INDEX MX27L2000 2M-BIT [256Kx8] CMOS EPROM FEATURES • • • • • • • 256Kx 8 organization Wide power supply range, 2.7V DC to 3.6V DC +12.5V programming voltage Fast access time: 120/150/200/250 ns Totally static operation Completely TTL compatible Operating current:20mA @ 3.6V, 5MHz • Standby current: 20uA • Package type: - 32 pin ceramic DIP, plastic DIP 32 pin SOP 8x20mm 32-lead TSOP(I) 8x14mm 32-lead TSOP(I) 8x13.4mm 32-lead TSOP(I) GENERAL DESCRIPTION The MX27L2000 is a 3V only, 2M-bit, ultraviolet Erasable Programmable Read Only Memory. It is organized as 256K words by 8 bits per word, operates from a single + 3 volt supply, has a static standby mode, and features fast single address location programming. All programming signals are TTL levels, requiring a single pulse. For programming outside from the system, existing EPROM programmers may be used. The MX27L2000 supports a intelligent fast programming algorithm which can result in programming time of less than one minute. PIN CONFIGURATIONS BLOCK DIAGRAM This EPROM is packaged in industry standard 32 pin dual-in-line packages, 32 lead SOP and 32 lead TSOP(I) packages. 32 CDIP/PDIP/SOP 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 MX27L2000 VPP A16 A15 A12 A7 A6 A5 A4 A3 A2 A1 A0 Q0 Q1 Q2 GND CE PGM 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 VCC PGM A17 A14 A13 A8 A9 A11 OE A10 CE Q7 Q6 Q5 Q4 Q3 . . A0~A17 ADDRESS INPUTS 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 P/N: PM0372 MX27L2000 Y-DECODER . . OUTPUT BUFFERS . Q0~Q7 Y-SELECT . . . . X-DECODER . . . . . . 2M BIT CELL MAXTRIX . VCC VSS PIN DESCRIPTION 32 TSOP(I) (8x20mm,8x14mm,8x13.4mm) A11 A9 A8 A13 A14 A17 PGM VCC VPP A16 A15 A12 A7 A6 A5 A4 CONTROL LOGIC OE 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 OE A10 CE Q7 Q6 Q5 Q4 Q3 GND Q2 Q1 Q0 A0 A1 A2 A3 1 SYMBOL PIN NAME A0~A17 Address Input Q0~Q7 Data Input/Output CE Chip Enable Input OE Output Enable Input PGM Programmable Enable Input VPP Program Supply Voltage NC No Internal Connection VCC Power Supply Pin (+5V) GND Ground Pin REV.2.5, APR 09,1998 INDEX MX27L2000 through each address of the device. When the programming mode is completed, the data in all address is verified at VCC = VPP = 5V ± 10%. FUNCTIONAL DESCRIPTION THE ERASURE OF THE MX27L2000 PROGRAM INHIBIT MODE The MX27L2000 is erased by exposing the chip to an ultraviolet light source. A dosage of 15 W seconds/cm2 is required to completely erase a MX27L2000. This dosage can be obtained by exposure to an ultraviolet lamp wavelength of 2537 Angstroms (A) - with intensity of 12,000 uW/cm2 for 15 to 20 minutes. The MX27L2000 should be directly under and about one inch from the source and all filters should be removed from the UV light source prior to erasure. Programming of multiple MX27L2000s in parallel with different data is also easily accomplished by using the Program Inhibit Mode. Except for CE and OE, all like inputs of the parallel MX27L2000 may be common. A TTL low-level program pulse applied to an MX27L2000 CE input with VPP = 12.5 ± 0.5 V and PGM LOW will program that MX27L2000. A high-level CE input inhibits the other MX27L2000s from being programmed. It is important to note that the MX27L2000, and similar devices, will be cleared for all bits of their programmed states