NSC OPA656UG4 Wideband, unity-gain stable, fet-input operational amplifier Datasheet

OPA656
OPA
656
www.ti.com
SBOS196G – DECEMBER 2001 – REVISED NOVEMBER 2008
Wideband, Unity-Gain Stable, FET-Input
OPERATIONAL AMPLIFIER
FEATURES
DESCRIPTION
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The OPA656 combines a very wideband, unity-gain stable,
voltage-feedback op amp with a FET-input stage to offer an
ultra high dynamic-range amplifier for ADC (Analog-to-Digital
Converter) buffering and transimpedance applications. Extremely
low DC errors give good precision in optical applications.
500MHz UNITY-GAIN BANDWIDTH
LOW INPUT BIAS CURRENT: 2pA
LOW OFFSET AND DRIFT: ±0.25mV, ±2µV/°C
LOW DISTORTION: 74dB SFDR at 5MHz
HIGH OUTPUT CURRENT: 70mA
LOW INPUT VOLTAGE NOISE: 7nV/√Hz
APPLICATIONS
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WIDEBAND PHOTODIODE AMPLIFIERS
SAMPLE-AND-HOLD BUFFERS
CCD OUTPUT BUFFERS
ADC INPUT BUFFERS
WIDEBAND PRECISION AMPLIFIERS
TEST AND MEASUREMENT FRONT ENDS
The high unity-gain stable bandwidth and JFET input allows
exceptional performance in high-speed, low-noise integrators.
The high input impedance and low bias current provided by
the FET input is supported by the ultra-low 7nV/√Hz input
voltage noise to achieve a very low integrated noise in
wideband photodiode transimpedance applications.
Broad transimpedance bandwidths are achievable given the
OPA656’s high 230MHz gain bandwidth product. As shown
below, a –3dB bandwidth of 1MHz is provided even for a high
1MΩ transimpedance gain from a 47pF source capacitance.
RELATED OPERATIONAL AMPLIFIER PRODUCTS
SLEW VOLTAGE
VS BW RATE NOISE
(V) (MHz) (V/µS) (nV/√HZ) AMPLIFIER DESCRIPTION
DEVICE
1pF
499kΩ
OPA355 +5 200
OPA655 ±5 400
OPA657 ±5 1600
OPA627 ±15 16
THS4601 ±15 180
499kΩ
300
290
700
55
100
5.8
6
4.8
4.5
5.4
Unity-Gain Stable CMOS
Unity-Gain Stable FET-Input
Gain of +7 Stable FET-Input
Unity-Gain Stable FET-Input
Unity-Gain Stable FET-Input
1MΩ TRANSIMPEDANCE BANDWIDTH
λ
OPA656
Transimpedance Gain (dB)
130
VO
(47pF)
–Vb
1MHz Bandwidth
120
110
100
90
Wideband Photodiode Transimpedance Amplifier
80
10kHz
100kHz
1MHz
5MHz
Frequency
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
Copyright © 2001-2008, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
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ELECTROSTATIC
DISCHARGE SENSITIVITY
ABSOLUTE MAXIMUM RATINGS(1)
Supply Voltage ................................................................................. ±6.5V
Internal Power Dissipation ........................... See Thermal Characteristics
Differential Input Voltage ..................................................................... ±VS
Input Voltage Range ............................................................................ ±VS
Storage Temperature Range ......................................... –65°C to +125°C
Lead Temperature ......................................................................... +260°C
Junction Temperature (TJ ) ........................................................... +150°C
ESD Rating (Human Body Model) .................................................. 2000V
(Machine Model) ............................................................ 200V
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
published specifications.
NOTE: (1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods may degrade
device reliability. These are stress ratings only, and functional operation of the
device at these or any other conditions beyond those specified is not implied.
PACKAGE/ORDERING INFORMATION(1)
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
MARKING
PRODUCT
PACKAGE-LEAD
PACKAGE
DESIGNATOR
OPA656U
SO-8 Surface Mount
D
–40°C to +85°C
OPA656U
OPA656U
Rails, 100
"
"
"
"
OPA656U/2K5
Tape and Reel, 2500
SO-8 Surface Mount
D
–40°C to +85°C
OPA656UB
OPA656UB
Rails, 100
"
"
"
"
OPA656UB/2K5
Tape and Reel, 2500
SOT23-5
DBV
–40°C to +85°C
B56
OPA656N/250
Tape and Reel, 250
"
"
"
"
OPA656N/3K
Tape and Reel, 3000
SOT23-5
DBV
–40°C to +85°C
B56
OPA656NB/250
Tape and Reel, 250
"
"
"
"
OPA656NB/3K
Tape and Reel, 3000
"
OPA656UB
"
OPA656N
"
OPA656NB
"
ORDERING
NUMBER(2)
TRANSPORT
MEDIA, QUANTITY
NOTE: (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at
www.ti.com. (2) UB and NB are high grade, while U and N are standard grade.
PIN CONFIGURATIONS
NC
1
8
NC
Inverting Input
2
7
+VS
Noninverting Input
3
6
Output
–VS
4
5
NC
Top View
SOT23
Output
1
–VS
2
Noninverting Input
3
5
+VS
4
Inverting Input
4
SO
5
Top View
3
2
1
B56
Pin Orientation/Package Marking
2
OPA656
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SBOS196G
ELECTRICAL CHARACTERISTICS: VS = ±5V
RF = 250Ω, RL = 100Ω, and G = +2, unless otherwise noted. Figure 1 for AC performance.
