Freescale MC33879EKR2 Configurable octal serial switch with open load detect current disable Datasheet

Freescale Semiconductor
Advance Information
Document Number: MC33879
Rev 7, 8/2008
Configurable Octal Serial Switch
with Open Load Detect Current
Disable
33879
33879A
The 33879 device is an 8-output hardware-configurable, high side /
low side switch with 16-bit serial input control. Two of the outputs may
be controlled directly via microprocessor for PWM applications. The
33879 incorporates SMARTMOS technology, with CMOS logic,
bipolar/MOS analog circuitry, and DMOS power MOSFETs. The 33879
controls various inductive, incandescent, or LED loads by directly
interfacing with a microcontroller. The circuit’s innovative monitoring
and protection features include very low standby currents, cascade
fault reporting, internal + 45 V clamp voltage for low-side configuration,
- 20 V high side configuration, output specific diagnostics, and
independent over-temperature protection.
HIGH SIDE/ LOW SIDE SWITCH
Features
• Designed to operate 5.5V < VPWR < 26.5V
• 16-Bit SPI for control and fault reporting, 3.3V / 5.0V compatible
• Outputs are current limited (0.6A to 1.2A) to drive incandescent
lamps
• Output voltage clamp, + 45V (Low Side) and - 20V (High Side)
during inductive switching
• On/Off control of open load detect current (LED application)
• Internal reverse battery protection on VPWR
• Loss of ground or supply will not energize loads or damage IC
• Maximum 5.0μA IPWR standby current at 13V VPWR
• RDS(ON) of 0.75Ω at 25°C typical
• Short-circuit detect and current limit with automatic retry
• Independent over-temperature protection
• Pb-free packaging designated by suffix code EK
DWB SUFFIX EXPOSED PAD
EK SUFFIX (PB-FREE)
98ARL10543D
32-PIN SOICW
ORDERING INFORMATION
Device
MCU
33879
VDD VPWR
A0
MOSI
SCLK
CS
EN
DI
SCLK
CS
MISO
DO
PWM1
IN5
MCZ33879EK/R2
MCZ33879AEK/R2
PWM2
IN6
GND
VBAT
D1
D2
D3
D4
S1
S2
S3
S4
High-Side Drive
M
D5
D6
D7
D8
S5
S6
S7
S8
H-Bridge Configuration
VBAT
VBAT
Low-Side Drive
Figure 1. 33879 Simplified Application Diagram
* This document contains certain information on a new product.
Specifications and information herein are subject to change without notice.
© Freescale Semiconductor, Inc., 2007-2008. All rights reserved.
Package
-40°C to 125°C
32 SOICW-EP
MC33879EK/R2
VPWR
+5.0 V
Temperature
Range (TA)
DEVICE VARIATIONS
DEVICE VARIATIONS
Table 1. Device Variations (Optional Table)
Freescale Part No.
VPWR Supply Voltage
33879
-16 to 40V
33879A
-16 to 45V
Reference Location
6, 7, 13
33879
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Analog Integrated Circuit Device Data
Freescale Semiconductor
INTERNAL BLOCK DIAGRAM
INTERNAL BLOCK DIAGRAM
VDD
__
CS
VPWR
~50 μA
Internal
Bias
Power Supply
SCLK
Charge
Pump
Over-voltage
Shutdown/POR
Sleep State
DI
GND
DO
EN
~110 kΩ
OV, POR, SLEEP
SPI and
Interface
Logic
Typical of all 8 output drivers
TLIM
SPI Bit 0
IN5
Enable
~50 μA
SPI Bit 4
IN5
IN6
Open
Load
Detect
Current
~80 μA
Gate
Drive
Control
Current
Limit
+
–
~50 μA
+
–
Open/Short
Comparator
+
–
~4.0 V Open/Short
Threshold
Open
Load
Detect
Current
~80 μA
TLIM
EP
Gate
Drive
Control
Exposed Pad
Current
Limit
+
–
+
–
Open/Short
Comparator
D1
D2
D3
D4
D7
D8
Drain
Outputs
S1
S2
S3
S4
S7
S8
Source
Outputs
D5
D6
Drain
Outputs
S5
Source
Outputs
S6
+
–
~4.0 V Open/Short
Threshold
Figure 2. 33879 Simplified Internal Block Diagram
33879
Analog Integrated Circuit Device Data
Freescale Semiconductor
3
PIN CONNECTIONS
PIN CONNECTIONS
GND
VDD
S8
NC
D8
S2
D2
NC
NC
S1
D1
D6
S6
IN6
EN
SCLK
9
24
10
23
11
22
12
21
13
20
14
19
DO
VPWR
NC
S7
D7
S4
D4
NC
NC
S3
D3
D5
S5
IN5
15
18
CS
16
17
DI
1
32
2
31
3
30
4
29
5
28
6
27
7
8
26
GND
25
Figure 3. 33879 Pin Connections
Table 2. 33879 Pin Definitions
A functional description of each pin can be found in the Functional Pin Description section beginning on page 15.
Pin Number
Pin Name
Pin
Function
Formal Name
1
GND
Ground
Ground
2
VDD
Input
Logic Supply
Voltage
3
S8
Output
Source Output 8
4, 8, 9,
24, 25, 30
NC
No
Connection
Not Connected
No internal connection to this pin.
5
D8
Output
Drain Output 8
Output 8 MOSFET drain pin.
6
S2
Output
Source Output 2
7
D2
Output
Drain Output 2
10
S1
Output
Source Output 1
11
D1
Output
Drain Output 1
Output 1 MOSFET drain pin.
12
D6
Output
Drain Output 6
Output 6 MOSFET drain pin.
13
S6
Output
Source Output 6
14
IN6
Input
Command Input 6
PWM direct control input pin for output 6. IN6 is “OR” with SPI bit.
15
EN
Input
Enable Input
IC Enable. Active high. With EN low, the device is in Sleep mode.
