MOC8111M, MOC8112M, MOC8113M 6-Pin DIP Optocoupler for Power Supply Applications (No Base Connection) Features Description ■ High isolation voltage The MOC811XM series consists of a Gallium Arsenide IRED coupled with an NPN phototransistor. The base of the transistor is not bonded to an external pin for improved noise immunity. ■ ■ ■ ■ ■ 7500 VAC Peak—1 second High BVCEO minimum 70 Volts Current transfer ratio in selected groups: MOC8111M: 20% min. MOC8112M: 50% min. MOC8113M: 100% min. Maximum switching time in saturation specified Underwriters Laboratory (UL) recognized (File #E90700, Vol. 2) IEC60747-5-2 approved (ordering option V) tm Applications ■ Power supply regulators ■ Digital logic inputs ■ Microprocessor inputs ■ Appliance sensor systems ■ Industrial controls Packages Schematic ANODE 1 6 N/C 6 6 CATHODE 2 1 5 COLLECTOR 1 N/C 3 4 EMITTER 6 1 ©2007 Fairchild Semiconductor Corporation MOC8111M, MOC8112M, MOC8113M Rev. 1.0.0 www.fairchildsemi.com MOC8111M, MOC8112M, MOC8113M 6-Pin DIP Optocoupler for Power Supply Applications (No Base Connection) September 2007 Symbol Parameter Value Unit 260 mW 3.5 mW/°C TOTAL DEVICE PD Total Device Power Dissipation @ TA = 25°C Derate above 25°C TOPR Ambient Operating Temperature Range -40 to +100 °C TSTG Storage Temperature Range -40 to +150 °C TSOL Lead Soldering Temperature (Wave Solder) (1/16" from case, 10 sec. duration) 260 °C Forward Current – Continuous 90 mA Forward Current – Peak (PW = 1µs, 300pps) 3 A VR Reverse Voltage 6 V PD LED Power Dissipation @ TA = 25°C INPUT LED IF IF(pk) Derate above 25°C 135 mW 1.8 mW/°C 200 mW 2.67 mW/°C OUTPUT TRANSISTOR PD Detector Power Dissipation @ TA = 25°C Derate above 25°C ©2007 Fairchild Semiconductor Corporation MOC8111M, MOC8112M, MOC8113M Rev. 1.0.0 www.fairchildsemi.com 2 MOC8111M, MOC8112M, MOC8113M 6-Pin DIP Optocoupler for Power Supply Applications (No Base Connection) Absolute Maximum Ratings (TA = 25°C Unless otherwise specified.) Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Individual Component Characteristics Symbol Parameter Test Conditions Min. Typ. Max. Unit 1.35 1.65 V 1.15 1.50 EMITTER VF Input Forward Voltage IF = 60mA VR Reverse Voltage IR = 10µA CJ Capacitance IF = 10mA IR Reverse Leakage Current 6.0 15 V VF = 0V, f = 1.0MHz 50 pF VF = 1V, f = 1.0MHz 65 VR = 3.0V .35 10 µA DETECTOR BVCEO Breakdow Voltage, Collector to Emitter IC = 1.0mA, IF = 0 70 V BVECO Breakdow Voltage, Emitter to Collector IE = 100µA, IF = 0 7 V ICEO Leakage Current, Collector to Emitter VCE = 10V, IF = 0 5 CCE Capacitance, Collector to Emitter VCE = 0 V, f = 1MHz 8 50 V pF Isolation Characteristics Symbol Characteristic Test Conditions VISO Input-Output Isolation Voltage f = 60Hz, t = 1 sec. CISO Isolation Capacitance VI-O = 0, f = 1MHz Min. Typ. Max. 7500 Units VAC(PK) 0.5 pF Transfer Characteristic Symbol Characteristics Test Conditions Device Min. MOC8111M 20 MOC8112M 50 MOC8113M 100 Typ. Max. Units DC CHARACTERISTICS CTR Output/Input Current Transfer Ratio VCE(SAT) Collector-Emitter Saturation Voltage IF = 10mA, VCE = 5V % IF = 10mA, IC = 2.5mA All 0.27 0.4 V RL = 100Ω, IC = 2mA, VCC = 10V, See Figure 7 All 6.0 10 µs All 5.5 10 µs IF = 20mA, VCE = 0.4V MOC8111M 3.0 5.5 µs IF = 10mA, VCE = 0.4V MOC812M/3M 4.2 8.0 AC CHARACTERISTICS Non-Saturated Switching Times ton Turn-On