MCNIX MX29LV320BXBC-90G 32 bit 4m x 8 / 2m x 16 ] single voltage 3v only flash memory Datasheet

MX29LV320T/B
32M-BIT [4M x 8 / 2M x 16] SINGLE VOLTAGE
3V ONLY FLASH MEMORY
FEATURES
• Low Power Consumption
- Low active read current: 10mA (typical) at 5MHz
- Low standby current: 200nA (typical)
• Minimum 100,000 erase/program cycle
• 10-year data retention
GENERAL FEATURES
• 4,194,304 x 8 / 2,097,152 x 16 switchable
• Sector Structure
- 8K-Byte x 8 and 64K-Byte x 63
• Extra 64K-Byte sector for security
- Features factory locked and identifiable, and customer lockable
• Twenty-Four Sector Groups
- Provides sector group protect function to prevent program or erase operation in the protected sector group
- Provides chip unprotect function to allow code changing
- Provides temporary sector group unprotect function
for code changing in previously protected sector groups
• Single Power Supply Operation
- 2.7 to 3.6 volt for read, erase, and program operations
• Latch-up protected to 250mA from -1V to Vcc + 1V
• Low Vcc write inhibit is equal to or less than 1.4V
• Compatible with JEDEC standard
- Pinout and software compatible to single power supply Flash
SOFTWARE FEATURES
• Erase Suspend/ Erase Resume
- Suspends sector erase operation to read data from
or program data to another sector which is not being
erased
• Status Reply
- Data polling & Toggle bits provide detection of program and erase operation completion
• Support Common Flash Interface (CFI)
HARDWARE FEATURES
• Ready/Busy (RY/BY) Output
- Provides a hardware method of detecting program
and erase operation completion
• Hardware Reset (RESET) Input
- Provides a hardware method to reset the internal state
machine to read mode
• WP/ACC input pin
- Provides accelerated program capability
PERFORMANCE
• High Performance
- Fast access time: 70/90/120ns
- Fast program time: 7us/word typical utilizing accelerate function
- Fast erase time: 1.6s/sector, 112s/chip (typical)
PACKAGE
• 48-Pin TSOP
• 48-Ball CSP
GENERAL DESCRIPTION
The MX29LV320T/B is a 32-mega bit Flash memory organized as 4M bytes of 8 bits and 2M words of 16 bits.
MXIC's Flash memories offer the most cost-effective and
reliable read/write non-volatile random access memory.
The MX29LV320T/B is packaged in 48-pin TSOP and
48-ball CSP. It is designed to be reprogrammed and
erased in system or in standard EPROM programmers.
MXIC's Flash memories augment EPROM functionality
with in-circuit electrical erasure and programming. The
MX29LV320T/B uses a command register to manage
this functionality.
MXIC Flash technology reliably stores memory
contents even after 100,000 erase and program
cycles. The MXIC cell is designed to optimize the
erase and program mechanisms. In addition, the
combination of advanced tunnel oxide processing
and low internal electric fields for erase and
programming operations produces reliable cycling.
The standard MX29LV320T/B offers access time as fast
as 70ns, allowing operation of high-speed microprocessors without wait states. To eliminate bus contention,
the MX29LV320T/B has separate chip enable (CE) and
output enable (OE) controls.
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1
MX29LV320T/B
The MX29LV320T/B uses a 2.7V to 3.6V VCC
supply to perform the High Reliability Erase and
auto Program/Erase algorithms.
modes allow sectors of the array to be erased in one
erase cycle. The Automatic Sector Erase algorithm
automatically programs the specified sector(s) prior to
electrical erase. The timing and verification of
electrical erase are controlled internally within the
device.
The highest degree of latch-up protection is
achieved with MXIC's proprietary non-epi process.
Latch-up protection is proved for stresses up to 100
milliamperes on address and data pin from -1V to
VCC + 1V.
AUTOMATIC ERASE ALGORITHM
MXIC's Automatic Erase algorithm requires the user to
write commands to the command register using standard microprocessor write timings. The device will automatically pre-program and verify the entire array. Then
the device automatically times the erase pulse width,
provides the erase verification, and counts the number
of sequences. A status bit toggling between consecutive read cycles provides feedback to the user as to the
status of the programming operation.
AUTOMATIC PROGRAMMING
The MX29LV320T/B is byte/word programmable using
the Automatic Programming algorithm. The Automatic
Programming algorithm makes the external system do
not need to have time out sequence nor to verify the
data programmed. The typical chip programming time at
room temperature of the MX29LV320T/B is less than 36
seconds.
Register contents serve as inputs to an internal statemachine which controls the erase and programming circuitry. During write cycles, the command register internally latches address and data needed for the programming and erase operations. During a system write cycle,
addresses are latched on the falling edge, and data are
latched on the rising edge of WE .
AUTOMATIC PROGRAMMING ALGORITHM
MXIC's Automatic Programming algorithm require the user
to only write program set-up commands (including 2 unlock write cycle and A0H) and a program command (program data and address). The device automatically times
the programming pulse width, provides the program verification, and counts the number of sequences. A status
bit similar to DATA polling and a status bit toggling between consecutive read cycles, provide feedback to the
user as to the status of the programming operation.
MXIC's Flash technology combines years of EPROM
experience to produce the highest levels of quality, reliability, and cost effectiveness. The MX29LV320T/B electrically erases all bits simultaneously using Fowler-Nordheim tunneling. The bytes/words are programmed by
using the EPROM programming mechanism of hot electron injection.
AUTOMATIC CHIP ERASE
During a program cycle, the state-machine will control
the program sequences and command register will not
respond to any command set. During a Sector Erase
cycle, the command register will only respond to Erase
Suspend command. After Erase Suspend is completed,
the device stays in read mode. After the state machine
has completed its task, it will allow the command register to respond to its full command set.
The entire chip is bulk erased using 50 ms erase pulses
according to MXIC's Automatic Chip Erase algorithm.
Typical erasure at room temperature is accomplished in
less than 50 seconds. The Automatic Erase algorithm
automatically programs the entire array prior to electrical erase. The timing and verification of electrical erase
are controlled internally within the device.
AUTOMATIC SECTOR ERASE
The MX29LV320T/B is sector(s) erasable using
MXIC's Auto Sector Erase algorithm. Sector erase
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2
MX29LV320T/B
PIN CONFIGURATION
48 TSOP
A15
A14
A13
A12
A11
A10
A9
A8
A19
A20
WE
RESET
NC
WP/ACC
RY/BY
A18
A17
A7
A6
A5
A4
A3
A2
A1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
MX29LV320T/B
A16
BYTE
GND
Q15/A-1
Q7
Q14
Q6
Q13
Q5
Q12
Q4
VCC
Q11
Q3
Q10
Q2
Q9
Q1
Q8
Q0
OE
GND
CE
A0
48-Ball CSP 8mm x 9mm (Ball Pitch = 0.8 mm), Top View, Balls Facing Down
A
B
C
D
E
F
G
H
6
A13
A12
A14
A15
A16
BYTE
Q15/A-1 GND
5
A9
A8
A10
A11
Q7
Q14
Q13
Q6
4
WE
RESET
NC
A19
Q5
Q12
Vcc
Q4
3
RY/BY WP/ACC
A18
A20
Q2
Q10
Q11
Q3
2
A7
A17
A6
A5
Q0
Q8
Q9
Q1
1
A3
A4
A2
A1
A0
CE
OE
GND
PIN DESCRIPTION
SYMBOL
A0~A20
Q0~Q14
Q15/A-1
CE
WE
OE
BYTE
RESET
RY/BY
VCC
WP/ACC
GND
NC
LOGIC SYMBOL
PIN NAME
Address Input
15 Data Inputs/Outputs
Q15(Data Input/Output, word mode)
A-1(LSB Address Input, byte mode)
Chip Enable Input
Write Enable Input
Output Enable Input
Word/Byte Selection Input
Hardware Reset Pin, Active Low
Read/Busy Output
3.0 volt-only single power supply
Hardware Write Protect/Acceleration
Pin
Device Ground
Pin Not Connected Internally
21
16 or 8
A0-A20
Q0-Q15
(A-1)
CE
OE
WE
RESET
BYTE
RY/BY
WP/ACC
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MX29LV320T/B
BLOCK DIAGRAM
CE
OE
WE
RESET
BYTE
WRITE
CONTROL
LOGIC
STATE
HIGH VOLTAGE
MACHINE
(WSM)
LATCH
BUFFER
STATE
MX29LV320T/B
FLASH
REGISTER
ARRAY
ARRAY
Y-DECODER
AND
X-DECODER
ADDRESS
A0-A20
PROGRAM/ERASE
INPUT
Y-PASS GATE
SOURCE
HV
COMMAND
DATA
DECODER
SENSE
AMPLIFIER
PGM
DATA
HV
COMMAND
DATA LATCH
PROGRAM
DATA LATCH
Q0-Q15/A-1
I/O BUFFER
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4
MX29LV320T/B
Table 1.a: MX29LV320T SECTOR GROUP ARCHITECTURE
Sector
Group
1
1
1
1
2
2
2
2
3
3
3
3
4
4
4
4
5
5
5
5
6
6
6
6
7
7
7
7
8
8
8
8
9
9
9
9
10
10
10
10
Sector Sector Address
A20-A12
SA0
000000xxx
SA1
000001xxx
SA2
000010xxx
SA3
000011xxx
SA4
000100xxx
SA5
000101xxx
SA6
000110xxx
SA7
000111xxx
SA8
001000xxx
SA9
001001xxx
SA10
001010xxx
SA11
001011xxx
SA12
001100xxx
SA13
001101xxx
SA14
001110xxx
SA15
001111xxx
SA16
010000xxx
SA17
010001xxx
SA18
010010xxx
SA19
010011xxx
SA20
010100xxx
SA21
010101xxx
SA22
010110xxx
SA23
010111xxx
SA24
011000xxx
SA25
011001xxx
SA26
011010xxx
SA27
011011xxx
SA28
011100xxx
SA29
011101xxx
SA30
011110xxx
SA31
011111xxx
SA32
100000xxx
SA33
100001xxx
SA34
100010xxx
SA35
100011xxx
SA36
100100xxx
SA37
100101xxx
SA38
100110xxx
SA39
100111xxx
Sector Size
(Kbytes/Kwords)
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
P/N:PM0742
(x8)
Address Range
000000h-00FFFFh