16
SCLK
Clock
SPI Clock
17
DI
Input
Serial Data Input
SPI control data input pin from MCU to the 33879. Logic [1] activates output.
18
CS
Input
SPI Chip Select
SPI control chip select input pin from MCU to the 33879. Logic [0] allows
data to be transferred in.
19
IN5
Input
Command Input 5
20
S5
Output
Source Output 5
21
D5
Output
Drain Output 5
Output 5 MOSFET drain pin.
22
D3
Output
Drain Output 3
Output 3 MOSFET drain pin.
Definition
Digital ground.
Logic supply for SPI interface. With VDD low the device will be in Sleep
mode.
Output 8 MOSFET source pin.
Output 2 MOSFET source pin.
Output 2 MOSFET drain pin.
Output 1 MOSFET source pin.
Output 6 MOSFET source pin.
SPI control clock input pin.
PWM direct control input pin for output 5. IN5 is “OR” with SPI bit.
Output 5 MOSFET source pin.
33879
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Analog Integrated Circuit Device Data
Freescale Semiconductor
PIN CONNECTIONS
Table 2. 33879 Pin Definitions (continued)
A functional description of each pin can be found in the Functional Pin Description section beginning on page 15.
Pin Number
Pin Name
Pin
Function
Formal Name
23
S3
Output
Source Output 3
26
D4
Output
Drain Output 4
27
S4
Output
Source Output 4
28
D7
Output
Drain Output 7
29
S7
Output
Source Output 7
31
VPWR
Input
Battery Input
32
DO
Output
Serial Data Output
33
EP
Ground
Exposed Pad
Definition
Output 3 MOSFET source pin.
Output 4 MOSFET drain pin.
Output 4 MOSFET source pin.
Output 7 MOSFET drain pin.
Output 7 MOSFET source pin.
Power supply pin to the 33879. VPWR has internal reverse battery
protection.
SPI control data output pin from the 33879 to the MCU. DO = 0 no fault,
DO = 1 specific output has fault.
Device will perform as specified with the Exposed Pad un-terminated
(floating) however, it is recommended that the Exposed Pad be terminated
to pin 1 (GND) and system ground.
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Analog Integrated Circuit Device Data
Freescale Semiconductor
5
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 3. 33879 Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
VDD
- 0.3 to 7.0
VDC
–
- 0.3 to 7.0
VDC
ELECTRICAL RATINGS
VDD Supply Voltage(1)
CS, DI, DO, SCLK, IN5, IN6, and EN(1)
VPWR
(1)
VPWR Supply Voltage
VDC
33879
-16 to 40
33879A
-16 to 45
Output Clamp Energy(2)
ECLAMP
50
± 450
mJ
V
ESD Voltage(3)
Human Body Model
33879
VESD1
Machine Model
33879
VESD2
±100
VESD1
±2000
Human Body Model
33879A
Machine Model
33879A
VESD2
±200
THERMAL RATINGS
°C
Operating Temperature
Ambient
TA
- 40 to 125
Junction
TJ
- 40 to 150
Case
TC
- 40 to 125
Storage Temperature
TSTG
- 55 to 150
°C
Power Dissipation(4)
PD
1.7
W
RθJA
71
RθJC
1.2
TPPRT
Note 6
°C/W
Thermal Resistance
Junction to Ambient
Between the Die and the Exposed Die Pad
Peak Package Reflow Temperature During Reflow
(5), (6)
°C
Notes
1. Exceeding these limits may cause malfunction or permanent damage to the device.
2. Maximum output clamp energy capability at 150°C junction temperature using single non-repetitive pulse method with I = 350 mA.
3. ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100pF, RZAP = 1500Ω), ESD2 testing is performed in
accordance with the Machine Model (CZAP = 200pF, RZAP = 0Ω).
4.
Maximum power dissipation at TA = 25°C with no heatsink used.
5.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes
and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.
6.
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Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 4. Static Electrical Characteristics
Characteristics noted under conditions 3.1V ≤ VDD ≤ 5.5V, 5.5V ≤ VPWR ≤ 18V, - 40°C ≤ TC ≤ 125°C, unless otherwise noted.
Where applicable, typical values reflect the parameter’s approximate average value with VPWR = 13 V, TA = 25°C.
Characteristic
Symbol
Min
Typ
Max
5.5
–
26.5
5.5
–
27.5
–
14
24
–
2.0
5.0
–
2.0
5.0
33879
27
28.5
32
33879A
28
30
33
Unit
POWER INPUT
Supply Voltage Range
VPWR (FO)
Fully Operational 33879
33879A
Supply Current
IPWR (ON)
Sleep State Supply Current
IPWR (SS)
VDD or EN ≤ 0.8V, VPWR = 13V
Sleep State Supply Current
V
μA
μA
IVDD (SS)
EN ≤ 0.8V, VDD = 5.5V
VPWR Over-voltage Shutdown Threshold Voltage
mA
VPWR(OV)
V
VPWR Over-voltage Shutdown Hysteresis Voltage
VPWR(OV-HYS)
0.2
1.5
2.5
V
VPWR Under-voltage Shutdown Threshold Voltage
VPWR(UV)
3.0
4.0
5.0
V
VPWR Under-voltage Shutdown Hysteresis Voltage
VPWR(UV-HYS)
300
500
700
mV
Logic Supply Voltage
VDD
3.1
–
5.5
V
Logic Supply Current
IDD
250
400
700
μA
VDD(SS)
0.8
2.5
3.0
V
Logic Supply Sleep State Threshold Voltage
33879
Analog Integrated Circuit Device Data
Freescale Semiconductor
7
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 4. Static Electrical Characteristics (continued)
Characteristics noted under conditions 3.1V ≤ VDD ≤ 5.5V, 5.5V ≤ VPWR ≤ 18V, - 40°C ≤ TC ≤ 125°C, unless otherwise noted.
