MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision Vishay Beyschlag Precision Thin Film Chip Resistor Superior Moisture Resistivity FEATURES • Superior moisture resistivity, |ΔR/R| < 0.5 % (85 °C; 85 % RH; 1000 h) • Rated dissipation P70 up to 0.4 W for size 1206 • AEC-Q200 qualified • Approved according to EN 140401-801 • Lead (Pb)-free solder contacts • Compliant to RoHS directive 2002/95/EC APPLICATIONS • Automotive • Telecommunication • Medical equipment Automotive-Grade MC AT Precision Thin Film Chip Resistors are the perfect choice for most fields of modern precision electronics where reliability and stability is of major concern. Typical applications include automotive, telecommunication, industrial, medical equipment, precision test and measuring equipment. • Industrial equipment METRIC SIZE INCH: METRIC: 0603 0805 1206 RR 1608M RR 2012M RR 3216M TECHNICAL SPECIFICATIONS DESCRIPTION MCT 0603 AT MCU 0805 AT MCA 1206 AT RR 1608M RR 2012M RR 3216M 47 Ω to 100 kΩ 47 Ω to 100 kΩ 47 Ω to 100 kΩ Metric size Resistance range Resistance tolerance ± 0.1 % Temperature coefficient ± 25 ppm/K; ± 15 ppm/K Rated dissipation P70 (1) Operating voltage, Umax. AC/DC 0.125 W 0.200 W 0.400 W 75 V 150 V 200 V Permissible film temperature (1) 155 °C Insulation voltage 1 min; Uins 100 V 200 V 300 V Continuous 75 V 75 V 75 V Note (1) Please refer to APPLICATION INFORMATION below www.vishay.com 1 For technical questions, contact: [email protected] Document Number: 28785 Revision: 09-Apr-09 MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision Precision Thin Film Chip Resistor Superior Moisture Resistivity Vishay Beyschlag APPLICATION INFORMATION The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support of the printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature is not exceeded. Furthermore, a high level of ambient temperature or of power dissipation may raise the temperature of the solder joint, hence special solder alloys or board materials may be required to maintain the reliability of the assembly. These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift increasing over operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional lifetime. The designer may estimate the performance of the particular resistor application or set certain load and temperature limits in order to maintain a desired stability. MAXIMUM RESISTANCE CHANGE AT RATED DISSIPATION Operation mode Standard Power Rated dissipation P70 P70 MCT 0603 AT 0.100 W 0.125 W MCU 0805 AT 0.125 W 0.200 W MCA 1206 AT 0.250 W 0.400 W 125 °C 155 °C MCT 0603 AT 47 Ω to 100 kΩ 47 Ω to 100 kΩ MCU 0805 AT 47 Ω to 100 kΩ 47 Ω to 100 kΩ MCA 1206 AT 47 Ω to 100 kΩ 47 Ω to 100 kΩ 1000 h ≤ 0.1 % ≤ 0.2 % 8000 h ≤ 0.2 % ≤ 0.4 % 225 000 h ≤ 0.6 % - Film temperature Max. resistance change at rated dissipation for resistance range: |ΔR/R| max., after: Document Number: 28785 Revision: 09-Apr-09 For technical questions, contact: [email protected] www.vishay.com 2 MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision Precision Thin Film Chip Resistor Superior Moisture Resistivity Vishay Beyschlag PART NUMBER AND PRODUCT DESCRIPTION (1) PART NUMBER: MCT0603MD4641BPW00 M C T 0 6 0 3 M D 4 6 4 1 B P W 0 0 MODEL/SIZE VERSION TCR VALUE TOLERANCE PACKAGING SPECIAL MCT0603 MCU0805 MCA1206 M = AT (Automotive) E = ± 15 ppm/K D = ± 25 ppm/K 3 digit value 1 digit multiplier B = ± 0.1 % P1 P5 PW Up to 2 digits 00 = Standard MULTIPLIER 0 = *100 1 = *101 2 = *102 3 = *103 PRODUCT DESCRIPTION: MCT 0603 - 25 0.1 % AT PW 4K64 MCT 0603 - 25 0.1 % AT PW 4K64 MODEL SIZE TCR TOLERANCE VALUE VERSION PACKAGING RESISTANCE VALUE MCT MCU MCA 0603 0805 1206 ± 15 ppm/K ± 25 ppm/K ± 0.1 % AT = Automotive P1 P5 PW 47K = 47 kΩ Note (1) Products can be ordered using either the PART NUMBER or PRODUCT DESCRIPTION TEMPERATURE COEFFICIENT AND RESISTANCE RANGE RESISTANCE VALUE (2) DESCRIPTION TCR TOLERANCE MCT 0603 AT MCU 0805 AT MCA 1206 AT ± 0.1 % 47 Ω to 100 kΩ 47 Ω to 100 kΩ 47 Ω to 100 kΩ ± 25 ppm/K ± 15 ppm/K Note (2) Resistance values to be selected from E96 and E192 PACKAGING REEL MODEL MCT 0603 AT MCU 0805 AT PIECES/ PAPER TAPE ON REEL CODE 1000 P1 5000 P5 20 000 PW 1000 P1 5000 P5 20 000 PW 1000 P1 5000 P5 MCA 1206 AT www.vishay.com 3 For technical questions, contact: [email protected] Document Number: 28785 Revision: 09-Apr-09 MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision Precision Thin Film Chip Resistor Superior Moisture Resistivity Vishay Beyschlag DIMENSIONS T1 W WT H T2 L DIMENSIONS AND MASS H (mm) L (mm) W (mm) WT (mm) T1 (mm) T2 (mm) MASS (mg) MCT 0603 AT 0.45 + 0.1/- 0.05 1.55 ± 0.05 0.85 ± 0.1 > 75 % of W 0.3 + 0.15/- 0.2 0.3 + 0.15/- 0.2 1.9 MCU 0805 AT 0.52 ± 0.1 2.0 ± 0.1 1.25 ± 0.15 > 75 % of W 0.4 + 0.1/- 0.2 0.4 + 0.1/- 0.2 4.6 MCA 1206 AT 0.55 ± 0.1 3.2 + 0.1/- 0.2 1.6 ± 0.15 > 75 % of W 0.5 ± 0.25 0.5 ± 0.25 9.2 TYPE SOLDER PAD DIMENSIONS X G Y Z RECOMMENDED SOLDER PAD DIMENSIONS WAVE SOLDERING TYPE REFLOW SOLDERING G (mm) Y (mm) X (mm) Z (mm) G (mm) Y (mm) X (mm) Z (mm) MCT 0603 AT 0.5 1.2 1.1 2.9 0.5 0.95 0.95 2.4 MCU 0805 AT 0.65 1.4 1.5 3.45 0.65 1.1 1.4 2.85 MCA 1206 AT 1.5 1.6 1.9 4.7 1.5 1.25 1.75 4.0 Note • The rated dissipation applies only if the permitted film temperature is not exceeded. Furthermore, a high level of ambient temperature or of power dissipation may raise the temperature of the solder joint, hence special solder alloys or boardmaterials may be required to maintain the reliability of the assembly. Specified power rating above 125 °C requires dedicated heat-sink pads, which depend on boardmaterials. The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x, or in publication IPC-7351. They do not guarantee any supposed thermal properties, particularly as these are also strongly influenced by many other parameters. Still, the given solder pad dimensions will be found adequate for most general applications, e.g. those referring to “standard operation mode”. Please note however that applications for “power operation mode” require special considerations for the design of solder pads and adjacent conductor areas. Document Number: 28785 Revision: 09-Apr-09 For technical questions, contact: [email protected] www.vishay.com 4 MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision Precision Thin Film Chip Resistor Superior Moisture Resistivity Vishay Beyschlag DESCRIPTION APPROVALS Production is strictly controlled and follows an extensive set of instructions established for reproducibility. A homogeneous film of special metal alloy is deposited on a high grade (Al2O3) ceramic substrate and conditioned to achieve the desired temperature coefficient. Specially designed inner contacts are deposited on both sides. A special laser is used to achieve the target value by