Preliminary Spec. MITSUBISHI LSIs Some contents are subject to change without notice. MH4S64DBKG -7,-7L,-8,-8L 268435456-BIT (4194304 - WORD BY 64-BIT)SynchronousDRAM DESCRIPTION The MH4S64DBKG is 8388608 - word by 64-bit Synchronous DRAM module. This consists of four industry standard 4Mx16 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high densities and large quantities of memory are required. This is a socket type - memory modules, suitable for easy interchange or addition of modules. Utilizes industry s t andard 4M x 16 Sy nchronous DRAMs TSOP and industry s t andard EEPROM in TSSOP 144-pin (72-pin dual in-line package) single 3.3V±0.3V power supply Clock frequency 100MHz(max.) Fully synchronous operation referenced to clock rising edge 4 bank operation controlled by BA0,1(Bank Address) /CAS latency- 2/3(programmable) FEATURES Burst length- 1/2/4/8/Full Page(programmable) Frequency CLK Access Time Burst type- sequential / interleave(programmable) (Component SDRAM) -7,-7L 100MHz 6.0ns(CL=3) Column access - random -8,-8L 100MHz 6.0ns(CL=3) Auto precharge / All bank precharge controlled by A10 Auto refresh and Self refresh 4096 refresh cycle /64ms PC100 compliant LVTTL Interface APPLICATION main memory or graphic memory in computer systems PCB Outline (Front) (Back) MIT-DS-0338-0.0 1 2 143 144 MITSUBISHI ELECTRIC ( 1 / 55 ) 17.Sep.1999 Preliminary Spec. MITSUBISHI LSIs Some contents are subject to change without notice. MH4S64DBKG -7,-7L,-8,-8L 268435456-BIT (4194304 - WORD BY 64-BIT)SynchronousDRAM PIN CONFIGURATION PIN Number Front side Pin Name PIN Number Back side Pin Name PIN Number Front side Pin Name PIN Number Back side Pin Name 1 Vss 2 Vss 73 NC 74 CLK1 3 5 DQ0 DQ1 4 6 DQ32 DQ33 75 Vss 76 Vss 77 NC 78 NC NC 7 9 DQ2 DQ3 8 10 DQ34 DQ35 79 80 NC 81 Vcc 82 Vcc 11 13 Vcc DQ4 12 14 Vcc DQ36 83 DQ16 84 DQ48 85 DQ17 86 DQ49 15 DQ5 16 DQ37 87 DQ18 88 DQ50 17 DQ6 18 DQ38 89 DQ19 90 DQ51 19 21 DQ7 Vss 20 DQ39 91 Vss 92 Vss 22 Vss 93 DQ20 94 DQ52 23 DQMB0 25 DQMB1 24 DQMB4 95 DQ21 96 DQ53 26 DQMB5 97 DQ22 98 DQ54 Vcc 99 DQ23 100 DQ55 Vcc 27 Vcc 29 A0 30 A3 101 102 Vcc 31 A1 32 A4 103 A6 104 A7 33 A2 34 A5 105 A8 106 BA0 35 Vss 36 Vss 107 Vss 108 Vss 37 DQ8 38 DQ40 109 A9 110 BA1 39 DQ9 40 DQ41 111 A10 112 A11 41 DQ10 42 DQ42 113 Vcc 114 43 DQ11 44 DQ43 115 DQMB2 116 DQMB6 45 Vcc 46 Vcc 117 DQMB3 118 DQMB7 47 DQ12 48 DQ44 119 Vss 120 Vss 49 DQ13 50 DQ45 121 DQ24 122 DQ56 51 DQ14 52 DQ46 123 DQ25 124 DQ57 53 DQ15 54 DQ47 125 DQ26 126 DQ58 55 Vss 56 Vss 127 DQ27 128 DQ59 57 NC 58 NC 129 Vcc 130 Vcc 59 NC 60 NC 131 DQ28 132 DQ60 61 CLK0 62 CKE0 133 DQ29 134 DQ61 63 Vcc 64 Vcc 135 DQ30 136 DQ62 65 /RAS 66 /CAS 137 DQ31 138 DQ63 67 /WE 68 CKE1 139 Vss 140 Vss 69 /S0 70 NC 141 SDA 142 SCL 71 /S1 72 NC 143 Vcc 144 Vcc 28 Vcc NC = No Connection MIT-DS-0338-0.0 MITSUBISHI ELECTRIC ( 2 / 55 ) 17.Sep.1999 Preliminary Spec. MITSUBISHI LSIs Some contents are subject to change without notice. MH4S64DBKG -7,-7L,-8,-8L 268435456-BIT (4194304 - WORD BY 64-BIT)SynchronousDRAM Block Diagram /S0 DQMB0 DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 DQMB4 DQML /CS DQMB1 DQML /CS DQMB3 DQMU 10Ω I/O 0 I/O 1 D3 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 DQMB7 DQMU DQ56 DQ57 DQ58 DQ59 DQ60 DQ61 DQ62 DQ63 I/O 8 I/O 9 I/O 10 I/O 11 I/O 12 I/O 13 I/O 14 I/O 15 D0 - D3 BA0,BA1,A<11:0> D0 - D3 I/O 8 I/O 9 I/O 10 I/O 11 I/O 12 I/O 13 I/O 14 I/O 15 CLK1 D0 - D3 D0 - D3 D0 - D3 D0 - D3 SERIAL PD SCL Vcc MIT-DS-0338-0.0 DQML /CS DQ48 DQ49 DQ50 DQ51 DQ52 DQ53 DQ54 DQ55 CLK0 CKE0 /RAS /CAS /WE Vss I/O 8 I/O 9 I/O 10 I/O 11 I/O 12 I/O 13 I/O 14 I/O 15 DQMB6 I/O 0 I/O 1 D1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 DQ24 DQ25 DQ26 DQ27 DQ28 DQ29 DQ30 DQ31 DQMU DQ40 DQ41 DQ42 DQ43 DQ44 DQ45 DQ46 DQ47 I/O 8 I/O 9 I/O 10 I/O 11 I/O 12 I/O 13 I/O 14 I/O 15 DQMB2 DQ16 DQ17 DQ18 DQ19 DQ20 DQ21 DQ22 DQ23 I/O 0 I/O 1 D2 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 DQMB5 DQMU DQ8 DQ9 DQ10 DQ11 DQ12 DQ13 DQ14 DQ15 DQML /CS DQ32 DQ33 DQ34 DQ35 DQ36 DQ37 DQ38 DQ39 I/O 0 I/O 1 D0 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 A0 A1 A2 SDA D0 - D3 MITSUBISHI ELECTRIC ( 3 / 55 ) 17.Sep.1999 Preliminary Spec. MITSUBISHI LSIs Some contents are subject to change without notice. MH4S64DBKG -7,-7L,-8,-8L 268435456-BIT (4194304 - WORD BY 64-BIT)SynchronousDRAM Serial Presence Detect Table I Byte Function described SPD enrty data SPD DATA(hex) 0 Defines # bytes written into serial memory at module mfgr 128 80 08 2 Total # bytes of SPD memory device Fundamental memory type 256 Bytes SDRAM 04 3 # Row Addresses on this assembly A0-A11 0C 4 # Column Addresses on this assembly A0-A7 08 5 # Module Banks on this assembly 1BANK 01 6 Data Width of this assembly... x64 40 7 ... Data Width continuation 0 00 8 Voltage interface standard of this assembly LVTTL 01 10ns A0 6ns 60 1 9 SDRAM Cycletime at Max. Supported CAS Latency (CL). Cycle time for CL=3 10 SDRAM Access from Clock tAC for CL=3 11 DIMM Configuration type (Non-parity,Parity,ECC) Non-PARITY 00 12 Refresh Rate/Type self refresh(15.625uS) 80 13 SDRAM width,Primary DRAM x16 10 14 Error Checking SDRAM data width N/A 00 15 Minimum Clock Delay,Back to Back Random Column Addresses 1 01 16 Burst Lengths Supported 17 # Banks on Each SDRAM device 4bank 04 18 CAS# Latency 2/3 06 19 CS# Latency 0 01 1/2/4/8/Full page 8F 20 Write Latency 0 01 21 SDRAM Module Attributes non-buffered,non-registered 00 22 SDRAM Device Attributes:General 23 24 Precharge All,Auto precharge 0E SDRAM Cycle time(2nd highest CAS latency) Cycle time for CL=2 -7,7L 10ns -8,8L 13ns A0 D0 SDRAM Access form Clock(2nd highest CAS latency) -7,7L 6ns 60 tAC for CL=2 -8,8L 7ns 70 25 SDRAM Cycle time(3rd highest CAS latency) N/A 00 26 27 SDRAM Access form Clock(3rd highest CAS latency) N/A 00 Precharge to Active Minimum 20ns 14 28 Row Active to Row Active Min. 29 RAS to CAS Delay Min 20ns 20ns 14 30 Active to Precharge Min 50ns 32 MIT-DS-0338-0.0 MITSUBISHI ELECTRIC ( 4 / 55 ) 14 17.Sep.1999 Preliminary Spec. MITSUBISHI LSIs Some contents are subject to change without notice. MH4S64DBKG -7,-7L,-8,-8L 268435456-BIT (4194304 - WORD BY 64-BIT)SynchronousDRAM Serial Presence Detect Table II 31 32MByte 08 32 Command and Address signal input setup time 2ns 20 33 Command and Address signal input hold time 1ns 10 34 35 Data signal input setup time Data signal input hold time 2ns 20 36-61 Density of each bank on module Superset Information (may be used in future) 62 SPD Revision 63 Checksum for bytes 0-62 1ns 10 option 00 rev 1.2A 12 Check sum for -7,7L 04 Check sum for -8,-8L 44 64-71 Manufactures Jedec ID code per JEP-108E MITSUBISHI 1CFFFFFFFFFFFFFF 72 Manufacturing location Miyoshi,Japan 01 Tajima,Japan 02 NC,USA 03 Germany 73-90 Manufactures Part Number 91-92 93-94 95-98 MH4S64DBKG-7 MH8S64DBKG-7L MH8S64DBKG-8 4D483453363444424B472D38202020202020 MH8S64DBKG-8L 