Where applicable, typical values reflect the parameter’s approximate average value with VPWR = 13 V, TA = 25°C.
Characteristic
Symbol
Min
Typ
Max
–
–
1.4
–
0.75
–
–
–
–
0.6
–
1.2
2.5
4.0
4.5
35
55
90
20
30
60
65
100
160
40
75
135
40
45
55
-15
- 20
- 25
–
–
5.0
Unit
POWER OUTPUT
Drain-to-Source ON Resistance (IOUT = 0.350A, VPWR = 13V)
TJ = 125°C
TJ = 25°C
TJ = -40°C
Output Self Limiting Current High Side and Low Side Configurations
Output Fault Detection Voltage Threshold(7)
IOUT (LIM)
VOUT(FLT-TH)
Outputs Programmed OFF
Output Fault Detection Current @ Threshold, High Side Configuration
Output OFF Open Load Detection Current, High Side Configuration
Over-temperature Shutdown Hysteresis(8)
μA
–
–
5.0
μA
IOUT (LKG)
VDD = 5.0V, VDRAIN = 16V, VSOURCE = 0V,
Open Load Detection Current Disabled
Over-temperature Shutdown(8)
μA
IOUT (LKG)
VDD = 5.0V, VDRAIN = 16V, VSOURCE = 0V,
Open Load Detection Current Disabled
Output Leakage Current High Side Configuration
V
IOUT (LKG)
VDD = 0V, VDRAIN = 16V, VSOURCE = 0V
Output Leakage Current Low Side Configuration
V
VOC (HSD)
IS = -10mA
Output Leakage Current High Side and Low Side Configurations
μA
VOC (LSD)
ID = 10mA
Output Clamp Voltage High Side Drive
μA
IOCO
VDRAIN = 16V, VSOURCE = 0V, Outputs Programmed OFF,
VPWR=16V
Output Clamp Voltage Low Side Drive
μA
IOCO
VDRAIN = 16V, VSOURCE = 0V, Outputs Programmed OFF,
VPWR=16V
Output OFF Open Load Detection Current, Low Side Configuration
μA
IOUT(FLT-TH)
Outputs Programmed OFF
A
V
IOUT(FLT-TH)
Outputs Programmed OFF
Output Fault Detection Current @ Threshold, Low Side Configuration
Ω
RDS (ON)
–
–
20
TLIM
155
–
185
°C
TLIM (HYS)
5.0
10
15
°C
Notes
7. Output fault detection thresholds with outputs programmed OFF. Output fault detect thresholds are the same for output open and shorts.
8. This parameter is guaranteed by design; however, it is not production tested.
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Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 4. Static Electrical Characteristics (continued)
Characteristics noted under conditions 3.1V ≤ VDD ≤ 5.5V, 5.5V ≤ VPWR ≤ 18V, - 40°C ≤ TC ≤ 125°C, unless otherwise noted.
Where applicable, typical values reflect the parameter’s approximate average value with VPWR = 13 V, TA = 25°C.
Characteristic
Symbol
Min
Typ
Max
Unit
Input Logic High-voltage Thresholds(9)
VIH
0.7 VDD
–
VDD + 0.3
V
Input Logic Low-voltage Thresholds(9)
VIL
GND - 0.3
–
0.2 VDD
V
-10
–
10
DIGITAL INTERFACE
IN5, IN6, EN Input Logic Current
μA
I IN5, I IN6, I EN
IN5, IN6, EN = 0V
IN5, IN6 Pull-down Current
μA
I IN5, I IN6,
0.8 to 5.0V
EN Pull-down Current
0 to 5.0 V
CS Input Current
-10
–
10
μA
-10
–
10
μA
ICS
-30
–
-100
–
–
10
μA
ICS(LKG)
VDOHIGH
V
VDD - 0.4
–
VDD
–
–
0.4
–
–
20
VDOLOW
IDO-LOW = 1.6mA
Input Capacitance on SCLK, DI, Tri-state DO, IN5, IN6, EN(10)
100
ICS
IDO-HIGH = -1.6mA
DO Low-state Output Voltage
45
μA
DO
CS = 5.0V, VDD = 0V
DO High-state Output Voltage
20
I SCK, I DI, I TRI-
CS = 0V
CS Leakage Current to VDD
100
μA
CS = VDD
CS Pull-up Current
45
I EN
EN = 5.0V
SCLK, DI Input, Tri-state DO Output
30
CIN
V
pF
Notes
9. Upper and lower logic threshold voltage levels apply to DI, CS, SCLK, IN5, IN6, and EN.
10. This parameter is guaranteed by design; however, it is not production tested.
33879
Analog Integrated Circuit Device Data
Freescale Semiconductor
9
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 5. Dynamic Electrical Characteristics
Characteristics noted under conditions 3.1V ≤ VDD ≤ 5.5V, 5.5V ≤ VPWR ≤ 18V, - 40°C ≤ TC ≤ 125°C, unless otherwise noted.
Where applicable, typical values reflect the parameter’s approximate average value with VPWR = 13 V, TA = 25°C.
Characteristic
Symbol
Min
Typ
Max
0.1
0.5
1.0
0.1
0.5
1.0
Unit
POWER OUTPUT TIMING
Output Slew Rate Low Side Configuration(11)
t SR(RISE)
RLOAD = 620Ω, CL = 200pF
Output Slew Rate Low Side Configuration(11)
t SR(FALL)
RLOAD = 620 Ω, CL = 200 pF
Output Rise Time High Side Configuration(11)
Output Turn OFF Delay Time, High Side and Low Side Configuration(12)
Output Fault Delay Time(13)
Power-ON Reset Delay
VDD or EN ≤ 0.2 V
0.1
0.3
1.0
0.1
0.3
1.0
1.0
15
50
1.0
30
100
100
–
300
100
–
–
V/μs
μs
t DLY(ON)
μs
t DLY(OFF)
t FAULT
μs
μs
tPOR
Delay Time Required from Rising Edge of EN and VDD to SPI Active
Low-State Duration on VDD or EN for Reset
V/μs
t SR(FALL)
RLOAD = 620Ω, CL = 200pF
Output Turn ON Delay Time, High Side and Low Side Configuration(12)
V/μs
t SR(RISE)
RLOAD = 620Ω, CL = 200pF
Output Fall Time High Side Configuration(11)
V/μs
t RESET
µs
100
–
–
Notes
11. Output slew rate respectively measured across a 620Ω resistive load at 10 to 90 percent and 90 to 10 percent voltage points. CL capacitor
is connected from Drain or Source output to Ground.
