OPA137 OPA2137 OPA4137 ® OPA 413 7 OPA 137 OPA 413 7 OPA 213 7 LOW COST FET-INPUT OPERATIONAL AMPLIFIERS MicroAmplifier ™ Series FEATURES DESCRIPTION ● ● ● ● ● ● ● ● OPA137 series FET-input operational amplifiers are designed for low cost and miniature applications. In addition to small size (SOT-23-5 and MSOP-8 packages), they provide low input bias current (5pA), low quiescent currrent (220µA/ channel), and high open-loop gain (94dB). Either single (+4.5V to +36V) or dual (±2.25 to ±18V) supplies can be used. The input common-mode voltage range includes the positive supply—suitable for many single-supply applications. Single, dual, and quad versions have identical specifications for maximum design flexibility. OPA137 op amps are easy to use and free from phase inversion and overload problems found in some FET-input amplifiers. High performance, including linearity, is maintained as the amplifiers swing to their specified limits. In addition, the combination of high slew rate (3.5V/µs) and wide bandwidth (1MHz) provide fast settling time assuring good dynamic response. Dual and quad designs feature completely independent circuitry for lowest crosstalk and freedom from interaction. The single (OPA137) packages are the tiny 5-lead SOT-23-5 surface mount, SO-8 surface mount, and 8-pin DIP. The dual (OPA2137) comes in the miniature MSOP-8 surface mount, SO-8 surface mount, and 8-pin DIP packages. The quad (OPA4137) packages are the SO-14 surface mount and the 14-pin DIP. All are specified from –40°C to +85°C and operate from –55°C to +125°C. A SPICE macromodel is available for design analysis. FET INPUT: IB = 5pA LOW OFFSET VOLTAGE: 1.5mV WIDE SUPPLY RANGE: ±2.25V to ±18V LOW QUIESCENT CURRENT: 220µA/channel EXCELLENT SPEED/POWER: 1MHz INPUT TO POSITIVE SUPPLY MicroSIZE PACKAGES: SOT-23-5, MSOP-8 SINGLE, DUAL, AND QUAD APPLICATIONS ● STRAIN GAGE AMPLIFIER ● PHOTODETECTOR AMPLIFIER ● PRECISION INTEGRATOR ● BATTERY-POWERED INSTRUMENTS ● TEST EQUIPMENT ● ACTIVE FILTERS OPA137 NC 1 8 NC –In 2 7 V+ +In 3 6 Output V– 4 5 NC OPA4137 OPA2137 Out A 1 14 Out D –In A 2 13 –In D +In A 3 12 +In D V+ 4 11 V– +In B 5 10 +In C A OPA137 8-Pin DIP, SO-8 Out 1 5 V+ V– 2 +In 3 4 –In SOT-23-5 Out A 1 –In A 2 +In A 3 V– 4 A B 8 V+ 7 Out B 6 –In B 5 +In B 8-Pin DIP, SO-8, MSOP-8 D B C –In B 6 9 –In C Out B 7 8 Out C 14-Pin DIP SO-14 International Airport Industrial Park • Mailing Address: PO Box 11400, Tucson, AZ 85734 • Street Address: 6730 S. Tucson Blvd., Tucson, AZ 85706 • Tel: (520) 746-1111 • Twx: 910-952-1111 Internet: http://www.burr-brown.com/ • FAXLine: (800) 548-6133 (US/Canada Only) • Cable: BBRCORP • Telex: 066-6491 • FAX: (520) 889-1510 • Immediate Product Info: (800) 548-6132 © 1998 Burr-Brown Corporation SBOS089 PDS-1438A Printed in U.S.A. August, 1998 SPECIFICATIONS: VS = ±15V At TA = +25°C, RL = 10kΩ connected to ground, unless otherwise noted. Boldface limits apply over the specified temperature range, TA = –40°C to +85°C. OPA137N, U, P OPA2137E, U, P OPA4137U, P PARAMETER CONDITION OFFSET VOLTAGE Input Offset Voltage TA = –40°C to +85°C vs Temperature vs Power Supply TA = –40°C to +85°C Channel Separation (dual, quad) dVOS/dT PSRR TA = –40°C to +85°C VS = ±3V to ±18V dc 0.6 VCM = 0V IOS FREQUENCY RESPONSE Gain-Bandwidth Product Slew Rate Settling Time, 0.1% 0.01% Overload Recovery Time Total Harmonic Distortion + Noise OUTPUT Voltage Output TA = –40°C to +85°C Short-Circuit Current Capacitive Load Drive POWER SUPPLY Specified Operating Range Operating Voltage Range Dual Supplies Single Supply Quiescent Current TA = –40°C to +85°C TEMPERATURE RANGE Specified Range Operating Range Storage Range Thermal Resistance