with light sources having wavelengths shorter than 4000 A. Although erasure times will be much longer than that with UV sources at 2537 A, nevertheless the exposure to fluorescent light and sunlight will eventually erase the MX27L2000 and exposure to them should be prevented to realize maximum system reliability. If used in such an environment, the package window should be covered by an opaque label or substance. PROGRAM VERIFY MODE Verification should be performed on the programmed bits to determine that they were correctly programmed. The verification should be performed with OE and CE, at VIL, PGM at VIH, and VPP at its programming voltage. AUTO IDENTIFY MODE The auto identify mode allows the reading out of a binary code from an EPROM that will identify its manufacturer and device type. This mode is intended for use by programming equipment for the purpose of automatically matching the device to be programmed with its corresponding programming algorithm. This mode is functional in the 25°C ± 5°C ambient temperature range that is required when programming the MX27L2000. THE PROGRAMMING OF THE MX27L2000 When the MX27L2000 is delivered, or it is erased, the chip has all 2M bits in the "ONE" or HIGH state. "ZEROs" are loaded into the MX27L2000 through the procedure of programming. To activate this mode, the programming equipment must force 12.0 ± 0.5 V on address line A9 of the device. Two identifier bytes may then be sequenced from the device outputs by toggling address line A0 from VIL to VIH. All other address lines must be held at VIL during auto identify mode. For programming, the data to be programmed is applied with 8 bits in parallel to the data pins. Vcc must be applied simultaneously or before Vpp, and removed simultaneously or after Vpp. When programming an MXIC EPROM, a 0.1uF capacitor is required across Vpp and ground to suppress spurious voltage transients which may damage the device. Byte 0 ( A0 = VIL) represents the manufacturer code, and byte 1 (A0 = VIH), the device identifier code. For the MX27L2000, these two identifier bytes are given in the Mode Select Table. All identifiers for manufacturer and device codes will possess odd parity, with the MSB (Q7) defined as the parity bit. FAST PROGRAMMING The device is set up in the fast programming mode when the programming voltage VPP = 12.75V is applied, with VCC = 6.25 V and PGM = VIH (Algorithm is shown in Figure 1). The programming is achieved by applying a single TTL low level 100us pulse to the PGM input after addresses and data line are stable. If the data is not verified, an additional pulse is applied for a maximum of 25 pulses. This process is repeated while sequencing P/N: PM0372 REV.2.5, APR 09,1998 2 INDEX MX27L2000 READ MODE It is recommended that CE be decoded and used as the primary device-selecting function, while OE be made a common connection to all devices in the array and connected to the READ line from the system control bus. This assures that all deselected memory devices are in their low-power standby mode and that the output pins are only active when data is desired from a particular memory device. The MX27L2000 has two control functions, both of which must be logically satisfied in order to obtain data at the outputs. Chip Enable (CE) is the power