OPA656U, N (Standard-Grade)
TYP
PARAMETER
AC PERFORMANCE (Figure 1)
Small-Signal Bandwidth
Gain-Bandwidth Product
Bandwidth for 0.1dB flatness
Peaking at a Gain of +1
Large-Signal Bandwidth
Slew Rate
Rise-and-Fall Time
Settling Time to 0.02%
Harmonic Distortion
2nd-Harmonic
3rd-Harmonic
Input Voltage Noise
Input Current Noise
Differential Gain
Differential Phase
DC PERFORMANCE(4)
Open-Loop Voltage Gain (AOL)
Input Offset Voltage
Average Offset Voltage Drift
Input Bias Current
Input Offset Current
INPUT
Most Positive Input Voltage(5)
Most Negative Input Voltage(5)
Most Positive Input Voltage(6)
Most Negative Input Voltage(6)
Common-Mode Rejection Ratio (CMRR)
Input Impedance
Differential
Common-Mode
OUTPUT
Voltage Output Swing
Current Output, Sourcing
Current Output, Sinking
Closed-Loop Output Impedance
POWER SUPPLY
Specified Operating Voltage
Maximum Operating Voltage Range
Maximum Quiescent Current
Minimum Quiescent Current
Power-Supply Rejection Ratio (+PSRR)
(–PSRR)
TEMPERATURE RANGE
Specified Operating Range: U, N Package
Thermal Resistance, θJA
U: SO-8
N: SOT23-5
MIN/MAX OVER TEMPERATURE
+25°C(1)
0°C to
70°C(2)
–40°C to
+85°C(2)
MIN/ TEST
MAX LEVEL(3)
CONDITIONS
+25°C
G = +1, VO = 200mVPP, RF = 0Ω
G = +2, VO = 200mVPP
G = +5, VO = 200mVPP
G = +10, VO = 200mVPP
G > +10
G = +2, VO = 200mVPP
VO < 200mVPP, RF = 0Ω
G = +2, VO = 2VPP
G = +2, 1V Step
0.2V Step
G = +2, VO = 2V Step
G = +2, f = 5MHz, VO = 2VPP
RL = 200Ω
RL > 500Ω
RL = 200Ω
RL > 500Ω
f > 100kHz
f > 100kHz
G = +2, PAL, RL = 150Ω
G = +2, PAL, RL = 150Ω
500
200
59
23
230
30
1.5
75
290
1.5
21
MHz
MHz
MHz
MHz
MHz
MHz
dB
MHz
V/µs
ns
ns
Typ
Typ
Typ
Typ
Typ
Typ
Typ
Typ
Typ
Typ
Typ
C
C
C
C
C
C
C
C
C
C
C
–71
–74
–81
–100
7
1.3
0.02
0.05
dBc
dBc
dBc
dBc
nV/√Hz
fA/√Hz
%
°
Typ
Typ
Typ
Typ
Typ
Typ
Typ
Typ
C
C
C
C
C
C
C
C
VO = 0V, RL = 100Ω
VCM = 0V
VCM = 0V
VCM = 0V
VCM = 0V
65
±0.25
±2
±2
±1
±1.8
±12
±20
±10
60
59
±2.2
±12
±1800
±900
58
±2.6
±12
±5000
±2500
dB
mV
µV/°C
pA
pA
Min
Max
Max
Max
Max
A
A
A
A
B
VCM = ±0.5V
+2.75
–4.5
+3.25
–4.5
86
+2.1
–4.0
+2.6
–4.0
80
+2.05
–3.9
+2.5
–3.9
78
+2.0
–3.8
+2.4
–3.8
76
V
V
V
V
dB
Min
Min
Min
Min
Min
A
A
A
A
A
Ω || pF
Ω || pF
Typ
Typ
C
C
1012 || 0.7
1012 || 2.8
No Load
RL = 100Ω
G = +1, f = 0.1MHz
±3.9
±3.5
+70
–70
0.01
±3.2
48
–48
±3.1
46
–46
V
V
mA
mA
Ω
Typ
Min
Min
Min
Typ
A
A
A
C
±6
16.2
11.4
70
54
±6
16.3
11.1
68
52
V
V
mA
mA
dB
dB
Typ
Max
Max
Min
Min
Min
C
A
A
A
A
A
–40 to 85
°C
Typ
125
150
°C/W
°C/W
Typ
Typ
±5
+VS = 4.50V to 5.50V
–VS = 4.50V to –5.50V
±3.7
±3.3
UNITS
14
14
76
62
50
–50
±6
16
11.7
72
56
Junction-to-Ambient
NOTES: (1) Junction temperature = ambient for 25°C min/max specifications.
(2) Junction temperature = ambient at low temperature limit: junction temperature = ambient +20°C at high temperature limit for over temperature min/max
specifications.
(3) Test Levels: (A) 100% tested at 25°C. Over temperature limits by characterization and simulation. (B) Limits set by characterization and simulation.
(C) Typical value only for information.
(4) Current is considered positive out-of-node. VCM is the input common-mode voltage.
(5) Tested < 3dB below minimum specified CMRR at ±CMIR limits.
(6) Input range to give > 53dB CMRR.
OPA656
SBOS196G
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3
ELECTRICAL CHARACTERISTICS: VS = ±5V: High Grade DC Specifications(1)
RF = 250Ω, RL = 100Ω, and G = +2, unless otherwise noted.
OPA656UB, NB (High-Grade)
TYP
PARAMETER
Input Offset Voltage
Input Offset Voltage Drift
Input Bias Current
Input Offset Current
Common-Mode Rejection Ratio (CMRR)
Power-Supply Rejection Ratio (+PSRR)
(–PSRR)
MIN/MAX OVER TEMPERATURE
CONDITIONS
+25°C
+25°C(2)
VCM = 0V
VCM = 0V
VCM = 0V
VCM = 0V
VCM = ±0.5V
+VS = 4.5V to 5.5V
–VS = –4.5V to –5.5V
±0.1
±2
±1
±0.5
95
78
68
±0.6
±6
±5
±5
88
74
62
0°C to
70°C(3)
–40°C to
+85°C(3)
UNITS
MIN/ TEST
MAX LEVEL(4)
±0.85
±6
±450
±450
86
72
60
±0.9
±6
±1250
±1250
84
70
58
mV
µV/°C
pA
pA
dB
dB
dB
Max
Max
Max
Max
Min
Min
Min
A
A
A
A
A
A
A
NOTES: (1) All other specifications are the same as the standard-grade.
(2) Junction temperature = ambient for 25°C min/max specifications.
(3) Junction temperature = ambient at low temperature limit: junction temperature = ambient +20°C at high temperature limit for over temperature
min/max specifications.
(4) Test Levels: (A) 100% tested at 25°C. Over temperature limits by characterization and simulation.
4
OPA656
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SBOS196G
TYPICAL CHARACTERISTICS: VS = ±5V
TA = +25°C, G = +2, RF = 250Ω, RL = 100Ω, unless otherwise noted.