12. Output turn ON and OFF delay time measured from 50 percent rising edge of CS to the beginning of the 10 and 90 percent transition
points.
13. Duration of fault before fault bit is set. Duration between access times must be greater than 300μs to read faults.
33879
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Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 5. Dynamic Electrical Characteristics (continued)
Characteristics noted under conditions 3.1V ≤ VDD ≤ 5.5V, 5.5V ≤ VPWR ≤ 18V, - 40°C ≤ TC ≤ 125°C, unless otherwise noted.
Where applicable, typical values reflect the parameter’s approximate average value with VPWR = 13 V, TA = 25°C.
Characteristic
Symbol
Min
Typ
Max
Unit
f SPI
–
4.0
–
MHz
Falling Edge of CS to Rising Edge of SCLK (Required Setup Time)
t LEAD
100
–
–
ns
Falling Edge of SCLK to Rising Edge of CS (Required Setup Time)
t LAG
50
–
–
ns
DI to Falling Edge of SCLK (Required Setup Time)
t DI (SU)
16
–
–
ns
Falling Edge of SCLK to DI (Required Hold Time)
t DI (HOLD)
20
–
–
ns
DI, CS, SCLK Signal Rise Time(15)
t R (DI)
–
5.0
–
ns
DI, CS, SCLK Signal Fall Time(15)
t F (DI)
–
5.0
–
ns
Time from Falling Edge of CS to DO Low Impedance(16)
t DO (EN)
–
–
55
ns
Time from Rising Edge of CS to DO High Impedance(17)
t DO (DIS)
–
–
55
ns
t VALID
–
25
55
ns
DIGITAL INTERFACE TIMING(14)
Recommended Frequency of SPI Operation(14)
Time from Rising Edge of SCLK to DO Data Valid(18)
Notes
14.
15.
16.
17.
18.
This parameter is guaranteed by design. Production test equipment uses 4.16MHz, 5.5V/3.1V SPI interface.
Rise and Fall time of incoming DI, CS, and SCLK signals suggested for design consideration to prevent the occurrence of double pulsing.
Time required for output status data to be available for use at DO pin.
Time required for output status data to be terminated at DO pin.
Time required to obtain valid data out from DO following the rise of SCLK.
33879
Analog Integrated Circuit Device Data
Freescale Semiconductor
11
ELECTRICAL CHARACTERISTICS
TIMING DIAGRAMS
TIMING DIAGRAMS
CS
0.2 VDD
tLEAD
tLAG
0.7 VDD
SCLK
0.2 VDD
tDI(SU) tDI(HOLD)
0.7 VDD
0.2 VDD
DI
MSB in
tDO(EN)
0.7 VDD
0.2 VDD
DO
tDO(DIS)
tVALID
MSB out
LSB out
Figure 4. SPI Timing Diagram
< 50 ns
tR(DI)
VDD = 5.0 V
0.7 VDD
33879
Under
Test
< 50 ns
3.3/5.0 V
50%
SCLK
SCLK
tF(DI
0.2 VDD
0V
DO
0.7 VDD
CL = 200 pF
DO
0.2 VDD
VOL
tR(DO
(Low-to-High)
tVALID
DO
(High-to-Low) 0.7 VDD
NOTE: CL represents the total capacitance of the test
fixture and probe.
0.2
Figure 5. Valid Data Delay Time
and Valid Time Test Circuit
VOH
VOH
VOL
Figure 6. Valid Data Delay Time
and Valid Time Waveforms
tF(CS)
tR(CS)
< 50 ns
< 50 ns
3.3/5.0 V
90%
CS
0.2 VDD
0.7 VDD
10%
0V
tDO(EN)
DO
(Tri-State to Low)
tDO(DIS)
VTri-State
90%
10%
tDO(EN)
tDO(DIS)
90%
DO
10%
VOL
VOH
VTri-State
(Tri-State to High)
Figure 7. Enable and Disable Time Waveforms
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Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
TYPICAL ELECTRICAL CHARACTERISTICS
TYPICAL ELECTRICAL CHARACTERISTICS
7
VPWR @ 18 V
19
33879
18
17
16
33879A
15
14
-40 -25
0
25
50
75
100
VPWR @ 13 V
IPWR Current into VPWR Pin (µA)
IPWR Current into VPWR Pin (mA)
20
125
6
5
4
3
2
1
-40 -25
25
50
75
100
125
TA, Ambient Temperature (°C)
Figure 9. Sleep State IPWR vs. Temperature
TA, Ambient Temperature (°C)
Figure 8. IPWR vs. Temperature
1.4
140
TA = 25°C
1.2
120
VPWR @ 13 V
High Side Drive
1.0
100
RDS(ON) (Ω)
IPWR Current into VPWR Pin (µA)
0
33879
80
60
40
20
0.8
0.6
0.4
33879A
0
5
10
15
VPWR
20
-40 -25
25
125
Figure 11. RDS(ON) vs. Temperature at 350mA
Figure 10. Sleep State IPWR vs. VPWR
1.4
0
25
50
75
100
TA, Ambient Temperature (°C)
TA = 25°C
High Side Drive
1.2
RDS(ON) (Ω)
1.0
0.8
0.6
0.4
0.2
0
5
10
15
20
25
VPWR (V)
Figure 12. RDS(ON) vs. VPWR at 350mA
33879
Analog Integrated Circuit Device Data
Freescale Semiconductor
13
140
IOCO, Open Load (µA)
VPWR @ 13 V
120
100
80
60
High Side
40
Low Side
20
-40 -25
0
25
50
75
100
125
TA, Ambient Temperature (°C)
Figure 13. Open Load Detection Current at Threshold
VOUT(flt-th), Open Load Threshold (V)
ELECTRICAL CHARACTERISTICS
TYPICAL ELECTRICAL CHARACTERISTICS
5.5
5.0
VPWR @ 13 V
High Side and Low Side
4.5
4.0
3.5
3.0
2.5
-40 -25
0
25
50
75
100
125
TA, Ambient Temperature (°C)
Figure 14. Open Load Detection
Threshold vs. Temperature
33879
14
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DESCRIPTION
FUNCTIONAL PIN DESCRIPTION
FUNCTIONAL DESCRIPTION
FUNCTIONAL PIN DESCRIPTION
CS PIN
The system MCU selects the 33879 with which to
communicate through the use of the chip select CS pin. Logic
low on CS enables the data output (DO) driver and allows
data to be transferred from the MCU to the 33879 and vice
versa. Data clocked into the 33879 is acted upon on the rising
edge of CS.