control and should be used for device selection. Output Enable (OE) is the output control and should be used to gate data to the output pins, independent of device selection. Assuming that addresses are stable, address access time (tACC) is equal to the delay from CE to output (tCE). Data is available at the outputs tQE after the falling edge of OE, assuming that CE has been LOW and addresses have been stable for at least tACC - tQE. SYSTEM CONSIDERATIONS During the switch between active and standby conditions, transient current peaks are produced on the rising and falling edges of Chip Enable. The magnitude of these transient current peaks is dependent on the output capacitance loading of the device. At a minimum, a 0.1 uF ceramic capacitor (high frequency, low inherent inductance) should be used on each device between Vcc and GND to minimize transient effects. In addition, to overcome the voltage drop caused by the inductive effects of the printed circuit board traces on EPROM arrays, a 4.7 uF bulk electrolytic capacitor should be used between VCC and GND for each eight devices. The location of the capacitor should be close to where the power supply is connected to the array. STANDBY MODE The MX27L2000 has a CMOS standby mode which reduces the maximum VCC current to 100 uA. It is placed in CMOS standby when CE is at VCC ± 0.3 V. The MX27L2000 also has a TTL-standby mode which reduces the maximum VCC current to 1.5 mA. It is placed in TTLstandby when CE is at VIH. When in standby mode, the outputs are in a high-impedance state, independent of the OE input. TWO-LINE OUTPUT CONTROL FUNCTION To accommodate multiple memory connections, a twoline control function is provided to allow for: 1. Low memory power dissipation, 2. Assurance that output bus contention will not occur. MODE SELECT TABLE PINS MODE CE OE PGM A0 A9 VPP OUTPUTS Read VIL VIL X X X VCC DOUT Output Disable VIL VIH X X X VCC High Z Standby (TTL) VIH X X X X VCC High Z Standby (CMOS) VCC±0.3V X X X X VCC High Z Program VIL VIH VIL X X VPP DIN Program Verify VIL VIL VIH X X VPP DOUT Program Inhibit VIH X X X X VPP High Z Manufacturer Code(3) VIL VIL X VIL VH VCC C2H Device Code(3) VIL VIL X VIH VH VCC 20H 3. A1 - A8 = A10 - A17 = VIL(For auto select) 4. See DC Programming Characteristics for VPP voltage during programming. NOTES: 1. VH = 12.0 V ± 0.5 V 2. X = Either VIH or VIL P/N: PM0372 REV.2.5, APR 09,1998 3 INDEX MX27L2000 FIGURE 1. FAST PROGRAMMING FLOW CHART START ADDRESS = FIRST LOCATION VCC = 6.25V VPP = 12.75V X=0 PROGRAM ONE 100us PULSE INCREMENT X INTERACTIVE SECTION YES X = 25? NO FAIL VERIFY BYTE ? PASS NO LAST ADDRESS INCREMENT ADDRESS FAIL YES VCC = VPP = 5.25V VERIFY SECTION VERIFY ALL BYTES ? FAIL DEVICE FAILED PASS DEVICE PASSED P/N: PM0372 REV.2.5, APR 09,1998 4 INDEX MX27L2000 SWITCHING TEST CIRCUITS DEVICE UNDER TEST 1.8K ohm +5V DIODES = IN3064 OR EQUIVALENT CL 6.2K ohm CL = 100 pF including jig capacitance (30pF for MX27L2000-120, 150ns) SWITCHING TEST WAVEFORMS 2.0V 2.0V TEST POINTS AC driving levels 0.8V 0.8V OUTPUT INPUT AC TESTING: AC driving levels are 3.0V/0V for both commercial grade and industrial grade. Input pulse rise and fall times are < 10ns. 1.5V AC driving levels 1.5V TEST POINTS OUTPUT INPUT AC TESTING: (1) AC driving levels are 3.0V/0V