MCP1754/MCP1754S 150 mA, 16V, High Performance LDO Features Description • • • • • • • The MCP1754/MCP1754S is a family of CMOS low dropout (LDO) voltage regulators that can deliver up to 150 mA of current while consuming only 56.0 µA of quiescent current (typical). The input operating range is specified from 3.6V to 16.0V, making it an ideal choice for four to six primary cell battery-powered applications, 12V mobile applications and one- to three-cell Li-Ionpowered applications. • • • • • • • • High PSRR: >70 dB @ 1 kHz typical 56.0 µA Typical Quiescent Current Input Operating Voltage Range: 3.6V to16.0V 150 mA Output Current for All Output Voltages Low Drop Out Voltage, 300 mV Typical @ 150 mA 0.4% Typical Output Voltage Tolerance Standard Output Voltage Options (1.8V, 2.5V, 2.8V, 3.0V, 3.3V, 4.0V, 5.0V) Output Voltage Range 1.8V to 5.5V in 0.1V Increments (tighter increments also possible per design) Output Voltage Tolerances of ±2.0% Over Entire Temperature Range Stable with Minimum 1.0 µF Output Capacitance Power Good Output Shutdown Input True Current Foldback Protection Short-Circuit Protection Overtemperature Protection Applications • • • • • • • • • • • Battery-powered Devices Battery-powered Alarm Circuits Smoke Detectors CO2 Detectors Pagers and Cellular Phones Smart Battery Packs PDAs Digital Cameras Microcontroller Power Consumer Products Battery-powered Data Loggers The MCP1754/MCP1754S is capable of delivering 150 mA with only 300 mV (typical) of input to output voltage differential. The output voltage tolerance of the MCP1754/MCP1754S is typically ±0.4% at +25°C and ±2.0% maximum over the operating junction temperature range of -40°C to +125°C. Line regulation is ±0.01% typical at +25°C. Output voltages available for the MCP1754/MCP1754S range from 1.8V to 5.5V. The LDO output is stable when using only 1 µF of output capacitance. Ceramic, tantalum or aluminum electrolytic capacitors may all be used for input and output. Overcurrent limit and overtemperature shutdown provide a robust solution for any application. The MCP1754/MCP1754S family introduces a true current foldback feature. When the load impedance decreases beyond the MCP1754/MCP1754S load rating, the output current and voltage will gracefully foldback towards 30 mA at about 0V output. When the load impedance decreases and returns to the rated load, the MCP1754/MCP1754S will follow the same foldback curve as the device comes out of current foldback. Package options for the MCP1754S include the SOT23A, SOT-89-3, SOT-223-3 and 2x3 DFN-8. Package options for the MCP1754 include the SOT-235, SOT-223-5, and 2x3 DFN-8. Related Literature • AN765, “Using Microchip’s Micropower LDOs”, DS00765, Microchip Technology Inc., 2007 • AN766, “Pin-Compatible CMOS Upgrades to BiPolar LDOs”, DS00766, Microchip Technology Inc., 2003 • AN792, “A Method to Determine How Much Power a SOT23 Can Dissipate in an Application”, DS00792, Microchip Technology Inc., 2001 © 2011 Microchip Technology Inc. DS22276A-page 1 MCP1754/MCP1754S Package Types - MCP1754S 3-Pin SOT-23A 3-Pin SOT-89 VIN SOT-223-3 GND GND 2 4 3 8-Lead 2X3 DFN(*) VOUT 1 NC 2 NC 3 1 1 2 GND VOUT 2 1 3 VIN VIN GND VOUT 2 8 VIN EP 9 GND 4 3 7 NC 6 NC 5 GND Tab will be connected to GND GND VOUT (Note: The 3-lead SOT-223 (DB) is not a standard package for output voltages below 3.0V) * Includes Exposed Thermal Pad (EP); see Table 3-2. Package Types - MCP1754 SOT23-5 SOT-223-5 4 5 8-Lead 2X3 DFN(*) 3 VOUT 1 PWRGD 2 NC 3 1 2 3 1 2 3 4 5 GND 4 8 VIN EP 9 7 NC 6 NC 5 SHDN Tab will be connected to GND PIN 1 2 3 4 5 FUNCTION VIN GND /SHDN PWRGD VOUT PIN 1 2 3 4 5 FUNCTION /SHDN VIN GND VOUT PWRGD * Includes Exposed Thermal Pad (EP); see Table 3-1. DS22276A-page 2 © 2011 Microchip Technology Inc. MCP1754/MCP1754S Functional Block Diagrams MCP1754S VOUT VIN Error Amplifier +VIN Voltage Reference + Over Current Over Temperature GND © 2011 Microchip Technology Inc. DS22276A-page 3 MCP1754/MCP1754S PMOS MCP1754 VIN VOUT Undervoltage Lock Out (UVLO) Sense ISNS Cf Rf SHDN Overtemperature Sensing + Driver w/limit and SHDN EA – SHDN VREF V IN SHDN Reference Soft-Start Comp TDELAY PWRGD GND 92% of VREF Typical Application Circuits CIN 1 µF Ceramic VIN + 12V MCP1754S VOUT GND VOUT 5.0V COUT 1 µF Ceramic DS22276A-page 4 IOUT 30 mA © 2011 Microchip Technology Inc. MCP1754/MCP1754S 1.0 ELECTRICAL CHARACTERISTICS † Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings † Input Voltage, VIN..................................................................+17.6V VIN, PWRGD, SHDN ..................... (GND-0.3V) to (VIN+0.3V) VOUT .................................................. (GND-0.3V) to (+5.5V) Internal Power Dissipation ............ Internally-Limited (Note 6) Output Short Circuit Current ................................. Continuous Storage temperature .....................................-55°C to +150°C Maximum Junction Temperature ......................165°C(Note 7) Operating Junction Temperature...................-40°C to +150°C ESD protection on all pins ..........≥ 4 kV HBM and ≥ 200V MM AC/DC CHARACTERISTICS Electrical Specifications: Unless otherwise specified, all limits are established for VIN = VR + 1V, Note 1, ILOAD = 1 mA, COUT = 1 µF (X7R), CIN = 1 µF (X7R), TA = 25°C, tr(VIN) = 0.5V/µs, SHDN = VIN, PWRGD = 10K to VOUT. Boldface type applies for junction temperatures, TJ (Note 7) of -40°C to +125°C. Parameters Sym Min Typ Max Units Conditions VIN 3.6 — 16.0 V VOUT-RANGE 1.8 — 5.5 V Input Quiescent Current Iq — 56 90 µA IL = 0 mA Input Quiescent Current for SHDN mode ISHDN — 0.1 5 µA SHDN = GND ILOAD = 150 mA Input / Output Characteristics Input Operating Voltage Output Voltage Operating Range IGND — 150 250 µA Maximum Output Current IOUT_mA 150 — — mA Output Soft Current Limit IOUT_CL — 250 — mA VIN = VIN(MIN), VOUT ≥ 0.1V, Current measured 10 ms after load is applied Output Pulse Current Limit IOUT_CL — 250 — mA Pulse Duration < 100 ms, Duty Cycle < 50%, VOUT ≥ 0.1V, Note 6 Output Short Circuit Foldback Current IOUT_SC — 30 — mA VIN = VIN(MIN), VOUT = GND Output Voltage Overshoot on Startup VOVER — 0.5 — %VOUT Ground Current Note 1: 2: 3: 4: 5: 6: 7: VIN = 0 to 16V, ILOAD = 150 mA The minimum VIN must meet two conditions: VIN ≥ 3.6V and VIN ≥ VR + VDROPOUT(MAX). VR is the nominal regulator output voltage when the input voltage VIN = VRated + VDROPOUT(MAX) or ViIN = 3.6V (whichever is greater); IOUT = 1 mA. TCVOUT = (VOUT-HIGH - VOUT-LOW) *106 / (VR * ΔTemperature), VOUT-HIGH = highest voltage measured over the temperature range. VOUT-LOW = lowest voltage measured over the temperature range. Load regulation is measured at a constant junction temperature using low duty cycle pulse testing. Changes in output voltage due to heating effects are determined using thermal regulation specification TCVOUT. