LM2931, NCV2931 Series 100 mA, Adjustable Output, LDO Voltage Regulator with 60 V Load Dump Protection The LM2931 series consists of positive fixed and adjustable output voltage regulators that are specifically designed to maintain proper regulation with an extremely low input−to−output voltage differential. These devices are capable of supplying output currents in excess of 100 mA and feature a low bias current of 0.4 mA at 10 mA output. Designed primarily to survive in the harsh automotive environment, these devices will protect all external load circuitry from input fault conditions caused by reverse battery connection, two battery jump starts, and excessive line transients during load dump. This series also includes internal current limiting, thermal shutdown, and additionally, is able to withstand temporary power−up with mirror−image insertion. Due to the low dropout voltage and bias current specifications, the LM2931 series is ideally suited for battery powered industrial and consumer equipment where an extension of useful battery life is desirable. The ‘C’ suffix adjustable output regulators feature an output inhibit pin which is extremely useful in microprocessor−based systems. Features • • • • • • • • • • • • • Input−to−Output Voltage Differential of < 0.6 V @ 100 mA Output Current in Excess of 100 mA Low Bias Current 60 V Load Dump Protection −50 V Reverse Transient Protection Internal Current Limiting with Thermal Shutdown Temporary Mirror−Image Protection Ideally Suited for Battery Powered Equipment Economical 5−Lead TO−220 Package with Two Optional Leadforms Available in Surface Mount SOP−8, D2PAK and DPAK Packages High Accuracy (±2.5%) Reference (LM2931AC) Available Pb−Free Packages are Available NCV Prefix for Automotive and Other Applications Requiring Site and Control Changes Applications • Battery Powered Consumer Products • Hand−held Instruments • Camcorders and Cameras SOIC−8 D SUFFIX CASE 751 N.C. 5 4 Input 8 1 8 1 December, 2011 − Rev. 25 Pin 1. Output 2. Ground 3. Input 1 2 3 TO−220 T SUFFIX CASE 221AB 1 2 3 DPAK DT SUFFIX CASE 369C 1 D2PAK D2T SUFFIX CASE 936 Pin 1. Input 2. Ground 3. Output 3 1 3 SOT−223 ST SUFFIX CASE 318H 1 3 ADJUSTABLE OUTPUT VOLTAGE TO−220 TH SUFFIX CASE 314A 1 5 TO−220 1 TV SUFFIX CASE 314B TO−220 T SUFFIX CASE 314D 5 1 Pin 1. Adjust 2. Output Inhibit 3. Ground 4. Input 5. Output N.C. GND GND Output Input 5 4 5 ORDERING INFORMATION ADJUSTABLE © Semiconductor Components Industries, LLC, 2011 TO−92 Z SUFFIX CASE 29 D2PAK D2T SUFFIX 1 CASE 936A Output Inhibit (Top View) FIXED OUTPUT VOLTAGE 5 FIXED GND http://onsemi.com Adjust See detailed ordering and shipping information in the package dimensions section on page 12 of this data sheet. GND 8 1 Output DEVICE MARKING INFORMATION See general marking and heatsink information in the device marking section on page 15 of this data sheet. (Top View) 1 Publication Order Number: LM2931/D LM2931, NCV2931 Series Representative Schematic Diagram Input 6.0 30 k 6.0 k 6.8 V 350 500 Output Inhibit Output 30 k 30 k 50 k 30 k * 48 k 180 k 184 k 3.94 k Adjust 3.0 k EPI Bias 92.8 k * 35 k 11.5 k Ground *Deleted on Adjustable Regulators This device contains 26 active transistors. http://onsemi.com 2 10 k 5.8 V LM2931, NCV2931 Series MAXIMUM RATINGS Rating Symbol Value Unit VI 40 Vdc Transient Input Voltage (t ≤ 100 ms) VI(t) 60 Vpk Transient Reverse Polarity Input Voltage 1.0% Duty Cycle, t ≤ 100 ms −VI(t) −50− Vpk − − − 2000 200 2000 V V V PD RqJA RqJC Internally Limited 178 83 W °C/W °C/W PD RqJA RqJC Internally Limited 65 5.0 W °C/W °C/W PD RqJA RqJC Internally Limited 242 21 W °C/W °C/W PD RqJA RqJC Internally Limited 92 6.0 W °C/W °C/W PD RqJA RqJC Internally Limited 160 25 W °C/W °C/W PD RqJA RqJC Internally Limited 70 5.0 W °C/W °C/W TA −40 to +125 °C Input Voltage Continuous Electrostatic Discharge Sensitivity (ESD) Human Body Model (HBM) Class 2, JESD22 A114−C Machine Model (MM) Class A, JESD22 A115−A Charged Device Model (CDM), JESD22 C101−C Power Dissipation Case 29 (TO−92 Type) TA = 25°C Thermal Resistance, Junction−to−Ambient Thermal Resistance, Junction−to−Case Case 221A, 314A, 314B and 314D (TO−220 Type) TA = 25°C Thermal Resistance, Junction−to−Ambient Thermal Resistance, Junction−to−Case Case 318H (SOT−223) TA = 25°C Thermal Resistance, Junction−to−Ambient Thermal Resistance, Junction−to−Case Case 369A (DPAK) (Note 1) TA = 25°C Thermal Resistance, Junction−to−Ambient Thermal Resistance, Junction−to−Case Case 751 (SOP−8) (Note 2) TA = 25°C Thermal Resistance, Junction−to−Ambient Thermal Resistance, Junction−to−Case Case 936 and 936A (D2PAK) (Note 3) TA = 25°C Thermal Resistance, Junction−to−Ambient Thermal Resistance, Junction−to−Case Operating Ambient Temperature Range Operating Die Junction Temperature TJ +150 °C Storage Temperature Range Tstg −65 to +150 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. DPAK Junction−to−Ambient Thermal Resistance is for vertical mounting. Refer to Figure 25 for board mounted Thermal Resistance. 