E2E0010-38-94
¡ Semiconductor
MSM6351/6351L
¡ Semiconductor
This version:
Sep. 1998
MSM6351/6351L
Previous version: Mar. 1996
Built-in 8 or 5 bit Serial Port and LCD Driver 4-Bit Microcontroller
GENERAL DESCRIPTION
The MSM6351/6351L is a low-power microcontroller manufactured in silicon gate CMOS
technology. Integrated into a single chip are ROM, RAM, five I/O ports, serial I/O port, timebase counter, LCD driver, three interrupts, crystal oscillator, and voltage tripler.
The MSM6351/6351L, which can drive LCD display with higher-count segments, is best suited
to battery powered applications, such as watches and game machines.
The built-in 8-bit or 5-bit serial port provides a data communication capability with external
machines.
FEATURES
• Low power consumption
• Large capacity memory
• ROM
: 4096 words ¥ 15 bits
• RAM
: 1024 words ¥ 4 bits
• I/O port
Input-output port
: 5 ports ¥ 4 bits (input or output can be specified for each port)
• 62 LCD drivers (1/3 duty or 1/4 duty is selectable. Up to 232 segments can be displayed)
• Single 1.5 V power supply operation (MSM6351)
Can be changed to 3.0 V specification by mask option (MSM6351L).
• Melody function
• Built-in watchdog timer
• Built-in 8-bit or 5-bit serial port (asynchronous or synchronous selectable)
• 32.768 kHz crystal oscillator
• Package options:
100-pin plastic QFP (QFP100-P-1420-0.65-K) (Product name :MSM6351-¥¥GS-K/
MSM6351L-¥¥GS-K)
100-pin plastic QFP (QFP100-P-1420-0.65-L) (Product name :MSM6351-¥¥GS-L/
MSM6351L-¥¥GS-L)
100-pin plastic QFP (QFP100-P-1420-0.65-BK) (Product name :MSM6351-¥¥GS-BK/
MSM6351L-¥¥GS-BK)
Chip
¥¥ indicates a code number.
1/17
SCLK
A-Bus
P0.0
P0.1
P0.2
P0.3
PORT0
P1.0
P1.1
P1.2
P1.3
PORT1
P01C
P00C
FLAG
SCNT SCND
ALU
P2¥C
P2.0 to P23
EIRT IRQRT IEXM0 IEXM1 IEXM2
FRMT
4096¥15Bits
PROGRAM COUNTER(PC)
PORT4
PROGRAM
ROM
IRQEX
DATA
RAM
WORK
INTERRUPT CONTROL
PAGE
WATCHDOG
TIMER
P1¥C
BANK
P3¥C
CAP1
CAP0
CAPF
PORT3
P4.0
P4.1
P4.2
P4.3
P4¥C
WDOG1
P3.0
P3.1
P3.2
P3.3
P02C
S-Bus
D-Bus
WDOG0
PORT2
P2.0
P2.1
P2.2
P2.3
P03C
SBFF u
SBFF l
ACC
SERIAL
I/O
¡ Semiconductor
SOUT
BLOCK DIAGRAM
SIN
1024¥4Bits
VDD
TMOUT
XT
XT
INSTRUCTION
REGISTER
OSC
INSTRUCTION
DECODER
MELODY
TEMP0
SYSTEM
CLOCK
GENERATOR
LCD CT
2/17
VCP VCM
LCD DRIVER
BD
SEG0
SEG1
SEG2
SEG3
SEG61
VOLTAGE
REGURATOR
CONVERTER
VSS1
VSS2
VSS3
VEE
MSM6351/6351L
STACK
RESET
TEST1
TEST2
TEST3
MPX
ADDER
TIME BASE COUNTER
MDTL MDTH
XTOUT
¡ Semiconductor
MSM6351/6351L
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
TEST3
TEST2