SOT-23-5 Surface Mount MSOP-8 Surface Mount SO-8 Surface Mount 8-Pin DIP SO-14 Surface Mount 14-Pin DIP ±3 (V–) + 3 TYP ±2.5 ±3.5 ✻ ✻ ±7 ±250 ±250 MAX UNITS ±10 mV mV µV/°C µV/V µV/V µV/V ±15 ✻ ✻ ✻ ✻ ✻ ✻ ✻ pA ✻ pA µVp-p nV/√Hz fA/√Hz ✻ ✻ ✻ (V+) ✻ ✻ V VCM = –12V to 15V 76 74 84 84 70 70 ✻ ✻ dB dB VCM = –12V to 15V 72 70 INPUT IMPEDANCE Differential Common-Mode OPEN-LOOP GAIN Open-Loop Voltage Gain TA = –40°C to +85°C MIN 2 45 1.2 en in VCM CMRR MAX ±5 ±100 See Typical Curve ±2 ±50 IB NOISE Input Voltage Noise, f = 0.1 to 10Hz Input Voltage Noise Density, f = 1kHz Current Noise Density, f = 1kHz TYP ±1.5 ±2.5 ±15 ±90 VOS INPUT BIAS CURRENT Input Bias Current vs Temperature Input Offset Current INPUT VOLTAGE RANGE Common-Mode Voltage Range Common-Mode Rejection Ratio OPA137, OPA2137 OPA4137 TA = –40°C to +85°C OPA137, OPA2137 OPA4137 MIN OPA137NA, UA, PA OPA2137EA, UA, PA OPA4137UA, PA 70 70 1010 || 1 1012 || 2 AOL GBW SR THD+N VO = –13.8V to 13.9V VO = –13.8V to 13.9V 86 86 1 3.5 8 10 1 0.05 G=1 G = 1, 10V Step, CL = 100pF G = 1, 10V Step, CL = 100pF VIN • G = VS G = 1, f = 1kHz, 3.5Vrms VOUT (V–) + 1.2 (V–) + 1.2 ISC CLOAD VS (V+) – 1.1 (V+) – 1.1 Ω || pF Ω || pF ✻ dB dB ✻ ✻ ✻ ✻ ✻ ✻ MHz V/µs µs µs µs % ✻ ✻ ✻ ✻ –25/+60 1000 ✻ ✻ ±15 ✻ V ±220 IO = 0 IO = 0 ✻ ✻ V V mA pF ±2.25(1) +4.5 IQ ✻ ✻ 94 dB dB –40 –55 –55 ±18 +36 ±270 ±375 ✻ ✻ +85 +125 +125 ✻ ✻ ✻ ✻ θJA 200 150 150 100 100 80 ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ V V µA µA ✻ ✻ ✻ °C °C °C °C/W °C/W °C/W °C/W °C/W °C/W ✻ Specifications the same as OPA137N, U, P. NOTE: (1) At minimum power supply voltage inputs must be biased above ground in accordance with common-mode voltage range restrictions—see “Operating Voltage” discussion. ® OPA137, 2137, 4137 2 ABSOLUTE MAXIMUM RATINGS(1) ELECTROSTATIC DISCHARGE SENSITIVITY Supply Voltage, V+ to V– ..................................................................... 36V Input Voltage ....................................................... (V–) –0.7V to (V+) +0.7V Input Current ....................................................................................... 2mA Output Short-Circuit(2) .............................................................. Continuous Operating Temperature .................................................. –55°C to +125°C Storage Temperature ...................................................... –55°C to +125°C Junction Temperature .................................................................... +150°C Lead Temperature (soldering, 10s) ................................................. 300°C This integrated circuit can be damaged by ESD. Burr-Brown recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. NOTE: (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum ratings for extended periods may affact device reliability. (2) Short circuit to ground, one amplifier per package. PACKAGE/ORDERING INFORMATION PRODUCT PACKAGE PACKAGE DRAWING NUMBER(1) SPECIFIED TEMPERATURE RANGE PACKAGE MARKING ORDERING NUMBER(2) TRANSPORT MEDIA Single OPA137N 5-Lead SOT-23-5 Surface Mount 331 –40°C to +85°C E37(3) " " " " " –40°C to +85°C E37(3) OPA137N/250 OPA137N/3K OPA137NA/250 OPA137NA/3K OPA137U OPA137U/2K5 OPA137UA OPA137UA/2K5 OPA137P OPA137PA Tape and Reel Tape and Reel Tape and Reel Tape and Reel Rails Tape and Reel Rails Tape and Reel Rails Rails OPA2137E/250 OPA2137E/2K5 OPA2137EA/250 OPA2137EA/2K5 OPA2137U OPA2137U/2K5 OPA2137UA OPA2137UA/2K5 OPA2137P OPA2137PA Tape and Reel Tape and Reel Tape and Reel Tape and Reel Rails Tape and Reel Rails Tape and Reel Rails Rails OPA4137U OPA4137U/2K5 OPA4137UA OPA4137UA/2K5 OPA4137P OPA4137PA Rails Tape and Reel Rails Tape and Reel