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal VR measured value. The nominal VR measured value is obtained with The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum 150°C rating. Sustained junction temperatures above 150°C can impact the device reliability. The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the desired Junction temperature. The test time is small enough such that the rise in the Junction temperature over the ambient temperature is not significant. © 2011 Microchip Technology Inc. DS22276A-page 5 MCP1754/MCP1754S AC/DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise specified, all limits are established for VIN = VR + 1V, Note 1, ILOAD = 1 mA, COUT = 1 µF (X7R), CIN = 1 µF (X7R), TA = 25°C, tr(VIN) = 0.5V/µs, SHDN = VIN, PWRGD = 10K to VOUT. Boldface type applies for junction temperatures, TJ (Note 7) of -40°C to +125°C. Parameters Sym Min Typ Max Units Output Voltage Regulation VOUT VR2.0% VR±0. 2% VR+2.0 % V Note 2 TCVOUT — 22 ppm/°C Note 3 Line Regulation ΔVOUT/ (VOUTXΔVIN) -0.05 ±0.01 Load Regulation ΔVOUT/VOUT -1.1 -0.4 0 % VDROPOUT — 300 500 mV IL = 150 mA IDO — 50 85 µA VIN = 0.95VR, IOUT = 0 mA Undervoltage Lockout UVLO — 2.95 — V Rising VIN Undervoltage Lockout Hysterisis UVLOHYS — 285 — mV Falling VIN Logic High Input VSHDN-HIGH 2.4 — VIN(MAX) V Logic Low Input VSHDN-LOW 0.0 — 0.8 V SHDNILK — — 0.100 0.500 0.500 2.0 µA SHDN = GND SHDN = 16V PWRGD Input Voltage Operating Range VPWRGD_VIN 1.7 — VIN V ISINK = 1 mA PWRGD Threshold Voltage (Referenced to VOUT) VPWRGD_TH 90 92 94 %VOUT Falling Edge of VOUT PWRGD Threshold Hysteresis VPWRGD_HYS — 2.0 — %VOUT Rising Edge of VOUT PWRGD Output Voltage Low VPWRGD_L — 0.2 0.6 V PWRGD Output Sink Current IPWRGD_L 5.0 — — mA VPWRGD ≤ 0.4V PWRGD Leakage Current IPWRGD_LK — 40 700 nA VPWRGD Pullup = 10 KΩ to VIN, VIN = 16V VOUT Temperature Coefficient Dropout Voltage (Note 5) Dropout Current +0.05 %/V Conditions VR + 1V ≤ VIN ≤ 16V IL = 1.0 mA to 150 mA, Note 4 Undervoltage Lockout Shutdown Input Shutdown Input Leakage Current Power Good Output Note 1: 2: 3: 4: 5: 6: 7: IPWRGD_SINK = 5.0 mA, VOUT = 0V The minimum VIN must meet two conditions: VIN ≥ 3.6V and VIN ≥ VR + VDROPOUT(MAX). VR is the nominal regulator output voltage when the input voltage VIN = VRated + VDROPOUT(MAX) or ViIN = 3.6V (whichever is greater); IOUT = 1 mA. TCVOUT = (VOUT-HIGH - VOUT-LOW) *106 / (VR * ΔTemperature), VOUT-HIGH = highest voltage measured over the temperature range. VOUT-LOW = lowest voltage measured over the temperature range. Load regulation is measured at a constant junction temperature using low duty cycle pulse testing. Changes in output voltage due to heating effects are determined using thermal regulation specification TCVOUT. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal VR measured value. The nominal VR measured value is obtained with The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum 150°C rating. Sustained junction temperatures above 150°C can impact the device reliability. The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the desired Junction temperature. The test time is small enough such that the rise in the Junction temperature over the ambient temperature is not significant. DS22276A-page 6 © 2011 Microchip Technology Inc. MCP1754/MCP1754S AC/DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise specified, all limits are established for VIN = VR + 1V, Note 1, ILOAD = 1 mA, COUT = 1 µF (X7R), CIN = 1 µF (X7R), TA = 25°C, tr(VIN) = 0.5V/µs, SHDN = VIN, PWRGD = 10K to VOUT. Boldface type applies for junction temperatures, TJ (Note 7) of -40°C to +125°C. Parameters Sym Min Typ Max Units Conditions PWRGD Time Delay TPG — 100 — µs Rising Edge of VOUT, RPULLUP = 10 kΩ Detect Threshold to PWRGD Active Time Delay TVDET_PWRGD — 200 — µs Falling Edge of VOUT after Transition from VOUT = VPRWRGD_TH + 50 mV, to VPWRGD_TH - 50 mV, RPULLUP = 10kΩ to VIN Output Delay From VIN To VOUT = 90% VREG TDELAY — 240 — µs VIN = 0V to 16V, VOUT = 90% VR, tr (VIN)= 5V/µs, COUT = 1 µF, SHDN = VIN Output Delay From VIN To VOUT > 0.1V TDELAY_START — 80 — µs VIN = 0V to 16V, VOUT ≥ 0.1V, tr (VIN)= 5V/µs, COUT = 1 µF, SHDN = VIN Output Delay From SHDN TDELAY_SHDN — 160 — µs VIN = 16V, VOUT = 90% VR, COUT = 1 µF, SHDN = GND to VIN eN — 3 — PSRR — 72 — dB VR = 5V, f = 1 kHz, IL = 150 mA, VINAC = 1V pk-pk, CIN = 0 µF, VIN = VR + 1.5V Thermal Shutdown Temperature TSD — 150 — °C Note 6 Thermal Shutdown Hysteresis ΔTSD — 10 — °C AC Performance Output Noise Power Supply Ripple Rejection Ratio Note 1: 2: 3: 4: 5: 6: 7: µV/(Hz)1/2 IL = 50 mA, f = 1 kHz, COUT = 1 µF The minimum VIN must meet two conditions: VIN ≥ 3.6V and VIN ≥ VR + VDROPOUT(MAX). VR is the nominal regulator output voltage when the input voltage VIN = VRated + VDROPOUT(MAX) or ViIN = 3.6V (whichever is greater); IOUT = 1 mA. TCVOUT = (VOUT-HIGH - VOUT-LOW) *106 / (VR * ΔTemperature), VOUT-HIGH = highest voltage measured over the temperature range. VOUT-LOW = lowest voltage measured over the temperature range. Load regulation is measured at a constant junction temperature using low duty cycle pulse testing. Changes in output voltage due to heating effects are determined using thermal regulation specification TCVOUT. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal VR measured value. The nominal VR measured value is obtained with The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum 150°C rating. Sustained junction temperatures above 150°C can impact the device reliability. The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the desired Junction temperature. The test time is small enough such that the rise in the Junction temperature over the ambient temperature is not significant. © 2011 Microchip Technology Inc. DS22276A-page 7 MCP1754/MCP1754S TEMPERATURE SPECIFICATIONS (Note 1) Parameters Sym Min TA Operating Temperature Range Storage Temperature Range Thermal Resistance, SOT-223-3 θJA θJC — — Thermal Resistance, SOT-223-5 θJA θJC Thermal Resistance, SOT-23A-3 Typ Max Units -40 +125 °C TJ -40 +150 °C TA -55 +150 °C 62 15 — — °C/W — — 62 15 — — °C/W θJA θJC — — 336 110 — — °C/W Thermal Resistance, SOT-89-3 θJA θJC — — 153.3 100 — — °C/W Thermal Resistance, 2X3 DFN θJA θJC — — 93 26 — — °C/W Conditions Temperature Ranges Specified Temperature Range Thermal Package Resistance Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum 150°C rating. Sustained junction temperatures above 150°C can impact the device reliability. DS22276A-page 8 © 2011 Microchip Technology Inc. MCP1754/MCP1754S 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated VR = 3.3V, COUT = 1 µF Ceramic (X7R), CIN = 1 µF Ceramic (X7R), IL = 1 mA, TA = +25 °C, VIN = VR + 1V or VIN = 3.6V (whichever is greater), SHDN = VIN, package = SOT223. Note: Junction Temperature (TJ) is approximated by soaking the device under test to an ambient temperature equal to the desired Junction temperature. The test time is small enough such that the rise in Junction temperature over the ambient temperature is not significant. 180 +90°C 160 70 +25°C +130°C 60 -45°C 0°C 50 VOUT = 1.8V IOUT = 0 µA GND Current (µA) Quiescent Current (µA) 80 140 120 VOUT = 5.0V 100 80 VOUT = 3.3V 60 VOUT = 1.8V 40 40 3 4 5 6 7 8 9 10 11 12 13 14 15 16 0 20 40 Input Voltage (V) FIGURE 2-1: Voltage. Quiescent Current vs. Input FIGURE 2-4: Current. +130°C +90°C 60 55 +25°C 0°C 50 -45°C 45 40 5 7 9 11 13 140 160 VOUT = 1.8V 60 50 40 30 VOUT = 3.3V 20 10 15 -45 -20 Quiescent Current vs. Input VOUT = 5.0V IOUT = 0 µA +130°C 30 55 80 80 50 +25°C 30 105 130 FIGURE 2-5: Quiescent Current vs. Junction Temperature. +90°C 60 40 5 Junction Temperature (°C) 0°C -45°C 20 10 0 Quiescent Current (µA) FIGURE 2-2: Voltage. Quiescent Current (µA) 120 Ground Current vs. Load VOUT = 5.0V 70 Input Voltage (V) 70 100 0 3 80 80 80 VOUT = 3.3V IOUT = 0 µA Quiescent Current (µA) Quiescent Current (µA) 70 65 60 Load Current (mA) VOUT = 5.0V 70 60 50 +25°C 40 30 20 10 0 1.0 3.0 5.0 7.0 9.0 11.0 13.0 15.0 17.0 18 16 Input Voltage (V) FIGURE 2-3: Voltage. Quiescent Current vs. Input © 2011 Microchip Technology Inc. 14 12 10 8 6 4 2 0 Input Voltage (V) FIGURE 2-6: Voltage. Quiescent Current vs. Input DS22276A-page 9 MCP1754/MCP1754S Note: Unless otherwise indicated VR = 3.3V, COUT = 1 µF Ceramic (X7R), CIN = 1 µF Ceramic (X7R), IL = 1 mA, TA = +25 °C, VIN = VR + 1V or VIN = 3.6V (whichever is greater), SHDN = VIN, package = SOT223. 1.815 1.814 +25°C 1.812 VOUT = 1.8V 1.810 1.808 +130°C 0°C 1.806 1.804 -45°C 1.802 1.800 1.810 90°C 1.805 0°C 1.800 130°C -45°C 1.795 1.790 3 4 5 6 7 8 0 9 10 11 12 13 14 15 16 25 50 Input Voltage (V) 75 100 125 150 Load Current (mA) Output Voltage vs. Input FIGURE 2-10: Current. Output Voltage vs. Load 3.310 3.310 3.308 3.306 3.304 3.302 3.300 3.298 3.296 3.294 3.292 3.290 VOUT = 3.3V VOUT = 3.3V Output Voltage (V) Output Voltage (V) FIGURE 2-7: Voltage. +90°C +130°C +25°C 0°C -45°C 3.305 25°C 90°C 3.300 3.295 3.290 -45°C 0°C 3.285 130°C 3.280 4 5 6 7 8 0 9 10 11 12 13 14 15 16 25 Input Voltage (V) FIGURE 2-8: Voltage. 50 75 100 125 150 Load Current (mA) Output Voltage vs. Input FIGURE 2-11: Current. Output Voltage vs. Load 5.020 5.020 VOUT = 5.0V +130°C 5.012 +90°C 5.008 -45°C VOUT = 5.0V 5.015 5.016 Output Voltage (V) Output Voltage (V) VOUT = 1.8V 25°C Output Voltage (V) Output Voltage (V) +90°C +25°C 5.004 130°C 5.010 90°C 5.005 5.000 25°C 4.995 4.990 4.985 0°C 5.000 6 7 -45°C 4.980 8 9 10 11 12 13 14 15 16 0 Input Voltage (V) FIGURE 2-9: Voltage. DS22276A-page 10 Output Voltage vs. Input 25 50 75 100 0°C 125 150 Load Current (mA) FIGURE 2-12: Current. Output Voltage vs. Load © 2011 Microchip Technology Inc. MCP1754/MCP1754S Note: Unless otherwise indicated VR = 3.3V, COUT = 1 µF Ceramic (X7R), CIN = 1 µF Ceramic (X7R), IL = 1 mA, TA = +25 °C, VIN = VR + 1V or VIN = 3.6V (whichever is greater), SHDN = VIN, package = SOT223. 0.500 Dropout Voltage (V) VOUT = 3.3V 0.400 +25°C +90°C 0.300 +130°C 0.200 0°C 0.100 -45°C 0.000 0 15 30 45 60 75 90 105 120 135 150 Load Current (mA) Dropout Voltage vs. Load Dropout Voltage (V) 0.400 VOUT = 3.3V 0.350 +25°C 0.300 +90°C 0.250 -45°C 0.200 0.150 +130°C 0.100 0°C 0.050 FIGURE 2-16: Short Circuit Current (mA) FIGURE 2-13: Current. Dynamic Line Response. 50 0°C 25°C 90°C 130°C 40 VOUT = 3.3V 30 -45°C 20 10 0 0.000 0 15 30 45 60 75 90 105 120 135 150 4 6 FIGURE 2-14: Current. Dropout Voltage vs. Load FIGURE 2-15: Dynamic Line Response. © 2011 Microchip Technology Inc. 8 10 12 14 16 Input Voltage (V) Load Current (mA) FIGURE 2-17: Input Voltage. Short Circuit Current vs. DS22276A-page 11 MCP1754/MCP1754S Unless otherwise indicated VR = 3.3V, COUT = 1 µF Ceramic (X7R), CIN = 1 µF Ceramic (X7R), IL = 1 mA, TA = +25 °C, VIN = VR + 1V or VIN = 3.6V (whichever is greater), SHDN = VIN, package = SOT223. 0.01 VIN = 3.6V VIN = 5V VIN = 16V VIN = 12V VIN = 10V -20 5 FIGURE 2-18: Temperature. 30 55 80 Temperature (°C) 105 -0.01 50 mA 150 mA -0.02 -45 VIN = 4.3V VIN = 5V -0.40 VIN = 16V -20 5 FIGURE 2-21: Temperature. VIN = 10V VIN = 12V -0.80 30 55 80 Temperature (°C) 105 130 Line Regulation vs. 0.01 VOUT=3.3V 0 mA -1.00 0.00 10 mA -0.01 50 mA 100 mA 150 mA -0.02 -0.03 -45 -20 5 FIGURE 2-19: Temperature. 30 55 80 Temperature (°C) 105 130 Load Regulation vs. 0.00 -45 VIN = 4.3V VIN = 5V -0.40 VIN = 16V VIN = 10V VIN = 12V -0.80 -1.00 -45 -20 FIGURE 2-20: Temperature. DS22276A-page 12 5 30 55 80 Temperature (°C) 105 Load Regulation vs. 5 130 30 55 Temperature (°C) 80 105 130 Line Regulation vs. 0.01 VOUT=3.3V Iout = 1 mA to 150 mA -0.20 -20 FIGURE 2-22: Temperature. VOUT=5V 0 mA Line Regulation (%/V) Load Regulation (%) 0.00 130 VOUT=3.3V Iout = 1 mA to 150 mA -0.20 -0.60 VOUT=1.8V 0 mA 100 mA Load Regulation vs. 0.00 -0.60 10 mA -0.03 -45 Load Regulation (%) VOUT=1.8V Iout = 1 mA to 150 mA Line Regulation (%/V) -0.50 -0.60 -0.70 -0.80 -0.90 -1.00 -1.10 -1.20 -1.30 -1.40 -1.50 Line Regulation (%/V) Load Regulation (%) Note: 0.00 10 mA -0.01 50 mA 150 mA -0.02 100 mA -0.03 -45 -20 FIGURE 2-23: Temperature. 5 30 55 Temperature (°C) 80 105 130 Line Regulation vs. © 2011 Microchip Technology Inc. MCP1754/MCP1754S PSRR (dB) Note: Unless otherwise indicated VR = 3.3V, COUT = 1 µF Ceramic (X7R), CIN = 1 µF Ceramic (X7R), IL = 1 mA, TA = +25 °C, VIN = VR + 1V or VIN = 3.6V (whichever is greater), SHDN = VIN, package = SOT223. 0 -10 VOUT=1.8V VIN=6.5V -20 VINAC = 1 V p-p -30 CIN=0 μF -40 -50 -60 -70 -80 -90 -100 -110 0.01 0.1 IOUT = 150 mA IOUT = 10 mA 1 10 Frequency (KHz) 100 1000 PSRR (dB) FIGURE 2-24: Power Supply Ripple Rejection vs. Frequency. 