NZX series Single Zener diodes Rev. 02 — 3 June 2009 Product data sheet 1. Product profile 1.1 General description General-purpose Zener diodes in a SOD27 (SC-40) small hermetically sealed glass package. 1.2 Features n n n n Total power dissipation: Ptot ≤ 500 mW Low differential resistance Low leakage current AEC-Q101 qualified 1.3 Applications n General regulation functions 1.4 Quick reference data Table 1. Quick reference data Tj = 25 °C unless otherwise specified. Symbol forward voltage VF [1] Parameter Conditions IF = 200 mA [1] Min Typ Max Unit - - 1.5 V Pulse test: tp ≤ 300 µs; δ ≤ 0.02. 2. Pinning information Table 2. Pinning Pin Description 1 cathode 2 anode Simplified outline Graphic symbol [1] k a 1 2 006aaa152 [1] The marking band indicates the cathode. NZX series NXP Semiconductors Single Zener diodes 3. Ordering information Table 3. Ordering information Type number NZX2V4A to [1] NZX36X[1] Package Name Description Version SC-40 hermetically sealed glass package; axial leaded; 2 leads SOD27 The series consists of 111 types with nominal working voltages from 2.4 V to 36 V. 4. Marking Table 4. Marking codes Type number Marking code NZX2V4A to NZX36X the diodes are type branded 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions IF forward current Ptot total power dissipation Ttp ≤ 25 °C Min Max Unit - 250 mA - 500 mW Tj junction temperature - 175 °C Tamb ambient temperature −55 +175 °C Tstg storage temperature −65 +175 °C 6. Thermal characteristics Table 6. Symbol Thermal characteristics Parameter Conditions Rth(j-a) thermal resistance from junction to ambient Rth(j-t) thermal resistance from junction to tie-point [1] Typ Max Unit - - 380 K/W [1] - - 300 K/W Device mounted on an FR4 Printed-Circuit Board (PCB) without metallization pad; maximum lead length 8 mm. NZX_SER_2 Product data sheet in free air Min [1] © NXP B.V. 2009. All rights reserved. Rev. 02 — 3 June 2009 2 of 12 NZX series NXP Semiconductors Single Zener diodes 006aab601 103 δ=1 0.75 0.50 0.33 0.20 0.10 Rth(j-a) (K/W) 102 0.05 0.02 0.01 10 ≤0.001 1 10−1 1 102 10 103 104 105 tp (ms) Fig 1. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values 7. Characteristics Table 7. Characteristics Tj = 25 °C unless otherwise specified. Symbol Conditions forward voltage VF [1] Parameter [1] IF = 200 mA Min Typ Max Unit - - 1.5 V Pulse test: tp ≤ 300 µs; δ ≤ 0.02. Table 8. Characteristics per type; NZX2V4A to NZX18C Tj = 25 °C unless otherwise specified. NZXxxx Sel Working voltage VZ (V) Differential resistance Reverse current IR (µA) rdif (Ω) IZ = 5 mA 2V4 2V7 3V0 3V3 IZ = 5 mA Min Max Max Max VR (V) A 2.3 2.5 100 50 1 B 2.4 2.6 A 2.5 2.7 100 20 1 B 2.6 2.8 C 2.7 2.9 A 2.8 3.0 100 10 1 B 2.9 3.1 C 3.0 3.2 A 3.1 3.3 100 5 1 B 3.2 3.4 C 3.3 3.5 NZX_SER_2 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 02 — 3 June 2009 3 of 12 NZX series NXP Semiconductors Single Zener diodes Table 8. Characteristics per type; NZX2V4A to NZX18C …continued Tj = 25 °C unless otherwise specified. NZXxxx Sel Working voltage VZ (V) Differential resistance Reverse current IR (µA) rdif (Ω) IZ = 5 mA 3V6 3V9 4V3 4V7 5V1 5V6 6V2 6V8 IZ = 5 mA Min Max Max Max VR (V) A 3.4 3.6 100 5 1 B 3.5 3.7 C 3.6 3.8 A 3.7 3.9 100 3 1 B 3.8 4.0 C 3.9 4.1 A 4.0 4.2 100 3 1 B 4.1 4.3 C 4.2 4.4 D 4.3 4.5 A 4.4 4.6 100 3 2 B 4.5 4.7 C 4.6 4.8 D 4.7 4.9 A 4.8 5.0 100 2 2 B 4.9 5.1 C 5.0 5.2 D 5.1 5.3 A 5.2 5.5 40 1 2 B 5.3 5.6 C 5.4 5.7 D 5.5 5.8 E 5.6 5.9 A 5.7 6.0 15 3 4 B 5.8 6.1 C 6.0 6.3 D 6.1 6.4 E 6.3 6.6 A 6.4 6.7 15 2 4 B 6.6 6.9 C 6.7 7.0 D 6.9 7.2 NZX_SER_2 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 02 — 3 June 2009 4 of 12 NZX series NXP Semiconductors Single Zener diodes Table 8. Characteristics per type; NZX2V4A to NZX18C …continued Tj = 25 °C unless otherwise specified. NZXxxx Sel Working voltage VZ (V) Differential resistance Reverse current IR (µA) rdif (Ω) IZ = 5 mA 7V5 8V2 9V1 10 11 12 13 14 IZ = 5 mA Min Max Max Max VR (V) A 7.0 7.3 15 1 5 B 7.2 7.6 C 7.3 7.7 D 7.5 7.9 X 7.07 7.45 20 0.7 5 20 0.5 6 25 0.2 7 25 0.1 8 35 0.1 8 35 0.1 8 35 0.05 9.8 A 7.7 8.1 B 7.9 8.3 C 8.1 8.5 D 8.3 8.7 A 8.5 8.9 B 8.7 9.1 C 8.9 9.3 D 9.1 9.5 E 9.3 9.7 A 9.5 9.9 B 9.7 10.1 C 9.9 10.3 D 10.2 10.6 A 10.4 10.8 B 10.7 11.1 C 10.9 11.3 D 11.1 11.6 A 11.4 11.9 B 11.6 12.1 C 11.9 12.4 D 12.2 12.7 X 11.44 12.03 A 12.4 12.9 B 12.6 13.1 C 12.9 13.4 A 13.2 13.7 B 13.5 14.0 C 13.8 14.3 NZX_SER_2 