MNS Microwave Chip Capacitors MA4M Series MA4M Series MNS Microwave Chip Capacitors Features Case Style • Excellent Repeatability (Wafer-to-Wafer and Lot-to-Lot) • Small Size • Low Loss, High Q • Available with Round or Square Bonding Pads Description M/A-COM’s MA4M series of MNS (metal-nitride-silicon) silicon chip capacitors is designed specifically for high reliability and repeatable performance in microwave circuit applications. These capacitors are made using a low pressure chemical vapor deposition (LPCVD) that results in dense, uniform nitride layers. These capacitors exhibit higher capacitance per unit area (resulting in smaller chip size) than similar MOS, MIS and ceramic capacitors. Evaporated gold contacts are used to provide an easily bondable metal pad on the capacitor chip. M/A-COM MNS capacitors have shown no measurable capacitance change when subjected to the rated standoff voltage of 150ºC. 350 The MA4M series of chip capacitors is an excellent choice for use in hybrid microwave circuits up through Ku-band, where low loss, high reliability, small size and temperature stability are prime concerns. These chip capacitors are suited for applications requiring DC blocks, coupling capacitors, bypass capacitors, capacitive loads and tuning elements in oscillators, multipliers and filters. Comparison of M/A-COM MNS Capacitors to Ceramic Chip Capacitors Characteristics Compared Operating Temperature Range Temperature Coefficient Insertion Loss of a 20 pF Capacitor in a 50 Ω line at 15 GHz Chip Size 200 pF, 100V 20 pF, 100V MNS -55 to +200°C 180 PPM 0.1 dB Ceramic -55 to +125°C 1000 PPM 0.2 dB 40 x 40 mils 22 x 22 mils 70 x 70 mils 50 x 50 mils V3.00 M/A-COM Division of AMP Incorporated ■ North America: Tel. (800) 366-2266, Fax (800) 618-8883 ■ Asia/Pacific: Tel.+85 2 2111 8088, Fax +85 2 2111 8087 ■ Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020 www.macom.com AMP and Connecting at a Higher Level are trademarks. Specifications subject to change without notice. MNS Microwave Chip Capacitors MA4M Series Specifications Chip Capacitors with Round Bonding Pads Model Number Maximum Standoff Capactance Voltage 2,5 1,2,3,4 Rating (pF) (Volts) ± 10 % Chip Capacitors with Square Bonding Pads Chip Style Nominal Top Contact Diameter (mils) Model Number Capactance 1,2,3,4 (pF) ± 10 % Maximum Standoff Voltage 2,5 Rating (Volts) Chip Style MA4M2002 2 200 132 3.5 MA4M3010 10 200 350 MA4M2005 5 200 132 6.0 MA4M3020 20 200 351 MA4M1010 10 100 132 6.0 MA4M3030 30 200 352 MA4M1020 20 100 132 9.0 MA4M3050 50 200 354 MA4M2020 20 200 132 11.5 MA4M3100 100 50 358 MA4M1030 30 100 132 11.0 MA4M3150 150 50 359 MA4M1050 50 100 132 14.0 MA4M1080 80 100 199 18.0 MA4M1100 100 100 199 20.0 MA4M2100 100 200 200 26.0 MA4M1200 200 100 200 28.0 MA4M1250 250 100 200 32.0 MA4M1300 300 100 201 35.0 MA4M2300 300 200 263 45.0 MA4M1600 600 100 263 48.0 Maximum Ratings Applied Voltage Specified standoff voltage Operating Temperature -55°C to +200°C Storage Temperature -55°C to +200°C Notes: 1 5% capacitance tolerance is available on request. 2 Other capacitance and standoff voltage values are available on request. 3 Capacitance is measured at 1 MHz. 4 Temperature coefficient of capacitance is nominally 180 PPM/°C. 5 Device failure may occur if standoff voltage ratio is exceeded. TYPICAL CAPACITANCE CHANGE FOR MNS and CERAMIC CAPACITOR vs TEMPERATURE (200 pF CAPACITOR) +10 % CAPACITANCE CHANGE +8 +6 +4 TEMPERATURE qC -75 -25 0 25 50 -4 125 150 200 M/A-COM MA4M1200 CAPACITOR -6 -8 -10 CERAMIC CAPACITOR V3.00 M/A-COM Division of AMP Incorporated ■ North America: Tel. (800) 366-2266, Fax (800) 618-8883 ■ Asia/Pacific: Tel.