NCP4810 X2 Capacitors Discharger The NCP4810 is a HV switch suitable for implementation of the X2 capacitor discharge function in applications with extremely low standby consumption requirements. It contains two high voltage MOSFETs with 700 V peak capabilities that can be connected directly to AC line voltage. Implementing this IC helps to design optimized EMI filter with appropriate X2 capacitor and reduced EMI coil volume and losses. http://onsemi.com MARKING DIAGRAM Features • • • • • • • 8 Build−in 700 V MOSFET Minimum Discharge Capability 0.85 mA Self Consumption Below 11 mW @ 700 V NoVCC Necessary Compact SOIC−8 Package −40°C to + 125°C Operating Temperature Range This is a Pb−Free Device 8 1 NCP4810G ALYWX 1 A L Y W X G Typical Applications • • • • SOIC−8 D SUFFIX CASE 751 Auxiliary Power Supply AC−DC Adapter Standby Power Supply Offline Battery Charger = Assembly Location = Wafer Lot = Year = Work Week = Assembly Lot = Pb−Free Package PINOUT NC NC AC1 AC2 AC1 AC2 NC NC ORDERING INFORMATION Device NCP4810DR2G Package Shipping† SOIC−8 (Pb−Free) 2500 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2013 September, 2013 − Rev. 0 1 Publication Order Number: NCP4810/D NCP4810 X1−1 R1 NCP4810 L1 CX1 AC input X2−2 AC1 CX2 C1 AC2 DC output X2−1 R2 GND X1−2 Figure 1. Typical Application Example of the X2 Discharger PIN FUNCTION DESCRIPTION Pin N5 Pin Name Function Pin Description 1 NC Not connected − 2 AC1 Alternate Current 1 Terminal for connections AC line 3 AC1 Alternate Current 1 Terminal for connections AC line 4 NC Not connected − 5 NC Not connected − 6 AC2 Alternate Current 2 Terminal for connections AC line 7 AC2 Alternate Current 2 Terminal for connections AC line 8 NC Not connected − AC1 + Idisch − Tdel delay S SET Q R CLR Q VAC(start) R SET Q VAC(start) − AC2 Tdel delay S CLR Q Idisch + Figure 2. Simplified Circuit Architecture http://onsemi.com 2 NCP4810 MAXIMUM RATINGS Rating Symbol Value Unit VHV −700 to 700 V RqJ−A 162 °C/W Junction Temperature TJ −40 to +150 °C Storage Temperature Range Tstg −60 to +150 °C ESD Capability, HBM model per JEDEC standard JESD22, Method A114E VESD−HBM 4 kV ESD Capability, Machine Model per JEDEC standard JESD22, Method A115A VESD−MM 600 V AC1 pin Voltage related to AC2 pin Thermal Resistance, Junction−to−Air (50 mm2 x 35 mm Cu) Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. The latchup tests were not provided on this device because of two function pins only. ELECTRICAL CHARACTERISTICS (for typical values TJ = 25°C, for min/max values TJ = −40°C to +125°C, unless otherwise noted.) Parameter Conditions Symbol Min Typ Max Unit VAC = 400 Vdc Idisch 0.85 − − mA IAC = Idisch * 0.95 VAC(start) − − 40 Vdc VAC = 700 Vdc IAC(leak) − 7 15 mA − Tdel 15 − − ms HV PIN Discharge current capability Minimum HV voltage IHV or IHV(strat) leakage current INTERNAL TIMER Internal timer http://onsemi.com 3 NCP4810 TYPICAL CHARACTERISTICS 9.5 1.75 1.50 8.5 Idisch (mA) IAC(Leak) (mA) 9.0 8.0 1.00 7.5 7.0 −40 −25 −10 25.00 1.25 5 20 35 50 65 TEMPERATURE (°C) 80 95 110 125 Figure 3. IHV or IHV(start) Leakage Current, IAC(Leak) 0.75 −40 −25 −10 5 20 35 50 65 TEMPERATURE (°C) 80 95 110 125 Figure 4. Discharge Current Capability, Idisch 55 50 45 Tdel (ms) VAC(start) (V) 24.75 24.50 40 35 24.25 30 24.00 −40 −25 −10 5 20 35 50 65 TEMPERATURE (°C) 80 95 110 125 25 −40 −25 −10 Figure 5. Minimum HV Voltage, VAC(start) 5 20 35 50 65 TEMPERATURE (°C) 80 95 110 125 Figure 6. Internal Timer, Tdel Function Description: function refer to the input voltage behavior is described on Figure 7. The input sinusoidal voltage resets the relevant internal timer by transitioning across zero level at each its half wave. If no zero cross is detected, the internal timer expires and the appropriate current sink is turned on. This discharging path (the current sink and opposite diode) is established until the X2 capacitors are discharged (the input terminal voltage VAC drops to zero) or the input AC voltage is restored by re−plugging the mains. The minimum discharge voltage is defined by VAC(start). Low VAC(start) allows to use serial resistors to distribute loss during discharging process. The recommended resistors values (R1 and R2) for any X2 capacitor are mentioned in Table 1. Every possibility of IC Table 1. RECOMMENDED SERIES RESISTORS VALUES X2 Capacitance Total Series Resistance (R1 + R2) ≤500 nF 1.5 MW 750 nF 1.02 MW 1 mF 780 kW 1.5 mF 480 kW 2 mF 360 kW http://onsemi.com 4 NCP4810 VAC VAC(start) Idisch t = Tdel t < Tdel Discharge Current Plugged Unplugged Mains Figure 7. Function Description http://onsemi.com 5 t + Tdel NCP4810 PACKAGE DIMENSIONS SOIC−8 NB CASE 751−07 ISSUE AK −X− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751−01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07. A 8 5 S B 0.25 (0.010) M Y M 1 4 −Y− K G C N DIM A B C D G H J K M N S X 45 _ SEATING PLANE −Z− 0.10 (0.004) H D 0.25 (0.010) M Z Y S X M J SOLDERING FOOTPRINT* S MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8_ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0 _ 8 _ 0.010 0.020 0.228 0.244 1.52 0.060 7.0 0.275 4.0 0.155 0.6 0.024 1.270 0.050 SCALE 6:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. 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