4D483453363444424B472D384C2020202020 PCB revision Manufacturing date year/week code yyww serial number ssssssss option 00 100MHz 64 Assembly Serial Number Manufacture Specific Data 126 Intetl specification frequency -7,7L-8,8L 127 Intel specification CAS# Latency support -7,7L Unused storage locations rrrr 8F -8,8L MIT-DS-0338-0.0 4D483453363444424B472D37202020202020 Revision Code 99-125 128+ 04 4D483453363444424B472D374C2020202020 8D open MITSUBISHI ELECTRIC ( 5 / 55 ) 00 17.Sep.1999 Preliminary Spec. MITSUBISHI LSIs Some contents are subject to change without notice. MH4S64DBKG -7,-7L,-8,-8L 268435456-BIT (4194304 - WORD BY 64-BIT)SynchronousDRAM PIN FUNCTION Input Master Clock:All other inputs are referenced to the rising edge of CK CKE0 Input Clock Enable:CKE controls internal clock.When CKE is low,internal clock for the following cycle is ceased. CKE is also used to select auto / self refresh. After self refresh mode is started, CKE E becomes asynchronous input.Self refresh is maintained as long as CKE is low. /S0 Input Chip Select: When /S is high,any command means No Operation. Input Combination of /RAS,/CAS,/WE defines basic commands. Input A0-11 specify the Row/Column Address in conjunction with BA0,1.The Row Address is specified by A0-11.The Column Address is specified by A0-7.A10 is also used to indicate precharge option.When A10 is high at a read / write command, an auto precharge is performed. When A10 is high at a precharge command, both banks are precharged. Input Bank Address:BA0,1 is not simply BA.BA specifies the bank to which a command is applied.BA0,1 must be set with ACT,PRE,READ,WRITE commands CLK0 /RAS,/CAS,/WE A0-11 BA0,1 DQ0-63 DQMB0-7 Vdd,Vss Input/Output Data In and Data out are referenced to the rising edge of CK Input Din Mask/Output Disable:When DQMB is high in burst write.Din for the current cycle is masked.When DQMB is high in burst read,Dout is disabled at the next but one cycle. Power Supply Power Supply for the memory mounted module. SCL Input Serial clock for serial PD SDA Output Serial data for serial PD MIT-DS-0338-0.0 MITSUBISHI ELECTRIC ( 6 / 55 ) 17.Sep.1999 Preliminary Spec. MITSUBISHI LSIs Some contents are subject to change without notice. MH4S64DBKG -7,-7L,-8,-8L 268435456-BIT (4194304 - WORD BY 64-BIT)SynchronousDRAM BASIC FUNCTIONS The MH4S64DBKG provides basic functions,bank(row)activate,burst read / write, bank(row)precharge,and auto / self refresh. Each command is defined by control signals of /RAS,/CAS and /WE at CK rising edge. In addition to 3 signals,/S,CKE and A10 are used as chip select,refresh option,and precharge option,respectively. To know the detailed definition of commands please see the command truth table. CK /S Chip Select : L=select, H=deselect /RAS Command /CAS Command /WE Command CKE Ref resh Option @ref resh command Precharge Option @precharge or read/write command A10 def ine basic commands Activate(ACT) [/RAS =L, /CAS = /WE =H] ACT command activates a row in an idle bank indicated by BA. Read(READ) [/RAS =H,/CAS =L, /WE =H] READ command starts burst read from the active bank indicated by BA.First output data appears after /CAS latency. When A10 =H at this command,the bank is deactivated after the burst read(auto-precharge,READA). Write(WRITE) [/RAS =H, /CAS = /WE =L] WRITE command starts burst write to the active bank indicated by BA. Total data length to be written is set by burst length. When A10 =H at this command, the bank is deactivated after the burst write(auto-precharge,WRITEA). Precharge(PRE) [/RAS =L, /CAS =H,/WE =L] PRE command deactivates the active bank indicated by BA. This command also terminates burst read / write operation. When A10 =H at this command, both banks are deactivated(precharge all, PREA). Auto-Refresh(REFA) [/RAS =/CAS =L, /WE =CKE =H] PEFA command starts auto-refresh cycle. Refresh address including bank address are generated internally. After this command, the banks are precharged automatically. MIT-DS-0338-0.0 MITSUBISHI ELECTRIC ( 7 / 55 ) 17.Sep.1999 Preliminary Spec. MITSUBISHI LSIs Some contents are subject to change without notice. MH4S64DBKG -7,-7L,-8,-8L 268435456-BIT (4194304 - WORD BY 64-BIT)SynchronousDRAM COMMAND TRUTH TABLE CKE CKE n-1 n /RAS /CAS A10 A0-9 MNEMONIC Deselect No Operation DESEL NOP H H X X H L X H X H X H X X X X X X X X ACT H X L L H H V V V V Single Bank Precharge Precharge All Bank PRE PREA H H X X L L L L H H L L V X X X L H X X Column Address Entry & Write WRITE H X L H L L V X L V Column Address Entry & Write with AutoPrecharge WRITEA H X L H L L V X H V Column Address Entry & Read READ H X L H L H V X L V Column Address Entry & Read with Auto Precharge READA H X L H L H V X H V Auto-Refresh Self-Refresh Entry Self-Refresh Exit REFA REFS REFSX Burst Terminate Mode Register Set TERM MRS H H L L H H H L H H X X L L H L L L L L X H H L L L X H H L H H X H L L X X X X X L X X X X X L X X X X X L X X X X X V*1 Row Adress Entry & Bank Activate /S /WE BA0,1 A11 COMMAND H =High Level, L = Low Level, V = Valid, X = Don't Care, n = CK cycle number NOTE: 1.A7-9 = 0, A0-6 = Mode Address MIT-DS-0338-0.0 MITSUBISHI ELECTRIC ( 8 / 55 ) 17.Sep.1999 Preliminary Spec. MITSUBISHI LSIs Some contents are subject to change without notice. MH4S64DBKG -7,-7L,-8,-8L 268435456-BIT (4194304 - WORD BY 64-BIT)SynchronousDRAM FUNCTION TRUTH TABLE /S IDLE H X X X X DESEL NOP L H H H X NOP NOP L H H L BA TBST ILLEGAL*2 L H L X BA,CA,A10 L L H H BA,RA ACT L L H L L L L H BA,A10 X PRE/PREA REFA L L L L H X X X X DESEL NOP L H H H X NOP NOP L H H L BA TBST NOP L H L H BA,CA,A10 L H L L BA,CA,A10 L L H H BA,RA ACT Bank Active/ILLEGAL*2 L L H L BA,A10 PRE/PREA Precharge/Precharge All L L L H X L L L L H X X X X DESEL NOP(Continue Burst to END) L H H H X NOP NOP(Continue Burst to END) L H H L BA TBST Terminate Burst ROW ACT IVE READ /RAS /CAS /WE Address Command Current State Op-Code, Mode-Add Op-Code, Mode-Add Action READ/WRITE ILLEGAL*2 MRS READ/READA Bank Active,Latch RA NOP*4 Auto-Refresh*5 Mode Register Set*5 Begin Read,Latch CA, Determine Auto-Precharge WRITE/ Begin Write,Latch CA, WRITEA Determine Auto-Precharge REFA ILLEGAL MRS ILLEGAL Terminate Burst,Latch CA, L H L H BA,CA,A10 READ/READA Begin New Read,Determine Auto-Precharge*3 Terminate Burst,Latch CA, L H L L BA,CA,A10 WRITE/WRITEA Begin Write,Determine AutoPrecharge*3 MIT-DS-0338-0.0 L L H H BA,RA ACT L L H L BA,A10 PRE/PREA L L L H X L L L L Op-Code, Mode-Add Bank Active/ILLEGAL*2 Terminate Burst,Precharge REFA ILLEGAL MRS ILLEGAL MITSUBISHI ELECTRIC ( 9 / 55 ) 17.Sep.1999 Preliminary Spec. MITSUBISHI LSIs Some contents are subject to change without notice. MH4S64DBKG -7,-7L,-8,-8L 268435456-BIT (4194304 - WORD BY 64-BIT)SynchronousDRAM FUNCTION TRUTH TABLE(continued) /RAS /CAS Command Action X DESEL NOP(Continue Burst to END) H X NOP NOP(Continue Burst to END) L BA TBST Terminate Burst Current