2. SOP−8 Junction−to−Ambient Thermal Resistance is for minimum recommended pad size. Refer to Figure 24 for Thermal Resistance variation versus pad size. 3. D2PAK Junction−to−Ambient Thermal Resistance is for vertical mounting. Refer to Figure 26 for board mounted Thermal Resistance. 4. NCV rated devices are subjected to and meet the AECQ−100 quality standards. http://onsemi.com 3 LM2931, NCV2931 Series ELECTRICAL CHARACTERISTICS (Vin = 14 V, IO = 10 mA, CO = 100 mF, CO(ESR) = 0.3 W, TA = 25°C [Note 5]) LM2931−5.0/NCV2931−5.0 Characteristic Symbol Min Typ Max LM2931A−5.0/NCV2931A−5.0 Min Typ Max Unit FIXED OUTPUT Output Voltage VO V Vin = 14 V, IO = 10 mA, TA = 25°C 4.75 5.0 5.25 4.81 5.0 5.19 Vin = 6.0 V to 26 V, IO ≤ 100 mA, TA = − 40° to +125°C 4.50 − 5.50 4.75 − 5.25 Vin = 9.0 V to 16 V − 2.0 10 − 2.0 10 Vin = 6.0 V to 26 V − 4.0 30 − 4.0 30 − 14 50 − 14 50 Line Regulation Load Regulation (IO = 5.0 mA to 100 mA) Output Impedance Regline Regload ZO mV mW − IO = 10 mA, DIO = 1.0 mA, f = 100 Hz to 10 kHz Bias Current mV 200 − − 200 − IB mA Vin = 14 V, IO = 100 mA, TA = 25°C − 5.8 30 − 5.8 30 Vin = 6.0 V to 26 V, IO = 10 mA, TA = − 40° to +125°C − 0.4 1.0 − 0.4 1.0 Output Noise Voltage (f = 10 Hz to 100 kHz) Vn − 700 − − 700 − mVrms Long Term Stability S − 20 − − 20 − mV/kHR RR 60 90 − 60 90 − dB Ripple Rejection (f = 120 Hz) Dropout Voltage VI−VO IO = 10 mA IO = 100 mA Over−Voltage Shutdown Threshold Output Voltage with Reverse Polarity Input (Vin = −15 V) V − 0.015 0.2 − 0.015 0.2 − 0.16 0.6 − 0.16 0.6 Vth(OV) 26 29.5 40 26 29.5 40 V −VO −0.3 0 − −0.3 0 − V 5. Low duty cycle pulse techniques are used during test to maintain junction temperature as close to ambient as possible. 6. NCV devices are qualified for automotive use. http://onsemi.com 4 LM2931, NCV2931 Series ELECTRICAL CHARACTERISTICS (Vin = 14 V, IO = 10 mA, CO = 100 mF, CO(ESR) = 0.3 W, TA = 25°C [Note 7]) LM2931C/NCV2931C Characteristic Symbol LM2931AC/NCV2931AC Min Typ Max Min Typ Max 1.14 1.08 1.20 − 1.26 1.32 1.17 1.15 1.20 − 1.23 1.25 Unit ADJUSTABLE OUTPUT Reference Voltage (Note 8, Figure 18) IO = 10 mA, TA = 25°C IO ≤ 100 mA, TA = − 40 to +125°C Vref V Output Voltage Range VO range 3.0 to 24 2.7 to 29.5 − 3.0 to 24 2.7 to 29.5 − V Line Regulation (Vin = VO + 0.6 V to 26 V) Regline − 0.2 1.5 − 0.2 1.5 mV/V Load Regulation (IO = 5.0 mA to 100 mA) Regload − 0.3 1.0 − 0.3 1.0 %/V − 40 − − 40 − − − − 6.0 0.4 0.2 − 1.0 1.0 − − − 6.0 0.4 0.2 − 1.0 1.0 IAdj − 0.2 − − 0.2 − mA Output Noise Voltage (f = 10 Hz to 100 kHz) Vn − 140 − − 140 − mVrms/V Long−Term Stability S − 0.4 − − 0.4 − %/kHR RR 0.10 0.003 − 0.10 0.003 − %/V − − 0.015 0.16 0.2 0.6 − − 0.015 0.16 0.2 0.6 Output Impedance IO = 10 mA, DIO = 1.0 mA, f = 10 Hz to 10 kHz ZO Bias Current IO = 100 mA IO = 10 mA Output Inhibited (Vth(OI) = 2.5 V) IB Adjustment Pin Current Ripple Rejection (f = 120 Hz) mW/V mA Dropout Voltage IO = 10 mA IO = 100 mA VI−VO Over−Voltage Shutdown Threshold Vth(OV) 26 29.5 40 26 29.5 40 V Output Voltage with Reverse Polarity Input (Vin = −15 V) −VO −0.3 0 − −0.3 0 − V Output Inhibit Threshold Voltages Output “On”: TA = 25°C TA = − 40° to +125°C Output “Off”: TA = 25°C TA = − 40° to +125°C Vth(OI) − − 2.50 3.25 2.15 − 2.26 − 1.90 1.20 − − − − 2.50 3.25 2.15 − 2.26 − 1.90 1.20 − − − 30 50 − 30 50 Output Inhibit Threshold Current (Vth(OI) = 2.5 V) V V Ith(OI) 7. Low duty cycle pulse techniques are used during test to maintain junction temperature as close to ambient as possible. 