Rev 1; 5/06 Microcontroller with Internal Voltage Regulator, Piezoelectric Horn Driver, and Comparator Features The MAXQ3210 microcontroller is a low-power, 16-bit RISC device that incorporates a driver for a high-output piezoelectric horn/transducer, an analog comparator, and a high-current I/O pin that directly drives an LED. The device is uniquely suited for cost-conscious applications such as chemical detectors, alarm systems, and white goods, but can be used in any application that requires high-performance and low-power operation. The high-performance 16-bit RISC core and 8-bit accumulators are complemented by standard amenities such as timers and digital I/O. The power consumption per MIPS ratio is among the best in the 16-bit microcontroller industry. The MAXQ3210 is powered directly from a 6V to 9.5V source, such as a battery, but an internal voltage regulator operates the core at 5V. The microcontroller also provides a flag if the input voltage supply falls below the low-batttery detection threshold (VBF), which can be used to signal a low-voltage condition of the 9V battery. The MAXQ3212 is a general-purpose version of the MAXQ3210 that is powered directly from an external 5.0V supply. A 1kWord EEPROM program memory stores customer application code and software algorithms. Software is programmable in-system by the ROM-based bootloader and also in-application programmable under user software control. The device provides 64 bytes of volatile SRAM and 128 bytes of EEPROM in the data memory space. Contact Dallas Semiconductor concerning the availability of ROM-based devices for highvolume, low-cost applications. ♦ High-Performance, Low-Power, 16-Bit RISC Core DC to 3.58MHz Operation, Approaching 1MIPS per MHz Low-Cost Operation from “Colorburst” Crystal or RC Oscillator 6V to 9.5V External Voltage Supply Operates from Single 9V Battery 5.0V Nominal Internal Operation Up to 15 General-Purpose I/O Pins 33 Instructions, Most Single-Cycle Three Independent Data Pointers Accelerate Data Movement with Automatic Increment/Decrement Two Loop Counters 4-Level Hardware Stack 16-Bit Instruction Word, 16-Bit Data Bus 16 x 8-Bit Accumulators JTAG Debug/Visibility Port ♦ Program and Data Memory 1kWord EEPROM Program Memory, Mask ROM for High-Volume Applications 128 Bytes EEPROM Data Memory 60,000 EEPROM Write/Erase Cycles 64 Bytes SRAM Data Memory In-System Programming ♦ Peripheral Features Piezoelectric Horn Driver 16-Bit Programmable Timer/Counter with Prescaler High-Current I/O Pin Suitable for LED Drive Programmable Watchdog Timer Selectable Power-Fail Reset Power-On Reset (POR) Wake-Up Timer Internal 8kHz Ring Oscillator ♦ Flexible Programming Interface Integrated Bootloader In-System/In-Application Programming of EEPROM Through JTAG ♦ Ultra-Low-Power Consumption < 6mA at 3.58MHz 5.5µA Standby Current (typ) Low-Power Divide-by-256 Mode ♦ Analog Features Analog Comparator Uses Internal or External Voltage Reference +2.5V Reference Output Available On-Chip Voltage Regulator Supports Up to 9.5V as Power Supply Low-Battery Detection 5V Regulated Output Available, Up to 50mA Applications Gas and Chemical Sensors Security Alarm Systems Environmental Systems Battery-Powered and Portable Devices Electrochemical and Optical Sensors Home Appliances Thermostats/Humidity Sensors Typical Operating Circuits, Pin Configuration, and Ordering Information appear at end of data sheet. MAXQ is a registered trademark of Maxim Integrated Products, Inc. Note: Some revisions of this device may incorporate deviations from published specifications known as errata. Multiple revisions of any device may be simultaneously available through various sales channels. For information about device errata, go to: www.maxim-ic.com/errata. ______________________________________________ Maxim Integrated Products For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com. 1 MAXQ3210 General Description MAXQ3210 Microcontroller with Internal Voltage Regulator, Piezoelectric Horn Driver, and Comparator ABSOLUTE MAXIMUM RATINGS Voltage Range on Any Digital I/O Pin Relative to Ground ...................................-0.5V to (VDDINT + 0.5V) Voltage Range on Any Analog I/O Pin Relative to Ground..............................-0.5V to (VDDINT + 0.5V) Voltage Range on VDD Relative to Ground .........-0.5V to +10.5V Voltage Range on FEED Relative to Ground..........-0.5V to +20V Continuous Output Current (any single I/O pin) .................25mA Continuous Output Current (all I/O pins combined) ...........25mA Operating Temperature Range ...........................-40°C to +85°C Storage Temperature Range .............................-65°C to +150°C Soldering Temperature .......................................See IPC/JEDEC J-STD-020 Specification Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS (VDD = VDD(MIN) to VDD(MAX), CREGOUT = 10µF + 0.1µF, CVDD = 1µF, TA = -40°C to +85°C. Typical values are at TA = +25°C.) (Note 1) PARAMETER MIN TYP MAX UNITS VDD 6.0 9.0 9.5 V Internal Regulated Supply Voltage VDDINT 4.5 5.0 5.5 V Voltage Regulator Output VREGOUT Maximum ISOURCE = 50mA 4.5 5.0 5.5 V 0°C to +85°C 7.0 7.51 -40°C 6.9 7.6 4.15 4.6 V Supply Voltage SYMBOL Low-Battery Detection Threshold VBF Power-Fail Reset VRST Active Current Stop-Mode Current RESET Pullup 2 CONDITIONS V IDD1 /1 mode (Note 2) sysclk = fHFXIN 6.4 9.0 mA IDD2 /2 mode (Note 2) sysclk = fHFXIN / 2 4.0 6.0 mA IDD3 /4 mode (Note 2) sysclk = fHFXIN / 4 2.9 4.5 mA IDD4 /8 mode (Note 2) sysclk = fHFXIN / 8 2.3 3.5 mA IDD5 PMM1 mode (Note 2) sysclk = fHFXIN / 256 1.7 3.0 mA IDD6 8kHz ring mode (Note 2) 0.6 1.2 mA ISTOP1 Brownout detector off, wake-up timer on, TA = +50°C (Note 3), VDD = 9V 7.5 33.0 ISTOP2 Brownout detector off, wake-up timer on, TA = +25°C, VDD = 9V 5.5 13 ISTOP3 Brownout detector on, wake-up timer on, TA = +25°C, VDD = 9V 51 80 150 250 RRST VRST = 0.4V, VREGOUT = 5.5V _____________________________________________________________________ 102 µA kΩ Microcontroller with Internal Voltage Regulator, Piezoelectric Horn Driver, and Comparator (VDD = VDD(MIN) to VDD(MAX), CREGOUT = 10µF + 0.1µF, CVDD = 1µF, TA = -40°C to +85°C. Typical values are at TA = +25°C.) (Note 1) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS 2.44 2.5 2.56 V INTERNAL VOLTAGE REFERENCE Voltage Reference Output VREFO ISOURCE = 50µA max, ISINK = 50µA max Regulated Voltage Settling Time tREFO Turn on to 0.1% of final VREFO value (Note 3) Input Common-Mode Voltage VREFI Input Input Current IREFI Input 1.2 ms VDDINT - 1.5 0 1 V nA PIEZOELECTRIC HORN DRIVER 0.85 x VDD Input High Voltage: FEED VIH2 V Input Low Voltage: FEED VIL2 Input Leakage: FEED IIL1 FEED = 0 and 18V, VDD = 9V, typical at feed = 18V -50 +9 Output High Voltage: HORNS, HORNB VOH2 VDD = 9V, TA = +25°C, ISOURCE = 16mA VDD 0.5 VDD 0.34 Output Low Voltage: HORNS, HORNB VOL2 VDD = 9V, TA = +25°C, ISINK = 16mA 0.36 0.15 x VDD V +50 µA V 0.5 V -11 +11 mV 0 VDDINT - 1.5 V ANALOG VOLTAGE COMPARATOR Input Offset Voltage VOS Input Common-Mode