NCV8560 High Performance Low-Power, LDO Regulator with Enable The NCV8560 provides 150 mA of output current at fixed voltage options, or an adjustable output voltage from 5.0 V down to 1.250 V. It is designed for portable battery powered applications and offers high performance features such as low power operation, fast enable response time, and low dropout. The device is designed to be used with low cost ceramic capacitors and is packaged in the DFN6, 3x3 and TSOP−5 packages. Features • Output Voltage Options: • • • • • • • • • Adjustable, 1.3 V, 1.5 V, 1.8 V, 2.5 V, 2.8 V, 3.0 V, 3.3 V, 3.5 V, 5.0 V Ultra−Low Dropout Voltage of 150 mV at 150 mA Adjustable Output by External Resistors from 5.0 V down to 1.250 V Fast Enable Turn−on Time of 15 ms Wide Supply Voltage Range Operating Range Excellent Line and Load Regulation High Accuracy up to 1.5% Output Voltage Tolerance over All Operating Conditions Typical Noise Voltage of 50 mVrms without a Bypass Capacitor NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable These Devices are Pb−Free and are RoHS Compliant Typical Applications • • • • www.onsemi.com ÇÇ DFN6 MN SUFFIX CASE 488AE DFN6 MN SUFFIX CASE 506BA TSOP−5 SN SUFFIX CASE 483 MARKING DIAGRAMS DFN6 1 1 V8560 xxx ALYWG AQ MG G V8560 or AQ = Specific Device Code xxx = ADJ, 150, 180, 250, 280, 300, 330, 350 or 500 A = Assembly Location L = Wafer Lot Y = Year W = Work Week M = Date Code G = Pb−Free Package SMPS Post−Regulation Hand−held Instrumentation Noise Sensitive Circuits – VCO, RF Stages, etc. Camcorders and Cameras TSOP−5 5 xxxAYWG G 1 VOUT VIN Fixed Voltage Only Driver w/ Current Limit + - − = Specific Device Code = Assembly Location = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) + GND xxx A Y W G 1.25 V Thermal Shutdown ORDERING INFORMATION ADJ Adjustable Version Only See detailed ordering and shipping information in the package dimensions section on page 13 of this data sheet. ENABLE Figure 1. Simplified Block Diagram © Semiconductor Components Industries, LLC, 2013 February, 2017 − Rev. 5 1 Publication Order Number: NCV8560/D NCV8560 PIN CONNECTIONS Vin 1 GND 2 ENABLE 3 5 ADJ/NC* 1 Vout GND 2 GND ENABLE 3 4 ADJ/NC* (Top View) 6 Vout Vout 1 5 GND GND 2 6 Vin GND NC 3 4 Vin (Top View) 5 GND 4 ENABLE (Top View) * ADJ − Adjustable Version * NC − Fixed Voltage Version * ADJ − Adjustable Version * NC − Fixed Voltage Version Figure 2. TSOP5 Figure 3. DFN6 (3x3) ÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁÁ Figure 4. DFN6 (2x2.2) PIN FUNCTION DESCRIPTION Pin No. DFN6 (2x2.2) DFN6 (3x3) 3 1 2, 5, EPAD 2, 5, EPAD 4 3 6 4 1 6 TSOP−5 Pin Name 4 ADJ/NC 2 GND 3 ENABLE 1 Vin Positive Power Supply Input 5 Vout Regulated Output Voltage Description Output Voltage Adjust Input (Adjustable Version), No Connection (Fixed Voltage Versions) (Note 1) Power Supply Ground; Device Substrate The Enable Input places the device into low−power standby when pulled to logic low (< 0.4 V). Connect to Vin if the function is not used. 1. True no connect. Printed circuit board traces are allowable. ABSOLUTE MAXIMUM RATINGS Rating Symbol Min Max Unit Vin −0.3 6 V Vout, ENABLE, ADJ −0.3 Vin + 0.3 V V TJ(max) − 150 °C TSTG −65 150 °C ESD Capability, Human Body Model (Note 3) ESDHBM 3500 − V ESD Capability, Machine Model (Note 3) ESDMM 200 − V Input Voltage (Note 2) Output, Enable, Adjustable Voltage Maximum Junction Temperature Storage Temperature Moisture Sensitivity Level MSL MSL1/260 − Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 2. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area. 3. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114) ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115) Latchup Current Maximum Rating: v150 mA per JEDEC standard: JESD78. THERMAL CHARACTERISTICS Rating Symbol Thermal Characteristics, DFN6, 3x3.3 mm (Note 4) Thermal Resistance, Junction−to−Air (Note 5) RqJA Thermal Characteristics, TSOP−5 (Note 4) Thermal Resistance, Junction−to−Air (Note 5) RqJA Thermal Characteristics, DFN6, 2x2.2 mm (Note 4) Thermal Resistance, Junction−to−Air (Note 5) RqJA Value °C/W 107 °C/W 205 °C/W 122 4. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area. 5. As measured using a copper heat spreading area of 650 mm2, 1 oz copper thickness. www.onsemi.com 2 Unit NCV8560 OPERATING RANGES Symbol Min Max Unit Operating Input Voltage (Note 6) Rating Vin Vout + VDO, 1.75 V (Note 7) 6 V Adjustable Output Voltage Range (Adjustable Version Only) Vout 1.25 5.0 V TA −40 125 °C Operating Ambient Temperature Range 6. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area. 7. Minimum Vin = 1.75 V or (Vout + VDO), whichever is higher. ELECTRICAL CHARACTERISTICS (Vin = 1.750 V, Vout = 1.250 V (adjustable version)), (Vin = Vout + 0.5 V (fixed version)), Cin = Cout =1.0 mF, −40°C ≤ TA ≤ 125°C, Figure 5, unless otherwise specified.) (Note 8) Characteristic Symbol Test Conditions Min Typ Max Unit − 0.01 1.0 mA − − − − − 100 135 135 140 145 135 150 170 175 180 GENERAL Disable Current IDIS ENABLE = 0 V, Vin = 6 V −40°C ≤ TA ≤ 85°C Ground Current Adjustable Option 1.3 V Option 1.5 V Option 1.8 V to 3.0 V Option 3.3 V to 5.0 V Option IGND ENABLE = 0.9 V, Iout = 1.0 mA to 150 mA Thermal Shutdown Temperature (Note 9) TSD 150 175 200 °C Thermal Shutdown Hysteresis TSH − 10 − °C ADJ Input Bias Current IADJ −0.75 − 0.75 mA mA CHIP ENABLE ENABLE Input Threshold Voltage Vth(EN) V Voltage Increasing, Logic High 0.9 − − Voltage Decreasing, Logic Low − − 0.4 − 3.0 100 − − − 15 15 30 25 25 50 Enable Input Bias Current (Note 9) IEN nA TIMING Output Turn On Time Adjustable Option 1.3 V to 3.5 V Option 5.0 V Option tEN ENABLE = 0 V to Vin ms 8. Performance guaranteed over the indicated operating temperature range by design and/or characterization, production tested at TJ = TA = 25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. 9. Values based on design and/or characterization. www.onsemi.com 3 NCV8560 ELECTRICAL CHARACTERISTICS (Vin = 1.750 V, Vout = 1.250 V, Cin = Cout =1.0 mF, −40°C ≤ TA ≤ 125°C, Figure 5, unless otherwise specified.) (Note 10) Characteristic Symbol Test Conditions Min Typ Max Unit 1.231 (−1.5%) 1.250 1.269 (+1.5%) V − − − 62 55 38 − − − REGULATOR OUTPUT (Adjustable Voltage Version) Output Voltage Vout Iout = 1.0 mA to 150 mA Vin = 1.75 V to 6.0 V, Vout = ADJ Ripple Rejection (Vin = Vout + 1.0 V + 0.5 Vp−p) RR Iout = 1.0 mA to 150 mA f = 120 Hz f = 1.0 kHz f = 10 kHz dB Line Regulation Regline Vin = 1.750 V to 6.0 V, Iout = 1.0 mA − 1.0 10 mV Load Regulation Regload Iout = 1.0 mA to 150 mA − 2.0 15 mV f = 10 Hz to 100 kHz − 50 − mVrms 300 550 800 mA − − − − − − 175 175 150 125 100 75 250 250 225 175 150 125 Output Noise Voltage (Note 11) Vn Output Short Circuit Current Isc Dropout Voltage Vout = 1.25 V Vout = 1.3 V Vout = 1.5 V Vout = 1.8 V Vout = 2.5 V Vout ≥ 2.8 V VDO Measured at: Vout – 2.0%, Iout = 150 mA, Figure 6 mV REGULATOR OUTPUT (Fixed Voltage Version) (Vin = Vout + 0.5 V, Cin = Cout =1.0 mF, −40°C ≤ TA ≤ 125°C, Figure 7, unless otherwise specified.) (Note 10) Output Voltage 1.3 V Option 1.5 V Option 1.8 V Option 2.5 V Option 2.8 V Option 3.0 V Option 3.3 V Option 3.5 V Option 5.0 V Option Vout Iout = 1.0 mA to 150 mA Vin = (Vout + 0.5 V) to 6.0 V Power Supply Ripple Rejection (Note 11) (Vin = Vout + 1.0 V + 0.5 Vp−p) PSRR Line Regulation Regline Vin = 1.750 V to 6.0 V, Iout = 1.0 mA Load Regulation 1.3 V to 1.5 V Option 1.8 V Option 2.5 V to 5.0 V Option Regload Iout = 1.0 mA to 150 mA Output Noise Voltage (Note 11) Vn Output Short Circuit Current Dropout Voltage 1.3 V Option 1.5 V Option 1.8 V Option 2.5 V Option 2.8 V to 5.0 V Option Isc VDO Iout = 1.0 mA to 150 mA f = 120 Hz f = 1.0 kHz f = 10 kHz f = 10 Hz to 100 kHz V 1.274 1.470 1.764 2.450 2.744 2.940 3.234 3.430 4.900 (−2%) 1.326 1.530 1.836 2.550 2.856 3.060 3.366 3.570 5.100 (+2%) dB − − − 62 55 38 − − − − 1.0 10 − − − 2.0 2.0 2.0 20 25 30 − 50 − mVrms 300 550 800 mA − − − − − 175 150 125 100 75 250 225 175 150 125 mV mV Measured at: Vout – 2.0% mV 10. Performance guaranteed over the indicated operating temperature range by design and/or characterization, production tested at TJ = TA = 25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. 11. Values based on design and/or characterization. Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. www.onsemi.com 4 NCV8560 VOUT VIN VIN CIN NCV8560 (adjustable) ADJ EN VOUT COUT GND Figure 5. Typical Application Circuit for Vout = 1.25 V (Adjustable Version) VIN CIN VOUT VIN NCV8560 (adjustable) ADJ EN VOUT COUT GND Figure 6. Typical Application Circuit for Adjustable Vout VOUT VIN VIN CIN NCV8560 (fixed) EN GND Figure 7. Typical Application Circuit (Fixed Voltage Version) www.onsemi.com 5 VOUT COUT NCV8560 TYPICAL CHARACTERISTICS 1.260 Vout, OUTPUT VOLTAGE (V) Vout, OUTPUT VOLTAGE (V) 1.260 1.256 Iout = 1.0 mA 1.252 Iout = 150 mA 1.248 Vin = Vout + 0.5 V Vout = ADJ 1.244 1.240 −40 −20 0 20 40 60 80 Vin = 6.0 V Vout = ADJ 1.244 −15 10 35 60 85 110 125 Figure 8. Output Voltage vs. Temperature (Vin = Vout + 0.5 V) Figure 9. Output Voltage vs. Temperature (Vin = 6.0 V) 1.500 Vout, OUTPUT VOLTAGE (V) Vout, OUTPUT VOLTAGE (V) Iout = 1.0 mA 1.490 Iout = 150 mA 1.485 1.480 −15 10 35 60 85 Iout = 1.0 mA 1.495 1.490 Iout = 150 mA 1.485 1.480 1.475 −40 110 125 −15 10 35 60 85 110 125 TA, AMBIENT TEMPERATURE (°C) TA, AMBIENT TEMPERATURE (°C) Figure 10. Output Voltage vs. Temperature (1.5 V Fixed Output, Vin = 2 V) Figure 11. Output Voltage vs. Temperature (1.5 V Fixed Output, Vin = 6 V) 3.005 3.005 Iout = 1.0 mA 3.000 2.995 Vout, OUTPUT VOLTAGE (V) Vout, OUTPUT VOLTAGE (V) Iout = 150 mA 1.248 TA, AMBIENT TEMPERATURE (°C) 1.495 Iout = 150 mA 2.990 2.985 2.980 2.975 −40 1.252 TA, AMBIENT TEMPERATURE (°C) 1.500 1.475 −40 Iout = 1.0 mA 1.240 −40 120 100 1.256 −15 10 35 60 85 110 125 Iout = 1.0 mA 3.000 2.995 2.990 Iout = 150 mA 2.985 2.980 2.975 2.970 −40 TA, AMBIENT TEMPERATURE (°C) −15 10 35 60 85 110 125 TA, AMBIENT TEMPERATURE (°C) Figure 12. Output Voltage vs. Temperature (3.0 V Fixed Output, Vin = 3.5 V) Figure 13. Output Voltage vs. Temperature (3.0 V Fixed Output, Vin = 6 V) www.onsemi.com 6 NCV8560 TYPICAL CHARACTERISTICS 5.000 5.000 Iout = 1.0 mA 4.995 Vout, OUTPUT VOLTAGE (V) Vout, OUTPUT VOLTAGE (V) Iout = 1.0 mA 4.990 Iout = 150 mA 4.985 4.980 4.975 4.970 4.965 −40 −15 10 35 60 110 125 85 4.995 4.990 4.985 Iout = 150 mA 4.980 4.975 4.970 4.965 −40 −15 TA, AMBIENT TEMPERATURE (°C) 60 85 110 125 Figure 15. Output Voltage vs. Temperature (5.0 V Fixed Output, Vin = 6 V) 250 Vout = ADJ VDO, DROPOUT VOLTAGE (mV) 250 Iout = 150 mA 200 150 100 Iout = 50 mA 50 Iout = 1.0 mA 0 −40 −20 0 20 40 60 80 100 Iout = 150 mA Vout = 1.25 V 200 1.50 V 1.80 V 150 2.80 V 100 3.00 V 50 5.00 V 0 −40 −20 120 0 20 40 60 80 100 120 TA, AMBIENT TEMPERATURE (°C) TA, AMBIENT TEMPERATURE (°C) Figure 16. Dropout Voltage vs. Temperature (Over Current Range) Figure 17. Dropout Voltage vs. Temperature (Over Output Voltage) 800 6.0 5.5 5.0 Iout = 0 mA Cout = 1.0 mF TA = 25°C ENABLE = Vin 4.5 4.0 Vth(EN), ENABLE THRESHOLD (mV) VDO, DROPOUT VOLTAGE (mV) 35 TA, AMBIENT TEMPERATURE (°C) Figure 14. Output Voltage vs. Temperature (5.0 V Fixed Output, Vin = 5.5 V) Vout, OUTPUT VOLTAGE (V) 10 5.0 V 3.3 V 3.0 V 3.5 3.0 2.80 V 2.5 2.0 1.80 V 1.5 V 1.5 1.0 1.25 V 0.5 0 0 1.0 2.0 3.0 4.0 5.0 750 Enable Increasing 700 Enable Decreasing 650 Vin = 5.5 V 600 −40 6.0 −15 10 35 60 85 110 125 Vin, INPUT VOLTAGE (V) TA, AMBIENT TEMPERATURE (°C) Figure 18. Output Voltage vs. Input Voltage Figure 19. Enable Threshold vs. Temperature www.onsemi.com 7 NCV8560 TYPICAL CHARACTERISTICS 154 IGND, GROUND CURRENT (mA) IGND, GROUND CURRENT (mA) 6.0 5.0 4.0 3.0 2.0 ENABLE = 0 V 1.0 0 −40 −15 10 35 60 85 110 146 125 Iout = 150 mA Vout = 5.0 V 138 130 122 114 Vout = 1.25 V Iout = 1.0 mA 106 Iout = 150 mA 98 ENABLE = 0.9 V 90 −40 −20 0 20 40 60 100 80 TA, AMBIENT TEMPERATURE (°C) TA, AMBIENT TEMPERATURE (°C) Figure 20. Ground Current (Sleep Mode) vs. Temperature Figure 21. Ground Current (Run Mode) vs. Temperature 120 106 160 140 3.0 V 1.5 V IGND, GROUND CURRENT (mA) 2.8 V 5.0 V 3.3 V 120 1.8 V 1.25 V 100 80 60 40 20 105 104 103 102 101 100 Vout = ADJ Vin = 1.75 V 99 98 0 0 1.0 2.0 3.0 4.0 0 6.0 5.0 25 50 75 100 125 150 Vin, INPUT VOLTAGE (V) Iout, OUTPUT CURRENT (mA) Figure 22. Ground Current vs. Input Voltage Figure 23. Ground Current vs. Output Current IADJ, ADJ INPUT BIAS CURRENT (nA) IGND, GROUND CURRENT (mA) Iout = 1.0 mA 400 300 200 100 0 −40 −20 0 20 40 60 80 100 120 TA, AMBIENT TEMPERATURE (°C) Figure 24. ADJ Input Bias Current vs. Temperature www.onsemi.com 8 NCV8560 700 650 ILIM, CURRENT LIMIT (mA) ISC, OUTPUT SHORT CIRCUIT