010000h-01FFFFh
020000h-02FFFFh
030000h-03FFFFh
040000h-04FFFFh
050000h-05FFFFh
060000h-06FFFFh
070000h-07FFFFh
080000h-08FFFFh
090000h-09FFFFh
0A0000h-0AFFFFh
0B0000h-0BFFFFh
0C0000h-0CFFFFh
0D0000h-0DFFFFh
0E0000h-0EFFFFh
0F0000h-0FFFFFh
100000h-10FFFFh
110000h-11FFFFh
120000h-12FFFFh
130000h-13FFFFh
140000h-14FFFFh
150000h-15FFFFh
160000h-16FFFFh
170000h-17FFFFh
180000h-18FFFFh
190000h-19FFFFh
1A0000h-1AFFFFh
1B0000h-1BFFFFh
1C0000h-1CFFFFh
1D0000h-1DFFFFh
1E0000h-1EFFFFh
1F0000h-1FFFFFh
200000h-20FFFFh
210000h-21FFFFh
220000h-22FFFFh
230000h-23FFFFh
240000h-24FFFFh
250000h-25FFFFh
260000h-26FFFFh
270000h-27FFFFh
(x16)
Address Range
000000h-07FFFh
008000h-0FFFFh
010000h-17FFFh
018000h-01FFFFh
020000h-027FFFh
028000h-02FFFFh
030000h-037FFFh
038000h-03FFFFh
040000h-047FFFh
048000h-04FFFFh
050000h-057FFFh
058000h-05FFFFh
060000h-067FFFh
068000h-06FFFFh
070000h-077FFFh
078000h-07FFFFh
080000h-087FFFh
088000h-08FFFFh
090000h-097FFFh
098000h-09FFFFh
0A0000h-0A7FFFh
0A8000h-0AFFFFh
0B0000h-0B7FFFh
0B8000h-0BFFFFh
0C0000h-0C7FFFh
0C8000h-0CFFFFh
0D0000h-0D7FFFh
0D8000h-0DFFFFh
0E0000h-0E7FFFh
0E8000h-0EFFFFh
0F0000h-0F7FFFh
0F8000h-0FFFFFh
100000h-107FFFh
108000h-10FFFFh
110000h-117FFFh
118000h-11FFFFh
120000h-127FFFh
128000h-12FFFFh
130000h-137FFFh
138000h-13FFFFh
REV. 1.4, JUL. 04, 2003
5
MX29LV320T/B
Sector
Group
11
11
11
11
12
12
12
12
13
13
13
13
14
14
14
14
15
15
15
15
16
16
16
17
18
19
20
21
22
23
24
Sector Sector Address
A20-A12
SA40
101000xxx
SA41
101001xxx
SA42
101010xxx
SA43
101011xxx
SA44
101100xxx
SA45
101101xxx
SA46
101110xxx
SA47
101111xxx
SA48
110000xxx
SA49
110001xxx
SA50
110010xxx
SA51
110011xxx
SA52
110100xxx
SA53
110101xxx
SA54
110110xxx
SA55
110111xxx
SA56
111000xxx
SA57
111001xxx
SA58
111010xxx
SA59
111011xxx
SA60
111100xxx
SA61
111101xxx
SA62
111110xxx
SA63
111111000
SA64
111111001
SA65
111111010
SA66
111111011
SA67
111111100
SA68
111111101
SA69
111111110
SA70
111111111
Sector Size
(Kbytes/Kwords)
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
8/4
8/4
8/4
8/4
8/4
8/4
8/4
8/4
(x8)
Address Range
280000h-28FFFFh
290000h-29FFFFh
2A0000h-2AFFFFh
2B0000h-2BFFFFh
2C0000h-2CFFFFh
2D0000h-2DFFFFh
2E0000h-2EFFFFh
2F0000h-2FFFFFh
300000h-30FFFFh
310000h-31FFFFh
320000h-32FFFFh
330000h-33FFFFh
340000h-34FFFFh
350000h-35FFFFh
360000h-36FFFFh
370000h-37FFFFh
380000h-38FFFFh
390000h-39FFFFh
3A0000h-3AFFFFh
3B0000h-3BFFFFh
3C0000h-3CFFFFh
3D0000h-3DFFFFh
3E0000h-3EFFFFh
3F0000h-3F1FFFh
3F2000h-3F3FFFh
3F4000h-3F5FFFh
3F6000h-3F7FFFh
3F8000h-3F9FFFh
3FA000h-3FBFFFh
3FC000h-3FDFFFh
3FE000h-3FFFFFh
(x16)
Address Range
140000h-147FFFh
148000h-14FFFFh
150000h-157FFFh
158000h-15FFFFh
160000h-147FFFh
168000h-14FFFFh
170000h-177FFFh
178000h-17FFFFh
180000h-187FFFh
188000h-18FFFFh
190000h-197FFFh
198000h-19FFFFh
1A0000h-1A7FFFh
1A8000h-1AFFFFh
1B0000h-1B7FFFh
1B8000h-1BFFFFh
1C0000h-1C7FFFh
1C8000h-1CFFFFh
1D0000h-1D7FFFh
1D8000h-1DFFFFh
1E0000h-1E7FFFh
1E8000h-1EFFFFh
1F0000h-1F7FFFh
1F8000h-1F8FFFh
1F9000h-1F9FFFh
1FA000h-1FAFFFh
1FB000h-1FBFFFh
1FC000h-1FCFFFh
1FD000h-1FDFFFh
1FE000h-1FEFFFh
1FF000h-1FFFFFh
Note:The address range is A20:A-1 in byte mode (BYTE=VIL) or A20:A0 in word mode (BYTE=VIH)
Top Boot Security Sector Addresses
Sector Address
A20~A12
111111xxx
Sector Size
(Kbytes/Kwords)
64/32
(x8)
Address Range
3F0000h-3FFFFFh
P/N:PM0742
(x16)
Address Range
1F8000h-1FFFFFh
REV. 1.4, JUL. 04, 2003
6
MX29LV320T/B
Table 1.b: MX29LV320B SECTOR GROUP ARCHITECTURE
Sector
Group
1
2
3
4
5
6
7
8
9
9
9
10
10
10
10
11
11
11
11
12
12
12
12
13
13
13
13
14
14
14
14
15
15
15
15
16
16
16
16
Sector Sector Address
A20-A12
SA0
000000000
SA1
000000001
SA2
000000010
SA3
000000011
SA4
000000100
SA5
000000101
SA6
000000110
SA7
000000111
SA8
000001xxx
SA9
000010xxx
SA10
000011xxx
SA11
000100xxx
SA12
000101xxx
SA13
000110xxx
SA14
000111xxx
SA15
001000xxx
SA16
001001xxx
SA17
001010xxx
SA18
001011xxx
SA19
001100xxx
SA20
001101xxx
SA21
001110xxx
SA22
001111xxx
SA23
010000xxx
SA24
010001xxx
SA25
010010xxx
SA26
010011xxx
SA27
010100xxx
SA28
010101xxx
SA29
010110xxx
SA30
010111xxx
SA31
011000xxx
SA32
011001xxx
SA33
011010xxx
SA34
011011xxx
SA35
011100xxx
SA36
011101xxx
SA37
011110xxx
SA38
011111xxx
Sector Size
(Kbytes/Kwords)
8/4
8/4
8/4
8/4
8/4
8/4
8/4
8/4
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
P/N:PM0742
(x8)
Address Range
000000h-001FFFh
002000h-003FFFh
004000h-005FFFh
006000h-007FFFh
008000h-009FFFh
00A000h-00BFFFh
00C000h-00DFFFh
00E000h-00FFFFh
010000h-01FFFFh
020000h-02FFFFh
030000h-03FFFFh
040000h-04FFFFh
050000h-05FFFFh
060000h-06FFFFh
070000h-07FFFFh
080000h-08FFFFh
090000h-09FFFFh
0A0000h-0AFFFFh
0B0000h-0BFFFFh
0C0000h-0CFFFFh
0D0000h-0DFFFFh
0E0000h-0EFFFFh
0F0000h-0FFFFFh
100000h-10FFFFh
110000h-11FFFFh
120000h-12FFFFh
130000h-13FFFFh
140000h-14FFFFh
150000h-15FFFFh
160000h-16FFFFh
170000h-17FFFFh
180000h-18FFFFh
190000h-19FFFFh
1A0000h-1AFFFFh
1B0000h-1BFFFFh
1C0000h-1CFFFFh
1D0000h-1DFFFFh
1E0000h-1EFFFFh
1F0000h-1FFFFFh
(x16)
Address Range
000000h-000FFFh
001000h-001FFFh
002000h-002FFFh
003000h-003FFFh
004000h-004FFFh
005000h-005FFFh
006000h-006FFFh
007000h-007FFFh
008000h-00FFFFh
010000h-017FFFh
018000h-01FFFFh
020000h-027FFFh
028000h-02FFFFh
030000h-037FFFh
038000h-03FFFFh
040000h-047FFFh
048000h-04FFFFh
050000h-057FFFh
058000h-05FFFFh
060000h-067FFFh
068000h-06FFFFh
070000h-077FFFh
078000h-07FFFFh
080000h-087FFFh
088000h-08FFFFh
090000h-097FFFh
098000h-09FFFFh
0A0000h-0A7FFFh
0A8000h-0AFFFFh
0B0000h-0B7FFFh
0B8000h-0BFFFFh
0C0000h-0C7FFFh
0C8000h-0CFFFFh
0D0000h-0D7FFFh
0D8000h-0DFFFFh
0E0000h-0E7FFFh
0E8000h-0EFFFFh
0F0000h-0F7FFFh
0F8000h-0FFFFFh
REV. 1.4, JUL. 04, 2003
7
MX29LV320T/B
Sector
Group
17
17
17
17
18
18
18
18
19
19
19
19
20
20
20
20
21
21
21
21
22
22
22
22
23
23
23
23
24
24
24
24
Sector Sector Address
A20-A12
SA39
100000xxx
SA40
100001xxx
SA41
100010xxx
SA42
100011xxx
SA43
100100xxx
SA44
100101xxx
SA45
100110xxx
SA46
100111xxx
SA47
101000xxx
SA48
101001xxx
SA49
101010xxx
SA50
101011xxx
SA51
101100xxx
SA52
101101xxx
SA53
101110xxx
SA54
101111xxx
SA55
110000xxx
SA56
110001xxx
SA57
110010xxx
SA58
110011xxx
SA59
110100xxx
SA60
110101xxx
SA61
110110xxx
SA62
110111xxx
SA63
111000xxx
SA64
111001xxx
SA65
111010xxx
SA66
111011xxx
SA67
111100xxx
SA68
111101xxx
SA69
111110xxx
SA70
111111xxx
Sector Size
(Kbytes/Kwords)
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
(x8)
Address Range
200000h-20FFFFh
210000h-21FFFFh
220000h-22FFFFh
230000h-23FFFFh
240000h-24FFFFh
250000h-25FFFFh
260000h-26FFFFh
270000h-27FFFFh
280000h-28FFFFh
290000h-29FFFFh
2A0000h-2AFFFFh
2B0000h-2BFFFFh
2C0000h-2CFFFFh
2D0000h-2DFFFFh
2E0000h-2EFFFFh
2F0000h-2FFFFFh
300000h-30FFFFh
310000h-31FFFFh
320000h-32FFFFh
330000h-33FFFFh
340000h-34FFFFh
350000h-35FFFFh
360000h-36FFFFh
370000h-37FFFFh
380000h-38FFFFh
390000h-39FFFFh
3A0000h-3AFFFFh
3B0000h-3BFFFFh
3C0000h-3CFFFFh
3D0000h-3DFFFFh
3E0000h-3EFFFFh
3F0000h-3FFFFFh
(x16)
Address Range
100000h-107FFFh
108000h-10FFFFh
110000h-117FFFh
118000h-11FFFFh
120000h-127FFFh
128000h-12FFFFh
130000h-137FFFh
138000h-13FFFFh
140000h-147FFFh
148000h-14FFFFh
150000h-157FFFh
158000h-15FFFFh
160000h-167FFFh
168000h-16FFFFh
170000h-177FFFh
178000h-17FFFFh
180000h-187FFFh
188000h-18FFFFh
190000h-197FFFh
198000h-19FFFFh
1A0000h-1A7FFFh
1A8000h-1AFFFFh
1B0000h-1B7FFFh
1B8000h-1BFFFFh
1C0000h-1C7FFFh
1C8000h-1CFFFFh
1D0000h-1D7FFFh
1D8000h-1DFFFFh
1E0000h-1E7FFFh
1E8000h-1EFFFFh
1F0000h-1F7FFFh
1F8000h-1FFFFFh
Note:The address range is A20:A-1 in byte mode (BYTE=VIL) or A20:A0 in word mode (BYTE=VIH)
Bottom Boot Security Sector Addresses
Sector Address
A20~A12
111111xxx
Sector Size
(Kbytes/Kwords)
64/32
(x8)
Address Range
000000h-00FFFFh
P/N:PM0742
(x16)
Address Range
00000h-07FFFh
REV. 1.4, JUL. 04, 2003
8
MX29LV320T/B
Table 2. BUS OPERATION--1
Operation
CE
OE
WE RESET WP/ACC
Addresses
Q0~Q7
(Note 2)
Read
L
L
H
H
L/H
AIN
DOUT
Q8 ~ Q15
Byte=VIH
Byte=VIL
DOUT
Q8-A14
=High-Z
Write (Note 1)
L
H
L
H
Note 3
AIN
DIN
DIN
Accelerate
L
H
L
H
V HH
AIN
DIN
DIN
VCC ±
X
X
VCC ±
H
X
High-Z
High-Z
High-Z
Q15=A-1
Program
Standby
0.3V
0.3V
Output Disable
L
H
H
H
L/H
X
High-Z
High-Z
High-Z
Reset
X
X
X
L
L/H
X
High-Z
High-Z
High-Z
Sector Group
L
H
L
VID
L/H
X
X
X
X
DIN
High-Z
Protect (Note 2)
Chip Unprotect
A6=L, A1=H, A0=L
L
H
L
VID
Note 3
(Note 2)
Temporary Sector
Sector Addresses, DIN, DOUT
Sector Addresses, DIN, DOUT
A6=H, A1=H, A0=L
X
X
X
VID
Note 3
AIN
DIN
Group Unprotect
Legend:
L=Logic LOW=VIL, H=Logic High=VIH, VID=12.0±0.5V, VHH=11.5-12.5V, X=Don't Care, AIN=Address IN, DIN=Data IN,
DOUT=Data OUT
Notes:
1. When the WP/ACC pin is at VHH, the device enters the accelerated program mode. See "Accelerated Program
Operations" for more information.
2.The sector group protect and chip unprotect functions may also be implemented via programming equipment. See
the "Sector Group Protection and Chip Unprotection" section.
3.If WP/ACC=VIL, the two outermost boot sectors remain protected. If WP/ACC=VIH, the two outermost boot sector
protection depends on whether they were last protected or unprotected using the method described in "Sector/
Sector Block Protection and Unprotection". If WP/ACC=VHH, all sectors will be unprotected.
4.DIN or Dout as required by command sequence, data polling, or sector protection algorithm.
5.Address are A20:A0 in word mode (BYTE=VIH), A20:A-1 in byte mode (BYTE=VIL).