Voltage VCMR Common-Mode Rejection Ratio CMRR (Note 3) Response Time fHFIN = 3.58MHz, comparator on, comparator reference at (VDDINT - 1.5) / 2 while CMPI transitions from GND to (VDDINT - 1.5) in approximately 2ns Comparator Mode Change to Output Valid fHFIN = 3.58MHz, ∆V=20mV DC Input-Leakage Current TA = +25°C 55 -50 dB 0.14 + tCLCL 0.6 + tCLCL µs 0.8 1.6 µs +50 nA _____________________________________________________________________ 3 MAXQ3210 ELECTRICAL CHARACTERISTICS (continued) MAXQ3210 Microcontroller with Internal Voltage Regulator, Piezoelectric Horn Driver, and Comparator ELECTRICAL CHARACTERISTICS (continued) (VDD = VDD(MIN) to VDD(MAX), CREGOUT = 10µF + 0.1µF, CVDD = 1µF, TA = -40°C to +85°C. Typical values are at TA = +25°C.) (Note 1) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS DIGITAL I/O AND OSCILLATOR Input High Voltage: Px.x and HFXIN VIH XTRC = 0/1 Input Low Voltage: Px.x and HFXIN VIL XTRC = 0/1 Output High Voltage: Px.x VOH ISOURCE = 4mA Output Low Voltage: Px.x (except P0.7) VOL ISINK = 4mA Output Low Voltage: P0.7 VOL1 ISINK = 10mA Input Low Current (All Ports) IL Input mode with weak pullup disabled Input Low Current (All Ports) IL Input mode with weak pullup active, VIL = 0.4V, VDDINT = 5.5V 0.85 x VDDINT V 0.15 x VDDINT 0.85 x VDDINT V V 0.4 -1 -31 V 0.4 V +1 µA -50 µA CLOCK SOURCES External-Clock Frequency Internal Ring Oscillator fHFIN External crystal External oscillator 1.00 3.58 0 3.58 8 fRO MHz kHz JTAG PROGRAMMING TCK Frequency fTCK JTAG programming (Note 3). Sysclk is a function of fHFXIN and the clock divisor; see IDDx parameters above 0 sysclk / 8 MHz MEMORY CHARACTERISTICS (Note 3) EEPROM Write/Erase Cycles θJA = +85°C 15,000 Cycles θJA = +25°C 60,000 Cycles 10 Years EEPROM Data Retention Note 1: Specifications to -40°C are guaranteed by design and are not production tested. Note 2: Measured on the VDD pin with VDD = 9.5V, fHFXIN = 3.58MHz, program EEPROM contains checkerboard, and not in reset. Note 3: Specification guaranteed by design but not production tested. 4 _____________________________________________________________________ Microcontroller with Internal Voltage Regulator, Piezoelectric Horn Driver, and Comparator P0/P1 HIGH OUTPUT VOLTAGE vs. SOURCE CURRENT DIGITAL SUPPLY CURRENT vs. CLOCK FREQUENCY TA = -40°C 5 VDD = +9.0V fHFXIN = 3.58MHz TA = -40°C 30 MAXQ3210 toc02 35 MAXQ3210 toc01 6 25 TA = +25°C IOH (mA) IDD1 (mA) 4 TA = +85°C 3 2 20 15 TA = +85°C 10 1 5 VDD = +9.0V CLOCK SOURCE DRIVE ON HFXIN 0 0 1 0 0 3 2 fHFXIN (MHz) 1 2 3 4 5 VOH (V) RC VALUE vs. OPERATING FREQUENCY ANALOG COMPARATOR DELAY MAXQ3210 toc04 MA XQ 32 10 toc 4500 4000 3500 3000 2500 2000 1500 1000 500 0 C (pF) 15 100 OSC2 PIN (kHz) 03 CMPI 5V/div CMPO 5V/div 330 100 49.9 10 4.99 3.32 50ns/div R (kΩ) _____________________________________________________________________ 5 MAXQ3210 Typical Operating Characteristics (TA = +25°C, unless otherwise noted.) MAXQ3210 Microcontroller with Internal Voltage Regulator, Piezoelectric Horn Driver, and Comparator Pin Description PIN NAME 1 GND 2 VREF/P0.4 Voltage Reference Input/Output or General-Purpose, Digital I/O, Type D Port. This pin functions as either the output of the internal voltage reference or as a bidirectional I/O. This pin can also be driven with an external voltage to provide an optional voltage reference. The pin defaults to a digital input with a weak pullup after a reset. 3 CMP0/P0.3 Analog Voltage Comparator Output or General-Purpose, Digital I/O, Type D Port. This pin functions as either the output of the analog voltage comparator or as a bidirectional I/O. The pin defaults to a digital input with a weak pullup after a reset. 4 T2P/P0.2 5 T2PB/P0.1 6 P0.0 General-Purpose, Digital I/O, Type D Port. This pin functions as a bidirectional I/O, and defaults to a digital input with a weak pullup after a reset. 7 P1.6 General-Purpose, Digital I/O, Type D Port. This pin functions as a bidirectional I/O, and defaults to a digital input with a weak pullup after a reset. 8 P1.5 General-Purpose, Digital I/O, Type D Port. This pin functions as a bidirectional I/O, and defaults to a digital input with a weak pullup after a reset. 9 TDO/P1.4 Debug Port Signal TDO or General-Purpose, Digital I/O, Type D Port. This pin functions as either the TDO signal of the debug port or as a bidirectional I/O. The pin defaults to a digital input with a weak pullup after a reset. 10 TCK/P1.3 Debug Port Signal TCK or General-Purpose, Digital I/O, Type D Port. This pin functions as either the TCK signal of the debug port or as a bidirectional I/O. The pin defaults to a digital input with a weak pullup after a reset. 11 HFXIN Oscillator Input. Connect an external crystal or resonator between HFXIN and HFXOUT for system clock generation. When using a crystal, a load capacitor of approximately 22pF must be connected between this pin and ground. Alternatively, HFXIN is the input for an external clock source when HFXOUT is floating. 12 HFXOUT Oscillator Output. Connect an external crystal or resonator between HFXIN and HFXOUT as the system clock. When using a crystal, a load capacitor of approximately 22pF must be connected between this pin and ground. Alternatively, float HFXOUT when an external high-frequency clock source is connected to the HFXIN pin. 6 FUNCTION Ground Timer 2 Input/Output or General-Purpose, Digital I/O, Type D Port. This pin functions as either the input or output of Timer 2 or as a bidirectional I/O. The pin defaults to a digital input with a weak pullup after a reset. Secondary Timer 2 Input/Output or General-Purpose, Digital I/O, Type D Port. This pin functions as either the secondary output of Timer 2 or as a bidirectional I/O. The pin defaults to a digital input with a weak pullup after a reset. _____________________________________________________________________ Microcontroller with Internal Voltage Regulator, Piezoelectric Horn Driver, and Comparator PIN NAME 13 FEED Piezoelectric Horn Driver, Feedback. This input is connected to the feedback electrode of the horn. If FEED is not used, it should be grounded. 14 HORNB Piezoelectric Horn Driver, Horn Brass. This output pin is connected to the piezo metal support electrode of the horn. 15 GNDHORN Piezoelectric Horn Driver, Ground. This pin should be connected to GND, the same ground as pin 1. There is no special isolation required for this pin. 16 HORNS Piezoelectric Horn Driver, Horn Silver. This output pin is connected to the ceramic electrode and provides the complementary output to HORNB when the horn output is enabled. 17 VDD 18 REGOUT Voltage Regulator Output. This pin provides the regulated output of the internal voltage regulator. This pin requires sufficient bypass capacitance, preferrably a parallel combination of 10µF and 0.1µF capacitors between this pin and ground. 19 TMS/P1.2 Debug Port Signal TMS or General-Purpose, Digital I/O, Type D Port. This pin functions as either the TMS signal of the debug port or as a bidirectional I/O. The pin defaults to a digital input with a weak pullup after a reset. 