STMICROELECTRONICS M25P64

M25P64
64 Mbit, Low Voltage, Serial Flash Memory
With 50MHz SPI Bus Interface
PRELIMINARY DATA
FEATURES SUMMARY
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■
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■
■
■
■
■
■
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64Mbit of Flash Memory
Page Program (up to 256 Bytes) in 1.4ms
(typical)
Sector Erase (512Kbit)
Bulk Erase (64Mbit)
2.7 to 3.6V Single Supply Voltage
SPI Bus Compatible Serial Interface
50MHz Clock Rate (maximum)
Electronic Signatures
– JEDEC Standard Two-Byte Signature
(2017h)
– RES Instruction, One-Byte, Signature
(16h), for backward compatibility
More than 100000 Erase/Program Cycles per
Sector
More than 20-Year Data Retention
Figure 1. Packages
VDFPN8 (ME)
8x6mm (MLP8)
SO16 (MF)
300 mils width
February 2005
1/38
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice.
M25P64
TABLE OF CONTENTS
FEATURES SUMMARY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Figure 1.
Figure 2.
Table 1.
Figure 3.
Figure 4.
Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Logic Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Signal Names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
VDFPN Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
SO Connections. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
SIGNAL DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Serial Data Output (Q) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Serial Data Input (D) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Serial Clock (C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Chip Select (S) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Hold (HOLD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Write Protect (W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
SPI MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 5. Bus Master and Memory Devices on the SPI Bus. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 6. SPI Modes Supported . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
OPERATING FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Page Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Sector Erase and Bulk Erase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Polling During a Write, Program or Erase Cycle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Active Power and Standby Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
WIP bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
WEL bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
BP2, BP1, BP0 bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
SRWD bit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Protection Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 2. Protected Area Sizes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Hold Condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 7. Hold Condition Activation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
MEMORY ORGANIZATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 8. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 3. Memory Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
INSTRUCTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 4. Instruction Set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Write Enable (WREN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 9. Write Enable (WREN) Instruction Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Write Disable (WRDI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
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M25P64
Figure 10.Write Disable (WRDI) Instruction Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Read Identification (RDID) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Table 5. Read Identification (RDID) Data-Out Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 11.Read Identification (RDID) Instruction Sequence and Data-Out Sequence . . . . . . . . . . 16
Read Status Register (RDSR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Table 6. Status Register Format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
WIP bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
WEL bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
BP2, BP1, BP0 bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
SRWD bit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 12.Read Status Register (RDSR) Instruction Sequence and Data-Out Sequence . . . . . . . 17
Write Status Register (WRSR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Table 7. Protection Modes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 13.Write Status Register (WRSR) Instruction Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Read Data Bytes (READ). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 14.Read Data Bytes (READ) Instruction Sequence and Data-Out Sequence . . . . . . . . . . . 20
Read Data Bytes at Higher Speed (FAST_READ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 15.Read Data Bytes at Higher Speed (FAST_READ) Instruction and Data-Out Sequence 21
Page Program (PP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 16.Page Program (PP) Instruction Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Sector Erase (SE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 17.Sector Erase (SE) Instruction Sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Bulk Erase (BE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Figure 18.Bulk Erase (BE) Instruction Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Read Electronic Signature (RES) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Figure 19.Read Electronic Signature (RES) Instruction Sequence and Data-Out Sequence . . . . . 25
POWER-UP AND POWER-DOWN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Figure 20.Power-up Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Table 8. Power-Up Timing and VWI Threshold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
INITIAL DELIVERY STATE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
MAXIMUM RATING. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Table 9. Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
DC AND AC PARAMETERS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Table 10. Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Table 11. AC Measurement Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Figure 21.AC Measurement I/O Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Table 12. Capacitance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Table 13. DC Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Table 14. AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Figure 22.Serial Input Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Figure 23.Write Protect Setup and Hold Timing during WRSR when SRWD=1 . . . . . . . . . . . . . . . 32
Figure 24.Hold Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
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M25P64
Figure 25.Output Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
PACKAGE MECHANICAL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Figure 26.MLP8, 8-lead Very thin Dual Flat Package No lead, 8x6mm, Package Outline . . . . . . . 34
Table 15. MLP8, 8-lead Very thin Dual Flat Package No lead, 8x6mm,
Package Mechanical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Figure 27.SO16 wide – 16 lead Plastic Small Outline, 300 mils body width . . . . . . . . . . . . . . . . . . 35
Table 16. SO16 wide – 16 lead Plastic Small Outline, 300 mils body width . . . . . . . . . . . . . . . . . . 35
PART NUMBERING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Table 17. Ordering Information Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
REVISION HISTORY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Table 18. Document Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
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M25P64
SUMMARY DESCRIPTION
Figure 3. VDFPN Connections
The M25P64 is a 64Mbit (8M x 8) Serial Flash
Memory, with advanced write protection mechanisms, accessed by a high speed SPI-compatible
bus.
The memory can be programmed 1 to 256 bytes at
a time, using the Page Program instruction.
The memory is organized as 128 sectors, each
containing 256 pages. Each page is 256 bytes
wide. Thus, the whole memory can be viewed as
consisting of 32768 pages, or 8388608 bytes.
The whole memory can be erased using the Bulk
Erase instruction, or a sector at a time, using the
Sector Erase instruction.
M25P64
S
Q
W
VSS
8
7
6
5
1
2
3
4
VCC
HOLD
C
D
AI08595
Figure 2. Logic Diagram
VCC
D
Note: 1. There is an exposed die paddle on the underside of the
MLP8 package. This is pulled, internally, to VSS, and
must not be allowed to be connected to any other voltage
or signal line on the PCB.
2. See PACKAGE MECHANICAL section for package dimensions, and how to identify pin-1.
Q
C
S
M25P64
Figure 4. SO Connections
W
M25P64
HOLD
VSS
AI07485
Table 1. Signal Names
C
Serial Clock
D
Serial Data Input
Q
Serial Data Output
S
Chip Select
W
Write Protect
HOLD
Hold
VCC
Supply Voltage
VSS
Ground
HOLD
VCC
DU
DU
DU
DU
S
Q
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
C
D
DU
DU
DU
DU
VSS
W
AI07486b
Note: 1. DU = Don’t Use
2. See PACKAGE MECHANICAL section for package dimensions, and how to identify pin-1.
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M25P64
SIGNAL DESCRIPTION
Serial Data Output (Q). This output signal is
used to transfer data serially out of the device.
Data is shifted out on the falling edge of Serial
Clock (C).
Serial Data Input (D). This input signal is used to
transfer data serially into the device. It receives instructions, addresses, and the data to be programmed. Values are latched on the rising edge of
Serial Clock (C).
Serial Clock (C). This input signal provides the
timing of the serial interface. Instructions, addresses, or data present at Serial Data Input (D) are
latched on the rising edge of Serial Clock (C). Data
on Serial Data Output (Q) changes after the falling
edge of Serial Clock (C).
Chip Select (S). When this input signal is High,
the device is deselected and Serial Data Output
(Q) is at high impedance. Unless an internal Program, Erase or Write Status Register cycle is in
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progress, the device will be in the Standby Power
mode. Driving Chip Select (S) Low selects the device, placing it in the Active Power mode.
After Power-up, a falling edge on Chip Select (S)
is required prior to the start of any instruction.
Hold (HOLD). The Hold (HOLD) signal is used to
pause any serial communications with the device
without deselecting the device.
During the Hold condition, the Serial Data Output
(Q) is high impedance, and Serial Data Input (D)
and Serial Clock (C) are Don’t Care.