0 VOUT=5.0V -10 VIN=6.5V VINAC = 1V p-p -20 CIN=0 μF -30 -40 -50 -60 -70 -80 -90 -100 0.01 0.1 FIGURE 2-28: Startup From Shutdown. IOUT = 40 mA 1 10 Frequency (KHz) 100 1000 2.00 VOUT=5.0V, VIN=6.0V IOUT=50mA Output Voltage (V) 10.000 Noise (μV/√Hz) Power Up Timing. IOUT = 160 mA FIGURE 2-25: Power Supply Ripple Rejection vs. Frequency. 1.000 0.100 FIGURE 2-27: VOUT=3.3V, VIN=4.3V VOUT=1.8V, VIN=3.6V 0.010 0.001 0.01 1.75 1.50 VIN = 3.6V VOUT = 1.8V 1.25 1.00 0.75 Increasing Load 0.50 Decreasing Load 0.25 0.1 1 10 Frequency (KHz) 100 1000 FIGURE 2-26: Output Noise vs. Frequency (3 lines, VR = 1.2V, 3.3V, 5.0V). © 2011 Microchip Technology Inc. 0.00 0.00 0.05 FIGURE 2-29: Foldback. 0.10 0.15 0.20 Output Current (A) 0.25 0.30 Short Circuit Current DS22276A-page 13 MCP1754/MCP1754S Note: Unless otherwise indicated VR = 3.3V, COUT = 1 µF Ceramic (X7R), CIN = 1 µF Ceramic (X7R), IL = 1 mA, TA = +25 °C, VIN = VR + 1V or VIN = 3.6V (whichever is greater), SHDN = VIN, package = SOT223. Output Voltage (V) 3.5 3.0 2.5 VIN = 4.3V VOUT = 3.3V 2.0 1.5 1.0 Increasing Load Decreasing Load 0.5 0.0 0.00 0.05 Output Voltage (V) FIGURE 2-30: Foldback. 5.5 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0.00 0.10 0.15 0.20 Output Current (A) 0.25 0.30 Short Circuit Current FIGURE 2-32: Dynamic Load Response. FIGURE 2-33: Dynamic Load Response. VIN = 6V VOUT = 5V Increasing Load Decreasing Load 0.05 FIGURE 2-31: Foldback. DS22276A-page 14 0.10 0.15 0.20 Output Current (A) 0.25 Short Circuit Current 0.30 © 2011 Microchip Technology Inc. MCP1754/MCP1754S 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1 and Table 3-2. TABLE 3-1: MCP1754 PIN FUNCTION TABLE Pin No. SOT223-5 Pin No. SOT23-5 Pin No. 2X3 DFN 3 2 4 GND Ground Terminal 4 5 1 VOUT Regulated Voltage Output Name Function 2 1 8 VIN Unregulated Supply Voltage — — 3,6,7 NC No Connection 5 4 2 PWRGD 1 3 5 SHDN EP — EP GND TABLE 3-2: Open Drain Power Good Output Shutdown Input Exposed Pad, Connected to GND MCP1754S PIN FUNCTION TABLE Pin No. SOT223-3 Pin No. SOT23A Pin No. SOT89 2 1 2 4 GND Ground Terminal 3 2 3 1 VOUT Regulated Voltage Output 3.1 Pin No. 2X3 DFN Function 1 3 1 8 VIN Unregulated Supply Voltage — — — 2,3,5,6,7 NC No Connection EP — EP EP GND Ground Terminal (GND) Regulator ground. Tie GND to the negative side of the output and the negative side of the input capacitor. Only the LDO bias current flows out of this pin; there is no high current. The LDO output regulation is referenced to this pin. Minimize voltage drops between this pin and the negative side of the load. 3.2 Name Regulated Output Voltage (VOUT) Connect VOUT to the positive side of the load and the positive terminal of the output capacitor. The positive side of the output capacitor should be physically located as close to the LDO VOUT pin as is practical. The current flowing out of this pin is equal to the DC load current. © 2011 Microchip Technology Inc. 3.3 Exposed Pad, Connected to GND Unregulated Input Voltage (VIN) Connect VIN to the input unregulated source voltage. Like all low dropout linear regulators, low source impedance is necessary for the stable operation of the LDO. The amount of capacitance required to ensure low source impedance will depend on the proximity of the input source capacitors or battery type. For most applications, 1 µF of capacitance will ensure stable operation of the LDO circuit. The input capacitor should have a capacitance value equal to or larger than the output capacitor for performance applications. The input capacitor will supply the load current during transients and improve performance. For applications that have load currents below 10 mA, the input capacitance requirement can be lowered. The type of capacitor used may be ceramic, tantalum or aluminum electrolytic. The low ESR characteristics of the ceramic will yield better noise and PSRR performance at highfrequency. DS22276A-page 15 MCP1754/MCP1754S 3.4 Shutdown Input (SHDN) The SHDN input is used to turn the LDO output voltage on and off. When the SHDN input is at a logic-high level, the LDO output voltage is enabled. When the SHDN input is pulled to a logic-low level, the LDO output voltage is disabled. When the SHDN input is pulled low, the PWRGD output also goes low and the LDO enters a low quiescent current shutdown state. 3.5 3.6 Exposed Pad (EP) Some of the packages have an exposed metal pad on the bottom of the package. The exposed metal pad gives the device better thermal characteristics by providing a good thermal path to either the PCB or heat sink to remove heat from the device. The exposed pad of the package is internally connected to GND. Power Good Output (PWRGD) For fixed applications, the PWRGD output is an opendrain output used to indicate when the LDO output voltage is within 92% (typically) of its nominal regulation value. The PWRGD threshold has a typical hysteresis value of 2%. The PWRGD output is delayed by 100 µs (typical) from the time the LDO output is within 92% + 2% (typical hysteresis) of the regulated output value on power-up. This delay time is internally fixed. The PWRGD pin may be pulled up to VIN or VOUT. Pulling up to VOUT conserves power when the device is in shutdown (/SHDN = 0V) mode. DS22276A-page 16 © 2011 Microchip Technology Inc. MCP1754/MCP1754S 4.0 DEVICE OVERVIEW MCP1754S will supply higher load currents of up to typically 250 mA. This allows for device usage in applications that have pulsed load currents having an average output current value of 150 mA or less. The MCP1754/MCP1754S is a 150 mA output current, Low Dropout (LDO) voltage regulator. The low dropout voltage of 300 mV typical at 150 mA of current makes it ideal for battery-powered applications. The input voltage range is 3.6V to 16.0V. Unlike other high output current LDOs, the MCP1754/MCP1754S typically draws only 150 µA of quiescent current for a 150 mA load. The MCP1754 adds a shutdown control input pin and a power good output pin. The output voltage options are fixed. 4.1 Output overload conditions may also result in an overtemperature shutdown of the device. If the junction temperature rises above 150°C (typical), the LDO will shut down the output. See Section 4.8 “Overtemperature Protection” for more information on overtemperature shutdown. 