NCV4274, NCV4274A 400 mA 2% and 4%Voltage Regulator Family Description The NCV4274 and NCV4274A is a precision micro−power voltage regulator with an output current capability of 400 mA available in the DPAK and D2PAK packages. The output voltage is accurate within ±2.0% or ±4.0% depending on the version with a maximum dropout voltage of 0.5 V with an input up to 40 V. Low quiescent current is a feature drawing only 150 mA with a 1 mA load. This part is ideal for automotive and all battery operated microprocessor equipment. The regulator is protected against reverse battery, short circuit, and thermal overload conditions. The device can withstand load dump transients making it suitable for use in automotive environments. http://onsemi.com MARKING DIAGRAMS 4 74X−xxG ALYWW x DPAK DT SUFFIX CASE 369C 1 Features • • • • • • • • • • • • 2.5, 3.3 V, 5.0 V, ±2.0% and ±4.0% Output Options Low 150 mA Quiescent Current at 1 mA load current 400 mA Output Current Capability Fault Protection +60 V Peak Transient Voltage with Respect to GND −40 V Reverse Voltage Short Circuit Thermal Overload Very Low Dropout Voltage Electrical Parameters Guaranteed Over Entire Temperature Range NCV Prefix for Automotive and Other Applications Requiring Site and Control Changes These are Pb−Free Devices 2 1 Input 2, 4 Ground 3 Output 3 4 NC V4274X−xx AWLYWWG D2PAK DS SUFFIX CASE 936 SOT−223 ST SUFFIX CASE 318E X xx A L, WL Y WW, W G 1 2 1 Input 2, 4 Ground 3 Output 3 AYW 74X−xxG 1 = A or blank = Voltage Ratings = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 13 of this data sheet. © Semiconductor Components Industries, LLC, 2006 December, 2006 − Rev. 7 1 Publication Order Number: NCV4274/D NCV4274, NCV4274A I Q Bandgap Refernece Current Limit and Saturation Sense − + Thermal Shutdown GND Figure 1. Block Diagram Pin Definitions and Functions Pin No. Symbol 1 I 2,4 GND 3 Q Function Input; Bypass directly at the IC a ceramic capacitor to GND. Ground Output; Bypass with a capacitor to GND. 1. DPAK 3LD package code 6025 2. D2PAK 3LD package code 6083 ABSOLUTE MAXIMUM RATINGS Pin Symbol, Parameter I, Input−to−Regulator Symbol Condition Min Max Unit V Voltage VI −42 45 Current II Internally Limited Internally Limited I, Input peak Transient Voltage to Regulator with Respect to GND VI 60 V Q, Regulated Output Voltage VQ −1.0 40 V Current IQ Internally Limited Internally Limited GND, Ground Current IGND − 100 mA Junction Temperature Storage Temperature TJ TStg − −50 150 150 °C °C ESD Capability, Human Body Model ESDHB 4 kV ESD Capability, Machine Model ESDMM 200 V ESD Capability, Charged Device Model ESDCDM 1 kV Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 3. This device series incorporates ESD protection and is tested by the following methods: ESD HBM tested per AEC−Q100−002 (EIA/JESD22−A114) ESD MM tested per AEC−Q100−003 (EIA/JESD22−A115) ESD