1.425 V
Pr e li m i n a ry v1 . 7
2 -159
Device Architecture
tPY
tPYS
tDIN
D
PAD
Q
DIN
Y
CLK
To Array
I/O interface
tPY = MAX(tPY (R), tPY (F))
tPYs = MAX(tPYS (R), tPYS (F))
tDIN = MAX(tDIN (R), tDIN (F))
VIH
PAD
Vtrip
Vtrip
VIL
VCC
50%
50%
Y
GND
tPY
(R)
tPY
(F)
tPYS
(R)
tPYS
(F)
VCC
50%
DIN
GND
50%
tDOUT
tDOUT
(R)
(F)
Figure 2-108 • Input Buffer Timing Model and Delays (example)
2 -1 6 0
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
tDOUT
tDP
D Q
D
PAD
DOUT
Std
Load
CLK
From Array
tDP = MAX(tDP(R), tDP(F))
tDOUT = MAX(tDOUT(R), tDOUT(F))
I/O Interface
tDOUT
tDOUT
(R)
D
50%
VCC
(F)
50%
0V
VCC
DOUT
50%
50%
0V
VOH
Vtrip
Vtrip
VOL
PAD
tDP
(R)
tDP
(F)
Figure 2-109 • Output Buffer Model and Delays (example)
Pr e li m i n a ry v1 . 7
2 -161
Device Architecture
tEOUT
D Q
tZL, tZH, tHZ, tLZ, tZLS, tZHS
CLK
E
EOUT
D Q
PAD
DOUT
CLK
D
tEOUT = MAX(tEOUT (R). tEOUT (F))
I/O Interface
VCC
D
VCC
50%
tEOUT (F)
50%
tEOUT (R)
E
EOUT
VCC
50%
50%
tZL
PAD
50%
tZH
tHZ
Vtrip
VCCI
90% VCCI
Vtrip
VOL
VCC
D
VCC
E
50%
EOUT
PAD
tEOUT (R)
50%
tEOUT (F)
VCC
50%
50%
tZLS
VOH
Vtrip
VOL
50%
tZHS
Vtrip
Figure 2-110 • Tristate Output Buffer Timing Model and Delays (example)
2 -1 6 2
Pr e li m i n a ry v1 . 7
50%
tLZ
10% VCCI
Actel Fusion Mixed-Signal FPGAs
Overview of I/O Performance
Summary of I/O DC Input and Output Levels – Default I/O Software Settings
Table 2-83 • Summary of Maximum and Minimum DC Input and Output Levels Applicable to Commercial and
Industrial Conditions
Applicable to Pro I/Os
I/O Standard
Drive
Strength
Slew
Rate Min., V
VIH
VIL
VOL
VOH
Max., V
Min., V
Max., V
Max., V
Min., V
IOL
IOH
mA mA
3.3 V LVTTL /
3.3 V LVCMOS
12 mA
High
–0.3
0.8
2
3.6
0.4
2.4
12
12
2.5 V LVCMOS
12 mA
High
–0.3
0.7
1.7
3.6
0.7
1.7
12
12
1.8 V LVCMOS
12 mA
High
–0.3
0.35 * VCCI
0.65*VCCI
3.6
0.45
VCCI – 0.45
12
12
1.5 V LVCMOS
12 mA
High
–0.3
0.30 VCCI
0.7*VCCI
3.6
0.25 * VCCI
0.75 * VCCI
12
12
3.3 V PCI
Per PCI Specification
3.3 V PCI-X
Per PCI-X Specification
25
mA2
High
–0.3
VREF – 0.05 VREF + 0.05
3.6
0.4
–
25
25
2.5 V GTL
25
mA2
High
–0.3
VREF – 0.05 VREF + 0.05
3.6
0.4
–
25
25
3.3 V GTL+
35 mA
High
–0.3
VREF – 0.1
VREF + 0.1
3.6
0.6
–
51
51
2.5 V GTL+
33 mA
High
–0.3
VREF – 0.1
VREF + 0.1
3.6
0.6
–
40
40
HSTL (I)
8 mA
High
–0.3
VREF – 0.1
VREF + 0.1
3.6
0.4
VCCI – 0.4
8
8
High
–0.3
VREF – 0.1
VREF + 0.1
3.6
0.4
VCCI – 0.4
15
15
3.3 V GTL
HSTL (II)
15
mA2
SSTL2 (I)
15 mA
High
–0.3
VREF – 0.2
VREF + 0.2
3.6
0.54
VCCI – 0.6
15
15
SSTL2 (II)
18 mA
High
–0.3
VREF – 0.2
VREF + 0.2
3.6
0.35
VCCI – 0.43
18
18
SSTL3 (I)
14 mA
High
–0.3
VREF – 0.2
VREF + 0.2
3.6
0.7
VCCI – 1.1
14
14
SSTL3 (II)
21 mA
High
–0.3
VREF – 0.2
VREF + 0.2
3.6
0.5
VCCI – 0.9
21
21
Notes:
1. Currents are measured at 85°C junction temperature.
2. Output drive strength is below JEDEC specification.
3. Output slew rate can be extracted by the IBIS models.
Table 2-84 • Summary of Maximum and Minimum DC Input and Output Levels Applicable to Commercial and
Industrial Conditions
Applicable to Advanced I/Os
I/O Standard
Drive
Slew
Strength Rate
VIH
VIL
VOL
VOH
IOL
IOH
Min., V
Max., V
Min., V
Max., V
Max., V
Min., V
mA
mA
3.3 V LVTTL /
3.3 V LVCMOS
12 mA
High
–0.3
0.8
2
3.6
0.4
2.4
12
12
2.5 V LVCMOS
12 mA
High
–0.3
0.7
1.7
3.6
0.7
1.7
12
12
1.8 V LVCMOS
12 mA
High
–0.3
0.35 * VCCI 0.65 * VCCI
3.6
0.45
VCCI – 0.45
12
12
1.5 V LVCMOS
12 mA
High
–0.3
0.30 * VCCI
3.6
0.25 * VCCI 0.75 * VCCI
12
12
3.3 V PCI
3.3 V PCI-X
0.7 * VCCI
Per PCI specifications
Per PCI-X specifications
Notes:
1. Currents are measured at 85°C junction temperature.
2. Output drive strength is below JEDEC specification.
Pr e li m i n a ry v1 . 7
2 -163
Device Architecture
Table 2-85 • Summary of Maximum and Minimum DC Input and Output Levels Applicable to Commercial and
Industrial Conditions
Applicable to Standard I/Os
I/O Standard
Drive
Strength
Slew
Rate Min., V
VIL
VIH
VOL
VOH
Max., V
Min., V
Max., V
Max., V
Min., V
IOL IOH
mA mA
3.3 V LVTTL /
3.3 V LVCMOS
8 mA
High
–0.3
0.8
2
3.6
0.4
2.4
8
8
2.5 V LVCMOS
8 mA
High
–0.3
0.7
1.7
3.6
0.7
1.7
8
8
1.8 V LVCMOS
4 mA
High
–0.3
0.35 * VCCI 0.65 * VCCI
3.6
0.45
VCCI – 0.45
4
4
1.5 V LVCMOS
2 mA
High
–0.3
0.30 * VCCI
3.6
0.25 * VCCI
0.75 * VCCI
2
2
0.7 * VCCI
Notes:
1. Currents are measured at 85°C junction temperature.
2. Output drive strength is below JEDEC specification.
Table 2-86 • Summary of Maximum and Minimum DC Input Levels Applicable to Commercial and Industrial
Conditions
Applicable to All I/O Bank Types
Commercial1
Industrial2
IIL
IIH
IIL
IIH
DC I/O Standards
µA
µA
µA
µA
3.3 V LVTTL / 3.3 V LVCMOS
10
10
15
15
2.5 V LVCMOS
10
10
15
15
1.8 V LVCMOS
10
10
15
15
1.5 V LVCMOS
10
10
15
15
3.3 V PCI
10
10
15
15
3.3 V PCI-X
10
10
15
15
3.3 V GTL
10
10
15
15
2.5 V GTL
10
10
15
15
3.3 V GTL+
10
10
15
15
2.5 V GTL+
10
10
15
15
HSTL (I)
10
10
15
15
HSTL (II)
10
10
15
15
SSTL2 (I)
10
10
15
15
SSTL2 (II)
10
10
15
15
SSTL3 (I)
10
10
15
15
SSTL3 (II)
10
10
15
15
Notes:
1. Commercial range (0°C < TA < 70°C)
2. Industrial range (–40°C < TA < 85°C)
2 -1 6 4
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
Summary of I/O Timing Characteristics – Default I/O Software Settings
Table 2-87 • Summary of AC Measuring Points
Applicable to All I/O Bank Types
Input Reference Voltage
(VREF_TYP)
Board Termination Voltage
(VTT_REF)
Measuring Trip Point
(Vtrip)
3.3 V LVTTL / 3.3 V LVCMOS
–
–
1.4 V
2.5 V LVCMOS
–
–
1.2 V
1.8 V LVCMOS
–
–
0.90 V
1.5 V LVCMOS
–
–
0.75 V
3.3 V PCI
–
–
Standard
0.285 * VCCI (RR)
0.615 * VCCI (FF))
3.3 V PCI-X
–
–
0.285 * VCCI (RR)
0.615 * VCCI (FF)
3.3 V GTL
0.8 V
1.2 V
VREF
2.5 V GTL
0.8 V
1.2 V
VREF
3.3 V GTL+
1.0 V
1.5 V
VREF
2.5 V GTL+
1.0 V
1.5 V
VREF
HSTL (I)
0.75 V
0.75 V
VREF
HSTL (II)
0.75 V
0.75 V
VREF
SSTL2 (I)
1.25 V
1.25 V
VREF
SSTL2 (II)
1.25 V
1.25 V
VREF
SSTL3 (I)
1.5 V
1.485 V
VREF
SSTL3 (II)
1.5 V
1.485 V
VREF
LVDS
–
–
Cross point
LVPECL
–
–
Cross point
Table 2-88 • I/O AC Parameter Definitions
Parameter
Definition
tDP
Data to Pad delay through the Output Buffer
tPY
Pad to Data delay through the Input Buffer with Schmitt trigger disabled
tDOUT
Data to Output Buffer delay through the I/O interface
tEOUT
Enable to Output Buffer Tristate Control delay through the I/O interface
tDIN
Input Buffer to Data delay through the I/O interface
tPYS
Pad to Data delay through the Input Buffer with Schmitt trigger enabled
tHZ
Enable to Pad delay through the Output Buffer—HIGH to Z
tZH
Enable to Pad delay through the Output Buffer—Z to HIGH
tLZ
Enable to Pad delay through the Output Buffer—LOW to Z
tZL
Enable to Pad delay through the Output Buffer—Z to LOW
tZHS
Enable to Pad delay through the Output Buffer with delayed enable—Z to HIGH
tZLS
Enable to Pad delay through the Output Buffer with delayed enable—Z to LOW
Pr e li m i n a ry v1 . 7
2 -165
Device Architecture
Units
tZHS
tZLS
tHZ
tLZ
tZH
tZL
tEOUT
tPYS
tPY
tDIN
tDP
t DOUT
External Resistor (Ohm)
Capacitive Load (pF)
Slew Rate
I/O Standard
Drive Strength (mA)
Table 2-89 • Summary of I/O Timing Characteristics – Software Default Settings
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V
Applicable to Pro I/Os
3.3 V LVTTL/
12 mA High 35
3.3 V LVCMOS
–
0.49 2.74 0.03 0.90 1.17 0.32 2.79 2.14 2.45 2.70 4.46 3.81 ns
2.5 V LVCMOS 12 mA High 35
–
0.49 2.80 0.03 1.13 1.24 0.32 2.85 2.61 2.51 2.61 4.52 4.28 ns
1.8 V LVCMOS 12 mA High 35
–
0.49 2.83 0.03 1.08 1.42 0.32 2.89 2.31 2.79 3.16 4.56 3.98 ns
1.5 V LVCMOS 12 mA High 35
–
0.49 3.30 0.03 1.27 1.60 0.32 3.36 2.70 2.96 3.27 5.03 4.37 ns
3.3 V PCI
Per
PCI
spec
High 10
2
0.49 2.09 0.03 0.78 1.25 0.32 2.13 1.49 2.45 2.70 3.80 3.16 ns
3.3 V PCI-X
Per
PCI-X
spec
High 10 252 0.49 2.09 0.03 0.77 1.17 0.32 2.13 1.49 2.45 2.70 3.80 3.16 ns
3.3 V GTL
25 mA High 10
25 0.49 1.55 0.03 2.19
–
0.32 1.52 1.55 0.00 0.00 3.19 3.22 ns
2.5 V GTL
25 mA High 10
25 0.49 1.59 0.03 1.83
–
0.32 1.61 1.59 0.00 0.00 3.28 3.26 ns
3.3 V GTL+
35 mA High 10
25 0.49 1.53 0.03 1.19
–
0.32 1.56 1.53 0.00 0.00 3.23 3.20 ns
2.5 V GTL+
33 mA High 10
25 0.49 1.65 0.03 1.13
–
0.32 1.68 1.57 0.00 0.00 3.35 3.24 ns
HSTL (I)
8 mA
High 20
50 0.49 2.37 0.03 1.59
–
0.32 2.42 2.35 0.00 0.00 4.09 4.02 ns
HSTL (II)
15 mA High 20
25 0.49 2.26 0.03 1.59
–
0.32 2.30 2.03 0.00 0.00 3.97 3.70 ns
SSTL2 (I)
17 mA High 30
50 0.49 1.59 0.03 1.00
–
0.32 1.62 1.38 0.00 0.00 3.29 3.05 ns
SSTL2 (II)
21 mA High 30
25 0.49 1.62 0.03 1.00
–
0.32 1.65 1.32 0.00 0.00 3.32 2.99 ns
SSTL3 (I)
16 mA High 30
50 0.49 1.72 0.03 0.93
–
0.32 1.75 1.37 0.00 0.00 3.42 3.04 ns
SSTL3 (II)
24 mA High 30
25 0.49 1.54 0.03 0.93
–
0.32 1.57 1.25 0.00 0.00 3.24 2.92 ns
LVDS
24 mA High
–
–
0.49 1.57 0.03 1.36
–
–
–
–
–
–
–
–
ns
LVPECL
24 mA High
–
–
0.49 1.60 0.03 1.22
–
–
–
–
–
–
–
–
ns
2
Notes:
1. For specific junction temperature and voltage-supply levels, refer to Table 3-6 on page 3-7 for derating
values.
2. Resistance is used to measure I/O propagation delays as defined in PCI specifications. See Figure 2-115 on
page 2-191 for connectivity. This resistor is not required during normal operation.
2 -1 6 6
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
–
0.49 2.64 0.03 0.91 0.32 2.69 2.27 2.76 3.05 4.36 3.94 ns
1.5 V LVCMOS
12 mA
High 35 pF
–
0.49 3.05 0.03 1.07 0.32 3.10 2.67 2.95 3.14 4.77 4.34 ns
High 10 pF
252
0.49 2.00 0.03 0.65 0.32 2.04 1.46 2.40 2.68 3.71 3.13 ns
3.3 V PCI
3.3 V PCI-X
Per PCI
spec
Units
High 3 5pF
tZHS
12 mA
tZLS
1.8 V
LVCMOS
tHZ
0.49 2.66 0.03 0.98 0.32 2.71 2.56 2.47 2.57 4.38 4.23 ns
tLZ
–
tZH
High 35 pF
tZL
12 mA
tEOUT
2.5 V LVCMOS
tPY
0.49 2.64 0.03 0.90 0.32 2.69 2.11 2.40 2.68 4.36 3.78 ns
tDIN
–
tDP
High 35 pF
t DOUT
External Resistor (Ohm)
12 mA
Slew Rate
3.3 V LVTTL/
3.3 V LVCMOS
I/O Standard
Drive Strength (mA)
Capacitive Load (pF)
Table 2-90 • Summary of I/O Timing Characteristics – Software Default Settings
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V
Applicable to Advanced I/Os
Per PCI-X High 10 pF 252 0.49 2.00 0.03 0.62 0.32 2.04 1.46 2.40 2.68 3.71 3.13 ns
spec
LVDS
24 mA
High
–
–
0.49 1.37 0.03 1.20 N/A
N/A N/A N/A N/A N/A N/A ns
LVPECL
24 mA
High
–
–
0.49 1.34 0.03 1.05 N/A
N/A N/A N/A N/A N/A N/A ns
Notes:
1. For specific junction temperature and voltage-supply levels, refer to Table 3-6 on page 3-7 for derating
values.
2. Resistance is used to measure I/O propagation delays as defined in PCI specifications. See Figure 2-115 on
page 2-191 for connectivity. This resistor is not required during normal operation.
Pr e li m i n a ry v1 . 7
2 -167
Device Architecture
tPY
tEOUT
tZL
tZH
tLZ
tHZ
High
35 pF
–
0.49 3.29 0.03
0.75
0.32
3.36
2.80
1.79
2.01
ns
2.5 V LVCMOS
8 mA
High
35pF
–
0.49 3.56 0.03
0.96
0.32
3.40
3.56
1.78
1.91
ns
1.8 V LVCMOS
4 mA
High
35pF
–
0.49 4.74 0.03
0.90
0.32
4.02
4.74
1.80
1.85
ns
1.5 V LVCMOS
2 mA
High
35pF
–
0.49 5.71 0.03
1.06
0.32
4.71
5.71
1.83
1.83
ns
Units
tDIN
8 mA
tDP
3.3 V LVTTL/
3.3 V LVCMOS
I/O Standard
t DOUT
Slew Rate
External Resistor (Ohm)
Drive Strength (mA)
Capacitive Load (pF)
Table 2-91 • Summary of I/O Timing Characteristics – Software Default Settings
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V
Applicable to Standard I/Os
Notes:
1. For specific junction temperature and voltage-supply levels, refer to Table 3-6 on page 3-7 for derating
values.
2. Resistance is used to measure I/O propagation delays as defined in PCI specifications. See Figure 2-115 on
page 2-191 for connectivity. This resistor is not required during normal operation.
2 -1 6 8
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
Detailed I/O DC Characteristics
Table 2-92 • Input Capacitance
Symbol
Definition
Conditions
Min.
Max.
Units
CIN
Input capacitance
VIN = 0, f = 1.0 MHz
8
pF
CINCLK
Input capacitance on the clock pin
VIN = 0, f = 1.0 MHz
8
pF
Table 2-93 • I/O Output Buffer Maximum Resistances1
Drive Strength
RPULL-DOWN
(ohms)2
RPULL-UP
(ohms)3
4 mA
100
300
8 mA
50
150
12 mA
25
75
16 mA
17
50
24 mA
11
33
4 mA
100
200
8 mA
50
100
12 mA
25
50
16 mA
20
40
24 mA
11
22
2 mA
200
225
4 mA
100
112
6 mA
50
56
8 mA
50
56
12 mA
20
22
16 mA
20
22
2 mA
200
224
4 mA
100
112
6 mA
67
75
8 mA
33
37
12 mA
33
37
Per PCI/PCI-X specification
25
75
3.3 V GTL
25 mA
11
–
2.5 V GTL
25 mA
14
–
3.3 V GTL+
35 mA
12
–
Standard
Applicable to Pro I/O Banks
3.3 V LVTTL / 3.3 V LVCMOS
2.5 V LVCMOS
1.8 V LVCMOS
1.5 V LVCMOS
3.3 V PCI/PCI-X
Notes:
1. These maximum values are provided for informational reasons only. Minimum output buffer resistance
values depend on VCC, drive strength selection, temperature, and process. For board design considerations
and detailed output buffer resistances, use the corresponding IBIS models located on the Actel website at
http://www.actel.com/techdocs/models/ibis.html.
2. R(PULL-DOWN-MAX) = VOLspec / IOLspec
3. R(PULL-UP-MAX) = (VCCImax – VOHspec) / IOHs pe c
Pr e li m i n a ry v1 . 7
2 -169
Device Architecture
Table 2-93 • I/O Output Buffer Maximum Resistances1 (continued)
Drive Strength
RPULL-DOWN
(ohms)2
RPULL-UP
(ohms)3
2.5 V GTL+
33 mA
15
–
HSTL (I)
8 mA
50
50
HSTL (II)
15 mA
25
25
SSTL2 (I)
17 mA
27
31
SSTL2 (II)
21 mA
13
15
SSTL3 (I)
16 mA
44
69
SSTL3 (II)
24 mA
18
32
2 mA
100
300
4 mA
100
300
6 mA
50
150
8 mA
50
150
12 mA
25
75
16 mA
17
50
24 mA
11
33
2 mA
100
200
4 mA
100
200
6 mA
50
100
8 mA
50
100
12 mA
25
50
16 mA
20
40
24 mA
11
22
2 mA
200
225
4 mA
100
112
6 mA
50
56
8 mA
50
56
12 mA
20
22
16 mA
20
22
Standard
Applicable to Advanced I/O Banks
3.3 V LVTTL / 3.3 V LVCMOS
2.5 V LVCMOS
1.8 V LVCMOS
Notes:
1. These maximum values are provided for informational reasons only. Minimum output buffer resistance
values depend on VCC, drive strength selection, temperature, and process. For board design considerations
and detailed output buffer resistances, use the corresponding IBIS models located on the Actel website at
http://www.actel.com/techdocs/models/ibis.html.
2. R(PULL-DOWN-MAX) = VOLspec / IOLspec
3. R(PULL-UP-MAX) = (VCCImax – VOHspec) / IOHs pe c
2 -1 7 0
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
Table 2-93 • I/O Output Buffer Maximum Resistances1 (continued)
Drive Strength
RPULL-DOWN
(ohms)2
RPULL-UP
(ohms)3
2 mA
200
224
4 mA
100
112
6 mA
67
75
8 mA
33
37
12 mA
33
37
Per PCI/PCI-X specification
25
75
2 mA
100
300
4 mA
100
300
6 mA
50
150
8 mA
50
150
2 mA
100
200
4 mA
100
200
6 mA
50
100
8 mA
50
100
2 mA
200
225
4 mA
100
112
2 mA
200
224
Standard
1.5 V LVCMOS
3.3 V PCI/PCI-X
Applicable to Standard I/O Banks
3.3 V LVTTL / 3.3 V LVCMOS
2.5 V LVCMOS
1.8 V LVCMOS
1.5 V LVCMOS
Notes:
1. These maximum values are provided for informational reasons only. Minimum output buffer resistance
values depend on VCC, drive strength selection, temperature, and process. For board design considerations
and detailed output buffer resistances, use the corresponding IBIS models located on the Actel website at
http://www.actel.com/techdocs/models/ibis.html.
2. R(PULL-DOWN-MAX) = VOLspec / IOLspec
3. R(PULL-UP-MAX) = (VCCImax – VOHspec) / IOHs pe c
Table 2-94 • I/O Weak Pull-Up/Pull-Down Resistances
Minimum and Maximum Weak Pull-Up/Pull-Down Resistance Values
R(WEAK PULL-UP)1
(ohms)
R(WEAK PULL-DOWN)2
(ohms)
VCCI
Min.
Max.
Min.
Max.
3.3 V
10 k
45 k
10 k
45 k
2.5 V
11 k
55 k
12 k
74 k
1.8 V
18 k
70 k
17 k
110 k
1.5 V
19 k
90 k
19 k
140 k
Notes:
1. R(WEAK PULL-DOWN-MAX) = VOLspec / IWEAK PULL-DOWN-MIN
2. R(WEAK PULL-UP-MAX) = (VCCImax – VOHspec) / IWEAK PULL-UP-MIN
Pr e li m i n a ry v1 . 7
2 -171
Device Architecture
Table 2-95 • I/O Short Currents IOSH/IOSL
Drive Strength
IOSH (mA)*
IOSL (mA)*
4 mA
25
27
8 mA
51
54
12 mA
103
109
16 mA
132
127
24 mA
268
181
4 mA
16
18
8 mA
32
37
12 mA
65
74
16 mA
83
87
24 mA
169
124
2 mA
9
11
4 mA
17
22
6 mA
35
44
8 mA
45
51
12 mA
91
74
16 mA
91
74
2 mA
13
16
4 mA
25
33
6 mA
32
39
8 mA
66
55
12 mA
66
55
2 mA
25
27
4 mA
25
27
6 mA
51
54
8 mA
51
54
12 mA
103
109
16 mA
132
127
24 mA
268
181
2 mA
25
27
4 mA
25
27
6 mA
51
54
8 mA
51
54
12 mA
103
109
16 mA
132
127
24 mA
268
181
Applicable to Pro I/O Banks
3.3 V LVTTL / 3.3 V LVCMOS
2.5 V LVCMOS
1.8 V LVCMOS
1.5 V LVCMOS
Applicable to Advanced I/O Banks
3.3 V LVTTL / 3.3 V LVCMOS
3.3 V LVCMOS
Note: *TJ = 100°C
2 -1 7 2
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
Table 2-95 • I/O Short Currents IOSH/IOSL (continued)
2.5 V LVCMOS
1.8 V LVCMOS
1.5 V LVCMOS
3.3 V PCI/PCI-X
Drive Strength
IOSH (mA)*
IOSL (mA)*
2 mA
16
18
4 mA
16
18
6 mA
32
37
8 mA
32
37
12 mA
65
74
16 mA
83
87
24 mA
169
124
2 mA
9
11
4 mA
17
22
6 mA
35
44
8 mA
45
51
12 mA
91
74
16 mA
91
74
2 mA
13
16
4 mA
25
33
6 mA
32
39
8 mA
66
55
12 mA
66
55
Per PCI/PCI-X
specification
103
109
2 mA
25
27
4 mA
25
27
6 mA
51
54
8 mA
51
54
2 mA
16
18
4 mA
16
18
6 mA
32
37
8 mA
32
37
2 mA
9
11
4 mA
17
22
2 mA
13
16
Applicable to Standard I/O Banks
3.3 V LVTTL / 3.3 V LVCMOS
2.5 V LVCMOS
1.8 V LVCMOS
1.5 V LVCMOS
Note: *TJ = 100°C
The length of time an I/O can withstand IOSH/IOSL events depends on the junction temperature. The
reliability data below is based on a 3.3 V, 36 mA I/O setting, which is the worst case for this type of
analysis.
For example, at 110°C, the short current condition would have to be sustained for more than three
months to cause a reliability concern. The I/O design does not contain any short circuit protection,
but such protection would only be needed in extremely prolonged stress conditions.
Pr e li m i n a ry v1 . 7
2 -173
Device Architecture
Table 2-96 • Short Current Event Duration before Failure
Temperature
Time before Failure
–40°C
>20 years
0°C
>20 years
25°C
>20 years
70°C
5 years
85°C
2 years
100°C
6 months
110°C
3 months
Table 2-97 • Schmitt Trigger Input Hysteresis
Hysteresis Voltage Value (typ.) for Schmitt Mode Input Buffers
Input Buffer Configuration
Hysteresis Value (typ.)
3.3 V LVTTL/LVCMOS/PCI/PCI-X (Schmitt trigger mode)
240 mV
2.5 V LVCMOS (Schmitt trigger mode)
140 mV
1.8 V LVCMOS (Schmitt trigger mode)
80 mV
1.5 V LVCMOS (Schmitt trigger mode)
60 mV
Table 2-98 • I/O Input Rise Time, Fall Time, and Related I/O Reliability
Input Buffer
Input Rise/Fall Time (min.)
Input Rise/Fall Time (max.)
Reliability
LVTTL/LVCMOS (Schmitt trigger
disabled)
No requirement
10 ns*
20 years (110°C)
LVTTL/LVCMOS (Schmitt trigger
enabled)
No requirement
HSTL/SSTL/GTL
No requirement
10 ns*
10 years (100°C)
LVDS/BLVDS/M-LVDS/LVPECL
No requirement
10 ns*
10 years (100°C)
No requirement, but input 20 years (110°C)
noise voltage cannot exceed
Schmitt hysteresis
Note: *The maximum input rise/fall time is related only to the noise induced into the input buffer trace. If the
noise is low, the rise time and fall time of input buffers, when Schmitt trigger is disabled, can be increased
beyond the maximum value. The longer the rise/fall times, the more susceptible the input signal is to the
board noise. Actel recommends signal integrity evaluation/characterization of the system to ensure there is
no excessive noise coupling into input signals.
2 -1 7 4
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
Single-Ended I/O Characteristics
3.3 V LVTTL / 3.3 V LVCMOS
Low-Voltage Transistor–Transistor Logic is a general-purpose standard (EIA/JESD) for 3.3 V
applications. It uses an LVTTL input buffer and push-pull output buffer. The 3.3 V LVCMOS standard
is supported as part of the 3.3 V LVTTL support.
Table 2-99 • Minimum and Maximum DC Input and Output Levels
3.3 V LVTTL /
3.3 V LVCMOS
VIH
VIL
VOL
VOH
IOL IOH
Drive Strength Min., V Max., V Min., V Max., V Max., V Min., V mA mA
IOSL
IOSH
Max.,
mA1
Max.,
mA1
IIL
IIH
µA2 µA2
Applicable to Pro I/O Banks
4 mA
–0.3
0.8
2
3.6
0.4
2.4
4
4
27
25
10
10
8 mA
–0.3
0.8
2
3.6
0.4
2.4
8
8
54
51
10
10
12 mA
–0.3
0.8
2
3.6
0.4
2.4
12
12
109
103
10
10
16 mA
–0.3
0.8
2
3.6
0.4
2.4
16
16
127
132
10
10
24 mA
–0.3
0.8
2
3.6
0.4
2.4
24
24
181
268
10
10
Applicable to Advanced I/O Banks
2 mA
–0.3
0.8
2
3.6
0.4
2.4
2
2
27
25
10
10
4 mA
–0.3
0.8
2
3.6
0.4
2.4
4
4
27
25
10
10
6 mA
–0.3
0.8
2
3.6
0.4
2.4
6
6
54
51
10
10
8 mA
–0.3
0.8
2
3.6
0.4
2.4
8
8
54
51
10
10
12 mA
–0.3
0.8
2
3.6
0.4
2.4
12
12
109
103
10
10
16 mA
–0.3
0.8
2
3.6
0.4
2.4
16
16
127
132
10
10
24 mA
–0.3
0.8
2
3.6
0.4
2.4
24
24
181
268
10
10
Applicable to Standard I/O Banks
2 mA
–0.3
0.8
2
3.6
0.4
2.4
2
2
27
25
10
10
4 mA
–0.3
0.8
2
3.6
0.4
2.4
4
4
27
25
10
10
6 mA
–0.3
0.8
2
3.6
0.4
2.4
6
6
54
51
10
10
8 mA
–0.3
0.8
2
3.6
0.4
2.4
8
8
54
51
10
10
Notes:
1. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.
2. Currents are measured at 85°C junction temperature.
3. Software default selection highlighted in gray.
Test Point
Data Path
35 pF
R=1k
Test Point
Enable Path
R to VCCI for tLZ/tZL/tZLS
R to GND for tHZ/tZH/tZHS
35 pF for tZH/tZHS/tZL/tZLS
5 pF for tHZ/tLZ
Figure 2-111 • AC Loading
Table 2-100 • AC Waveforms, Measuring Points, and Capacitive Loads
Input LOW (V)
0
Input HIGH (V)
Measuring Point* (V)
VREF (typ.) (V)
CLOAD (pF)
3.3
1.4
–
35
Note: *Measuring point = Vtrip. See Table 2-87 on page 2-165 for a complete table of trip points.
Pr e li m i n a ry v1 . 7
2 -175
Device Architecture
Timing Characteristics
Table 2-101 • 3.3 V LVTTL / 3.3 V LVCMOS Low Slew
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V
Applicable to Pro I/Os
Drive
Speed
Strength Grade tDOUT
4 mA
8 mA
12 mA
16 mA
24 mA
tDP
tDIN
tPY
tPYS
tEOUT
tZL
tZH
tLZ
tHZ
tZLS
tZHS
Units
Std.
0.66
11.01
0.04
1.20
1.57
0.43
11.21
9.05
2.69
2.44
13.45 11.29
ns
–1
0.56
9.36
0.04
1.02
1.33
0.36
9.54
7.70
2.29
2.08
11.44
9.60
ns
–2
0.49
8.22
0.03
0.90
1.17
0.32
8.37
6.76
2.01
1.82
10.04
8.43
ns
Std.
0.66
7.86
0.04
1.20
1.57
0.43
8.01
6.44
3.04
3.06
10.24
8.68
ns
–1
0.56
6.69
0.04
1.02
1.33
0.36
6.81
5.48
2.58
2.61
8.71
7.38
ns
–2
0.49
5.87
0.03
0.90
1.17
0.32
5.98
4.81
2.27
2.29
7.65
6.48
ns
Std.
0.66
6.03
0.04
1.20
1.57
0.43
6.14
5.02
3.28
3.47
8.37
7.26
ns
–1
0.56
5.13
0.04
1.02
1.33
0.36
5.22
4.27
2.79
2.95
7.12
6.17
ns
–2
0.49
4.50
0.03
0.90
1.17
0.32
4.58
3.75
2.45
2.59
6.25
5.42
ns
Std.
0.66
5.62
0.04
1.20
1.57
0.43
5.72
4.72
3.32
3.58
7.96
6.96
ns
–1
0.56
4.78
0.04
1.02
1.33
0.36
4.87
4.02
2.83
3.04
6.77
5.92
ns
–2
0.49
4.20
0.03
0.90
1.17
0.32
4.27
3.53
2.48
2.67
5.94
5.20
ns
Std.
0.66
5.24
0.04
1.20
1.57
0.43
5.34
4.69
3.39
3.96
7.58
6.93
ns
–1
0.56
4.46
0.04
1.02
1.33
0.36
4.54
3.99
2.88
3.37
6.44
5.89
ns
–2
0.49
3.92
0.03
0.90
1.17
0.32
3.99
3.50
2.53
2.96
5.66
5.17
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
Table 2-102 • 3.3 V LVTTL / 3.3 V LVCMOS High Slew
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V
Applicable to Pro I/Os
Drive
Strength
4 mA
8 mA
12 mA
16 mA
24 mA
Speed
Grade tDOUT
Std.
0.66
tDP
tDIN
tPY
tPYS
tEOUT
tZL
tZH
tLZ
tHZ
tZLS
tZHS
Units
7.88
0.04
1.20
1.57
0.43
8.03
6.70
2.69
2.59
10.26
8.94
ns
–1
0.56
6.71
0.04
1.02
1.33
0.36
6.83
5.70
2.29
2.20
8.73
7.60
ns
–2
0.49
5.89
0.03
0.90
1.17
0.32
6.00
5.01
2.01
1.93
7.67
6.67
ns
Std.
0.66
5.08
0.04
1.20
1.57
0.43
5.17
4.14
3.05
3.21
7.41
6.38
ns
–1
0.56
4.32
0.04
1.02
1.33
0.36
4.40
3.52
2.59
2.73
6.30
5.43
ns
–2
0.49
3.79
0.03
0.90
1.17
0.32
3.86
3.09
2.28
2.40
5.53
4.76
ns
Std.
0.66
3.67
0.04
1.20
1.57
0.43
3.74
2.87
3.28
3.61
5.97
5.11
ns
–1
0.56
3.12
0.04
1.02
1.33
0.36
3.18
2.44
2.79
3.07
5.08
4.34
ns
–2
0.49
2.74
0.03
0.90
1.17
0.32
2.79
2.14
2.45
2.70
4.46
3.81
ns
Std.
0.66
3.46
0.04
1.20
1.57
0.43
3.53
2.61
3.33
3.72
5.76
4.84
ns
–1
0.56
2.95
0.04
1.02
1.33
0.36
3.00
2.22
2.83
3.17
4.90
4.12
ns
–2
0.49
2.59
0.03
0.90
1.17
0.32
2.63
1.95
2.49
2.78
4.30
3.62
ns
Std.
0.66
3.21
0.04
1.20
1.57
0.43
3.27
2.16
3.39
4.13
5.50
4.39
ns
–1
0.56
2.73
0.04
1.02
1.33
0.36
2.78
1.83
2.88
3.51
4.68
3.74
ns
–2
0.49
2.39
0.03
0.90
1.17
0.32
2.44
1.61
2.53
3.08
4.11
3.28
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
2 -1 7 6
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
Table 2-103 • 3.3 V LVTTL / 3.3 V LVCMOS Low Slew
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V
Applicable to Advanced I/Os
Drive
Strength
4 mA
8 mA
12 mA
16 mA
24 mA
Speed
Grade
tDOUT
tDP
tDIN
tPY
tEOUT
tZL
tZH
tLZ
tHZ
tZLS
tZHS
Units
Std.
0.66
10.26
0.04
1.20
0.43
10.45
8.90
2.64
2.46
12.68
11.13
ns
–1
0.56
8.72
0.04
1.02
0.36
8.89
7.57
2.25
2.09
10.79
9.47
ns
–2
0.49
7.66
0.03
0.90
0.32
7.80
6.64
1.98
1.83
9.47
8.31
ns
Std.
0.66
7.27
0.04
1.20
0.43
7.41
6.28
2.98
3.04
9.65
8.52
ns
–1
0.56
6.19
0.04
1.02
0.36
6.30
5.35
2.54
2.59
8.20
7.25
ns
–2
0.49
5.43
0.03
0.90
0.32
5.53
4.69
2.23
2.27
7.20
6.36
ns
Std.
0.66
5.58
0.04
1.20
0.43
5.68
4.87
3.21
3.42
7.92
7.11
ns
–1
0.56
4.75
0.04
1.02
0.36
4.84
4.14
2.73
2.91
6.74
6.05
ns
–2
0.49
4.17
0.03
0.90
0.32
4.24
3.64
2.39
2.55
5.91
5.31
ns
Std.
0.66
5.21
0.04
1.20
0.43
5.30
4.56
3.26
3.51
7.54
6.80
ns
–1
0.56
4.43
0.04
1.02
0.36
4.51
3.88
2.77
2.99
6.41
5.79
ns
–2
0.49
3.89
0.03
0.90
0.32
3.96
3.41
2.43
2.62
5.63
5.08
ns
Std.
0.66
4.85
0.04
1.20
0.43
4.94
4.54
3.32
3.88
7.18
6.78
ns
–1
0.56
4.13
0.04
1.02
0.36
4.20
3.87
2.82
3.30
6.10
5.77
ns
–2
0.49
3.62
0.03
0.90
0.32
3.69
3.39
2.48
2.90
5.36
5.06
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
Table 2-104 • 3.3 V LVTTL / 3.3 V LVCMOS High Slew
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V
Applicable to Advanced I/Os
Drive
Strength
4 mA
8 mA
12 mA
16 mA
24 mA
Speed
Grade
tDOUT
tDP
tDIN
tPY
tEOUT
tZL
tZH
tLZ
tHZ
tZLS
tZHS
Units
Std.
0.66
7.66
0.04
1.20
0.43
7.80
6.59
2.65
2.61
10.03
8.82
ns
–1
0.56
6.51
0.04
1.02
0.36
6.63
5.60
2.25
2.22
8.54
7.51
ns
–2
0.49
5.72
0.03
0.90
0.32
5.82
4.92
1.98
1.95
7.49
6.59
ns
Std.
0.66
4.91
0.04
1.20
0.43
5.00
4.07
2.99
3.20
7.23
6.31
ns
–1
0.56
4.17
0.04
1.02
0.36
4.25
3.46
2.54
2.73
6.15
5.36
ns
–2
0.49
3.66
0.03
0.90
0.32
3.73
3.04
2.23
2.39
5.40
4.71
ns
Std.
0.66
3.53
0.04
1.20
0.43
3.60
2.82
3.21
3.58
5.83
5.06
ns
–1
0.56
3.00
0.04
1.02
0.36
3.06
2.40
2.73
3.05
4.96
4.30
ns
–2
0.49
2.64
0.03
0.90
0.32
2.69
2.11
2.40
2.68
4.36
3.78
ns
Std.
0.66
3.33
0.04
1.20
0.43
3.39
2.56
3.26
3.68
5.63
4.80
ns
–1
0.56
2.83
0.04
1.02
0.36
2.89
2.18
2.77
3.13
4.79
4.08
ns
–2
0.49
2.49
0.03
0.90
0.32
2.53
1.91
2.44
2.75
4.20
3.58
ns
Std.
0.66
3.08
0.04
1.20
0.43
3.13
2.12
3.32
4.06
5.37
4.35
ns
–1
0.56
2.62
0.04
1.02
0.36
2.66
1.80
2.83
3.45
4.57
3.70
ns
–2
0.49
2.30
0.03
0.90
0.32
2.34
1.58
2.48
3.03
4.01
3.25
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
Pr e li m i n a ry v1 . 7
2 -177
Device Architecture
Table 2-105 • 3.3 V LVTTL / 3.3 V LVCMOS Low Slew
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V
Applicable to Standard I/Os
Drive
Strength
2 mA
4 mA
6 mA
8 mA
Speed
Grade
tDOUT
tDP
tDIN
tPY
tEOUT
tZL
tZH
tLZ
tHZ
Units
Std.