20 FUNCTION Digital Power. This pin should be connected to a bypass capacitor to ground. Active-Low Reset Input or General-Purpose, Digital I/O, Type D Port. This pin defaults to the reset input RESET/P1.1 mode of operation following a POR. The reset input mode can be deactivated and the digital I/O mode enabled by programming the RSTD bit to 1. 21 TDI/P1.0 Debug Port Signal TDI or General-Purpose, Digital I/O, Type D Port. This pin functions as either the TDI signal of the debug port or as a bidirectional I/O. The pin defaults to a digital input with a weak pullup after a reset. 22 LED/P0.7 High-Current (Sink) Driver Output or General-Purpose, Digital I/O, Type D Port. This pin functions with a high-current pulldown to drive a device such as an LED or as a bidirectional I/O. The pin defaults to a digital input with a weak pullup after a reset. 23 INT/P0.6 External Edge-Selectable Interrupt or General-Purpose, Digital I/O, Type D Port. This pin functions as either an external edge-selectable interrupt or as a bidirectional I/O. The pin defaults to a digital input with a weak pullup after a reset. 24 CMPI/P0.5 Analog Voltage Comparator Input or General-Purpose, Digital I/O, Type D Port. This pin functions as either the input to the analog voltage comparator or as a bidirectional I/O. The pin defaults to a digital input with a weak pullup after a reset. _____________________________________________________________________ 7 MAXQ3210 Pin Description (continued) Microcontroller with Internal Voltage Regulator, Piezoelectric Horn Driver, and Comparator MAXQ3210 Functional Diagram 1kWORD EEPROM (PROGRAM) COMPARATOR PIEZOELECTRIC HORN DRIVER 2kWORD UTILITY ROM MAXQ10 RISC CORE (16 x 8-BIT ACCUMULATORS) 5V VOLTAGE REGULATOR GPIO WATCHDOG TIMERS EXTERNAL CRYSTAL/ EXTERNAL OSCILLATOR/ EXTERNAL RC OR RESONATOR 9V 16-BIT TIMER/COUNTER WITH PRESCALER 64B SRAM (DATA) 128B EEPROM (DATA) HIGH-CURRENT LED DRIVER POWER REDUCTION/ CLOCK GENERATION POR JTAG TMS, TDI, TDO, TCK MAXQ3210 Detailed Description Instruction Set The following is an introduction to the primary features of the microcontroller. More detailed descriptions of the device features can be found in the data sheets, errata sheets, and user’s guides described later in the Additional Documentation section. The instruction set is composed of fixed-length, 16-bit instructions that operate on registers and memory locations. The instruction set is highly orthogonal, allowing arithmetic and logical operations to use any register along with the accumulator. Special-function registers control the peripherals and are subdivided into register modules. The family architecture is modular, so that new devices and modules can often reuse code developed for existing products. MAXQ Core Architecture The MAXQ3210 is a low-cost, high-performance, CMOS, fully static, 16-bit RISC microcontroller with EEPROM and an integrated piezoelectric horn driver and analog comparator. It is structured on a highly advanced, 8-bit accumulator-based, 16-bit RISC architecture. Fetch and execution operations are completed in one cycle without pipelining, because the instruction contains both the op code and data. The result is a streamlined 3.58 million instructions-per-second (MIPS) microcontroller. A 4-level hardware stack, enabling fast subroutine calling and task switching, supports the highly efficient core. Data can be quickly and efficiently manipulated with three internal data pointers. Multiple data pointers allow more than one function to access data memory without having to save and restore data pointers each time. The data pointers can automatically increment or decrement before or after an operation, eliminating the need for software intervention. As a result, the application speed is greatly increased. 8 The architecture is transport-triggered. This means that writes or reads from certain register locations can trigger other associated operations. These operations form the basis for the higher-level instructions defined by the assembler, such as ADDC, OR, JUMP, etc. The op codes are actually implemented as MOVE instructions between certain register locations, while the assembler handles the encoding, which need not be a concern to the programmer. The 16-bit instruction word is designed for efficient execution. Bit 15 indicates the format for the source field of the instruction. Bits 0 to 7 of the instruction represent the source for the transfer. Depending on the value of the format field, this can either be an immediate value or a source register. If this field represents a register, the lower four bits contain the module specifier and the upper four bits contain the register index in that module. Bits 8 to 14 represent the destination for the transfer. This value always represents a destination register, with the lower four bits containing the module specifier _____________________________________________________________________ Microcontroller with Internal Voltage Regulator, Piezoelectric Horn Driver, and Comparator Memory Organization The device incorporates several memory areas: • 2kWords of utility ROM • 1kWords of EEPROM for program storage • 128bytes of EEPROM for data storage • 64bytes of SRAM for storage of temporary variables • 4-level stack memory for storage of program return addresses and general-purpose use The memory is arranged by default in a Harvard architecture, with separate address spaces for program and data memory. A special pseudo-Von Neumann memory mode allows data memory to be mapped into program space, permitting code execution from data memory. This places the utility ROM, code, and data memory into a single contiguous memory map. This is useful for applications that require dynamic program modification or unique memory configurations. In addition, another mode allows program memory to be mapped into data space, permitting code constants to be accessed as data memory. The incorporation of EEPROM for program storage allows the devices to be reprogrammed, eliminating the expense of throwing away one-time programmable devices during development and field upgrades. EEPROM can be password protected with a 16-word key, denying access to program memory by unauthorized individuals. DATA SPACE (BYTE MODE) PROGRAM SPACE A05Fh 64 x 16 EEPROM A020h A01Fh 32 x 16 SRAM A000h 87FFh 8000h 03FFh 2k x 16 UTILITY ROM 8000h 128 x 8 EEPROM 00BFh 0040h 1k x 16 PROGRAM MEMORY 64 x 8 SRAM 0000h 87FFh 8FFFh 4k x 8 UTILITY ROM 2k x 16 UTILITY ROM EXECUTING FROM DATA SPACE (WORD MODE) 003Fh 0000h 8000h 64 x 16 EEPROM 005Fh 0020h 32 x 16 SRAM 001Fh 0000h Figure 1. Memory Map _____________________________________________________________________ 9 MAXQ3210 and the upper three bits containing the register subindex within that module. Any time that it is necessary to directly select one of the upper 24 index locations in a destination module, the prefix register PFX is needed to supply the extra destination bits. This prefix