+85 2 2111 8088, Fax +85 2 2111 8087 ■ Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020 www.macom.com AMP and Connecting at a Higher Level are trademarks. Specifications subject to change without notice. MNS Microwave Chip Capacitors MA4M Series Chip Case Style MILLIMETERS Style DIM. MIN. MAX. MIN. MAX. 132 A 0.020 0.024 0.51 0.61 B 0.003 0.008 0.08 0.203 A 0.027 0.031 0.69 0.79 B 0.004 0.008 0.10 0.203 A 0.037 0.041 0.94 1.04 B 0.004 0.008 0.10 0.203 A 0.047 0.051 1.19 1.30 B 0.004 0.008 0.10 0.203 A — 0.060 — 1.52 B 0.004 0.008 0.10 0.203 199 C INCHES A 200 201 263 B Note: For “C” dimension on above case styles, see specifications. Chip MILLIMETERS Style DIM. MIN. MAX. MIN. MAX. 350 A 0.018 0.021 0.46 0.53 B — 0.008 — 0.203 C — 0.009 — 0.23 A 0.018 0.021 0.46 0.53 B — 0.008 — 0.203 C — 0.012 — 0.30 A 0.018 0.021 0.46 0.53 B — 0.008 — 0.203 C — 0.015 — 0.38 A 0.020 0.023 0.51 0.58 B — 0.008 — 0.203 C — 0.018 — 0.46 A 0.018 0.021 0.46 0.53 B — 0.008 — 0.203 C — 0.013 — 0.33 A 0.018 0.021 0.46 0.53 B — 0.008 — 0.203 C — 0.016 — 0.41 351 C INCHES A 352 354 B 358 359 V3.00 M/A-COM Division of AMP Incorporated ■ North America: Tel. (800) 366-2266, Fax (800) 618-8883 ■ Asia/Pacific: Tel.+85 2 2111 8088, Fax +85 2 2111 8087 ■ Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020 www.macom.com AMP and Connecting at a Higher Level are trademarks. Specifications subject to change without notice. MNS Microwave Chip Capacitors MA4M Series Bonding and Handling Considerations for MNS Chip Capacitors Handling Conductive Epoxy Normal precautions that are common to the handling of hybrid semiconductors also apply to MNS chip capacitors. Removal of chips from waffle packs and subsequent handling should be done with a vacuum pencil. Pencils equipped with either metallic or nonmetallic tips are acceptable. Any of the conductive epoxies that are available for semiconductor die attachment are acceptable for MNS chip capacitor attachment. Follow the manufacturer’s recommendations for mixing and application carefully. Take care to seat the capacitor on the substrate using a soft implement. Surface Preparation Lead Bonding Each MNS chip and substrate should be free of oils and other surface contamination. Such contaminants may result in poor solder wetting. Cleansing can be done with acetone, alcohol, freon, TMS or other common microelectronic solvents. Burnishing of MNS capacitor chips is not necessary or recommended. Ball, ultrasonic, TC or pulse bonding of the wire or ribbon leads are all acceptable methods. Temperature for the pulse bonder should not exceed 300ºC. Maximum pressure applied to the MNS capacitor chips should not exceed 25 grams for any of the methods used. Proper procedure will result in bond strength that exceeds MIL-STD-883B Method 2011.2 for gold wire or gold ribbon. Solder Soldering temperatures up to 300ºC are acceptable for a duration not greater than 5 seconds for MNS chip capacitors. Any of the common tin-lead-silver, lead-indium, or higher temperature gold alloy solders are acceptable provided that the 300ºC temperature is not exceeded. Pure tin or tin-antimony solders are not recommended. Cleaning of residual flux is required and can be accomplished with a fluorinated or chlorinated solvent. V3.00 M/A-COM Division of AMP Incorporated ■ North America: Tel. (800) 366-2266, Fax (800) 618-8883 ■ Asia/Pacific: Tel.+85 2 2111 8088, Fax +85 2 2111 8087 ■ Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020 www.macom.com AMP and Connecting at a Higher Level are trademarks. Specifications subject to change without notice.