NONINVERTING SMALL-SIGNAL
FREQUENCY RESPONSE
INVERTING SMALL-SIGNAL
FREQUENCY RESPONSE
6
9
3
0
G = +2
–3
–6
G = +5
–9
–12
G = +10
See Figure 1
VO = 200mVp-p
RF = 402Ω
6
Normalized Gain (dB)
3
0
–6
G = –5
–9
–12
G = –10
–15
See Figure 2
–21
–18
–24
0.5
1
10
Frequency (MHz)
100
500
0.5
1
10
Frequency (MHz)
NONINVERTING LARGE-SIGNAL
FREQUENCY RESPONSE
9
500
3
VO = 0.5Vp-p
G = –1
0
6
–3
Gain (dB)
VO = 0.5Vp-p
3
Gain (dB)
100
INVERTING LARGE-SIGNAL
FREQUENCY RESPONSE
VO = 0.2Vp-p
G = +2
VO = 1Vp-p
0
VO = 2Vp-p
–3
VO = 1Vp-p
–6
VO = 2Vp-p
–9
–12
See Figure 1
See Figure 2
–6
–15
–18
–9
0.5
1
10
Frequency (MHz)
100
500
0.5
1
G = +2
0.6
0.4
1.2
Large-Signal Right Scale
0.2
0
0.8
0.4
Small-Signal Left Scale
0
–0.2
–0.4
–0.4
–0.8
See Figure 1
–0.6
–1.2
–0.8
–1.6
Time (10ns/div)
100
500
0.8
1.6
G = –1
0.6
0.4
1.2
Large-Signal Right Scale
0.2
0
0.8
0.4
Small-Signal Left Scale
–0.2
0
–0.4
–0.4
–0.8
See Figure 2
–0.6
–1.2
–0.8
–1.6
Time (10ns/div)
OPA656
SBOS196G
10
Frequency (MHz)
INVERTING PULSE RESPONSE
1.6
Small-Signal Output Voltage (200mV/div)
0.8
Large-Signal Output Voltage (400mV/div)
NONINVERTING PULSE RESPONSE
Small-Signal Output Voltage (200mV/div)
G = –2
–3
–18
–15
G = –1
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5
Large-Signal Output Voltage (400mV/div)
Normalized Gain (dB)
G = +1
RF = 0Ω
VO = 200mVp-p
TYPICAL CHARACTERISTICS: VS = ±5V (Cont.)
TA = +25°C, G = +2, RF = 250Ω, RL = 100Ω, unless otherwise noted.
HARMONIC DISTORTION vs OUTPUT VOLTAGE (5MHz)
HARMONIC DISTORTION vs LOAD RESISTANCE
–60
–60
VO = 2Vp-p
f = 5MHz
–70
–75
2nd Harmonic
–80
–85
–90
3rd Harmonic
–95
–100
See Figure 1
–105
f = 5MHz
RL = 200Ω
–65
Harmonic Distortion (dBc)
Harmonic Distortion (dBc)
–65
–70
–75
–80
–85
3rd Harmonic
–90
–95
–100
–110
–105
100
1k
0.5
1
Output Voltage Swing (Vp-p)
Resistance (Ω)
f = 1MHz
RL = 200Ω
–75
Harmonic Distortion (dBc)
Harmonic Distortion (dBc)
–70
VO = 2Vp-p
RL = 200Ω
–60
2nd Harmonic
–70
–80
–90
3rd Harmonic
–100
2nd Harmonic
–80
–85
–90
–95
3rd Harmonic
–100
See Figure 1
–105
See Figure 1
–110
–110
0.1
1
Frequency (MHz)
10
20
0.5
HARMONIC DISTORTION vs NONINVERTING GAIN
1
Output Voltage Swing (Vp-p)
5
HARMONIC DISTORTION vs INVERTING GAIN
–60
–60
VO = 2Vp-p
f = 5MHz
RL = 200Ω
–70
2nd Harmonic
Harmonic Distortion (dBc)
Harmonic Distortion (dBc)
5
HARMONIC DISTORTION vs OUTPUT VOLTAGE (1MHz)
HARMONIC DISTORTION vs FREQUENCY
–50
–80
3rd Harmonic
–90
–100
VO = 2Vp-p
RF = 604Ω
F = 5MHz
RL = 200Ω
–65
2nd Harmonic
–70
–75
3rd Harmonic
–80
–85
See Figure 2, RG and RM Adjusted
See Figure 1, RG Adjusted
–110
–90
1
10
–1
Gain (V/V)
6
2nd Harmonic
–10
Gain (V/V)
OPA656
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SBOS196G
TYPICAL CHARACTERISTICS: VS = ±5V (Cont.)
TA = +25°C, G = +2, RF = 250Ω, RL = 100Ω, unless otherwise noted.
2-TONE, 3RD-ORDER
INTERMODULATION SPURIOUS
INPUT CURRENT AND VOLTAGE NOISE DENSITY
–30
3rd-Order Spurious Level (dBc)
10
Input Voltage Noise 7nV/√Hz
Input Current Noise 1.3fA/√Hz
1
PI
–40
50Ω
50Ω
–50
–60
250Ω
10MHz
–70
5MHz
–80
–90
2MHz
100
1k
10k
f (Hz)
100k
1M
10M
–10
–8
COMMON-MODE REJECTION RATIO AND
POWER-SUPPLY REJECTION RATIO vs FREQUENCY
6
8
0
70
CMRR
100
20 log(AOL)
60
Open-Loop Gain (dB)
90
+PSRR
80
PSRR (dB)
–6
–4
–2
0
2
4
Single-Tone Load Power (dBm)
OPEN-LOOP GAIN AND PHASE
110
70
–PSRR
60
50
40
30
–30
–60
50
–90
40
< AOL
30
–120
20
–150
10
–180
–210
0
20
1k
10k
100k
1M
10M
100M
100
1k
10k
Frequency (Hz)
RECOMMENDED RS vs CAPACITIVE LOAD
Normalized Gain to Capacitive Load (dB)
For Maximally Flat Frequency Response
1
100
1k
10M
100M
1G
9
CL = 10pF
6
CL = 22pF
3
CL = 100pF
0
VI
–3
RS
VO
50Ω OPA656
CL
–6
1kΩ
250Ω
–9
250Ω
–12
1
Capacitive Load (pF)
10
100
500
Frequency (MHz)
OPA656
SBOS196G
1M
FREQUENCY RESPONSE vs CAPACITIVE LOAD
10
10
100k
Frequency (Hz)
100
RS (Ω)
15MHz
250Ω
–100
10
CMRR (dB)
PO
50Ω OPA656
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7
Open-Loop Phase (30°/div)
in (fA/√Hz)
en (nV/√Hz)
100
TYPICAL CHARACTERISTICS: VS = ±5V (Cont.)
TA = +25°C, G = +2, RF = 250Ω, RL = 100Ω, unless otherwise noted.
