Intersil MD80C86-2B Cmos 16-bit microprocessor Datasheet

80C86
®
Datasheet
January 9, 2009
CMOS 16-Bit Microprocessor
Features
The Intersil 80C86 high performance 16-bit CMOS CPU is
manufactured using a self-aligned silicon gate CMOS
process (Scaled SAJI IV). Two modes of operation,
minimum for small systems and maximum for larger
applications such as multiprocessing, allow user
configuration to achieve the highest performance level. Full
TTL compatibility (with the exception of CLOCK) and
industry standard operation allow use of existing NMOS
8086 hardware and software designs.
• Compatible with NMOS 8086
FN2957.3
• Completely Static CMOS Design
- DC . . . . . . . . . . . . . . . . . . . . . . . . . . . .8MHz (80C86-2)
• Low Power Operation
- lCCSB . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500mA Max
- ICCOP . . . . . . . . . . . . . . . . . . . . . . . . . 10mA/MHz Typ
• 1MByte of Direct Memory Addressing Capability
• 24 Operand Addressing Modes
Ordering Information
• Bit, Byte, Word and Block Move Operations
PART NUMBER
TEMP.
RANGE
(°C)
PART
MARKING
PACKAGE
PKG.
DWG. #
CP80C86-2
CP80C86-2
0 to +70
40 Ld PDIP
E40.6
CP80C86-2Z
(Note)
CP80C86-2Z
0 to +70
40 Ld PDIP*
(Pb-free)
E40.6
• 8-Bit and 16-Bit Signed/Unsigned Arithmetic
- Binary, or Decimal
- Multiply and Divide
MD80C86-2/883 MD80C86-2/883 -55 to +125 40 Ld CERDIP F40.6
• Wide Operating Temperature Range
- C80C86 . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to +70°C
- M80C86 . . . . . . . . . . . . . . . . . . . . . . . -55°C to +125°C
MD80C86-2/B
MD80C86-2/B
-55 to +125 40 Ld CERDIP F40.6
• Pb-Free Available (RoHS Compliant)
8405202QA
8405202QA
-55 to +125 40 Ld CERDIP F40.6
(SMD)
*Pb-free PDIPs can be used for through-hole wave solder processing only.
They are not intended for use in Reflow solder processing applications.
NOTE: These Intersil Pb-free plastic packaged products employ special
Pb-free material sets, molding compounds/die attach materials, and 100%
matte tin plate plus anneal (e3 termination finish, which is RoHS compliant
and compatible with both SnPb and Pb-free soldering operations). Intersil
Pb-free products are MSL classified at Pb-free peak reflow temperatures
that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2002, 2006, 2009. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
80C86
Pinout
80C86
(40 LD PDIP, CERDIP)
TOP VIEW
2
GND
1
MAX
40 VCC
AD14
2
39 AD15
AD13
3
38 A16/S3
AD12
4
37 A17/S4
(MIN)
AD11
5
36 A18/S5
AD10
6
35 A19/S6
AD9
7
34 BHE/S7
AD8
8
33 MN/MX
AD7
9
32 RD
AD6
10
31 RQ/GT0
(HOLD)
AD5
11
30 RQ/GT1
(HLDA)
AD4
12
29 LOCK
(WR)
AD3
13
28 S2
(M/IO)
AD2
14
27 S1
(DT/R))
AD1
15
26 S0
(DEN)
AD0
16
25 QS0
(ALE)
NMI
17
24 QS1
(INTA)
INTR
18
23 TEST
CLK
19
22 READY
GND
20
21 RESET
FN2957.3
January 9, 2009
80C86
Functional Diagram
EXECUTION UNIT
REGISTER FILE
BUS INTERFACE UNIT
RELOCATION
REGISTER FILE
DATA POINTER
AND
INDEX REGS
(8 WORDS)
SEGMENT REGISTERS
AND
INSTRUCTION POINTER
(5 WORDS)
16-BIT ALU
16
BHE/S7
A19/S6
A16/S3
AD15-AD0
3
INTA, RD, WR
4
DT/R, DEN, ALE, M/IO
4
FLAGS
BUS INTERFACE UNIT
6-BYTE
INSTRUCTION
QUEUE
TEST
INTR
NMI
LOCK
RQ/GT0, 1
CONTROL AND TIMING
2
HOLD
HLDA
CLK
2
QS0, QS1
3
S2, S1, S0
3
RESET READY MN/MX GND
VCC
MEMORY INTERFACE
C-BUS
INSTRUCTION
STREAM BYTE
QUEUE
B-BUS
ES
CS
BUS
INTERFACE
UNIT
SS
DS
IP
EXECUTION UNIT
CONTROL SYSTEM
A-BUS
AH
BH
AL
BL
CL
CH
EXECUTION
UNIT
ARITHMETIC/
LOGIC UNIT
DL
DH
SP
BP
SI
DI
3
FLAGS
FN2957.3
January 9, 2009
80C86
Pin Descriptions
The following pin function descriptions are for 80C86 systems in either minimum or maximum mode. The “Local Bus” in these description is the direct
multiplexed bus interface connection to the 80C86 (without regard to additional bus buffers).
SYMBOL
PIN
NUMBER
TYPE
DESCRIPTION
AD15-AD0
2-16, 39
I/O
ADDRESS DATA BUS: These lines constitute the time multiplexed memory/lO address (t1) and data
(t2, t3, tW, t4) bus. A0 is analogous to BHE for the lower byte of the data bus, pins D7-D0. It is LOW
during Ti when a byte is to be transferred on the lower portion of the bus in memory or I/O operations.
Eight-bit oriented devices tied to the lower half would normally use A0 to condition chip select functions
(See BHE). These lines are active HIGH and are held at high impedance to the last valid logic level
during interrupt acknowledge and local bus “hold acknowledge” or “grant sequence”.
A19/S6
A18/S5
A17/S4
A16/S3
35-38
O
ADDRESS/STATUS: During t1, these are the 4 most significant address lines for memory operations.
During I/O operations these lines are LOW. During memory and I/O operations, status information is
available on these lines during t2, t3, tW, t4. S6 is always LOW. The status of the interrupt enable
FLAG bit (S5) is updated at the beginning of each clock cycle. S4 and S3 are encoded as shown.
This information indicates which segment register is presently being used for data accessing.
These lines are held at high impedance to the last valid logic level during local bus “hold acknowledge”
or “grant sequence”.
BHE/S7
RD
34
O
32
O
S4
S3
CHARACTERISTICS
0
0
Alternate Data
0
1
Stack
1
0
Code or None
1
1
Data
BUS HIGH ENABLE/STATUS: During t1 the bus high enable signal (BHE) should be used to enable
data onto the most significant half of the data bus, pins D15-D8. Eight bit oriented devices tied to the
upper half of the bus would normally use BHE to condition chip select functions. BHE is LOW during
t1 for read, write, and interrupt acknowledge cycles when a byte is to be transferred on the high portion
of the bus. The S7 status information is available during t2, t3 and t4. The signal is active LOW, and
is held at high impedance to the last valid logic level during interrupt acknowledge and local bus “hold
acknowledge” or “grant sequence”, it is LOW during t1 for the first interrupt acknowledge cycle.
BHE
A0
CHARACTERISTICS
0
0
Whole Word
0
1
Upper Byte From/to Odd Address
1
0
Lower Byte From/to Even address
1
1
None
READ: Read strobe indicates that the processor is performing a memory or I/O read cycle, depending
on the state of the M/IO or S2 pin. This signal is used to read devices which reside on the 80C86 local
bus. RD is active LOW during t2, t3 and tW of any read cycle, and is guaranteed to remain HIGH in t2
until the 80C86 local bus has floated.
This line is held at a high impedance logic one state during “hold acknowledge” or “grand sequence”.
READY
22
I
READY: The acknowledgment from the addressed memory or I/O device that will complete the data
transfer. The RDY signal from memory or I/O is synchronized by the 82C84A Clock Generator to form
READY. This signal is active HIGH. The 80C86 READY input is not synchronized. Correct operation
is not guaranteed if the Setup and Hold Times are not met.
INTR
18
I
INTERRUPT REQUEST: A level triggered input which is sampled during the last clock cycle of each
instruction to determine if the processor should enter into an interrupt acknowledge operation. A
subroutine is vectored to via an interrupt vector lookup table located in system memory. It can be
internally masked by software resetting the interrupt enable bit.
lNTR is internally synchronized. This signal is active HIGH.
4
FN2957.3
January 9, 2009
80C86
Pin Descriptions (Continued)
The following pin function descriptions are for 80C86 systems in either minimum or maximum mode. The “Local Bus” in these description is the direct
multiplexed bus interface connection to the 80C86 (without regard to additional bus buffers).
SYMBOL
PIN
NUMBER
TYPE
DESCRIPTION
TEST
23
I
TEST: input is examined by the “Wait” instruction. If the TEST input is LOW execution continues,
otherwise the processor waits in an “Idle” state. This input is synchronized internally during each clock
cycle on the leading edge of CLK.
NMI
17
I
NON-MASKABLE INTERRUPT: An edge triggered input which causes a type 2 interrupt. A subroutine
is vectored to via an interrupt vector lookup table located in system memory. NMI is not maskable
internally by software. A transition from LOW to HIGH initiates the interrupt at the end of the current
instruction. This input is internally synchronized.
RESET
21
I
RESET: Causes the processor to immediately terminate its present activity. The signal must transition
LOW to HIGH and remain active HIGH for at least 4 clock cycles. It restarts execution, as described
in the “Instruction Set Summary” on page 31 when RESET returns LOW. RESET is internally
synchronized.
CLK
19
I
CLOCK: Provides the basic timing for the processor and bus controller. It is asymmetric with a 33%
duty cycle to provide optimized internal timing.
VCC
40
VCC: +5V power supply pin. A 0.1µF capacitor between pins 20 and 40 is recommended for
decoupling.
GND
1, 20
GND: Ground. Note: Both must be connected. A 0.1µF capacitor between pins 1 and 20 is
recommended for decoupling.
MN/MX
33
I
MINIMUM/MAXIMUM: Indicates what mode the processor is to operate in. The two modes are
discussed in the following sections.
Minimum Mode System
The following pin function descriptions are for the 80C86 in minimum mode (i.e., MN/MX = VCC). Only the pin functions which are unique to minimum
mode are described; all other pin functions are as described in the following.
SYMBOL
PIN
NUMBER
TYPE
DESCRIPTION
M/IO
28
O
STATUS LINE: Logically equivalent to S2 in the maximum mode. It is used to distinguish a memory
access from an I/O access. M/lO becomes valid in the t4 preceding a bus cycle and remains valid until
the final t4 of the cycle (M = HIGH, I/O = LOW). M/lO is held to a high impedance logic one during local
bus “hold acknowledge”.
WR
29
O
WRITE: Indicates that the processor is performing a write memory or write I/O cycle, depending on
the state of the M/IO signal. WR is active for t2, t3 and tW of any write cycle. It is active LOW, and is
held to high impedance logic one during local bus “hold acknowledge”.
INTA
24
O
INTERRUPT ACKNOWLEDGE: Used as a read strobe for interrupt acknowledge cycles. It is active
LOW during t2, t3 and tW of each interrupt acknowledge cycle. Note that INTA is never floated.
ALE
25
O
ADDRESS LATCH ENABLE: Provided by the processor to latch the address into the 82C82/82C83
address latch. It is a HIGH pulse active during clock LOW of t1 of any bus cycle. Note that ALE is never
floated.