smoothly cutting a meander groove in the resistive layer without damaging the ceramics. The resistor elements are covered by a unique protective coating designed for electrical, mechanical and climatic protection. The terminations receive a final pure tin on nickel plating. The resistors are approved within the IECQ-CECC Quality Assessment System for Electronic Components to the detail specification EN 140401-801 which refers to EN 60115-1, EN 140400 and the variety of environmental test procedures of the IEC 60068 (3) series. The detail specification refers to the climatic categories 55/125/56, which relates to the “standard operation mode” of this datasheet. The result of the determined production is verified by an extensive testing procedure and optical inspection performed on 100 % of the individual chip resistors. Only accepted products are laid directly into the paper tape in accordance with IEC 60286-3 (3). Conformity is attested by the use of the CECC Logo ( the Mark of Conformity on the package label. ) as Vishay BEYSCHLAG has achieved “Approval of Manufacturer” in accordance with IEC QC 001002-3, clause 2. The release certificate for “Technology Approval Schedule” in accordance with CECC 240001 based on IEC QC 001002-3, clause 6 is granted for the Vishay BEYSCHLAG manufacturing process. The resistors are qualified according to AEC-Q200. ASSEMBLY RELATED PRODUCTS The resistors are suitable for processing on automatic SMD assembly systems. They are suitable for automatic soldering using wave, reflow or vapour phase as shown in IEC 61760-1 (3). The encapsulation is resistant to all cleaning solvents commonly used in the electronics industry, including alcohols, esters and aqueous solutions. The suitability of conformal coatings, if applied, shall be qualified by appropriate means to ensure the long-term stability of the whole system. For more information about products with higher operation temperature please refer to the professional datasheet document no. 28760. Chip resistor arrays may be used in sensing applications or precision amplifiers where close matching between multiple resistors is necessary. Please refer to the ACAS AT - Precision datasheet document no. 28770. The resistors are RoHS compliant; the pure tin plating provides compatibility with lead (Pb)-free and lead-containing soldering processes. Solderability is specified for 2 years after production or requalification. The permitted storage time is 20 years. The immunity of the plating against tin whisker growth has been proven under extensive testing. All products comply with the GADSL (1) and the CEFIC-EECA-EICTA (2) list of legal restrictions on hazardous substances. This includes full compliance with the following directives: • 2000/53/EC End of Vehicle life Directive (ELV) and Annex II (ELV II) • 2002/95/EC Restriction of the Substances directive (RoHS) use of Hazardous • 2002/96/EC Waste Electrical and Electronic Equipment Directive (WEEE) Notes (1) Global Automotive Declarable Substance List, see www.gadsl.org (2) CEFIC (European Chemical Industry Council), EECA (European Electronic Component Manufacturers Association), EICTA (European trade organisation representing the information and communications technology and consumer electronics), see www.eicta.org → issues → environment policy → chemicals → chemicals for electronics (3) The quoted IEC standards