register write is inserted automatically by the assembler and requires only one additional execution cycle. MAXQ3210 Microcontroller with Internal Voltage Regulator, Piezoelectric Horn Driver, and Comparator Stack Memory A 16-bit-wide internal stack provides storage for program return addresses and general-purpose use. The stack is used automatically by the processor when the CALL, RET, and RETI instructions are executed and interrupts serviced. The PUSH, POP, and POPI instructions can also be used explicitly to store and retrieve data to/from the stack. For the MAXQ3210, the stack is four levels deep. On reset, the stack pointer, SP, initializes to the top of the stack (03h). The CALL, PUSH, and interrupt-vectoring operations increment SP, then store a value at the stack location pointed to by SP. The RET, RETI, POP, and POPI operations retrieve the value at the stack location pointed to by SP, and then decrement SP. Utility ROM The utility ROM is a block of internal memory that starts at address 8000h. The utility ROM consists of subroutines that can be called from application software. These include: • In-system programming (bootloader) over JTAG interface • In-circuit debug routines • Test routines (internal memory tests, memory loader, etc.) • User-callable routines for in-application EEPROM programming and fast table lookup Routines within the utility ROM are user-accessible and can be called as subroutines by the application software. More information on the utility ROM contents is contained in the user’s guide for this device. Some applications require protection against unauthorized viewing of program code memory. For these applications, access to in-system programming or incircuit debugging functions is prohibited until a password has been supplied. The password is defined as the 16 words of physical program memory at addresses x0010h to x001Fh. A single Password Lock (PWL) bit is implemented in the SC register. When the PWL is set to one (power-on reset default), the password is required to access the utility ROM, including in-circuit debug and in-system programming routines that allow reading or writing of internal memory. When PWL is cleared to zero, these utilities are fully accessible without the password. The 10 password is automatically set to all zeros following a mass erase. An additional Code Lock bit set from the bootloader prevents any access to the device, even through the password. The device must be erased by the mass erase operation to clear the Code Lock bit before the device can be reprogrammed. Programming The microcontroller’s EEPROM can be programmed by two different methods: in-system programming and inapplication programming. Both methods afford great flexibility in system design as well as reduce the lifecycle cost of the embedded system. In-system programming can be password protected to prevent unauthorized access to code memory. In-System Programming An internal bootloader allows the device to be reloaded over a simple JTAG interface. As a result, system software can be upgraded in-system, eliminating the need for a costly hardware retrofit when software updates are required. Remote software uploads are possible that enable physically inaccessible applications to be frequently updated. The interface hardware can be a JTAG connection to another microcontroller, or a connection to a PC serial port using a serial to JTAG converter such as the MAXQJTAG-001, available from Dallas Semiconductor. If in-system programmability is not required, a commercial gang programmer can be used for mass programming. Activating the JTAG interface and sending the system programming instruction invokes the bootloader. Setting the SPE bit to 1 during reset through the JTAG interface executes the bootloader-mode program that resides in the utility ROM. When programming is complete, the bootloader can clear the SPE bit and reset the device, allowing the device to bypass the utility ROM and begin execution of the application software. Optionally, the bootloader can be invoked by the application code. The following bootloader functions are supported: • Load • Dump • CRC • Verify • Erase ____________________________________________________________________ Microcontroller with Internal Voltage Regulator, Piezoelectric Horn Driver, and Comparator Register Set Most functions of the device are controlled by sets of registers. These registers provide a working space for memory operations as well as configuring and addressing peripheral registers on the device. Registers are divided into two major types: system registers and peripheral registers. The common register set, also known as the system registers, includes the ALU, accumulator registers, data pointers, interrupt vectors and control, and stack pointer. The peripheral registers define additional functionality that may be included by different products based on the MAXQ architecture. This functionality is broken up into discrete modules so that only the features required for a given product need to be included. The following tables show the MAXQ3210 register set. Note that the accumulators are 8 bits wide for this device. Table 1. System Register Map REGISTER INDEX MODULE NAME (BASE SPECIFIER) AP (8h) A (9h) PFX (Bh) 0xh AP A[0] PFX[0] 1xh APC A[1] PFX[1] 2xh — A[2] PFX[2] 3xh — A[3] 4xh PSF A[4] 5xh IC 6xh 7xh IP (Ch) SP (Dh) DPC (Eh) DP (Fh) IP — — — — SP — — — IV — — PFX[3] — — Offs DP0 PFX[4] — — DPC — A[5] PFX[5] — — GR — IMR A[6] PFX[6] — LC0 GRL — — A[7] PFX[7] — LC1 BP DP1 8xh SC A[8] — — — GRS — 9xh — A[9] — — — GRH — Axh — A[10] — — — GRXL — Bxh IIR A[11] — — — BP[offs] — Cxh — A[12] — — — — — Dxh — A[13] — — — — — Exh CKCN A[14] — — — — — Fxh WDCN A[15] — — — — — Note: Names that appear in italics indicate that all bits of a register are read-only. Names that appear in bold indicate that a register is 16 bits wide. Registers in module AP are bit addressable. ____________________________________________________________________ 11 MAXQ3210 In-Application Programming: The in-application programming feature allows the microcontroller to modify its own program memory from its application software. This allows on-the-fly software updates in mission-critical applications that cannot afford downtime. Alternatively, it allows the application to develop custom loader software that can operate under the control of the application software. The utility ROM contains user-accessible programming functions that erase and program memory. These functions are described in detail in the user’s guide for this device. MAXQ3210 Microcontroller with Internal Voltage Regulator, Piezoelectric Horn Driver, and Comparator Table 2. System Register Bit Functions REGISTER REGISTER BIT 15 14 13 12 11 10 9 8 7 6 5 4 AP — — — — APC CLR IDS — — — PSF Z S — GPF1 GPF0 OV C E IC — — CGDS — — — INS IGE IMR IMS — — — — — IM1 IM0 SC TAP — — — — ROD PWL — IIR IIS — — — — — II1 II0 CKCN XT/RC RGSL WDCN POR EWDI RGMD STOP — A[n] (0..15) PFX (16 bits) IP IP (16 