4.3 LDO Output Voltage The MCP1754/MCP1754S requires a minimum output capacitance of 1 µF for output voltage stability. Ceramic capacitors are recommended because of their size, cost and environmentally robust qualities. The MCP1754/MCP1754S LDO has a fixed output voltage. The output voltage range is 1.8V to 5.5V. 4.2 Output Capacitor Aluminum-electrolytic and tantalum capacitors can be used on the LDO output as well. The Equivalent Series Resistance (ESR) of the electrolytic output capacitor should be no greater than 2.0 Ω. The output capacitor should be located as close to the LDO output as is practical. Ceramic materials X7R and X5R have low temperature coefficients and are well within the acceptable ESR range required. A typical 1 µF X7R 0805 capacitor has an ESR of 50 milliohms. Output Current and Current Limiting The MCP1754/MCP1754S LDO is tested and ensured to supply a minimum of 150 mA of output current. The MCP1754/MCP1754S has no minimum output load, so the output load current can go to 0 mA and the LDO will continue to regulate the output voltage to within tolerance. Larger LDO output capacitors can be used with the MCP1754/MCP1754S to improve dynamic performance and power supply ripple rejection performance. A maximum of 1000 µF is recommended. Aluminum-electrolytic capacitors are not recommended for low temperature applications of < -25°C. The MCP1754/MCP1754S also incorporates a true output current foldback. If the output load presents an excessive load due to a low impedance short circuit condition, the output current and voltage will fold back towards 30 mA and 0V respectively. The output voltage and current will resume normal levels when the excessive load is removed. If the overload condition is a soft overload, the MCP1754/ Typical Current FoldBack - 5V Output Increasing Load Decreasing Load 6 VOUT (V) 5 4 3 2 1 0 0.000 0.050 0.100 0.150 0.200 0.250 IOUT (A) FIGURE 4-1: Typical Current Foldback. © 2011 Microchip Technology Inc. DS22276A-page 17 MCP1754/MCP1754S 4.4 Input Capacitor Low input source impedance is necessary for the LDO output to operate properly. When operating from batteries, or in applications with long lead length (> 10 inches) between the input source and the LDO, some input capacitance is recommended. A minimum of 1.0 µF to 4.7 µF is recommended for most applications. For applications that have output step load requirements, the input capacitance of the LDO is very important. The input capacitance provides the LDO with a good local low-impedance source to pull the transient currents from in order to respond quickly to the output load step. For good step response performance, the input capacitor should be of equivalent or higher value than the output capacitor. The capacitor should be placed as close to the input of the LDO as is practical. Larger input capacitors will also help reduce any high-frequency noise on the input and output of the LDO and reduce the effects of any inductance that exists between the input source voltage and the input capacitance of the LDO. 4.5 Power Good Output (PWRGD) The open drain PWRGD output is used to indicate when the output voltage of the LDO is within 94% (typical value, see Section 1.0 “Electrical Characteristics” for minimum and maximum specifications) of its nominal regulation value. As the output voltage of the LDO rises, the open drain PWRGD output will actively be held low until the output voltage has exceeded the power good threshold plus the hysteresis value. Once this threshold has been exceeded, the power good time delay is started (shown as TPG in the Electrical Characteristics table). The power good time delay is fixed at 100 µs (typical). After the time delay period, the PWRGD open drain output becomes inactive and may be pulled high by an external pullup resistor, indicating that the output voltage is stable and within regulation limits. The power good output is typically pulled up to VIN or VOUT. Pulling the signal up to VOUT conserves power during shutdown mode. If the output voltage of the LDO falls below the power good threshold, the power good output will transition low. The power good circuitry has a 200 µs delay when detecting a falling output voltage, which helps to increase noise immunity of the power good output and avoid false triggering of the power good output during fast output transients. See Figure 4-2 for power good timing characteristics. When the LDO is put into Shutdown mode using the SHDN input, the power good output is pulled low immediately, indicating that the output voltage will be DS22276A-page 18 out of regulation. The timing diagram for the power good output when using the shutdown input is shown in Figure 4-3. The power good output is an open-drain output that can be pulled up to any voltage that is equal to or less than the LDO input voltage. This output is capable of sinking 1.2 mA minimum (VPWRGD < 0.4V maximum). VPWRGD_TH VOUT TPG VOH TVDET_PWRGD PWRGD VOL FIGURE 4-2: VIN Power Good Timing. TDELAY_SHDN TPG SHDN VOUT PWRGD FIGURE 4-3: Shutdown. 4.6 Power Good Timing from Shutdown Input (SHDN) The SHDN input is an active-low input signal that turns the LDO on and off. The SHDN threshold is a fixed voltage level. The minimum value of this shutdown threshold required to turn the output ON is 2.4V. The maximum value required to turn the output OFF is 0.8V. © 2011 Microchip Technology Inc. MCP1754/MCP1754S The SHDN input will ignore low-going pulses (pulses meant to shut down the LDO) that are up to 400 ns in pulse width. If the shutdown input is pulled low for more than 400 ns, the LDO will enter Shutdown mode. This small bit of filtering helps to reject any system noise spikes on the shutdown input signal. On the rising edge of the SHDN input, the shutdown circuitry has a 30 µs delay before allowing the LDO output to turn on. This delay helps to reject any false turn-on signals or noise on the SHDN input signal. After the 30 µs delay, the LDO output enters its soft-start period as it rises from 0V to its final regulation value. If the SHDN input signal is pulled low during the 30 µs delay period, the timer will be reset and the delay time will start over again on the next rising edge of the SHDN input. The total time from the SHDN input going high (turn-on) to the LDO output being in regulation is typically 100 µs. See Figure 4-4 for a timing diagram of the SHDN input. TDELAY_SHDN 400 ns (typ) 30 µs 70 µs For high-current applications, voltage drops across the PCB traces must be taken into account. The trace resistances can cause significant voltage drops between the input voltage source and the LDO. For applications with input voltages near 3.0V, these PCB trace voltage drops can sometimes lower the input voltage enough to trigger a shutdown due to undervoltage lockout. 