Rails Rails OPA137NA 5-Lead SOT-23-5 Surface Mount 331 " " " " " OPA137U SO-8 Surface Mount 182 –40°C to +85°C OPA137U " " " " " OPA137UA SO-8 Surface Mount 182 –40°C to +85°C OPA137UA " " " " " OPA137P OPA137PA 8-Pin DIP 8-Pin DIP 006 006 –40°C to +85°C –40°C to +85°C OPA137P OPA137PA Dual OPA2137E MSOP-8 Surface Mount 337 –40°C to +85°C E37(3) " " " " " E37(3) OPA2137EA MSOP-8 Surface Mount 337 –40°C to +85°C " " " " " OPA2137U SO-8 Surface Mount 182 –40°C to +85°C OPA2137U " OPA2137UA " " " " " SO-8 Surface Mount 182 –40°C to +85°C OPA2137UA " " " " 8-Pin DIP 8-Pin DIP 006 006 –40°C to +85°C –40°C to +85°C OPA2137P OPA2137PA Quad OPA4137U SO-14 Surface Mount 235 –40°C to +85°C OPA4137U " " " " " SO-14 Surface Mount 235 –40°C to +85°C OPA4137UA " " " " 14-Pin DIP 14-Pin DIP 010 010 –40°C to +85°C –40°C to +85°C OPA4137P OPA4137PA OPA2137P OPA2137PA OPA4137UA " OPA4137P OPA4137PA NOTES: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix C of Burr-Brown IC Data Book. (2) Models with a slash (/) are available only in Tape and Reel in the quantities indicated (e.g., /2K5 indicates 2500 devices per reel). Ordering 3000 pieces of “OPA137NA/3K” will get a single 3000-piece Tape and Reel. For detailed Tape and Reel mechanical information, refer to Appendix B of Burr-Brown IC Data Book. (3) Grade information is marked on the reel. The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant any BURR-BROWN product for use in life support devices and/or systems. ® 3 OPA137, 2137, 4137 TYPICAL PERFORMANCE CURVES At TA = +25°C, VS = ±15V, RL = 10kΩ, connected to ground, unless otherwise noted. POWER SUPPLY AND COMMON-MODE REJECTION vs FREQUENCY OPEN-LOOP GAIN/PHASE vs FREQUENCY 100 100 80 0 –45 –40°C φ 40 –90 20 –135 +85°C 0 PSRR, CMRR (dB) Gain (dB) 60 80 Phase Shift (°) G CMRR 60 40 –PSRR 20 –180 +25°C +PSRR –20 0 1 10 100 1k 10k 100k 1M 10 10M 100 1k Frequency (Hz) 10k 100k 1M Frequency (Hz) INPUT VOLTAGE AND CURRENT NOISE SPECTRAL DENSITY vs FREQUENCY CHANNEL SEPARATION vs FREQUENCY 1k 1 140 10 10 1 Current Noise 1 Channel Separation (dB) Voltage Noise 100 Current Noise (fA/√Hz) Voltage Noise (nV/√Hz) 120 0.1 0.1 1 10 100 1k 10k 100k 80 60 40 Dual and quad devices. G = 1, all channels. Quad measured channel A to D or B to C—other combinations yield improved rejection. 20 1M 100 1k 10k 100k 1M Frequency (Hz) Frequency (Hz) INPUT BIAS CURRENT vs TEMPERATURE INPUT BIAS CURRENT vs INPUT COMMON-MODE VOLTAGE 1n 10k Input Bias Current (pA) 1k Input Bias Current (pA) 100 100 10 1 0.1 Input bias current is a function of the voltage between the V– supply and the inputs. 100p 10p 1p –75 –50 –25 0 25 50 75 100 125 –15 ® OPA137, 2137, 4137 –10 –5 0 5 Common-Mode Voltage (V) Temperature (°C) 4 10 15 TYPICAL PERFORMANCE CURVES (CONT) At TA = +25°C, VS = ±15V, RL = 10kΩ, connected to ground, unless otherwise noted. TOTAL HARMONIC DISTORTION + NOISE vs FREQUENCY AOL, CMRR, PSRR vs TEMPERATURE 1 95 AOL, CMRR, PSRR (dB) VO = –13.8V to +13.9V 0.1 G=1 0.01 PSRR 75 65 100 1k 10k 100k –75 –50 –25 75 100 125 QUIESCENT CURRENT and SHORT-CIRCUIT CURRENT vs SUPPLY VOLTAGE (IQ Per Amplifier) ±80 ±40 ±150 ±30 ±20 –ISC ±50 0 –75 –50 –25 0 25 50 75 100 ±60 ±220 Quiescent Current (µA) ±50 IQ ±100 (IQ Per Amplifier) Short-Circuit Current (mA) +ISC ±70 ±230 ±70 ±60 ±200 ±210 ±40 ±190 ±30 –ISC ±180 ±170 0 ±160 0 ±5 ±15 ±20 OUTPUT VOLTAGE SWING vs OUTPUT CURRENT (V+) –55°C (V+) –1 Output Voltage Swing (V) CL = 200pF ±10 Supply Voltage (V) CL = 100pF 20 ±20 ±10 0 125 Maximum output voltage without visible dynamic distortion. 