Dynex MP03/260-10 Dual diode module Datasheet

MP03 XX 260 Series
MP03 XX 260 Series
Dual Diode Modules
Replaces December 1998 version, DS5104-2.0
DS5104-3.0 January 2000
FEATURES
KEY PARAMETERS
VRRM
1600V
IFSM
8100A
267A
IF(AV) (per arm)
Visol
2500V
■ Dual Device Module
■ Electrically Isolated Package
■ Pressure Contact Construction
■ International Standard Footprint
CIRCUIT OPTIONS
■ Alumina (non-toxic) Isolation Medium
Code
APPLICATIONS
Circuit
HB
■ Rectifier Bridges
■ DC Power Bridges
G
■ Plating Rectifiers
■ Traction Systems
GN
VOLTAGE RATINGS
Type
Number
Conditions
Repetitive
Peak
Voltages
VRRM
MP03/260-16
1600
MP03/260-14
1400
MP03/260-12
1200
MP03/260-10
1000
PACKAGE OUTLINE
Tvj = 150oC
IRM = 30mA
VRSM = VRRM + 100V
Lower voltage grades available. For full description of part
numbers see "Ordering instructions" on page 3.
Module outline type code: MP03.
See Package Details for further information.
CURRENT RATINGS - PER ARM
Parameter
Symbol
IF(AV)
IF(RMS)
Mean forward current
RMS value
Max.
Units
Tcase = 75oC
267
A
Tcase = 85oC
240
A
Theatsink = 75oC
235
A
Theatsink = 85oC
211
A
420
A
Conditions
Halfwave, resistive load
Tcase = 75oC
1/9
MP03 XX 260 Series
SURGE RATINGS - PER ARM
Symbol
IFSM
Parameter
Surge (non-repetitive) forward current
Max.
Units
8100
A
6500
A
328000
A2s
211000
A2s
Max.
Units
dc
0.21
o
C/W
halfwave
0.22
o
C/W
3 phase
0.23
o
C/W
Mounting torque = 5Nm
with mounting compound
0.05
o
Conditions
V =0
10ms half sine; R
Tj = 150˚C
VR = 50% VRRM
VR = 0
I2t
10ms half sine;
Tj = 150˚C
VR = 50% VRRM
I2t for fusing
THERMAL & MECHANICAL RATINGS
Parameter
Symbol
Rth(j-c)
Rth(c-hs)
Thermal resistance - junction to case
per Diode
Thermal resistance - case to heatsink
per Diode
Conditions
C/W
Tvj
Virtual junction temperature
150
o
Tsto
Storage temperature range
-40 to 150
o
Visol
Isolation voltage
Commoned terminals to base plate
AC RMS, 1min, 50Hz
C
C
2.5
kV
Max.
Units
CHARACTERISTICS
Symbol
Conditions
VFM
Forward voltage
At 600A, Tcase = 25oC
1.3
V
IRM
Peak reverse current
At VRRM, Tj = 150oC
30
mA
Threshold voltage
At Tvj = 150oC
0.84
V
On-state slope resistance
At Tvj = 150oC
0.667
mΩ
VTO
rT
2/9
Parameter
MP03 XX 260 Series
ORDERING INSTRUCTIONS
Part number is made up as follows:
MP03 HB 260 - 16
MP
03
HB
260
16
= Pressure contact module
= Outline type
= Circuit configuration code (see "circuit options" - front page)
= Nominal average current rating at Tcase = 75oC
= VRRM/100
Examples:
MP03 HB260-10
MP03 G260-14
MP023GN260-12
Note: Preferred type is HB configuration. G & GN types are available for specific applications, only when requested.
MOUNTING RECOMMENDATIONS
Adequate heatsinking is required to maintain the base
temperature at 75oC if full rated current is to be achieved.
Power dissipation may be calculated by use of VTO and rT
information in accordance with standard formulae. We can
provide assistance with calculations or choice of heatsink
if required.
The heatsink surface must be smooth and flat; a surface
finish of N6 (32µin) and a flatness within 0.05mm (0.002")
are recommended.
Immediately prior to mounting, the heatsink surface should
be lightly scrubbed with fine emery, Scotch Brite or a mild
chemical etchant and then cleaned with a solvent to
remove oxide build up and foreign material. Care should
be taken to ensure no foreign particles remain.
An even coating of thermal compound (eg. Unial) should be
applied to both the heatsink and module mounting surfaces.
This should ideally be 0.05mm (0.002") per surface to
ensure optimum thermal performance.
After application of thermal compound, place the module
squarely over the mounting holes, (or 'T' slots) in the
heatsink. Using a torque wrench, slowly tighten the
recommended fixing bolts at each end, rotating each in turn
no more than 1/4 of a revolution at a time. Continue until the
required torque of 5Nm (44lb.ins) is reached at both ends.
It is not acceptable to fully tighten one fixing bolt before
starting to tighten the others. Such action may DAMAGE the
module.