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 02 — 3 June 2009 5 of 12 NZX series NXP Semiconductors Single Zener diodes Table 8. Characteristics per type; NZX2V4A to NZX18C …continued Tj = 25 °C unless otherwise specified. NZXxxx Sel Working voltage VZ (V) Differential resistance Reverse current IR (µA) rdif (Ω) IZ = 5 mA 15 16 18 IZ = 5 mA Min Max Max Max VR (V) A 14.1 14.7 40 0.05 10.5 B 14.5 15.1 C 14.9 15.5 X 14.35 15.09 A 15.3 15.9 45 0.05 11.2 B 15.7 16.5 C 16.3 17.1 A 16.9 17.7 55 0.05 12.6 B 17.5 18.3 C 18.1 19.0 NZX_SER_2 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 02 — 3 June 2009 6 of 12 NZX series NXP Semiconductors Single Zener diodes Table 9. Characteristics per type; NZX20A to NZX36X Tj = 25 °C unless otherwise specified. NZXxxx Sel Working voltage VZ (V) Differential resistance Reverse current IR (µA) rdif (Ω) IZ = 2 mA 20 22 24 27 30 33 36 IZ = 2 mA Min Max Max Max VR (V) A 18.8 19.7 60 0.05 14 B 19.5 20.4 C 20.2 21.2 65 0.05 15.4 70 0.05 16.8 80 0.05 18.9 100 0.05 21 120 0.05 23.1 140 0.05 25.2 A 20.9 21.9 B 21.6 22.6 C 22.3 23.3 A 22.9 24.0 B 23.6 24.7 C 24.3 25.5 X 22.61 23.77 A 25.2 26.6 B 26.2 27.6 C 27.2 28.6 X 26.99 28.39 A 28.2 29.6 B 29.2 30.6 C 30.2 31.6 X 29.02 30.51 A 31.2 32.6 B 32.2 33.6 C 33.2 34.5 A 34.2 35.7 B 35.3 36.8 C 36.4 38.0 X 35.36 37.19 NZX_SER_2 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 02 — 3 June 2009 7 of 12 NZX series NXP Semiconductors Single Zener diodes mbg781 300 mbg783 0 SZ (mV/K) IF (mA) 4V3 −1 200 3V9 3V6 −2 100 3V3 3V0 2V4 2V7 0 0.6 −3 0.8 1 0 20 VF (V) Tj = 25 °C 40 IZ (mA) 60 NZX2V4 to NZX4V3 Tj = 25 °C to 150 °C Fig 2. Forward current as a function of forward voltage; typical values Fig 3. Temperature coefficient as a function of working current; typical values mbg782 10 12 SZ (mV/K) 11 10 9V1 5 8V2 7V5 6V8 6V2 5V6 5V1 0 4V7 −5 0 4 8 12 16 IZ (mA) 20 NZX4V7 to NZX12 Tj = 25 °C to 150 °C Fig 4. Temperature coefficient as a function of working current; typical values NZX_SER_2 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 02 — 3 June 2009 8 of 12 NZX series NXP Semiconductors Single Zener diodes 8. Package outline 0.56 max 25.4 min 4.25 max Dimensions in mm Fig 5. 1.85 max 25.4 min 05-12-22 Package outline SOD27 (SC-40) 9. Packing information Table 10. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number[2] Package NZX2V4A to NZX36X SOD27 Description 26 mm tape ammopack, axial 5000 10000 -143 - 52 mm tape ammopack, axial - -133 52 mm reel pack, axial - -113 [1] For further information and the availability of packing methods, see Section 12. [2] The series consists of 111 types with nominal working voltages from 2.4 V to 36 V. NZX_SER_2 Product data sheet Packing quantity © NXP B.V. 2009. All rights reserved. Rev. 02 — 3 June 2009 9 of 12 NZX series NXP Semiconductors Single Zener diodes 10. Revision history Table 11. Revision history Document ID Release date Data sheet status Change notice Supersedes NZX_SER_2 20090603 Product data sheet - NZX_SER_1 - - Modifications: NZX_SER_1 • • • • 42 type numbers added Section 1.1 “General description”: amended Figure 1: updated Table 5: Ptot condition amended 20080724 Product data sheet NZX_SER_2 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 02 — 3 June 2009 10 of 12 NZX series NXP Semiconductors Single Zener diodes 11. Legal information 11.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 11.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 11.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 11.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 12. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] NZX_SER_2 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 02 — 3 June 2009 11 of 12 NZX series NXP Semiconductors Single Zener diodes 13. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 11.1 11.2 11.3 11.4 12 13 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Thermal characteristics. . . . . . . . . . . . . . . . . . . 2 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 Packing information. . . . . . . . . . . . . . . . . . . . . . 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10 Legal information. . . . . . . . . . . . . . . . . . . . . . . 11 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Contact information. . . . . . . . . . . . . . . . . . . . . 11 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 3 June 2009 Document identifier: NZX_SER_2