P/N:PM0742
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9
MX29LV320T/B
BUS OPERATION--2
Operation
Read Silicon ID
Manufacturer Code
Read Silicon ID
MX29LV320T
Read Silicon ID
MX29LV320B
Sector Group Protect
Chip Unprotect
Sector Protect
Verification
Security Sector
Indicater
Bit (Q7)
CE
OE
WE
L
L
H
A20
to
A12
X
A11
to
A10
X
A9
A6
VID
A8
to
A7
X
L
A5
to
A2
X
L
L
H
X
X
VID
X
L
L
L
H
X
X
VID
X
L
L
L
VID
VID
L
L
L
H
SA
X
SA
X
X
X
VID
VID
VID
L
L
H
X
X
VID
A1
A0
Q0-Q7
Q8-Q15
L
L
C2H
X
X
L
H
A7H
L
X
L
H
X
X
X
L
H
L
X
X
X
X
X
H
X
X
L
X
L
X
H
H
22h(word)
X (byte)
A8H 22h(word)
X (byte)
X
X
X
X
01h(1),
X
or 00h
99h(2),
X
or 19h
Notes:
1.Code=00h means unprotected, or code=01h protected.
2.Code=99 means factory locked, or code=19h not facory locked.
P/N:PM0742
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10
MX29LV320T/B
REQUIREMENTS FOR READING ARRAY
DATA
ACCELERATED PROGRAM OPERATION
The device offers accelerated program operations through
the WP/ACC function. If the system asserts VHH on ACC
pin, the device will provide the fast programming time to
user. This function is primarily intended to allow faster
manufacturing throughput during production. Removing
VHH from the WP/ACC pin returns the device to normal
operation. Note that the WP/ACC pin must not be at VHH
for operations other than accelerated programming, or
device damage may result.
To read array data from the outputs, the system must
drive the CE and OE pins to VIL. CE is the power control
and selects the device. OE is the output control and gates
array data to the output pins. WE should remain at VIH.
The internal state machine is set for reading array data
upon device power-up, or after a hardware reset. This
ensures that no spurious alteration of the memory content
occurs during the power transition. No command is
necessary in this mode to obtain array data. Standard
microprocessor read cycles that assert valid address on
the device address inputs produce valid data on the device
data outputs. The device remains enabled for read access
until the command register contents are altered.
STANDBY MODE
MX29LV320T/B can be set into Standby mode with two
different approaches. One is using both CE and RESET
pins and the other one is using RESET pin only.
WRITE COMMANDS/COMMAND SEQUENCES
When using both pins of CE and RESET, a CMOS
Standby mode is achieved with both pins held at Vcc ±
0.3V. Under this condition, the current consumed is less
than 0.2uA (typ.). If both of the CE and RESET are held
at VIH, but not within the range of VCC ± 0.3V, the device
will still be in the standby mode, but the standby current
will be larger. During Auto Algorithm operation, Vcc active current (ICC2) is required even CE = "H" until the
operation is completed. The device can be read with standard access time (tCE) from either of these standby
modes.
To program data to the device or erase sectors of memory
, the system must drive WE and CE to VIL, and OE to
VIH.
An erase operation can erase one sector, multiple sectors
, or the entire device. Table 1 indicates the address space
that each sector occupies. A "sector address" consists
of the address bits required to uniquely select a sector.
Writing specific address and data commands or
sequences into the command register initiates device
operations. Table 3 defines the valid register command
sequences. Writing incorrect address and data values or
writing them in the improper sequence resets the device
to reading array data. Section has details on erasing a
sector or the entire chip, or suspending/resuming the erase
operation.
When using only RESET, a CMOS standby mode is
achieved with RESET input held at Vss ± 0.3V, Under
this condition the current is consumed less than 1uA
(typ.). Once the RESET pin is taken high,the device is
back to active without recovery delay.
In the standby mode the outputs are in the high impedance state, independent of the OE input.
After the system writes the Automatic Select command
sequence, the device enters the Automatic Select mode.
The system can then read Automatic Select codes from
the internal register (which is separate from the memory
array) on Q7-Q0. Standard read cycle timings apply in
this mode. Refer to the Automatic Select Mode and
Automatic Select Command Sequence section for more
information.
MX29LV320T/B is capable to provide the Automatic
Standby Mode to restrain power consumption during readout of data. This mode can be used effectively with an
application requested low power consumption such as
handy terminals.
To active this mode, MX29LV320T/B automatically switch
themselves to low power mode when MX29LV320T/B
addresses remain stable during access time of
tACC+30ns. It is not necessary to control CE, WE, and
OE on the mode. Under the mode, the current consumed
is typically 0.2uA (CMOS level).
ICC2 in the DC Characteristics table represents the active
current specification for the write mode. The "AC
Characteristics" section contains timing specification
table and timing diagrams for write operations.
P/N:PM0742
REV. 1.4, JUL. 04, 2003
11
MX29LV320T/B
on address pin A9 and control pin OE, (suggest VID =
12V) A6 = VIL and CE = VIL.(see Table 2) Programming
of the protection circuitry begins on the falling edge of
the WE pulse and is terminated on the rising edge. Please
refer to sector group protect algorithm and waveform.
OUTPUT DISABLE
With the OE input at a logic high level (VIH), output from
the devices are disabled. This will cause the output pins
to be in a high impedance state.
MX29LV320T/B also provides another method which requires VID on the RESET only. This method can be implemented either in-system or via programming equipment.
This method uses standard microprocessor bus cycle
timing.
RESET OPERATION
The RESET pin provides a hardware method of resetting
the device to reading array data. When the RESET pin is
driven low for at least a period of tRP, the device
immediately terminates any operation in progress,
tristates all output pins, and ignores all read/write
commands for the duration of the RESET pulse. The
device also resets the internal state machine to reading
array data. The operation that was interrupted should be
reinitiated once the device is ready to accept another
command sequence, to ensure data integrity
To verify programming of the protection circuitry, the programming equipment must force VID on address pin A9 (
with CE and OE at VIL and WE at VIH). When A1=1, it
will produce a logical "1" code at device output Q0 for a
protected sector. Otherwise the device will produce 00H
for the unprotected sector. In this mode, the addresses,
except for A1, are don't care. Address locations with
A1= VIL are reserved to read manufacturer and device
codes.(Read Silicon ID)
Current is reduced for the duration of the RESET pulse.
When RESET is held at VSS±0.3V, the device draws
CMOS standby current (ICC4). If RESET is held at VIL
but not within VSS±0.3V, the standby current will be
greater.
It is also possible to determine if the group is protected
in the system by writing a Read Silicon ID command.
Performing a read operation with A1=VIH, it will produce
a logical "1" at Q0 for the protected sector.
The RESET pin may be tied to system reset circuitry. A
system reset would that also reset the Flash memory,
enabling the system to read the boot-up firm-ware from
the Flash memory.
CHIP UNPROTECT OPERATION
The MX29LV320T/B also features the chip unprotect
mode, so that all sectors are unprotected after chip
unprotect is completed to incorporate any changes in
the code. It is recommended to protect all sectors before
activating chip unprotect mode.
If RESET is asserted during a program or erase
operation, the RY/BY pin remains a "0" (busy) until the
internal reset operation is complete, which requires a time
of tREADY (during Embedded Algorithms). The system
can thus monitor RY/BY to determine whether the reset
operation is complete. If RESET is asserted when a
program or erase operation is not executing (RY/BY pin
is "1"), the reset operation is completed within a time of
tREADY (not during Embedded Algorithms). The system
can read data tRH after the RESET pin returns to VIH.
To activate this mode, the programming equipment must
force VID on control pin OE and address pin A9. The CE
pins must be set at VIL. Pins A6 must be set to VIH.(see
Table 2) Refer to chip unprotect algorithm and waveform for the chip unprotect algorithm. The unprotection
mechanism begins on the falling edge of the WE pulse
and is terminated on the rising edge.
Refer to the AC Characteristics tables for RESET
parameters and to Figure 14 for the timing diagram.
MX29LV320T/B also provides another method which requires VID on the RESET only. This method can be implemented either in-system or via programming equipment.
This method uses standard microprocessor bus cycle
timing.
SECTOR GROUP PROTECT OPERATION
The MX29LV320T/B features hardware sector group protection. This feature will disable both program and erase
operations for these sector group protected. To activate
this mode, the programming equipment must force VID
It is also possible to determine if the chip is unprotected
in the system by writing the Read Silicon ID command.
P/N:PM0742
REV. 1.4, JUL. 04, 2003
12
MX29LV320T/B
Performing a read operation with A1=VIH, it will produce
00H at data outputs(Q0-Q7) for an unprotected sector. It
is noted that all sectors are unprotected after the chip
unprotect algorithm is completed.
facturer and device codes must be accessible while the
device resides in the target system. PROM programmers typically access signature codes by raising A9 to
a high voltage. However, multiplexing high voltage onto
address lines is not generally desired system design practice.
TEMPORARY SECTOR GROUP UNPROTECT
OPERATION
MX29LV320T/B provides hardware method to access the
Automatic Select operation. This method requires VID on
A9 pin, VIL on CE, OE, A6, and A1 pins. When applying
VIL on A0 pin, the device will output MXIC's manufacture code of C2H. When applying VIH on A0 pin, the device will output MX29LV320T/B device code of 22A7h
and 22A8h.
This feature allows temporary unprotection of previously
protected sector to change data in-system. The Temporary Sector Unprotect mode is activated by setting the
RESET pin to VID(11.5V-12.5V). During this mode, formerly protected sectors can be programmed or erased
as un-protected sector. Once VID is remove from the
RESET pin, all the previously protected sectors are protected again.
VERIFY SECTOR GROUP PROTECT STATUS
OPERATION
MX29LV320T/B provides hardware method for sector
group protect status verify. This method requires VID on
A9 pin, VIH on WE and A1 pins, VIL on CE, OE, A6, and
A0 pins, and sector address on A12 to A20 pins. When
the identified sector is protected, the device will output
01H. When the identified sector is not protect, the device
will output 00H.
WRITE PROTECT (WP)
The write protect function provides a hardware method
to protect boot sectors without using VID.
If the system asserts VIL on the WP/ACC pin, the device disables program and erase functions in the two
"outermost" 8 Kbyte boot sectors independently of
whether those sectors were protected or unprotected
using the method described in Sector/Sector Group Protection and Chip Unprotection". The two outermost 8
Kbyte boot sectors are the two sectors containing the
lowest addresses in a bottom-boot-configured device, or
the two sectors containing the highest addresses in a
top-boot-configured device.
SECURITY SECTOR FLASH MEMORY REGION
The Security Sector (Security Sector) feature provides a
Flash memory region that enables permanent part identification through an Electronic Serial Number (ESN). The
Security Sector is 64 Kbytes (32 Kwords) in length, and
uses a Security Sector Indicator Bit (Q7) to indicate
whether or not the Security Sector is locked when shipped
from the factory. This bit is per-manently set at the factory and cannot be changed, which prevents cloning of a
factory locked part. This ensures the security of the ESN
once the product is shipped to the field.
If the system asserts VIH on the WP/ACC pin, the device reverts to whether the two outermost 8K Byte boot
sectors were last set to be protected or unprotected. That
is, sector protection or unprotection for these two sectors depends on whether they were last protected or unprotected using the method described in "Sector/Sector
Group Protection and Chip Unprotection".
MXIC offers the device with the Security Sector either
factory locked or customer lockable. The factory-locked
version is always protected when shipped from the factory, and has the Security on Silicon Sector (Security
Sector) Indicator Bit permanently set to a "1". The customer-lockable version is shipped with the unprotected,
allowing customers to utilize the that sector in any manner they choose. The customer-lockable version has the
Security on Silicon Sector (Security Sector) Indicator Bit
permanently set to a "0". Thus, the Security Sector Indicator Bit prevents customer-lockable devices from be-
Note that the WP/ACC pin must not be left floating or
unconnected; inconsistent behavior of the device may
result.
AUTOMATIC SELECT OPERATION
Flash memories are intended for use in applications where
the local CPU alters memory contents. As such, manu-
P/N:PM0742
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13
MX29LV320T/B
RESET may be at either VIH or VID. This allows in-system protection of the without raising any device pin to a
high voltage. Note that this method is only applicable to
the Security Sector.
ing used to replace devices that are factory locked.
The system accesses the Security Sector through a
command sequence (see "Enter Security Sector/Exit
Security Sector Command Sequence"). After the system has written the Enter Security Sector command sequence, it may read the Security Sector by using the addresses normally occupied by the boot sectors. This
mode of operation continues until the system issues the
Exit Security Sector command sequence, or until power
is removed from the device. On power-up, or following a
hardware reset, the device reverts to sending commands
to the boot sectors.
Write the three-cycle Enter Security Region command
sequence, and then use the alternate method of sector
protection described in the "Sector/Sector Block Protection and Unprotection section.
Once the Security Sector is locked and verified, the system must write the Exit Security Sector Region command sequence to return to reading and writing the remainder of the array.
The Security Sector protection must be used with caution since, once protected, there is no procedure available for unprotecting the Security Sector area and none
of the bits in the Security Sector memory space can be
modified in any way.