0.66
9.46
0.04
1.00
0.43
9.64
8.54
2.07
2.04
ns
–1
0.56
8.05
0.04
0.85
0.36
8.20
7.27
1.76
1.73
ns
–2
0.49
7.07
0.03
0.75
0.32
7.20
6.38
1.55
1.52
ns
Std.
0.66
9.46
0.04
1.00
0.43
9.64
8.54
2.07
2.04
ns
–1
0.56
8.05
0.04
0.85
0.36
8.20
7.27
1.76
1.73
ns
–2
0.49
7.07
0.03
0.75
0.32
7.20
6.38
1.55
1.52
ns
Std.
0.66
6.57
0.04
1.00
0.43
6.69
5.98
2.40
2.57
ns
–1
0.56
5.59
0.04
0.85
0.36
5.69
5.09
2.04
2.19
ns
–2
0.49
4.91
0.03
0.75
0.32
5.00
4.47
1.79
1.92
ns
Std.
0.66
6.57
0.04
1.00
0.43
6.69
5.98
2.40
2.57
ns
–1
0.56
5.59
0.04
0.85
0.36
5.69
5.09
2.04
2.19
ns
–2
0.49
4.91
0.03
0.75
0.32
5.00
4.47
1.79
1.92
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
Table 2-106 • 3.3 V LVTTL / 3.3 V LVCMOS High Slew
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V
Applicable to Standard I/Os
Drive
Strength
2 mA
4 mA
6 mA
8 mA
Speed
Grade
tDOUT
tDP
tDIN
tPY
tEOUT
tZL
tZH
tLZ
tHZ
Units
Std.
0.66
7.07
0.04
1.00
0.43
7.20
6.23
2.07
2.15
ns
–1
0.56
6.01
0.04
0.85
0.36
6.12
5.30
1.76
1.83
ns
–2
0.49
5.28
0.03
0.75
0.32
5.37
4.65
1.55
1.60
ns
Std.
0.66
7.07
0.04
1.00
0.43
7.20
6.23
2.07
2.15
ns
–1
0.56
6.01
0.04
0.85
0.36
6.12
5.30
1.76
1.83
ns
–2
0.49
5.28
0.03
0.75
0.32
5.37
4.65
1.55
1.60
ns
Std.
0.66
4.41
0.04
1.00
0.43
4.49
3.75
2.39
2.69
ns
–1
0.56
3.75
0.04
0.85
0.36
3.82
3.19
2.04
2.29
ns
–2
0.49
3.29
0.03
0.75
0.32
3.36
2.80
1.79
2.01
ns
Std.
0.66
4.41
0.04
1.00
0.43
4.49
3.75
2.39
2.69
ns
–1
0.56
3.75
0.04
0.85
0.36
3.82
3.19
2.04
2.29
ns
–2
0.49
3.29
0.03
0.75
0.32
3.36
2.80
1.79
2.01
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
2 -1 7 8
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
2.5 V LVCMOS
Low-Voltage CMOS for 2.5 V is an extension of the LVCMOS standard (JESD8-5) used for generalpurpose 2.5 V applications. It uses a 5 V–tolerant input buffer and push-pull output buffer.
Table 2-107 • Minimum and Maximum DC Input and Output Levels
2.5 V LVCMOS
Drive
Strength
VIH
VIL
Min., V
Max., V
Min., V
VOL
Max., V Max., V
VOH
Min., V
IOL
IOH
IOSL
Max.,
mA1
mA mA
IOSH
IIL
IIH
Max.,
mA1 µA2 µA2
Applicable to Pro I/O Banks
4 mA
–0.3
0.7
1.7
3.6
0.7
1.7
4
4
18
16
10
10
8 mA
–0.3
0.7
1.7
3.6
0.7
1.7
8
8
37
32
10
10
12 mA
–0.3
0.7
1.7
3.6
0.7
1.7
12
12
74
65
10
10
16 mA
–0.3
0.7
1.7
3.6
0.7
1.7
16
16
87
83
10
10
24 mA
–0.3
0.7
1.7
3.6
0.7
1.7
24
24
124
169
10
10
Applicable to Advanced I/O Banks
2 mA
–0.3
0.7
1.7
3.6
0.7
1.7
2
2
18
16
10
10
4 mA
–0.3
0.7
1.7
3.6
0.7
1.7
4
4
18
16
10
10
6 mA
–0.3
0.7
1.7
3.6
0.7
1.7
6
6
37
32
10
10
8 mA
–0.3
0.7
1.7
3.6
0.7
1.7
8
8
37
32
10
10
12 mA
–0.3
0.7
1.7
3.6
0.7
1.7
12
12
74
65
10
10
16 mA
–0.3
0.7
1.7
3.6
0.7
1.7
16
16
87
83
10
10
24 mA
–0.3
0.7
1.7
3.6
0.7
1.7
24
24
124
169
10
10
Applicable to Standard I/O Banks
2 mA
–0.3
0.7
1.7
3.6
0.7
1.7
2
2
18
16
10
10
4 mA
–0.3
0.7
1.7
3.6
0.7
1.7
4
4
18
16
10
10
6 mA
–0.3
0.7
1.7
3.6
0.7
1.7
6
6
37
32
10
10
8 mA
–0.3
0.7
1.7
3.6
0.7
1.7
8
8
37
32
10
10
Notes:
1. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.
2. Currents are measured at 85°C junction temperature.
3. Software default selection highlighted in gray.
Test Point
Data Path
35 pF
R=1k
Test Point
Enable Path
R to VCCI for tLZ/tZL/tZLS
R to GND for tHZ/tZH/tZHS
35 pF for tZH/tZHS/tZL/tZLS
5 pF for tHZ/tLZ
Figure 2-112 • AC Loading
Table 2-108 • AC Waveforms, Measuring Points, and Capacitive Loads
Input LOW (V)
0
Input HIGH (V)
Measuring Point* (V)
VREF (typ.) (V)
CLOAD (pF)
2.5
1.2
–
35
Note: *Measuring point = Vtrip. See Table 2-87 on page 2-165 for a complete table of trip points.
Pr e li m i n a ry v1 . 7
2 -179
Device Architecture
Timing Characteristics
Table 2-109 • 2.5 V LVCMOS Low Slew
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 2.3 V
Applicable to Pro I/Os
Drive
Speed
Strength Grade tDOUT
4 mA
8 mA
12 mA
16 mA
24 mA
Std.
tDP
tDIN
tPY
tPYS
tEOUT
tZL
tZH
0.60
12.00
0.04
1.51
1.66
0.43
12.23 11.61
tLZ
tHZ
2.72
2.20
tZLS
tZHS
14.46 13.85
Units
ns
–1
0.51
10.21
0.04
1.29
1.41
0.36
10.40
9.88
2.31
1.87
12.30 11.78
ns
–2
0.45
8.96
0.03
1.13
1.24
0.32
9.13
8.67
2.03
1.64
10.80 10.34
ns
Std.
0.60
8.73
0.04
1.51
1.66
0.43
8.89
8.01
3.10
2.93
11.13 10.25
ns
–1
0.51
7.43
0.04
1.29
1.41
0.36
7.57
6.82
2.64
2.49
9.47
8.72
ns
–2
0.45
6.52
0.03
1.13
1.24
0.32
6.64
5.98
2.32
2.19
8.31
7.65
ns
Std.
0.66
6.77
0.04
1.51
1.66
0.43
6.90
6.11
3.37
3.39
9.14
8.34
ns
–1
0.56
5.76
0.04
1.29
1.41
0.36
5.87
5.20
2.86
2.89
7.77
7.10
ns
–2
0.49
5.06
0.03
1.13
1.24
0.32
5.15
4.56
2.51
2.53
6.82
6.23
ns
Std.
0.66
6.31
0.04
1.51
1.66
0.43
6.42
5.73
3.42
3.52
8.66
7.96
ns
–1
0.56
5.37
0.04
1.29
1.41
0.36
5.46
4.87
2.91
3.00
7.37
6.77
ns
–2
0.49
4.71
0.03
1.13
1.24
0.32
4.80
4.28
2.56
2.63
6.47
5.95
ns
Std.
0.66
5.93
0.04
1.51
1.66
0.43
6.04
5.70
3.49
4.00
8.28
7.94
ns
–1
0.56
5.05
0.04
1.29
1.41
0.36
5.14
4.85
2.97
3.40
7.04
6.75
ns
–2
0.49
4.43
0.03
1.13
1.24
0.32
4.51
4.26
2.61
2.99
6.18
5.93
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
Table 2-110 • 2.5 V LVCMOS High Slew
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 2.3 V
Applicable to Pro I/Os
Drive
Strength
4 mA
8 mA
12 mA
16 mA
24 mA
Speed
Grade tDOUT
tDP
tDIN
tPY
tPYS
tEOUT
tZL
tZH
tLZ
tHZ
Std.
0.60
8.82
0.04
1.51
1.66
0.43
8.13
8.82
2.72
2.29
10.37 11.05
tZLS
tZHS
ns
–1
0.51
7.50
0.04
1.29
1.41
0.36
6.92
7.50
2.31
1.95
8.82
ns
9.40
Units
–2
0.45
6.58
0.03
1.13
1.24
0.32
6.07
6.58
2.03
1.71
7.74
8.25
ns
Std.
0.60
5.27
0.04
1.51
1.66
0.43
5.27
5.27
3.10
3.03
7.50
7.51
ns
–1
0.51
4.48
0.04
1.29
1.41
0.36
4.48
4.48
2.64
2.58
6.38
6.38
ns
–2
0.45
3.94
0.03
1.13
1.24
0.32
3.93
3.94
2.32
2.26
5.60
5.61
ns
Std.
0.66
3.74
0.04
1.51
1.66
0.43
3.81
3.49
3.37
3.49
6.05
5.73
ns
–1
0.56
3.18
0.04
1.29
1.41
0.36
3.24
2.97
2.86
2.97
5.15
4.87
ns
–2
0.49
2.80
0.03
1.13
1.24
0.32
2.85
2.61
2.51
2.61
4.52
4.28
ns
Std.
0.66
3.53
0.04
1.51
1.66
0.43
3.59
3.12
3.42
3.62
5.83
5.35
ns
–1
0.56
3.00
0.04
1.29
1.41
0.36
3.06
2.65
2.91
3.08
4.96
4.55
ns
–2
0.49
2.63
0.03
1.13
1.24
0.32
2.68
2.33
2.56
2.71
4.35
4.00
ns
Std.
0.66
3.26
0.04
1.51
1.66
0.43
3.32
2.48
3.49
4.11
5.56
4.72
ns
–1
0.56
2.77
0.04
1.29
1.41
0.36
2.83
2.11
2.97
3.49
4.73
4.01
ns
–2
0.49
2.44
0.03
1.13
1.24
0.32
2.48
1.85
2.61
3.07
4.15
3.52
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
2 -1 8 0
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
Table 2-111 • 2.5 V LVCMOS Low Slew
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 2.3 V
Applicable to Advanced I/Os
Drive
Strength
4 mA
8 mA
12 mA
16 mA
24 mA
Speed
Grade
tDOUT
tDP
tDIN
tPY
tEOUT
tZL
tZH
tLZ
tHZ
tZLS
tZHS
Units
Std.
0.66
11.40
0.04
1.31
0.43
11.22
11.40
2.68
2.20
13.45
13.63
ns
–1
0.56
9.69
0.04
1.11
0.36
9.54
9.69
2.28
1.88
11.44
11.60
ns
–2
0.49
8.51
0.03
0.98
0.32
8.38
8.51
2.00
1.65
10.05
10.18
ns
Std.
0.66
7.96
0.04
1.31
0.43
8.11
7.81
3.05
2.89
10.34
10.05
ns
–1
0.56
6.77
0.04
1.11
0.36
6.90
6.65
2.59
2.46
8.80
8.55
ns
–2
0.49
5.94
0.03
0.98
0.32
6.05
5.84
2.28
2.16
7.72
7.50
ns
Std.
0.66
6.18
0.04
1.31
0.43
6.29
5.92
3.30
3.32
8.53
8.15
ns
–1
0.56
5.26
0.04
1.11
0.36
5.35
5.03
2.81
2.83
7.26
6.94
ns
–2
0.49
4.61
0.03
0.98
0.32
4.70
4.42
2.47
2.48
6.37
6.09
ns
Std.
0.66
6.18
0.04
1.31
0.43
6.29
5.92
3.30
3.32
8.53
8.15
ns
–1
0.56
5.26
0.04
1.11
0.36
5.35
5.03
2.81
2.83
7.26
6.94
ns
–2
0.49
4.61
0.03
0.98
0.32
4.70
4.42
2.47
2.48
6.37
6.09
ns
Std.
0.66
6.18
0.04
1.31
0.43
6.29
5.92
3.30
3.32
8.53
8.15
ns
–1
0.56
5.26
0.04
1.11
0.36
5.35
5.03
2.81
2.83
7.26
6.94
ns
–2
0.49
4.61
0.03
0.98
0.32
4.70
4.42
2.47
2.48
6.37
6.09
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
Table 2-112 • 2.5 V LVCMOS High Slew
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 2.3 V
Applicable to Advanced I/Os
Drive
Strength
4 mA
8 mA
12 mA
16 mA
24 mA
Speed
Grade
tDOUT
tDP
tDIN
tPY
tEOUT
tZL
tZH
tLZ
tHZ
tZLS
tZHS
Units
Std.
0.66
8.66
0.04
1.31
0.43
7.83
8.66
2.68
2.30
10.07
10.90
ns
–1
0.56
7.37
0.04
1.11
0.36
6.66
7.37
2.28
1.96
8.56
9.27
ns
–2
0.49
6.47
0.03
0.98
0.32
5.85
6.47
2.00
1.72
7.52
8.14
ns
Std.
0.66
5.17
0.04
1.31
0.43
5.04
5.17
3.05
3.00
7.27
7.40
ns
–1
0.56
4.39
0.04
1.11
0.36
4.28
4.39
2.59
2.55
6.19
6.30
ns
–2
0.49
3.86
0.03
0.98
0.32
3.76
3.86
2.28
2.24
5.43
5.53
ns
Std.
0.66
3.56
0.04
1.31
0.43
3.63
3.43
3.30
3.44
5.86
5.67
ns
–1
0.56
3.03
0.04
1.11
0.36
3.08
2.92
2.81
2.92
4.99
4.82
ns
–2
0.49
2.66
0.03
0.98
0.32
2.71
2.56
2.47
2.57
4.38
4.23
ns
Std.
0.66
3.35
0.04
1.31
0.43
3.41
3.06
3.36
3.55
5.65
5.30
ns
–1
0.56
2.85
0.04
1.11
0.36
2.90
2.60
2.86
3.02
4.81
4.51
ns
–2
0.49
2.50
0.03
0.98
0.32
2.55
2.29
2.51
2.65
4.22
3.96
ns
Std.
0.66
3.56
0.04
1.31
0.43
3.63
3.43
3.30
3.44
5.86
5.67
ns
–1
0.56
3.03
0.04
1.11
0.36
3.08
2.92
2.81
2.92
4.99
4.82
ns
–2
0.49
2.66
0.03
0.98
0.32
2.71
2.56
2.47
2.57
4.38
4.23
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
Pr e li m i n a ry v1 . 7
2 -181
Device Architecture
Table 2-113 • 2.5 V LVCMOS Low Slew
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 2.3 V
Applicable to Standard I/Os
Drive
Strength
2 mA
4 mA
6 mA
8 mA
Speed
Grade
tDOUT
tDP
tDIN
tPY
tEOUT
tZL
tZH
tLZ
tHZ
Units
Std.
0.66
11.00
0.04
1.29
0.43
10.37
11.00
2.03
1.83
ns
–1
0.56
9.35
0.04
1.10
0.36
8.83
9.35
1.73
1.56
ns
–2
0.49
8.21
0.03
0.96
0.32
7.75
8.21
1.52
1.37
ns
Std.
0.66
11.00
0.04
1.29
0.43
10.37
11.00
2.03
1.83
ns
–1
0.56
9.35
0.04
1.10
0.36
8.83
9.35
1.73
1.56
ns
–2
0.49
8.21
0.03
0.96
0.32
7.75
8.21
1.52
1.37
ns
Std.
0.66
7.50
0.04
1.29
0.43
7.36
7.50
2.39
2.46
ns
–1
0.56
6.38
0.04
1.10
0.36
6.26
6.38
2.03
2.10
ns
–2
0.49
5.60
0.03
0.96
0.32
5.49
5.60
1.78
1.84
ns
Std.
0.66
7.50
0.04
1.29
0.43
7.36
7.50
2.39
2.46
ns
–1
0.56
6.38
0.04
1.10
0.36
6.26
6.38
2.03
2.10
ns
–2
0.49
5.60
0.03
0.96
0.32
5.49
5.60
1.78
1.84
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
Table 2-114 • 2.5 V LVCMOS High Slew
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 2.3 V
Applicable to Standard I/Os
Drive
Strength
2 mA
4 mA
6 mA
8 mA
Speed
Grade
tDOUT
tDP
tDIN
tPY
Std.
0.66
8.20
0.04
–1
0.56
6.98
0.04
–2
0.49
6.13
Std.
0.66
–1
–2
tEOUT
tZL
tZH
tLZ
tHZ
Units
1.29
0.43
7.24
8.20
2.03
1.91
ns
1.10
0.36
6.16
6.98
1.73
1.62
ns
0.03
0.96
0.32
5.41
6.13
1.52
1.43
ns
8.20
0.04
1.29
0.43
7.24
8.20
2.03
1.91
ns
0.56
6.98
0.04
1.10
0.36
6.16
6.98
1.73
1.62
ns
0.49
6.13
0.03
0.96
0.32
5.41
6.13
1.52
1.43
ns
Std.
0.66
4.77
0.04
1.29
0.43
4.55
4.77
2.38
2.55
ns
–1
0.56
4.05
0.04
1.10
0.36
3.87
4.05
2.03
2.17
ns
–2
0.49
3.56
0.03
0.96
0.32
3.40
3.56
1.78
1.91
ns
Std.
0.66
4.77
0.04
1.29
0.43
4.55
4.77
2.38
2.55
ns
–1
0.56
4.05
0.04
1.10
0.36
3.87
4.05
2.03
2.17
ns
–2
0.49
3.56
0.03
0.96
0.32
3.40
3.56
1.78
1.91
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
2 -1 8 2
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
1.8 V LVCMOS
Low-Voltage CMOS for 1.8 V is an extension of the LVCMOS standard (JESD8-5) used for generalpurpose 1.8 V applications. It uses a 1.8 V input buffer and push-pull output buffer.
Table 2-115 • Minimum and Maximum DC Input and Output Levels
1.8 V
LVCMOS
Drive
Strength
VIH
VIL
Min., V
Max., V
Min., V
VOL
VOH
IOL IOH
IOSL
Max., V
Max., V
Min., V
mA mA
Max.,
mA1
IOSH
IIL
IIH
Max.,
mA1 µA2 µA2
Applicable to Pro I/O Banks
2 mA
–0.3
0.35 * VCCI 0.65 * VCCI
3.6
0.45
VCCI – 0.45
2
2
11
9
10
10
4 mA
–0.3
0.35 * VCCI 0.65 * VCCI
3.6
0.45
VCCI – 0.45
4
4
22
17
10
10
6 mA
–0.3
0.35 * VCCI 0.65 * VCCI
3.6
0.45
VCCI – 0.45
6
6
44
35
10
10
8 mA
–0.3
0.35 * VCCI 0.65 * VCCI
3.6
0.45
VCCI – 0.45
8
8
51
45
10
10
12 mA
–0.3
0.35 * VCCI 0.65 * VCCI
3.6
0.45
VCCI – 0.45 12
12
74
91
10
10
16 mA
–0.3
0.35 * VCCI 0.65 * VCCI
3.6
0.45
VCCI – 0.45 16
16
74
91
10
10
Applicable to Advanced I/O Banks
2 mA
–0.3
0.35 * VCCI 0.65 * VCCI
3.6
0.45
VCCI – 0.45
2
2
11
9
10
10
4 mA
–0.3
0.35 * VCCI 0.65 * VCCI
3.6
0.45
VCCI – 0.45
4
4
22
17
10
10
6 mA
–0.3
0.35 * VCCI 0.65 * VCCI
3.6
0.45
VCCI – 0.45
6
6
44
35
10
10
8 mA
–0.3
0.35 * VCCI 0.65 * VCCI
3.6
0.45
VCCI – 0.45
8
8
51
45
10
10
12 mA
–0.3
0.35 * VCCI 0.65 * VCCI
3.6
0.45
VCCI – 0.45 12
12
74
91
10
10
16 mA
–0.3
0.35 * VCCI 0.65 * VCCI
3.6
0.45
VCCI – 0.45 16
16
74
91
10
10
Applicable to Standard I/O Banks
2 mA
–0.3
0.35 * VCCI 0.65 * VCCI
3.6
0.45
VCCI – 0.45
2
2
11
9
10
10
4 mA
–0.3
0.35 * VCCI 0.65 * VCCI
3.6
0.45
VCCI – 0.45
4
4
22
17
10
10
Notes:
1. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.
2. Currents are measured at 85°C junction temperature.
3. Software default selection highlighted in gray.
Test Point
Data Path
35 pF
R=1k
Test Point
Enable Path
R to VCCI for tLZ/tZL/tZLS
R to GND for tHZ/tZH/tZHS
35 pF for tZH/tZHS/tZL/tZLS
5 pF for tHZ/tLZ
Figure 2-113 • AC Loading
Table 2-116 • AC Waveforms, Measuring Points, and Capacitive Loads
Input LOW (V)
0
Input LOW (V)
Measuring Point* (V)
VREF (typ.) (V)
CLOAD (pF)
1.8
0.9
–
35
Note: *Measuring point = Vtrip. See Table 2-87 on page 2-165 for a complete table of trip points.
Pr e li m i n a ry v1 . 7
2 -183
Device Architecture
Timing Characteristics
Table 2-117 • 1.8 V LVCMOS Low Slew
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 1.7 V
Applicable to Pro I/Os
Drive
Strength
2 mA
4 mA
8 mA
12 mA
16 mA
Speed
Grade tDOUT
tDP
tDIN
tPY
tPYS
tEOUT
tLZ
tHZ
Std.
0.66
15.84
0.04
1.45
1.91
0.43
15.65 15.84
tZL
tZH
2.78
1.58
17.89 18.07
tZLS
tZHS
ns
–1
0.56
13.47
0.04
1.23
1.62
0.36
13.31 13.47
2.37
1.35
15.22 15.37
ns
Units
–2
0.49
11.83
0.03
1.08
1.42
0.32
11.69 11.83
2.08
1.18
13.36 13.50
ns
Std.
0.66
11.39
0.04
1.45
1.91
0.43
11.60 10.76
3.26
2.77
13.84 12.99
ns
–1
0.56
9.69
0.04
1.23
1.62
0.36
9.87
9.15
2.77
2.36
11.77 11.05
ns
–2
0.49
8.51
0.03
1.08
1.42
0.32
8.66
8.03
2.43
2.07
10.33
9.70
ns
Std.
0.66
8.97
0.04
1.45
1.91
0.43
9.14
8.10
3.57
3.36
11.37 10.33
ns
–1
0.56
7.63
0.04
1.23
1.62
0.36
7.77
6.89
3.04
2.86
9.67
8.79
ns
–2
0.49
6.70
0.03
1.08
1.42
0.32
6.82
6.05
2.66
2.51
8.49
7.72
ns
Std.
0.66
8.35
0.04
1.45
1.91
0.43
8.50
7.59
3.64
3.52
10.74
9.82
ns
–1
0.56
7.10
0.04
1.23
1.62
0.36
7.23
6.45
3.10
3.00
9.14
8.35
ns
–2
0.49
6.24
0.03
1.08
1.42
0.32
6.35
5.66
2.72
2.63
8.02
7.33
ns
Std.
0.66
7.94
0.04
1.45
1.91
0.43
8.09
7.56
3.74
4.11
10.32
9.80
ns
–1
0.56
6.75
0.04
1.23
1.62
0.36
6.88
6.43
3.18
3.49
8.78
8.33
ns
–2
0.49
5.93
0.03
1.08
1.42
0.32
6.04
5.65
2.79
3.07
7.71
7.32
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
Table 2-118 • 1.8 V LVCMOS High Slew
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 1.7 V
Applicable to Pro I/Os
Drive
Speed
Strength Grade tDOUT
2 mA
4 mA
8 mA
12 mA
16 mA
tDP
tDIN
tPY
tPYS
tEOUT
tZL
tZH
tLZ
tHZ
Std.
0.66
12.10
0.04
1.45
1.91
0.43
9.59
12.10
2.78
1.64
11.83 14.34
tZLS
tZHS
Units
ns
–1
0.56
10.30
0.04
1.23
1.62
0.36
8.16
10.30
2.37
1.39
10.06 12.20
ns
–2
0.49
9.04
0.03
1.08
1.42
0.32
7.16
9.04
2.08
1.22
8.83
10.71
ns
Std.
0.66
7.05
0.04
1.45
1.91
0.43
6.20
7.05
3.25
2.86
8.44
9.29
ns
–1
0.56
6.00
0.04
1.23
1.62
0.36
5.28
6.00
2.76
2.44
7.18
7.90
ns
–2
0.49
5.27
0.03
1.08
1.42
0.32
4.63
5.27
2.43
2.14
6.30
6.94
ns
Std.
0.66
4.52
0.04
1.45
1.91
0.43
4.47
4.52
3.57
3.47
6.70
6.76
ns
–1
0.56
3.85
0.04
1.23
1.62
0.36
3.80
3.85
3.04
2.95
5.70
5.75
ns
–2
0.49
3.38
0.03
1.08
1.42
0.32
3.33
3.38
2.66
2.59
5.00
5.05
ns
Std.
0.66
4.12
0.04
1.45
1.91
0.43
4.20
3.99
3.63
3.62
6.43
6.23
ns
–1
0.56
3.51
0.04
1.23
1.62
0.36
3.57
3.40
3.09
3.08
5.47
5.30
ns
–2
0.49
3.08
0.03
1.08
1.42
0.32
3.14
2.98
2.71
2.71
4.81
4.65
ns
Std.
0.66
3.80
0.04
1.45
1.91
0.43
3.87
3.09
3.73
4.24
6.10
5.32
ns
–1
0.56
3.23
0.04
1.23
1.62
0.36
3.29
2.63
3.18
3.60
5.19
4.53
ns
–2
0.49
2.83
0.03
1.08
1.42
0.32
2.89
2.31
2.79
3.16
4.56
3.98
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
2 -1 8 4
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
Table 2-119 • 1.8 V LVCMOS Low Slew
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 1.7 V
Applicable to Advanced I/Os
Drive
Strength
2 mA
4 mA
8 mA
12 mA
16 mA
Speed
Grade
tDOUT
tDP
tDIN
tPY
tEOUT
tZL
tZH
tLZ
tHZ
tZLS
tZHS
Units
Std.
0.66
15.53
0.04
1.31
0.43
14.11
15.53
2.78
1.60
16.35
17.77
ns
–1
0.56
13.21
0.04
1.11
0.36
12.01
13.21
2.36
1.36
13.91
15.11
ns
–2
0.49
11.60
0.03
0.98
0.32
10.54
11.60
2.07
1.19
12.21
13.27
ns
Std.
0.66
10.48
0.04
1.31
0.43
10.41
10.48
3.23
2.73
12.65
12.71
ns
–1
0.56
8.91
0.04
1.11
0.36
8.86
8.91
2.75
2.33
10.76
10.81
ns
–2
0.49
7.82
0.03
0.98
0.32
7.77
7.82
2.41
2.04
9.44
9.49
ns
Std.
0.66
8.05
0.04
1.31
0.43
8.20
7.84
3.54
3.27
10.43
10.08
ns
–1
0.56
6.85
0.04
1.11
0.36
6.97
6.67
3.01
2.78
8.88
8.57
ns
–2
0.49
6.01
0.03
0.98
0.32
6.12
5.86
2.64
2.44
7.79
7.53
ns
Std.
0.66
7.50
0.04
1.31
0.43
7.64
7.30
3.61
3.41
9.88
9.53
ns
–1
0.56
6.38
0.04
1.11
0.36
6.50
6.21
3.07
2.90
8.40
8.11
ns
–2
0.49
5.60
0.03
0.98
0.32
5.71
5.45
2.69
2.55
7.38
7.12
ns
Std.
0.66
7.29
0.04
1.31
0.43
7.23
7.29
3.71
3.95
9.47
9.53
ns
–1
0.56
6.20
0.04
1.11
0.36
6.15
6.20
3.15
3.36
8.06
8.11
ns
–2
0.49
5.45
0.03
0.98
0.32
5.40
5.45
2.77
2.95
7.07
7.12
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
Table 2-120 • 1.8 V LVCMOS High Slew
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 1.7 V
Applicable to Advanced I/Os
Drive
Strength
2 mA
4 mA
8 mA
12 mA
16 mA
Speed
Grade
tDOUT
tDP
tDIN
tPY
tEOUT
tZL
tZH
tLZ
tHZ
tZLS
tZHS
Units
Std.
0.66
11.86
0.04
1.22
0.43
9.14
11.86
2.77
1.66
11.37
14.10
ns
–1
0.56
10.09
0.04
1.04
0.36
7.77
10.09
2.36
1.41
9.67
11.99
ns
–2
0.49
8.86
0.03
0.91
0.32
6.82
8.86
2.07
1.24
8.49
10.53
ns
Std.
0.66
6.91
0.04
1.22
0.43
5.86
6.91
3.22
2.84
8.10
9.15
ns
–1
0.56
5.88
0.04
1.04
0.36
4.99
5.88
2.74
2.41
6.89
7.78
ns
–2
0.49
5.16
0.03
0.91
0.32
4.38
5.16
2.41
2.12
6.05
6.83
ns
Std.
0.66
4.45
0.04
1.22
0.43
4.18
4.45
3.53
3.38
6.42
6.68
ns
–1
0.56
3.78
0.04
1.04
0.36
3.56
3.78
3.00
2.88
5.46
5.69
ns
–2
0.49
3.32
0.03
0.91
0.32
3.12
3.32
2.64
2.53
4.79
4.99
ns
Std.
0.66
3.92
0.04
1.22
0.43
3.93
3.92
3.60
3.52
6.16
6.16
ns
–1
0.56
3.34
0.04
1.04
0.36
3.34
3.34
3.06
3.00
5.24
5.24
ns
–2
0.49
2.93
0.03
0.91
0.32
2.93
2.93
2.69
2.63
4.60
4.60
ns
Std.
0.66
3.53
0.04
1.22
0.43
3.60
3.04
3.70
4.08
5.84
5.28
ns
–1
0.56
3.01
0.04
1.04
0.36
3.06
2.59
3.15
3.47
4.96
4.49
ns
–2
0.49
2.64
0.03
0.91
0.32
2.69
2.27
2.76
3.05
4.36
3.94
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
Pr e li m i n a ry v1 . 7
2 -185
Device Architecture
Table 2-121 • 1.8 V LVCMOS Low Slew
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 1.7 V
Applicable to Standard I/Os
Drive
Strength
2 mA
4 mA
Speed
Grade
tDOUT
tDP
tDIN
tPY
tEOUT
tZL
tZH
tLZ
tHZ
Units
Std.
0.66
15.01
0.04
1.20
0.43
13.15
15.01
1.99
1.99
ns
–1
0.56
12.77
0.04
1.02
0.36
11.19
12.77
1.70
1.70
ns
–2
0.49
11.21
0.03
0.90
0.32
9.82
11.21
1.49
1.49
ns
Std.
0.66
10.10
0.04
1.20
0.43
9.55
10.10
2.41
2.37
ns
–1
0.56
8.59
0.04
1.02
0.36
8.13
8.59
2.05
2.02
ns
–2
0.49
7.54
0.03
0.90
0.32
7.13
7.54
1.80
1.77
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
Table 2-122 • 1.8 V LVCMOS High Slew
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 1.7 V
Applicable to Standard I/Os
Drive
Strength
2 mA
4 mA
Speed
Grade
tDOUT
Std.
0.66
11.21
0.04
1.20
0.43
8.53
11.21
1.99
1.21
ns
–1
0.56
9.54
0.04
1.02
0.36
7.26
9.54
1.69
1.03
ns
tDP
tDIN
tPY
tEOUT
tZL
tZH
tLZ
tHZ
Units
–2
0.49
8.37
0.03
0.90
0.32
6.37
8.37
1.49
0.90
ns
Std.
0.66
6.34
0.04
1.20
0.43
5.38
6.34
2.41
2.48
ns
–1
0.56
5.40
0.04
1.02
0.36
4.58
5.40
2.05
2.11
ns
–2
0.49
4.74
0.03
0.90
0.32
4.02
4.74
1.80
1.85
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
2 -1 8 6
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
1.5 V LVCMOS (JESD8-11)
Low-Voltage CMOS for 1.5 V is an extension of the LVCMOS standard (JESD8-5) used for generalpurpose 1.5 V applications. It uses a 1.5 V input buffer and push-pull output buffer.
Table 2-123 • Minimum and Maximum DC Input and Output Levels
1.5 V
LVCMOS
Drive
Strength
VIH
VIL
Min., V
Max., V
Min., V
Max., V
VOL
VOH
IOL IOH
Max., V
Min., V
mA mA
IOSL
IOSH
IIL
IIH
Max., Max.,
mA1 mA1 µA2 µA2
Applicable to Pro I/O Banks
2 mA
–0.3
0.30 * VCCI 0.7 * VCCI
3.6
0.25 * VCCI 0.75 * VCCI
2
2
16
13
10
10
4 mA
–0.3
0.30 * VCCI 0.7 * VCCI
3.6
0.25 * VCCI 0.75 * VCCI
4
4
33
25
10
10
6 mA
–0.3
0.30 * VCCI 0.7 * VCCI
3.6
0.25 * VCCI 0.75 * VCCI
6
6
39
32
10
10
8 mA
–0.3
0.30 * VCCI 0.7 * VCCI
3.6
0.25 * VCCI 0.75 * VCCI
8
8
55
66
10
10
12 mA
–0.3
0.30 * VCCI 0.7 * VCCI
3.6
0.25 * VCCI 0.75 * VCCI 12
12
55
66
10
10
Applicable to Pro I/O Banks
2 mA
–0.3
0.30 * VCCI 0.7 * VCCI
3.6
0.25 * VCCI 0.75 * VCCI
2
2
16
13
10
10
4 mA
–0.3
0.30 * VCCI 0.7 * VCCI
3.6
0.25 * VCCI 0.75 * VCCI
4
4
33
25
10
10
6 mA
–0.3
0.30 * VCCI 0.7 * VCCI
3.6
0.25 * VCCI 0.75 * VCCI
6
6
39
32
10
10
8 mA
–0.3
0.30 * VCCI 0.7 * VCCI
3.6
0.25 * VCCI 0.75 * VCCI
8
8
55
66
10
10
12 mA
–0.3
0.30 * VCCI 0.7 * VCCI
3.6
0.25 * VCCI 0.75 * VCCI 12
12
55
66
10
10
3.6
0.25 * VCCI 0.75 * VCCI
2
16
13
10
10
Applicable to Pro I/O Banks
2 mA
–0.3
0.30 * VCCI 0.7 * VCCI
2
Notes:
1. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.
2. Currents are measured at 85°C junction temperature.
3. Software default selection highlighted in gray.
Test Point
Data Path
35 pF
R=1k
Test Point
Enable Path
R to VCCI for tLZ/tZL/tZLS
R to GND for tHZ/tZH/tZHS
35 pF for tZH/tZHS/tZL/tZLS
5 pF for tHZ/tLZ
Figure 2-114 • AC Loading
Table 2-124 • AC Waveforms, Measuring Points, and Capacitive Loads
Input LOW (V)
0
Input HIGH (V)
Measuring Point* (V)
VREF (typ.) (V)
CLOAD (pF)
1.5
0.75
–
35
Note: *Measuring point = Vtrip. See Table 2-87 on page 2-165 for a complete table of trip points.
Pr e li m i n a ry v1 . 7
2 -187
Device Architecture
Timing Characteristics
Table 2-125 • 1.5 V LVCMOS Low Slew
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 1.4 V
Applicable to Pro I/Os
Drive
Strength
2 mA
4 mA
8 mA
12 mA
Speed
Grade
tDOUT
tDP
tDIN
tPY
tPYS
tEOUT
Std.
0.66
14.11
0.04
1.70
2.14
–1
0.56
12.00
0.04
1.44
–2
0.49
10.54
0.03
Std.
0.66
11.23
–1
0.56
–2
tZL
tZH
tLZ
tHZ
tZLS
tZHS
0.43 14.37 13.14
3.40
2.68
16.61 15.37
ns
1.82
0.36 12.22 11.17
2.90
2.28
14.13 13.08
ns
1.27
1.60
0.32 10.73
9.81
2.54
2.00
12.40 11.48
ns
0.04
1.70
2.14
0.43 11.44
9.87
3.77
3.36
13.68 12.10
ns
9.55
0.04
1.44
1.82
0.36
9.73
8.39
3.21
2.86
11.63 10.29
ns
0.49
8.39
0.03
1.27
1.60
0.32
8.54
7.37
2.81
2.51
10.21
9.04
ns
Std.
0.66
10.45
0.04
1.70
2.14
0.43 10.65
9.24
3.84
3.55
12.88 11.48
ns
–1
0.56
8.89
0.04
1.44
1.82
0.36
9.06
7.86
3.27
3.02
10.96
9.76
ns
–2
0.49
7.81
0.03
1.27
1.60
0.32
7.95
6.90
2.87
2.65
9.62
8.57
ns
Std.
0.66
10.02
0.04
1.70
2.14
0.43 10.20
9.23
3.97
4.22
12.44 11.47
ns
–1
0.56
8.52
0.04
1.44
1.82
0.36
8.68
7.85
3.38
3.59
10.58
9.75
ns
–2
0.49
7.48
0.03
1.27
1.60
0.32
7.62
6.89
2.97
3.15
9.29
8.56
ns
Units
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
Table 2-126 • 1.5 V LVCMOS High Slew
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 1.4 V
Applicable to Pro I/Os
Drive
Strength
2 mA
4 mA
8 mA
12 mA
Speed
Grade
tDOUT
tDP
tDIN
tPY
tPYS
tEOUT
tZL
tZH
tLZ
tHZ
tZLS
Std.
0.66
8.53
0.04
1.70
2.14
0.43
7.26
8.53
3.39
2.79
9.50 10.77
ns
–1
0.56
7.26
0.04
1.44
1.82
0.36
6.18
7.26
2.89
2.37
8.08
9.16
ns
–2
0.49
6.37
0.03
1.27
1.60
0.32
5.42
6.37
2.53
2.08
7.09
8.04
ns
Std.
0.66
5.41
0.04
1.70
2.14
0.43
5.22
5.41
3.75
3.48
7.45
7.65
ns
–1
0.56
4.60
0.04
1.44
1.82
0.36
4.44
4.60
3.19
2.96
6.34
6.50
ns
–2
0.49
4.04
0.03
1.27
1.60
0.32
3.89
4.04
2.80
2.60
5.56
5.71
ns
Std.
0.66
4.80
0.04
1.70
2.14
0.43
4.89
4.75
3.83
3.67
7.13
6.98
ns
–1
0.56
4.09
0.04
1.44
1.82
0.36
4.16
4.04
3.26
3.12
6.06
5.94
ns
–2
0.49
3.59
0.03
1.27
1.60
0.32
3.65
3.54
2.86
2.74
5.32
5.21
ns
Std.
0.66
4.42
0.04
1.70
2.14
0.43
4.50
3.62
3.96
4.37
6.74
5.86
ns
–1
0.56
3.76
0.04
1.44
1.82
0.36
3.83
3.08
3.37
3.72
5.73
4.98
ns
–2
0.49
3.30
0.03
1.27
1.60
0.32
3.36
2.70
2.96
3.27
5.03
4.37
ns
tZHS
Units
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
2 -1 8 8
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
Table 2-127 • 1.5 V LVCMOS Low Slew
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 1.4 V
Applicable to Advanced I/Os
Drive
Strength
2 mA
4 mA
8 mA
12 mA
Speed
Grade
tDOUT
tDP
tDIN
tPY
tEOUT
tZL
tZH
tLZ
tHZ
tZLS
tZHS
Units
Std.
0.66
12.78
0.04
1.31
0.43
12.81
12.78
3.40
2.64
15.05
15.02
ns
–1
0.56
10.87
0.04
1.11
0.36
10.90
10.87
2.89
2.25
12.80
12.78
ns
–2
0.49
9.55
0.03
0.98
0.32
9.57
9.55
2.54
1.97
11.24
11.22
ns
Std.
0.66
10.01
0.04
1.31
0.43
10.19
9.55
3.75
3.27
12.43
11.78
ns
–1
0.56
8.51
0.04
1.11
0.36
8.67
8.12
3.19
2.78
10.57
10.02
ns
–2
0.49
7.47
0.03
0.98
0.32
7.61
7.13
2.80
2.44
9.28
8.80
ns
Std.
0.66
9.33
0.04
1.31
0.43
9.51
8.89
3.83
3.43
11.74
11.13
ns
–1
0.56
7.94
0.04
1.11
0.36
8.09
7.56
3.26
2.92
9.99
9.47
ns
–2
0.49
6.97
0.03
0.98
0.32
7.10
6.64
2.86
2.56
8.77
8.31
ns
Std.