8. The reference voltage on the adjustable device is measured from the output to the adjust pin across R1. http://onsemi.com 5 mA LM2931, NCV2931 Series 300 Vin -VO , DROPOUT VOLTAGE (mV) Vin -VO , DROPOUT VOLTAGE (mV) 200 Vin = 14 V DVout = 100 mV TJ = 25°C 160 120 80 40 0 0 20 40 60 IO, OUTPUT CURRENT (mA) 80 Vin = 14 V DVout = 100 mV 100 IO = 50 mA IO = 10 mA 0 100 0 75 100 125 6.0 TJ = -40°C VO , OUTPUT VOLTAGE (V) I O , OUTPUT CURRENT (mA) 50 Figure 2. Dropout Voltage versus Junction Temperature 350 TJ = 25°C 250 TJ = 85°C 150 Dashed lines below Vin = 5.0 V are for Adjustable output devices only. 0 5.0 10 15 20 Vin, INPUT VOLTAGE (V) 25 Vout = 5.0 V TA = 25°C 5.0 4.0 3.0 2.0 RL = 50 W 1.0 0 30 0 Figure 3. Peak Output Current versus Input Voltage 4.0 VO, OUTPUT VOLTAGE (5.0 V/DIV) 3.0 2.0 Vout = 5.0 V RL = 500 W TA = 25°C 1.0 0 -20 -10 0 10 20 30 Vin, INPUT VOLTAGE (V) 40 50 2.0 3.0 4.0 Vin, INPUT VOLTAGE (V) Vin , INPUT VOLTAGE (10 V/DIV) VCC = 15 V VFB1 = 5.05 V 5.0 1.0 IO = 100 mA 5.0 6.0 Figure 4. Output Voltage versus Input Voltage 6.0 VO , OUTPUT VOLTAGE (V) 25 TJ, JUNCTION TEMPERATURE (°C) Figure 1. Dropout Voltage versus Output Current 50 IO = 100 mA 200 60 Vout = 5.0 V RL = 50 W CO = 100 mF t = 150 ms TA = 25°C 0 0 Figure 5. Output Voltage versus Input Voltage t, TIME (50 ms/DIV) Figure 6. Load Dump Characteristics http://onsemi.com 6 LM2931, NCV2931 Series 8.0 10 Vout = 5.0 V TJ = 25°C IB , BIAS CURRENT (mA) IB , BIAS CURRENT (mA) 12 8.0 RL = 50 W 6.0 4.0 RL = 100 W 2.0 Vin = 14 V Vout = 5.0 V TJ = 25°C 6.0 4.0 2.0 RL = 500 W 0 0 -20 -10 0 10 20 30 Vin, INPUT VOLTAGE (V) 40 50 60 0 40 60 80 100 IO, OUTPUT CURRENT (mA) Figure 8. Bias Current versus Output Current Figure 7. Bias Current versus Input Voltage 2.0 8.0 IO , OUTPUT IMPEDANCE ( Ω ) Vin = 14 V Vout = 5.0 V IB , BIAS CURRENT (mA) 20 IO = 100 mA 6.0 4.0 IO = 50 mA 2.0 Vin = 14 V Vout = 5.0 V IO = 10 mA DIO = 1.0 mA CO = 100 mF TJ = 25°C 1.6 1.2 0.8 CO(ESR) = 0.3 W Electrolytic 0.4 CO(ESR) = 0.15 W Tantulum IO = 0 mA 0 -55 0 -25 0 25 50 75 TJ, JUNCTION TEMPERATURE (°C) 100 10 125 Figure 9. Bias Current versus Junction Temperature 1.0 k 10 k 100 k f, FREQUENCY (Hz) 1.0 M 10 M Figure 10. Output Impedance versus Frequency 95 95 RR, RIPPLE REJECTION RATIO (dB) RR, RIPPLE REJECTION RATIO (dB) 100 85 CO(ESR) = 0.15 W Tantulum Vin = 14 V Vout = 5.0 V DVin = 100 mV RL = 500 W CO = 100 mF TJ = 25°C 75 65 CO(ESR) = 0.3 W Electrolytic 55 10 100 1.0 k 10 k 100 k 1.0 M 85 Vin = 14 V Vout = 5.0 V f = 120 Hz TJ = 25°C 75 65 10 M 0 f, FREQUENCY (Hz) Figure 11. Ripple Rejection versus Frequency 20 40 60 IO, OUTPUT CURRENT (mA) 80 100 Figure 12. Ripple Rejection versus Output Current http://onsemi.com 7 18.5 14 t, TIME (10 ms/DIV) Figure 13. Line Regulation OUTPUT CURRENT, OUTPUT VOLTAGE DEVIATION, I out (mA) Δ VO , (2.0 mV/DIV) Vout = 5.0 V RL = 500 W CO = 100 mF CO(ESR) = 0.3 W TA = 25°C V th(on/off) , OUTPUT INHIBIT‐THRESHOLDS (V) INPUT VOLTAGE, V in, (V) OUTPUT VOLTAGE DEVIATION, Δ VO , (2.0 mV/DIV) LM2931, NCV2931 Series Vref, REFERENCE VOLTAGE (V) 1.240 LM2931C Adjustable IO = 10 mA Vin = Vout + 1.0 V TA = 25°C 1.220 1.200 1.180 1.160 0 3.0 6.0 9.0 12 15 18 21 24 Vin = 14 V Vout = 5.0 V Cin = 1000 mF 100 CO = 100 mF CO(ESR) = 0.3 W TA = 25°C 0 t, TIME (10 ms/DIV) Figure 14. Load Regulation 2.6 LM2931C Adjustable IO = 10 mA Vin = Vout + 1.0 V TA = 25°C 2.5 Output “Off" 2.4 2.3 2.2 Output “On" 2.1 2.0 0 3.0 VO, OUTPUT VOLTAGE (V) Figure 15. Reference Voltage versus Output Voltage 6.0 9.0 12 15 18 VO, OUTPUT VOLTAGE (V) 21 24 Figure 16. Output Inhibit−Thresholds versus Output Voltage APPLICATIONS INFORMATION The LM2931 series regulators are designed with many protection features making them essentially blow−out proof. These features include internal current limiting, thermal shutdown, overvoltage and reverse polarity input protection, and the capability to withstand temporary power−up with mirror−image insertion. Typical application circuits for the fixed and adjustable output device are shown in Figures 17 and 18. The input bypass capacitor Cin is recommended if the regulator is located an appreciable distance (≥ 4″) from the supply input filter. This will reduce the circuit’s sensitivity to the input line impedance at high frequencies. This regulator series is not internally compensated and thus requires an external output capacitor for stability. The capacitance value required is dependent upon the load current, output voltage for the adjustable regulator, and the type of capacitor selected. The least stable condition is encountered at maximum load current and minimum output voltage. Figure 22 shows that for operation