State /S /WE WRITE H X X X L H H L H H Address Terminate Burst,Latch CA, L H L H BA,CA,A10 READ/READA Begin Read,Determine AutoPrecharge*3 L H L L BA,CA,A10 WRITE/ WRITEA Terminate Burst,Latch CA, Begin Write,Determine AutoPrecharge*3 L L H H BA,RA ACT L L H L BA,A10 PRE/PREA L L L H X REFA ILLEGAL L L L L Op-Code, Mode-Add MRS ILLEGAL READ with H X X X X AUTO L H H H PRECHARGE L H H L L H L H BA,CA,A10 L H L L BA,CA,A10 L L H H BA,RA ACT L L H L BA,A10 PRE/PREA L L L H X L L L L WRITE with H X X X X DESEL NOP(Continue Burst to END) AUTO L H H H X NOP NOP(Continue Burst to END) PRECHARGE L H H L TBST ILLEGAL L H L H BA BA,CA,A10 L H L L BA,CA,A10 L L H H BA,RA ACT L L H L BA,A10 PRE/PREA L L L H X REFA ILLEGAL L Op-Code, Mode-Add MRS ILLEGAL L MIT-DS-0338-0.0 L L Bank Active/ILLEGAL*2 Terminate Burst,Precharge DESEL NOP(Continue Burst to END) X NOP NOP(Continue Burst to END) BA TBST ILLEGAL READ/READA ILLEGAL WRITE/ WRITEA Op-Code, Mode-Add ILLEGAL Bank Active/ILLEGAL*2 ILLEGAL*2 REFA ILLEGAL MRS ILLEGAL READ/READA ILLEGAL WRITE/ WRITEA MITSUBISHI ELECTRIC ( 10 / 55 ) ILLEGAL Bank Active/ILLEGAL*2 ILLEGAL*2 17.Sep.1999 Preliminary Spec. MITSUBISHI LSIs Some contents are subject to change without notice. MH4S64DBKG -7,-7L,-8,-8L 268435456-BIT (4194304 - WORD BY 64-BIT)SynchronousDRAM FUNCTION TRUTH TABLE(continued) /S PRE - H X X X X DESEL NOP(Idle after tRP) CHARGING L H H H X NOP NOP(Idle after tRP) L H H L BA TBST ILLEGAL*2 L H L X BA,CA,A10 L L H H BA,RA ACT L L H L BA,A10 PRE/PREA L L L H X L L L L ROW H X X X X DESEL NOP(Row Active after tRCD ACTIVATING L H H H X NOP NOP(Row Active after tRCD L H H L BA TBST ILLEGAL*2 L H L X BA,CA,A10 L L H H BA,RA ACT ILLEGAL*2 L L H L BA,A10 PRE/PREA ILLEGAL*2 L L L H X L L L L WRITE RE- H X X X X DESEL NOP COVERING L H H H X NOP NOP L H H L BA TBST ILLEGAL*2 L H L X BA,CA,A10 L L H H BA,RA ACT ILLEGAL*2 L L H L BA,A10 PRE/PREA ILLEGAL*2 L L L H X L L L L MIT-DS-0338-0.0 /RAS /CAS /WE Address Command Current State Action READ/WRITE ILLEGAL*2 Op-Code, Mode-Add ILLEGAL*2 NOP*4(Idle after tRP) REFA ILLEGAL MRS ILLEGAL READ/WRITE ILLEGAL*2 Op-Code, Mode-Add REFA ILLEGAL MRS ILLEGAL READ/WRITE ILLEGAL*2 Op-Code, Mode-Add MITSUBISHI ELECTRIC ( 11 / 55 ) REFA ILLEGAL MRS ILLEGAL 17.Sep.1999 Preliminary Spec. MITSUBISHI LSIs Some contents are subject to change without notice. MH4S64DBKG -7,-7L,-8,-8L 268435456-BIT (4194304 - WORD BY 64-BIT)SynchronousDRAM FUNCTION TRUTH TABLE(continued) Current State /S /RAS /CAS /WE Address Command Action RE- H X X X X DESEL NOP(Idle after tRC) FRESHING L H H H X NOP NOP(Idle after tRC) L H H L BA TBST ILLEGAL L H L X BA,CA,A10 L L H H BA,RA ACT ILLEGAL L L H L BA,A10 PRE/PREA ILLEGAL L L L H X REFA ILLEGAL L L L L MRS ILLEGAL MODE H X X X X DESEL NOP(Idle after tRSC) REGISTER L H H H X NOP NOP(Idle after tRSC) SETTING L H H L BA TBST ILLEGAL L H L X BA,CA,A10 L L H H BA,RA ACT ILLEGAL L L H L BA,A10 PRE/PREA ILLEGAL L L L H X REFA ILLEGAL L L L L MRS ILLEGAL READ/WRITE ILLEGAL Op-Code, Mode-Add READ/WRITE ILLEGAL Op-Code, Mode-Add ABBREVIATIONS: H = Hige Level, L = Low Level, X = Don't Care BA = Bank Address, RA = Row Address, CA = Column Address, NOP = No Operation NOTES: 1. All entries assume that CKE was High during the preceding clock cycle and the current clock cycle. 2. ILLEGAL to bank in specified state; function may be legal in the bank indicated by BA, depending on the state of that bank. 3. Must satisfy bus contention, bus turn around, write recovery requirements. 4. NOP to bank precharging or in idle state.May precharge bank indicated by BA. 5. ILLEGAL if any bank is not idle. ILLEGAL = Device operation and / or date-integrity are not guaranteed. MIT-DS-0338-0.0 MITSUBISHI ELECTRIC ( 12 / 55 ) 17.Sep.1999 Preliminary Spec. MITSUBISHI LSIs Some contents are subject to change without notice. MH4S64DBKG -7,-7L,-8,-8L 268435456-BIT (4194304 - WORD BY 64-BIT)SynchronousDRAM FUNCTION TRUTH TABLE FOR CKE Current State CK n-1 CK n /S SELF - H X X X REFRESH*1 L H H L H L /RAS /CAS Action /WE Add X X X INVALID X X X X Exit Self-Refresh(Idle after tRC) L H H H X Exit Self-Refresh(Idle after tRC) H L H H L X ILLEGAL L H L H L X X ILLEGAL L H L L X X X ILLEGAL L L X X X X X NOP(Maintain Self-Refresh) POWER H X X X X X X INVALID DOWN L H X X X X X Exit Power Down to Idle L L X X X X X NOP(Maintain Self-Refresh) ALL BANKS H H X X X X X Refer to Function Truth Table IDLE*2 H L L L L H X Enter Self-Refresh H L H X X X X Enter Power Down H L L H H H X Enter Power Down H L L H H L X ILLEGAL H L L H L X X ILLEGAL H L L L X X X ILLEGAL L X X X X X X Refer to Current State = Power Down ANY STATE H H X X X X X Refer to Function Truth Table other than H L X X X X X Begin CK0 Suspend at Next Cycle*3 listed above L H X X X X X Exit CK0 Suspend at Next Cycle*3 L L X X X X X Maintain CK0 Suspend ABBREVIATIONS: H = High Level, L = Low Level, X = Don't Care NOTES: 1. CKE Low to High transition will re-enable CK and other inputs asynchronously. A minimum setup time must be satisfied before any command other than EXIT. 2. Power-Down and Self-Refresh can be entered only form the All banks idle State. 3. Must be legal command. MIT-DS-0338-0.0 MITSUBISHI ELECTRIC ( 13 / 55 ) 17.Sep.1999 Preliminary Spec. MITSUBISHI LSIs Some contents are subject to change without notice. MH4S64DBKG -7,-7L,-8,-8L 268435456-BIT (4194304 - WORD BY 64-BIT)SynchronousDRAM SIMPLIFIED STATE DIAGRAM SELF REFRESH REFS REFSX MRS MODE REGISTER SET REFA IDLE AUTO REFRESH CKEL CKEH CLK SUSPEND ACT POWER DOWN CKEL CKEH ROW ACTIVE WRITE READA WRITEA CKEL WRITE SUSPEND READ READ WRITE WRITE CKEL READ CKEH CKEH WRITEA READA WRITEA READA CKEL WRITEA SUSPEND POWER APPLIED READ SUSPEND CKEL PRE WRITEA CKEH POWER ON PRE PRE READA PRE CKEH READA SUSPEND PRE CHARGE Automatic Sequence Command Sequence MIT-DS-0338-0.0 MITSUBISHI ELECTRIC ( 14 / 55 ) 17.Sep.1999 Preliminary Spec. MITSUBISHI LSIs Some contents are subject to change without notice. MH4S64DBKG -7,-7L,-8,-8L 268435456-BIT (4194304 - WORD BY 64-BIT)SynchronousDRAM POWER ON SEQUENCE Before starting normal operation, the following power on sequence is necessary to prevent a SDRAM from damaged or malfunctioning. 1. Clock will be applied at power up along with power.Attempt to maintain CKE high,DQM0-7 high and NOP condition at the inputs along with power. 2. Maintain stable power, stable cock, and NOP input conditions for a minimum of 500us. 3. Issue precharge commands for all banks. (PRE or PREA) 4. After all banks become idle state (after tRP), issue 8 or more auto-refresh commands. 