TYPICAL INPUT OFFSET VOLTAGE DRIFT
OVER TEMPERATURE
TYPICAL INPUT BIAS CURRENT
vs COMMON-MODE INPUT VOLTAGE
1.0
2.0
Input Bias Current (pA)
Input Offset Voltage (mV)
1.5
0.5
0
–0.5
1.0
0.5
0
–0.5
–1.0
–1.5
–1.0
–2.0
–25
0
25
50
75
100
125
–3
–2
Ambient Temperature (°C)
–1
TYPICAL INPUT BIAS CURRENT DRIFT
OVER TEMPERATURE
1
2
3
SUPPLY AND OUTPUT CURRENT vs TEMPERATURE
1000
150
18
Supply Current
Output Current (25mA/div)
900
Input Bias Current (pA)
0
Common-Mode Input Voltage (V)
800
700
600
500
400
300
200
Right Scale
125
15
Left Scale
100
Sourcing Current
12
75
9
50
6
Left Scale
Sinking Current
25
3
100
0
0
–50
–25
0
25
50
75
100
125
0
–50
–25
0
Ambient Temperature (°C)
3.2
4
2.4
3.2
1.6
1.6
0
0
–1.6
–3.2
–0.8
RL = 100Ω
G = +2
–1.6
–4.8
–6.4
0.8
–2.4
See Figure 1
–8.0
3
2
100
125
Input
RL = 100Ω
RF = 402Ω
G = –1
1
0
–1
–2
Output
–3
–3.2
–4
–4.0
–5
Time (20ns/div)
8
Input and Output Voltage (V)
Output Voltage (V)
5
4.8
Output Voltage
Left Scale
75
INVERTING OVERDRIVE RECOVERY
4.0
Input Voltage (V)
Input Voltage
Right Scale
6.4
50
Ambient Temperature (°C)
NONINVERTING INPUT OVERDRIVE RECOVERY
8.0
25
See Figure 2
Time (20ns/div)
OPA656
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SBOS196G
Supply Current (3mA/div)
–50
TYPICAL CHARACTERISTICS: VS = ±5V (Cont.)
TA = +25°C, G = +2, RF = 250Ω, RL = 100Ω, unless otherwise noted.
CLOSED-LOOP OUTPUT IMPEDANCE
vs FREQUENCY
OUTPUT VOLTAGE AND CURRENT LIMITATIONS
10
5
4
1W Internal Power
VO (V)
2
1
Output Impedance (Ω)
3
RL = 100Ω
RL = 50Ω
0
RL = 25Ω
–1
–2
1
0.1
–3
–4
–5
–100 –80
1W Internal Power
–60 –40 –20
0
20
40
60
80
0.01
1k
100
10k
100k
1M
10M
100M
Frequency (Hz)
IO (mA)
COMMON-MODE REJECTION RATIO
vs COMMON-MODE INPUT VOLTAGE
CMRR (dB)
110
90
70
50
–5
–4
–3
–2
–1
0
1
2
3
4
5
Common-Mode Input Voltage (V)
OPA656
SBOS196G
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9
APPLICATIONS INFORMATION
WIDEBAND, NONINVERTING OPERATION
The OPA656 provides a unique combination of a broadband,
unity gain stable, voltage-feedback amplifier with the DC
precision of a trimmed JFET-input stage. Its very high Gain
Bandwidth Product (GBP) of 230MHz can be used to either
deliver high signal bandwidths for low-gain buffers, or to
deliver broadband, low-noise transimpedance bandwidth to
photodiode-detector applications. To achieve the full performance of the OPA656, careful attention to printed circuit
board (PCB) layout and component selection is required as
discussed in the remaining sections of this data sheet.
Figure 1 shows the noninverting gain of +2 circuit used as the
basis for most of the Typical Characteristics. Most of the curves
were characterized using signal sources with 50Ω driving impedance, and with measurement equipment presenting a 50Ω
load impedance. In Figure 1, the 50Ω shunt resistor at the VI
terminal matches the source impedance of the test generator,
while the 50Ω series resistor at the VO terminal provides a
matching resistor for the measurement equipment load. Generally, data sheet voltage swing specifications are at the output pin
(VO in Figure 1) while output power specifications are at the
matched 50Ω load. The total 100Ω load at the output combined
with the 500Ω total feedback network load, presents the OPA656
with an effective output load of 83Ω for the circuit of Figure 1.
WIDEBAND, INVERTING GAIN OPERATION
The circuit of Figure 2 shows the inverting gain of –1 test
circuit used for most of the inverting Typical Characteristics.
In this case, an additional resistor RM is used to achieve the
50Ω input impedance required by the test equipment using in
characterization. This input impedance matching is optional
in a circuit board environment where the OPA656 is used as
an inverting amplifier at the output of a prior stage.
+5V
+VS
0.1µF
VO
+
6.8µF
50Ω
50Ω Load
OPA656
50Ω Source
RG
402Ω
RF
402Ω
VI
RM
57.6Ω
0.1µF
+
6.8µF
–VS
–5V
FIGURE 2. Inverting G = –1 Specifications and Test Circuit.
+5V
In this configuration, the output sees the feedback resistor as
an additional load in parallel with the 100Ω load used for test.
It is often useful to increase the RF value to decrease the
loading on the output (improving harmonic distortion) with the
constraint that the parallel combination of RF || RG < 200Ω.
For higher inverting gains with the DC precision provided by
the FET input OPA656, consider the higher gain bandwidth
+VS
0.1µF
6.8µF
+
50Ω Source
50Ω Load
VI
50Ω
VO
OPA656
50Ω
product OPA657.
RF
250Ω
RG
250Ω
+
6.8µF
0.1µF
–VS
–5V
FIGURE 1. Noninverting G = +2 Specifications and Test
Circuit.
Voltage-feedback op amps, unlike current feedback products, can use a wide range of resistor values to set their gain.
To retain a controlled frequency response for the noninverting
voltage amplifier of Figure 1, the parallel combination of
RF || RG should always < 200Ω. In the noninverting configuration, the parallel combination of RF || RG will form a pole
with the parasitic input capacitance at the inverting node of
the OPA656 (including layout parasitics). For best performance, this pole should be at a frequency greater than the
closed loop bandwidth for the OPA656. For this reason, a
direct short from output to inverting input is recommended for
the unity gain follower application.