in the “Stable” region, under the conditions specified, the magnitude of the output capacitor impedance |ZO| must not exceed 0.4 W. This limit must be observed over the entire operating temperature range of the regulator circuit. With economical electrolytic capacitors, cold temperature operation can pose a serious stability problem. As the electrolyte freezes, around − 30°C, the capacitance will decrease and the equivalent series resistance (ESR) will increase drastically, causing the circuit to oscillate. Quality electrolytic capacitors with extended temperature ranges of −40° to +85°C and − 55° to +105°C are readily available. Solid tantalum capacitors may be a better choice if small size is a requirement, however, the maximum ⏐ZO⏐ limit over temperature must be observed. Note that in the stable region, the output noise voltage is linearly proportional to ⏐ZO⏐. In effect, CO dictates the high frequency roll−off point of the circuit. Operation in the area titled “Marginally Stable” will cause the output of the regulator to exhibit random bursts of oscillation that decay in an under−damped fashion. Continuous oscillation occurs when operating in the area titled “Unstable”. It is suggested that oven testing of the entire circuit be performed with maximum load, minimum input voltage, and minimum ambient temperature. http://onsemi.com 8 LM2931, NCV2931 Series Input Output Vin Vout 51 k Output Inhibit 2 Cin 0.1 LM2931C Adjustable Output CO 1 IAdj Input Cin 0.1 LM2931-5.0 Fixed Output IB Output Vout Switch Position 1 = Output “On", 2 = Output “Off" CO GND ǒ 22.5k w R 1R 2 R 1 ) R 2 Figure 18. Adjustable Output Regulator D45VH7 68 Ǔ R V out + V 1 ) 2 ) I R 2 ref Adj R1 Figure 17. Fixed Output Regulator Input ≥ 6.0 V R2 GND IB Vin R1 Adjust RSC Input R R Output 5.0 V @ 5.0 A LM2931-5.0 LM2931-5.0 + + 100 + Output The LM2931 series can be current boosted with a PNP transistor. The D45VH7, on a heatsink, will provide an output current of 5.0 A with an input to output voltage differential of approximately 1.0 V. Resistor R in conjunction with the VBE of the PNP determines when the pass transistor begins conducting. This circuit is not short circuit proof. Figure 20. Current Boost Regulator with Short Circuit Projection LM2931C + 2.0 k 100 8.2 k CM #345 + 100 100 The circuit of Figure 19 can be modified to provide supply protection against short circuits by adding the current sense resistor RSC and an additional PNP transistor. The current sensing PNP must be capable of handling the short circuit current of the LM2931. Safe operating area of both transistors must be considered under worst case conditions. Figure 19. (5.0 A) Low Differential Voltage Regulator Input 6.4 V to 30 V + 100 100 33 k 6.2 V 0 fosc = 2.2 Hz Figure 21. Constant Intensity Lamp Flasher http://onsemi.com 9 100 Unstable Marginally Stable 1.0 10 mF 22 mF 47 mF 100 mF 0.40 Unstable 0.50 ESR (Ohms) 10 0.60 Vin = 5.6 V Vout = 5.0 V IO = 100 mA Vnrms 10 Hz to 10 MHz |ZO| @ 40 kHz TA = 25°C 0.30 Stable 0.20 0.1 Note - Optimum stability uses a 22 mF output capacitor. Output capacitor values below 10 mF are not recommended. 0.10 100 1.0 k |ZO|, MAGNITUDE OF CAPACITOR IMPEDANCE (mW) 0.00 10 k 0 10 20 30 40 60 70 50 OUTPUT CURRENT (mA) JUNCTION-TO-AIR ( °C/W) R θ JA, THERMAL RESISTANCE 170 3.2 150 2.8 PD(max) for TA = 50°C 2.4 130 110 ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ 2.0 Graph represents symmetrical layout 90 L 1.6 2.0 oz. Copper 1.2 70 L 3.0 mm 0.8 50 RqJA 30 0 10 0.4 20 30 40 50 L, LENGTH OF COPPER (mm) 100 2.4 PD(max) for TA = 50°C Free Air Mounted Vertically 2.0 ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ 80 Minimum Size Pad 70 60 2.0 oz. Copper L 1.6 L 1.2 0.8 50 0.4 RqJA 40 0 0 5.0 10 15 20 25 30 L, LENGTH OF COPPER (mm) Figure 25. DPAK Thermal Resistance and Maximum Power Dissipation versus P.C.B. Copper Length http://onsemi.com 10 PD, MAXIMUM POWER DISSIPATION (W) Figure 24. SOP−8 Thermal Resistance and Maximum Power Dissipation versus P.C.B. Copper Length 90 80 90 100 Figure 23. Output Capacitor ESR Stability vs. Output Load Current PD, MAXIMUM POWER DISSIPATION (W) Figure 22. Output Noise Voltage vs. Output Capacitor Impedance JUNCTION-TO-AIR ( °C/W) 0.01 10 Stable R θ JA, THERMAL RESISTANCE Vn , OUTPUT NOISE VOLTAGE (mVrms) LM2931, NCV2931 Series 3.5 PD(max) for TA = 50°C JUNCTION-TO-AIR (° C/W) R θ JA, THERMAL RESISTANCE 80 70 3.0 Free Air Mounted Vertically 60 ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ 2.0 oz. Copper L Minimum Size Pad 50 2.5 2.0 L 1.5 40 RqJA 30 1.0 0 5.0 10 15 20 25 PD, MAXIMUM POWER DISSIPATION (W) LM2931, NCV2931 Series 30 L, LENGTH OF COPPER (mm) RqJA, THERMAL RESISTANCE, JUNCTION−TO−AIR (°CW) 300 1.8 PD(max) for TA = 50°C 250 1.4 2.0 oz. Copper L ÎÎÎ ÎÎÎ ÎÎÎ 200 150 L 100 50 0 1.6 RqJA 0 5.0 10 15 20 25 L, LENGTH OF COPPER (mm) 1.2 1.0 0.8 0.6 0.4 0.2 0.0 30 PD, MAXIMUM POWER DISSIPATION (W) Figure 26. 