5. Issue a mode register set command to initialize the mode register. After these sequence, the SDRAM is idle state and ready for normal operation. MODE REGISTER Burst Length, Burst Type and /CAS Latency can be programmed by setting the mode register(MRS). The mode register stores these date until the next MRS command, which may be issued when both banks are in idle state. After tRSC from a MRS command, the SDRAM is ready for new command. CK /S BA0 BA1 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 /RAS /CAS 0 0 0 0 WM 0 0 LTMODE BT BL /WE BA0,1 A11-0 CL LATENCY MODE /CAS LATENCY 000 001 R R 0 0 1 1 1 1 2 3 R R R R WRITE MODE MIT-DS-0338-0.0 1 1 0 0 1 1 0 1 0 1 0 1 0 1 BURST SINGLE BIT BURST LENGTH BURST TYPE V BL BT= 0 BT= 1 0 0 1 1 0 0 1 0 1 0 1 2 4 8 R 1 2 4 8 R 101 110 111 R R FP R R R 0 0 0 0 1 0 1 SEQUENTIAL INTERLEAVED R:Reserved for Future Use FP: Full Page MITSUBISHI ELECTRIC ( 15 / 55 ) 17.Sep.1999 Preliminary Spec. MITSUBISHI LSIs Some contents are subject to change without notice. MH4S64DBKG -7,-7L,-8,-8L 268435456-BIT (4194304 - WORD BY 64-BIT)SynchronousDRAM [ /CAS LATENCY] /CAS latency,CL,is used to synchronize the first output data with the CLK frequency,i.e.,the speed of CLK determines which CL should be used.First output data is available after CL cycles from READ command. /CAS Latency Timing(BL=4) CK ACT Command READ tRCD Address X Y CL=2 DQ Q0 Q1 Q2 Q3 Q0 Q1 Q2 CL=2 CL=3 DQ Q3 CL=3 [ BURST LENGTH ] The burst length,BL,determines the number of consecutive wrutes or reads that will be automatically performed after the initial write or read command.For BL=1,2,4,8,full page the output data is tristated(Hi-Z) after the last read.For BL=FP (Full Page),the TBST (Burs t Terminate) command should be issued to stop the output of data. Burst Length Timing(CL=2) tRCD CK Command Address ACT READ X Y DQ Q0 DQ Q0 Q1 DQ Q0 Q1 Q2 Q3 DQ Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7 DQ Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7 BL=1 BL=2 BL=4 m=255 MIT-DS-0338-0.0 MITSUBISHI ELECTRIC ( 16 / 55 ) BL=8 Q8 Qm Q0 Q1 BL=FP Full Page counter rolls over and continues to count. 17.Sep.1999 Preliminary Spec. MITSUBISHI LSIs Some contents are subject to change without notice. MH4S64DBKG -7,-7L,-8,-8L 268435456-BIT (4194304 - WORD BY 64-BIT)SynchronousDRAM CK Command Read Write Y Y Address Q0 DQ CL= 3 BL= 4 /CAS Latency Q1 Q2 D0 Q3 Burst Length D1 D2 D3 Burst Length Burst Type Initial Address BL Column Addressing A2 A1 A0 0 0 0 0 1 2 3 4 5 6 7 0 1 2 3 4 5 6 7 0 0 1 1 2 3 4 5 6 7 0 1 0 3 2 5 4 7 6 0 1 0 2 3 4 5 6 7 0 1 2 3 0 1 6 7 4 5 0 1 1 3 4 5 6 7 0 1 2 3 2 1 0 7 6 5 4 Sequential Interleaved 8 1 0 0 4 5 6 7 0 1 2 3 4 5 6 7 0 1 2 3 1 0 1 5 6 7 0 1 2 3 4 5 4 7 6 1 0 3 2 1 1 0 6 7 0 1 2 3 4 5 6 7 4 5 2 3 0 1 1 1 1 7 0 1 2 3 4 5 6 7 6 5 4 3 2 1 0 - 0 0 0 1 2 3 0 1 2 3 - 0 1 1 2 3 0 1 0 3 2 4 - 1 0 2 3 0 1 2 3 0 1 - 1 1 3 0 1 2 3 2 1 0 - - 0 0 1 0 1 1 0 1 0 2 - - 1 MIT-DS-0338-0.0 MITSUBISHI ELECTRIC ( 17 / 55 ) 17.Sep.1999 Preliminary Spec. MITSUBISHI LSIs Some contents are subject to change without notice. MH4S64DBKG -7,-7L,-8,-8L 268435456-BIT (4194304 - WORD BY 64-BIT)SynchronousDRAM OPERATION DESCRIPTION BANK ACTIVATE The SDRAM has four independent banks. Each bank is activated by the ACT command with the bank address(BA0,1). A row is indicated by the row address A11-0. The minimum activation interval between one bank and the other bank is tRRD. PRECHARGE The PRE command deactivates indicated by BA. When both banks are active, the precharge all command(PREA,PRE + A10=H) is available to deactivate them at the same time. After tRP from the precharge, an ACT command can be issued. Bank Activation and Precharge All (BL=4, CL=3) CK Command ACT ACT READ tRRD A0-9,11 Xa PRE ACT tRAS Xb tRP Y Xb tRCD A10 Xa Xb 0 BA0,1 00 01 00 DQ 1 Xb 01 Qa0 Qa1 Qa2 Qa3 Precharge all READ After tRCD from the bank activation, a READ command can be issued. 1st output date is available after the /CAS Latency from the READ, followed by (BL-1) consecutive date when the Burst Length is BL. The start address is specified by A7-0, and the address sequence of burst data is defined by the Burst Type. A READ command may be applied to any active bank, so the row precharge time(tRP) can be hidden behind continuous output data(in case of BL=8) by interleaving the dual banks. When A10 is high at a READ command, the autoprecharge(READA) is performed. Any command (READ, WRITE, PRE, ACT) to the same bank is inhibited till the internal precharge is complete. The internal precharge start timing depends on /CAD Latency. The next ACT command can be issued after tRP from the internal precharge timing. MIT-DS-0338-0.0 MITSUBISHI ELECTRIC ( 18 / 55 ) 17.Sep.1999 Preliminary Spec. MITSUBISHI LSIs Some contents are subject to change without notice. MH4S64DBKG -7,-7L,-8,-8L 268435456-BIT (4194304 - WORD BY 64-BIT)SynchronousDRAM Dual Bank Interleaving READ (BL=4, CL=3) CK Command ACT READ ACT READ PRE tRCD A0-9,11 Xa Y Xb Y A10 Xa 0 Xb 0 0 BA0,1 0 0 1 1 0 Qa1 Qa2 DQ Qa0 /CAS latency Qa3 Qb0 Qb1 Qb2 Burst Length READ with Auto-Precharge (BL=4, CL=3) CK Command ACT READ ACT tRCD A0-9,11 tRP Xa Y Xa A10 Xa 1 Xa BA0,1 0 0 0 DQ Qa0 Qa1 Qa2 Qa3 Internal precharge begins READ Auto-Precharge Timing (BL=4) CK Command CL=3 DQ CL=2 DQ ACT READ Qa0 Qa0 Qa1 Qa2 Qa1 Qa2 Qa3 Qa3 Internal Precharge Start Timing MIT-DS-0338-0.0 MITSUBISHI ELECTRIC ( 19 / 55 ) 17.Sep.1999 Preliminary Spec. MITSUBISHI LSIs Some contents are subject to change without notice. MH4S64DBKG -7,-7L,-8,-8L 268435456-BIT (4194304 - WORD BY 64-BIT)SynchronousDRAM WRITE After tRCD from the bank activation, a WRITE command can be issued. 1st input data is set at the same cycle as the WRITE. Following(BL-1) data are written into the RAM, when the Burst Length is BL. The start address is specified by A7-0, and the address sequence of burst data is defined by the Burst Type. A WRITE command may be applied to any active bank, so the row precharge time(tRP) can be hidden behind continuous input data (in case of BL=8) by interleaving the dual banks. From the last input data to the PRE command, the write recovery time (tWR) is required. When A10 is high at a WRITE command, the autoprecharge(WRITEA) is performed. Any command(READ, WRITE, PRE, ACT) to the same bank is inhibited till the internal precharge is complete. The internal precharge begins at tWR after the last input data cycle. The next ACT command can be issued after tRP from the internal precharge timing. Dual Bank Interleaving WRITE (BL=4) CK Command ACT Write ACT tRCD Write PRE tRCD A0-9,11 Xa Y Xb Y A10 Xa 0 Xb 0 0 0 0 1 1 0 Da0 Da1 Db0 Db1 tWR BA0,1 DQ Da2 Da3 Db2 Db3 Burst Length WRITE with Auto-Precharge (BL=4) CK Command ACT Write ACT tRCD tRP A0-9,11 Xa Y Xa A10 Xa 1 Xa 0 0 BA0,1 0 tWR DQ Da0 Da1 Da2 Da3 Internal precharge begins MIT-DS-0338-0.0 MITSUBISHI ELECTRIC ( 20 / 55 ) 17.Sep.1999 Preliminary Spec. MITSUBISHI LSIs Some contents are subject to change without notice. MH4S64DBKG -7,-7L,-8,-8L 268435456-BIT (4194304 - WORD BY 64-BIT)SynchronousDRAM [ BURST WRITE ] A burst write operation is enabled by setting A9=0 at MRS.A burst write stats in the same cycle as a write command set.