0.66
8.91
0.04
1.31
0.43
9.07
8.89
3.95
4.05
11.31
11.13
ns
–1
0.56
7.58
0.04
1.11
0.36
7.72
7.57
3.36
3.44
9.62
9.47
ns
–2
0.49
6.65
0.03
0.98
0.32
6.78
6.64
2.95
3.02
8.45
8.31
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
Table 2-128 • 1.5 V LVCMOS High Slew
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 1.4 V
Applicable to Advanced I/Os
Drive
Strength
2 mA
4 mA
8 mA
12 mA
Speed
Grade
tDOUT
tDP
tDIN
tPY
tEOUT
tZL
tZH
tLZ
tHZ
tZLS
tZHS
Units
Std.
0.66
8.36
0.04
1.44
0.43
6.82
8.36
3.39
2.77
9.06
10.60
ns
–1
0.56
7.11
0.04
1.22
0.36
5.80
7.11
2.88
2.35
7.71
9.02
ns
–2
0.49
6.24
0.03
1.07
0.32
5.10
6.24
2.53
2.06
6.76
7.91
ns
Std.
0.66
5.31
0.04
1.44
0.43
4.85
5.31
3.74
3.40
7.09
7.55
ns
–1
0.56
4.52
0.04
1.22
0.36
4.13
4.52
3.18
2.89
6.03
6.42
ns
–2
0.49
3.97
0.03
1.07
0.32
3.62
3.97
2.79
2.54
5.29
5.64
ns
Std.
0.66
4.67
0.04
1.44
0.43
4.55
4.67
3.82
3.56
6.78
6.90
ns
–1
0.56
3.97
0.04
1.22
0.36
3.87
3.97
3.25
3.03
5.77
5.87
ns
–2
0.49
3.49
0.03
1.07
0.32
3.40
3.49
2.85
2.66
5.07
5.16
ns
Std.
0.66
4.08
0.04
1.44
0.43
4.15
3.58
3.94
4.20
6.39
5.81
ns
–1
0.56
3.47
0.04
1.22
0.36
3.53
3.04
3.36
3.58
5.44
4.95
ns
–2
0.49
3.05
0.03
1.07
0.32
3.10
2.67
2.95
3.14
4.77
4.34
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
Pr e li m i n a ry v1 . 7
2 -189
Device Architecture
Table 2-129 • 1.5 V LVCMOS Low Slew
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 1.4 V
Applicable to Standard I/Os
Drive
Strength
2 mA
Speed
Grade
tDOUT
tDP
tDIN
tPY
tEOUT
tZL
tZH
tLZ
tHZ
Units
Std.
0.66
12.33
0.04
1.42
0.43
11.79
12.33
2.45
2.32
ns
–1
0.56
10.49
0.04
1.21
0.36
10.03
10.49
2.08
1.98
ns
–2
0.49
9.21
0.03
1.06
0.32
8.81
9.21
1.83
1.73
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
Table 2-130 • 1.5 V LVCMOS High Slew
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 1.4 V
Applicable to Standard I/Os
Drive
Strength
2 mA
Speed
Grade
tDOUT
tDP
tDIN
tPY
tEOUT
tZL
tZH
tLZ
tHZ
Units
Std.
0.66
7.65
0.04
1.42
0.43
6.31
7.65
2.45
2.45
ns
–1
0.56
6.50
0.04
1.21
0.36
5.37
6.50
2.08
2.08
ns
–2
0.49
5.71
0.03
1.06
0.32
4.71
5.71
1.83
1.83
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
2 -1 9 0
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
3.3 V PCI, 3.3 V PCI-X
The Peripheral Component Interface for 3.3 V standard specifies support for 33 MHz and 66 MHz
PCI Bus applications.
Table 2-131 • Minimum and Maximum DC Input and Output Levels
3.3 V PCI/PCI-X
Drive Strength
VIL
VIH
VOL
VOH
Min., V Max., V Min., V Max., V Max., V Min., V
Per PCI
specification
IOL
IOH
mA
mA
IOSL
IOSH
IIL
IIH
Max., Max.,
mA1 mA1 µA2 µA2
Per PCI curves
10
10
Notes:
1. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.
2. Currents are measured at 85°C junction temperature.
AC loadings are defined per the PCI/PCI-X specifications for the datapath; Actel loadings for enable
path characterization are described in Figure 2-115.
R to VCCI for tDP (F)
R to GND for tDP (R)
R = 25
Test Point
Data Path
R=1k
Test Point
Enable Path
R to VCCI for tLZ/tZL/tZLS
R to GND for tHZ/tZH/tZHS
10 pF for tZH/tZHS/tZL/tZLS
5 pF for tHZ/tLZ
Figure 2-115 • AC Loading
AC loadings are defined per PCI/PCI-X specifications for the data path; Actel loading for tristate
is described in Table 2-132.
Table 2-132 • AC Waveforms, Measuring Points, and Capacitive Loads
Input LOW (V)
0
Input HIGH (V)
Measuring Point* (V)
VREF (typ.) (V)
CLOAD (pF)
3.3
0.285 * VCCI for tDP(R)
–
10
0.615 * VCCI for tDP(F)
Note: *Measuring point = Vtrip. See Table 2-87 on page 2-165 for a complete table of trip points.
Pr e li m i n a ry v1 . 7
2 -191
Device Architecture
Timing Characteristics
Table 2-133 • 3.3 V PCI/PCI-X
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V
Applicable to Pro I/Os
Speed
Grade
tDOUT
tDP
tDIN
tPY
tPYS
tEOUT
tZL
tZH
tLZ
tHZ
tZLS
tZHS
Units
Std.
0.66
2.81
0.04
1.05
1.67
0.43
2.86
2.00
3.28
3.61
5.09
4.23
ns
–1
0.56
2.39
0.04
0.89
1.42
0.36
2.43
1.70
2.79
3.07
4.33
3.60
ns
–2
0.49
2.09
0.03
0.78
1.25
0.32
2.13
1.49
2.45
2.70
3.80
3.16
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
Table 2-134 • 3.3 V PCI/PCI-X
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V
Applicable to Advanced I/Os
Speed
Grade
tDOUT
tDP
tDIN
tPY
tPYS
tEOUT
tZL
tZH
tLZ
tHZ
tZLS
tZHS
Units
Std.
0.66
2.68
0.04
0.86
0.43
2.73
1.95
3.21
3.58
4.97
4.19
0.66
ns
–1
0.56
2.28
0.04
0.73
0.36
2.32
1.66
2.73
3.05
4.22
3.56
0.56
ns
–2
0.49
2.00
0.03
0.65
0.32
2.04
1.46
2.40
2.68
3.71
3.13
0.49
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
2 -1 9 2
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
Voltage Referenced I/O Characteristics
3.3 V GTL
Gunning Transceiver Logic is a high-speed bus standard (JESD8-3). It provides a differential
amplifier input buffer and an open-drain output buffer. The VCCI pin should be connected to 3.3 V.
Table 2-135 • Minimum and Maximum DC Input and Output Levels
3.3 V GTL
Drive
Strength
VIL
Min., V
25 mA3
–0.3
VIH
Max., V
Min., V
VREF – 0.05 VREF + 0.05
VOL
Max., V
VOH
IOL IOH
Max., V Min., V mA mA
3.6
0.4
–
25
25
IOSL
Max.,
mA1
IOSH
IIL
IIH
Max.,
mA1 µA2 µA2
181
268
10
10
Note:
1. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.
2. Currents are measured at 85°C junction temperature.
3. Output drive strength is below JEDEC specification.
VTT
GTL
25
Test Point
10 pF
Figure 2-116 • AC Loading
Table 2-136 • AC Waveforms, Measuring Points, and Capacitive Loads
Input LOW (V)
VREF – 0.05
Input HIGH (V)
Measuring Point* (V)
VREF (typ.) (V)
VTT (typ.) (V)
CLOAD (pF)
VREF + 0.05
0.8
0.8
1.2
10
Note: *Measuring point = Vtrip. See Table 2-87 on page 2-165 for a complete table of trip points.
Timing Characteristics
Table 2-137 • 3.3 V GTL
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V,
VREF = 0.8 V
Speed
Grade
tDOUT
tDP
tDIN
tPY
tEOUT
tZL
tZH
Std.
0.66
2.08
0.04
2.93
0.43
2.04
–1
0.56
1.77
0.04
2.50
0.36
–2
0.49
1.55
0.03
2.19
0.32
tLZ
tHZ
tZLS
tZHS
Units
2.08
4.27
4.31
ns
1.73
1.77
3.63
3.67
ns
1.52
1.55
3.19
3.22
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
Pr e li m i n a ry v1 . 7
2 -193
Device Architecture
2.5 V GTL
Gunning Transceiver Logic is a high-speed bus standard (JESD8-3). It provides a differential
amplifier input buffer and an open-drain output buffer. The VCCI pin should be connected to 2.5 V.
Table 2-138 • Minimum and Maximum DC Input and Output Levels
2.5 GTL
VIL
Drive
Strength
Min.,
V
25 mA3
–0.3
VIH
Max., V
Min., V
VOL
Max., V
VREF – 0.05 VREF + 0.05
3.6
VOH
IOL
IOH
Max., V Min., V mA
mA
0.4
–
25
25
IOSL
IOSH
IIL
IIH
Max., Max.,
mA1 mA1 µA2
124
169
µA2
10
10
1.
1. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.
2. Currents are measured at 85°C junction temperature.
3. Output drive strength is below JEDEC specification.
VTT
GTL
25
Test Point
10 pF
Figure 2-117 • AC Loading
Table 2-139 • AC Waveforms, Measuring Points, and Capacitive Loads
Input LOW (V)
VREF – 0.05
Input HIGH (V)
Measuring Point* (V)
VREF (typ.) (V)
VTT (typ.) (V)
CLOAD (pF)
VREF + 0.05
0.8
0.8
1.2
10
Note: *Measuring point = Vtrip. See Table 2-87 on page 2-165 for a complete table of trip points.
Timing Characteristics
Table 2-140 • 2.5 V GTL
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V,
VREF = 0.8 V
Speed
Grade
tDOUT
tDP
tDIN
tPY
tEOUT
tZL
tZH
Std.
0.66
2.13
0.04
2.46
0.43
2.16
–1
0.56
1.81
0.04
2.09
0.36
–2
0.49
1.59
0.03
1.83
0.32
tLZ
tHZ
tZLS
tZHS
Units
2.13
4.40
4.36
ns
1.84
1.81
3.74
3.71
ns
1.61
1.59
3.28
3.26
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
2 -1 9 4
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
3.3 V GTL+
Gunning Transceiver Logic Plus is a high-speed bus standard (JESD8-3). It provides a differential
amplifier input buffer and an open-drain output buffer. The VCCI pin should be connected to 3.3 V.
Table 2-141 • Minimum and Maximum DC Input and Output Levels
3.3 V GTL+
Drive
Strength
35 mA
VIL
VIH
VOL
Min., V
Max., V
Min., V
Max., V
–0.3
VREF – 0.1
VREF + 0.1
3.6
VOH
Max., V Min., V
0.6
–
IOL IOH
IOSL
m
A
m
A
Max.,
mA1
35
35
181
IOSH
IIL
IIH
Max.
,
mA1 µA2 µA2
268
10
10
Notes:
1. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.
2. Currents are measured at 85°C junction temperature.
VTT
GTL+
25
Test Point
10 pF
Figure 2-118 • AC Loading
Table 2-142 • AC Waveforms, Measuring Points, and Capacitive Loads
Input LOW (V)
VREF – 0.1
Input HIGH (V)
Measuring Point* (V)
VREF (typ.) (V)
VTT (typ.) (V)
CLOAD (pF)
VREF + 0.1
1.0
1.0
1.5
10
Note: *Measuring point = Vtrip. See Table 2-87 on page 2-165 for a complete table of trip points.
Timing Characteristics
Table 2-143 • 3.3 V GTL+
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V,
VREF = 1.0 V
Speed
Grade
tDOUT
tDP
tDIN
tPY
tEOUT
tZL
tZH
Std.
0.66
2.06
0.04
1.59
0.43
2.09
–1
0.56
1.75
0.04
1.35
0.36
–2
0.49
1.53
0.03
1.19
0.32
tLZ
tHZ
tZLS
tZHS
Units
2.06
4.33
4.29
ns
1.78
1.75
3.68
3.65
ns
1.56
1.53
3.23
3.20
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
Pr e li m i n a ry v1 . 7
2 -195
Device Architecture
2.5 V GTL+
Gunning Transceiver Logic Plus is a high-speed bus standard (JESD8-3). It provides a differential
amplifier input buffer and an open-drain output buffer. The VCCI pin should be connected to 2.5 V.
Table 2-144 • Minimum and Maximum DC Input and Output Levels
2.5 V GTL+
Drive
Strength
33 mA
VIL
Min., V
–0.3
VIH
Max., V
Min., V
VREF – 0.1 VREF + 0.1
VOL
Max., Max.,
V
V
3.6
VOH
IOL
IOH
IOSL
IOSH
Min.,
V
mA
mA
Max.,
mA1
Max.,
mA1
–
33
33
124
169
0.6
IIL
IIH
µA2 µA2
10
10
Notes:
1. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.
2. Currents are measured at 85°C junction temperature.
VTT
GTL+
25
Test Point
10 pF
Figure 2-119 • AC Loading
Table 2-145 • AC Waveforms, Measuring Points, and Capacitive Loads
Input LOW (V)
VREF – 0.1
Input HIGH (V)
Measuring Point* (V)
VREF (typ.) (V)
VTT (typ.) (V)
CLOAD (pF)
VREF + 0.1
1.0
1.0
1.5
10
Note: *Measuring point = Vtrip. See Table 2-87 on page 2-165 for a complete table of trip points.
Timing Characteristics
Table 2-146 • 2.5 V GTL+
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 2.3 V,
VREF = 1.0 V
Speed
Grade
tDOUT
tDP
tDIN
tPY
tEOUT
tZL
tZH
Std.
0.66
2.21
0.04
1.51
0.43
2.25
–1
0.56
1.88
0.04
1.29
0.36
–2
0.49
1.65
0.03
1.13
0.32
tLZ
tHZ
tZLS
tZHS
Units
2.10
4.48
4.34
ns
1.91
1.79
3.81
3.69
ns
1.68
1.57
3.35
4.34
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
2 -1 9 6
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
HSTL Class I
High-Speed Transceiver Logic is a general-purpose high-speed 1.5 V bus standard (EIA/JESD8-6).
Fusion devices support Class I. This provides a differential amplifier input buffer and a push-pull
output buffer.
Table 2-147 • Minimum and Maximum DC Input and Output Levels
HSTL Class I
Drive
Strength
VIL
Min., V
8 mA
–0.3
VIH
Max., V
Min., V
VREF – 0.1 VREF + 0.1
VOL
VOH
Max., V Max., V
3.6
0.4
Min., V
VCCI – 0.4
IOL
IOH
IOSL
IOSH
IIL
IIH
Max.
Max.,
,
mA mA mA1 mA1 µA2 µA2
8
8
39
32
10
10
Notes:
1. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.
2. Currents are measured at 85°C junction temperature.
HSTL
Class I
VTT
50
Test Point
20 pF
Figure 2-120 • AC Loading
Table 2-148 • AC Waveforms, Measuring Points, and Capacitive Loads
Input LOW (V)
VREF – 0.1
Input HIGH (V)
Measuring Point* (V)
VREF (typ.) (V)
VTT (typ.) (V)
CLOAD (pF)
VREF + 0.1
0.75
0.75
0.75
20
Note: *Measuring point = Vtrip. See Table 2-87 on page 2-165 for a complete table of trip points.
Timing Characteristics
Table 2-149 • HSTL Class I
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 1.4 V,
VREF = 0.75 V
Speed
Grade
tDOUT
tDP
tDIN
tPY
tEOUT
tZL
tZH
Std.
0.66
3.18
0.04
2.12
0.43
3.24
–1
0.56
2.70
0.04
1.81
0.36
–2
0.49
2.37
0.03
1.59
0.32
tLZ
tHZ
tZLS
tZHS
Units
3.14
5.47
5.38
ns
2.75
2.67
4.66
4.58
ns
2.42
2.35
4.09
4.02
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
Pr e li m i n a ry v1 . 7
2 -197
Device Architecture
HSTL Class II
High-Speed Transceiver Logic is a general-purpose high-speed 1.5 V bus standard (EIA/JESD8-6).
Fusion devices support Class II. This provides a differential amplifier input buffer and a push-pull
output buffer.
Table 2-150 • Minimum and Maximum DC Input and Output Levels
HSTL Class II
Drive
Strength
VIL
Min., V
15 mA3
VIH
Max., V
–0.3
Min., V
VOL
VOH
Max., V Max., V
VREF – 0.1 VREF + 0.1
3.6
0.4
Min., V
VCCI – 0.4
IOL
IOH
mA mA
15
15
IOSL
IOSH
IIL
IIH
Max., Max., µA µA
2
2
mA1
mA1
55
66
10
10
Note:
1. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.
2. Currents are measured at 85°C junction temperature.
3. Output drive strength is below JEDEC specification.
HSTL
Class II
VTT
25
Test Point
20 pF
Figure 2-121 • AC Loading
Table 2-151 • AC Waveforms, Measuring Points, and Capacitive Loads
Input LOW (V)
VREF – 0.1
Input HIGH (V)
Measuring Point* (V)
VREF (typ.)
(V)
VTT (typ.) (V)
CLOAD (pF)
VREF + 0.1
0.75
0.75
0.75
20
Note: *Measuring point = Vtrip. See Table 2-87 on page 2-165 for a complete table of trip points.
Timing Characteristics
Table 2-152 • HSTL Class II
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 1.4 V,
VREF = 0.75 V
Speed
Grade
tDOUT
tDP
tDIN
tPY
tEOUT
tZL
tZH
Std.
0.66
3.02
0.04
2.12
0.43
3.08
–1
0.56
2.57
0.04
1.81
0.36
–2
0.49
2.26
0.03
1.59
0.32
tLZ
tHZ
tZLS
tZHS
Units
2.71
5.32
4.95
ns
2.62
2.31
4.52
4.21
ns
2.30
2.03
3.97
3.70
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
2 -1 9 8
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
SSTL2 Class I
Stub-Speed Terminated Logic for 2.5 V memory bus standard (JESD8-9). Fusion devices support Class
I. This provides a differential amplifier input buffer and a push-pull output buffer.
Table 2-153 • Minimum and Maximum DC Input and Output Levels
SSTL2 Class I
Drive
Strength
VIL
Min., V
15 mA
–0.3
VIH
Max., V
Min., V
VREF – 0.2 VREF + 0.2
VOL
VOH
Max., V Max., V
3.6
0.54
IOL
Min., V
VCCI – 0.62
IOH
IOSL
IOSH
IIL
IIH
Max., Max.,
mA mA mA1 mA1 µA2 µA2
15
15
87
83
10
10
Notes:
1. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.
2. Currents are measured at 85°C junction temperature.
SSTL2
Class I
VTT
50
Test Point
25
30 pF
Figure 2-122 • AC Loading
Table 2-154 • AC Waveforms, Measuring Points, and Capacitive Loads
Input LOW (V)
VREF – 0.2
Input HIGH (V)
Measuring Point* (V)
VREF (typ.) (V)
VTT (typ.) (V)
CLOAD (pF)
VREF + 0.2
1.25
1.25
1.25
30
Note: *Measuring point = Vtrip. See Table 2-87 on page 2-165 for a complete table of trip points.
Timing Characteristics
Table 2-155 • SSTL 2 Class I
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 2.3 V,
VREF = 1.25 V
Speed
Grade
tDOUT
tDP
tDIN
tPY
tEOUT
tZL
tZH
Std.
0.66
2.13
0.04
1.33
0.43
2.17
–1
0.56
1.81
0.04
1.14
0.36
–2
0.49
1.59
0.03
1.00
0.32
tLZ
tHZ
tZLS
tZHS
Units
1.85
4.40
4.08
ns
1.84
1.57
3.74
3.47
ns
1.62
1.38
3.29
3.05
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
Pr e li m i n a ry v1 . 7
2 -199
Device Architecture
SSTL2 Class II
Stub-Speed Terminated Logic for 2.5 V memory bus standard (JESD8-9). Fusion devices support Class
II. This provides a differential amplifier input buffer and a push-pull output buffer.
Table 2-156 • Minimum and Maximum DC Input and Output Levels
SSTL2 Class II
Drive
Strength
VIL
Min., V
18 mA
VIH
Max., V
–0.3
Min., V
VREF – 0.2 VREF + 0.2
VOL
VOH
IOL
Max., V
Max.,
V
Min., V
3.6
0.35
IOH
mA mA
VCCI – 0.43 18
18
IOSL
IOSH
IIL
IIH
Max., Max.,
mA1 mA1 µA2 µA2
124
169
10
10
Notes:
1. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.
2. Currents are measured at 85°C junction temperature.
SSTL2
Class II
VTT
25
Test Point
25
30 pF
Figure 2-123 • AC Loading
Table 2-157 • AC Waveforms, Measuring Points, and Capacitive Loads
Input LOW (V)
VREF – 0.2
Input HIGH (V)
Measuring Point* (V)
VREF (typ.) (V)
VTT (typ.) (V)
CLOAD (pF)
VREF + 0.2
1.25
1.25
1.25
30
Note: *Measuring point = Vtrip. See Table 2-87 on page 2-165 for a complete table of trip points.
Timing Characteristics
Table 2-158 • SSTL 2 Class II
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 2.3 V,
VREF = 1.25 V
Speed
Grade
tDOUT
tDP
tDIN
tPY
tEOUT
tZL
tZH
Std.
0.66
2.17
0.04
1.33
0.43
2.21
–1
0.56
1.84
0.04
1.14
0.36
–2
0.49
1.62
0.03
1.00
0.32
tLZ
tHZ
tZLS
tZHS
Units
1.77
4.44
4.01
ns
1.88
1.51
3.78
3.41
ns
1.65
1.32
3.32
2.99
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
2 -2 0 0
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
SSTL3 Class I
Stub-Speed Terminated Logic for 3.3 V memory bus standard (JESD8-8). Fusion devices support Class
I. This provides a differential amplifier input buffer and a push-pull output buffer.
Table 2-159 • Minimum and Maximum DC Input and Output Levels
SSTL3 Class I
VIL
Drive
Strength
Min.,
V
14 mA
–0.3
VIH
Max., V
Min., V
VREF – 0.2 VREF + 0.2
VOL
Max.,
V
Max., V
3.6
0.7
VOH
IOL
IOH
Min., V
mA
mA
VCCI – 1.1
14
14
IOSL
IOSH
IIL
IIH
Max., Max.,
mA1 mA1 µA2 µA2
54
51
10
10
Notes:
1. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.
2. Currents are measured at 85°C junction temperature.
SSTL3
Class I
VTT
50
Test Point
25
30 pF
Figure 2-124 • AC Loading
Table 2-160 • AC Waveforms, Measuring Points, and Capacitive Loads
Input LOW (V)
VREF – 0.2
Input HIGH (V)
Measuring Point* (V)
VREF (typ.) (V)
VTT (typ.) (V)
CLOAD (pF)
VREF + 0.2
1.5
1.5
1.485
30
Note: *Measuring point = Vtrip. See Table 2-87 on page 2-165 for a complete table of trip points.
Timing Characteristics
Table 2-161 • SSTL3 Class I
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V,
VREF = 1.5 V
Speed
Grade
tDOUT
tDP
tDIN
tPY
tEOUT
tZL
tZH
Std.
0.66
2.31
0.04
1.25
0.43
2.35
–1
0.56
1.96
0.04
1.06
0.36
–2
0.49
1.72
0.03
0.93
0.32
tLZ
tHZ
tZLS
tZHS
Units
1.84
4.59
4.07
ns
2.00
1.56
3.90
3.46
ns
1.75
1.37
3.42
3.04
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on page 3-9.
Pr e li m i n a ry v1 . 7
2 -201
Device Architecture
SSTL3 Class II
Stub-Speed Terminated Logic for 3.3 V memory bus standard (JESD8-8). Fusion devices support Class
II. This provides a differential amplifier input buffer and a push-pull output buffer.
Table 2-162 • Minimum and Maximum DC Input and Output Levels
SSTL3 Class II
Drive
Strength
VIL
Min., V
21 mA
VIH
Max., V
–0.3
VOL
VOH
Max., Max.
V
,V
Min., V
VREF – 0.2 VREF + 0.2
3.6
IOL
Min., V
0.5
IOH
mA mA
VCCI – 0.9
21
21
IOSL
Max.,
mA1
109
IOSH
IIL
IIH
Max.,
mA1 µA2 µA2
103
10
10
Notes:
1. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.
2. Currents are measured at 85°C junction temperature.
SSTL3
Class II
VTT
25
Test Point
25
30 pF
Figure 2-125 • AC Loading
Table 2-163 • AC Waveforms, Measuring Points, and Capacitive Loads
Input LOW (V)
VREF – 0.2
Input HIGH (V)
Measuring Point* (V)
VREF (typ.) (V)
VTT (typ.) (V)
CLOAD (pF)
VREF + 0.2
1.5
1.5
1.485
30
Note: *Measuring point = Vtrip. See Table 2-87 on page 2-165 for a complete table of trip points.
Timing Characteristics
Table 2-164 • SSTL3- Class II
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V,
VREF = 1.5 V
Speed
Grade
tDOUT
tDP
tDIN
tPY
tEOUT
tZL
tZH
Std.
0.66
2.07
0.04
1.25
0.43
2.10
–1
0.56
1.76
0.04
1.06
0.36
–2
0.49
1.54
0.03
0.93
0.32
tLZ
tHZ
tZLS
tZHS
Units
1.67
4.34
3.91
ns
1.79
1.42
3.69
3.32
ns
1.57
1.25
3.24
2.92
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
2 -2 0 2
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
Differential I/O Characteristics
Configuration of the I/O modules as a differential pair is handled by the Actel Designer
software when the user instantiates a differential I/O macro in the design.
Differential I/Os can also be used in conjunction with the embedded Input Register (InReg), Output
Register (OutReg), Enable Register (EnReg), and Double Data Rate (DDR). However, there is no
support for bidirectional I/Os or tristates with these standards.
LVDS
Low-Voltage Differential Signal (ANSI/TIA/EIA-644) is a high-speed differential I/O standard. It
requires that one data bit be carried through two signal lines, so two pins are needed. It also
requires external resistor termination.
The full implementation of the LVDS transmitter and receiver is shown in an example in
Figure 2-126. The building blocks of the LVDS transmitter–receiver are one transmitter macro, one
receiver macro, three board resistors at the transmitter end, and one resistor at the receiver end.
The values for the three driver resistors are different from those used in the LVPECL
implementation because the output standard specifications are different.
Bourns Part Number: CAT16-LV4F12
OUTBUF_LVDS
FPGA
P
165 Ω
ZO = 50 Ω
ZO = 50 Ω
165 Ω
FPGA
+
–
100 Ω
140 Ω
N
P
INBUF_LVDS
N
Figure 2-126 • LVDS Circuit Diagram and Board-Level Implementation
Table 2-165 • Minimum and Maximum DC Input and Output Levels
DC Parameter
Description
Min.
Typ.
Max.
Units
2.375
2.5
2.625
V
VCCI
Supply Voltage
VOL
Output LOW Voltage
0.9
1.075
1.25
V
VOH
Input HIGH Voltage
1.25
1.425
1.6
V
3
Input LOW Voltage
0.65
0.91
1.16
mA
IOH3
Output HIGH Voltage
0.65
0.91
1.16
mA
VI
Input Voltage
2.925
V
IOL
0
IIL
Input LOW Voltage
10
μA
IIH4
Output HIGH Voltage
10
μA
VODIFF
Differential Output Voltage
VOCM
4
250
350
450
mV
Output Common Mode Voltage
1.125
1.25
1.375
V
VICM
Input Common Mode Voltage
0.05
1.25
2.35
V
VIDIFF
Input Differential Voltage
100
350
mV
Notes:
1. ±5%
2. Differential input voltage = ±350 mV
Pr e li m i n a ry v1 . 7
2 -203
Device Architecture
Table 2-166 • AC Waveforms, Measuring Points, and Capacitive Loads
Input LOW (V)
Input HIGH (V)
Measuring Point* (V)
VREF (typ.) (V)
1.325
Cross point
–
1.075
Note: *Measuring point = Vtrip. See Table 2-87 on page 2-165 for a complete table of trip points.
Timing Characteristics
Table 2-167 • LVDS
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 2.3 V
Applicable to Pro I/Os
Speed Grade
tDOUT
tDP
tDIN
tPY
Units
Std.
0.66
2.10
0.04
1.82
ns
–1
0.56
1.79
0.04
1.55
ns
–2
0.49
1.57
0.03
1.36
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
BLVDS/M-LVDS
Bus LVDS (BLVDS) and Multipoint LVDS (M-LVDS) specifications extend the existing LVDS standard
to high-performance multipoint bus applications. Multidrop and multipoint bus configurations can
contain any combination of drivers, receivers, and transceivers. Actel LVDS drivers provide the
higher drive current required by BLVDS and M-LVDS to accommodate the loading. The driver
requires series terminations for better signal quality and to control voltage swing. Termination is
also required at both ends of the bus, since the driver can be located anywhere on the bus. These
configurations can be implemented using TRIBUF_LVDS and BIBUF_LVDS macros along with
appropriate terminations. Multipoint designs using Actel LVDS macros can achieve up to 200 MHz
with a maximum of 20 loads. A sample application is given in Figure 2-127. The input and output
buffer delays are available in the LVDS section in Table 2-168.
Example: For a bus consisting of 20 equidistant loads, the following terminations provide the
required differential voltage, in worst-case industrial operating conditions at the farthest receiver:
RS = 60 Ω and RT = 70 Ω, given Z0 = 50 Ω (2") and Zstub = 50 Ω (~1.5").
Receiver
Transceiver
EN
R
+
RS
Zstub
D
EN
T
-
+
RS
Zstub
Driver
RS
Zstub
-
Zstub
RS
Zstub
EN
+
RS
Zstub
Transceiver
EN
R
-
+
RS
Receiver
RS
Zstub
EN
T
-
+
RS
Zstub
RS
BIBUF_LVDS
-
RS
...
Z0
Z0
Z0
Z0
Z0
Z0
RT Z
0
Z0
Z0
Z0
Z0
Z0
Figure 2-127 • BLVDS/M-LVDS Multipoint Application Using LVDS I/O Buffers
2 -2 0 4
Pr e li m i n a ry v1 . 7
R
T
Actel Fusion Mixed-Signal FPGAs
LVPECL
Low-Voltage Positive Emitter-Coupled Logic (LVPECL) is another differential I/O standard. It
requires that one data bit be carried through two signal lines. Like LVDS, two pins are needed. It
also requires external resistor termination.
The full implementation of the LVDS transmitter and receiver is shown in an example in
Figure 2-128. The building blocks of the LVPECL transmitter–receiver are one transmitter macro,
one receiver macro, three board resistors at the transmitter end, and one resistor at the receiver
end. The values for the three driver resistors are different from those used in the LVDS
implementation because the output standard specifications are different.
Bourns Part Number: CAT16-PC4F12
OUTBUF_LVPECL
FPGA
P
100 Ω
P
ZO = 50 Ω
INBUF_LVPECL
ZO = 50 Ω
100 Ω
N
+
–
100 Ω
187 W
FPGA
N
Figure 2-128 • LVPECL Circuit Diagram and Board-Level Implementation
Table 2-168 • Minimum and Maximum DC Input and Output Levels
DC Parameter
Description
Min.
Max.
Min.
3.0
Max.
Min.
3.3
Max.
Units
VCCI
Supply Voltage
3.6
VOL
Output LOW Voltage
0.96
1.27
1.06
1.43
1.30
1.57
V
VOH
Output HIGH Voltage
1.8
2.11
1.92
2.28
2.13
2.41
V
VIL, VIH
Input LOW, Input HIGH Voltages
0
3.3
0
3.6
0
3.9
V
VODIFF
Differential Output Voltage
0.625
0.97
0.625
0.97
0.625
0.97
V
VOCM
Output Common Mode Voltage
1.762
1.98
1.762
1.98
1.762
1.98
V
VICM
Input Common Mode Voltage
1.01
2.57
1.01
2.57
1.01
2.57
V
VIDIFF
Input Differential Voltage
300
300
V
300
mV
Table 2-169 • AC Waveforms, Measuring Points, and Capacitive Loads
Input LOW (V)
Input HIGH (V)
Measuring Point* (V)
VREF (typ.) (V)
1.94
Cross point
–
1.64
Note: *Measuring point = Vtrip. See Table 2-87 on page 2-165 for a complete table of trip points.
Timing Characteristics
Table 2-170 • LVPECL
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V
Applicable to Pro I/Os
Speed Grade
tDOUT
tDP
tDIN
tPY
Units
Std.
0.66
2.14
0.04
1.63
ns
–1
0.56
1.82
0.04
1.39
ns
–2
0.49
1.60
0.03
1.22
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
Pr e li m i n a ry v1 . 7
2 -205
Device Architecture
I/O Register Specifications
Fully Registered I/O Buffers with Synchronous Enable and Asynchronous Preset
INBUF
Preset
L
X
Pad Out
X
D
DOUT
Data_out
Enable
INBUF
CLK
CLKBUF
X
B
E
Y
X
F
Core
Array
X
G
X
X
E
X
E
PRE
D
Q
DFN1E1P1
TRIBUF
PRE
X D
Q
C DFN1E1P1
INBUF
Data
EOUT
H
X
X
A
I
X
J
X
K
X
CLKBUF
INBUF
INBUF
CLK
Enable
D_Enable
Data Input I/O Register with:
Active High Enable
Active High Preset
Positive Edge Triggered
PRE
D
Q
DFN1E1P1
E
Data Output Register and
Enable Output Register with:
Active High Enable
Active High Preset
Postive Edge Triggered
Figure 2-129 • Timing Model of Registered I/O Buffers with Synchronous Enable and Asynchronous Preset
2 -2 0 6
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
Table 2-171 • Parameter Definitions and Measuring Nodes
Parameter
Name
Parameter Definition
Measuring Nodes
(from, to)*
tOCLKQ
Clock-to-Q of the Output Data Register
H, DOUT
tOSUD
Data Setup Time for the Output Data Register
F, H
tOHD
Data Hold Time for the Output Data Register
F, H
tOSUE
Enable Setup Time for the Output Data Register
G, H
tOHE
Enable Hold Time for the Output Data Register
G, H
tOPRE2Q
Asynchronous Preset-to-Q of the Output Data Register
tOREMPRE
Asynchronous Preset Removal Time for the Output Data Register
L, H
tORECPRE
Asynchronous Preset Recovery Time for the Output Data Register
L, H
tOECLKQ
Clock-to-Q of the Output Enable Register
tOESUD
Data Setup Time for the Output Enable Register
J, H
tOEHD
Data Hold Time for the Output Enable Register
J, H
tOESUE
Enable Setup Time for the Output Enable Register
K, H
tOEHE
Enable Hold Time for the Output Enable Register
K, H
tOEPRE2Q
Asynchronous Preset-to-Q of the Output Enable Register
tOEREMPRE
Asynchronous Preset Removal Time for the Output Enable Register
I, H
tOERECPRE
Asynchronous Preset Recovery Time for the Output Enable Register
I, H
tICLKQ
Clock-to-Q of the Input Data Register
A, E
tISUD
Data Setup Time for the Input Data Register
C, A
tIHD
Data Hold Time for the Input Data Register
C, A
tISUE
Enable Setup Time for the Input Data Register
B, A
tIHE
Enable Hold Time for the Input Data Register
B, A
tIPRE2Q
Asynchronous Preset-to-Q of the Input Data Register
D, E
tIREMPRE
Asynchronous Preset Removal Time for the Input Data Register
D, A
tIRECPRE
Asynchronous Preset Recovery Time for the Input Data Register
D, A
L,DOUT
H, EOUT
I, EOUT
Note: *See Figure 2-129 on page 2-206 for more information.
Pr e li m i n a ry v1 . 7
2 -207
Device Architecture
Fully Registered I/O Buffers with Synchronous Enable and Asynchronous Clear
Y
D
CC
Core
Array
Q
DFN1E1C1
EE
D
Q
DFN1E1C1
TRIBUF
INBUF
Data
Pad Out
DOUT
Data_out FF
GG
INBUF
Enable
BB
EOUT
E
E
CLR
CLR
LL
INBUF
CLR
CLKBUF
CLK
HH
AA
JJ
DD
D
Q
DFN1E1C1
KK
E
CLR
INBUF
INBUF
CLKBUF
Enable
D_Enable
CLK
Data Input I/O Register with
Active High Enable
Active High Clear
Positive Edge Triggered
Data Output Register and
Enable Output Register with
Active High Enable
Active High Clear
Positive Edge Triggered
Figure 2-130 • Timing Model of the Registered I/O Buffers with Synchronous Enable and Asynchronous Clear
2 -2 0 8
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
Table 2-172 • Parameter Definitions and Measuring Nodes
Parameter Name
Parameter Definition
Measuring Nodes
(from, to)*
tOCLKQ
Clock-to-Q of the Output Data Register
HH, DOUT
tOSUD
Data Setup Time for the Output Data Register
FF, HH
tOHD
Data Hold Time for the Output Data Register
FF, HH
tOSUE
Enable Setup Time for the Output Data Register
GG, HH
tOHE
Enable Hold Time for the Output Data Register
GG, HH
tOCLR2Q
Asynchronous Clear-to-Q of the Output Data Register
tOREMCLR
Asynchronous Clear Removal Time for the Output Data Register
LL, HH
tORECCLR
Asynchronous Clear Recovery Time for the Output Data Register
LL, HH
tOECLKQ
Clock-to-Q of the Output Enable Register
tOESUD
Data Setup Time for the Output Enable Register
JJ, HH
tOEHD
Data Hold Time for the Output Enable Register
JJ, HH
tOESUE
Enable Setup Time for the Output Enable Register
KK, HH
tOEHE
Enable Hold Time for the Output Enable Register
KK, HH
tOECLR2Q
Asynchronous Clear-to-Q of the Output Enable Register
II, EOUT
tOEREMCLR
Asynchronous Clear Removal Time for the Output Enable Register
II, HH
tOERECCLR
Asynchronous Clear Recovery Time for the Output Enable Register
II, HH
tICLKQ
Clock-to-Q of the Input Data Register
AA, EE
tISUD
Data Setup Time for the Input Data Register
CC, AA
tIHD
Data Hold Time for the Input Data Register
CC, AA
tISUE
Enable Setup Time for the Input Data Register
BB, AA
tIHE
Enable Hold Time for the Input Data Register
BB, AA
tICLR2Q
Asynchronous Clear-to-Q of the Input Data Register
DD, EE
tIREMCLR
Asynchronous Clear Removal Time for the Input Data Register
DD, AA
tIRECCLR
Asynchronous Clear Recovery Time for the Input Data Register
DD, AA
LL, DOUT
HH, EOUT
Note: *See Figure 2-130 on page 2-208 for more information.
Pr e li m i n a ry v1 . 7
2 -209
Device Architecture
Input Register
tICKMPWH tICKMPWL
CLK
50%
50%
Enable
50%
1
50%
50%
50%
tIHD
tISUD
Data
50%
50%
50%
0
50%
tIREMPRE
tIRECPRE
tIWPRE
tIHE
Preset
tISUE
50%
50%
50%
tIWCLR
50%
Clear
tIRECCLR
tIREMCLR
50%
50%
tIPRE2Q
50%
Out_1
50%
50%
tICLR2Q
tICLKQ
Figure 2-131 • Input Register Timing Diagram
Timing Characteristics
Table 2-173 • Input Data Register Propagation Delays
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V
Parameter
Description
–2
–1
Std.
Units
tICLKQ
Clock-to-Q of the Input Data Register
0.24
0.27
0.32
ns
tISUD
Data Setup Time for the Input Data Register
0.26
0.30
0.35
ns
tIHD
Data Hold Time for the Input Data Register
0.00
0.00
0.00
ns
tISUE
Enable Setup Time for the Input Data Register
0.37
0.42
0.50
ns
tIHE
Enable Hold Time for the Input Data Register
0.00
0.00
0.00
ns
tICLR2Q
Asynchronous Clear-to-Q of the Input Data Register
0.45
0.52
0.61
ns
tIPRE2Q
Asynchronous Preset-to-Q of the Input Data Register
0.45
0.52
0.61
ns
tIREMCLR
Asynchronous Clear Removal Time for the Input Data Register
0.00
0.00
0.00
ns
tIRECCLR
Asynchronous Clear Recovery Time for the Input Data Register
0.22
0.25
0.30
ns
tIREMPRE
Asynchronous Preset Removal Time for the Input Data Register
0.00
0.00
0.00
ns
tIRECPRE
Asynchronous Preset Recovery Time for the Input Data Register
0.22
0.25
0.30
ns
tIWCLR
Asynchronous Clear Minimum Pulse Width for the Input Data Register
0.22
0.25
0.30
ns
tIWPRE
Asynchronous Preset Minimum Pulse Width for the Input Data Register 0.22
0.25
0.30
ns
tICKMPWH
Clock Minimum Pulse Width HIGH for the Input Data Register
0.36
0.41
0.48
ns
tICKMPWL
Clock Minimum Pulse Width LOW for the Input Data Register
0.32
0.37
0.43
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
2 -2 1 0
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
Output Register
tOCKMPWH tOCKMPWL
CLK
50%
50%
50%
50%
50%
50%
50%
tOSUD tOHD
1
Data_out
nable
50%
50%
0
50%
tOWPRE
tOHE
Preset
tOSUE
tOREMPRE
tORECPRE
50%
50%
50%
tOWCLR
50%
Clear
tOREMCLR
tORECCLR
50%
50%
tOPRE2Q
50%
DOUT
50%
tOCLR2Q
50%
tOCLKQ
Figure 2-132 • Output Register Timing Diagram
Timing Characteristics
Output Enable Register
Table 2-174 • Output Data Register Propagation Delays
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V
Parameter
Description
–2
–1
Std.