10
Figure 2 also shows the noninverting input tied directly to
ground. Often, a bias current canceling resistor to ground is
included here to null out the DC errors caused by input bias
current effects. This is only useful when the input bias
currents are matched. For a JFET part like the OPA656, the
input bias currents do not match but are so low to begin with
(< 5pA) that DC errors due to input bias currents are
negligible. Hence, no resistor is recommended at the
noninverting inputs for the inverting signal path condition.
WIDEBAND, HIGH SENSITIVITY, TRANSIMPEDANCE
DESIGN
The high GBP and low input voltage and current noise for the
OPA656 make it an ideal wideband transimpedance amplifier for low to moderate transimpedance gains. Higher
transimpedance gains (> 100kΩ) will benefit from the low
input noise current of a FET input op amp such as the
OPA656. One transimpedance design example is shown on
the front page of the data sheet. Designs that require high
bandwidth from a large area detector will benefit from the low
input voltage noise for the OPA656. This input voltage noise
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is peaked up over frequency by the diode source capacitance, and can, in many cases, become the limiting factor to
input sensitivity. The key elements to the design are the
expected diode capacitance (CD) with the reverse bias voltage (–VB) applied, the desired transimpedance gain, RF, and
the GBP for the OPA656 (230MHz). Figure 3 shows a design
from a 25pF source capacitance diode through a 50kΩ
transimpedance gain. With these 3 variables set (including
the parasitic input capacitance for the OPA656 added to CD),
the feedback capacitor value (CF) may be set to control the
frequency response.
If the total output noise is bandlimited to a frequency less
than the feedback pole frequency (1/RFCF), a very simple
expression for the equivalent input noise current can be
derived as:
iEQ = Equivalent input noise current if the output noise is
bandlimited to F < 1/(2πRFCD).
iN = Input current noise for the op amp inverting input.
eN = Input voltage noise for the op amp.
Supply Decoupling
Not Shown
OPA656
CD = Diode capacitance.
F = Bandlimiting frequency in Hz (usually a postfilter prior
to further signal processing).
VO = ID RF
4kT = 1.6E – 20J at 290°K.
RF
50kΩ
ID
CD
25pF
–5V
2
Where:
+5V
λ
(E 2πCDF)
4kT  EN 
+ N
+

RF  RF 
3
2
2
IEQ = IN
+
CF
0.6pF
–VB
FIGURE 3. Wideband, Low-Noise, Transimpedance Amplifier.
To achieve a maximally flat 2nd-order Butterworth frequency
response, the feedback pole should be set to:
Evaluating this expression up to the feedback pole frequency
at 3.8MHz for the circuit of Figure 3, gives an equivalent input
noise current of 2.7pA/ Hz . This is much higher than the
1.3fA/ Hz for just the op amp itself. This result is being
dominated by the last term in the equivalent input noise
current expression. It is essential in this case to use a low
voltage noise op amp.
DESIGN-IN TOOLS
DEMONSTRATION FIXTURES
1/(2πR F C F ) = (GBP /(4πR F C D ))
Adding the common mode and differential mode input capacitance (0.7 + 2.8)pF to the 25pF diode source capacitance of Figure 3, and targeting a 50kΩ transimpedance gain
using the 230MHz GBP for the OPA656 will require a
feedback pole set to 3.8MHz. This will require a total feedback capacitance of 0.8pF. Typical surface-mount resistors
have a parasitic capacitance of 0.2pF leaving the required
0.6pF value shown in Figure 3 to get the required feedback
pole.
This will give an approximate –3dB bandwidth set by:
Two printed circuit boards (PCBs) are available to assist in
the initial evaluation of circuit performance using the OPA656
in its two package options. Both of these are offered free of
charge as unpopulated PCBs, delivered with a user's guide.
The summary information for these fixtures is shown in
Table I.
PRODUCT
PACKAGE
ORDERING
NUMBER
LITERATURE
NUMBER
OPA656U
OPA656N
SO-8
SOT23-5
DEM-OPA-SO-1A
DEM-OPA-SOT-1A
SBOU009
SBOU010
TABLE I. Demonstration Fixtures by Package.
f−3dB = GBP / 2πR F C D ) Hz
The example of Figure 3 will give approximately 5.7MHz flat
bandwidth using the 0.6pF feedback compensation.
The demonstration fixtures can be requested at the Texas
Instruments web site (www.ti.com) through the OPA656
product folder.
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11
OPERATING SUGGESTIONS
FREQUENCY RESPONSE CONTROL
SETTING RESISTOR VALUES TO MINIMIZE NOISE
The OPA656 provides a very low input noise voltage while
requiring a low 14mA quiescent supply current. To take full
advantage of this low input noise, careful attention to the other
possible noise contributors is required. Figure 4 shows the op
amp noise analysis model with all the noise terms included. In
this model, all the noise terms are taken to be noise voltage or
current density terms in either nV/ Hz or pA/ Hz .
ENI
*
ERS
EO
OPA656
RS
IBN
*
RF
√4kTRS
4kT
RG
*
RG
√4kTRF
IBI
4kT = 1.6E –20J
at 290°K
FIGURE 4. Op Amp Noise Analysis Model.
The total output spot noise voltage can be computed as the
square root of the squared contributing terms to the output
noise voltage. This computation is adding all the contributing
noise powers at the output by superposition, then taking the
square root to get back to a spot noise voltage. Equation 1
shows the general form for this output noise voltage using
the terms shown in Figure 4.
(1)
2
2
EO =  ENI2 + (IBNRS ) + 4kTRS  NG2 + (IBIRF ) + 4kTRFNG
Dividing this expression by the noise gain (GN = 1+RF/RG)
will give the equivalent input referred spot noise voltage at
the noninverting input as shown in Equation 2.
(2)
2
4kTRF
2
I R 
EN = ENI2 + (IBNRS ) + 4kTRS +  BI F  +
 NG 
NG
Putting high resistor values into Equation 2 can quickly
dominate the total equivalent input referred noise. A source
impedance on the noninverting input of 3kΩ will add a
Johnson voltage noise term equal to just that for the amplifier
itself (7nV/ Hz). While the JFET input of the OPA656 is ideal
for high source impedance applications, both the overall
bandwidth and noise will be limited by higher source impedances in the noninverting configuration of Figure 1.