TEST1
RESET
P4.3
P4.2
P4.1
P4.0
P3.3
P3.2
P3.1
P3.0
P2.3
P2.2
P2.1
P2.0
P0.3
P0.2
P0.1
P0.0
PIN CONFIGURATION (TOP VIEW)
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
SEG61
SEG60
SEG59
SEG58
SEG57
SEG56
SEG55
SEG54
SEG53
SEG52
SEG51
SEG50
SEG49
SEG48
SEG47
SEG46
SEG45
SEG44
SEG43
SEG42
SEG41
SEG40
SEG39
SEG38
SEG37
SEG36
SEG35
SEG34
SEG33
SEG32
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
SEG30
P1.3
P1.2
P1.1
P1.0
BD
XTOUT
XT
XT
VDD
VSS3
VSS2
VSS1
VEE
VCP
VCM
SOUT
SIN
SCLK
SEG31
SEG0
SEG1
SEG2
SEG3
SEG4
SEG5
SEG6
SEG7
SEG8
SEG9
SEG10
SEG11
SEG12
SEG13
SEG14
SEG15
SEG16
SEG17
SEG18
SEG19
SEG20
SEG21
SEG22
SEG23
SEG24
SEG25
SEG26
SEG27
SEG28
SEG29
100-Pin Plastic QFP
3/17
¡ Semiconductor
MSM6351/6351L
PIN DESCRIPTIONS
Symbol
Type
Description
P0.0
• 4-bit I/O port 0
P0.1
The input (*) /output, the existence (*) /
absence of pull-down resistance, and the
HALT function release enable/disable (*)
condition can be selected for each bit.
PORT0
P0.2
P0.3
P1.0 to P1.3
P2.0
P2.1
PORT1
• 4-bit I/O port 1
I/O
PORT2
• 4-bit I/O port 2
P3.0 to P3.3
PORT3
• 4-bit I/O port 3
P4.0 to P4.3
PORT4
• 4-bit I/O port 4
P2.2
I/O Circuitry
Capture
trigger
signal
P2.3
The input (*) /output, External
the existence (*) /
interrupt
absence of pull-down signal
resistance, and the
HALT function
release enable/
disable (*) condition
can be selected for
each port.
A
• Oscillator clock output.
XTOUT
O
XT
O
XT
I
RESET
I
The oscillator clock is output when XTF (bit 3 of port P00C) is set
E
to "1".
• Oscillator connection pins.
B
• Reset input.
This is an input with a pull-down resistor. The system is reset when
C
"1" is input.
TEST1
TEST2
I
TEST3
SIN
I
• Test input.
This is an input with a pull-down resistor.
• Serial port data input.
D
F
• Serial port data output. When the port is not in an output state,
SOUT
O
this pin is set at high-impedance level, except when HZOUT
G
(bit 3 of port P2XC) =1 and transmitting data.
• Serial port clock input/output.
SCLK
I/O
BD
O
The input/output (*) is switched by the serial port control register
SCNT. In the output mode, the serial clock frequency can be selected
H
from the demultiplied signal (1/1, 1/2 or 1/4 of the system clock).
• Melody output (buzzer drive output).
I
• LCD drive output with 1/3 bias and 1/3 duty, or 1/3 bias and 1/4 duty.
The duty can be switched by LCD control register LCDCNT.
SEG0 to SEG61
O
A maximum of 177 segments can be displayed when using 1/3 duty
—
and 232 when using 1/4 duty.
*
Means system reset conditions.