CURRENT (mA) TYPICAL CHARACTERISTICS 600 550 500 450 −40 −20 600 500 400 300 200 100 0 0 20 40 60 80 100 0 120 5.0 4.0 Figure 25. Output Short Circuit Current vs. Temperature Figure 26. Current Limit vs. Input Voltage 6.0 5.0 Regload, LOAD REGULATION (mV) 3.0 2.0 1.0 Vin = (Vout + 0.5 V) to 6.0 V Iout = 1.0 mA 0 20 40 60 80 100 120 4.0 3.0 2.0 1.0 Iout = 1.0 mA to 150 mA 0 −40 −15 10 35 60 85 110 125 TA, AMBIENT TEMPERATURE (°C) TA, AMBIENT TEMPERATURE (°C) Figure 27. Line Regulation vs. Temperature Figure 28. Load Regulation vs. Temperature 45 80 40 70 1.25 V 60 35 3.3 V 5.0 V PSRR (dB) Regline, LINE REGULATION (mV) 3.0 Vin, INPUT VOLTAGE (V) 0 −40 −20 ton, OUTPUT TURN ON TIME (mS) 2.0 TA, AMBIENT TEMPERATURE (°C) 4.0 30 25 3.0 V 20 15 1.0 1.5 V 40 5.0 V 30 Vin = Vout + 1.0 V Vripple = 0.5 Vp−p Cout = 1.0 mF Iout = 1.0 mA to 150 mA 20 1.25 V (ADJ) 10 −40 −20 50 10 0 0 20 40 60 80 100 120 0.1 1.0 10 100 TA, AMBIENT TEMPERATURE (°C) f, FREQUENCY (kHz) Figure 29. Output Turn On Time vs. Temperature Figure 30. Power Supply Ripple Rejection vs. Frequency www.onsemi.com 9 NCV8560 TYPICAL CHARACTERISTICS OUTPUT CAPACITOR ESR (W) 10 Unstable Region Vout = 5.0 V Vout = 1.25 V 1.0 Stable Region 0.1 Cout = 1.0 mF to 10 mF TA = −40°C to 125°C Vin = up to 6.0 V 0.01 0 25 50 75 100 125 Iout, OUTPUT CURRENT (mA) Figure 31. Output Stability with Output Capacitor ESR over Output Current Vout = 1.25 V Figure 32. Load Transient Response (1.0 mF) Vout = 1.25 V Figure 33. Load Transient Response (10 mF) www.onsemi.com 10 150 NCV8560 DEFINITIONS Load Regulation Line Regulation The change in output voltage for a change in output load current at a constant temperature. The change in output voltage for a change in input voltage. The measurement is made under conditions of low dissipation or by using pulse techniques such that the average junction temperature is not significantly affected. Dropout Voltage The input/output differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 2% below its nominal. The junction temperature, load current, and minimum input supply requirements affect the dropout level. Line Transient Response Typical output voltage overshoot and undershoot response when the input voltage is excited with a given slope. Output Noise Voltage Load Transient Response This is the integrated value of the output noise over a specified frequency range. Input voltage and output load current are kept constant during the measurement. Results are expressed in mVrms or nV/√Hz. Typical output voltage overshoot and undershoot response when the output current is excited with a given slope between no−load and full−load conditions. Thermal Protection Internal thermal shutdown circuitry is provided to protect the integrated circuit in the event that the maximum junction temperature is exceeded. When activated at typically 175°C, the regulator turns off. This feature is provided to prevent failures from accidental overheating. Ground Current Ground Current (IGND) is the current that flows through the ground pin when the regulator operates with a load on its output. This consists of internal IC operation, bias, etc. It is actually the