Units
tOCLKQ
Clock-to-Q of the Output Data Register
0.59
0.67
0.79
ns
tOSUD
Data Setup Time for the Output Data Register
0.31
0.36
0.42
ns
tOHD
Data Hold Time for the Output Data Register
0.00
0.00
0.00
ns
tOSUE
Enable Setup Time for the Output Data Register
0.44
0.50
0.59
ns
tOHE
Enable Hold Time for the Output Data Register
0.00
0.00
0.00
ns
tOCLR2Q
Asynchronous Clear-to-Q of the Output Data Register
0.80
0.91
1.07
ns
tOPRE2Q
Asynchronous Preset-to-Q of the Output Data Register
0.80
0.91
1.07
ns
tOREMCLR
Asynchronous Clear Removal Time for the Output Data Register
0.00
0.00
0.00
ns
tORECCLR
Asynchronous Clear Recovery Time for the Output Data Register
0.22
0.25
0.30
ns
tOREMPRE
Asynchronous Preset Removal Time for the Output Data Register
0.00
0.00
0.00
ns
tORECPRE
Asynchronous Preset Recovery Time for the Output Data Register
0.22
0.25
0.30
ns
tOWCLR
Asynchronous Clear Minimum Pulse Width for the Output Data
Register
0.22
0.25
0.30
ns
tOWPRE
Asynchronous Preset Minimum Pulse Width for the Output Data
Register
0.22
0.25
0.30
ns
tOCKMPWH
Clock Minimum Pulse Width HIGH for the Output Data Register
0.36
0.41
0.48
ns
Pr e li m i n a ry v1 . 7
2 -211
Device Architecture
Table 2-174 • Output Data Register Propagation Delays
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V
Parameter
tOCKMPWL
Description
Clock Minimum Pulse Width LOW for the Output Data Register
–2
–1
Std.
Units
0.32
0.37
0.43
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
tOECKMPWH tOECKMPWL
CLK
50%
50%
50%
50%
50%
50%
50%
tOESUD tOEHD
1
D_Enable
Enable
Preset
50%
0 50%
50%
tOESUEtOEHE
tOEWPRE
50%
tOEREMPRE
tOERECPRE
50%
50%
tOEWCLR
50%
Clear
EOUT
50%
50%
tOEPRE2Q
tOECLR2Q
50%
50%
tOECLKQ
Figure 2-133 • Output Enable Register Timing Diagram
2 -2 1 2
tOERECCLR
Pr e li m i n a ry v1 . 7
tOEREMCLR
50%
Actel Fusion Mixed-Signal FPGAs
Timing Characteristics
Table 2-175 • Output Enable Register Propagation Delays
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V
Parameter
Description
–2
–1
Std.
Units
tOECLKQ
Clock-to-Q of the Output Enable Register
0.44 0.51
0.59
ns
tOESUD
Data Setup Time for the Output Enable Register
0.31 0.36
0.42
ns
tOEHD
Data Hold Time for the Output Enable Register
0.00 0.00
0.00
ns
tOESUE
Enable Setup Time for the Output Enable Register
0.44 0.50
0.58
ns
tOEHE
Enable Hold Time for the Output Enable Register
0.00 0.00
0.00
ns
tOECLR2Q
Asynchronous Clear-to-Q of the Output Enable Register
0.67 0.76
0.89
ns
tOEPRE2Q
Asynchronous Preset-to-Q of the Output Enable Register
0.67 0.76
0.89
ns
tOEREMCLR
Asynchronous Clear Removal Time for the Output Enable Register
0.00 0.00
0.00
ns
tOERECCLR
Asynchronous Clear Recovery Time for the Output Enable Register
0.22 0.25
0.30
ns
tOEREMPRE
Asynchronous Preset Removal Time for the Output Enable Register
0.00 0.00
0.00
ns
tOERECPRE
Asynchronous Preset Recovery Time for the Output Enable Register
0.22 0.25
0.30
ns
tOEWCLR
Asynchronous Clear Minimum Pulse Width for the Output Enable 0.22 0.25
Register
0.30
ns
tOEWPRE
Asynchronous Preset Minimum Pulse Width for the Output Enable 0.22 0.25
Register
0.30
ns
tOECKMPWH
Clock Minimum Pulse Width HIGH for the Output Enable Register
0.36 0.41
0.48
ns
tOECKMPWL
Clock Minimum Pulse Width LOW for the Output Enable Register
0.32 0.37
0.43
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
Pr e li m i n a ry v1 . 7
2 -213
Device Architecture
DDR Module Specifications
Input DDR Module
Input DDR
A
D
Data
INBUF
FF1
E
B
CLK
Out_QF
(to core)
CLKBUF
Out_QR
(to core)
FF2
C
CLR
INBUF
DDR_IN
Figure 2-134 • Input DDR Timing Model
Table 2-176 • Parameter Definitions
Parameter Name
Parameter Definition
Measuring Nodes (from, to)
tDDRICLKQ1
Clock-to-Out Out_QR
B, D
tDDRICLKQ2
Clock-to-Out Out_QF
B, E
tDDRISUD
Data Setup Time of DDR Input
A, B
tDDRIHD
Data Hold Time of DDR Input
A, B
tDDRICLR2Q1
Clear-to-Out Out_QR
C, D
tDDRICLR2Q2
Clear-to-Out Out_QF
C, E
tDDRIREMCLR
Clear Removal
C, B
tDDRIRECCLR
Clear Recovery
C, B
2 -2 1 4
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
CLK
tDDRISUD
Data
1
2
3
4
5
tDDRIHD
6
7
8
9
tDDRIRECCLR
CLR
tDDRIREMCLR
tDDRICLKQ1
tDDRICLR2Q1
Out_QF
2
6
4
tDDRICLKQ2
tDDRICLR2Q2
Out_QR
3
7
5
Figure 2-135 • Input DDR Timing Diagram
Timing Characteristics
Table 2-177 • Input DDR Propagation Delays
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V
Parameter
Description
–2
–1
Std.
Units
tDDRICLKQ1
Clock-to-Out Out_QR for Input DDR
0.39
0.44
0.52
ns
tDDRICLKQ2
Clock-to-Out Out_QF for Input DDR
0.27
0.31
0.37
ns
tDDRISUD
Data Setup for Input DDR
0.28
0.32
0.38
ns
tDDRIHD
Data Hold for Input DDR
0.00
0.00
0.00
ns
tDDRICLR2Q1
Asynchronous Clear-to-Out Out_QR for Input DDR
0.57
0.65
0.76
ns
tDDRICLR2Q2
Asynchronous Clear-to-Out Out_QF for Input DDR
0.46
0.53
0.62
ns
tDDRIREMCLR
Asynchronous Clear Removal Time for Input DDR
0.00
0.00
0.00
ns
tDDRIRECCLR
Asynchronous Clear Recovery Time for Input DDR
0.22
0.25
0.30
ns
tDDRIWCLR
Asynchronous Clear Minimum Pulse Width for Input DDR
0.22
0.25
0.30
ns
tDDRICKMPWH
Clock Minimum Pulse Width HIGH for Input DDR
0.36
0.41
0.48
ns
tDDRICKMPWL
Clock Minimum Pulse Width LOW for Input DDR
0.32
0.37
0.43
ns
FDDRIMAX
Maximum Frequency for Input DDR
MHz
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
Pr e li m i n a ry v1 . 7
2 -215
Device Architecture
Output DDR
Data_F
(from core)
A
X
FF1
B
CLK
CLKBUF
C
D
Data_R
(from core)
Out
0
X
E
X
X
OUTBUF
1
X
FF2
BX
CLR
INBUF
CX
DDR_OUT
Figure 2-136 • Output DDR Timing Model
Table 2-178 • Parameter Definitions
Parameter Name
2 -2 1 6
Parameter Definition
Measuring Nodes (From, To)
tDDROCLKQ
Clock-to-Out
B, E
tDDROCLR2Q
Asynchronous Clear-to-Out
C, E
tDDROREMCLR
Clear Removal
C, B
tDDRORECCLR
Clear Recovery
C, B
tDDROSUD1
Data Setup Data_F
A, B
tDDROSUD2
Data Setup Data_R
D, B
tDDROHD1
Data Hold Data_F
A, B
tDDROHD2
Data Hold Data_R
D, B
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Actel Fusion Mixed-Signal FPGAs
CLK
tDDROSUD2 tDDROHD2
Data_F
1
2
tDDROSUD1
Data_R 6
4
3
5
tDDROHD1
7
8
9
10
11
tDDRORECCLR
CLR
tDDROREMCLR
tDDROCLR2Q
Out
tDDROCLKQ
2
7
8
3
9
4
10
Figure 2-137 • Output DDR Timing Diagram
Timing Characteristics
Table 2-179 • Output DDR Propagation Delays
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V
Parameter
Description
–2
–1
Std.
Units
tDDROCLKQ
Clock-to-Out of DDR for Output DDR
0.70
0.80
0.94
ns
tDDROSUD1
Data_F Data Setup for Output DDR
0.38
0.43
0.51
ns
tDDROSUD2
Data_R Data Setup for Output DDR
0.38
0.43
0.51
ns
tDDROHD1
Data_F Data Hold for Output DDR
0.00
0.00
0.00
ns
tDDROHD2
Data_R Data Hold for Output DDR
0.00
0.00
0.00
ns
tDDROCLR2Q
Asynchronous Clear-to-Out for Output DDR
0.80
0.91
1.07
ns
tDDROREMCLR
Asynchronous Clear Removal Time for Output DDR
0.00
0.00
0.00
ns
tDDRORECCLR
Asynchronous Clear Recovery Time for Output DDR
0.22
0.25
0.30
ns
tDDROWCLR1
Asynchronous Clear Minimum Pulse Width for Output DDR
0.22
0.25
0.30
ns
tDDROCKMPWH
Clock Minimum Pulse Width HIGH for the Output DDR
0.36
0.41
0.48
ns
tDDROCKMPWL
Clock Minimum Pulse Width LOW for the Output DDR
0.32
0.37
0.43
ns
FDDOMAX
Maximum Frequency for the Output DDR
MHz
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
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2 -217
Device Architecture
Pin Descriptions
Supply Pins
GND
Ground
Ground supply voltage to the core, I/O outputs, and I/O logic.
GNDQ
Ground (quiet)
Quiet ground supply voltage to input buffers of I/O banks. Within the package, the GNDQ plane is
decoupled from the simultaneous switching noise originated from the output buffer ground
domain. This minimizes the noise transfer within the package and improves input signal integrity.
GNDQ needs to always be connected on the board to GND. Note: In FG256, FG484, and FG676
packages, GNDQ and GND pins are connected within the package and are labeled as GND pins in
the respective package pin assignment tables.
ADCGNDREF
Analog Reference Ground
Analog ground reference used by the ADC. This pad should be connected to a quiet analog
ground.
GNDA
Ground (analog)
Quiet ground supply voltage to the Analog Block of Fusion devices. The use of a separate analog
ground helps isolate the analog functionality of the Fusion device from any digital switching noise.
A 0.2 V maximum differential voltage between GND and GNDA/GNDQ should apply to system
implementation.
GNDAQ
Ground (analog quiet)
Quiet ground supply voltage to the analog I/O of Fusion devices. The use of a separate analog
ground helps isolate the analog functionality of the Fusion device from any digital switching noise.
A 0.2 V maximum differential voltage between GND and GNDA/GNDQ should apply to system
implementation. Note: In FG256, FG484, and FG676 packages, GNDAQ and GNDA pins are
connected within the package and are labeled as GNDA pins in the respective package pin
assignment tables.
GNDNVM
Flash Memory Ground
Ground supply used by the Fusion device's flash memory block module(s).
GNDOSC
Oscillator Ground
Ground supply for both integrated RC oscillator and crystal oscillator circuit.
VCC15A
Analog Power Supply (1.5 V)
A 1.5 V analog power supply input should be used to provide this input.
VCC33A
Analog Power Supply (3.3 V)
3.3 V clean analog power supply input for use by the 3.3 V portion of the analog circuitry.
VCC33N
Negative 3.3 V Output
This is the –3.3 V output from the voltage converter. A 2.2 µF capacitor must be connected from
this pin to ground.
VCC33PMP
Analog Power Supply (3.3 V)
3.3 V clean analog power supply input for use by the analog charge pump. To avoid high current
draw, VCC33PMP should be powered up before or simultaneously with VCC33A.
VCCNVM
Flash Memory Block Power Supply (1.5 V)
1.5 V power supply input used by the Fusion device's flash memory block module(s). To avoid high
current draw, VCC should be powered up before or simultaneously with VCCNVM.
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Actel Fusion Mixed-Signal FPGAs
VCCOSC
Oscillator Power Supply (3.3 V)
Power supply for both integrated RC oscillator and crystal oscillator circuit.
VCC
Core Supply Voltage
Supply voltage to the FPGA core, nominally 1.5 V. VCC is also required for powering the JTAG state
machine, in addition to VJTAG. Even when a Fusion device is in bypass mode in a JTAG chain of
interconnected devices, both VCC and VJTAG must remain powered to allow JTAG signals to pass
through the Fusion device.
VCCIBx
I/O Supply Voltage
Supply voltage to the bank's I/O output buffers and I/O logic. Bx is the I/O bank number. There are
either four (AFS090 and AFS250) or five (AFS600 and AFS1500) I/O banks on the Fusion devices plus
a dedicated VJTAG bank.
Each bank can have a separate VCCI connection. All I/Os in a bank will run off the same VCCIBx
supply. VCCI can be 1.5 V, 1.8 V, 2.5 V, or 3.3 V, nominal voltage. Unused I/O banks should have their
corresponding VCCI pins tied to GND.
VCCPLA/B
PLL Supply Voltage
Supply voltage to analog PLL, nominally 1.5 V, where A and B refer to the PLL. AFS090 and AFS250
each have a single PLL. The AFS600 and AFS1500 devices each have two PLLs. Actel recommends
tying VCCPLX to VCC and using proper filtering circuits to decouple VCC noise from PLL.
If unused, VCCPLA/B should be tied to GND.
VCOMPLA/B
Ground for West and East PLL
VCOMPLA is the ground of the west PLL (CCC location F) and VCOMPLB is the ground of the east PLL
(CCC location C).
VJTAG
JTAG Supply Voltage
Fusion devices have a separate bank for the dedicated JTAG pins. The JTAG pins can be run at any
voltage from 1.5 V to 3.3 V (nominal). Isolating the JTAG power supply in a separate I/O bank gives
greater flexibility in supply selection and simplifies power supply and PCB design. If the JTAG
interface is neither used nor planned to be used, the VJTAG pin together with the TRST pin could be
tied to GND. It should be noted that VCC is required to be powered for JTAG operation; VJTAG alone
is insufficient. If a Fusion device is in a JTAG chain of interconnected boards and it is desired to
power down the board containing the Fusion device, this may be done provided both VJTAG and
VCC to the Fusion part remain powered; otherwise, JTAG signals will not be able to transition the
Fusion device, even in bypass mode.
VPUMP
Programming Supply Voltage
Fusion devices support single-voltage ISP programming of the configuration flash and FlashROM.
For programming, VPUMP should be in the 3.3 V +/-5% range. During normal device operation,
VPUMP can be left floating or can be tied to any voltage between 0 V and 3.6 V.
When the VPUMP pin is tied to ground, it shuts off the charge pump circuitry, resulting in no sources
of oscillation from the charge pump circuitry.
For proper programming, 0.01 µF and 0.33 µF capacitors (both rated at 16 V) are to be connected in
parallel across VPUMP and GND, and positioned as close to the FPGA pins as possible.
User-Defined Supply Pins
VREF
I/O Voltage Reference
Reference voltage for I/O minibanks. Both AFS600 and AFS1500 (north bank only) support Actel Pro
I/O. These I/O banks support voltage reference standard I/O. The VREF pins are configured by the
user from regular I/Os, and any I/O in a bank, except JTAG I/Os, can be designated as the voltage
reference I/O. Only certain I/O standards require a voltage reference—HSTL (I) and (II), SSTL2 (I) and
(II), SSTL3 (I) and (II), and GTL/GTL+. One VREF pin can support the number of I/Os available in its
minibank.
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Device Architecture
VAREF
Analog Reference Voltage
The Fusion device can be configured to generate a 2.56 V internal reference voltage that can be
used by the ADC. While using the internal reference, the reference voltage is output on the VAREF
pin for use as a system reference. If a different reference voltage is required, it can be supplied by
an external source and applied to this pin. The valid range of values that can be supplied to the
ADC is 1.0 V to 3.3 V. When VAREF is internally generated by the Fusion device, a bypass capacitor
must be connected from this pin to ground. The value of the bypass capacitor should be between
3.3 µF and 22 µF, which is based on the needs of the individual designs. The choice of the capacitor
value has an impact on the settling time it takes the VAREF signal to reach the required
specification of 2.56 V to initiate valid conversions by the ADC. If the lower capacitor value is
chosen, the settling time required for VAREF to achieve 2.56 V will be shorter than when selecting
the larger capacitor value. The above range of capacitor values supports the accuracy specification
of the ADC, which is detailed in the datasheet. Designers choosing the smaller capacitor value will
not obtain as much margin in the accuracy as that achieved with a larger capacitor value.
Depending on the capacitor value selected in the Analog System Builder, a tool in Libero IDE, an
automatic delay circuit will be generated using logic tiles available within the FPGA to ensure that
VAREF has achieved the 2.56 V value. Actel recommends customers use 10 µF as the value of the
bypass capacitor. Designers choosing to use an external VAREF need to ensure that a stable and
clean VAREF source is supplied to the VAREF pin before initiating conversions by the ADC.
Designers should also make sure that the ADCRESET signal is deasserted before initiating valid
conversions.2
User Pins
I/O
User Input/Output
The I/O pin functions as an input, output, tristate, or bidirectional buffer. Input and output signal
levels are compatible with the I/O standard selected. Unused I/O pins are configured as inputs with
pull-up resistors.
During programming, I/Os become tristated and weakly pulled up to VCCI. With the VCCI and VCC
supplies continuously powered up, when the device transitions from programming to operating
mode, the I/Os get instantly configured to the desired user configuration.
Axy
Analog Input/Output
Analog I/O pin, where x is the analog pad type (C = current pad, G = Gate driver pad,
T = Temperature pad, V = Voltage pad) and y is the Analog Quad number (0 to 9). There is a
minimum 1 MΩ to ground on AV, AC, and AT. This pin can be left floating when it is unused.
ATRTNx
Temperature Monitor Return
AT returns are the returns for the temperature sensors. The cathode terminal of the external diodes
should be connected to these pins. There is one analog return pin for every two Analog Quads. The
x in the ATRTNx designator indicates the quad pairing (x = 0 for AQ1 and AQ2, x = 1 for AQ2 and
AQ3, ..., x = 4 for AQ8 and AQ9). The signals that drive these pins are called out as ATRETUNxy in
the software (where x and y refer to the quads that share the return signal). ATRTN is internally
connected to ground. It can be left floating when it is unused.
GL
Globals
GL I/Os have access to certain clock conditioning circuitry (and the PLL) and/or have direct access to
the global network (spines). Additionally, the global I/Os can be used as Pro I/Os since they have
identical capabilities. Unused GL pins are configured as inputs with pull-up resistors. See more
detailed descriptions of global I/O connectivity in the "Clock Conditioning Circuits" section on
page 2-24.
Refer to the "User I/O Naming Convention" section on page 2-157 for a description of naming of
global pins.
2. The ADC is functional with an external reference down to 1V, however to meet the performance
parameters highlighted in the datasheet refer to the VAREF specification in Table 3-2 on page 3-3.
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Actel Fusion Mixed-Signal FPGAs
JTAG Pins
Fusion devices have a separate bank for the dedicated JTAG pins. The JTAG pins can be run at any
voltage from 1.5 V to 3.3 V (nominal). VCC must also be powered for the JTAG state machine to
operate, even if the device is in bypass mode; VJTAG alone is insufficient. Both VJTAG and VCC to the
Fusion part must be supplied to allow JTAG signals to transition the Fusion device.
Isolating the JTAG power supply in a separate I/O bank gives greater flexibility with supply
selection and simplifies power supply and PCB design. If the JTAG interface is neither used nor
planned to be used, the VJTAG pin together with the TRST pin could be tied to GND.
TCK
Test Clock
Test clock input for JTAG boundary scan, ISP, and UJTAG. The TCK pin does not have an internal
pull-up/-down resistor. If JTAG is not used, Actel recommends tying off TCK to GND or VJTAG
through a resistor placed close to the FPGA pin. This prevents JTAG operation in case TMS enters an
undesired state.
Note that to operate at all VJTAG voltages, 500 Ω to 1 kΩ will satisfy the requirements. Refer to
Table 2-180 for more information.
Table 2-180 • Recommended Tie-Off Values for the TCK and TRST Pins
Tie-Off Resistance2, 3
VJTAG
VJTAG at 3.3 V
200 Ω to 1 kΩ
VJTAG at 2.5 V
200 Ω to 1 kΩ
VJTAG at 1.8 V
500 Ω to 1 kΩ
VJTAG at 1.5 V
500 Ω to 1 kΩ
Notes:
1. Equivalent parallel resistance if more than one device is on JTAG chain.
2. The TCK pin can be pulled up/down.
3. The TRST pin can only be pulled down.
TDI
Test Data Input
Serial input for JTAG boundary scan, ISP, and UJTAG usage. There is an internal weak pull-up
resistor on the TDI pin.
TDO
Test Data Output
Serial output for JTAG boundary scan, ISP, and UJTAG usage.
TMS
Test Mode Select
The TMS pin controls the use of the IEEE1532 boundary scan pins (TCK, TDI, TDO, TRST). There is an
internal weak pull-up resistor on the TMS pin.
TRST
Boundary Scan Reset Pin
The TRST pin functions as an active low input to asynchronously initialize (or reset) the boundary
scan circuitry. There is an internal weak pull-up resistor on the TRST pin. If JTAG is not used, an
external pull-down resistor could be included to ensure the TAP is held in reset mode. The resistor
values must be chosen from Table 2-180 and must satisfy the parallel resistance value requirement.
The values in Table 2-180 correspond to the resistor recommended when a single device is used and
to the equivalent parallel resistor when multiple devices are connected via a JTAG chain.
In critical applications, an upset in the JTAG circuit could allow entering an undesired JTAG state. In
such cases, Actel recommends tying off TRST to GND through a resistor placed close to the FPGA
pin.
Note that to operate at all VJTAG voltages, 500 Ω to 1 kΩ will satisfy the requirements.
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2 -221
Device Architecture
Special Function Pins
NC
No Connect
This pin is not connected to circuitry within the device. These pins can be driven to any voltage or
can be left floating with no effect on the operation of the device.
DC
Don't Connect
This pin should not be connected to any signals on the PCB. These pins should be left unconnected.
NCAP
Negative Capacitor
Negative Capacitor is where the negative terminal of the charge pump capacitor is connected. A
capacitor, with a 2.2 µF recommended value, is required to connect between PCAP and NCAP.
PCAP
Positive Capacitor
Positive Capacitor is where the positive terminal of the charge pump capacitor is connected. A
capacitor, with a 2.2 µF recommended value, is required to connect between PCAP and NCAP.
PUB
Push Button
Push button is the connection for the external momentary switch used to turn on the 1.5 V voltage
regulator and can be floating if not used.
PTBASE
Pass Transistor Base
Pass Transistor Base is the control signal of the voltage regulator. This pin should be connected to
the base of the external pass transistor used with the 1.5 V internal voltage regulator and can be
floating if not used.
PTEM
Pass Transistor Emitter
Pass Transistor Emitter is the feedback input of the voltage regulator.
This pin should be connected to the emitter of the external pass transistor used with the 1.5 V
internal voltage regulator and can be floating if not used.
XTAL1
Crystal Oscillator Circuit Input
Input to crystal oscillator circuit. Pin for connecting external crystal, ceramic resonator, RC network,
or external clock input. When using an external crystal or ceramic oscillator, external capacitors are
also recommended (Please refer to the crystal oscillator manufacturer for proper capacitor value).
If using external RC network or clock input, XTAL1 should be used and XTAL2 left unconnected.
XTAL2
Crystal Oscillator Circuit Input
Input to crystal oscillator circuit. Pin for connecting external crystal, ceramic resonator, RC network,
or external clock input. When using an external crystal or ceramic oscillator, external capacitors are
also recommended (Please refer to the crystal oscillator manufacturer for proper capacitor value).
If using external RC network or clock input, XTAL1 should be used and XTAL2 left unconnected.
Software Tools and Programming
Overview of Tools Flow
The Fusion family of FPGAs is fully supported by both Actel Libero IDE and Designer FPGA
development software. Actel Libero IDE is an integrated design manager that seamlessly integrates
design tools while guiding the user through the design flow, managing all design and log files, and
passing necessary design data among tools. Additionally, Libero IDE allows users to integrate both
schematic and HDL synthesis into a single flow and verify the entire design in a single environment
(see the Libero IDE flow diagram located on the Actel website). Libero IDE includes Synplify® AE
from Synplicity,® ViewDraw® AE from Mentor Graphics,® ModelSim® HDL Simulator from Mentor
Graphics, WaveFormer Lite™ AE from SynaptiCAD,® PALACE™ AE Physical Synthesis from Magma
Design Automation,™ and Designer software from Actel.
2 -2 2 2
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
Actel Designer software is a place-and-route tool and provides a comprehensive suite of backend
support tools for FPGA development. The Designer software includes the following:
•
SmartTime – a world-class integrated static timing analyzer and constraints editor that
supports timing-driven place-and-route
•
NetlistViewer – a design netlist schematic viewer
•
ChipPlanner – a graphical floorplanning viewer and editor
•
SmartPower – a sophisticated power analysis environment that gives designers the ability to
quickly determine the power consumption of an FPGA or its components
•
PinEditor – a graphical application for editing pin assignments and I/O attributes
•
I/O Attribute Editor – displays all assigned and unassigned I/O macros and their attributes in
a spreadsheet format
With the Designer software, a user can lock the design pins before layout while minimally
impacting the results of place-and-route. Additionally, the Actel back-annotation flow is
compatible with all major simulators. Included in the Designer software is SmartGen core
generator, which easily creates commonly used logic functions for implementation into your
Fusion-based schematic or HDL design.
Actel Designer software is compatible with the most popular FPGA design entry and verification
tools from EDA vendors, such as Cadence,® Magma,® Mentor Graphics, Synopsys, and Synplicity.
The Designer software is available for both the Windows® and UNIX operating systems.
CoreMP7 and Cortex-M1 Software Tools
CoreConsole is the Intellectual Property Deployment Platform (IDP) that assists the developer in
programming the soft ARM core onto M7 (CoreMP7) and M1 (Cortex-M1) Fusion devices.
CoreConsole provides the seamless environment to work with the Libero IDE and Designer FPGA
development software tools concurrently.
Security
Fusion devices have a built-in 128-bit AES decryption core. The decryption core facilitates secure, insystem programming of the FPGA core array fabric and the FlashROM. The FlashROM and the FPGA
core fabric can be programmed independently from each other, allowing the FlashROM to be
updated without the need for change to the FPGA core fabric. The AES master key is stored in onchip nonvolatile memory (flash). The AES master key can be preloaded into parts in a secure
programming environment (such as the Actel in-house programming center), and then "blank"
parts can be shipped to an untrusted programming or manufacturing center for final
personalization with an AES-encrypted bitstream. Late stage product changes or personalization
can be implemented easily and securely by simply sending a STAPL file with AES-encrypted data.
Secure remote field updates over public networks (such as the Internet) are possible by sending and
programming a STAPL file with AES-encrypted data. For more information, refer to the Fusion
Security application note.
128-Bit AES Decryption
The 128-bit AES standard (FIPS-192) block cipher is the National Institute of Standards and
Technology (NIST) replacement for DES (Data Encryption Standard FIPS46-2). AES has been
designed to protect sensitive government information well into the 21st century. It replaces the
aging DES, which NIST adopted in 1977 as a Federal Information Processing Standard used by
federal agencies to protect sensitive, unclassified information. The 128-bit AES standard has
3.4 × 1038 possible 128-bit key variants, and it has been estimated that it would take 1,000 trillion
years to crack 128-bit AES cipher text using exhaustive techniques. Keys are stored (securely) in
Fusion devices in nonvolatile flash memory. All programming files sent to the device can be
authenticated by the part prior to programming to ensure that bad programming data is not
loaded into the part that may possibly damage it. All programming verification is performed onchip, ensuring that the contents of Fusion devices remain secure.
Pr e li m i n a ry v1 . 7
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Device Architecture
AES decryption can also be used on the 1,024-bit FlashROM to allow for secure remote updates of
the FlashROM contents. This allows for easy, secure support for subscription model products. See
the application note Fusion Security for more details.
AES for Flash Memory
AES decryption can also be used on the flash memory blocks. This allows for the secure update of
the flash memory blocks. During runtime, the encrypted data can be clocked in via the JTAG
interface. The data can be passed through the internal AES decryption engine, and the decrypted
data can then be stored in the flash memory block.
Programming
Programming can be performed using various programming tools, such as Silicon Sculptor II (BP
Micro Systems) or FlashPro3 (Actel).
The user can generate STP programming files from the Designer software and can use these files to
program a device.
Fusion devices can be programmed in-system. During programming, VCCOSC is needed in order to
power the internal 100 MHz oscillator. This oscillator is used as a source for the 20 MHz oscillator
that is used to drive the charge pump for programming.
ISP
Fusion devices support IEEE 1532 ISP via JTAG and require a single VPUMP voltage of 3.3 V during
programming. In addition, programming via a microcontroller in a target system can be achieved.
Refer to the standard or the In-System Programming (ISP) of Actel's Low-Power Flash Devices Using
FlashPro3 document for more details.
JTAG IEEE 1532
Programming with IEEE 1532
Fusion devices support the JTAG-based IEEE1532 standard for ISP. As part of this support, when a
Fusion device is in an unprogrammed state, all user I/O pins are disabled. This is achieved by
keeping the global IO_EN signal deactivated, which also has the effect of disabling the input
buffers. Consequently, the SAMPLE instruction will have no effect while the Fusion device is in this
unprogrammed state—different behavior from that of the ProASICPLUS® device family. This is done
because SAMPLE is defined in the IEEE1532 specification as a noninvasive instruction. If the input
buffers were to be enabled by SAMPLE temporarily turning on the I/Os, then it would not truly be
a noninvasive instruction. Refer to the standard or the In-System Programming (ISP) of Actel's LowPower Flash Devices Using FlashPro3 document for more details.
Boundary Scan
Fusion devices are compatible with IEEE Standard 1149.1, which defines a hardware architecture
and the set of mechanisms for boundary scan testing. The basic Fusion boundary scan logic circuit is
composed of the test access port (TAP) controller, test data registers, and instruction register
(Figure 2-138 on page 2-226). This circuit supports all mandatory IEEE 1149.1 instructions (EXTEST,
SAMPLE/PRELOAD, and BYPASS) and the optional IDCODE instruction (Table 2-182 on page 2-226).
Each test section is accessed through the TAP, which has five associated pins: TCK (test clock input),
TDI, TDO (test data input and output), TMS (test mode selector), and TRST (test reset input). TMS,
TDI, and TRST are equipped with pull-up resistors to ensure proper operation when no input data is
supplied to them. These pins are dedicated for boundary scan test usage. Refer to the "JTAG Pins"
section on page 2-221 for pull-up/-down recommendations for TDO and TCK pins. The TAP
controller is a 4-bit state machine (16 states) that operates as shown in Figure 2-138 on page 2-226.
The 1s and 0s represent the values that must be present on TMS at a rising edge of TCK for the
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Actel Fusion Mixed-Signal FPGAs
given state transition to occur. IR and DR indicate that the instruction register or the data register is
operating in that state.
Table 2-181 • TRST and TCK Pull-Down Recommendations
Tie-Off Resistance*
VJTAG
VJTAG at 3.3 V
200 Ω to 1 kΩ
VJTAG at 2.5 V
200 Ω to 1 kΩ
VJTAG at 1.8 V
500 Ω to 1 kΩ
VJTAG at 1.5 V
500 Ω to 1 kΩ
Note: *Equivalent parallel resistance if more than one device is on JTAG chain.
The TAP controller receives two control inputs (TMS and TCK) and generates control and clock
signals for the rest of the test logic architecture. On power-up, the TAP controller enters the TestLogic-Reset state. To guarantee a reset of the controller from any of the possible states, TMS must
remain HIGH for five TCK cycles. The TRST pin can also be used to asynchronously place the TAP
controller in the Test-Logic-Reset state.
Fusion devices support three types of test data registers: bypass, device identification, and
boundary scan. The bypass register is selected when no other register needs to be accessed in a
device. This speeds up test data transfer to other devices in a test data path. The 32-bit device
identification register is a shift register with four fields (LSB, ID number, part number, and version).
The boundary scan register observes and controls the state of each I/O pin. Each I/O cell has three
boundary scan register cells, each with a serial-in, serial-out, parallel-in, and parallel-out pin.
The serial pins are used to serially connect all the boundary scan register cells in a device into a
boundary scan register chain, which starts at the TDI pin and ends at the TDO pin. The parallel
ports are connected to the internal core logic I/O tile and the input, output, and control ports of an
I/O buffer to capture and load data into the register to control or observe the logic state of each
I/O.
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Device Architecture
I/O
I/O
I/O
I/O
I/O
TDI
Test Data
Registers
TAP
Controller
Instruction
Register
Device
Logic
TDO
I/O
TRST
I/O
TMS
I/O
TCK
I/O
Bypass Register
I/O
I/O
I/O
I/O
I/O
Figure 2-138 • Boundary Scan Chain in Fusion
Table 2-182 • Boundary Scan Opcodes
Hex Opcode
2 -2 2 6
EXTEST
00
HIGHZ
07
USERCODE
0E
SAMPLE/PRELOAD
01
IDCODE
0F
CLAMP
05
BYPASS
FF
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Actel Fusion Mixed-Signal FPGAs
IEEE 1532 Characteristics
JTAG timing delays do not include JTAG I/Os. To obtain complete JTAG timing, add I/O buffer delays
to the corresponding standard selected; refer to the I/O timing characteristics in the "User I/Os"
section on page 2-130 for more details.
Timing Characteristics
Table 2-183 • JTAG 1532
Commercial-Case Conditions: TJ = 70°C, VCC = 1.425 V
Parameter
Description
–2
–1
Std.
Units
tDISU
Test Data Input Setup Time
0.50
0.57
0.67
ns
tDIHD
Test Data Input Hold Time
1.00
1.13
1.33
ns
tTMSSU
Test Mode Select Setup Time
0.50
0.57
0.67
ns
tTMDHD
Test Mode Select Hold Time
1.00
1.13
1.33
ns
tTCK2Q
Clock to Q (data out)
6.00
6.80
8.00
ns
tRSTB2Q
Reset to Q (data out)
20.00
22.67
26.67
ns
FTCKMAX
TCK Maximum Frequency
25.00
22.00
19.00
MHz
tTRSTREM
ResetB Removal Time
0.00
0.00
0.00
ns
tTRSTREC
ResetB Recovery Time
0.20
0.23
0.27
ns
tTRSTMPW
ResetB Minimum Pulse
TBD
TBD
TBD
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to
Table 3-7 on page 3-9.
Pr e li m i n a ry v1 . 7
2 -227
Device Architecture
Part Number and Revision Date
Part Number 51700092-014-0
Revised October 2008
List of Changes
The following table lists critical changes that were made in the current version of the document.
Previous Version
Advance v1.6
(August 2008)
Changes in Current Version (Preliminary v1.7)
Page
The version number category was changed from Advance to Preliminary, which
means the datasheet contains information based on simulation and/or initial
characterization. The information is believed to be correct, but changes are
possible.
N/A
The following updates were made to Table 2-38 •Temperature Data Format:
2-98
Temperature
Digital Output
213
00 1111 1101
283
01 0001 1011
358
01 0110 0110 – only the digital output was updated.
Temperature 358 remains in the temperature column.
In Advance v1.2, the "VAREF Analog Reference Voltage" pin description was
significantly updated but the change was not noted in the change table.
2-220
Advance v1.5
(July 2008)
The references to the Peripherals User’s Guide in the "No-Glitch MUX
(NGMUX)" section and "Voltage Regulator Power Supply Monitor (VRPSM)"
section were changed to Fusion Handbook.
2-32,
2-40
Advance v1.4
(July 2008)
The title of the datasheet changed from Actel Programmable System Chips to
Actel Fusion Mixed-Signal FPGAs. In addition, all instances of programmable
system chip were changed to mixed-signal FPGA.
N/A
Advance v1.2
(June 2008)
The "ADC Description" section was significantly updated. Please review
carefully.
2-103
Advance v1.1
(May 2008)
Table 2-25 · Flash Memory Block Timing was significantly updated.
2-54
The "VAREF Analog Reference Voltage" pin description section was significantly
update. Please review it carefully.
2-220
Table 2-45 · ADC Interface Timingwas significantly updated.
2-109
Table 2-56 · Direct Analog Input Switch Control Truth Table—AV (x = 0), AC (x =
1), and AT (x = 3) was significantly updated.
2-128
The following sentence was deleted from the "Voltage Monitor" section:
2-86
The Analog Quad inputs are tolerant up to 12 V + 10%.
Advance v1.0
(January 2008)
The following text was incorrect and therefore deleted:
VCC33A
2-204
Analog Power Filter
Analog power pin for the analog power supply low-pass filter. An external 100
pF capacitor should be connected between this pin and ground.
There is still a description of VCC33A on page 2-218.
Advance v0.9
(October 2007)
2 -2 2 8
All Timing Characteristics tables were updated. For the Differential I/O
Standards, the Standard I/O support tables are new.
N/A
Table 2-3 · Array Coordinates was updated to change the max x and y values
2-9
Table 2-13 · Fusion CCC/PLL Specification was updated.
2-31
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
Previous Version
Advance v0.9
(continued)
Changes in Current Version (Preliminary v1.7)
Page
A note was added to Table 2-16 · RTC ACM Memory Map.
2-36
A reference to the Peripheral’s User’s Guide was added to the "Voltage
Regulator Power Supply Monitor (VRPSM)" section.
2-40
In Table 2-25 · Flash Memory Block Timing, the commercial conditions were
updated.
2-54
In Table 2-26 · FlashROM Access Time, the commercial conditions were missing
and have been added below the title of the table.
2-57
In Table 2-36 · Analog Block Pin Description, the function description was
updated for the ADCRESET.
2-82
In the "Voltage Monitor" section, the following sentence originally had ± 10%
and it was changed to +10%.
2-86
The Analog Quad inputs are tolerant up to 12 V + 10%.
In addition, this statement was deleted from the datasheet:
Each I/O will draw power when connected to power (3 mA at 3 V).
The "Terminology" section is new.
2-88
The "Current Monitor" section was significantly updated. Figure 2-71 · Timing
Diagram for Current Monitor Strobe to Figure 2-73 · Negative Current Monitor
and Table 2-37 · Recommended Resistor for Different Current Range
Measurement are new.
2-90
The "ADC Description" section was updated to add the "Terminology" section.
2-93
In the "Gate Driver" section, 25 mA was changed to 20 mA and 1.5 MHz was
changed to 1.3 MHz. In addition, the following sentence was deleted:
2-94
The maximum AG pad switching frequency is 1.25 MHz.
The "Temperature Monitor" section was updated to rewrite most of the text
and add Figure 2-77, Figure 2-78, and Figure 2-38 · Temperature Data Format.
2-96
In Table 2-38 · Temperature Data Format, the temperature K column was
changed for 85°C from 538 to 358.
2-98
In Table 2-45 · ADC Interface Timing, "Typical-Case" was changed to "WorstCase."
2-109
The "ADC Interface Timing" section is new.
2-109
Table 2-46 · Analog Channel Specifications was updated.
2-115
The "VCC15A Analog Power Supply (1.5 V)" section was updated.
2-218
The "VCCPLA/B PLL Supply Voltage" section is new.
2-219
In "VCCNVM Flash Memory Block Power Supply (1.5 V)" section, supply was
changed to supply input.