3−Pin and 5−Pin D2PAK Thermal Resistance and Maximum Power Dissipation versus P.C.B. Copper Length Figure 27. SOT−223 Thermal Resistance and Maximum Power Dissipation vs. P.C.B. Copper Length DEFINITIONS Maximum Power Dissipation − The maximum total device dissipation for which the regulator will operate within specifications. Bias Current − That part of the input current that is not delivered to the load. Output Noise Voltage − The rms AC voltage at the output, with constant load and no input ripple, measured over a specified frequency range. Long−Term Stability − Output voltage stability under accelerated life test conditions with the maximum rated voltage listed in the devices electrical characteristics and maximum power dissipation. Dropout Voltage − The input/output voltage differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output decreases 100 mV from nominal value at 14 V input, dropout voltage is affected by junction temperature and load current. Line Regulation − The change in output voltage for a change in the input voltage. The measurement is made under conditions of low dissipation or by using pulse techniques such that the average chip temperature is not significantly affected. Load Regulation − The change in output voltage for a change in load current at constant chip temperature. http://onsemi.com 11 LM2931, NCV2931 Series ORDERING INFORMATION Output Device LM2931AD−5.0 LM2931AD−5.0G LM2931AD−5.0R2 LM2931AD−5.0R2G LM2931ADT−5.0 LM2931ADT−5.0G LM2931ADT−5.0RK LM2931ADT−5.0RKG LM2931AD2T−5.0 LM2931AD2T−5.0G LM2931AD2T−5.0R4 LM2931AD2T−5R4G LM2931AT−5.0 LM2931AT−5.0G LM2931AZ−5.0 LM2931AZ−5.0G LM2931AZ−5.0RA LM2931AZ−5.0RAG LM2931AZ−5.0RP LM2931AZ−5.0RPG LM2931D−5.0 LM2931D−5.0G LM2931D−5.0R2 LM2931D−5.0R2G LM2931D2T−5.0 LM2931D2T−5.0G LM2931D2T−5.0R4 LM2931D2T−5.0R4G Voltage Tolerance Package Shipping† 5.0 V "3.8% SOIC−8 98 Units / Rail 5.0 V "3.8% SOIC−8 (Pb−Free) 98 Units / Rail 5.0 V "3.8% SOIC−8 2500 / Tape & Reel 5.0 V "3.8% SOIC−8 (Pb−Free) 2500 / Tape & Reel 5.0 V "3.8% DPAK 75 Units / Rail 5.0 V "3.8% DPAK (Pb−Free) 75 Units / Rail 5.0 V "3.8% DPAK 2500 / VacPk Reel 5.0 V "3.8% DPAK (Pb−Free) 2500 / VacPk Reel 5.0 V "3.8% D2PAK 50 Units / Rail 5.0 V "3.8% D2PAK (Pb−Free) 50 Units / Rail 5.0 V "3.8% D2PAK 800 / VacPk Reel 5.0 V "3.8% D2PAK (Pb−Free) 800 / VacPk Reel 5.0 V "3.8% TO−220 50 Units / Rail 5.0 V "3.8% TO−220 (Pb−Free) 50 Units / Rail 5.0 V "3.8% TO−92 2000 / Inner Bag 5.0 V "3.8% TO−92 (Pb−Free) 2000 / Inner Bag 5.0 V "3.8% TO−92 2000 / Tape & Reel 5.0 V "3.8% TO−92 (Pb−Free) 2000 / Tape & Reel 5.0 V "3.8% TO−92 2000 / Ammo Pack 5.0 V "3.8% TO−92 (Pb−Free) 2000 / Ammo Pack 5.0 V "5.0% SOIC−8 98 Units / Rail 5.0 V "5.0% SOIC−8 (Pb−Free) 98 Units / Rail 5.0 V "5.0% SOIC−8 2500 / Tape & Reel 5.0 V "5.0% SOIC−8 (Pb−Free) 2500 / Tape & Reel 5.0 V "5.0% D2PAK 50 Units / Rail D2PAK 50 Units / Rail 5.0 V "5.0% (Pb−Free) 5.0 V "5.0% D2PAK 800 / VacPk Reel D2PAK 800 / VacPk Reel 5.0 V "5.0% (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NCV2931: Tlow = −40°C, Thigh = +125°C. Guaranteed by design. NCV prefix is for automotive and other applications requiring site and change control. http://onsemi.com 12 LM2931, NCV2931 Series ORDERING INFORMATION Output Device LM2931DT−5.0 LM2931DT−5.0G LM2931T−5.0 LM2931T−5.0G LM2931Z−5.0 LM2931Z−5.0G LM2931Z−5.0RA LM2931Z−5.0RAG LM2931Z−5.0RP LM2931Z−5.0RPG LM2931CD LM2931CDG LM2931CDR2 LM2931CDR2G LM2931CD2T LM2931CD2TG LM2931CD2TR4 LM2931CD2TR4G LM2931CT LM2931CTG LM2931ACD LM2931ACDG LM2931ACDR2 LM2931ACDR2G LM2931ACD2TR4 LM2931ACD2TR4G LM2931ACTV LM2931ACTVG Voltage Tolerance Package Shipping† 5.0 V "5.0% DPAK 75 Units / Rail 5.0 V "5.0% DPAK (Pb−Free) 75 Units / Rail 5.0 V "5.0% TO−220 50 Units / Rail 5.0 V "5.0% TO−220 (Pb−Free) 50 Units / Rail 5.0 V "5.0% TO−92 2000 / Inner Bag 5.0 V "5.0% TO−92 (Pb−Free) 2000 / Inner Bag 5.0 V "5.0% TO−92 2000 / Tape & Reel 5.0 V "5.0% TO−92 (Pb−Free) 2000 / Tape & Reel 5.0 V "5.0% TO−92 2000 / Ammo Pack 5.0 V "5.0% TO−92 (Pb−Free) 2000 / Ammo Pack Adjustable "5.0% SOIC−8 98 Units / Rail Adjustable "5.0% SOIC−8 (Pb−Free) 98 Units / Rail Adjustable "5.0% SOIC−8 2500 / Tape & Reel Adjustable "5.0% SOIC−8 (Pb−Free) 2500 / Tape & Reel Adjustable "5.0% D2PAK 50 Units / Rail Adjustable "5.0% D2PAK (Pb−Free) 50 Units / Rail Adjustable "5.0% D2PAK 800 / VacPk Reel Adjustable "5.0% D2PAK (Pb−Free) 800 / VacPk Reel Adjustable "5.0% TO−220 50 Units / Rail Adjustable "5.0% TO−220 (Pb−Free) 50 Units / Rail Adjustable "2.0% SOIC−8 98 Units / Rail Adjustable "2.0% SOIC−8 (Pb−Free) 98 Units / Rail Adjustable "2.0% SOIC−8 2500 / Tape & Reel Adjustable "2.0% SOIC−8 (Pb−Free) 2500 / Tape & Reel Adjustable "2.0% D2PAK 800 / VacPk Reel D2PAK 800 / VacPk Reel Adjustable "2.0% (Pb−Free) Adjustable "2.0% TO−220 50 Units / Rail Adjustable "2.0% TO−220 (Pb−Free) 50 Units / Rail †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NCV2931: Tlow = −40°C, Thigh = +125°C. Guaranteed by design. NCV prefix is for automotive and other applications requiring site and change control. http://onsemi.com 13 LM2931, NCV2931 Series ORDERING INFORMATION Output Voltage Tolerance Package Shipping† Adjustable "2.5% SOIC−8 2500 / Tape & Reel Adjustable "2.5% SOIC−8 (Pb−Free) 2500 / Tape & Reel 5.0 V "3.8% SOIC−8 2500 / Tape & Reel 5.0 V "3.8% SOIC−8 (Pb−Free) 2500 / Tape & Reel 5.0 V "3.8% SOT−223 4000 / Tape & Reel 5.0 V "3.8% SOT−223 (Pb−Free) 4000 / Tape & Reel 5.0 V "3.8% TO−92 (Pb−Free) 2000 / Inner Bag 5.0 V "3.8% TO−92 (Pb−Free) 2000 / Tape & Reel Adjustable "5.0% SOIC−8 2500 / Tape & Reel Adjustable "5.0% SOIC−8 (Pb−Free) 2500 / Tape & Reel 5.0 V "5.0% SOIC−8 2500 / Tape & Reel 5.0 V "5.0% SOIC−8 (Pb−Free) 2500 / Tape & Reel 5.0 V "3.8% DPAK 2500 / Tape & Reel 5.0 V "3.8% DPAK (Pb−Free) 2500 / Tape & Reel 5.0 V "5.0% DPAK 2500 / Tape & Reel 5.0 V "5.0% DPAK (Pb−Free) 2500 / Tape & Reel NCV2931ACD2TR4G* Adjustable "2.5% D2PAK (Pb−Free) 800 / VacPk Reel NCV2931D2T−5.0R4* 5.0 V "5.0% D2PAK 800 / VacPk Reel D2PAK 800 / VacPk Reel Device NCV2931ACDR2* NCV2931ACDR2G* NCV2931AD−5.0R2* NCV2931AD−5.0R2G* NCV2931AST−5.0T3* NCV2931AST−5.0T3G* NCV2931AZ−5.0G* NCV2931AZ−5.0RAG* NCV2931CDR2* NCV2931CDR2G* NCV2931D−5.0R2* NCV2931D−5.0R2G* NCV2931ADT−5.0RK* NCV2931ADT5.0RKG* NCV2931DT−5.0RK* NCV2931DT−5.0RKG* NCV2931D2T5.0R4G* 5.0 V "5.0% (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NCV2931: Tlow = −40°C, Thigh = +125°C. Guaranteed by design. NCV prefix is for automotive and other applications requiring site and change control. http://onsemi.com 14 LM2931, NCV2931 Series MARKING DIAGRAMS DPAK DT SUFFIX CASE 369A DPAK DT SUFFIX CASE 369A 931A5G ALYWW 2931G ALYWW * D2PAK D2T SUFFIX CASE 936 D2PAK D2T SUFFIX CASE 936 D2PAK D2T SUFFIX CASE 936 LM 2931AD2T−5 AWLYWWG LM 2931AD2T−5.0 AWLYWWG LM 2931D2T−5 AWLYWWG * Heatsink surface (shown as terminal 4 in case outline drawing) is connected to Pin 2. TO−220 T SUFFIX CASE 221A TO−220 T SUFFIX CASE 221A TO−220 T SUFFIX CASE 314D LM 2931AT−5 AWLYWWG LM 2931T−5.0 AWLYWWG LM 2931ACTV AWLYWWG Heatsink surface connected to Pin 2. SOIC−8 D SUFFIX CASE 751 SOIC−8 D SUFFIX CASE 751 8 1 Heatsink surface connected to Pin 3. 8 8 2931A ALYW G 1 SOIC−8 D SUFFIX CASE 751 2931A ALYW5 G * 1 D2PAK D2T SUFFIX CASE 936A D2PAK D2T SUFFIX CASE 936A LM 2931ACD2T AWLYWWG LM 2931CT AWLYWWG Heatsink surface (shown as terminal 6 in case outline drawing) is connected to Pin 3. SOIC−8 D SUFFIX CASE 751 TO−92 Z SUFFIX CASE 029 TO−92 Z SUFFIX CASE 029 2931 ALYW5 G 2931A Z−5.0 ALYWG G 2931Z −5.0 ALYWG G 8 2931C ALYW G * 1 SOT−223 ST SUFFIX CASE 318H * ALYW 2931AG G 1 2 3 A WL, L YY, Y WW, W G or G = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Device *This marking diagram also applies to NCV2931. http://onsemi.com 15 LM2931, NCV2931 Series PACKAGE DIMENSIONS TO−92 (TO−226) CASE 29−11 ISSUE AM 1 12 3 STRAIGHT LEAD BULK PACK 2 3 BENT LEAD TAPE & REEL AMMO PACK A B STRAIGHT LEAD BULK PACK R P L SEATING PLANE K D X X G J H V C SECTION X−X N 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM. DIM A B C D G H J K L N P R V INCHES MIN MAX 0.175 0.205 0.170 0.210 0.125 0.165 0.016 0.021 0.045 0.055 0.095 0.105 0.015 0.020 0.500 --0.250 --0.080 0.105 --0.100 0.115 --0.135 --- MILLIMETERS MIN MAX 4.45 5.20 