difference between the input current (measured through the LDO input pin) and the output load current. If the regulator has an input pin that reduces its internal bias and shuts off the output (enable/disable function), this term is called the disable current (IDIS). Maximum Package Power Dissipation The power dissipation level at which the junction temperature reaches its maximum operating value. APPLICATIONS INFORMATION output, there is no resistor divider. If the part is enabled under no−load conditions, leakage current through the pass transistor at junction temperatures above 85°C can approach several microamps, especially as junction temperature approaches 150°C. If this leakage current is not directed into a load, the output voltage will rise up to a level approximately 20 mV above nominal. The NCV8560 contains an overshoot clamp circuit to improve transient response during a load current step release. When output voltage exceeds the nominal by approximately 20 mV, this circuit becomes active and clamps the output from further voltage increase. Tying the ENABLE pin to Vin will ensure that the part is active whenever the supply voltage is present, thus guaranteeing that the clamp circuit is active whenever leakage current is present. When the NCV8560 adjustable regulator is disabled, the overshoot clamp circuit becomes inactive and the pass transistor leakage will charge any capacitance on Vout. If no load is present, the output can charge up to within a few millivolts of Vin. In most applications, the load will present some impedance to Vout such that the output voltage will be inherently clamped at a safe level. A minimum load of 10 mA is recommended. The NCV8560 series regulator is self−protected with internal thermal shutdown and internal current limit. Typical application circuits are shown in Figures 5 and 6. Input Decoupling (Cin) A ceramic or tantalum 1.0 mF capacitor is recommended and should be connected close to the NCV8560 package. Higher capacitance and lower ESR will improve the overall line transient response. Output Decoupling (Cout) The NCV8560 is a stable component and does not require a minimum Equivalent Series Resistance (ESR) for the output capacitor. The minimum output decoupling value is 1.0 mF and can be augmented to fulfill stringent load transient requirements. The regulator works with ceramic chip capacitors as well as tantalum devices. Larger values improve noise rejection and load regulation transient response. Figure 31 shows the stability region for a range of operating conditions and ESR values. No−Load Regulation Considerations The NCV8560 adjustable regulator will operate properly under conditions where the only load current is through the resistor divider that sets the output voltage. However, in the case where the NCV8560 is configured to provide a 1.250 V www.onsemi.com 11 NCV8560 Noise Decoupling 600 mW when the ambient temperature (TA) is 25°C, and PCB area is 150mm2 and larger, see Figure 34. The power dissipated by the NCV8560 can be calculated from the following equations: The NCV8560 is a low noise regulator and needs no external noise reduction capacitor. Unlike