To avoid any spurious data, it is essential the high-to-low
transition of the CS signal occur only when SPI clock (SCLK)
is in a logic low state.
SCLK PIN
The SCLK pin clocks the internal shift registers of the
33879. The serial data input (DI) pin is latched into the input
shift register on the falling edge of the SCLK. The serial data
output (DO) pin shifts data out of the shift register on the
rising edge of the SCLK signal. False clocking of the shift
register must be avoided to ensure validity of data. It is
essential that the SCLK pin be in a logic low state when the
CS pin makes any transition. For this reason, it is
recommended the SCLK pin is commanded to a logic low
state when the device is not accessed (CS in logic high state).
With CS in a logic high state, signals present on SCLK and DI
are ignored and the DO output is tri-state.
Load Detection Current disabled will report logic [0] in the off
state. The first eight positive transitions of SCLK will report
logic [0] followed by the status of the eight output drivers. The
DI / DO shifting of data follows a first-in, first-out protocol with
both input and output words transferring the most significant
bit (MSB) first.
EN PIN
The EN pin on the 33879 enables the device. With the EN
pin high, output drivers may be activated and open / short fault
detection performed and reported. With the EN pin low, all
outputs become inactive, Open Load Detection Current is
disabled, and the device enters Sleep mode. The 33879 will
perform Power-ON Reset on rising edge of the enable signal.
IN5 AND IN6 PINS
The IN5 and IN6 command inputs allow outputs five and
six to be used in PWM applications. The IN5 and IN6 pins are
OR-ed with the Serial Peripheral Interface (SPI) command
input bits. For SPI control of outputs five and six, the IN5 and
IN6 pins should be grounded or held low by the
microprocessor. When using IN5 or IN6 to PWM the output,
the control SPI bit must be logic [0]. Maximum PWM
frequency for each output is 2.0 kHz.
DI PIN
VDD PIN
The DI pin is used for serial instruction data input. DI
information is latched into the input register on the falling
edge of SCLK. A logic high state present on DI will program
a specific output on. The specific output will turn on with the
rising edge of the CS signal. Conversely, a logic low state
present on the DI pin will program the output off. The specific
output will turn off with the rising edge of the CS signal. To
program the eight outputs and Open Load Detection Current
on or off, send the DI data beginning with the Open Load
Detection Current bits, followed by output eight, output
seven, and so on to output one. For each falling edge of the
SCLK while CS is logic low, a data bit instruction (on or off) is
loaded into the shift register per the data bit DI state. Sixteen
bits of entered information is required to fill the input shift
register.
The VDD input pin is used to determine logic levels on the
microprocessor interface (SPI) pins. Current from VDD is
used to drive DO output and the pullup current for CS. VDD
must be applied for normal mode operation. The 33879
device will perform Power-ON Reset with the application of
VDD.
DO PIN
The DO pin is the output from the shift register. The DO pin
remains tri-state until the CS pin is in a logic low state. All
faults on the 33879 device are reported as logic [1] through
the DO data pin. Regardless of the configuration of the driver,
open loads and shorted loads are reported as logic [1].
Conversely, normal operating outputs with non-faulted loads
are reported as logic [0]. Outputs programmed with Open
VPWR PIN
The VPWR pin is battery input and Power-ON Reset to the
33879 IC. The VPWR pin has internal reverse battery
protection. All internal logic current is provided from the VPWR
pin. The 33879 will perform Power-ON Reset with the
application of VPWR.
D1– D8 PINS
The D1 to D8 pins are the open-drain outputs of the 33879.
For high-side drive configurations, the drain pins are
connected to battery supply. In low side drive configurations,
the drain pins are connected to the low side of the load. All
outputs may be configured individually as desired. When
configured as low side drive, the 33879 limits the positive
inductive transient to 45V.
33879
Analog Integrated Circuit Device Data
Freescale Semiconductor
15
FUNCTIONAL DESCRIPTION
MCU INTERFACE DESCRIPTION
S1– S8 PINS
EXPOSED PAD PIN
The S1 to S8 pins are the source outputs of the 33879. For
high side drive configurations, the source pins are connected
directly to the load. In low side drive configurations, the
source is connected to ground. All outputs may be configured
individually as desired. When high side drive is used, the
33879 will limit the negative inductive transient to negative
20 V.
Device will perform as specified with the Exposed Pad unterminated (floating) however, it is recommended that the
Exposed Pad be terminated to pin 1 (GND) and system
ground.
MCU INTERFACE DESCRIPTION
INTRODUCTION
The 33879 is an 8-output hardware-configurable power
switch with 16-bit serial control. A simplified internal block
diagram of the 33879 is shown in Figure 2 on page 3.