4/17
¡ Semiconductor
MSM6351/6351L
PIN DESCRIPTIONS (continued)
Symbol
Description
I/O Circuitry
VDD
• 0 V power supply pin
—
VSS1
• –1.5 V power supply pin (for 1.5 V operation)
—
VSS2
• –3.0 V power supply pin (for 3.0 V operation)
—
VSS3
• –4.5 V power supply pin
—
VEE
• Internal logic power supply pin
—
• Internal voltage converter capacitor connecting pin
—
VCM
VCP
Circuitry on Input/Output Pins
A. Input/output port
CMOS inverter
3-state CMOS buffer
Note:
I/O
VSS:
1.5 V operationÆVSS1
3.0 V operationÆVSS2
VSS
10 kW
(Standard)
VSS
Output enable
Pull-down enable
VSS
B. Oscillator
Note
a
I
XT
VDD
VEE
c
VEE
VDD
O
XT
b
a
b
c
5/17
¡ Semiconductor
MSM6351/6351L
Circuitry on Input/Output Pins (continued)
H. SCLK input/output
C. RESET input
CMOS
Schmitt trigger
buffer
I
I/O
VSS
VSS
VSS
Output enable
VSS
D. TEST input
I. BD output
I
VDD
VSS
Output
resistor
control
O
VSS
E. XTOUT output
VSS
O
VSS
F. SIN input
I
VSS
G. SOUT output
O
VSS
Output enable
6/17
¡ Semiconductor
MSM6351/6351L
ABSOLUTE MAXIMUM RATINGS (MSM6351 (1.5 V Battery), BUF = "0")
VDD = 0 V (VSS1 = Battery Voltage)
Parameter
Power Supply Voltage
Symbol
Condition
—
Input Voltage
VIN
Output Voltage *1
VO1
Output Voltage *2
VO2
Storage Temperature
TSTG
Rating
Unit
–6.0 to +0.3
Ta = 25°C
VSS1 – 0.3 to VSS1 + 0.3
VSS1 – 0.3 to VSS1 + 0.3
V
–6.0 to +0.3
—
–55 to +125
°C
*1 Normal output
*2 LCD driver output
RECOMMENDED OPERATING CONDITIONS (MSM6351 (1.5 V Battery), BUF = "0")
Parameter
VDD = 0 V (VSS1 = Battery Voltage)
Range
Unit
Symbol
Condition
Operating Voltage
Vop
BUF = "0"
–1.75 to –1.25
V
Operating Temperature
Top
—
–20 to +70
°C
Operating Frequency
fOSC
—
32.768
kHz
7/17
¡ Semiconductor
MSM6351/6351L
ELECTRICAL CHARACTERISTICS (MSM6351 (1.5 V Battery), BUF = "0")
VDD = 0 V, VSS1 = –1.5 V (Battery Voltage), VSS2 = –3.0 V, VSS3 = –4.5 V, fOSC = 32.768 kHz, CX = 35 pF, Ta = 25°C
Parameter
Symbol
Condition
Min. Typ. Max. Unit Applied Pin
Power Supply Current
Voltage for Oscillation Start
Output Current 1
Common/Segment
Output
*1 *2
—
3.0
—
mA
—
–VOSC
Within 2 sec.
—
—
1.4
V
—
–IOH1
VOH = –0.2 V
4
—
—
ΩIOMH1Ω
VOMH = VSS1 ±0.2 V
4
—
—
ΩIOML1Ω
VOML = VSS2 ±0.2 V
4
—
—
mA
SEG0
to
SEG61
–IOL1
VOL = –4.3 V
4
—
—
–IOH2
VO = –0.5 V
150
—
—
IOL2
VO = –1.0 V
150
—
—
–IOH3
VO = –0.5 V
7
—
—
IOL3
VO = –1.0 V
VI = 0 V
I/O input
With pull-down resistor
20
—
—
75
150 300
mA
—
—
1
PORT0 to
mA PORT4,
SCLK, SIN,
SOUT
—
4
—
mA RESET
IDD
Output Current 2
Output Current 3
Input Current 1
Input Leakage Current
Input Current 3
Input Voltage
–IIH1
ΩIIL2Ω
–IIH3
VI = 0 V, –1.5 V
I/O input
Without pull-down resistor
VI = 0 V
With pull-down resistor
–VIH
—
—
—
0.3
–VIL
—
1.2
—
—
PORT0 to
*3,
mA PORT4
SOUT, SCLK,
XTOUT
mA BD
V
PORT0
to
PORT4
All input pins
*1 This value depends on program.
*2 BUF = "0"
*3 PORT0 = P0.0 to P0.3, PORT1 = P1.0 to P1.3, PORT2 = P2.0 to P2.3, PORT3 = P3.0 to P3.3,
PORT4 = P4.0 to P4.3
8/17
¡ Semiconductor
MSM6351/6351L
ABSOLUTE MAXIMUM RATINGS (MSM6351L (3.0 V Battery), Halver used (BUF = "0"))
VDD = 0 V (VSS2 = Battery Voltage)
Parameter
Power Supply Voltage
Symbol
Condition
—
Input Voltage
VIN
Output Voltage *1
VO1
Output Voltage *2
VO2
Storage Temperature
TSTG
Rating
Unit
–6.0 to +0.3
Ta = 25°C
VSS2 – 0.3 to VSS2 + 0.3
VSS2 – 0.3 to VSS2 + 0.3
V
–6.0 to +0.3
—
–55 to +125
°C
*1 Normal output
*2 LCD driver output
RECOMMENDED OPERATING CONDITIONS
(MSM6351L (3.0 V Battery), Halver used (BUF = "0"))
VDD = 0 V (VSS2 = Battery Voltage)
Parameter
Symbol
Condition
Operating Voltage
Vop
Range
Halver used (BUF = "0")
–3.5 to –2.6
V
Operating Temperature
Top
—
–20 to +70
°C
Operating Frequency
fOSC
—
32.768
kHz
Unit
9/17
¡ Semiconductor
MSM6351/6351L
ELECTRICAL CHARACTERISTICS (MSM6351L (3.0 V Battery), Halver used (BUF="0"))
VDD = 0 V, VSS1 = –1.5 V, VSS2 = –3.0 V (Battery Voltage), VSS3 = –4.5 V, fOSC = 32.768 kHz, CX = 35 pF, Ta = 25°C
Parameter
Symbol
Condition
Min. Typ. Max. Unit Applied Pin
Power Supply Current
Voltage for Oscillation Start
Output Current 1
Common/Segment
Output
IDD
–VOSC
–IOH1
*1 *2
—
1.5
—
mA
—
Within 2 sec.
—
—
2.4
V
—
mA
SEG0
to
SEG61
VOH = –0.2 V
4
—
—
ΩIOMH1Ω
VOMH = VSS1 ±0.2 V
4
—
—
ΩIOML1Ω
VOML = VSS2 ±0.2 V
4
—
—
–IOL1
VOL = –4.3 V
4
—
—
–IOH2
VO = –0.5 V
500
—
—
–IOL2
VO = –2.5 V
500
—
—
–IOH3
VO = –0.5 V
7
—
—
–IOL3
VO = –2.5 V
VI = 0 V
I/O input
With pull-down resistor
20
—
—
150
300
600
—
—
1
PORT0 to
mA PORT4,
SCLK, SIN,
SOUT
—
25
—
mA RESET
—
—
0.5
2.5
—
—
Output Current 2
Output Current 3
Input Current 1
Input Leakage Current
Input Current 3
Input Voltage
–IIH1
ΩIIL2Ω
–IIH3
–VIH
–VIL
VI = 0 V, –3 V
I/O input
Without pull-down resistor
VI = 0 V
With pull-down resistor
—
—
PORT0 to
*3,
mA PORT4
SOUT, SCLK,
XTOUT
mA BD
mA
V
PORT0
to
PORT4
All input pins
*1 This value depends on program.