for commercial grade and industrial grade. Input pulse rise and fall times are < 10ns. (2) For MX27L2000-12/15. P/N: PM0372 REV.2.5, APR 09,1998 5 INDEX MX27L2000 ABSOLUTE MAXIMUM RATINGS RATING VALUE Ambient Operating Temperature -40oC to 85oC Storage Temperature -65oC to 125oC Applied Input Voltage -0.5V to 7.0V Applied Output Voltage -0.5V to VCC + 0.5V VCC to Ground Potential -0.5V to 7.0V V9 & VPP -0.5V to 13.5V NOTICE: Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended period may affect reliability. NOTICE: Specifications contained within the following tables are subject to change. DC/AC Operating Conditions for Read Operation MX27L2000 Operating Temperature Commercial -12 -15 -20 -25 0°C to 70°C 0°C to 70°C 0°C to 70°C 0°C to 70°C - - -40°C to 85°C -40°C to 85°C 2.7V to 3.6V 2.7V to 3.6V 2.7V to 3.6V 2.7V to 3.6V Industrial Vcc Power Supply DC CHARACTERISTICS SYMBOL PARAMETER MIN. VOH Output High Voltage 2.4 VOL Output Low Voltage VIH Input High Voltage VIL MAX. UNIT CONDITIONS V IOH = -0.4mA, VCC=3.0V 0.4 V IOL = 2.1mA, VCC=3.0V 2.0 VCC + 0.5 V Input Low Voltage -0.3 0.8 V 2.7V < VCC < 3.6V ILI Input Leakage Current -10 10 uA VIN = 0 to 3.6V ILO Output Leakage Current -10 10 uA VOUT = 0 to 5.5V ICC3 VCC Power-Down Current 20 uA CE = VCC ± 0.3V ICC2 VCC Standby Current 0.25 mA CE = VIH ICC1 VCC Active Current 20 mA CE = VIL, f=5MHz, Iout = 0mA, VCC=3.6V IPP VPP Supply Current Read 10 uA CE = OE = VIL, VPP = VCC CAPACITANCE TA = 25oC, f = 1.0 MHz (Sampled only) SYMBOL PARAMETER TYP. MAX. UNIT CONDITIONS CIN Input Capacitance 8 12 pF VIN = 0V COUT Output Capacitance 8 12 pF VOUT = 0V CVPP VPP Capacitance 18 25 pF VPP = 0V P/N: PM0372 REV.2.5, APR 09,1998 6 INDEX MX27L2000 AC CHARACTERISTICS 27L2000-12 27L2000-15 27L2000-20 27L2000-25 MIN MIN. MAX. MIN. MAX. MIN. SYMBOL PARAMETER tACC Address to Output Delay 120 150 tCE Chip Enable to Output Delay 120 tOE tDF Output Enable to Output Delay OE High to Output Float, tOH or CE High to Output Floa Output Hold from Address, CE or OE which ever occurred first 0 MAX. 50 35 0 0 MAX. UNIT CONDITIONS 200 250 ns CE = OE =VIL 150 200 250 ns OE = VIL 65 50 100 0 120 0 ns 70 CE = VIL ns 0 0 60 0 ns DC PROGRAMMING CHARACTERISTICS TA = 25oC ± 5°C SYMBOL PARAMETER MIN. VOH Output High Voltage 2.4 VOL Output Low Voltage VIH Input High Voltage VIL MAX. UNIT CONDITIONS V IOH = -0.40mA 0.4 V IOL = 2.1mA 2.0 VCC + 0.5 V Input Low Voltage -0.3 0.8 V ILI Input Leakage Current -10 10 uA VH A9 Auto Select Voltage 11.5 12.5 V ICC3 VCC Supply Current (Program & Verify) 50 mA IPP2 VPP Supply Current(Program) 30 mA VCC1 Fast Programming Supply Voltage 6.00 6.50 V VPP1 Fast Programming Voltage 12.5 13.0 V MAX. UNIT VIN = 0 to 3.6V CE=PGM=VIL,OE=VIH AC PROGRAMMING CHARACTERISTICS TA = 25oC ± 5°C SYMBOL PARAMETER MIN. tAS Address Setup Time 2.0 us tOES OE Setup Time 2.0 us tDS Data Setup Time 2.0 us tAH Address Hold Time 0 us tDH Data Hold Time 2.0 us tDFP Output Enable to Output Float Delay 0 tVPS VPP Setup Time 2.0 tPW PGM Program Pulse Width 95 tVCS VCC Setup Time 2.0 us tCES CE Setup Time 2 us tOE Data valid from OE P/N: PM0372 130 CONDITIONS ns us 105 150 us ns REV.2.5, APR 09,1998 7 INDEX MX27L2000 WAVEFORMS READ CYCLE ADDRESS INPUTS DATA ADDRESS tACC CE tCE OE tDF DATA OUT VALID DATA tOE tOH FAST PROGRAMMING ALGORITHM WAVEFORM PROGRAM PROGRAM VERIFY VIH Addresses VIL DATA tAH Hi-z tAS DATA OUT VALID DATA IN STABLE tDS tDFP tDH VPP1 VPP VCC tVPS VCC1 VCC tVCS VCC VIH CE VIL tCES VIH PGM VIL tPW tOES tOE Max VIH OE P/N: PM0372 VIL REV.2.5, APR 09,1998 8 INDEX MX27L2000 ORDERING INFORMATION CERAMIC PACKAGE PART NO. ACCESS TIME(ns) OPERATING STANDBY CURRENT MAX.