ONSEMI MC74LVX04DT

SEMICONDUCTOR TECHNICAL DATA
LVX
The MC74LVX04 is an advanced high speed CMOS hex inverter. The
inputs tolerate voltages up to 7V, allowing the interface of 5V systems to
3V systems.
•
•
•
•
•
•
•
•
High Speed: tPD = 4.1ns (Typ) at VCC = 3.3V
Low Power Dissipation: ICC = 2µA (Max) at TA = 25°C
LOW–VOLTAGE CMOS
Power Down Protection Provided on Inputs
Balanced Propagation Delays
Low Noise: VOLP = 0.5V (Max)
Pin and Function Compatible with Other Standard Logic Families
Latchup Performance Exceeds 300mA
ESD Performance: HBM > 2000V; Machine Model > 200V
VCC
14
A5
O5
A4
O4
A3
O3
13
12
11
10
9
8
D SUFFIX
14–LEAD SOIC PACKAGE
CASE 751A–03
DT SUFFIX
14–LEAD TSSOP PACKAGE
CASE 948G–01
1
2
3
4
5
6
7
A0
O0
A1
O1
A2
O2
GND
Figure 1. 14–Lead Pinout (Top View)
A0
A1
A2
A3
A4
A5
1
2
3
4
5
6
13
8
11
10
9
12
M SUFFIX
14–LEAD SOIC EIAJ PACKAGE
CASE 965–01
O0
O1
PIN NAMES
O2
Pins
Function
O3
An
On
Data Inputs
Outputs
O4
FUNCTION TABLE
O5
Figure 2. Logic Diagram
6/97
 Motorola, Inc. 1997
1
REV 0
An
On
L
H
H
L
MC74LVX04
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MAXIMUM RATINGS*
Symbol
Parameter
Value
Unit
VCC
DC Supply Voltage
–0.5 to +7.0
V
Vin
DC Input Voltage
–0.5 to +7.0
V
Vout
DC Output Voltage
–0.5 to VCC +0.5
V
IIK
Input Diode Current
–20
mA
IOK
Output Diode Current
±20
mA
Iout
DC Output Current, per Pin
±25
mA
ICC
DC Supply Current, VCC and GND Pins
±50
mA
PD
Power Dissipation
180
mW
Tstg
Storage Temperature
–65 to +150
_C
* Absolute maximum continuous ratings are those values beyond which damage to the device may occur. Exposure to these conditions or
conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute–maximum–rated conditions is
not implied.
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RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
VCC
DC Supply Voltage
2.0
3.6
V
Vin
DC Input Voltage
0
5.5
V
Vout
DC Output Voltage
0
VCC
V
TA
Operating Temperature, All Package Types
–40
+85
_C
∆t/∆V
Input Rise and Fall Time
0
100
ns/V
DC ELECTRICAL CHARACTERISTICS
S b l
Symbol
P
Parameter
T
Test
C
Conditions
di i
Min
1.5
2.0
2.4
VIH
High–Level Input Voltage
2.0
3.0
3.6
VIL
Low–Level Input Voltage
2.0
3.0
3.6
VOH
High–Level Output Voltage
(Vin = VIH or VIL)
IOH = –50µA
IOH = –50µA
IOH = –4mA
2.0
3.0
3.0
VOL
Low–Level Output Voltage
(Vin = VIH or VIL)
IOL = 50µA
IOL = 50µA
IOL = 4mA
2.0
3.0
3.0
Iin
Input Leakage Current
Vin = 5.5V or GND
ICC
Quiescent Supply Current
Vin = VCC or GND
MOTOROLA
TA = 25°C
VCC
V
Typ
TA = – 40 to 85°C
Max
Min
1.5
2.0
2.4
0.5
0.8
0.8
1.9
2.9
2.58
Max
2.0
3.0
V
0.5
0.8
0.8
1.9
2.9
2.48
V
V
0.1
0.1
0.36
0.1
0.1
0.44
V
3.6
±0.1
±1.0
µA
3.6
2.0
20.0
µA
2
0.0
0.0
U i
Unit
LCX DATA
BR1339 — REV 3
MC74LVX04
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AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0ns)
TA = 25°C
S b l
Symbol
P
Parameter
Propagation Delay, Input to
Output
tPLH,
tPHL
tOSHL
tOSLH
Output–to–Output Skew
(Note NO TAG)
T
Test
C
Conditions
di i
Min
TA = – 40 to 85°C
Typ
Max
Min
Max
U i
Unit
ns
VCC = 2.7V
CL = 15pF
CL = 50pF
5.4
7.9
10.1
13.6
1.0
1.0
12.5
16.0
VCC = 3.3 ± 0.3V
CL = 15pF
CL = 50pF
4.1
6.6
6.2
9.7
1.0
1.0
7.5
11.0
VCC = 2.7V
VCC = 3.3 ±0.3V
CL = 50pF
CL = 50pF
1.5
1.5
1.5
1.5
ns
1. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.