4.8 Overtemperature Protection The MCP1754/MCP1754S LDO has temperaturesensing circuitry to prevent the junction temperature from exceeding approximately 150°C. If the LDO junction temperature does reach 150°C, the LDO output will be turned off until the junction temperature cools to approximately 137°C, at which point the LDO output will automatically resume normal operation. If the internal power dissipation continues to be excessive, the device will again shut off. The junction temperature of the die is a function of power dissipation, ambient temperature and package thermal resistance. See Section 5.0 “Application Circuits & Issues” for more information on LDO power dissipation and junction temperature. SHDN VOUT FIGURE 4-4: Diagram. 4.7 Shutdown Input Timing Dropout Voltage and Undervoltage Lockout Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below the nominal value that was measured with a VR + 1.0V differential applied. The MCP1754/ MCP1754S LDO has a very low dropout voltage specification of 300 mV (typical) at 150 mA of output current. See Section 1.0 “Electrical Characteristics” for maximum dropout voltage specifications. The MCP1754/MCP1754S LDO operates across an input voltage range of 3.6V to 16.0V and incorporates input Undervoltage Lockout (UVLO) circuitry that keeps the LDO output voltage off until the input voltage reaches a minimum of 2.95V (typical) on the rising edge of the input voltage. As the input voltage falls, the LDO output will remain on until the input voltage level reaches 2.70V (typical). © 2011 Microchip Technology Inc. DS22276A-page 19 MCP1754/MCP1754S NOTES: DS22276A-page 20 © 2011 Microchip Technology Inc. MCP1754/MCP1754S 5.0 APPLICATION CIRCUITS & ISSUES 5.1 The MCP1754/MCP1754S is most commonly used as a voltage regulator. It’s low quiescent current and low dropout voltage make it ideal for many battery-powered applications. MCP1754S VOUT 1.8V VIN 3.6V to 4.8V VIN VOUT IOUT 50 mA T J ( MAX ) = P TOTAL × Rθ JA + T AMAX TJ(MAX) = Maximum continuous junction temperature Typical Application GND EQUATION COUT 1 µF Ceramic CIN 1 µF Ceramic PTOTAL = Total device power dissipation RθJA = Thermal resistance from junction to ambient TAMAX = Maximum ambient temperature The maximum power dissipation capability for a package can be calculated given the junction-toambient thermal resistance and the maximum ambient temperature for the application. The following equation can be used to determine the package maximum internal power dissipation. EQUATION FIGURE 5-1: 5.1.1 Typical Application Circuit. APPLICATION INPUT CONDITIONS Package Type = SOT23 Input Voltage Range = 3.6V to 4.8V VIN maximum = 4.8V VOUT typical = 1.8V IOUT = 50 mA maximum 5.2 Power Calculations 5.2.1 POWER DISSIPATION The internal power dissipation of the MCP1754/ MCP1754S is a function of input voltage, output voltage and output current. The power dissipation, as a result of the quiescent current draw, is so low, it is insignificant (56.0 µA x VIN). The following equation can be used to calculate the internal power dissipation of the LDO. ( T J ( MAX ) – T A ( MAX ) ) P D ( MAX ) = --------------------------------------------------Rθ JA PD(MAX) = Maximum device power dissipation TJ(MAX) = Maximum continuous junction temperature TA(MAX) = Maximum ambient temperature RθJA = Thermal resistance from junction to ambient EQUATION T J ( RISE ) = P D ( MAX ) × Rθ JA TJ(RISE) = Rise in device junction temperature over the ambient temperature PD(MAX) = Maximum device power dissipation RθJA = Thermal resistance from junction to ambient EQUATION EQUATION P LDO = ( VIN ( MAX ) ) – V OUT ( MIN ) ) × I OUT ( MAX ) ) T J = T J ( RISE ) + T A TJ = Junction Temperature PLDO = LDO Pass device internal power dissipation TJ(RISE) = Rise in device junction temperature over the ambient temperature VIN(MAX) = Maximum input voltage TA = Ambient temperature VOUT(MIN) = LDO minimum output voltage The maximum continuous operating junction temperature specified for the MCP1754/MCP1754S is +150°C. To estimate the internal junction temperature of the MCP1754/MCP1754S, the total internal power dissipation is multiplied by the thermal resistance from junction to ambient (RθJA). The thermal resistance from junction to ambient for the SOT23A pin package is estimated at 336 °C/W. © 2011 Microchip Technology Inc. DS22276A-page 21 MCP1754/MCP1754S 5.3 Voltage Regulator Internal power dissipation, junction temperature rise, junction temperature and maximum power dissipation are calculated in the following example. The power dissipation, as a result of ground current, is small enough to be neglected. 5.3.1 TJ = TJRISE + TA(MAX) TJ = 91.3°C Maximum Package Power Dissipation Examples at +40°C Ambient Temperature SOT23 (336.0°C/Watt = RθJA) PD(MAX) = (125°C - 40°C) / 336°C/W POWER DISSIPATION EXAMPLE Package Package Type = SOT23 PD(MAX) = 253 milliwatts SOT89 (153.3°C/Watt = RθJA) PD(MAX) = (125°C - 40°C) / 153.3°C/W Input Voltage PD(MAX) = 554 milliwatts VIN = 3.6V to 4.8V LDO Output Voltages and Currents VOUT = 1.8V IOUT = 50 mA Maximum Ambient Temperature TA(MAX) = +40°C Internal Power Dissipation Internal Power dissipation is the product of the LDO output current times the voltage across the LDO (VIN to VOUT). PLDO(MAX) = (VIN(MAX) - VOUT(MIN)) x IOUT(MAX) PLDO = (4.8V - (0.97 x 1.8V)) x 50 mA PLDO = 152.7 milli-Watts 5.4 Voltage Reference The MCP1754/MCP1754S can be used not only as a regulator, but also as a low quiescent current voltage reference. In many microcontroller applications, the initial accuracy of the reference can be calibrated using production test equipment or by using a ratio measurement. When the initial accuracy is calibrated, the thermal stability and line regulation tolerance are the only errors introduced by the MCP1754/ MCP1754S LDO. The low cost, low quiescent current and small ceramic output capacitor are all advantages when using the MCP1754/MCP1754S as a voltage reference. Ratio Metric Reference Device Junction Temperature Rise The internal junction temperature rise is a function of internal power dissipation and