The 33879 device uses high-efficiency up-drain power
DMOS output transistors exhibiting low drain-to-source ON
resistance (RDS(ON) = 0.75 Ω at 25°C typical) and dense
CMOS control logic. All outputs have independent voltage
clamps to provide fast inductive turn-off and transient
protection.
In operation, the 33879 functions as an 8-output serial
switch serving as a MCU bus expander and buffer with fault
management and fault reporting features. In doing so, the
device directly relieves the MCU of the fault management
functions. This device directly interfaces to an MCU using a
SPI for control and diagnostic readout. Figure 15 illustrates
the basic SPI configuration between an MCU and one 33879.
All inputs are compatible with 5.0 V and 3.3 V CMOS logic
levels and incorporate positive logic. When a SPI bit is
programmed to a logic [0], the corresponding output will be
OFF. Conversely, when a SPI bit is programmed to logic [1]
the output being controlled will be ON. Diagnostics are
treated in a similar manner. Outputs with a fault will feed back
(via DO) a logic [1] to the microcontroller, while normal
operating outputs will provide a logic [0].
Figure 16 illustrates the daisy chain configuration using
the 33879. Data from the MCU is clocked daisy chain through
each device while the CS bit is commanded low by the MCU.
During each clock cycle, output status from the daisy chain is
transferred to the MCU via the Master In Slave Out (MISO)
line. On rising edge of CS, command data stored in the input
register is then transferred to the output driver.
SCLK
Parallel Port
MC68HCxx
Microcontroller
33879
33879
CS
MC68HCxx
MISO
Microcontroller
DO
with
SPI Interface
MOSI
DI
MISO
DO
Shift Register
Shift Register
16 Bits
DI
8 Outputs
33879
33879
CS
SCLK
CS
SCLK
DO
DI
DO
DI
8 Outputs
8 Outputs
16 Bits
MOSI
SCLK
Receive
Buffer
Parallel
Ports
To
Logic
CS
Figure 15. SPI Interface with Microcontroller
Figure 16. 33879 SPI System Daisy Chain
Multiple 33879 devices can be controlled in a parallel input
fashion using the SPI. Figure 17 illustrates the control of
24 loads using three dedicated parallel MCU ports for chip
select.
33879
16
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DESCRIPTION
SPI DEFINITION
33879
MOSI
DI
SCLK
SCLK
MISO
8 Outputs
DO
CS
MC68HCxx
Microcontroller
with
SPI Interface
33879
DI
SCLK
DO
CS
8 Outputs
33879
Parallel
Ports
A
DI
B
SCLK
C
DO
8 Outputs
CS
Figure 17. Parallel Input SPI Control
SPI DEFINITION
Fault Register, shown in Table 7, defines the previous state
status of the output driver. Table 8 identifies the type of fault
and the method by which the fault is communicated to the
microprocessor.
On each SPI communication, a 16-bit command word is
sent to the 33879 and a 16-bit status word is received from
the 33879. The MSB is sent and received first. As Table 6
shows, the Command Register defines the position and
operation the 33879 will perform on rising edge of CS. The
Table 6. Command Register Definition
MSB
LSB
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
ON /
OFF
Open
Load
Detect
8
ON /
OFF
Open
Load
Detect
7
ON /
OFF
Open
Load
Detect
6
ON /
OFF
Open
Load
Detect
5
ON /
OFF
Open
Load
Detect
4
ON /
OFF
Open
Load
Detect
3
ON /
OFF
Open
Load
Detect
2
ON /
OFF
Open
Load
Detect
1
ON /
OFF
OUT 8
ON /
OFF
OUT 7
ON /
OFF
OUT 6
ON /
OFF
OUT 5
ON /
OFF
OUT 4
ON /
OFF
OUT 3
ON /
OFF
OUT 2
ON /
OFF
OUT 1
0 = Bits 0 to 7, Output commanded OFF.
0 = Bits 8 to 15, Open Load Detection Current OFF.
1 = Bits 0 to 7, Output commanded ON.
1 = Bits 8 to 15 Open Load Detection Current ON.
Table 7. Fault Register Definition
MSB
LSB
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
0
0
0
0
0
0
0
0
OUT 8
Status
OUT 7
Status
OUT 6
Status
OUT 5
Status
OUT 4
Status
OUT 3
Status
OUT 2
Status
OUT 1
Status
0 = Bits 0 to 7, No Fault at Output.
1 = Bits 0 to 7, Output Short-to-Battery, Short-to-GND,
Open Load, or TLIM.
Bits 8 to 15 will always return “0”.
33879
Analog Integrated Circuit Device Data
Freescale Semiconductor
17
FUNCTIONAL DESCRIPTION
SPI DEFINITION
Table 8. Fault Operation
Serial Output (DO) Pin Reports
Overtemperature
Fault reported by serial output (DO) pin.
Overcurrent
DO pin reports short to battery/supply or overcurrent condition.
Output ON Open Load Fault
Not reported.
Output OFF Open Load Fault
DO pin reports output OFF open load condition only with Open Load Detection Current enabled.
DO pin will report “0” for Output OFF Open Load Fault with Open Load Detection Current disabled.
Device Shutdowns
Overvoltage
Total device shutdown at VPWR = VPWR(OV) V. Resumes normal operation with proper voltage. All
outputs assuming the previous state upon recovery from overvoltage.
Overtemperature
Only the output experiencing an overtemperature shuts down. Output assumes previous state upon
recovery from overtemperature.
33879
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Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DESCRIPTION
DEVICE OPERATION
DEVICE OPERATION
POWER SUPPLY
SPI INTEGRITY CHECK
The 33879 device has been designed with ultra-low Sleep
mode currents. The device may enter Sleep mode via the EN
pin or the VDD pin. In the Sleep mode (EN or VDD ≤ 0.8 V), the
current consumed by the VPWR pin is less than 5.0 μA.