(The latency of data input is 0.) The burst length can be set to 1,2,4,8,and full-page,like burst read operations . tRCD CK Command ACT READ X Y Address DQ Q0 DQ Q0 Q1 DQ Q0 Q1 Q2 Q3 DQ Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7 DQ Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7 BL=1 BL=2 BL=4 m=255 BL=8 Q8 Qm Q0 BL=FP Q1 Full Page counter rolls over and continues to count. [ SINGLE WRITE ] A single write operation is enabled by setting A9=1 at MRS.In a single write operation,data is written only to the column address specified by the write command set cycle without regard to the burst length setting.(The latency of data input is 0.) CK Command READ ACT tRCD Address DQ MIT-DS-0338-0.0 X Y Q0 MITSUBISHI ELECTRIC ( 21 / 55 ) 17.Sep.1999 Preliminary Spec. MITSUBISHI LSIs Some contents are subject to change without notice. MH4S64DBKG -7,-7L,-8,-8L 268435456-BIT (4194304 - WORD BY 64-BIT)SynchronousDRAM BURST INTERRUPTION [ Read Interrupted by Read ] Burst read option can be interrupted by new read of the same or the other bank. MH8S64BBKG allows random column access. READ to READ interval is minimum 1 CK Read Interrupted by Read (BL=4, CL=3) CK Command A0-9,11 READ READ READ READ Yi Yj Yk Yl A10 0 0 0 0 BA0,1 0 0 1 0 DQ Qai0 Qaj0 Qaj1 Qbk0 Qbk1 Qbk2 Qal0 Qal1 Qal2 Qal3 [ Read Interrupted by Write ] Burst read operation can be interrupted by write of the same or the other bank. Random column access is allowed. In this case, the DQ should be controlled adequately by using the DQMB0-7 to prevent the bus contention. The output is disabled automatically 2 cycle after WRITE assertion. Read Interrupted by Write (BL=4, CL=3) CK Command A0-9,11 READ Write Yi Yj A10 0 0 BA0,1 0 0 DQMB0-7 Q D Qai0 Daj0 Daj1 Daj2 DQM control MIT-DS-0338-0.0 MITSUBISHI ELECTRIC ( 22 / 55 ) Daj3 Write control 17.Sep.1999 Preliminary Spec. MITSUBISHI LSIs Some contents are subject to change without notice. MH4S64DBKG -7,-7L,-8,-8L 268435456-BIT (4194304 - WORD BY 64-BIT)SynchronousDRAM [ Read Interrupted by Precharge ] Burst read operation can be interrupted by precharge of the same or the other bank. Read to PRE interval is minimum 1 CK. A PRE command disables the data output, depending on the /CAS Latency. The figure below shows examples, when the dataout is terminated. Read Interrupted by Precharge (BL=4) CK Command PRE READ DQ Q0 Q1 Q0 Q1 Q2 Q3 CL=3 Command READ PRE DQ Command PRE READ DQ Q0 Q1 Q2 Q3 CL=2 Command DQ MIT-DS-0338-0.0 READ PRE Q0 Q1 MITSUBISHI ELECTRIC ( 23 / 55 ) 17.Sep.1999 Preliminary Spec. MITSUBISHI LSIs Some contents are subject to change without notice. MH4S64DBKG -7,-7L,-8,-8L 268435456-BIT (4194304 - WORD BY 64-BIT)SynchronousDRAM [ Read Interrupted by Burst Terminate ] Similarly to the precharge, burst terminate command,TBST, can interrupt burst read operation and disable the data output. READ to TBST interval is minimum of 1 CK. TBST is mainly used to interrupt FP bursts.The figure below show examples, of how the output data is terminated with TBST. Read Interrupted by Burst Terminate (BL=4) CK Command READ TBST DQ Command Q0 READ Q1 Q2 Q1 Q2 Q3 TBST CL=3 DQ Command Q0 READ TBST Q0 DQ Command TBST READ DQ Command CL=2 DQ Q1 Q2 Q3 TBST READ DQ Command MIT-DS-0338-0.0 Q0 Q0 Q1 Q2 READ TBST Q0 MITSUBISHI ELECTRIC ( 24 / 55 ) 17.Sep.1999 Preliminary Spec. MITSUBISHI LSIs Some contents are subject to change without notice. MH4S64DBKG -7,-7L,-8,-8L 268435456-BIT (4194304 - WORD BY 64-BIT)SynchronousDRAM [ Write Interrupted by Write ] Burst write operation can be interrupted by new write of the same or the other bank. Random column access is allowed. WRITE to WRITE interval is minimum 1 CK. Write Interrupted by Write (BL=4) CK Command A0-9,11 Write Write Write Write Yi Yj Yk Yl A10 0 0 0 0 BA0,1 0 0 1 0 DQ Dai0 Daj0 Daj1 Dbk0 Dbk1 Dbk2 Dal0 Dal1 Dal2 Dal3 [ Write Interrupted by Read ] Burst write operation can be interrupted by read of the same or the other bank. Random column access is allowed. WRITE to READ interval is minimum 1 CK. The input data on DQ at the interrupting READ cycle is "don't care". Write Interrupted by Read (BL=4, CL=3) CK Command A0-9,11 Write READ Write READ Yi Yj Yk Yl A10 0 0 0 0 BA0,1 0 0 0 1 DQMB0-7 DQ MIT-DS-0338-0.0 Dai0 Qaj0 Qaj1 MITSUBISHI ELECTRIC ( 25 / 55 ) Dak0 Dak1 Qbl0 17.Sep.1999 Preliminary Spec. MITSUBISHI LSIs Some contents are subject to change without notice. MH4S64DBKG -7,-7L,-8,-8L 268435456-BIT (4194304 - WORD BY 64-BIT)SynchronousDRAM [ Write Interrupted by Precharge ] Burst write operation can be interrupted by precharge of the same bank. Random column access is allowed. Because the write recovery time(tWR) is required between the last input data and the next PRE, 3rd data should be masked with DQMB0-7 shown as below. Write Interrupted by Precharge (BL=4) CK Command Write PRE tWR A0-9,11 ACT tRP Yi Xb A10 0 0 Xb BA0,1 0 0 0 DQMB0-7 DQ Dai0 Dai1 This data should be masked to satisf y tWR requirement. [ Write Interrupted by Burst Terminate ] Burst terminate command can terminate burst write operation. In this case, the write recovery time is not required and the bank remains active. The figure below shows the case 3 words of data are written. Random column access is allowed. WRITE to TERM interval is minimum 1 CK. Write Interrupted by Burst Terminate (BL=4) CK Command A0-9,11 Write TERM Yi A10 0 BA0,1 0 DQMB0-7 DQ MIT-DS-0338-0.0 Dai0 Dai1 Dai2 MITSUBISHI ELECTRIC ( 26 / 55 ) 17.Sep.1999 Preliminary Spec. MITSUBISHI LSIs Some contents are subject to change without notice. MH4S64DBKG -7,-7L,-8,-8L 268435456-BIT (4194304 - WORD BY 64-BIT)SynchronousDRAM AUTO REFRESH Single cycle of auto-refresh is initiated with a REFA(/CS=/RAS=/CAS=L, /WE=/CKE=H) command. The refresh address is generated internally. 4096 REFA cycle within 64ms refresh 64Mbit memory cells. The auto-refresh is performed on 4bank alternately(ping-pong refresh). Before performing an auto-refresh, both banks must be in the idle state. Additional commands must not be supplied to the device before tRC from the REFA command. Auto-Refresh CK /S NOP or DESLECT /RAS /CAS /WE CKE minimum tRC A0-11 BA0,1 Auto Refresh on Bank 0 MIT-DS-0338-0.0 Auto Refresh on Bank 1 MITSUBISHI ELECTRIC ( 27 / 55 ) 17.Sep.1999 Preliminary Spec. MITSUBISHI LSIs Some contents are subject to change without notice. MH4S64DBKG -7,-7L,-8,-8L 268435456-BIT (4194304 - WORD BY 64-BIT)SynchronousDRAM SELF REFRESH Self-refresh mode is entered by issuing a REFS command (/CS=/RAS=/CAS=L, /WE=H, CKE=L). Once the self-refresh is initiated, it is maintained as log as CKE is kept low.During the self-refresh mode, CKE is asynchronous and the only enabled input (but asynchronous), all other inputs including CK0 are disabled and ignored, and power consumption due to synchronous inputs is saved. To exit the selfrefresh, supplying stable CK0 inputs, asserting DESEL or NOP command