MCP3202
2.7V Dual Channel 12-Bit A/D Converter
with SPI Serial Interface
Features
•
•
•
•
•
•
•
•
12-bit resolution
±1 LSB max DNL
±1 LSB max INL (MCP3202-B)
±2 LSB max INL (MCP3202-C)
Analog inputs programmable as single-ended or
pseudo-differential pairs
On-chip sample and hold
SPI serial interface (modes 0,0 and 1,1)
Single supply operation: 2.7V-5.5V
100 ksps max. sampling rate at VDD = 5V
50 ksps max. sampling rate at VDD = 2.7V
Low power CMOS technology
- 500 nA typical standby current, 5 μA max.
- 550 µA max. active current at 5V
Industrial temp range: -40°C to +85°C
8-pin MSOP, PDIP, SOIC and TSSOP packages
PDIP, MSOP, SOIC, TSSOP
CS/SHDN
1
CH0
2
CH1
3
VSS
4
MCP3202
•
•
•
•
•
Package Types
Sensor Interface
Process Control
Data Acquisition
Battery Operated Systems
Description
The Microchip Technology Inc. MCP3202 is a successive approximation 12-bit Analog-to-Digital (A/D)
Converter with on-board sample and hold circuitry. The
MCP3202 is programmable to provide a single pseudodifferential input pair or dual single-ended inputs. Differential Nonlinearity (DNL) is specified at ±1 LSB, and
Integral Nonlinearity (INL) is offered in ±1 LSB
(MCP3202-B) and ±2 LSB (MCP3202-C) versions.
Communication with the device is done using a simple
serial interface compatible with the SPI protocol. The
device is capable of conversion rates of up to 100 ksps
at 5V and 50 ksps at 2.7V. The MCP3202 device operates over a broad voltage range (2.7V-5.5V). Lowcurrent design permits operation with typical standby
and active currents of only 500 nA and 375 μA, respectively. The MCP3202 is offered in 8-pin MSOP, PDIP,
TSSOP and 150 mil SOIC packages.
© 2006 Microchip Technology Inc.
VDD/VREF
7
CLK
6
DOUT
5
DIN
Functional Block Diagram
VDD
CH0
CH1
Input
Channel
Mux
VSS
DAC
Comparator
Applications
•
•
•
•
8
12-Bit SAR
Sample
and
Hold
Control Logic
CS/SHDN
DIN
CLK
Shift
Register
DOUT
DS21034D-page 1
MCP3202
1.0
ELECTRICAL
CHARACTERISTICS
1.1
Maximum Ratings*
PIN FUNCTION TABLE
Name
Function
VDD/VREF
+2.7V to 5.5V Power Supply and
Reference Voltage Input
All inputs and outputs w.r.t. VSS ...... -0.6V to VDD +0.6V
CH0
Channel 0 Analog Input
Storage temperature ..........................-65°C to +150°C
CH1
Channel 1 Analog Input
CLK
Serial Clock
DIN
Serial Data In
DOUT
Serial Data Out
CS/SHDN
Chip Select/Shutdown Input
VDD.........................................................................7.0V
Ambient temp. with power applied .....-65°C to +125°C
ESD protection on all pins (HBM)......................... > 4 kV
*Notice: Stresses above those listed under “Maximum Ratings” may
cause permanent damage to the device. This is a stress rating only
and functional operation of the device at those or any other conditions
above those indicated in the operational listings of this specification is
not implied. Exposure to maximum rating conditions for extended
periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
All parameters apply at VDD = 5.5V, VSS = 0V, TAMB = -40°C to +85°C, fSAMPLE = 100 ksps and fCLK = 18*fSAMPLE
unless otherwise noted.
Parameter
Conversion Rate:
Conversion Time
Sym
Min.
Typ.
Max.
Units
tCONV
—
—
12
clock
cycles
clock
cycles
1.5
Analog Input Sample Time
tSAMPLE
Throughput Rate
fSAMPLE
—
—
—
—
100
50
ksps
ksps
DC Accuracy:
Resolution
Integral Nonlinearity
INL
Differential Nonlinearity
DNL
—
—
—
12
±0.75
±1
±0.5
±1
±2
±1
bits
LSB
LSB
LSB
Conditions
VDD = VREF = 5V
VDD = VREF = 2.7V
MCP3202-B
MCP3202-C
No missing codes over
temperature
Offset Error
—
±1.25
±3
LSB
Gain Error
—
±1.25
±5
LSB
Dynamic Performance:
Total Harmonic Distortion
THD
—
-82
—
dB
VIN = 0.1V to 4.9V@1 kHz
Signal to Noise and Distortion
SINAD
—
72
—
dB
VIN = 0.1V to 4.9V@1 kHz
(SINAD)
Spurious Free Dynamic Range
SFDR
—
86
—
dB
VIN = 0.1V to 4.9V@1 kHz
Analog Inputs:
—
VDD
V
Input Voltage Range for CH0 or
VSS
CH1 in Single-Ended Mode
See Sections 3.1 and 4.1
Input Voltage Range for IN+ in
IN+
IN—
VDD+INPseudo-Differential Mode
—
VSS+100
mV
See Sections 3.1 and 4.1
Input Voltage Range for IN- in
INVSS-100
Pseudo-Differential Mode
Leakage Current
—
.001
±1
μA
Switch Resistance
RSS
—
1k
—
Ω
See Figure 4-1
Note 1: This parameter is established by characterization and not 100% tested.
2: Because the sample cap will eventually lose charge, effective clock rates below 10 kHz can affect linearity
performance, especially at elevated temperatures. See Section 6.2 for more information.
DS21034D-page 2
© 2006 Microchip Technology Inc.
MCP3202
ELECTRICAL CHARACTERISTICS (CONTINUED)
All parameters apply at VDD = 5.5V, VSS = 0V, TAMB = -40°C to +85°C, fSAMPLE = 100 ksps and fCLK = 18*fSAMPLE
unless otherwise noted.
Parameter
Sample Capacitor
Digital Input/Output:
Data Coding Format
High Level Input Voltage
Low Level Input Voltage
High Level Output Voltage
Low Level Output Voltage
Input Leakage Current
Output Leakage Current
Pin Capacitance
(All Inputs/Outputs)
Timing Parameters:
Clock Frequency
Clock High Time
Clock Low Time
CS Fall To First Rising CLK
Edge
Data Input Setup Time
Data Input Hold Time
CLK Fall To Output Data Valid
CLK Fall To Output Enable
CS Rise To Output Disable
CS Disable Time
DOUT Rise Time
DOUT Fall Time
Sym
Min.