other low noise regulators which require an external capacitor and have slow startup times, the NCV8560 operates without a noise reduction capacitor, has a typical 15 ms start up delay and achieves a 50 mVrms overall noise level between 10 Hz and 100 kHz. P D [ V inǒI GND @ I outǓ ) I outǒV in * V outǓ or V in(MAX) [ Enable Operation The enable pin will turn the regulator on or off. The threshold limits are covered in the electrical characteristics table in this data sheet. The turn−on/turn−off transient voltage being supplied to the enable pin should exceed a slew rate of 10 mV/ms to ensure correct operation. If the enable function is not to be used then the pin should be connected to Vin. RthJA, THERMAL RESISTANCE JUNCTION−TO−AMBIENT (°C/W) The output voltage can be adjusted from 1 times (Figure 5) to 4 times (Figure 6) the typical 1.250 V regulation voltage via the use of resistors between the output and the ADJ input. The output voltage and resistors are chosen using Equation 1 and Equation 2. V out + 1.250 ǒ 1) R2 ^ Ǔ R2 ) ǒI ADJ R 1Ǔ (eq. 1) R1 V out 1.25 *1 (eq. 2) Input bias current IADJ is typically less than 150 nA. Choose R2 arbitrarily to minimize errors due to the bias current and to minimize noise contribution to the output voltage. Use Equation 2 to find the required value for R1. Thermal As power in the NCV8560 increases, it might become necessary to provide some thermal relief. The maximum power dissipation supported by the device is dependent upon board design and layout. Mounting pad configuration on the PCB, the board material, and the ambient temperature affect the rate of junction temperature rise for the part. When the NCV8560 has good thermal conductivity through the PCB, the junction temperature will be relatively low with high power applications. The maximum dissipation the NCV8560 can handle is given by: PD(MAX) + TJ(MAX) * TA RqJA P D(MAX) ) ǒV out I outǓ (eq. 5) I out ) I GND If a 150 mA output current is needed, the quiescent current IGND is taken from the data sheet electrical characteristics table or extracted from Figure 21 and Figure 23. IGND is approximately 108 mA when Iout = 150 mA. For an output voltage of 1.250 V, the maximum input voltage will then be 3.9 V, good for a 1 Cell Li−ion battery. Output Voltage Adjust R1 (eq. 4) 350 300 TSOP−5 (1 oz) 250 200 DFN6 3x3.3 (1 oz) 150 100 50 0 0 100 200 300 400 500 PCB COPPER AREA (mm2) 600 700 Figure 34. RthJA vs. PCB Copper Area Hints Vin and GND printed circuit board traces should be as wide as possible. When the impedance of these traces is high, there is a chance to pick up noise or cause the regulator to malfunction. Place external components, especially the output capacitor, as close as possible to the NCV8560, and make traces as short as possible. (eq. 3) Since TJ is not recommended to exceed 125°C (TJ(MAX)), then the NCV8560 in a DFN6 package can dissipate up to www.onsemi.com 12 NCV8560 DEVICE ORDERING INFORMATION Device* Marking Code Version NCV8560MNADJR2G 1st Line: V8560 2nd Line: ADJ ADJ NCV8560MN150R2G 1st Line: V8560 2nd Line: 150 1.5 V NCV8560MN180R2G 1st Line: V8560 2nd Line: 180 1.8 V NCV8560MN250R2G 