bits) — — — — — — — — — — — — — — IV IV (16 bits) LC[0] LC[0] (16 bits) LC[1] LC[1] (16 bits) Offs DPC GR 1 0 AP (4 bits) MOD2 MOD1 MOD0 SWB PMME CD1 CD0 WDIF WTRF RWT EWT — — — SP (2 bits) Offs (8 bits) — — — — — — — — GR.7 GR.6 GR.5 GR.4 GR.3 GR.2 GR.1 GR.0 GR.7 GR.6 GR.5 GR.4 GR.3 GR.2 GR.1 GR.0 BP BP (16 bits) GR.15 GR.14 GR.13 GR.12 GR.11 GR.10 GR.9 GR.8 GR.15 GR.14 GR.13 GR.12 GR.11 GR.10 GR.9 GR.8 GR.7 GR.6 GR.5 GR.0 GRS GR.15 GR.14 GR.13 GR.12 GR.11 GR.10 GR.9 GR.8 WBS2 WBS1 WBS0 SDPS1 SDPS0 GRL GR.7 GR.6 GR.5 GR.4 GR.3 GR.2 GR.1 GR.0 GRH GRXL GR.7 GR.7 GR.7 GR.7 GR.7 GR.7 GR.7 GR.7 BP[offs] BP[offs] (16 bits) DP[0] DP[0] (16 bits) DP[1] DP[1] (16 bits) 12 2 A[n] (8 bits) PFX SP — 3 ____________________________________________________________________ GR.4 GR.3 GR.2 GR.1 Microcontroller with Internal Voltage Regulator, Piezoelectric Horn Driver, and Comparator REGISTER REGISTER BIT 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 AP 0 0 0 0 0 0 0 0 APC 0 0 0 0 0 0 0 0 PSF 1 0 0 0 0 0 0 0 IC 0 0 0 0 0 0 0 0 IMR 0 0 0 0 0 0 0 0 SC 1 0 i i i 0 s 0 IIR 0 0 0 0 0 0 0 0 CKCN s s s 0 0 0 0 0 WDCN s s 0 0 0 s s 0 A[n] (0..15) 0 0 0 0 0 0 0 0 PFX 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 IP 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 SP 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 IV 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 LC[0] 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 LC[1] 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 DPC 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 GR 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 BP 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 GRS 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 GRXL 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 BP[offs] 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 DP0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 DP1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Offs GRL GRH Note: Bits marked with an “i” have an indeterminate value upon reset. Bits marked with an “s” have special behavior upon reset. Refer to the User’s Guide Supplement for this device for more details. ____________________________________________________________________ 13 MAXQ3210 Table 3. System Register Bit Reset Values MAXQ3210 Microcontroller with Internal Voltage Regulator, Piezoelectric Horn Driver, and Comparator Table 4. Peripheral Register Map REGISTER INDEX MODULE NAME (BASE SPECIFIER) REGISTER INDEX MODULE NAME (BASE SPECIFIER) M0 (x0h) M1 (x1h) M2 (x2h) 10xh PD0 T2CFG — 11xh PD1 — — — 12xh — — — — — 13xh — — — T2CNA — 14xh KEN0 — — — 15xh KEN1 — — M0 (x0h) M1 (x1h) M2 (x2h) 0xh PO0 CMPC — 1xh PO1 — — 2xh — — 3xh — 4xh — 5xh — T2H 6xh — T2RH — 16xh — — — 7xh EIE0 T2CH — 17xh — — — 8xh PI0 T2CNB — 18xh — — — 9xh PI1 T2V — 19xh — — — Axh — T2R — 1Axh — — — Bxh — T2C — 1Bxh ICDF — — Cxh HRNC — — 1Cxh — — — Dxh PWCN — — 1Dxh — — — Exh WUTC — — 1Exh — — — Fxh WUT — — 1Fxh — — — Note: Names that appear in italics indicate that all bits of a register are read-only. Names that appear in bold indicate that a register is 16 bits wide. 14 ____________________________________________________________________ Microcontroller with Internal Voltage Regulator, Piezoelectric Horn Driver, and Comparator REGISTER REGISTER BIT 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 PO0 PO0.7 PO0.6 PO0.5 PO0.4 PO0.3 PO0.2 PO0.1 PO0.0 PO1 — PO1.6 PO1.5 PO1.4 PO1.3 PO1.2 PO1.1 PO1.0 EI0 — — — — — IT0 EX0 IE0 PI0 PI0.7 PI0.6 PI0.5 PI0.4 PI0.3 PI0.2 PI0.1 PI0.0 PI1 — PI1.6 PI1.5 PI1.4 PI1.3 PI1.2 PI1.1 PI1.0 HRNC — — — — — — — HRNE PWCN — — RSTD REFO LBF LBIE LBDE BOD WUTC — — — — XTE WTCS WTF WTE WT11 WT10 WT9 WT8 WT7 WT6 WT5 WT4 PD0.7 PD0.6 PD0.5 PD0.4 PD0.3 PD0.2 PD0.1 PD0.0 WUT WT19 WT18 WT17 WT16 WT15 WT14 WT13 WT12 PD0 PD1 — PD1.6 PD1.5 PD1.4 PD1.3 PD1.2 PD1.1 PD1.0 KEN0 KEN0.7 KEN0.6 KEN0.5 KEN0.4 KEN0.3 KEN0.2 KEN0.1 KEN0.0 KEN1 — KEN1.6 KEN1.5 KEN1.4 KEN1.3 KEN1.2 KEN1.1 KEN1.0 ICDF — — — — PSS1 PSS0 SPE TXC CMPC CMON ECMF CMF CMM ECMO CMO CPOL EXRF G2EN T2CNA ET2 T2OE0 T2POL0 TR2L TR2 CPRL2 SS2 T2H T2V.15 T2V.14 T2V.13 T2V.12 T2V.11 T2V.10 T2V.9 T2V.8 T2RH T2R.15 T2R.14 T2R.13 T2R.12 T2R.11 T2R.10 T2R.9 T2R.8 T2CH T2C.15 T2C.14 T2C.13 T2C.12 T2C.11 T2C.10 T2C.9 T2C.8 T2CNB ET2L T2OE1 T2POL1 TR2L TF2 TCC2 TF2L TC2L T2V.0 T2V T2V.15 T2V.14 T2V.13 T2V.12 T2V.11 T2V.10 T2V.9 T2V.8 T2V.7 T2V.6 T2V.5 T2V.4 T2V.3 T2V.2 T2V.1 T2R T2R.15 T2R.14 T2R.13 T2R.12 T2R.11 T2R.10 T2R.9 T2R.8 T2R.7 T2R.6 T2R.5 T2R.4 T2R.3 T2R.2 T2R.1 T2R.0 T2C T2C.15 T2C.14 T2C.13 T2C.12 T2C.11 T2C.10 T2C.9 T2C.8 T2C.7 T2C.6 T2C.5 T2C.4 T2C.3 T2C.2 T2C.1 T2C.0 — DIV2 DIV1 DIV0 T2MD CCF1 CCF0 C/T2 T2CFG ____________________________________________________________________ 15 MAXQ3210 Table 5. Peripheral Register Bit Functions MAXQ3210 Microcontroller with Internal Voltage Regulator, Piezoelectric Horn Driver, and Comparator Table 6. Peripheral Register Reset Values REGISTER 7 6 5 4 3 2 1 0 PO0 1 1 1 1 1 1 1 1 PO1 0 1 1 1 1 1 1 1 EI0 0 0 0 0 0 0 0 0 PI0 s s s s s s s s 14 13 12 11 10 9 8 PI1 0 s s s s s s s HRNC 0 0 0 0 0 0 0 0 PWCN 0 0 s s s 0 0 s WUTC 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PD0 0 0 0 0 0 0 0 0 PD1 0 0 0 0 0 0 0 0 KEN0 0 0 0 0 0 0 0 0 KEN1 0 0 0 0 0 0 0 0 ICDF 0 0 0 0 s s s 0 CMPC 0 0 1 0 0 0 0 0 T2CNA 0 0 0 0 0 0 0 0 T2H 0 0 0 0 0 0 0 0 T2RH 0 0 0 0 0 0 0 0 T2CH 0 0 0 0 0 0 0 0 T2CNB 0 0 0 0 0 0 0 0 WUT 0 0 0 0 0 0 0 0 T2V 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 T2R 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 T2C 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 T2CFG 16 REGISTER BIT 15 ____________________________________________________________________ Microcontroller with Internal Voltage Regulator, Piezoelectric Horn Driver, and Comparator This allows time for the crystal amplitude and frequency to stabilize before using it as a clock source. While in the warmup mode, the device operates from the internal 8kHz ring oscillator and can optionally switch back to the crystal as soon as the warmup period expires. For maximum versatility, the MAXQ3210 generates its internal system clock from several sources: • External clock source, including low-cost operation from 3.58MHz “Colorburst” crystal • External crystal or ceramic resonator, using the internal oscillator • External RC, using the internal relaxation oscillator • Internal ring oscillator A crystal warmup counter enhances operational reliability. Each time the external crystal oscillation must restart, such as after exiting stop mode, the device initiates a crystal warmup period of 65,536 oscillations. Internal Voltage Regulator The MAXQ3210 features an internal voltage regulator that allows it to be powered from an external battery ranging from approximately 6.0V to 9.5V. A low-battery detect feature can set a flag and/or trigger an interrupt when enabled and the battery voltage falls below the VBF threshold. The battery voltage is regulated to an internal voltage (VDDINT) of approximately 