STMICROELECTRONICS M50FW002K1

M50FW002
2 Mbit (256Kb x8, Boot Block)
3V Supply Firmware Hub Flash Memory
PRELIMINARY DATA
FEATURES SUMMARY
■ SUPPLY VOLTAGE
Figure 1. Packages
– VCC = 3 V to 3.6 V for Program, Erase and
Read Operations
– VPP = 12 V for Fast Program and Fast Erase
(optional)
■
TWO INTERFACES
– Firmware Hub (FWH) Interface for embedded
operation with PC Chipsets
– Address/Address Multiplexed (A/A Mux)
Interface for programming equipment
compatibility
■
FIRMWARE HUB (FWH) HARDWARE
INTERFACE MODE
PLCC32 (K)
– 5 Signal Communication Interface supporting
Read and Write Operations
– Hardware Write Protect Pins for Block
Protection
– Register Based Read and Write Protection
– 5 Additional General Purpose Inputs for
platform design flexibility
– Synchronized with 33MHz PCI clock
– Multi-byte Read Operation (1-byte, 16-byte,
32-byte)
■
PROGRAMMING TIME
■
ELECTRONIC SIGNATURE
– 10 µs typical
– Manufacturer Code: 20h
– Quadruple Byte Programming Option
– Device Code: 29h
■ 7
MEMORY BLOCKS
– 1 Boot Block (Top Location)
– 4 Main Blocks and 2 Parameter Blocks
■
PROGRAM/ERASE CONTROLLER
– Embedded Byte Program, Block Erase and
Chip Erase algorithms
– Status Register Bits
■
PROGRAM and ERASE SUSPEND
■
FOR USE in PC BIOS APPLICATIONS
May 2002
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice.
1/39
M50FW002
TABLE OF CONTENTS
SUMMARY DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
SIGNAL DESCRIPTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Firmware Hub (FWH) Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Address/Address Multiplexed (A/A Mux) Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Supply Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
BUS OPERATIONS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Firmware Hub (FWH) Bus Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
FWH Bus Read Field Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
FWH Bus Write Field Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Address/Address Multiplexed (A/A Mux) Bus Operations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
A/A Mux Bus Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Manufacturer and Device Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
COMMAND INTERFACE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
STATUS REGISTER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Status Register Bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
FIRMWARE HUB (FWH) INTERFACE CONFIGURATION REGISTERS . . . . . . . . . . . . . . . . . . . . . . 17
Lock Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Firmware Hub (FWH) General Purpose Input Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Manufacturer Code Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Firmware Hub Register Configuration Map (1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Lock Register Bit Definitions(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
General Purpose Input Register Definition(1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
MAXIMUM RATING. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
DC and AC PARAMETERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Operating Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
AC Measurement Conditions (FWH Interface) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
AC Measurement Conditions (A/A Mux Interface). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Device Impedance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
DC Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Clock Characteristics (FWH Interface) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
AC Signal Timing Characteristics (FWH Interface) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Program and Erase Times. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
2/39
M50FW002
Reset AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Read AC Characteristics (A/A Mux Interface) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Write AC Characteristics (A/A Mux Interface) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
PACKAGE MECHANICAL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
PLCC32 – 32 lead Plastic Leaded Chip Carrier, Package Mechanical Data . . . . . . . . . . . . . . . . . 36
PART NUMBERING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Ordering Information Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
REVISION HISTORY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Document Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
3/39
M50FW002
SUMMARY DESCRIPTION
The M50FW002 is a 2 Mbit (256Kb x8) non-volatile memory that can be read, erased and reprogrammed. These operations can be performed
using a single low voltage (3.0 to 3.6V) supply. For
fast programming and fast erasing in production
lines an optional 12V power supply can be used to
reduce the programming and the erasing times.
The memory is divided into blocks that can be
erased independently so it is possible to preserve
valid data while old data is erased. Blocks can be
protected individually to prevent accidental Program or Erase commands from modifying the
memory. Program and Erase commands are written to the Command Interface of the memory. An
on-chip Program/Erase Controller simplifies the
process of programming or erasing the memory by
taking care of all of the special operations that are
required to update the memory contents. The end
of a program or erase operation can be detected
and any error conditions identified. The command
set required to control the memory is consistent
with JEDEC standards.
The device features an asymmetrical blocked architecture. The device has an array of 7 blocks:
■ 1 Boot Block of 16 KByte
■ 2 Parameter Blocks of 8 KByte each
■ 1 Main Block of 32 KByte
■ 3 Main Blocks of 64 KByte each
Two different bus interfaces are supported by the
memory. The primary interface, the Firmware Hub
(or FWH) Interface, uses Intel’s proprietary FWH
protocol. This has been designed to remove the
need for the ISA bus in current PC Chipsets; the
M50FW002 acts as the PC BIOS on the Low Pin
Count bus for these PC Chipsets.
The secondary interface, the Address/Address
Multiplexed (or A/A Mux) Interface, is designed to
be compatible with current Flash Programmers for
production line programming prior to fitting to a PC
Motherboard.
The memory is delivered with all the bits erased
(set to 1).
A8
A9
RP
VPP
VCC
RC
A10
Figure 2. PLCC Connections
A/A Mux
FGPI2
FGPI3
RP
VPP
VCC
CLK
FGPI4
A/A Mux
1 32
A7
A6
A5
A4
A3
A2
A1
A0
DQ0
FGPI1
FGPI0
WP
TBL
ID3
ID2
ID1
ID0
FWH0
9
M50FW002
25
IC (VIL)
NC
NC
VSS
VCC
INIT
FWH4
RFU
RFU
IC (VIH)
NC
NC
VSS
VCC
G
W
RB
DQ7
A/A Mux
DQ1
DQ2
VSS
DQ3
DQ4
DQ5
DQ6
FWH1
FWH2
VSS
FWH3
RFU
RFU
RFU
17
A/A Mux
AI05749
Note: Pins 27 and 28 are not internally connected.
4/39
M50FW002
Figure 3. Logic Diagram (FWH Interface)
Figure 4. Logic Diagram (A/A Mux Interface)
VCC VPP
VCC VPP
4
4
FWH0FWH3
ID0-ID3
11
5
DQ0-DQ7
A0-A10
FGPI0FGPI4
FWH4
8
WP
M50FW002
RC
TBL
IC
CLK
M50FW002
RB
G
IC
W
RP
RP
INIT
VSS
VSS
AI05748
AI05747
Table 1. Signal Names (FWH Interface)
Table 2. Signal Names (A/A Mux Interface)
FWH0-FWH3
Input/Output Communications
IC
Interface Configuration
FWH4
Input Communication Frame
A0-A10
Address Inputs
ID0-ID3
Identification Inputs
DQ0-DQ7
Data Inputs/Outputs
FGPI0-FGPI4
General Purpose Inputs
G
Output Enable
IC
Interface Configuration
W
Write Enable
RP
Interface Reset
RC
Row/Column Address Select
INIT
CPU Reset
RB
Ready/Busy Output
CLK
Clock
RP
Interface Reset
TBL
Top Block Lock
VCC
Supply Voltage
WP
Write Protect
VPP
Optional Supply Voltage for Fast
Program and Fast Erase Operations
RFU
Reserved for Future Use. Leave
disconnected
VSS
Ground
VCC
Supply Voltage
NC
Not Connected Internally
VPP
Optional Supply Voltage for Fast
Erase Operations
VSS
Ground
NC
Not Connected Internally
5/39
M50FW002
SIGNAL DESCRIPTIONS
There are two different bus interfaces available on
this part. The active interface is selected before
power-up or during Reset using the Interface Configuration Pin, IC.
The signals for each interface are discussed in the
Firmware Hub (FWH) Signal Descriptions section
and the Address/Address Multiplexed (A/A Mux)
Signal Descriptions section below. The supply signals are discussed in the Supply Signal Descriptions section below.
Firmware Hub (FWH) Signal Descriptions
For the Firmware Hub (FWH) Interface see Figure
4, Logic Diagram, and Table 1, Signal Names.
Input/Output Communications (FWH0-FWH3). All
Input and Output Communication with the memory
take place on these pins. Addresses and Data for
Bus Read and Bus Write operations are encoded
on these pins.
Input Communication Frame (FWH4). The Input Communication Frame (FWH4) signals the
start of a bus operation. When Input Communication Frame is Low, VIL, on the rising edge of the
Clock a new bus operation is initiated. If Input
Communication Frame is Low, VIL, during a bus
operation then the operation is aborted. When Input Communication Frame is High, VIH, the current bus operation is proceeding or the bus is idle.
Identification Inputs (ID0-ID3). The
Identification Inputs select the address that the
memory responds to. Up to 16 memories can be
addressed on a bus. For an address bit to be ‘0’
the pin can be left floating or driven Low, VIL; an
internal pull-down resistor is included with a value
of R IL. For an address bit to be ‘1’ the pin must be
driven High, V IH; there will be a leakage current of
ILI2 through each pin when pulled to V IH; see Table
19.
By convention the boot memory must have
address ‘0000’ and all additional memories take
sequential addresses starting from ‘0001’.