1st Line: V8560 2nd Line: 250 2.5 V NCV8560MN280R2G 1st Line: V8560 2nd Line: 280 2.8 V NCV8560MN300R2G 1st Line: V8560 2nd Line: 300 3.0 V NCV8560MN330R2G 1st Line: V8560 2nd Line: 330 3.3 V NCV8560MN350R2G 1st Line: V8560 2nd Line: 350 3.5 V NCV8560MN500R2G 1st Line: V8560 2nd Line: 500 5.0 V NCV8560MN130R2G 1st Line: AQ(M) 1.3 V NCV8560SNADJT1G LJ9 ADJ NCV8560SN130T1G LJ2 1.3 V NCV8560SN150T1G AAJ 1.5 V NCV8560SN180T1G LJ3 1.8 V NCV8560SN250T1G AAQ 2.5 V NCV8560SN280T1G AAR 2.8 V NCV8560SN300T1G LJ4 3.0 V NCV8560SN330T1G LJ5 3.3 V NCV8560SN350T1G LJ7 3.5 V NCV8560SN500T1G LJ8 5.0 V Package Shipping† DFN6 (3x3) (Pb−Free) 3000/Tape & Reel DFN6 (2x2.2) (Pb−Free) 3000/Tape & Reel TSOP−5 (Pb−Free) 3000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable www.onsemi.com 13 NCV8560 PACKAGE DIMENSIONS DFN6, 2x2.2, 0.65P CASE 506BA−01 ISSUE A A B D NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 mm FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. L L L1 ÉÉÉ ÉÉÉ PIN ONE REFERENCE 2X 0.10 C DETAIL A E ALTERNATE TERMINAL CONSTRUCTIONS ÉÉ ÉÉ EXPOSED Cu TOP VIEW 2X 0.10 C A 0.10 C ÉÉ ÇÇ ÇÇ A3 MOLD CMPD A1 DETAIL B DETAIL B DIM A A1 b D D2 E E2 e K L L1 ALTERNATE CONSTRUCTIONS MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.20 0.30 2.00 BSC 1.10 1.30 2.20 BSC 0.70 0.90 0.65 BSC 0.20 −−− 0.25 0.35 0.00 0.10 7X 0.08 C SOLDERING FOOTPRINT* SIDE VIEW C A1 SEATING PLANE 1.36 PACKAGE OUTLINE D2 6X 0.58 DETAIL A 6X L e 6X 3 1 L1 2.50 0.96 E2 1 K 6 4 BOTTOM VIEW 6X b 6X 0.35 0.10 C A B 0.05 C 0.65 PITCH DIMENSIONS: MILLIMETERS NOTE 3 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 14 NCV8560 PACKAGE DIMENSIONS DFN6 3x3 CASE 488AE ISSUE B EDGE OF PACKAGE A D B L1 E PIN ONE REFERENCE NOTES: 1. DIMENSIONS AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. 5. TERMINAL b MAY HAVE MOLD COMPOUND MATERIAL ALONG SIDE EDGE. MOLD FLASHING MAY NOT EXCEED 30 MICRONS ONTO BOTTOM SURFACE OF TERMINAL b. ÇÇÇ ÇÇÇ ÇÇÇ DETAIL A BOTTOM VIEW 0.15 C 2X EXPOSED Cu 0.15 C 2X MOLD COMPOUND TOP VIEW DETAIL B 0.10 C 6X 0.08 C A1 SEATING PLANE ÇÇÇ ÇÇÇ A A1 ÇÇÇÇ ÇÇÇÇ ÇÇÇÇ DETAIL B SIDE VIEW (A3) C SIDE VIEW D2 ÇÇÇ ÇÇÇ 1 6X L 6X K ÇÇÇ ÇÇÇ 6 3 e DETAIL A E2 4 BOTTOM VIEW 6X b NOTE 3 0.10 C A B 0.05 C www.onsemi.com 15 (A3) DIM A A1 A3 b D D2 E E2 e K L L1 MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.20 0.25 0.18 0.30 3.00 BSC 2.25 2.55 3.00 BSC 1.55 1.85 0.65 BSC 0.20 −−− 0.30 0.50 0.00 0.021 NCV8560 PACKAGE DIMENSIONS TSOP−5 CASE 483−02 ISSUE K NOTE 5 2X NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSION A. 5. OPTIONAL CONSTRUCTION: AN ADDITIONAL TRIMMED LEAD IS ALLOWED IN THIS LOCATION. TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2 FROM BODY. D 5X 0.20 C A B 0.10 T M 2X 0.20 T B 5 1 4 2 S 3 K B DETAIL Z G A A TOP VIEW DIM A B C D G H J K M S DETAIL Z J C 0.05 H SIDE VIEW C SEATING PLANE END VIEW MILLIMETERS MIN MAX 3.00 BSC 1.50 BSC 0.90 1.10 0.25 0.50 0.95 BSC 0.01 0.10 0.10 0.26 0.20 0.60 0_ 10 _ 2.50 3.00 SOLDERING FOOTPRINT* 0.95 0.037 1.9 0.074 2.4 0.094 1.0 0.039 0.7 0.028 SCALE 10:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 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