5V. The REGOUT output pin provides 5V for use by external devices. RESET RWT RESET EWDI WATCHDOG TIMER EWT INTERNAL NANO-RING OSCILLATOR KILL CRYSTAL/ RESONATOR OSCILLATOR CLOCK DIVIDER GLITCH-FREE MUX XT/RC MAXQ3210 GLITCH-FREE MUX RC OSCILLATOR CLOCK SYSTEM CLOCK STOP POR RGMD XT/RC DIV 1 DIV 2 DIV 4 DIV 8 DIV 256 KILL STOP CLOCK SELECTOR RGSL XTE STOP RC CLK XT CLK RESET X-DOG STARTUP TIMER RGSL DONE RGMD RGSL Figure 2. Clock Sources ____________________________________________________________________ 17 MAXQ3210 System Timing MAXQ3210 Microcontroller with Internal Voltage Regulator, Piezoelectric Horn Driver, and Comparator Power Management Advanced power-management features minimize power consumption by dynamically matching the processing speed of the device to the required performance level. This means device operation can be slowed and power consumption minimized during periods of reduced activity. When more processing power is required, the microcontroller can increase its operating frequency. Software-selectable clock-divide operations allow flexibility, selecting whether a system clock cycle (SYSCLK) is 1, 2, 4, or 8 oscillator cycles. By performing this function in software, a lower power state can be entered without the cost of additional hardware. For extremely power-sensitive applications, additional low-power modes are available: • Divide-by-256 power-management mode (PMM) (PMME = 1, CD1:0 = 00b) • Stop mode (STOP = 1) In PMM, one system clock is 256 oscillator cycles, significantly reducing power consumption while the microcontroller functions at reduced speed. The optional switchback feature allows enabled interrupt sources including external interrupts to quickly exit the powermanagement modes and return to a faster internal clock rate. Power consumption reaches its minimum in stop mode. In this mode the external oscillator, system clock, and all processing activity is halted. Stop mode is exited when an enabled external interrupt pin is triggered, the enabled wake-up timer expires, or an external reset signal is applied to the RESET pin. Upon exiting stop mode, the microcontroller starts execution immediately from its internal 8kHz (approximately) ring oscillator while the warmup period completes. Interrupts Multiple reset sources are available for quick response to internal and external events. The MAXQ architecture uses a single interrupt vector (IV), single interrupt-service routine (ISR) design. For maximum flexibility, interrupts can be enabled globally, individually, or by module. When an interrupt condition occurs, its individual flag is set, even if the interrupt source is disabled at the local, module, or global level. Interrupt flags must be cleared within the user-interrupt routine to avoid repeated interrupts from the same source. Application software must ensure a delay between the write to the flag and the RETI instruction to allow time for the interrupt hardware to remove the internal interrupt condition. Asynchronous interrupt flags require a one-instruction delay and synchronous interrupt flags require a two-instruction delay. 18 When an enabled interrupt is detected, software jumps to a user-programmable interrupt vector location. The IV register defaults to 0000h on reset or power-up, so if it is not changed to a different address, the user program must determine whether a jump to 0000h came from a reset or interrupt source. Once software control has been transferred to the ISR, the interrupt identification register (IIR) can be used to determine if a system register or peripheral register was the source of the interrupt. The specified module can then be interrogated for the specific interrupt source and software can take appropriate action. Because the interrupts are evaluated by user software, the user can define a unique interrupt priority scheme for each application. The following interrupt sources are available: • Watchdog Interrupt • External Interrupt 0 • Timer 2 Low Compare, Low Overflow, Capture/ Compare, and Overflow Interrupts • Analog Comparator Interrupt • Low-Battery Interrupt • Wake-Up Interrupt Reset Sources Several reset sources are provided for microcontroller control. Although code execution is halted in the reset state, the high-frequency oscillator and the ring oscillator continue to oscillate. Power-On Reset/Brownout Reset An internal power-on reset circuit enhances system reliability. This circuit forces the device to perform a power-on reset whenever a rising voltage on V DD climbs above approximately V RST. Additionally, the device performs a brownout reset whenever VDD drops below VRST, a feature that can be optionally disabled in stop mode. The following events occur during a poweron reset. • All registers and circuits enter their power-on reset state • I/O pins revert to their reset state, with logic-1 states tracking VREGOUT • The power-on reset flag is set to indicate the source of the reset • The ring oscillator becomes the clock source • The external high-speed oscillator begins its warmup • Code execution begins at location 8000h ____________________________________________________________________ Microcontroller with Internal Voltage Regulator, Piezoelectric Horn Driver, and Comparator External System Reset Asserting the external RESET pin low causes the device to enter the reset state. The external reset functions as described in the MAXQ Family User’s Guide. Execution resumes at location 8000h after the RESET pin is released. The external system reset function is enabled by default on a power-on reset, but can be disabled and the pin used as general-purpose I/O by setting the Reset Pin Disable (RSTD) bit. The system designer is cautioned not to disable the reset pin early in the software as it could disable future JTAG access and/or bootloader capability. I/O Ports The microcontroller uses a form of Type D bidirectional I/O pins described in the MAXQ Family User’s Guide. Each port has eight independent, general-purpose I/O pins and three configure/control registers. Many pins support alternate functions such as timers or interrupts, which are enabled, controlled, and monitored by dedicated peripheral registers. Using the alternate function automatically converts the pin to that function. The I/O pins on this device employ an optional “keeper” latch that helps to maintain the input pin state in the absence of external drive sources. Port 0.7 is a special pin with a stronger pulldown capability to drive devices such as LEDs. It operates and is configured the same as other pins. Type D port pins have Schmitt Trigger receivers and full CMOS output drivers, and can support special functions. The pin is either tri-stated or weak pullup when defined as an input, dependent on the state of the corresponding bit in the output register. One pin of the device has interrupt capability. VDD WEAK MUX PD.x SF DIRECTION VDDIO SF ENABLE MUX PO.x SF OUTPUT MAXQ3210 I/O PAD PIN.x PI.x OR SF INPUT FLAG INTERRUPT FLAG DETECT CIRCUIT EIES.x