DT/R
27
O
DATA TRANSMIT/RECEIVE: Needed in a minimum system that desires to use a data bus transceiver.
It is used to control the direction of data flow through the transceiver. Logically,
DT/R is equivalent to S1 in maximum mode, and its timing is the same as for M/IO (T = HIGH,
R = LOW). DT/R is held to a high impedance logic one during local bus “hold acknowledge”.
DEN
26
O
DATA ENABLE: Provided as an output enable for a bus transceiver in a minimum system which uses
the transceiver. DEN is active LOW during each memory and I/O access and for INTA cycles. For a
read or INTA cycle it is active from the middle of t2 until the middle of t4, while for a write cycle it is
active from the beginning of t2 until the middle of t4. DEN is held to a high impedance logic one during
local bus “hold acknowledge”.
5
FN2957.3
January 9, 2009
80C86
Minimum Mode System
(Continued)
The following pin function descriptions are for the 80C86 in minimum mode (i.e., MN/MX = VCC). Only the pin functions which are unique to minimum
mode are described; all other pin functions are as described in the following.
SYMBOL
HOLD
HLDA
PIN
NUMBER
TYPE
DESCRIPTION
I
O
HOLD: indicates that another master is requesting a local bus “hold”. To be an acknowledged, HOLD
must be active HIGH. The processor receiving the “hold” will issue a “hold acknowledge” (HLDA) in
the middle of a t4 or TI clock cycle. Simultaneously with the issuance of HLDA, the processor will float
the local bus and control lines. After HOLD is detected as being LOW, the processor will lower HLDA,
and when the processor needs to run another cycle, it will again drive the local bus and control lines.
31, 30
HOLD is not an asynchronous input. External synchronization should be provided if the system cannot
otherwise guarantee the setup time.
Maximum Mode System
The following pin function descriptions are for the 80C86 system in maximum mode (i.e., MN/MX - GND). Only the pin functions which are unique
to maximum mode are described in the following.
SYMBOL
PIN
NUMBER
TYPE
DESCRIPTION
S0
S1
S2
26
27
28
O
O
O
STATUS: is active during t4, t1 and t2 and is returned to the passive state (1, 1, 1) during t3 or during
tW when READY is HIGH. This status is used by the 82C88 Bus Controller to generate all memory
and I/O access control signals. Any change by S2, S1 or S0 during t4 is used to indicate the beginning
of a bus cycle, and the return to the passive state in t3 or tW is used to indicate the end of a bus cycle.
These signals are held at a high impedance logic one state during “grant sequence”.
6
S2
S1
S0
CHARACTERISTICS
0
0
0
Interrupt Acknowledge
0
0
1
Read I/O Port
0
1
0
Write I/O Port
0
1
1
Halt
1
0
0
Code Access
1
0
1
Read Memory
1
1
0
Write Memory
1
1
1
Passive
FN2957.3
January 9, 2009
80C86
Maximum Mode System
(Continued)
The following pin function descriptions are for the 80C86 system in maximum mode (i.e., MN/MX - GND). Only the pin functions which are unique
to maximum mode are described in the following.
SYMBOL
RQ/GT0
RQ/GT1
PIN
NUMBER
TYPE
DESCRIPTION
31, 30
I/O
REQUEST/GRANT: pins are used by other local bus masters to force the processor to release the
local bus at the end of the processor’s current bus cycle. Each pin is bidirectional with RQ/GTO having
higher priority than RQ/GT1. RQ/GT has an internal pull-up bus hold device so it may be left
unconnected. The request/grant sequence is as follows (see RQ/GT Sequence Timing)
1. A pulse of 1 CLK wide from another local bus master indicates a local bus request (“hold”) to the
80C86 (pulse 1).
2. During a t4 or TI clock cycle, a pulse 1 CLK wide from the 80C86 to the requesting master
(pulse 2) indicates that the 80C86 has allowed the local bus to float and that it will enter the “grant
sequence” state at the next CLK. The CPU’s bus interface unit is disconnected logically from the
local bus during “grant sequence”.
3. A pulse 1 CLK wide from the requesting master indicates to the 80C86 (pulse 3) that the “hold”
request is about to end and that the 80C86 can reclaim the local bus at the next CLK. The CPU
then enters t4 (or TI if no bus cycles pending). Each Master-Master exchange of the local bus is
a sequence of 3 pulses. There must be one idle CLK cycle after each bus exchange. Pulses are
active low.
If the request is made while the CPU is performing a memory cycle, it will release the local bus during
t4 of the cycle when all the following conditions are met:
1. Request occurs on or before t2.
2. Current cycle is not the low byte of a word (on an odd address).
3. Current cycle is not the first acknowledge of an interrupt acknowledge sequence.
4. A locked instruction is not currently executing.
If the local bus is idle when the request is made the two possible events will follow:
1. Local bus will be released during the next cycle.
2. A memory cycle will start within three clocks. Now the four rules for a currently active memory
cycle apply with condition number 1 already satisfied.
LOCK
29
O
LOCK: output indicates that other system bus masters are not to gain control of the system bus while
LOCK is active LOW. The LOCK signal is activated by the “LOCK” prefix instruction and remains active
until the completion of the next instruction. This signal is active LOW, and is held at a high impedance
logic one state during “grant sequence”. In MAX mode, LOCK is automatically generated during t2 of
the first INTA cycle and removed during t2 of the second INTA cycle.
QS1, QSO
24, 25
O
QUEUE STATUS: The queue status is valid during the CLK cycle after which the queue operation is
performed.
QS1 and QS0 provide status to allow external tracking of the internal 80C86 instruction queue. Note
that QS1, QS0 never become high impedance.
7
QSI
QSO
0
0
No Operation
0
1
First byte of op code from queue
1
0
Empty the queue
1
1
Subsequent byte from queue
FN2957.3
January 9, 2009
80C86
Functional Description
Static Operation
All 80C86 circuitry is of static design. Internal registers,
counters and latches are static and require no refresh as
with dynamic circuit design. This eliminates the minimum
operating frequency restriction placed on other
microprocessors. The CMOS 80C86 can operate from DC to
the specified upper frequency limit. The processor clock may
be stopped in either state (HIGH/LOW) and held there
indefinitely. This type of operation is especially useful for
system debug or power critical applications.
Memory Organization
The processor provides a 20-bit address to memory, which
locates the byte being referenced. The memory is organized
as a linear array of up to 1 million bytes, addressed as
00000(H) to FFFFF(H). The memory is logically divided into
code, data, extra and stack segments of up to 64k bytes
each, with each segment falling on 16-byte boundaries
(see Figure 1).
FFFFFH
64k-BIT
CODE SEGMENT
The 80C86 can be single stepped using only the CPU clock.
This state can be maintained as long as is necessary. Single
step clock operation allows simple interface circuitry to
provide critical information for bringing up your system.
Static design also allows very low frequency operation (down
to DC). In a power critical situation, this can provide
extremely low power operation since 80C86 power
dissipation is directly related to operating frequency. As the
system frequency is reduced, so is the operating power until,
ultimately, at a DC input frequency, the 80C86 power
requirement is the standby current, (500µA maximum).
XXXXOH
STACK SEGMENT
+ OFFSET
SEGMENT
REGISTER FILE
DATA SEGMENT
CS
SS
DS
ES
Internal Architecture
EXTRA SEGMENT
The internal functions of the 80C86 processor are partitioned
logically into two processing units. The first is the Bus
Interface Unit (BlU) and the second is the Execution Unit
(EU) as shown in the “Functional Diagram” on page 3.
00000H
These units can interact directly, but for the most part perform
as separate asynchronous operational processors. The bus
interface unit provides the functions related to instruction
fetching and queuing, operand fetch and store, and address
relocation. This unit also provides the basic bus control. The
overlap of instruction pre-fetching provided by this unit serves
to increase processor performance through improved bus
bandwidth utilization. Up to 6 bytes of the instruction stream
can be queued while waiting for decoding and execution.
The instruction stream queuing mechanism allows the BIU to
keep the memory utilized very efficiently. Whenever there is
space for at least 2 bytes in the queue, the BlU will attempt a
word fetch memory cycle. This greatly reduces “dead-time”
on the memory bus. The queue acts as a First-In-First-Out
(FIFO) buffer, from which the EU extracts instruction bytes
as required. If the queue is empty (following a branch
instruction, for example), the first byte into the queue
immediately becomes available to the EU.
The execution unit receives pre-fetched instructions from the
BlU queue and provides un-relocated operand addresses to
the BlU. Memory operands are passed through the BIU for
processing by the EU, which passes results to the BIU for
storage.
8
FIGURE 1. 80C86 MEMORY ORGANIZATION
TABLE 1.
DEFAULT
SEGMENT
BASE
ALTERNATE
SEGMENT
BASE
Instruction Fetch
CS
None
IP
Stack Operation
SS
None
SP
Variable (except
following)
DS
CS, ES, SS
Effective
Address
String Source
DS
CS, ES, SS
SI
String Destination
ES
None
DI
BP Used As Base
Register
SS
CS, DS, ES
TYPE OF
MEMORY
REFERENCE
OFFSET
Effective
Address
All memory references are made relative to base addresses
contained in high speed segment registers. The segment
types were chosen based on the addressing needs of
programs. The segment register to be selected is
automatically chosen according to the specific rules of
Table 1. All information in one segment type share the same
logical attributes (e.g. code or data). By structuring memory
into re-locatable areas of similar characteristics and by
automatically selecting segment registers, programs are
shorter, faster and more structured (see Table 1).
FN2957.3
January 9, 2009
80C86
Word (16-bit) operands can be located on even or odd
address boundaries and are thus, not constrained to even
boundaries as is the case in many 16-bit computers. For
address and data operands, the least significant byte of the
word is stored in the lower valued address location and the
most significant byte in the next higher address location. The
BIU automatically performs the proper number of memory
accesses; one, if the word operand is on an even byte
boundary and two, if it is on an odd byte boundary. Except
for the performance penalty, this double access is
transparent to the software. The performance penalty does
not occur for instruction fetches; only word operands.
Physically, the memory is organized as a high bank
(D15-D8) and a low bank (D7-D0) of 512k bytes addressed
in parallel by the processor’s address lines.
Byte data with even addresses is transferred on the D7-D0
bus lines, while odd addressed byte data (A0 HIGH) is
transferred on the D15-D8 bus lines. The processor provides
two enable signals, BHE and A0, to selectively allow reading
from or writing into either an odd byte location, even byte
location, or both. The instruction stream is fetched from
memory as words and is addressed internally by the
processor at the byte level as necessary.
In referencing word data, the BlU requires one or two memory
cycles depending on whether the starting byte of the word is
on an even or odd address, respectively. Consequently, in
referencing word operands performance can be optimized by
locating data on even address boundaries. This is an
especially useful technique for using the stack, since odd
address references to the stack may adversely affect the
context switching time for interrupt processing or task
multiplexing.
Certain locations in memory are reserved for specific CPU
operations (see Figure 2). Locations from address FFFF0H
through FFFFFH are reserved for operations including a jump
to the initial program loading routine. Following RESET, the
CPU will always begin execution at location FFFF0H where
the jump must be located. Locations 00000H through 003FFH
are reserved for interrupt operations. Each of the 256 possible
interrupt service routines is accessed through its own pair of
16-bit pointers (segment address pointer and offset address
pointer). The first pointer, used as the offset address, is
loaded into the lP and the second pointer, which designates
the base address is loaded into the CS. At this point, program
control is transferred to the interrupt routine. The pointer
elements are assumed to have been stored at the respective
places in reserved memory prior to occurrence of interrupts.