25 ±50 ±200 ±10 MAXIMUM OUTPUT VOLTAGE vs FREQUENCY VS = ±15V ±ISC IQ Temperature (°C) Output Voltage (Vp-p) 50 QUIESCENT CURRENT and SHORT-CIRCUIT CURRENT vs TEMPERATURE ±250 15 25 Temperature (°C) ±300 30 0 Frequency (Hz) ±350 Quiescent Current (µA) 80 70 VO = 3.5Vrms ±400 CMRR 85 Short-Circuit Current (mA) THD+N (%) G = 10 AOL 90 Without slew-rate induced distortion 10 5 (V+) –2 +125°C +25°C (V+) –3 (V–) +3 +25°C +125°C (V–) +2 (V–) +1 VS = ±5V 0 –55°C (V–) 10k 100k 0 1M ±2 ±4 ±6 ±8 ±10 Output Current (mA) Frequency (Hz) ® 5 OPA137, 2137, 4137 TYPICAL PERFORMANCE CURVES (CONT) At TA = +25°C, VS = ±15V, RL = 10kΩ, connected to ground, unless otherwise noted. 20 20 Typical production distribution of packaged units. Single, duals, and quads included. 16 14 Typical production distribution of packaged units. Single, duals, and quads included. 18 Percent of Amplifiers (%) 18 12 10 8 6 4 16 14 12 10 8 6 4 2 0 0 0 4 8 12 16 20 24 28 32 36 40 44 48 52 56 60 64 68 82 76 80 2 –10 –9 –8 –7 –6 –5 –4 –3 –2 –1 0 1 2 3 4 5 6 7 8 9 10 Percent of Amplifiers (%) OFFSET VOLTAGE DRIFT PRODUCTION DISTRIBUTION OFFSET VOLTAGE PRODUCTION DISTRIBUTION Offset Voltage (mV) Offset Voltage Drift (µV/°C) SETTLING TIME vs CLOSED-LOOP GAIN SMALL-SIGNAL OVERSHOOT vs LOAD CAPACITANCE 60 100 10V Step 50 Overshoot (%) 10 0.1% 40 G = –1 30 20 10 G = +10 G = +1 0 1 1 10 10 100 100 SMALL-SIGNAL STEP RESPONSE G = 1, CL = 50pF LARGE-SIGNAL STEP RESPONSE G = 1, CL = 50pF 5V/div 1µs/div 5µs/div ® OPA137, 2137, 4137 1k Load Capacitance (pF) Closed-Loop Gain (V/V) 20mV/div Settling Time (µs) 0.01% 6 10k APPLICATIONS INFORMATION HIGH-SIDE CURRENT SENSING Many applications require the sensing of signals near the positive supply. The common-mode input range of OPA137 op amps includes the positive rail, enabling them to be used to sense power supply currents as shown in Figure 2. OPA137 series op amps are unity-gain stable and suitable for a wide range of general-purpose applications. Power supply pins should be bypassed with 10nF ceramic capacitors or larger. All circuitry is completely independent in dual and quad versions, assuring normal performance when one amplifier in a package is overdriven or short circuited. Many key parameters are guaranteed over the specified temperature range, –40°C to +85°C. R1 0.1Ω V+ R2 1kΩ Load OPERATING VOLTAGE OPA137 op amps can be operated on power supplies as low as ±2.25V. Performance remains excellent with power supplies ranging from ±2.25V to ±18V (+4.5V to +36V single supply). Most parameters vary only slightly throughout this supply voltage range. Quiescent current and short-circuit current vs supply voltage are shown in Typical Performance Curves. OPA137 20pF VO = R1 R3 I R2 L Zetex Darlington ZTX712 Operation at very low supply voltage (VS ≤ ±3V) requires careful attention to ensure that the common-mode voltage remains within the linear range, VCM = (V–)+3V to (V+). Inputs may need to be biased above ground in accordance with the common-mode voltage range restrictions for linear operation. VO OPA241 Ground-referred output R3 10kΩ FIGURE 2. High-Side Current Monitor. INPUT VOLTAGE The input common-mode voltage range of OPA137 series op amps extends from (V–)+3V to the positive rail, V+. For normal operation, inputs should be limited to this range. The inputs may go beyond the power supplies without output phase-reversal. Many FET-input op amps (such as TL061 types) exhibit phase-reversal of the output when the input common-mode range is exceeded. This can occur in voltagefollower circuits, causing serious problems in control loop applications. INPUT BIAS CURRENT The input bias current is approximately 5pA at room temperature and increases with temperature as shown in the typical performance curve “Input Bias Current vs Temperature.” Input