General Purpose Inputs (FGPI0-FGPI4). The General Purpose Inputs can be used as digital inputs
for the CPU to read. The General Purpose Input
Register holds the values on these pins. The pins
must have stable data from before the start of the
cycle that reads the General Purpose Input Register until after the cycle is complete. These pins
must not be left to float, they should be driven Low,
VIL, or High, VIH.
Interface Configuration (IC). The Interface Configuration input selects whether the Firmware Hub
(FWH) or the Address/Address Multiplexed (A/A
Mux) Interface is used. The chosen interface must
be selected before power-up or during a Reset
and, thereafter, cannot be changed. The state of
6/39
the Interface Configuration, IC, should not be
changed during operation.
To select the Firmware Hub (FWH) Interface the
Interface Configuration pin should be left to float or
driven Low, VIL; to select the Address/Address
Multiplexed (A/A Mux) Interface the pin should be
driven High, VIH. An internal pull-down resistor is
included with a value of RIL; there will be a leakage
current of ILI2 through each pin when pulled to VIH;
see Table 19.
Interface Reset (RP). The Interface Reset (RP)
input is used to reset the memory. When Interface
Reset (RP) is set Low, VIL, the memory is in Reset
mode: the outputs are put to high impedance and
the current consumption is minimized. When RP is
set High, V IH, the memory is in normal operation.
After exiting Reset mode, the memory enters
Read mode.
CPU Reset (INIT). The CPU Reset, INIT, pin is
used to Reset the memory when the CPU is reset.
It behaves identically to Interface Reset, RP, and
the internal Reset line is the logical OR (electrical
AND) of RP and INIT.
Clock (CLK). The Clock, CLK, input is used to
clock the signals in and out of the Input/Output
Communication Pins, FWH0-FWH3. The Clock
conforms to the PCI specification.
Top Block Lock (TBL). The Top Block Lock
input is used to prevent the Top Block (Block 6)
from being changed. When Top Block Lock, TBL,
is set Low, V IL, Program and Erase operations in
the Top Block have no effect, regardless of the
state of the Lock Register. When Top Block Lock,
TBL, is set High, VIH, the protection of the Block is
determined by the Lock Register. The state of Top
Block Lock, TBL, does not affect the protection of
the other blocks (Blocks 0 to 5).
Top Block Lock, TBL, must be set prior to a Program or Erase operation is initiated and must not
be changed until the operation completes or unpredictable results may occur. Care should be taken to avoid unpredictable behavior by changing
TBL during Program or Erase Suspend.
Write Protect (WP). The Write Protect input is
used to prevent the blocks 0 to 5 from being
changed. When Write Protect, WP, is set Low, VIL,
Program and Erase operations in these blocks
have no effect, regardless of the state of the Lock
Register. When Write Protect, WP, is set High,
VIH, the protection of the Block is determined by
the Lock Register. The state of Write Protect, WP,
does not affect the protection of the Top Block
(Block 6).
Write Protect, WP, must be set prior to a Program
or Erase operation is initiated and must not be
changed until the operation completes or unpre-
M50FW002
dictable results may occur. Care should be taken
to avoid unpredictable behavior by changing WP
during Program or Erase Suspend.
Reserved for Future Use (RFU). These pins do
not have assigned functions in this revision of the
part. They must be left disconnected.
Address/Address Multiplexed (A/A Mux)
Signal Descriptions
For the Address/Address Multiplexed (A/A Mux)
Interface see Figure 4, and Table 2.
Address Inputs (A0-A10). The Address Inputs
are used to set the Row Address bits (A0-A10) and
the Column Address bits (A11-A17). They are
latched during any bus operation by the Row/Column Address Select input, RC.
Data Inputs/Outputs (DQ0-DQ7). The Data Inputs/Outputs hold the data that is written to or read
from the memory. They output the data stored at
the selected address during a Bus Read operation. During Bus Write operations they represent
the commands sent to the Command Interface of
the internal state machine. The Data Inputs/Outputs, DQ0-DQ7, are latched during a Bus Write
operation.
Output Enable (G). The Output Enable, G, controls the Bus Read operation of the memory.
Write Enable (W). The Write Enable, W, controls
the Bus Write operation of the memory’s Command Interface.
Row/Column Address Select (RC). The Row/
Column Address Select input selects whether the
Address Inputs should be latched into the Row
Address bits (A0-A10) or the Column Address bits
(A11-A17). The Row Address bits are latched on
the falling edge of RC whereas the Column
Address bits are latched on the rising edge.
Ready/Busy Output (RB). The Ready/Busy pin
gives the status of the memory’s Program/Erase
Controller. When Ready/Busy is Low, VOL, the
memory is busy with a Program or Erase operation
and it will not accept any additional Program or
Erase command except the Program/Erase
Suspend command. When Ready/Busy is High,
VOH, the memory is ready for any Read, Program
or Erase operation.
Supply Signal Descriptions
The Supply Signals are the same for both interfaces.
VCC Supply Voltage. The VCC Supply Voltage
supplies the power for all operations (Read, Program, Erase etc.).
The Command Interface is disabled when the V CC
Supply Voltage is less than the Lockout Voltage,
VLKO. This prevents Bus Write operations from
accidentally damaging the data during power up,
power down and power surges. If the Program/
Erase Controller is programming or erasing during
this time then the operation aborts and the
memory contents being altered will be invalid.
After VCC becomes valid the Command Interface
is reset to Read mode.
A 0.1µF capacitor should be connected between
the VCC Supply Voltage pins and the VSS Ground
pin to decouple the current surges from the power
supply. Both V CC Supply Voltage pins must be
connected to the power supply. The PCB track
widths must be sufficient to carry the currents
required during program and erase operations.
VPP Optional Supply Voltage. The VPP Optional
Supply Voltage pin is used to select the Fast
Program (see the Quadruple Byte Program
Command description) and Fast Erase options of
the memory and to protect the memory. When VPP
< VPPLK Program and Erase operations cannot be
performed and an error is reported in the Status
Register if an attempt to change the memory
contents is made. When VPP = VCC Program and
Erase operations take place as normal. When VPP
= VPPH Fast Program (if A/A Mux interface is
selected) and Fast Erase operations are used.
Any other voltage input to V PP will result in
undefined behavior and should not be used.
VPP should not be set to V PPH for more than 80
hours during the life of the memory.
VSS Ground. VSS is the reference for all the voltage measurements.
Table 3. Block Addresses
Size
(Kbytes)
Address Range
Block
Number
Block Type
16
3C000h-3FFFFh
6
Boot Block
(Top)
8
3A000h-3BFFFh
5
Parameter
Block
8
38000h-39FFFh
4
Parameter
Block
32
30000h-37FFFh
3
Main Block
64
20000h-2FFFFh
2
Main Block
64
10000h-1FFFFh
1
Main Block
64
00000h-0FFFFh
0
Main Block
7/39
M50FW002
BUS OPERATIONS
The two interfaces have similar bus operations but
the signals and timings are completely different.
The Firmware Hub (FWH) Interface is the usual
interface and all of the functionality of the part is
available through this interface. Only a subset of
functions are available through the Address/
Address Multiplexed (A/A Mux) Interface.
Follow the section Firmware Hub (FWH) Bus
Operations below and the section Address/
Address Multiplexed (A/A Mux) Interface Bus
Operations below for a description of the bus
operations on each interface.
Firmware Hub (FWH) Bus Operations
The Firmware Hub (FWH) Interface consists of
four data signals (FWH0-FWH3), one control line
(FWH4) and a clock (CLK). In addition protection
against accidental or malicious data corruption
can be achieved using two further signals (TBL
and WP). Finally two reset signals (RP and INIT)
are available to put the memory into a known
state.
The data signals, control signal and clock are
designed to be compatible with PCI electrical
specifications. The interface operates with clock
speeds up to 33MHz.
The following operations can be performed using
the appropriate bus cycles: Bus Read, Bus Write,
Standby, Reset and Block Protection.
Bus Read. Bus Read operations read from the
memory cells, specific registers in the Command
Interface or Firmware Hub Registers. A valid Bus
Read operation starts when Input Communication
Frame, FWH4, is Low, VIL, as Clock rises and the
correct Start cycle is on FWH0-FWH3. On the
following clock cycles the Host will send the
Memory ID Select, Address and other control bits
on FWH0-FWH3. The memory responds by
outputting Sync data until the wait-states have
elapsed followed by Data0-Data3 and Data4Data7.
Refer to Table 4, FWH Bus Read Field Definitions,
and Figure 5, FWH Bus Read Waveforms (1-byte),
for a description of the Field definitions for each
clock cycle of the transfer. See Table 16, AC Measurement Conditions (FWH Interface), and Figure
10, AC Signal Timing Waveforms (FWH Interface),
for details on the timings of the signals.
Bus Write. Bus Write operations write to the
Command Interface or Firmware Hub Registers. A
8/39
valid Bus Write operation starts when Input
Communication Frame, FWH4, is Low, V IL, as
Clock rises and the correct Start cycle is on
FWH0-FWH3. On the following Clock cycles the
Host will send the Memory ID Select, Address,
other control bits, Data0-Data3 and Data4-Data7
on FWH0-FWH3. The memory outputs Sync data
until the wait-states have elapsed.