and then asserting CKE(REFSX). After tRC from REFSX both banks are in the idle state and a new command can be issued after tRC, but DESEL or NOP commands must be asserted till then. Self-Refresh CK Stable CK /S NOP /RAS /CAS /WE CKE new command A0-11 X BA0,1 0 Self Refresh Entry MIT-DS-0338-0.0 Self Refresh Exit MITSUBISHI ELECTRIC ( 28 / 55 ) minimum tRC for recovery 17.Sep.1999 Preliminary Spec. MITSUBISHI LSIs Some contents are subject to change without notice. MH4S64DBKG -7,-7L,-8,-8L 268435456-BIT (4194304 - WORD BY 64-BIT)SynchronousDRAM CLK SUSPEND CKE controls the internal CLK at the following cycle. Figure below shows how CKE works. By negating CKE, the next internal CLK is suspended. The purpose of CLK suspend is power down, output suspend or input suspend. CKE is a synchronous input except during the self-refresh mode. CLK suspend can be performed either when the banks are active or idle, but a command at the following cycle is ignored. CK (ext.CLK) CKE int.CLK Power Down by CKE CK Standby Power Down CKE Command PRE NOP NOP NOP NOP NOP NOP NOP Activ e Power Down CKE Command NOP NOP NOP NOP NOP NOP NOP ACT DQ Suspend by CKE CK CKE Command DQ MIT-DS-0338-0.0 Write D0 READ D1 D2 D3 MITSUBISHI ELECTRIC ( 29 / 55 ) Q0 Q1 Q2 Q3 17.Sep.1999 Preliminary Spec. MITSUBISHI LSIs Some contents are subject to change without notice. MH4S64DBKG -7,-7L,-8,-8L 268435456-BIT (4194304 - WORD BY 64-BIT)SynchronousDRAM DQM CONTROL DQMB0-7 is a dual function signal defined as the data mask for writes and the output disable for reads. During writes, DQMB0-7 masks input data word by word. DQMB0-7 to write mask latency is 0. During reads, DQMB0-7 forces output to Hi-Z word by word. DQMB0-7 to output Hi-Z latency is 2. DQM Function CK Command READ Write DQMB0-7 DQ D0 D2 D3 Q0 masked by DQM=H MIT-DS-0338-0.0 Q1 Q3 disabled by DQM=H MITSUBISHI ELECTRIC ( 30 / 55 ) 17.Sep.1999 Preliminary Spec. MITSUBISHI LSIs Some contents are subject to change without notice. MH4S64DBKG -7,-7L,-8,-8L 268435456-BIT (4194304 - WORD BY 64-BIT)SynchronousDRAM ABSOLUTE MAXIMUM RATINGS Symbol Parameter Condition Ratings Unit Vdd Supply Voltage with respect to Vss -0.5 ~ 4.6 V VI Input Voltage with respect to Vss -0.5 ~ Vdd+0.5 V VO Output Voltage with respect to Vss -0.5 ~ Vdd+0.5 V IO Output Current 50 mA Pd Power Dissipation 4 W Topr Operating Temperature 0 ~ 70 °C Tstg Storage Temperature -40 ~ 100 °C Ta=25°C RECOM M ENDED OPERATING CONDITION (Ta=0 ~ 70°C, unless otherwise noted) Limits Parameter Symbol Min. Typ. Max. Unit Vdd Supply Voltage 3.0 3.3 3.6 V Vss Supply Voltage 0 0 0 V VIH High-Level Input Voltage all inputs Low-Level Input Voltage all inputs 2.0 Vdd+0.3 V -0.3 0.8 V VIL CAPACITANCE (Ta=0 ~ 70°C, Vdd = 3.3 ± 0.3V, Vss = 0V, unless otherwise noted) Symbol Parameter Test Condition Limits(max.) Unit CI(A) Input Capacitance, address pin VI = 1.4V 30 pF CI(C) Input Capacitance, control pin 30 pF CI(K) Input Capacitance, CK pin 35 pF CI/O Input Capacitance, I/O pin 22 pF MIT-DS-0338-0.0 f=1MHz Vi=200mVrms MITSUBISHI ELECTRIC ( 31 / 55 ) 17.Sep.1999 Preliminary Spec. MITSUBISHI LSIs Some contents are subject to change without notice. MH4S64DBKG -7,-7L,-8,-8L 268435456-BIT (4194304 - WORD BY 64-BIT)SynchronousDRAM AVERAGE SUPPLY CURRENT from Vdd (Ta=0 ~70°C, Vdd = 3.3 ± 0.3V, Vss = 0V, unless otherwise noted) Symbol Parameter operating current one bank activ e (discrete) Icc3N Test Condition tRC=min.tCLK=min, BL=1, CL=3 Icc1 precharge stanby current Icc2N in non power-down mode Icc2NS active stanby current Icc3P in power-down mode Icc3PS active stanby current in non power-down mode Limits (max) CKE=/CS=VIHmin,tCLK=15ns(Note) , VIH>Vcc-0.2V, VIL<0.2V CKE=VIHmin,CLK=VILmax(fixed), VIH>Vcc-0.2V, VIL<0.2V CKE=VILmax,tCLK=15ns CKE=CLK=VILmax(fixed) CKE=/CS=VIHmin,tCLK=15ns burst current auto-refresh current Icc3NS CKE=VIHmin,CLK=VILmax(f ixed) tCLK=min, BL=4, CL=3,All banks activ e(discerte) Icc4 tRC=min, tCLK=min Icc5 self-refresh current Icc6 one bank activ e (discrete) -7, -8 -7L,-8L CKE <0.2V -7, -7L -8, -8L Unit 320 mA 80 60 mA mA 8 mA 4 mA 120 mA 100 mA 320 440 4 mA mA mA 2 mA Note:Input signals are changed one time during 30ns. Note:All other pins not under test are 0V. AC OPERATING CONDITIONS AND CHARACTERISTICS (Ta=0 ~ 70°C, Vdd = 3.3 ± 0.3V, Vss = 0V, unless otherwise noted) Symbol VOH(DC) VOL(DC) IOZ VOH(AC) Ii VOL(AC) MIT-DS-0338-0.0 Limits Unit Min. Max. High-Level Output Voltage(DC) IOH=-2mA 2.4 V Low-Level Output Voltage(DC) IOL=2mA 0.4 V Off-stare Output Current floating VO=0 High-Level Output Voltage(AC) Q CL=50pF, IOH=- ~ Vdd -102 10 uA V 2mA ~ Vdd+0.3V Input Current uA Low-Level Output Voltage(AC) VIH=0 CL=50pF, IOL=2mA 0.8 V -20 20 Parameter Test Condition MITSUBISHI ELECTRIC ( 32 / 55 ) 17.Sep.1999 Preliminary Spec. MITSUBISHI LSIs Some contents are subject to change without notice. MH4S64DBKG -7,-7L,-8,-8L 268435456-BIT (4194304 - WORD BY 64-BIT)SynchronousDRAM AC TIM ING REQUIREMENTS (SDRAM Component) (Ta=0 ~ 70°C, Vdd = 3.3 ± 0.3V, Vss = 0V, unless otherwise noted) Input Pulse Levels: 0.8V to 2.0V Input Timing Measurement Level: 1.4V Limits -7,-7L -8,-8L Min. Max. Min. Max. Symbol Parameter tCLK CK cycle time CL=2 10 10 3 3 1 10 2 1 70 20 50 100K 20 20 20 10 10 64 CL=3 tCH CK High pulse width tCL CK Low pilse width tT Transition time of CK tIS Input Setup time(all inputs) tIH Input Hold time(all inputs) tRC Row cycle time tRCD Row to Column Delay tRAS Row Active time tRP Row Precharge time tWR Write Recovery time tRRD Act to Act Deley time tRSC Mode Register Set Cycle time tSRX Self Refresh Exit time tREF Refresh Interval time Unit Note ns 13 10 ns 3 ns 3 ns 1 10 ns 2 ns ns 1 70 ns 20 ns 50 100K ns 20 ns 20 ns 20 ns 10 ns 10 ns 64 ms 1 1 1 1 Note:1 The timing requirements are assumed tT=1ns.If tT is longer than 1ns,(tT-1)ns should be added to the parameter. CK 1.4V Any AC timing is referenced to the input Signal 1.4V signal crossing through 1.4V. MIT-DS-0338-0.0 MITSUBISHI ELECTRIC ( 33 / 55 ) 17.Sep.1999 Preliminary Spec. MITSUBISHI LSIs Some contents are subject to change without notice. MH4S64DBKG -7,-7L,-8,-8L 268435456-BIT (4194304 - WORD BY 64-BIT)SynchronousDRAM SWITCHING CHARACTERISTICS (SDRAM Component) (Ta=0 ~ 70°C, Vdd = 3.3 ± 0.165V, Vss = 0V, unless otherwise noted) Limits -7,-7L -8,-8L Unit Min. Max. Min. Max. Symbol Parameter tAC tOH tOLZ tOHZ Access time from CK CL=2 6 7 ns CL=3 6 6 ns Output Hold time from CK Delay time, output low impedance from CK Delay time, output high impedance from CK 3 3 ns 0 0 ns 3 6 3 6 ns Note:3 If tr(clock rising time) is longer than 1ns,(tT/2-0.5)ns should be added to parameter. Output Load Condition V TT =1.4V CK 1.4V 50Ω DQ 1.4V V OUT 50pF Output Timing Measurement Reference Point CK 1.4V DQ 1.4V tAC MIT-DS-0338-0.0 tOH tOHZ MITSUBISHI ELECTRIC ( 34 / 55 ) 17.Sep.1999 Preliminary Spec. MITSUBISHI LSIs Some contents