TI RI-I03-112A-03

RI-I03-112A-03
www.ti.com
SCBS832A – OCTOBER 2001 – REVISED APRIL 2010
Tag-it™ HF-I PLUS TRANSPONDER INLAYS
MINIATURE RECTANGLE
Check for Samples: RI-I03-112A-03
FEATURES
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ISO/IEC 15693-2, -3; ISO/IEC 18000-3
Compliant
13.56-MHz Operating Frequency
2048-Bit User Memory in 64-Bit × 32-Bit Blocks
User and Factory Lock Per Block
Application Family Identifier (AFI)
Data Storage Format Identifier (DSFID)
Combined Inventory Read Block
APPLICATIONS
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Product Authentication
Library
Supply-Chain Management
Asset Management
Ticketing/Stored Value
DESCRIPTION
Texas Instruments Tag-it™ HF-I plus transponder inlays consist of 13.56-MHz high-frequency (HF) transponders
that are compliant with the ISO/IEC 15693 and ISO/IEC 18000-3 global open standards. These products offer a
user-accessible memory of 2048 bits, organized in 64 blocks, and an extensive command set available in six
different antenna shapes, with frequency offset for integration into paper, PVC, or other substrates.
The Tag-it HF-I plus transponder inlays are manufactured with TI’s patented laser tuning process to provide
consistent read performance. Prior to delivery, the transponders undergo complete functional and parametric
testing in order to provide the high quality that customers have come to expect from TI.
The Tag-it HF-I plus transponder inlays are well suited for a variety of applications including, but not limited to,
product authentication, library, supply-chain management, asset management, and ticketing/stored value
applications.
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2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Tag-it is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2001–2010, Texas Instruments Incorporated
RI-I03-112A-03
SCBS832A – OCTOBER 2001 – REVISED APRIL 2010
www.ti.com
Table 1. SPECIFICATIONS (1)
PART NUMBER
RI-I03-112A-03
Supported standard
ISO/IEC 15693-2, -3; ISO/IEC 18000-3
Recommended operating frequency
13.56 MHz
Passive resonance frequency (at 25°C)
13.86 MHz ± 200 kHz (includes frequency offset to compensate further
integration into paper or PVC lamination)
Typical required activation field strength to read (at 25°C)
107 dBmA/m (2)
Typical required activation field strength to write (at 25°C)
111 dBmA/m (2)
Factory programmed read-only number
64 bits
Memory (user programmable)
2k bits organized in 64-bit × 32-bit blocks
Typical programming cycles (at 25°C)
100,000
Data retention time (at 55°C)
>10 years
Simultaneous identification of tags
Up to 50 tags per second (reader/antenna dependent)
Antenna size
22.5 mm × 38 mm (~0.89 in × ~1.5 in)
Foil width
48 mm ± 0.5 mm (1.89 in ± 0.02 in)
Foil pitch
48 mm +0.1 mm/–0.4 mm (~1.89 in)
Thickness
Chip area: 0.34 mm ±0.02
Antenna area (Al both sides): 0.085 mm ±0.01
Antenna area (Al one side): 0.075 mm ±0.008
Base material
Substrate: PET (polyethylenetherephtalate)
Antenna: aluminum
Smallest bending radius allowed
18 mm (~0.71 in)
Operating temperature
–25°C to 70°C
Storage temperature (single inlay)
–40°C to 85°C (warpage may occur at upper temperature range)
Storage temperature (on reel)
–40°C to 40°C
Delivery
Single-row tape wound on cardboard reel with 500-mm diameter
Reel outer width: approximately 60 mm (~2.36 in)
Reel inner width: approximately 50 mm (~1.97 in)
Hub diameter: 76.2 mm (3 in)
Typical quantity of good units per reel
5,000
(1)
(2)
2
For highest possible read-out coverage, operate readers at a modulation depth of 20% or higher.
After integration into paper
Submit Documentation Feedback
Copyright © 2001–2010, Texas Instruments Incorporated
Product Folder Link(s): RI-I03-112A-03
RI-I03-112A-03
www.ti.com
SCBS832A – OCTOBER 2001 – REVISED APRIL 2010
Table 2. SUPPORTED COMMAND SET
REQUEST MODE (1)
REQUEST
REQUEST
CODE
ADDRESSED
NONADDRESSED
SELECT
AFI
OPT. FLAG
ü
–
–
–
ü
0
INVENTORY
ISO 15693 Mandatory and Optional Commands
Inventory
0x01
Stay Quiet
0x02
–
ü
–
–
–
0
Read_Single_Block
0x20
ü
ü
ü
ü
ü
0/1
Write_Single_Block
0x21
–
ü
ü
ü
–
1
Lock_Block
0x22
–
ü
ü
ü
–
1
Read_Multi_Blocks
0x23
ü
ü
ü
ü
ü
0/1
Select Tag
0x25
–
ü
–
–
–
0
Reset to Ready
0x26
–
ü
ü
ü
–
0
Write_AFI
0x27
–
ü
ü
ü
–
1
Lock_AFI
0x28
–
ü
ü
ü
–
1
Write DSFID
0x29
–
ü
ü
ü
–
1
Lock DSFID
0x2A
–
ü
ü
ü
–
1
Get_System_info
0x2B
ü
ü
ü
ü
ü
0
Get_M_BLK_Sec_St
0x2C
ü
ü
ü
ü
ü
0
Write_2_Blocks
0xA2
–
ü
ü
ü
–
1
Lock_2_Blocks
0xA3
–
ü
ü
ü
–
1
TI Custom Commands
(1)
ü = Implemented, – = Not applicable
MEMORY ORGANIZATION
32 bits
Lock Bits
F = Factory Lock, U = User Lock
F U
Block #
1
2
3
User data
62
63
64
DSFID
AFI
IC Version
ÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎ
ÏÏÏÏ
ÎÎÎÎÎÎÎÎÎÎÎÎ
ÏÏÏÏ
ÎÎÎÎÎÎÎÎÎÎÎÎ
ÏÏÏÏÏÏÏ
ÏÏÏÏ
ÏÏÏÏ
ÏÏÏ
ÏÏÏÏ
ÏÏÏÏÏÏÏ
ÏÏÏÏ
ÏÏÏÏÏÏÏ
ÏÏÏÏ
(2048 bits)
X
UID Number
(64 bits)
Application
Configuration
Factory Programmed
Submit Documentation Feedback
Copyright © 2001–2010, Texas Instruments Incorporated
Product Folder Link(s): RI-I03-112A-03
3
PACKAGE OPTION ADDENDUM
www.ti.com
10-Feb-2010
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
RI-I03-112A-03
ACTIVE
RFIDN
TFE
Pins Package Eco Plan (2)
Qty
0
5000
Pb-Free
(RoHS)
Lead/Ball Finish
Call TI
MSL Peak Temp (3)
N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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Addendum-Page 1
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