Typ.
Max.
Units
CSAMPLE
—
20
—
pF
VIH
VIL
VOH
VOL
ILI
ILO
CIN, COUT
Straight Binary
0.7 VDD
—
—
—
—
0.3 VDD
4.1
—
—
—
—
0.4
-10
—
10
-10
—
10
—
—
10
fCLK
—
—
tHI
tLO
tSUCS
250
250
100
tSU
tHD
tDO
tEN
tDIS
V
V
V
V
µA
µA
pF
—
—
—
1.8
0.9
—
—
—
MHz
MHz
ns
ns
ns
—
—
—
—
—
—
—
—
—
—
50
50
200
200
100
ns
ns
ns
ns
ns
tCSH
tR
500
—
—
—
—
100
ns
ns
tF
—
—
100
ns
Conditions
See Figure 4-1
IOH = -1 mA, VDD = 4.5V
IOL = 1 mA, VDD = 4.5V
VIN = VSS or VDD
VOUT = VSS or VDD
VDD = 5.0V (Note 1)
TAMB = 25°C, f = 1 MHz
VDD = 5V (Note 2)
VDD = 2.7V (Note 2)
See Test Circuits, Figure 1-2
See Test Circuits, Figure 1-2
See Test Circuits, Figure 1-2
Note 1
See Test Circuits, Figure 1-2
Note 1
See Test Circuits, Figure 1-2
Note 1
Power Requirements:
2.7
—
5.5
V
Operating Voltage
VDD
Operating Current
IDD
—
375
550
µA
VDD = 5.0V, DOUT unloaded
—
0.5
5
µA
CS = VDD = 5.0V
Standby Current
IDDS
Temperature Ranges:
Specified Temperature Range
TA
-40
—
+85
°C
-40
—
+85
°C
Operating Temperature Range
TA
Storage Temperature Range
TA
-65
—
+150
°C
Thermal Package Resistance:
Thermal Resistance, 8L-PDIP
θJA
—
85
—
°C/W
Thermal Resistance, 8L-SOIC
θJA
—
163
—
°C/W
Thermal Resistance, 8L-MSOP
θJA
—
206
—
°C/W
θJA
—
—
°C/W
Thermal Resistance, 8L-TSSOP
Note 1: This parameter is established by characterization and not 100% tested.
2: Because the sample cap will eventually lose charge, effective clock rates below 10 kHz can affect linearity
performance, especially at elevated temperatures. See Section 6.2 for more information.
© 2006 Microchip Technology Inc.
DS21034D-page 3
MCP3202
tCSH
CS
tSUCS
tLO
tHI
CLK
tSU
DIN
tHD
MSB IN
tEN
DOUT
tR
tDO
tDIS
MSB OUT
NULL BIT
FIGURE 1-1:
tF
LSB
Serial Timing.
Load circuit for tDIS and tEN
Load circuit for tR, tF, tDO
Test Point
1.4V
VDD
3 kΩ
Test Point
DOUT
3 kΩ
tDIS Waveform 2
VDD/2
tEN Waveform
DOUT
100 pF
CL = 100 pF
Voltage Waveforms for tR, tF
VOH
VOL
DOUT
Voltage Waveforms for tEN
CS
tF
tR
tDIS Waveform 1
VSS
1
CLK
2
3
4
B11
DOUT
tEN
Voltage Waveforms for tDO
Voltage Waveforms for tDIS
CS
CLK
tDO
VIH
DOUT
Waveform 1*
DOUT
90%
TDIS
DOUT
Waveform 2†
10%
* Waveform 1 is for an output with internal conditions such that
the output is high, unless disabled by the output control.
† Waveform 2 is for an output with internal conditions such that
the output is low, unless disabled by the output control.
FIGURE 1-2:
Test Circuits.
DS21034D-page 4
© 2006 Microchip Technology Inc.
MCP3202
2.0
TYPICAL PERFORMANCE CHARACTERISTICS
Note:
The graphs provided following this note are a statistical summary based on a limited number of samples
and are provided for informational purposes only. The performance characteristics listed herein are not
tested or guaranteed. In some graphs, the data presented may be outside the specified operating range
(e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, VDD = 5V, VSS = 0V, fSAMPLE = 100 ksps, fCLK = 18* fSAMPLE,TA = 25°C
1.0
2.0
Positive INL
0.8
1.0
INL (LSB)
0.4
INL (LSB)
VDD = 2.7V
1.5
0.6
0.2
0.0
-0.2
Negative INL
-0.4
Positive INL
0.5
0.0
-0.5
Negative INL
-1.0
-0.6
-1.5
-0.8
-2.0
-1.0
0
25
50
75
100
125
0
150
20
Sample Rate (ksps)
FIGURE 2-1:
Rate.
Integral Nonlinearity (INL) vs. Sample
80
100
FIGURE 2-4: Integral Nonlinearity (INL) vs. Sample
Rate (VDD = 2.7V).
1.0
FSAMPLE = 100 ksps
0.8
FSAMPLE = 50 ksps
0.8
Positive INL
0.6
Positive INL
0.6
0.4
INL (LSB)
0.4
0.2
0.0
-0.2
-0.4
Negative INL
0.2
0.0
-0.2
-0.4
-0.6
-0.6
-0.8
-0.8
Negative INL
-1.0
-1.0
3.0
3.5
4.0
4.5
2.5
5.0
3.0
3.5
FIGURE 2-2:
4.0
4.5
5.0
VDD(V)
VDD(V)
Integral Nonlinearity (INL) vs. VDD.
FIGURE 2-5:
Integral Nonlinearity (INL) vs. VDD.
1.0
1.0
0.8
0.8
VDD = 2.7V
0.6
0.6
FSAMPLE = 50 ksps
0.4
0.4
INL (LSB)
INL (LSB)
60
Sample Rate (ksps)
1.0
INL (LSB)
40
0.2
0.0
-0.2
-0.4
0.2
0.0
-0.2
-0.4
-0.6
-0.6
-0.8
-0.8
-1.0
-1.0
0
512
1024
1536 2048
2560 3072
3584 4096
Digital Code
FIGURE 2-3: Integral Nonlinearity (INL) vs. Code
(Representative Part).