To start the Hold condition, the device must be selected, with Chip Select (S) driven Low.
Write Protect (W). The main purpose of this input signal is to freeze the size of the area of memory that is protected against program or erase
instructions (as specified by the values in the BP2,
BP1 and BP0 bits of the Status Register).
M25P64
SPI MODES
These devices can be driven by a microcontroller
with its SPI peripheral running in either of the two
following modes:
– CPOL=0, CPHA=0
– CPOL=1, CPHA=1
For these two modes, input data is latched in on
the rising edge of Serial Clock (C), and output data
is available from the falling edge of Serial Clock
(C).
The difference between the two modes, as shown
in Figure 6., is the clock polarity when the bus
master is in Stand-by mode and not transferring
data:
– C remains at 0 for (CPOL=0, CPHA=0)
– C remains at 1 for (CPOL=1, CPHA=1)
Figure 5. Bus Master and Memory Devices on the SPI Bus
SDO
SPI Interface with
(CPOL, CPHA) =
(0, 0) or (1, 1)
SDI
SCK
C Q D
C Q D
C Q D
SPI Memory
Device
SPI Memory
Device
SPI Memory
Device
Bus Master
(ST6, ST7, ST9,
ST10, Others)
CS3
CS2
CS1
S
W
HOLD
S
W
HOLD
S
W
HOLD
AI03746D
Note: The Write Protect (W) and Hold (HOLD) signals should be driven, High or Low as appropriate.
Figure 6. SPI Modes Supported
CPOL
CPHA
0
0
C
1
1
C
D
Q
MSB
MSB
AI01438B
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M25P64
OPERATING FEATURES
Page Programming
Active Power and Standby Power Modes
To program one data byte, two instructions are required: Write Enable (WREN), which is one byte,
and a Page Program (PP) sequence, which consists of four bytes plus data. This is followed by the
internal Program cycle (of duration tPP).
To spread this overhead, the Page Program (PP)
instruction allows up to 256 bytes to be programmed at a time (changing bits from 1 to 0), provided that they lie in consecutive addresses on the
same page of memory.
When Chip Select (S) is Low, the device is selected, and in the Active Power mode.
When Chip Select (S) is High, the device is deselected, but could remain in the Active Power mode
until all internal cycles have completed (Program,
Erase, Write Status Register). The device then
goes in to the Standby Power mode. The device
consumption drops to ICC1.
Sector Erase and Bulk Erase
The Page Program (PP) instruction allows bits to
be reset from 1 to 0. Before this can be applied, the
bytes of memory need to have been erased to all
1s (FFh). This can be achieved either a sector at a
time, using the Sector Erase (SE) instruction, or
throughout the entire memory, using the Bulk
Erase (BE) instruction. This starts an internal
Erase cycle (of duration tSE or tBE).
The Erase instruction must be preceded by a Write
Enable (WREN) instruction.
Status Register
The Status Register contains a number of status
and control bits that can be read or set (as appropriate) by specific instructions.
WIP bit. The Write In Progress (WIP) bit indicates
whether the memory is busy with a Write Status
Register, Program or Erase cycle.
WEL bit. The Write Enable Latch (WEL) bit indicates the status of the internal Write Enable Latch.
Polling During a Write, Program or Erase Cycle
BP2, BP1, BP0 bits. The Block Protect (BP2,
BP1, BP0) bits are non-volatile. They define the
size of the area to be software protected against
Program and Erase instructions.
A further improvement in the time to Write Status
Register (WRSR), Program (PP) or Erase (SE or
BE) can be achieved by not waiting for the worst
case delay (tW, tPP, tSE, or tBE). The Write In
Progress (WIP) bit is provided in the Status Register so that the application program can monitor its
value, polling it to establish when the previous
Write cycle, Program cycle or Erase cycle is complete.
SRWD bit. The Status Register Write Disable
(SRWD) bit is operated in conjunction with the
Write Protect (W) signal. The Status Register
Write Disable (SRWD) bit and Write Protect (W)
signal allow the device to be put in the Hardware
Protected mode. In this mode, the non-volatile bits
of the Status Register (SRWD, BP2, BP1, BP0)
become read-only bits.
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M25P64
–
–
Protection Modes
The environments where non-volatile memory devices are used can be very noisy. No SPI device
can operate correctly in the presence of excessive
noise. To help combat this, the M25P64 features
the following data protection mechanisms:
■
Power On Reset and an internal timer (tPUW)
can provide protection against inadvertant
changes while the power supply is outside the
operating specification.
■
Program, Erase and Write Status Register
instructions are checked that they consist of a
number of clock pulses that is a multiple of
eight, before they are accepted for execution.
■
All instructions that modify data must be
preceded by a Write Enable (WREN)
instruction to set the Write Enable Latch
(WEL) bit. This bit is returned to its reset state
by the following events:
■
■
Power-up
Write Disable (WRDI) instruction
completion
– Write Status Register (WRSR) instruction
completion
– Page Program (PP) instruction completion
– Sector Erase (SE) instruction completion
– Bulk Erase (BE) instruction completion
The Block Protect (BP2, BP1, BP0) bits allow
part of the memory to be configured as readonly. This is the Software Protected Mode
(SPM).
The Write Protect (W) signal allows the Block
Protect (BP2, BP1, BP0) bits and Status
Register Write Disable (SRWD) bit to be
protected. This is the Hardware Protected
Mode (HPM).
Table 2. Protected Area Sizes
Status Register
Content
Memory Content
BP2
Bit
BP1
Bit
BP0
Bit
0
0
0
none
All sectors1 (128 sectors: 0 to 127)
0
0
1
Upper 64th (2 sectors: 126 and 127)
Lower 63/64ths (126 sectors: 0 to 125)
0
1
0
Upper 32nd (4 sectors: 124 to 127)
Lower 31/32nds (124 sectors: 0 to 123)
0
1
1
Upper sixteenth (8 sectors: 120 to 127)
Lower 15/16ths (120 sectors: 0 to 119)
1
0
0
Upper eighth (16 sectors: 112 to 127)
Lower seven-eighths (112 sectors: 0 to 111)
1
0
1
Upper quarter (32 sectors: 96 to 127)
Lower three-quarters (96 sectors: 0 to 95)
1
1
0
Upper half (64 sectors: 64 to 127)
Lower half (64 sectors: 0 to 63)
1
1
1
All sectors (128 sectors: 0 to 127)
none
Protected Area
Unprotected Area
Note: 1. The device is ready to accept a Bulk Erase instruction if, and only if, all Block Protect (BP2, BP1, BP0) are 0.
9/38
M25P64
Hold Condition
The Hold (HOLD) signal is used to pause any serial communications with the device without resetting the clocking sequence. However, taking this
signal Low does not terminate any Write Status
Register, Program or Erase cycle that is currently
in progress.
To enter the Hold condition, the device must be
selected, with Chip Select (S) Low.
The Hold condition starts on the falling edge of the
Hold (HOLD) signal, provided that this coincides
with Serial Clock (C) being Low (as shown in Figure 7.).
The Hold condition ends on the rising edge of the
Hold (HOLD) signal, provided that this coincides
with Serial Clock (C) being Low.
If the falling edge does not coincide with Serial
Clock (C) being Low, the Hold condition starts after Serial Clock (C) next goes Low. Similarly, if the
rising edge does not coincide with Serial Clock (C)
being Low, the Hold condition ends after Serial
Clock (C) next goes Low. (This is shown in Figure
7.).