Refer to Table 5, FWH Bus Write Field Definitions,
and Figure 6, FWH Bus Write Waveforms, for a
description of the Field definitions for each clock
cycle of the transfer. See Table 16, AC
Measurement Conditions (FWH Interface), and
Figure 10, AC Signal Timing Waveforms (FWH
Interface), for details on the timings of the signals.
Bus Abort. The Bus Abort operation can be used
to immediately abort the current bus operation. A
Bus Abort occurs when FWH4 is driven Low, VIL,
during the bus operation; the memory will tri-state
the Input/Output Communication pins, FWH0FWH3.
Note that, during a Bus Write operation, the
Command Interface starts executing the
command as soon as the data is fully received; a
Bus Abort during the final TAR cycles is not
guaranteed to abort the command; the bus,
however, will be released immediately.
Standby. When FWH4 is High, VIH, the memory
is put into Standby mode where FWH0-FWH3 are
put into a high-impedance state and the Supply
Current is reduced to the Standby level, ICC1.
Reset. During Reset mode all internal circuits are
switched off, the memory is deselected and the
outputs are put in high-impedance. The memory is
in Reset mode when Interface Reset, RP, or CPU
Reset, INIT, is Low, VIL. RP or INIT must be held
Low, VIL, for tPLPH. The memory resets to Read
mode upon return from Reset mode and the Lock
Registers return to their default states regardless
of their state before Reset, see Table 12. If RP or
INIT goes Low, VIL, during a Program or Erase
operation, the operation is aborted and the
memory cells affected no longer contain valid
data; the memory can take up to tPLRH to abort a
Program or Erase operation.
Block Protection. Block Protection can be
forced using the signals Top Block Lock, TBL, and
Write Protect, WP, regardless of the state of the
Lock Registers.
M50FW002
Table 4. FWH Bus Read Field Definitions
Clock
Cycle
Number
Clock Cycle
Count
Field
FWH0FWH3
Memory
I/O
Description
1
1
START
1101b
I
On the rising edge of CLK with FWH4 Low, the contents
of FWH0-FWH3 indicate the start of a FWH Read cycle.
2
1
IDSEL
XXXX
I
Indicates which FWH Flash Memory is selected. The
value on FWH0-FWH3 is compared to the IDSEL
strapping on the FWH Flash Memory pins to select
which FWH Flash Memory is being addressed.
3-9
7
ADDR
XXXX
I
A 28-bit address phase is transferred starting with the
most significant nibble first.
10
1
MSIZE
0X0Xb
I
Indicates how many bytes will be transferred during
multi-byte read operations. The FWH Flash Memory
supports 1-byte (0000b), 16-byte (0100b) and 32-byte
(0101b) transfers.
11
1
TAR
1111b
I
The host drives FWH0-FWH3 to 1111b to indicate a
turnaround cycle.
12
1
TAR
1111b (float)
O
The FWH Flash Memory takes control of FWH0-FWH3
during this cycle.
13-14
2
WSYNC
0101b
O
The FWH Flash Memory drives FWH0-FWH3 to 0101b
(short wait-sync) for two clock cycles, indicating that the
data is not yet available. Two wait-states are always
included.
15
1
RSYNC
0000b
O
The FWH Flash Memory drives FWH0-FWH3 to 0000b,
indicating that data will be available during the next
clock cycle.
16-17
2
DATA
XXXX
O
Data transfer is two CLK cycles, starting with the least
significant nibble.
17+
5(2n-1)
0 (1-byte)
75 (16-byte)
155 (32-byte)
MULTIBYTE
2 WSYNC
+
1 RSYNC
+
2 DATA
O
For each subsequent byte of data repeat cycles 13-17
(2WSYNC + 1RSYNC + 2DATA) 2n-1 times. The FWH
Flash Memory supports n = 0000b (1-byte), n = 0100b
(16-byte) and n = 0101b (32-byte) reads.
Previous
+1
1
TAR
1111b
O
The FWH Flash Memory drives FWH0-FWH3 to 1111b
to indicate a turnaround cycle.
Previous
+1
1
TAR
1111b
(float)
N/A
The FWH Flash Memory floats its outputs, the host
takes control of FWH0-FWH3.
Figure 5. FWH Bus Read Waveforms (1-byte)
CLK
FWH4
FWH0-FWH3
Number of
clock cycles
START
IDSEL
ADDR
MSIZE
TAR
SYNC
DATA
TAR
1
1
7
1
2
3
2
2
AI03437
9/39
M50FW002
Table 5. FWH Bus Write Field Definitions
Clock
Cycle
Number
Clock
Cycle
Count
Field
FWH0FWH3
Memory
I/O
1
1
START
1110b
I
On the rising edge of CLK with FWH4 Low, the contents of
FWH0-FWH3 indicate the start of a FWH Write Cycle.
2
1
IDSEL
XXXX
I
Indicates which FWH Flash Memory is selected. The value
on FWH0-FWH3 is compared to the IDSEL strapping on the
FWH Flash Memory pins to select which FWH Flash
Memory is being addressed.
3-9
7
ADDR
XXXX
I
A 28-bit address phase is transferred starting with the most
significant nibble first.
10
1
MSIZE
0000b
I
Always 0000b (single byte transfer).
11-12
2
DATA
XXXX
I
Data transfer is two cycles, starting with the least significant
nibble.
13
1
TAR
1111b
I
The host drives FWH0-FWH3 to 1111b to indicate a
turnaround cycle.
14
1
TAR
1111b
(float)
O
The FWH Flash Memory takes control of FWH0-FWH3
during this cycle.
15
1
SYNC
0000b
O
The FWH Flash Memory drives FWH0-FWH3 to 0000b,
indicating it has received data or a command.
16
1
TAR
1111b
O
The FWH Flash Memory drives FWH0-FWH3 to 1111b,
indicating a turnaround cycle.
17
1
TAR
1111b
(float)
N/A
Description
The FWH Flash Memory floats its outputs and the host takes
control of FWH0-FWH3.
Figure 6. FWH Bus Write Waveforms
CLK
FWH4
FWH0-FWH3
Number of
clock cycles
START
IDSEL
ADDR
MSIZE
DATA
TAR
SYNC
TAR
1
1
7
1
2
2
1
2
AI03441
10/39
M50FW002
Address/Address Multiplexed (A/A Mux) Bus
Operations
The Address/Address Multiplexed (A/A Mux)
Interface has a more traditional style interface.
The signals consist of a multiplexed address
signals (A0-A10), data signals, (DQ0-DQ7) and
three control signals (RC, G, W). An additional
signal, RP, can be used to reset the memory.
The Address/Address Multiplexed (A/A Mux)
Interface is included for use by Flash
Programming equipment for faster factory
programming. Only a subset of the features
available to the Firmware Hub (FWH) Interface are
available; these include all the Commands but
exclude the Security features and other registers.
The following operations can be performed using
the appropriate bus cycles: Bus Read, Bus Write,
Output Disable and Reset.
When the Address/Address Multiplexed (A/A Mux)
Interface is selected all the blocks are
unprotected. It is not possible to protect any blocks
through this interface.
Bus Read. Bus Read operations are used to
output the contents of the Memory Array, the
Electronic Signature and the Status Register. A
valid Bus Read operation begins by latching the
Row Address and Column Address signals into
the memory using the Address Inputs, A0-A10,
and the Row/Column Address Select RC. Then
Write Enable (W) and Interface Reset (RP) must
be High, V IH, and Output Enable, G, Low, VIL, in
order to perform a Bus Read operation. The Data
Inputs/Outputs will output the value, see Figure
12, Read AC Waveforms (A/A Mux Interface), and
Table 24, A/A Mux Interface Read AC
Characteristics, for details of when the output
becomes valid.
Bus Write. Bus Write operations write to the
Command Interface. A valid Bus Write operation
begins by latching the Row Address and Column
Address signals into the memory using the
Address Inputs, A0-A10, and the Row/Column
Address Select RC. The data should be set up on
the Data Inputs/Outputs; Output Enable, G, and
Interface Reset, RP, must be High, VIH and Write
Enable, W, must be Low, V IL. The Data Inputs/
Outputs are latched on the rising edge of Write
Enable, W. See Figure 13, and Table 25, A/A Mux
Interface Write AC Characteristics, for details of
the timing requirements.
Output Disable. The data outputs are high-impedance when the Output Enable, G, is at VIH.
Reset. During Reset mode all internal circuits are
switched off, the memory is deselected and the
outputs are put in high-impedance. The memory is
in Reset mode when RP is Low, VIL. RP must be
held Low, VIL for tPLPH. If RP is goes Low, VIL,
during a Program or Erase operation, the
operation is aborted and the memory cells affected
no longer contain valid data; the memory can take
up to tPLRH to abort a Program or Erase operation.