© 2006 Microchip Technology Inc.
0
512
1024
1536 2048
2560 3072
3584 4096
Digital Code
FIGURE 2-6: Integral Nonlinearity (INL) vs. Code
(Representative Part, VDD = 2.7V).
DS21034D-page 5
MCP3202
Note: Unless otherwise indicated, VDD = 5V, VSS = 0V, fSAMPLE = 100 ksps, fCLK = 18* fSAMPLE,TA = 25°C
1.0
1.0
0.8
VDD = 2.7V
0.6
0.6
FSAMPLE = 50 ksps
0.4
0.4
Positive INL
INL (LSB)
INL (LSB)
0.8
0.2
0.0
Negative INL
-0.2
0.2
0.0
-0.2
-0.4
-0.4
-0.6
-0.6
-0.8
-0.8
Negative INL
-1.0
-1.0
-50
-25
0
25
50
75
-50
100
-25
FIGURE 2-7:
Temperature.
Integral
Nonlinearity
(INL)
vs.
25
50
FIGURE 2-10: Integral
Nonlinearity
Temperature (VDD = 2.7V).
1.0
2.0
0.8
1.5
0.6
75
100
(INL)
vs.
V DD = 2.7V
DNL (LSB)
1.0
0.4
DNL (LSB)
0
Temperature (°C)
Temperature (°C)
Positive DNL
0.2
0.0
-0.2
Negative DNL
-0.4
Positive DNL
0.5
0.0
-0.5
Negative DNL
-1.0
-0.6
-1.5
-0.8
-2.0
-1.0
0
25
50
75
100
125
150
0
20
FIGURE 2-8: Differential
Sample Rate.
40
60
80
100
Sample Rate (ksps)
Sample Rate (ksps)
Nonlinearity
(DNL)
vs.
FIGURE 2-11: Differential
Sample Rate (VDD = 2.7V).
Nonlinearity
(DNL)
vs.
1.0
1.0
FSAMPLE = 100 ksps
0.8
0.6
0.6
0.4
0.2
0.0
-0.2
-0.4
FSAMPLE = 50 ksps
0.8
Positive DNL
DNL (LSB)
DNL (LSB)
Positive INL
Negative DNL
Positive DNL
0.4
0.2
0.0
-0.2
-0.4
-0.6
-0.6
-0.8
-0.8
Negative DNL
-1.0
-1.0
3.0
3.5
4.0
4.5
5.0
VDD(V)
FIGURE 2-9:
Differential Nonlinearity (DNL) vs. VDD.
DS21034D-page 6
2.5
3.0
3.5
4.0
4.5
5.0
VDD(V)
FIGURE 2-12: Differential Nonlinearity (DNL) vs. VDD.
© 2006 Microchip Technology Inc.
MCP3202
1.0
1.0
0.8
0.8
V DD = 2.7V
0.6
0.6
FSAMPLE = 50 ksps
0.4
0.4
DNL (LSB)
DNL (LSB)
Note: Unless otherwise indicated, VDD = 5V, VSS = 0V, fSAMPLE = 100 ksps, fCLK = 18* fSAMPLE,TA = 25°C
0.2
0.0
-0.2
-0.4
0.2
0.0
-0.2
-0.4
-0.6
-0.6
-0.8
-0.8
-1.0
-1.0
0
512
1024 1536 2048 2560 3072 3584 4096
0
512
1024 1536 2048 2560
Digital Code
Digital Code
FIGURE 2-13: Differential Nonlinearity
Code (Representative Part).
(DNL)
vs.
FIGURE 2-16: Differential Nonlinearity
Code (Representative Part, VDD = 2.7V).
1.0
1.0
0.8
0.8
V DD = 2.7V
0.6
FSAMPLE = 50 ksps
Positive DNL
DNL (LSB)
DNL (LSB)
0.6
0.4
0.2
0.0
-0.2
Negative DNL
-0.4
(DNL)
vs.
Positive DNL
0.4
0.2
0.0
-0.2
Negative DNL
-0.4
-0.6
-0.6
-0.8
-0.8
-1.0
-1.0
-50
-25
0
25
50
75
-50
100
-25
Temperature (°C)
FIGURE 2-14: Differential
Temperature.
0
25
50
75
100
Temperature (°C)
Nonlinearity
(DNL)
vs.
FIGURE 2-17: Differential
Temperature (VDD = 2.7V).
Nonlinearity
(DNL)
vs.
2.0
2.0
1.8
1.5
FSAMPLE = 10 ksps
1.0
Offset Error (LSB)
Gain Error (LSB)
3072 3584 4096
0.5
0.0
-0.5
-1.0
FSAMPLE = 100 ksps
-1.5
FSAMPLE = 100 ksps
1.6
1.4
FSAMPLE = 50 ksps
1.2
1.0
0.8
0.6
FSAMPLE = 10 ksps
0.4
0.2
FSAMPLE = 50 ksps
-2.0
0.0
2.5
3.0
3.5
4.0
VDD(V)
FIGURE 2-15: Gain Error vs. VDD.
© 2006 Microchip Technology Inc.
4.5
5.0
2.5
3.0
3.5
4.0
4.5
5.0
VDD(V)
FIGURE 2-18: Offset Error vs. VDD.
DS21034D-page 7
MCP3202
Note: Unless otherwise indicated, VDD = 5V, VSS = 0V, fSAMPLE = 100 ksps, fCLK = 18* fSAMPLE,TA = 25°C
1.0
2.0
1.8
V DD = 2.7V
0.6
Offset Error (LSB)
Gain Error (LSB)
0.8
FSAMPLE = 50 ksps
0.4
0.2
0.0
-0.2
-0.4
-0.6
V DD = 5V
-0.8
-50
-25
0
25
50
VDD = 5V
1.4
FSAMPLE = 100 ksps
1.2
1.0
0.8
VDD = 2.7V
0.6
FSAMPLE = 50 ksps
0.4
0.2
FSAMPLE = 100 ksps
-1.0
1.6
75
0.0
-50
100
-25
0
FIGURE 2-19: Gain Error vs. Temperature.
75
100
FIGURE 2-22: Offset Error vs. Temperature.
