NXP NZX13C Single zener diode Datasheet

NZX series
Single Zener diodes
Rev. 02 — 3 June 2009
Product data sheet
1. Product profile
1.1 General description
General-purpose Zener diodes in a SOD27 (SC-40) small hermetically sealed glass
package.
1.2 Features
n
n
n
n
Total power dissipation: Ptot ≤ 500 mW
Low differential resistance
Low leakage current
AEC-Q101 qualified
1.3 Applications
n General regulation functions
1.4 Quick reference data
Table 1.
Quick reference data
Tj = 25 °C unless otherwise specified.
Symbol
forward voltage
VF
[1]
Parameter
Conditions
IF = 200 mA
[1]
Min
Typ
Max
Unit
-
-
1.5
V
Pulse test: tp ≤ 300 µs; δ ≤ 0.02.
2. Pinning information
Table 2.
Pinning
Pin
Description
1
cathode
2
anode
Simplified outline
Graphic symbol
[1]
k
a
1
2
006aaa152
[1]
The marking band indicates the cathode.
NZX series
NXP Semiconductors
Single Zener diodes
3. Ordering information
Table 3.
Ordering information
Type number
NZX2V4A to
[1]
NZX36X[1]
Package
Name
Description
Version
SC-40
hermetically sealed glass package; axial leaded;
2 leads
SOD27
The series consists of 111 types with nominal working voltages from 2.4 V to 36 V.
4. Marking
Table 4.
Marking codes
Type number
Marking code
NZX2V4A to NZX36X
the diodes are type branded
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
IF
forward current
Ptot
total power dissipation
Ttp ≤ 25 °C
Min
Max
Unit
-
250
mA
-
500
mW
Tj
junction temperature
-
175
°C
Tamb
ambient temperature
−55
+175
°C
Tstg
storage temperature
−65
+175
°C
6. Thermal characteristics
Table 6.
Symbol
Thermal characteristics
Parameter
Conditions
Rth(j-a)
thermal resistance from junction to
ambient
Rth(j-t)
thermal resistance from junction to
tie-point
[1]
Typ
Max Unit
-
-
380
K/W
[1]
-
-
300
K/W
Device mounted on an FR4 Printed-Circuit Board (PCB) without metallization pad;
maximum lead length 8 mm.
NZX_SER_2
Product data sheet
in free air
Min
[1]
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 3 June 2009
2 of 12
NZX series
NXP Semiconductors
Single Zener diodes
006aab601
103
δ=1
0.75
0.50
0.33
0.20
0.10
Rth(j-a)
(K/W)
102
0.05
0.02
0.01
10
≤0.001
1
10−1
1
102
10
103
104
105
tp (ms)
Fig 1.
Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
7. Characteristics
Table 7.
Characteristics
Tj = 25 °C unless otherwise specified.
Symbol
Conditions
forward voltage
VF
[1]
Parameter
[1]
IF = 200 mA
Min
Typ
Max
Unit
-
-
1.5
V
Pulse test: tp ≤ 300 µs; δ ≤ 0.02.
Table 8.
Characteristics per type; NZX2V4A to NZX18C
Tj = 25 °C unless otherwise specified.
NZXxxx
Sel
Working voltage
VZ (V)
Differential
resistance
Reverse current
IR (µA)
rdif (Ω)
IZ = 5 mA
2V4
2V7
3V0
3V3
IZ = 5 mA
Min
Max
Max
Max
VR (V)
A
2.3
2.5
100
50
1
B
2.4
2.6
A
2.5
2.7
100
20
1
B
2.6
2.8
C
2.7
2.9
A
2.8
3.0
100
10
1
B
2.9
3.1
C
3.0
3.2
A
3.1
3.3
100
5
1
B
3.2
3.4
C
3.3
3.5
NZX_SER_2
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 3 June 2009
3 of 12
NZX series
NXP Semiconductors
Single Zener diodes
Table 8.