12
Voltage-feedback op amps like the OPA656 exhibit decreasing signal bandwidth as the signal gain is increased. In
theory, this relationship is described by the GBP shown in the
Electrical Characteristics. Ideally, dividing GBP by the
noninverting signal gain (also called the Noise Gain, or NG)
will predict the closed-loop bandwidth. In practice, this only
holds true when the phase margin approaches 90°, as it does
in high-gain configurations. At low gains (increased feedback
factors), most high-speed amplifiers will exhibit a more complex response with lower phase margin. The OPA656 is
compensated to give a maximally flat 2nd-order Butterworth
closed loop response at a noninverting gain of +2 (Figure 1).
This results in a typical gain of +2 bandwidth of 200MHz, far
exceeding that predicted by dividing the 230MHz GBP by 2.
Increasing the gain will cause the phase margin to approach
90° and the bandwidth to more closely approach the predicted value of (GBP/NG). At a gain of +10 the OPA656 will
show the 23MHz bandwidth predicted using the simple
formula and the typical GBP of 230MHz.
Unity-gain stable op amps like the OPA656 can also be
bandlimited using a capacitor across the feedback resistor.
For the noninverting configuration of Figure 1, a capacitor
across the feedback resistor will decrease the gain with
frequency down to a gain of +1. For instance, to bandlimit the
gain of +2 design to 20MHz, a 32pF capacitor can be placed
in parallel with the 250Ω feedback resistor. This will, however, only decrease the gain from 2 to 1. Using a feedback
capacitor to limit the signal bandwidth is more effective in the
inverting configuration of Figure 2. Adding that same capacitor to the feedback of Figure 2 will set a pole in the signal
frequency response at 20MHz, but in this case it will continue
to attenuate the signal gain to below 1. However, the output
noise contribution due the input voltage noise of the OPA656
will still only be reduced to a gain of 1 with the addition of the
feedback capacitor.
DRIVING CAPACITIVE LOADS
One of the most demanding and yet very common load
conditions for an op amp is capacitive loading. Often, the
capacitive load is the input of an ADC—including additional
external capacitance which may be recommended to improve ADC linearity. A high-speed, high open-loop gain
amplifier like the OPA656 can be very susceptible to decreased stability and closed-loop response peaking when a
capacitive load is placed directly on the output pin. When the
amplifier’s open loop output resistance is considered, this
capacitive load introduces an additional pole in the signal
path that can decrease the phase margin. Several external
solutions to this problem have been suggested. When the
primary considerations are frequency response flatness, pulse
response fidelity and/or distortion, the simplest and most
effective solution is to isolate the capacitive load from the
feedback loop by inserting a series isolation resistor between
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the amplifier output and the capacitive load. This does not
eliminate the pole from the loop response, but rather shifts it
and adds a zero at a higher frequency. The additional zero
acts to cancel the phase lag from the capacitive load pole,
thus increasing the phase margin and improving stability.
The Typical Characteristics show the recommended RS versus Capacitive Load and the resulting frequency response at
the load. In this case, a design target of a maximally flat
frequency response was used. Lower values of RS may be
used if some peaking can be tolerated. Also, operating at
higher gains (than the +2 used in the Typical Characteristics)
will require lower values of RS for a minimally peaked
frequency response. Parasitic capacitive loads greater than
2pF can begin to degrade the performance of the OPA656.
Long PC board traces, unmatched cables, and connections
to multiple devices can easily cause this value to be exceeded. Always consider this effect carefully, and add the
recommended series resistor as close as possible to the
OPA656 output pin (see Board Layout section).
DISTORTION PERFORMANCE
The OPA656 is capable of delivering a low distortion signal
at high frequencies over a wide range of gains. The distortion
plots in the Typical Characteristics show the typical distortion
under a wide variety of conditions.
Generally, until the fundamental signal reaches very high
frequencies or powers, the 2nd-harmonic will dominate the
distortion with negligible 3rd-harmonic component. Focusing
then on the 2nd-harmonic, increasing the load impedance
improves distortion directly. Remember that the total load
includes the feedback network—in the noninverting configuration this is sum of RF + RG, while in the inverting configuration
this is just RF (see Figure 1). Increasing output voltage swing
increases harmonic distortion directly. A 6dB increase in
output swing will generally increase the 2nd-harmonic 12dB
and the 3rd-harmonic 18dB. Increasing the signal gain will also
increase the 2nd-harmonic distortion. Again a 6dB increase in
gain will increase the 2nd- and 3rd-harmonic by about 6dB
even with a constant output power and frequency. And finally,
the distortion increases as the fundamental frequency increases due to the rolloff in the loop gain with frequency.
Conversely, the distortion will improve going to lower frequencies down to the dominant open loop pole at approximately
100kHz. Starting from the –70dBc 2nd-harmonic for a 5MHz,
2VPP fundamental into a 200Ω load at G = +2 (from the Typical
Characteristics), the 2nd-harmonic distortion for frequencies
lower than 100kHz will be < –105dBc.
The OPA656 has an extremely low 3rd-order harmonic
distortion. This also shows up in the 2-tone 3rd-order intermodulation spurious (IM3) response curves. The 3rd-order
spurious levels are extremely low (< –80dBc) at low output
power levels. The output stage continues to hold them low
even as the fundamental power reaches higher levels. As the
Typical Characteristics show, the spurious intermodulation
powers do not increase as predicted by a traditional intercept
model. As the fundamental power level increases, the dynamic range does not decrease significantly. For 2 tones
centered at 10MHz, with 4dBm/tone into a matched 50Ω load
(that is, 1VPP for each tone at the load, which requires 4VPP
for the overall 2-tone envelope at the output pin), the Typical
Characteristics show a 78dBc difference between the test
tone and the 3rd-order intermodulation spurious levels. This
exceptional performance improves further when operating at
lower frequencies and/or higher load impedances.
DC ACCURACY AND OFFSET CONTROL
The OPA656 can provide excellent DC accuracy due to its
high open-loop gain, high common-mode rejection, high
power-supply rejection, and its trimmed input offset voltage
(and drift) along with the negligible errors introduced by the
low input bias current. For the best DC precision, a highgrade version (OPA656UB or OPA656NB) screens the key
DC parameters to an even tighter limits. Both standard- and
high-grade versions take advantage of a new final test
technique to 100% test input offset voltage drift over temperature. This discussion will use the high-grade typical and
min/max electrical characteristics for illustration; however, an
identical analysis applies to the standard-grade version.
The total output DC offset voltage in any configuration and
temperature will be the combination of a number of possible
error terms. In a JFET part like the OPA656, the input bias
current terms are typically quite low but are unmatched.
