NLU3G14 Triple Schmitt-Trigger Inverter The NLU3G14 MiniGatet is an advanced high−speed CMOS triple Schmitt−trigger inverter in ultra−small footprint. The NLU3G14 input and output structures provide protection when voltages up to 7.0 V are applied, regardless of the supply voltage. The NLU3G14 can be used to enhance noise immunity or to square up slowly changing waveforms. www.onsemi.com MARKING DIAGRAMS Features • • • • • • • 8 High Speed: tPD = 4.0 ns (Typ) @ VCC = 5.0 V Low Power Dissipation: ICC = 1 mA (Max) at TA = 25°C Power Down Protection Provided on inputs Balanced Propagation Delays Overvoltage Tolerant (OVT) Input and Output Pins Ultra−Small Packages These are Pb−Free Devices 1 IN A1 8 UDFN8 1.45 x 1.0 CASE 517BZ 1 UDFN8 1.6 x 1.0 CASE 517BY 1 XM XM VCC OUT Y3 2 7 OUT Y1 IN A2 3 6 IN A3 4 5 GND 1 UXM G UDFN8 CASE 517AJ UDFN8 1.95 x 1.0 CASE 517CA XM 1 UX, A or LA = Specific Device Code M = Date Code G = Pb−Free Package OUT Y2 ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. Figure 1. Pinout (Top View) IN A1 1 OUT Y2 IN A2 1 OUT Y2 IN A3 1 OUT Y3 Figure 2. Logic Symbol FUNCTION TABLE PIN ASSIGNMENT 1 IN A1 2 OUT Y3 3 IN A2 4 GND 5 OUT Y2 A Y 6 IN A3 L H H L 7 OUT Y1 8 VCC © Semiconductor Components Industries, LLC, 2016 July, 2016 − Rev. 4 1 Publication Order Number: NLU3G14/D NLU3G14 MAXIMUM RATINGS Symbol Value Unit VCC DC Supply Voltage −0.5 to +7.0 V VIN DC Input Voltage −0.5 to +7.0 V DC Output Voltage −0.5 to +7.0 V VIN < GND −20 mA VOUT < GND ±20 mA VOUT Parameter IIK DC Input Diode Current IOK DC Output Diode Current IO DC Output Source/Sink Current ±12.5 mA ICC DC Supply Current Per Supply Pin ±25 mA IGND DC Ground Current per Ground Pin ±25 mA TSTG Storage Temperature Range −65 to +150 °C TL Lead Temperature, 1 mm from Case for 10 Seconds 260 °C TJ Junction Temperature Under Bias 150 °C MSL FR VESD ILATCHUP Moisture Sensitivity Level 1 Flammability Rating Oxygen Index: 28 to 34 ESD Withstand Voltage Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) Latchup Performance Above VCC and Below GND at 125°C (Note 5) UL 94 V−0 @ 0.125 in > 2000 > 200 N/A V ±500 mA Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow. 2. Tested to EIA / JESD22−A114−A. 3. Tested to EIA / JESD22−A115−A. 4. Tested to JESD22−C101−A. 5. Tested to EIA / JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit 1.65 5.5 V VCC Positive DC Supply Voltage VIN Digital Input Voltage 0 5.5 V Output Voltage 0 5.5 V −55 +125 °C 0 0 No Limit No Limit ns/V VOUT TA Operating Free−Air Temperature Dt/DV Input Transition Rise or Fall Rate VCC = 3.3 V ± 0.3 V VCC = 5.0 V ± 0.5 V www.onsemi.com 2 NLU3G14 DC ELECTRICAL CHARACTERISTICS Symbol Parameter Conditions TA = 25 5C TA = +855C VCC (V) Min Typ Max Min