Minimum and Maximum Operation Modes
The requirements for supporting minimum and maximum
80C86 systems are sufficiently different that they cannot be
met efficiently using 40 uniquely defined pins. Consequently,
the 80C86 is equipped with a strap pin (MN/MX) which
defines the system configuration. The definition of a certain
9
subset of the pins changes, dependent on the condition of the
strap pin. When the MN/MX pin is strapped to GND, the
80C86 defines pins 24 through 31 and 34 in maximum mode.
When the MN/MX pin is strapped to VCC, the 80C86
generates bus control signals itself on pins 24 through 31
and 34.
The minimum mode 80C86 can be used with either a
multiplexed or demultiplexed bus. This architecture provides
the 80C86 processing power in a highly integrated form.
The demultiplexed mode requires two 82C82 latches (for 64k
addressability) or three 82C82 latches (for a full megabyte of
addressing). An 82C86 or 82C87 transceiver can also be
used if data bus buffering is required (see Figure 6A.) The
80C86 provides DEN and DT/R to control the transceiver, and
ALE to latch the addresses. This configuration of the minimum
mode provides the standard demultiplexed bus structure with
heavy bus buffering and relaxed bus timing requirements.
The maximum mode employs the 82C88 bus controller (see
Figure 6B). The 82C88 decodes status lines S0, S1 and S2,
and provides the system with all bus control signals.
Moving the bus control to the 82C88 provides better source
and sink current capability to the control lines, and frees the
80C86 pins for extended large system features. Hardware
lock, queue status, and two request/grant interfaces are
provided by the 80C86 in maximum mode. These features
allow coprocessors in local bus and remote bus
configurations.
Bus Operation
The 80C86 has a combined address and data bus
commonly referred to as a time multiplexed bus. This
technique provides the most efficient use of pins on the
processor while permitting the use of a standard 40 lead
package. This “local bus” can be buffered directly and used
throughout the system with address latching provided on
memory and I/O modules. In addition, the bus can also be
demultiplexed at the processor with a single set of 82C82
address latches if a standard non-multiplexed bus is desired
for the system.
Each processor bus cycle consists of at least 4 CLK cycles.
These are referred to as t1, t2, t3 and t4 (see Figure 3). The
address is emitted from the processor during t1 and data
transfer occurs on the bus during t3 and t4. t2 is used
primarily for changing the direction of the bus during read
operations. In the event that a “NOT READY” indication is
given by the addressed device, “Wait” states (tW) are
inserted between t3 and t4. Each inserted wait state is the
same duration as a CLK cycle. Periods can occur between
80C86 driven bus cycles. These are referred to as idle”
states (TI) or inactive CLK cycles. The processor uses these
cycles for internal housekeeping and processing.
During t1 of any bus cycle, the ALE (Address Latch Enable)
signal is emitted (by either the processor or the 82C88 bus
controller, depending on the MN/MX strap). At the trailing
FN2957.3
January 9, 2009
80C86
edge of this pulse, a valid address and certain status
information for the cycle may be latched.
Status bits S0, S1 and S2 are used by the bus controller, in
maximum mode, to identify the type of bus transaction
according to Table 2.
TABLE 2.
S5 is a reflection of the PSW interrupt enable bit. S3 is
always zero and S7 is a spare status bit.
TABLE 3.
S4
S3
CHARACTERISTICS
0
0
Alternate Data (Extra Segment)
0
1
Stack
1
0
Code or None
1
1
Data
S2
S1
S0
0
0
0
Interrupt
0
0
1
Read I/O
0
1
0
Write I/O
I/O Addressing
0
1
1
Halt
1
0
0
Instruction Fetch
1
0
1
Read Data from Memory
1
1
0
Write Data to Memory
1
1
1
Passive (No Bus Cycle)
In the 80C86, I/O operations can address up to a maximum
of 64k I/O byte registers or 32k I/O word registers. The I/O
address appears in the same format as the memory address
on bus lines A15-A0. The address lines A19-A16 are zero in
I/O operations. The variable I/O instructions which use
register DX as a pointer have full address capability while
the direct I/O instructions directly address one or two of the
256 I/O byte locations in page 0 of the I/O address space.
CHARACTERISTICS
Status bits S3 through S7 are time multiplexed with high
order address bits and the BHE signal, and are therefore
valid during t2 through t4. S3 and S4 indicate which segment
register (see “Instruction Set Summary” on page 31) was
used for this bus cycle in forming the address, according to
Table 3.
10
I/O ports are addressed in the same manner as memory
locations. Even addressed bytes are transferred on the D7-D0
bus lines and odd addressed bytes on D15-D8. Care must be
taken to ensure that each register within an 8-bit peripheral
located on the lower portion of the bus be addressed as even.
FN2957.3
January 9, 2009
80C86
FFFFFH
FFFF0H
RESET BOOTSTRAP
PROGRAM JUMP
3FCH
TYPE 225 POINTER
(AVAILABLE)
084H
TYPE 33 POINTER
(AVAILABLE)
080H
TYPE 32 POINTER
(AVAILABLE)
07FH
TYPE 31 POINTER
(AVAILABLE)
014H
TYPE 5 POINTER
(RESERVED)
010H
TYPE 4 POINTER
OVERFLOW
00CH
TYPE 3 POINTER
1 BYTE INT INSTRUCTION
008H
TYPE 2 POINTER
NON MASKABLE
004H
TYPE 1 POINTER
SINGLE STEP
000H
TYPE 0 POINTER
DIVIDE ERROR
3FFH
AVAILABLE
INTERRUPT
POINTERS
(224)
RESERVED
INTERRUPT
POINTERS
(27)
DEDICATED
INTERRUPT
POINTERS
(5)
CS BASE ADDRESS
IP OFFSET
16 BITS
FIGURE 2. RESERVED MEMORY LOCATIONS
11
FN2957.3
January 9, 2009
80C86
(4 + NWAIT) = TCY
t1
t2
t3
(4 + NWAIT) = TCY
tWAIT
t4
t1
t2
t3
tWAIT
t4
CLK
GOES INACTIVE IN THE STATE
JUST PRIOR TO t4
ALE
S2-S0
ADDR/
STATUS
BHE,
A19-A16
BHE
A19-A16
S7-S3
S7-S3
BUS RESERVED
FOR DATA IN
ADDR/DATA
D15-D0
VALID
A15-A0
A15-A0
DATA OUT (D15-D0)
RD, INTA
READY
READY
READY
WAIT
WAIT
DT/R
DEN
MEMORY ACCESS TIME
WR
FIGURE 3. BASIC SYSTEM TIMING
External Interface
Processor RESET and Initialization
Processor initialization or start up is accomplished with
activation (HIGH) of the RESET pin. The 80C86 RESET is
required to be HIGH for greater than 4 CLK cycles. The 80C86
will terminate operations on the high-going edge of RESET and
will remain dormant as long as RESET is HIGH. The low-going
transition of RESET triggers an internal reset sequence for
approximately 7 CLK cycles. After this interval, the 80C86
operates normally beginning with the instruction in absolute
12
location FFFF0H (see Figure 2). The RESET input is internally
synchronized to the processor clock. At initialization, the
HIGH-to-LOW transition of RESET must occur no sooner than
50µs (or 4 CLK cycles, whichever is greater) after power-up, to
allow complete initialization of the 80C86.
NMl will not be recognized prior to the second CLK cycle
following the end of RESET. If NMl is asserted sooner than nine
clock cycles after the end of RESET, the processor may
execute one instruction before responding to the interrupt.
FN2957.3
January 9, 2009
80C86
Bus Hold Circuitry
To avoid high current conditions caused by floating inputs to
CMOS devices and to eliminate need for pull-up/down resistors,
“bus-hold” circuitry has been used on the 80C86 pins 2-16,
26-32 and 34-39 (see Figures 4A and 4B). These circuits will
maintain the last valid logic state if no driving source is present
(i.e., an unconnected pin or a driving source which goes to a
high impedance state). To overdrive the “bus hold” circuits, an
external driver must be capable of supplying approximately
400µA minimum sink or source current at valid input voltage
levels. Since this “bus hold” circuitry is active and not a
“resistive” type element, the associated power supply current is
negligible and power dissipation is significantly reduced when
compared to the use of passive pull-up resistors.
BOND
PAD
OUTPUT
DRIVER
EXTERNAL
PIN
INPUT
BUFFER
INPUT
PROTECTION
CIRCUITRY
FIGURE 4A. BUS HOLD CIRCUITRY PINS 2-16, 34-39
BOND
PAD
OUTPUT
DRIVER
VCC
INPUT
BUFFER
P
EXTERNAL
PIN
INPUT
PROTECTION
CIRCUITRY
FIGURE 4B. BUS HOLD CIRCUITRY PINS 26-32
FIGURE 4. INTERNAL BUS HOLD DEVICES
Interrupt Operations
Interrupt operations fall into two classes: software or
hardware initiated. The software initiated interrupts and
software aspects of hardware interrupts are specified in the
“Instruction Set Summary” on page 31. Hardware interrupts
can be classified as non-maskable or maskable.
Interrupts result in a transfer of control to a new program
location. A 256-element table containing address pointers to
the interrupt service program locations resides in absolute
locations 0 through 3FFH, which are reserved for this
purpose. Each element in the table is 4 bytes in size and
corresponds to an interrupt “type”. An interrupting device
supplies an 8-bit type number during the interrupt
acknowledge sequence, which is used to “vector” through the
appropriate element to the new interrupt service program
location. All flags and both the Code Segment and Instruction
Pointer register are saved as part of the lNTA sequence.
13
These are restored upon execution of an Interrupt Return
(IRET) instruction.
Non-Maskable Interrupt (NMI)
The processor provides a single non-maskable interrupt pin
(NMI) which has higher priority than the maskable interrupt
request pin (INTR). A typical use would be to activate a
power failure routine. The NMI is edge-triggered on a
LOW-to-HIGH transition. The activation of this pin causes a
type 2 interrupt.
NMl is required to have a duration in the HIGH state of
greater than two CLK cycles, but is not required to be
synchronized to the clock. Any positive transition of NMI is
latched on-chip and will be serviced at the end of the current
instruction or between whole moves of a block-type
instruction. Worst case response to NMI would be for
multiply, divide, and variable shift instructions. There is no
specification on the occurrence of the low-going edge; it may
occur before, during or after the servicing of NMI. Another
positive edge triggers another response if it occurs after the
start of the NMI procedure. The signal must be free of logical
spikes in general and be free of bounces on the low-going
edge to avoid triggering extraneous responses.
Maskable Interrupt (INTR)
The 80C86 provides a single interrupt request input (lNTR)
which can be masked internally by software with the
resetting of the interrupt enable flag (IF) status bit. The
interrupt request signal is level triggered. It is internally
synchronized during each clock cycle on the high-going
edge of CLK. To be responded to, lNTR must be present
(HIGH) during the clock period preceding the end of the
current instruction or the end of a whole move for a block
type instruction. lNTR may be removed anytime after the
falling edge of the first INTA signal. During the interrupt
response sequence further interrupts are disabled. The
enable bit is reset as part of the response to any interrupt
(lNTR, NMI, software interrupt or single-step), although the
FLAGS register which is automatically pushed onto the stack
reflects the state of the processor prior to the interrupt. Until
the old FLAGS register is restored, the enable bit will be zero
unless specifically set by an instruction.