*2 When 3 V battery with halver is used (BUF = "0")
*3 PORT0 = P0.0 to P0.3, PORT1 = P1.0 to P1.3, PORT2 = P2.0 to P2.3, PORT3 = P3.0 to P3.3,
PORT4 = P4.0 to P4.3
10/17
¡ Semiconductor
MSM6351/6351L
ABSOLUTE MAXIMUM RATINGS (MSM6351L (3.0 V Battery), Halver not used (BUF = "1"))
VDD = 0 V (VSS2 = Battery Voltage)
Parameter
Power Supply Voltage
Symbol
Condition
—
Input Voltage
VIN
Output Voltage *1
VO1
Output Voltage *2
VO2
Storage Temperature
TSTG
Rating
Unit
–6.0 to +0.3
Ta = 25°C
VSS2 – 0.3 to +0.3
VSS2 – 0.3 to +0.3
V
–6.0 to +0.3
—
–55 to +125
°C
*1 Normal output
*2 LCD driver output
RECOMMENDED OPERATING CONDITIONS
(MSM6351L (3.0 V Battery), Halver not used (BUF = "1"))
VDD = 0 V (VSS2 = Battery Voltage)
Parameter
Symbol
Condition
Range
Unit
Vop
Halver not used (BUF = "1")
–3.5 to –2.2
V
Operating Temperature
Top
—
–20 to +70
°C
Operating Frequency
fOSC
32.768
kHz
Operating Voltage
—
11/17
¡ Semiconductor
MSM6351/6351L
ELECTRICAL CHARACTERISTICS (MSM6351L (3.0 V Battery), Halver not used (BUF="1"))
VDD = 0 V, VSS1 = –1.5 V, VSS2 = –3.0 V (Battery Voltage), VSS3 = –4.5 V, fOSC = 32.768 kHz, CX = 35 pF, Ta = 25°C
Parameter
Symbol
Condition
Min. Typ. Max. Unit Applied Pin
Power Supply Current
Voltage for Oscillation Start
Output Current 1
Common/Segment
Output
*1 *2
—
3.0
—
mA
—
–VOSC
Within 2 sec.
—
—
2.4
V
—
–IOH1
VOH = –0.2 V
4
—
—
ΩIOMH1Ω
VOMH = VSS1 ±0.2 V
4
—
—
ΩIOML1Ω
VOML = VSS2 ±0.2 V
4
—
—
mA
SEG0
to
SEG61
–IOL1
VOL = –4.3 V
4
—
—
–IOH2
VO = –0.5 V
500
—
—
–IOL2
VO = –2.5 V
500
—
—
–IOH3
VO = –0.5 V
7
—
—
VO = –2.5 V
VI = 0 V
I/O input
With pull-down resistor
20
—
—
150
300
600
—
—
1
PORT0 to
mA PORT4,
SCLK, SIN,
SOUT
—
25
—
mA RESET
IDD
Output Current 2
Output Current 3
Input Current 1
Input Leakage Current
Input Current 3
Input Voltage
–IOL3
–IIH1
ΩIIL2Ω
–IIH3
VI = 0 V, –3 V
I/O input
Without pull-down resistor
VI = 0 V
With pull-down resistor
–VIH
—
—
—
0.5
–VIL
—
2.5
—
—
PORT0 to
*3,
mA PORT4
SOUT, SCLK,
XTOUT
mA BD
mA
V
PORT0
to
PORT4
All input pins
*1 This value depends on program.