Factory Locked: Security Sector Programmed
and Protected at the Factory
In a factory locked device, the Security Sector is protected when the device is shipped from the factory. The
Security Sector cannot be modified in any way. The device is available preprogrammed with one of the following:
DATA PROTECTION
The MX29LV320T/B is designed to offer protection
against accidental erasure or programming caused by
spurious system level signals that may exist during power
transition. During power up the device automatically resets the state machine in the Read mode. In addition,
with its control register architecture, alteration of the
memory contents only occurs after successful completion of specific command sequences. The device also
incorporates several features to prevent inadvertent write
cycles resulting from VCC power-up and power-down transition or system noise.
A random, secure ESN only.
Customer code through the Express Flash service.
Both a random, secure ESN and customer code through
the Express Flash service.
In devices that have an ESN, a Bottom Boot device will
have the 16-byte (8-word) ESN in the lowest addressable memory area starting at 00000h and ending at
0000Fh (00007h). In the Top Boot device the starting
address of the ESN will be at the bottom of the lowest 8
Kbyte (4 Kword) boot sector starting at 3F0000h
(1F8000h) and ending at 3F000Fh (1F8007h).
LOW VCC WRITE INHIBIT
Customer Lockable: Security Sector NOT Programmed or Protected at the Factory
When VCC is less than VLKO the device does not accept any write cycles. This protects data during VCC
power-up and power-down. The command register and
all internal program/erase circuits are disabled, and the
device resets. Subsequent writes are ignored until VCC
is greater than VLKO. The system must provide the proper
signals to the control pins to prevent unintentional write
when VCC is greater than VLKO.
If the security feature is not required, the Security Sector can be treated as an additional Flash memory space,
expanding the size of the available Flash array by 64
Kbytes (32 Kwords). The Security Sector can be read,
programmed, and erased as often as required. The Security Sector area can be protected using one of the
following procedures:
WRITE PULSE "GLITCH" PROTECTION
Write the three-cycle Enter Security Region command
sequence, and then follow the in-system sector group
protect algorithm as shown in Figure 17, except that
Noise pulses of less than 5ns (typical) on OE, CE or WE
will not initiate a write cycle.
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14
MX29LV320T/B
LOGICAL INHIBIT
Writing is inhibited by holding any one of OE = VIL, CE =
VIH or WE = VIH. To initiate a write cycle CE and WE
must be a logical zero while OE is a logical one.
POWER-UP SEQUENCE
The MX29LV320T/B powers up in the Read only mode.
In addition, the memory contents may only be altered
after successful completion of the predefined command
sequences.
POWER-UP WRITE INHIBIT
If WE=CE=VIL and OE=VIH during power up, the device
does not accept commands on the rising edge of WE.
The internal state machine is automatically reset to the
read mode on power-up.
POWER SUPPLY DECOUPLING
In order to reduce power switching effect, each device
should have a 0.1uF ceramic capacitor connected between its VCC and GND.
SOFTWARE COMMAND DEFINITIONS
Device operations are selected by writing specific address and data sequences into the command register.
Writing incorrect address and data values or writing them
in the improper sequence will reset the device to the
read mode. Table 3 defines the valid register command
sequences. Note that the Erase Suspend (B0H) and
Erase Resume (30H) commands are valid only while the
Sector Erase operation is in progress. Either of the two
reset command sequences will reset the device (when
applicable).
All addresses are latched on the falling edge of WE or
CE, whichever happens later. All data are latched on rising edge of WE or CE, whichever happens first.
P/N:PM0742
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15
MX29LV320T/B
TABLE 3. MX29LV320T/B COMMAND DEFINITIONS
First Bus
Command
Bus
Read(Note 5)
1
RA
RD
Reset(Note 4)
1
XXX
F0
Second Bus Third Bus
Cycle
Cycle
Fourth Bus
Cycle
Cycle
Cycles Addr Data Addr Data Addr Data Addr
Fifth Bus
Cycle
Data
Sixth Bus
Cycle
Addr Data Addr Data
Automatic Select(Note 5)
Manufacturer ID
Device ID
Word
4
555
AA
2AA
55
555
90
X00
C2H
Byte
4
AAA
AA
555
55
AAA
90
X00
C2H
Word
4
555
AA
2AA
55
555
90
X01
ID
Byte
4
AAA
AA
555
55
AAA
90
X02
Security Sector Factory Word
4
555
AA
2AA
55
555
90
X03
Protect Verify (Note 6) Byte
4
AAA
AA
555
55
AAA
90
X06
99/19
Sector Protect Verify
Word
4
555
AA
2AA
55
555
90
(SA)X02 00/01
(Note 7)
Byte
4
AAA
AA
555
55
AAA
90
(SA)X04
Enter Security Sector
Word
3
555
AA
2AA
55
555
88
Region
Byte
3
AAA
AA
555
55
AAA
88
Exit Security Sector
Program
Chip Erase
Sector Erase
CFI Query (Note 8)
Word
4
555
AA
2AA
55
555
90
XXX
00
Byte
4
AAA
AA
555
55
AAA
90
XXX
00
Word
4
555
AA
2AA
55
555
A0
PA
PD
Byte
4
AAA
AA
555
55
AAA
A0
PA
PD
Word
6
555
AA
2AA
55
555
80
555
AA
2AA 55
555
Byte
6
AAA
AA
555
55
AAA
80
AAA
AA
555
AAA 10
55
10
Word
6
555
AA
2AA
55
555
80
555
AA
2AA 55
SA
30
Byte
6
AAA
AA
555
55
AAA
80
AAA
AA
555
SA
30
Word
1
55
98
Byte
1
AA
98
Erase Suspend(Note 9)
1
SA
B0
Erase Resume(Note 10)
1
SA
30
55
Legend:
X=Don't care
RA=Address of the memory location to be read.
RD=Data read from location RA during read operation.
PA=Address of the memory location to be programmed.
Addresses are latched on the falling edge of the WE or CE
pulse.
PD=Data to be programmed at location PA. Data is latched
on the rising edge of WE or CE pulse.
SA=Address of the sector to be erased or verified. Address
bits A20-A12 uniquely select any sector.
ID=22A7h(Top), 22A8h(Bottom)
Notes:
1.
2.
3.
4.
See Table 1 for descriptions of bus operations.
All values are in hexadecimal.
Except when reading array or Automatic Select data, all bus cycles are write operation.
The Reset command is required to return to the read mode when the device is in the Automatic Select mode or if Q5 goes
high.
5. The fourth cycle of the Automatic Select command sequence is a read cycle.
6. The data is 99h for factory locked and 19h for not factory locked.
7. The data is 00h for an unprotected sector/sector block and 01h for a protected sector/sector block. In the third cycle of the
command sequence, address bit A20=0 to verify sectors 0~31, A20=1 to verify sectors 32~70 for Top Boot device.
8. Command is valid when device is ready to read array data or when device is in Automatic Select mode.
9. The system may read and program functions in non-erasing sectors, or enter the Automatic Select mode, when in the erase
Suspend mode. The Erase Suspend command is valid only during a sector erase operation.
10. The Erase Resume command is valid only during the Erase Suspend mode.
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MX29LV320T/B
READING ARRAY DATA
AUTOMATIC SELECT COMMAND SEQUENCE
The device is automatically set to reading array data
after device power-up. No commands are required to
retrieve data. The device is also ready to read array data
after completing an Automatic Program or Automatic
Erase algorithm.
The Automatic Select command sequence allows the
host system to access the manufacturer and device
codes, and determine whether or not a sector is protected. Table 2 shows the address and data requirements.
This method is an alternative to that shown in Table 3,
which is intended for EPROM programmers and requires
VID on address bit A9.
After the device accepts an Erase Suspend command,
the device enters the Erase Suspend mode. The system can read array data using the standard read timings, except that if it reads at an address within erasesuspended sectors, the device outputs status data. After
completing a programming operation in the Erase
Suspend mode, the system may once again read array
data with the same exception. See Erase Suspend/Erase
Resume Commands” for more information on this mode.
The system must issue the reset command to re-enable the device for reading array data if Q5 goes high
during an active program or erase operation, or while in
the Automatic Select mode. See the "Reset Command"
section, next.
The Automatic Select command sequence is initiated
by writ-ing two unlock cycles, followed by the Automatic
Select command. The device then enters the Automatic
Select mode, and the system may read at any address
any number of times, without initiating another command
sequence. A read cycle at address XX00h retrieves the
manufacturer code. A read cycle at address XX01h in
word mode (or xx02h in byte mode) returns the device
code. A read cycle containing a sector address (SA) and
the address 02h on A7-A0 in word mode (or the address
04h on A6-A-1 in byte mode) returns 01h if that sector is
protected, or 00h if it is unprotected. Refer to Table 1 for
valid sector addresses.
The system must write the reset command to exit the
Automatic Select mode and return to reading array data.
RESET COMMAND
Writing the reset command to the device resets the
device to reading array data. Address bits are don't care
for this command.
ENTER SECURITY SECTOR & EXIT SECURITY
SECTOR COMMAND SEQUENCE
The reset command may be written between the sequence cycles in an erase command sequence before
erasing begins. This resets the device to reading array
data. Once erasure begins, however, the device ignores
reset commands until the operation is complete.
The Security Sector provides a secured area which contains a random, sixteen-byte electronic serial
number.(ESN)
The reset command may be written between the sequence cycles in a program command sequence before
programming begins. This resets the device to reading
array data (also applies to programming in Erase Suspend
mode). Once programming begins, however, the device
ignores reset commands until the operation is complete.
The system can access the Security Sector area by issuing the three-cycle "Enter Security Sector command
sequence. The device continues to access the security
section area until the system issues the four-cycle Exit
Security Sector command sequence. The Exit Security
Sector command sequence returns the device to normal
operation.
The reset command may be written between the sequence cycles in an Automatic Select command
sequence. Once in the Automatic Select mode, the reset
command must be written to return to reading array data
(also applies to Automatic Select during Erase Suspend).
BYTE/WORD PROGRAM COMMAND SEQUENCE
The device programs one byte/word of data for each
program operation. The command sequence requires four
bus cycles, and is initiated by writing two unlock write
cycles, followed by the program set-up command. The
program address and data are written next, which in turn
initiate the Embedded Program algorithm. The system is
not required to provide further controls or timings. The
device automatically generates the program pulses and
If Q5 goes high during a program or erase operation,
writing the reset command returns the device to read-ing
array data (also applies during Erase Suspend).
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MX29LV320T/B
verifies the programmed cell margin. Table 3 shows the
address and data requirements for the byte/word program
command sequence.
However, a succeeding read will show that the data is
still "0". Only erase operations can convert a "0" to a
"1".
When the Embedded Program algorithm is complete, the
device then returns to reading array data and addresses
are no longer latched. The system can determine the
status of the program operation by using Q7, Q6, or RY/
BY. See "Write Operation Status" for information on these
status bits.
SETUP AUTOMATIC CHIP/SECTOR ERASE
Chip erase is a six-bus cycle operation. There are two
"unlock" write cycles. These are followed by writing the
"set-up" command 80H. Two more "unlock" write cycles
are then followed by the chip erase command 10H, or
the sector erase command 30H.
Any commands written to the device during the Embedded Program Algorithm are ignored. Note that a
hardware reset immediately terminates the programming
operation. The Byte/Word Program command sequence
should be reinitiated once the device has reset to reading
array data, to ensure data integrity.
The MX29LV320T/B contains a Silicon-ID-Read operation to supplement traditional PROM programming methodology. The operation is initiated by writing the read
silicon ID command sequence into the command register. Following the command write, a read cycle with
A1=VIL,A0=VIL retrieves the manufacturer code of C2H.
A read cycle with A1=VIL, A0=VIH returns the device
code of A7H/A8H for MX29LV320T/B.
Programming is allowed in any sequence and across
sector boundaries. A bit cannot be programmed from a
"0" back to a "1". Attempting to do so may cause the
device to set Q5 to "1" ,” or cause the Data Polling
algorithm to indicate the operation was successful.
TABLE 4. SILICON ID CODE
Pins
A0
A1
Q7
Q6
Q5
Q4
Q3
Q2
Q1
Q0
Code (Hex)
Manufacture code
VIL
VIL
1
1
0
0
0
0
1
0
C2H
Device code for MX29LV320T
VIH VIL
1
0
1
0
0
1
1
1
22A7H
Device code for MX29LV320B
VIH VIL
1
0
1
0
1
0
0
0
22A8H
be reinitiated once the device has returned to reading
array data, to ensure data integrity.
AUTOMATIC CHIP/SECTOR ERASE COMMAND
The device does not require the system to preprogram
prior to erase. The Automatic Erase algorithm automatically preprograms and verifies the entire memory for an
all zero data pattern prior to electrical erase. The system
is not required to provide any controls or timings during
these operations. Table 3 shows the address and data
requirements for the chip erase command sequence.