100
100
90
VDD = 5V
90
80
FSAMPLE = 100 ksps
80
60
SINAD (dB)
70
SNR (dB)
50
Temperature (°C)
Temperature (°C)
VDD = 2.7V
50
FSAMPLE = 50 ksps
40
30
VDD = 5V
FSAMPLE = 100 ksps
70
60
50
VDD = 2.7V
40
FSAMPLE = 50 ksps
30
20
20
10
10
0
0
1
10
100
1
10
Input Frequency (kHz)
100
Input Frequency (kHz)
FIGURE 2-20: Signal to Noise Ratio (SNR) vs. Input
Frequency.
FIGURE 2-23:
Signal to Noise and Distortion
(SINAD) vs. Input Frequency.
0
80
-10
VDD = 5V
70
-20
FSAMPLE = 100 ksps
60
-40
VDD = 2.7V
-50
FSAMPLE = 50 ksps
SINAD (dB)
-30
THD (dB)
25
-60
-70
-80
VDD = 5V
-90
FSAMPLE = 100 ksps
50
VDD = 2.7V
40
FSAMPLE = 50 ksps
30
20
10
0
-100
1
10
100
Input Frequency (kHz)
FIGURE 2-21: Total Harmonic Distortion (THD) vs.
Input Frequency.
DS21034D-page 8
-40
-35
-30
-25
-20
-15
-10
-5
0
Input Signal Level (dB)
FIGURE 2-24:
Signal to Noise and Distortion
(SINAD) vs. Signal Level.
© 2006 Microchip Technology Inc.
MCP3202
Note: Unless otherwise indicated, VDD = 5V, VSS = 0V, fSAMPLE = 100 ksps, fCLK = 18* fSAMPLE,TA = 25°C
12.0
12.0
11.5
FSAMPLE = 100 ksps
11.0
ENOB (rms)
ENOB (rms)
VDD = 5V
11.5
FSAMPLE = 50ksps
11.0
FSAMPLE = 100 ksps
10.5
10.0
10.5
10.0
9.5
9.0
9.5
V DD = 2.7V
8.5
9.0
2.0
2.5
3.0
3.5
4.0
4.5
FSAMPLE = 50 ksps
8.0
5.0
1
10
VDD (V)
FIGURE 2-25: Effective Number of Bits (ENOB) vs.
VDD.
FIGURE 2-28: Effective Number of Bits (ENOB) vs.
Input Frequency.
0
VDD = 5V
90
FSAMPLE = 100 ksps
SFDR (dB)
80
70
60
50
V DD = 2.7V
40
FSAMPLE = 50 ksps
30
20
10
0
1
10
100
Power Supply Rejection (dB)
100
-10
-20
-30
-40
-50
-60
-70
-80
1
10
Input Frequency (kHz)
FIGURE 2-26: Spurious Free
(SFDR) vs. Input Frequency.
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
-110
-120
-130
Dynamic
Range
FSAMPLE = 100 ksps
FINPUT = 9.985 kHz
4096 points
10000
20000
30000
40000
50000
Frequency (Hz)
FIGURE 2-27: Frequency Spectrum of 10 kHz input
(Representative Part).
© 2006 Microchip Technology Inc.
1000
10000
FIGURE 2-29: Power Supply Rejection (PSR) vs.
Ripple Frequency.
VDD = 5V
0
100
Ripple Frequency (kHz)
Amplitude (dB)
Amplitude (dB)
100
Input Frequency (kHz)
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
-110
-120
-130
VDD = 2.7V
FSAMPLE = 50 ksps
FINPUT = 998.76 Hz
4096 points
0
5000
10000
15000
20000
25000
Frequency (Hz)
FIGURE 2-30: Frequency Spectrum of 1 kHz input
(Representative Part, VDD = 2.7V).
DS21034D-page 9
MCP3202
Note: Unless otherwise indicated, VDD = 5V, VSS = 0V, fSAMPLE = 100 ksps, fCLK = 18* fSAMPLE,TA = 25°C
500
80
All points at FCLK = 1.8 MHz except
450
400
60
IDDS (pA)
350
IDD (µA)
CS = V DD
70
at VDD = 2.5V, FCLK = 900 kHz
300
250
200
150
50
40
30
20
100
10
50
0
0
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
2.0
6.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
VDD (V)
VDD (V)
FIGURE 2-34: IDDS vs. VDD.
FIGURE 2-31: IDD vs. VDD.
100.00
500
450
VDD = CS = 5V
400
V DD = 5V
10.00
300
IDDS (nA)
IDD (µA)
350
250
V DD = 2.7V
200
1.00
150
0.10
100
50
0
10
100
1000
0.01
10000
-50
-25
0
Clock Frequency (kHz)
FIGURE 2-32: IDD vs. Clock Frequency.
FCLK = 1.8 MHz
350
IDD (µA)
75
100
2.0
V DD = 5V
Analog Input Leakage (nA)
400
50
FIGURE 2-35: IDDS vs. Temperature.
500
450
25
Temperature (°C)
300
250
200
VDD = 2.7V
150
FCLK = 900 kHz
100
50
0
-50
-25
0
25
50
Temperature (°C)
FIGURE 2-33: IDD vs. Temperature.
DS21034D-page 10
75
100
1.8
1.6
1.4
1.2
VDD = 5V
1.0
FCLK = 1.8 MHz
0.8
0.6
0.4
0.2
0.0
-50
-25
0
25
50
75
100
Temperature (°C)
FIGURE 2-36: Analog Input leakage current vs.
Temperature.
© 2006 Microchip Technology Inc.
MCP3202
3.0
PIN DESCRIPTIONS
4.1
3.1
CH0/CH1
The MCP3202 device offers the choice of using the
analog input channels configured as two single-ended
inputs or a single pseudo-differential input. Configuration is done as part of the serial command before each
conversion begins. When used in the pseudo-differential mode, CH0 and CH1 are programmed as the IN+
and IN- inputs as part of the command string transmitted to the device. The IN+ input can range from IN- to
VREF (VDD + IN-). The IN- input is limited to ±100 mV
from the VSS rail. The IN- input can be used to cancel
small signal common-mode noise which is present on
both the IN+ and IN- inputs.
Analog inputs for channels 0 and 1 respectively. These
channels can programmed to be used as two independent channels in single ended-mode or as a single
pseudo-differential input where one channel is IN+ and
one channel is IN-. See Section 5.0 for information on
programming the channel configuration.