During the Hold condition, the Serial Data Output
(Q) is high impedance, and Serial Data Input (D)
and Serial Clock (C) are Don’t Care.
Normally, the device is kept selected, with Chip
Select (S) driven Low, for the whole duration of the
Hold condition. This is to ensure that the state of
the internal logic remains unchanged from the moment of entering the Hold condition.
If Chip Select (S) goes High while the device is in
the Hold condition, this has the effect of resetting
the internal logic of the device. To restart communication with the device, it is necessary to drive
Hold (HOLD) High, and then to drive Chip Select
(S) Low. This prevents the device from going back
to the Hold condition.
Figure 7. Hold Condition Activation
C
HOLD
Hold
Condition
(standard use)
Hold
Condition
(non-standard use)
AI02029D
10/38
M25P64
MEMORY ORGANIZATION
The memory is organized as:
■
8388608 bytes (8 bits each)
■
128 sectors (512Kbits, 65536 bytes each)
■
32768 pages (256 bytes each).
Each page can be individually programmed (bits
are programmed from 1 to 0). The device is Sector
or Bulk Erasable (bits are erased from 0 to 1) but
not Page Erasable.
Figure 8. Block Diagram
HOLD
W
High Voltage
Generator
Control Logic
S
C
D
I/O Shift Register
Q
Address Register
and Counter
Status
Register
256 Byte
Data Buffer
7FFFFFh
Y Decoder
Size of the
read-only
memory area
00000h
000FFh
256 Bytes (Page Size)
X Decoder
AI08520
11/38
M25P64
Table 3. Memory Organization
Sector
12/38
Sector
Address Range
127
7F0000h
7FFFFFh
126
7E0000h
7EFFFFh
125
7D0000h
7DFFFFh
124
7C0000h
7CFFFFh
123
7B0000h
7BFFFFh
122
7A0000h
7AFFFFh
121
790000h
79FFFFh
120
780000h
78FFFFh
119
770000h
77FFFFh
118
760000h
76FFFFh
117
750000h
75FFFFh
116
740000h
74FFFFh
115
730000h
73FFFFh
114
720000h
72FFFFh
113
710000h
71FFFFh
112
700000h
70FFFFh
111
6F0000h
6FFFFFh
110
6E0000h
6EFFFFh
109
6D0000h
6DFFFFh
108
6C0000h
6CFFFFh
107
6B0000h
6BFFFFh
106
6A0000h
6AFFFFh
105
690000h
69FFFFh
104
680000h
68FFFFh
103
670000h
67FFFFh
102
660000h
66FFFFh
101
650000h
65FFFFh
100
640000h
64FFFFh
99
630000h
63FFFFh
98
620000h
62FFFFh
97
610000h
61FFFFh
96
600000h
60FFFFh
95
5F0000h
5FFFFFh
94
5E0000h
5EFFFFh
93
5D0000h
5DFFFFh
Address Range
92
5C0000h
5CFFFFh
91
5B0000h
5BFFFFh
90
5A0000h
5AFFFFh
89
590000h
59FFFFh
88
580000h
58FFFFh
87
570000h
57FFFFh
86
560000h
56FFFFh
85
550000h
55FFFFh
84
540000h
54FFFFh
83
530000h
53FFFFh
82
520000h
52FFFFh
81
510000h
51FFFFh
80
500000h
50FFFFh
79
4F0000h
4FFFFFh
78
4E0000h
4EFFFFh
77
4D0000h
4DFFFFh
76
4C0000h
4CFFFFh
75
4B0000h
4BFFFFh
74
4A0000h
4AFFFFh
73
490000h
49FFFFh
72
480000h
48FFFFh
71
470000h
47FFFFh
70
460000h
46FFFFh
69
450000h
45FFFFh
68
440000h
44FFFFh
67
430000h
43FFFFh
66
420000h
42FFFFh
65
410000h
41FFFFh
64
400000h
40FFFFh
63
3F0000h
3FFFFFh
62
3E0000h
3EFFFFh
61
3D0000h
3DFFFFh
60
3C0000h
3CFFFFh
59
3B0000h
3BFFFFh
58
3A0000h
3AFFFFh
57
390000h
39FFFFh
M25P64
Sector
Address Range
Sector
Address Range
56
380000h
38FFFFh
20
140000h
14FFFFh
55
370000h
37FFFFh
19
130000h
13FFFFh
54
360000h
36FFFFh
18
120000h
12FFFFh
53
350000h
35FFFFh
17
110000h
11FFFFh
52
340000h
34FFFFh
16
100000h
10FFFFh
51
330000h
33FFFFh
15
0F0000h
0FFFFFh
50
320000h
32FFFFh
14
0E0000h
0EFFFFh
49
310000h
31FFFFh
13
0D0000h
0DFFFFh
48
300000h
30FFFFh
12
0C0000h
0CFFFFh
47
2F0000h
2FFFFFh
11
0B0000h
0BFFFFh
46
2E0000h
2EFFFFh
10
0A0000h
0AFFFFh
45
2D0000h
2DFFFFh
9
090000h
09FFFFh
44
2C0000h
2CFFFFh
8
080000h
08FFFFh
43
2B0000h
2BFFFFh
7
070000h
07FFFFh
42
2A0000h
2AFFFFh
6
060000h
06FFFFh
41
290000h
29FFFFh
5
050000h
05FFFFh
40
280000h
28FFFFh
4
040000h
04FFFFh
39
270000h
27FFFFh
3
030000h
03FFFFh
38
260000h
26FFFFh
2
020000h
02FFFFh
37
250000h
25FFFFh
1
010000h
01FFFFh
36
240000h
24FFFFh
0
000000h
00FFFFh
35
230000h
23FFFFh
34
220000h
22FFFFh
33
210000h
21FFFFh
32
200000h
20FFFFh
31
1F0000h
1FFFFFh
30
1E0000h
1EFFFFh
29
1D0000h
1DFFFFh
28
1C0000h
1CFFFFh
27
1B0000h
1BFFFFh
26
1A0000h
1AFFFFh
25
190000h
19FFFFh
24
180000h
18FFFFh
23
170000h
17FFFFh
22
160000h
16FFFFh
21
150000h
15FFFFh
13/38
M25P64
INSTRUCTIONS
All instructions, addresses and data are shifted in
and out of the device, most significant bit first.
Serial Data Input (D) is sampled on the first rising
edge of Serial Clock (C) after Chip Select (S) is
driven Low. Then, the one-byte instruction code
must be shifted in to the device, most significant bit
first, on Serial Data Input (D), each bit being
latched on the rising edges of Serial Clock (C).
The instruction set is listed in Table 4..
Every instruction sequence starts with a one-byte
instruction code. Depending on the instruction,
this might be followed by address bytes, or by data
bytes, or by both or none.
In the case of a Read Data Bytes (READ), Read
Data Bytes at Higher Speed (Fast_Read), Read
Status Register (RDSR), Read Identification
(RDID) or Read Electronic Signature (RES) instruction, the shifted-in instruction sequence is fol-
lowed by a data-out sequence. Chip Select (S) can
be driven High after any bit of the data-out sequence is being shifted out.
In the case of a Page Program (PP), Sector Erase
(SE), Bulk Erase (BE), Write Status Register
(WRSR), Write Enable (WREN) or Write Disable
(WRDI), Chip Select (S) must be driven High exactly at a byte boundary, otherwise the instruction
is rejected, and is not executed. That is, Chip Select (S) must driven High when the number of
clock pulses after Chip Select (S) being driven
Low is an exact multiple of eight.