are subject to change without notice. MH4S64DBKG -7,-7L,-8,-8L 268435456-BIT (4194304 - WORD BY 64-BIT)SynchronousDRAM Burst Write (single bank) @BL=4 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 CLK tRC /CS tRAS tRP /RAS tRCD tRCD /CAS /WE tWR CKE DQM Y A0-7 X A10 X X A8,9,11 X X BA0,1 0 0 D0 DQ ACT#0 X 0 D0 WRITE#0 D0 0 D0 Y 0 D0 PRE#0 ACT#0 D0 D0 D0 WRITE#0 Italic parameter indicates minimum case MIT-DS-0338-0.0 MITSUBISHI ELECTRIC ( 35 / 55 ) 17.Sep.1999 Preliminary Spec. MITSUBISHI LSIs Some contents are subject to change without notice. MH4S64DBKG -7,-7L,-8,-8L 268435456-BIT (4194304 - WORD BY 64-BIT)SynchronousDRAM Burst Write (multi bank) @BL=4 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 CLK tRC /CS tRRD tRRD tRAS tRP /RAS tRCD tRCD /CAS /WE tWR tWR CKE DQM A0-7 X X A10 X A8,9,11 BA0,1 Y X X X X X X X X X 0 1 0 D0 DQ ACT#0 Y D0 WRITE#0 ACT#1 D0 D0 1 0 D1 D1 0 D1 PRE#0 WRITE#1 D1 1 2 Y 0 D0 ACT#0 D0 D0 D0 ACT#2 WRITE#0 PRE#1 Italic parameter indicates minimum case MIT-DS-0338-0.0 MITSUBISHI ELECTRIC ( 36 / 55 ) 17.Sep.1999 Preliminary Spec. MITSUBISHI LSIs Some contents are subject to change without notice. MH4S64DBKG -7,-7L,-8,-8L 268435456-BIT (4194304 - WORD BY 64-BIT)SynchronousDRAM Burst Read (single bank) @BL=4 CL=3 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 CLK tRC /CS tRP tRAS /RAS tRCD tRCD /CAS /WE CKE DQM DQM read latency =2 A0-7 X A10 X X A8,9,11 X X BA0,1 0 Y X 0 0 0 Y 0 CL=3 Q0 DQ ACT#0 READ#0 Q0 Q0 Q0 PRE#0 Q0 ACT#0 Q0 READ#0 READ to PRE ≥BL allows full data out Italic parameter indicates minimum case MIT-DS-0338-0.0 MITSUBISHI ELECTRIC ( 37 / 55 ) 17.Sep.1999 Preliminary Spec. MITSUBISHI LSIs Some contents are subject to change without notice. MH4S64DBKG -7,-7L,-8,-8L 268435456-BIT (4194304 - WORD BY 64-BIT)SynchronousDRAM Burst Read (multiple bank) @BL=4 CL=3 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 CLK tRC /CS tRRD tRRD tRAS tRP /RAS tRCD tRCD /CAS /WE CKE DQM DQM read latency =2 A0-7 X X A10 X A8,9,11 BA0,1 Y Y X X X X X X X X X 0 1 0 1 CL=3 ACT#0 READ#0 ACT#1 0 1 2 Q1 Q1 Q1 0 CL=3 Q0 DQ 0 Y Q0 Q0 Q0 PRE#0 READ#1 Q1 Q0 ACT#0 READ#0 PRE#1 ACT#2 Italic parameter indicates minimum case MIT-DS-0338-0.0 MITSUBISHI ELECTRIC ( 38 / 55 ) 17.Sep.1999 Preliminary Spec. MITSUBISHI LSIs Some contents are subject to change without notice. MH4S64DBKG -7,-7L,-8,-8L 268435456-BIT (4194304 - WORD BY 64-BIT)SynchronousDRAM Burst Write (multi bank) with Auto-Precharge @BL=4 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 CLK tRC /CS tRRD tRRD /RAS tRCD tRCD tRCD /CAS BL-1+ tWR + tRP BL-1+ tWR + tRP /WE CKE DQM A0-7 X X A10 X X X X A8,9,11 X X X X BA0,1 0 1 Y 0 D0 DQ ACT#0 ACT#1 Y X 1 D0 D0 D0 WRITE#0 with AutoPrecharge D1 D1 D1 Y X 0 0 1 D1 D0 D0 ACT#0 WRITE#1 with AutoPrecharge Y 1 D0 WRITE#0 ACT#1 D0 D1 WRITE#1 Italic parameter indicates minimum case MIT-DS-0338-0.0 MITSUBISHI ELECTRIC ( 39 / 55 ) 17.Sep.1999 Preliminary Spec. MITSUBISHI LSIs Some contents are subject to change without notice. MH4S64DBKG -7,-7L,-8,-8L 268435456-BIT (4194304 - WORD BY 64-BIT)SynchronousDRAM Burst Read (multiple bank) with Auto-Precharge @BL=4 CL=3 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 CLK tRC /CS tRRD tRRD /RAS tRCD tRCD tRCD /CAS BL+tRP BL+tRP /WE CKE DQM DQM read latency =2 Y Y Y A0-7 X X A10 X X X X A8,9,11 X X X X BA0,1 0 1 0 1 CL=3 ACT#0 ACT#1 0 0 CL=3 Q0 DQ X READ#0 with Auto-Precharge Q0 Q0 X Y 1 1 CL=3 Q0 Q1 Q1 ACT#0 READ#1 with Auto-Precharge Q1 Q1 Q0 Q0 READ#0 ACT#1 Italic parameter indicates minimum case MIT-DS-0338-0.0 MITSUBISHI ELECTRIC ( 40 / 55 ) 17.Sep.1999 Preliminary Spec. MITSUBISHI LSIs Some contents are subject to change without notice. MH4S64DBKG -7,-7L,-8,-8L 268435456-BIT (4194304 - WORD BY 64-BIT)SynchronousDRAM Page Mode Burst Write (multi bank) @BL=4 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 CLK /CS tRRD /RAS tRCD /CAS /WE CKE DQM A0-7 X X A10 X X A8,9,11 X X BA0,1 0 1 Y Y Y Y 0 0 1 0 D0 DQ ACT#0 D0 WRITE#0 ACT#1 D0 D0 D0 D0 D0 D0 D1 D1 WRITE#0 D1 D1 D0 D0 D0 WRITE#0 WRITE#1 Italic parameter indicates minimum case MIT-DS-0338-0.0 MITSUBISHI ELECTRIC ( 41 / 55 ) 17.Sep.1999 Preliminary Spec. MITSUBISHI LSIs Some contents are subject to change without notice. MH4S64DBKG -7,-7L,-8,-8L 268435456-BIT (4194304 - WORD BY 64-BIT)SynchronousDRAM Page Mode Burst Read (multi bank) @BL=4 CL=3 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 CLK /CS tRRD /RAS tRCD /CAS /WE CKE DQM DQM read latency=2 A0-7 X X A10 X X A8,9,11 X X BA0,1 0 1 Y Y Y Y 0 0 1 0 CL=3 CL=3 Q0 DQ ACT#0 READ#0 ACT#1 Q0 Q0 CL=3 Q0 Q0 Q0 Q0 READ#0 Q0 Q1 Q1 Q1 Q1 READ#0 READ#1 Italic parameter indicates minimum case MIT-DS-0338-0.0 MITSUBISHI ELECTRIC ( 42 / 55 ) 17.Sep.1999 Preliminary Spec. MITSUBISHI LSIs Some contents are subject to change without notice. MH4S64DBKG -7,-7L,-8,-8L 268435456-BIT (4194304 - WORD BY 64-BIT)SynchronousDRAM Write Interrupted by Write / Read @BL=4 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 CLK /CS tRRD /RAS tCCD tRCD /CAS /WE CKE DQM A0-7 X X A10 X X A8,9,11 X X BA0,1 0 1 Y Y Y Y Y 0 0 0 1 0 CL=3 D0 DQ D0 D0 D0 D0 D0 D1 D1 Q0 Q0 Q0 Q0 ACT#0 WRITE#0 WRITE#0 WRITE#0 READ#0 ACT#1 WRITE#1 Burst Write can be interrupted by Write or Read of any active bank. Italic parameter indicates minimum case MIT-DS-0338-0.0 MITSUBISHI ELECTRIC ( 43 / 55 ) 17.Sep.1999 Preliminary Spec. MITSUBISHI LSIs Some contents are subject to change without notice. MH4S64DBKG -7,-7L,-8,-8L 268435456-BIT (4194304 - WORD BY 64-BIT)SynchronousDRAM Read Interrupted by Read / Write @BL=4 CL=3 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 CLK /CS tRRD /RAS tRCD /CAS /WE CKE DQM DQM read latency=2 A0-7 X X A10 X X X X 0 1 A8,9,11 BA0,1 DQ ACT#0 Y Y Y Y Y Y 0 0 0 1 0 0 Q0 Q0 Q0 Q0 Q0 Q0 Q1 Q1 Q0 D0 D0 READ#0 READ#0 READ#0 READ#0 WRITE#0 ACT#1 READ#1 blank to prevent bus contention Burst Read can be interrupted by Read or Write of any active bank. Italic parameter indicates minimum case MIT-DS-0338-0.0 MITSUBISHI ELECTRIC ( 44 / 55 ) 17.Sep.1999 Preliminary Spec. MITSUBISHI LSIs Some contents are subject to change without notice. MH4S64DBKG -7,-7L,-8,-8L 268435456-BIT (4194304 - WORD BY 64-BIT)SynchronousDRAM Write Interrupted by Precharge @BL=4 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 CLK /CS tRRD /RAS tRCD /CAS /WE CKE DQM Y A0-7 X X A10 X X X A8,9,11 X X X 0 1 BA0,1 0 D0 DQ Y D0 ACT#0 WRITE#0 ACT#1 D0 D0 X 1 0 D1 D1 1 1 1 D1 PRE#0 WRITE#1 PRE#1 Burst Write is not interrupted by Precharge of the other bank. Y ACT#1 D1 D1 WRITE#1 Burst Write is interrupted by Precharge of the same bank. Italic parameter indicates minimum case MIT-DS-0338-0.0 MITSUBISHI ELECTRIC ( 45 / 55 ) 17.Sep.1999 Preliminary Spec. MITSUBISHI LSIs Some contents are subject to change without notice. MH4S64DBKG -7,-7L,-8,-8L 268435456-BIT (4194304 - WORD BY 64-BIT)SynchronousDRAM Read Interrupted by