Figure 3. Type D Port Pin Schematic ____________________________________________________________________ 19 MAXQ3210 Watchdog Timer Reset The watchdog timer functions are described in the MAXQ Family User’s Guide. Software can determine if a reset is caused by a watchdog timeout by checking the Watchdog Timer Reset Flag (WTRF) in the WDCN register. Execution resumes at location 8000h following a watchdog timer reset. MAXQ3210 Microcontroller with Internal Voltage Regulator, Piezoelectric Horn Driver, and Comparator Programmable Timer The microcontroller incorporates one 16-bit programmable timer/counter. The type 2 timer (timer 2) can be used in counter/timer/capture/compare/PWM functions, allowing precise control of internal and external events. It also supports optional single-shot, external gating, and polarity control options. Timer 2 The timer 2 peripheral includes the following: • 16-bit auto-reload timer/counter • 16-bit capture • 16-bit counter • 8-bit capture and 8-bit timer • 8-bit counter and 8-bit timer Wakeup Timer The microcontroller includes a simple 20-bit wake-up timer that can be used to measure long intervals. The user-selectable timer period can be used to generate a long-period interrupt or wake the device out of stop mode. The timer can be clocked from either the currently active system clock or the 8kHz ring oscillator. In stop mode only the 8kHz ring oscillator is available as the wakeup timer clock source. As an interrupt, the feature increases overall performance by reducing many shorter timer interruptions to a single interrupt to measure the same long period. When used in stop mode, it provides the energy savings of the lowest power mode with periodic wakeup ability. Watchdog Timer An internal watchdog timer greatly increases system reliability. The timer resets the device if software execution is disturbed. The watchdog timer is a free-running counter designed to be periodically reset by the application software. If software is operating correctly, the counter is periodically reset and never reaches its maximum count. However, if software operation is interrupt- 20 ed, the timer does not reset, triggering a system reset and optionally a watchdog timer interrupt. This protects the system against electrical noise or electrostatic discharge (ESD) upsets that could cause uncontrolled processor operation. The internal watchdog timer is an upgrade to older designs with external watchdog devices, reducing system cost and simultaneously increasing reliability. The watchdog timer is controlled through bits in the WDCN register. Its timeout period can be set to one of four programmable intervals ranging from 2 12 to 221 system clocks in its default clock mode, allowing flexibility to support different types of applications. The interrupt occurs 512 system clocks before the reset, allowing the system to execute an interrupt and place the system in a known, safe state before the device performs a total system reset. At 3.58MHz, watchdog timeout periods can be programmed from 1.14ms to 149.94s, depending on the system clock mode. Analog Comparator The analog comparator is a one-bit, analog-to-digital comparator. The comparator input can be connected to a wide range of peripherals, including chemical sensors and motion or proximity detectors, or any other appropriate analog input. The comparator measures the analog input against either an external voltage reference or the internal +2.5V reference. When the level on the comparator input, CMPI, rises above the selected voltage reference, the CMO bit in the CMPC register is changed to the desired level. The device then responds by asserting an external signal and/or activating an internal interrupt request. The polarity of the external signal asserted is programmable. When not in use, the pins associated with the comparator are usable as general-purpose I/O. In addition, the +2.5V reference is configurable to be output on the VREF pin. This provides an absolute voltage reference for use with data converters or other precision devices. ____________________________________________________________________ Microcontroller with Internal Voltage Regulator, Piezoelectric Horn Driver, and Comparator MAXQ3210 REF0 EXRF ENABLE CMON +2.5V REFERENCE GENERATOR REF0 STOP 0 GAIN = 1 1 VOUT STOP +2.5V BANDGAP REFERENCE VIN ≈ (V+ > V-) EXRF CMON CPOL 0 VREF (P0.4) 0 1 D Q ECMO 0 CMPI (P0.5) CMPO (P0.3) 1 > SYSTEM CLOCK 1 CMON CMON STOP CMF INTERRUPT REQUEST Q SET CMM ECMF Figure 4. MAXQ3210 Analog Comparator Piezoelectric Horn Driver The piezoelectric horn driver provides circuitry to drive a 3-pin piezoelectric horn/annunciator. These horns contain a ceramic element that bends or expands when a voltage is applied, generating a single tone capable of reaching 100dB. They can be used in a wide variety of applications requiring audible alerts such as theft, intrusion proximity or fire alarms, chemical sensors, door sensors, and safety monitors. The three-terminal piezoelectric horn is connected to the horn silver (HORNS), horn brass (HORNB), and feedback (FEED) pins, plus a dedicated ground for the horn driver (GNDHORN). The MAXQ3210 is designed to drive any industry-standard piezoelectric horn, allowing the designer maximum flexibility and lowest overall system cost. A single bit (HRNE) enables or disables the horn output, and software can toggle the bit to produce sounds of varying durations and patterns. ____________________________________________________________________ 21 MAXQ3210 Microcontroller with Internal Voltage Regulator, Piezoelectric Horn Driver, and Comparator In-Circuit Debug Embedded debugging capability is available through the JTAG-compatible Test Access Port. Embedded debug hardware and embedded ROM firmware provide in-circuit debugging capability to the user application, eliminating the need for an expensive in-circuit emulator. Figure 5 shows a block diagram of the in-circuit debugger. The in-circuit debug features include: • Hardware debug engine • Set of registers able to set breakpoints on register, code, or data accesses • Set of debug service routines stored in the utility ROM The embedded hardware debug engine is an independent hardware block in the microcontroller. The debug engine can monitor internal activities and interact with selected internal registers while the CPU is executing user code. Collectively, the hardware and software features allow two basic modes of in-circuit debugging: • Background mode allows the host to configure and set up the in-circuit debugger while the CPU continues to execute the application software at full speed. Debug mode can be invoked from background mode. • Debug mode allows the debug engine to take control of the CPU, providing read/write access to internal registers and memory, and single-step trace operation. MAXQ3210 DEBUG SERVICE ROUTINES (UTILITY ROM) CPU DEBUG ENGINE TMS TCK TDI TDO TAP CONTROLLER Figure 5. In-Circuit Debugger 22 CONTROL BREAKPOINT ADDRESS DATA Applications