Time toff Turn-Off Time Saturated Switching Times ton tr toff tf Turn-On Time Rise-Time Turn-Off Time Fall-Time ©2007 Fairchild Semiconductor Corporation MOC8111M, MOC8112M, MOC8113M Rev. 1.0.0 IF = 20mA, VCE = 0.4V MOC8111M 2.0 4.0 IF = 10mA, VCE = 0.4V MOC812M/3M 3.0 6.0 IF = 20mA, VCE = 0.4V MOC8111M 18 34 IF = 10mA, VCE = 0.4V MOC812M/3M 23 39 IF = 20mA, VCE = 0.4V MOC8111M 11 20 IF = 10mA, VCE = 0.4V MOC812M/3M 14 24 µs µs µs www.fairchildsemi.com 3 MOC8111M, MOC8112M, MOC8113M 6-Pin DIP Optocoupler for Power Supply Applications (No Base Connection) Electrical Characteristics (TA = 25°C Unless otherwise specified.) Fig. 1 LED Forward Voltage vs. Forward Current Fig. 2 Normalized CTR vs. Forward Current 1.8 1.4 TA = 25°C VCE = 5.0 V Normalized to IF = 10 mA 1.2 1.6 1.0 NORMALIZED CTR VF - FORWARD VOLTAGE (V) 1.7 1.5 TA = -55°C 1.4 1.3 1.2 0.8 0.6 0.4 TA = 25°C 0.2 1.1 TA = 100°C 1.0 0.0 1 10 100 0 5 IF - LED FORWARD CURRENT (mA) VCE (sat) - COLLECTOR-EMITTER SATURATION VOLTAGE (V) 1.6 NORMALIZED CTR IF = 5 mA 1.2 IF = 10 mA 1.0 0.8 IF = 20 mA 0.6 0.4 -75 Normalized to IF = 10 mA TA = 25°C -50 -25 0 25 50 75 100 125 TA - AMBIENT TEMPERATURE (°C) 20 Fig. 4 Collector Emitter Saturation Voltage vs Collector Current 100 10 1 IF = 2.5 mA 0.1 IF = 20 mA 0.01 IF = 5 mA IF = 10 mA TA = 25°C 0.001 0.01 0.1 1 10 IC - COLLECTOR CURRENT (mA) Fig. 5 Switching Speed vs. Load Resistor Fig. 6 Dark current vs. Ambient Temperature. 1000 ICEO - COLLECTOR-EMITTER DARK CURRENT (µA) 1e+1 IF = 10 mA VCC = 10 V TA = 25°C SWITCHING SPEED - (µs) 15 IF - FORWARD CURRENT (mA) Fig. 3 Normalized CTR vs. Ambient Temperature 1.4 10 100 Toff Tf 10 Ton 1 Tr 0.1 VCE = 10V 1e+0 1e-1 1e-2 1e-3 1e-4 1e-5 1e-6 0.1 1 10 100 0 R-LOAD RESISTOR (kΩ) ©2007 Fairchild Semiconductor Corporation MOC8111M, MOC8112M, MOC8113M Rev. 1.0.0 25 50 75 100 125 TA - AMBIENT TEMPERATURE (°C) www.fairchildsemi.com 4 MOC8111M, MOC8112M, MOC8113M 6-Pin DIP Optocoupler for Power Supply Applications (No Base Connection) Typical Performance Characteristics WAVE FORMS VCC = 10V INPUT PULSE IF IC INPUT RL = 100Ω 10% OUTPUT OUTPUT PULSE 90% tr ton tf toff Adjust IF to produce IC = 2 mA Figure 7. Switching Time Test Circuit and Waveforms ©2007 Fairchild Semiconductor Corporation MOC8111M, MOC8112M, MOC8113M Rev. 1.0.0 www.fairchildsemi.com 5 MOC8111M, MOC8112M, MOC8113M 6-Pin DIP Optocoupler for Power Supply Applications (No Base Connection) TEST CIRCUIT Through Hole Surface Mount 0.350 (8.89) 0.320 (8.13) 0.350 (8.89) 0.320 (8.13) 0.260 (6.60) 0.240 (6.10) 0.070 (1.77) 0.040 (1.02) 0.260 (6.60) 0.240 (6.10) 0.070 (1.77) 0.040 (1.02) 0.320 (8.13) 0.014 (0.36) 0.010 (0.25) 0.200 (5.08) 0.115 (2.93) 0.320 (8.13) 0.014 (0.36) 0.010 (0.25) 0.200 (5.08) 0.115 (2.93) 0.100 (2.54) 0.015 (0.38) 0.012 (0.30) 0.008 (0.20) 0.025 (0.63) 0.020 (0.51) 0.020 (0.50) 0.016 (0.41) 0.100 (2.54) 0.390 (9.90) 0.332 (8.43) 0.100 [2.54] 15° 0.035 (0.88) 0.012 (0.30) 0.020 (0.50) 0.016 (0.41) 0.012 (0.30) Recommend Pad Layout for Surface Mount Leadform 0.4" Lead Spacing 0.350 (8.89) 0.320 (8.13) 0.070 (1.78) 0.060 (1.52) 0.260 (6.60) 0.240 (6.10) 0.425 (10.79) 0.070 (1.77) 0.040 (1.02) 0.100 (2.54) 0.305 (7.75) 0.030 (0.76) 0.014 (0.36) 0.010 (0.25) 0.200 (5.08) 0.115 (2.93) 0.100 (2.54) 0.015 (0.38) 0.020 (0.50) 0.016 (0.41) 0.012 (0.30) 0.008 (0.21) 0.100 [2.54] 0.425 (10.80) 0.400 (10.16) Note: All dimensions are in inches (millimeters). ©2007 Fairchild Semiconductor Corporation MOC8111M, MOC8112M, MOC8113M Rev. 1.0.0 www.fairchildsemi.com 6 MOC8111M, MOC8112M, MOC8113M 6-Pin DIP Optocoupler for Power Supply Applications (No Base Connection) Package Dimensions Option Example Part Number Description No Suffix MOC8111M S MOC8111SM Through Hole SR2 MOC8111SR2M T MOC8111TM 0.4" Lead Spacing VDE 0884 Surface Mount Lead Bend Surface Mount; Tape and Reel V MOC8111VM TV MOC8111TVM IEC60747-5-2 (VDE), 0.4" Lead Spacing SV MOC8111SVM IEC60747-5-2 (VDE), Surface Mount SR2V MOC8111SR2VM IEC60747-5-2 (VDE), Surface Mount, Tape and Reel Marking Information 1 MOC8111M 2 X YY Q 6 V 3 5 4 Definitions 1 Fairchild logo 2 Device number 3 VDE mark (Note: Only appears on parts ordered with VDE option – See order entry table) 4 One digit year code, e.g., ‘7’ 5 Two digit work week ranging from ‘01’ to ‘53’ 6 Assembly package code ©2007 Fairchild Semiconductor Corporation MOC8111M, MOC8112M, MOC8113M Rev. 1.0.0 www.fairchildsemi.com 7 MOC8111M, MOC8112M, MOC8113M 6-Pin DIP Optocoupler for Power Supply Applications (No Base Connection) Ordering Information 12.0 ± 0.1 4.5 ± 0.20 2.0 ± 0.05 Ø1.5 MIN 4.0 ± 0.1 0.30 ± 0.05 1.75 ± 0.10 11.5 ± 1.0 21.0 ± 0.1 9.1 ± 0.20 Ø1.5 ± 0.1/-0 10.1 ± 0.20 0.1 MAX 24.0 ± 0.3 User Direction of Feed Note: All dimensions are in millimeters. Reflow Profile 300 260°C 280 260 >245°C = 42 Sec 240 220 200 180 °C Time above 183°C = 90 Sec 160 140 120 1.822°C/Sec Ramp up rate 100 80 60 40 33 Sec 20 0 0 60 120 180 270 360 Time (s) ©2007 Fairchild Semiconductor Corporation MOC8111M, MOC8112M, MOC8113M Rev. 1.0.0 www.fairchildsemi.com 8 MOC8111M, MOC8112M, MOC8113M 6-Pin DIP Optocoupler for Power Supply Applications (No Base Connection) Tape Dimensions ACEx® Build it Now™ CorePLUS™ CROSSVOLT™ CTL™ Current Transfer Logic™ EcoSPARK® ® Fairchild® Fairchild Semiconductor® FACT Quiet Series™ FACT® FAST® FastvCore™ FPS™ FRFET® Global Power ResourceSM Power247® POWEREDGE® Power-SPM™ PowerTrench® Programmable Active Droop™ QFET® QS™ QT Optoelectronics™ Quiet Series™ RapidConfigure™ SMART START™ SPM® STEALTH™ SuperFET™ SuperSOT™-3 SuperSOT™-6 Green FPS™ Green FPS™ e-Series™ GTO™ i-Lo™ IntelliMAX™ ISOPLANAR™ MegaBuck™ MICROCOUPLER™ MicroFET™ MicroPak™ MillerDrive™ Motion-SPM™ OPTOLOGIC® OPTOPLANAR® ® PDP-SPM™ Power220® SuperSOT™-8 SyncFET™ The Power Franchise® TinyBoost™ TinyBuck™ TinyLogic® TINYOPTO™ TinyPower™ TinyPWM™ TinyWire™ µSerDes™ UHC® UniFET™ VCX™ DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Advance Information Formative or In Design This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Definition Preliminary First Production This datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. No Identification Needed Full Production This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild Semiconductor. The datasheet is printed for reference information only. Rev. I31 ©2007 Fairchild Semiconductor Corporation MOC8111M, MOC8112M, MOC8113M Rev. 1.0.0 www.fairchildsemi.com 9 MOC8111M, MOC8112M, MOC8113M 6-Pin DIP Optocoupler for Power Supply Applications (No Base Connection) TRADEMARKS The following are registered and unregistered trademarks and service marks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.