Using bias current cancellation techniques, more typical in
bipolar input amplifiers, does not improve output DC offset
errors. Errors due to the input bias current will only become
dominant at elevated temperatures. The OPA656 shows the
typical 2x increase in every 10°C common to JFET-input
stage amplifiers. Using the 5pA maximum tested value at
25°C, and a 20°C internal self heating (see thermal analysis),
the maximum input bias current at 85°C ambient will be
5pA • 2(105 – 25)/10 = 1280pA. For noninverting configurations,
this term only begins to be a significant term versus the input
offset voltage for source impedances > 750kΩ. This would
also be the feedback-resistor value for transimpedance applications (see Figure 3) where the output DC error due to
inverting input bias current is on the order of that contributed
by the input offset voltage. In general, except for these
extremely high impedance values, the output DC errors due
to the input bias current may be neglected.
After the input offset voltage itself, the most significant term
contributing to output offset voltage is the PSRR for the
negative supply. This term is modeled as an input offset
voltage shift due to changes in the negative power-supply
voltage (and similarly for the +PSRR). The high-grade test
limit for –PSRR is 62dB. This translates into 1.59mV/V input
offset voltage shift = 10(–62/20). In the worst case, a ±0.38V
(±7.6%) shift in the negative supply voltage will produce a
±0.6mV apparent input offset voltage shift. Since this is
comparable to the tested limit of ±0.6mV input offset voltage,
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13
a careful control of the negative supply voltage is required.
The +PSRR is tested to a minimum value of 74dB. This
translates into 10(–74/20) = 0.2mV/V sensitivity for the input
offset voltage to positive power supply changes.
As an example, compute the worst-case output DC error for
the transimpedance circuit of Figure 1 at 25°C and then the
shift over the 0°C to 70°C range given the following assumptions.
Negative Power Supply
= –5V ±0.2V with a ±5mV/°C worst-case shift
Positive Power Supply
= +5V ±0.2V with a ±5mV/°C worst-case shift
Initial 25°C Output DC Error Band
= ±0.3mV (due to the –PSRR = 1.59mV/V • ±0.2V)
±0.04mV (due to the +PSRR = 0.2mV/V • ±0.2V)
±0.6mV Input Offset Voltage
The OPA656 will not require heatsinking or airflow in most
applications. Maximum allowed junction temperature will set
the maximum allowed internal power dissipation as described below. In no case should the maximum junction
temperature be allowed to exceed 150°C.
Operating junction temperature (TJ) is given by TA + PD • θJA.
The total internal power dissipation (PD) is the sum of quiescent
power (PDQ) and additional power dissipated in the output stage
(PDL) to deliver load power. Quiescent power is simply the
specified no-load supply current times the total supply voltage
across the part. PDL will depend on the required output signal
and load but would, for a grounded resistive load, be at a
maximum when the output is fixed at a voltage equal to 1/2 of
either supply voltage (for equal bipolar supplies). Under this
condition PDL = VS2/(4 • RL) where RL includes feedback
network loading.
Note that it is the power in the output stage and not into the
load that determines internal power dissipation.
Total = ±0.94mV
This would be the worst-case error band in volume production at 25°C acceptance testing given the conditions stated.
Over the temperature range of 0°C to 70°C, we can expect
the following worst-case shifting from initial value. A 20°C
internal junction self heating is assumed here.
As a worst-case example, compute the maximum TJ using an
OPA656N (SOT23-5 package) in the circuit of Figure 1
operating at the maximum specified ambient temperature of
+85°C and driving a grounded 100Ω load.
PD = 10V • 16.1mA + 52 /(4 • (100Ω || 800Ω)) = 231mW
Maximum TJ = +85°C + (0.23W • 150°C/W) = 120°C.
±0.36mV (OPA656 high-grade input offset drift)
= ±6µV/°C • (70°C + 20°C – 25°C))
±0.23mV (–PSRR of 60dB with 5mV • (70°C – 25°C) supply shift)
±0.06mV (+PSRR of 72dB with 5mV • (70°C – 25°C) supply shift)
Total = ±0.65mV
This would be the worst-case shift from initial offset over a
0°C to 70°C ambient for the conditions stated. Typical initial
output DC error bands and shifts over temperature will be
much lower than these worst-case estimates.
In the transimpedance configuration, the CMRR errors can be
neglected since the input common mode voltage is held at
ground. For noninverting gain configurations (see Figure 1), the
CMRR term will need to be considered but will typically be far
lower than the input offset voltage term. With a tested minimum
of 80dB (100µV/V), the added apparent DC error will be no more
than ±0.2mV for a ±2V input swing to the circuit of Figure 1.
POWER-SUPPLY CONSIDERATIONS
The OPA656 is intended for operation on ±5V supplies.
Single-supply operation is allowed with minimal change from
the stated specifications and performance from a single
supply of +8V to +12V maximum. The limit to lower supply
voltage operation is the useable input voltage range for the
JFET-input stage. Operating from a single supply of +12V
can have numerous advantages. With the negative supply at
ground, the DC errors due to the –PSRR term can be
minimized. Typically, AC performance improves slightly at
+12V operation with minimal increase in supply current.
14
THERMAL ANALYSIS
All actual applications will be operating at lower internal
power and junction temperature.
BOARD LAYOUT
Achieving optimum performance with a high-frequency amplifier like the OPA656 requires careful attention to board
layout parasitics and external component types. Recommendations that will optimize performance include:
a) Minimize parasitic capacitance to any AC ground for all
of the signal I/O pins. Parasitic capacitance on the output and
inverting input pins can cause instability—on the noninverting input, it can react with the source impedance to cause
unintentional bandlimiting. To reduce unwanted capacitance,
a window around the signal I/O pins should be opened in all
of the ground and power planes around those pins. Otherwise, ground and power planes should be unbroken elsewhere on the board.
b) Minimize the distance (< 0.25”) from the power-supply
pins to high-frequency 0.1uF decoupling capacitors. At the
device pins, the ground and power plane layout should not
be in close proximity to the signal I/O pins. Avoid narrow
power and ground traces to minimize inductance between
the pins and the decoupling capacitors. The power-supply
connections should always be decoupled with these capacitors. Larger (2.2µF to 6.8µF) decoupling capacitors, effective
at lower frequency, should also be used on the supply pins.
These may be placed somewhat farther from the device and
may be shared among several devices in the same area of
the PC board.
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c) Careful selection and placement of external components
will preserve the high frequency performance of the OPA656.