All attempts to access the memory array during a
Write Status Register cycle, Program cycle or
Erase cycle are ignored, and the internal Write
Status Register cycle, Program cycle or Erase cycle continues unaffected.
Table 4. Instruction Set
Instruction
Description
One-byte Instruction Code
Address
Bytes
Dummy
Bytes
Data
Bytes
WREN
Write Enable
0000 0110
06h
0
0
0
WRDI
Write Disable
0000 0100
04h
0
0
0
RDID
Read Identification
1001 1111
9Fh
0
0
1 to 3
RDSR
Read Status Register
0000 0101
05h
0
0
1 to ∞
WRSR
Write Status Register
0000 0001
01h
0
0
1
READ
Read Data Bytes
0000 0011
03h
3
0
1 to ∞
0000 1011
0Bh
3
1
1 to ∞
FAST_READ Read Data Bytes at Higher Speed
PP
Page Program
0000 0010
02h
3
0
1 to 256
SE
Sector Erase
1101 1000
D8h
3
0
0
BE
Bulk Erase
1100 0111
C7h
0
0
0
Read Electronic Signature
1010 1011
ABh
0
3
1 to ∞
RES
14/38
M25P64
Write Enable (WREN)
(SE), Bulk Erase (BE) and Write Status Register
(WRSR) instruction.
The Write Enable (WREN) instruction is entered
by driving Chip Select (S) Low, sending the instruction code, and then driving Chip Select (S)
High.
The Write Enable (WREN) instruction (Figure 9.)
sets the Write Enable Latch (WEL) bit.
The Write Enable Latch (WEL) bit must be set prior to every Page Program (PP), Sector Erase
Figure 9. Write Enable (WREN) Instruction Sequence
S
0
1
2
3
4
5
6
7
C
Instruction
D
High Impedance
Q
AI02281E
Write Disable (WRDI)
–
–
–
The Write Disable (WRDI) instruction (Figure 10.)
resets the Write Enable Latch (WEL) bit.
The Write Disable (WRDI) instruction is entered by
driving Chip Select (S) Low, sending the instruction code, and then driving Chip Select (S) High.
The Write Enable Latch (WEL) bit is reset under
the following conditions:
Power-up
Write Disable (WRDI) instruction completion
Write Status Register (WRSR) instruction
completion
Page Program (PP) instruction completion
Sector Erase (SE) instruction completion
Bulk Erase (BE) instruction completion
–
–
–
Figure 10. Write Disable (WRDI) Instruction Sequence
S
0
1
2
3
4
5
6
7
C
Instruction
D
High Impedance
Q
AI03750D
15/38
M25P64
The device is first selected by driving Chip Select
(S) Low. Then, the 8-bit instruction code for the instruction is shifted in. This is followed by the 24-bit
device identification, stored in the memory, being
shifted out on Serial Data Output (Q), each bit being shifted out during the falling edge of Serial
Clock (C).
The instruction sequence is shown in Figure 11..
The Read Identification (RDID) instruction is terminated by driving Chip Select (S) High at any time
during data output.
When Chip Select (S) is driven High, the device is
put in the Standby Power mode. Once in the
Standby Power mode, the device waits to be selected, so that it can receive, decode and execute
instructions.
Read Identification (RDID)
The Read Identification (RDID) instruction allows
the 8-bit manufacturer identification to be read, followed by two bytes of device identification. The
manufacturer identification is assigned by JEDEC,
and has the value 20h for STMicroelectronics. The
device identification is assigned by the device
manufacturer, and indicates the memory type in
the first byte (20h), and the memory capacity of the
device in the second byte (17h).
Any Read Identification (RDID) instruction while
an Erase or Program cycle is in progress, is not
decoded, and has no effect on the cycle that is in
progress.
Table 5. Read Identification (RDID) Data-Out Sequence
Device Identification
Manufacturer Identification
20h
Memory Type
Memory Capacity
20h
17h
Figure 11. Read Identification (RDID) Instruction Sequence and Data-Out Sequence
S
0
1
2
3
4
5
6
7
8
9 10 11 12 13 14 15 16 17 18
28 29 30 31
C
Instruction
D
Manufacturer Identification
Device Identification
High Impedance
Q
15 14 13
MSB
3
2
1
0
MSB
AI06809b
16/38
M25P64
WEL bit. The Write Enable Latch (WEL) bit indicates the status of the internal Write Enable Latch.
When set to 1 the internal Write Enable Latch is
set, when set to 0 the internal Write Enable Latch
is reset and no Write Status Register, Program or
Erase instruction is accepted.
Read Status Register (RDSR)
The Read Status Register (RDSR) instruction allows the Status Register to be read. The Status
Register may be read at any time, even while a
Program, Erase or Write Status Register cycle is in
progress. When one of these cycles is in progress,
it is recommended to check the Write In Progress
(WIP) bit before sending a new instruction to the
device. It is also possible to read the Status Register continuously, as shown in Figure 12..
BP2, BP1, BP0 bits. The Block Protect (BP2,
BP1, BP0) bits are non-volatile. They define the
size of the area to be software protected against
Program and Erase instructions. These bits are
written with the Write Status Register (WRSR) instruction. When one or more of the Block Protect
(BP2, BP1, BP0) bits is set to 1, the relevant memory area (as defined in Table 2.) becomes protected against Page Program (PP) and Sector Erase
(SE) instructions. The Block Protect (BP2, BP1,
BP0) bits can be written provided that the Hardware Protected mode has not been set. The Bulk
Erase (BE) instruction is executed if, and only if, all
Block Protect (BP2, BP1, BP0) bits are 0.
Table 6. Status Register Format
b7
SRWD
b0
0
0
BP2
BP1
BP0
WEL
WIP
Status Register
Write Protect
Block Protect Bits
SRWD bit. The Status Register Write Disable
(SRWD) bit is operated in conjunction with the
Write Protect (W) signal. The Status Register
Write Disable (SRWD) bit and Write Protect (W)
signal allow the device to be put in the Hardware
Protected mode (when the Status Register Write
Disable (SRWD) bit is set to 1, and Write Protect
(W) is driven Low). In this mode, the non-volatile
bits of the Status Register (SRWD, BP2, BP1,
BP0) become read-only bits and the Write Status
Register (WRSR) instruction is no longer accepted
for execution.
Write Enable Latch Bit
Write In Progress Bit
The status and control bits of the Status Register
are as follows:
WIP bit. The Write In Progress (WIP) bit indicates
whether the memory is busy with a Write Status
Register, Program or Erase cycle. When set to 1,
such a cycle is in progress, when reset to 0 no
such cycle is in progress.
Figure 12. Read Status Register (RDSR) Instruction Sequence and Data-Out Sequence
S
0
1
2
3
4
5
6
7
8
9 10 11 12 13 14 15
C
Instruction
D
Status Register Out
Status Register Out
High Impedance
Q
7
MSB
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
7
MSB
AI02031E
17/38
M25P64
Write Status Register (WRSR)
The Write Status Register (WRSR) instruction allows new values to be written to the Status Register. Before it can be accepted, a Write Enable
(WREN) instruction must previously have been executed. After the Write Enable (WREN) instruction
has been decoded and executed, the device sets
the Write Enable Latch (WEL).
The Write Status Register (WRSR) instruction is
entered by driving Chip Select (S) Low, followed
by the instruction code and the data byte on Serial
Data Input (D).