(mA) CURRENT MAX.(uA) OPERATING PACKAGE TEMPERATURE MX27L2000DC-12 120 20 20 0°C to 70°C 32 Pin DIP MX27L2000DC-15 150 20 20 0°C to 70°C 32 Pin DIP MX27L2000DC-20 200 20 20 0°C to 70°C 32 Pin DIP MX27L2000DC-25 250 20 20 0°C to 70°C 32 Pin DIP MX27L2000DI-12 120 20 20 -40°C to 85°C 32 Pin DIP MX27L2000DI-15 150 20 20 -40°C to 85°C 32 Pin DIP MX27L2000DI-20 200 20 20 -40°C to 85°C 32 Pin DIP MX27L2000DI-25 250 20 20 -40°C to 85°C 32 Pin DIP ACCESS TIME(ns) OPERATING STANDBY OPERATING PACKAGE CURRENT MAX.(mA) CURRENT MAX.(uA) PLASTIC PACKAGE PART NO. TEMPERATURE MX27L2000PC-12 120 20 20 0°C to 70°C 32 Pin DIP MX27L2000MC-12 120 20 20 0°C to 70°C 32 Pin SOP MX27L2000TC-12 120 20 20 0°C to 70°C 8x20mm 32 Pin TSOP(I) MX27L2000PC-15 150 20 20 0°C to 70°C 32 Pin DIP MX27L2000MC-15 150 20 20 0°C to 70°C 32 Pin SOP MX27L2000TC-15 150 20 20 0°C to 70°C 8x20mm 32 Pin TSOP(I) MX27L2000PC-20 200 20 20 0°C to 70°C 32 Pin DIP MX27L2000MC-20 200 20 20 0°C to 70°C 32 Pin SOP MX27L2000TC-20 200 20 20 0°C to 70°C 8x20mm 32 Pin TSOP(I) MX27L2000PC-25 250 20 20 0°C to 70°C 32 Pin DIP MX27L2000MC-25 250 20 20 0°C to 70°C 32 Pin SOP MX27L2000TC-25 250 20 20 0°C to 70°C 8x20mm 32 Pin TSOP(I) MX27L2000PI-12 120 20 20 -40°C to 85°C 32 Pin DIP MX27L2000MI-12 120 20 20 -40°C to 85°C 32 Pin SOP MX27L2000TI-12 120 20 20 -40°C to 85°C 8x20mm 32 Pin TSOP(I) MX27L2000PI-15 150 20 20 -40°C to 85°C 32 Pin DIP MX27L2000MI-15 150 20 20 -40°C to 85°C 32 Pin SOP MX27L2000TI-15 150 20 20 -40°C to 85°C 8x20mm 32 Pin TSOP(I) MX27L2000PI-20 200 20 20 -40°C to 85°C 32 Pin DIP MX27L2000MI-20 200 20 20 -40°C to 85°C 32 Pin SOP MX27L2000TI-20 200 20 20 -40°C to 85°C 8x20mm 32 Pin TSOP(I) MX27L2000PI-25 250 20 20 -40°C to 85°C 32 Pin DIP MX27L2000MI-25 250 20 20 -40°C to 85°C 32 Pin SOP MX27L2000TI-25 250 20 20 -40°C to 85°C 8x20mm 32 Pin TSOP(I) P/N: PM0372 REV.2.5, APR 09,1998 9 INDEX MX27L2000 PLASTIC PACKAGE PART NO. ACCESS TIME(ns) OPERATING STANDBY CURRENT MAX.(mA) CURRENT MAX.(uA) OPERATING PACKAGE TEMPERATURE MX27L2000T2C-12 120 20 20 0°C to 70°C 8x14mm 32 Pin TSOP(I) MX27L2000T2C-15 150 20 20 0°C to 70°C 8x14mm 32 Pin TSOP(I) MX27L2000T2C-20 200 20 20 0°C to 70°C 8x14mm 32 Pin TSOP(I) MX27L2000T2C-25 250 20 20 0°C to 70°C 8x14mm 32 Pin TSOP(I) MX27L2000T2I-12 120 20 20 -40°C to 85°C 8x14mm 32 Pin TSOP(I) MX27L2000T2I-15 150 20 20 -40°C to 85°C 8x14mm 32 Pin TSOP(I) MX27L2000T2I-20 200 20 20 -40°C to 85°C 8x14mm 32 Pin TSOP(I) MX27L2000T2I-25 250 20 20 -40°C to 85°C 8x14mm 32 Pin TSOP(I) MX27L2000T3C-12 120 20 20 0°C to 70°C 8x13.4mm 32 Pin TSOP(I) MX27L2000T3C-15 150 20 20 0°C to 70°C 8x13.4mm 32 Pin TSOP(I) MX27L2000T3C-20 200 20 20 0°C to 70°C 8x13.4mm 32 Pin TSOP(I) MX27L2000T3C-25 250 20 20 0°C to 70°C 8x13.4mm 32 Pin TSOP(I) MX27L2000T3I-12 120 20 20 -40°C to 85°C 8x13.4mm 32 Pin TSOP(I) MX27L2000T3I-15 150 20 20 -40°C to 85°C 8x13.4mm 32 Pin TSOP(I) MX27L2000T3I-20 200 20 20 -40°C to 85°C 8x13.4mm 32 Pin