*2 When halver is not used (BUF = "1")
*3 PORT0 = P0.0 to P0.3, PORT1 = P1.0 to P1.3, PORT2 = P2.0 to P2.3, PORT3 = P3.0 to P3.3,
PORT4 = P4.0 to P4.3
12/17
¡ Semiconductor
MSM6351/6351L
INSTRUCTION LIST
Flag operation instruction Rotate instruction
Bit manipulation instruction
Arithmetic operation instruction
Mnemonic
Instruction code
Description
14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Machine
cycle
ADD ACC, REG1
0 0 0 0 0 0 P 0 1 0 0 r3 r2 r1 r0
(rP), (ACC), (Z), (C)¨(rP) + (ACC)
1
ADD #i, REG1
0 0 1 1 0 0 P i3 i2 i1 i0 r3 r2 r1 r0
(rP), (ACC), (Z), (C)¨(rP) +i
1
ADC REG1
0 0 0 0 0 0 P 0 1 0 1 r3 r2 r1 r0
(rP), (ACC), (Z), (C)¨decimal adj [(rP) + (ACC) + (C)]
1
ADCN REG1
0 1 1 0 0 0 P N3 N2 N1 N0 r3 r2 r1 r0
(rP), (ACC), (Z), (C)¨N adjust [(rP) + (C)]
1
SUB ACC, REG1
0 0 0 0 0 1 P 0 1 0 0 r3 r2 r1 r0
(rP), (ACC), (Z), (C)¨(rP) + (ACC)
1
SUB #i, REG1
0 0 1 1 0 1 P i3 i2 i1 i0 r3 r2 r1 r0
(rP), (ACC), (Z), (C)¨(rP) –i
1
SBC REG1
0 0 0 0 0 1 P 0 1 0 1 r3 r2 r1 r0
(rP), (ACC), (Z), (C)¨decimal adj [(rP) – (ACC) – (C)]
1
SBCN REG1
0 1 1 0 0 1 P N3 N2 N1 N0 r3 r2 r1 r0
(rP), (ACC), (Z), (C)¨N adjust [(rP) – (C)]
1
CMP ACC, REG1
0 0 0 0 0 1 P 1 1 1 0 r3 r2 r1 r0
(Z), (C)¨(rP) – (ACC)
1
CMP #i, REG1
0 0 1 0 1 1 P i3 i2 i1 i0 r3 r2 r1 r0
(Z), (C)¨(rP) – i
1
INC REG1
0 0 0 0 0 0 P 0 0 0 1 r3 r2 r1 r0
(rP), (ACC), (Z), (C)¨(rP) +1
1
INCD REG2
1 0 0 0 b1 b0 0 P3 P2 P1 P0 r3 r2 r1 r0
(rPb), (ACC), (Z), (C)¨(rPb) +1
1
DEC REG1
0 0 0 0 0 1 P 0 0 0 1 r3 r2 r1 r0
(rP), (ACC), (Z), (C)¨(rP) –1
1
DECD REG2
1 0 0 1 b1 b0 0 P3 P2 P1 P0 r3 r2 r1 r0
(rPb), (ACC), (Z), (C)¨(rPb) –1
1
BIT ACC, REG1
0 0 0 0 0 0 P 1 1 1 0 r3 r2 r1 r0
(Z)¨(rP3) (ACC3) (rP2) (ACC2) (rP1) (ACC1)
1
(rP0) (ACC0)
BIT #i, REG1
0 0 1 0 1 0 P i3 i2 i1 i0 r3 r2 r1 r0
(Z)¨(rP3) i3 (rP2) i2 (rP1) i1 (rP0) i0
1
BIS ACC, REG1
0 0 0 0 0 0 P 0 1 1 0 r3 r2 r1 r0
(rP), (ACC), (Z)¨(rP) (ACC)
1
BIS #i, REG1
0 0 1 0 0 0 P i3 i2 i1 i0 r3 r2 r1 r0
(rP), (ACC), (Z)¨(rP) i
1
BIC ACC, REG1
0 0 0 0 0 1 P 0 1 1 0 r3 r2 r1 r0
(rP), (ACC), (Z)¨(rP) (ACC)
1
BIC #1, REG1
0 0 1 0 0 1 P i3 i2 i1 i0 r3 r2 r1 r0
(rP), (ACC), (Z)¨(rP)