the thermal resistance from junction to ambient for the application. The thermal resistance from junction to ambient (RθJA) is derived from an EIA/JEDEC standard for measuring thermal resistance for small surface mount packages. The EIA/ JEDEC specification is JESD51-7, “High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages”. The standard describes the test method and board specifications for measuring the thermal resistance from junction to ambient. The actual thermal resistance for a particular application can vary depending on many factors, such as copper area and thickness. Refer to AN792, “A Method to Determine How Much Power a SOT23 Can Dissipate in an Application”, (DS00792), for more information regarding this subject. TJ(RISE) = PTOTAL x RqJA TJRISE = 152.7 milliwatts x 336.0°C/Watt TJRISE = 51.3°C Junction Temperature Estimate To estimate the internal junction temperature, the calculated temperature rise is added to the ambient or offset temperature. For this example, the worst-case junction temperature is estimated below. DS22276A-page 22 MCP1754S PICmicro® microcontroller 56 µA Bias CIN 1 µF VIN VOUT GND COUT 1 µF VREF ADO AD1 Bridge Sensor FIGURE 5-2: Using the MCP1754/MCP1754S as a Voltage Reference. 5.5 Pulsed Load Applications For some applications, there are pulsed load current events that may exceed the specified 150 mA maximum specification of the MCP1754/MCP1754S. The internal current limit of the MCP1754/MCP1754S will prevent high peak load demands from causing nonrecoverable damage. The 150 mA rating is a maximum average continuous rating. As long as the average current does not exceed 150 mA, pulsed higher load currents can be applied to the MCP1754/MCP1754S. The typical current limit for the MCP1754/MCP1754S is 250 mA (TA +25°C). © 2011 Microchip Technology Inc. MCP1754/MCP1754S 6.0 PACKAGING INFORMATION 6.1 Package Marking Information Example: 3-Lead SOT-223 (MCP1754S) XXXXXXX Part Number XXXYYWW NNN Code 1754S18 MCP1754ST-3302E/DB 1754S33 MCP1754ST-5002E/DB 1754S50 EDB1130 256 3-Lead SOT-23A (MCP1754S) XXNN Example: Part Number Code MCP1754ST-1802E/CB JCNN JC25 MCP1754ST-3302E/CB JDNN MCP1754ST-5002E/CB JENN 3-Lead SOT-89 (MCP1754S) Example: Part Number Code MT1130 MCP1754ST-1802E/MB MTYYWW NNN Legend: XX...X Y YY WW NNN e3 * Note: MCP1754ST-3302E/MB MUYYWW 256 MCP1754ST-5002E/MB MVYYWW Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. © 2011 Microchip Technology Inc. DS22276A-page 23 MCP1754/MCP1754S Package Marking Information (Continued) Example: 5-Lead SOT-23 (2x3) (MCP1754) Part Number XXNN Code MCP1754T-1802E/OT YQNN MCP1754T-3302E/OT YRNN MCP1754T-5002E/OT YSNN YQ25 5-Lead SOT-223 (MCP1754) Example: XXXXXXX Part Number XXXYYWW NNN Code MCP1754T-1802E/DC 175418 MCP1754T-3302E/DC 175433 MCP1754T-5002E/DC 175450 175418 EDC1130 256 Example: 8-Lead DFN (2x3) (MCP1754) Part Number Code Part Number Code MCP1754-1802E/MC AKG MCP1754S-1802E/MC ALN MCP1754-3302E/MC AKH MCP1754S-3302E/MC ALM MCP1754-5002E/MC AKJ MCP1754S-5002E/MC ALL MCP1754T-1802E/MC AKG MCP1754ST-1802E/MC ALN AKJ 130 25 MCP1754T-3302E/MC AKH MCP1754ST-3302E/MC ALM MCP1754T-5002E/MC AKJ MCP1754ST-5002E/MC ALL Legend: XX...X Y YY WW NNN e3 * Note: DS22276A-page 24 Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. © 2011 Microchip Technology Inc. MCP1754/MCP1754S !" )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ D b2 E1 E 3 2 1 e e1 A2 A b c φ L A1 8QLWV 'LPHQVLRQ/LPLWV 1XPEHURI/HDGV 0,//,0(7(56 0,1 120 0$; 1 /HDG3LWFK H %6& 2XWVLGH/HDG3LWFK H 2YHUDOO+HLJKW $ ± ± 6WDQGRII $ ± 0ROGHG3DFNDJH+HLJKW $ 2YHUDOO:LGWK ( 0ROGHG3DFNDJH:LGWK ( 2YHUDOO/HQJWK ' /HDG7KLFNQHVV F /HDG:LGWK E 7DE/HDG:LGWK E )RRW/HQJWK / ± ± /HDG$QJOH ± %6& !" 'LPHQVLRQV'DQG(GRQRWLQFOXGHPROGIODVKRUSURWUXVLRQV0ROGIODVKRUSURWUXVLRQVVKDOOQRWH[FHHGPPSHUVLGH 'LPHQVLRQLQJDQGWROHUDQFLQJSHU$60(<0 %6& %DVLF'LPHQVLRQ7KHRUHWLFDOO\H[DFWYDOXHVKRZQZLWKRXWWROHUDQFHV 0LFURFKLS 7HFKQRORJ\ 'UDZLQJ &% © 2011 Microchip Technology Inc. DS22276A-page 25 MCP1754/MCP1754S !" )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ DS22276A-page 26 © 2011 Microchip Technology Inc. MCP1754/MCP1754S # $ !" )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ D e1 e 2 1 E E1 N b A φ c A2 L A1 8QLWV 'LPHQVLRQ/LPLWV 1XPEHURI3LQV 0,//,0(7(56 0,1 120 0$; 1 /HDG3LWFK H %6& 2XWVLGH/HDG3LWFK H 2YHUDOO+HLJKW $ ± 0ROGHG3DFNDJH7KLFNQHVV $ ± 6WDQGRII $ ± 2YHUDOO:LGWK ( ± 0ROGHG3DFNDJH:LGWK ( ± 2YHUDOO/HQJWK ' ± )RRW/HQJWK / ± )RRW$QJOH ± /HDG7KLFNQHVV F ± %6& /HDG:LGWK E ± !" 'LPHQVLRQV'DQG(GRQRWLQFOXGHPROGIODVKRUSURWUXVLRQV0ROGIODVKRUSURWUXVLRQVVKDOOQRWH[FHHGPPSHUVLGH 'LPHQVLRQLQJDQGWROHUDQFLQJSHU$60(<0 %6& %DVLF'LPHQVLRQ7KHRUHWLFDOO\H[DFWYDOXHVKRZQZLWKRXWWROHUDQFHV 0LFURFKLS 7HFKQRORJ\ 'UDZLQJ &% © 2011 Microchip Technology Inc. DS22276A-page 27 MCP1754/MCP1754S Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS22276A-page 28 © 2011 Microchip Technology Inc. MCP1754/MCP1754S % & '* !" )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ D D1 E H L 1 N 2 b b1 b1 e E1 e1 A C 8QLWV 'LPHQVLRQ/LPLWV 1XPEHURI/HDGV 0,//,0(7(56 0,1 1 0$; 3LWFK H %6& 2XWVLGH/HDG3LWFK H %6& 2YHUDOO+HLJKW $ 2YHUDOO:LGWK + 0ROGHG3DFNDJH:LGWKDW%DVH ( 0ROGHG3DFNDJH:LGWKDW7RS ( 2YHUDOO/HQJWK ' 7DE/HQJWK ' )RRW/HQJWK / /HDG7KLFNQHVV F /HDG:LGWK E /HDGV:LGWK E !" 'LPHQVLRQV'DQG(GRQRWLQFOXGHPROGIODVKRUSURWUXVLRQV0ROGIODVKRUSURWUXVLRQVVKDOOQRWH[FHHGPPSHUVLGH 'LPHQVLRQLQJDQGWROHUDQFLQJSHU$60(<0 %6& %DVLF'LPHQVLRQ7KHRUHWLFDOO\H[DFWYDOXHVKRZQZLWKRXWWROHUDQFHV 0LFURFKLS 7HFKQRORJ\ 'UDZLQJ &% © 2011 Microchip Technology Inc. DS22276A-page 29 MCP1754/MCP1754S Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS22276A-page 30 © 2011 Microchip Technology Inc. MCP1754/MCP1754S + !" )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ b N E E1 3 2 1 e e1 D A2 A c φ A1 L L1 8QLWV 'LPHQVLRQ/LPLWV 1XPEHURI3LQV 0,//,0(7(56 0,1 120 0$; 1 /HDG3LWFK H %6& 2XWVLGH/HDG3LWFK H 2YHUDOO+HLJKW $ ± 0ROGHG3DFNDJH7KLFNQHVV $ ± 6WDQGRII $ ± 2YHUDOO:LGWK ( ± 0ROGHG3DFNDJH:LGWK ( ± 2YHUDOO/HQJWK ' ± %6& )RRW/HQJWK / ± )RRWSULQW / ± )RRW$QJOH ± /HDG7KLFNQHVV F ± /HDG:LGWK E ± !" 