TSOP(I) MX27L2000T3I-25 250 20 20 -40°C to 85°C 8x13.4mm 32 Pin TSOP(I) P/N: PM0372 REV.2.5, APR 09,1998 10 INDEX MX27L2000 PACKAGE INFORMATION 32-PIN CERDIP(MSI) WITH WINDOW (600mil) ITEM MILLIMETERS INCHES A 42.26 max 1.665 max B 1.90 ± .38 .075 ± .015 C 2.54 [TP] .100 [TP] D .46 [REF] .018 [REF] E 38.07 1.500 F 1.42 [REF] .056 [REF] G 3.43 ± .38 .135 ± .015 H .96 ± .43 .038 ± .017 I 4.06 .160 J 5.00 .203 K 15.58 ± .13 .614 ± .005 L 13.20 ± .38 .520 ± .015 M .25 [REF] .010 [REF] N ø8.12 ø.320 NOTE: 32 17 N 1 16 K L A I J H G F D C B M 0.15¡ E Each lead centerline is located within .25 mm[.01 inch] of its true position [TP] at maximum material condition. 32-PIN PLASTIC DIP(600 mil) ITEM MILLIMETERS A 42.13 max. 1.660 max. B 1.90 [REF] .075 [REF] C 2.54 [TP] .100 [TP] D .46 [Typ.] .018 [Typ.] E 38.07 1.500 F 1.27 [Typ.] .050 [Typ.] G 3.30 ± .25 .130 ± .010 H .51 [REF] .020 [REF] I 3.94 ± .25 .155 ± .010 J 5.33 max. .210 max. K 15.22 ± .25 .600 ± .010 L 13.97 ± .25 .550 ±.010 .25 [Typ.] .010 [Typ.] M NOTE: P/N: PM0372 INCHES 32 17 1 16 A F D Each lead centerline is located within .25 mm[.01 inch] of its true position [TP] at maximum material condition. K L C B I J H G M 0~15¡ E REV.2.5, APR 09,1998 11 INDEX MX27L2000 PACKAGE INFORMATION(Continued) 32-PIN PLASTIC SOP (450 mil) ITEM MILLIMETERS A 20.95 max. .825 max. B 1.00 [REF] .039 [REF] C 1.27 [TP] .050 [TP] D .40 [Typ.] .016 [Typ.] E .05 min. .002 min. F 3.05 max. .120 max. G 2.69 ± .13 .106 ±.005 H 14.12 ± .25 .556 ± .010 I 11.30 ± .13 .445 ± .005 J 1.42 .056 K .20 [Typ.] .008 [Typ.] .79 .031 L NOTE: 32 17 1 16 INCHES H A I G J F K Each lead centerline is located within .25 mm[.01 inch] of its true position [TP] at maximum material condition. E D C L B 32-PIN PLASTIC TSOP ITEM MILLIMETERS A 20.0 ± .20 .078 ±.006 B 18.40 ± .10 .724 ± .004 C 8.20 max. .323 max. D 0.15 [Typ.] .006 [Typ.] E .80 [Typ.] .031 [Typ.] F .20 ± .10 .008 ± .004 G .30 ± .10 .012 ±.004 H .50 [Typ.] .020 [Typ.] I .45 max. .018 max. J 0 ~ .20 0 ~ .008 K 1.00 ±.10 .039 ±.004 L 1.27 max. .050 max. M .50 .020 N 0 ~ 5° .500 NOTE: INCHES A B C O K L D E Each lead centerline is located within .25 mm[.01 inch] of its true position [TP] at maximum material condition. P/N: PM0372 N M F G H I J REV.2.5, APR 09,1998 12 INDEX MX27L2000 Revision History Revision No. Description 2.0 Eliminate Interactive Programming Mode. AC driving levels changed from 2.4V/0.4V to 3V/0V. 2.1 IPP 100uA --> 10uA 2.2 Add 120/150ns speed grades. 2.3 Corrected errors in the DC/AC Operating Conditions for Read Operation 2.4 Add 8x14mm and 8x13.4mm 32-TSOP(I) Packages 2.5 Change TSOP Orientation P/N: PM0372 Date 5/29/1997 8/07/1997 12/24/1997 2/5/1998 2/24/1998 4/09/1998 REV.2.5, APR 09,1998 13 INDEX MX27L2000 MACRONIX INTERNATIONAL CO., LTD. HEADQUARTERS: TEL:+886-3-578-8888 FAX:+886-3-578-8887 EUROPE OFFICE: TEL:+32-2-456-8020 FAX:+32-2-456-8021 JAPAN OFFICE: TEL:+81-44-246-9100 FAX:+81-44-246-9105 SINGAPORE OFFICE: TEL:+65-747-2309 FAX:+65-748-4090 TAIPEI OFFICE: TEL:+886-3-509-3300 FAX:+886-3-509-2200 MACRONIX AMERICA, INC. TEL:+1-408-453-8088 FAX:+1-408-453-8488 CHICAGO OFFICE: TEL:+1-847-963-1900 FAX:+1-847-963-1909 http : //www.macronix.com MACRONIX INTERNATIONAL CO., LTD. reserves the rignt to change product and specifications without notice. 14