Characteristics per type; NZX2V4A to NZX18C …continued
Tj = 25 °C unless otherwise specified.
NZXxxx
Sel
Working voltage
VZ (V)
Differential
resistance
Reverse current
IR (µA)
rdif (Ω)
IZ = 5 mA
3V6
3V9
4V3
4V7
5V1
5V6
6V2
6V8
IZ = 5 mA
Min
Max
Max
Max
VR (V)
A
3.4
3.6
100
5
1
B
3.5
3.7
C
3.6
3.8
A
3.7
3.9
100
3
1
B
3.8
4.0
C
3.9
4.1
A
4.0
4.2
100
3
1
B
4.1
4.3
C
4.2
4.4
D
4.3
4.5
A
4.4
4.6
100
3
2
B
4.5
4.7
C
4.6
4.8
D
4.7
4.9
A
4.8
5.0
100
2
2
B
4.9
5.1
C
5.0
5.2
D
5.1
5.3
A
5.2
5.5
40
1
2
B
5.3
5.6
C
5.4
5.7
D
5.5
5.8
E
5.6
5.9
A
5.7
6.0
15
3
4
B
5.8
6.1
C
6.0
6.3
D
6.1
6.4
E
6.3
6.6
A
6.4
6.7
15
2
4
B
6.6
6.9
C
6.7
7.0
D
6.9
7.2
NZX_SER_2
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 3 June 2009
4 of 12
NZX series
NXP Semiconductors
Single Zener diodes
Table 8.
Characteristics per type; NZX2V4A to NZX18C …continued
Tj = 25 °C unless otherwise specified.
NZXxxx
Sel
Working voltage
VZ (V)
Differential
resistance
Reverse current
IR (µA)
rdif (Ω)
IZ = 5 mA
7V5
8V2
9V1
10
11
12
13
14
IZ = 5 mA
Min
Max
Max
Max
VR (V)
A
7.0
7.3
15
1
5
B
7.2
7.6
C
7.3
7.7
D
7.5
7.9
X
7.07
7.45
20
0.7
5
20
0.5
6
25
0.2
7
25
0.1
8
35
0.1
8
35
0.1
8
35
0.05
9.8
A
7.7
8.1
B
7.9
8.3
C
8.1
8.5
D
8.3
8.7
A
8.5
8.9
B
8.7
9.1
C
8.9
9.3
D
9.1
9.5
E
9.3
9.7
A
9.5
9.9
B
9.7
10.1
C
9.9
10.3
D
10.2
10.6
A
10.4
10.8
B
10.7
11.1
C
10.9
11.3
D
11.1
11.6
A
11.4
11.9
B
11.6
12.1
C
11.9
12.4
D
12.2
12.7
X
11.44
12.03
A
12.4
12.9
B
12.6
13.1
C
12.9
13.4
A
13.2
13.7
B
13.5
14.0
C
13.8
14.3
NZX_SER_2
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 3 June 2009
5 of 12
NZX series
NXP Semiconductors
Single Zener diodes
Table 8.
Characteristics per type; NZX2V4A to NZX18C …continued
Tj = 25 °C unless otherwise specified.
NZXxxx
Sel
Working voltage
VZ (V)
Differential
resistance
Reverse current
IR (µA)
rdif (Ω)
IZ = 5 mA
15
16
18
IZ = 5 mA
Min
Max
Max
Max
VR (V)
A
14.1
14.7
40
0.05
10.5
B
14.5
15.1
C
14.9
15.5
X
14.35
15.09
A
15.3
15.9
45
0.05
11.2
B
15.7
16.5
C
16.3
17.1
A
16.9
17.7
55
0.05
12.6
B
17.5
18.3
C
18.1
19.0
NZX_SER_2
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 3 June 2009
6 of 12
NZX series
NXP Semiconductors
Single Zener diodes
Table 9.
Characteristics per type; NZX20A to NZX36X
Tj = 25 °C unless otherwise specified.