3.2
Chip Select/Shutdown (CS/SHDN)
The CS/SHDN pin is used to initiate communication
with the device when pulled low and will end a conversion and put the device in low power standby when
pulled high. The CS/SHDN pin must be pulled high
between conversions.
3.3
Serial Clock (CLK)
The SPI clock pin is used to initiate a conversion and to
clock out each bit of the conversion as it takes place.
See Section 6.2 for constraints on clock speed.
3.4
Serial Data Input (DIN)
The SPI port serial data input pin is used to clock in
input channel configuration data.
3.5
Serial Data Output (DOUT)
The SPI serial data output pin is used to shift out the
results of the A/D conversion. Data will always change
on the falling edge of each clock as the conversion
takes place.
4.0
DEVICE OPERATION
The MCP3202 A/D Converter employs a conventional
SAR architecture. With this architecture, a sample is
acquired on an internal sample/hold capacitor for
1.5 clock cycles starting on the second rising edge of
the serial clock after the start bit has been received.
Following this sample time, the input switch of the converter opens and the device uses the collected charge
on the internal sample and hold capacitor to produce a
serial 12-bit digital output code. Conversion rates of
100 ksps are possible on the MCP3202. See
Section 6.2 for information on minimum clock rates.
Communication with the device is done using a 3-wire
SPI-compatible interface.
Analog Inputs
For the A/D Converter to meet specification, the charge
holding capacitor (CSAMPLE) must be given enough time
to acquire a 12-bit accurate voltage level during the
1.5 clock cycle sampling period. The analog input
model is shown in Figure 4-1.
In this diagram, it is shown that the source impedance
(RS) adds to the internal sampling switch (RSS) impedance, directly affecting the time that is required to
charge the capacitor, CSAMPLE. Consequently, larger
source impedances increase the offset, gain, and integral linearity errors of the conversion.
Ideally, the impedance of the signal source should be
near zero. This is achievable with an operational amplifier such as the MCP601 which has a closed loop output impedance of tens of ohms. The adverse affects of
higher source impedances are shown in Figure 4-2.
When operating in the pseudo-differential mode, if the
voltage level of IN+ is equal to or less than IN-, the
resultant code will be 000h. If the voltage at IN+ is equal
to or greater than {[VDD + (IN-)] – 1 LSB}, then the output code will be FFFh. If the voltage level at IN- is more
than 1 LSB below VSS, then the voltage level at the IN+
input will have to go below VSS to see the 000h output
code. Conversely, if IN- is more than 1 LSB above VSS,
then the FFFh code will not be seen unless the IN+
input level goes above VDD level.
4.2
Digital Output Code
The digital output code produced by an A/D Converter
is a function of the input signal and the reference voltage. For the MCP3202, VDD is used as the reference
voltage. As the VDD level is reduced, the LSB size is
reduced accordingly. The theoretical digital output code
produced by the A/D Converter is shown below.
4096•V IN
Digital Output Code = -----------------------V DD
where:
VIN = analog input voltage
VDD = supply voltage
© 2006 Microchip Technology Inc.
DS21034D-page 11
MCP3202
VDD
RSS
VT = 0.6V
CHx
CPIN
7 pF
VA
Sampling
Switch
VT = 0.6V
SS
ILEAKAGE
±1 nA
RS = 1 kΩ
CSAMPLE
= DAC capacitance
= 20 pF
VSS
Legend
VA
RSS
CHx
CPIN
VT
ILEAKAGE
SS
RS
CSAMPLE
FIGURE 4-1:
=
=
=
=
=
=
=
=
=
signal source
source impedance
input channel pad
input pin capacitance
threshold voltage
leakage current at the pin
due to various junctions
sampling switch
sampling switch resistor
sample/hold capacitance
Analog Input Model.
Clock Frequency (MHz)
2.0
1.8
VDD = 5V
1.6
1.4
1.2
1.0
0.8
0.6
V DD = 2.7V
0.4
0.2
0.0
100
1000
10000
Input Resistance (Ohms)
FIGURE 4-2: Maximum Clock Frequency vs. Input
Resistance (RS) to maintain less than a 0.1 LSB
deviation in INL from nominal conditions.
DS21034D-page 12
© 2006 Microchip Technology Inc.
MCP3202
5.0
SERIAL COMMUNICATIONS
5.1
Overview
Communication with the MCP3202 is done using a
standard SPI-compatible serial interface. Initiating
communication with the device is done by bringing the
CS line low. See Figure 5-1. If the device was powered
up with the CS pin low, it must be brought high and
back low to initiate communication. The first clock
received with CS low and DIN high will constitute a start
bit. The SGL/DIFF bit and the ODD/SIGN bit follow the
start bit and are used to select the input channel configuration. The SGL/DIFF is used to select single ended
or psuedo-differential mode. The ODD/SIGN bit selects
which channel is used in single ended mode, and is
used to determine polarity in pseudo-differential mode.
Following the ODD/SIGN bit, the MSBF bit is transmitted to and is used to enable the LSB first format for the
device. If the MSBF bit is high, then the data will come
from the device in MSB first format and any further
clocks with CS low will cause the device to output
zeros. If the MSBF bit is low, then the device will output
the converted word LSB first after the word has been
transmitted in the MSB first format. See Figure 5-2.
Table 5-1 shows the configuration bits for the
MCP3202. The device will begin to sample the analog
input on the second rising edge of the clock, after the
start bit has been received. The sample period will end
on the falling edge of the third clock following the start
bit.
On the falling edge of the clock for the MSBF bit, the
device will output a low null bit. The next sequential
12 clocks will output the result of the conversion with
MSB first as shown in Figure 5-1. Data is always output
from the device on the falling edge of the clock. If all
12 data bits have been transmitted and the device continues to receive clocks while the CS is held low, (and
MSBF = 1), the device will output the conversion result
LSB first as shown in Figure 5-2. If more clocks are provided to the device while CS is still low (after the LSB
first data has been transmitted), the device will clock
out zeros indefinitely.
If necessary, it is possible to bring CS low and clock in
leading zeros on the DIN line before the start bit. This is
often done when dealing with microcontroller-based
SPI ports that must send 8 bits at a time. Refer to
Section 6.1 for more details on using the MCP3202
devices with hardware SPI ports.