2-218
The "VCCPLA/B PLL Supply Voltage" pin description was updated to include the
following statement:
2-219
Actel recommends tying VCCPLX to VCC and using proper filtering circuits to
decouple VCC noise from PLL.
The "VCOMPLA/B Ground for West and East PLL" section was updated.
2-219
In Table 2-47 · ADC Characteristics in Direct Input Mode, the commercial
conditions were updated and note 2 is new.
2-118
The VCC33ACAP signal name was changed to "XTAL1 Crystal Oscillator Circuit
Input".
2-222
Pr e li m i n a ry v1 . 7
2 -229
Device Architecture
Previous Version
Advance v0.9
(continued)
Changes in Current Version (Preliminary v1.7)
Page
Table 2-48 · Uncalibrated Analog Channel Accuracy*is new.
2-120
Table 2-49 · Calibrated Analog Channel Accuracy 1,2,3, is new.
2-121
Table 2-50 · Analog Channel Accuracy: Monitoring Standard Positive Voltages is
new.
2-122
In Table 2-57 · Voltage Polarity Control Truth Table—AV (x = 0), AC (x = 1), and
AT (x = 3)*, the following I/O Bank names were changed:
2-128
Hot-Swap changed to Standard
LVDS changed to Advanced
In Table 2-58 · Prescaler Op Amp Power-Down Truth Table—AV (x = 0), AC (x =
1), and AT (x = 3), the following I/O Bank names were changed:
2-129
Hot-Swap changed to Standard
LVDS changed to Advanced
Advance v0.9
(continued)
In the title of Table 2-64 · I/O Standards Supported by Bank Type, LVDS I/O was
changed to Advanced I/O.
2-131
The title was changed from "Fusion Standard, LVDS, and Standard plus HotSwap I/O" to Table 2-68 · Fusion Standard and Advanced I/O Features. In
addition, the table headings were all updated. The heading used to be
Standard and LVDS I/O and was changed to Advanced I/O. Standard Hot-Swap
was changed to just Standard.
2-133
This sentence was deleted from the "Slew Rate Control and Drive Strength"
section:
2-150
The Standard hot-swap I/Os do not support slew rate control. In addition, these
references were changed:
• From: Fusion hot-swap I/O (Table 2-69 on page 2-122) To: Fusion Standard I/O
• From: Fusion LVDS I/O (Table 2-70 on page 2-122) To: Fusion Advanced I/O
The "Cold-Sparing Support" section was significantly updated.
2-140
In the title of Table 2-75 · Fusion Standard I/O Standards—OUT_DRIVE Settings,
Hot-Swap was changed to Standard.
2-151
In the title of Table 2-76 · Fusion Advanced I/O Standards—SLEW and
OUT_DRIVE Settings, LVDS was changed to Advanced.
2-151
In the title of Table 2-80 · Fusion Standard and Advanced I/O Attributes vs. I/O
Standard Applications, LVDS was changed to Advanced.
2-154
In Figure 2-105 · Naming Conventions of Fusion Devices with Three Digital I/O
Banks and Figure 2-106 · Naming Conventions of Fusion Devices with Four I/O
Banks the following names were changed:
2-158
Hot-Swap changed to Standard
LVDS changed to Advanced
Advance v0.7
(January 2007)
2 -2 3 0
The Figure 2-107 · Timing Model was updated.
2-159
In the notes for Table 2-86 · Summary of Maximum and Minimum DC Input
Levels Applicable to Commercial and Industrial Conditions, TJ was changed to
TA.
2-164
Figure 2-16 · Fusion Clocking Options and the "RC Oscillator" section were
updated to change GND_OSC and VCC_OSC to GNDOSC and VCCOSC.
2-20,
2-21
Figure 2-19 · Fusion CCC Options: Global Buffers with the PLL Macro was
updated to change the positions of OADIVRST and OADIVHALF, and a note was
added.
2-25
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
Previous Version
Advance v0.7
(continued)
Changes in Current Version (Preliminary v1.7)
Page
The "Crystal Oscillator" section was updated to include information about
controlling and enabling/disabling the crystal oscillator.
2-22
Table 2-11 · Electrical Characteristics of the Crystal Oscillator was updated to
change the typical value of IDYNXTAL for 0.032–0.2 MHz to 0.19.
2-23
The "1.5 V Voltage Regulator" section was updated to add "or floating" in the
paragraph stating that an external pull-down is required on TRST to power
down the VR.
2-39
The "1.5 V Voltage Regulator" section was updated to include information on
powering down with the VR.
2-39
This sentence was updated in the "No-Glitch MUX (NGMUX)" section to delete
GLA:
2-32
The GLMUXCFG[1:0] configuration bits determine the source of the CLK inputs
(i.e., internal signal or GLC).
In Table 2-14 · NGMUX Configuration and Selection Table, 10 and 11 were
deleted.
2-32
The method to enable sleep mode was updated for bit 0 in Table 2-17 · RTC
Control/Status Register.
2-37
S2 was changed to D2 in Figure 2-38 · Read Waveform (Pipe Mode, 32-bit
access) for RD[31:0] was updated.
2-50
The definitions for bits 2 and 3 were updated in Table 2-24 · Page Status Bit
Definition.
2-51
Figure 2-45 · FlashROM Timing Diagram was updated.
2-57
Table 2-26 · FlashROM Access Time is new.
2-57
Figure 2-54 · Write Access After Write onto Same Address, Figure 2-55 · Read
Access After Write onto Same Address, and Figure 2-56 · Write Access After
Read onto Same Address are new.
2-68–
2-70
Table 2-31 · RAM4K9 and Table 2-32 · RAM512X18 were updated.
2-71,
2-72
The VAREF and SAMPLE functions were updated in Table 2-36 · Analog Block
Pin Description.
2-82
The title of Figure 2-71 · Timing Diagram for Current Monitor Strobe was
updated to add the word "positive."
2-91
The "Gate Driver" section was updated to give information about the
switching rate in High Current Drive mode.
2-94
The "ADC Description" section was updated to include information about the
SAMPLE and BUSY signals and the maximum frequencies for SYSCLK and
ADCCLK. EQ 2-12 was updated to add parentheses around the entire
expression in the denominator.
2-103
Table 2-46 · Analog Channel Specifications and Table 2-47 · ADC Characteristics
in Direct Input Mode were updated.
2-115,
2-118
The note was removed from Table 2-55 · Analog Multiplexer Truth Table—AV (x
= 0), AC (x = 1), and AT (x = 3).
2-128
Table 2-63 · Internal Temperature Monitor Control Truth Table is new.
2-129
The "Cold-Sparing Support" section was updated to add information about
cases where current draw can occur.
2-140
Figure 2-98 · Solution 4 was updated.
2-146
Pr e li m i n a ry v1 . 7
2 -231
Device Architecture
Previous Version
Advance v0.7
(continued)
Changes in Current Version (Preliminary v1.7)
Page
Table 2-75 · Fusion Standard I/O Standards—OUT_DRIVE Settings was updated.
2-151
The "GNDA Ground (analog)" section and "GNDAQ Ground (analog quiet)"
section were updated to add information about maximum differential voltage.
2-218
The "VAREF Analog Reference Voltage" section and "VPUMP Programming
Supply Voltage" section were updated.
2-220
The "VCCPLA/B PLL Supply Voltage" section was updated to include information
about the east and west PLLs.
2-219
The VCOMPLF pin description was deleted.
N/A
The "Axy Analog Input/Output" section was updated with information about
grounding and floating the pin.
2-220
The voltage range in the "VPUMP Programming Supply Voltage" section was
updated. The parenthetical reference to "pulled up" was removed from the
statement, "VPUMP can be left floating or can be tied (pulled up) to any
2-219
The "ATRTNx Temperature Monitor Return" section was updated with
information about grounding and floating the pin.
2-220
The following text was deleted from the "VREF I/O Voltage Reference" section:
(all digital I/O).
2-219
The "NCAP Negative Capacitor" section and "PCAP Positive Capacitor" section
were updated to include information about the type of capacitor that is
required to connect the two.
2-222
1 µF was changed to 100 pF in the "XTAL1 Crystal Oscillator Circuit Input".
2-222
The "Programming" section was updated to include information about VCCOSC.
2-224
The second paragraph of the "PLL Macro" section was updated to include
information about POWERDOWN.
2-30
The description for bit 0 was updated in Table 2-17 · RTC Control/Status
Register.
2-37
3.9 was changed to 7.8 in the "Crystal Oscillator (Xtal Osc)" section.
2-38.
All function descriptions in Table 2-18 · Signals for VRPSM Macro.
2-40
In Table 2-19 · Flash Memory Block Pin Names, the RD[31:0] description was
updated.
2-42
The "RESET" section was updated.
2-61
The "RESET" section was updated.
2-64
Table 2-35 · FIFO was updated.
2-79
The VAREF function description was updated in Table 2-36 · Analog Block Pin
Description.
2-82
The "Voltage Monitor" section was updated to include information about low
power mode and sleep mode.
2-86
The text in the "Current Monitor" section was changed from 2 mV to 1 mV.
2-90
The "Gate Driver" section was updated to include information about forcing 1
V on the drain.
2-94
The "Analog-to-Digital Converter Block" section was updated with the
following statement:
"All results are MSB justified in the ADC."
2-100
voltage between 0 V and 3.6 V."
Advance v0.5
(June 2006)
2 -2 3 2
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
Previous Version
Advance v0.5
(continued)
Changes in Current Version (Preliminary v1.7)
Page
The information about the ADCSTART signal was updated in the "ADC
Description" section.
2-103
Table 2-46 · Analog Channel Specifications was updated.
2-115
Table 2-47 · ADC Characteristics in Direct Input Mode was updated.
2-118
Table 2-51 · ACM Address Decode Table for Analog Quad was updated.
2-124
In Table 2-53 · Analog Quad ACM Byte Assignment, the Function and Default
Setting for Bit 6 in Byte 3 was updated.
2-127
The "Introduction" section was updated to include information about digital
inputs, outputs, and bibufs.
2-130
In Table 2-69 · Fusion Pro I/O Features, the programmable delay descriptions
were updated for the following features:
2-134
Single-ended receiver
Voltage-referenced differential receiver
LVDS/LVPECL differential receiver features
The "User I/O Naming Convention" section was updated to include "V" and "z"
descriptions
2-157
The "VCC33PMP Analog Power Supply (3.3 V)" section was updated to include
information about avoiding high current draw.
2-218
The "VCCNVM Flash Memory Block Power Supply (1.5 V)" section was updated to
include information about avoiding high current draw.
2-218
The "VMVx I/O Supply Voltage (quiet)" section was updated to include this
statement: VMV and VCCI must be connected to the same power supply and
VCCI pins within a given I/O bank.
2-185
The "PUB Push Button" section was updated to include information about
leaving the pin floating if it is not used.
2-222
The "PTBASE Pass Transistor Base" section was updated to include information
about leaving the pin floating if it is not used.
2-222
The "PTEM Pass Transistor Emitter" section was updated to include information
about leaving the pin floating if it is not used.
2-222
Advance v0.4
(April 2006)
The "Voltage Regulator Power Supply Monitor (VRPSM)" section was updated.
2-40
Advance v0.2
(April 2006)
Figure 2-45 · FlashROM Timing Diagram was updated.
2-57
The "FlashROM" section was updated.
2-56
"RESET" section was updated.
2-61
"RESET" section was updated.
2-64
Figure 2-27 · Real-Time Counter System was updated.
2-34
Table 2-19 · Flash Memory Block Pin Names was updated.
2-42
Figure 2-32 · Flash Memory Block Diagram was updated to include AUX block
information.
2-44
Figure 2-33 · Flash Memory Block Organization was updated to include AUX
block information.
2-45
The note in the "Program Operation" section was updated.
2-47
Figure 2-75 · Gate Driver Example was updated.
2-95
Pr e li m i n a ry v1 . 7
2 -233
Device Architecture
Previous Version
Advance v0.2
(continued)
2 -2 3 4
Changes in Current Version (Preliminary v1.7)
Page
The "Analog Quad ACM Description" section was updated.
2-127
Information about the maximum pad input frequency was added to the "Gate
Driver" section.
2-94
Figure 2-64 · Analog Block Macro was updated.
2-81
Figure 2-64 · Analog Block Macro was updated.
2-81
The "Analog Quad" section was updated.
2-84
The "Voltage Monitor" section was updated.
2-86
The "Direct Digital Input" section was updated.
2-89
The "Current Monitor" section was updated.
2-90
Information about the maximum pad input frequency was added to the "Gate
Driver" section.
2-94
The "Temperature Monitor" section was updated.
2-96
EQ 2-12 is new.
2-104
The "ADC Description" section was updated.
2-103
Figure 2-16 · Fusion Clocking Options was updated.
2-20
Table 2-46 · Analog Channel Specifications was updated.
2-115
The notes in Table 2-72 · Fusion Standard and Advanced I/O – Hot-Swap and 5 V
Input Tolerance Capabilities were updated.
2-141
The "Simultaneously Switching Outputs and PCB Layout" section is new.
2-147
LVPECL and LVDS were updated in Table 2-80 · Fusion Standard and Advanced
I/O Attributes vs. I/O Standard Applications.
2-154
LVPECL and LVDS were updated in Table 2-81 · Fusion Pro I/O Attributes vs. I/O
Standard Applications.
2-154
The "Timing Model" was updated.
2-159
All voltage-referenced Minimum and Maximum DC Input and Output Level
tables were updated.
N/A
All Timing Characteristic tables were updated
N/A
Table 2-83 · Summary of Maximum and Minimum DC Input and Output Levels
Applicable to Commercial and Industrial Conditions was updated.
2-163
Table 2-79 • Summary of I/O Timing Characteristics – Software Default Settings
was updated.
2-134
Table 2-93 · I/O Output Buffer Maximum Resistances1 was updated.
2-169
The "BLVDS/M-LVDS" section is new. BLVDS and M-LVDS are two new I/O
standards included in the datasheet.
2-204
The "CoreMP7 and Cortex-M1 Software Tools" section is new.
2-223
Table 2-83 · Summary of Maximum and Minimum DC Input and Output Levels
Applicable to Commercial and Industrial Conditions was updated.
2-163
Table 2-79 • Summary of I/O Timing Characteristics – Software Default Settings
was updated.
2-134
Table 2-93 · I/O Output Buffer Maximum Resistances1 was updated.
2-169
The "BLVDS/M-LVDS" section is new. BLVDS and M-LVDS are two new I/O
standards included in the datasheet.
2-204
Pr e li m i n a ry v1 . 7
3 – DC and Power Characteristics
General Specifications
DC and switching characteristics for –F speed grade targets are based only on simulation.
The characteristics provided for –F speed grade are subject to change after establishing FPGA
specifications. Some restrictions might be added and will be reflected in future revisions of this
document. The –F speed grade is only supported in the commercial temperature range.
Operating Conditions
Stresses beyond those listed in Table 3-1 may cause permanent damage to the device.
Exposure to absolute maximum rated conditions for extended periods may affect device reliability.
Devices should not be operated outside the recommended operating ranges specified in Table 3-2
on page 3-3.
Table 3-1 •
Absolute Maximum Ratings
Symbol
Parameter
Commercial
Industrial
Units
VCC
DC core supply voltage
–0.3 to 1.65
–0.3 to 1.65
V
VJTAG
JTAG DC voltage
–0.3 to 3.75
–0.3 to 3.75
V
VPUMP
Programming voltage
–0.3 to 3.75
–0.3 to 3.75
V
VCCPLL
Analog power supply (PLL)
–0.3 to 1.65
–0.3 to 1.65
V
VCCI
DC I/O output buffer supply voltage
–0.3 to 3.75
–0.3 to 3.75
V
1
–0.3 V to 3.6 V (when I/O hot insertion mode
is enabled)
–0.3 V to (VCCI + 1 V) or 3.6 V, whichever
voltage is lower
(when I/O hot-insertion mode is disabled)
VI
I/O input voltage
VCC33A
+3.3 V power supply
–0.3 to 3.752
–0.3 to 3.752
V
VAREF
Voltage reference for ADC
–0.3 to 3.75
–0.3 to 3.75
V
VCC15A
Digital power supply for the analog system
–0.3 to 1.65
–0.3 to 1.65
V
VCCNVM
Embedded flash power supply
–0.3 to 1.65
–0.3 to 1.65
V
VCCOSC
Oscillator power supply
–0.3 to 3.75
–0.3 to 3.75
V
AV, AC
Unpowered,
unconfigured
–11.0 to 12.6
–11.0 to 12.4
V
Analog input (+16 V to +2 V prescaler range)
–0.4 to 12.6
–0.4 to 12.4
V
Analog input (+1 V to +0.125 V prescaler
range)
–0.4 to 3.75
–0.4 to 3.75
V
ADC
reset
asserted
or
V
Notes:
1. The device should be operated within the limits specified by the datasheet. During transitions, the input
signal may undershoot or overshoot according to the limits shown in Table 3-4 on page 3-4.
2. Analog data not valid beyond 3.65 V.
3. For flash programming and retention maximum limits, refer to Table 3-5 on page 3-5. For recommended
operating limits refer to Table 3-2 on page 3-3.
Pr e li m i n a ry v1 . 7
3-1
DC and Power Characteristics
Table 3-1 •
Absolute Maximum Ratings (continued)
Symbol
AG
AT
Parameter
Commercial
Industrial
Units
Analog input (–16 V to –2 V prescaler range)
–11.0 to 0.4
–11.0 to 0.4
V
Analog input (–1 V to –0.125 V prescaler
range)
–3.75 to 0.4
–3.75 to 0.4
V
Analog input (direct input to ADC)
–0.4 to 3.75
–0.4 to 3.75
V
Digital input
–0.4 to 12.6
–0.4 to 12.4
V
–11.0 to 12.6
–11.0 to 12.4
V
Low Current Mode (1 µA, 3 µA, 10 µA, 30 µA)
–0.4 to 12.6
–0.4 to 12.4
V
Low Current Mode (–1 µA, –3 µA, –10 µA, –30
µA)
–11.0 to 0.4
–11.0 to 0.4
V
High Current Mode3
–11.0 to 12.6
–11.0 to 12.4
V
–0.4 to 16.5
–0.4 to 16.0
V
Analog input (+16 V, 4 V prescaler range)
–0.4 to 16.5
–0.4 to 16.0
V
Analog input (direct input to ADC)
–0.4 to 3.75
–0.4 to 3.75
V
Digital input
–0.4 to 16.5
–0.4 to 16.0
V
Unpowered,
unconfigured
Unpowered,
unconfigured
ADC
ADC
reset
reset
asserted
asserted
or
or
TSTG3
Storage temperature
–65 to +150
°C
Tj3
Junction temperature
+125
°C
Notes:
1. The device should be operated within the limits specified by the datasheet. During transitions, the input
signal may undershoot or overshoot according to the limits shown in Table 3-4 on page 3-4.
2. Analog data not valid beyond 3.65 V.
3. For flash programming and retention maximum limits, refer to Table 3-5 on page 3-5. For recommended
operating limits refer to Table 3-2 on page 3-3.
3 -2
Pr e li m i n a r y v1 . 7
Actel Fusion Mixed-Signal FPGAs
Table 3-2 •
Recommended Operating Conditions
Symbol
Parameter
Commercial
TA,TJ
Ambient and junction temperature
VCC
1.5 V DC core supply voltage
VJTAG
JTAG DC voltage
VPUMP
Programming voltage
Programming mode
3
Operation
Industrial
Units
0 to +70
–40 to +85
°C
1.425 to 1.575
1.425 to 1.575
V
1.4 to 3.6
1.4 to 3.6
V
3.15 to 3.45
3.15 to 3.45
V
0 to 3.6
0 to 3.6
V
VCCPLL
Analog power supply (PLL)
1.425 to 1.575
1.425 to 1.575
V
VCCI
1.5 V DC supply voltage
1.425 to 1.575
1.425 to 1.575
V
1.8 V DC supply voltage
1.7 to 1.9
1.7 to 1.9
V
2.5 V DC supply voltage
2.3 to 2.7
2.3 to 2.7
V
3.3 V DC supply voltage
LVDS differential I/O
LVPECL differential I/O
3.0 to 3.6
3.0 to 3.6
V
2.375 to 2.625
2.375 to 2.625
V
3.0 to 3.6
3.0 to 3.6
V
2.97 to 3.63
2.97 to 3.63
V
VCC33A
+3.3 V power supply
VAREF
Voltage reference for ADC
2.527 to 2.593
2.527 to 2.593
V
VCC15A6
Digital power supply for the analog system
1.425 to 1.575
1.425 to 1.575
V
VCCNVM
Embedded flash power supply
1.425 to 1.575
1.425 to 1.575
V
VCCOSC
Oscillator power supply
2.97 to 3.63
2.97 to 3.63
V
Unpowered, ADC reset asserted or unconfigured
–10.5 to 12.0
–10.5 to 12.0
V
Analog input (+16 V to +2 V prescaler range)
–0.3 to 12.0
–0.3 to 12.0
V
Analog input (+1 V to + 0.125 V prescaler range)
–0.3 to 3.6
–0.3 to 3.6
V
Analog input (–16 V to –2 V prescaler range)
–10.5 to 0.3
–10.5 to 0.3
V
Analog input (–1 V to –0.125 V prescaler range)
–3.6 to 0.3
–3.6 to 0.3
V
Analog input (direct input to ADC)
–0.3 to 3.6
–0.3 to 3.6
V
Digital input
–0.3 to 12.0
–0.3 to 12.0
V
Unpowered, ADC reset asserted or unconfigured
–10.5 to 12.0
–10.5 to 12.0
V
Low Current Mode (1 µA, 3 µA, 10 µA, 30 µA)
–0.3 to 12.0
–0.3 to 12.0
V
Low Current Mode (–1 µA, –3 µA, –10 µA, –30 µA)
–10.5 to 0.3
–10.5 to 0.3
V
High Current Mode
–10.5 to 12.0
–10.5 to 12.0
V
Unpowered, ADC reset asserted or unconfigured
–0.3 to 16.0
–0.3 to 15.5
V
Analog input (+16 V, +4 V prescaler range)
AV, AC
4
AG
4
5
4
AT
–0.3 to 16.0
–0.3 to 15.5
V
Analog input (direct input to ADC)
–0.3 to 3.6
–0.3 to 3.6
V
Digital input
–0.3 to 16.0
–0.3 to 15.5
V
Notes:
1. The ranges given here are for power supplies only. The recommended input voltage ranges specific to each
I/O standard are given in Table 2-81 on page 2-154.
2. All parameters representing voltages are measured with respect to GND unless otherwise specified.
3. VPUMP can be left floating during normal operation (not programming mode).
4. The input voltage may overshoot by up to 500 mV above the Recommended Maximum (150 mV in Direct
mode), provided the duration of the overshoot is less than 50% of the operating lifetime of the device.
5. The AG pad should also conform to the limits as specified inTable 2-45 on page 2-109.
6. Violating the VCC15A recommended voltage supply during an embedded flash program cycle can corrupt
the page being programmed.
Pr e li m i n a ry v1 . 7
3-3
DC and Power Characteristics
Table 3-3 •
Input Resistance of Analog Pads
Pads
AV, AC
Pad Configuration
Prescaler Range
Input Resistance to Ground
+16 V to +2 V
1 MΩ (typical)
+1 V to +0.125 V
> 10 MΩ
+16 V to +2 V
1 MΩ (typical)
+1 V to +0.125 V
> 10 MΩ
–16 V to –2 V
1 MΩ (typical)
–1 V to –0.125 V
> 10 MΩ
Digital input
+16 V to +2 V
1 MΩ (typical)
Current monitor
+16 V to +2 V
1 MΩ (typical)
–16 V to –2 V
1 MΩ (typical)
Analog Input (direct input to ADC)
+16 V, +4 V
1 MΩ (typical)
Analog Input (positive prescaler)
+16 V, +4 V
1 MΩ (typical)
Digital input
+16 V, +4 V
1 MΩ (typical)
Temperature monitor
+16 V, +4 V
> 10 MΩ
Analog Input (direct input to ADC)
Analog Input (positive prescaler)
Analog Input (negative prescaler)
AT
Table 3-4 •
VCCI
Overshoot and Undershoot Limits 1
Average VCCI–GND Overshoot or Undershoot
Duration as a Percentage of Clock Cycle2
Maximum Overshoot/
Undershoot2
10%
1.4 V
5%
1.49 V
10%
1.1 V
5%
1.19 V
10%
0.79 V
5%
0.88 V
10%
0.45 V
5%
0.54 V
2.7 V or less
3.0 V
3.3 V
3.6 V
Notes:
1. Based on reliability requirements at 85°C.
2. The duration is allowed at one cycle out of six clock cycle. If the overshoot/undershoot occurs at one out of
two cycles, the maximum overshoot/undershoot has to be reduced by 0.15 V.
3 -4
Pr e li m i n a r y v1 . 7
Actel Fusion Mixed-Signal FPGAs
Table 3-5 •
FPGA Programming, Storage, and Operating Limits
Product
Grade
Commercial
Element
Retention
Minimum
Maximum
FPGA/FlashROM
500
20 years2
0
85
1k
years2
0
85
0
85
Embedded Flash
Industrial
Storage Temperature (°C)
Grade Programming
Cycles
20
2
15 k
5 years
FPGA/FlashROM
500
20 years
–40
85
Embedded Flash
1k
20 years
–40
85
15 k
5 years
–40
85
Notes:
1. This is a stress rating only. Functional operation at any condition other than those indicated is not implied.
2. If the embedded flash has been programmed less than 1 k times, every time it is programmed, the data will
hold for 20 years. If the embedded flash has been programmed more than 1 k times but less than 15 k
times, every time it is programmed, the data will hold for 5 years.
I/O Power-Up and Supply Voltage Thresholds for Power-On Reset
(Commercial and Industrial)
Sophisticated power-up management circuitry is designed into every Fusion device. These circuits
ensure easy transition from the powered off state to the powered up state of the device. The many
different supplies can power up in any sequence with minimized current spikes or surges. In
addition, the I/O will be in a known state through the power-up sequence. The basic principle is
shown in Figure 3-1 on page 3-6.
There are five regions to consider during power-up.
Fusion I/Os are activated only if ALL of the following three conditions are met:
1. VCC and VCCI are above the minimum specified trip points (Figure 3-1).
2. VCCI > VCC – 0.75 V (typical).
3. Chip is in the operating mode.
VCCI Trip Point:
Ramping up: 0.6 V < trip_point_up < 1.2 V
Ramping down: 0.5 V < trip_point_down < 1.1 V
VCC Trip Point:
Ramping up: 0.6 V < trip_point_up < 1.1 V
Ramping down: 0.5 V < trip_point_down < 1 V
VCC and VCCI ramp-up trip points are about 100 mV higher than ramp-down trip points. This
specifically built-in hysteresis prevents undesirable power-up oscillations and current surges. Note
the following:
•
During programming, I/Os become tristated and weakly pulled up to VCCI.
•
JTAG supply, PLL power supplies, and charge pump VPUMP supply have no influence on I/O
behavior.
Internal Power-Up Activation Sequence
1. Core
2. Input buffers
3. Output buffers, after 200 ns delay from input buffer activation
Pr e li m i n a ry v1 . 7
3-5
DC and Power Characteristics
PLL Behavior at Brownout Condition
Actel recommends using monotonic power supplies or voltage regulators to ensure proper powerup behavior. Power ramp-up should be monotonic at least until VCC and VCCPLX exceed brownout
activation levels. The VCC activation level is specified as 1.1 V worst-case (see Figure 3-1 on page 3-6
for more details).
When PLL power supply voltage and/or VCC levels drop below the VCC brownout levels (0.75 V ±
0.25 V), the PLL output lock signal goes low and/or the output clock is lost. Refer to the PowerUp/Down of Fusion FPGAs application note for information on clock and lock recovery.
VCC = VCCI + VT
Where VT can be from 0.58 V to 0.9 V (typically 0.75 V)
VCC
VCC = 1.575 V
Region 4: I/O
buffers are ON.
I/Os are functional
(except differential inputs)
but slower because VCCI is
below specification. For the
same reason, input buffers do not
meet VIH/VIL levels, and output
buffers do not meet VOH/VOL levels.
Region 1: I/O Buffers are OFF
Region 5: I/O buffers are ON
and power supplies are within
specification.
I/Os meet the entire datasheet
and timer specifications for
speed, VIH/VIL , VOH /VOL , etc.
VCC = 1.425 V
Region 2: I/O buffers are ON.
I/Os are functional (except differential inputs)
but slower because VCCI/VCC are below
specification. For the same reason, input
buffers do not meet VIH/VIL levels, and
output buffers do not meet VOH/VOL levels.
Activation trip point:
Va = 0.85 V ± 0.25 V
Deactivation trip point:
Vd = 0.75 V ± 0.25 V
Region 1: I/O buffers are OFF
Activation trip point:
Va = 0.9 V ±0.3 V
Deactivation trip point:
Vd = 0.8 V ± 0.3 V
Min VCCI datasheet specification
voltage at a selected I/O
standard; i.e., 1.425 V or 1.7 V
or 2.3 V or 3.0 V
Figure 3-1 • I/O State as a Function of VCCI and VCC Voltage Levels
3 -6
Region 3: I/O buffers are ON.
I/Os are functional; I/O DC
specifications are met,
but I/Os are slower because
the VCC is below specification
Pr e li m i n a r y v1 . 7
VCCI
Actel Fusion Mixed-Signal FPGAs
Thermal Characteristics
Introduction
The temperature variable in the Actel Designer software refers to the junction temperature, not
the ambient, case, or board temperatures. This is an important distinction because dynamic and
static power consumption will cause the chip's junction temperature to be higher than the
ambient, case, or board temperatures. EQ 3-1 through EQ 3-3 give the relationship between
thermal resistance, temperature gradient, and power.
TJ – θA
θ JA = ---------------P
EQ 3-1
θ JB
TJ – TB
= --------------P
θ JC
TJ – TC
= ---------------P
EQ 3-2
EQ 3-3
where
θJA = Junction-to-air thermal resistance
Table 3-6 •
θJB
= Junction-to-board thermal resistance
θJC
= Junction-to-case thermal resistance
TJ
= Junction temperature
TA
= Ambient temperature
TB
= Board temperature (measured 1.0 mm away from
the package edge)
TC
= Case temperature
P
= Total power dissipated by the device
Package Thermal Resistance
θJA
Still Air
1.0 m/s
2.5 m/s
θJC
θJB
Units
AFS090-QN108
TBD
TBD
TBD
TBD
TBD
°C/W
AFS090-QN180
TBD
TBD
TBD
TBD
TBD
°C/W
AFS250-QN180
TBD
TBD
TBD
TBD
TBD
°C/W
AFS250-PQ208
TBD
TBD
TBD
TBD
TBD
°C/W
AFS600-PQ208
TBD
TBD
TBD
TBD
TBD
°C/W
AFS090-FG256
37.7
33.9
32.2
11.5
29.7
°C/W
AFS250-FG256
33.7
30.0
28.3
9.3
24.8
°C/W
AFS600-FG256
28.9
25.2
23.5
6.8
19.9
°C/W
AFS1500-FG256
23.3
19.6
18.0
4.3
14.2
°C/W
AFS600-FG484
21.8
18.2
16.7
7.7
16.8
°C/W
AFS1500-FG484
21.6
16.8
15.2
5.6
14.9
°C/W
AFS1500-FG676
TBD
TBD
TBD
TBD
TBD
°C/W
Product
Pr e li m i n a ry v1 . 7
3-7
DC and Power Characteristics
Theta-JA
Junction-to-ambient thermal resistance (θJA) is determined under standard conditions specified by
JEDEC (JESD-51), but it has little relevance in actual performance of the product. It should be used
with caution but is useful for comparing the thermal performance of one package to another.
A sample calculation showing the maximum power dissipation allowed for the AFS600-FG484
package under forced convection of 1.0 m/s and 75°C ambient temperature is as follows:
T J(MAX) – T A(MAX)
Maximum Power Allowed = ----------------------------------------θ JA
EQ 3-4
where
θJA
= 19.00°C/W (taken from Table 3-6 on page 3-7).
TA
= 75.00°C
– 75.00°C- = 1.84 W
Maximum Power Allowed = 110.00°C
--------------------------------------------------19.00°C/W
The power consumption of a device can be calculated using the Actel power calculator. The
device's power consumption must be lower than the calculated maximum power dissipation by the
package. If the power consumption is higher than the device's maximum allowable power
dissipation, a heat sink can be attached on top of the case, or the airflow inside the system must be
increased.
Theta-JB
Junction-to-board thermal resistance (θJB) measures the ability of the package to dissipate heat
from the surface of the chip to the PCB. As defined by the JEDEC (JESD-51) standard, the thermal
resistance from junction to board uses an isothermal ring cold plate zone concept. The ring cold
plate is simply a means to generate an isothermal boundary condition at the perimeter. The cold
plate is mounted on a JEDEC standard board with a minimum distance of 5.0 mm away from the
package edge.
Theta-JC
Junction-to-case thermal resistance (θJC) measures the ability of a device to dissipate heat from the
surface of the chip to the top or bottom surface of the package. It is applicable for packages used
with external heat sinks. Constant temperature is applied to the surface in consideration and acts
as a boundary condition. This only applies to situations where all or nearly all of the heat is
dissipated through the surface in consideration.
Calculation for Heat Sink
For example, in a design implemented in an AFS600-FG484 package with 2.5 m/s airflow, the power
consumption value using the power calculator is 3.00 W. The user-dependent Ta and Tj are given as
follows:
TJ
=
110.00°C
TA =
70.00°C
From the datasheet:
θJA
=
17.00°C/W
θJC
=
8.28°C/W
TJ – TA
– 70°C- = 2.35 W
- = 110°C
---------------------------------P = ---------------17.00 W
θ JA
EQ 3-5
3 -8
Pr e li m i n a r y v1 . 7
Actel Fusion Mixed-Signal FPGAs
The 2.35 W power is less than the required 3.00 W. The design therefore requires a heat sink, or the
airflow where the device is mounted should be increased. The design's total junction-to-air thermal
resistance requirement can be estimated by EQ 3-6:
TJ – TA
– 70°C- = 13.33°C/W
- = 110°C
---------------------------------θ ja(total) = ---------------P
3.00 W
EQ 3-6
Determining the heat sink's thermal performance proceeds as follows:
θ JA(TOTAL) = θ JC + θ CS + θ SA
EQ 3-7
where
θJA
θSA
=
0.37°C/W
=
Thermal resistance of the interface material
between the case and the heat sink, usually
provided by the thermal interface manufacturer
=
Thermal resistance of the heat sink in °C/W
θ SA = θ JA(TOTAL) – θ JC – θ CS
EQ 3-8
θ SA = 13.33°C/W – 8.28°C/W – 0.37°C/W = 5.01°C/W
A heat sink with a thermal resistance of 5.01°C/W or better should be used. Thermal resistance of
heat sinks is a function of airflow. The heat sink performance can be significantly improved with
increased airflow.
Carefully estimating thermal resistance is important in the long-term reliability of an Actel FPGA.
Design engineers should always correlate the power consumption of the device with the maximum
allowable power dissipation of the package selected for that device.
Note: The junction-to-air and junction-to-board thermal resistances are based on JEDEC standard
(JESD-51) and assumptions made in building the model. It may not be realized in actual application
and therefore should be used with a degree of caution. Junction-to-case thermal resistance
assumes that all power is dissipated through the case.
Temperature and Voltage Derating Factors
Table 3-7 •
Array
Voltage VCC
(V)
Temperature and Voltage Derating Factors for Timing Delays
(normalized to TJ = 70°C, VCC = 1.425 V)
Junction Temperature (°C)
–40°C
0°C
25°C
70°C
85°C
110°C
1.425
0.88
0.93
0.95
1.00
1.02
1.05
1.500
0.83
0.88
0.90
0.95
0.96
0.99
1.575
0.80
0.85
0.87
0.91
0.93
0.96
Pr e li m i n a ry v1 . 7
3-9
DC and Power Characteristics
Calculating Power Dissipation
Quiescent Supply Current
Table 3-8 •
Parameter
IDC1
Quiescent Supply Current Characteristics (IDDQ)1
Conditions and Modes
AFS090
AFS250
AFS600
AFS1500
Maximum in operating mode (85°C) 2
15 mA
30 mA
45 mA
TBD
2
10 mA
20 mA
30 mA
TBD
2 mA
3 mA
5 mA
TBD
200 µA
200 µA
200 µA
TBD
10 µA
10 µA
10 µA
TBD
Maximum in operating mode (70°C)
Typical in operating mode (25°C)
IDC2
Typical in standby mode (25°C)
IDC3
Typical in sleep mode (25°C) 4,5
2
3,5
Notes:
1. –F speed grade devices may experience higher Quiescent Supply current of up to five times the standard
IDD, and higher I/O leakage.
2. IDC1 includes VCC, VPUMP, and VCCI, currents. Values do not include I/O static contribution, which is shown in
Table 3-9 on page 3-11 and Table 3-10 on page 3-13.
3. IDC2 represents the current from the VCC33A and VCCI supplies when the RTC (and the 32 kHz crystal
oscillator) is ON, the FPGA is OFF, and the voltage regulator is OFF.
4. IDC3 represents the current from the VCC33A and VCCI supplies when the RTC (and the crystal oscillator), the
FPGA, and the voltage regulator are OFF.
5. VCCI supply is ON, since the east and west I/O banks are not cold-sparable. Values do not include I/O static
contribution, which is shown in Table 3-9 on page 3-11 and Table 3-10 on page 3-13.
3 -1 0
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
Power per I/O Pin
Table 3-9 •
Summary of I/O Input Buffer Power (per pin)—Default I/O Software Settings
VCCI (V)
Static Power
PDC7 (mW)1
Dynamic Power
PAC9 (µW/MHz)2
3.3 V LVTTL/LVCMOS
3.3
–
17.39
3.3 V LVTTL/LVCMOS – Schmitt trigger
3.3
–
25.51
2.5 V LVCMOS
2.5
–
5.76
2.5 V LVCMOS – Schmitt trigger
2.5
–
7.16
1.8 V LVCMOS
1.8
–
2.72
1.8 V LVCMOS – Schmitt trigger
1.8
–
2.80
1.5 V LVCMOS (JESD8-11)
1.5
–
2.08
1.5 V LVCMOS (JESD8-11) – Schmitt trigger
1.5
–
2.00
3.3 V PCI
3.3
–
18.82
3.3 V PCI – Schmitt trigger
3.3
–
20.12
3.3 V PCI-X
3.3
–
18.82
3.3 V PCI-X – Schmitt trigger
3.3
–
20.12
3.3 V GTL
3.3
2.90
8.23
2.5 V GTL
2.5
2.13
4.78
3.3 V GTL+
3.3
2.81
4.14
2.5 V GTL+
2.5
2.57
3.71
HSTL (I)
1.5
0.17
2.03
HSTL (II)
1.5
0.17
2.03
SSTL2 (I)
2.5
1.38
4.48
SSTL2 (II)
2.5
1.38
4.48
SSTL3 (I)
3.3
3.21
9.26
SSTL3 (II)
3.3
3.21
9.26
LVDS
2.5
2.26
1.50
LVPECL
3.3
5.71
2.17
Applicable to Pro I/O Banks
Single-Ended
Voltage-Referenced
Differential
Notes:
1. PDC7 is the static power (where applicable) measured on VCCI.
2. PAC9 is the total dynamic power measured on VCC and VCCI.
Pr e li m i n a ry v1 . 7
3 - 11
DC and Power Characteristics
Table 3-9 •
Summary of I/O Input Buffer Power (per pin)—Default I/O Software Settings (continued)
VCCI (V)
Static Power
PDC7 (mW)1
Dynamic Power
PAC9 (µW/MHz)2
3.3 V LVTTL/LVCMOS
3.3
–
16.69
2.5 V LVCMOS
2.5
–
5.12
1.8 V LVCMOS
1.8
–
2.13
1.5 V LVCMOS (JESD8-11)
1.5
–
1.45
3.3 V PCI
3.3
–
18.11
3.3 V PCI-X
3.3
–
18.11
LVDS
2.5
2.26
1.20
LVPECL
3.3
5.72
1.87
3.3 V LVTTL/LVCMOS
3.3
–
16.79
2.5 V LVCMOS
2.5
–
5.19
1.8 V LVCMOS
1.8
–
2.18
1.5 V LVCMOS (JESD8-11)
1.5
–
1.52
Applicable to Advanced I/O Banks
Single-Ended
Differential
Applicable to Standard I/O Banks
Notes:
1. PDC7 is the static power (where applicable) measured on VCCI.
2. PAC9 is the total dynamic power measured on VCC and VCCI.
3 -1 2
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
Table 3-10 • Summary of I/O Output Buffer Power (per pin)—Default I/O Software Settings1
CLOAD (pF)
VCCI (V)
Static Power
PDC8 (mW)2
Dynamic Power
PAC10 (µW/MHz)3
3.3 V LVTTL/LVCMOS
35
3.3
–
474.70
2.5 V LVCMOS
35
2.5
–
270.73
1.8 V LVCMOS
35
1.8
–
151.78
1.5 V LVCMOS (JESD8-11)
35
1.5
–
104.55
3.3 V PCI
10
3.3
–
204.61
3.3 V PCI-X
10
3.3
–
204.61
3.3 V GTL
10
3.3
–
24.08
2.5 V GTL
10
2.5
–
13.52
3.3 V GTL+
10
3.3
–
24.10
2.5 V GTL+
10
2.5
–
13.54
HSTL (I)
20
1.5
7.08
26.22
HSTL (II)
20
1.5
13.88
27.22
SSTL2 (I)
30
2.5
16.69
105.56
SSTL2 (II)
30
2.5
25.91
116.60
SSTL3 (I)
30
3.3
26.02
114.87
SSTL3 (II)
30
3.3
42.21
131.76
LVDS
–
2.5
7.70
89.62
LVPECL
–
3.3
19.42
168.02
3.3 V LVTTL / 3.3 V LVCMOS
35
3.3
–
468.67
2.5 V LVCMOS
35
2.5
–
267.48
1.8 V LVCMOS
35
1.8
–
149.46
1.5 V LVCMOS (JESD8-11)
35
1.5
–
103.12
3.3 V PCI
10
3.3
–
201.02
3.3 V PCI-X
10
3.3
–
201.02
Applicable to Pro I/O Banks
Single-Ended
Voltage-Referenced
Differential
Applicable to Advanced I/O Banks
Single-Ended
Notes:
1. Dynamic power consumption is given for standard load and software-default drive strength and output
slew.