During the response sequence (see Figure 5) the processor
executes two successive (back-to-back) interrupt acknowledge
cycles. The 80C86 emits the LOCK signal (Max mode only)
from t2 of the first bus cycle until t2 of the second. A local bus
“hold” request will not be honored until the end of the second
bus cycle. In the second bus cycle, a byte is supplied to the
80C86 by the 82C59A Interrupt Controller, which identifies the
source (type) of the interrupt. This byte is multiplied by 4 and
used as a pointer into the interrupt vector lookup table. An INTR
signal left HIGH will be continually responded to within the
limitations of the enable bit and sample period. The
INTERRUPT RETURN instruction includes a FLAGS pop
which returns the status of the original interrupt enable bit
when it restores the FLAGS.
FN2957.3
January 9, 2009
80C86
.
t1
t2
t3
t4
TI
t1
t2
t3
t4
ALE
circuits. If interrupts are enabled, the 80C86 will recognize
interrupts and process them when it regains control of the
bus. The WAIT instruction is then refetched, and
re-executed.
TABLE 4. 80C86 REGISTER
LOCK
INTA
AD0AD15
FLOAT
TYPE
VECTOR
AX
AH
AL
ACCUMULATOR
BX
BH
BL
BASE
CX
CH
CL
COUNT
DX
DH
DL
DATA
FIGURE 5. INTERRUPT ACKNOWLEDGE SEQUENCE
Halt
When a software “HALT” instruction is executed, the
processor indicates that it is entering the “HALT” state in one
of two ways depending upon which mode is strapped. In
minimum mode, the processor issues one ALE with no
qualifying bus control signals. In maximum mode the
processor issues appropriate HALT status on S2, S1, S0 and
the 82C88 bus controller issues one ALE. The 80C86 will not
leave the “HALT” state when a local bus “hold” is entered
while in “HALT”. In this case, the processor reissues the
HALT indicator at the end of the local bus hold. An NMI or
interrupt request (when interrupts enabled) or RESET will
force the 80C86 out of the “HALT” state.
Read/Modify/Write (Semaphore)
Operations Via Lock
The LOCK status information is provided by the processor
when consecutive bus cycles are required during the execution
of an instruction. This gives the processor the capability of
performing read/modify/write operations on memory (via the
Exchange Register With Memory instruction, for example)
without another system bus master receiving intervening
memory cycles. This is useful in multiprocessor system
configurations to accomplish “test and set lock” operations. The
LOCK signal is activated (forced LOW) in the clock cycle
following decoding of the software “LOCK” prefix instruction. It
is deactivated at the end of the last bus cycle of the instruction
following the “LOCK” prefix instruction. While LOCK is active a
request on a RQ/GT pin will be recorded and then honored at
the end of the LOCK.
External Synchronization Via TEST
As an alternative to interrupts, the 80C86 provides a single
software-testable input pin (TEST). This input is utilized by
executing a WAIT instruction. The single WAIT instruction is
repeatedly executed until the TEST input goes active (LOW).
The execution of WAIT does not consume bus cycles once
the queue is full.
If a local bus request occurs during WAIT execution, the
80C86 three-states all output drivers while inputs and I/O
pins are held at valid logic levels by internal bus-hold
14
SP
STACK POINTER
BP
BASE POINTER
SI
SOURCE INDEX
DI
DESTINATION INDEX
INSTRUCTION POINTER
IP
FLAGSH
FLAGSL
STATUS FLAG
CS
CODE SEGMENT
DS
DATA SEGMENT
SS
STACK SEGMENT
ES
EXTRA SEGMENT
Basic System Timing
Typical system configurations for the processor operating in
minimum mode and in maximum mode are shown in
Figures 6A and 6B, respectively. In minimum mode, the
MN/MX pin is strapped to VCC and the processor emits bus
control signals (e.g. RD, WR, etc.) directly. In maximum
mode, the MN/MX pin is strapped to GND and the processor
emits coded status information which the 82C88 bus
controller uses to generate MULTIBUS compatible bus
control signals. Figure 3 shows the signal timing
relationships.
System Timing - Minimum System
The read cycle begins in t1 with the assertion of the Address
Latch Enable (ALE) signal. The trailing (low-going) edge of
this signal is used to latch the address information, which is
valid on the address/data bus (AD0-AD15) at this time, into
the 82C82/82C83 latch. The BHE and A0 signals address
the low, high or both bytes. From t1 to t4 the M/lO signal
indicates a memory or I/O operation. At t2, the address is
removed from the address/data bus and the bus is held at
the last valid logic state by internal bus hold devices. The
read control signal is also asserted at t2. The read (RD)
signal causes the addressed device to enable its data bus
drivers to the local bus. Some time later, valid data will be
available on the bus and the addressed device will drive the
READY line HIGH. When the processor returns the read
signal to a HIGH level, the addressed device will again
three-state its bus drivers. If a transceiver (82C86/82C87) is
FN2957.3
January 9, 2009
80C86
required to buffer the 80C86 local bus, signals DT/R and
DEN are provided by the 80C86.
A write cycle also begins with the assertion of ALE and the
emission of the address. The M/IO signal is again asserted
to indicate a memory or I/O write operation. In t2,
immediately following the address emission, the processor
emits the data to be written into the addressed location. This
data remains valid until at least the middle of t4. During t2, t3
and tW, the processor asserts the write control signal. The
write (WR) signal becomes active at the beginning of t2 as
opposed to the read which is delayed somewhat into t2 to
provide time for output drivers to become inactive.
The BHE and A0 signals are used to select the proper
byte(s) of the memory/lO word to be read or written
according to Table 5.
TABLE 5.
BHE
A0
CHARACTERISTICS
0
0
Whole word
0
1
Upper Byte From/To Odd Address
1
0
Lower Byte From/To Even Address
1
1
None
I/O ports are addressed in the same manner as memory
location. Even addressed bytes are transferred on the
D7-D0 bus lines and odd address bytes on D15-D8.
The basic difference between the interrupt acknowledge
cycle and a read cycle is that the interrupt acknowledge
signal (INTA) is asserted in place of the read (RD) signal and
the address bus is held at the last valid logic state by internal
bus hold devices (see Figure 4). In the second of two
successive INTA cycles a byte of information is read from
the data bus (D7-D0) as supplied by the interrupt system
15
logic (i.e., 82C59A Priority Interrupt Controller). This byte
identifies the source (type) of the interrupt. It is multiplied by
4 and used as a pointer into an interrupt vector lookup table,
as described earlier.
Bus Timing - Medium Size Systems
For medium complexity systems the MN/MX pin is
connected to GND and the 82C88 Bus Controller is added to
the system as well as an 82C82/82C83 latch for latching the
system address, and an 82C86/82C87 transceiver to allow
for bus loading greater than the 80C86 is capable of
handling. Signals ALE, DEN, and DT/R are generated by the
82C88 instead of the processor in this configuration,
although their timing remains relatively the same. The
80C86 status outputs (S2, S1 and S0) provide type-of-cycle
information and become 82C88 inputs. This bus cycle
information specifies read (code, data or I/O), write (data or
I/O), interrupt acknowledge, or software halt. The 82C88
issues control signals specifying memory read or write, I/O
read or write, or interrupt acknowledge. The 82C88 provides
two types of write strobes, normal and advanced, to be
applied as required. The normal write strobes have data
valid at the leading edge of write. The advanced write
strobes have the same timing as read strobes, and hence,
data is not valid at the leading edge of write. The
82C86/82C87 transceiver receives the usual T and OE
inputs from the 82C88 DT/R and DEN signals.
The pointer into the interrupt vector table, which is passed
during the second INTA cycle, can be derived from an
82C59A located on either the local bus or the system bus. If
the master 82C59A Priority Interrupt Controller is positioned
on the local bus, the 82C86/82C87 transceiver must be
disabled when reading from the master 82C59A during the
interrupt acknowledge sequence and software “poll”.
FN2957.3
January 9, 2009
80C86
VCC
MN/MX
M/IO
82C8A/85
CLOCK
GENERATOR
INTA
CLK
RD
WR
READY
RES
RESET
RDY
VCC
DT/R
DEN
GND
WAIT
STATE
GENERATOR
ALE
80C86
CPU
VCC
STB
GND
GND
1
AD0-AD15
A16-A19
C1
ADDR
ADDR/DATA
82C82
LATCH
2 OR 3
BHE
GND
20
OE
C2
T
VCC
40
OE
82C86
TRANSCEIVER
(2)
C1 = C2 = 0.1µF
DATA
A0
BHE
OPTIONAL
FOR INCREASED
DATA BUS DRIVE
W G
EL
HM-6516
CMOS RAM
EH
2k x 8
2k x 8
E
G
HM-6616
CMOS PROM (2)
2k x 8 2k x 8
CS
RD WR
CMOS
82CXX
PERIPHERALS
FIGURE 6A. MINIMUM MODE 80C86 TYPICAL CONFIGURATION
VCC
GND
MN/MX
S0
READY S1
CLK
82C84A/85
CLOCK
GENERATOR/
RES
RDY
RESET
S2
LOCK
WAIT
STATE
GENERATOR
NC
NC
NC
STB
GND
GND
1
VCC
MRDC
MWTC
82C88
S1 BUS AMWC
S2 CTRLR IORC
IOWC
DEN
DT/R
AIOWC
ALE
INTA
S0
80C86
CPU
GND
CLK
AD0-AD15
A16-A19
C1
BHE
20
ADDR/DATA
OE
ADDR
82C82
(2 OR 3)
GND
C2
40
VCC
C1 = C2 = 0.1µF
T
OE
82C86
TRANSCEIVER
(2)
DATA
A0
BHE
EH
EL
W G
HM-65162
CMOS RAM
2k x 8
2k x 8
E
G
HM-6616
CMOS PROM (2)
2k x 8 2k x 8
CS
RDWR
CMOS
82CXX
PERIPHERALS
FIGURE 6B. MAXIMUM MODE 80C86 TYPICAL CONFIGURATION
16
FN2957.3
January 9, 2009
80C86
Absolute Maximum Ratings
Thermal Information
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +8.0V
Input, Output or I/O Voltage . . . . . . . . . . . . GND -0.5V to VCC +0.5V
Gate Count. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9750 Gates
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 1
Thermal Resistance (Typical)
θJA (oC/W)
θJC (oC/W)
PDIP Package* (Note 1) . . . . . . . . . . .
50
N/A
CERDIP Package (Notes 1, 2) . . . . . .
30
6
Storage Temperature Range . . . . . . . . . . . . . . . . -65°C to +150°C
Junction Temperature
Ceramic Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +175°C
Plastic Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +150°C
Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
*Pb-free PDIPs can be used for through hole wave solder processing
only. They are not intended for use in Reflow solder processing
applications.
Operating Conditions
Operating Supply Voltage . . . . . . . . . . . . . . . . . . . . . +4.5V to +5.5V
M80C86-2 ONLY . . . . . . . . . . . . . . . . . . . . . . . . +4.75V to +5.25V
Temperature Range
C80C86-2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to +70°C
M80C86-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-55°C to +125°C
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTE:
1. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech
Brief TB379.
2. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside.
DC Electrical Specifications
VCC = 5.0V, ±10%; TA = 0°C to +70°C (C80C86, C80C86-2)
VCC = 5.0V, ±10%; TA = -55°C to +125°C (M80C86)
VCC = 5.0V, ±5%; TA = -55°C to +125°C (M80C86-2). Parameters with MIN and/or MAX limits are 100%
tested at +25°C, unless otherwise specified. Temperature limits established by characterization and are
not production tested.