CDM tested per EIA/JES D22/C101, Field Induced Charge Model 4. Latchup Current Maximum Rating: ≤ 150 mA per JEDEC standard: JESD78. http://onsemi.com 2 NCV4274, NCV4274A OPERATING RANGE Min Max Unit Input Voltage (5.0 V Version) Parameter Symbol VI Condition 5.5 40 V Input Voltage (3.3 V, and 2.5 V Version) VI 4.5 40 V Junction Temperature TJ −40 150 °C THERMAL RESISTANCE Min Max Unit Junction−to−Ambient Parameter DPAK Rthja − 70 (Note 6) °C/W Junction−to−Ambient D2PAK Rthja − 60 (Note 6) °C/W Junction−to−Case DPAK Rthjc − 4 °C/W Junction−to−Case D2PAK Rthjc − 3 °C/W SOT−223 Y−JLX, − 14.5 (Note 7) °C/W − 169.7 (Note 7) °C/W Min Max Unit Junction−to−Tab Symbol Condition YLX Junction−to−Ambient SOT−223 RqJA, qJA 5. Soldered in, 1 cm2 copper area at Pin 4, FR4 6. Soldered in, minimal footprint, FR4 7. 1 oz copper, 5 mm2 copper area, FR4 LEAD SOLDERING TEMPERATURE AND MSL Parameter Lead Temperature Soldering, (Note 8) Reflow (SMD styles only), Symbol °C Pb 60s − 150s Above 183s 30s Max at Peak 60s − 150s Above 217s 40s Max at Peak Pb−Free Moisture Sensitivity Level Condition Tsld MSL 8. Per IPC/JEDEC J−STD−020C http://onsemi.com 3 − 240 pk − 265 pk 1 − NCV4274, NCV4274A ELECTRICAL CHARACTERISTICS NCV4274A and NCV4274 5.0 V −40°C < TJ < 150°C; VI = 13.5 V unless otherwise noted. Min Parameter Symbol Typ Max Min NCV4274A Test Conditions Typ Max NCV4274 Unit REGULATOR Output Voltage (5.0 V Version) VQ 5 mA < IQ < 400 mA 6V < VI < 28 V 4.9 5.0 5.1 4.8 5.0 5.2 V Output Voltage (5.0 V Version) VQ 5 mA < IQ < 200 mA 6 V < VI < 40 V 4.9 5.0 5.1 4.8 5.0 5.2 V Output Voltage (3.3 V Version) VQ 5 mA < IQ < 400 mA 4.5 V < VI < 28 V 3.23 3.3 3.37 3.17 3.3 3.43 V Output Voltage (3.3 V Version) VQ 5 mA < IQ < 200 mA 4.5 V < VI < 40 V 3.23 3.3 3.37 3.17 3.3 3.43 V Output Voltage (2.5 V Version) VQ 5 mA < IQ < 400 mA 4.5 V < VI < 28 V 2.45 2.5 2.55 2.4 2.5 2.6 V Output Voltage (2.5 V Version) VQ 5 mA < IQ < 200 mA 4.5 V < VI < 40 V 2.45 2.5 2.55 2.4 2.5 2.6 V Current Limit IQ − 400 600 − 400 600 − mA Quiescent Current Iq Iq = 1 mA VQ = 5.0 V VQ = 3.3 V VQ = 2.5 V Iq = 250 mA VQ = 5.0 V VQ = 3.3 V VQ = 2.5 V Iq = 400 mA VQ = 5.0 V VQ = 3.3 V VQ = 2.5 V − − − 190 145 140 250 250 250 − − − 190 145 140 250 250 250 mA mA mA − − − 10 13 12 15 20 15 − − − 10 13 12 15 20 15 mA mA mA − − − 20 30 28 35 45 35 − − − 20 30 28 35 45 35 mA mA mA IQ = 250 mA, VDR = VI − VQ VI = 5.0 V VI = 4.5 V VI = 4.5 V − − − 250 − − 500 1.23 2.05 − − − 250 − − 500 1.33 2.1 mV V V Dropout Voltage VDR 5.0 V Version 3.3 V Version 2.5 V Version Load Regulation DVQ IQ = 5 mA to 400 mA − 7 20 − 7 30 mV Line Regulation DVQ DVI = 12 V to 32 V IQ = 5 mA − 10 25 − 10 25 mV Power Supply Ripple Rejection PSRR ƒr = 100 Hz, Vr = 0.5 VPP − 60 − − 60 − dB Temperature output voltage drift dVQ/dT − 0.5 − − 0.5 − mV/K Thermal Shutdown Temperature* TSD 150 − 210 150 − 210 °C IQ = 5 mA *Guaranteed by design, not tested in production VI VI II C11 1.0 mF I C12 100 nF 1 NCV4274 3 NCV4274A Q 2,4 GND IGND IQ CQ 10 mF or 22 mF 4.5 − 40 V VQ VQ Input Rload CI 100 nF 1 NCV4274 3 NCV4274A 2,4 GND Figure 2. Measuring Circuit Figure 3. Application Circuit http://onsemi.com 4 5.0 V CQ Output 10 mF NCV4274, NCV4274A TYPICAL CHARACTERISTIC CURVES 1000 VI = 13.5 V ESR (W) 100 Maximum ESR COUT = 1 mF − 100 mF 10 Stable Region 1.0 0.1 Minimum ESR COUT = 1 mF 0 5 20 60 100 140 180 220 260 300 340 380 420 LOAD CURRENT (mA) Figure 4. ESR Characterization http://onsemi.com 5 NCV4274, NCV4274A TYPICAL CHARACTERISTIC CURVES − 5.0 V Version 5.2 6 VI = 13.5 V RL = 1 kW RL = 20 W TJ = 25°C 5 5.1 VQ (V) VQ (V) 4 5.0 3 2 4.9 1 0 4.8 −40 0 40 80 120 160 0 TJ (°C) 2 4 6 8 10 VI (V) Figure 5. Output Voltage vs. Junction Temperature Figure 6. Output Voltage vs. Input Voltage 60 800 TJ = 25°C VQ = 0 V TJ = 25°C VI = 13.5 V 50 600 Iq (mA) IQ (mA) 40 400 30 20 200 10 0 0 0 10 20 30 40 0 50 100 200 300 IQ (mA) VI (V) Figure 7. Output Current vs. Input Voltage 1.2 600 600 TJ = 25°C VI = 13.5 V 500 400 VDR (mV) 1 Iq (mA) 500 Figure 8. Current Consumption vs. Output Current (High Load) 1.6 1.4 400 0.8 0.6 TJ = 125°C 300 TJ = 25°C 200 0.4 100 0.2 0 0 10 20 30 40 50 0 60 0 100 200 300 IQ (mA) IQ (mA) Figure 9. Current Consumption vs. Output Current (Low Load) Figure 10. Drop Voltage vs. Output Current http://onsemi.com 6 400 NCV4274, NCV4274A TYPICAL CHARACTERISTIC CURVES − 5.0 V Version 6 40 4 RL = 20 W TJ = 25°C 2 30 RL = 6.8 kW TJ = 25°C 0 II (mA) Iq (mA) −2 20 −4 −6 −8 −10 10 −12 −14 0 0 10 20 30 40 −16 −50 50 VI (V) −25 0 25 VI (V) Figure 11. Current Consumption vs. Input Voltage Figure 12. Input Current vs. Input Voltage http://onsemi.com 7 50 NCV4274, NCV4274A TYPICAL CHARACTERISTIC CURVES − 3.3 V Version 3.5 6 VI = 6 V RL = 1 kW 3.4 4 VQ (V) 3.3 VQ (V) RL = 20 W TJ = 25°C 5 3.2 3 3.1 2 3.0 1 2.9 −40 0 0 40 80 120 160 0 TJ (°C) 1 2 3 4 5 6 VI (V) Figure 13. Output Voltage vs. Junction Temperature Figure 14. Output Voltage vs. Input Voltage 800 60 TJ = 25°C VQ = 0 V TJ = 25°C VI = 13.5 V 50 600 Iq (mA) IQ (mA) 40 400 30 20 200 10 0 0 10 20 30 40 0 50 0 100 200 VI (V) Figure 15. Output Current vs. Input Voltage 500 600 1.26 TJ = 25°C VI = 13.5 V 1.4 1.24 1.2 TJ = 125°C 1.22 VDR (V) 1.0 Iq (mA) 400 Figure 16. Current Consumption vs. Output Current (High Load) 1.6 0.8 0.6 TJ = 25°C 1.20 1.18 VDR = VI(min) − VQ 0.4 1.16 0.2 0 300 IQ (mA) 0 10 20 30 40 50 60 1.14 0 100 200 300 IQ (mA) IQ (mA) Figure 17. Current Consumption vs. Output Current (Low Load) Figure 18. Voltage Drop vs. Output Current http://onsemi.com 8 400 NCV4274, NCV4274A TYPICAL CHARACTERISTIC CURVES − 3.3 V Version 7 4 2 RL = 20 W TJ = 25°C 6 0 −2 4 II (mA) Iq (mA) 5 3 −6 −8 −10 2 −12 1 0 −4 RL = 3.3 kW TJ = 25°C −14 0 10 20 30 40 −16 −50 50 VI (V) −25 0 25 VI (V) Figure 19. Current Consumption vs. Input Voltage Figure 20. Input Current vs. Input Voltage http://onsemi.com 9 50 NCV4274, NCV4274A TYPICAL CHARACTERISTIC CURVES − 2.5 V Version 2.7 5.0 4.5 VI = 6 V RL = 1 kW 2.6 4.0 3.5 VQ (V) VQ (V) 2.5 2.4 2.3 3.0 2.5 2.0 1.5 1.0 2.2 0.5 0 2.1 −40 0 40 80 120 160 0 2 1 3 TJ (°C) 4 5 6 VI (V) Figure 21. Output Voltage vs. Junction Temperature Figure 22. Output Voltage vs. Input Voltage 800 60 TJ = 25°C VQ = 0 V TJ = 25°C VI = 13.5 V 50 600 Iq (mA) IQ (mA) 40 400 30 20 200 10 0 0 10 20 30 40 0 50 0 100 200 300 IQ (mA) VI (V) Figure 23. Output Current vs. Input Voltage 600 2.05 TJ = 25°C VI = 13.5 V 1.4 2.04 2.03 1.2 2.02 1.0 TJ = 125°C 2.01 VDR (V) Iq (mA) 500 Figure 24. Current Consumption vs. Output Current (High Load) 1.6 0.8 0.6 TJ = 25°C 2.00 1.99 1.98 0.4 1.97 0.2 0 400 VDR = VI(min) − VQ 1.96 0 10 20 30 40 50 60 1.95 0 100 200 300 IQ (mA) IQ (mA) Figure 25. Current Consumption vs. Output Current (Low Load) Figure 26. Voltage Drop vs. Output Current http://onsemi.com 10 400 NCV4274, NCV4274A TYPICAL CHARACTERISTIC CURVES − 2.5 V Version 4.5 2 RL = 20 W TJ = 25°C 4.0 3.5 0 −2 II (mA) Iq (mA) 3.0 2.5 2.0 −6 −8 1.5 −10 1.0 RL = 3.3 kW TJ = 25°C −12 0.5 0 −4 0 10 20 30 40 −14 −50 50 VI (V) −25 0 25 VI (V) Figure 27. Current Consumption vs. Input Voltage Figure 28. Input Current vs. Input Voltage http://onsemi.com 11 50 NCV4274, NCV4274A APPLICATION DESCRIPTION Output Regulator Once the value of PD(max) is known, the maximum permissible value of RqJA can be calculated: ǒ150 C * T AǓ The output is controlled by a precision trimmed reference and error amplifier. The PNP output has saturation control for regulation while the input voltage is low, preventing over saturation. Current limit and voltage monitors complement the regulator design to give safe operating signals to the processor and control circuits. Pq JA + PD (eq. 2) The value of RqJA can then be compared with those in the package section of the data sheet. Those packages with RqJA’s less than the calculated value in Equation 2 will keep the die temperature below 150°C. In some cases, none of the packages will be sufficient to dissipate the heat generated by the IC, and an external heat sink will be required. The current flow and voltages are shown in the Measurement Circuit Diagram. Stability Considerations The input capacitor CI1 in Figure 2 is necessary for compensating input line reactance. Possible oscillations caused by input inductance and input capacitance can be damped by using a resistor of approximately 1 W in series with CI2. The output or compensation capacitor helps determine three main characteristics of a linear regulator: startup delay, load transient response and loop stability. The capacitor value and type should be based on cost, availability, size and temperature constraints. The aluminum electrolytic