'LPHQVLRQV'DQG(GRQRWLQFOXGHPROGIODVKRUSURWUXVLRQV0ROGIODVKRUSURWUXVLRQVVKDOOQRWH[FHHGPPSHUVLGH 'LPHQVLRQLQJDQGWROHUDQFLQJSHU$60(<0 %6& %DVLF'LPHQVLRQ7KHRUHWLFDOO\H[DFWYDOXHVKRZQZLWKRXWWROHUDQFHV 0LFURFKLS 7HFKQRORJ\ 'UDZLQJ &% © 2011 Microchip Technology Inc. DS22276A-page 31 MCP1754/MCP1754S Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS22276A-page 32 © 2011 Microchip Technology Inc. MCP1754/MCP1754S + # !" )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ D b2 E E1 2 1 3 4 N e e1 A2 A b c φ L A1 8QLWV 'LPHQVLRQ/LPLWV 1XPEHURI/HDGV 0,//,0(7(56 0,1 120 0$; 1 /HDG3LWFK H %6& 2XWVLGH/HDG3LWFK H 2YHUDOO+HLJKW $ ± ± 6WDQGRII $ 0ROGHG3DFNDJH+HLJKW $ 2YHUDOO:LGWK ( 0ROGHG3DFNDJH:LGWK ( 2YHUDOO/HQJWK ' /HDG7KLFNQHVV F /HDG:LGWK E 7DE/HDG:LGWK E )RRW/HQJWK / ± /HDG$QJOH %6& !" 'LPHQVLRQV'DQG(GRQRWLQFOXGHPROGIODVKRUSURWUXVLRQV0ROGIODVKRUSURWUXVLRQVVKDOOQRWH[FHHGPPSHUVLGH 'LPHQVLRQLQJDQGWROHUDQFLQJSHU$60(<0 %6& %DVLF'LPHQVLRQ7KHRUHWLFDOO\H[DFWYDOXHVKRZQZLWKRXWWROHUDQFHV 0LFURFKLS 7HFKQRORJ\ 'UDZLQJ &% © 2011 Microchip Technology Inc. DS22276A-page 33 MCP1754/MCP1754S + # !" )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ DS22276A-page 34 © 2011 Microchip Technology Inc. MCP1754/MCP1754S ' ,- ! .0 &# 1 2234* 5 ,! !" )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ e D b N N L K E2 E EXPOSED PAD NOTE 1 NOTE 1 2 1 2 1 D2 BOTTOM VIEW TOP VIEW A A3 A1 NOTE 2 8QLWV 'LPHQVLRQ/LPLWV 1XPEHURI3LQV 0,//,0(7(56 0,1 1 120 0$; 3LWFK H 2YHUDOO+HLJKW $ 6WDQGRII $ &RQWDFW7KLFNQHVV $ 5() 2YHUDOO/HQJWK ' %6& 2YHUDOO:LGWK ( ([SRVHG3DG/HQJWK ' ± ([SRVHG3DG:LGWK ( ± E &RQWDFW/HQJWK / &RQWDFWWR([SRVHG3DG . ± ± &RQWDFW:LGWK %6& %6& !" 3LQYLVXDOLQGH[IHDWXUHPD\YDU\EXWPXVWEHORFDWHGZLWKLQWKHKDWFKHGDUHD 3DFNDJHPD\KDYHRQHRUPRUHH[SRVHGWLHEDUVDWHQGV 3DFNDJHLVVDZVLQJXODWHG 'LPHQVLRQLQJDQGWROHUDQFLQJSHU$60(<0 %6& %DVLF'LPHQVLRQ7KHRUHWLFDOO\H[DFWYDOXHVKRZQZLWKRXWWROHUDQFHV 5() 5HIHUHQFH'LPHQVLRQXVXDOO\ZLWKRXWWROHUDQFHIRULQIRUPDWLRQSXUSRVHVRQO\ 0LFURFKLS 7HFKQRORJ\ 'UDZLQJ && © 2011 Microchip Technology Inc. DS22276A-page 35 MCP1754/MCP1754S Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS22276A-page 36 © 2011 Microchip Technology Inc. MCP1754/MCP1754S APPENDIX A: REVISION HISTORY Revision A (August 2011) • Original data sheet for the MCP1754/MCP1754S family of devices. © 2011 Microchip Technology Inc. DS22276A-page 37 MCP1754/MCP1754S NOTES: DS22276A-page 38 © 2011 Microchip Technology Inc. MCP1754/MCP1754S PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. X- X XX X X/ XX Examples: a) MCP1754T-1802E/DC: Device Tape and Reel Output Feature Voltage Code Tolerance Temp. Package b) MCP1754T-3302E/DC: c) MCP1754T-5002E/DC: MCP1754: MCP1754T: MCP1754S: MCP1754ST: 150 mA, 16V High Performance LDO 150 mA, 16V High Performance LDO (Tape and Reel) (SOT) 150 mA, 16V High Performance LDO 150 mA, 16V High Performance LDO (Tape and Reel) (SOT) Tape and Reel: T = Tape and Reel Output Voltage*: 18 = 1.8V “Standard” 33 = 3.3V “Standard” 50 = 5.0V “Standard” *Contact factory for other voltage options a) MCP1754T-1802E/CB: 1.8V, 3LD SOT-23A, Tape and Reel b) MCP1754T-3302E/CB: 3.3V, 3LD SOT-23A, Tape and Reel c) MCP1754T-5002E/CB: 5.0V, 3LD SOT-23A, Tape and Reel a) MCP1754T-1802E/MB: 1.8V, 3LD SOT-89, Tape and Reel b) MCP1754T-3302E/MB: 3.3V, 3LD SOT-89, Tape and Reel c) MCP1754T-5002E/MB: 5.0V, 3LD SOT-89, Tape and Reel a) MCP1754T-1802E/OT: b) MCP1754T-3302E/OT: Extra Feature Code: 0 = Fixed Tolerance: 2 = 2% (Standard) 1.8V, 5LD SOT-223, Tape and Reel 3.3V, 5LD SOT-223, Tape and Reel 5.0V, 5LD SOT-223, Tape and Reel c) MCP1754T-5002E/OT: 1.8V, 5LD SOT-23, Tape and Reel 3.3V, 5LD SOT-23, Tape and Reel 5.0V, 5LD SOT-23, Tape and Reel a) MCP1754T-1802E/MC: Temperature Range: E Package: *DB CB MB DC OT MC = -40°C to +125°C = = = = = = Plastic Small Outline, (SOT-223), 3-lead Plastic Small Outline, (SOT-23A), 3-lead Plastic Small Outline, (SOT-89), 3-lead Plastic Small Outline, (SOT223), 5-lead Plastic Small Outline, (SOT-23), 5-lead Plastic Dual Flat, No Lead, (2x3 DFN), 8-lead *Note: The 3-lead SOT-223 (DB) is not a standard package for output voltages below 3.0V © 2011 Microchip Technology Inc. 1.8V, 8LD DFN, Tape and Reel b) MCP1754T-3302E/MC: 3.3V, 8LD DFN, Tape and Reel c) MCP1754T-5002E/MC: 5.0V, 8LD DFN, Tape and Reel a) MCP1754ST-1802E/MC: 1.8V, 8LD DFN, Tape and Reel b) MCP1754ST-3302E/MC: 3.3V, 8LD DFN, Tape and Reel c) MCP1754ST-5002E/MC: 5.0V, 8LD DFN, Tape and Reel a) MCP1754ST-3302E/DB: 3.3V, 3LD SOT-223, Tape and Reel b) MCP1754ST-5002E/DB: 5.0V, 3LD SOT-223, Tape and Reel DS22276A-page 39 MCP1754/MCP1754S NOTES: DS22276A-page 40 © 2011 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2011, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 978-1-61341-570-2 Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. © 2011 Microchip Technology Inc. DS22276A-page 41 Worldwide Sales and Service AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://www.microchip.com/ support Web Address: www.microchip.com Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Harbour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 India - Bangalore Tel: 91-80-3090-4444 Fax: 91-80-3090-4123 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 India - Pune Tel: 91-20-2566-1512 Fax: 91-20-2566-1513 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Japan - Yokohama Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Cleveland Independence, OH Tel: 216-447-0464 Fax: 216-447-0643 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Indianapolis Noblesville, IN Tel: 317-773-8323 Fax: 317-773-5453 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Santa Clara Santa Clara, CA Tel: 408-961-6444 Fax: 408-961-6445 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8569-7000 Fax: 86-10-8528-2104 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 China - Chongqing Tel: 86-23-8980-9588 Fax: 86-23-8980-9500 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 China - Hangzhou Tel: 86-571-2819-3187 Fax: 86-571-2819-3189 Malaysia - Kuala Lumpur Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 China - Hong Kong SAR Tel: 852-2401-1200 Fax: 852-2401-3431 Malaysia - Penang Tel: 60-4-227-8870 Fax: 60-4-227-4068 China - Nanjing Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 Taiwan - Hsin Chu Tel: 886-3-5778-366 Fax: 886-3-5770-955 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-330-9305 China - Shenzhen Tel: 86-755-8203-2660 Fax: 86-755-8203-1760 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820 China - Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 China - Xiamen Tel: 86-592-2388138 Fax: 86-592-2388130 China - Zhuhai Tel: 86-756-3210040 Fax: 86-756-3210049 DS22276A-page 42 Korea - Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 08/02/11 © 2011 Microchip Technology Inc.