The system can determine the status of the erase operation by using Q7, Q6, Q2, or RY/BY. See "Write Operation Status" for information on these status bits. When
the Automatic Erase algorithm is complete, the device
returns to reading array data and addresses are no longer
latched.
Any commands written to the chip during the Automatic
Erase algorithm are ignored. Note that a hard-ware reset
during the chip erase operation immediately terminates
the operation. The Chip Erase command sequence should
Figure 5 illustrates the algorithm for the erase operation.See the Erase/Program Operations tables in "AC
Characteristics" for parameters, and to Figure 4 for timing diagrams.
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MX29LV320T/B
Sector Erase operation. When the Erase Suspend command is issued during the sector erase operation, the
device requires a maximum 20us to suspend the sector
erase operation. However, When the Erase Suspend command is written during the sector erase time-out, the
device immediately terminates the time-out period and
suspends the erase operation. After this command has
been executed, the command register will initiate erase
suspend mode. The state machine will return to read
mode automatically after suspend is ready. At this time,
state machine only allows the command register to respond to the Erase Resume, program data to, or read
data from any sector not selected for erasure. The system can use Q7, or Q6 and Q2 together, to determine if
a sector is actively erasing or is erase-suspended.
SECTOR ERASE COMMANDS
The device does not require the system to entirely
pre-program prior to executing the Automatic Set-up
Sector Erase command and Automatic Sector Erase
command. Upon executing the Automatic Sector
Erase command, the device will automatically
program and verify the sector(s) memory for an allzero data pattern. The system is not required to
provide any control or timing during these operations.
When the sector(s) is automatically verified to
contain an all-zero pattern, a self-timed sector erase
and verify begin. The erase and verify operations are
complete when the data on Q7 is "1" and the data on
Q6 stops toggling for two consecutive read cycles, at
which time the device returns to the Read mode. The
system is not required to provide any control or timing
during these operations.
The system can determine the status of the program
operation using the Q7 or Q6 status bits, just as in the
standard program operation. After an erase-suspend program operation is complete, the system can once again
read array data within non-suspended blocks.
When using the Automatic Sector Erase algorithm,
note that the erase automatically terminates when
adequate erase margin has been achieved for the
memory array (no erase verification command is
required). Sector erase is a six-bus cycle operation.
There are two "unlock" write cycles. These are
followed by writing the set-up command 80H. Two
more "unlock" write cycles are then followed by the
sector erase command 30H. The sector address is
latched on the falling edge of WE or CE, whichever
happens later , while the command(data) is latched on
the rising edge of WE or CE, whichever happens first.
Sector addresses selected are loaded into internal
register on the sixth falling edge of WE or CE,
whichever happens later. Each successive sector
load cycle started by the falling edge of WE or CE,
whichever happens later must begin within 50us from
the rising edge of the preceding WE or CE, whichever
happens first. Otherwise, the loading period ends and
internal auto sector erase cycle starts. (Monitor Q3 to
determine if the sector erase timer window is still
open, see section Q3, Sector Erase Timer.) Any
command other than Sector Erase(30H) or Erase
Suspend(B0H) during the time-out period resets the
device to read mode.
ERASE RESUME
This command will cause the command register to clear
the suspend state and return back to Sector Erase mode
but only if an Erase Suspend command was previously
issued. Erase Resume will not have any effect in all
other conditions. Another Erase Suspend command can
be written after the chip has resumed erasing.
ERASE SUSPEND
This command only has meaning while the state machine is executing Automatic Sector Erase operation,
and therefore will only be responded during Automatic
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MX29LV320T/B
WRITE OPERATION STATUS
The device provides several bits to determine the status of a write operation: Q2, Q3, Q5, Q6, Q7, and RY/BY.
Table 5 and the following subsections describe the functions of these bits. Q7, RY/BY, and Q6 each offer a
method for determining whether a program or erase operation is complete or in progress. These three bits are
discussed first.
Table 5. Write Operation Status
Status
Byte/Word Program in Auto Program Algorithm
Auto Erase Algorithm
Erase Suspend Read
(Erase Suspended Sector)
Q7
Note1
Q6
Q5
Note2
Q3
Q2
RY/BY
Q7
Toggle
0
N/A
No
Toggle
0
0
Toggle
0
1
Toggle
0
1
No
Toggle
0
N/A Toggle
1
Data
Data
Data Data
1
Q7
Toggle
0
N/A
N/A
0
Q7
Toggle
1
N/A
No
Toggle
0
0
Toggle
1
1
Toggle
0
Q7
Toggle
1
N/A
N/A
0
In Progress
Erase Suspended Mode
Erase Suspend Read
Data
(Non-Erase Suspended Sector)
Erase Suspend Program
Byte/Word Program in Auto Program Algorithm
Exceeded
Time Limits
Auto Erase Algorithm
Erase Suspend Program
Notes:
1. Performing successive read operations from the erase-suspended sector will cause Q2 to toggle.
2. Performing successive read operations from any address will cause Q6 to toggle.
3. Reading the byte/word address being programmed while in the erase-suspend program mode will indicate logic "1"
at the Q2 bit.
However, successive reads from the erase-suspended sector will cause Q2 to toggle.
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MX29LV320T/B
after the rising edge of the final WE or CE, whichever
happens first pulse in the command sequence (prior to
the program or erase operation), and during the sector
time-out.
Q7: Data Polling
The Data Polling bit, Q7, indicates to the host system
whether an Automatic Algorithm is in progress or completed, or whether the device is in Erase Suspend. Data
Polling is valid after the rising edge of the final WE pulse
in the program or erase command sequence.
During an Automatic Program or Erase algorithm operation, successive read cycles to any address cause Q6
to toggle. The system may use either OE or CE to control the read cycles. When the operation is complete, Q6
stops toggling.
During the Automatic Program algorithm, the device outputs on Q7 the complement of the datum programmed
to Q7. This Q7 status also applies to programming during Erase Suspend. When the Automatic Program algorithm is complete, the device outputs the datum programmed to Q7. The system must provide the program
address to read valid status information on Q7. If a program address falls within a protected sector, Data Polling on Q7 is active for approximately 1 us, then the device returns to reading array data.
After an erase command sequence is written, if all sectors selected for erasing are protected, Q6 toggles for
100us and returns to reading array data. If not all selected sectors are protected, the Automatic Erase algorithm erases the unprotected sectors, and ignores the
selected sectors that are protected.
The system can use Q6 and Q2 together to determine
whether a sector is actively erasing or is erase suspended.
When the device is actively erasing (that is, the Automatic Erase algorithm is in progress), Q6 toggling. When
the device enters the Erase Suspend mode, Q6 stops
toggling. However, the system must also use Q2 to determine which sectors are erasing or erase-suspended.
Alternatively, the system can use Q7.
During the Automatic Erase algorithm, Data Polling produces a "0" on Q7. When the Automatic Erase algorithm
is complete, or if the device enters the Erase Suspend
mode, Data Polling produces a "1" on Q7. This is analogous to the complement/true datum out-put described
for the Automatic Program algorithm: the erase function
changes all the bits in a sector to "1" prior to this, the
device outputs the "complement,” or "0".” The system
must provide an address within any of the sectors selected for erasure to read valid status information on Q7.
If a program address falls within a protected sector, Q6
toggles for approximately 2us after the program command sequence is written, then returns to reading array
data.
After an erase command sequence is written, if all sectors selected for erasing are protected, Data Polling on
Q7 is active for approximately 100 us, then the device
returns to reading array data. If not all selected sectors
are protected, the Automatic Erase algorithm erases the
unprotected sectors, and ignores the selected sectors
that are protected.
Q6 also toggles during the erase-suspend-program mode,
and stops toggling once the Automatic Program algorithm is complete.
Table 5 shows the outputs for Toggle Bit I on Q6.
When the system detects Q7 has changed from the
complement to true data, it can read valid data at Q7-Q0
on the following read cycles. This is because Q7 may
change asynchronously with Q0-Q6 while Output Enable
(OE) is asserted low.
Q2:Toggle Bit II
The "Toggle Bit II" on Q2, when used with Q6, indicates
whether a particular sector is actively erasing (that is,
the Automatic Erase algorithm is in process), or whether
that sector is erase-suspended. Toggle Bit II is valid
after the rising edge of the final WE or CE, whichever
happens first pulse in the command sequence.
Q6:Toggle BIT I
Toggle Bit I on Q6 indicates whether an Automatic Program or Erase algorithm is in progress or complete, or
whether the device has entered the Erase Suspend mode.
Toggle Bit I may be read at any address, and is valid
Q2 toggles when the system reads at addresses within
those sectors that have been selected for erasure. (The
system may use either OE or CE to control the read
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MX29LV320T/B
cycles.) But Q2 cannot distinguish whether the sector
is actively erasing or is erase-suspended. Q6, by comparison, indicates whether the device is actively erasing, or is in Erase Suspend, but cannot distinguish which
sectors are selected for erasure. Thus, both status bits
are required for sectors and mode information. Refer to
Table 5 to compare outputs for Q2 and Q6.
only operating functions of the device under this condition.
If this time-out condition occurs during sector erase operation, it specifies that a particular sector is bad and it
may not be reused. However, other sectors are still functional and may be used for the program or erase operation. The device must be reset to use other sectors.
Write the Reset command sequence to the device, and
then execute program or erase command sequence. This
allows the system to continue to use the other active
sectors in the device.
Reading Toggle Bits Q6/ Q2
Whenever the system initially begins reading toggle bit
status, it must read Q7-Q0 at least twice in a row to
determine whether a toggle bit is toggling. Typically, the
system would note and store the value of the toggle bit
after the first read. After the second read, the system
would compare the new value of the toggle bit with the
first. If the toggle bit is not toggling, the device has
completed the program or erase operation. The system
can read array data on Q7-Q0 on the following read cycle.
If this time-out condition occurs during the chip erase
operation, it specifies that the entire chip is bad or combination of sectors are bad.
If this time-out condition occurs during the byte/word programming operation, it specifies that the entire sector
containing that byte/word is bad and this sector maynot
be reused, (other sectors are still functional and can be
reused).
However, if after the initial two read cycles, the system
determines that the toggle bit is still toggling, the system also should note whether the value of Q5 is high
(see the section on Q5). If it is, the system should then
determine again whether the toggle bit is toggling, since
the toggle bit may have stopped toggling just as Q5 went
high. If the toggle bit is no longer toggling, the device
has successfully completed the program or erase operation. If it is still toggling, the device did not complete the
operation successfully, and the system must write the
reset command to return to reading array data.
The time-out condition may also appear if a user tries to
program a non blank location without erasing. In this
case the device locks out and never completes the Automatic Algorithm operation. Hence, the system never
reads a valid data on Q7 bit and Q6 never stops toggling.
Once the Device has exceeded timing limits, the Q5 bit
will indicate a "1". Please note that this is not a device
failure condition since the device was incorrectly used.
The Q5 failure condition may appear if the system tries
to program a "1" to a location that is previously programmed to "0". Only an erase operation can change a
"0" back to a "1".” Under this condition, the device halts
the operation, and when the operation has exceeded the
timing limits, Q5 produces a "1".
The remaining scenario is that system initially determines
that the toggle bit is toggling and Q5 has not gone high.
The system may continue to monitor the toggle bit and
Q5 through successive read cycles, determining the status as described in the previous paragraph. Alternatively,
it may choose to perform other system tasks. In this
case, the system must start at the beginning of the algorithm when it returns to determine the status of the
operation.
Q3:Sector Erase Timer
After the completion of the initial sector erase command
sequence, the sector erase time-out will begin. Q3 will
remain low until the time-out is complete. Data Polling
and Toggle Bit are valid after the initial sector erase command sequence.
Q5:Program/Erase Timing
Q5 will indicate if the program or erase time has exceeded
the specified limits(internal pulse count). Under these
conditions Q5 will produce a "1". This time-out condition
indicates that the program or erase cycle was not successfully completed. Data Polling and Toggle Bit are the
If Data Polling or the Toggle Bit indicates the device has
been written with a valid erase command, Q3 may be
used to determine if the sector erase timer window is
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MX29LV320T/B
still open. If Q3 is high ("1") the internally controlled
erase cycle has begun; attempts to write subsequent
commands to the device will be ignored until the erase
operation is completed as indicated by Data Polling or
Toggle Bit. If Q3 is low ("0"), the device will accept additional sector erase commands. To insure the command
has been accepted, the system software should check
the status of Q3 prior to and following each subsequent
sector erase command. If Q3 were high on the second
status check, the command may not have been accepted.
lect mode. The command is valid only when the device
is in the CFI mode.
If the time between additional erase commands from the
system can be less than 50us, the system need not to
monitor Q3.
RY/BY:READY/BUSY OUTPUT
The RY/BY is a dedicated, open-drain output pin that
indicates whether an Embedded Algorithm is in progress
or complete. The RY/BY status is valid after the rising
edge of the final WE pulse in the command sequence.