Checking the integrity of the SPI communication with the
initial power-up of the VDD and EN pins is recommended.
After initial system start-up or reset, the MCU will write one
32-bit pattern to the 33879. The first 16 bits read by the MCU
will be 8 logic [0]s followed by the fault status of the outputs.
The second 16 bits will be the same bit pattern sent by the
MCU. By the MCU receiving the same bit pattern it sent, bus
integrity is confirmed. Please note the second 16-bit pattern
the MCU sends to the device is the command word and will
be transferred to the outputs with rising edge of CS.
Important A SCLK pulse count strategy has been
implemented to ensure integrity of SPI communications. SPI
messages consisting of 16 SCLK pulses and multiples of
8 clock pulses thereafter will be acknowledged. SPI
messages consisting of other than 16 + multiples of 8 SCLK
pulses will be ignored by the device.
Placing the 33879 in Sleep mode resets the internal
registers to the Power-ON Reset state. The reset state is
defined as all outputs off and Open Load Detection Current
disabled.
To place the 33879 in the Sleep mode, either command all
outputs off and apply logic low to the EN input pin or remove
power from the VDD supply pin. Prior to removing VDD from
the device, it is recommended that all control inputs from the
MCU be low.
PARALLELING OF OUTPUTS
Using MOSFETs as an output switch conveniently allows
the paralleling of outputs for increased current capability.
RDS(ON) of MOSFETs have an inherent positive temperature
coefficient that provides balanced current sharing between
outputs without destructive operation. This mode of operation
may be desirable in the event the application requires lower
power dissipation or the added capability of switching higher
currents. Performance of parallel operation results in a
corresponding decrease in RDS(ON) while the output OFF
Open Load Detection Currents and the output current limits
increase correspondingly. Paralleling outputs from two or
more different IC devices is possible but not recommended.
FAULT LOGIC OPERATION
Fault logic of the 33879 device has been greatly simplified
over other devices using SPI communications. As command
word one is being written into the shift register, a fault status
word is being simultaneously written out and received by the
MCU. Regardless of the configuration, with no outputs
faulted and Open Load Detection Current enabled, all status
bits being received by the MCU will be zero. When outputs
are faulted (off state open circuit or on state short circuit /
overtemperature), the status bits being received by the MCU
will be one. The distinction between open circuit fault and
short / overtemperature is completed via the command word.
For example, when a zero command bit is sent and a one
fault is received in the following word, the fault is open / shortto-battery for high-side drive or open / short-to-ground for lowside drive. In the same manner, when a one command bit is
sent and a one fault is received in the following word, the fault
is a short-to-ground / overtemperature for high-side drive or
short-to-battery/overtemperature for low-side drive. The
timing between two write words must be greater than 300 μs
to allow adequate time to sense and report the proper fault
status.
OVERTEMPERATURE FAULT
Overtemperature detection and shutdown circuits are
specifically incorporated for each individual output. The
shutdown following an overtemperature condition is
independent of the system clock or any other logic signal.
Each independent output shuts down at 155°C to 185°C.
When an output shuts down owing to an overtemperature
fault, no other outputs are affected. The MCU recognizes the
fault by a one in the fault status register. After the 33879
device has cooled below the switch point temperature and
15°C hysteresis, the output will activate unless told otherwise
by the MCU via SPI to shut down.
OVERVOLTAGE FAULT
An overvoltage condition on the VPWR pin will cause the
device to shut down all outputs until the overvoltage condition
is removed. When the overvoltage condition is removed, the
outputs will resume their previous state. This device does not
detect an overvoltage on the VDD pin. The overvoltage
threshold on the VPWR pin is specified as VPWR(OV) V, with
1.0 V typical hysteresis. A VPWR overvoltage detection is
global, causing all outputs to be turned OFF.
OUTPUT OFF OPEN LOAD FAULT
An output OFF open load fault is the detection and
reporting of an open load when the corresponding output is
disabled (input bit programmed to a logic low state). The
Output OFF Open Load fault is detected by comparing the
drain-to-source voltage of the specific MOSFET output to an
internally generated reference. Each output has one
dedicated comparator for this purpose.
33879
Analog Integrated Circuit Device Data
Freescale Semiconductor
19
FUNCTIONAL DESCRIPTION
DEVICE OPERATION
An output OFF open load fault is indicated when the drainto-source voltage is less than the output threshold voltage
(VOUT(flt-th)) of 2.5 V to 4.0 V. Hence, the 33879 will declare
the load open in the OFF state when the output drain-tosource voltage is less than VOUT(flt-th).
This device has an internal 80 μA current source
connected from drain to source of the output MOSFET. The
current source may be programmed on or off via SPI. The
Power-ON Reset state for the current source is “off” and must
be enabled via SPI. To achieve low Sleep mode quiescent
currents, the Open Load Detection Current source of each
driver is switched off when VDD or EN is removed.
During output switching, especially with capacitive loads,
a false output OFF open load fault may be triggered. To
prevent this false fault from being reported, an internal fault
filter of 100 μs to 300 μs is incorporated. A false fault
reporting is a function of the load impedance, RDS(ON), COUT
of the MOSFET, as well as the supply voltage, VPWR. The
rising edge of CS triggers the built-in fault delay timer. The
timer will time out before the fault comparator is enabled and
the fault is detected. Once the condition causing the open
load fault is removed, the device will resume normal
operation. The open load fault, however, will be latched in the
output DO register for the MCU to read.
OUTPUT VOLTAGE CLAMP
Each output of the 33879 incorporates an internal voltage
clamp to provide fast turn-off and transient protection of each
output. Each clamp independently limits the drain-to-source
voltage to 45 V for low-side drive configurations and -20 V for
high-side drive configurations. The total energy clamped (E J)
can be calculated by multiplying the current area under the
current curve (I A) times the clamp voltage (V CL) (see
Figure 18).
Characterization of the output clamps, using a single pulse
non-repetitive method at 0.35 A, indicates the maximum
energy per output to be 50 mJ at 150°C junction temperature.