The instruction sequence is shown in Figure 13..
The Write Status Register (WRSR) instruction has
no effect on b6, b5, b1 and b0 of the Status Register. b6 and b5 are always read as 0.
Chip Select (S) must be driven High after the
eighth bit of the data byte has been latched in. If
not, the Write Status Register (WRSR) instruction
is not executed. As soon as Chip Select (S) is driven High, the self-timed Write Status Register cycle
(whose duration is tW) is initiated. While the Write
Status Register cycle is in progress, the Status
Register may still be read to check the value of the
Write In Progress (WIP) bit. The Write In Progress
(WIP) bit is 1 during the self-timed Write Status
Register cycle, and is 0 when it is completed.
When the cycle is completed, the Write Enable
Latch (WEL) is reset.
The Write Status Register (WRSR) instruction allows the user to change the values of the Block
Protect (BP2, BP1, BP0) bits, to define the size of
the area that is to be treated as read-only, as defined in Table 2.. The Write Status Register
(WRSR) instruction also allows the user to set or
reset the Status Register Write Disable (SRWD)
bit in accordance with the Write Protect (W) signal.
The Status Register Write Disable (SRWD) bit and
Write Protect (W) signal allow the device to be put
in the Hardware Protected Mode (HPM). The Write
Status Register (WRSR) instruction is not executed once the Hardware Protected Mode (HPM) is
entered.
Table 7. Protection Modes
W
Signal
SRWD
Bit
1
0
0
0
1
1
0
1
Memory Content
Mode
Write Protection of the
Status Register
Software
Protected
(SPM)
Status Register is Writable
(if the WREN instruction
has set the WEL bit)
The values in the SRWD,
BP2, BP1 and BP0 bits
can be changed
Protected against Page
Program, Sector Erase
and Bulk Erase
Ready to accept Page
Program and Sector Erase
instructions
Hardware
Protected
(HPM)
Status Register is
Hardware write protected
The values in the SRWD,
BP2, BP1 and BP0 bits
cannot be changed
Protected against Page
Program, Sector Erase
and Bulk Erase
Ready to accept Page
Program and Sector Erase
instructions
Protected Area1
Unprotected Area1
Note: 1. As defined by the values in the Block Protect (BP2, BP1, BP0) bits of the Status Register, as shown in Table 2..
The protection features of the device are summarized in Table 7.
When the Status Register Write Disable (SRWD)
bit of the Status Register is 0 (its initial delivery
state), it is possible to write to the Status Register
provided that the Write Enable Latch (WEL) bit has
previously been set by a Write Enable (WREN) instruction, regardless of the whether Write Protect
(W) is driven High or Low.
When the Status Register Write Disable (SRWD)
bit of the Status Register is set to 1, two cases
need to be considered, depending on the state of
Write Protect (W):
– If Write Protect (W) is driven High, it is
possible to write to the Status Register
provided that the Write Enable Latch (WEL) bit
18/38
has previously been set by a Write Enable
(WREN) instruction.
– If Write Protect (W) is driven Low, it is not
possible to write to the Status Register even if
the Write Enable Latch (WEL) bit has
previously been set by a Write Enable
(WREN) instruction. (Attempts to write to the
Status Register are rejected, and are not
accepted for execution). As a consequence,
all the data bytes in the memory area that are
software protected (SPM) by the Block Protect
(BP2, BP1, BP0) bits of the Status Register,
are also hardware protected against data
modification.
Regardless of the order of the two events, the
Hardware Protected Mode (HPM) can be entered:
M25P64
–
–
The only way to exit the Hardware Protected Mode
(HPM) once entered is to pull Write Protect (W)
High.
If Write Protect (W) is permanently tied High, the
Hardware Protected Mode (HPM) can never be
activated, and only the Software Protected Mode
(SPM), using the Block Protect (BP2, BP1, BP0)
bits of the Status Register, can be used.
by setting the Status Register Write Disable
(SRWD) bit after driving Write Protect (W) Low
or by driving Write Protect (W) Low after
setting the Status Register Write Disable
(SRWD) bit.
Figure 13. Write Status Register (WRSR) Instruction Sequence
S
0
1
2
3
4
5
6
7
8
9 10 11 12 13 14 15
C
Instruction
Status
Register In
7
D
High Impedance
6
5
4
3
2
1
0
MSB
Q
AI02282D
19/38
M25P64
Read Data Bytes (READ)
next higher address after each byte of data is shifted out. The whole memory can, therefore, be read
with a single Read Data Bytes (READ) instruction.
When the highest address is reached, the address
counter rolls over to 000000h, allowing the read
sequence to be continued indefinitely.
The Read Data Bytes (READ) instruction is terminated by driving Chip Select (S) High. Chip Select
(S) can be driven High at any time during data output. Any Read Data Bytes (READ) instruction,
while an Erase, Program or Write cycle is in
progress, is rejected without having any effects on
the cycle that is in progress.
The device is first selected by driving Chip Select
(S) Low. The instruction code for the Read Data
Bytes (READ) instruction is followed by a 3-byte
address (A23-A0), each bit being latched-in during
the rising edge of Serial Clock (C). Then the memory contents, at that address, is shifted out on Serial Data Output (Q), each bit being shifted out, at
a maximum frequency fR, during the falling edge of
Serial Clock (C).
The instruction sequence is shown in Figure 14..
The first byte addressed can be at any location.
The address is automatically incremented to the
Figure 14. Read Data Bytes (READ) Instruction Sequence and Data-Out Sequence
S
0
1
2
3
4
5
6
7
8
9 10
28 29 30 31 32 33 34 35 36 37 38 39
C
Instruction
24-Bit Address
23 22 21
D
3
2
1
0
MSB
Data Out 1
High Impedance
Q
7
6
5
4
3
2
Data Out 2
1
0
7
MSB
AI03748D
Note: 1. Address bit A23 is Don’t Care.
20/38
M25P64
Read Data Bytes at Higher Speed
(FAST_READ)
next higher address after each byte of data is shifted out. The whole memory can, therefore, be read
with a single Read Data Bytes at Higher Speed
(FAST_READ) instruction. When the highest address is reached, the address counter rolls over to
000000h, allowing the read sequence to be continued indefinitely.
The Read Data Bytes at Higher Speed
(FAST_READ) instruction is terminated by driving
Chip Select (S) High. Chip Select (S) can be driven High at any time during data output. Any Read
Data Bytes at Higher Speed (FAST_READ) instruction, while an Erase, Program or Write cycle
is in progress, is rejected without having any effects on the cycle that is in progress.
The device is first selected by driving Chip Select
(S) Low. The instruction code for the Read Data
Bytes at Higher Speed (FAST_READ) instruction
is followed by a 3-byte address (A23-A0) and a
dummy byte, each bit being latched-in during the
rising edge of Serial Clock (C). Then the memory
contents, at that address, is shifted out on Serial
Data Output (Q), each bit being shifted out, at a
maximum frequency fC, during the falling edge of
Serial Clock (C).
The instruction sequence is shown in Figure 15..
The first byte addressed can be at any location.
The address is automatically incremented to the
Figure 15. Read Data Bytes at Higher Speed (FAST_READ) Instruction and Data-Out Sequence
S
0
1
2
3
4
5
6
7
8
9 10
28 29 30 31
C
Instruction
24 BIT ADDRESS
23 22 21
D
3
2
1
0
High Impedance
Q
S
32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47
C
Dummy Byte
D
7
6
5
4
3
2
1
0
DATA OUT 2
DATA OUT 1
Q
7
MSB
6
5
4
3
2
1
0
7
MSB
6
5
4
3
2
1
0
7
MSB
AI04006
Note: Address bit A23 is Don’t Care.