Config
Bits
Channel
Selection
GND
Sgl/
Diff
Odd/
sign
Single Ended
Mode
1
1
PseudoDifferentiaL
Mode
TABLE 5-1:
0
1
0
+
—
-
1
—
+
-
0
0
IN+
IN-
0
1
IN-
IN+
Configuration Bits for the MCP3202.
tCYC
tCYC
tCSH
CS
tSUCS
CLK
Start SGL/ ODD/ MS
DIFF SIGN BF
DIN
HI-Z
DOUT
tSAMPLE
Start SGL/ ODD/
DIFF SIGN
Don’t Care
Null
Bit B11 B10 B9 B8 B7 B6 B5 B4 B3 B2 B1 B0*
tCONV
HI-Z
tDATA**
* After completing the data transfer, if further clocks are applied with CS low, the A/D Converter will output zeros
indefinitely. See Figure 5-2 below for details on obtaining LSB first data.
** tDATA: during this time, the bias current and the comparator power down while the reference input becomes a
high impedance node, leaving the CLK running to clock out the LSB-first data or zeros.
FIGURE 5-1:
Communication with the MCP3202 using MSB first format only.
© 2006 Microchip Technology Inc.
DS21034D-page 13
MCP3202
tCYC
tCSH
CS
tSUCS
Power Down
HI-Z
DOUT
tSAMPLE
MSBF
SGL/
DIFF
ODD/
SIGN
DIN
Start
CLK
Don’t Care
Null
B11 B10 B9
Bit
B8
B7
B6
B5 B4
B3
B2
B1
B0
B1
B2
B3
B4
B5
B6
B7
B8
B9 *B10 B11
HI-Z
(MSB)
tCONV
tDATA **
* After completing the data transfer, if further clocks are applied with CS low, the A/D Converter will
output zeros indefinitely.
** tDATA: During this time, the bias circuit and the comparator power down while the reference input
becomes a high impedance node, leaving the CLK running to clock out LSB first data or zeroes.
FIGURE 5-2:
Communication with MCP3202 using LSB first format.
DS21034D-page 14
© 2006 Microchip Technology Inc.
MCP3202
6.0
APPLICATIONS INFORMATION
6.1
Using the MCP3202 with
Microcontroller (MCU) SPI Ports
in the ‘low’ state, while Figure 6-2 shows the similar
case of SPI Mode 1,1 where the clock idles in the ‘high’
state.
As shown in Figure 6-1, the first byte transmitted to the
A/D Converter contains seven leading zeros before the
start bit. Arranging the leading zeros this way produces
the output 12 bits to fall in positions easily manipulated
by the MCU. The MSB is clocked out of the A/D Converter on the falling edge of clock number 12. After the
second eight clocks have been sent to the device, the
MCU receive buffer will contain three unknown bits (the
output is at high impedance until the null bit is clocked
out), the null bit and the highest order four bits of the
conversion. After the third byte has been sent to the
device, the receive register will contain the lowest order
eight bits of the conversion results. Easier manipulation
of the converted data can be obtained by using this
method.
With most microcontroller SPI ports, it is required to
send groups of eight bits. It is also required that the
microcontroller SPI port be configured to clock out data
on the falling edge of clock and latch data in on the rising edge. Depending on how communication routines
are used, it is very possible that the number of clocks
required for communication will not be a multiple of
eight. Therefore, it may be necessary for the MCU to
send more clocks than are actually required. This is
usually done by sending ‘leading zeros’ before the start
bit, which are ignored by the device. As an example,
Figure 6-1 and Figure 6-2 show how the MCP3202 can
be interfaced to a MCU with a hardware SPI port.
Figure 6-1 depicts the operation shown in SPI Mode
0,0, which requires that the SCLK from the MCU idles
CS
MCU latches data from A/D Converter
on rising edges of SCLK
SCLK
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
B5
B4
21
22
23
24
B2
B1
B0
X
X
ODD/
SIGN
DIN
SGL/
DIFF
Start
MSBF
Data is clocked out of
A/D Converter on falling edges
Don’t Care
HI-Z
DOUT
NULL
B11
BIT
B10
B9
B8
X
X
X
B7
B6
B3
Start
Bit
MCU Transmitted Data
(Aligned with falling
edge of clock)
MCU Received Data
(Aligned with rising
edge of clock)
X
X
CS
X
X
X
X
X
X
X
X
X
X
SGL/ ODD/
MSBF
DIFF SIGN
1
X
X
X
Data stored into MCU receive
register after transmission of
first 8 bits
X = Don’t Care Bits
FIGURE 6-1:
X
X
X
0
B11
(Null)
X
B10
B9
X
X
B7
B8
Data stored into MCU receive
register after transmission of
second 8 bits
X
B6
X
B5
X
B4
X
B3
B2
B1
X
B0
Data stored into MCU receive
register after transmission of
last 8 bits
SPI Communication using 8-bit segments (Mode 0,0: SCLK idles low).
MCU latches data from A/D Converter
on rising edges of SCLK
1
SCLK
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
B5
B4
B3
B2
B1
B0
MSBF
SGL/
DIFF
Start
DIN
ODD/
SIGN
Data is clocked out of
A/D Converter on falling edges
Don’t Care
HI-Z
DOUT
NULL
B11
BIT
B10
B9
X
X
B8
B6
B7
Start
Bit
MCU Transmitted Data
(Aligned with falling
edge of clock)
0
MCU Received Data
(Aligned with rising
edge of clock)
0
X
0
X
0
X
0
X
X
X
SGL/ ODD/
MSBF
DIFF SIGN
1
0
0
X
X
Data stored into MCU receive
register after transmission of
first 8 bits
X
X
X
X
X
0
B11
(Null)
B10
X
X
B9
B8
Data stored into MCU receive
register after transmission of
second 8 bits
X
B7
X
B6
X
B5
X
B4
X
B3
X
B2
X
B1
B0
Data stored into MCU receive
register after transmission of
last 8 bits
X = Don’t Care Bits
FIGURE 6-2:
SPI Communication using 8-bit segments (Mode 1,1: SCLK idles high).
© 2006 Microchip Technology Inc.
