DOCUMENT : SRLF0000NH REVISION : A1 PAGE : 1 OF 7 SPECIFICATION FOR APPROVAL 1/3W, 0805 Low Resistance Chip Resistor (Lead / Halogen free) 1. Scope This specification applies to 1.2mm x 2.0mm size 1/3W, fixe metal film chip resistors rectangular type for use in electronic equipment. 2. Type Designation RLW2012 — F — □□□□ (1) (2) (3) Where (1) Series No. (2) Power rating F = 1/3W (3) Resistance value: For example— R005 = 0.005 Ω (4) Resistance tolerance: F= ± 1% G= ± 2% J= ± 5% □ (4) 3. Construction and Physical Dimensions Code Letter Dimensions (mm) L 1.3 ± 0.20 W 2.0 ± 0.20 t 0.50 ± 0.20 a 0.35 ± 0.15 b 0.35 ± 0.15 NOTE: ① Resistive element ( under protection film ) ② Electrode ③ Protection film ④ Substrate Figure 1. Structure (No mark) DOCUMENT : SRLF0000NH REVISION : A1 PAGE : 2 OF 7 SPECIFICATION FOR APPROVAL 4. Ratings 4-1 Specification Power Rating* 1/3 W Resistance Range 0.005Ω~0.030Ω Resistance Tolerance ±1% , ±2% , ±5% 0~200ppm/℃ Temperature Coefficient of Resistance Note*: Power Rating is based on continuous full load operation at rated ambient temperature of 70℃. For resistors operated at ambient temperature in excess of 70℃, the maximum load shall be derated in accordance with the following curve. % 100 Percentage of the rated dissipation 50 0 -55 70 125 Ambient temperature Figure 2 Derating Curve 4-2 Rated Voltage The rated voltage shall be determined by the following expression. V = P× R Where V：Rated voltage (V) R：Nominal resistance value (Ω) P：Rated dissipation (W) 4-3 Operating and Storage Temperature Range -55 to +125℃ ℃ DOCUMENT : SRLF0000NH REVISION : A1 PAGE : 3 OF 7 SPECIFICATION FOR APPROVAL 5. Characteristics Test Item Condition of Test Requirements Short Time Overload 5 * Rated power for 5 seconds Refer to JIS C 5201-1 4.13 ∆R : ± (0.5%+0.0005Ω) Without significant damage by flashover ( spark, arching ), burning or breakdown etc. Insulation Resistance The resistor shall be cramped in the metal block and tested , as shown below. Test voltage : 100 ± 15VDC for 1 minute Refer to JIS C 5201-1 4.6 Mounting condition G. Between Electrode and Protection Film 100MΩ or over Between Electrode and Substrate 1,000MΩ or over Voltage Proof The voltage : 100VAC (rms.) for 1 minute ∆R : ± (1.0%+0.0005Ω) Refer to JIS C 5201-1 4.7 Without damage by flashover, fire or breakdown, as shown below. Thermal Shock -55 ~125℃ 5 cycles, 15 min at each extreme condition Refer to JIS C 5201-1 4.19 ∆R : ± (1.0%+0.0005Ω) Without distinct damage in appearance Low Temperature Storage Kept at -55℃, 1,000 hours Refer to JIS C 5201-1 4.23.4 ∆R : ± (1.0%+0.0005Ω) Without distinct damage in appearance High Temperature Exposure Kept at 125℃ for 1,000 hours Refer to JIS C 5201-1 4.23.2 ∆R : ± (1.0%+0.0005Ω) Without distinct damage in appearance Solderability Temperature of Solder : 245 ± 5℃ Immersion Duration : 2 ± 0.5 second Refer to JIS C 5201-1 4.17 Uniform coating of solder cover minimum of 95% surface being immersed Resistance to Soldering Heat Dipped into solder at 270 ± 5℃ for 10 ± 1 seconds Refer to JIS C 5201-1 4.18 ∆R : ± (0.5%+0.0005Ω) Without distinct deformation in appearance DOCUMENT : SRLF0000NH REVISION : A1 PAGE : 4 OF 7 SPECIFICATION FOR APPROVAL Test Item Condition of Test Requirements Load Life Rated voltage for 1.5 hours followed by a pause 0.5 hour at 70 ± 2℃. Cycle repeated 1000 hours Refer to JIS C 5201-1 4.25 ∆R : ± (1.0%+0.0005Ω) Without distinct damage in appearance Damp Heat with Load 40 ± 2℃ with relative humidity 90% to 95%. D.C. rated voltage for 1.5 hours ON and 30 minutes OFF. Cycle repeated 1,000 hours Refer to JIS C 5201-1 4.24 ∆R : ± (1.0%+0.0005Ω) Without distinct damage in appearance Mechanical Shock 100 G’s for 6milliseconds. 5 pulses Refer to JIS C 5201-1 4.21 ∆R : ± (0.5%+0.0005Ω) Without mechanical damage such as break Bending Test Glass-Epoxy board thickness : 1.6mm Bending width : 2mm Between the fulcrums : 90mm Refer to JIS C 5201-1 4.33 ∆R : ±(1.0%+0.0005Ω) Without mechanical damage such as break DOCUMENT : SRLF0000NH REVISION : A1 PAGE : 5 OF 7 SPECIFICATION FOR APPROVAL 6. Recommended Solder Pad Dimensions Note : We recommend there is no circuit design between pads to avoid circuit short DOCUMENT : SRLF0000NH REVISION : A1 PAGE : 6 OF 7 SPECIFICATION FOR APPROVAL 7. Packaging 7-1 Dimensions 7-1-1 Tape packaging dimensions 1.5 +- 0.6 ± 0.10 0.1 0.0 Sprocket hole 4.0 ± 0.1 1.75 ±0.1 A CHIP 3.5 ± 0.05 8.0 ± 0.3 B 0.65 ± 0.10 4.0 ± 0.1 Carrier cavity 2.0 ± 0.05 Pull Direction ※ Pre-emptied holes : 150 holes (or 30cm) or more. Code letter A B Unit : mm 1.45 ± 0.10 2.25 ± 0.10 Dimension 7-1-2 Reel Dimensions (Plastic reel : Correspond with EIAJ RRV08B) 13 ± 1.4 50 105 2 13 ± 0.2 +1 60-0 28 ± 0.8 R1 +0 180-3 Label 105 x 50 9 ± 0.3 Unit : mm SPECIFICATION FOR APPROVAL 7-2 Peel force of top cover tape The peel speed shall be about 300 mm / min. The peel force of top cover tape shall be between 0.1 to 0.7 N. Top Cover Tape 165 ~ 180° 0.1~0.7 N 7-3 Numbers of taping 5,000 pieces / reel 7-4 Making The following items shall be marked on the reel. (1) Type designation (2) Quantity (3) Manufacturing date code (4) Manufacturer’s name (5) The country of origin DOCUMENT : SRLF0000NH REVISION : A1 PAGE : 7 OF 7