Resistors should be a very low reactance type. Surface-mount
resistors work best and allow a tighter overall layout. Metal film
and carbon composition axially leaded resistors can also provide good high frequency performance. Again, keep their leads
and PCB trace length as short as possible. Never use wirewound
type resistors in a high frequency application. Since the output
pin and inverting input pin are the most sensitive to parasitic
capacitance, always position the feedback and series output
resistor, if any, as close as possible to the output pin. Other
network components, such as noninverting input termination
resistors, should also be placed close to the package. Where
double side component mounting is allowed, place the feedback resistor directly under the package on the other side of the
board between the output and inverting input pins. Even with a
low parasitic capacitance shunting the external resistors, excessively high resistor values can create significant time constants
that can degrade performance. Good axial metal film or surfacemount resistors have approximately 0.2pF in shunt with the
resistor. For resistor values > 1.5kΩ, this parasitic capacitance
can add a pole and/or zero below 500MHz that can effect circuit
operation. Keep resistor values as low as possible consistent
with load driving considerations. It has been suggested here
that a good starting point for design would be to keep RF || RG
< 250Ω for voltage amplifier applications. Doing this will automatically keep the resistor noise terms low, and minimize the
effect of their parasitic capacitance. Transimpedance applications (see Figure 3) can use whatever feedback resistor is
required by the application as long as the feedback compensation capacitor is set considering all parasitic capacitance terms
on the inverting node.
based on board material and trace dimensions, a matching
series resistor into the trace from the output of the OPA656
is used as well as a terminating shunt resistor at the input of
the destination device. Remember also that the terminating
impedance will be the parallel combination of the shunt
resistor and the input impedance of the destination device—
this total effective impedance should be set to match the
trace impedance. If the 6dB attenuation of a doubly-terminated transmission line is unacceptable, a long trace can be
series-terminated at the source end only. Treat the trace as
a capacitive load in this case and set the series resistor value
as shown in the plot of Recommended RS vs Capacitive
Load. This will not preserve signal integrity as well as a
doubly-terminated line. If the input impedance of the destination device is low, there will be some signal attenuation due
to the voltage divider formed by the series output into the
terminating impedance.
d) Connections to other wideband devices on the board
may be made with short direct traces or through onboard
transmission lines. For short connections, consider the trace
and the input to the next device as a lumped capacitive load.
Relatively wide traces (50mils to 100mils) should be used,
preferably with ground and power planes opened up around
them. Estimate the total capacitive load and set RS from the
plot of Recommended RS vs Capacitive Load. Low parasitic
capacitive loads (< 5pF) may not need an RS since the
OPA656 is nominally compensated to operate with a 2pF
parasitic load. Higher parasitic capacitive loads without an RS
are allowed as the signal gain increases (increasing the
unloaded phase margin) If a long trace is required, and the
6dB signal loss intrinsic to a doubly-terminated transmission
line is acceptable, implement a matched impedance transmission line using microstrip or stripline techniques (consult
an ECL design handbook for microstrip and stripline layout
techniques). A 50Ω environment is normally not necessary
onboard, and in fact a higher impedance environment will
improve distortion as shown in the distortion versus load
plots. With a characteristic board trace impedance defined
These diodes provide moderate protection to input overdrive
voltages above the supplies as well. The protection diodes
can typically support 30mA continuous current. Where higher
currents are possible (for example, in systems with ±12V
supply parts driving into the OPA656), current limiting series
resistors should be added into the two inputs. Keep these
resistor values as low as possible since high values degrade
both noise performance and frequency response.
e) Socketing a high speed part like the OPA656 is not
recommended. The additional lead length and pin-to-pin capacitance introduced by the socket can create an extremely
troublesome parasitic network which can make it almost impossible to achieve a smooth, stable frequency response. Best
results are obtained by soldering the OPA656 onto the board.
INPUT AND ESD PROTECTION
The OPA656 is built using a very high speed complementary
bipolar process. The internal junction breakdown voltages are
relatively low for these very small geometry devices. These
breakdowns are reflected in the Absolute Maximum Ratings
table. All device pins are protected with internal ESD protection diodes to the power supplies as shown in Figure 5.
+V CC
External
Pin
–V CC
FIGURE 5. Internal ESD Protection.
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15
Revision History
DATE
REVISION
11/08
G
3/06
F
PAGE
SECTION
2
Abs Max Ratings
3
Electrical Characteristics
11
Design-In Tools
DESCRIPTION
Changed Storage Temperature Range from −40°C to +125C to
−65°C to +125C.
DC Performance section; deleted Drift from Input Offset Current specifications.
Added Design-In Tools paragraph and table.
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
16
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PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
OPA656N/250
ACTIVE
SOT-23
DBV
5
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
B56
OPA656N/250G4
ACTIVE
SOT-23
DBV
5
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
B56
OPA656NB/250
ACTIVE
SOT-23
DBV
5
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
B56
OPA656NB/250G4
ACTIVE
SOT-23
DBV
5
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
B56
OPA656U
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
OPA
656U
OPA656U/2K5
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
OPA
656U
OPA656U/2K5G4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
OPA
656U
OPA656UB
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
OPA
656U
B
OPA656UB/2K5
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
OPA
656U
B
OPA656UB/2K5G4
PREVIEW
SOIC
D
8
TBD
Call TI
Call TI
-40 to 85
OPA
656U
B
OPA656UBG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
OPA
656U
B
OPA656UG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
OPA
656U
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
OPA656N/250
SOT-23
DBV
5
250
180.0
OPA656NB/250
SOT-23
DBV
5
250
OPA656U/2K5
SOIC
D
8
2500
OPA656UB/2K5
SOIC
D
8
2500
B0
(mm)
K0
(mm)
P1
(mm)
8.4
3.2
3.1
1.39
4.0
180.0
8.4
3.2
3.1
1.39
330.0
12.4
6.4
5.2
2.1
330.0
12.4
6.4
5.2
2.1
Pack Materials-Page 1
W
Pin1
(mm) Quadrant
8.0
Q3
4.0
8.0
Q3
8.0
12.0
Q1
8.0
12.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
OPA656N/250
SOT-23
DBV
5
250
210.0
185.0
35.0
OPA656NB/250
SOT-23
DBV
5
250
210.0
185.0
35.0
OPA656U/2K5
SOIC
D
8
2500
367.0
367.0
35.0
OPA656UB/2K5
SOIC
D
8
2500
367.0
367.0
35.0
Pack Materials-Page 2
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