SYMBOL
VlH
VIL
PARAMETER
MIN
MAX
UNITS
Logical One
C80C86 (Note 6)
2.0
V
Input Voltage
M80C86 (Note 6)
2.2
V
Logical Zero Input Voltage
VIHC
CLK Logical One Input Voltage
VILC
CLK Logical Zero Input Voltage
VOH
Output High Voltage
VOL
TEST CONDITION
0.8
VCC - 0.8
V
V
0.8
V
lOH = -2.5mA
3.0
V
lOH = -100µA
VCC - 0.4
V
Output Low Voltage
lOL = +2.5mA
0.4
V
Input Leakage Current
VIN = GND or VCC DIP
Pins 17-19, 21-23, 33
-1.0
1.0
µA
lBHH
Input Current-Bus Hold High
VIN = - 3.0V (Note 3)
-40
-400
µA
lBHL
Input Current-Bus Hold Low
VIN = - 0.8V (Note 4)
40
400
µA
Output Leakage Current
VOUT = GND (Note 6)
-
-10.0
µA
ICCSB
Standby Power Supply Current
VCC = - 5.5V (Note 5)
-
500
µA
ICCOP
Operating Power Supply Current
FREQ = Max, VIN = VCC or GND,
Outputs Open (Note 7)
-
10
mA/MHz
II
IO
17
FN2957.3
January 9, 2009
80C86
Capacitance
SYMBOL
CIN
COUT
CI/O
TA = +25°C
PARAMETER
TYPICAL
UNITS
TEST CONDITIONS
Input Capacitance
25
pF
FREQ = 1MHz. All measurements are referenced to device GND
Output Capacitance
25
pF
FREQ = 1MHz. All measurements are referenced to device GND
I/O Capacitance
25
pF
FREQ = 1MHz. All measurements are referenced to device GND
NOTES:
3. lBHH should be measured after raising VIN to VCC and then lowering to 3.0V on the following pins 2-16, 26-32, 34-39.
4. IBHL should be measured after lowering VIN to GND and then raising to 0.8V on the following pins: 2-16, 34-39.
5. lCCSB tested during clock high time after halt instruction executed. VIN = VCC or GND, VCC = 5.5V, Outputs unloaded.
6. IO should be measured by putting the pin in a high impedance state and then driving VOUT to GND on the following pins: 26-29 and 32.
7. MN/MX is a strap option and should be held to VCC or GND.
AC Electrical Specifications
VCC = 5.0V ±10%; TA = 0°C to +70°C (C80C86, C80C86-2)
VCC = 5.0V ±100%; TA = -55°C to +125°C (M80C86)
VCC = 5.0V ±5%; TA = -55°C to +125°C (M80C86-2). Parameters with MIN and/or MAX limits are 100%
tested at +25°C, unless otherwise specified. Temperature limits established by characterization and are
not production tested.
SYMBOL
PARAMETER
TEST
CONDITIONS
80C86
MIN
80C86-2
MAX
MIN
MAX
UNITS
MINIMUM COMPLEXITY SYSTEM
Timing Requirements
(1)
TCLCL
Cycle Period
200
125
ns
(2)
TCLCH
CLK Low Time
118
68
ns
(3)
TCHCL
CLK High Time
69
44
ns
(4)
TCH1CH2
CLK Rise Time
From 1.0V to 3.5V
10
10
ns
(5)
TCL2C1
CLK FaIl Time
From 3.5V to 1.0V
10
10
ns
(6)
TDVCL
Data In Setup Time
30
20
ns
(7)
TCLDX1
Data In Hold Time
10
10
ns
(8)
TR1VCL
RDY Setup Time into 82C84A
(Notes 8, 9)
35
35
ns
(9)
TCLR1X
RDY Hold Time into 82C84A (Notes 8, 9)
0
0
ns
(10)
TRYHCH
READY Setup Time into 80C86
118
68
ns
(11)
TCHRYX
READY Hold Time into 80C86
30
20
ns
(12)
TRYLCL
READY Inactive to CLK (Note 10)
-8
-8
ns
(13)
THVCH
HOLD Setup Time
35
20
ns
(14)
TINVCH
lNTR, NMI, TEST Setup Time (Note 9)
30
15
ns
(15)
TILIH
Input Rise Time (Except CLK)
From 0.8V to 2.0V
15
15
ns
(16)
TIHIL
Input FaIl Time (Except CLK)
From 2.0V to 0.8V
15
15
ns
60
ns
Timing Responses
(17)
TCLAV
Address Valid Delay
CL = 100pF
10
(18)
TCLAX
Address Hold Time
CL = 100pF
10
(19)
TCLAZ
Address Float Delay
CL = 100pF
TCLAX
(20)
TCHSZ
Status Float Delay
CL = 100pF
(21)
TCHSV
Status Active Delay
CL = 100pF
10
(22)
TLHLL
ALE Width
CL = 100pF
TCLCH - 20
18
110
10
10
80
TCLAX
80
110
10
TCLCH - 10
ns
50
ns
50
ns
60
ns
ns
FN2957.3
January 9, 2009
80C86
AC Electrical Specifications
VCC = 5.0V ±10%; TA = 0°C to +70°C (C80C86, C80C86-2)
VCC = 5.0V ±100%; TA = -55°C to +125°C (M80C86)
VCC = 5.0V ±5%; TA = -55°C to +125°C (M80C86-2). Parameters with MIN and/or MAX limits are 100%
tested at +25°C, unless otherwise specified. Temperature limits established by characterization and are
not production tested. (Continued)
SYMBOL
PARAMETER
80C86
TEST
CONDITIONS
MIN
80C86-2
MAX
MIN
MAX
UNITS
(23)
TCLLH
ALE Active Delay
CL = 100pF
80
50
ns
(24)
TCHLL
ALE Inactive Delay
CL = 100pF
85
55
ns
(25)
TLLAX
Address Hold Time to ALE Inactive
CL = 100pF
TCHCL - 10
(26)
TCLDV
Data Valid Delay
CL = 100pF
10
(27)
TCLDX2
Data Hold Time
CL = 100pF
10
10
ns
(28)
TWHDX
Data Hold Time After WR
CL = 100pF
TCLCL - 30
TCLCL - 30
ns
(29)
TCVCTV
Control Active Delay 1
CL = 100pF
10
110
10
70
ns
(30)
TCHCTV
Control Active Delay 2
CL = 100pF
10
110
10
60
ns
(31)
TCVCTX
Control Inactive Delay
CL = 100pF
10
110
10
70
ns
(32)
TAZRL
Address Float to READ Active
CL = 100pF
0
(33)
TCLRL
RD Active Delay
CL = 100pF
10
165
10
100
ns
(34)
TCLRH
RD Inactive Delay
CL = 100pF
10
150
10
80
ns
(35)
TRHAV
RD Inactive to Next Address Active
CL = 100pF
TCLCL - 45
(36)
TCLHAV
HLDA Valid Delay
CL = 100pF
10
(37)
TRLRH
RD Width
CL = 100pF
2TCLCL - 75
2TCLCL - 50
ns
(38)
TWLWH
WR Width
CL = 100pF
2TCLCL - 60
2TCLCL - 40
ns
(39)
TAVAL
Address Valid to ALE Low
CL = 100pF
TCLCH - 60
TCLCH - 40
ns
(40)
TOLOH
Output Rise Time
From 0.8V to 2.0V
20
15
ns
(41)
TOHOL
Output Fall Time
From 2.0V to 0.8V
20
15
ns
TCHCL - 10
110
10
ns
60
0
ns
TCLCL - 40
160
10
ns
ns
100
ns
NOTES:
8. Signal at 82C84A shown for reference only.
9. Setup requirement for asynchronous signal only to guarantee recognition at next CLK.
10. Applies only to t2 state (8ns into t3).
19
FN2957.3
January 9, 2009
80C86
Waveforms
t1
t2
t3
t4
(5)
TCL2CL1
(1)
TCLCL
tW
TCH1CH2
(4)
CLK (82C84A OUTPUT)
(3)
(2)
TCLCH
TCHCL
(30) TCHCTV
TCHCTV
(30)
M/IO
(17)
TCLAV
(17)
TCLAV
(26) TCLDV
(18) TCLAX
S7-S3
BHE, A19-A16
BHE/S7, A19/S6-A16/S3
TLHLL
(22)
(23) TCLLH
TLLAX
(25)
ALE
(24)
TR1VCL (8)
TCHLL
RDY (82C84A INPUT)
SEE NOTE
TAVAL
(39)
VIH
VIL
TCLR1X (9)
(12)
TRYLCL
(11)
TCHRYX
READY (80C86 INPUT)
(19)
TCLAZ
AD15-AD0
(10)
TRYHCH
(16)
TDVCL
AD15-AD0
DATA IN
(32) TAZRL
(34) TCLRH
(7)
TCLDX1
TRHAV
(35)
RD
(30)
TCHCTV
READ CYCLE
(WR, INTA = VOH)
TCLRL
(33)
TRLRH
(37)
(30)
TCHCTV
DT/R
(29) TCVCTV
TCVCTX
(31)
DEN
NOTE:
FIGURE 7A. BUS TIMING - MINIMUM MODE SYSTEM
Signals at 82C84A are shown for reference only. RDY is sampled near the end of t2, t3, tW to determine if TW machine states are to be
inserted.
20
FN2957.3
January 9, 2009
80C86
Waveforms
(Continued)
t1
t2
t3
(4)
(5)
TCH1CH2
TCL2CL1
TW
CLK (82C84A OUTPUT)
(26)
TCLDV
TCLAX
(17)
TCLAV
TCVCTV
(27)
TCLDX2
(18)
AD15-AD0
AD15-AD0
WRITE CYCLE
t4
tW
DATA OUT
(28)
TWHDX
(29)
(31) TCVCTX
DEN
(RD, INTA,
DT/R = VOH)
(29) TCVCTV
(38)
TWLWH
WR
TCVCTX
TDVCL
(19)
TCLAZ
(31)
(6)
TCLDX1 (7)
POINTER
AD15-AD0
TCHCTV (30)
TCHCTV
(30)
DT/R
INTA CYCLE
(SEE NOTE)
(RD, WR = VOH
BHE = VOL)
(29) TCVCTV
INTA
(29) TCVCTV
TCVCTX
(31)
DEN
SOFTWARE
HALT DEN, RD,
WR, INTA = VOH
INVALID ADDRESS
AD15-AD0
SOFTWARE HALT
TCLAV
(17)
DT/R = INDETERMINATE
NOTE:
FIGURE 7B. BUS TIMING - MINIMUM MODE SYSTEM
Two INTA cycles run back-to-back. The 80C86 local ADDR/DATA bus is floating during both INTA cycles. Control signals are shown for the
second INTA cycle.
21
FN2957.3
January 9, 2009
80C86
AC Electrical Specifications
VCC = 5.0V ±10%TA = 0°C to +70°C (C80C86, C80C86-2)
VCC = 5.0V ±10%;TA = -55°C to +125°C (M80C86)
VCC = 5.0V ±5%;TA = -55°C to +125°C (M80C86-2). Parameters with MIN and/or MAX limits are 100%
tested at +25°C, unless otherwise specified. Temperature limits established by characterization and are
not production tested.