Table 6. A/A Mux Bus Operations
G
W
RP
VPP
DQ7-DQ0
Bus Read
VIL
VIH
VIH
Don’t Care
Data Output
Bus Write
VIH
VIL
VIH
VCC or VPPH
Data Input
Output Disable
VIH
VIH
VIH
Don’t Care
Hi-Z
VIL or VIH
VIL or VIH
VIL
Don’t Care
Hi-Z
Operation
Reset
Table 7. Manufacturer and Device Codes
G
W
RP
A17-A1
A0
DQ7-DQ0
Manufacturer Code
VIL
VIH
VIH
VIL
VIL
20h
Device Code
VIL
VIH
VIH
VIL
VIH
29h
Operation
11/39
M50FW002
Command
Cycles
Table 8. Commands
Bus Write Operations
1st
2nd
Addr
Data
3rd
Addr
Data
Read Memory Array
1
X
FFh
Read Status Register
1
X
70h
1
X
90h
1
X
98h
2
X
40h
PA
PD
2
X
10h
PA
PD
Quadruple Byte Program
5
X
30h
A1
PD
Chip Erase
2
X
80h
X
10h
Block Erase
2
X
20h
BA
D0h
Clear Status Register
1
X
50h
Program/Erase Suspend
1
X
B0h
Program/Erase Resume
1
X
D0h
1
X
00h
1
X
01h
1
X
60h
1
X
2Fh
1
X
C0h
4th
5th
Addr
Data
Addr
Data
Addr
Data
A2
PD
A3
PD
A4
PD
Read Electronic Signature
Program
Invalid/Reserved
Note: X Don’t Care, PA Program Address, PD Program Data, A1,2,3,4 Consecutive Addresses, BA Any address in the Block.
Read Memory Array: After a Read Memory Array command, read the memory as normal until another command is issued.
Read Status Register: After a Read Status Register command, read the Status Register as normal until another command is issued.
Read Electronic Signature: After a Read Electronic Signature command, read Manufacturer Code, Device Code until another command is issued.
Block Erase, Byte Program: After these commands, read the Status Register until the command completes and another command
is issued.
Quadruple Byte Program: This command is only valid in A/A Mux mode. Addresses A1, A2, A3 and A4 must be consecutive addresses
differing only for address bit A0 and A1. After this command read the Status Register until the command completes and another command is issued.
Chip Erase: This command is only valid in A/A Mux mode. After this command, read the Status Register until the command completes
and another command is issued.
Clear Status Register: After the Clear Status Register command bits 1, 3, 4 and 5 in the Status Register are reset to ‘0’.
Program/Erase Suspend: After the Program/Erase Suspend command has been accepted, issue Read Memory Array, Read Status
Register, Program (during Erase suspend) and Program/Erase resume commands.
Program/Erase Resume: After the Program/Erase Resume command the suspended Program/Erase operation resumes, read the
Status Register until the Program/Erase Controller completes and the memory returns to Read Mode.
Invalid/Reserved: Do not use Invalid or Reserved commands.
12/39
M50FW002
COMMAND INTERFACE
All Bus Write operations to the memory are
interpreted
by
the
Command
Interface.
Commands consist of one or more sequential Bus
Write operations.
After power-up or a Reset operation the memory
enters Read mode.
The commands are summarized in Table 8,
Commands. Refer to Table 8 in conjunction with
the text descriptions below.
Read Memory Array Command. The Read Memory Array command returns the memory to its
Read mode where it behaves like a ROM or
EPROM. One Bus Write cycle is required to issue
the Read Memory Array command and return the
memory to Read mode. Once the command is issued the memory remains in Read mode until another command is issued. From Read mode Bus
Read operations will access the memory array.
While the Program/Erase Controller is executing a
Program or Erase operation the memory will not
accept the Read Memory Array command until the
operation completes.
Read Status Register Command. The Read Status Register command is used to read the Status
Register. One Bus Write cycle is required to issue
the Read Status Register command. Once the
command is issued subsequent Bus Read operations read the Status Register until another command is issued. See the section on the Status
Register for details on the definitions of the Status
Register bits.
Read Electronic Signature Command. The Read
Electronic Signature command is used to read the
Manufacturer Code and the Device Code. One
Bus Write cycle is required to issue the Read
Electronic Signature command. Once the
command is issued subsequent Bus Read
operations read the Manufacturer Code or the
Device Code until another command is issued.
After the Read Electronic Signature Command is
issued the Manufacturer Code and Device Code
can be read using Bus Read operations using the
addresses in Table 9.
Table 9. Read Electronic Signature
Code
Address
Data
Manufacturer Code
00000h
20h
Device Code
00001h
29h
Program Command. The Program command
can be used to program a value to one address in
the memory array at a time. Two Bus Write
operations are required to issue the command; the
second Bus Write cycle latches the address and
data in the internal state machine and starts the
Program/Erase Controller. Once the command is
issued subsequent Bus Read operations read the
Status Register. See the section on the Status
Register for details on the definitions of the Status
Register bits.
If the address falls in a protected block then the
Program operation will abort, the data in the
memory array will not be changed and the Status
Register will output the error.
During the Program operation the memory will
only accept the Read Status Register command
and the Program/Erase Suspend command. All
other commands will be ignored. Typical Program
times are given in Table 22.
Note that the Program command cannot change a
bit set at ‘0’ back to ‘1’ and attempting to do so will
not cause any modification on its value. One of the
Erase commands must be used to set all of the
bits in the block to ‘1’.
See Figure 14, Program Flowchart and Pseudo
Code, for a suggested flowchart on using the
Program command.
Quadruple Byte Program Command. The Quadruple Byte Program Command can be only used
in A/A Mux mode to program four adjacent bytes
in the memory array at a time. The four bytes must
differ only for the addresses A0 and A1.
Programming should not be attempted when VPP
is not at V PPH. The operation can also be executed
if V PP is below VPPH, but result could be uncertain.
Five Bus Write operations are required to issue the
command. The second, the third and the fourth
Bus Write cycle latches respectively the address
and data of the first, the second and the third byte
in the internal state machine. The fifth Bus Write
cycle latches the address and data of the fourth
byte in the internal state machine and starts the
Program/Erase Controller. Once the command is
issued subsequent Bus Read operations read the
Status Register. See the section on the Status
Register for details on the definitions of the Status
Register bits.
During the Quadruple Byte Program operation the
memory will only accept the Read Status register
command and the Program/Erase Suspend command. All other commands will be ignored. Typical
Quadruple Byte Program times are given in Table
22.
Note that the Quadruple Byte Program command
cannot change a bit set to ‘0’ back to ‘1’ and
attempting to do so will not cause any modification
on its value. An Erase command must be used to
set all of the bits in the block to ‘1’.
See Figure 15, Quadruple Byte Program Flowchart and Pseudo Code (A/A Mux Interface Only),
13/39
M50FW002
for a suggested flowchart on using the Quadruple
Byte Program command.
Chip Erase Command. The Chip Erase command can be used in A/A Mux mode to erase the
entire chip at a time. Erasing should not be attempted when VPP is not at VPPH. The operation
can also be executed if V PP is below VPPH, but result could be uncertain. Two Bus Write operations
are required to issue the command and start the
Program/Erase Controller. Once the command is
issued, subsequent Bus Read operations read the
Status Register. (See the section on the Status
Register for details of the definitions of the Status
Register bits.)
During the Chip Erase operation, the memory only
accepts the Read Status Register command. All
other commands are ignored.
Typical Chip Erase times are given in Table 22.
The Chip Erase command sets all of the bits in the
memory to ‘1’. See Figure 17, Chip Erase Flowchart and Pseudo Code, for a suggested flowchart
when using the Chip Erase command.
Block Erase Command. The Block Erase command can be used to erase a block. Two Bus Write
operations are required to issue the command; the
second Bus Write cycle latches the block address
in the internal state machine and starts the Program/Erase Controller. Once the command is issued subsequent Bus Read operations read the
Status Register. See the section on the Status
Register for details on the definitions of the Status
Register bits.
If the block is protected then the Erase operation
will abort, the data in the block will not be changed
and the Status Register will output the error.
During the Erase operation the memory only
accepts the Read Status Register command and
the Program/Erase Suspend command. All other
commands are ignored. Typical Erase times are
given in Table 22.
The Erase command sets all of the bits in the block
to ‘1’. All previous data in the block is lost.
See Figure 18, for a suggested flowchart on using
the Erase command.
Clear Status Register Command. The Clear Status Register command can be used to reset bits 1,
3, 4 and 5 in the Status Register to ‘0’. One Bus
Write is required to issue the Clear Status Register
command. Once the command is issued the memory returns to its previous mode, subsequent Bus
Read operations continue to output the same data.
14/39
The bits in the Status Register are sticky and do
not automatically return to ‘0’ when a new Program
or Erase command is issued. If an error occurs
then it is essential to clear any error bits in the Status Register by issuing the Clear Status Register
command before attempting a new Program or
Erase command.
Program/Erase Suspend Command. The
Program/Erase Suspend command can be used to
pause a Program or Erase operation. One Bus
Write cycle is required to issue the Program/Erase
Suspend command and pause the Program/Erase
Controller. Once the command is issued it is necessary to poll the Program/Erase Controller Status
bit to find out when the Program/Erase Controller
has paused; no other commands will be accepted
until the Program/Erase Controller has paused.