Since RY/BY is an open-drain output, several RY/BY pins
can be tied together in parallel with a pull-up resistor to
VCC .
If the output is low (Busy), the device is actively erasing
or programming. (This includes programming in the Erase
Suspend mode.) If the output is high (Ready), the device
is ready to read array data (includ-ing during the Erase
Suspend mode), or is in the standby mode.
QUERY COMMAND AND COMMON FLASH
INTERFACE (CFI) MODE
MX29LV320T/B is capable of operating in the CFI mode.
This mode all the host system to determine the manufacturer of the device such as operating parameters and
configuration. Two commands are required in CFI mode.
Query command of CFI mode is placed first, then the
Reset command exits CFI mode. These are described in
Table 3.
The single cycle Query command is valid only when the
device is in the Read mode, including Erase Suspend,
Standby mode, and Automatic Select mode; however, it
is ignored otherwise.
The Reset command exits from the CFI mode to the
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MX29LV320T/B
Table 6-1. CFI mode: Identification Data Values
(All values in these tables are in hexadecimal)
Description
Address (h)
Address (h)
(Word Mode)
(Byte Mode)
10
20
0051
11
22
0052
12
24
0059
13
26
0002
14
28
0000
15
2A
0040
16
2C
0000
17
2E
0000
18
30
0000
19
32
0000
1A
34
0000
Address (h)
Address (h)
Data (h)
(Word Mode)
(Byte Mode)
VCC supply, minimum (2.7V)
1B
36
0027
VCC supply, maximum (3.6V)
1C
38
0036
VPP supply, minimum (none)
1D
3A
0000
1E
3C
0000
1F
3E
0004
20
40
0000
21
42
000A
22
44
0000
23
46
0005
24
48
0000
Maximum timeout for individual sector erase times (2 X Typ)
25
4A
0004
Maximum timeout for full chip erase times (not supported)
26
4C
0000
Query-unique ASCII string "QRY"
Primary vendor command set and control interface ID code
Address for primary algorithm extended query table
Alternate vendor command set and control interface ID code (none)
Address for secondary algorithm extended query table (none)
Data (h)
Table 6-2. CFI Mode: System Interface Data Values
Description
VPP supply, maximum (none)
N
Typical timeout for single word/byte write (2 us)
N
Typical timeout for maximum size buffer write (2 us) (not supported)
N
Typical timeout for individual sector erase (2 ms)
N
Typical timeout for full chip erase (2 ms)
N
Maximum timeout for single word/byte write times (2 X Typ)
N
Maximum timeout for maximum size buffer write times (2 X Typ)
N
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MX29LV320T/B
Table 6-3. CFI Mode: Device Geometry Data Values
Description
Address (h)
Address (h)
(Word Mode)
(Byte Mode)
Device size (2 bytes)
27
4E
0016
Flash device interface code (02=asynchronous x8/x16)
28
50
0002
29
52
0000
2A
54
0000
2B
56
0000
Number of erase sector regions
2C
58
0002
Erase Sector Region 1 Information
2D
5A
0007
[2E,2D] = # of same-size sectors in region 1-1
2E
5C
0000
[30, 2F] = sector size in multiples of 256-bytes
2F
5E
0020
30
60
0000
31
62
003E
32
64
0000
33
66
0000
34
68
0001
35
6A
0000
36
6C
0000
37
6E
0000
38
70
0000
39
72
0000
3A
74
0000
3B
76
0000
3C
78
0000
N
Maximum number of bytes in multi-byte write (not supported)
Erase Sector Region 2 Information
Erase Sector Region 3 Information
Erase Sector Region 4 Information
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Data (h)
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MX29LV320T/B
Table 6-4. CFI Mode: Primary Vendor-Specific Extended Query Data Values
Description
Address (h)
Address (h)
(Word Mode)
(Byte Mode)
40
80
0050
41
82
0052
42
84
0049
Major version number, ASCII
43
86
0031
Minor version number, ASCII
44
88
0031
Address sensitive unlock (0=required, 1= not required)
45
8A
0000
Erase suspend (2= to read and write)
46
8C
0002
Sector protect (N= # of sectors/group)
47
8E
0004
Temporary sector unprotect (1=supported)
48
90
0001
Sector protect/Chip unprotect scheme
49
92
0004
Simultaneous R/W operation (0=not supported)
4A
94
0000
Burst mode type (0=not supported)
4B
96
0000
Page mode type (0=not supported)
4C
98
0000
ACC (Acceleration) Supply Minimum
4D
9A
00B5
4E
9C
00C5
4F
9E
000X
Query-unique ASCII string "PRI"
Data (h)
(0=not supported, D7-D4:Volt, D3-D0:100mV
ACC (Acceleration) Supply Maximum
(0=not supported, D7-D4:Volt, D3-D0:100mV
Top/Bottom Boot Sector Flag
02h=Bottom Boot Device, 03h=Top Boot Device
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MX29LV320T/B
ABSOLUTE MAXIMUM RATINGS
OPERATING RATINGS
Storage Temperature
Plastic Packages . . . . . . . . . . . . . ..... -65oC to +150oC
Ambient Temperature
with Power Applied. . . . . . . . . . . . . .... -65oC to +125oC
Voltage with Respect to Ground
VCC (Note 1) . . . . . . . . . . . . . . . . . -0.5 V to +4.0 V
A9, OE, and
RESET (Note 2) . . . . . . . . . . . ....-0.5 V to +12.5 V
All other pins (Note 1) . . . . . . . -0.5 V to VCC +0.5 V
Output Short Circuit Current (Note 3) . . . . . . 200 mA
Commercial (C) Devices
Ambient Temperature (TA ). . . . . . . . . . . . 0°C to +70°C
Industrial (I) Devices
Ambient Temperature (TA ). . . . . . . . . . -40°C to +85°C
VCC Supply Voltages
VCC for full voltage range. . . . . . . . . . . +2.7 V to 3.6 V
Operating ranges define those limits between which the
functionality of the device is guaranteed.
Notes:
1. Minimum DC voltage on input or I/O pins is -0.5 V.
During voltage transitions, input or I/O pins may overshoot VSS to -2.0 V for periods of up to 20ns. Maximum DC voltage on input or I/O pins is VCC +0.5 V.
During voltage transitions, input or I/O pins may overshoot to VCC +2.0 V for periods up to 20 ns.
2. Minimum DC input voltage on pins A9, OE, and
RESET is -0.5 V. During voltage transitions, A9, OE,
and RESET may overshoot VSS to -2.0 V for periods
of up to 20 ns. Maximum DC input voltage on pin A9
is +12.5 V which may overshoot to 14.0 V for periods
up to 20 ns.
3. No more than one output may be shorted to ground at
a time. Duration of the short circuit should not be
greater than one second.
Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device.
This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational sections of this data sheet is
not implied. Exposure of the device to absolute maximum rating conditions for extended periods may affect
device reliability.
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MX29LV320T/B
DC CHARACTERISTICS VCC=2.7V~3.6V
Para- Description
meter
ILI
Input Load Current
(Note 1)
ILIT A9 Input Load Current
ILO
ICC1
ICC2
ICC3
ICC4
ICC5
IACC
VIL
VIH
VHH
VID
VOL
VOH1
VOH2
VLKO
Test Conditions
°C
TA=0°
°C to 70°
Min Typ Max
±1.0
VIN = VSS to VCC,
VCC = VCC max
VCC = VCC max,
A9=12.5V
Output Leakage Current
VOUT = VSS to VCC ,
VCC = VCC max
VCC Active Read Current
CE= VIL, 5 MHz
(Notes 2, 3)
OE = VIH 1 MHz
VCC Active Write Current
CE= VIL , OE = VIH,
(Notes 2, 4, 6)
WE=VIL
VCC Standby Current
CE, RESET,
(Note 2)
WP/ACC = VCC±0.3V
VCC Reset Current (Note 2)
RESET = VSS ± 0.3V,
WP/ACC= VCC ± 0.3V
Automatic Sleep Mode
VIH = VCC ± 0.3V;
(Notes 2,5)
VIL = VSS ± 0.3V,
WP/ACC=VCC±0.3V
WP/ACC Accelerated Program CE=VIL, WP/ACC pin
Current, Word or Byte
OE=VIH VCC pin
Input Low Voltage
-0.5
Input High Voltage
0.7xVcc
Voltage for WP/ACC Sector
VCC = 3.0 V ± 10%
11.5
Protect/Unprotect and
Program Acceleration
Voltage for Automatic Select VCC = 3.0 V ± 10%
11.5
and Temporary Sector
Unprotect
Output Low Voltage
IOL=4.0mA,
VCC=VCC min
Output High Voltage
IOH=-2.0mA,
0.85Vcc
VCC=VCC min
IOH=-100uA,
Vcc-0.4
VCC = VCC min
Low VCC Lock-Out Voltage
1.4
(Note 6)
°C
TA=-40°
°C to 85°
Min Typ Max Unit
±1.0 uA
35
45
uA
±1.0
±1.0
uA
10
2
15
16
4
30
10
2
15
16
4
30
mA
mA
mA
0.2
15
0.2
15
uA
0.2
15
0.2
15
uA
0.2
15
0.2
15
uA
5
15
10
5
10
mA
30
15
30
mA
0.8
-0.5
0.8
V
Vcc+0.3 0.7xVcc
Vcc+0.3 V
12.5
11.5
12.5
V
12.5
11.5
0.45
2.1
12.5
V
0.45
V
0.85Vcc
V
Vcc-0.4
V
1.4
2.1
V
Notes:
1. On the WP/ACC pin only, the maximum input load current when WP/ACC = VIL is ± 5.0uA / VIH is ± 3.0uA.
2. Maximum ICC specifications are tested with VCC = VCC max.
3. The ICC current listed is typically is less than 2 mA/MHz, with OE at VIH. Typical specifications are for VCC = 3.0V.
4. ICC active while Embedded Erase or Embedded Program is in progress.
5. Automatic sleep mode enables the low power mode when addresses remain stable for tACC + 30 ns. Typical sleep
mode current is 200 nA.