Bias current also varies with common-mode voltage and power supply voltage. This variation is dependent on the voltage between the negative power supply and the common-mode input voltage. The effect is shown in the typical performance curve “Input Bias Current vs CommonMode Voltage.” Input terminals are diode-clamped to the power supply rails for ESD protection. If the input voltage can exceed the negative supply by 500mV, input current should be limited to 2mA (or less). If the input current is not adequately limited, you may see unpredicatable behavior in the other amplifiers in the package. This is easily accomplished with an input resistor as shown in Figure 1. Many input signals are inherently current-limited, therefore, a limiting resistor may not be required. RF 1MΩ 3.3pF V+ IOVERLOAD 2mA max OPA137 λ Photodiode BPW34 CD = 75pF VOUT VIN Inputs are internally clamped to V+ and V– ID OPA137 VO = – R F I D ID is proportional to light intensity (radiant power) V– FIGURE 3. Photodetector Amplifier. FIGURE 1. Input Current Protection for Voltages Exceeding the Supply Voltage. ® 7 OPA137, 2137, 4137 SOT-23-5 (Package Drawing #331) MSOP-8 (Package Drawing #337) 0.19 (4.83) 0.04 (1.016) 0.035 (0.889) 0.10 (2.54) 0.075 (1.905) 0.027 (0.686) 0.0375 (0.9525) 0.0375 (0.9525) 0.016 (0.41) Refer to end of data sheet or Appendix C of Burr-Brown Data Book for tolerances and detailed package drawing. For further information on solder pads for surface-mount devices consult Application Bulletin AB-132. FIGURE 4. Recommended SOT-23-5 and MSOP-8 Solder Footprints. ® OPA137, 2137, 4137 8 0.0256 (0.65) PACKAGE OPTION ADDENDUM www.ti.com 6-Sep-2016 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) OPA137N/250 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 E37 OPA137N/250E4 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 E37 OPA137N/3K ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 E37 OPA137N/3KE4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 E37 OPA137NA/250 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 E37 OPA137NA/250E4 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 E37 OPA137NA/3K ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 E37 OPA137P LIFEBUY PDIP P 8 50 Green (RoHS & no Sb/Br) CU SNPB N / A for Pkg Type OPA137P OPA137PA LIFEBUY PDIP P 8 50 Green (RoHS & no Sb/Br) CU SNPB N / A for Pkg Type OPA137P A OPA137U ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 OPA 137U OPA137UA ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 OPA 137U A OPA137UA/2K5 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 OPA 137U A OPA137UA/2K5G4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 OPA 137U A OPA137UAG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 OPA 137U A OPA137UE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 OPA 137U Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 6-Sep-2016 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) OPA2137E/250 ACTIVE VSSOP DGK 8 250 Green (RoHS & no Sb/Br) CU NIPDAU | Call TI Level-3-260C-168 HR -40 to 85 E37 OPA2137E/250G4 ACTIVE VSSOP DGK 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 E37 OPA2137E/2K5 ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU | Call TI Level-3-260C-168 HR -40 to 85 E37 OPA2137E/2K5G4 ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 E37 OPA2137EA/250 ACTIVE VSSOP DGK 8 250 Green (RoHS & no Sb/Br) CU NIPDAU | Call TI Level-3-260C-168 HR E37 OPA2137EA/250G4 ACTIVE VSSOP DGK 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR E37 OPA2137EA/2K5 ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU | Call TI Level-3-260C-168 HR E37 OPA2137P ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type OPA2137P OPA2137PA ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type OPA2137P A OPA2137PAG4 ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type OPA2137P A OPA2137PG4 ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type OPA2137P OPA2137U ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR OPA 2137U OPA2137U/2K5 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR OPA 2137U OPA2137UA ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 OPA 2137U A OPA2137UA/2K5 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 OPA 2137U A OPA2137UA/2K5E4 PREVIEW SOIC D 8 TBD Call TI Call TI -40 to 85 OPA2137UAE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 Addendum-Page 2 OPA 2137U A Samples PACKAGE OPTION ADDENDUM www.ti.com 6-Sep-2016 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) OPA2137UE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR OPA 2137U OPA4137P ACTIVE PDIP N 14 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type OPA4137P OPA4137PA ACTIVE PDIP N 14 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type OPA4137P A OPA4137PAG4 ACTIVE PDIP N 14 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type OPA4137P A OPA4137U ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 OPA4137U OPA4137U/2K5 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 OPA4137U OPA4137UA ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 OPA4137U A OPA4137UA/2K5 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 OPA4137U A OPA4137UAE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 OPA4137U A OPA4137UAG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 OPA4137U A (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) Addendum-Page 3 Samples PACKAGE OPTION ADDENDUM www.ti.com 6-Sep-2016 (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 4 PACKAGE MATERIALS INFORMATION www.ti.com 15-Feb-2014 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) OPA137N/250 SOT-23 DBV 5 250 178.0 8.4 3.3 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 3.2 1.4 4.0 8.0 Q3 OPA137N/3K SOT-23 DBV 5 3000 178.0 8.4 3.3 3.2 1.4 4.0 8.0 Q3 OPA137NA/250 SOT-23 DBV 5 250 178.0 8.4 3.23 3.17 1.37 4.0 8.0 Q3 OPA137NA/3K SOT-23 DBV 5 3000 178.0 8.4 3.3 3.2 1.4 4.0 8.0 Q3 OPA137UA/2K5 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 OPA2137E/250 VSSOP DGK 8 250 180.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 OPA2137E/2K5 VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 OPA2137EA/250 VSSOP DGK 8 250 180.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 OPA2137EA/2K5 VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 OPA2137U/2K5 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 OPA2137UA/2K5 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 OPA4137U/2K5 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 OPA4137UA/2K5 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 15-Feb-2014 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) OPA137N/250 SOT-23 DBV OPA137N/3K SOT-23 DBV 5 250 565.0 140.0 75.0 5 3000 565.0 140.0 75.0 OPA137NA/250 SOT-23 DBV OPA137NA/3K SOT-23 DBV 5 250 565.0 140.0 75.0 5 3000 565.0 140.0 OPA137UA/2K5 SOIC 75.0 D 8 2500 367.0 367.0 35.0 OPA2137E/250 VSSOP DGK 8 250 210.0 185.0 35.0 OPA2137E/2K5 VSSOP DGK 8 2500 367.0 367.0 35.0 OPA2137EA/250 VSSOP DGK 8 250 210.0 185.0 35.0 OPA2137EA/2K5 VSSOP DGK 8 2500 367.0 367.0 35.0 OPA2137U/2K5 SOIC D 8 2500 367.0 367.0 35.0 OPA2137UA/2K5 SOIC D 8 2500 367.0 367.0 35.0 OPA4137U/2K5 SOIC D 14 2500 367.0 367.0 38.0 OPA4137UA/2K5 SOIC D 14 2500 367.0 367.0 38.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2016, Texas Instruments Incorporated