are also released as EN standards with the same number and identical contents www.vishay.com 5 For technical questions, contact: [email protected] Document Number: 28785 Revision: 09-Apr-09 MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision Precision Thin Film Chip Resistor Superior Moisture Resistivity Vishay Beyschlag Rated Power in % FUNCTIONAL PERFORMANCE Standard Mode Power Mode 100 80 60 40 20 0 - 55 0 50 70 100 125 180 155 Ambient Temperature in °C For permissible resistance change please refer to table MAXIMUM RESISTANCE CHANGE AT RATED POWER, above Current Noise A1 Derating 3 MCT 0603 AT MCU 0805 AT MCA 1206 AT 1 µV/V 0.1 0.01 10 Ω 100 Ω 1 kΩ 10 kΩ 100 kΩ 1 MΩ Resistance Value R Current noise A1 in accordance with IEC 60195 Current Noise TESTS AND REQUIREMENTS All tests are carried out in accordance with the following specifications: EN 60115-1, generic specification EN 140400, sectional specification EN 140401-801, detail specification The components are approved in accordance with the IECQ-CECC-system, where applicable. The following table contains only the most important tests. For the full test schedule refer to the documents listed above. The testing also covers most of the requirements specified by EIA/IS-703 and JIS-C-5202. The tests are carried out in accordance with IEC 60068 and under standard atmospheric conditions in accordance with IEC 60068-1, 5.3. Climatic category LCT/UCT/56 (rated temperature range: Lower category temperature, upper Document Number: 28785 Revision: 09-Apr-09 category temperature; damp heat, long term, 56 days) is valid (LCT = - 55 °C/UCT = 125 °C). Unless otherwise specified the following values apply: Temperature: 15 °C to 35 °C Relative humidity: 45 % to 75 % Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar). The components are mounted for testing on boards in accordance with EN 140400, 2.3.3 unless otherwise specified. The requirements stated in the Test Procedures and Requirements table are based on the required tests and permitted limits of EN 140401-801. However, some additional tests and a number of improvements against those minimum requirements have been included. For technical questions, contact: [email protected] www.vishay.com 6 MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision Precision Thin Film Chip Resistor Superior Moisture Resistivity Vishay Beyschlag TEST PROCEDURES AND REQUIREMENTS EN 60115-1 CLAUSE IEC 60068-2 TEST METHOD TEST PROCEDURE REQUIREMENTS PERMISSIBLE CHANGE (ΔR) STABILITY CLASS 0.25 OR BETTER (1) Stability for product types: MCT 0603 AT 47 Ω to 100 kΩ MCU 0805 AT 47 Ω to 100 kΩ MCA 1206 AT 47 Ω to 100 kΩ ± 0.1 % R 4.5 - Resistance 4.8.4.2 - Temperature coefficient At (20/- 55/20) °C and (20/155/20) °C Endurance at 70 °C: Standard operation mode U = P 70 x R or U = Umax.; whichever is the less severe; 1.5 h on; 0.5 h off; 70 °C; 1000 h 70 °C; 8000 h ± (0.1 % R + 0.02 Ω) ± (0.2 % R + 0.02 Ω) Endurance at 70 °C: Power operation mode U = P 70 x R or U = Umax.; whichever is the less severe; 1.5 h on; 0.5 h off; 70 °C; 1000 h 70 °C; 8000 h ± (0.2 % R + 0.02 Ω) ± (0.4 % R + 0.05 Ω) - Endurance at upper category temperature 125 °C; 1000 h 155 °C; 1000 h ± (0.15 % R + 0.02 Ω) ± (0.3 % R + 0.02 Ω) 78 (Cab) Damp heat, steady state (40 ± 2) °C; 56 days; (93 ± 3) % RH ± (0.1 % R + 0.02 Ω) 67 (Cy) Damp heat, steady state, accelerated (85 ± 2) °C (85 ± 5) % RH U = 0.1 x P 70 x R ≤ 100 V; 1000 h ± (0.5 % R + 0.05 Ω) 4.25.1 4.25.3 4.24 4.39 - 4.23 4.23.2 ± 25 ppm/K; ± 15 ppm/K Climatic sequence: 2 (Ba) dry heat 125 °C; 16 h 4.23.3 30 (Db) damp heat, cyclic 55 °C; 24 h; > 90 % RH; 1 cycle 4.23.4 1 (Aa) cold - 55 °C; 2 h 4.23.5 13 (M) low air pressure 8.5 kPa; 2 h; (25 ± 10) °C damp heat, cyclic 55 °C; 5 days > 90 % RH; 5 cycles ± (0.25 % R + 0.02 Ω) 4.23.6 30 (Db) 4.23.7 - DC load U = P 70 x R ≤ Umax.; 1 min - 1 (Aa) Storage at low temperature - 55 °C; 2 h ± (0.05 % R + 0.01 Ω) 4.19 14 (Na) Rapid change of temperature 30 min at - 55 °C and 30 min at 125 °C; 1000 cycles ± (0.25 % R + 0.02 Ω) 4.13 - Short time overload; standard operation mode U = 2.5 x P 70 x R ≤ 2 × Umax.; 5 s ± (0.05 % R + 0.01 Ω) 4.27 - Single pulse high voltage overload; standard operation mode Severity no. 4: U = 10 x P 70 x R ≤ 2 x Umax.; 10 pulses ± (0.25 % R + 0.05 Ω) Note (1) According to the detail specification EN 140401-801 the stability class applies to the category temperatures 85 °C and 125 °C and their respective test conditions. www.vishay.com 7 For technical questions, contact: [email protected] Document Number: 28785 Revision: 09-Apr-09 MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision Precision Thin Film Chip Resistor Superior Moisture Resistivity Vishay Beyschlag TEST PROCEDURES AND REQUIREMENTS EN 60115-1 CLAUSE IEC 60068-2 TEST METHOD TEST PROCEDURE REQUIREMENTS PERMISSIBLE CHANGE (ΔR) STABILITY CLASS 0.25 OR BETTER (1) Stability for product types: 4.37 4.40 4.22 4.17.2 - - 6 (Fc) 58 (Td) MCT 0603 AT 47 Ω to 100 kΩ MCU 0805 AT 47 Ω to 100 kΩ MCA 1206 AT 47 Ω to 100 kΩ 15 x P 70 x R ≤ 2 x Umax.; 0.1 s on; 2.5 s off; 1000 cycles ± (0.5 % R + 0.05 Ω) ESD (Electro Static Discharge) IEC 61340-3-1; 3 pos. + 3 neg. (equivalent to MIL-STD-883, Method 3015) MCT 0603 AT: 1000 V MCU 0805 AT: 1500 V MCA 1206 AT: 2000 V ± (0.5 % R + 0.05 Ω) Vibration Endurance by sweeping; 10 Hz to 2000 Hz; no resonance; amplitude ≤ 1.5 mm or ≤ 200 m/s2; 6 h ± (0.05 % R + 0.01 Ω) no visible damage Solder bath method; SnPb40; non-activated flux (215 ± 3) °C; (3 ± 0.3) s Good tinning (≥ 95 % covered); no visible damage Solder bath method; SnAg3Cu0.5 or SnAg3.5; non-activated flux; (235 ± 3) °C; (2 ± 0.2) s Good tinning (≥ 95 % covered); no visible damage Periodic electric overload; standard operation mode Solderability U= 4.18.2 58 (Td) Resistance to soldering heat Solder bath method; (260 ± 5) °C; (10 ± 1) s ± (0.05 % R + 0.01 Ω) no visible damage 4.29 45 (XA) Component solvent resistance Isopropyl alcohol + 50 °C; method 2 No visible damage 4.32 21 (Ue3) Shear (adhesion) RR 2012M and RR 3216M; 45 N 4.33 21 (Ue1) Substrate bending Depth 2 mm, 3 times ± (0.05 % R + 0.01 Ω) no visible damage; no open circuit in bent position 4.7 - Voltage proof URMS = Uins; (60 ± 5) s No flashover or breakdown 4.35 - Flammability Needle flame test; 10 s No burning after 30 s RR 1608M; 9 N Document Number: 28785 Revision: 09-Apr-09 No visible damage For technical questions, contact: [email protected] www.vishay.com 8 Legal Disclaimer Notice Vishay Disclaimer All product specifications and data are subject to change without notice. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. Product names and markings noted herein may be trademarks of their respective owners. Document Number: 91000 Revision: 18-Jul-08 www.vishay.com 1