After the Program/Erase Controller has paused,
the memory will continue to output the Status Register until another command is issued.
During the polling period between issuing the
Program/Erase Suspend command and the
Program/Erase Controller pausing it is possible for
the operation to complete. Once Program/Erase
Controller Status bit indicates that the Program/
Erase Controller is no longer active, the Program
Suspend Status bit or the Erase Suspend Status
bit can be used to determine if the operation has
completed or is suspended. For timing on the
delay between issuing the Program/Erase
Suspend command and the Program/Erase
Controller pausing see Table 22.
During Program/Erase Suspend the Read
Memory Array, Read Status Register, Read
Electronic Signature and Program/Erase Resume
commands will be accepted by the Command
Interface. Additionally, if the suspended operation
was Erase then the Program command will also be
accepted; only the blocks not being erased may be
read or programmed correctly.
See Figures 16, Program Suspend and Resume
Flowchart, and Pseudo Code, and 19, Erase
Suspend and Resume Flowchart, and Pseudo
Code, for suggested flowcharts on using the
Program/Erase Suspend command.
Program/Erase Resume Command. The
Program/Erase Resume command can be used to restart the Program/Erase Controller after a
Program/Erase Suspend has paused it. One Bus
Write cycle is required to issue the Program/Erase
Resume command. Once the command is issued
subsequent Bus Read operations read the Status
Register.
M50FW002
STATUS REGISTER
The Status Register provides information on the
current or previous Program or Erase operation.
Different bits in the Status Register convey
different information and errors on the operation.
To read the Status Register the Read Status
Register command can be issued. The Status
Register is automatically read after Program,
Erase and Program/Erase Resume commands
are issued. The Status Register can be read from
any address.
The Status Register bits are summarized in Table
10, Status Register Bits. Refer to Table 10 in conjunction with the text descriptions below.
Program/Erase Controller Status (Bit 7). The Program/Erase Controller Status bit indicates whether
the Program/Erase Controller is active or inactive.
When the Program/Erase Controller Status bit is
‘0’, the Program/Erase Controller is active; when
the bit is ‘1’, the Program/Erase Controller is inactive.
The Program/Erase Controller Status is ‘0’ immediately after a Program/Erase Suspend command
is issued until the Program/Erase Controller pauses. After the Program/Erase Controller pauses the
bit is ‘1’.
During Program and Erase operation the Program/Erase Controller Status bit can be polled to
find the end of the operation. The other bits in the
Status Register should not be tested until the Program/Erase Controller completes the operation
and the bit is ‘1’.
After the Program/Erase Controller completes its
operation the Erase Status, Program Status, VPP
Status and Block Protection Status bits should be
tested for errors.
Erase Suspend Status (Bit 6). The Erase Suspend Status bit indicates that an Erase operation
has been suspended and is waiting to be resumed. The Erase Suspend Status should only be
considered valid when the Program/Erase Controller Status bit is ‘1’ (Program/Erase Controller
inactive); after a Program/Erase Suspend command is issued the memory may still complete the
operation rather than entering the Suspend mode.
When the Erase Suspend Status bit is ‘0’ the Program/Erase Controller is active or has completed
its operation; when the bit is ‘1’ a Program/Erase
Suspend command has been issued and the
memory is waiting for a Program/Erase Resume
command.
When a Program/Erase Resume command is issued the Erase Suspend Status bit returns to ‘0’.
Erase Status (Bit 5). The Erase Status bit can be
used to identify if the memory has applied the
maximum number of erase pulses to the block and
still failed to verify that the block has erased correctly. The Erase Status bit should be read once
the Program/Erase Controller Status bit is ‘1’ (Program/Erase Controller inactive).
When the Erase Status bit is ‘0’ the memory has
successfully verified that the block has erased correctly; when the Erase Status bit is ‘1’ the Program/Erase Controller has applied the maximum
number of pulses to the block and still failed to verify that the block has erased correctly.
Once the Erase Status bit is set to ‘1’ it can only be
reset to ‘0’ by a Clear Status Register command or
a hardware reset. If it is set to ‘1’ it should be reset
before a new Program or Erase command is issued, otherwise the new command will appear to
fail.
Program Status (Bit 4). The Program Status bit
can be used to identify if the memory has applied
the maximum number of program pulses to the
byte and still failed to verify that the byte has programmed correctly. The Program Status bit should
be read once the Program/Erase Controller Status
bit is ‘1’ (Program/Erase Controller inactive).
When the Program Status bit is ‘0’ the memory has
successfully verified that the byte has programmed correctly; when the Program Status bit is
‘1’ the Program/Erase Controller has applied the
maximum number of pulses to the byte and still
failed to verify that the byte has programmed correctly.
Once the Program Status bit is set to ‘1’ it can only
be reset to ‘0’ by a Clear Status Register command or a hardware reset. If it is set to ‘1’ it should
be reset before a new Program or Erase command
is issued, otherwise the new command will appear
to fail.
VPP Status (Bit 3). The VPP Status bit can be
used to identify an invalid voltage on the VPP pin
during Program and Erase operations. The VPP
pin is only sampled at the beginning of a Program
or Erase operation. Indeterminate results can occur if VPP becomes invalid during a Program or
Erase operation.
When the VPP Status bit is ‘0’ the voltage on the
VPP pin was sampled at a valid voltage; when the
VPP Status bit is ‘1’ the V PP pin has a voltage that
is below the V PP Lockout Voltage, VPPLK, the
memory is protected; Program and Erase operation cannot be performed.
Once the VPP Status bit set to ‘1’ it can only be reset to ‘0’ by a Clear Status Register command or a
hardware reset. If it is set to ‘1’ it should be reset
before a new Program or Erase command is issued, otherwise the new command will appear to
fail.
15/39
M50FW002
Program Suspend Status (Bit 2). The Program
Suspend Status bit indicates that a Program operation has been suspended and is waiting to be resumed. The Program Suspend Status should only
be considered valid when the Program/Erase
Controller Status bit is ‘1’ (Program/Erase Controller inactive); after a Program/Erase Suspend command is issued the memory may still complete the
operation rather than entering the Suspend mode.
When the Program Suspend Status bit is ‘0’ the
Program/Erase Controller is active or has completed its operation; when the bit is ‘1’ a Program/
Erase Suspend command has been issued and
the memory is waiting for a Program/Erase Resume command.
When a Program/Erase Resume command is issued the Program Suspend Status bit returns to
‘0’.
Block Protection Status (Bit 1). The Block Protection Status bit can be used to identify if the Pro-
gram or Erase operation has tried to modify the
contents of a protected block. When the Block Protection Status bit is to ‘0’ no Program or Erase operations have been attempted to protected blocks
since the last Clear Status Register command or
hardware reset; when the Block Protection Status
bit is ‘1’ a Program or Erase operation has been attempted on a protected block.
Once it is set to ‘1’ the Block Protection Status bit
can only be reset to ‘0’ by a Clear Status Register
command or a hardware reset. If it is set to ‘1’ it
should be reset before a new Program or Erase
command is issued, otherwise the new command
will appear to fail.
Using the A/A Mux Interface the Block Protection
Status bit is always ‘0’.
Reserved (Bit 0). Bit 0 of the Status Register is
reserved. Its value should be masked.
Table 10. Status Register Bits
Operation
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Program active
‘0’
X1
‘0’
‘0’
‘0’
‘0’
‘0’
Program suspended
‘1
X1
‘0’
‘0’
‘0’
‘1’
‘0’
Program completed successfully
‘1’
X1
‘0’
‘0’
‘0’
‘0’
‘0’
Program failure due to VPP Error
‘1’
X1
‘0’
‘0’
‘1’
‘0’
‘0’
Program failure due to Block Protection (FWH Interface only)
‘1’
X1
‘0’
‘0’
‘0’
‘0’
‘1’
Program failure due to cell failure
‘1’
X1
‘0’
‘1’
‘0’
‘0’
‘0’
Erase active
‘0’
‘0’
‘0’
‘0’
‘0’
‘0’
‘0’
Block Erase suspended
‘1’
‘1’
‘0’
‘0’
‘0’
‘0’
‘0’
Erase completed successfully
‘1’
‘0’
‘0’
‘0’
‘0’
‘0’
‘0’
Erase failure due to VPP Error
‘1’
‘0’
‘0’
‘0’
‘1’
‘0’
‘0’
Block Erase failure due to Block Protection (FWH Interface
only)
‘1’
‘0’
‘0’
‘0’
‘0’
‘0’
‘1’
Erase failure due to failed cell(s)
‘1’
‘0’
‘1’
‘0’
‘0’
‘0’
‘0’
Note: 1. For Program operations during Erase Suspend Bit 6 is ‘1’, otherwise Bit 6 is ‘0’.
