ML401 The Communications Edge TM 1.7–2.2 GHz High IP3 Mixer with Integrated LO Amp Product Features Product Information Product Description Functional Diagram • High dynamic range mixer with integrated LO driver • +31 dBm Input IP3 • 8 dB Conversion Loss • RF: 1700 – 2200 MHz • LO: 1550 – 2150 MHz • IF: 50 – 250 MHz • 0 dBm Drive Level • RoHS-compliant SOIC-8 pkg The ML401 high linearity upconverter or downconverter combines a passive GaAs MESFET mixer with an integrated HBT LO driver in a low-cost leadfree/green/RoHS-compliant SOIC-8 package. WJ’s ML401 uses patented techniques to realize +31 dBm Input IP3 with 8 dB conversion loss using an LO drive level of 0 dBm in a downconverting application. The on-chip diplexer in the mixers allows for good matching on the RF and IF ports. The dual-stage LO driver provides a stable input power level into the mixer to allow for consistent performance over a wide range of LO power levels. Applications Typical applications include frequency up/down conversion, modulation and demodulation for receivers and transmitters used in 2.5G and 3G GSM/CDMA/W-CDMA systems in the DCS, PCS, or UMTS frequency bands. • 2.5/3G GSM/CDMA/WCDMA • DCS/PCS-band Mobile Infrastructure LO 1 8 RF GND 2 7 GND Vcc1 3 6 GND Vcc2 4 5 IF The backside paddle is Ground. Specifications (1) Parameter RF Frequency Range LO Frequency Range IF Frequency Range SSB Conversion Loss Input IP3 (2) Input P1dB LO – RF Isolation (3) LO – IF Isolation (3) RF – IF Isolation Return Loss: RF Port Return Loss: IF Port Return Loss: LO Port LO Drive Level Operating Supply Voltage Operating Current (4) 1. 2. 3. 4. Units MHz MHz MHz dB dBm dBm dB dB dB dB dB dB dBm V mA Min -2.5 Typ 1700 – 1800 1550 – 1750 50 – 150 8.2 +31 +17 9 27 19 16 25 15 0 +5 102 Max Min +28 2.5 -2.5 85 Typ 1800 – 2000 1600 – 1950 50 – 250 8.2 +30 +19 8 27 20 16 25 15 0 +5 105 Max Min 9 2.5 135 -2.5 Typ 2000 – 2200 1750 – 2150 50 – 250 8.2 +30 +20 8 27 21 16 25 15 0 +5 110 Max 2.5 Min / max limits are tested for the mixer in downconverting application with a low-side LO at 0 dBm at 25 °C with RF/IF = 1800/50, 2000/50, and 1800/200 MHz. IIP3 is measured with Δf = 1 MHz with RFin = 0 dBm / tone. LO is injected with 0 dBm. This refers to the operating current under LO drive. The current can be reduced by increasing the value of the R2 resistor slightly. Absolute Maximum Rating Parameter Operating Case Temperature Storage Temperature DC Voltage LO Power Input IF / RF Power Rating -40 to +85 °C -55 to +150 °C +5.5 V +10 dBm +20 dBm Ordering Information Part No. Description ML401-G 1.7–2.2 GHz High IP3 Mixer w/ Integrated LO Amp ML401-PCB Full Assembled Evaluation Board (lead-free/green/RoHS-compliant SOIC-8 package) Operation of this device above any of these parameters may cause permanent damage. Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com Page 1 of 4 June 2006 ML401 The Communications Edge TM 1.7–2.2 GHz High IP3 Mixer with Integrated LO Amp Product Information Typical Downconversion Performance Plots Performance using the circuitry on the ML401-PCB Evaluation Board R1 is shown in the silkscreen but is not required for the ML401. A 0Ω jumper is placed in this spot on the PCB. Conversion Loss vs RF Frequency vs IF Frequency Input IP3 vs RF Frequency vs IF Frequency +25 °C, LO = 0 dBm, low-side LO +25 °C, LO = 0 dBm, low-side LO 9 32 Input IP3 (dBm) 34 Conversion Loss (dB) 10 8 7 IF=50MHz IF=150MHz IF=250MHz 6 5 1700 1750 1800 1850 IF=100MHz IF=200MHz 1900 1950 2000 30 28 IF=50MHz IF=150MHz IF=250MHz 26 24 1700 1750 1800 RF Frequency (MHz) Conversion Loss vs RF Frequency vs Temperature 8 7 6 1750 1800 1850 +25 °C 1900 +85 °C 1950 8 7 6 -40 °C 2000 1750 RF Frequency (MHz) Conversion Loss vs RF Frequency vs LO Power 1850 1900 +85 °C 1950 2000 1800 1850 1900 RF Frequency (MHz) -40 °C 1750 1950 2000 1850 1900 +85 °C 1950 2000 Conversion Loss vs RF Frequency vs LO Power +25 °C, IF = 250 MHz, low-side LO 10 9 8 7 LO = -3 dBm LO = 0 dBm LO = 3 6 5 1700 1800 +25 °C RF Frequency (MHz) Conversion Loss (dB) LO = -3 dBm LO = 0 dBm LO = 3 dBm Conversion Loss (dB) 8 1750 6 +25 °C, IF = 150 MHz, low-side LO 9 6 7 5 1700 10 7 8 Conversion Loss vs RF Frequency vs LO Power +25 °C, IF = 50 MHz, low-side LO Conversion Loss (dB) 1800 +25 °C 9 RF Frequency (MHz) 10 5 1700 LO = 0 dBm, IF = 250 MHz, low-side LO 9 5 1700 2000 10 Conversion Loss (dB) 9 Conversion Loss (dB) Conversion Loss (dB) 10 1950 Conversion Loss vs RF Frequency vs Temperature LO = 0 dBm, IF = 150 MHz, low-side LO 10 -40 °C 1900 RF Frequency (MHz) Conversion Loss vs RF Frequency vs Temperature LO = 0 dBm, IF = 50 MHz, low-side LO 5 1700 1850 IF=100MHz IF=200MHz 1750 1800 1850 1900 1950 2000 9 8 7 LO = -3 dBm LO = 0 dBm LO = 3 dBm 6 5 1700 1750 1800 1850 1900 1950 2000 RF Frequency (MHz) RF Frequency (MHz) Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com Page 2 of 4 June 2006 ML401 The Communications Edge TM 1.7–2.2 GHz High IP3 Mixer with Integrated LO Amp Product Information Typical Downconversion Performance Plots (cont’d) Performance using the circuitry on the ML401-PCB Evaluation Board Input IP3 vs RF Frequency vs Temperature Input IP3 vs RF Frequency vs Temperature 32 30 28 26 1800 1850 1900 30 28 26 +85 °C 1950 -40 °C 24 1700 2000 1750 1800 +25 °C 1850 1900 30 28 26 +85 °C 1950 -40 °C 24 1700 2000 1900 1950 Input IP3 vs RF Frequency vs LO Power Input IP3 vs RF Frequency vs LO Power Input IP3 vs RF Frequency vs LO Power +25 °C, IF = 50 MHz, low-side LO +25 °C, IF = 150 MHz, low-side LO 32 32 28 LO = -3 dBm LO = 0 dBm LO = 3 dBm 26 1750 1800 1850 1900 1950 30 28 LO = -3 dBm LO = 0 dBm LO = 3 dBm 26 24 1700 2000 1750 RF Frequency (MHz) 1800 1850 1900 RF Return Loss vs LO Frequency 24 1700 2000 IF Return Loss (dB) IF = 50 MHz IF = 150 MHz IF = 250 MHz -15 -20 1850 1900 1950 -20 100 150 200 1700 1800 1900 2000 LO Frequency (MHz) R-I Isolation vs LO Frequency 25 10 5 R-I Isolation (dB) L-I Isolation (dB) 15 1900 -20 Referenced with LO = 0 dBm 20 1800 -15 -25 1600 250 35 +25 °C 2000 -10 L-I Isolation vs LO Frequency Referenced with LO = 0 dBm 1950 -5 IF Frequency (MHz) L-R Isolation vs LO Frequency 1900 +25 °C -40 50 1850 LO Return Loss vs LO Frequency -30 2000 25 1700 1800 0 LO = 1550 MHz LO = 1650 MHz LO = 1750 MHz LO = 1850 MHz -10 RF Frequency (MHz) -40 °C 1750 RF Frequency (MHz) -50 1800 LO = -3 dBm LO = 0 dBm LO = 3 dBm 26 +25 °C, LO = 0 dBm 0 1750 28 IF Return Loss vs IF Frequency +25 °C, LO = 0 dBm -10 1950 30 RF Frequency (MHz) 0 -5 Input IP3 (dBm) 32 30 2000 +25 °C, IF = 250 MHz, low-side LO 34 0 1600 1850 RF Frequency (MHz) 34 -25 1700 1800 +85 °C RF Frequency (MHz) 34 24 1700 1750 +25 °C RF Frequency (MHz) LO Return Loss (dB) Input IP3 (dBm) 1750 +25 °C Input IP3 (dBm) 32 Input IP3 (dBm) 32 24 1700 RF Return Loss (dB) LO = 0 dBm, IF = 250 MHz, low-side LO 34 -40 °C L-R Isolation (dB) Input IP3 vs RF Frequency vs Temperature LO = 0 dBm, IF = 150 MHz, low-side LO 34 Input IP3 (dBm) Input IP3 (dBm) LO = 0 dBm, IF = 50 MHz, low-side LO 34 30 25 20 15 +85 °C -40 °C 10 1600 2000 1700 LO Frequency (MHz) +25 °C 1800 20 15 10 5 -40 °C +85 °C 1900 2000 0 1800 1850 1900 1950 +25 °C 2000 +85 °C 2050 2100 LO Frequency (MHz) LO Frequency (MHz) Input P1dB vs RF Frequency IF = 100 MHz, low-side LO at 0 dBm Input P1dB (dBm) 22 20 18 16 14 -40 °C 12 1700 1750 1800 +25 °C 1850 +85 °C 1900 1950 2000 RF Frequency (MHz) Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com Page 3 of 4 June 2006 ML401 The Communications Edge TM 1.7–2.2 GHz High IP3 Mixer with Integrated LO Amp Product Information ML401-G Mechanical Information This package is lead-free/green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free (maximum 260 °C reflow temperature) and lead (maximum 245 °C reflow temperature) soldering processes. Product Marking Outline Drawing The component will be lasermarked with a “ML401-G” product label with an alphanumeric lot code on the top surface of the package. Tape and reel specifications for this part will be located on the website in the “Application Notes” section. ESD / MSL Information ESD Rating: Value: Test: Standard: Class 1B Passes 500V to <1000V Human Body Model (HBM) JEDEC Standard JESD22-A114 ESD Rating: Value: Test: Standard: Class IV Passes 1000V Charged Device Model (CDM) JEDEC Standard JESD22-C101 MSL Rating: Level 2 at +260 °C convection reflow Standard: JEDEC Standard J-STD-020 Functional Pin Layout Mounting Configuration / Land Pattern LO 1 8 RF GND 2 7 GND Vcc1 3 6 GND Vcc2 4 5 IF The backside paddle is Ground. Pin 1 2 3 4 5 6 7 8 1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”) diameter drill and have a final plated thru diameter of .25 mm (.010”). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. All dimensions are in millimeters (inches). Angles are in degrees. 5. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 6. RF trace width depends upon the PC board material and construction. 7. Use 1 oz. Copper minimum. Function LO GND Vcc1 Vcc2 IF GND GND RF Backside paddle is RF and DC ground. Thermal Specifications Parameter Rating Operating Case Temperature Thermal Resistance, Rth -40 to +85 °C 104 °C / W Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com Page 4 of 4 June 2006