DS21034D-page 15
MCP3202
6.2
Maintaining Minimum Clock Speed
When the MCP3202 initiates the sample period, charge
is stored on the sample capacitor. When the sample
period is complete, the device converts one bit for each
clock that is received. It is important for the user to note
that a slow clock rate will allow charge to bleed off the
sample cap while the conversion is taking place. At
85°C (worst case condition), the part will maintain
proper charge on the sample capacitor for at least
1.2 ms after the sample period has ended. This means
that the time between the end of the sample period and
the time that all 12 data bits have been clocked out
must not exceed 1.2 ms (effective clock frequency of
10 kHz). Failure to meet this criteria may induce linearity errors into the conversion outside the rated specifications. It should be noted that during the entire
conversion cycle, the A/D Converter does not require a
constant clock speed or duty cycle, as long as all timing
specifications are met.
6.3
Buffering/Filtering the Analog Inputs
If the signal source for the A/D Converter is not a low
impedance source, it will have to be buffered or inaccurate conversion results may occur. It is also recommended that a filter be used to eliminate any signals
that may be aliased back into the conversion results.
This is illustrated in Figure 6-3 below where an op amp
is used to drive the analog input of the MCP3202. This
amplifier provides a low impedance output for the converter input and a low pass filter, which eliminates
unwanted high frequency noise.
Low pass (anti-aliasing) filters can be designed using
Microchip’s interactive FilterLab™ software. FilterLab
will calculate capacitor and resistor values, as well as,
determine the number of poles that are required for the
application. For more information on filtering signals,
see the application note AN699 “Anti-Aliasing Analog
Filters for Data Acquisition Systems.
6.4
Layout Considerations
When laying out a printed circuit board for use with
analog components, care should be taken to reduce
noise wherever possible. A bypass capacitor should
always be used with this device and should be placed
as close as possible to the device pin. A bypass capacitor value of 0.1 µF is recommended.
Digital and analog traces should be separated as much
as possible on the board and no traces should run
underneath the device or the bypass capacitor. Extra
precautions should be taken to keep traces with high
frequency signals (such as clock lines) as far as possible from analog traces.
Use of an analog ground plane is recommended in
order to keep the ground potential the same for all
devices on the board. Providing VDD connections to
devices in a “star” configuration can also reduce noise
by eliminating current return paths and associated
errors. See Figure 6-4. For more information on layout
tips when using A/D Converters, refer to AN688 “Layout Tips for 12-Bit A/D Converter Applications”
(DS00688).
VDD
Connection
Device 4
Device 1
Device 3
Device 2
”
VDD
10 μF
R1
VIN
C1
MCP601
+
R2
C2
FIGURE 6-4: VDD traces arranged in a ‘Star’
configuration in order to reduce errors caused by
current return paths.
0.1 μF
IN+
-
MCP3202
IN-
R3
R4
FIGURE 6-3: The MCP601 Operational Amplifier is
used to implement a 2nd order anti-aliasing filter for
the signal being converted by the MCP3202.
DS21034D-page 16
© 2006 Microchip Technology Inc.
MCP3202
7.0
PACKAGING INFORMATION
7.1
Package Marking Information
8-Lead PDIP (300 mil)
MCP3202 e3
I/PNNN
YYWW
XXXXXXXX
XXXXXNNN
YYWW
8-Lead SOIC (150 mil)
Example:
MCP3202 e3
ISNYYWW
NNN
XXXXXXXX
XXXXYYWW
NNN
Example:
8-Lead MSOP
XXXXXX
YWWNNN
3202I e3
YWWNNN
Example:
8-Lead TSSOP
XXXX
YYWW
NNN
3202
IYWW
NNN
Legend: XX...X
Y
YY
WW
NNN
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator (e3 )
can be found on the outer packaging for this package.
e3
*
Note:
*
Example:
In the event the full Microchip part number cannot be marked on one line, it
will be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
Standard OTP marking consists of Microchip part number, year code, week code, facility code, mask
rev#, and assembly code.
© 2006 Microchip Technology Inc.
DS21034D-page 17
MCP3202
8-Lead Plastic Dual In-line (P) – 300 mil Body (PDIP)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
E1
D
2
n
1
α
E
A2
A
L
c
A1
β
B1
p
eB
B
Units
Dimension Limits
n
p
INCHES*
NOM
8
.100
.155
.130
MAX
MILLIMETERS
NOM
8
2.54
3.56
3.94
2.92
3.30
0.38
7.62
7.94
6.10
6.35
9.14
9.46
3.18
3.30
0.20
0.29
1.14
1.46
0.36
0.46
7.87
9.40
5
10
5
10
MAX
Number of Pins
Pitch
Top to Seating Plane
A
.140
.170
4.32
Molded Package Thickness
A2
.115
.145
3.68
Base to Seating Plane
.015
A1
Shoulder to Shoulder Width
E
.300
.313
.325
8.26
Molded Package Width
E1
.240
.250
.260
6.60
Overall Length
D
.360
.373
.385
9.78
Tip to Seating Plane
L
.125
.130
.135
3.43
c
Lead Thickness
.008
.012
.015
0.38
Upper Lead Width
B1
.045
.058
.070
1.78
Lower Lead Width
B
.014
.018
.022
0.56
Overall Row Spacing
§
eB
.310
.370
.430
10.92
α
Mold Draft Angle Top
5
10
15
15
β
Mold Draft Angle Bottom
5
10
15
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
DS21034D-page 18
MIN
MIN
© 2006 Microchip Technology Inc.
MCP3202
8-Lead Plastic Small Outline (SN) – Narrow, 150 mil Body (SOIC)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
E
E1
p
D
2
B
n
1
h
α
45°
c
A2
A
φ
β
L
Units
Dimension Limits
n
p
INCHES*
NOM
8
.050
.061
.056
.007
.237
.154
.193
.015
.025
4
.009
.017
12
12
MAX
MILLIMETERS
NOM
8
1.27
1.35
1.55
1.32
1.42
0.10
0.18
5.79
6.02
3.71
3.91
4.80
4.90
0.25
0.38
0.48
0.62
0
4
0.20
0.23
0.33
0.42
0
12
0
12
MAX
Number of Pins
Pitch
Overall Height
A
.053
.069
1.75
Molded Package Thickness
A2
.052
.061
1.55
Standoff
§
A1
.004
.010
0.25
Overall Width
E
.228
.244
6.20
Molded Package Width
E1
.146
.157
3.99
Overall Length
D
.189
.197
5.00
Chamfer Distance
h
.010
.020
0.51
Foot Length
L
.019
.030
0.76
φ
Foot Angle
0
8
8
c
Lead Thickness
.008
.010
0.25
Lead Width
B
.013
.020
0.51
α
Mold Draft Angle Top
0
15
15
β
Mold Draft Angle Bottom
0
15
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
© 2006 Microchip Technology Inc.