2. PDC8 is the static power (where applicable) measured on VCCI.
3. PAC10 is the total dynamic power measured on VCC and VCCI.
Pr e li m i n a ry v1 . 7
3 - 13
DC and Power Characteristics
Table 3-10 • Summary of I/O Output Buffer Power (per pin)—Default I/O Software Settings1 (continued)
CLOAD (pF)
VCCI (V)
Static Power
PDC8 (mW)2
Dynamic Power
PAC10 (µW/MHz)3
LVDS
–
2.5
7.74
88.92
LVPECL
–
3.3
19.54
166.52
3.3 V LVTTL / 3.3 V LVCMOS
35
3.3
–
431.08
2.5 V LVCMOS
35
2.5
–
247.36
1.8 V LVCMOS
35
1.8
–
128.46
1.5 V LVCMOS (JESD8-11)
35
1.5
–
89.46
Differential
Applicable to Standard I/O Banks
Single-Ended
Notes:
1. Dynamic power consumption is given for standard load and software-default drive strength and output
slew.
2. PDC8 is the static power (where applicable) measured on VCCI.
3. PAC10 is the total dynamic power measured on VCC and VCCI.
3 -1 4
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
Dynamic Power Consumption of Various Internal Resources
Table 3-11 • Different Components Contributing to the Dynamic Power Consumption in Fusion Devices
Device-Specific
Dynamic Contributions
Power Supply
Parameter
Definition
Name
PAC1
Clock contribution of a Global
Rib
VCC
1.5 V
14.5
12.8
11
11
µW/MHz
PAC2
Clock contribution of a Global
Spine
VCC
1.5 V
2.5
1.9
1.6
0.8
µW/MHz
PAC3
Clock contribution of a VersaTile
row
VCC
1.5 V
0.81
µW/MHz
PAC4
Clock contribution of a VersaTile
used as a sequential module
VCC
1.5 V
0.11
µW/MHz
PAC5
First contribution of a VersaTile
used as a sequential module
VCC
1.5 V
0.07
µW/MHz
PAC6
Second
contribution
of
a
VersaTile used as a sequential
module
VCC
1.5 V
0.29
µW/MHz
PAC7
Contribution of a VersaTile used
as a combinatorial module
VCC
1.5 V
0.29
µW/MHz
PAC8
Average contribution
routing net
VCC
1.5 V
0.70
µW/MHz
PAC9
Contribution of an I/O input pin
(standard dependent)
VMV/
VCC
See Table 3-9 on page 3-11
PAC10
Contribution of an I/O output
pin (standard dependent)
VCCI /
VCC
See Table 3-10 on page 3-13
PAC11
Average contribution of a RAM
block during a read operation
VCC
1.5 V
25
µW/MHz
PAC12
Average contribution of a RAM
block during a write operation
VCC
1.5 V
30
µW/MHz
PAC13
Dynamic Contribution for PLL
VCC
1.5 V
2.6
µW/MHz
PAC15
Contribution of NVM block
during a read operation (F <
33MHz)
VCC
1.5 V
358
µW/MHz
PAC16
1st contribution of NVM block
during a read operation (F >
33MHz)
VCC
1.5 V
12.88
mW
PAC17
2nd contribution of NVM block
during a read operation (F >
33MHz)
VCC
1.5 V
4.8
µW/MHz
PAC18
Crystal Oscillator contribution
VCC33A
3.3 V
0.63
mW
PAC19
RC Oscillator contribution
VCC33A
3.3 V
3.3
mW
PAC20
Analog Block dynamic power
contribution of ADC
VCC
1.5 V
3
mW
of
a
Setting AFS1500 AFS600 AFS250 AFS090
Pr e li m i n a ry v1 . 7
Units
3 - 15
DC and Power Characteristics
Static Power Consumption of Various Internal Resources
Table 3-12 • Different Components Contributing to the Static Power Consumption in Fusion Devices
Device-Specific Static Contributions
Parameter
Definition
Power Supply
AFS1500 AFS600
AFS090
Units
4.50
3.00
mW
PDC1
Core static power contribution in
operating mode
VCC
1.5 V
PDC2
Device static power contribution
in standby mode
VCC33A
3.3 V
0.66
mW
PDC3
Device static power contribution
in sleep mode
VCC33A
3.3 V
0.03
mW
PDC4
NVM static power contribution
VCC
1.5 V
1.19
mW
PDC5
Analog Block static
contribution of ADC
power
VCC33A
3.3 V
8.25
mW
PDC6
Analog Block static
contribution per Quad
power
VCC33A
3.3 V
3.3
mW
PDC7
Static contribution per input pin
–
standard
dependent
contribution
VMV/
VCC
See Table 3-9 on page 3-11
PDC8
Static contribution per input pin
–
standard
dependent
contribution
VMV/
VCC
See Table 3-10 on page 3-13
PDC9
Static contribution for PLL
3 -1 6
VCC
1.5 V
Pr e li m i n a ry v1 . 7
TBD
AFS250
7.5
2.55
mW
Actel Fusion Mixed-Signal FPGAs
Power Calculation Methodology
This section describes a simplified method to estimate power consumption of an application. For
more accurate and detailed power estimations, use the SmartPower tool in the Libero IDE
software.
The power calculation methodology described below uses the following variables:
•
The number of PLLs as well as the number and the frequency of each output clock
generated
•
The number of combinatorial and sequential cells used in the design
•
The internal clock frequencies
•
The number and the standard of I/O pins used in the design
•
The number of RAM blocks used in the design
•
The number of NVM blocks used in the design
•
The number of Analog Quads used in the design
•
Toggle rates of I/O pins as well as VersaTiles—guidelines are provided in Table 3-13 on
page 3-21.
•
Enable rates of output buffers—guidelines are provided for typical applications in
Table 3-14 on page 3-21.
•
Read rate and write rate to the RAM—guidelines are provided for typical applications in
Table 3-14 on page 3-21.
•
Read rate to the NVM blocks
The calculation should be repeated for each clock domain defined in the design.
Methodology
Total Power Consumption—PTOTAL
Operating Mode, Standby Mode, and Sleep Mode
PTOTAL = PSTAT + PDYN
PSTAT is the total static power consumption.
PDYN is the total dynamic power consumption.
Total Static Power Consumption—PSTAT
Operating Mode
PSTAT = PDC1 + (NNVM-BLOCKS * PDC4) + PDC5+ (NQUADS * PDC6) + (NINPUTS * PDC7) + (NOUTPUTS * PDC8) +
(NPLLS * PDC9)
NNVM-BLOCKS is the number of NVM blocks available in the device.
NQUADS is the number of Analog Quads used in the design.
NINPUTS is the number of I/O input buffers used in the design.
NOUTPUTS is the number of I/O output buffers used in the design.
NPLLS is the number of PLLs available in the device.
Standby Mode
PSTAT = PDC2
Sleep Mode
PSTAT = PDC3
Total Dynamic Power Consumption—PDYN
Operating Mode
PDYN = PCLOCK + PS-CELL + PC-CELL + PNET + PINPUTS + POUTPUTS + PMEMORY + PPLL + PNVM+ PXTL-OSC +
PRC-OSC + PAB
Pr e li m i n a ry v1 . 7
3 - 17
DC and Power Characteristics
Standby Mode
PDYN = PXTL-OSC
Sleep Mode
PDYN = 0 W
Global Clock Dynamic Contribution—PCLOCK
Operating Mode
PCLOCK = (PAC1 + NSPINE * PAC2 + NROW * PAC3 + NS-CELL * PAC4) * FCLK
NSPINE is the number of global spines used in the user design—guidelines are provided in
Table 3-13 on page 3-21.
NROW is the number of VersaTile rows used in the design—guidelines are provided in
Table 3-13 on page 3-21.
FCLK is the global clock signal frequency.
NS-CELL is the number of VersaTiles used as sequential modules in the design.
Standby Mode and Sleep Mode
PCLOCK = 0 W
Sequential Cells Dynamic Contribution—PS-CELL
Operating Mode
PS-CELL = NS-CELL * (PAC5 + (α1 / 2) * PAC6) * FCLK
NS-CELL is the number of VersaTiles used as sequential modules in the design. When a multitile sequential cell is used, it should be accounted for as 1.
α1
is the toggle rate of VersaTile outputs—guidelines are provided in Table 3-13 on
page 3-21.
FCLK is the global clock signal frequency.
Standby Mode and Sleep Mode
PS-CELL = 0 W
Combinatorial Cells Dynamic Contribution—PC-CELL
Operating Mode
PC-CELL = NC-CELL* (α1 / 2) * PAC7 * FCLK
NC-CELL is the number of VersaTiles used as combinatorial modules in the design.
α1
is the toggle rate of VersaTile outputs—guidelines are provided in Table 3-13 on
page 3-21.
FCLK is the global clock signal frequency.
Standby Mode and Sleep Mode
PC-CELL = 0 W
Routing Net Dynamic Contribution—PNET
Operating Mode
PNET = (NS-CELL + NC-CELL) * (α1 / 2) * PAC8 * FCLK
NS-CELL is the number VersaTiles used as sequential modules in the design.
NC-CELL is the number of VersaTiles used as combinatorial modules in the design.
α1
is the toggle rate of VersaTile outputs—guidelines are provided in Table 3-13 on
page 3-21.
FCLK is the global clock signal frequency.
3 -1 8
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
Standby Mode and Sleep Mode
PNET = 0 W
I/O Input Buffer Dynamic Contribution—PINPUTS
Operating Mode
PINPUTS = NINPUTS * (α2 / 2) * PAC9 * FCLK
NINPUTS is the number of I/O input buffers used in the design.
α2 is the I/O buffer toggle rate—guidelines are provided in Table 3-13 on page 3-21.
FCLK is the global clock signal frequency.
Standby Mode and Sleep Mode
PINPUTS = 0 W
I/O Output Buffer Dynamic Contribution—POUTPUTS
Operating Mode
POUTPUTS = NOUTPUTS * (α2 / 2) * β1 * PAC10 * FCLK
NOUTPUTS is the number of I/O output buffers used in the design.
α2 is the I/O buffer toggle rate—guidelines are provided in Table 3-13 on page 3-21.
β1 is the I/O buffer enable rate—guidelines are provided in Table 3-14 on page 3-21.
FCLK is the global clock signal frequency.
Standby Mode and Sleep Mode
POUTPUTS = 0 W
RAM Dynamic Contribution—PMEMORY
Operating Mode
PMEMORY = (NBLOCKS * PAC11 * β2 * FREAD-CLOCK) + (NBLOCKS * PAC12 * β3 * FWRITE-CLOCK)
NBLOCKS is the number of RAM blocks used in the design.
FREAD-CLOCK is the memory read clock frequency.
β2
is the RAM enable rate for read operations—guidelines are provided in Table 3-14 on
page 3-21.
β3
the RAM enable rate for write operations—guidelines are provided in Table 3-14 on
page 3-21.
FWRITE-CLOCK is the memory write clock frequency.
Standby Mode and Sleep Mode
PMEMORY = 0 W
PLL/CCC Dynamic Contribution—PPLL
Operating Mode
PPLL = PAC13 * FCLKOUT
FCLKIN is the input clock frequency.
FCLKOUT is the output clock frequency.1
Standby Mode and Sleep Mode
PPLL = 0 W
1. The PLL dynamic contribution depends on the input clock frequency, the number of output clock
signals generated by the PLL, and the frequency of each output clock. If a PLL is used to generate more
than one output clock, include each output clock in the formula output clock by adding its
corresponding contribution (PAC14 * FCLKOUT product) to the total PLL contribution.
Pr e li m i n a ry v1 . 7
3 - 19
DC and Power Characteristics
Nonvolatile Memory Dynamic Contribution—PNVM
Operating Mode
The NVM dynamic power consumption is a piecewise linear function of frequency.
PNVM = NNVM-BLOCKS * β4 * PAC15 * FREAD-NVM when FREAD-NVM ≤ 33 MHz,
PNVM = NNVM-BLOCKS * β4 *(PAC16 + PAC17 * FREAD-NVM)when FREAD-NVM > 33 MHz
NNVM-BLOCKS is the number of NVM blocks used in the design (2 in AFS600).
β4 is the NVM enable rate for read operations. Default is 0 (NVM mainly in idle state).
FREAD-NVM is the NVM read clock frequency.
Standby Mode and Sleep Mode
PNVM = 0 W
Crystal Oscillator Dynamic Contribution—PXTL-OSC
Operating Mode
PXTL-OSC = PAC18
Standby Mode
PXTL-OSC = PAC18
Sleep Mode
PXTL-OSC = 0 W
RC Oscillator Dynamic Contribution—PRC-OSC
Operating Mode
PRC-OSC = PAC19
Standby Mode and Sleep Mode
PRC-OSC = 0 W
Analog System Dynamic Contribution—PAB
Operating Mode
PAB = PAC20
Standby Mode and Sleep Mode
PAB = 0 W
3 -2 0
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
Guidelines
Toggle Rate Definition
A toggle rate defines the frequency of a net or logic element relative to a clock. It is a percentage.
If the toggle rate of a net is 100%, this means that the net switches at half the clock frequency.
Below are some examples:
•
•
The average toggle rate of a shift register is 100%, as all flip-flop outputs toggle at half of
the clock frequency.
The average toggle rate of an 8-bit counter is 25%:
–
Bit 0 (LSB) = 100%
–
Bit 1 = 50%
–
Bit 2 = 25%
–
…
–
Bit 7 (MSB) = 0.78125%
–
Average toggle rate = (100% + 50% + 25% + 12.5% + . . . 0.78125%) / 8.
Enable Rate Definition
Output enable rate is the average percentage of time during which tristate outputs are enabled.
When non-tristate output buffers are used, the enable rate should be 100%.
Table 3-13 • Toggle Rate Guidelines Recommended for Power Calculation
Component
α1
α2
Definition
Guideline
Toggle rate of VersaTile outputs
10%
I/O buffer toggle rate
10%
Table 3-14 • Enable Rate Guidelines Recommended for Power Calculation
Component
β1
β2
β3
β4
Definition
Guideline
I/O output buffer enable rate
100%
RAM enable rate for read operations
12.5%
RAM enable rate for write operations
12.5%
NVM enable rate for read operations
0%
Pr e li m i n a ry v1 . 7
3 - 21
DC and Power Characteristics
Example of Power Calculation
This example considers a shift register with 5,000 storage tiles, including a counter and memory
that stores analog information. The shift register is clocked at 50 MHz and stores and reads
information from a RAM.
The device used is a commercial AFS600 device operating in typical conditions.
The calculation below uses the power calculation methodology previously presented and shows
how to determine the dynamic and static power consumption of resources used in the application.
Also included in the example is the calculation of power consumption in operating, standby, and
sleep modes to illustrate the benefit of power-saving modes.
Global Clock Contribution—PCLOCK
FCLK = 50 MHz
Number of sequential VersaTiles: NS-CELL = 5,000
Estimated number of Spines: NSPINES = 5
Estimated number of Rows: NROW = 313
Operating Mode
PCLOCK = (PAC1 + NSPINE * PAC2 + NROW * PAC3 + NS-CELL * PAC4) * FCLK
PCLOCK = (0.0128 + 5 * 0.0019 + 313 * 0.00081 + 5,000 * 0.00011) * 50
PCLOCK = 41.28 mW
Standby Mode and Sleep Mode
PCLOCK = 0 W
Logic—Sequential Cells, Combinational Cells, and Routing Net Contributions—PS-CELL,
PC-CELL, and PNET
FCLK = 50 MHz
Number of sequential VersaTiles: NS-CELL = 5,000
Number of combinatorial VersaTiles: NC-CELL = 6,000
Estimated toggle rate of VersaTile outputs: α1 = 0.1 (10%)
Operating Mode
PS-CELL = NS-CELL * (PAC5+ (α1 / 2) * PAC6) * FCLK
PS-CELL = 5,000 * (0.00007 + (0.1 / 2) * 0.00029) * 50
PS-CELL = 21.13 mW
PC-CELL = NC-CELL* (α1 / 2) * PAC7 * FCLK
PC-CELL = 6,000 * (0.1 / 2) * 0.00029 * 50
PC-CELL = 4.35 mW
PNET = (NS-CELL + NC-CELL) * (α1 / 2) * PAC8 * FCLK
PNET = (5,000 + 6,000) * (0.1 / 2) * 0.0007 * 50
PNET = 19.25 mW
PLOGIC = PS-CELL + PC-CELL + PNET
PLOGIC = 21.13 mW + 4.35 mW + 19.25 mW
PLOGIC = 44.73 mW
Standby Mode and Sleep Mode
3 -2 2
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
PS-CELL = 0 W
PC-CELL = 0 W
PNET = 0 W
PLOGIC = 0 W
I/O Input and Output Buffer Contribution—PI/O
This example uses LVTTL 3.3 V I/O cells. The output buffers are 12 mA–capable, configured with
high output slew and driving a 35 pF output load.
FCLK = 50 MHz
Number of input pins used: NINPUTS = 30
Number of output pins used: NOUTPUTS = 40
Estimated I/O buffer toggle rate: α2 = 0.1 (10%)
Estimated IO buffer enable rate: β1 = 1 (100%)
Operating Mode
PINPUTS = NINPUTS * (α2 / 2) * PAC9 * FCLK
PINPUTS = 30 * (0.1 / 2) * 0.01739 * 50
PINPUTS = 1.30 mW
POUTPUTS = NOUTPUTS * (α2 / 2) * β1 * PAC10 * FCLK
POUTPUTS = 40 * (0.1 / 2) * 1 * 0.4747 * 50
POUTPUTS = 47.47 mW
PI/O = PINPUTS + POUTPUTS
PI/O = 1.30 mW + 47.47 mW
PI/O = 48.77 mW
Standby Mode and Sleep Mode
PINPUTS = 0 W
POUTPUTS = 0 W
PI/O = 0 W
RAM Contribution—PMEMORY
Frequency of Read Clock: FREAD-CLOCK = 10 MHz
Frequency of Write Clock: FWRITE-CLOCK = 10 MHz
Number of RAM blocks: NBLOCKS = 20
Estimated RAM Read Enable Rate: β2 = 0.125 (12.5%)
Estimated RAM Write Enable Rate: β3 = 0.125 (12.5%)
Operating Mode
PMEMORY = (NBLOCKS * PAC11 * β2 * FREAD-CLOCK) + (NBLOCKS * PAC12 * β3 * FWRITE-CLOCK)
PMEMORY = (20 * 0.025 * 0.125 * 10) + (20 * 0.030 * 0.125 * 10)
PMEMORY = 1.38 mW
Standby Mode and Sleep Mode
PMEMORY = 0 W
PLL/CCC Contribution—PPLL
PLL is not used in this application.
Pr e li m i n a ry v1 . 7
3 - 23
DC and Power Characteristics
PPLL = 0 W
Nonvolatile Memory—PNVM
Nonvolatile memory is not used in this application.
PNVM = 0 W
Crystal Oscillator—PXTL-OSC
The application utilizes standby mode. The crystal oscillator is assumed to be active.
Operating Mode
PXTL-OSC = PAC18
PXTL-OSC = 0.63 mW
Standby Mode
PXTL-OSC = PAC18
PXTL-OSC = 0.63 mW
Sleep Mode
PXTL-OSC = 0 W
RC Oscillator—PRC-OSC
Operating Mode
PRC-OSC = PAC19
PRC-OSC = 3.30 mW
Standby Mode and Sleep Mode
PRC-OSC = 0 W
Analog System—PAB
Number of Quads used: NQUADS = 4
Operating Mode
PAB = PAC20
PAB = 3.00 mW
Standby Mode and Sleep Mode
PAB = 0 W
Total Dynamic Power Consumption—PDYN
Operating Mode
PDYN = PCLOCK + PS-CELL + PC-CELL + PNET + PINPUTS + POUTPUTS + PMEMORY + PPLL + PNVM+ PXTL-OSC + PRC+ PAB
OSC
PDYN = 41.28 mW + 21.1 mW + 4.35 mW + 19.25 mW + 1.30 mW + 47.47 mW + 1.38 mW + 0 + 0 +
0.63 mW + 3.30 mW + 3.00 mW
PDYN = 143.06 mW
Standby Mode
PDYN = PXTL-OSC
PDYN = 0.63 mW
Sleep Mode
PDYN = 0 W
3 -2 4
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
Total Static Power Consumption—PSTAT
Number of Quads used: NQUADS = 4
Number of NVM blocks available (AFS600): NNVM-BLOCKS = 2
Number of input pins used: NINPUTS = 30
Number of output pins used: NOUTPUTS = 40
Operating Mode
PSTAT = PDC1 + (NNVM-BLOCKS * PDC4) + PDC5 + (NQUADS * PDC6) + (NINPUTS * PDC7) + (NOUTPUTS * PDC8)
PSTAT = 7.50 mW + (2 * 1.19 mW) + 8.25 mW + (4 * 3.30 mW) + (30 * 0.00) + (40 * 0.00)
PSTAT = 31.33 mW
Standby Mode
PSTAT = PDC2
PSTAT = 0.03 mW
Sleep Mode
PSTAT = PDC3
PSTAT = 0.03 mW
Total Power Consumption—PTOTAL
In operating mode, the total power consumption of the device is 174.39 mW:
PTOTAL = PSTAT + PDYN
PTOTAL = 143.06 mW + 31.33 mW
PTOTAL = 174.39 mW
In standby mode, the total power consumption of the device is limited to 0.66 mW:
PTOTAL = PSTAT + PDYN
PTOTAL = 0.03 mW + 0.63 mW
PTOTAL = 0.66 mW
In sleep mode, the total power consumption of the device drops as low as 0.03 mW:
PTOTAL = PSTAT + PDYN
PTOTAL = 0.03 mW
Pr e li m i n a ry v1 . 7
3 - 25
DC and Power Characteristics
Power Consumption
Table 3-15 • Power Consumption
Parameter
Description
Condition
Min.
Typical
Max.
Units
Crystal Oscillator
ISTBXTAL
Standby Current of Crystal
Oscillator
IDYNXTAL
Operating Current
10
µA
RC
0.6
mA
0.032–0.2
0.19
mA
0.2–2.0
0.6
mA
2.0–20.0
0.6
mA
1
mA
RC Oscillator
IDYNRC
Operating Current
ACM
Operating
clock)
Current
(fixed
200
µA/MHz
Operating
clock)
Current
(user
30
µA
Idle
795
µA
Read
operation
See
Table 3-12 on
page 3-16.
See
Table 3-12 on
page 3-16.
Erase
900
µA
Write
900
µA
20
µW/MHz
NVM System
NVM
Power
PNVMCTRL
3 -2 6
Array
Operating
NVM Controller Operating
Power
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
Part Number and Revision Date
Part Number 51700092-015-0
Revised October 2008
List of Changes
The following table lists critical changes that were made in the current version of the
document.
Previous Version
Changes in Current Version (Preliminary v1.7)
Page
Advance v1.6
(August 2008)
The version number category was changed from Advance to Preliminary, which
means the datasheet contains information based on simulation and/or initial
characterization. The information is believed to be correct, but changes are
possible.
N/A
Advance v1.4
(July 2008)
The title of the datasheet changed from Actel Programmable System Chips to
Actel Fusion Mixed-Signal FPGAs. In addition, all instances of programmable
system chip were changed to mixed-signal FPGA.
N/A
Advance v1.3
(July 2008)
In Table 3-8 · Quiescent Supply Current Characteristics (IDDQ)1, footnote
references were updated for IDC2 and IDC3.
3-10
Footnote 3 and 4 were updated and footnote 5 is new.
Advance v1.1
Table 3-6 · Package Thermal Resistance was significantly updated
Table 3-11 · Different Components Contributing to the
Consumption in Fusion Devices was significantly updated.
Advance v0.9
Power
3-15
Table 3-13 · Toggle Rate Guidelines Recommended for Power Calculation was
significantly updated.
3-21
In Table 3-1 · Absolute Maximum Ratings, the AT for the Unpowered, ADC reset
asserted or unconfigured parameter, –11 was changed to –0.4.
3-1
The units column of Table 3-2 · Recommended Operating Conditions was
incomplete in the previous version. V was added to all the rows. In addition, AT
for the Unpowered, ADC reset asserted or unconfigured parameter, –10.5 was
changed to –0.3. Note 6 was updated to include VCC15A.
3-3
In the title of Table 3-3 · Input Resistance of Analog Pads, Impedance was
changed to Resistance.
3-4
In Table 3-5 · FPGA Programming, Storage, and Operating Limits, note 2 is new.
"Program" was removed from the table heading in the Retention column.
3-5
The "PLL Behavior at Brownout Condition" section is new.
3-6
Table 3-7 · Temperature and Voltage Derating Factors for Timing Delays was
updated.
3-9
In the Table 3-9 · Summary of I/O Input Buffer Power (per pin)—Default I/O
Software Settings, the HSTL (I) for the Static Power PDC7 (mW) was changed
from 0.1 to 0.17.
3-11
The Table 3-11 · Different Components Contributing to the Dynamic Power
Consumption in Fusion Devices was updated.
3-15
The Table 3-12 · Different Components Contributing to the Static Power
Consumption in Fusion Devices was updated.
3-16
In the "PLL/CCC Dynamic Contribution—PPLL" section, PAC14 was deleted.
3-19
Pr e li m i n a ry v1 . 7
Dynamic
3-7
3 - 27
DC and Power Characteristics
Previous Version
Changes in Current Version (Preliminary v1.7)
Page
Advance v0.8
(June 2007)
In Table 3-6 · Package Thermal Resistance, the data for the following
device/packages were updated:
3-7
AFS090-FG256
AFS250-FG256
AFS600-FG256
AFS1500-FG256
AFS600-FG484
AFS1500-FG484
AFS1500-FG676
Advance v0.7
(January 2007)
The VMV pins have now been tied internally with the VCCI pins.
N/A
The VCOMPLF pin description was deleted.
N/A
Table 3-1 · Absolute Maximum Ratings, Table 3-2 · Recommended Operating
Conditions, and Table 3-3 · Input Resistance of Analog Pads were updated.
3-1 to
3-4
Table 3-5 · FPGA Programming, Storage, and Operating Limits was updated.
3-5
PAC13 and PAC14 were updated in Table 3-11 · Different Components
Contributing to the Dynamic Power Consumption in Fusion Devices.
3-15
The Operating Mode for the "PLL/CCC Dynamic Contribution—PPLL" section was
updated.
3-19
Table 3-15 · Power Consumption was updated to change the typical value of
IDYNXTAL for 0.032–0.2 MHz to 0.19.
3-26
Advance v0.5
(June 2006)
Table 3-3 · Input Resistance of Analog Pads is new.
3-4
Advance v0.4
The low power modes of operation were updated and clarified.
N/A
Table 3-8 · Quiescent Supply Current Characteristics (IDDQ)1 was updated.
3-10
(April 2006)
Advance v0.2
(April 2006)
Table 3-11 · Different Components Contributing
Consumption in Fusion Devices was updated.
to
the
Dynamic
Power
3-15
Table 3-11 · Different Components Contributing
Consumption in Fusion Devices was updated.
to
the
Dynamic
Power
3-15
The "Example of Power Calculation" was updated.
The Analog System
Consumption.
3 -2 8
information
was
Pr e li m i n a ry v1 . 7
deleted
3-22
from
Table 3-15 · Power
3-26
Actel Fusion Mixed-Signal FPGAs
Actel Safety Critical, Life Support, and High-Reliability
Applications Policy
The Actel products described in this advance status datasheet may not have completed Actel’s
qualification process. Actel may amend or enhance products during the product introduction and
qualification process, resulting in changes in device functionality or performance. It is the
responsibility of each customer to ensure the fitness of any Actel product (but especially a new
product) for a particular purpose, including appropriateness for safety-critical, life-support, and
other high-reliability applications. Consult Actel’s Terms and Conditions for specific liability
exclusions relating to life-support applications. A reliability report covering all of Actel’s products is
available on the Actel website at http://www.actel.com/documents/ORT_Report.pdf. Actel also
offers a variety of enhanced qualification and lot acceptance screening procedures. Contact your
local Actel sales office for additional reliability information.
Pr e li m i n a ry v1 . 7
3 - 29
Actel Fusion® Mixed-Signal FPGAs Packaging
4 – Package Pin Assignments
108-Pin QFN
A44
A56
B41
B52
Pin A1 Mark
A1
A43
B40
B1
B13
A14
B27
A29
B26
B14
A28
A15
Note: The die attach paddle center of the package is tied to ground (GND).
Note
For Package Manufacturing and Environmental information, visit the Resource Center at
http://www.actel.com/products/solutions/package/default.aspx.
Pr e li m i n a ry v1 . 7
4-1
Package Pin Assignments
108-Pin QFN
108-Pin QFN
108-Pin QFN
Pin Number
AFS090 Function
Pin Number
AFS090 Function
Pin Number
AFS090 Function
A1
NC
A39
GND
B21
AC2
A2
GNDQ
A40
GCB1/IO35PDB1V0
B22
ATRTN1
A3
GAA2/IO52PDB3V0
A41
GCB2/IO33PDB1V0
B23
AG3
A4
GND
A42
GBA2/IO31PDB1V0
B24
AV3
A5
GFA1/IO47PDB3V0
A43
NC
B25
VCC33A
A6
GEB1/IO45PDB3V0
A44
GBA1/IO30RSB0V0
B26
VAREF
A7
VCCOSC
A45
GBB1/IO28RSB0V0
B27
PUB
A8
XTAL2
A46
GND
B28
VCC33A
A9
GEA1/IO44PPB3V0
A47
VCC
B29
PTBASE
A10
GEA0/IO44NPB3V0
A48
GBC1/IO26RSB0V0
B30
VCCNVM
A11
GEB2/IO42PDB3V0
A49
IO21RSB0V0
B31
VCC
A12
VCCNVM
A50
IO19RSB0V0
B32
TDI
A13
VCC15A
A51
IO09RSB0V0
B33
TDO
A14
PCAP
A52
GAC0/IO04RSB0V0
B34
VJTAG
A15
NC
A53
VCCIB0
B35
GDC0/IO38NDB1V0
A16
GNDA
A54
GND
B36
VCCIB1
A17
AV0
A55
GAB0/IO02RSB0V0
B37
GCB0/IO35NDB1V0
A18
AG0
A56
GAA0/IO00RSB0V0
B38
GCC2/IO33NDB1V0
A19
ATRTN0
B1
VCOMPLA
B39
GBB2/IO31NDB1V0
A20
AT1
B2
VCCIB3
B40
VCCIB1
A21
AC1
B3
GAB2/IO52NDB3V0
B41
GNDQ
A22
AV2
B4
VCCIB3
B42
GBA0/IO29RSB0V0
A23
AG2
B5
GFA0/IO47NDB3V0
B43
VCCIB0
A24
AT2
B6
GEB0/IO45NDB3V0
B44
GBB0/IO27RSB0V0
A25
AT3
B7
XTAL1
B45
GBC0/IO25RSB0V0
A26
AC3
B8
GNDOSC
B46
IO20RSB0V0
A27
GNDAQ
B9
GEC2/IO43PSB3V0
B47
IO10RSB0V0
A28
ADCGNDREF
B10
GEA2/IO42NDB3V0
B48
GAC1/IO05RSB0V0
A29
NC
B11
VCC
B49
GAB1/IO03RSB0V0
A30
GNDA
B12
GNDNVM
B50
VCC
A31
PTEM
B13
NCAP
B51
GAA1/IO01RSB0V0
A32
GNDNVM
B14
VCC33PMP
B52
VCCPLA
A33
VPUMP
B15
VCC33N
A34
TCK
B16
GNDAQ
A35
TMS
B17
AC0
A36
TRST
B18
AT0
A37
GDB1/IO39PSB1V0
B19
AG1
A38
GDC1/IO38PDB1V0
B20
AV1
4 -2
Pr e li m i n a r y v1 . 7
Actel Fusion Mixed-Signal FPGAs
180-Pin QFN
A64
B60
A49
B46
C56
C43
Pin A1 Mark
D4
D1
A48
B45
C42
A33
C1
A1
C14
B15
A16
C29
B31
D3
Optional Corner
Pad (4X)
B1
D2
C15
B16
C28
B30
A32
A17
Note: The die attach paddle center of the package is tied to ground (GND).
Note
For Package Manufacturing and Environmental information, visit the Resource Center at
http://www.actel.com/products/solutions/package/default.aspx.
Pr e li m i n a ry v1 . 7
4-3
Package Pin Assignments
180-Pin QFN
180-Pin QFN
Pin Number
AFS090 Function
AFS250 Function
Pin Number
AFS090 Function
AFS250 Function
A1
GNDQ
GNDQ
A37
VPUMP
VPUMP
A2
VCCIB3
VCCIB3
A38
TDI
TDI
A3
GAB2/IO52NDB3V0
IO74NDB3V0
A39
TDO
TDO
A4
GFA2/IO51NDB3V0
IO71NDB3V0
A40
VJTAG
VJTAG
A5
GFC2/IO50NDB3V0
IO69NPB3V0
A41
GDB1/IO39PPB1V0
GDA1/IO54PPB1V0
A6
VCCIB3
VCCIB3
A42
GDC1/IO38PDB1V0 GDB1/IO53PDB1V0
A7
GFA1/IO47PPB3V0
GFB1/IO67PPB3V0
A43
VCC
VCC
A8
GEB0/IO45NDB3V0
NC
A44
GCB0/IO35NPB1V0
GCB0/IO48NPB1V0
A9
XTAL1
XTAL1
A45
GCC1/IO34PDB1V0
GCC1/IO47PDB1V0
A10
GNDOSC
GNDOSC
A46
VCCIB1
VCCIB1
A11
GEC2/IO43PPB3V0
GEA1/IO61PPB3V0
A47
GBC2/IO32PPB1V0
GBB2/IO41PPB1V0
A12
IO43NPB3V0
GEA0/IO61NPB3V0
A48
VCCIB1
VCCIB1
A13
NC
VCCIB3
A49
NC
NC
A14
GNDNVM
GNDNVM
A50
GBA0/IO29RSB0V0
GBB1/IO37RSB0V0
A15
PCAP
PCAP
A51
VCCIB0
VCCIB0
A16
VCC33PMP
VCC33PMP
A52
GBB0/IO27RSB0V0
GBC0/IO34RSB0V0
A17
NC
NC
A53
GBC1/IO26RSB0V0
IO33RSB0V0
A18
AV0
AV0
A54
IO24RSB0V0
IO29RSB0V0
A19
AG0
AG0
A55
IO21RSB0V0
IO26RSB0V0
A20
ATRTN0
ATRTN0
A56
VCCIB0
VCCIB0
A21
AG1
AG1
A57
IO15RSB0V0
IO21RSB0V0
A22
AC1
AC1
A58
IO10RSB0V0
IO13RSB0V0
A23
AV2
AV2
A59
IO07RSB0V0
IO10RSB0V0
A24
AT2
AT2
A60
GAC0/IO04RSB0V0
IO06RSB0V0
A25
AT3
AT3
A61
GAB1/IO03RSB0V0
GAC1/IO05RSB0V0
A26
AC3
AC3
A62
VCC
VCC
A27
AV4
AV4
A63
GAA1/IO01RSB0V0
GAB0/IO02RSB0V0
A28
AC4
AC4
A64
NC
NC
A29
AT4
AT4
B1
VCOMPLA
VCOMPLA
A30
NC
AG5
B2
GAA2/IO52PDB3V0 GAC2/IO74PDB3V0
A31
NC
AV5
B3
GAC2/IO51PDB3V0
GFA2/IO71PDB3V0
A32
ADCGNDREF
ADCGNDREF
B4
GFB2/IO50PDB3V0
GFB2/IO70PSB3V0
A33
VCC33A
VCC33A
B5
VCC
VCC
A34
GNDA
GNDA
B6
GFC0/IO49NDB3V0
GFC0/IO68NDB3V0
A35
PTBASE
PTBASE
B7
GEB1/IO45PDB3V0
NC
A36
VCCNVM
VCCNVM
B8
VCCOSC
VCCOSC
4 -4
Pr e li m i n a r y v1 . 7
Actel Fusion Mixed-Signal FPGAs
180-Pin QFN
180-Pin QFN
Pin Number
AFS090 Function
AFS250 Function
Pin Number
AFS090 Function
AFS250 Function
B9
XTAL2
XTAL2
B43
GCB2/IO33PSB1V0
GBC2/IO42PSB1V0
VCC
VCC
B10
GEA0/IO44NDB3V0 GFA0/IO66NDB3V0
B44
B11
GEB2/IO42PDB3V0
IO60NDB3V0
B45
B12
VCC
VCC
B46
GNDQ
GNDQ
B12
VCC
VCC
B47
GBA1/IO30RSB0V0
GBA0/IO38RSB0V0
B13
VCCNVM
VCCNVM
B48
GBB1/IO28RSB0V0
GBC1/IO35RSB0V0
B14
VCC15A
VCC15A
B49
VCC
VCC
B15
NCAP
NCAP
B50
GBC0/IO25RSB0V0
IO31RSB0V0
B16
VCC33N
VCC33N
B51
IO23RSB0V0
IO28RSB0V0
B17
GNDAQ
GNDAQ
B52
IO20RSB0V0
IO25RSB0V0
B18
AC0
AC0
B53
VCC
VCC
B19
AT0
AT0
B54
IO11RSB0V0
IO14RSB0V0
B20
AT1
AT1
B55
IO08RSB0V0
IO11RSB0V0
B21
AV1
AV1
B56
GAC1/IO05RSB0V0
IO08RSB0V0
B22
AC2
AC2
B57
VCCIB0
VCCIB0
B23
ATRTN1
ATRTN1
B58
GAB0/IO02RSB0V0
GAC0/IO04RSB0V0
B24
AG3
AG3
B59
GAA0/IO00RSB0V0
GAA1/IO01RSB0V0
B25
AV3
AV3
B60
VCCPLA
VCCPLA
B26
AG4
AG4
C1
NC
NC
B27
ATRTN2
ATRTN2
C2
NC
VCCIB3
B28
NC
AC5
C3
GND
GND
B29
VCC33A
VCC33A
C4
NC
GFC2/IO69PPB3V0
B30
VAREF
VAREF
C5
GFC1/IO49PDB3V0
GFC1/IO68PDB3V0
B31
PUB
PUB
C6
GFA0/IO47NPB3V0
GFB0/IO67NPB3V0
B32
PTEM
PTEM
C7
VCCIB3
NC
B33
GNDNVM
GNDNVM
C8
GND
GND
B34
VCC
VCC
C9
GEA1/IO44PDB3V0
GFA1/IO66PDB3V0
B34
VCC
VCC
C10
GEA2/IO42NDB3V0 GEC2/IO60PDB3V0
B35
TCK
TCK
C11
NC
GEA2/IO58PSB3V0
B36
TMS
TMS
C12
NC
NC
B37
TRST
TRST
C13
GND
GND
B38
GDB2/IO41PSB1V0
GDA2/IO55PSB1V0
C14
NC
NC
B39
GDC0/IO38NDB1V0 GDB0/IO53NDB1V0
C15
NC
NC
C16
GNDA
GNDA
B40
VCCIB1
VCCIB1
GBA2/IO31PDB1V0 GBA2/IO40PDB1V0
B41
GCA1/IO36PDB1V0 GCA1/IO49PDB1V0
C17
NC
NC
B42
GCC0/IO34NDB1V0 GCC0/IO47NDB1V0
C18
NC
NC
Pr e li m i n a ry v1 . 7
4-5
Package Pin Assignments
180-Pin QFN
180-Pin QFN
Pin Number
AFS090 Function
AFS250 Function
Pin Number
AFS090 Function
AFS250 Function
C19
NC
NC
C55
NC
GAA0/IO00RSB0V0
C20
NC
NC
C56
NC
NC
C21
AG2
AG2
D1
NC
NC
C22
NC
NC
D2
NC
NC
C23
NC
NC
D3
NC
NC
C24
NC
NC
D4
NC
NC
C25
NC
AT5
C26
GNDAQ
GNDAQ
C27
NC
NC
C28
NC
NC
C29
NC
NC
C30
NC
NC
C31
GND
GND
C32
NC
NC
C33
NC
NC
C34
NC
NC
C35
GND
GND
4 -6
C36
GDB0/IO39NPB1V0 GDA0/IO54NPB1V0
C37
GDA1/IO37NSB1V0 GDC0/IO52NSB1V0
C38
GCA0/IO36NDB1V0 GCA0/IO49NDB1V0
C39
GCB1/IO35PPB1V0
GCB1/IO48PPB1V0
C40
GND
GND
C41
GCA2/IO32NPB1V0
IO41NPB1V0
C42
GBB2/IO31NDB1V0
IO40NDB1V0
C43
NC
NC
C44
NC
GBA1/IO39RSB0V0
C45
NC
GBB0/IO36RSB0V0
C46
GND
GND
C47
NC
IO30RSB0V0
C48
IO22RSB0V0
IO27RSB0V0
C49
GND
GND
C50
IO13RSB0V0
IO16RSB0V0
C51
IO09RSB0V0
IO12RSB0V0
C52
IO06RSB0V0
IO09RSB0V0
C53
GND
GND
C54
NC
GAB1/IO03RSB0V0
Pr e li m i n a r y v1 . 7
Actel Fusion Mixed-Signal FPGAs
208-Pin PQFP
1
208
208-Pin PQFP
Note
For Package Manufacturing and Environmental information, visit the Resource Center at
http://www.actel.com/products/solutions/package/default.aspx.