3/9
MP03 XX 260 Series
CURVES
2500
Instantaneous forward current IF - (A)
2000
1500
1000
500
0
0.5
Tj = 150˚C
1.0
1.5
2.0
Instantaneous forward voltage IF - (V)
Fig. 1 Maximum (limit) forward characteristics (Per diode)
Thermal Impedance - (˚C/W)
0.3
Rth(j-hs)
0.2
Rth(j-c)
0.1
0
0.001
0.010
0.100
Time - (s)
1.0
Fig. 2 Transient thermal impedance (DC) - (Per diode)
4/9
10
100
MP03 XX 260 Series
12500
22
I2t
10000
20
18
7500
16
5000
14
2500
0
I2t value - A2s x 104
Peak half sine wave forward current - (A)
15000
12
1
10
ms
1
2 3 5
10
10
20 30 50
cycles at 50Hz
Duration
Fig. 3 Surge (non-repetitive) forward current vs time (with 0% VRRM, Tcase = 150˚C)
5/9
MP03 XX 260 Series
500
d.c.
On-state power loss per device - (W)
450
400
180˚ Rectangular
180˚ Sine
350
120˚ Rectangular
300
60˚ Rectangular
250
200
150
100
50
0
0
50
100
150
200
250
Mean forward current - (A)
300
350
400
425
Fig. 4 On-state power loss per arm vs forward current at various conduction angles, 50/60Hz
140
120
100
20
0
0
50
100
150
200
250
Forward current - (A)
d.c.
180˚ Rectangular
40
180˚ Sine
60
120˚ Rectangular
80
60˚ Rectangular
Maximum permissible case temperature - (˚C)
160
300
350
400
Fig. 5 Maximum permissible case temperature vs forward current per arm at various conduction angles, 50/60Hz
6/9
425
MP03 XX 260 Series
1400
0.04
0.02 0.01 Rth(hs-a) ˚C/W
R- Load
1200
Total power - (W)
1000 0.08
L- Load
800
0.10
0.12
0.15
0.20
600
400
0.30
0.40
200
00
40
80 100 120 140
20
60
Maximum ambient temperature - (˚C)
0
200
400
D.C. output current - (A)
600
Fig. 6 50/60Hz single phase bridge dc output current vs power loss and maximum permissible ambient temperature for
various values of heatsink thermal resistance.
(Note: Rth(hs-a) values given above are true heatsink thermal resistances to ambient and already account for Rth(c-hs) module contact thermal).
1400
1200
0.08
0.04
0.02 0.01 Rth(hs-a) ˚C/W
R & L - Load
Total power - (W)
1000
800
0.10
0.12
600
0.15
0.20
400 0.30
200
00
0.40
40
80 100 120 140
20
60
Maximum ambient temperature - (˚C)
160
0
200
400
D.C. output current - (A)
500
Fig. 7 50/60Hz 3- phase bridge dc output current vs power loss and maximum permissible ambient temperature for various
values of heatsink thermal resistance.
(Note: Rth(hs-a) values given above are true heatsink thermal resistances to ambient and already account for Rth(c-hs) module contact thermal).
7/9
MP03 XX 260 Series
PACKAGE DETAILS
For further package information, please contact your local Customer Service Centre. All dimensions in mm, unless stated otherwise.
DO NOT SCALE.
42.5
35
28.5
5
18
50
38
4 holes Ø5.5
80
2x M8
2
3
32
52
1
92
Recommended fixings for mounting:
Recommended mounting torque:
Recommended torque for electrical connections:
Maximum torque for electrical connections:
Nominal weight: 950g
Module outline type code: MP03
CIRCUIT CONFIGURATIONS
1
2
3
HB
1
2
3
2
3
G
1
GN
8/9
M5 socket head cap screws.
5Nm (44lb.ins)
8Nm (70lb.ins)
9Nm (80lb.ins)
MP03 XX 260 Series
http://www.dynexsemi.com
e-mail: [email protected]
HEADQUARTERS OPERATIONS
DYNEX SEMICONDUCTOR LTD
Doddington Road, Lincoln.
Lincolnshire. LN6 3LF. United Kingdom.
Tel: 00-44-(0)1522-500500
Fax: 00-44-(0)1522-500550
DYNEX POWER INC.
Unit 7 - 58 Antares Drive,
Nepean, Ontario, Canada K2E 7W6.
Tel: 613.723.7035
Fax: 613.723.1518
Toll Free: 1.888.33.DYNEX (39639)
CUSTOMER SERVICE CENTRES
France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50
North America Tel: 011-800-5554-5554. Fax: 011-800-5444-5444
UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
SALES OFFICES
France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50
Germany Tel: 07351 827723
North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) /
Tel: (831) 440-1988. Fax: (831) 440-1989 / Tel: (949) 733-3005. Fax: (949) 733-2986.
UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
These offices are supported by Representatives and Distributors in many countries world-wide.
© Dynex Semiconductor 2000 Publication No. DS5104-3 Issue No. 3.0 January 2000
TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM
Datasheet Annotations:
Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.
Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change.
Advance Information: The product design is complete and final characterisation for volume production is well in hand.
No Annotation: The product parameters are fixed and the product is available to datasheet specification.
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as
a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves
the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such
methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication
or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury
or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request.
All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.
9/9
Similar pages