TIMING REQUIREMENTS
SYMBOL
PARAMETER
80C86
TEST CONDITIONS
MIN
80C86-2
MAX
MIN
MAX
UNITS
MAX MODE SYSTEM (USING 82C88 BUS CONTROLLER)
Timing Requirements
(1)
TCLCL
CLK Cycle Period
200
125
ns
(2)
TCLCH
CLK Low Time
118
68
ns
(3)
TCHCL
CLK High Time
69
44
ns
(4)
TCH1CH2
CLK Rise Time
From 1.0V to 3.5V
10
10
ns
(5)
TCL2CL1
CLK Fall Time
From 3.5V to 1.0V
10
10
ns
(6)
TDVCL
Data in Setup Time
30
20
ns
(7)
TCLDX1
Data In Hold Time
10
10
ns
(8)
TR1VCL
RDY Setup Time into 82C84A
(Notes 11, 12)
35
35
ns
(9)
TCLR1X
RDY Hold Time into 82C84A
(Notes 11, 12)
0
0
ns
(10)
TRYHCH
READY Setup Time into 80C86
118
68
ns
(11)
TCHRYX
READY Hold Time into 80C86
30
20
ns
(12)
TRYLCL
READY Inactive to CLK (Note 13)
-8
-8
ns
(13)
TlNVCH
Setup Time for Recognition (lNTR, NMl,
TEST) (Note 12)
30
15
ns
(14)
TGVCH
RQ/GT Setup Time
30
15
ns
(15)
TCHGX
RQ Hold Time into 80C86 (Note 14)
40
(16)
TILlH
Input Rise Time (Except CLK)
From 0.8V to 2.0V
(17)
TIHIL
Input Fall Time (Except CLK)
From 2.0V to 0.8V
TCHCL +
10
30
TCHCL +
10
ns
15
15
ns
15
15
ns
Timing Responses
(18)
TCLML
Command Active Delay (Note 11)
CL = 100pF for All
80C86 Outputs (In
Addition to 80C86 Self
Load)
5
35
5
35
ns
(19)
TCLMH
Command Inactive (Note 11)
CL = 100pF for All
80C86 Outputs (In
Addition to 80C86 Self
Load)
5
35
5
35
ns
(20)
TRYHSH
READY Active to Status Passive
(Notes 13, 15)
CL = 100pF for All
80C86 Outputs (In
Addition to 80C86 Self
Load)
65
ns
(21)
TCHSV
Status Active Delay
CL = 100pF for All
80C86 Outputs (In
Addition to 80C86 Self
Load)
60
ns
22
110
10
110
10
FN2957.3
January 9, 2009
80C86
AC Electrical Specifications
VCC = 5.0V ±10%TA = 0°C to +70°C (C80C86, C80C86-2)
VCC = 5.0V ±10%;TA = -55°C to +125°C (M80C86)
VCC = 5.0V ±5%;TA = -55°C to +125°C (M80C86-2). Parameters with MIN and/or MAX limits are 100%
tested at +25°C, unless otherwise specified. Temperature limits established by characterization and are
not production tested. (Continued)
TIMING REQUIREMENTS
SYMBOL
PARAMETER
80C86
80C86-2
TEST CONDITIONS
MIN
MAX
MIN
MAX
UNITS
(22)
TCLSH
Status Inactive Delay (Note 15)
CL = 100pF for All
80C86 Outputs (In
Addition to 80C86 Self
Load)
10
130
10
70
ns
(23)
TCLAV
Address Valid Delay
CL = 100pF for All
80C86 Outputs (In
Addition to 80C86 Self
Load)
10
110
10
60
ns
(24)
TCLAX
Address Hold Time
CL = 100pF for All
80C86 Outputs (In
Addition to 80C86 Self
Load)
10
(25)
TCLAZ
Address Float Delay
CL = 100pF for All
80C86 Outputs (In
Addition to 80C86 Self
Load)
TCLAX
(26)
TCHSZ
Status Float Delay
CL = 100pF for All
80C86 Outputs (In
Addition to 80C86 Self
Load)
(27)
TSVLH
Status Valid to ALE High (Note 11)
(28)
TSVMCH
(29)
10
50
ns
80
50
ns
CL = 100pF for All
80C86 Outputs (In
Addition to 80C86 Self
Load)
20
20
ns
Status Valid to MCE High (Note 11)
CL = 100pF for All
80C86 Outputs (In
Addition to 80C86 Self
Load)
30
30
ns
TCLLH
CLK low to ALE Valid (Note 11)
CL = 100pF for All
80C86 Outputs (In
Addition to 80C86 Self
Load)
20
20
ns
(30)
TCLMCH
CLK low to MCE High (Note 11)
CL = 100pF for All
80C86 Outputs (In
Addition to 80C86 Self
Load)
25
25
ns
(31)
TCHLL
ALE Inactive Delay (Note 11)
CL = 100pF for All
80C86 Outputs (In
Addition to 80C86 Self
Load)
18
ns
(32)
TCLMCL
MCE Inactive Delay (Note 11)
CL = 100pF for All
80C86 Outputs (In
Addition to 80C86 Self
Load)
15
ns
(33)
TCLDV
Data Valid Delay
CL = 100pF for All
80C86 Outputs (In
Addition to 80C86 Self
Load)
60
ns
23
4
80
18
TCLAX
ns
4
15
10
110
10
FN2957.3
January 9, 2009
80C86
AC Electrical Specifications
VCC = 5.0V ±10%TA = 0°C to +70°C (C80C86, C80C86-2)
VCC = 5.0V ±10%;TA = -55°C to +125°C (M80C86)
VCC = 5.0V ±5%;TA = -55°C to +125°C (M80C86-2). Parameters with MIN and/or MAX limits are 100%
tested at +25°C, unless otherwise specified. Temperature limits established by characterization and are
not production tested. (Continued)
TIMING REQUIREMENTS
SYMBOL
PARAMETER
80C86
TEST CONDITIONS
MIN
80C86-2
MAX
MIN
MAX
10
UNITS
(34)
TCLDX2
Data Hold Time
CL = 100pF for All
80C86 Outputs (In
Addition to 80C86 Self
Load)
10
ns
(35)
TCVNV
Control Active Delay (Note 11)
CL = 100pF for All
80C86 Outputs (In
Addition to 80C86 Self
Load)
5
45
5
45
ns
(36)
TCVNX
Control Inactive Delay (Note 11)
CL = 100pF
10
45
10
45
ns
(37)
TAZRL
Address Float to Read Active
CL = 100pF
0
(38)
TCLRL
RD Active Delay
CL = 100pF
10
165
10
100
ns
(39)
TCLRH
RD Inactive Delay
CL = 100pF
10
150
10
80
ns
(40)
TRHAV
RD Inactive to Next Address Active
CL = 100pF
TCLCL
- 45
(41)
TCHDTL
Direction Control Active Delay
(Note 11)
CL = 100pF
50
50
ns
(42)
TCHDTH
Direction Control Inactive Delay
(Note 11)
CL = 100pF
30
30
ns
(43)
TCLGL
GT Active Delay
CL = 100pF
10
85
0
50
ns
(44)
TCLGH
GT Inactive Delay
CL = 100pF
10
85
0
50
ns
(45)
TRLRH
RD Width
CL = 100pF
2TCLCL
- 75
(46)
TOLOH
Output Rise Time
From 0.8V to 2.0V
20
15
ns
(47)
TOHOL
Output Fall Time
From 2.0V to 0.8V
20
15
ns
0
ns
TCLCL
- 40
ns
2TCLCL
- 50
ns
NOTES:
11. Signal at 82C84A or 82C88 shown for reference only.
12. Setup requirement for asynchronous signal only to guarantee recognition at next CLK.
13. Applies only to t2 state (8ns into t3).
14. The 80C86 actively pulls the RQ/GT pin to a logic one on the following clock low time.
15. Status lines return to their inactive (logic one) state after CLK goes low and READY goes high.
24
FN2957.3
January 9, 2009
80C86
Waveforms
t1
t2
(4)
TCH1CH2
(1)
TCLCL
t3
t4
(5)
TCL2CL1
tW
CLK
(23)
TCLAV
TCLCH
(2)
TCHCL (3)
QS0, QS1
TCLSH
(21) TCHSV
S2, S1, S0 (EXCEPT HALT)
(22)
(33)
(SEE NOTE 17)
TCLDV
TCLAX
(23) TCLAV
TCLAV
(24)
BHE, A19-A16
BHE/S7, A19/S6-A16/S3
TSVLH
(27)
(23)
S7-S3
TCHLL (31)
TCLLH
(29)
ALE (82C88 OUTPUT)
NOTE
TR1VCL
(8)
RDY (82C84 INPUT)
TCLR1X
(9)
(12) TRYLCL
(11)
READY 80C86 INPUT)
(24)
TCLAX
TRYHSH
(20)
TCHRYX
(10)
TRYHCH
TCLAV
READ CYCLE
(25)
TCLAZ
(23)
(6)
TDVCL
AD15-AD0
AD15-AD0
(37) TAZRL
(7)
TCLDX1
DATA IN
(39) TCLRH
TRHAV
RD
(42)
TCHDTH
(41) TCHDTL
TCLRL
(38)
DT/R
TCLML
82C88
OUTPUTS
SEE NOTES
15, 16
(18)
(40)
TRLRH
(45)
TCLMH
(19)
TCVNX
(36)
MRDC OR IORC
(35) TCVNV
DEN
FIGURE 8A. BUS TIMING - MAXIMUM MODE (USING 82C88)
NOTES:
16. Signals at 82C84A or 82C88 are shown for reference only. RDY is sampled near the end of t2, t3, tW to determine if TW machine states are to
be inserted.
17. The issuance of the 82C88 command and control signals (MRDC, MWTC, AMWC, IORC, IOWC, AIOWC, INTA, and DEN) lags the active high
82C88 CEN.
18. Status inactive in state just prior to t4.
25
FN2957.3
January 9, 2009
80C86
Waveforms
(Continued)
t1
t2
t3
t4
tW
CLK
TCHSV (21)
S2, S1, S0 (EXCEPT HALT)
WRITE CYCLE
(SEE NOTE 20))
(23)
TCLAV
TCLDV
TCLAX
(33)
(24)
TCLSH
(22)
AD15-AD0
(34)
DATA
TCVNX (36)
TCVNV
(35)
DEN
82C88
OUTPUTS
SEE NOTES
18, 19
TCLDX2
TCLMH
(19)
(18) TCLML
AMWC OR AIOWC
TCLMH (19)
(18)TCLML
MWTC OR IOWC
INTA CYCLE
AD15-AD0
(SEE NOTES 21, 22)
RESERVED FOR
CASCADE ADDR
(25) TCLAZ
(6)
AD15-AD0
TDVCL
TCLDX1 (7)
POINTER
TCLMCL
(32)
(28) TSVMCH
(41)
TCHDTL
MCE/PDEN
(30) TCLMCH
DT/R
82C88 OUTPUTS
SEE NOTES 18, 19
(42)
TCHDTH
(18) TCLML
INTA
TCVNV
(35)
(19) TCLMH
DEN
SOFTWARE
HALT - RD, MRDC, IORC, MWTC, AMWC, IOWC, AIOWC, INTA, S0, S1 = VOH
TCVNX
(36)
INVALID ADDRESS
AD15-AD0
TCLAV
(23)
S2
TCHSV
(21)
TCLSH
(22)
FIGURE 8B. BUS TIMING - MAXIMUM MODE (USING 82C88)
NOTES:
19. Signals at 82C84A or 82C86 are shown for reference only.
20. The issuance of the 82C88 command and control signals (MRDC, MWTC, AMWC, IORC, IOWC, AIOWC, INTA and DEN) lags the active high
82C88 CEN.