16/39
M50FW002
FIRMWARE HUB (FWH) INTERFACE CONFIGURATION REGISTERS
Read Lock. The Read Lock bit determines
When the Firmware Hub Interface is selected sevwhether the contents of the Block can be read
eral additional registers can be accessed. These
(from Read mode). When the Read Lock Bit is set,
registers control the protection status of the
‘1’, the block is read protected; any operation that
Blocks, read the General Purpose Input pins and
attempts to read the contents of the block will read
identify the memory using the Electronic Signature
00h instead. When the Read Lock Bit is reset, ‘0’,
codes. See Table 11 for the memory map of the
read operations in the Block return the data proConfiguration Registers.
grammed into the block as expected.
Lock Registers
After power-up or reset the Read Lock Bit is alThe Lock Registers control the protection status of
ways reset to ‘0’ (not read protected).
the Blocks. Each Block has its own Lock Register.
Three bits within each Lock Register control the
Lock Down. The Lock Down Bit provides a
protection of each block, the Write Lock Bit, the
mechanism for protecting software data from simRead Lock Bit and the Lock Down Bit.
ple hacking and malicious attack. When the Lock
Down Bit is set, ‘1’, further modification to the
The Lock Registers can be read and written,
Write Lock, Read Lock and Lock Down Bits cannot
though care should be taken when writing as, once
be performed. A reset or power-up is required bethe Lock Down Bit is set, ‘1’, further modifications
fore changes to these bits can be made. When the
to the Lock Register cannot be made until cleared,
Lock Down Bit is reset, ‘0’, the Write Lock, Read
to ‘0’, by a reset or power-up.
Lock and Lock Down Bits can be changed.
See Table 12 for details on the bit definitions of the
Firmware Hub (FWH) General Purpose Input
Lock Registers.
Register
Write Lock. The Write Lock Bit determines
The Firmware Hub (FWH) General Purpose Input
whether the contents of the Block can be modified
Register holds the state of the Firmware Hub Inter(using the Program or Erase Command). When
face General Purpose Input pins, FGPI0-FGPI4.
the Write Lock Bit is set, ‘1’, the block is write proWhen this register is read, the state of these pins
tected; any operations that attempt to change the
is returned. This register is read-only and writing to
data in the block will fail and the Status Register
it has no effect.
will report the error. When the Write Lock Bit is reset, ‘0’, the block is not write protected through the
The signals on the Firmware Hub Interface GenerLock Register and may be modified unless write
al Purpose Input pins should remain constant
protected through some other means.
throughout the whole Bus Read cycle in order to
guarantee that the correct data is read.
When V PP is less than VPPLK all blocks are protected and cannot be modified, regardless of the
Manufacturer Code Register
state of the Write Lock Bit. If Top Block Lock, TBL,
Reading the Manufacturer Code Register returns
is Low, V IL, then the Top Block (Block 6) is write
the manufacturer code for the memory. The manprotected and cannot be modified. Similarly, if
ufacturer code for STMicroelectronics is 20h. This
Write Protect, WP, is Low, VIL, then the blocks 0 to
register is read-only and writing to it has no effect.
5 are write protected and cannot be modified.
Device Code Register
After power-up or reset the Write Lock Bit is alReading the Device Code Register returns the deways set to ‘1’ (write protected).
vice code for the memory (29h). This register is
read-only and writing to it has no effect.
17/39
M50FW002
Table 11. Firmware Hub Register Configuration Map (1)
Memory
Address
Default
Value
Access
Top Block Lock Register (Block 6)
FBFC002h
01h
R/W
T_MINUS01_LK
Top Block [-1] Lock Register (Block 5)
FBFA002h
01h
R/W
T_MINUS02_LK
Top Block [-2] Lock Register (Block 4)
FBF8002h
01h
R/W
T_MINUS03_LK
Top Block [-3] Lock Register (Block 3)
FBF0002h
01h
R/W
T_MINUS04_LK
Top Block [-4] Lock Register (Block 2)
FBE0002h
01h
R/W
T_MINUS05_LK
Top Block [-5] Lock Register (Block 1)
FBD0002h
01h
R/W
T_MINUS06_LK
Top Block [-6] Lock Register (Block 0)
FBC0002h
01h
R/W
Firmware Hub (FWH) General Purpose Input Register
FBC0100h
N/A
R
Manufacturer Code Register
FBC0000h
20h
R
Device Code Register
FBC0001h
29h
R
Mnemonic
T_BLOCK_LK
FGPI_REG
MANUF_REG
DEV_REG
18/39
Register Name
M50FW002
Table 12. Lock Register Bit Definitions(1)
Bit
Bit Name
Value
7-3
2
1
0
Function
Reserved
‘1’
Bus Read operations in this Block always return 00h.
‘0’
Bus read operations in this Block return the Memory Array contents. (Default
value).
‘1’
Changes to the Read-Lock bit and the Write-Lock bit cannot be performed. Once a
‘1’ is written to the Lock-Down bit it cannot be cleared to ‘0’; the bit is always reset
to ‘0’ following a Reset (using RP or INIT) or after power-up.
‘0’
Read-Lock and Write-Lock can be changed by writing new values to them. (Default
value).
‘1’
Program and Erase operations in this Block will set an error in the Status Register.
The memory contents will not be changed. (Default value).
‘0’
Program and Erase operations in this Block are executed and will modify the Block
contents.
Read-Lock
Lock-Down
Write-Lock
Note: 1. Applies to Top Block Lock Register (T_BLOCK_LK) and Top Block [-1] Lock Register (T_MINUS01_LK) to Top Block [-6] Lock Register (T_MINUS06_LK).
Table 13. General Purpose Input Register Definition(1)
Bit
Bit Name
Value
7-5
4
3
2
1
0
Function
Reserved
‘1’
Input Pin FGPI4 is at VIH
‘0’
Input Pin FGPI4 is at VIL
‘1’
Input Pin FGPI3 is at VIH
‘0’
Input Pin FGPI3 is at VIL
‘1’
Input Pin FGPI2 is at VIH
‘0’
Input Pin FGPI2 is at VIL
‘1’
Input Pin FGPI1 is at VIH
‘0’
Input Pin FGPI1 is at VIL
‘1’
Input Pin FGPI0 is at VIH
‘0’
Input Pin FGPI0 is at VIL
FGPI4
FGPI3
FGPI2
FGPI1
FGPI0
Note: 1. Applies to the General Purpose Input Register (FGPI_REG).
19/39
M50FW002
MAXIMUM RATING
Stressing the device above the rating listed in the
Absolute Maximum Ratings table may cause permanent damage to the device. Exposure to Absolute Maximum Rating conditions for extended
periods may affect device reliability. These are
stress ratings only and operation of the device at
these or any other conditions above those indicated in the Operating sections of this specification is
not implied. Refer also to the STMicroelectronics
SURE Program and other relevant quality documents.
Table 14. Absolute Maximum Ratings
Symbol
Parameter
Min
Max
Unit
TBIAS
Temperature Under Bias
–50
125
°C
TSTG
Storage Temperature
–65
150
°C
VIO
Input or Output Voltage (1,2)
–0.6
VCC +0.6
V
VCC
Supply Voltage
–0.6
4
V
VPP
Program Voltage
–0.6
13
V
Note: 1. Minimum voltage may undershoot to –2V during transition and for less than 20ns during transitions.
2. Maximum voltage may overshoot to V CC +2V during transition and for less than 20ns during transitions.
20/39
M50FW002
DC AND AC PARAMETERS
This section summarizes the operating and measurement conditions, and the DC and AC characteristics of the device. The parameters in the DC
and AC Characteristic tables that follow are derived from tests performed under the Measure-
ment Conditions summarized in the relevant
tables. Designers should check that the operating
conditions in their circuit match the measurement
conditions when relying on the quoted parameters.
Table 15. Operating Conditions
Symbol
VCC
Parameter
Min.
Max.
Unit
3.0
3.6
V
Ambient Operating Temperature (range 1)
0
70
°C
Ambient Operating Temperature (range 5)
–20
85
°C
Max.
Unit
Supply Voltage
TA
Figure 7. AC Measurement I/O Waveform (FWH Interface)
0.6 VCC
0.4 VCC
0.2 VCC
Input and Output AC Testing Waveform
IO < ILO
IO > ILO
IO < ILO
Output AC Tri-state Testing Waveform
AI03404
Table 16. AC Measurement Conditions (FWH Interface)
Symbol
CL
Parameter
Load Capacitance
Min.
10
Input Rise and Fall Times
Input Pulse Voltages
Input and Output Timing Reference Voltages
pF
1.4
ns
0.2VCC to 0.6VCC
V
0.4VCC
V
21/39
M50FW002
Figure 8. AC Measurement I/O Waveform (A/A Mux Interface)
3V
1.5V
0V
AI01417
Table 17. AC Measurement Conditions (A/A Mux Interface)
Symbol
CL
Parameter
Min.
Load Capacitance
Max.
