MF436 1300 nm - 50 MHz High Performance LED Data Sheet October 2004 Ordering Information MF436 MF436 ST MF436 FC TO-46 Package ST Housing FC Housing -40°C to +85°C Note: Rated Fiber coupled power apply only on the TO-46 package, for housing options fiber coupled power is typically 10% less. Features Description • 1310 nm Surface-Emitting LED • 50 MHz Bandwidth • Designed for 62.5/125 µm fiber • High power This device generates very high power which makes it ideal for many sensors and signal transmission applications. It operates in a wide range of temperatures, and can satisfy virtually any environmental specification. The double-lens optical system results in optimum coupling of power into the fiber. Applications • Sensors • Test Equipment • Signal transmission CASE CATHODE ANODE ANODE CATHODE Bottom View Figure 1 - Pin Diagram Figure 2 - Functional Schematic 1 Zarlink Semiconductor Inc. Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc. Copyright 2003-2004, Zarlink Semiconductor Inc. All Rights Reserved. MF436 Data Sheet Optical and Electrical Characteristics - Case Temperature 25°C Parameter Symbol Min. Typ. Pfiber 20 27 µW IF=80mA, Note 1 Fiber: 50/125µm NA=0.20 70 80 µW IF=80mA, Note 1 Fiber: 62.5/125µm NA=0.275 ns IF=80mA (no bias) Fiber-Coupled Power (Figures 3, 4 and 5) (Table 1) Rise and Fall Time (10-90%) tr,tf 7 Bandwidth (3 dBel) fc 50 Peak Wavelength λp Spectral Width (FWHM) Unit 10 Test Condition MHz IF=80mA 1300 1350 nm IF=80mA ∆λ 145 165 nm IF=80mA Forward Voltage (Figure 5) VF 1.5 2 V IF=80mA Reverse Current IR 100 µA VR=1V Capacitance C pF VR-0V, f=1MHz Note 1: 1270 Max. 200 Measured at the exit of 100 meters of fiber. Absolute Maximum Ratings Parameter Symbol Limit Storage Temperature Tstg -55 to +125°C Operating Temperature Top -40 to +85°C Electrical Power Dissipation (Figure 4) Ptot 160 mW IF 90 mA IFRM 130 mA Reverse Voltage VR 0.5 V Soldering Temperature (2mm from the case for 10 sec.) Tsld 260°C Continuous Forward Current (f<10 kHz) Peak Forward Current (duty cycle<50%,f>1 MHz Thermal Characteristics Parameter Symbol Min. Typ. Max. Unit Thermal Resistance - Infinite Heat Sink Rthjc 150 °C/W Thermal Resistance - No Heat Sink Rthja 450 ° C/W Temperature Coefficient - Optical Power dP/dTj -0.6 %/°C Temperature Coefficient - Wavelength dλ/dTj 0.45 nm/°C d∆λ/dTj 0.25 nm/°C Temperature Coefficient - Spectral Width 2 Zarlink Semiconductor Inc. MF436 Data Sheet Typical Fiber-Coupled Power Core Diameter/Cladding Diameter Numerical Aperture 50/125 µm 0.20 62.5/125 µm 0.275 100/140 µm 0.29 27 µW 80 µW 140 µW r Relative Fiber-coupled Power (%) 100 z 80 r - optimal ØC = 62.5 µm 60 40 20 0 0.5 0.75 1 1.25 1.5 1.75 2 2.25 2.5 z - axial Displacement of Fiber (mm) Figure 3 - z - Axial Displacement of Fiber 3 Zarlink Semiconductor Inc. 2.75 3 MF436 Data Sheet 100 r 90 z Relative Fiber-coupled Power (%) 80 z - optimal ØC = 62.5 µm 70 60 50 40 30 20 10 0 0 10 20 30 40 50 60 70 80 90 100 r - Radial Displacem ent of Fiber (µ m ) Figure 4 - r - Radial Displacement of Fiber Relative Fiber-coupled Power (%) 100 80 50% Duty Cycle 60 40 DC 20 Heat Sinked 0 0 20 40 60 80 100 120 140 160 180 Forw ard Current (m A) Figure 5 - Relative Fiber-coupled Power vs. Forward Current 4 Zarlink Semiconductor Inc. 200 MF436 Data Sheet Max. Electrical Power Dissipation (mW) 300 250 200 150 Infinite Heat Sink No Heat Sink 100 50 0 0 15 30 45 60 75 90 Operating Tem perature ( oC) 105 120 135 150 Figure 6 - Max. Electrical Power Dissipation vs. Operating Temperature 200 Forward Current (mA) 175 150 125 100 75 50 25 0 0 0.25 0.5 0.75 1 1.25 1.5 1.75 2 2.25 2.5 Forw ard Voltage (V) Figure 7 - Forward Current vs. Forward Voltage 5 Zarlink Semiconductor Inc. 2.75 3 BOTTOM VIEW ( 10 : 1 ) SIDE VIEW 13,46`0,76 3,8 2,54 0,6 0,03 (3x) n0,45 + - 0,05 (3x) n1,17 + - 0,04 n4,7 0 R2,7 45° R0,2 max (4x) 0,3 max glass overmould (2x) R0,4 max 2` 0, 3 3, 6 1, 0 Lens n1.5`0.05 NOTES:1. All dimensions in mm. 2. General tol. ISO-2768-mK. 3. Coating: Case: Ni 1,5-2,5 µm. Header: Ni 2-3 µm / Au min 1,32 µm. Package code © Zarlink Semiconductor 2002. All rights reserved. ISSUE 1 ACN JS004 076R1 A DATE 22-MAR-03 APPRD. TD/BE Previous package codes TB Drawing type Package drawing, TO-46 with lens Title JS004076 For more information about all Zarlink products visit our Web Site at www.zarlink.com Information relating to products and services furnished herein by Zarlink Semiconductor Inc. or its subsidiaries (collectively “Zarlink”) is believed to be reliable. However, Zarlink assumes no liability for errors that may appear in this publication, or for liability otherwise arising from the application or use of any such information, product or service or for any infringement of patents or other intellectual property rights owned by third parties which may result from such application or use. Neither the supply of such information or purchase of product or service conveys any license, either express or implied, under patents or other intellectual property rights owned by Zarlink or licensed from third parties by Zarlink, whatsoever. Purchasers of products are also hereby notified that the use of product in certain ways or in combination with Zarlink, or non-Zarlink furnished goods or services may infringe patents or other intellectual property rights owned by Zarlink. This publication is issued to provide information only and (unless agreed by Zarlink in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. The products, their specifications, services and other information appearing in this publication are subject to change by Zarlink without notice. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user’s responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. Manufacturing does not necessarily include testing of all functions or parameters. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to Zarlink’s conditions of sale which are available on request. Purchase of Zarlink’s I2C components conveys a licence under the Philips I2C Patent rights to use these components in and I2C System, provided that the system conforms to the I2C Standard Specification as defined by Philips. Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc. Copyright Zarlink Semiconductor Inc. All Rights Reserved. TECHNICAL DOCUMENTATION - NOT FOR RESALE