21/38
M25P64
rectly within the same page. If less than 256 Data
bytes are sent to device, they are correctly programmed at the requested addresses without having any effects on the other bytes of the same
page.
Chip Select (S) must be driven High after the
eighth bit of the last data byte has been latched in,
otherwise the Page Program (PP) instruction is not
executed.
As soon as Chip Select (S) is driven High, the selftimed Page Program cycle (whose duration is tPP)
is initiated. While the Page Program cycle is in
progress, the Status Register may be read to
check the value of the Write In Progress (WIP) bit.
The Write In Progress (WIP) bit is 1 during the selftimed Page Program cycle, and is 0 when it is
completed. At some unspecified time before the
cycle is completed, the Write Enable Latch (WEL)
bit is reset.
A Page Program (PP) instruction applied to a page
which is protected by the Block Protect (BP2, BP1,
BP0) bits (see Table 2. and Table 3.) is not executed.
Page Program (PP)
The Page Program (PP) instruction allows bytes to
be programmed in the memory (changing bits from
1 to 0). Before it can be accepted, a Write Enable
(WREN) instruction must previously have been executed. After the Write Enable (WREN) instruction
has been decoded, the device sets the Write Enable Latch (WEL).
The Page Program (PP) instruction is entered by
driving Chip Select (S) Low, followed by the instruction code, three address bytes and at least
one data byte on Serial Data Input (D). If the 8
least significant address bits (A7-A0) are not all
zero, all transmitted data that goes beyond the end
of the current page are programmed from the start
address of the same page (from the address
whose 8 least significant bits (A7-A0) are all zero).
Chip Select (S) must be driven Low for the entire
duration of the sequence.
The instruction sequence is shown in Figure 16..
If more than 256 bytes are sent to the device, previously latched data are discarded and the last 256
data bytes are guaranteed to be programmed cor-
Figure 16. Page Program (PP) Instruction Sequence
S
0
1
2
3
4
5
6
7
8
28 29 30 31 32 33 34 35 36 37 38 39
9 10
C
Instruction
24-Bit Address
23 22 21
D
3
2
Data Byte 1
1
0
7
6
5
4
3
2
0
1
MSB
MSB
2078
2079
2077
2076
2075
2074
2073
40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55
2072
S
1
0
C
Data Byte 2
D
7
6
MSB
5
4
3
2
Data Byte 3
1
0
7
MSB
6
5
4
3
2
Data Byte 256
1
0
7
6
5
4
3
2
MSB
AI04082B
22/38
M25P64
Sector Erase (SE)
Chip Select (S) must be driven High after the
eighth bit of the last address byte has been latched
in, otherwise the Sector Erase (SE) instruction is
not executed. As soon as Chip Select (S) is driven
High, the self-timed Sector Erase cycle (whose duration is tSE) is initiated. While the Sector Erase cycle is in progress, the Status Register may be read
to check the value of the Write In Progress (WIP)
bit. The Write In Progress (WIP) bit is 1 during the
self-timed Sector Erase cycle, and is 0 when it is
completed. At some unspecified time before the
cycle is completed, the Write Enable Latch (WEL)
bit is reset.
A Sector Erase (SE) instruction applied to a page
which is protected by the Block Protect (BP2, BP1,
BP0) bits (see Table 2. and Table 3.) is not executed.
The Sector Erase (SE) instruction sets to 1 (FFh)
all bits inside the chosen sector. Before it can be
accepted, a Write Enable (WREN) instruction
must previously have been executed. After the
Write Enable (WREN) instruction has been decoded, the device sets the Write Enable Latch (WEL).
The Sector Erase (SE) instruction is entered by
driving Chip Select (S) Low, followed by the instruction code, and three address bytes on Serial
Data Input (D). Any address inside the Sector (see
Table 3.) is a valid address for the Sector Erase
(SE) instruction. Chip Select (S) must be driven
Low for the entire duration of the sequence.
The instruction sequence is shown in Figure 17..
Figure 17. Sector Erase (SE) Instruction Sequence
S
0
1
2
3
4
5
6
7
8
9
29 30 31
C
Instruction
D
24 Bit Address
23 22
2
1
0
MSB
AI03751D
Note: Address bit A23 is Don’t Care.
23/38
M25P64
in, otherwise the Bulk Erase instruction is not executed. As soon as Chip Select (S) is driven High,
the self-timed Bulk Erase cycle (whose duration is
tBE) is initiated. While the Bulk Erase cycle is in
progress, the Status Register may be read to
check the value of the Write In Progress (WIP) bit.
The Write In Progress (WIP) bit is 1 during the selftimed Bulk Erase cycle, and is 0 when it is completed. At some unspecified time before the cycle
is completed, the Write Enable Latch (WEL) bit is
reset.
The Bulk Erase (BE) instruction is executed only if
all Block Protect (BP2, BP1, BP0) bits are 0. The
Bulk Erase (BE) instruction is ignored if one, or
more, sectors are protected.
Bulk Erase (BE)
The Bulk Erase (BE) instruction sets all bits to 1
(FFh). Before it can be accepted, a Write Enable
(WREN) instruction must previously have been executed. After the Write Enable (WREN) instruction
has been decoded, the device sets the Write Enable Latch (WEL).
The Bulk Erase (BE) instruction is entered by driving Chip Select (S) Low, followed by the instruction
code on Serial Data Input (D). Chip Select (S)
must be driven Low for the entire duration of the
sequence.
The instruction sequence is shown in Figure 18..
Chip Select (S) must be driven High after the
eighth bit of the instruction code has been latched
Figure 18. Bulk Erase (BE) Instruction Sequence
S
0
1
2
3
4
5
6
7
C
Instruction
D
AI03752D
24/38
M25P64
The instruction sequence is shown in Figure 19.
The Read Electronic Signature (RES) instruction
is terminated by driving Chip Select (S) High after
the Electronic Signature has been read at least
once. Sending additional clock cycles on Serial
Clock (C), while Chip Select (S) is driven Low,
cause the Electronic Signature to be output repeatedly.
When Chip Select (S) is driven High, the device is
put in the Standby Power mode. Once in the
Standby Power mode, the device waits to be selected, so that it can receive, decode and execute
instructions.
Driving Chip Select (S) High after the 8-bit instruction byte has been received by the device, but before the whole of the 8-bit Electronic Signature has
been transmitted for the first time, still ensures that
the device is put into Standby Power mode. Once
in the Standby Power mode, the device waits to be
selected, so that it can receive, decode and execute instructions.
Read Electronic Signature (RES)
The instruction is used to read, on Serial Data Output (Q), the old-style 8-bit Electronic Signature,
whose value for the M25P64 is 16h.
Please note that this is not the same as, or even a
subset of, the JEDEC 16-bit Electronic Signature
that is read by the Read Identifier (RDID) instruction. The old-style Electronic Signature is supported for reasons of backward compatibility, only, and
should not be used for new designs. New designs
should, instead, make use of the JEDEC 16-bit
Electronic Signature, and the Read Identifier
(RDID) instruction.
The device is first selected by driving Chip Select
(S) Low. The instruction code is followed by 3
dummy bytes, each bit being latched-in on Serial
Data Input (D) during the rising edge of Serial
Clock (C). Then, the old-style 8-bit Electronic Signature, stored in the memory, is shifted out on Serial Data Output (Q), each bit being shifted out
during the falling edge of Serial Clock (C).