30
Input Rise and Fall Times
pF
10
Input Pulse Voltages
Input and Output Timing Reference Voltages
Unit
ns
0 to 3
V
1.5
V
Table 18. Device Impedance
Symbol
Parameter 1
CIN
Input Capacitance 2
VIN = 0V
CCLK
Clock Capacitance 2
VIN = 0V
LPIN
Recommended Pin
Inductance 3
Note: 1. TA=25°C, f=1 MHz
2. Sampled only, not 100% tested
3. See PCI Specification
22/39
Test Condition
Min
3
Max
Unit
13
pF
12
pF
20
nH
M50FW002
Table 19. DC Characteristics
Symbol
VIH
VIL
Parameter
Input High Voltage
Input Low Voltage
Interface
Test Condition
Min
Max
Unit
FWH
0.5 VCC
VCC + 0.5
V
A/A Mux
0.7 VCC
VCC + 0.3
V
FWH
–0.5
0.3 VCC
V
A/A Mux
-0.5
0.8
V
VIH(INIT)
INIT Input High Voltage
FWH
1.35
VCC + 0.5
V
VIL(INIT)
INIT Input Low Voltage
FWH
–0.5
0.2 VCC
V
ILI(2)
Input Leakage Current
0V ≤ VIN ≤ VCC
±10
µA
ILI2
IC, IDx Input Leakage
Current
IC, ID0, ID1, ID2, ID3 = VCC
200
µA
RIL
IC, IDx Input Pull Low
Resistor
100
kΩ
VOH
Output High Voltage
VOL
ILO
20
FWH
IOH = –500µA
0.9 VCC
V
A/A Mux
IOH = –100µA
VCC – 0.4
V
FWH
IOL = 1.5mA
0.1 VCC
V
A/A Mux
IOL = 1.8mA
0.45
V
0V ≤ VOUT ≤ VCC
±10
µA
3
3.6
V
12.6
V
Output Low Voltage
Output Leakage Current
VPP1
VPP Voltage
VPPH
VPP Voltage (Fast
Program/Fast Erase)
11.4
VPPLK(1)
VPP Lockout Voltage
1.5
VLKO(1)
VCC Lockout Voltage
1.8
V
2.3
V
ICC1
Supply Current (Standby)
FWH
FWH4 = 0.9 VCC, VPP = VCC
All other inputs 0.9 VCC to 0.1 VCC
VCC = 3.6V, f(CLK) = 33MHz
100
µA
ICC2
Supply Current (Standby)
FWH
FWH4 = 0.1 VCC, VPP = VCC
All other inputs 0.9 VCC to 0.1 VCC
VCC = 3.6V, f(CLK) = 33MHz
10
mA
ICC3
Supply Current
(Any internal operation
active)
FWH
VCC = VCC max, VPP = VCC
f(CLK) = 33MHz
IOUT = 0mA
60
mA
ICC4
Supply Current (Read)
A/A Mux
G = VIH, f = 6MHz
20
mA
Supply Current
(Program/Erase)
A/A Mux
Program/Erase Controller Active
20
mA
VPP Supply Current
(Read/Standby)
VPP > VCC
400
µA
VPP Supply Current
(Program/Erase active)
VPP = VCC
40
mA
VPP = 12V ± 5%
15
mA
ICC5(1)
IPP
IPP1(1)
Note: 1. Sampled only, not 100% tested.
2. Input leakage currents include High-Z output leakage for all bi-directional buffers with tri-state outputs.
23/39
M50FW002
Table 20. Clock Characteristics (FWH Interface)
Symbol
Parameter
Test Condition
Value
Unit
tCYC
CLK Cycle Time(1)
Min
30
ns
tHIGH
CLK High Time
Min
11
ns
tLOW
CLK Low Time
Min
11
ns
Min
1
V/ns
Max
4
V/ns
CLK Slew Rate
peak to peak
Note: 1. Devices on the PCI Bus must work with any clock frequency between DC and 33MHz. Below 16MHz devices may be guaranteed
by design rather than tested. Refer to PCI Specification.
Figure 9. Clock Waveform (FWH Interface)
tCYC
tHIGH
0.6 VCC
0.5 VCC
0.4 VCC
tLOW
0.4 VCC, p-to-p
(minimum)
0.3 VCC
0.2 VCC
AI03403
24/39
M50FW002
Table 21. AC Signal Timing Characteristics (FWH Interface)
Symbol
PCI
Symbol
tCHQV
tval
CLK to Data Out
tCHQX(1)
ton
tCHQZ
Parameter
Test Condition
Value
Unit
Min
2
ns
Max
11
ns
CLK to Active
(Float to Active Delay)
Min
2
ns
toff
CLK to Inactive
(Active to Float Delay)
Max
28
ns
tAVCH
tDVCH
tsu
Input Set-up Time(2)
Min
7
ns
tCHAX
tCHDX
th
Input Hold Time(2)
Min
0
ns
Note: 1. The timing measurements for Active/Float transitions are defined when the current through the pin equals the leakage current specification.
2. Applies to all inputs except CLK.
Figure 10. AC Signal Timing Waveforms (FWH Interface)
CLK
tCHQV
tCHQZ
tCHQX
FWH0-FWH3
tDVCH
tCHDX
VALID
VALID OUTPUT DATA
FLOAT OUTPUT DATA
VALID INPUT DATA
AI03405
25/39
M50FW002
Table 22. Program and Erase Times
Parameter
Interface
Test Condition
Byte Program
Min
Typ (1)
Max
Unit
10
200
µs
200
µs
Quadruple Byte Program
A/A Mux
VPP = 12V ± 5%
10
Chip Erase
A/A Mux
VPP = 12V ± 5%
3
A/A Mux
VPP = 12V ± 5%
0.1 (2)
5
sec
VPP = VCC
0.4
5
sec
VPP = 12V ± 5%
0.75
8
sec
VPP = VCC
1
10
sec
Program/Erase Suspend to Program pause (3)
5
µs
Program/Erase Suspend to Block Erase pause (3)
30
µs
Block Program (64 KBytes)
sec
Block Erase (64 KBytes)
Note: 1. TA = 25°C, VCC = 3.3V
2. This time is obtained executing the Quadruple Byte Program Command.
3. Sampled only, not 100% tested.
Table 23. Reset AC Characteristics
Symbol
Parameter
tPLPH
RP or INIT Reset Pulse Width
tPLRH
RP or INIT Low to Reset
RP or INIT Slew Rate(1)
tPHFL
RP or INIT High to FWH4 Low
tPHWL
tPHGL
RP High to Write Enable or Output
Enable Low
Note: 1. See Chapter 4 of the PCI Specification.
26/39
Test Condition
Value
Unit
Min
100
ns
Program/Erase Inactive
Max
100
ns
Program/Erase Active
Max
30
µs
Rising edge only
Min
50
mV/ns
FWH Interface only
Min
30
µs
A/A Mux Interface only
Min
50
µs
M50FW002
Figure 11. Reset AC Waveforms
RP, INIT
tPLPH
W, G, FWH4
tPHWL, tPHGL, tPHFL
tPLRH
RB
AI03420
27/39
M50FW002
Table 24. Read AC Characteristics (A/A Mux Interface)
Symbol
Parameter
Test Condition
Value
Unit
tAVAV
Read Cycle Time
Min
250
ns
tAVCL
Row Address Valid to RC Low
Min
50
ns
tCLAX
RC Low to Row Address Transition
Min
50
ns
tAVCH
Column Address Valid to RC high
Min
50
ns
tCHAX
RC High to Column Address Transition
Min
50
ns
tCHQV(1)
RC High to Output Valid
Max
150
ns
tGLQV(1)
Output Enable Low to Output Valid
Max
50
ns
tPHAV
RP High to Row Address Valid
Min
1
µs
tGLQX
Output Enable Low to Output Transition
Min
0
ns
tGHQZ
Output Enable High to Output Hi-Z
Max
50
ns
tGHQX
Output Hold from Output Enable High
Min
0
ns
Note: 1. G may be delayed up to tCHQV – t GLQV after the rising edge of RC without impact on t CHQV.
Figure 12. Read AC Waveforms (A/A Mux Interface)
tAVAV
ROW ADDR VALID
A0-A10
tAVCL
NEXT ADDR VALID
COLUMN ADDR VALID
tAVCH
tCLAX
tCHAX
RC
tCHQV
G
tGLQV
tGHQZ
tGLQX
tGHQX
VALID
DQ0-DQ7
W
tPHAV
RP
AI03406
28/39
M50FW002
Table 25. Write AC Characteristics (A/A Mux Interface)
Symbol
Parameter
Test Condition
Value
Unit
tWLWH
Write Enable Low to Write Enable High
Min
100
ns
tDVWH
Data Valid to Write Enable High
Min
50
ns
tWHDX
Write Enable High to Data Transition
Min
5
ns
tAVCL
Row Address Valid to RC Low
Min
50
ns
tCLAX
RC Low to Row Address Transition
Min
50
ns
tAVCH
Column Address Valid to RC High
Min
50
ns
tCHAX
RC High to Column Address Transition
Min
50
ns
tWHWL
Write Enable High to Write Enable Low
Min
100
ns
tCHWH
RC High to Write Enable High
Min
50
ns
tVPHWH(1)
VPP High to Write Enable High
Min
100
ns
tWHGL
Write Enable High to Output Enable Low
Min
30
ns
tWHRL
Write Enable High to RB Low
Min
0
ns
Output Valid, RB High to VPP Low
Min
0
ns
tQVVPL(1,2)
Note: 1. Sampled only, not 100% tested.