capacitor is the least expensive solution, but, if the circuit operates at low temperatures (−25°C to −40°C), both the value and ESR of the capacitor will vary considerably. The capacitor manufacturer’s data sheet usually provides this information. The value for the output capacitor CQ shown in Figure 2 should work for most applications; however, it is not necessarily the optimized solution. Stability is guaranteed at values CQ w 2.2 mF and an ESR v 2.5 W within the operating temperature range. Actual limits are shown in a graph in the Typical Performance Characteristics section. Heat Sinks A heat sink effectively increases the surface area of the package to improve the flow of heat away from the IC and into the surrounding air. Each material in the heat flow path between the IC and the outside environment will have a thermal resistance. Like series electrical resistances, these resistances are summed to determine the value of RqJA: R qJA + R qJC ) R qCS ) R qSA (eq. 3) Where: RqJC = the junction−to−case thermal resistance, RqCS = the case−to−heat sink thermal resistance, and RqSA = the heat sink−to−ambient thermal resistance. RqJC appears in the package section of the data sheet. Like RqJA, it too is a function of package type. RqCS and RqSA are functions of the package type, heat sink and the interface between them. These values appear in data sheets of heat sink manufacturers. Thermal, mounting, and heat sinking are discussed in the ON Semiconductor application note AN1040/D, available on the ON Semiconductor Website. Calculating Power Dissipation in a Single Output Linear Regulator The maximum power dissipation for a single output regulator (Figure 3) is: P D(max) + [V I(max) * V Q(min)]I Q(max) ) V I(max)I q (eq. 1) Where: VI(max) is the maximum input voltage, VQ(min) is the minimum output voltage, IQ(max) is the maximum output current for the application, and Iq is the quiescent current the regulator consumes at IQ(max). http://onsemi.com 12 NCV4274, NCV4274A ORDERING INFORMATION4 Output Voltage Accuracy Output Voltage Package Shipping † NCV4274DS50G 4% 5.0 V D2PAK (Pb−Free) 50 Units / Rail NCV4274DS50R4G 4% 5.0 V D2PAK (Pb−Free) 800 / Tape & Reel NCV4274DT50G 4% 5.0 V DPAK (Pb−Free) 75 Units / Rail NCV4274DT50RKG 4% 5.0 V DPAK (Pb−Free) 2500 / Tape & Reel NCV4274ADS50G 2% 5.0 V D2PAK (Pb−Free) 50 Units / Rail NCV4274ADS50R4G 2% 5.0 V D2PAK (Pb−Free) 800 / Tape & Reel NCV4274ADT50G 2% 5.0 V DPAK (Pb−Free) 75 Units / Rail NCV4274ADT50RKG 2% 5.0 V DPAK (Pb−Free) 2500 / Tape & Reel NCV4274ST33T3G 4% 3.3 V SOT−223 (Pb−Free) 4000 / Tape & Reel NCV4274DT33RKG 4% 3.3 V DPAK (Pb−Free) 2500 / Tape & Reel NCV4274AST33T3G 2% 3.3 V SOT−223 (Pb−Free) 4000 / Tape & Reel NCV4274ADT33RKG 2% 3.3 V DPAK (Pb−Free) 2500 / Tape & Reel NCV4274ST25T3G 4% 2.5 V SOT−223 (Pb−Free) 4000 / Tape & Reel NCV4274AST25T3G 2% 2.5 V SOT−223 (Pb−Free) 4000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 13 NCV4274, NCV4274A PACKAGE DIMENSIONS DPAK (SINGLE GAUGE) CASE 369C−01 ISSUE O −T− C B V NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. SEATING PLANE E R 4 Z A S 1 2 DIM A B C D E F G H J K L R S U V Z 3 U K F J L H D G 2 PL 0.13 (0.005) M T SOLDERING FOOTPRINT* 6.20 0.244 2.58 0.101 5.80 0.228 3.0 0.118 1.6 0.063 6.172 0.243 SCALE 3:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 14 INCHES MIN MAX 0.235 0.245 0.250 0.265 0.086 0.094 0.027 0.035 0.018 0.023 0.037 0.045 0.180 BSC 0.034 0.040 0.018 0.023 0.102 0.114 0.090 BSC 0.180 0.215 0.025 0.040 0.020 −−− 0.035 0.050 0.155 −−− MILLIMETERS MIN MAX 5.97 6.22 6.35 6.73 2.19 2.38 0.69 0.88 0.46 0.58 0.94 1.14 4.58 BSC 0.87 1.01 0.46 0.58 2.60 2.89 2.29 BSC 4.57 5.45 0.63 1.01 0.51 −−− 0.89 1.27 3.93 −−− NCV4274, NCV4274A PACKAGE DIMENSIONS SOT−223 (TO−261) CASE 318E−04 ISSUE L NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. D b1 4 HE 1 2 3 E b e1 e 0.08 (0003) C q A A1 DIM A A1 b b1 c D E e e1 L1 HE q MIN 1.50 0.02 0.60 2.90 0.24 6.30 3.30 2.20 0.85 1.50 6.70 0° L1 SOLDERING FOOTPRINT 3.8 0.15 2.0 0.079 2.3 0.091 2.3 0.091 6.3 0.248 2.0 0.079 1.5 0.059 SCALE 6:1 http://onsemi.com 15 mm Ǔ ǒinches MILLIMETERS NOM MAX 1.63 1.75 0.06 0.10 0.75 0.89 3.06 3.20 0.29 0.35 6.50 6.70 3.50 3.70 2.30 2.40 0.94 1.05 1.75 2.00 7.00 7.30 10° − MIN 0.060 0.001 0.024 0.115 0.009 0.249 0.130 0.087 0.033 0.060 0.264 0° INCHES NOM 0.064 0.002 0.030 0.121 0.012 0.256 0.138 0.091 0.037 0.069 0.276 − MAX 0.068 0.004 0.035 0.126 0.014 0.263 0.145 0.094 0.041 0.078 0.287 10° NCV4274, NCV4274A PACKAGE DIMENSIONS D2PAK CASE 936−03 ISSUE B −T− K OPTIONAL CHAMFER A TERMINAL 4 E U S B F 1 2 3 V H M J D 0.010 (0.254) M T NOTES: 3. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 4. CONTROLLING DIMENSION: INCH. 5. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS A AND K. 6. DIMENSIONS U AND V ESTABLISH A MINIMUM MOUNTING SURFACE FOR TERMINAL 4. 7. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH OR GATE PROTRUSIONS. MOLD FLASH AND GATE PROTRUSIONS NOT TO EXCEED 0.025 (0.635) MAXIMUM. L P N G DIM A B C D E F G H J K L M N P R S U V R C SOLDERING FOOTPRINT* 8.38 0.33 1.016 0.04 10.66 0.42 17.02 0.67 INCHES MIN MAX 0.386 0.403 0.356 0.368 0.170 0.180 0.026 0.036 0.045 0.055 0.051 REF 0.100 BSC 0.539 0.579 0.125 MAX 0.050 REF 0.000 0.010 0.088 0.102 0.018 0.026 0.058 0.078 5 _ REF 0.116 REF 0.200 MIN 0.250 MIN MILLIMETERS MIN MAX 9.804 10.236 9.042 9.347 4.318 4.572 0.660 0.914 1.143 1.397 1.295 REF 2.540 BSC 13.691 14.707 3.175 MAX 1.270 REF 0.000 0.254 2.235 2.591 0.457 0.660 1.473 1.981 5 _ REF 2.946 REF 5.080 MIN 6.350 MIN 5.08 0.20 3.05 0.12 SCALE 3:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 http://onsemi.com 16 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative NCV4274/D