Figure 19. Read Electronic Signature (RES) Instruction Sequence and Data-Out Sequence
S
0
1
2
3
4
5
6
7
8
9 10
28 29 30 31 32 33 34 35 36 37 38
C
Instruction
3 Dummy Bytes
23 22 21
D
3
2
1
0
MSB
Electronic Signature Out
High Impedance
Q
7
MSB
6
5
4
3
2
1
0
AI04047C
Note: The value of the 8-bit Electronic Signature, for the M25P64, is 16h.
25/38
M25P64
POWER-UP AND POWER-DOWN
At Power-up and Power-down, the device must
not be selected (that is Chip Select (S) must follow
the voltage applied on VCC) until VCC reaches the
correct value:
– VCC(min) at Power-up, and then for a further
delay of tVSL
– VSS at Power-down
Usually a simple pull-up resistor on Chip Select (S)
can be used to ensure safe and proper Power-up
and Power-down.
To avoid data corruption and inadvertent write operations during Power-up, a Power On Reset
(POR) circuit is included. The logic inside the device is held reset while VCC is less than the Power
On Reset (POR) threshold voltage, VWI – all operations are disabled, and the device does not respond to any instruction.
Moreover, the device ignores all Write Enable
(WREN), Page Program (PP), Sector Erase (SE),
Bulk Erase (BE) and Write Status Register
(WRSR) instructions until a time delay of tPUW has
elapsed after the moment that VCC rises above the
VWI threshold. However, the correct operation of
the device is not guaranteed if, by this time, VCC is
still below VCC(min). No Write Status Register,
Program or Erase instructions should be sent until
the later of:
– tPUW after VCC passed the VWI threshold
– tVSL after VCC passed the VCC(min) level
These values are specified in Table 8..
If the delay, tVSL, has elapsed, after VCC has risen
above VCC(min), the device can be selected for
READ instructions even if the tPUW delay is not yet
fully elapsed.
At Power-up, the device is in the following state:
– The device is in the Standby Power mode
– The Write Enable Latch (WEL) bit is reset.
Normal precautions must be taken for supply rail
decoupling, to stabilize the VCC supply. Each device in a system should have the VCC rail decoupled by a suitable capacitor close to the package
pins. (Generally, this capacitor is of the order of
0.1µF).
At Power-down, when VCC drops from the operating voltage, to below the Power On Reset (POR)
threshold voltage, VWI, all operations are disabled
and the device does not respond to any instruction. (The designer needs to be aware that if a
Power-down occurs while a Write, Program or
Erase cycle is in progress, some data corruption
can result.)
Figure 20. Power-up Timing
VCC
VCC(max)
Program, Erase and Write Commands are Rejected by the Device
Chip Selection Not Allowed
VCC(min)
Reset State
of the
Device
tVSL
Read Access allowed
Device fully
accessible
VWI
tPUW
time
26/38
AI04009C
M25P64
Table 8. Power-Up Timing and VWI Threshold
Symbol
(1)
Parameter
Min.
Max.
Unit
VCC(min) to S low
30
tPUW(1)
Time delay to Write instruction
1
10
ms
VWI(1)
Write Inhibit Voltage
1.5
2.5
V
tVSL
µs
Note: 1. These parameters are characterized only.
INITIAL DELIVERY STATE
The device is delivered with the memory array
erased: all bits are set to 1 (each byte contains
FFh). The Status Register contains 00h (all Status
Register bits are 0).
27/38
M25P64
MAXIMUM RATING
Stressing the device outside the ratings listed in
Table 9. may cause permanent damage to the device. These are stress ratings only, and operation
of the device at these, or any other conditions outside those indicated in the Operating sections of
this specification, is not implied. Exposure to Absolute Maximum Rating conditions for extended
periods may affect device reliability. Refer also to
the STMicroelectronics SURE Program and other
relevant quality documents.
Table 9. Absolute Maximum Ratings
Symbol
Parameter
TSTG
Storage Temperature
TLEAD
Lead Temperature during Soldering
Max.
Unit
–65
150
°C
See note (1)
°C
VIO
Input and Output Voltage (with respect to Ground)
–0.5
4.0
V
VCC
Supply Voltage
–0.2
4.0
V
VESD
Electrostatic Discharge Voltage (Human Body model) 2
–2000
2000
V
Note: 1. Compliant with JEDEC Std J-STD-020C (for small body, Sn-Pb or Pb assembly), the ST
the European directive on Restrictions on Hazardous Substances (RoHS) 2002/95/EU
2. JEDEC Std JESD22-A114A (C1=100 pF, R1=1500 Ω, R2=500 Ω)
28/38
Min.
ECOPACK®
7191395 specification, and
M25P64
DC AND AC PARAMETERS
This section summarizes the operating and measurement conditions, and the DC and AC characteristics of the device. The parameters in the DC
and AC Characteristic tables that follow are derived from tests performed under the Measure-
ment Conditions summarized in the relevant
tables. Designers should check that the operating
conditions in their circuit match the measurement
conditions when relying on the quoted parameters.
Table 10. Operating Conditions
Symbol
VCC
TA
Parameter
Min.
Max.
Unit
Supply Voltage
2.7
3.6
V
Ambient Operating Temperature
–40
85
°C
Min.
Max.
Unit
Table 11. AC Measurement Conditions
Symbol
CL
Parameter
Load Capacitance
30
Input Rise and Fall Times
pF
5
ns
Input Pulse Voltages
0.2VCC to 0.8VCC
V
Input Timing Reference Voltages
0.3VCC to 0.7VCC
V
VCC / 2
V
Output Timing Reference Voltages
Note: Output Hi-Z is defined as the point where data out is no longer driven.
Figure 21. AC Measurement I/O Waveform
Input Levels
Input and Output
Timing Reference Levels
0.8VCC
0.7VCC
0.5VCC
0.3VCC
0.2VCC
AI07455
Table 12. Capacitance
Symbol
COUT
CIN
Parameter
Output Capacitance (Q)
Input Capacitance (other pins)
Test Condition
Min.
Max.
Unit
VOUT = 0V
8
pF
VIN = 0V
6
pF
Note: Sampled only, not 100% tested, at TA=25°C and a frequency of 20 MHz.
29/38
M25P64
Table 13. DC Characteristics
Symbol
Parameter
Test Condition
(in addition to those in Table 10.)
Min.
Max.
Unit
ILI
Input Leakage Current
±2
µA
ILO
Output Leakage Current
±2
µA
ICC1
Standby Current
S = VCC, VIN = VSS or VCC
50
µA
C = 0.1VCC / 0.9.VCC at 50MHz,
Q = open
8
mA
C = 0.1VCC / 0.9.VCC at 20MHz,
Q = open
4
mA
ICC3
Operating Current (READ)
ICC4
Operating Current (PP)
S = VCC
15
mA
ICC5
Operating Current (WRSR)
S = VCC
20
mA
ICC6
Operating Current (SE)
S = VCC
20
mA
ICC7
Operating Current (BE)
S = VCC
20
mA
VIL
Input Low Voltage
– 0.5
0.3VCC
V
VIH
Input High Voltage
0.7VCC
VCC+0.2
V
VOL
Output Low Voltage
IOL = 1.6mA
0.4
V
VOH
Output High Voltage
IOH = –100µA
30/38
VCC–0.2
V
M25P64
Table 14. AC Characteristics
Test conditions specified in Table 10. and Table 11.