NZXxxx
Sel
Working voltage
VZ (V)
Differential
resistance
Reverse current
IR (µA)
rdif (Ω)
IZ = 2 mA
20
22
24
27
30
33
36
IZ = 2 mA
Min
Max
Max
Max
VR (V)
A
18.8
19.7
60
0.05
14
B
19.5
20.4
C
20.2
21.2
65
0.05
15.4
70
0.05
16.8
80
0.05
18.9
100
0.05
21
120
0.05
23.1
140
0.05
25.2
A
20.9
21.9
B
21.6
22.6
C
22.3
23.3
A
22.9
24.0
B
23.6
24.7
C
24.3
25.5
X
22.61
23.77
A
25.2
26.6
B
26.2
27.6
C
27.2
28.6
X
26.99
28.39
A
28.2
29.6
B
29.2
30.6
C
30.2
31.6
X
29.02
30.51
A
31.2
32.6
B
32.2
33.6
C
33.2
34.5
A
34.2
35.7
B
35.3
36.8
C
36.4
38.0
X
35.36
37.19
NZX_SER_2
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 3 June 2009
7 of 12
NZX series
NXP Semiconductors
Single Zener diodes
mbg781
300
mbg783
0
SZ
(mV/K)
IF
(mA)
4V3
−1
200
3V9
3V6
−2
100
3V3
3V0
2V4
2V7
0
0.6
−3
0.8
1
0
20
VF (V)
Tj = 25 °C
40
IZ (mA)
60
NZX2V4 to NZX4V3
Tj = 25 °C to 150 °C
Fig 2.
Forward current as a function of forward
voltage; typical values
Fig 3.
Temperature coefficient as a function of
working current; typical values
mbg782
10
12
SZ
(mV/K)
11
10
9V1
5
8V2
7V5
6V8
6V2
5V6
5V1
0
4V7
−5
0
4
8
12
16
IZ (mA)
20
NZX4V7 to NZX12
Tj = 25 °C to 150 °C
Fig 4.
Temperature coefficient as a function of working current; typical values
NZX_SER_2
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 3 June 2009
8 of 12
NZX series
NXP Semiconductors
Single Zener diodes
8. Package outline
0.56
max
25.4
min
4.25
max
Dimensions in mm
Fig 5.
1.85
max
25.4
min
05-12-22
Package outline SOD27 (SC-40)
9. Packing information
Table 10. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number[2]
Package
NZX2V4A to NZX36X SOD27
Description
26 mm tape ammopack, axial
5000
10000
-143
-
52 mm tape ammopack, axial
-
-133
52 mm reel pack, axial
-
-113
[1]
For further information and the availability of packing methods, see Section 12.
[2]
The series consists of 111 types with nominal working voltages from 2.4 V to 36 V.
NZX_SER_2
Product data sheet
Packing quantity
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 3 June 2009
9 of 12
NZX series
NXP Semiconductors
Single Zener diodes
10. Revision history
Table 11.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
NZX_SER_2
20090603
Product data sheet
-
NZX_SER_1
-
-
Modifications:
NZX_SER_1
•
•
•
•
42 type numbers added
Section 1.1 “General description”: amended
Figure 1: updated
Table 5: Ptot condition amended
20080724
Product data sheet
NZX_SER_2
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 3 June 2009
10 of 12
NZX series
NXP Semiconductors
Single Zener diodes
11. Legal information
11.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
11.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
11.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
11.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
12. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
NZX_SER_2
Product data sheet
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Rev. 02 — 3 June 2009
11 of 12
NZX series
NXP Semiconductors
Single Zener diodes
13. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
9
10
11
11.1
11.2
11.3
11.4
12
13
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Thermal characteristics. . . . . . . . . . . . . . . . . . . 2
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
Packing information. . . . . . . . . . . . . . . . . . . . . . 9
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10
Legal information. . . . . . . . . . . . . . . . . . . . . . . 11
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Contact information. . . . . . . . . . . . . . . . . . . . . 11
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 3 June 2009
Document identifier: NZX_SER_2
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