Information Grounds and Bypassing Careful PC board layout significantly minimizes crosstalk among the reference input, comparator outputs, and digital inputs. Keep digital and analog lines separate, and use ground traces as shields between them where possible. Separate CMPI and VREF from each other by running a ground trace between these pins. Bypass VDD with a capacitor as low as 1µF and keep bypass capacitor leads short for best noise rejection. Capacitor Selection and Regulator Stability For general purposes, use a combination of a 10µF and 0.1µF capacitor on REGOUT. Note that the 0.1µF capacitor is always required on REGOUT and must be a good quality ceramic with low ESR. The internal regulator is designed to be stable with an output filter capacitor as low as 4.7µF and an ESR as high as 6Ω. Larger REGOUT capacitor values and lower ESR provide better supply-noise rejection and transient response. Note that some ceramic dielectric materials (e.g., Z5U and Y5V) exhibit a large temperature coefficient for both capacitance and ESR, and a larger REGOUT capacitance may be needed to ensure stability at low temperatures. Applications The low-power, high-performance RISC architecture of the MAXQ3210 makes it an excellent fit for many portable or battery-powered applications that require cost-effective computing. The analog comparator can function as an A/D converter when simple analog measurements are necessary, and the high-current I/O pin can drive a power or status LED. Combined with the high-output piezoelectric horn/transducer, the microcontroller can function as both the “brain” and “mouth” in a wide variety of monitoring applications. The microcontroller includes an on-chip voltage regulator that allows it to be powered directly off a 9V battery. A low-battery detector allows the microcontroller to monitor its own battery condition. The internal voltage regulator can also drive external 5V circuitry while a 9V battery drives the system. This device can also be used as a low-cost analog-todigital converter (ADC). The single-slope conversion method can be easily implemented using the internal comparator and an internal timer. The basic implementation of such a converter is illustrated below. One of the benefits of this approach is the small number of ____________________________________________________________________ Microcontroller with Internal Voltage Regulator, Piezoelectric Horn Driver, and Comparator Additional Documentation Designers must have four documents to fully use all the features of this device. This data sheet contains pin descriptions, feature overviews, and electrical specifications. Errata sheets contain deviations from published specifications. The user’s guides offer detailed information about device features and operation. The following documents can be downloaded from www.maxim-ic.com/microcontrollers: • The MAXQ3210 data sheet, which contains electrical/timing specifications and pin descriptions, available at www.maxim-ic.com/MAXQ3210. • The MAXQ3210 errata sheet for the specific device revision, available at www.maxim-ic.com/errata. including programming, available at www.maximic.com/MAXQUG. • The MAXQ Family User’s Guide: MAXQ3210/ MAXQ3212 Supplement, which contains detailed information on features specific to the MAXQ3210, available at www.maxim-ic.com/MAXQ32xxSUP. Development and Technical Support A variety of highly versatile, affordably priced development tools for this microcontroller are available from Maxim/Dallas Semiconductor and third-party suppliers, including: • Compilers • In-circuit emulators • Integrated development environments (IDEs) • JTAG-to-serial converters for programming and debugging A partial list of development tool vendors can be found at www.maxim-ic.com/MAXQ. Technical support is available through email at [email protected]. • The MAXQ Family User’s Guide, which contains detailed information on core features and operation, ____________________________________________________________________ 23 MAXQ3210 external components required: the transistor creates a constant current source, a ramp capacitor times the conversion, and a resistor and capacitor on the comparator input acting as a simple filter. The result is the addition of A/D capability to the end system at virtually no additional cost. Microcontroller with Internal Voltage Regulator, Piezoelectric Horn Driver, and Comparator MAXQ3210 Typical Chemical Sensor Application Using An External Voltage Reference VDD Px.x CHEMICAL SENSOR 9V BATTERY REGOUT 1kΩ SELF-TEST Px.x MAXQ3210 P0.7/LED ANALOG SENSOR CMPI 22pF HFXIN MAX6037 VOLTAGE REF OR EQUIVALENT (OPTIONAL) 3.5795MHz VREF HFXOUT 22pF HORNB GND HORNS GNDHORN 68kΩ 470kΩ FEED 24 ____________________________________________________________________ 2nF 30kΩ PIEZOELECTRIC ALARM Microcontroller with Internal Voltage Regulator, Piezoelectric Horn Driver, and Comparator REGOUT Px.x Px.x CHEMICAL SENSOR REGOUT VREF 1kΩ MAXQ3210 P0.7/LED INPUT CMPI VDD 9V BATTERY 22pF HFXIN 3.5795MHz HFXOUT HORNB HORNS 22pF GND 68kΩ 470kΩ GNDHORN 2nF 30kΩ PIEZOELECTRIC ALARM FEED ____________________________________________________________________ 25 MAXQ3210 Typical Chemical Sensor Application Using A Simple SAR ADC MAXQ3210 Microcontroller with Internal Voltage Regulator, Piezoelectric Horn Driver, and Comparator Ordering Information TEMP RANGE NOMINAL VDD (V) MEMORY MAXQ3210-EJX PART -40°C to +85°C 9 1kWord EEPROM 24 TSSOP PIN-PACKAGE MAXQ3210-EJX+ -40°C to +85°C 9 1kWord EEPROM 24 TSSOP MAXQ3210-EMX -40°C to +85°C 9 1kWord EEPROM 24 PDIP MAXQ3210-EMX+ -40°C to +85°C 9 1kWord EEPROM 24 PDIP +Denotes a Pb-free/RoHS-compliant package. Revision History Pin Configuration TOP VIEW Original release. Rev 1; 5/06: Changed units on Active Current (Electrical Characteristics) from “µA” to “mA” for IDD5 and IDD6. 24 CMPI/P0.5 GND 1 VREF/P0.4 2 23 INT/P0.6 CMP0/P0.3 3 22 LED/P0.7 T2P/P0.2 4 T2PB/P0.1 5 Rev 0; 1/06: 21 TDI/P1.0 MAXQ3210 20 RESET/P1.1 P0.0 6 19 TMS/P1.2 P1.6 7 18 REGOUT P1.5 8 17 VDD TDO/P1.4 9 16 HORNS TCK/P1.3 10 15 GNDHORN HFXIN 11 14 HORNB HFXOUT 12 13 FEED PDIP/TSSOP 26 ____________________________________________________________________ Microcontroller with Internal Voltage Regulator, Piezoelectric Horn Driver, and Comparator TSSOP4.40mm.EPS PACKAGE OUTLINE, TSSOP 4.40mm BODY 21-0066 G 1 1 ____________________________________________________________________ 27 MAXQ3210 Package Information (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to www.maxim-ic.com/packages.) Package Information (continued) (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to www.maxim-ic.com/packages.) PDIPN.EPS MAXQ3210 Microcontroller with Internal Voltage Regulator, Piezoelectric Horn Driver, and Comparator Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. 28 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 © 2006 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products, Inc. is a registered trademark of Dallas Semiconductor Corporation. Marichu Quijano