1
XOR ACC, REG1
0 0 0 0 0 0 P 0 1 1 1 r3 r2 r1 r0
(rP), (ACC), (Z)¨(rP) (ACC)
1
XOR #1, REG1
0 0 1 1 1 1 P i3 i2 i1 i0 r3 r2 r1 r0
(rP), (ACC), (Z)¨(rP)
1
i
i
ROR REG1
0 0 0 0 0 0 P 0 0 1 0 r3 r2 r1 r0
(Z), (ACC)¨[ Æ(C)Æ(rP)Æ ]
1
ROL REG1
0 0 0 0 0 1 P 0 0 1 0 r3 r2 r1 r0
(Z), (ACC)¨[ ¨(C)¨(rP)¨ ]
1
ASR REG1
0 0 0 0 0 0 P 0 0 1 1 r3 r2 r1 r0
(Z), (ACC)¨[OÆ(rP)Æ(C)]
1
ASL REG1
0 0 0 0 0 1 P 0 0 1 1 r3 r2 r1 r0
(Z), (ACC)¨[(C)¨(rP)¨O]
1
CLG
0 0 0 0 0 0 0 1 0 0 0 0 0 0 0
(G)¨O
1
CLC
0 0 0 0 0 0 0 1 0 0 1 0 0 0 0
(C)¨O
1
CLZ
0 0 0 0 0 0 0 1 0 1 0 0 0 0 0
(Z)¨O
1
CLA
0 0 0 0 0 0 0 1 0 1 1 0 0 0 0
(Z), (C), (G)¨O
1
SEG
0 0 0 0 0 1 0 1 0 0 0 0 0 0 0
(G)¨1
1
SEC
0 0 0 0 0 1 0 1 0 0 1 0 0 0 0
(C)¨1
1
SEZ
0 0 0 0 0 1 0 1 0 1 0 0 0 0 0
(Z)¨1
1
SEA
0 0 0 0 0 1 0 1 0 1 1 0 0 0 0
(Z), (C), (G)¨1
1
13/17
¡ Semiconductor
MSM6351/6351L
INSTRUCTION LIST (continued)
Subroutine Data transfer instruction
instruciton
Mnemonic
Instruction code
Machine
cycle
Description
14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
MOV ACC, REG1
0 0 0 0 0 0 P 1 1 1 1 r3 r2 r1 r0
(rP)¨(ACC)
MOVD ACC, REG2
1 0 1 0 b1 b0 0 P3 P2 P1 P0 r3 r2 r1 r0
(rPb)¨(ACC)
MOV #i, REG1
0 0 1 1 1 0 P i3 i2 i1 i0 r3 r2 r1 r0
(rP), (ACC), (Z)¨i
MOV REG1, ACC
0 0 0 0 0 1 P 1 1 1 1 r3 r2 r1 r0
(ACC), (Z)¨(rP)
MOVD REG2, ACC
1 0 1 1 b1 b0 0 P3 P2 P1 P0 r3 r2 r1 r0
(ACC), (Z)¨(rPb)
1
1
When P=0
in bit 8,
N=n+1;
when P=1,
N=–n.
1
1
1
EXG REG1
0 0 0 0 0 1 P 0 0 0 0 r3 r2 r1 r0
(rP)´(ACC)
1
EXGD REG2
0 1 1 1 b1 b0 0 P3 P2 P1 P0 r3 r2 r1 r0
(rPb)´(ACC)
1
CALL adrs
1 1 1 a11 a10 a9 a8 a7 a6 a5 a4 a3 a2 a1 a0
(STACK)¨(PC), (PC)¨a11 to a0, (SP)¨(SP)+1
1
RET
0 0 0 0 0 0 0 1 1 0 0 0 0 0 0
(PC)¨(STACK)+1, (SP)¨(SP)–1
1
RTI
0 0 0 0 0 1 0 1 1 0 0 0 0 0 0
(PC)¨(STACK)+1, (SP)¨(SP)–1 (at INT routine)
1
JMP adrs
1 1 0 a11 a10 a9 a8 a7 a6 a5 a4 a3 a2 a1 a0
(PC)¨a11 to a0
1
AMP @ REG1
0 0 0 0 0 0 0 1 1 0 1 r3 r2 r1 r0
(PC)¨(PC)+(rP)+1
1
JMPO @ REG1
0 0 0 0 0 1 0 1 1 0 1 r3 r2 r1 r0
(PC)¨(PC)+7 (rP)+1
1
BGT n
0 0 0 0 1 1 P 0 0 1 n4 n3 n2 n1 n0
if (G)=1
1
then (PC)¨(PC)+N else (PC)¨(PC)+1
if (G)=0
BLE n
0 0 0 0 1 1 P 1 0 1 n4 n3 n2 n1 n0