VT+ Positive Threshold Voltage 3.0 4.5 5.5 1.85 2.86 3.50 2.0 3.0 3.6 2.2 3.15 3.85 VT− Negative Threshold Voltage 3.0 4.5 5.5 0.9 1.35 1.65 1.5 2.3 2.9 1.65 2.46 3.05 0.9 1.35 1.65 VH Hysteresis Voltage 3.0 4.5 5.5 0.30 0.40 0.50 0.57 0.67 0.74 1.20 1.40 1.60 0.30 0.40 0.50 VOH Minimum High−Level Output Voltage 2.0 3.0 4.5 1.9 2.9 4.4 2.0 3.0 4.5 3.0 4.5 2.58 3.94 VOL Maximum Low−Level Output Voltage VIN v VT−MIN IOH = −50 mA VIN v VT−MIN IOH = −4 mA IOH = −8 mA VIN w VT+MAX IOL = 50 mA VIN w VT+MAX IOL = 4 mA IOL = 8 mA 2.0 3.0 4.5 0 0 0 Max TA = −555C to +1255C Min 2.2 3.15 3.85 Max Unit 2.2 3.15 3.85 V 0.9 1.35 1.65 1.20 1.40 1.60 0.30 0.40 0.50 1.9 2.9 4.4 1.9 2.9 4.4 2.48 3.80 2.34 3.66 V 1.20 1.40 1.60 V V 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 3.0 4.5 0.36 0.36 0.44 0.44 0.52 0.52 V IIN Input Leakage Current 0 v VIN v 5.5 V 0 to 5.5 ±0.1 ±1.0 ±1.0 mA ICC Quiescent Supply Current 0 v VIN v VCC 5.5 1.0 10 40 mA AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns) Symbol tPLH, tPHL Parameter Propagation Delay, Input A to Output Y CIN Input Capacitance CPD Power Dissipation Capacitance (Note 6) VCC (V) Test Condition TA = 25 5C Min TA = +855C Typ Max Min TA = −555C to +1255C Max Min Max Unit ns 3.0 to 3.6 CL = 15 pF 7.0 12.8 1.0 15 1.0 17 CL = 50 pF 8.5 16.3 1.0 18.5 1.0 20.5 4.5 to 5.5 CL = 15 pF 4.0 8.6 1.0 10 1.0 11.5 CL = 50 pF 5.5 10.6 1.0 12 1.0 13.5 5.0 10 5.0 7.0 10 10 pF pF 6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the dynamic operating current consumption without load. Average operating current can be obtained by the equation ICC(OPR) = CPD • VCC • fin + ICC. CPD is used to determine the no−load dynamic power consumption: PD = CPD • VCC2 • fin + ICC • VCC. www.onsemi.com 3 NLU3G14 OUTPUT INPUT VCC A or B 50% CL* GND tPLH Y tPHL 50% VCC *Includes all probe and jig capacitance. A 1−MHz square input wave is recommended for propagation delay tests. Figure 3. Switching Waveforms Figure 4. Test Circuit VH VCC VT+ VT− VIN VCC VH VT+ VT− VIN GND GND VOH VOH VOUT Vout VOL VOL (a) A Schmitt−Trigger Squares Up Inputs With Slow Rise and Fall Times (b) A Schmitt−Trigger Offers Maximum Noise Immunity Figure 5. Typical Schmitt−Trigger Applications ORDERING INFORMATION Package Shipping† UDFN8 (Pb−Free) 3000 / Tape & Reel NLU3G14DMUTCG UDFN8, 1.95 x 1.0, 0.5P (Pb−Free) 3000 / Tape & Reel NLU3G14EMUTCG UDFN8, 1.6 x 1.0, 0.4P (Pb−Free) 3000 / Tape & Reel NLU3G14FMUTCG UDFN8, 1.45 x 1.0, 0.35P (Pb−Free) 3000 / Tape & Reel Device NLU3G14MUTAG †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 4 NLU3G14 PACKAGE DIMENSIONS UDFN8 1.6x1.0, 0.4P CASE 517BY ISSUE O PIN ONE REFERENCE 0.10 C 2X 2X ÉÉÉ ÉÉÉ ÉÉÉ 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 MM