2. Applicable if VPP is seen as a logic input (V PP < 3.6V).
Figure 13. Write AC Waveforms (A/A Mux Interface)
Write erase or
program setup
A0-A10
Write erase confirm or
valid address and data
C1
R2
tCLAX
tAVCH
R1
tAVCL
Automated erase
or program delay
Read Status
Register Data
Ready to write
another command
C2
tCHAX
RC
tWHWL
tWLWH
tCHWH
W
tVPHWH
tWHGL
G
tWHRL
RB
tQVVPL
VPP
tDVWH
DQ0-DQ7
DIN1
tWHDX
DIN2
VALID SRD
AI04194
29/39
M50FW002
Figure 14. Program Flowchart and Pseudo Code
Start
Program command:
– write 40h or 10h
– write Address & Data
(memory enters read status state after
the Program command)
Write 40h or 10h
Write Address
& Data
do:
–read Status Register if Program/Erase
Suspend command given execute
suspend program loop
NO
Read Status
Register
Suspend
b7 = 1
NO
YES
Suspend
Loop
while b7 = 1
YES
b3 = 0
NO
VPP Invalid
Error (1, 2)
If b3 = 1, VPP invalid error:
– error handler
NO
Program
Error (1, 2)
If b4 = 1, Program error:
– error handler
NO
Program to Protected
Block Error (1, 2)
YES
b4 = 0
YES
FWH
Interface
Only
b1 = 0
If b1 = 1, Program to protected block error:
– error handler
YES
End
AI03407
Note: 1. A Status check of b1 (Protected Block), b3 (V PP invalid) and b4 (Program Error) can be made after each Program operation by
following the correct command sequence.
2. If an error is found, the Status Register must be cleared before further Program/Erase Controller operations.
30/39
M50FW002
Figure 15. Quadruple Byte Program Flowchart and Pseudo Code (A/A Mux Interface Only)
Start
Write 30h
Write Address 1
& Data 1 (3)
Quadruple Byte Program command:
– write 30h
– write Address 1 & Data 1 (3)
– write Address 2 & Data 2 (3)
– write Address 3 & Data 3 (3)
– write Address 4 & Data 4 (3)
Write Address 2
& Data 2 (3)
(memory enters read status state after
the Quadruple Byte Program command)
Write Address 3
& Data 3 (3)
Write Address 4
& Data 4 (3)
do:
– read Status Register if Program/Erase
Suspend command given execute
suspend program loop
NO
Read Status
Register
Suspend
b7 = 1
NO
YES
Suspend
Loop
while b7 = 1
YES
b3 = 0
NO
VPP Invalid
Error (1, 2)
If b3 = 1, VPP invalid error:
– error handler
NO
Program
Error (1, 2)
If b4 = 1, Program error:
– error handler
YES
b4 = 0
YES
End
AI03982
Note: 1. A Status check of b3 (VPP invalid) and b4 (Program Error) can be made after each Program operation by following the correct command sequence.
2. If an error is found, the Status Register must be cleared before further Program/Erase Controller operations.
3. Address 1, Address 2, Address 3 and Address 4 must be consecutive addresses differing only for address bits A0 and A1.
31/39
M50FW002
Figure 16. Program Suspend and Resume Flowchart, and Pseudo Code
Start
Write B0h
Program/Erase Suspend command:
– write B0h
– write 70h
Write 70h
do:
– read Status Register
Read Status
Register
b7 = 1
NO
while b7 = 1
YES
b2 = 1
NO
Program Complete
If b2 = 0 Program completed
YES
Write a read
Command
Read data from
another address
Write D0h
Write FFh
Program Continues
Read Data
Program/Erase Resume command:
– write D0h to resume the program
– if the Program operation completed
then this is not necessary.
The device returns to Read as
normal (as if the Program/Erase
suspend was not issued).
AI03408
32/39
M50FW002
Figure 17. Chip Erase Flowchart and Pseudo Code (A/A Mux Interface Only)
Start
Chip Erase command:
– write 80h
– write 10h
(memory enters read Status Register after
the Chip Erase command)
Write 80h
Write 10h
do:
– read Status Register
Read Status
Register
b7 = 1
NO
while b7 = 1
YES
b3 = 0
NO
VPP Invalid
Error (1)
NO
Command
Sequence Error (1)
If b3 = 1, VPP invalid error:
– error handler
YES
b4, b5 = 0
If b4, b5 = 1, Command sequence error:
– error handler
YES
b5 = 0
NO
Erase Error (1)
If b5 = 1, Erase error:
– error handler
YES
End
AI04195
Note: 1. If an error is found, the Status Register must be cleared before further Program/Erase Controller operations.
33/39
M50FW002
Figure 18. Block Erase Flowchart and Pseudo Code
Start
Erase command:
– write 20h
– write Block Address & D0h
(memory enters read Status Register after
the Erase command)
Write 20h
Write Block Address
& D0h
Suspend
b7 = 1
do:
– read Status Register
– if Program/Erase Suspend command
given execute suspend erase loop
NO
Read Status
Register
NO
YES
Suspend
Loop
while b7 = 1
YES
b3 = 0
NO
VPP Invalid
Error (1)
NO
Command
Sequence Error (1)
If b3 = 1, VPP invalid error:
– error handler
YES
b4, b5 = 0
If b4, b5 = 1, Command sequence error:
– error handler
YES
b5 = 0
NO
Erase Error (1)
If b5 = 1, Erase error:
– error handler
YES
FWH
Interface
Only
b1 = 0
NO
Erase to Protected
Block Error (1)
If b1 = 1, Erase to protected block error:
– error handler
YES
End
AI05433
Note: 1. If an error is found, the Status Register must be cleared before further Program/Erase Controller operations.
34/39
M50FW002
Figure 19. Erase Suspend and Resume Flowchart, and Pseudo Code
Start
Write B0h
Program/Erase Suspend command:
– write B0h
– write 70h
Write 70h
do:
– read Status Register
Read Status
Register
b7 = 1
NO
while b7 = 1
YES
b6 = 1
NO
Erase Complete
If b6 = 0, Erase completed
YES
Read data from
another block
or
Program
Write D0h
Write FFh
Erase Continues
Read Data
Program/Erase Resume command:
– write D0h to resume erase
– if the Erase operation completed
then this is not necessary.
The device returns to Read as
normal (as if the Program/Erase
suspend was not issued).
AI03410
35/39
M50FW002
PACKAGE MECHANICAL
PLCC32 – 32 lead Plastic Leaded Chip Carrier, Package Outline
D
D1
A1
A2
1 N
B1
E2
E3
e
E1 E
F
B
0.51 (.020)
E2
1.14 (.045)
A
D3
R
D2
CP
D2
PLCC-A
Note: Drawing is not to scale.
PLCC32 – 32 lead Plastic Leaded Chip Carrier, Package Mechanical Data
Symbol
millimeters
Typ
Min
Max
Min
Max
A
3.18
3.56
0.125
0.140
A1
1.53
2.41
0.060
0.095
A2
0.38
–
0.015
–
B
0.33
0.53
0.013
0.021
B1
0.66
0.81
0.026
0.032
CP
Typ
0.10
0.004
D
12.32
12.57
D1
11.35
11.51
0.447
0.453
D2
4.78
5.66
0.188
0.223
–
–
–
–
E
14.86
15.11
0.585
0.595
E1
13.89
14.05
0.547
0.553
E2
6.05
6.93
0.238
0.273
D3
7.62
0.485
0.300
0.495
E3
10.16
–
–
0.400
–
–
e
1.27
–
–
0.050
–
–
F
0.00
0.13
0.000
0.005
N
32
R
36/39
inches
0.89
–
32
–
0.035
–
–
M50FW002
PART NUMBERING
Table 26. Ordering Information Scheme
Example:
M50FW002
K
1
T
Device Type
M50
Architecture
F = Firmware Hub Interface
Operating Voltage
W = 3.0 to 3.6V
Device Function
002 = 2 Mbit (256Kb x8), Boot Block
Package
K = PLCC32
Temperature Range
1 = 0 to 70 °C
5 = –20 to 85°C
Option
T = Tape & Reel Packing
Devices are shipped from the factory with the memory content bits erased to 1. For a list of available options (Speed, Package, etc...) or for further information on any aspect of this device, please contact your
nearest ST Sales Office.
37/39
M50FW002
REVISION HISTORY
Table 27. Document Revision History
Date
Version
18-Dec-2001
-01
Document released
22-Jan-2002
-02
Details of Chip Erase command added
01-Mar-2002
-03
RFU pins must be left disconnected
12-Mar-2002
-04
Specification of PLCC32 package mechanical data revised
31-May-2002
-05
Document promoted from Product Preview to Preliminary Data
38/39
Revision Details
M50FW002
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is registered trademark of STMicroelectronics
All other names are the property of their respective owners
© 2002 STMicroelectronics - All Rights Reserved
STMicroelectronics group of companies
Australia - Brazil - Canada - China - Finland - France - Germany - Hong Kong India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States.
www.st.com
39/39