6. Not 100% tested.
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MX29LV320T/B
SWITCHING TEST CIRCUITS
TEST SPECIFICATIONS
DEVICE UNDER
Test Condition
Output Load
Output Load Capacitance,CL
(including jig capacitance)
Input Rise and Fall Times
Input Pulse Levels
Input timing measurement
reference levels
Output timing measurement
reference levels
1.6K ohm
+3.3V
TEST
CL
6.2K ohm
DIODES=IN3064
OR EQUIVALENT
70
90 120 Unit
1 TTL gate
30
30 100 pF
5
0.0-3.0
1.5
ns
V
V
1.5
V
KEY TO SWITCHING WAVEFORMS
WAVEFROM
INPUTS
OUTPUTS
Steady
Changing from H to L
Changing from L to H
Don't Care, Any Change Permitted
Changing, State Unknown
Does Not Apply
Center Line is High Impedance State(High Z)
SWITCHING TEST WAVEFORMS
3.0V
1.5V
Measurement Level
1.5V
0.0V
INPUT
OUTPUT
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MX29LV320T/B
AC CHARACTERISTICS
Symbol
tACC
°C, VCC=2.7V~3.6V
TA=-40°
°C to 85°
DESCRIPTION
Address to output delay
tCE
tOE
tDF
tOH
Chip enable to output delay
Output enable to output delay
OE High to output float(Note1)
Output hold time of from the rising edge of
Address, CE, or OE, whichever happens first
tRC
Read cycle time (Note 1)
tWC
Write cycle time (Note 1)
tCWC
Command write cycle time(Note 1)
tAS
Address setup time
tAH
Address hold time
tDS
Data setup time
tDH
Data hold time
tVCS
Vcc setup time(Note 1)
tCS
Chip enable setup time
tCH
Chip enable hold time
tOES
Output enable setup time (Note 1)
tOEH
Output enable hold time (Note 1) Read
Toggle &
Data Polling
tWES
WE setup time
tWEH
WE hold time
tCEP
CE pulse width
tCEPH
CE pulse width high
tWP
WE pulse width
tWPH
WE pulse width high
tBUSY
Program/Erase valid to RY/BY delay
tGHWL
Read recovery time before write
tGHEL
Read recovery time before write
tWHWH1 Programming operation
BYTE
WORD
Accelerated programming operation word or
byte
tWHWH2 Sector erase operation
tBAL
Sector address hold time
Note:
CONDITION
CE=VIL
MAX
OE=VIL
OE=VIL
MAX
MAX
MAX
MIN
70
70
90
90
120
120
Unit
ns
70
40
30
0
90
40
30
0
120
50
30
0
ns
ns
ns
ns
MIN
MIN
MIN
MIN
MIN
MIN
MIN
MIN
MIN
MIN
MIN
MIN
MIN
70
70
70
0
45
45
0
50
0
0
0
0
10
90
90
90
0
45
45
0
50
0
0
0
0
10
120
120
120
0
50
50
0
50
0
0
0
0
10
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
MIN
MIN
MIN
MIN
MIN
MIN
MAX
MIN
MIN
TYP
TYP
TYP
0
0
45
30
45
30
90
0
0
9
11
7
0
0
45
30
45
30
90
0
0
9
11
7
0
0
50
30
50
30
90
0
0
9
11
7
ns
ns
ns
ns
ns
ns
ns
ns
ns
us
us
us
TYP
MAX
0.9
50
0.9
50
0.9
50
sec
us
1.Not 100% Tested
2.tr = tf = 5ns
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MX29LV320T/B
Fig 1. COMMAND WRITE OPERATION
VCC
Addresses
3V
VIH
ADD Valid
VIL
tAH
tAS
WE
VIH
VIL
tOES
tWPH
tWP
tCWC
CE
VIH
VIL
tCS
OE
tCH
VIH
VIL
tDS
tDH
VIH
Data
DIN
VIL
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MX29LV320T/B
READ/RESET OPERATION
Fig 2. READ TIMING WAVEFORMS
tRC
VIH
ADD Valid
Addresses
VIL
tCE
VIH
CE
VIL
VIH
WE
VIL
OE
VIH
VIL
Outputs
tDF
tOE
tOEH
VOH
tACC
HIGH Z
tOH
DATA Valid
HIGH Z
VOL
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MX29LV320T/B
AC CHARACTERISTICS
Parameter
Description
Test Setup All Speed Options Unit
tREADY1
RESET PIN Low (During Automatic Algorithms)
MAX
20
us
MAX
500
ns
to Read or Write (See Note)
tREADY2
RESET PIN Low (NOT During Automatic
Algorithms) to Read or Write (See Note)
tRP1
RESET Pulse Width (During Automatic Algorithms)
MIN
10
us
tRP2
RESET Pulse Width (NOT During Automatic Algorithms)
MIN
500
ns
tRH
RESET High Time Before Read(See Note)
MIN
70
ns
tRB1
RY/BY Recovery Time(to CE, OE go low)
MIN
0
ns
tRB2
RY/BY Recovery Time(to WE go low)
MIN
50
ns
Note:Not 100% tested
Fig 3. RESET TIMING WAVEFORM
RY/BY
CE, OE
tRH
RESET
tRP2
tReady2
Reset Timing NOT during Automatic Algorithms
tReady1
RY/BY
tRB1
CE, OE
WE
tRB2
RESET
tRP1
Reset Timing during Automatic Algorithms
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MX29LV320T/B
ERASE/PROGRAM OPERATION
Fig 4. AUTOMATIC CHIP ERASE TIMING WAVEFORM
Erase Command Sequence(last two cycle)
tWC
2AAh
Address
Read Status Data
tAS
VA
SA
555h for chip erase
VA
tAH
CE
tCH
tGHWL
OE
tWHWH2
tWP
WE
tCS
tWPH
tDS tDH
55h
In
Progress Complete
10h
Data
tBUSY
tRB
RY/BY
tVCS
VCC
NOTES:
SA=sector address(for Sector Erase), VA=Valid Address for reading status data(see "Write Operation Status").
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MX29LV320T/B
Fig 5. AUTOMATIC CHIP ERASE ALGORITHM FLOWCHART
START
Write Data AAH Address 555H
Write Data 55H Address 2AAH
Write Data 80H Address 555H
Write Data AAH Address 555H
Write Data 55H Address 2AAH
Write Data 10H Address 555H
Data Poll
from system
YES
No
DATA = FFh ?
YES
Auto Erase Completed
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MX29LV320T/B
Fig 6. AUTOMATIC SECTOR ERASE TIMING WAVEFORM
Erase Command Sequence(last two cycle)
tWC
Sector
Address 0
2AAh
Address
Read Status Data
tAS
Sector
Address 1
Sector
Address n
VA
VA
tAH
CE
tCH
tGHWL
OE
WE
tCS
tWHWH2
tBAL
tWP
tWPH
tDS tDH
55h
30h
30h
30h
In
Progress Complete
Data
tBUSY
tRB
RY/BY
tVCS
VCC
NOTES:
SA=sector address(for Sector Erase), VA=Valid Address for reading status data(see "Write Operation Status").
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MX29LV320T/B
Fig 7. AUTOMATIC SECTOR ERASE ALGORITHM FLOWCHART
START
Write Data AAH Address 555H
Write Data 55H Address 2AAH
Write Data 80H Address 555H
Write Data AAH Address 555H
Write Data 55H Address 2AAH
Write Data 30H Sector Address
NO
Last Sector
to Erase ?
YES
Data Poll from System
NO
Data=FFh?
YES
Auto Sector Erase Completed
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MX29LV320T/B
Fig 8. ERASE SUSPEND/RESUME FLOWCHART
START
Write Data B0H
NO
ERASE SUSPEND
Toggle Bit checking Q6
not toggled
YES
Read Array or
Program
Reading or
Programming End
NO
YES
Write Data 30H
ERASE RESUME
Continue Erase
Another
Erase Suspend ?
NO
YES
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MX29LV320T/B
Fig 9. AUTOMATIC PROGRAM TIMING WAVEFORMS
Program Command Sequence(last two cycle)
tWC
555h
Address
Read Status Data (last two cycle)
tAS
PA
PA
PA
tAH
CE
tCH
tGHWL
OE
tWHWH1
tWP
WE
tCS
tWPH
tDS
tDH
A0h
Status
PD
DOUT
Data
tBUSY
tRB
RY/BY
tVCS
VCC
NOTES:
1.PA=Program Address, PD=Program Data, DOUT is the true data the program address
Fig 10. Accelerated Program Timing Diagram
(11.5V ~ 12.5V)
VHH
WP/ACC
VIL or VIH
VIL or VIH
tVHH
tVHH
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MX29LV320T/B
Fig 11. CE CONTROLLED WRITE TIMING WAVEFORM
555 for program
2AA for erase
PA for program
SA for sector erase
555 for chip erase
Data Polling
Address
PA
tWC
tAS
tAH
tWH
WE
tGHEL
OE
tCP
tWHWH1 or 2
CE
tCPH
tWS
tDS
tBUSY
tDH
Q7
Data
tRH
A0 for program
55 for erase
DOUT
PD for program
30 for sector erase
10 for chip erase
RESET
RY/BY
NOTES:
1. PA=Program Address, PD=Program Data, DOUT=Data Out, Q7=complement of data written to device.
2. Figure indicates the last two bus cycles of the command sequence.
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MX29LV320T/B
Fig 12. AUTOMATIC PROGRAMMING ALGORITHM FLOWCHART
START
Write Data AAH Address 555H
Write Data 55H Address 2AAH
Write Data A0H Address 555H
Write Program Data/Address
Data Poll
from system
Increment
Address
No
Verify Data OK ?
YES
No
Last Address ?
YES
Auto Program Completed
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MX29LV320T/B
SECTOR GROUP PROTECT/CHIP UNPROTECT
Fig 13. Sector Group Protect/Chip Unprotect Waveform (RESET Control)
VID
VIH
RESET
SA, A6
A1, A0
Valid (note2)
Valid (note2)
Sector Group Protect or Chip Unprotect
Data
60h
1us
60h
Valid (note2)
Verify
40h
Status
Sector Group Protect: 150us
Chip Unprotect: Time out timing (note 1)
CE
WE
OE
Note:
1. If TA range during 0°C to 70°C, the time out timing is 15ms.
If TA range during -40°C to 85°C, the time out timing is 18ms.
2. For sector group protect A6=0, A1=1, A0=0 ; for chip unprotect A6=1, A1=1, A0=0
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MX29LV320T/B
Fig 14. SECTOR GROUP PROTECT TIMING WAVEFORM (A9, OE Control)
A1
A6
12V
3V
A9
tVLHT
Verify
12V
3V
OE
tVLHT
tVLHT
tWPP 1
WE
tOESP
CE
Data
01H
F0H
tOE
A20-A12
Sector Address
Notes: tVLHT (Voltage transition time)=4us min.
tWPP1 (Write pulse width for sector group protect)=100ns min.
tOESP (OE setup time to WE active)=4us min.
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MX29LV320T/B
Fig 15. SECTOR GROUP PROTECTION ALGORITHM (A9, OE Control)
START
Set Up Sector Addr
PLSCNT=1
OE=VID, A9=VID, CE=VIL
A6=VIL
Activate WE Pulse
Time Out 150us
Set WE=VIH, CE=OE=VIL
A9 should remain VID
Read from Sector
Addr=SA, A1=1, A6=0, A0=0
No
PLSCNT=32?
.
No
Data=01H?
Yes
Device Failed
Protect Another
Sector?
Yes
Remove VID from A9
Write Reset Command
Sector Group Protection
Complete
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MX29LV320T/B
Fig 16. CHIP UNPROTECT TIMING WAVEFORM (A9, OE Control)
A1
12V
3V
A9
tVLHT
A6
Verify
12V
3V
OE
tVLHT
tVLHT
tWPP 2
WE
tOESP
CE
Data
00H
F0H
tOE
Notes: tVLHT (Voltage transition time)=4us min.
tWPP2 (Write pulse width for chip unprotect)=100ns min.
tOESP (OE setup time to WE active)=4us min.
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MX29LV320T/B
Fig 17. CHIP UNPROTECT FLOWCHART(A9, OE Control)
START
Protect All Sectors
PLSCNT=1
Set OE=A9=VID
CE=VIL, A6=1
Activate WE Pulse
Time Out Timing (note 1)
Increment
PLSCNT
Set OE=CE=VIL
A9=VID, A1=1, A6=A0=0
Set Up First Sector Addr
Read Data from Device
No
Data=00H?
Increment
Sector Addr
Yes
No
All sectors have
been verified?
No
PLSCNT=1000?
Yes
Device Failed
Yes
Remove VID from A9
Write Reset Command
Chip Unprotect
Complete
* It is recommended before unprotect whole chip, all sectors should be protected in advance.
Note:
1. If TA range during 0°C to 70°C, the time out timing is 15ms.
If TA range during -40°C to 85°C, the time out timing is 18ms.
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MX29LV320T/B
Fig 18. IN-SYSTEM SECTOR GROUP PROTECT/CHIP UNPROTECT ALGORITHMS WITH RESET=VID
START
START
Protect all sectors:
The indicated portion of
the sector protect algorithm
must be performed
for all unprotected sectors
prior to issuing the first
sector unprotect address
PLSCNT=1
RESET=VID
Wait 1us
PLSCNT=1
RESET=VID
Wait 1us
Temporary Sector
Unprotect Mode
No
First Write
Cycle=60h?
First Write
Cycle=60h?
No
Temporary Sector
Unprotect Mode
Yes
Yes
Set up sector address
No
Sector Protect:
Write 60h to sector
address with
A6=0, A1=1, A0=0
All sectors
protected?
Yes
Set up first sector address
Wait 150us
Verify Sector Protect:
Write 40h to sector
address with
A6=0, A1=1, A0=0
Chip Unprotect:
Write 60h to sector
address with
A6=1, A1=1, A0=0
Reset
PLSCNT=1
Increment PLSCNT
Time Out Timing (note 1)
Read from
sector address
with
A6=0, A1=1, A0=0
Verify Sector Unprotect:
Write 40h to sector
address with
A6=1, A1=1, A0=0
No
Increment PLSCNT
No
PLSCNT=25?
Yes
Data=01h?
Read from
sector address
with
A6=1, A1=1, A0=0
Yes
No
Device failed
Protect another
sector?
Sector Protect
Algorithm
Reset
PLSCNT=1
Yes
No
PLSCNT=1000?
Data=00h?
No
Yes
Remove VID from RESET
Yes
Device failed
Last sector
verified?
Write reset command
Chip Unprotect
Algorithm
Sector Protect complete
No
Yes
Remove VID from RESET
Write reset command
Chip Unprotect complete
Note:
1. If TA range during 0°C to 70°C, the time out timing is 15ms.
If TA range during -40°C to 85°C, the time out timing is 18ms.
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MX29LV320T/B
Table 7. TEMPORARY SECTOR GROUP UNPROTECT
Parameter Std. Description
Test Setup All Speed Options Unit
tVIDR
VID Rise and Fall Time (See Note)
Min
500
ns
tRSP
RESET Setup Time for Temporary Sector Unprotect
Min
4
us
Note:
Not 100% tested
Fig 19. TEMPORARY SECTOR GROUP UNPROTECT WAVEFORMS
12V
RESET
0 or 3V
VIL or VIH
tVIDR
tVIDR
Program or Erase Command Sequence
CE
WE
tRSP
RY/BY
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MX29LV320T/B
Fig 20. TEMPORARY SECTOR GROUP UNPROTECT FLOWCHART
Start
RESET = VID (Note 1)
Perform Erase or Program Operation
Operation Completed
RESET = VIH
Temporary Sector Unprotect Completed(Note 2)
Note : 1. All protected sectors are temporary unprotected. VID=11.5V~12.5V.