FROM TERMINAL TIP. 4. PACKAGE DIMENSIONS EXCLUSIVE OF BURRS AND MOLD FLASH. A B D E DIM A A1 A3 b D E e L L1 TOP VIEW A3 0.05 C A 0.05 C A1 SIDE VIEW C RECOMMENDED SOLDERING FOOTPRINT* SEATING PLANE 7X e/2 0.49 e 1 7X MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.15 0.25 1.60 BSC 1.00 BSC 0.40 BSC 0.25 0.35 0.30 0.40 L 8X 0.26 4 L1 1.24 8 5 BOTTOM VIEW 8X b 0.10 M C A B 0.05 M C 0.53 1 PKG OUTLINE 0.40 PITCH DIMENSIONS: MILLIMETERS NOTE 3 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 5 NLU3G14 PACKAGE DIMENSIONS UDFN8 1.45x1.0, 0.35P CASE 517BZ ISSUE O PIN ONE REFERENCE 0.10 C 2X 2X 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 MM FROM TERMINAL TIP. 4. PACKAGE DIMENSIONS EXCLUSIVE OF BURRS AND MOLD FLASH. A B D ÉÉ ÉÉ ÉÉ E DIM A A1 A3 b D E e L L1 TOP VIEW A3 0.05 C A 0.05 C A1 SIDE VIEW C RECOMMENDED SOLDERING FOOTPRINT* SEATING PLANE 7X 0.48 e/2 e 1 7X MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.15 0.25 1.45 BSC 1.00 BSC 0.35 BSC 0.25 0.35 0.30 0.40 8X 0.22 L 4 L1 1.18 8 5 BOTTOM VIEW 8X 0.53 b 0.10 M C A B 0.05 M C 1 PKG OUTLINE NOTE 3 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 6 0.35 PITCH NLU3G14 PACKAGE DIMENSIONS UDFN8 1.95x1.0, 0.5P CASE 517CA ISSUE O PIN ONE REFERENCE 0.10 C 2X 2X ÉÉÉ ÉÉÉ ÉÉÉ 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 MM FROM TERMINAL TIP. 4. PACKAGE DIMENSIONS EXCLUSIVE OF BURRS AND MOLD FLASH. A B D E DIM A A1 A3 b D E e L L1 TOP VIEW A3 0.05 C A 0.05 C A1 SIDE VIEW C RECOMMENDED SOLDERING FOOTPRINT* SEATING PLANE 7X e/2 0.49 e 7X MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.15 0.25 1.95 BSC 1.00 BSC 0.50 BSC 0.25 0.35 0.30 0.40 L 8X 0.30 4 1 L1 1.24 8 5 BOTTOM VIEW 8X b 0.10 M C A B 0.05 M C 0.54 NOTE 3 0.50 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 7 1 PKG OUTLINE NLU3G14 PACKAGE DIMENSIONS UDFN8 1.8x1.2, 0.4P CASE 517AJ ISSUE O PIN ONE REFERENCE NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM TERMINAL TIP. 4. MOLD FLASH ALLOWED ON TERMINALS ALONG EDGE OF PACKAGE. FLASH MAY NOT EXCEED 0.03 ONTO BOTTOM SURFACE OF TERMINALS. 5. DETAIL A SHOWS OPTIONAL CONSTRUCTION FOR TERMINALS. A B D 0.10 C ÉÉ ÉÉ L1 E DETAIL A NOTE 5 0.10 C TOP VIEW (A3) 0.05 C DIM A A1 A3 b b2 D E e L L1 L2 A 0.05 C SIDE VIEW A1 e/2 e (b2) C DETAIL A 8X 1 SEATING PLANE L 4 MOUNTING FOOTPRINT SOLDERMASK DEFINED (L2) 8 5 MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.127 REF 0.15 0.25 0.30 REF 1.80 BSC 1.20 BSC 0.40 BSC 0.45 0.55 0.00 0.03 0.40 REF 8X b BOTTOM VIEW 8X 0.10 M C A B 0.05 M C 0.66 7X 0.22 NOTE 3 1.50 1 0.32 0.40 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. MiniGate is a trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. 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