Pr e li m i n a ry v1 . 7
4-7
Package Pin Assignments
208-Pin PQFP
208-Pin PQFP
Pin Number
AFS250 Function
AFS600 Function
Pin Number
AFS250 Function
AFS600 Function
1
VCCPLA
VCCPLA
37
GEC2/IO60PDB3V0
GEB1/IO62PDB4V0
2
VCOMPLA
VCOMPLA
38
IO60NDB3V0
GEB0/IO62NDB4V0
3
GNDQ
GAA2/IO85PDB4V0
39
GND
GEA1/IO61PDB4V0
4
VCCIB3
IO85NDB4V0
40
VCCIB3
GEA0/IO61NDB4V0
41
GEB2/IO59PDB3V0
GEC2/IO60PDB4V0
5
4 -8
GAA2/IO76PDB3V0 GAB2/IO84PDB4V0
6
IO76NDB3V0
IO84NDB4V0
42
IO59NDB3V0
IO60NDB4V0
7
GAB2/IO75PDB3V0
GAC2/IO83PDB4V0
43
GEA2/IO58PDB3V0
VCCIB4
8
IO75NDB3V0
IO83NDB4V0
44
IO58NDB3V0
GNDQ
9
NC
IO77PDB4V0
45
VCC
VCC
10
NC
IO77NDB4V0
45
VCC
VCC
11
VCC
IO76PDB4V0
46
VCCNVM
VCCNVM
12
GND
IO76NDB4V0
47
GNDNVM
GNDNVM
13
VCCIB3
VCC
48
GND
GND
14
IO72PDB3V0
GND
49
VCC15A
VCC15A
15
IO72NDB3V0
VCCIB4
50
PCAP
PCAP
16
GFA2/IO71PDB3V0
GFA2/IO75PDB4V0
51
NCAP
NCAP
17
IO71NDB3V0
IO75NDB4V0
52
VCC33PMP
VCC33PMP
18
GFB2/IO70PDB3V0
GFC2/IO73PDB4V0
53
VCC33N
VCC33N
19
IO70NDB3V0
IO73NDB4V0
54
GNDA
GNDA
20
GFC2/IO69PDB3V0
VCCOSC
55
GNDAQ
GNDAQ
21
IO69NDB3V0
XTAL1
56
NC
AV0
22
VCC
XTAL2
57
NC
AC0
23
GND
GNDOSC
58
NC
AG0
24
VCCIB3
GFC1/IO72PDB4V0
59
NC
AT0
25
GFC1/IO68PDB3V0
GFC0/IO72NDB4V0
60
NC
ATRTN0
26
GFC0/IO68NDB3V0
GFB1/IO71PDB4V0
61
NC
AT1
27
GFB1/IO67PDB3V0
GFB0/IO71NDB4V0
62
NC
AG1
28
GFB0/IO67NDB3V0
GFA1/IO70PDB4V0
63
NC
AC1
29
VCCOSC
GFA0/IO70NDB4V0
64
NC
AV1
30
XTAL1
IO69PDB4V0
65
AV0
AV2
31
XTAL2
IO69NDB4V0
66
AC0
AC2
32
GNDOSC
VCC
67
AG0
AG2
33
GEB1/IO62PDB3V0
GND
68
AT0
AT2
34
GEB0/IO62NDB3V0
VCCIB4
69
ATRTN0
ATRTN1
35
GEA1/IO61PDB3V0
GEC1/IO63PDB4V0
70
AT1
AT3
36
GEA0/IO61NDB3V0 GEC0/IO63NDB4V0
71
AG1
AG3
Pr e li m i n a r y v1 . 7
Actel Fusion Mixed-Signal FPGAs
208-Pin PQFP
208-Pin PQFP
Pin Number
AFS250 Function
AFS600 Function
Pin Number
AFS250 Function
AFS600 Function
72
AC1
AC3
108
PTEM
PTEM
73
AV1
AV3
109
PTBASE
PTBASE
74
AV2
AV4
110
GNDNVM
GNDNVM
75
AC2
AC4
111
VCCNVM
VCCNVM
76
AG2
AG4
112
VCC
VCC
77
AT2
AT4
112
VCC
VCC
78
ATRTN1
ATRTN2
113
VPUMP
VPUMP
79
AT3
AT5
114
GNDQ
NC
80
AG3
AG5
115
VCCIB1
TCK
81
AC3
AC5
116
TCK
TDI
82
AV3
AV5
117
TDI
TMS
83
AV4
AV6
118
TMS
TDO
84
AC4
AC6
119
TDO
TRST
85
AG4
AG6
120
TRST
VJTAG
86
AT4
AT6
121
VJTAG
IO57NDB2V0
87
ATRTN2
ATRTN3
122
IO57NDB1V0
GDC2/IO57PDB2V0
88
AT5
AT7
123
GDC2/IO57PDB1V0
IO56NDB2V0
89
AG5
AG7
124
IO56NDB1V0
GDB2/IO56PDB2V0
90
AC5
AC7
125
GDB2/IO56PDB1V0
IO55NDB2V0
91
AV5
AV7
126
VCCIB1
GDA2/IO55PDB2V0
92
NC
AV8
127
GND
93
NC
AC8
GDA0/IO54NDB2V
0
94
NC
AG8
128
IO55NDB1V0
GDA1/IO54PDB2V0
95
NC
AT8
129
GDA2/IO55PDB1V0
VCCIB2
96
NC
ATRTN4
130
GDA0/IO54NDB1V0
GND
97
NC
AT9
131
GDA1/IO54PDB1V0
VCC
98
NC
AG9
132
GDB0/IO53NDB1V0 GCA0/IO45NDB2V0
99
NC
AC9
133
GDB1/IO53PDB1V0 GCA1/IO45PDB2V0
100
NC
AV9
134
GDC0/IO52NDB1V0 GCB0/IO44NDB2V0
101
GNDAQ
GNDAQ
135
GDC1/IO52PDB1V0
GCB1/IO44PDB2V0
102
VCC33A
VCC33A
136
IO51NSB1V0
GCC0/IO43NDB2V0
103
ADCGNDREF
ADCGNDREF
137
VCCIB1
GCC1/IO43PDB2V0
104
VAREF
VAREF
138
GND
IO42NDB2V0
105
PUB
PUB
139
VCC
IO42PDB2V0
106
VCC33A
VCC33A
140
IO50NDB1V0
IO41NDB2V0
107
GNDA
GNDA
141
IO50PDB1V0
GCC2/IO41PDB2V0
Pr e li m i n a ry v1 . 7
4-9
Package Pin Assignments
208-Pin PQFP
208-Pin PQFP
Pin Number
AFS250 Function
AFS600 Function
Pin Number
AFS250 Function
AFS600 Function
142
GCA0/IO49NDB1V0
VCCIB2
178
IO24RSB0V0
IO14NSB0V1
143
GCA1/IO49PDB1V0
GND
179
IO23RSB0V0
IO12PDB0V1
144
GCB0/IO48NDB1V0
VCC
180
IO22RSB0V0
IO12NDB0V1
145
GCB1/IO48PDB1V0
IO40NDB2V0
181
IO21RSB0V0
VCCIB0
146
GCC0/IO47NDB1V0
GCB2/IO40PDB2V0
182
IO20RSB0V0
GND
147
GCC1/IO47PDB1V0
IO39NDB2V0
183
IO19RSB0V0
VCC
148
IO42NDB1V0
GCA2/IO39PDB2V0
184
IO18RSB0V0
IO10PPB0V1
149
GBC2/IO42PDB1V0
IO31NDB2V0
185
IO17RSB0V0
IO09PPB0V1
150
VCCIB1
GBB2/IO31PDB2V0
186
IO16RSB0V0
IO10NPB0V1
151
GND
IO30NDB2V0
187
IO15RSB0V0
IO09NPB0V1
152
VCC
GBA2/IO30PDB2V0
188
VCCIB0
IO08PPB0V1
153
IO41NDB1V0
VCCIB2
189
GND
IO07PPB0V1
154
GBB2/IO41PDB1V0
GNDQ
190
VCC
IO08NPB0V1
155
IO40NDB1V0
VCOMPLB
191
IO14RSB0V0
IO07NPB0V1
156
GBA2/IO40PDB1V0
VCCPLB
192
IO13RSB0V0
IO06PPB0V0
157
GBA1/IO39RSB0V0
VCCIB1
193
IO12RSB0V0
IO05PPB0V0
158
GBA0/IO38RSB0V0
GNDQ
194
IO11RSB0V0
IO06NPB0V0
159
GBB1/IO37RSB0V0
GBB1/IO27PPB1V1
195
IO10RSB0V0
IO04PPB0V0
160
GBB0/IO36RSB0V0
GBA1/IO28PPB1V1
196
IO09RSB0V0
IO05NPB0V0
161
GBC1/IO35RSB0V0
GBB0/IO27NPB1V1
197
IO08RSB0V0
IO04NPB0V0
162
VCCIB0
GBA0/IO28NPB1V1
198
IO07RSB0V0
GAC1/IO03PDB0V0
163
GND
VCCIB1
199
IO06RSB0V0
GAC0/IO03NDB0V0
164
VCC
GND
200
GAC1/IO05RSB0V0
VCCIB0
165
GBC0/IO34RSB0V0
VCC
201
VCCIB0
GND
166
IO33RSB0V0
GBC1/IO26PDB1V1
202
GND
VCC
167
IO32RSB0V0
GBC0/IO26NDB1V1
203
VCC
GAB1/IO02PDB0V0
168
IO31RSB0V0
IO24PPB1V1
204
GAC0/IO04RSB0V0
GAB0/IO02NDB0V0
169
IO30RSB0V0
IO23PPB1V1
205
GAB1/IO03RSB0V0
GAA1/IO01PDB0V0
170
IO29RSB0V0
IO24NPB1V1
206
GAB0/IO02RSB0V0
171
IO28RSB0V0
IO23NPB1V1
GAA0/IO01NDB0V
0
172
IO27RSB0V0
IO22PPB1V0
207
GAA1/IO01RSB0V0
GNDQ
173
IO26RSB0V0
IO21PPB1V0
208
GAA0/IO00RSB0V0
VCCIB0
174
IO25RSB0V0
IO22NPB1V0
175
VCCIB0
IO21NPB1V0
176
GND
IO20PSB1V0
177
VCC
IO19PSB1V0
4 -1 0
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
256-Pin FBGA
A1 Ball Pad Corner
16 15 14 13 12 11 10 9
8
7
6 5 4
3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
Note
For Package Manufacturing and Environmental information, visit the Resource Center at
http://www.actel.com/products/solutions/package/default.aspx.
Pr e li m i n a ry v1 . 7
4 - 11
Package Pin Assignments
256-Pin FBGA
Pin Number
AFS090 Function
AFS250 Function
AFS600 Function
AFS1500 Function
A1
GND
GND
GND
GND
A2
VCCIB0
VCCIB0
VCCIB0
VCCIB0
A3
GAB0/IO02RSB0V0
GAA0/IO00RSB0V0
GAA0/IO01NDB0V0
GAA0/IO01NDB0V0
A4
GAB1/IO03RSB0V0
GAA1/IO01RSB0V0
GAA1/IO01PDB0V0
GAA1/IO01PDB0V0
A5
GND
GND
GND
GND
A6
IO07RSB0V0
IO11RSB0V0
IO10PDB0V1
IO07PDB0V1
A7
IO10RSB0V0
IO14RSB0V0
IO12PDB0V1
IO13PDB0V2
A8
IO11RSB0V0
IO15RSB0V0
IO12NDB0V1
IO13NDB0V2
A9
IO16RSB0V0
IO24RSB0V0
IO22NDB1V0
IO24NDB1V0
A10
IO17RSB0V0
IO25RSB0V0
IO22PDB1V0
IO24PDB1V0
A11
IO18RSB0V0
IO26RSB0V0
IO24NDB1V1
IO29NDB1V1
A12
GND
GND
GND
GND
A13
GBC0/IO25RSB0V0
GBA0/IO38RSB0V0
GBA0/IO28NDB1V1
GBA0/IO42NDB1V2
A14
GBA0/IO29RSB0V0
IO32RSB0V0
IO29NDB1V1
IO43NDB1V2
A15
VCCIB0
VCCIB0
VCCIB1
VCCIB1
A16
GND
GND
GND
GND
B1
VCOMPLA
VCOMPLA
VCOMPLA
VCOMPLA
B2
VCCPLA
VCCPLA
VCCPLA
VCCPLA
B3
GAA0/IO00RSB0V0
IO07RSB0V0
IO00NDB0V0
IO00NDB0V0
B4
GAA1/IO01RSB0V0
IO06RSB0V0
IO00PDB0V0
IO00PDB0V0
B5
NC
GAB1/IO03RSB0V0
GAB1/IO02PPB0V0
GAB1/IO02PPB0V0
B6
IO06RSB0V0
IO10RSB0V0
IO10NDB0V1
IO07NDB0V1
B7
VCCIB0
VCCIB0
VCCIB0
VCCIB0
B8
IO12RSB0V0
IO16RSB0V0
IO18NDB1V0
IO22NDB1V0
B9
IO13RSB0V0
IO17RSB0V0
IO18PDB1V0
IO22PDB1V0
B10
VCCIB0
VCCIB0
VCCIB1
VCCIB1
B11
IO19RSB0V0
IO27RSB0V0
IO24PDB1V1
IO29PDB1V1
B12
GBB0/IO27RSB0V0
GBC0/IO34RSB0V0
GBC0/IO26NPB1V1
GBC0/IO40NPB1V2
B13
GBC1/IO26RSB0V0
GBA1/IO39RSB0V0
GBA1/IO28PDB1V1
GBA1/IO42PDB1V2
B14
GBA1/IO30RSB0V0
IO33RSB0V0
IO29PDB1V1
IO43PDB1V2
B15
NC
NC
VCCPLB
VCCPLB
B16
NC
NC
VCOMPLB
VCOMPLB
C1
VCCIB3
VCCIB3
VCCIB4
VCCIB4
C2
GND
GND
GND
GND
C3
VCCIB3
VCCIB3
VCCIB4
VCCIB4
C4
NC
NC
VCCIB0
VCCIB0
C5
VCCIB0
VCCIB0
VCCIB0
VCCIB0
C6
GAC1/IO05RSB0V0
GAC1/IO05RSB0V0
GAC1/IO03PDB0V0
GAC1/IO03PDB0V0
4 -1 2
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
256-Pin FBGA
Pin Number
AFS090 Function
AFS250 Function
AFS600 Function
AFS1500 Function
C7
IO09RSB0V0
IO12RSB0V0
IO06NDB0V0
IO09NDB0V1
C8
IO14RSB0V0
IO22RSB0V0
IO16PDB1V0
IO23PDB1V0
C9
IO15RSB0V0
IO23RSB0V0
IO16NDB1V0
IO23NDB1V0
C10
IO22RSB0V0
IO30RSB0V0
IO25NDB1V1
IO31NDB1V1
C11
IO20RSB0V0
IO31RSB0V0
IO25PDB1V1
IO31PDB1V1
C12
VCCIB0
VCCIB0
VCCIB1
VCCIB1
C13
GBB1/IO28RSB0V0
GBC1/IO35RSB0V0
GBC1/IO26PPB1V1
GBC1/IO40PPB1V2
C14
VCCIB1
VCCIB1
VCCIB2
VCCIB2
C15
GND
GND
GND
GND
C16
VCCIB1
VCCIB1
VCCIB2
VCCIB2
D1
GFC2/IO50NPB3V0
IO75NDB3V0
IO84NDB4V0
IO124NDB4V0
D2
GFA2/IO51NDB3V0
GAB2/IO75PDB3V0
GAB2/IO84PDB4V0
GAB2/IO124PDB4V0
D3
GAC2/IO51PDB3V0
IO76NDB3V0
IO85NDB4V0
IO125NDB4V0
D4
GAA2/IO52PDB3V0
GAA2/IO76PDB3V0
GAA2/IO85PDB4V0
GAA2/IO125PDB4V0
D5
GAB2/IO52NDB3V0
GAB0/IO02RSB0V0
GAB0/IO02NPB0V0
GAB0/IO02NPB0V0
D6
GAC0/IO04RSB0V0
GAC0/IO04RSB0V0
GAC0/IO03NDB0V0
GAC0/IO03NDB0V0
D7
IO08RSB0V0
IO13RSB0V0
IO06PDB0V0
IO09PDB0V1
D8
NC
IO20RSB0V0
IO14NDB0V1
IO15NDB0V2
D9
NC
IO21RSB0V0
IO14PDB0V1
IO15PDB0V2
D10
IO21RSB0V0
IO28RSB0V0
IO23PDB1V1
IO37PDB1V2
D11
IO23RSB0V0
GBB0/IO36RSB0V0
GBB0/IO27NDB1V1
GBB0/IO41NDB1V2
D12
NC
NC
VCCIB1
VCCIB1
D13
GBA2/IO31PDB1V0
GBA2/IO40PDB1V0
GBA2/IO30PDB2V0
GBA2/IO44PDB2V0
D14
GBB2/IO31NDB1V0
IO40NDB1V0
IO30NDB2V0
IO44NDB2V0
D15
GBC2/IO32PDB1V0
GBB2/IO41PDB1V0
GBB2/IO31PDB2V0
GBB2/IO45PDB2V0
D16
GCA2/IO32NDB1V0
IO41NDB1V0
IO31NDB2V0
IO45NDB2V0
E1
GND
GND
GND
GND
E2
GFB0/IO48NPB3V0
IO73NDB3V0
IO81NDB4V0
IO118NDB4V0
E3
GFB2/IO50PPB3V0
IO73PDB3V0
IO81PDB4V0
IO118PDB4V0
E4
VCCIB3
VCCIB3
VCCIB4
VCCIB4
E5
NC
IO74NPB3V0
IO83NPB4V0
IO123NPB4V0
E6
NC
IO08RSB0V0
IO04NPB0V0
IO05NPB0V1
E7
GND
GND
GND
GND
E8
NC
IO18RSB0V0
IO08PDB0V1
IO11PDB0V1
E9
NC
NC
IO20NDB1V0
IO27NDB1V1
E10
GND
GND
GND
GND
E11
IO24RSB0V0
GBB1/IO37RSB0V0
GBB1/IO27PDB1V1
GBB1/IO41PDB1V2
E12
NC
IO50PPB1V0
IO33PSB2V0
IO48PSB2V0
Pr e li m i n a ry v1 . 7
4 - 13
Package Pin Assignments
256-Pin FBGA
Pin Number
AFS090 Function
AFS250 Function
AFS600 Function
AFS1500 Function
E13
VCCIB1
VCCIB1
VCCIB2
VCCIB2
E14
GCC2/IO33NDB1V0
IO42NDB1V0
IO32NDB2V0
IO46NDB2V0
E15
GCB2/IO33PDB1V0
GBC2/IO42PDB1V0
GBC2/IO32PDB2V0
GBC2/IO46PDB2V0
E16
GND
GND
GND
GND
F1
NC
NC
IO79NDB4V0
IO111NDB4V0
F2
NC
NC
IO79PDB4V0
IO111PDB4V0
F3
GFB1/IO48PPB3V0
IO72NDB3V0
IO76NDB4V0
IO112NDB4V0
F4
GFC0/IO49NDB3V0
IO72PDB3V0
IO76PDB4V0
IO112PDB4V0
F5
NC
NC
IO82PSB4V0
IO120PSB4V0
F6
GFC1/IO49PDB3V0
GAC2/IO74PPB3V0
GAC2/IO83PPB4V0
GAC2/IO123PPB4V0
F7
NC
IO09RSB0V0
IO04PPB0V0
IO05PPB0V1
F8
NC
IO19RSB0V0
IO08NDB0V1
IO11NDB0V1
F9
NC
NC
IO20PDB1V0
IO27PDB1V1
F10
NC
IO29RSB0V0
IO23NDB1V1
IO37NDB1V2
F11
NC
IO43NDB1V0
IO36NDB2V0
IO50NDB2V0
F12
NC
IO43PDB1V0
IO36PDB2V0
IO50PDB2V0
F13
NC
IO44NDB1V0
IO39NDB2V0
IO59NDB2V0
F14
NC
GCA2/IO44PDB1V0
GCA2/IO39PDB2V0
GCA2/IO59PDB2V0
F15
GCC1/IO34PDB1V0
GCB2/IO45PDB1V0
GCB2/IO40PDB2V0
GCB2/IO60PDB2V0
F16
GCC0/IO34NDB1V0
IO45NDB1V0
IO40NDB2V0
IO60NDB2V0
G1
GEC0/IO46NPB3V0
IO70NPB3V0
IO74NPB4V0
IO109NPB4V0
G2
VCCIB3
VCCIB3
VCCIB4
VCCIB4
G3
GEC1/IO46PPB3V0
GFB2/IO70PPB3V0
GFB2/IO74PPB4V0
GFB2/IO109PPB4V0
G4
GFA1/IO47PDB3V0
GFA2/IO71PDB3V0
GFA2/IO75PDB4V0
GFA2/IO110PDB4V0
G5
GND
GND
GND
GND
G6
GFA0/IO47NDB3V0
IO71NDB3V0
IO75NDB4V0
IO110NDB4V0
G7
GND
GND
GND
GND
G8
VCC
VCC
VCC
VCC
G9
GND
GND
GND
GND
G10
VCC
VCC
VCC
VCC
G11
GDA1/IO37NDB1V0
GCC0/IO47NDB1V0
GCC0/IO43NDB2V0
GCC0/IO62NDB2V0
G12
GND
GND
GND
GND
G13
IO37PDB1V0
GCC1/IO47PDB1V0
GCC1/IO43PDB2V0
GCC1/IO62PDB2V0
G14
GCB0/IO35NPB1V0
IO46NPB1V0
IO41NPB2V0
IO61NPB2V0
G15
VCCIB1
VCCIB1
VCCIB2
VCCIB2
G16
GCB1/IO35PPB1V0
GCC2/IO46PPB1V0
GCC2/IO41PPB2V0
GCC2/IO61PPB2V0
H1
GEB1/IO45PDB3V0
GFC2/IO69PDB3V0
GFC2/IO73PDB4V0
GFC2/IO108PDB4V0
H2
GEB0/IO45NDB3V0
IO69NDB3V0
IO73NDB4V0
IO108NDB4V0
4 -1 4
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
256-Pin FBGA
Pin Number
AFS090 Function
AFS250 Function
AFS600 Function
AFS1500 Function
H3
XTAL2
XTAL2
XTAL2
XTAL2
H4
XTAL1
XTAL1
XTAL1
XTAL1
H5
GNDOSC
GNDOSC
GNDOSC
GNDOSC
H6
VCCOSC
VCCOSC
VCCOSC
VCCOSC
H7
VCC
VCC
VCC
VCC
H8
GND
GND
GND
GND
H9
VCC
VCC
VCC
VCC
H10
GND
GND
GND
GND
H11
GDC0/IO38NDB1V0
IO51NDB1V0
IO47NDB2V0
IO69NDB2V0
H12
GDC1/IO38PDB1V0
IO51PDB1V0
IO47PDB2V0
IO69PDB2V0
H13
GDB1/IO39PDB1V0
GCA1/IO49PDB1V0
GCA1/IO45PDB2V0
GCA1/IO64PDB2V0
H14
GDB0/IO39NDB1V0
GCA0/IO49NDB1V0
GCA0/IO45NDB2V0
GCA0/IO64NDB2V0
H15
GCA0/IO36NDB1V0
GCB0/IO48NDB1V0
GCB0/IO44NDB2V0
GCB0/IO63NDB2V0
H16
GCA1/IO36PDB1V0
GCB1/IO48PDB1V0
GCB1/IO44PDB2V0
GCB1/IO63PDB2V0
J1
GEA0/IO44NDB3V0
GFA0/IO66NDB3V0
GFA0/IO70NDB4V0
GFA0/IO105NDB4V0
J2
GEA1/IO44PDB3V0
GFA1/IO66PDB3V0
GFA1/IO70PDB4V0
GFA1/IO105PDB4V0
J3
IO43NDB3V0
GFB0/IO67NDB3V0
GFB0/IO71NDB4V0
GFB0/IO106NDB4V0
J4
GEC2/IO43PDB3V0
GFB1/IO67PDB3V0
GFB1/IO71PDB4V0
GFB1/IO106PDB4V0
J5
NC
GFC0/IO68NDB3V0
GFC0/IO72NDB4V0
GFC0/IO107NDB4V0
J6
NC
GFC1/IO68PDB3V0
GFC1/IO72PDB4V0
GFC1/IO107PDB4V0
J7
GND
GND
GND
GND
J8
VCC
VCC
VCC
VCC
J9
GND
GND
GND
GND
J10
VCC
VCC
VCC
VCC
J11
GDC2/IO41NPB1V0
IO56NPB1V0
IO56NPB2V0
IO83NPB2V0
J12
NC
GDB0/IO53NPB1V0
GDB0/IO53NPB2V0
GDB0/IO80NPB2V0
J13
NC
GDA1/IO54PDB1V0
GDA1/IO54PDB2V0
GDA1/IO81PDB2V0
J14
GDA0/IO40PDB1V0
GDC1/IO52PPB1V0
GDC1/IO52PPB2V0
GDC1/IO79PPB2V0
J15
NC
IO50NPB1V0
IO51NSB2V0
IO77NSB2V0
J16
GDA2/IO40NDB1V0
GDC0/IO52NPB1V0
GDC0/IO52NPB2V0
GDC0/IO79NPB2V0
K1
NC
IO65NPB3V0
IO67NPB4V0
IO92NPB4V0
K2
VCCIB3
VCCIB3
VCCIB4
VCCIB4
K3
NC
IO65PPB3V0
IO67PPB4V0
IO92PPB4V0
K4
NC
IO64PDB3V0
IO65PDB4V0
IO96PDB4V0
K5
GND
GND
GND
GND
K6
NC
IO64NDB3V0
IO65NDB4V0
IO96NDB4V0
K7
VCC
VCC
VCC
VCC
K8
GND
GND
GND
GND
Pr e li m i n a ry v1 . 7
4 - 15
Package Pin Assignments
256-Pin FBGA
Pin Number
AFS090 Function
AFS250 Function
AFS600 Function
AFS1500 Function
K9
VCC
VCC
VCC
VCC
K10
GND
GND
GND
GND
K11
NC
GDC2/IO57PPB1V0
GDC2/IO57PPB2V0
GDC2/IO84PPB2V0
K12
GND
GND
GND
GND
K13
NC
GDA0/IO54NDB1V0
GDA0/IO54NDB2V0
GDA0/IO81NDB2V0
K14
NC
GDA2/IO55PPB1V0
GDA2/IO55PPB2V0
GDA2/IO82PPB2V0
K15
VCCIB1
VCCIB1
VCCIB2
VCCIB2
K16
NC
GDB1/IO53PPB1V0
GDB1/IO53PPB2V0
GDB1/IO80PPB2V0
L1
NC
GEC1/IO63PDB3V0
GEC1/IO63PDB4V0
GEC1/IO90PDB4V0
L2
NC
GEC0/IO63NDB3V0
GEC0/IO63NDB4V0
GEC0/IO90NDB4V0
L3
NC
GEB1/IO62PDB3V0
GEB1/IO62PDB4V0
GEB1/IO89PDB4V0
L4
NC
GEB0/IO62NDB3V0
GEB0/IO62NDB4V0
GEB0/IO89NDB4V0
L5
NC
IO60NDB3V0
IO60NDB4V0
IO87NDB4V0
L6
NC
GEC2/IO60PDB3V0
GEC2/IO60PDB4V0
GEC2/IO87PDB4V0
L7
GNDA
GNDA
GNDA
GNDA
L8
AC0
AC0
AC2
AC2
L9
AV2
AV2
AV4
AV4
L10
AC3
AC3
AC5
AC5
L11
PTEM
PTEM
PTEM
PTEM
L12
TDO
TDO
TDO
TDO
L13
VJTAG
VJTAG
VJTAG
VJTAG
L14
NC
IO57NPB1V0
IO57NPB2V0
IO84NPB2V0
L15
GDB2/IO41PPB1V0
GDB2/IO56PPB1V0
GDB2/IO56PPB2V0
GDB2/IO83PPB2V0
L16
NC
IO55NPB1V0
IO55NPB2V0
IO82NPB2V0
M1
GND
GND
GND
GND
M2
NC
GEA1/IO61PDB3V0
GEA1/IO61PDB4V0
GEA1/IO88PDB4V0
M3
NC
GEA0/IO61NDB3V0
GEA0/IO61NDB4V0
GEA0/IO88NDB4V0
M4
VCCIB3
VCCIB3
VCCIB4
VCCIB4
M5
NC
IO58NPB3V0
IO58NPB4V0
IO85NPB4V0
M6
NC
NC
AV0
AV0
M7
NC
NC
AC1
AC1
M8
AG1
AG1
AG3
AG3
M9
AC2
AC2
AC4
AC4
M10
AC4
AC4
AC6
AC6
M11
NC
AG5
AG7
AG7
M12
VPUMP
VPUMP
VPUMP
VPUMP
M13
VCCIB1
VCCIB1
VCCIB2
VCCIB2
M14
TMS
TMS
TMS
TMS
4 -1 6
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
256-Pin FBGA
Pin Number
AFS090 Function
AFS250 Function
AFS600 Function
AFS1500 Function
M15
TRST
TRST
TRST
TRST
M16
GND
GND
GND
GND
N1
GEB2/IO42PDB3V0
GEB2/IO59PDB3V0
GEB2/IO59PDB4V0
GEB2/IO86PDB4V0
N2
GEA2/IO42NDB3V0
IO59NDB3V0
IO59NDB4V0
IO86NDB4V0
N3
NC
GEA2/IO58PPB3V0
GEA2/IO58PPB4V0
GEA2/IO85PPB4V0
N4
VCC33PMP
VCC33PMP
VCC33PMP
VCC33PMP
N5
VCC15A
VCC15A
VCC15A
VCC15A
N6
NC
NC
AG0
AG0
N7
AC1
AC1
AC3
AC3
N8
AG3
AG3
AG5
AG5
N9
AV3
AV3
AV5
AV5
N10
AG4
AG4
AG6
AG6
N11
NC
NC
AC8
AC8
N12
GNDA
GNDA
GNDA
GNDA
N13
VCC33A
VCC33A
VCC33A
VCC33A
N14
VCCNVM
VCCNVM
VCCNVM
VCCNVM
N15
TCK
TCK
TCK
TCK
N16
TDI
TDI
TDI
TDI
P1
VCCNVM
VCCNVM
VCCNVM
VCCNVM
P2
GNDNVM
GNDNVM
GNDNVM
GNDNVM
P3
GNDA
GNDA
GNDA
GNDA
P4
NC
NC
AC0
AC0
P5
NC
NC
AG1
AG1
P6
NC
NC
AV1
AV1
P7
AG0
AG0
AG2
AG2
P8
AG2
AG2
AG4
AG4
P9
GNDA
GNDA
GNDA
GNDA
P10
NC
AC5
AC7
AC7
P11
NC
NC
AV8
AV8
P12
NC
NC
AG8
AG8
P13
NC
NC
AV9
AV9
P14
ADCGNDREF
ADCGNDREF
ADCGNDREF
ADCGNDREF
P15
PTBASE
PTBASE
PTBASE
PTBASE
P16
GNDNVM
GNDNVM
GNDNVM
GNDNVM
R1
VCCIB3
VCCIB3
VCCIB4
VCCIB4
R2
PCAP
PCAP
PCAP
PCAP
R3
NC
NC
AT1
AT1
R4
NC
NC
AT0
AT0
Pr e li m i n a ry v1 . 7
4 - 17
Package Pin Assignments
256-Pin FBGA
Pin Number
AFS090 Function
AFS250 Function
AFS600 Function
AFS1500 Function
R5
AV0
AV0
AV2
AV2
R6
AT0
AT0
AT2
AT2
R7
AV1
AV1
AV3
AV3
R8
AT3
AT3
AT5
AT5
R9
AV4
AV4
AV6
AV6
R10
NC
AT5
AT7
AT7
R11
NC
AV5
AV7
AV7
R12
NC
NC
AT9
AT9
R13
NC
NC
AG9
AG9
R14
NC
NC
AC9
AC9
R15
PUB
PUB
PUB
PUB
R16
VCCIB1
VCCIB1
VCCIB2
VCCIB2
T1
GND
GND
GND
GND
T2
NCAP
NCAP
NCAP
NCAP
T3
VCC33N
VCC33N
VCC33N
VCC33N
T4
NC
NC
ATRTN0
ATRTN0
T5
AT1
AT1
AT3
AT3
T6
ATRTN0
ATRTN0
ATRTN1
ATRTN1
T7
AT2
AT2
AT4
AT4
T8
ATRTN1
ATRTN1
ATRTN2
ATRTN2
T9
AT4
AT4
AT6
AT6
T10
ATRTN2
ATRTN2
ATRTN3
ATRTN3
T11
NC
NC
AT8
AT8
T12
NC
NC
ATRTN4
ATRTN4
T13
GNDA
GNDA
GNDA
GNDA
T14
VCC33A
VCC33A
VCC33A
VCC33A
T15
VAREF
VAREF
VAREF
VAREF
T16
GND
GND
GND
GND
4 -1 8
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
484-Pin FBGA
A1 Ball Pad Corner
22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
Note
For Package Manufacturing and Environmental information, visit the Resource Center at
http://www.actel.com/products/solutions/package/default.aspx.