(if WP/ACC=VIL, outermost boot sectors will remain protected)
2. All previously protected sectors are protected again.
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MX29LV320T/B
Fig 21. SILICON ID READ TIMING WAVEFORM
VCC
3V
VID
VIH
VIL
ADD
A9
ADD
A0
VIH
A1
VIH
VIL
tACC
tACC
VIL
VIH
ADD
VIL
CE
VIH
VIL
WE
VIH
tCE
VIL
OE
VIH
tOE
VIL
tDF
tOH
tOH
VIH
DATA
Q0-Q7
DATA OUT
DATA OUT
C2H
A7H (TOP boot)
A8H (Bottom boot)
VIL
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MX29LV320T/B
WRITE OPERATION STATUS
Fig 22. DATA POLLING TIMING WAVEFORMS (DURING AUTOMATIC ALGORITHMS)
tRC
Address
VA
VA
tACC
tCE
CE
tCH
tOE
OE
tOEH
tDF
WE
tOH
Q7
Status Data
Complement
True
Valid Data
Q0-Q6
Status Data
Status Data
True
Valid Data
High Z
High Z
tBUSY
RY/BY
NOTES:
VA=Valid address. Figure shows are first status cycle after command sequence, last status read cycle, and array data read cycle.
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MX29LV320T/B
Fig 23. Data Polling Algorithm
START
Read Q7~Q0
Add. = VA (1)
Q7 = Data ?
Yes
No
No
Q5 = 1 ?
Yes
Read Q7~Q0
Add. = VA
Yes
Q7 = Data ?
(2)
No
PASS
FAIL
Notes:
1. VA=valid address for programming or erasure.
2. Q7 should be rechecked even Q5="1"because Q7 may change simultaneously with Q5.
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MX29LV320T/B
Fig 24. TOGGLE BIT TIMING WAVEFORMS (DURING AUTOMATIC ALGORITHMS)
tRC
Address
VA
VA
VA
VA
tACC
tCE
CE
tCH
tOE
OE
tOEH
tDF
WE
tOH
Q6/Q2
Valid Status
(first read)
Valid Status
Valid Data
(second read)
(stops toggling)
Valid Data
tBUSY
RY/BY
NOTES:
VA=Valid address; not required for Q6. Figure shows first two status cycle after command sequence, last status read cycle, and
array data read cycle.
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MX29LV320T/B
Fig 25. Toggle Bit Algorithm
START
Read Q7~Q0
Read Q7~Q0
(Note 1)
NO
Toggle Bit Q6
=Toggle?
YES
NO
Q5=1?
YES
(Note 1,2)
Read Q7~Q0 Twice
Toggle Bit Q6=
Toggle?
YES
Program/Erase Operation Not
Complete, Write Reset Command
Program/Erase Operation Complete
Note:
1.Read toggle bit twice to determine whether or not it is toggling.
2.Recheck toggle bit because it may stop toggling as Q5 changes to "1".
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MX29LV320T/B
Fig 26. Q6 versus Q2
Enter Embedded
Erasing
Erase
Suspend
Erase
WE
Enter Erase
Suspend Program
Erase Suspend
Read
Erase
Resume
Erase
Suspend
Program
Erase Suspend
Read
Erase
Erase
Complete
Q6
Q2
NOTES:
The system can use OE or CE to toggle Q2/Q6, Q2 toggles only when read at an address within an erase-suspended
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MX29LV320T/B
ERASE AND PROGRAMMING PERFORMANCE(1)
LIMITS
PARAMETER
MIN.
TYP.(2)
MAX.
UNITS
Sector Erase Time
0.9
15
sec
Chip Erase Time
35
50
sec
Byte Programming Time
9
300
us
Word Program Time
11
360
us
Byte Mode
36
108
sec
Word Mode
24
72
sec
7
210
us
Chip Programming Time
Accelerated Byte/Word Program Time
Erase/Program Cycles
Note:
100,000
Cycles
1.Not 100% Tested, Excludes external system level over head.
2.Typical values measured at 25°C,3.3V.
LATCH-UP CHARACTERISTICS
MIN.
MAX.
Input Voltage with respect to GND on all pins except I/O pins
-1.0V
12.5V
Input Voltage with respect to GND on all I/O pins
-1.0V
Vcc + 1.0V
-100mA
+100mA
VCC Current
Includes all pins except Vcc. Test conditions: Vcc = 3.0V, one pin at a time.
TSOP PIN CAPACITANCE
Parameter Symbol
Parameter Description
Test Set
TYP
MAX
UNIT
CIN
Input Capacitance
VIN=0
6
7.5
pF
COUT
Output Capacitance
VOUT=0
8.5
12
pF
CIN2
Control Pin Capacitance
VIN=0
7.5
9
pF
Notes:
1. Sampled, not 100% tested.
2. Test conditions TA=25°C, f=1.0MHz
DATA RETENTION
Parameter
Test Conditions
Min
Unit
Minimum Pattern Data Retention Time
150°C
10
Years
125°C
20
Years
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MX29LV320T/B
ORDERING INFORMATION
PLASTIC PACKAGE
PART NO.
ACCESS TIME
Ball Pitch/
(ns)
Ball Size
MX29LV320TTC-70
70
-
48 Pin TSOP
MX29LV320BTC-70
70
-
48 Pin TSOP
MX29LV320TTI-70
70
-
48 Pin TSOP
MX29LV320BTI-70
70
-
48 Pin TSOP
MX29LV320TTC-90
90
-
48 Pin TSOP
MX29LV320BTC-90
90
-
48 Pin TSOP
MX29LV320TTI-90
90
-
48 Pin TSOP
MX29LV320BTI-90
90
-
48 Pin TSOP
MX29LV320TTI-12
120
-
48 Pin TSOP
MX29LV320BTI-12
120
-
48 Pin TSOP
MX29LV320TXBC-70
70
0.8mm/0.3mm
48-Ball CSP
MX29LV320BXBC-70
70
0.8mm/0.3mm
48-Ball CSP
MX29LV320TXEC-70
70
0.8mm/0.4mm
48-Ball CSP
MX29LV320BXEC-70
70
0.8mm/0.4mm
48-Ball CSP
MX29LV320TXBI-70
70
0.8mm/0.3mm
48-Ball CSP
MX29LV320BXBI-70
70
0.8mm/0.3mm
48-Ball CSP
MX29LV320TXEI-70
70
0.8mm/0.4mm
48-Ball CSP
MX29LV320BXEI-70
70
0.8mm/0.4mm
48-Ball CSP
MX29LV320TXBC-90
90
0.8mm/0.3mm
48-Ball CSP
MX29LV320BXBC-90
90
0.8mm/0.3mm
48-Ball CSP
MX29LV320TXEC-90
90
0.8mm/0.4mm
48-Ball CSP
MX29LV320BXEC-90
90
0.8mm/0.4mm
48-Ball CSP
MX29LV320TXBI-90
90
0.8mm/0.3mm
48-Ball CSP
MX29LV320BXBI-90
90
0.8mm/0.3mm
48-Ball CSP
MX29LV320TXEI-90
90
0.8mm/0.4mm
48-Ball CSP
MX29LV320BXEI-90
90
0.8mm/0.4mm
48-Ball CSP
MX29LV320TXBC-12
120
0.8mm/0.3mm
48-Ball CSP
MX29LV320BXBC-12
120
0.8mm/0.3mm
48-Ball CSP
MX29LV320TXEC-12
120
0.8mm/0.4mm
48-Ball CSP
MX29LV320BXEC-12
120
0.8mm/0.4mm
48-Ball CSP
MX29LV320TXBI-12
120
0.8mm/0.3mm
48-Ball CSP
MX29LV320BXBI-12
120
0.8mm/0.3mm
48-Ball CSP
MX29LV320TXEI-12
120
0.8mm/0.4mm
48-Ball CSP
MX29LV320BXEI-12
120
0.8mm/0.4mm
48-Ball CSP
P/N:PM0742
PACKAGE
Remark
REV. 1.4, JUL. 04, 2003
57
MX29LV320T/B
PART NO.
ACCESS TIME
Ball Pitch/
PACKAGE
Remark
(ns)
Ball Size
MX29LV320TTC-70G
70
-
48 Pin TSOP
PB free
MX29LV320BTC-70G
70
-
48 Pin TSOP
PB free
MX29LV320TTI-70G
70
-
48 Pin TSOP
PB free
MX29LV320BTI-70G
70
-
48 Pin TSOP
PB free
MX29LV320TTC-90G
90
-
48 Pin TSOP
PB free
MX29LV320BTC-90G
90
-
48 Pin TSOP
PB free
MX29LV320TTI-90G
90
-
48 Pin TSOP
PB free
MX29LV320BTI-90G
90
-
48 Pin TSOP
PB free
MX29LV320TTI-12G
120
-
48 Pin TSOP
PB free
MX29LV320BTI-12G
120
-
48 Pin TSOP
PB free
MX29LV320TXBC-70G
70
0.8mm/0.3mm
48-Ball CSP
PB free
MX29LV320BXBC-70G
70
0.8mm/0.3mm
48-Ball CSP
PB free
MX29LV320TXEC-70G
70
0.8mm/0.4mm
48-Ball CSP
PB free
MX29LV320BXEC-70G
70
0.8mm/0.4mm
48-Ball CSP
PB free
MX29LV320TXBI-70G
70
0.8mm/0.3mm
48-Ball CSP
PB free
MX29LV320BXBI-70G
70
0.8mm/0.3mm
48-Ball CSP
PB free
MX29LV320TXEI-70G
70
0.8mm/0.4mm
48-Ball CSP
PB free
MX29LV320BXEI-70G
70
0.8mm/0.4mm
48-Ball CSP
PB free
MX29LV320TXBC-90G
90
0.8mm/0.3mm
48-Ball CSP
PB free
MX29LV320BXBC-90G
90
0.8mm/0.3mm
48-Ball CSP
PB free
MX29LV320TXEC-90G
90
0.8mm/0.4mm
48-Ball CSP
PB free
MX29LV320BXEC-90G
90
0.8mm/0.4mm
48-Ball CSP
PB free
MX29LV320TXBI-90G
90
0.8mm/0.3mm
48-Ball CSP
PB free
MX29LV320BXBI-90G
90
0.8mm/0.3mm
48-Ball CSP
PB free
MX29LV320TXEI-90G
90
0.8mm/0.4mm
48-Ball CSP
PB free
MX29LV320BXEI-90G
90
0.8mm/0.4mm
48-Ball CSP
PB free
MX29LV320TXBC-12G
120
0.8mm/0.3mm
48-Ball CSP
PB free
MX29LV320BXBC-12G
120
0.8mm/0.3mm
48-Ball CSP
PB free
MX29LV320TXEC-12G
120
0.8mm/0.4mm
48-Ball CSP
PB free
MX29LV320BXEC-12G
120
0.8mm/0.4mm
48-Ball CSP
PB free
MX29LV320TXBI-12G
120
0.8mm/0.3mm
48-Ball CSP
PB free
MX29LV320BXBI-12G
120
0.8mm/0.3mm
48-Ball CSP
PB free
MX29LV320TXEI-12G
120
0.8mm/0.4mm
48-Ball CSP
PB free
MX29LV320BXEI-12G
120
0.8mm/0.4mm
48-Ball CSP
PB free
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MX29LV320T/B
PACKAGE INFORMATION
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MX29LV320T/B
REVISION HISTORY
Revision No. Description
1.0
1. To removed "Advanced Information"
2. To modify Package Information
3. To modify sector erasy timing wavefrom and added tBAL
timing in the AC Characteristics table
1.1
1. To modify the chip erase time from typ. 112sec to
typ. 35sec/max.50sec
2. To modify the sector erase time from typ. 1.6sec to typ. 0.9sec
1.2
1. To modify ILIT parameter value from 35uA to 45uA during
TA=-40°C to 85°C in DC Characteristics
2. To modify the chip unprotection time out timing during
TA=-40°C to 85°C range from 15ms to 18ms
3. Remove 70/90R information
1.3
1. To added PB-free part no. in ordering information
1.4
1. To corrected the fast program timing from normal program speed
to ACC program speed
P/N:PM0742
Page
P1
P57~59
P30,36
Date
NOV/21/2002
P2,56
FEB/10/2003
P30,56
P28
MAR/26/2003
P42,46,47
P27~30, 57
P58
APR/23/2003
P1
JUL/04/2003
REV. 1.4, JUL. 04, 2003
62
MX29LV320T/B
MACRONIX INTERNATIONAL CO., LTD.
HEADQUARTERS:
TEL:+886-3-578-6688
FAX:+886-3-563-2888
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TEL:+32-2-456-8020
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FAX:+65-348-8096
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CHICAGO OFFICE:
TEL:+1-847-963-1900
FAX:+1-847-963-1909
http : //www.macronix.com
MACRONIX INTERNATIONAL CO., LTD. reserves the right to change product and specifications without notice.