The specification applies to any outputs switching in the same direction, either HIGH–to–LOW (tOSHL) or LOW–to–HIGH (tOSLH); parameter
guaranteed by design.
CAPACITIVE CHARACTERISTICS
TA = 25°C
S b l
Symbol
P
Parameter
Min
TA = – 40 to 85°C
Typ
Max
10
Cin
Input Capacitance
4
CPD
Power Dissipation Capacitance (Note NO TAG)
18
Min
Max
U i
Unit
10
pF
pF
2. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC / 6 (per buffer). CPD is used to determine the no–load
dynamic power consumption; PD = CPD VCC2 fin + ICC VCC.
NOISE CHARACTERISTICS (Input tr = tf = 3.0ns, CL = 50pF, VCC = 3.3V, Measured in SOIC Package)
TA = 25°C
S b l
Symbol
Ch
Characteristic
i i
Typ
Max
U i
Unit
VOLP
Quiet Output Maximum Dynamic VOL
0.3
0.5
V
VOLV
Quiet Output Minimum Dynamic VOL
–0.3
–0.5
V
VIHD
Minimum High Level Dynamic Input Voltage
2.0
V
VILD
Maximum Low Level Dynamic Input Voltage
0.8
V
TEST POINT
VCC
A
OUTPUT
50%
DEVICE
UNDER
TEST
GND
tPLH
O
tPHL
CL*
50% VCC
* Includes all probe and jig capacitance
Figure 3. Switching Waveforms
LCX DATA
BR1339 — REV 3
Figure 4. Test Circuit
3
MOTOROLA
MC74LVX04
OUTLINE DIMENSIONS
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751A–03
ISSUE F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
–A
–
14
8
–B
–
1
P7
PL
0.25 (0.010)
7
G
D
0.25 (0.010)
M
T
F
B
A
S
DIM
A
B
C
D
F
G
J
K
M
P
R
J
M
K
14 PL
M
R X 45°
C
SEATING
PLANE
B
M
S
MILLIMETERS
MIN
MAX
8.75
8.55
4.00
3.80
1.75
1.35
0.49
0.35
1.25
0.40
1.27 BSC
0.25
0.19
0.25
0.10
7°
0°
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.337 0.344
0.150 0.157
0.054 0.068
0.014 0.019
0.016 0.049
0.050 BSC
0.008 0.009
0.004 0.009
7°
0°
0.228 0.244
0.010 0.019
M SUFFIX
PLASTIC SOIC EIAJ PACKAGE
CASE 965–01
ISSUE O
14
NOTES:
1 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2 CONTROLLING DIMENSION: MILLIMETER.
3 DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4 TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5 THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
LE
8
Q1
E HE
M_
L
7
1
DETAIL P
Z
D
e
VIEW P
A
c
b
0.13 (0.005)
MOTOROLA
A1
M
0.10 (0.004)
4
DIM
A
A1
b
c
D
E
e
HE
L
LE
M
Q1
Z
MILLIMETERS
MIN
MAX
--2.05
0.05
0.20
0.35
0.50
0.18
0.27
9.90
10.50
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
10 _
0_
0.70
0.90
--1.42
INCHES
MIN
MAX
--0.081
0.002
0.008
0.014
0.020
0.007
0.011
0.390
0.413
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
10 _
0_
0.028
0.035
--0.056
LCX DATA
BR1339 — REV 3
MC74LVX04
OUTLINE DIMENSIONS
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948G–01
ISSUE O
14X K REF
0.10 (0.004)
0.15 (0.006) T U
M
T U
V
S
NOTES:
1 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2 CONTROLLING DIMENSION: MILLIMETER.
3 DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4 DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5 DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6 TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7 DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
S
S
N
2X
14
L/2
0.25 (0.010)
8
M
B
–U–
L
PIN 1
IDENT.
F
7
1
0.15 (0.006) T U
N
S
DETAIL E
ÇÇÇ
ÉÉÉ
ÇÇÇ
ÉÉÉ
ÇÇÇ
K
A
–V–
K1
J J1
SECTION N–N
–W–
C
0.10 (0.004)
–T– SEATING
PLANE
D
H
G
DETAIL E
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MILLIMETERS
MIN
MAX
4.90
5.10
4.30
4.50
–––
1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.50
0.60
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
INCHES
MIN
MAX
0.193
0.200
0.169
0.177
–––
0.047
0.002
0.006
0.020
0.030
0.026 BSC
0.020
0.024
0.004
0.008
0.004
0.006
0.007
0.012
0.007
0.010
0.252 BSC
0_
8_
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◊
LCX DATA
BR1339 — REV 3
5
MC74LVX04/D
MOTOROLA