Pr e li m i n a ry v1 . 7
4 - 19
Package Pin Assignments
484-Pin FBGA
484-Pin FBGA
Pin Number
AFS600 Function
AFS1500 Function
Pin Number
AFS600 Function
AFS1500 Function
A1
GND
GND
AA15
AG8
AG8
A2
VCC
NC
AA16
GNDA
GNDA
A3
GAA1/IO01PDB0V0 GAA1/IO01PDB0V0
AA17
AG9
AG9
A4
GAB0/IO02NDB0V0 GAB0/IO02NDB0V0
AA18
VAREF
VAREF
A5
GAB1/IO02PDB0V0 GAB1/IO02PDB0V0
AA19
VCCIB2
VCCIB2
A6
IO07NDB0V1
IO07NDB0V1
AA20
PTEM
PTEM
A7
IO07PDB0V1
IO07PDB0V1
AA21
GND
GND
A8
IO10PDB0V1
IO09PDB0V1
AA22
VCC
NC
A9
IO14NDB0V1
IO13NDB0V2
AB1
GND
GND
A10
IO14PDB0V1
IO13PDB0V2
AB2
VCC
NC
A11
IO17PDB1V0
IO24PDB1V0
AB3
NC
IO94NSB4V0
A12
IO18PDB1V0
IO26PDB1V0
AB4
GND
GND
A13
IO19NDB1V0
IO27NDB1V1
AB5
VCC33N
VCC33N
A14
IO19PDB1V0
IO27PDB1V1
AB6
AT0
AT0
A15
IO24NDB1V1
IO35NDB1V2
AB7
ATRTN0
ATRTN0
A16
IO24PDB1V1
IO35PDB1V2
AB8
AT1
AT1
A17
GBC0/IO26NDB1V1 GBC0/IO40NDB1V2
AB9
AT2
AT2
A18
GBA0/IO28NDB1V1 GBA0/IO42NDB1V2
AB10
ATRTN1
ATRTN1
A19
IO29NDB1V1
IO43NDB1V2
AB11
AT3
AT3
A20
IO29PDB1V1
IO43PDB1V2
AB12
AT6
AT6
A21
VCC
NC
AB13
ATRTN3
ATRTN3
A22
GND
GND
AB14
AT7
AT7
AA1
VCC
NC
AB15
AT8
AT8
AA2
GND
GND
AB16
ATRTN4
ATRTN4
AA3
VCCIB4
VCCIB4
AB17
AT9
AT9
AA4
VCCIB4
VCCIB4
AB18
VCC33A
VCC33A
AA5
PCAP
PCAP
AB19
GND
GND
AA6
AG0
AG0
AB20
NC
IO76NPB2V0
AA7
GNDA
GNDA
AB21
VCC
NC
AA8
AG1
AG1
AB22
GND
GND
AA9
AG2
AG2
B1
VCC
NC
AA10
GNDA
GNDA
B2
GND
GND
AA11
AG3
AG3
B3
AA12
AG6
AG6
B4
GND
GND
AA13
GNDA
GNDA
B5
IO05NDB0V0
IO04NDB0V0
AA14
AG7
AG7
B6
IO05PDB0V0
IO04PDB0V0
4 -2 0
Pr e li m i n a ry v1 . 7
GAA0/IO01NDB0V0 GAA0/IO01NDB0V0
Actel Fusion Mixed-Signal FPGAs
484-Pin FBGA
484-Pin FBGA
Pin Number
AFS600 Function
AFS1500 Function
Pin Number
AFS600 Function
AFS1500 Function
B7
GND
GND
C21
NC
IO48PSB2V0
B8
IO10NDB0V1
IO09NDB0V1
C22
GBB2/IO31PDB2V0
GBB2/IO45PDB2V0
B9
IO13PDB0V1
IO11PDB0V1
D1
IO82NDB4V0
IO121NDB4V0
B10
GND
GND
D2
GND
GND
B11
IO17NDB1V0
IO24NDB1V0
D3
IO83NDB4V0
IO123NDB4V0
B12
IO18NDB1V0
IO26NDB1V0
D4
B13
GND
GND
GAC2/IO83PDB4V0 GAC2/IO123PDB4V
0
B14
IO21NDB1V0
IO31NDB1V1
D5
GAA2/IO85PDB4V0 GAA2/IO125PDB4V
0
B15
IO21PDB1V0
IO31PDB1V1
D6
GAC0/IO03NDB0V0 GAC0/IO03NDB0V0
B16
GND
GND
D7
GAC1/IO03PDB0V0 GAC1/IO03PDB0V0
B17
GBC1/IO26PDB1V1
GBC1/IO40PDB1V2
B18
GBA1/IO28PDB1V1 GBA1/IO42PDB1V2
D8
IO09NDB0V1
IO10NDB0V1
D9
IO09PDB0V1
IO10PDB0V1
D10
IO11NDB0V1
IO14NDB0V2
D11
IO16NDB1V0
IO23NDB1V0
D12
IO16PDB1V0
IO23PDB1V0
D13
NC
IO32NPB1V1
D14
IO23NDB1V1
IO34NDB1V1
D15
IO23PDB1V1
IO34PDB1V1
D16
IO25PDB1V1
IO37PDB1V2
D17
GBB1/IO27PDB1V1
GBB1/IO41PDB1V2
D18
VCCIB2
VCCIB2
D19
NC
IO47PPB2V0
D20
IO30NDB2V0
IO44NDB2V0
D21
GND
GND
D22
IO31NDB2V0
IO45NDB2V0
B19
GND
GND
B20
VCCPLB
VCCPLB
B21
GND
GND
B22
VCC
NC
C1
IO82PDB4V0
IO121PDB4V0
C2
NC
IO122PSB4V0
C3
IO00NDB0V0
IO00NDB0V0
C4
IO00PDB0V0
IO00PDB0V0
C5
VCCIB0
VCCIB0
C6
IO06NDB0V0
IO05NDB0V1
C7
IO06PDB0V0
IO05PDB0V1
C8
VCCIB0
VCCIB0
C9
IO13NDB0V1
IO11NDB0V1
C10
IO11PDB0V1
IO14PDB0V2
E1
IO81NDB4V0
IO120NDB4V0
C11
VCCIB0
VCCIB0
E2
IO81PDB4V0
IO120PDB4V0
C12
VCCIB1
VCCIB1
E3
VCCIB4
VCCIB4
C13
IO20NDB1V0
IO29NDB1V1
C14
IO20PDB1V0
IO29PDB1V1
C15
VCCIB1
VCCIB1
E5
IO85NDB4V0
IO125NDB4V0
C16
IO25NDB1V1
IO37NDB1V2
E6
GND
GND
E7
VCCIB0
VCCIB0
C17
GBB0/IO27NDB1V1 GBB0/IO41NDB1V2
E4
GAB2/IO84PDB4V0 GAB2/IO124PDB4V
0
C18
VCCIB1
VCCIB1
E8
NC
IO08NDB0V1
C19
VCOMPLB
VCOMPLB
E9
NC
IO08PDB0V1
E10
GND
GND
C20
GBA2/IO30PDB2V0 GBA2/IO44PDB2V0
Pr e li m i n a ry v1 . 7
4 - 21
Package Pin Assignments
484-Pin FBGA
484-Pin FBGA
Pin Number
AFS600 Function
AFS1500 Function
Pin Number
AFS600 Function
AFS1500 Function
E11
IO15NDB1V0
IO22NDB1V0
G3
IO78NDB4V0
IO116NDB4V0
E12
IO15PDB1V0
IO22PDB1V0
G4
IO78PDB4V0
IO116PDB4V0
E13
GND
GND
G5
VCCIB4
VCCIB4
E14
NC
IO32PPB1V1
G6
NC
IO117PDB4V0
E15
NC
IO36NPB1V2
G7
VCCIB4
VCCIB4
E16
VCCIB1
VCCIB1
G8
GND
GND
E17
GND
GND
G9
IO04NDB0V0
IO06NDB0V1
E18
NC
IO47NPB2V0
G10
IO04PDB0V0
IO06PDB0V1
E19
IO33PDB2V0
IO49PDB2V0
G11
IO12NDB0V1
IO16NDB0V2
E20
VCCIB2
VCCIB2
G12
IO12PDB0V1
IO16PDB0V2
E21
IO32NDB2V0
IO46NDB2V0
G13
NC
IO28NDB1V1
E22
GBC2/IO32PDB2V0
GBC2/IO46PDB2V0
G14
NC
IO28PDB1V1
F1
IO80NDB4V0
IO118NDB4V0
G15
GND
GND
F2
IO80PDB4V0
IO118PDB4V0
G16
NC
IO38PPB1V2
F3
NC
IO119NSB4V0
G17
NC
IO53PDB2V0
F4
IO84NDB4V0
IO124NDB4V0
G18
VCCIB2
VCCIB2
F5
GND
GND
G19
IO36PDB2V0
IO52PDB2V0
F6
VCOMPLA
VCOMPLA
G20
IO36NDB2V0
IO52NDB2V0
F7
VCCPLA
VCCPLA
G21
GND
GND
F8
VCCIB0
VCCIB0
G22
IO35NDB2V0
IO51NDB2V0
F9
IO08NDB0V1
IO12NDB0V1
H1
IO77NDB4V0
IO115NDB4V0
F10
IO08PDB0V1
IO12PDB0V1
H2
IO76PDB4V0
IO113PDB4V0
F11
VCCIB0
VCCIB0
H3
VCCIB4
VCCIB4
F12
VCCIB1
VCCIB1
H4
IO79NDB4V0
IO114NDB4V0
F13
IO22NDB1V0
IO30NDB1V1
H5
IO79PDB4V0
IO114PDB4V0
F14
IO22PDB1V0
IO30PDB1V1
H6
NC
IO117NDB4V0
F15
VCCIB1
VCCIB1
H7
GND
GND
F16
NC
IO36PPB1V2
H8
VCC
VCC
F17
NC
IO38NPB1V2
H9
VCCIB0
VCCIB0
F18
GND
GND
H10
GND
GND
F19
IO33NDB2V0
IO49NDB2V0
H11
VCCIB0
VCCIB0
F20
IO34PDB2V0
IO50PDB2V0
H12
VCCIB1
VCCIB1
F21
IO34NDB2V0
IO50NDB2V0
H13
GND
GND
F22
IO35PDB2V0
IO51PDB2V0
H14
VCCIB1
VCCIB1
G1
IO77PDB4V0
IO115PDB4V0
H15
GND
GND
G2
GND
GND
H16
GND
GND
4 -2 2
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
484-Pin FBGA
484-Pin FBGA
Pin Number
AFS600 Function
AFS1500 Function
Pin Number
AFS600 Function
AFS1500 Function
H17
NC
IO53NDB2V0
K8
GND
GND
H18
IO38PDB2V0
IO57PDB2V0
K9
VCC
VCC
K10
GND
GND
H19
GCA2/IO39PDB2V0 GCA2/IO59PDB2V0
H20
VCCIB2
VCCIB2
K11
VCC
VCC
H21
IO37NDB2V0
IO54NDB2V0
K12
GND
GND
H22
IO37PDB2V0
IO54PDB2V0
K13
VCC
VCC
J1
NC
IO112PPB4V0
K14
GND
GND
J2
IO76NDB4V0
IO113NDB4V0
K15
GND
GND
J3
GFB2/IO74PDB4V0 GFB2/IO109PDB4V0
K16
IO40NDB2V0
IO60NDB2V0
J4
GFA2/IO75PDB4V0
GFA2/IO110PDB4V
0
K17
NC
IO58PDB2V0
K18
GND
GND
J5
NC
IO112NPB4V0
K19
NC
IO68NPB2V0
J6
NC
IO104PDB4V0
K20
IO41NDB2V0
IO61NDB2V0
J7
NC
IO111PDB4V0
K21
GND
GND
J8
VCCIB4
VCCIB4
K22
IO42NDB2V0
IO56NDB2V0
J9
GND
GND
L1
IO73NDB4V0
IO108NDB4V0
J10
VCC
VCC
L2
VCCOSC
VCCOSC
J11
GND
GND
L3
VCCIB4
VCCIB4
J12
VCC
VCC
L4
XTAL2
XTAL2
J13
GND
GND
J14
VCC
VCC
L6
J15
VCCIB2
VCCIB2
L7
J16
GCB2/IO40PDB2V0
GCB2/IO60PDB2V0
J17
NC
IO58NDB2V0
J18
IO38NDB2V0
IO57NDB2V0
J19
IO39NDB2V0
IO59NDB2V0
J20
GCC2/IO41PDB2V0
GCC2/IO61PDB2V0
J21
NC
IO55PSB2V0
J22
IO42PDB2V0
IO56PDB2V0
K1
L5
GFC2/IO73PDB4V0 GFC2/IO108PDB4V0
K2
GND
GND
K3
IO74NDB4V0
IO109NDB4V0
K4
IO75NDB4V0
IO110NDB4V0
K5
GND
GND
K6
NC
IO104NDB4V0
K7
NC
IO111NDB4V0
GFC1/IO72PDB4V0 GFC1/IO107PDB4V0
VCCIB4
VCCIB4
GFB1/IO71PDB4V0 GFB1/IO106PDB4V0
L8
VCCIB4
VCCIB4
L9
GND
GND
L10
VCC
VCC
L11
GND
GND
L12
VCC
VCC
L13
GND
GND
L14
VCC
VCC
L15
VCCIB2
VCCIB2
L16
IO48PDB2V0
IO70PDB2V0
L17
VCCIB2
VCCIB2
L18
IO46PDB2V0
IO69PDB2V0
L19
L20
L21
Pr e li m i n a ry v1 . 7
GCA1/IO45PDB2V0 GCA1/IO64PDB2V0
VCCIB2
VCCIB2
GCC0/IO43NDB2V0 GCC0/IO62NDB2V0
4 - 23
Package Pin Assignments
484-Pin FBGA
484-Pin FBGA
Pin Number
AFS600 Function
AFS1500 Function
Pin Number
AFS600 Function
AFS1500 Function
L22
GCC1/IO43PDB2V0
GCC1/IO62PDB2V0
N12
VCC
VCC
M1
NC
IO103PDB4V0
N13
GND
GND
M2
XTAL1
XTAL1
N14
VCC
VCC
M3
VCCIB4
VCCIB4
N15
GND
GND
M4
GNDOSC
GNDOSC
N16
M5
GFC0/IO72NDB4V0
GFC0/IO107NDB4V
0
N17
NC
IO78PDB2V0
N18
GND
GND
M6
VCCIB4
VCCIB4
N19
IO47NDB2V0
IO72NDB2V0
M7
GFB0/IO71NDB4V0
GFB0/IO106NDB4V
0
N20
IO47PDB2V0
IO72PDB2V0
M8
VCCIB4
VCCIB4
N21
GND
GND
M9
VCC
VCC
N22
IO49PDB2V0
IO71PDB2V0
M10
GND
GND
P1
GFA1/IO70PDB4V0
GFA1/IO105PDB4V
0
M11
VCC
VCC
P2
M12
GND
GND
GFA0/IO70NDB4V0 GFA0/IO105NDB4V
0
M13
VCC
VCC
P3
IO68NDB4V0
IO101NDB4V0
M14
GND
GND
P4
IO65PDB4V0
IO96PDB4V0
M15
VCCIB2
VCCIB2
P5
IO65NDB4V0
IO96NDB4V0
M16
IO48NDB2V0
IO70NDB2V0
P6
NC
IO99NDB4V0
M17
VCCIB2
VCCIB2
P7
NC
IO97NDB4V0
M18
IO46NDB2V0
IO69NDB2V0
P8
VCCIB4
VCCIB4
P9
VCC
VCC
P10
GND
GND
M19
M20
4 -2 4
GCA0/IO45NDB2V0 GCA0/IO64NDB2V0
VCCIB2
VCCIB2
GDB2/IO56PDB2V0 GDB2/IO83PDB2V0
M21
GCB0/IO44NDB2V0 GCB0/IO63NDB2V0
P11
VCC
VCC
M22
GCB1/IO44PDB2V0
GCB1/IO63PDB2V0
P12
GND
GND
N1
NC
IO103NDB4V0
P13
VCC
VCC
N2
GND
GND
P14
GND
GND
N3
IO68PDB4V0
IO101PDB4V0
P15
VCCIB2
VCCIB2
N4
NC
IO100NPB4V0
P16
IO56NDB2V0
IO83NDB2V0
N5
GND
GND
P17
NC
IO78NDB2V0
N6
NC
IO99PDB4V0
P18
GDA1/IO54PDB2V0 GDA1/IO81PDB2V0
N7
NC
IO97PDB4V0
P19
GDB1/IO53PDB2V0 GDB1/IO80PDB2V0
N8
GND
GND
P20
IO51NDB2V0
IO73NDB2V0
N9
GND
GND
P21
IO51PDB2V0
IO73PDB2V0
N10
VCC
VCC
P22
IO49NDB2V0
IO71NDB2V0
N11
GND
GND
R1
IO69PDB4V0
IO102PDB4V0
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
484-Pin FBGA
484-Pin FBGA
Pin Number
AFS600 Function
AFS1500 Function
Pin Number
AFS600 Function
AFS1500 Function
R2
IO69NDB4V0
IO102NDB4V0
T16
NC
IO77PPB2V0
R3
VCCIB4
VCCIB4
T17
NC
IO74PDB2V0
R4
IO64PDB4V0
IO91PDB4V0
T18
VCCIB2
VCCIB2
R5
IO64NDB4V0
IO91NDB4V0
T19
IO55NDB2V0
IO82NDB2V0
R6
NC
IO92PDB4V0
T20
R7
GND
GND
T21
R8
GND
GND
T22
R9
VCC33A
VCC33A
U1
IO67PDB4V0
IO98PDB4V0
R10
GNDA
GNDA
U2
IO67NDB4V0
IO98NDB4V0
R11
VCC33A
VCC33A
U3
GEC1/IO63PDB4V0
GEC1/IO90PDB4V0
R12
GNDA
GNDA
U4
GEC0/IO63NDB4V0 GEC0/IO90NDB4V0
R13
VCC33A
VCC33A
U5
GND
GND
R14
GNDA
GNDA
U6
VCCNVM
VCCNVM
R15
VCC
VCC
U7
VCCIB4
VCCIB4
R16
GND
GND
U8
VCC15A
VCC15A
R17
NC
IO74NDB2V0
U9
GNDA
GNDA
GDA2/IO55PDB2V0 GDA2/IO82PDB2V0
GND
GND
GDC1/IO52PDB2V0 GDC1/IO79PDB2V0
R18
GDA0/IO54NDB2V0 GDA0/IO81NDB2V0
U10
AC4
AC4
R19
GDB0/IO53NDB2V0 GDB0/IO80NDB2V0
U11
VCC33A
VCC33A
R20
VCCIB2
VCCIB2
U12
GNDA
GNDA
R21
IO50NDB2V0
IO75NDB2V0
U13
AG5
AG5
R22
IO50PDB2V0
IO75PDB2V0
U14
GNDA
GNDA
T1
NC
IO100PPB4V0
U15
PUB
PUB
T2
GND
GND
U16
VCCIB2
VCCIB2
T3
IO66PDB4V0
IO95PDB4V0
U17
TDI
TDI
T4
IO66NDB4V0
IO95NDB4V0
U18
GND
GND
T5
VCCIB4
VCCIB4
U19
IO57NDB2V0
IO84NDB2V0
T6
NC
IO92NDB4V0
U20
T7
GNDNVM
GNDNVM
U21
T8
GNDA
GNDA
U22
T9
NC
NC
V1
GEB1/IO62PDB4V0
T10
AV4
AV4
V2
GEB0/IO62NDB4V0 GEB0/IO89NDB4V0
T11
NC
NC
V3
VCCIB4
VCCIB4
T12
AV5
AV5
V4
GEA1/IO61PDB4V0
GEA1/IO88PDB4V0
T13
AC5
AC5
V5
GEA0/IO61NDB4V0 GEA0/IO88NDB4V0
T14
NC
NC
V6
GND
GND
T15
GNDA
GNDA
V7
VCC33PMP
VCC33PMP
Pr e li m i n a ry v1 . 7
GDC2/IO57PDB2V0 GDC2/IO84PDB2V0
NC
IO77NPB2V0
GDC0/IO52NDB2V0 GDC0/IO79NDB2V0
GEB1/IO89PDB4V0
4 - 25
Package Pin Assignments
484-Pin FBGA
484-Pin FBGA
Pin Number
AFS600 Function
AFS1500 Function
Pin Number
AFS600 Function
AFS1500 Function
V8
NC
NC
W22
NC
IO76PPB2V0
V9
VCC33A
VCC33A
Y1
GEC2/IO60PDB4V0
GEC2/IO87PDB4V0
V10
AG4
AG4
Y2
IO60NDB4V0
IO87NDB4V0
V11
AT4
AT4
Y3
GEA2/IO58PDB4V0
GEA2/IO85PDB4V0
V12
ATRTN2
ATRTN2
Y4
IO58NDB4V0
IO85NDB4V0
V13
AT5
AT5
Y5
NCAP
NCAP
V14
VCC33A
VCC33A
Y6
AC0
AC0
V15
NC
NC
Y7
VCC33A
VCC33A
V16
VCC33A
VCC33A
Y8
AC1
AC1
V17
GND
GND
Y9
AC2
AC2
V18
TMS
TMS
Y10
VCC33A
VCC33A
V19
VJTAG
VJTAG
Y11
AC3
AC3
V20
VCCIB2
VCCIB2
Y12
AC6
AC6
V21
TRST
TRST
Y13
VCC33A
VCC33A
V22
TDO
TDO
Y14
AC7
AC7
W1
NC
IO93PDB4V0
Y15
AC8
AC8
W2
GND
GND
Y16
VCC33A
VCC33A
W3
NC
IO93NDB4V0
Y17
AC9
AC9
W4
GEB2/IO59PDB4V0
GEB2/IO86PDB4V0
Y18
ADCGNDREF
ADCGNDREF
W5
IO59NDB4V0
IO86NDB4V0
Y19
PTBASE
PTBASE
W6
AV0
AV0
Y20
GNDNVM
GNDNVM
W7
GNDA
GNDA
Y21
VCCNVM
VCCNVM
W8
AV1
AV1
Y22
VPUMP
VPUMP
W9
AV2
AV2
W10
GNDA
GNDA
W11
AV3
AV3
W12
AV6
AV6
W13
GNDA
GNDA
W14
AV7
AV7
W15
AV8
AV8
W16
GNDA
GNDA
W17
AV9
AV9
W18
VCCIB2
VCCIB2
W19
NC
IO68PPB2V0
W20
TCK
TCK
W21
GND
GND
4 -2 6
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
676-Pin FBGA
A1 Ball Pad Corner
26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8
7 6
5 4
3
2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
Note
For Package Manufacturing and Environmental information, visit the Resource Center at
http://www.actel.com/products/solutions/package/default.aspx.
Pr e li m i n a ry v1 . 7
4 - 27
Package Pin Assignments
676-Pin FBGA
676-Pin FBGA
676-Pin FBGA
Pin Number
AFS1500 Function
Pin Number
AFS1500 Function
Pin Number
AFS1500 Function
A1
NC
AA11
AV2
AB21
PTBASE
A2
GND
AA12
GNDA
AB22
GNDNVM
A3
NC
AA13
AV3
AB23
VCCNVM
A4
NC
AA14
AV6
AB24
VPUMP
A5
GND
AA15
GNDA
AB25
NC
A6
NC
AA16
AV7
AB26
GND
A7
NC
AA17
AV8
AC1
NC
A8
GND
AA18
GNDA
AC2
NC
A9
IO17NDB0V2
AA19
AV9
AC3
NC
A10
IO17PDB0V2
AA20
VCCIB2
AC4
GND
A11
GND
AA21
IO68PPB2V0
AC5
VCCIB4
A12
IO18NDB0V2
AA22
TCK
AC6
VCCIB4
A13
IO18PDB0V2
AA23
GND
AC7
PCAP
A14
IO20NDB0V2
AA24
IO76PPB2V0
AC8
AG0
A15
IO20PDB0V2
AA25
VCCIB2
AC9
GNDA
A16
GND
AA26
NC
AC10
AG1
A17
IO21PDB0V2
AB1
GND
AC11
AG2
A18
IO21NDB0V2
AB2
NC
AC12
GNDA
A19
GND
AB3
GEC2/IO87PDB4V0
AC13
AG3
A20
IO39NDB1V2
AB4
IO87NDB4V0
AC14
AG6
A21
IO39PDB1V2
AB5
GEA2/IO85PDB4V0
AC15
GNDA
A22
GND
AB6
IO85NDB4V0
AC16
AG7
A23
NC
AB7
NCAP
AC17
AG8
A24
NC
AB8
AC0
AC18
GNDA
A25
GND
AB9
VCC33A
AC19
AG9
A26
NC
AB10
AC1
AC20
VAREF
AA1
NC
AB11
AC2
AC21
VCCIB2
AA2
VCCIB4
AB12
VCC33A
AC22
PTEM
AA3
IO93PDB4V0
AB13
AC3
AC23
GND
AA4
GND
AB14
AC6
AC24
NC
AA5
IO93NDB4V0
AB15
VCC33A
AC25
NC
AA6
GEB2/IO86PDB4V0
AB16
AC7
AC26
NC
AA7
IO86NDB4V0
AB17
AC8
AD1
NC
AA8
AV0
AB18
VCC33A
AD2
NC
AA9
GNDA
AB19
AC9
AD3
GND
AA10
AV1
AB20
ADCGNDREF
AD4
NC
4 -2 8
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
676-Pin FBGA
676-Pin FBGA
676-Pin FBGA
Pin Number
AFS1500 Function
Pin Number
AFS1500 Function
Pin Number
AFS1500 Function
AD5
IO94NPB4V0
AE15
GNDA
AF25
GND
AD6
GND
AE16
NC
AF26
NC
AD7
VCC33N
AE17
NC
B1
GND
AD8
AT0
AE18
GNDA
B2
GND
AD9
ATRTN0
AE19
NC
B3
NC
AD10
AT1
AE20
NC
B4
NC
AD11
AT2
AE21
NC
B5
NC
AD12
ATRTN1
AE22
NC
B6
VCCIB0
AD13
AT3
AE23
NC
B7
NC
AD14
AT6
AE24
NC
B8
NC
AD15
ATRTN3
AE25
GND
B9
VCCIB0
AD16
AT7
AE26
GND
B10
IO15NDB0V2
AD17
AT8
AF1
NC
B11
IO15PDB0V2
AD18
ATRTN4
AF2
GND
B12
VCCIB0
AD19
AT9
AF3
NC
B13
IO19NDB0V2
AD20
VCC33A
AF4
NC
B14
IO19PDB0V2
AD21
GND
AF5
NC
B15
VCCIB1
AD22
IO76NPB2V0
AF6
NC
B16
IO25NDB1V0
AD23
NC
AF7
NC
B17
IO25PDB1V0
AD24
GND
AF8
NC
B18
VCCIB1
AD25
NC
AF9
VCC33A
B19
IO33NDB1V1
AD26
NC
AF10
NC
B20
IO33PDB1V1
AE1
GND
AF11
NC
B21
VCCIB1
AE2
GND
AF12
VCC33A
B22
NC
AE3
NC
AF13
NC
B23
NC
AE4
NC
AF14
NC
B24
NC
AE5
NC
AF15
VCC33A
B25
GND
AE6
NC
AF16
NC
B26
GND
AE7
NC
AF17
NC
C1
NC
AE8
NC
AF18
VCC33A
C2
NC
AE9
GNDA
AF19
NC
C3
GND
AE10
NC
AF20
NC
C4
NC
AE11
NC
AF21
NC
C5
GAA1/IO01PDB0V0
AE12
GNDA
AF22
NC
C6
GAB0/IO02NDB0V0
AE13
NC
AF23
NC
C7
GAB1/IO02PDB0V0
AE14
NC
AF24
NC
C8
IO07NDB0V1
Pr e li m i n a ry v1 . 7
4 - 29
Package Pin Assignments
676-Pin FBGA
676-Pin FBGA
676-Pin FBGA
Pin Number
AFS1500 Function
Pin Number
AFS1500 Function
Pin Number
AFS1500 Function
C9
IO07PDB0V1
D19
GBC1/IO40PDB1V2
F3
IO121NDB4V0
C10
IO09PDB0V1
D20
GBA1/IO42PDB1V2
F4
GND
C11
IO13NDB0V2
D21
GND
F5
IO123NDB4V0
C12
IO13PDB0V2
D22
VCCPLB
F6
GAC2/IO123PDB4V0
C13
IO24PDB1V0
D23
GND
F7
GAA2/IO125PDB4V0
C14
IO26PDB1V0
D24
NC
F8
GAC0/IO03NDB0V0
C15
IO27NDB1V1
D25
NC
F9
GAC1/IO03PDB0V0
C16
IO27PDB1V1
D26
NC
F10
IO10NDB0V1
C17
IO35NDB1V2
E1
GND
F11
IO10PDB0V1
C18
IO35PDB1V2
E2
IO122NPB4V0
F12
IO14NDB0V2
C19
GBC0/IO40NDB1V2
E3
IO121PDB4V0
F13
IO23NDB1V0
C20
GBA0/IO42NDB1V2
E4
IO122PPB4V0
F14
IO23PDB1V0
C21
IO43NDB1V2
E5
IO00NDB0V0
F15
IO32NPB1V1
C22
IO43PDB1V2
E6
IO00PDB0V0
F16
IO34NDB1V1
C23
NC
E7
VCCIB0
F17
IO34PDB1V1
C24
GND
E8
IO05NDB0V1
F18
IO37PDB1V2
C25
NC
E9
IO05PDB0V1
F19
GBB1/IO41PDB1V2
C26
NC
E10
VCCIB0
F20
VCCIB2
D1
NC
E11
IO11NDB0V1
F21
IO47PPB2V0
D2
NC
E12
IO14PDB0V2
F22
IO44NDB2V0
D3
NC
E13
VCCIB0
F23
GND
D4
GND
E14
VCCIB1
F24
IO45NDB2V0
D5
GAA0/IO01NDB0V0
E15
IO29NDB1V1
F25
VCCIB2
D6
GND
E16
IO29PDB1V1
F26
NC
D7
IO04NDB0V0
E17
VCCIB1
G1
NC
D8
IO04PDB0V0
E18
IO37NDB1V2
G2
IO119PPB4V0
D9
GND
E19
GBB0/IO41NDB1V2
G3
IO120NDB4V0
D10
IO09NDB0V1
E20
VCCIB1
G4
IO120PDB4V0
D11
IO11PDB0V1
E21
VCOMPLB
G5
VCCIB4
D12
GND
E22
GBA2/IO44PDB2V0
G6
GAB2/IO124PDB4V0
D13
IO24NDB1V0
E23
IO48PPB2V0
G7
IO125NDB4V0
D14
IO26NDB1V0
E24
GBB2/IO45PDB2V0
G8
GND
D15
GND
E25
NC
G9
VCCIB0
D16
IO31NDB1V1
E26
GND
G10
IO08NDB0V1
D17
IO31PDB1V1
F1
NC
G11
IO08PDB0V1
D18
GND
F2
VCCIB4
G12
GND
4 -3 0
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
676-Pin FBGA
676-Pin FBGA
676-Pin FBGA
Pin Number
AFS1500 Function
Pin Number
AFS1500 Function
Pin Number
AFS1500 Function
G13
IO22NDB1V0
H23
IO50NDB2V0
K7
IO114PDB4V0
G14
IO22PDB1V0
H24
IO51PDB2V0
K8
IO117NDB4V0
G15
GND
H25
NC
K9
GND
G16
IO32PPB1V1
H26
GND
K10
VCC
G17
IO36NPB1V2
J1
NC
K11
VCCIB0
G18
VCCIB1
J2
VCCIB4
K12
GND
G19
GND
J3
IO115PDB4V0
K13
VCCIB0
G20
IO47NPB2V0
J4
GND
K14
VCCIB1
G21
IO49PDB2V0
J5
IO116NDB4V0
K15
GND
G22
VCCIB2
J6
IO116PDB4V0
K16
VCCIB1
G23
IO46NDB2V0
J7
VCCIB4
K17
GND
G24
GBC2/IO46PDB2V0
J8
IO117PDB4V0
K18
GND
G25
IO48NPB2V0
J9
VCCIB4
K19
IO53NDB2V0
G26
NC
J10
GND
K20
IO57PDB2V0
H1
GND
J11
IO06NDB0V1
K21
GCA2/IO59PDB2V0
H2
NC
J12
IO06PDB0V1
K22
VCCIB2
H3
IO118NDB4V0
J13
IO16NDB0V2
K23
IO54NDB2V0
H4
IO118PDB4V0
J14
IO16PDB0V2
K24
IO54PDB2V0
H5
IO119NPB4V0
J15
IO28NDB1V1
K25
NC
H6
IO124NDB4V0
J16
IO28PDB1V1
K26
NC
H7
GND
J17
GND
L1
GND
H8
VCOMPLA
J18
IO38PPB1V2
L2
NC
H9
VCCPLA
J19
IO53PDB2V0
L3
IO112PPB4V0
H10
VCCIB0
J20
VCCIB2
L4
IO113NDB4V0
H11
IO12NDB0V1
J21
IO52PDB2V0
L5
GFB2/IO109PDB4V0
H12
IO12PDB0V1
J22
IO52NDB2V0
L6
GFA2/IO110PDB4V0
H13
VCCIB0
J23
GND
L7
IO112NPB4V0
H14
VCCIB1
J24
IO51NDB2V0
L8
IO104PDB4V0
H15
IO30NDB1V1
J25
VCCIB2
L9
IO111PDB4V0
H16
IO30PDB1V1
J26
NC
L10
VCCIB4
H17
VCCIB1
K1
NC
L11
GND
H18
IO36PPB1V2
K2
NC
L12
VCC
H19
IO38NPB1V2
K3
IO115NDB4V0
L13
GND
H20
GND
K4
IO113PDB4V0
L14
VCC
H21
IO49NDB2V0
K5
VCCIB4
L15
GND
H22
IO50PDB2V0
K6
IO114NDB4V0
L16
VCC
Pr e li m i n a ry v1 . 7
4 - 31
Package Pin Assignments
676-Pin FBGA
676-Pin FBGA
676-Pin FBGA
Pin Number
AFS1500 Function
Pin Number
AFS1500 Function
Pin Number
AFS1500 Function
L17
VCCIB2
N1
NC
P11
VCC
L18
GCB2/IO60PDB2V0
N2
NC
P12
GND
L19
IO58NDB2V0
N3
IO108NDB4V0
P13
VCC
L20
IO57NDB2V0
N4
VCCOSC
P14
GND
L21
IO59NDB2V0
N5
VCCIB4
P15
VCC
L22
GCC2/IO61PDB2V0
N6
XTAL2
P16
GND
L23
IO55PPB2V0
N7
GFC1/IO107PDB4V0
P17
VCCIB2
L24
IO56PDB2V0
N8
VCCIB4
P18
IO70NDB2V0
L25
IO55NPB2V0
N9
GFB1/IO106PDB4V0
P19
VCCIB2
L26
GND
N10
VCCIB4
P20
IO69NDB2V0
M1
NC
N11
GND
P21
GCA0/IO64NDB2V0
M2
VCCIB4
N12
VCC
P22
VCCIB2
M3
GFC2/IO108PDB4V0
N13
GND
P23
GCB0/IO63NDB2V0
M4
GND
N14
VCC
P24
GCB1/IO63PDB2V0
M5
IO109NDB4V0
N15
GND
P25
IO66NDB2V0
M6
IO110NDB4V0
N16
VCC
P26
IO67PDB2V0
M7
GND
N17
VCCIB2
R1
NC
M8
IO104NDB4V0
N18
IO70PDB2V0
R2
VCCIB4
M9
IO111NDB4V0
N19
VCCIB2
R3
IO103NDB4V0
M10
GND
N20
IO69PDB2V0
R4
GND
M11
VCC
N21
GCA1/IO64PDB2V0
R5
IO101PDB4V0
M12
GND
N22
VCCIB2
R6
IO100NPB4V0
M13
VCC
N23
GCC0/IO62NDB2V0
R7
GND
M14
GND
N24
GCC1/IO62PDB2V0
R8
IO99PDB4V0
M15
VCC
N25
IO66PDB2V0
R9
IO97PDB4V0
M16
GND
N26
IO65NDB2V0
R10
GND
M17
GND
P1
NC
R11
GND
M18
IO60NDB2V0
P2
NC
R12
VCC
M19
IO58PDB2V0
P3
IO103PDB4V0
R13
GND
M20
GND
P4
XTAL1
R14
VCC
M21
IO68NPB2V0
P5
VCCIB4
R15
GND
M22
IO61NDB2V0
P6
GNDOSC
R16
VCC
M23
GND
P7
GFC0/IO107NDB4V0
R17
GND
M24
IO56NDB2V0
P8
VCCIB4
R18
GDB2/IO83PDB2V0
M25
VCCIB2
P9
GFB0/IO106NDB4V0
R19
IO78PDB2V0
M26
IO65PDB2V0
P10
VCCIB4
R20
GND
4 -3 2
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
676-Pin FBGA
676-Pin FBGA
676-Pin FBGA
Pin Number
AFS1500 Function
Pin Number
AFS1500 Function
Pin Number
AFS1500 Function
R21
IO72NDB2V0
U5
VCCIB4
V15
AC5
R22
IO72PDB2V0
U6
IO91PDB4V0
V16
NC
R23
GND
U7
IO91NDB4V0
V17
GNDA
R24
IO71PDB2V0
U8
IO92PDB4V0
V18
IO77PPB2V0
R25
VCCIB2
U9
GND
V19
IO74PDB2V0
R26
IO67NDB2V0
U10
GND
V20
VCCIB2
T1
GND
U11
VCC33A
V21
IO82NDB2V0
T2
NC
U12
GNDA
V22
GDA2/IO82PDB2V0
T3
GFA1/IO105PDB4V0
U13
VCC33A
V23
GND
T4
GFA0/IO105NDB4V0
U14
GNDA
V24
GDC1/IO79PDB2V0
T5
IO101NDB4V0
U15
VCC33A
V25
VCCIB2
T6
IO96PDB4V0
U16
GNDA
V26
NC
T7
IO96NDB4V0
U17
VCC
W1
GND
T8
IO99NDB4V0
U18
GND
W2
IO94PPB4V0
T9
IO97NDB4V0
U19
IO74NDB2V0
W3
IO98PDB4V0
T10
VCCIB4
U20
GDA0/IO81NDB2V0
W4
IO98NDB4V0
T11
VCC
U21
GDB0/IO80NDB2V0
W5
GEC1/IO90PDB4V0
T12
GND
U22
VCCIB2
W6
GEC0/IO90NDB4V0
T13
VCC
U23
IO75NDB2V0
W7
GND
T14
GND
U24
IO75PDB2V0
W8
VCCNVM
T15
VCC
U25
NC
W9
VCCIB4
T16
GND
U26
NC
W10
VCC15A
T17
VCCIB2
V1
NC
W11
GNDA
T18
IO83NDB2V0
V2
VCCIB4
W12
AC4
T19
IO78NDB2V0
V3
IO100PPB4V0
W13
VCC33A
T20
GDA1/IO81PDB2V0
V4
GND
W14
GNDA
T21
GDB1/IO80PDB2V0
V5
IO95PDB4V0
W15
AG5
T22
IO73NDB2V0
V6
IO95NDB4V0
W16
GNDA
T23
IO73PDB2V0
V7
VCCIB4
W17
PUB
T24
IO71NDB2V0
V8
IO92NDB4V0
W18
VCCIB2
T25
NC
V9
GNDNVM
W19
TDI
T26
GND
V10
GNDA
W20
GND
U1
NC
V11
NC
W21
IO84NDB2V0
U2
NC
V12
AV4
W22
GDC2/IO84PDB2V0
U3
IO102PDB4V0
V13
NC
W23
IO77NPB2V0
U4
IO102NDB4V0
V14
AV5
W24
GDC0/IO79NDB2V0
Pr e li m i n a ry v1 . 7
4 - 33
Package Pin Assignments
676-Pin FBGA
Pin Number
AFS1500 Function
W25
NC
W26
GND
Y1
NC
Y2
NC
Y3
GEB1/IO89PDB4V0
Y4
GEB0/IO89NDB4V0
Y5
VCCIB4
Y6
GEA1/IO88PDB4V0
Y7
GEA0/IO88NDB4V0
Y8
GND
Y9
VCC33PMP
Y10
NC
Y11
VCC33A
Y12
AG4
Y13
AT4
Y14
ATRTN2
Y15
AT5
Y16
VCC33A
Y17
NC
Y18
VCC33A
Y19
GND
Y20
TMS
Y21
VJTAG
Y22
VCCIB2
Y23
TRST
Y24
TDO
Y25
NC
Y26
NC
4 -3 4
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
Part Number and Revision Date
Part Number 51700092-016-0
Revised October 2008
List of Changes
The following table lists critical changes that were made in the current version of the chapter.
Previous Version
Changes in Current Version (Preliminary v1.7)
Page
Advance v1.6
(August 2008)
The version number category was changed from Advance to Preliminary, which
means the datasheet contains information based on simulation and/or initial
characterization. The information is believed to be correct, but changes are
possible.
N/A
Advance v1.4
(July 2008)
The title of the datasheet changed from Actel Programmable System Chips to
Actel Fusion Mixed-Signal FPGAs. In addition, all instances of programmable
system chip were changed to mixed-signal FPGA.
N/A
Advance v1.1
(May 2008)
The "108-Pin QFN"figure was updated. D1 to D4 are new and the figure was
changed to bottom view. The note below the figure is new.
4-1
The "180-Pin QFN"figure was updated. D1 to D4 are new and the figure was
changed to bottom view. The note below the figure is new.
4-3
Advance v0.9
October 2007
This change table states that in the "208-Pin PQFP" table listed under the
Advance v0.8 changes, the AFS090 device had a pin change. That is incorrect. Pin
102 was updated for AFS250 and AFS600. The function name changed from
VCC33ACAP to VCC33A.
4-8
Advance v0.8
(June 2007)
In the "108-Pin QFN" table, the function changed from VCC33ACAP to VCC33A for
the following pin:
4-2
B25
In the "180-Pin QFN" table, the function changed from VCC33ACAP to VCC33A for
the following pins:
4-4
AFS090: B29
AFS250: B29
In the "208-Pin PQFP" table, the function changed from VCC33ACAP to VCC33A for
the following pins:
4-8
AFS090: 102
AFS250: 102
In the "256-Pin FBGA" table, the function changed from VCC33ACAP to VCC33A for
the following pins:
4-12
AFS090: T14
AFS250: T14
AFS600: T14
AFS1500: T14
In the "484-Pin FBGA" table, the function changed from VCC33ACAP to VCC33A for
the following pins:
4-20
AFS600: AB18
AFS1500: AB18
In the "676-Pin FBGA" table, the function changed from VCC33ACAP to VCC33A for
the following pins:
4-28
AFS1500: AD20
Pr e li m i n a ry v1 . 7
4 - 35
Package Pin Assignments
Previous Version
Changes in Current Version (Preliminary v1.7)
Page
Advance v0.7
(January 2007)
The VMV pins have now been tied internally with the VCCI pins.
N/A
The AFS090"108-Pin QFN" table was updated.
4-2
The AFS090 and AFS250 devices were updated in the "108-Pin QFN" table.
4-2
The AFS250 device was updated in the "208-Pin PQFP" table.
4-8
The AFS600 device was updated in the "208-Pin PQFP" table.
4-8
The AFS090, AFS250, AFS600, and AFS1500 devices were updated in the "256-Pin
FBGA" table.
4-12
The AFS600 and AFS1500 devices were updated in the "484-Pin FBGA" table.
4-20
The AFS600 device was updated in the "676-Pin FBGA" table.
4-28
Advance v0.5
(June 2006)
The heading was incorrect in the "208-Pin PQFP" table. It should be AFS250 and
not AFS090.
4-8
Advance v0.4
(April 2006)
The "256-Pin FBGA" table for the AFS1500 is new.
4-12
Advance v0.2
(April 2006)
The "108-Pin QFN" table for the AFS090 device is new.
4-2
The "180-Pin QFN" table for the AFS090 device is new.
4-4
The "208-Pin PQFP" table for the AFS090 device is new.
4-8
The "256-Pin FBGA" table for the AFS090 device is new.
4-12
The "256-Pin FBGA" table for the AFS250 device is new.
4-12
Advance v0.7
(continued)
4 -3 6
Pr e li m i n a ry v1 . 7
Actel Fusion Mixed-Signal FPGAs
Datasheet Categories
Categories
In order to provide the latest information to designers, some datasheets are published before data has been
fully characterized. Datasheets are designated as “Product Brief,” “Advance,” and “Production”. The definition
of these categories are as follows:
Product Brief
The product brief is a summarized version of a datasheet (advance or production) and contains general product
information. This document gives an overview of specific device and family information.
Advance
This version contains initial estimated information based on simulation, other products, devices, or speed
grades. This information can be used as estimates, but not for production. This label only applies to the DC and
Switching Characteristics chapter of the datasheet and will only be used when the data has not been fully
characterized.
Unmarked (production)
This version contains information that is considered to be final.
Export Administration Regulations (EAR)
The products described in this document are subject to the Export Administration Regulations (EAR). They could
require an approved export license prior to export from the United States. An export includes release of product
or disclosure of technology to a foreign national inside or outside the United States.
Actel Safety Critical, Life Support, and High-Reliability
Applications Policy
The Actel products described in this advance status document may not have completed Actel’s qualification
process. Actel may amend or enhance products during the product introduction and qualification process,
resulting in changes in device functionality or performance. It is the responsibility of each customer to ensure
the fitness of any Actel product (but especially a new product) for a particular purpose, including
appropriateness for safety-critical, life-support, and other high-reliability applications. Consult Actel’s Terms and
Conditions for specific liability exclusions relating to life-support applications. A reliability report covering all of
Actel’s products is available on the Actel website at http://www.actel.com/documents/ORT_Report.pdf. Actel also
offers a variety of enhanced qualification and lot acceptance screening procedures. Contact your local Actel
sales office for additional reliability information.
Pr e li m i n a ry v1 . 7
4 - 37
Actel and the Actel logo are registered trademarks of Actel Corporation.
All other trademarks are the property of their owners.
w w w. a c t e l . c o m
Actel Corporation
Actel Europe Ltd.
Actel Japan
Actel Hong Kong
2061 Stierlin Court
Mountain View, CA
94043-4655 USA
Phone 650.318.4200
Fax 650.318.4600
River Court,Meadows Business Park
Station Approach, Blackwater
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United Kingdom
Phone +44 (0) 1276 609 300
Fax +44 (0) 1276 607 540
EXOS Ebisu Buillding 4F
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Phone +81.03.3445.7671
Fax +81.03.3445.7668
http://jp.actel.com
Room 2107, China Resources Building
26 Harbour Road
Wanchai, Hong Kong
Phone +852 2185 6460
Fax +852 2185 6488
www.actel.com.cn
51700092-018-0/ 10.08