Precharge @BL=4 CL=3 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 CLK /CS tRRD tRP /RAS tRCD tRCD /CAS /WE CKE DQM DQM read latency=2 Y A0-7 X X A10 X X X X X X 0 1 A8,9,11 BA0,1 Y 0 Q0 DQ ACT#0 READ#0 ACT#1 X 1 0 1 Q0 Q0 Q0 1 Q1 PRE#0 READ#1 PRE#1 Burst Read is not interrupted by Precharge of the other bank. Y 1 Q1 ACT#1 READ#1 Burst Read is interrupted by Precharge of the same bank. Italic parameter indicates minimum case MIT-DS-0338-0.0 MITSUBISHI ELECTRIC ( 46 / 55 ) 17.Sep.1999 Preliminary Spec. MITSUBISHI LSIs Some contents are subject to change without notice. MH4S64DBKG -7,-7L,-8,-8L 268435456-BIT (4194304 - WORD BY 64-BIT)SynchronousDRAM Mode Register Setting 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 CLK /CS tRSC tRC /RAS tRCD /CAS /WE CKE DQM M A0-7 X Y X A10 X A8,9,11 0 BA0,1 0 0 D0 DQ Auto-Ref (last of 8 cycles) Mode Register Setting ACT#0 D0 D0 D0 WRITE#0 Italic parameter indicates minimum case MIT-DS-0338-0.0 MITSUBISHI ELECTRIC ( 47 / 55 ) 17.Sep.1999 Preliminary Spec. MITSUBISHI LSIs Some contents are subject to change without notice. MH4S64DBKG -7,-7L,-8,-8L 268435456-BIT (4194304 - WORD BY 64-BIT)SynchronousDRAM Auto-Refresh @BL=4 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 CLK /CS tRC /RAS tRCD /CAS /WE CKE DQM A0-7 X A10 X A8,9,11 X 0 BA0,1 Y 0 D0 DQ D0 D0 Auto-Refresh ACT#0 Before Auto-Refresh, all banks must be idle state. After tRC from Auto-Refresh, all banks are idle state. D0 WRITE#0 Italic parameter indicates minimum case MIT-DS-0338-0.0 MITSUBISHI ELECTRIC ( 48 / 55 ) 17.Sep.1999 Preliminary Spec. MITSUBISHI LSIs Some contents are subject to change without notice. MH4S64DBKG -7,-7L,-8,-8L 268435456-BIT (4194304 - WORD BY 64-BIT)SynchronousDRAM Self-Refresh 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 CLK CLK can be stopped tRC /CS /RAS /CAS /WE tSRX CKE CKE must be low to maintain Self-Refresh DQM A0-7 X A10 X A8,9,11 X 0 BA0,1 DQ Self-Refresh Entry Before Self-Refresh Entry, all banks must be idle state. Self-Refresh Exit ACT#0 After tRC from Self-Refresh Exit, all banks are idle state. Italic parameter indicates minimum case MIT-DS-0338-0.0 MITSUBISHI ELECTRIC ( 49 / 55 ) 17.Sep.1999 Preliminary Spec. MITSUBISHI LSIs Some contents are subject to change without notice. MH4S64DBKG -7,-7L,-8,-8L 268435456-BIT (4194304 - WORD BY 64-BIT)SynchronousDRAM DQM Write Mask @BL=4 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 CLK /CS /RAS tRCD /CAS /WE CKE DQM A0-7 X A10 X A8,9,11 X BA0,1 0 Y Y Y 0 0 0 masked D0 DQ ACT#0 D0 WRITE#0 D0 D0 masked D0 WRITE#0 D0 D0 WRITE#0 Italic parameter indicates minimum case MIT-DS-0338-0.0 MITSUBISHI ELECTRIC ( 50 / 55 ) 17.Sep.1999 Preliminary Spec. MITSUBISHI LSIs Some contents are subject to change without notice. MH4S64DBKG -7,-7L,-8,-8L 268435456-BIT (4194304 - WORD BY 64-BIT)SynchronousDRAM DQM Read Mask @BL=4 CL=3 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 CLK /CS /RAS tRCD /CAS /WE CKE DQM read latency=2 DQM A0-7 X A10 X Y Y Y 0 0 0 X A8,9,11 0 BA0,1 masked Q0 DQ ACT#0 READ#0 Q0 Q0 Q0 READ#0 masked Q0 Q0 Q0 READ#0 Italic parameter indicates minimum case MIT-DS-0338-0.0 MITSUBISHI ELECTRIC ( 51 / 55 ) 17.Sep.1999 Preliminary Spec. MITSUBISHI LSIs Some contents are subject to change without notice. MH4S64DBKG -7,-7L,-8,-8L 268435456-BIT (4194304 - WORD BY 64-BIT)SynchronousDRAM Power Down 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 CLK /CS /RAS /CAS /WE Standby Power Down Active Power Down CKE CKE latency=1 DQM A0-7 X A10 X A8,9,11 X BA0,1 0 DQ Precharge All ACT#0 Italic parameter indicates minimum case MIT-DS-0338-0.0 MITSUBISHI ELECTRIC ( 52 / 55 ) 17.Sep.1999 Preliminary Spec. MITSUBISHI LSIs Some contents are subject to change without notice. MH4S64DBKG -7,-7L,-8,-8L 268435456-BIT (4194304 - WORD BY 64-BIT)SynchronousDRAM CLK Suspend @BL=4 CL=3 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 CLK /CS /RAS tRCD /CAS /WE CKE CKE latency=1 CKE latency=1 DQM A0-7 X A10 X A8,9,11 X BA0,1 0 Y Y 0 0 D0 DQ ACT#0 D0 D0 D0 WRITE#0 READ#0 CLK suspended Q0 Q0 Q0 Q0 CLK suspended Italic parameter indicates minimum case MIT-DS-0338-0.0 MITSUBISHI ELECTRIC ( 53 / 55 ) 17.Sep.1999 Preliminary Spec. MITSUBISHI LSIs Some contents are subject to change without notice. MH4S64DBKG -7,-7L,-8,-8L 268435456-BIT (4194304 - WORD BY 64-BIT)SynchronousDRAM OUTLINE 31.75 20.00 4.00 MIT-DS-0338-0.0 6.00 MITSUBISHI ELECTRIC ( 54 / 55 ) 17.Sep.1999 Preliminary Spec. MITSUBISHI LSIs Some contents are subject to change without notice. MH4S64DBKG -7,-7L,-8,-8L 268435456-BIT (4194304 - WORD BY 64-BIT)SynchronousDRAM Keep safety first in your circuit designs! Mitsubishi Electric Corporation puts the maximum effort into making semiconductor products better and more reliable,but there is always the possibility that trouble may occur with them. Trouble with semiconductors consideration to safety when making your circuit designs,with appropriate measures such as (i) placement of substitutive,auxiliary circuits,(ii) use of non-flammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1.These materials are intended as a reference to assist our customers in the selection of the Mitsubishi semiconductor product best suited to the customer's application;they do not convey any license under any intellectual property rights,or any other rights,belonging to Mitsubishi Electric Corporation or a third party. 2.Mitsubishi Electric Corporation assumes no responsibility for any damage, or infringement of any third-party's rights,originating in the use of any product data,diagrams,charts or circuit application examples contained in these materials. 3.All information contained in these materials,including product data, diagrams and charts,represent information on products at the time of publication of these materials,and are subject to change by Mitsubishi Electric Corporation without notice due to product improvements or other reasons. It is therefore recommended that customers contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor for the latest product information before purchasing a product listed herein. 4.Mitsubishi Electric Corporation semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor when considering the use of a product contained herein for special applications,such as apparatus or systems for transportation, vehicular,medical,aerospace,nuclear,or undersea repeater use. 5.The prior written approval of Mitsubishi Electric Corporation is necessary to reprint or reproduce in whole or in part these materials. 6.If these products or technologies are subject the Japanese export control restrictions,they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 7.Please contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor for further details on these materials or the products contained therein. MIT-DS-0338-0.0 MITSUBISHI ELECTRIC ( 55 / 55 ) 17.Sep.1999