1
then (PC)¨(PC)+N else (PC)¨(PC)+1
if (C)=1
Jump instruction
BCS n
0 0 0 0 1 1 P 0 0 0 n4 n3 n2 n1 n0
1
then (PC)¨(PC)+N else (PC)¨(PC)+1
if (C)=0
BCC n
0 0 0 0 1 1 P 1 0 0 n4 n3 n2 n1 n0
1
then (PC)¨(PC)+N else (PC)¨(PC)+1
if (Z)=1
BEQ n (BZE n)
0 0 0 0 1 1 P 0 1 0 n4 n3 n2 n1 n0
1
then (PC)¨(PC)+N else (PC)¨(PC)+1
if (Z)=0
BNE n (BNZ n)
0 0 0 0 1 1 P 1 1 0 n4 n3 n2 n1 n0
1
then (PC)¨(PC)+N else (PC)¨(PC)+1
if {(G)=1 or (Z)=1}
BGE n
0 0 0 0 1 1 P 0 1 1 n4 n3 n2 n1 n0
1
then (PC)¨(PC)+N else (PC)¨(PC)+1
if {(G)=0 and (Z)=0}
CPU Input/output
control instruction
Display
instruction
Melody
start
BLT n
0 0 0 0 1 1 P 1 1 1 n4 n3 n2 n1 n0
1
then (PC)¨(PC)+N else (PC)¨(PC)+1
MSA adrs *
0 0 0 0 1 0 a8 a7 a6 a5 a4 a3 a2 a1 a0
Specifies the first address of note data. (E00H~FFFH)
2
DSP dig, REG1 *
0 0 0 1 0 0 P dig3 dig2 dig1 dig0 r3 r2 r1 r0
digit (Low Part)¨(rP), (ACC)
1
DSPH dig, REG1 *
0 0 0 1 0 1 P dig3 dig2 dig1 dig0 r3 r2 r1 r0
digit (High Part)¨(rP), (ACC)
1
DSPF dig, REG1 *
0 0 0 1 1 0 P dig3 dig2 dig1 dig0 r3 r2 r1 r0
digit (Low Part)¨(rP) via Table
2
DSPF dig, REG1 *
0 0 0 1 1 1 P dig3 dig2 dig1 dig0 r3 r2 r1 r0
digit (Low Part)¨(rP) via Table
2
OUT REG1, PORT
0 1 0 1 0 y4 P y3 y2 y1 y0 r3 r2 r1 r0
(PORTy)¨(rP)
1
OUT #i, PORT
0 1 0 1 1 y4 P y3 y2 y1 y0 i3 i2 i1 i0
(PORTy)¨i
1
INP PORT, REG1
0 1 0 0 0 y4 P y3 y2 y1 y0 r3 r2 r1 r0
(rP), (ACC)¨(PORTy)
1
NOP
0 0 0 0 0 0 0 0 0 0 0 0 0 0 0
NO Operation
1
HALT
0 0 0 0 0 1 0 0 1 1 1 0 0 0 0
HAIT CPU
1
14/17
¡ Semiconductor
MSM6351/6351L
PACKAGE DIMENSIONS
(Unit : mm)
QFP100-P-1420-0.65-K
Mirror finish
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
1.29 TYP.
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
15/17
¡ Semiconductor
MSM6351/6351L
(Unit : mm)
QFP100-P-1420-0.65-L
Spherical surface
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
1.29 TYP.
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
16/17
¡ Semiconductor
MSM6351/6351L
(Unit : mm)
QFP100-P-1420-0.65-BK
Mirror finish
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
1.29 TYP.
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
17/17