Symbol
Alt.
fC
fC
fR
Parameter
Min.
Typ.
Max.
Unit
Clock Frequency for the following instructions: FAST_READ,
PP, SE, BE, RES, WREN, WRDI, RDID, RDSR, WRSR
D.C.
50
MHz
Clock Frequency for READ instructions
D.C.
20
MHz
tCH (1)
tCLH
Clock High Time
9
ns
tCL (1)
tCLL
Clock Low Time
9
ns
tCLCH (2)
Clock Rise Time3 (peak to peak)
0.1
V/ns
tCHCL (2)
Clock Fall Time3 (peak to peak)
0.1
V/ns
S Active Setup Time (relative to C)
5
ns
S Not Active Hold Time (relative to C)
5
ns
tSLCH
tCSS
tCHSL
tDVCH
tDSU
Data In Setup Time
2
ns
tCHDX
tDH
Data In Hold Time
5
ns
tCHSH
S Active Hold Time (relative to C)
5
ns
tSHCH
S Not Active Setup Time (relative to C)
5
ns
100
ns
tSHSL
tCSH
S Deselect Time
tSHQZ (2)
tDIS
Output Disable Time
8
ns
tCLQV
tV
Clock Low to Output Valid
8
ns
tCLQX
tHO
Output Hold Time
0
ns
tHLCH
HOLD Setup Time (relative to C)
5
ns
tCHHH
HOLD Hold Time (relative to C)
5
ns
tHHCH
HOLD Setup Time (relative to C)
5
ns
tCHHL
HOLD Hold Time (relative to C)
5
ns
tHHQX (2)
tLZ
HOLD to Output Low-Z
8
ns
tHLQZ (2)
tHZ
HOLD to Output High-Z
8
ns
tWHSL (4)
Write Protect Setup Time
20
ns
tSHWL (4)
Write Protect Hold Time
100
ns
tW
Write Status Register Cycle Time
tPP
Page Program Cycle Time
tSE
tBE
Note: 1.
2.
3.
4.
5
15
ms
1.4
5
ms
Sector Erase Cycle Time
1
3
s
Bulk Erase Cycle Time
68
160
s
tCH + tCL must be greater than or equal to 1/ fC(max)
Value guaranteed by characterization, not 100% tested in production.
Expressed as a slew-rate.
Only applicable as a constraint for a WRSR instruction when SRWD is set at 1.
31/38
M25P64
Figure 22. Serial Input Timing
tSHSL
S
tCHSL
tSLCH
tCHSH
tSHCH
C
tDVCH
tCHCL
tCHDX
D
Q
MSB IN
tCLCH
LSB IN
High Impedance
AI01447C
Figure 23. Write Protect Setup and Hold Timing during WRSR when SRWD=1
W
tSHWL
tWHSL
S
C
D
High Impedance
Q
AI07439
32/38
M25P64
Figure 24. Hold Timing
S
tHLCH
tCHHL
tHHCH
C
tCHHH
tHLQZ
tHHQX
Q
D
HOLD
AI02032
Figure 25. Output Timing
S
tCH
C
tCLQV
tCLQX
tCLQV
tCL
tSHQZ
tCLQX
LSB OUT
Q
tQLQH
tQHQL
D
ADDR.LSB IN
AI01449e
33/38
M25P64
PACKAGE MECHANICAL
Figure 26. MLP8, 8-lead Very thin Dual Flat Package No lead, 8x6mm, Package Outline
D
E
E2
e
b
D2
A
L
L1
ddd
A1
VDFPN-02
Note: Drawing is not to scale.
Table 15. MLP8, 8-lead Very thin Dual Flat Package No lead, 8x6mm,
Package Mechanical Data
millimeters
inches
Symbol
Typ.
A
Min.
0.85
A1
Typ.
1.00
0.0335
0.00
0.05
0.35
0.48
b
0.40
D
8.00
0.3150
D2
6.40
0.2520
ddd
0.0157
6.00
0.2362
E2
4.80
0.1890
e
1.27
–
0.0500
0.20
0.50
0.45
L1
N
–
0.0394
0.0000
0.0020
0.0138
0.0189
–
–
0.0079
0.60
0.0197
0.0177
0.15
8
Max.
0.0020
E
L
Min.
0.05
K
34/38
Max.
0.0236
0.0059
8
M25P64
Figure 27. SO16 wide – 16 lead Plastic Small Outline, 300 mils body width
D
16
h x 45˚
9
C
E
1
H
θ
8
A2
B
A1
A
L
ddd
e
SO-H
Note: Drawing is not to scale.
Table 16. SO16 wide – 16 lead Plastic Small Outline, 300 mils body width
millimeters
inches
Symbol
Typ
Min
Max
A
2.35
A1
Min
Max
2.65
0.093
0.104
0.10
0.30
0.004
0.012
B
0.33
0.51
0.013
0.020
C
0.23
0.32
0.009
0.013
D
10.10
10.50
0.398
0.413
E
7.40
7.60
0.291
0.299
–
–
–
–
H
10.00
10.65
0.394
0.419
h
0.25
0.75
0.010
0.030
L
0.40
1.27
0.016
0.050
θ
0°
8°
0°
8°
e
ddd
1.27
0.10
Typ
0.050
0.004
35/38
M25P64
PART NUMBERING
Table 17. Ordering Information Scheme
Example:
M25P64
–
V MF
6
T
P
Device Type
M25P = Serial Flash Memory for Code Storage
Device Function
64 = 64Mbit (8M x 8)
Operating Voltage
V = VCC = 2.7 to 3.6V
Package
MF = SO16 (300 mil width)
ME = VDFPN8 8x6mm (MLP8)
Device Grade
6 = Industrial temperature range, –40 to 85 °C.
Device tested with standard test flow
Option
blank = Standard Packing
T = Tape and Reel Packing
Plating Technology
blank = Standard SnPb plating
P or G = RoHS compliant
For a list of available options (speed, package,
etc.) or for further information on any aspect of this
36/38
device, please contact your nearest ST Sales Office.
M25P64
REVISION HISTORY
Table 18. Document Revision History
Date
Rev.
28-Apr-2003
0.1
Target Specification Document written in brief form
15-May-2003
0.2
Target Specification Document written in full
20-Jun-2003
0.3
8x6 MLP8 and SO16(300 mil) packages added
18-Jul-2003
0.4
tPP, tSE and tBE revised
02-Sep-2003
0.5
Voltage supply range changed
19-Sep-2003
0.6
Table of contents, warning about exposed paddle on MLP8, and Pb-free options added
17-Dec-2003
0.7
Value of tVSL(min) VWI, tPP(typ) and tBE(typ) changed. MLP8 package removed.
15-Nov-2004
1.0
Document status promoted from Target Specification to Preliminary Data. 8x6 MLP8 package
added. Minor wording changes.
2.0
Deep Power-Down mode removed from datasheet (Figure 19., Read Electronic Signature
(RES) Instruction Sequence and Data-Out Sequence modified and tRES1 and tRES2
removed from Table 14., AC Characteristics). SO16 Wide package specifications updated.
End timing line of tSHQZ modified in Figure 25., Output Timing. Figures moved below the
corresponding instructions in the INSTRUCTIONS section.
24-Feb-2005
Description of Revision
37/38
M25P64
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics.
ECOPACK is a registered trademark of STMicroelectronics.
All other names are the property of their respective owners
© 2005 STMicroelectronics - All rights reserved
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38/38