Drain-to-Source Clamp
Voltage (V CL = 45 V)
Drain Current
(I D = 0.3 A)
Clamp Energy
(E J = I A x V CL)
Drain-to-Source ON
Voltage (V DS(ON))
Current
Area (I A)
GND
SHORTED LOAD FAULT
A shorted load (overcurrent) fault can be caused by any
output being shorted directly to supply, or an output
experiencing a current greater than the current limit.
There are two safety circuits progressively in operation
during load short conditions that provide system protection:
1. The device’s output current is monitored in an analog
fashion using SENSEFET approach and current
limited.
2. The device’s output thermal limit is sensed and when
attained causes only the specific faulted output to shut
down. The output will remain off until cooled. The
device will then reassert the output automatically. The
cycle will continue until fault is removed or the
command bit instructs the output off. Shorted load
faults will be reported properly through SPI regardless
of Open Load Detection Current enable bits.
UNDERVOLTAGE SHUTDOWN
An undervoltage condition on VDD or VPWR will result in the
shutdown of all outputs. The VDD undervoltage threshold is
between 0.8 V and 3.0 V. VPWR undervoltage threshold is
between 3.0 V and 5.0 V. When the supplies fall below their
respective thresholds, all outputs are turned OFF. As both
supplies returns to normal levels, internal logic is reset and
the device resumes normal operation.
Drain Voltage
Time
Drain-to-Source ON
Voltage (V DS(ON))
VS
BAT
GND
Time
Current
Area (I A)
Clamp Energy
(E J = I A x V CL)
Source Current
(I S = 0.3 A)
Source Clamp Voltage
(V CL = -15 V)
Source Voltage
Figure 18. Output Voltage Clamping
SPI CONFIGURATIONS
The SPI configuration on the 33879 device is consistent
with other devices in the Octal Serial Switch (OSS) family.
This device may be used in serial SPI or parallel SPI with the
33298 and 33291. Different SPI configurations may be
provided. For more information, contact Freescale Analog
Products Division or local Freescale representative.
REVERSE BATTERY
The 33879 has been designed with reverse battery
protection on the VPWR pin.
All outputs consist of a power MOSFET with an integral
substrate diode. During the reverse battery condition, current
will flow through the load via the substrate diode. Under this
circumstance, relays may energize and lamps will turn on.
Where load reverse battery protection is desired, a reverse
battery blocking diode must be placed in series with the load.
33879
20
Analog Integrated Circuit Device Data
Freescale Semiconductor
PACKAGING
PACKAGE DIMENSIONS
PACKAGING
PACKAGE DIMENSIONS
Important: For the most current revision of the package, visit www.freescale.com and perform a keyword search using the
“98A” drawing number listed below.
DWB SUFFIX
EK (Pb-FREE) SUFFIX
32-LEAD SOICW EXPOSED PAD
98ARL10543D
ISSUE C
33879
Analog Integrated Circuit Device Data
Freescale Semiconductor
21
PACKAGING
PACKAGE DIMENSIONS
PACKAGE DIMENSIONS (CONTINUED)
DWB SUFFIX
EK (Pb-FREE) SUFFIX
32-LEAD SOICW EXPOSED PAD
98ARL10543D
ISSUE C
33879
22
Analog Integrated Circuit Device Data
Freescale Semiconductor
PACKAGING
PACKAGE DIMENSIONS
DWB SUFFIX
EK (Pb-FREE) SUFFIX
32-LEAD SOICW EXPOSED PAD
98ARL10543D
ISSUE C
33879
Analog Integrated Circuit Device Data
Freescale Semiconductor
23
REVISION HISTORY
REVISION HISTORY
REVISION
5.0
DATE
2/2006
DESCRIPTION OF CHANGES
•
•
•
•
•
•
•
•
•
•
6.0
7.0
6/2007
8/2008
•
•
•
•
Page 2, Figure 1; An exposed pad internal block and EP pin have been added to the internal block
diagram.
Page 4, Table 1; Table 1 has been updated to reflect the Exposed pad pin and pin definition.
Page 6, Table 3; Logic Supply Sleep State Hysteresis and Note 7 have been removed. The VDD
Supply contains no hysteresis.
Page 7, Table 3; Output Fault Detection Current @ Threshold, High-Side Configuration Max
parameter has been increased from 70uA to 90uA.
Page 7, Table 3; Output OFF Open Load Detection Current, High-Side Configuration has been
updated to reflect the voltage of the VPWR pin during the parameter test.
Page 7, Table 3; Output OFF Open Load Detection Current, Low-Side Configuration has been
updated to reflect the voltage of the VPWR pin during the parameter test.
Page 7, Table 3; Output Leakage Current High-Side and Low-Side Configuration Max parameter
has been decreased from 7uA to 5uA.
Page 15, Functional Pin Description; A description has been added for the Exposed Pad pin.
Page 1, Device isometric; Corrected orientation of IC pin 1 from top left to bottom right.
ALL Pages; Updated Data Sheet to reflect Freescale formatting.
•
•
•
Added 33879A version
Added MCZ33879EK/R2 and MCZ33879AEK/R2 to the Ordering Information
Added Device Variations on page 2
Removed Peak Package Reflow Temperature During Reflow (solder reflow) parameter from
Maximum Rations on page 6. Added note with instructions from www.freescale.com.
Changed Output Fault Detection Voltage Threshold(7) on page 8
Renumbered X axis on Figure 14 - Open Load Detection Threshold vs. Temperature on page 14
Changed Overvoltage on page 18 and Overvoltage Fault on page 19
•
Updated package drawing.
33879
24
Analog Integrated Circuit Device Data
Freescale Semiconductor
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MC33879
Rev 7
8/2008
RoHS-compliant and/or Pb-free versions of Freescale products have the functionality
and electrical characteristics of their non-RoHS-compliant and/or non-Pb-free
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