4.32 5.33 3.18 4.19 0.407 0.533 1.15 1.39 2.42 2.66 0.39 0.50 12.70 --6.35 --2.04 2.66 --2.54 2.93 --3.43 --- N A R BENT LEAD TAPE & REEL AMMO PACK B P T SEATING PLANE G K D X X J V 1 C N SECTION X−X http://onsemi.com 16 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM. DIM A B C D G J K N P R V MILLIMETERS MIN MAX 4.45 5.20 4.32 5.33 3.18 4.19 0.40 0.54 2.40 2.80 0.39 0.50 12.70 --2.04 2.66 1.50 4.00 2.93 --3.43 --- LM2931, NCV2931 Series PACKAGE DIMENSIONS TO−220, SINGLE GAUGE CASE 221AB−01 ISSUE A −T− B F T SEATING PLANE C S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCHES. 3. DIMENSION Z DEFINES A ZONE WHERE ALL BODY AND LEAD IRREGULARITIES ARE ALLOWED. 4. PRODUCT SHIPPED PRIOR TO 2008 HAD DIMENSIONS S = 0.045 - 0.055 INCHES (1.143 - 1.397 MM) 4 DIM A B C D F G H J K L N Q R S T U V Z A Q U 1 2 3 H K Z L R V J G D N http://onsemi.com 17 INCHES MIN MAX 0.570 0.620 0.380 0.405 0.160 0.190 0.025 0.035 0.142 0.147 0.095 0.105 0.110 0.155 0.018 0.025 0.500 0.562 0.045 0.060 0.190 0.210 0.100 0.120 0.080 0.110 0.020 0.024 0.235 0.255 0.000 0.050 0.045 ----0.080 MILLIMETERS MIN MAX 14.48 15.75 9.66 10.28 4.07 4.82 0.64 0.88 3.61 3.73 2.42 2.66 2.80 3.93 0.46 0.64 12.70 14.27 1.15 1.52 4.83 5.33 2.54 3.04 2.04 2.79 0.508 0.61 5.97 6.47 0.00 1.27 1.15 ----2.04 LM2931, NCV2931 Series PACKAGE DIMENSIONS TO−220 TH SUFFIX CASE 314A−03 ISSUE E B −P− Q −T− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION D DOES NOT INCLUDE INTERCONNECT BAR (DAMBAR) PROTRUSION. DIMENSION D INCLUDING PROTRUSION SHALL NOT EXCEED 0.043 (1.092) MAXIMUM. SEATING PLANE C OPTIONAL CHAMFER A U E F L K G D 5X 0.014 (0.356) M T P 5X M J S DIM A B C D E F G J K L Q S U INCHES MIN MAX 0.572 0.613 0.390 0.415 0.170 0.180 0.025 0.038 0.048 0.055 0.570 0.585 0.067 BSC 0.015 0.025 0.730 0.745 0.320 0.365 0.140 0.153 0.210 0.260 0.468 0.505 MILLIMETERS MIN MAX 14.529 15.570 9.906 10.541 4.318 4.572 0.635 0.965 1.219 1.397 14.478 14.859 1.702 BSC 0.381 0.635 18.542 18.923 8.128 9.271 3.556 3.886 5.334 6.604 11.888 12.827 TO−220 TV SUFFIX CASE 314B−05 ISSUE L Q OPTIONAL CHAMFER E A U K S L W F D 0.10 (0.254) M T P M 0.24 (0.610) V J 5X G 5X NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION D DOES NOT INCLUDE INTERCONNECT BAR (DAMBAR) PROTRUSION. DIMENSION D INCLUDING PROTRUSION SHALL NOT EXCEED 0.043 (1.092) MAXIMUM. C B −P− M H T N −T− http://onsemi.com 18 SEATING PLANE DIM A B C D E F G H J K L N Q S U V W INCHES MIN MAX 0.572 0.613 0.390 0.415 0.170 0.180 0.025 0.038 0.048 0.055 0.850 0.935 0.067 BSC 0.166 BSC 0.015 0.025 0.900 1.100 0.320 0.365 0.320 BSC 0.140 0.153 --0.620 0.468 0.505 --0.735 0.090 0.110 MILLIMETERS MIN MAX 14.529 15.570 9.906 10.541 4.318 4.572 0.635 0.965 1.219 1.397 21.590 23.749 1.702 BSC 4.216 BSC 0.381 0.635 22.860 27.940 8.128 9.271 8.128 BSC 3.556 3.886 --- 15.748 11.888 12.827 --- 18.669 2.286 2.794 LM2931, NCV2931 Series PACKAGE DIMENSIONS TO−220 5−LEAD CASE 314D−04 ISSUE H −T− B −Q− B1 DETAIL A-A L DIM A B B1 C D E G H J K L Q U 1234 5 K D NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION D DOES NOT INCLUDE INTERCONNECT BAR (DAMBAR) PROTRUSION. DIMENSION D INCLUDING PROTRUSION SHALL NOT EXCEED 10.92 (0.043) MAXIMUM. C E A U SEATING PLANE J H G 5 PL 0.356 (0.014) T Q M M B INCHES MIN MAX 0.572 0.613 0.390 0.415 0.375 0.415 0.170 0.180 0.025 0.038 0.048 0.055 0.067 BSC 0.087 0.112 0.015 0.025 0.977 1.045 0.320 0.365 0.140 0.153 0.105 0.117 MILLIMETERS MIN MAX 14.529 15.570 9.906 10.541 9.525 10.541 4.318 4.572 0.635 0.965 1.219 1.397 1.702 BSC 2.210 2.845 0.381 0.635 24.810 26.543 8.128 9.271 3.556 3.886 2.667 2.972 B1 DETAIL A−A SOT−223 ST SUFFIX CASE 318H−01 ISSUE O E S C B 3 e D A 0.1 2 M C A S B e1 B M A 0.1 4 b2 B S C B S M b 0.2 0.08 1 S A E1 A1 A B ÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉ ÇÇÇÇÇÇÇ ÉÉÉ ÉÉÉ ÇÇÇ (b) (b2) c c1 T b1 b3 SECTION B−B C A H SECTION A−A L http://onsemi.com 19 NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSION E1 DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.23 PER SIDE. 4. DIMENSIONS b AND b2 DO NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 TOTAL IN EXCESS OF THE b AND b2 DIMENSIONS AT MAXIMUM MATERIAL CONDITION. 5. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 6. DIMENSIONS D AND E1 ARE TO BE DETERMINED AT DATUM PLANE H. DIM A A1 b b1 b2 b3 c c1 D E E1 e e1 L T MILLIMETERS MIN MAX --1.80 0.02 0.11 0.60 0.88 0.60 0.80 2.90 3.10 2.90 3.05 0.24 0.35 0.24 0.30 6.30 6.70 6.70 7.30 3.30 3.70 2.30 4.60 --0.25 0_ 10_ LM2931, NCV2931 Series PACKAGE DIMENSIONS DPAK DT SUFFIX CASE 369C−01 ISSUE D A E b3 c2 B Z D 1 L4 A 4 L3 b2 e 2 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCHES. 3. THERMAL PAD CONTOUR OPTIONAL WITHIN DIMENSIONS b3, L3 and Z. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.006 INCHES PER SIDE. 5. DIMENSIONS D AND E ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY. 6. DATUMS A AND B ARE DETERMINED AT DATUM PLANE H. C H DETAIL A 3 DIM A A1 b b2 b3 c c2 D E e H L L1 L2 L3 L4 Z c b 0.005 (0.13) M H C L2 GAUGE PLANE C L SEATING PLANE A1 L1 DETAIL A ROTATED 905 CW INCHES MIN MAX 0.086 0.094 0.000 0.005 0.025 0.035 0.030 0.045 0.180 0.215 0.018 0.024 0.018 0.024 0.235 0.245 0.250 0.265 0.090 BSC 0.370 0.410 0.055 0.070 0.108 REF 0.020 BSC 0.035 0.050 −−− 0.040 0.155 −−− SOLDERING FOOTPRINT* 6.20 0.244 2.58 0.102 5.80 0.228 3.00 0.118 1.60 0.063 6.17 0.243 SCALE 3:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 20 MILLIMETERS MIN MAX 2.18 2.38 0.00 0.13 0.63 0.89 0.76 1.14 4.57 5.46 0.46 0.61 0.46 0.61 5.97 6.22 6.35 6.73 2.29 BSC 9.40 10.41 1.40 1.78 2.74 REF 0.51 BSC 0.89 1.27 −−− 1.01 3.93 −−− LM2931, NCV2931 Series PACKAGE DIMENSIONS SOIC−8 NB CASE 751−07 ISSUE AK −X− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751−01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07. A 8 5 S B 0.25 (0.010) M Y M 1 4 −Y− K G C N DIM A B C D G H J K M N S X 45 _ SEATING PLANE −Z− 0.10 (0.004) H D 0.25 (0.010) M Z Y S X S M J SOLDERING FOOTPRINT* 1.52 0.060 7.0 0.275 4.0 0.155 0.6 0.024 1.270 0.050 SCALE 6:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 21 MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8_ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0 _ 8 _ 0.010 0.020 0.228 0.244 LM2931, NCV2931 Series PACKAGE DIMENSIONS D2PAK D2T SUFFIX CASE 936−03 ISSUE D T C A K S B J 2 ES DETAIL C DETAIL C 3 F G SIDE VIEW 2X TOP VIEW D 0.010 (0.254) N M P R C OPTIONAL CHAMFER V H 1 U ED OPTIONAL CHAMFER T TERMINAL 4 L SIDE VIEW BOTTOM VIEW DUAL GAUGE CONSTRUCTION NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCHES. 3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS A AND K. 4. DIMENSIONS U AND V ESTABLISH A MINIMUM MOUNTING SURFACE FOR TERMINAL 4. 5. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH OR GATE PROTRUSIONS. MOLD FLASH AND GATE PROTRUSIONS NOT TO EXCEED 0.025 (0.635) MAXIMUM. 6. SINGLE GAUGE DESIGN WILL BE SHIPPED AFTER FPCN EXPIRATION IN OCTOBER 2011. SINGLE GAUGE CONSTRUCTION T M T SEATING PLANE BOTTOM VIEW DETAIL C OPTIONAL CONSTRUCTIONS SOLDERING FOOTPRINT* 10.490 8.380 16.155 2X 3.504 2X 1.016 5.080 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 22 DIM A B C D ED ES F G H J K L M N P R S U V INCHES MIN MAX 0.386 0.403 0.356 0.368 0.170 0.180 0.026 0.036 0.045 0.055 0.018 0.026 0.051 REF 0.100 BSC 0.539 0.579 0.125 MAX 0.050 REF 0.000 0.010 0.088 0.102 0.018 0.026 0.058 0.078 5 _ REF 0.116 REF 0.200 MIN 0.250 MIN MILLIMETERS MIN MAX 9.804 10.236 9.042 9.347 4.318 4.572 0.660 0.914 1.143 1.397 0.457 0.660 1.295 REF 2.540 BSC 13.691 14.707 3.175 MAX 1.270 REF 0.000 0.254 2.235 2.591 0.457 0.660 1.473 1.981 5 _ REF 2.946 REF 5.080 MIN 6.350 MIN LM2931, NCV2931 Series PACKAGE DIMENSIONS D2PAK D2T SUFFIX CASE 936A−02 ISSUE C −T− OPTIONAL CHAMFER A TERMINAL 6 E U S K B NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS A AND K. 4. DIMENSIONS U AND V ESTABLISH A MINIMUM MOUNTING SURFACE FOR TERMINAL 6. 5. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH OR GATE PROTRUSIONS. MOLD FLASH AND GATE PROTRUSIONS NOT TO EXCEED 0.025 (0.635) MAXIMUM. V H 1 2 3 4 5 M D 0.010 (0.254) M T L P N G INCHES MIN MAX 0.386 0.403 0.356 0.368 0.170 0.180 0.026 0.036 0.045 0.055 0.067 BSC 0.539 0.579 0.050 REF 0.000 0.010 0.088 0.102 0.018 0.026 0.058 0.078 5 _ REF 0.116 REF 0.200 MIN 0.250 MIN DIM A B C D E G H K L M N P R S U V R C SOLDERING FOOTPRINT* MILLIMETERS MIN MAX 9.804 10.236 9.042 9.347 4.318 4.572 0.660 0.914 1.143 1.397 1.702 BSC 13.691 14.707 1.270 REF 0.000 0.254 2.235 2.591 0.457 0.660 1.473 1.981 5 _ REF 2.946 REF 5.080 MIN 6.350 MIN 8.38 0.33 1.702 0.067 10.66 0.42 16.02 0.63 3.05 0.12 SCALE 3:1 1.016 0.04 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 http://onsemi.com 23 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative LM2931/D