MIN
A1
MIN
DS21034D-page 19
MCP3202
8-Lead Plastic Micro Small Outline Package (MS) [MSOP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
N
E
E1
NOTE 1
1
2
e
b
A2
A
ϕ
c
L1
A1
Number of Pins
Pitch
Overall Height
Molded Package
Standoff
Overall Width
Molded Package
Overall Length
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
Units
Dimension Limits
N
e
A
Thickness
A2
A1
E
Width
E1
D
L
L1
ϕ
c
b
MIN
—
0.75
0.00
0.40
0°
0.08
0.22
MILLIMETERS
NOM
8
0.65 BSC
—
0.85
—
4.90 BSC
3.00 BSC
3.00 BSC
0.60
0.95 REF
—
—
—
L
MAX
1.10
0.95
0.15
0.80
8°
0.23
0.40
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions
shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing No. C04–111, Sept. 8, 2006
DS21034D-page 20
© 2006 Microchip Technology Inc.
MCP3202
8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body (TSSOP)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
E
E1
e
D
2
1
n
b
α
c
ϕ
A
β
L
Units
Dimension Limits
Number of Pins
n
Pitch
e
Overall Height
A
Molded Package Thickness
A2
Standoff
A1
Overall Width
E
Molded Package Width
E1
Molded Package Length
D
Foot Length
L
Foot Angle
ϕ
Lead Thickness
c
Lead Width
b
Mold Draft Angle Top
α
Mold Draft Angle Bottom
β
A2
A1
MIN
–
.031
.002
.169
.114
.018
0°
.004
.007
INCHES
NOM
8
.026 BSC
–
.039
–
.252 BSC
.173
.118
.024
–
–
–
12° REF
12° REF
MAX
.047
.041
.006
.177
.122
.030
8°
.008
.012
MILLIMETERS*
NOM
MAX
8
0.65 BSC
–
–
1.20
0.80
1.00
1.05
0.05
–
0.15
6.40 BSC
4.30
4.40
4.50
2.90
3.00
3.10
0.45
0.60
0.75
0°
–
8°
0.09
–
0.20
0.19
–
0.30
12° REF
12° REF
MIN
*Controlling Parameter
Notes:
1. Dimension D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.005" (0.127mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
REF: Reference Dimension, usually without tolerance, for information purposes only.
See ASME Y14.5M
Drawing No. C04-086
Revised 7-25-06
© 2006 Microchip Technology Inc.
DS21034D-page 21
MCP3202
NOTES:
DS21034D-page 22
© 2006 Microchip Technology Inc.
MCP3202
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
X
X
/XX
Device
Performance
Grade
Temperature
Range
Package
Device:
Performance Grade:
MCP3202: 12-Bit Serial A/d Converter
MCP3202T: 12-Bit Serial A/D Converter (Tape and Reel)
(SOIC, MSOP and TSSOP package only)
B
C
= ±1 LSB INL (TSSOP not available)
= ±2 LSB INL
Temperature Range:
I
= -40°C to +85°C
Package:
MS
P
SN
ST
=
=
=
=
Examples:
a)
MCP3202-I/MS: = Industrial temperature,
MSOP package.
b)
MCP3202-BI/P: = B Performance grade,
industrial temp., PDIP package
c)
MCP3202-CI/SN: = C Performance grade,
industrial temp., SOIC package
d)
MCP3202T-BI/SN: = Tape and Reel, B Performance grade, industrial temp., SOIC
package
a)
MCP3202T-CI/ST: = Tape and Reel, C Performance grade, industrial temp., TSSOP
package.
Plastic Micro Small Outline (MSOP), 8-Lead
Plastic DIP (300 mil Body), 8-Lead
Plastic SOIC (150 mil Body), 8-Lead
TSSOP (4.4 mm Body), 8-Lead (C Grade only)
© 2001 Microchip Technology Inc.
DS21034C-page23
MCP3202
NOTES:
DS21034C-page24
© 2001 Microchip Technology Inc.
MCP3202
APPENDIX A:
REVISION HISTORY
Revision D (December 2006)
This revision includes updates to the packaging diagrams.
© 2006 Microchip Technology Inc.
DS21034D-page 25
NOTES:
DS21034D-page 26
© 2006 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART,
PRO MATE, PowerSmart, rfPIC, and SmartShunt are
registered trademarks of Microchip Technology Incorporated
in the U.S.A. and other countries.
AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB,
SEEVAL, SmartSensor and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, ECAN,
ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active
Thermistor, Mindi, MiWi, MPASM, MPLIB, MPLINK, PICkit,
PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal,
PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB,
rfPICDEM, Select Mode, Smart Serial, SmartTel, Total
Endurance, UNI/O, WiperLock and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2006, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona, Gresham, Oregon and Mountain View, California. The
Company’s quality system processes and procedures are for its PIC®
8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs,
microperipherals, nonvolatile memory and analog products. In addition,
Microchip’s quality system for the design and manufacture of
development systems is ISO 9001:2000 certified.
© 2006 Microchip Technology Inc.
DS21034D-page 27
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://support.microchip.com
Web Address:
www.microchip.com
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Habour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
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Tel: 91-80-4182-8400
Fax: 91-80-4182-8422
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
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Tel: 91-20-2566-1512
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Tel: 86-28-8665-5511
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Korea - Gumi
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Fax: 82-54-473-4302
China - Fuzhou
Tel: 86-591-8750-3506
Fax: 86-591-8750-3521
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
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China - Hong Kong SAR
Tel: 852-2401-1200
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Malaysia - Penang
Tel: 60-4-646-8870
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Tel: 86-532-8502-7355
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Tel: 63-2-634-9065
Fax: 63-2-634-9069
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Tel: 86-21-5407-5533
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Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-572-9526
Fax: 886-3-572-6459
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Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-536-4803
China - Shunde
Tel: 86-757-2839-5507
Fax: 86-757-2839-5571
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands - Drunen
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Fax: 31-416-690340
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Xian
Tel: 86-29-8833-7250
Fax: 86-29-8833-7256
10/19/06
DS21034D-page 28
© 2006 Microchip Technology Inc.