21. Status inactive in state just prior to t4.
22. Cascade address is valid between first and second INTA cycles.
23. Two INTA cycles run back-to-back. The 80C86 local ADDR/DATA bus is floating during both INTA cycles. Control for pointer address is shown
for second INTA cycle.
26
FN2957.3
January 9, 2009
80C86
Waveforms
(Continued)
>0-CLK
ANY
CLK
CYCLE
CYCLES
CLK
TCLGH
(44)
TGVCH (14)
(1)
TCLCL
TCHGX (15)
RQ/GT
TCLGH (44)
PULSE 2
80C86 GT
PULSE 1
COPROCESSOR
RQ
PREVIOUS GRANT
AD15-AD0
TCLGL
(43)
TCLAZ (25)
80C86
COPROCESSOR
TCHSV (21)
(SEE NOTE)
TCHSZ (26)
RD, LOCK
BHE/S7, A19/S0-A16/S3
S2, S1, S0
NOTE:
PULSE 3
COPROCESSOR
RELEASE
The coprocessor may not drive the busses outside the region shown without risking contention.
FIGURE 9. REQUEST/GRANT SEQUENCE TIMING (MAXIMUM MODE ONLY)
≥ 1CLK
CYCLE
1 OR 2
CYCLES
CLK
THVCH (13)
THVCH (13)
HOLD
TCLHAV (36)
TCLHAV (36)
HLDA
TCLAZ (19)
AD15-AD0
80C86
BHE/S7, A19/S6-A16/S3
80C86
COPROCESSOR
TCHSZ (20)
TCHSV (21)
RD, WR, M/IO, DT/R, DEN
FIGURE 10. HOLD/HOLD ACKNOWLEDGE TIMING (MINIMUM MODE ONLY)
ANY CLK CYCLE
CLK
ANY CLK CYCLE
CLK
(13)
TINVCH (SEE NOTE)
NMI
INTR
SIGNAL
TCLAV
(23)
TCLAV
(23)
LOCK
TEST
NOTE:
Setup requirements for asynchronous signals only to
guarantee recognition at next CLK.
FIGURE 11. ASYNCHRONOUS SIGNAL RECOGNITION
27
FIGURE 12. BUS LOCK SIGNAL TIMING (MAXIMUM MODE
ONLY)
FN2957.3
January 9, 2009
80C86
Waveforms
(Continued)
≥ 50µs
VCC
CLK
(7) TCLDX1
(6) TDVCL
RESET
≥ 4 CLK CYCLES
FIGURE 13. RESET TIMING
AC Test Circuit
OUTPUT FROM
DEVICE UNDER TEST
TEST POINT
CL (SEE NOTE)
NOTE:
Includes stay and jig capacitance.
AC Testing Input, Output Waveform
INPUT
VIH + 20% VIH
OUTPUT
1.5V
1.5V
VOH
VOL
VIL - 50% VIL
NOTE:
AC Testing: All input signals (other than CLK) must switch between VILMAX -50% VIL and VIHMIN +20% VIH. CLK must switch between 0.4V
and VCC. - 0.4 Input rise and fall times are driven at 1ns/V.
28
FN2957.3
January 9, 2009
80C86
Burn-In Circuits
MD80C86 CERDIP
C
GND
1 GND
GND
RIO
VCC 40
RIO
2 AD14
AD15 39
3 AD13
AD16 38
4 AD12
AD17 37
5 AD11
AD18 36
6 AD10
AD19 35
7 AD9
BHE 34
8 AD8
MX 33
9 AD7
RD 32
10 AD6
RQ0 31
11 AD5
RQ1 30
12 AD4
LOCK 29
OPEN
13 AD3
S2 28
OPEN
14 AD2
S1 27
OPEN
15 AD1
S0 26
RO
OPEN
16 AD0
QS0 25
RO
GND
17 NMI
QS2 24
GND
18 INTR
TEST 23
19 CLK
READY 22
RI
20 GND
RESET 21
RI
GND
VCL
GND
GND
VCL
GND
GND
GND
VCL
VCL
VCL
F0
RIO
RIO
RIO
RIO
RIO
RIO
RIO
RIO
RIO
RIO
RC
GND
RO
RO
RO
RO
RO
VCC
VCL
VCC/2
VCC/2
VCC/2
VCC/2
VCC/2
GND
RO
RI
RO
RO
RO
RO
RO
VCC/2
VCL
VCL
VCC/2
VCC/2
VCC/2
VCC/2
VCC/2
VCC/2
GND
VCL
NODE A
FROM
PROGRAM
CARD
COMPONENTS:
NOTES:
24. VCC = 5.5V ±0.5V, GND = 0V.
25. Input voltage limits (except clock):
VIL (maximum) = 0.4V
VIH (minimum) = 2.6V, VIH (clock) = (VCC - 0.4V) minimum.
1. RI = 10kΩ ±5%, 1/4W
2. RO = 1.2kΩ ±5%, 1/4W
3. RIO = 2.7kΩ ±5%, 1/4W
26. VCC/2 is external supply set to 2.7V ±10%.
4. RC = 1kΩ ± ±5%, 1/4W
27. VCL is generated on program card (VCC - 0.65V).
5. C = 0.01µF (Minimum)
28. Pins 13 - 16 input sequenced instruction from internal hold devices.
29. F0 = 100kHz ±10%.
30. Node A = a 40µs pulse every 2.56ms.
29
FN2957.3
January 9, 2009
80C86
Metallization Topology
GLASSIVATION:
Type: Nitrox
Thickness: 10kÅ ±2kÅ
WORST CASE CURRENT DENSITY:
1.5 x 105 A/cm2
DIE DIMENSIONS:
249.2 x 290.9 x 19
METALLIZATION:
Type: Silicon - Aluminum
Thickness: 11kÅ ±2kÅ
Metallization Mask Layout
80C86
AD11
AD12
AD13 AD14 GND
VCC
AD15 A16/S3 A17/S4 A18/S5
A19/S6
AD10
AD9
BHE/S7
MN/MX
AD8
AD7
RD
AD6
RQ/GT0
AD5
RQ/GT1
AD4
AD3
LOCK
S2
AD2
AD1
S1
AD0
S0
NMI
30
INTR CLK
GND
RESET READY TEST QS1 QS0
FN2957.3
January 9, 2009
80C86
Instruction Set Summary
INSTRUCTION CODE
MNEMONIC AND DESCRIPTION
76543210
76543210
76543210
76543210
Register/Memory to/from Register
100010dw
mod reg r/m
Immediate to Register/Memory
1100011w
mod 0 0 0 r/m
data
data if w 1
1 0 1 1 w reg
data
data if w 1
Memory to Accumulator
1010000w
addr-low
addr-high
Accumulator to Memory
1010001w
addr-low
addr-high
Register/Memory to Segment Register ††
10001110
mod 0 reg r/m
Segment Register to Register/Memory
10001100
mod 0 reg r/m
11111111
mod 1 1 0 r/m
DATA TRANSFER
MOV = Move:
Immediate to Register
PUSH = Push:
Register/Memory
Register
0 1 0 1 0 reg
Segment Register
0 0 0 reg 1 1 0
POP = Pop:
Register/Memory
10001111
Register
mod 0 0 0 r/m
0 1 0 1 1 reg
Segment Register
0 0 0 reg 1 1 1
XCHG = Exchange:
Register/Memory with Register
1000011w
Register with Accumulator
mod reg r/m
1 0 0 1 0 reg
IN = Input from:
Fixed Port
1110010w
Variable Port
1110110w
port
OUT = Output to:
Fixed Port
1110011w
port
Variable Port
1110111w
XLAT = Translate Byte to AL
11010111
LEA = Load EA to Register2
10001101
mod reg r/m
LDS = Load Pointer to DS
11000101
mod reg r/m
LES = Load Pointer to ES
11000100
mod reg r/m
LAHF = Load AH with Flags
10011111
SAHF = Store AH into Flags
10011110
PUSHF = Push Flags
10011100
POPF = Pop Flags
10011101
ARITHMETIC
ADD = Add:
Register/Memory with Register to Either
000000dw
mod reg r/m
Immediate to Register/Memory
100000sw
mod 0 0 0 r/m
data
Immediate to Accumulator
0000010w
data
data if w = 1
31
data if s:w = 01
FN2957.3
January 9, 2009
80C86
Instruction Set Summary
(Continued)
INSTRUCTION CODE
MNEMONIC AND DESCRIPTION
76543210
76543210
76543210
76543210
Register/Memory with Register to Either
000100dw
mod reg r/m
Immediate to Register/Memory
100000sw
mod 0 1 0 r/m
data
data if s:w = 01
Immediate to Accumulator
0001010w
data
data if w = 1
1111111w
mod 0 0 0 r/m
ADC = Add with Carry:
INC = Increment:
Register/Memory
Register
0 1 0 0 0 reg
AAA = ASCll Adjust for Add
00110111
DAA = Decimal Adjust for Add
00100111
SUB = Subtract:
Register/Memory and Register to Either
001010dw
mod reg r/m
Immediate from Register/Memory
100000sw
mod 1 0 1 r/m
data
Immediate from Accumulator
0010110w
data
data if w = 1
Register/Memory and Register to Either
000110dw
mod reg r/m
Immediate from Register/Memory
100000sw
mod 0 1 1 r/m
data
Immediate from Accumulator
0001110w
data
data if w = 1
1111111w
mod 0 0 1 r/m
data if s:w = 01
SBB = Subtract with Borrow
data if s:w = 01
DEC = Decrement:
Register/Memory
Register
0 1 0 0 1 reg
NEG = Change Sign
1111011w
mod 0 1 1 r/m
Register/Memory and Register
001110dw
mod reg r/m
Immediate with Register/Memory
100000sw
mod 1 1 1 r/m
data
Immediate with Accumulator
0011110w
data
data if w = 1
AAS = ASCll Adjust for Subtract
00111111
DAS = Decimal Adjust for Subtract
00101111
MUL = Multiply (Unsigned)
1111011w
mod 1 0 0 r/m
IMUL = Integer Multiply (Signed)
1111011w
mod 1 0 1 r/m
AAM = ASCll Adjust for Multiply
11010100
00001010
DlV = Divide (Unsigned)
1111011w
mod 1 1 0 r/m
IDlV = Integer Divide (Signed)
1111011w
mod 1 1 1 r/m
AAD = ASClI Adjust for Divide
11010101
00001010
CBW = Convert Byte to Word
10011000
CWD = Convert Word to Double Word
10011001
CMP = Compare:
data if s:w = 01
LOGIC
NOT = Invert
1111011w
mod 0 1 0 r/m
SHL/SAL = Shift Logical/Arithmetic Left
110100vw
mod 1 0 0 r/m
SHR = Shift Logical Right
110100vw
mod 1 0 1 r/m
32
FN2957.3
January 9, 2009
80C86
Instruction Set Summary
(Continued)
INSTRUCTION CODE
MNEMONIC AND DESCRIPTION
76543210
76543210
SAR = Shift Arithmetic Right
110100vw
mod 1 1 1 r/m
76543210
76543210
ROL = Rotate Left
110100vw
mod 0 0 0 r/m
ROR = Rotate Right
110100vw
mod 0 0 1 r/m
RCL = Rotate Through Carry Flag Left
110100vw
mod 0 1 0 r/m
RCR = Rotate Through Carry Right
110100vw
mod 0 1 1 r/m
0010000dw
mod reg r/m
Immediate to Register/Memory
1000000w
mod 1 0 0 r/m
data
data if w = 1
Immediate to Accumulator
0010010w
data
data if w = 1
Register/Memory and Register
1000010w
mod reg r/m
Immediate Data and Register/Memory
1111011w
mod 0 0 0 r/m
data
Immediate Data and Accumulator
1010100w
data
data if w = 1
Register/Memory and Register to Either
000010dw
mod reg r/m
Immediate to Register/Memory
1000000w
mod 1 0 1 r/m
data
Immediate to Accumulator
0000110w
data
data if w = 1
Register/Memory and Register to Either
001100dw
mod reg r/m
Immediate to Register/Memory
1000000w
mod 1 1 0 r/m
data
Immediate to Accumulator
0011010w
data
data if w = 1
disp-high
AND = And:
Reg./Memory and Register to Either
