High Frequency Ceramic Solutions Preliminary 2.45 GHz Balun / Matching Network : Optimized for TI Chipset CC2520 P/N 2450BM15B0002 Detail Specification: 12/10/2009 Page 1 of 3 General Specifications 2450BM15B0002 Part Number Phase Difference 180° ± 15 50 Ω Input Power 2W max. Conjugate match to TI Chipset 2520 Reel Quanity Unbalanced Impedance Differential Balanced Impedance Packaging Style P/N Suffix Termination Style 4,000 -40 to +85°C Operating Temperature 1.5 dB max. Insertion Loss Storage Temperature Range 16 min.@ 4800~5000MHz Differential Mode Attenuation (dB) 10.0 dB min. Return Loss 2400 - 2500 Frequency (MHz) +5 ~ +35 °C, Humidity 45~75%RH, 12 mos. max 25 min.@ 7200~7500MHz Bulk Suffix = S Eg. 2450BM15B0002S T&R Suffix = E Eg. 2450BM15B0002E 100% Tin Suffix = None Eg. 2450BM15B0002(E or S) Tin / Lead Please consult Factory Terminal Configuration Function No. Unbalanced Port (2.2nH Ind)* 1 Mechanical Dimensions In mm 2 GND L 0.079 ± 0.004 2.00 ± 0.10 3 Balanced Port W 0.049 ± 0.004 1.25 ± 0.10 4 Balanced Port T 0.028 ± 0.004 0.70 ± 0.10 a 0.012 ± 0.004 0.30 ± 0.10 b 0.008 ± 0.004 0.20 ± 0.10 c 0.012 +.004/-.008 0.30 +0.1/-0.2 g 0.014 ± 0.004 0.35 ± 0.10 p 0.026 ± 0.002 0.65 ± 0.05 W c L a p 5 GND 6 GND 3 2 1 4 5 6 T g b *2.2 nH Ceramic Chip inductor required on unbalanced port. See page 2 for details 0.35 Mounting Considerations Mount these devices with brown mark facing up. Units: mm * * Line width should be designed to provide 50 Ω impedance matching characteristics. * Solder Resist 3 21 0.8 45 6 1.0 Land Through-hole (φ 0.3) * 0.30 Johanson Technology, Inc. reserves the right to make design changes without notice. All sales are subject to Johanson Technology, Inc. terms and conditions. www.johansontechnology.com 4001 Calle Tecate • Camarillo, CA 93012 • TEL 805.389.1166 FAX 805.389.1821 2009 Johanson Technology, Inc. All Rights Reserved Preliminary High Frequency Ceramic Solutions 2.45 GHz Balun / Matching Network : Optimized for TI Chipset CC2520 P/N 2450BM15B0002 Detail Specification: 12/10/2009 Page 2 of 3 Mounting Considerations ) Mounting layout for reference only. Mount device with colored mark facing up. For detailed dimensions, please contact Johanson Technology or visit TI’s CC2520 website: http://focus.ti.com/docs/prod/folders/print/cc2520.html ) ) ) ) ) ) ) 2.2nH Inductor ) ) ) ) Component P/N: 2.2nH Inductor: L-07C2N2SV6T Johanson Technology, Inc. reserves the right to make design changes without notice. All sales are subject to Johanson Technology, Inc. terms and conditions. www.johansontechnology.com 4001 Calle Tecate • Camarillo, CA 93012 • TEL 805.389.1166 FAX 805.389.1821 2009 Johanson Technology, Inc. All Rights Reserved Preliminary High Frequency Ceramic Solutions 2.45 GHz Balun / Matching Network : Optimized for TI Chipset CC2520 P/N 2450BM15B0002 Detail Specification: 12/10/2009 Page 3 of 3 Typical Electrical Performance (T=25°C) ) ) ) ) ) ) ) ) ) ) Johanson Technology, Inc. reserves the right to make design changes without notice. All sales are subject to Johanson Technology, Inc. terms and conditions. www.johansontechnology.com 4001 Calle Tecate • Camarillo, CA 93012 • TEL 805.389.1166 FAX 805.389.1821 2009 Johanson Technology, Inc. All Rights Reserved