TEST = And Function to Flags, No Result:
data if w = 1
OR = Or:
data if w = 1
XOR = Exclusive Or:
data if w = 1
STRING MANIPULATION
REP = Repeat
1111001z
MOVS = Move Byte/Word
1010010w
CMPS = Compare Byte/Word
1010011w
SCAS = Scan Byte/Word
1010111w
LODS = Load Byte/Word to AL/AX
1010110w
STOS = Stor Byte/Word from AL/A
1010101w
CONTROL TRANSFER
CALL = Call:
Direct Within Segment
11101000
disp-low
Indirect Within Segment
11111111
mod 0 1 0 r/m
Direct Intersegment
10011010
offset-low
offset-high
seg-low
seg-high
Indirect Intersegment
11111111
mod 0 1 1 r/m
Direct Within Segment
11101001
disp-low
Direct Within Segment-Short
11101011
disp
Indirect Within Segment
11111111
mod 1 0 0 r/m
JMP = Unconditional Jump:
33
disp-high
FN2957.3
January 9, 2009
80C86
Instruction Set Summary
(Continued)
INSTRUCTION CODE
MNEMONIC AND DESCRIPTION
Direct Intersegment
Indirect Intersegment
76543210
76543210
76543210
11101010
offset-low
offset-high
seg-low
seg-high
11111111
76543210
mod 1 0 1 r/m
RET = Return from CALL:
Within Segment
11000011
Within Seg Adding lmmed to SP
11000010
Intersegment
11001011
Intersegment Adding Immediate to SP
data-low
data-high
11001010
data-low
data-high
JE/JZ = Jump on Equal/Zero
01110100
disp
JL/JNGE = Jump on Less/Not Greater or Equal
01111100
disp
JLE/JNG = Jump on Less or Equal/ Not Greater
01111110
disp
JB/JNAE = Jump on Below/Not Above or Equal
01110010
disp
JBE/JNA = Jump on Below or Equal/Not Above
01110110
disp
JP/JPE = Jump on Parity/Parity Even
01111010
disp
JO = Jump on Overflow
01110000
disp
JS = Jump on Sign
01111000
disp
JNE/JNZ = Jump on Not Equal/Not Zero
01110101
disp
JNL/JGE = Jump on Not Less/Greater or Equal
01111101
disp
JNLE/JG = Jump on Not Less or Equal/Greater
01111111
disp
JNB/JAE = Jump on Not Below/Above or Equal
01110011
disp
JNBE/JA = Jump on Not Below or Equal/Above
01110111
disp
JNP/JPO = Jump on Not Par/Par Odd
01111011
disp
JNO = Jump on Not Overflow
01110001
disp
JNS = Jump on Not Sign
01111001
disp
LOOP = Loop CX Times
11100010
disp
LOOPZ/LOOPE = Loop While Zero/Equal
11100001
disp
LOOPNZ/LOOPNE = Loop While Not Zero/Equal
11100000
disp
JCXZ = Jump on CX Zero
11100011
disp
Type Specified
11001101
type
Type 3
11001100
INTO = Interrupt on Overflow
11001110
IRET = Interrupt Return
11001111
INT = Interrupt
PROCESSOR CONTROL
CLC = Clear Carry
11111000
CMC = Complement Carry
11110101
STC = Set Carry
11111001
CLD = Clear Direction
11111100
34
FN2957.3
January 9, 2009
80C86
Instruction Set Summary
(Continued)
INSTRUCTION CODE
MNEMONIC AND DESCRIPTION
76543210
STD = Set Direction
11111101
CLl = Clear Interrupt
11111010
ST = Set Interrupt
11111011
HLT = Halt
11110100
WAIT = Wait
10011011
ESC = Escape (to External Device)
11011xxx
LOCK = Bus Lock Prefix
11110000
NOTES:
AL = 8-bit accumulator
AX = 16-bit accumulator
CX = Count register
DS= Data segment
ES = Extra segment
Above/below refers to unsigned value.
Greater = more positive;
Less = less positive (more negative) signed values
if d = 1 then “to” reg; if d = 0 then “from” reg
if w = 1 then word instruction; if w = 0 then byte
instruction
if mod = 11 then r/m is treated as a REG field
if mod = 00 then DISP = O†, disp-low and disp-high
are absent
if mod = 01 then DISP = disp-low sign-extended
16-bits, disp-high is absent
if mod = 10 then DISP = disp-high:disp-low
if r/m = 000 then EA = (BX) + (SI) + DISP
if r/m = 001 then EA = (BX) + (DI) + DISP
if r/m = 010 then EA = (BP) + (SI) + DISP
if r/m = 011 then EA = (BP) + (DI) + DISP
if r/m = 100 then EA = (SI) + DISP
if r/m = 101 then EA = (DI) + DISP
if r/m = 110 then EA = (BP) + DISP †
if r/m = 111 then EA = (BX) + DISP
DISP follows 2nd byte of instruction (before data
if required)
† except if mod = 00 and r/m = 110 then
EA = disp-high: disp-low.
†† MOV CS, REG/MEMORY not allowed.
76543210
76543210
76543210
mod x x x r/m
if s:w = 01 then 16-bits of immediate data form the operand.
if s:w. = 11 then an immediate data byte is sign extended
to form the 16-bit operand.
if v = 0 then “count” = 1; if v = 1 then “count” in (CL)
x = don't care
z is used for string primitives for comparison with ZF FLAG.
SEGMENT OVERRIDE PREFIX
001 reg 11 0
REG is assigned according to the following table:
16-BIT (w = 1)
8-BIT (w = 0)
SEGMENT
000 AX
000 AL
00 ES
001 CX
001 CL
01 CS
010 DX
010 DL
10 SS
011 BX
011 BL
11 DS
100 SP
100 AH
00 ES
101 BP
101 CH
00 ES
110 SI
110 DH
00 ES
111 DI
111 BH
00 ES
Instructions which reference the flag register file as a 16-bit object
use the symbol FLAGS to represent the file:
FLAGS =
X:X:X:X:(OF):(DF):(IF):(TF):(SF):(ZF):X:(AF):X:(PF):X:(CF)
Mnemonics © Intel, 1978
35
FN2957.3
January 9, 2009
80C86
Dual-In-Line Plastic Packages (PDIP)
E40.6 (JEDEC MS-011-AC ISSUE B)
N
40 LEAD DUAL-IN-LINE PLASTIC PACKAGE
E1
INDEX
AREA
1 2 3
INCHES
N/2
SYMBOL
-B-
-C-
SEATING
PLANE
A2
e
B1
D1
A1
eC
B
0.010 (0.25) M
C A B S
MAX
NOTES
-
0.250
-
6.35
4
0.015
-
0.39
-
4
A2
0.125
0.195
3.18
4.95
-
B
0.014
0.022
0.356
0.558
-
C
L
B1
0.030
0.070
0.77
1.77
8
eA
C
0.008
0.015
0.204
0.381
-
D
1.980
2.095
D1
0.005
-
A
L
D1
MIN
A
E
BASE
PLANE
MAX
A1
-AD
MILLIMETERS
MIN
C
eB
NOTES:
1. Controlling Dimensions: INCH. In case of conflict between English
and Metric dimensions, the inch dimensions control.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Symbols are defined in the “MO Series Symbol List” in Section 2.2
of Publication No. 95.
4. Dimensions A, A1 and L are measured with the package seated in
JEDEC seating plane gauge GS-3.
5. D, D1, and E1 dimensions do not include mold flash or protrusions.
Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).
6. E and eA are measured with the leads constrained to be perpendicular to datum -C- .
50.3
53.2
5
-
5
0.13
E
0.600
0.625
15.24
15.87
6
E1
0.485
0.580
12.32
14.73
5
e
0.100 BSC
2.54 BSC
-
eA
0.600 BSC
15.24 BSC
6
eB
-
0.700
-
17.78
7
L
0.115
0.200
2.93
5.08
4
N
40
40
9
Rev. 0 12/93
7. eB and eC are measured at the lead tips with the leads unconstrained. eC must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions. Dambar protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,
E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
36
FN2957.3
January 9, 2009
80C86
Ceramic Dual-In-Line Frit Seal Packages (CERDIP)
BASE
METAL
E
M
-Bbbb S
C A-B S
(c)
Q
-C-
SEATING
PLANE
S1
b2
C A-B S
eA/2
NOTES
-
0.225
-
5.72
-
0.026
0.36
0.66
2
b1
0.014
0.023
0.36
0.58
3
b2
0.045
0.065
1.14
1.65
-
b3
0.023
0.045
0.58
1.14
4
c
0.008
0.018
0.20
0.46
2
c1
0.008
0.015
0.20
0.38
3
D
-
2.096
-
53.24
5
E
0.510
0.620
15.75
5
c
aaa M C A - B S D S
D S
MAX
0.014
eA
e
b
MIN
b
α
A A
MILLIMETERS
MAX
A
A
L
MIN
M
(b)
SECTION A-A
D S
INCHES
SYMBOL
b1
D
BASE
PLANE
ccc M
F40.6 MIL-STD-1835 GDIP1-T40 (D-5, CONFIGURATION A)
40 LEAD CERAMIC DUAL-IN-LINE FRIT SEAL PACKAGE
LEAD FINISH
c1
-D-
-A-
NOTES:
1. Index area: A notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the shaded
area shown. The manufacturer’s identification shall not be used
as a pin one identification mark.
e
12.95
0.100 BSC
2.54 BSC
-
eA
0.600 BSC
15.24 BSC
-
eA/2
0.300 BSC
7.62 BSC
-
L
0.125
0.200
3.18
5.08
-
Q
0.015
0.070
0.38
1.78
6
S1
0.005
-
0.13
-
7
105o
90o
105o
-
2. The maximum limits of lead dimensions b and c or M shall be
measured at the centroid of the finished lead surfaces, when
solder dip or tin plate lead finish is applied.
α
90o
aaa
-
0.015
-
0.38
-
3. Dimensions b1 and c1 apply to lead base metal only. Dimension
M applies to lead plating and finish thickness.
bbb
-
0.030
-
0.76
-
ccc
-
0.010
-
0.25
-
M
-
0.0015
-
0.038
2, 3
4. Corner leads (1, N, N/2, and N/2+1) may be configured with a
partial lead paddle. For this configuration dimension b3 replaces
dimension b2.
N
40
40
5. This dimension allows for off-center lid, meniscus, and glass
overrun.
8
Rev. 0 4/94
6. Dimension Q shall be measured from the seating plane to the
base plane.
7. Measure dimension S1 at all four corners.
8. N is the maximum number of terminal positions.
9. Dimensioning and tolerancing per ANSI Y14.5M - 1982.
10. Controlling dimension: INCH.
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
37
FN2957.3
January 9, 2009